STPS20150C High voltage power Schottky rectifier Main product characteristics Features and benefits

STPS20150C High voltage power Schottky rectifier Main product characteristics Features and benefits

STPS20150C

High voltage power Schottky rectifier

Main product characteristics

A1

A2

I

F(AV)

V

RRM

T j

V

F

(max)

2 x 10 A

150 V

175° C

0.75 V

Features and benefits

HIgh junction temperature capability

Good trade off between leakage current and forward voltage drop

Low leakage current

Avalanche capability specified

Insulated package

– TO-220FPAB

Insulating voltage = 2000 V

Typical package capacitance 12 pF

K

A1

A2

D

2

PAK

STPS20150CG

A1

K

A2

TO-220AB

STPS20150CT

Description

Dual center tap schottky rectifier designed for high frequency Switched Mode Power Supplies.

Order Codes

Part Number

STPS20150CT

STPS20150CG

STPS20150CG-TR

STPS20150CR

STPS20150CFP

Table 1.

Symbol

V

RRM

I

F(RMS)

I

F(AV)

1.

I

FSM

P

ARM

T stg

T j dTj

<

Absolute ratings (limiting values)

Parameter

Repetitive peak reverse voltage

RMS forward voltage

Average forward current

δ = 0.5

TO-220AB

I

2

PAK, D

2

PAK

TO-220FPAB

Surge non repetitive forward current

Repetitive peak avalanche power

Storage temperature range

Maximum operating junction temperature

(1) t t

T

T p p

C

C

= 155° C Per diode

= 135° C Per device

= 10 ms sinusoidal

= 1 µs T j

= 25° C

(

– a

)

condition to avoid thermal runaway for a diode on its own heatsink

K

K

A1

K

A2

I

2

PAK

STPS20150CR

A1

K

A2

TO-220FPAB

STPS20150CFP

Marking

STPS20150CT

STPS20150CG

STPS20150CG

STPS20150CR

STPS20150CFP

Value

150

30

10

20

180

6700

-65 to + 150

175

Unit

V

A

A

A

W

° C

° C

March 2007 Rev 8 1/10

www.st.com

10

Characteristics

1 Characteristics

STPS20150C

Table 2.

Symbol

R th(j-c)

R th(c)

Thermal resistance

Parameter

TO-220AB, D

2

PAK, I

2

PAK

Junction to case

Coupling

TO-220FPAB

TO-220AB, D

2

PAK, I

2

PAK

TO-220FPAB

TO-220AB, D

2

PAK, I

2

PAK

TO-220FPAB

Per diode

Total

Value

2.2

4.5

1.3

3.5

0.3

2.5

Unit

° C/W

Table 3.

Symbol

When the diodes 1 and 2 are used simultaneously:

ΔT j

(diode 1) = P(diode 1) x

R th(j-l)

(Per diode) + P(diode 2) x

R th(c)

Static electrical characteristics (per diode)

Parameter Tests conditions Min.

Typ

I

R

(1)

V

F

(2)

Reverse leakage current

Forward voltage drop

T j

= 25° C

T j

= 125° C

T j

= 25° C

T j

= 125° C

T j

= 25° C

T j

= 125° C

V

R

= V

RRM

I

F

= 10 A

I

F

= 20 A

1.

t p

= 5 ms,

δ < 2%

2.

t p

= 380 µs,

δ < 2%

To evaluate the conduction losses use the following equation:

P = 0.64 x I

F(AV)

+ 0.011 I

F

2

(RMS)

0.69

0.79

Figure 1.

Average forward power dissipation versus average forward current (per diode)

10

9

8

7

6

5

4

3

2

1

0

0

P

F(AV)

(W)

1 2 3

δ = 0.05 δ

= 0.1

δ = 0.2

4

I

F(AV)

(A)

5 6 7 8

δ = 0.5

δ = 1

T

9

δ

=tp/T

10 11 tp

12

Max.

5.0

5.0

0.92

0.75

1

0.86

Unit

µA mA

V

Figure 2.

