BLM8G0710S-30PB; BLM8G0710S-30PBG 1. Product profile LDMOS 2-stage power MMIC

BLM8G0710S-30PB; BLM8G0710S-30PBG 1.  Product profile LDMOS 2-stage power MMIC
BLM8G0710S-30PB;
BLM8G0710S-30PBG
LDMOS 2-stage power MMIC
Rev. 3 — 1 September 2015
Product data sheet
1. Product profile
1.1 General description
The BLM8G0710S-30PB(G) is a dual section, 2-stage power MMIC using Ampleon’s state
of the art GEN8 LDMOS technology. This multiband device is perfectly suited as general
purpose driver or small cell final in the frequency range from 700 MHz to 1000 MHz.
Available in gull wing or straight lead outline.
Table 1.
Performance
Typical RF performance at Tcase = 25 C; IDq1 = 30 mA; IDq2 = 120 mA.
Test signal: 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF; per section
unless otherwise specified in a class-AB production circuit.
Test signal
single carrier W-CDMA
f
VDS
PL(AV)
Gp
D
ACPR5M
(MHz)
(V)
(W)
(dB)
(%)
(dBc)
957.5
28
3
35
27
41.5
1.2 Features and benefits









Designed for broadband operation (frequency 700 MHz to 1000 MHz)
High section-to-section isolation enabling multiple combinations
Integrated temperature compensated bias
Biasing of individual stages is externally accessible
Integrated ESD protection
Excellent thermal stability
High power gain
On-chip matching for ease of use
Compliant to Directive 2002/95/EC, regarding restriction of hazardous substances
(RoHS)
1.3 Applications
 RF power MMIC for W-CDMA base stations in the 700 MHz to 1000 MHz frequency
range. Possible circuit topologies are the following as also depicted in Section 8.1:
 Dual section or single ended
 Doherty
 Quadrature combined
 Push-pull
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
2. Pinning information
2.1 Pinning
pin 1 index
VDS(A1)
VGS(A2)
VGS(A1)
RF_IN_A
n.c.
n.c.
n.c.
n.c.
n.c.
n.c.
RF_IN_B
VGS(B1)
VGS(B2)
VDS(B1)
1
2
3
4
5
6
7
16
RF_OUT_A / VDS(A2)
8
9
10
11
12
13
14
15
RF_OUT_B / VDS(B2)
aaa-009322
Transparent top view
The exposed backside of the package is the ground terminal of the device.
Fig 1.
Pin configuration
2.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
VDS(A1)
1
drain-source voltage of driver stage A1
VGS(A2)
2
gate-source voltage of final stage A2
VGS(A1)
3
gate-source voltage of driver stage A1
RF_IN_A
4
RF input section A
n.c.
5
not connected
n.c.
6
not connected
n.c.
7
not connected
n.c.
8
not connected
n.c.
9
not connected
n.c.
10
not connected
RF_IN_B
11
RF input section B
VGS(B1)
12
gate-source voltage of driver stage B1
VGS(B2)
13
gate-source voltage of final stage B2
VDS(B1)
14
drain-source voltage of driver stage B1
BLM8G0710S-30PB_S-30PBG#3
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Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
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BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
Table 2.
Pin description …continued
Symbol
Pin
Description
RF_OUT_B/VDS(B2)
15
RF output section B / drain-source voltage of final stage B2
RF_OUT_A/VDS(A2)
16
RF output section A / drain-source voltage of final stage A2
GND
flange
RF ground
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
BLM8G0710S-30PB
HSOP16F
plastic, heatsink small outline package; 16 leads (flat)
SOT1211-2
BLM8G0710S-30PBG
HSOP16
plastic, heatsink small outline package; 16 leads
SOT1212-2
4. Block diagram
VDS(A1)
RF_IN_A
RF_OUT_A / VDS(A2)
VGS(A1)
VGS(A2)
TEMPERATURE
COMPENSATED BIAS
VGS(B1)
VGS(B2)
TEMPERATURE
COMPENSATED BIAS
RF_IN_B
RF_OUT_B / VDS(B2)
VDS(B1)
aaa-009323
Fig 2.
