SM2T TRANSIL™

SM2T TRANSIL™
SM2T
®
TRANSIL™
FEATURES
■ High Peak pulse power:
200 W (10/1000 µs )
1000 W ( 8/20 µs)
■ Stand-off voltage range 5 to 24V
■ Unidirectional types
■ Low clamping factor VCL/VBR
■
■
A
K
Fast response time
1.0mm overall component height
DESCRIPTION
The SM2T series are Transil diodes designed specifically for portable equipment and miniaturized
electronics devices subject to ESD transient overvoltages.
Fully compatible with pick and place equipment
and inspectable soldering joints.
STmite
(JEDEC DO-216AA)
Table 1: Order Codes
Part Number
Marking
SM2T6V8A
MUA
SM2T14A
MUE
SM2T18A
MUG
SM2T27A
MUJ
Table 2: Absolute Ratings (Tamb = 25°C)
Symbol
Parameter
1
Value
Unit
Peak pulse power dissipation (see note )
Tj initial = Tamb
200
W
Power dissipation on infinite heatsink
Tamb = 100°C
2.5
W
IFSM
Non repetitive surge peak forward current
tp = 10 ms
Tj initial = Tamb
25
A
Tstg
Tj
Storage temperature range
Maximum junction temperature
-65 to 175
150
°C
260
°C
Value
20
250
Unit
°C/W
°C/W
PPP
P
TL
Maximum lead temperature for soldering during 10 s.
Note 1: 10/1000µs pulse waveform.
Table 3: Thermal Resistances
Symbol
Parameter
Rth(j-t) Junction to tab
Rth(j-a) Junction to ambient on PCB with recommended pad layout
January 2005
REV. 3
1/6
SM2T
Table 4: Electrical Characteristics (Tamb = 25°C)
Symbol
Parameter
I
IF
VRM
Stand-off voltage
VBR
Breakdown voltage
VCL
Clamping voltage
IRM
Leakage current @ VRM
IPP
Peak pulse current
αT
Voltage temperature coefficient
VF
Forward voltage drop
SM2T6V8A
SM2T14A
SM2T18A
SM2T27A
Note 1: 10/1000µs pulse waveform.
2/6
VBR
V RM
IRM
Types
VCL
VF
V
I RM
I PP
@
VRM
max
VBR
@
IR
min
VCL @
IPP
max
αT
C
max
typ
@ 0V
note1
µA
V
V
mA
V
A
50
1
1
1
5
12
16
24
6.4
13.3
17.1
25.7
10
1
1
1
9.2
19.9
26
28.9
19.6
9
7
4.6
10-4/°C
5.7
8.3
8.8
9.6
pF
1600
650
500
350
SM2T
Figure 1: Peak pulse power versus exponential
pulse duration
Figure 2: Relative variation of peak pulse
power versus initial junction temperature
PPP(W)
%
1.E+04
110
Tj initial = 25°C
100
90
80
1.E+03
70
60
50
40
1.E+02
30
20
10
tp(ms)
Tj(°C)
0
1.E+01
0.01
0.10
1.00
10.00
Figure 3: Average power dissipation versus
ambient temperature
0
25
50
75
100
125
150
175
Figure 4: Variation of thermal impedance
junction to ambient versus pulse duration
Zth(j-c)/Rth(j-c)
P(W)
1000.0
3.0
S=0.135cm²
TAMB = Ttab
2.5
100.0
2.0
S=2cm²
10.0
1.5
1.0
Printed circuit board FR4, recommended pad layout
1.0
0.5
tp(s)
TAMB(°C)
0.0
0.1
0
25
50
75
100
125
150
Figure 5: Thermal resistance junction to
ambient versus copper surface under tab
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 6: Reverse leakage current versus
junction temperature (typical values)
Rth(j-a)(°C/W)
IR(nA)
250
1.E+02
VR = VRM
200
1.E+01
150
1.E+00
100
1.E-01
50
S(cm²)
Tj(°C)
1.E-02
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0
25
50
75
100
125
150
3/6
SM2T
Figure 7: Clamping voltage versus peak pulse
current (maximum values)
Figure 8: Junction capacitance versus reverse
voltage applied (typical values)
IPP(A)
C(pF)
100.0
10000
Tj initial = 25°C
F=1MHz
VOSC=30mVRMS
Tj=25°C
8/20µs
10/1000µs
10.0
1000
SM2T6V8A
SM2T14A
SM2T6V8A
SM2T18A
1.0
100
SM2T14A
SM2T27A
SM2T18A
SM2T27A
VR(V)
VCL(V)
10
0.1
0
5
10
15
20
25
30
35
40
45
Fig. 9: Forward voltage drop versus forward
current (typical values)
IFM(A)
1.E+02
1.E+01
Tj = 150°C
Tj = 25°C
1.E+00
1.E-01
VFM(V)
1.E-02
0.0
4/6
0.5
1.0
1.5
2.0
2.5
3.0
1
10
100
SM2T
Figure 10: STmite Package Mechanical Data
REF.
A
A1
b
b2
c
D
E
H
L
L2
L3
L3
D
b2
b
H
L2
L
E
R
C
A
A1
0° to 6°
R1
R
R1
DIMENSIONS
Millimeters
Inches
Min. Typ. Max. Min. Typ.
0.85 1.00 1.15 0.033 0.039
0.10
0.40
0.65 0.016
0.70
1.00 0.027
0.10
0.25 0.004
1.75 1.90 2.05 0.069 0.007
1.75 1.90 2.05 0.069 0.007
3.60 3.75 3.90 0.142 0.148
0.50 0.63 0.80 0.020 0.025
1.20 1.35 1.50 0.047 0.053
0.50
0.019
ref
ref
0.07
0.003
0.07
0.003
Max.
0.045
0.004
0.025
0.039
0.010
0.081
0.081
0.154
0.031
0.059
Figure 11: STmite Foot Print Dimensions
(in millimeters)
2.67
0.762
2.54
1.27
0.635
Table 5: Ordering Information
Part Number
Marking
SM2T6V8A
MUA
SM2T14A
MUE
SM2T18A
MUG
SM2T27A
MUJ
Package
Weight
Base qty
Delivery mode
STmite
15.5 mg
12000
Tape & reel
Table 6: Revision History
Date
Revision
Description of Changes
April-2002
1A
Aug-2004
2
STmite package dimensions update.
14-Jan-2005
3
Minor layout update. No content change.
Last update.
5/6
SM2T
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
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6/6
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