BAT54 Series

Small signal Schottky diodes

Main product characteristics

I

F

V

RRM

C (typ)

T j

(max)

300 mA

40 V

7 pF

150° C

Features and benefits

■

■

■

■

■

■

Low conduction and reverse losses

Negligible switching losses

Low forward and reverse recovery times

Extremely fast switching

Surface mount device

Low capacitance diode

Description

The BAT54 series uses 40 V Schottky barrier diodes packaged in SOD- 23, SOD-323,

SOD-523, SOT-23, SOT-323, or SOT-666.

Order codes

Part Number

BAT54FILM

BAT54SFILM

BAT54CFILM

BAT54AFILM

BAT54WFILM

BAT54SWFILM

BAT54CWFILM

BAT54AWFILM

BAT54JFILM

BAT54KFILM

BAT54-07P6FILM

BAT54-09P6FILM

BAT54ZFILM

Marking

D86

D88

D87

D84

D73

D78

D77

D74

86

86

P4

Q4

D72

July 2006 Rev 9

SOD-123

SOD-323

SOD-523

SOT-23

SOT-323

BAT54ZFILM

(Single)

BAT54JFILM

(Single)

BAT54KFILM

(Single)

BAT54FILM

(Single)

BAT54AFILM

(Common anode)

BAT54SFILM

(Series)

BAT54CFILM

(Common cathode)

BAT54WFILM

(Single)

BAT54CWFILM

(Common cathode)

BAT54AWFILM

(Common anode)

BAT54SWFILM

(Series)

BAT54-07P6FILM

(2 parallel diodes)

SOT-666

BAT54-09P6FILM

(2 opposite diodes)

Configurations in top view

1/13

www.st.com

Characteristics

1 Characteristics

BAT54 Series

Table 1.

Symbol

V

RRM

I

F

I

FSM

T stg

T j

T

L

Absolute ratings (limiting values at T

Parameter

Repetitive peak reverse voltage

Continuous forward current

Surge non repetitive forward current

Storage temperature range

Operating junction temperature range

Maximum soldering temperature

j

= 25° C, unless otherwise specified)

t p

= 10 ms Sinusoidal

Value

40

300

1

-65 to +150

-40 to +150

260

Table 2.

Symbol

R th(j-a)

Thermal parameters

Junction to ambient

(1)

Parameter

SOT-23, SOD-123

SOT-323, SOD-323,

SOD-523, SOT-666

Value

500

550

600

Unit

°C/W

1.

Epoxy printed circuit board with recommended pad layout

Table 3.

Symbol

I

R

(1)

V

F

(2)

Static electrical characteristics

Parameter

Reverse leakage current

Test conditions

T j

= 25° C

T j

= 100° C

V

R

= 30 V

Forward voltage drop T j

= 25° C

I

F

= 0.1 mA

I

F

= 1 mA

I

F

= 10 mA

I

F

= 30 mA

I

F

= 100 mA

1.

Pulse test: t p

= 5 ms,

δ < 2 %

2.

Pulse test: t p

= 380 µs,

δ < 2 %

Table 4.

Symbol

Dynamic characteristics

Parameter

Test conditions

C t rr

Diode capacitance

Reverse recovery time

V

R

= 1 V, F = 1 MHz

I

F

I rr

= 10 mA, I

= 1 mA, R

R

= 10 mA, T

L

= 100

Ω j

= 25° C

Min.

Typ Max.

Unit

1

100

240

320

400

µA mV

500

900

Min.

Typ Max.

Unit

7 10 pF

5 ns

Unit

V mA

A

° C

° C

° C

2/13

BAT54 Series Characteristics

Figure 1.

Average forward power dissipation versus average forward current

Figure 2.

Average forward current versus ambient temperature (

δ = 1)

0.35

P(W)

0.30

0.25

0.20

0.15

0.10

0.05

0.00

0.00

0.05

δ=0.05

δ=0.2

0.10

δ=0.1

I

F(AV)

(A)

0.15

0.20

δ=0.5

0.25

δ

=tp/T

δ=1

T

0.30

tp

0.35

0.35

I

F(AV)

(A)

0.30

0.25

0.20

0.15

0.10

0.05

0.00

0 25 50 75 100 125 150

3/13

Characteristics BAT54 Series

Figure 7.

