RC4560

RC4560 www.ti.com

.....................................................................................................................................................

SLOS457A – JANUARY 2005 – REVISED APRIL 2008

DUAL AUDIO OPERATIONAL AMPLIFIER

1

FEATURES

Operating Voltage . . . ±2 V to ±18 V

Low Noise Voltage . . . 1.2

µ

Vrms (Typ)

Wide GBW . . . 15 MHz (Typ)

Low THD . . . 0.05% (Typ)

Slew Rate . . . 5.5 V/

µ

sec (Typ)

Suitable for Applications Such as Audio

Preamplifier, Active Filter, Headphone

Amplifier, Industrial Measurement Equipment

DESCRIPTION/ORDERING INFORMATION

The RC4560 is a high-gain, wide-bandwidth, dual operational amplifier capable of driving 20 V peak-to-peak into

400Ω loads. The RC4560 combines many of the features of the RC4558, but with wider bandwidth and higher slew rate, making this device ideal for active filters, data and telecommunications, and many instrumentation applications.

T

A

–40

°

C to 85

°

C

PDIP – P

SOIC – D

TSSOP – PW

ORDERING INFORMATION

(1)

PACKAGE

(2)

Tube of 50

Tube of 75

Reel of 2500

Tube of 150

Reel of 2000

ORDERABLE PART NUMBER

RC4560IP

RC4560ID

RC4560IDR

RC4560IPW

RC4560IPWR

TOP-SIDE MARKING

RC4560IP

R4560I

R4560I

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com

.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright © 2005–2008, Texas Instruments Incorporated

RC4560

SLOS457A – JANUARY 2005 – REVISED APRIL 2008 .....................................................................................................................................................

www.ti.com

EQUIVALENT CIRCUIT

V

CC+

Output

− Input

+ Input

V

CC−

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

V

θ

CC±

JA

Supply voltage

Input voltage (any input)

Output current

Package thermal impedance

(2) (3)

D package

P package

PW package

±18 V

±15 V

±50 mA

97

°

C/W

85

°

C/W

149

°

C/W

150

°

C

−60

°

C to 125

°

C

T

J

T stg

Operating virtual junction temperature

Storage temperature range

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

(2)

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Maximum power dissipation is a function of T temperature is P

D

= (T

J

(max) – T

A

J

(max),

θ

JA

, and T

A

. The maximum allowable power dissipation at any allowable ambient

)/

θ

JA

. Operating at the absolute maximum T

J of 150

°

C can impact reliability.

(3) The package thermal impedance is calculated in accordance with JESD 51-7.

2

Submit Documentation Feedback

Product Folder Link(s):

RC4560

Copyright © 2005–2008, Texas Instruments Incorporated

RC4560 www.ti.com

.....................................................................................................................................................

SLOS457A – JANUARY 2005 – REVISED APRIL 2008

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

V

CC+

V

CC–

V

ID

V

ICR

T

A

Supply voltage

Differential input voltage

Input common mode range

Operating free-air temperature range

MIN MAX UNIT

2 16

V

–2 –16

–14

–40

±30 V

14 V

85

°

C

V

IO

I

IO

I

IB

A

VD r i

ELECTRICAL CHARACTERISTICS

V

CC±

= ±15 V, T

A

= 25

°

C (unless otherwise noted)

Input offset voltage

PARAMETER

Input offset current

Input bias current

Large-signal differential voltage amplification

Input resistance

TEST CONDITIONS

R

S

≤ 10 kΩ

R

L

≥ 2 kΩ, V

O

= ±10 V

V

O

Output voltage swing

R

L

≥ 2 kΩ

I

O

= 25 mA

V

ICR

Common-mode input voltage range

CMRR Common-mode rejection ratio k

SVR

Supply-voltage rejection ratio

(1)

I

CC

Supply current (all amplifiers)

R

R

S

S

≤ 10 kΩ

≤ 10 kΩ

(1) Measured with V

CC± differentially varied simultaneously from ±4 V to ±15 V

OPERATING CHARACTERISTICS

V

CC±

= ±15 V, T

A

= 25

°

C (unless otherwise noted)