Block diagram
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDS
Min
Max
Unit
drain-source voltage
-
65
V
VGS
gate-source voltage
0.5
+13
V
Tstg
storage temperature
65
+150
C
-
225
C
-
150
C
Tj
junction temperature
Tcase
case temperature
[1]
Conditions
[1]
Continuous use at maximum temperature will affect the reliability. For details refer to the online MTF
calculator.
BLM8G0710S-30PB_S-30PBG#3
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Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
3 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
6. Thermal characteristics
Table 5.
Thermal characteristics
Measured for total device.
Symbol
Rth(j-c)
[1]
Parameter
Conditions
thermal resistance from
junction to case
Value Unit
final stage; Tcase = 90 C; PL = 2.52 W
[1]
1.5
K/W
driver stage; Tcase = 90 C; PL = 2.52 W
[1]
5.3
K/W
When operated with a CW signal.
7. Characteristics
Table 6.
DC characteristics
Tcase = 25 C; per section unless otherwise specified.
Symbol
Parameter
Conditions
Min Typ Max Unit
Final stage
V(BR)DSS
drain-source breakdown voltage VGS = 0 V; ID = 0.241 mA
VGSq
gate-source quiescent voltage
VDS = 28 V; ID = 120 mA
VDS = 28 V; ID = 120 mA
[1]
65
-
-
V
1.5
2
2.7
V
1.9
2.6
3.5
V
IDSS
drain leakage current
VGS = 0 V; VDS = 28 V
-
-
1.4
A
IDSX
drain cut-off current
VGS = 5.65 V; VDS = 10 V
-
4.4
-
A
IGSS
gate leakage current
VGS = 1.0 V; VDS = 0 V
-
-
140
nA
65
-
-
V
1.5
2.1
2.7
V
1.9
2.6
3.5
V
Driver stage
V(BR)DSS
drain-source breakdown voltage VGS = 0 V; ID = 0.06 mA
VGSq
gate-source quiescent voltage
VDS = 28 V; ID = 30 mA
VDS = 28 V; ID = 30 mA
[2]
IDSS
drain leakage current
VGS = 0 V; VDS = 28 V
-
-
1.4
A
IDSX
drain cut-off current
VGS = 5.65 V; VDS = 10 V
-
1.1
-
A
IGSS
gate leakage current
VGS = 1.0 V; VDS = 0 V
-
-
140
nA
[1]
In production circuit with 1.3 k gate feed resistor.
[2]
In production circuit with 1.2 k gate feed resistor.
Table 7.
RF Characteristics
Typical RF performance at Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA; PL(AV) = 3 W. Per section unless otherwise
specified, measured in an Ampleon wideband f = 700 MHz to 1000 MHz production circuit.
Symbol
Parameter
Conditions
Min Typ
Max
Unit
f = 730.5 MHz
-
-
dB
f = 957.5 MHz
33.5 35
36.5
dB
Test signal: single carrier W-CDMA [1]
Gp
D
RLin
power gain
drain efficiency
input return loss
ACPR5M adjacent channel power ratio
(5 MHz)
35.7
f = 730.5 MHz
-
24
-
%
f = 957.5 MHz
23.5 27
-
%
f = 730.5 MHz
-
20
-
dB
f = 957.5 MHz
-
16
10
dB
f = 730.5 MHz
-
39
-
dBc
f = 957.5 MHz
-
41.5 38.5 dBc
BLM8G0710S-30PB_S-30PBG#3
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Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
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BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
Table 7.
RF Characteristics …continued
Typical RF performance at Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA; PL(AV) = 3 W. Per section unless otherwise
specified, measured in an Ampleon wideband f = 700 MHz to 1000 MHz production circuit.
Symbol
Parameter
Conditions
Min Typ
Max
Unit
PARO
output peak-to-average ratio
f = 730.5 MHz
-
8
-
dB
f = 957.5 MHz
7.3
8
-
dB
-
0.5
-
%
-
0.5
-
%
IDq/T
quiescent drain current variation with T = 40 C to +85 C
temperature
final stage IDq; gate feed resistor = 1.3 k
driver stage IDq; gate feed resistor = 1.2 k
Test signal: CW [2]
s21
s21
2
phase response difference
between sections
10 -
+10
deg
insertion power gain difference
between sections
0.5 -
+0.5
dB
[1]
3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF.
[2]
f = 957.5 MHz.
