M27C4001 4 Mbit (512Kb x 8) UV EPROM and OTP EPROM

M27C4001 4 Mbit (512Kb x 8) UV EPROM and OTP EPROM

M27C4001

4 Mbit (512Kb x 8) UV EPROM and OTP EPROM

Feature summary

5V ± 10% supply voltage in Read operation

Access time: 35ns

Low power consumption:

– Active Current 30mA at 5MHz

– Standby Current 100µA

Programming voltage: 12.75V ± 0.25V

Programming time: 100µs/Word

Electronic signature

– Manufacturer Code: 20h

– Device Code: 41h

Packages

– ECOPACK® compliant versions

32

32

1

FDIP32W (F)

1

PDIP32 (B)

PLCC32 (C)

TSOP32 (N) 8 x 20 mm

March 2006 Rev 4 1/24

www.st.com

1

5

6

3

4

7

1

2

Contents

Contents

M27C4001

Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.2

Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.3

Two Line Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.4

System Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.5

Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.6

PRESTO II Programming Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.7

Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.8

Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.9

Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.10

Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11

Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

2/24

M27C4001

List of tables

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 9.

Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 10.

Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 11.

Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 12.

FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical data. . . . . . . 18

Table 13.

PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data . . . . . . . . . . . . . 19

Table 14.

PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data . . . . . . . . . . . . 20

Table 15.

TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Mechanical Data. . . . 21

Table 16.

Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 17.

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3/24

List of figures

List of figures

M27C4001

Figure 1.

Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2.

DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 3.

LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 4.

TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 5.

Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Figure 6.

AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 7.

AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 8.

Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 9.

Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 10.

FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline . . . . . . . . . . . . . . 18

Figure 11.

PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 19

Figure 12.

PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 20

Figure 13.

TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline . . . . . . . . . . . 21

4/24

M27C4001 Summary description

The M27C4001 is a 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and

OTP (one time programmable). It is ideally suited for microprocessor systems requiring large programs and is organised as 524,288 by 8 bits.

The FDIP32W (window ceramic frit-seal package) has a transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure.

For applications where the content is programmed only one time and erasure is not required, the M27C4001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.

In order to meet environmental requirements, ST offers the M27C4001 in ECOPACK® packages.

ECOPACK packages are Lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 1.

Logic Diagram

VCC VPP

A0-A18

19

E

G

M27C4001

8

Q0-Q7

VSS

Table 1.

A0-A18

Q0-Q7

E

G

V

PP

V

CC

V

SS

Signal names

Address Inputs

Data Outputs

Chip Enable

Output Enable

Program Supply

Supply Voltage

Ground

AI00721B

5/25

Summary description

Figure 2.

DIP Connections

VPP

A16

A15

A12

A7

A6

A5

A4

Q0

Q1

Q2

VSS

A3

A2

A1

A0

1 32

13

14

15

16

4

5

2

3

6

7

8

27

26

9

10

M27C4001

25

24

23

11

12

22

21

31

30

29

28

20

19

18

17

AI00722

VCC

A18

A17

A14

A13

A8

A9

A11

G

A10

E

Q7

Q6

Q5

Q4

Q3

Figure 3.

LCC Connections

A3

A2

A1

A0

Q0

A7

A6

A5

A4

9

1 32

M27C4001 25

A14

A13

A8

A9

A11

G

A10

E

Q7

17

AI00723

M27C4001

6/25

M27C4001

Figure 4.

TSOP Connections

A11

A9

A8

A13

A14

A17

A18

VCC

VPP

A16

A15

A12

A7

A6

A5

A4

8

9

1

16

M27C4001

(Normal)

32

25

24

17

AI01155B

G

A0

A1

A2

A3

VSS

Q2

Q1

Q0

A10

E

Q7

Q6

Q5

Q4

Q3

Summary description

7/25

Device operation M27C4001

The operating modes of the M27C4001 are listed in the Operating Modes table. A single power supply is required in the read mode. All inputs are TTL levels except for V

PP

and 12V on A9 for Electronic Signature.

The M27C4001 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (t

AVQV

) is equal to the delay from E to output (t

ELQV

). Data is available at the output after a delay of t

GLQV

from the falling edge of G, assuming that E has been low and the addresses have been stable for at least t

AVQV

-t

GLQV

.

2.3

The M27C4001 has a standby mode which reduces the supply current from 30mA to 100

µ

A.

The M27C4001 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the G input.

Two Line Output Control

Because EPROMs are usually used in larger memory arrays, this product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows: a) the lowest possible memory power dissipation, b) complete assurance that output bus contention will not occur.