Average forward current versus ambient temperature (

δ = 0.5, per

diode)

12

11

10

9

8

7

6

5

4

3

2

1

0

0

I

F(AV)

(A)

δ

=tp/T

25

T tp

50

R th(j-a)

=15°C/W

T

75

R th(j-a)

=R th(j-c)

R th(j-a)

=R th(j-c)

(TO-220FPAB)

amb

(°C)

100 125 150 175

2/10

STPS20150C Characteristics

Figure 3.

Normalized avalanche power derating versus pulse duration

1

P (t )

P

ARM

(1µs)

0.1

0.01

0.001

0.01

0.1

1 10 100 1000

Figure 4.

Normalized avalanche power derating versus junction temperature

1.2

P (t )

P

ARM

(25°C)

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

Figure 5.

Non repetitive surge peak forward current versus overload duration - maximum values, per diode (TO-220AB, D

2

PAK, I

2

PAK)

Figure 6.

Non repetitive surge peak forward current versus overload duration

- maximum values, per diode

(TO-220FPAB)

150

125

100

75

50

25

0

1.E-03

I M

t

δ

=0.5

1.E-02

t(s)

1.E-01 1.E+00

100

90

80

70

60

50

40

30

20

10

0

1.E-03

I M

t

δ

=0.5

1.E-02

t(s)

1.E-01

TO-220FPAB

1.E+00

Figure 7.

Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, D

2

PAK,

I

2

PAK)

Figure 8.

Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB)

Z th(j-c)

/R th(j-c)

1.0

0.9

0.8

0.7

δ = 0.5

0.6

0.5

0.4

0.3

0.2

0.1

δ = 0.2

δ = 0.1

Single pulse

0.0

1.E-03 1.E-02 1.E-01

δ

=tp/T

T tp

1.E+00

Z th(j-c)

/R th(j-c)

1.0

0.9

0.8

TO-220FPAB

0.7

0.6

δ = 0.5

0.5

0.4

0.3

0.2

δ = 0.2

δ = 0.1

0.1

Single pulse

0.0

1.E-03 1.E-02 1.E-01

δ

=tp/T

1.E+00

T tp

1.E+01

3/10

Characteristics STPS20150C

Figure 9.

Reverse leakage current versus reverse voltage applied (typical values, per diode)

Figure 10.

Junction capacitance versus reverse voltage applied (typical values, per diode)

1000

C(pF)

F=1MHz

1E+5

1E+4

1E+3

1E+2

1E+1

1E+0

1E-1

0 25 50 75 100 125 150

100

10

1 2 5 10 20 50 100 200

Figure 11.

100.0

I

FM

(A)

10.0

1.0

Forward voltage drop versus forward current (per diode)

(typical values)

0.1

0.0

0.2

0.4

0.6

V

FM

(V)

0.8

1.0

1.2

1.4

1.6

1.8

70

60

50

40

30

Figure 12.

Thermal resistance junction to ambient versus copper surface under tab - Epoxy printed circuit board, copper thickness = 35 µm

(STPS20150CG only)

80

R th(j-a)

(°C/W)

20

10

0

0 5 10 15

S(cm²)

20 25 30 35 40

4/10

STPS20150C Package information

Epoxy meets UL94, V0.

Table 4.

D

2

PAK Dimensions

L

L2

L3

E

G

B2

B

A1

2.0 MIN.

FLAT ZONE

C2

C

A2

A

R

V2

D

D

E

G

L

L2

L3

M

R

V2

B

B2

C

C2

A

A1

A2

REF.

Dimensions

Millimeters Inches

Min.

Max.

Min.

Max.

4.40

2.49

0.03

0.70

1.14

0.45

1.23

4.60

2.69

0.23

0.93

1.70

0.60

1.36

0.173

0.181

0.098

0.106

0.001

0.009

0.027

0.037

0.045

0.067

0.017

0.024

0.048

0.054

8.95

9.35

0.352

0.368

10.00

10.40

0.393

0.409

4.88

5.28

0.192

0.208

15.00

15.85

0.590

0.624

1.27

1.40

0.050

0.055

1.40

1.75

0.055

0.069

2.40

3.20

0.40 typ.