8. Application information
Table 8.
Typical performance
Test signal: 1-tone CW; RF performance at Tcase = 25 C; VDS = 28 V; IDq1 = 60 mA (both sections); IDq2 = 240 mA (both
sections) unless otherwise specified, measured in an Ampleon wideband f = 700 MHz to 1000 MHz class AB application
circuit.
Symbol
Parameter
Conditions
Min Typ
Max Unit
PL(1dB)
output power at 1 dB gain compression
f = 800 MHz
-
29.7
-
W
D
drain efficiency
at PL(1dB); f = 800 MHz
-
51.7
-
%
Gp
power gain
PL(AV) = 8 W; f = 800 MHz
-
35.8
-
dB
Bvideo
video bandwidth
2-tone CW; PL(AV) = 16 W; f = 881 MHz
-
168
-
MHz
Gflat
gain flatness
PL(AV) = 8 W
-
0.5
-
dB
G/T
gain variation with temperature
f = 800 MHz
-
0.03
-
dB/C
s122
isolation
between sections A and B;
PL(AV) = 8 W; f = 800 MHz
-
26
-
dB
K
Rollett stability factor
T = 40 C; f = 0.1 GHz to 3 GHz
-
>1
-
BLM8G0710S-30PB_S-30PBG#3
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Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
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BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
40 mm
10 μF
100 pF
2.7 pF
1.2 kΩ
1.3 kΩ
10 μF
10 μF
10 μF
5.1 pF
100 Ω
10 pF
5.1 pF
40 mm
10 μF
10 μF
10 μF
1.3 kΩ
1.2 kΩ
100 pF
10 μF
aaa-016380
Printed-Circuit Board (PCB): Rogers 4350; thickness = 0.508 mm.
Fig 3.
Component layout for class-AB application circuit
BLM8G0710S-30PB_S-30PBG#3
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Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
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BLM8G0710S-30PB_S-30PBG#3
Product data sheet
BLM8G0710S-30PB
Single ended class AB compact board
schematics 700-1000 MHz v1r0
10 μF
50 V
VDS
28 V
100 pF
ATC600F
ferrite
VGS
VDS
28 V
1.3 kΩ
10 μF
50 V
10 μF
6.3 V
BLM8G0710S-30PB
PathA
VDS(A1) 1
VGS(A2) 2
1.2 kΩ
VGS(A1) 3
10 μF
6.3 V
RF_IN_A 4
n.c.
n.c.
2.7 pF
ATC600F
Final
clamped
RF FET
5
6
7
RF in
16
5.1 pF
ATC600F
Driver
RF power FET
Final
RF power FET
5.1 pF
ATC600F
10 pF
ATC600F
RF out
100 Ω
n.c.
n.c.
n.c.
Driver
RF power FET
15
9
10
RF_IN_B 11
1.2 kΩ
10 μF
6.3 V
Final
RF power FET
8
Driver
clamped
RF FET
Final
clamped
RF FET
VDS(B2) 12
1.3 kΩ
VGS(B2) 13
VDS(B1) 14
BLM8G0710S-30PB
10 μF
50 V
PathB
ferrite
100 pF
ATC600F
10 μF
50 V
aaa-016381
Fig 4.
Electrical schematic
LDMOS 2-stage power MMIC
7 of 19
© Ampleon The Netherlands B.V. 2015. All rights reserved.
10 μF
6.3 V
BLM8G0710S-30PB(G)
Rev. 3 — 1 September 2015
All information provided in this document is subject to legal disclaimers.
n.c.
Driver
clamped
RF FET
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
8.1 Possible circuit topologies
-3 dB / Φ-0°
In A
Out A
In
Out
-3 dB / Φ-0°
In B
Out B
aaa-009324
Fig 5.
Dual section or single ended
Splitter
Combiner
In
-3 dB / Φ-0°
λ/4
λ/4
-3 dB / Φ-90°
Out
aaa-009325
Fig 6.
Doherty
3 dB Coupler
In
3 dB Coupler
-3 dB / Φ-0°
-3 dB / Φ-90°
Out
aaa-009326
Fig 7.
Quadrature combined
BLM8G0710S-30PB_S-30PBG#3
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Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
8 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
Combiner
Splitter
In
-3 dB / Φ-0°
λ/2
λ/2
-3 dB / Φ-180°
Out
aaa-009327
Fig 8.