For the most efficient use of these two control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device.

8/25

M27C4001 Device operation

2.5 Programming

When delivered (and after each erasure for UV EPROM), all bits of the M27C4001 are in the

'1' state. Data is introduced by selectively programming '0's into the desired bit locations.

Although only '0's will be programmed, both '1's and '0's can be present in the data word.

The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The

M27C4001 is in the programming mode when V

PP

input is at 12.75V, G is at V

IH

and E is pulsed to V

IL

. The data to be programmed is applied to 8 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. V

CC

is specified to be

6.25V ± 0.25V.

2.6

The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the devices. The supply current, I

CC

, has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of the transient current peaks is dependent on the capacitive and inductive loading of the device at the output. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1

µ

F ceramic capacitor be used on every device between V

CC

and V

SS

. This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7

µ

F bulk electrolytic capacitor should be used between V

CC

and V

SS

for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces.

PRESTO II Programming Algorithm

PRESTO II Programming Algorithm allows the whole array to be programmed with a guaranteed margin, in a typical time of 52.5 seconds. Programming with PRESTO II consists of applying a sequence of 100

µ s program pulses to each byte until a correct verify

occurs (see

Figure 5

). During programming and verify operation, a MARGIN MODE circuit is automatically activated in order to guarantee that each cell is programmed with enough margin. No overprogram pulse is applied since the verify in MARGIN MODE provides the necessary margin to each programmed cell.

9/25

Device operation

Figure 5.

Programming Flowchart

VCC = 6.25V, VPP = 12.75V

n = 0

E = 100

µ s Pulse

NO

++n

= 25

YES

NO

VERIFY

YES

FAIL

Last

Addr

YES

NO

CHECK ALL BYTES

1st: VCC = 6V

2nd: VCC = 4.2V

++ Addr

AI00760B

M27C4001

Programming of multiple M27C4001s in parallel with different data is also easily accomplished. Except for E, all like inputs including G of the parallel M27C4001 may be common. A TTL low level pulse applied to a M27C4001's E input, with V

PP

at 12.75V, will program that M27C4001. A high level E input inhibits the other M27C4001s from being programmed.

A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with G at V

IL

, E at V

IH

, V

PP

at 12.75V and

V

CC

at 6.25V.

10/25

The Electronic Signature (ES) mode allows the reading out of a binary code from an

EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the M27C4001. To activate the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of the M27C4001 with V

PP

= V

CC

= 5V. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from V

IL

to V

IH

. All other address lines must be held at V

IL

during Electronic Signature mode. Byte 0 (A0 = V

IL

) represents the manufacturer code and byte 1 (A0 = V

IH

) the device identifier code. For the STMicroelectronics

M27C4001, these two identifier bytes are given in

Table 3

and can be read-out on outputs

Q7 to Q0.

M27C4001 Device operation

2.10 Erasure operation (applies to UV EPROM)

The erasure characteristics of the M27C4001 are such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å range. Data shows that constant exposure to room level fluorescent lighting could erase a typical M27C4001 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27C4001 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C4001 window to prevent unintentional erasure. The recommended erasure procedure for the M27C4001 is exposure to short wave ultraviolet light which has wavelength of 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 15 W-sec/cm

2

. The erasure time with this dosage is approximately

15 to 20 minutes using an ultraviolet lamp with 12000

µ

W/cm

2

power rating. The M27C4001 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure.

Table 2.

Mode

Operating Modes

(1)

E

Read V

IL

Output Disable

Program

V

IL

V

IL

Pulse

Verify

Program Inhibit

V

IH

V

IH

Standby

Electronic Signature

V

IH

V

IL

1.

X = V

IH

or V

IL

, V

ID

= 12V ± 0.5V.

Table 3.

Electronic Signature

Identifier A0 Q7 Q6

Manufacturer’s

Code

Electronic

Signature

V

IL

V

IH

0

0

0

1

G

V

IL

V

IH

V

IH

V

IL

V

IH

X

V

IL

Q5

1

0

Q4

0

0

A9

X

X

X

X

X

X

V

ID

Q3

0

0

Q2

0

0

V pp

V

CC

or V

SS

V

CC

or V

SS

V

PP

V

PP

V

PP

V

CC

or V

SS

V

CC

Q1

0

0

Q7 - Q0

Data Out

Hi-Z

Data In

Data Out

Hi-Z

Hi-Z

Codes

Q0 Hex Data

0

1

20h

41h

11/25

Maximum rating M27C4001

Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Table 4.