SR

PARAMETER

Slew rate at unity gain

GBW Gain bandwidth product

THD Total harmonic distortion

V n

Equivalent input noise voltage

TEST CONDITIONS

V

O

= 5 V, R

L

= 2 k Ω, f = 1 kHz, A

VD

= 20 dB

RIAA, R

S

≤ 2 kΩ, 30-kHz LPF

MIN TYP MAX UNIT

0.5

6 mV

5

40

200

500 nA nA

86

0.3

±12

100

5

±14 dB

M

V

±10 ±12.5

±12 ±14

70

76.5

90

90

4.3

5.7

V dB dB mA

TYP UNIT

5.5

V/

µ s

15 MHz

0.05

%

1.2

µ

Vrms

Copyright © 2005–2008, Texas Instruments Incorporated

Product Folder Link(s):

RC4560

Submit Documentation Feedback

3

www.ti.com

PACKAGE OPTION ADDENDUM

25-Apr-2008

PACKAGING INFORMATION

Orderable Device

RC4560ID

RC4560IDE4

RC4560IDG4

RC4560IDR

RC4560IDRE4

RC4560IDRG4

RC4560IP

RC4560IPE4

RC4560IPW

RC4560IPWE4

RC4560IPWG4

RC4560IPWR

RC4560IPWRE4

RC4560IPWRG4

Status

(1)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Package

Type

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

PDIP

PDIP

TSSOP

TSSOP

TSSOP

TSSOP

TSSOP

TSSOP

Package

Drawing

D

D

D

D

D

D

P

P

PW

PW

PW

PW

PW

PW

Eco Plan

(2)

Pins Package

Qty

8 75 Green (RoHS & no Sb/Br)

Lead/Ball Finish MSL Peak Temp

(3)

CU NIPDAU Level-1-260C-UNLIM

8 CU NIPDAU Level-1-260C-UNLIM

8

75 Green (RoHS & no Sb/Br)

75 Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

8 CU NIPDAU Level-1-260C-UNLIM

8

8

8

8

8

8

2500 Green (RoHS & no Sb/Br)

2500 Green (RoHS & no Sb/Br)

2500 Green (RoHS & no Sb/Br)

50 Pb-Free

(RoHS)

50 Pb-Free

(RoHS)

150 Green (RoHS & no Sb/Br)

150 Green (RoHS & no Sb/Br)

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

Level-1-260C-UNLIM

Level-1-260C-UNLIM

N / A for Pkg Type

N / A for Pkg Type

Level-1-260C-UNLIM

Level-1-260C-UNLIM

8

8

8

8

150 Green (RoHS & no Sb/Br)

2000 Green (RoHS & no Sb/Br)

2000 Green (RoHS & no Sb/Br)

2000 Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU

CU NIPDAU

CU NIPDAU

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

Addendum-Page 1

www.ti.com

PACKAGE OPTION ADDENDUM

25-Apr-2008 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

www.ti.com

TAPE AND REEL INFORMATION

PACKAGE MATERIALS INFORMATION

14-Jul-2012

*All dimensions are nominal

Device

RC4560IDR

RC4560IPWR

Package

Type

Package

Drawing

SOIC

TSSOP

D

PW

Pins

8

8

SPQ

2500

2000

Reel

Diameter

(mm)

Reel

Width

W1 (mm)

330.0

12.4

330.0

12.4

A0

(mm)

6.4

7.0

B0

(mm)

5.2

3.6

K0

(mm)

P1

(mm)

W

(mm)

Pin1

Quadrant

2.1

1.6

8.0

8.0

12.0

12.0

Q1

Q1

Pack Materials-Page 1

www.ti.com

PACKAGE MATERIALS INFORMATION

14-Jul-2012

*All dimensions are nominal

Device

RC4560IDR

RC4560IPWR

Package Type Package Drawing Pins

SOIC

TSSOP

D

PW

8

8

SPQ

2500

2000

Length (mm) Width (mm) Height (mm)

340.5

367.0

338.1

367.0

20.6

35.0

Pack Materials-Page 2

IMPORTANT NOTICE

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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

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Amplifiers

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DLP® Products

DSP

Clocks and Timers

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Medical www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical

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