Push-pull
8.2 Ruggedness in class-AB operation
The BLM8G0710S-30PB and BLM8G0710S-30PBG are capable of withstanding a load
mismatch corresponding to VSWR = 10 : 1 through all phases under the following
conditions: VDS = 32 V; IDq1 = 40 mA; IDq2 = 120 mA; Pi = 13 dBm, Pi is measured at CW
and corresponding to PL(3dB) under ZS = 50 ; f = 840 MHz.
BLM8G0710S-30PB_S-30PBG#3
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Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
9 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
8.3 Impedance information
Table 9.
Typical impedance tuned for maximum output power
Measured load-pull data per section; test signal: pulsed CW; Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA;
tp = 100 s;  = 10 %; ZS = 50 . Typical values unless otherwise specified.
at 1dB gain compression point
at 3dB gain compression point
f
ZL
Gp(max) PL
add
AM-PM
ZL
conversion
Gp(max) PL
add
AM-PM
conversion
(MHz)
()
(dB)
(W)
(%)
(deg)
()
(dB)
(W)
(%)
(deg)
BLM8G0710S-30PB
680
6.1 + j5.1
34.2
44
56.2
7.3
6.4 + j4.3
34
44.9
59.4
9.2
700
5.6 + j4.6
34
43.9
53.3
6.8
6.2 + j3.6
33.9
44.8
56.4
8.5
720
6.1 + j5.2
34.5
43.8
56.7
6.4
6.2 + j3.7
34
44.8
56.8
8
740
5.7 + j4.6
34.1
43.8
53.7
5.3
6.3 + j3.6
33.9
44.8
57.2
7.2
760
5.7 + j4.5
34
43.8
54.6
4.4
6.3 + j3.5
33.8
44.8
57.4
6.1
780
6.2 + j3.5
33.6
43.8
53.4
3.6
6.2 + j3.5
33.6
44.8
57.7
6.2
800
7.0 + j3.3
33.7
43.9
55.6
2.6
6.2 + j2.8
33.4
44.9
56.3
5
820
6.3 + j2.9
33.3
43.9
52.7
3
6.3 + j2.9
33.3
44.8
56.8
5.7
840
6.3 + j2.8
33.2
43.9
53.3
2.1
6.8 + j2.2
33.1
44.9
56.5
4.1
860
7.0 + j3.2
33.5
43.8
56
2.2
7.4 + j1.7
33.1
44.8
56.2
4
880
6.7 + j2.1
33.1
43.8
52
1.3
7.4 + j1.7
33.1
44.8
56.2
3.3
900
7.4 + j1.8
33.2
43.9
53.4
1.2
7.2 + j0.9
32.9
44.8
54.3
3.4
920
6.8 + j2.2
33.3
43.8
53.1
1
7.3 + j0.9
32.9
44.7
54.2
2.7
940
7.5 + j1.7
33.4
43.8
53.1
0.5
8.1 + j0.7
33.2
44.7
55.2
2
960
7.2 + j0.9
33.2
43.6
49.7
0.2
7.2 + j0.9
33.2
44.6
53.4
2.4
980
6.5 + j1.3
33.2
43.7
49.7
0.3
8.0 + j0.8
33.4
44.7
55.1
2
1000
8.1 + j0.9
33.4
43.6
51.4
0.3
8.1 + j0.9
33.4
44.6
55.1
2.2
BLM8G0710S-30PBG
700
5.7 + j4.6
34.7
43.5
53.5
7.3
6.4 + j3.1
34.4
44.4
55.3
8.8
720
5.8 + j3.8
34.6
43.5
52.1
6
6.3 + j3.4
34.6
44.4
56.6
8.3
740
5.6 + j3.8
34.5
43.5
51.7
6.2
6.5 + j2.6
34.4
44.5
55.5
7.6
760
6.1 + j3.2
34.3
43.5
52.5
5
7.4 + j1.8
34.2
44.5
55.9
6
780
5.7 + j2.7
33.8
43.5
50.1
4.1
6.5 + j1.6
33.6
44.5
53.1
5.5
800
6.4 + j2.2
33.7
43.7
52.7
3.1
7.1 + j1.3
33.6
44.7
55.7
4.8
820
6.8 + j2.4
33.8
43.7
54.3
2.6
6.4 + j1.2
33.3
44.7
54.2
4.8
840
7.0 + j0.8
33.3