Absolute Maximum Ratings

Symbol Parameter Value Unit

T

A

T

BIAS

T

STG

V

IO

(2)

Ambient Operating Temperature

Temperature Under Bias

Storage Temperature

(1)

Input or Output Voltage (except A9)

–40 to 125

–50 to 125

–65 to 150

–2 to 7

°C

°C

°C

V

V

CC

V

A9

(2)

V

PP

Supply Voltage

A9 Voltage

Program Supply Voltage

–2 to 7

–2 to 13.5

–2 to 14

V

V

V

1. Depends on range.

2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC voltage on Output is V

+2V for a period less than 20ns.

CC

+0.5V with possible overshoot to V

CC

12/25

M27C4001

4 DC and AC parameters

DC and AC parameters

This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters.

Table 5.

AC Measurement Conditions

High Speed Standard

Input Rise and Fall Times

Input Pulse Voltages

Input and Output Timing Ref. Voltages

0 to 3V

1.5V

0.4 to 2.4V

0.8 and 2V

Figure 6.

AC Testing Input Output Waveform

High Speed

3V

1.5V

0V

Standard

2.4V

0.4V

2.0V

0.8V

AI01822

Figure 7.

AC Testing Load Circuit

1.3V

1N914

3.3k

DEVICE

UNDER

TEST

CL

OUT

CL = 30pF for High Speed

CL = 100pF for Standard

CL includes JIG capacitance

AI01823B

13/25

DC and AC parameters M27C4001

Table 6.

Symbol

Capacitance

(1) (2)

Parameter Test Condition Min Max Unit

C

IN

C

OUT

Input Capacitance

Output Capacitance

V

IN

= 0V

V

OUT

= 0V

1.

T

A

= 25 °C, f = 1 MHz.

2.

Sampled only, not 100% tested.

.

Table 7.

Read Mode DC Characteristics

(1) (2)

Symbol Parameter

I

LI

I

LO

I

CC

I

CC1

Input Leakage Current

Output Leakage Current

Supply Current

Supply Current (Standby) TTL

Test Condition

0V

IN

V

CC

0V

OUT

V

CC

E = V

IL

, G = V

IL

,

I

OUT

= 0mA, f = 5MHz

E = V

IH

I

CC2

Supply Current (Standby)

CMOS

E > V

CC

– 0.2V

Min

6

12

Max

±10

±10

30

1

100 pF pF

Unit

µ

A

µ

A mA mA

µ

A

I

PP

V

IL

V

IH

(3)

V

OL

V

OH

Program Current

Input Low Voltage

Input High Voltage

Output Low Voltage

Output High Voltage TTL

Output High Voltage CMOS

V

PP

= V

CC

I

OL

= 2.1mA

I

OH

= –400

µ

A

I

OH

= –100

µ

A

–0.3

2

2.4

V

CC

– 0.7V

10

0.8

V

CC

+ 1

0.4

1.

T

A

= 0 to 70 °C or –40 to 85 °C; V

CC

= 5V ± 5% or 5V ± 10%; V

PP

= V

CC

2.

V

CC

must be applied simultaneously with or before V

PP

and removed simultaneously or after V

PP.

.

3.

Maximum DC voltage on Output is V

CC

+0.5V.

Table 8.

Programming Mode DC Characteristics

(1) (2)

Symbol Parameter Test Condition Min Max

I

LI

I

CC

I

PP

V

IL

V

IH

V

OL

V

OH

V

ID

Input Leakage Current

Supply Current

Program Current

Input Low Voltage

Input High Voltage

Output Low Voltage

Output High Voltage TTL

A9 Voltage

I

I

0

OH

OL

IN

E = V

V

IL

= –400

CC

= 2.1mA

µ

A

–0.3

2

2.4

11.5

V

±10

0.8

CC

50

50

+ 0.5

0.4

12.5

1.

T

A

= 25 °C; V

CC

= 6.25V ± 0.25V; V

PP

= 12.75V ± 0.25V.

2.

V

CC

must be applied simultaneously with or before V

PP

and removed simultaneously or after V

PP

.

Unit

µ

A mA mA

V

V

V

V

V

µ

A

V

V

V

V

V

14/25

M27C4001 DC and AC parameters

Figure 8.

Read Mode AC Waveforms

A0-A18

VALID tAVQV

E tGLQV

G tELQV

Q0-Q7 tAXQX

VALID tEHQZ tGHQZ

Hi-Z

AI00724B

Table 9.