Thermal resistance junction to ambient versus copper surface under each lead - epoxy FR4 with recommended pad layout, e

CU

= 35 µm (SOD-323)

600

R th(j-a)

(°C/W)

Epoxy FR4 e

CU

=35 µm

500

Figure 8.

Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, e

CU

= 35 µm (SOD-323)

1.E+00

Z th(j-a)

/R th(j-a)

Single pulse

SOD323

1.E-01

400

300

200

0 5 10 15 20

S

CU

(mm²)

25 30 35 40 45 50

1.E-02

1.E-03

1.E-03 1.E-02 1.E-01

Epoxy FR4

S

CU

=2.25 mm² e

CU

=35 µm

t

P

(s)

1.E+00 1.E+01 1.E+02 1.E+03

Figure 9.

Relative variation of thermal impedance junction to ambient versus pulse duration - aluminium oxide substrate

10 mm x 8 mm x 0.5 mm (SOT-23)

1.E+00

Z th(j-a)

/R th(j-a)

Single pulse

SOT23

Figure 10.

Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, e

CU

= 35 µm (SOD-523)

1.E+00

Z th(j-a)

/R th(j-a)

Single pulse

SOD523

1.E-01

1.E-01

1.E-02

1.E-02

1.E-03 1.E-02

Alumine substrate

10 x 8 x 0.5 mm

t

P

(s)

1.E-01 1.E+00 1.E+01 1.E+02

Figure 11.

Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy FR4 with recommended pad layout, e

CU

= 35 µm (SOT-666)

1.E+00

Z th(j-a)

/R th(j-a)

Single pulse

SOT666

1.E-03

1.E-03 1.E-02

t

P

(s)

1.E-01

Epoxy FR4 e

CU

=35 µm

1.E+00 1.E+01

1.E-01

1.E-02

1.E-03 1.E-02

t

P

(s)

1.E-01

Epoxy FR4 e

CU

=35 µm

1.E+00 1.E+01

4/13

BAT54 Series

2 Ordering information scheme

Ordering information scheme

BAT54 xx xx FILM

Signal Schottky diodes

V

RRM

= 40 V

Configuration

No letter = Single diode

A = Common anode

C = Common cathode

S = Series diodes

07 = Parallel diodes

09 = Opposite diodes

Package

Blank = SOT-23

J = SOD-323

W = SOT-323

K = SOD-523

P6 = SOT-666

Z = SOD-123

Packing

FILM = Tape and reel

5/13

Package information BAT54 Series

Epoxy meets UL94, V0

Table 5.

SOD-123 dimensions

H

A2

A1

Ref.

E c

G

D b

A

A

A1

A2 b c

D

E

G

H

Figure 12.

SOD-123 footprint (dimensions in mm)

4.45

Dimensions

Millimeters

Min.

Max.

0

1.45

0.1

0.85

1.35

0.55 Typ.

0.15 Typ.

2.55

2.85

1.4

1.7

0.25

3.55

3.95

Inches

Min.

Max.

0

0.057

0.004

0.033

0.053

0.022 Typ.

0.039 Typ.

0.1

0.112

0.055

0.067

0.01

0.14

0.156

0.65

0.97

2.51

0.97

6/13

BAT54 Series Package information

Table 6.

SOD-323 dimensions

Ref.

H

A1 b

E c

D

L

Q1

A

A

A1 b c

D

E

H

L

Q1

Figure 13.

SOD-323 footprint (dimensions in mm)

0

0.25

0.1

1.52

1.11

2.3

0.1

0.1

Dimensions

Millimeters Inches

Min.

Max.

1.17

0.1

0.44

0.25

1.8

1.45

2.7

0.46

0.41

Min.

Max.

0

0.01

0.004

0.06

0.046

0.004

0.017

0.01

0.071

0.044

0.057

0.09

0.004

0.106

0.02

0.004

0.016

3.20

0.54

1.06

1.08

1.06

7/13

Package information BAT54 Series

Table 7.

SOD-523 dimensions

A

SEATING PLANE

C

2xb

E 0.15

M C A B

E1

B

0.20

M C A B

L

R0.1

A

L1

D c

7°

8°

Millimeters

Dimensions

Inches Ref.

Min.

Typ.

Max.

Min.

Typ.

Max.

A

E

0.50

0.60

0.70

0.020

0.024

0.028

1.50

1.60

1.70

0.059

0.063

0.067

E1 1.10

1.20

1.30

0.043

0.047

0.051

D 0.70

0.80

0.90

0.028

0.031

0.035

b 0.25

0.35

0.010

0.014

c 0.07

0.20

0.003

0.008

L 0.15

0.20

0.25

0.006

0.008

0.010

L1 0.10

0.20

0.004

0.008

Figure 14.