43.7
51.2
2.3
7.0 + j0.8
33.3
44.7
55
4.7
860
6.8 + j1.9
33.6
43.6
53.2
2.5
7.5 + j0.5
33.3
44.6
54.7
4.4
880
6.6 + j1.3
33.5
43.5
50.8
2
7.4 + j0.7
33.4
44.5
54.6
4.3
900
7.1 + j1.3
33.7
43.4
51.6
1.2
8.2 + j0.3
33.6
44.4
54.8
2.9
920
7.4 + j0.0
33.4
43.4
49.4
0.7
7.4 + j0.1
33.4
44.5
53.8
2.8
940
8.0  j0.2
33.4
43.3
49.3
0.2
8.0 + j0.1
33.5
44.4
53.9
2.4
960
7.8 + j0.7
34
43.3
51.1
0.1
7.9  j0.6
33.5
44.3
52.4
2
980
7.7  j0.5
33.7
43.3
48.6
0.5
7.7  j0.5
33.7
44.4
53
1.6
1000
7.2  j0.4
33.5
43.3
48.4
0.1
7.2  j0.4
33.5
44.3
52.7
2.3
BLM8G0710S-30PB_S-30PBG#3
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Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
10 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
Table 10. Typical impedance tuned for maximum power added efficiency
Measured load-pull data per section; test signal: pulsed CW; Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA;
tp = 100 s;  = 10 %; ZS = 50 . Typical values unless otherwise specified.
at 1dB gain compression point
at 3dB gain compression point
f
ZL
Gp(max) PL
add
AM-PM
ZL
conversion
Gp(max) PL
add
AM-PM
conversion
(MHz)
()
(dB)
(W)
(%)
(deg)
()
(dB)
(W)
(%)
(deg)
BLM8G0710S-30PB
680
9.6 + j9.3
35.5
42.6
65.9
8.9
9.3 + j8.4
35.3
43.6
68.1
11.1
700
8.7 + j9.5
35.6
42.5
65.4
9
9.2 + j8.5
35.5
43.5
67.3
10.7
720
8.8 + j9.6
35.7
42.3
64.5
8
8.8 + j9.6
35.7
43
67
11
740
8.0 + j9.5
35.6
42.3
64.2
7.3
8.5 + j8.7
35.4
43.3
66.7
9.7
760
8.9 + j9.4
35.5
42.3
64.5
5.5
9.4 + j8.4
35.3
43.3
66.7
7.3
780
8.4 + j8.5
35.1
42.5
63.8
5
8.4 + j8.5
35.1
43.2
66.1
8.2
800
8.4 + j8.6
35.1
42.4
63.5
4.2
9.2 + j8.5
35.1
43.2
65.4
6.1
820
8.4 + j8.7
34.9
42.3
62.7
4.1
8.7 + j6.8
34.6
43.7
65.1
6.3
840
8.5 + j8.6
34.9
42.3
63
3.1
7.9 + j6.9
34.6
43.7
65.1
6.2
860
8.5 + j8.5
34.8
42.2
62.1
2.9
7.9 + j6.8
34.5
43.7
64.5
6.2
880
7.6 + j8.5
34.8
42.1
61.8
3
7.8 + j6.8
34.5
43.6
64
5.3
900
8.0 + j7.7
34.7
42.4
61.9
2.3
7.8 + j6.8
34.6
43.5
63.8
5.2
920
8.7 + j6.8
34.6
42.7
61.2
1
8.1 + j7.8
34.8
43.1
63.1
3.9
940
8.2 + j7.7
34.9
42.2
60.6
1.3
8.3 + j5.9
34.6
43.7
62.4
2.8
960
7.9 + j6.8
34.9
42.4
59.3
1.1
8.7 + j6.7
34.8
43.3
61.8
1.9
980
7.5 + j8.5
35.2
41.7
59.8
1
8.6 + j6.8
34.8
43.3
62.1
1.5
1000
8.0 + j7.8
35
41.9
59.1
0.2
7.1 + j6.8
34.9
43.1
61.6
3.2
36
42.3
63.4
9
8.5 + j8.5
36.1
42.9
65.8
12.7
BLM8G0710S-30PBG
700
8.4 + j8.2
720
8.6 + j9.1
36.2
41.9
63.9
8.1
8.9 + j8.8
36.1
42.8
66.8
11
740
8.3 + j8.2
36
42.2
62.6
7.6
8.3 + j8.2
36
42.9
65.4
10.9
760
9.6 + j7.7
35.7
42.2
62.2
5.4
8.8 + j8.7
35.9
42.6
65.1
9.2
780
8.5 + j7.1
35.4
42.4