Read Mode AC Characteristics

(1) (2)

Symbol Alt Parameter Test Condition -35

(3)

M27C4001

-45

(3)

-55

(3)

Unit

Min Max Min Max Min Max

t

EHQZ

(4) t

GHQZ

(4)

t t t t

AVQV

ELQV

GLQV

AXQX t

ACC

Address Valid to

Output Valid t t

CE

OE

Chip Enable Low to

Output Valid

Output Enable Low to Output Valid

E = V

IL

, G = V

IL

G = V

E = V

IL

IL t t t

DF

DF

OH

Chip Enable High to

Output Hi-Z

Output Enable High to Output Hi-Z

Address Transition to Output Transition

G = V

E = V

IL

IL

E = V

IL

, G = V

IL

0

0

0

35

35

20

30

30

0

0

0

45

45

25

30

30

0

0

0

1.

T

A

= 0 to 70 °C or –40 to 85 °C; V

CC

= 5V ± 5% or 5V ± 10%; V

PP

= V

CC

2.

V

CC

must be applied simultaneously with or before V

PP

and removed simultaneously or after V

PP

3.

Speed obtained with High Speed AC measurement conditions.

4.

Sampled only, not 100% tested.

55 ns

55 ns

30 ns

30 ns

30 ns ns

15/25

DC and AC parameters M27C4001

Table 10.

Read Mode AC Characteristics

(1) (2)

M27C4001

-80/-90 -10/-12/-15 Unit Symbol Alt Parameter Test Condition -70

Min Max Min Max Min Max

t

EHQZ

(3) t

GHQZ

(3)

t t t t

AVQV

ELQV

GLQV

AXQX t

ACC

Address Valid to

Output Valid t t

CE

OE

Chip Enable Low to

Output Valid

Output Enable Low to Output Valid

E = V

IL

, G = V

IL

G = V

E = V

IL

IL t t t

DF

DF

OH

Chip Enable High to

Output Hi-Z

Output Enable High to Output Hi-Z

Address Transition to Output Transition

G = V

E = V

IL

IL

E = V

IL

, G = V

IL

0

0

0

70

70

35

30

30

0

0

0

80

80

40

30

30

0

0

0

1.

T

A

= 0 to 70 °C or –40 to 85 °C; V

CC

= 5V ± 5% or 5V ± 10%; V

PP

= V

CC

2.

V

CC

must be applied simultaneously with or before V

PP

and removed simultaneously or after V

PP

.

3.

Sampled only, not 100% tested.

100 ns

100

50

30

30 ns ns ns ns ns

16/25

M27C4001 DC and AC parameters

Figure 9.

Programming and Verify Modes AC Waveforms

A0-A18

VALID

Q0-Q7 tAVPL

DATA IN tQVEL tEHQX

DATA OUT

VPP tVPHEL tGLQV

VCC tVCHEL

E tELEH tQXGL

G tGHQZ tGHAX

PROGRAM VERIFY

AI00725

Table 11.

Programming Mode AC Characteristics

(1) (2) (3)

Symbol Alt Parameter Test Condition Min Max

t

AVEL t

QVEL t

VPHEL t

VCHEL t

ELEH t

EHQX t

QXGL t

GLQV t

GHQZ t

GHAX t

AS t

DS t

VPS t

VCS t

PW t

DH t

OES t

OE t

DFP t

AH

Address Valid to Chip Enable Low

Input Valid to Chip Enable Low

V

PP

High to Chip Enable Low

V

CC

High to Chip Enable Low

Chip Enable Program Pulse Width

Chip Enable High to Input Transition

Input Transition to Output Enable Low

Output Enable Low to Output Valid

Output Enable High to Output Hi-Z

Output Enable High to Address

Transition

2

2

2

2

95

2

2

0

0

105

100

130

1.

T

A

= 25 °C; V

CC

= 6.25V ± 0.25V; V

PP

= 12.75V ± 0.25V

2.

V

CC

must be applied simultaneously with or before V

PP

and removed simultaneously or after V

PP

.

3.

Sampled only, not 100% tested.

Unit

µ s

µ s

µ s

µ s

µ s

µ s

µ s ns ns ns

17/25

Package mechanical M27C4001

18/25

Figure 10.

FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline

A2

A3 A

B1

D2

B

D

A1 e

L

α eA

C eB

N

S

E1 E

1

FDIPW-a

1.

Drawing is not to scale.

Table 12.

FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical data millimeters inches

Symbol

Typ Min Max Typ Min Max

E1 eA eB

L

N

S

Ø

α

C

D

D2 e

E

A

A1

A2

A3

B

B1 1.45

38.10

2.54

15.24

14.99

32

7.11

0.23

41.73

0.51

3.91

3.89

0.41

13.06

16.18

3.18

1.52

0.30

42.04

13.36

18.03

4.10

5.72

1.40

4.57

4.50

0.56

2.49

11°

0.057

1.500

0.100

0.600

0.590

32

0.280

0.020

0.154

0.153

0.016

0.009

1.643

0.514

0.637

0.125

0.060

0.098

11°

0.012

1.655

0.526

0.710

0.161

0.225

0.055

0.180

0.177

0.022

M27C4001 Package mechanical

Figure 11.

PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline

b1

A2 A

A1 e

L α eA c

D2 b

D

N

S

E1 E

1

PDIP-C

1.

Drawing is not to scale.

Table 13.

PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data millimeters inches

Symbol

Typ Min Max Typ Min Max

4.83

0.190

eA e

E

E1

S

L

α

N b b1 c

D

A

A1

A2 3.81

15.24

2.54

0.38

0.41

1.14

0.23

41.78

15.24

13.46

1.65

3.05

32

0.53

1.65

0.38

42.29

15.88

13.97

2.21

3.56

15°

0.150

0.600

0.100

0.015

0.016

0.045

0.009

1.645

0.600

0.530

0.065

0.120

32

0.021

0.065

0.015

1.665

0.625

0.550

0.087

0.140

15°

19/25

Package mechanical M27C4001

Figure 12.

PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline

D

D1

A1

A2

1 N

B1

E2 e

E3 E1 E

F

0.51 (.020)

1.14 (.045)

E2

B

D3 A

R

CP

D2 D2

PLCC-A

1.

Drawing is not to scale.

Table 14.

PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data millimeters inches

Symbol

Typ Min Max Typ Min Max

E3 e

F

R

N

D2

D3

E

E1

E2

B1

CP

D

D1

A

A1

A2

B

7.62

10.16

1.27

0.89

32

12.32

11.35

4.78

14.86

13.89

6.05

0.00

3.18

1.53

0.38

0.33

0.66

5.66

15.11

14.05

6.93

0.13

3.56

2.41

0.53

0.81

0.10

12.57

11.51

0.300

0.400

0.050

0.035

32

0.485

0.447

0.188

0.585

0.547

0.238

0.000

0.125

0.060

0.015

0.013

0.026

0.223

0.595

0.553

0.273

0.005

0.140

0.095

0.021

0.032

0.004

0.495

0.453

20/25

M27C4001 Package mechanical

Figure 13.

TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline

A2

1 N e

E

B

N/2

D1

D

A

CP

DIE

C

TSOP-a

A1

α

L

1.

Drawing is not to scale.

Table 15.

TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package

Mechanical Data millimeters inches

Symbol

Typ Min Max Typ Min Max

C

CP

D

D1

A

A1

A2

B

L

N

α e

E

0.500

32

0.050

0.950

0.170

0.100

19.800

18.300

7.900

0.500

1.200

0.150

1.050

0.250

0.210

0.100

20.200

18.500

8.100

0.700

0.0197

32

0.0020

0.0374

0.0067

0.0039

0.7795

0.7205

0.3110

0.0197

0.0472

0.0059

0.0413

0.0098

0.0083

0.0039

0.7953

0.7283

0.3189

0.0276

21/25

Part numbering M27C4001

Table 16.

Ordering Information Scheme

Example: M27C4001

Device Type

M27

Supply Voltage

C = 5V

Device Function

4001 = 4 Mbit (512Kb x 8)

Speed

-35

(1)

= 35 ns

-45

(1)

= 45 ns

-55

(1)

= 55 ns

-70 = 70 ns

-80 = 80 ns

-90 = 90 ns

-10 = 100 ns

-12 = 120 ns

-15 = 150 ns

V

CC

Tolerance

blank = ± 10%

X = ± 5%

Package

F = FDIP32W

B = PDIP32

C = PLCC32

N = TSOP32: 8 x 20 mm

-45 X C 1

Temperature Range

1 = 0 to 70 °C

6 = –40 to 85 °C

1.

High Speed, see AC Characteristics section for further information.

For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.

22/25

M27C4001 Revision history

Table 17.

Document revision history

Date Revision

July 1998

09/25/00

11/29/00

28-Mar-2006

1

2

3

4

Changes

First Issue

AN620 Reference removed

PLCC codification changed (

Table 16.

)

Document converted to new template (sections added, information moved). LCCC32W package removed. Package specifications updated (see

Section 5: Package mechanical

). Packages are

ECOPACK® compliant. X and TR options removed from

Table 16:

Ordering Information Scheme

.

23/25

M27C4001

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