0° 8°

0.094

0.126

0.016 typ.

0° 8°

Figure 13.

D

2

PAK footprint dimensions (in mm)

16.90

10.30

3.70

1.30

5.08

8.90

5/10

Package information

Table 5.

TO-220AB Dimensions

L2

F2

F1

H2

Dia

F

G1

G

L5

L6

L9

L4

STPS20150C

Dimensions

Millimeters Inches REF.

C

A

D

M

E

L7

Min.

Max.

Min.

Max.

E

F

F1

F2

G

G1

H2

L2

A

C

D

4.40

1.23

2.40

0.49

0.61

1.14

1.14

4.95

4.60

1.32

2.72

0.70

0.88

1.70

1.70

5.15

0.173

0.048

0.051

0.094

0.107

0.019

0.024

0.044

0.044

0.194

0.181

0.027

0.034

0.066

0.066

0.202

2.40

10

2.70

16.4 typ.

0.094

0.106

10.40

0.393

0.409

0.645 typ.

L4

L5

L6

13

2.65

14

2.95

0.511

0.104

0.551

0.116

15.25

15.75

0.600

0.620

L7

L9

M

6.20

3.50

Diam.

3.75

6.60

3.93

2.6 typ.

3.85

0.244

0.259

0.137

0.154

0.102 typ.

0.147

0.151

6/10

STPS20150C

Table 6.

I

2

PAK Dimensions

L2

L

L1 e

E b2 b1 b

Package information

c2

D

A1

A c b1 c c2

D e

A

A1 b e1

E

L

L1

L2

REF.

Dimensions

Millimeters Inches

Min.

Max.

Min.

Max.

4.40

2.40

0.61

1.14

0.49

1.23

8.95

2.40

4.95

10

13

3.50

1.27

4.60

3.93

1.40

0.173

0.138

0.050

0.181

2.72

0.094

0.107

0.88

0.024

0.035

1.70

0.044

0.067

0.70

0.019

0.028

1.32

0.048

0.052

9.35

0.352

0.368

2.70

0.094

0.106

5.15

0.195

0.203

10.40

0.394

0.409

14 0.512

0.551

0.155

0.055

7/10

Package information STPS20150C

Table 7.

TO-220FPAB Dimensions

Dimensions

Millimeters Inches REF.

L3

L2

L4

G1

H

G

F

F1

F2

L6

L5

Dia

D

B

A

E

L7

L3

L4

L5

L6

L7

Dia.

E

F

F1

F2

G

G1

H

L2

A

B

D

Min.

Max.

Min.

Max.

28.6

9.8

2.9

15.9

9.00

3.00

4.4

2.5

2.5

0.45

0.75

1.15

1.15

4.95

4.6

2.7

2.75

0.098

0.108

0.70

1

0.173

0.098

0.106

0.018

0.030

0.181

0.027

0.039

1.70

0.045

0.067

1.70

0.045

0.067

5.20

0.195

0.205

2.4

10

16 Typ.

2.7

0.094

0.106

10.4

0.393

0.409

0.63 Typ.

30.6

10.6

3.6

1.126

0.386

0.114

1.205

0.417

0.142

16.4

0.626

0.646

9.30

0.354

0.366

3.20

0.118

0.126

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

8/10

STPS20150C Ordering information

Ordering type Marking Package

STPS20150CT

STPS20150CG

STPS20150CG-TR

STPS20150CR

STPS20150CFP

STPS20150CT

STPS20150CG

STPS20150CG

STPS20150CR

TO-220AB

D

2

PAK

D

2

PAK

I

2

PAK

STPS20150CFP TO-220FPAB

Weight Base qty Delivery mode

2.20 g

1.48 g

1.48 g

1.49 g

2.0 g

50

50

1000

50

50

Tube

Tube

Tape and reel

Tube

Tube

Date

Jul-2003

31-May-2006

07-Mar-2007

Revision

6D

7

8

Description of Changes

Last update.

Reformatted to current standard. Added ECOPACK statement.

Changed nF to pF in Figure 10.

Reworded footnote to Table 1. Corrected typing error in Table 3.

9/10

STPS20150C

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