61.5
5.1
7.3 + j8.1
35.5
42.7
64.2
10.2
800
8.0 + j8.3
35.5
41.8
62.1
4.8
7.1 + j8.0
35.5
42.8
64.9
9.7
820
8.0 + j7.1
35.1
42.3
61.6
4
8.3 + j8.2
35.3
42.6
64
6.9
840
8.8 + j7.2
35.1
42.1
61.4
3.4
8.1 + j8.1
35.3
42.5
63.5
7
860
8.4 + j7.1
35.1
42.1
60.9
3.3
8.4 + j7.1
35.1
42.9
63.4
6
880
8.1 + j6.4
35.1
42.2
60.1
2.9
8.2 + j7.4
35.3
42.7
62.3
6
900
7.3 + j6.2
35.2
42.1
59.5
2.8
8.0 + j7.2
35.4
42.6
62.1
4.9
920
8.0 + j7.4
35.4
41.6
59.5
2.1
7.3 + j6.3
35.3
42.9
61.8
5.4
940
8.1 + j6.6
35.3
41.8
58.7
1.5
6.8 + j6.5
35.4
42.6
60.9
5.7
960
9.5 + j5.4
35.2
42.2
57.8
0
7.0 + j6.9
35.8
42.4
60.5
4.2
980
8.1 + j6.5
35.4
41.7
58.1
0.3
7.1 + j6.3
35.5
42.6
61.3
3
1000
6.9 + j4.9
35
42.2
58.2
1.1
7.0 + j6.0
35.2
42.7
61.1
3.2
BLM8G0710S-30PB_S-30PBG#3
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
11 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
8.4 Graphs
aaa-015424
40
Gp
(dB)
0
Gp
(dB)
RLin
(dB)
(1)
30
aaa-015425
38
-10
0
RLin
(dB)
36
-10
(1)
(2)
(2)
20
-20
34
-20
10
-30
32
-30
0
200
400
600
800
1000
f (MHz)
-40
1200
30
700
Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA;
PL = 0.25 W. Per section.
(1) magnitude of Gp
800
850
900
950
f (MHz)
-40
1000
Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA;
PL = 0.25 W. Per section.
(1) magnitude of Gp
(2) magnitude of RLin
Fig 9.
750
(2) magnitude of RLin
Wideband power gain and input return loss as
function of frequency; typical values
aaa-015426
40
80
Gp
(dB)
ηD
(%)
(1)
(1)
(2)
(2)
(3)
(3)
(4)
(4)
38
Fig 10. In-band power gain and input return loss as
function of frequency; typical values
aaa-015427
5
____ φs21/φs21(norm)
(deg)
2.5
(3)
(2)
60
(4)
0
Gp
36
40
34
20
(1)
-2.5
-5
-7.5
ηD
32
0
25
30
35
40
45
PL (dBm)
50
Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA.
Per section.
-10
25
30
40
45
PL (dBm)
50
Normalized at PL = 26 dBm; Tcase = 25 C; VDS = 28 V;
IDq1 = 30 mA; IDq2 = 120 mA. Per section.
(1) f = 700 MHz
(1) f = 700 MHz
(2) f = 800 MHz
(2) f = 800 MHz
(3) f = 900 MHz
(3) f = 900 MHz
(4) f = 1000 MHz
(4) f = 1000 MHz
Fig 11. Power gain and drain efficiency as function of
output power; typical values
35
Fig 12. Normalized phase response as a function of
output power; typical values
BLM8G0710S-30PB_S-30PBG#3
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
12 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
aaa-015428
-10
IMD
(dBc)
(1)
(2)
-30
IMD3
(1)
(2)
IMD5
-50
IMD7
(1)
(2)
-70
-90
1
102
10
tone spacing (MHz)
103
Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA; f = 881 MHz; 2-tone CW; PL = 8 W. Per section.