SOD-523 footprint (dimensions in mm)

0.7

0.3

2

8/13

BAT54 Series Package information

Table 8.

SOT-23 dimensions

E

A

Ref.

B

H e

S

L c e1

A1

D e e1

E

H

L

S

A

A1

B c

D

Figure 15.

SOT-23 footprint (dimensions in mm)

Millimeters

Dimensions

Inches

Min.

Max.

0.89

0

0.3

0.085

2.75

0.85

1.7

1.2

1.05

2.1

1.6

2.1

0.6 typ.

2.75

0.35

0.65

1.4

0.1

0.51

0.18

3.04

Min.

Max.

0.035

0

0.012

0.003

0.108

0.055

0.004

0.02

0.007

0.12

0.033

0.067

0.047

0.041

0.083

0.063

0.083

0.108

0.024 typ.

0.014

0.026

0.95

0.61

0.73

1.26

3.25

9/13

Package information BAT54 Series

Table 9.

SOT-323 dimensions

b c

θ

E

H

L e

A1

A

D

E e

H

L q

A

A1 b c

D

Ref.

Millimeters

Dimensions

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

0.8

0.0

1.1

0.031

0.1

0.0

0.043

0.004

0.25

0.1

1.8

2.0

0.4

0.010

0.26

0.004

0.016

0.010

2.2

0.071

0.079

0.086

1.15

1.25

1.35

0.045

0.049

0.053

1.8

0.1

0

0.65

2.1

0.2

0.026

2.4

0.071

0.083

0.094

0.3

0.004

0.008

0.012

30° 0 30°

Figure 16.

SOT-323 footprint (dimensions in mm)

0.95

1.0

2.9

0.8

0.50

10/13

BAT54 Series Package information

Table 10.

SOT-666 dimensions

L1

L3 b b1 e

D

A

E1

E

L2

A3

Dimensions

Millimeters Inches Ref.

Min.

Typ.

Max.

Min.

Typ.

Max.

A 0.45

A3 0.08

0.60

0.018

0.18

0.003

0.024

0.007

b 0.17

0.34

0.007

0.013

b1 0.19

0.27

0.34

0.007 0.011 0.013

D 1.50

1.70

0.059

0.067

E

E1 1.10

e

1.50

L1

L2 0.10

0.50

0.19

1.70

0.059

1.30

0.043

0.30

0.004

0.020

0.007

0.067

0.051

0.012

L3 0.10

0.004

Figure 17.

SOT-666 footprint (dimensions in mm)

0.50

0.62

2.60

0.99

0.30

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

11/13

Ordering information BAT54 Series

Part Number

BAT54FILM

BAT54SFILM

BAT54CFILM

BAT54AFILM

BAT54WFILM

BAT54SWFILM

BAT54CWFILM

BAT54AWFILM

BAT54JFILM

BAT54KFILM

BAT54-07P6FILM

BAT54-09P6FILM

BAT54ZFILM

Marking

D86

D88

D87

D74

86

86

P4

Q4

D72

D84

D73

D78

D77

Package

SOT-23 Single

SOT-23 Serial

SOT-23

Common cathode

SOT-23

Common anode

SOT-323 Single

SOT-323 Serial

SOT-323

Common cathode

SOT-323

Common anode

SOD-323

SOD-523

SOT-666 Parallel

SOT-666 Opposite

SOD-123

Weight Base qty Delivery mode

10 mg

10 mg

3000

3000

Tape and reel

Tape and reel

10 mg 3000 Tape and reel

10 mg

6 mg

6 mg

6 mg

6 mg

5 mg

1.4 mg

2.9 mg

2.9 mg

10 mg

3000

3000

3000

3000

3000

3000

3000

3000

3000

3000

Tape and reel

Tape and reel

Tape and reel

Tape and reel

Tape and reel

Tape and reel

Tape and reel

Tape and reel

Tape and reel

Tape and reel

Date

Jun-1999

24-Jul-2006

Revision

8

9

Description of Changes

Last update.

BAT54, A, C, S and BAT54J / W / AW / CW /SW datasheets merged. ECOPACK statement added. SOD-

123, SOD-523 and SOT-666 packages added.

12/13

BAT54 Series

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13/13