(1) IMD low
(2) IMD high
Fig 13. Intermodulation distortion as a function of tone spacing; typical values
aaa-015429
-30
ACPR
(dB)
40
ηD
(%)
aaa-015430
60
|s12|2
(dB)
48
-40
30
ACPR5M
36
-50
20
ηD
-60
24
10
ACPR10M
12
-70
0
25
30
35
40
PL (dBm)
45
Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA;
f = 900 MHz; 1-carrier W-CDMA; test model 1;
PAR = 9.9 dB at 0.01 % probability on CCDF. Per
section.
Fig 14. Adjacent channel power ratio and drain
efficiency as function of output power;
typical values
0
500
600
700
800
900
1000 1100
f (MHz)
1200
Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA;
measured on evaluation board.
Fig 15. Isolation as a function of frequency;
typical values
BLM8G0710S-30PB_S-30PBG#3
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
13 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
9. Package outline
HSOP16F: plastic, heatsink small outline package; 16 leads(flat)
SOT1211-2
D
E
X
c
D3
E3
B
y
A
HE
v
A
D1
D2
e1
b1(2x)
w
16
B
15
(8x) METAL
PROTRUSIONS (SOURCE)
e6
(2x)
F(16x)
e5
(2x)
E2
A
E1
A2
Q1
pin 1
index
A1
detail X
1
14
b(14x)
e2
w
B
e (12x)
e3 (2x)
HE
e4 (2x)
0
Q1
v
w
y
16.16 1.62
0.1
15.96 1.57 0.25 0.25
15.76 1.52
10 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
max
nom
min
A
3.9
A1
A2
b
b1
c
D(1)
D1
D2
D3
E(1)
E1
E2
E3
e
e1
e2
0.2 3.65 0.40 5.55 0.27 20.62 19.00 16.05 20.44 10.01 8.18 5.89 9.83
0.1 3.60 0.35 5.50 0.22 20.57 18.95 16.00 20.39 9.96 8.13 5.84 9.78 1.0 7.45 1.5
0 3.55 0.30 5.45 0.17 20.52 18.90 15.95 20.34 9.91 8.08 5.79 9.73
e3
e4
References
IEC
JEDEC
JEITA
e6
F
8.45 9.55 2.97 4.07 0.2
Note
1. Package body dimensions “D and “E do not include mold and metal protrusions. Allowable protrusion is 0.25 mm per side.
2. Lead width dimensions “b and “ b1 do not include dambar protrusions. Allowable dambar protrusion is 0.25 mm in total per lead.
Outline
version
e5
European
projection
sot1211-2_po
Issue date
15-01-12
15-06-09
SOT1211-2
Fig 16. Package outline SOT1211-2 (HSOP16F)
BLM8G0710S-30PB_S-30PBG#3
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
14 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
HSOP16: plastic, heatsink small outline package; 16 leads
SOT1212-2
E
X
E3
A
D
c
B
D3
y
v
HE
A
D1
D2
e1
b1(2x)
w
16
B
(8x) METAL
PROTRUSIONS (SOURCE)
15
e6
e5
(2x)
(2x)
Q
E2
E1
A
A2
(A3)
A1 A4
pin 1 index
θ
1
H
14
Lp
detail X
e2
e
(12x)
b
(14x)
w
B
e3 (2x)
e4 (2x)
HE
0
Unit
mm
max
nom
min
A
3.9
A1
A2
A3
A4
b
b1
c
D(1)
10 mm
D1
D2
D3
E(1)
Q
v
w
E1
E2
E3
e
e1
e2
e3
e4
e5
θ
7°
3°
0°
e6
0.2 3.65
0.06 0.40 5.55 0.27 20.62 19.00 16.05 20.44 10.01 8.18 5.89 9.83
0.1 3.60 0.35 0 0.35 5.50 0.22 20.57 18.95 16.00 20.39 9.96 8.13 5.84 9.78 1.0 7.45 1.5 8.45 9.55 2.97 4.07
0 3.55
-0.02 0.30 5.45 0.17 20.52 18.90 15.95 20.34 9.91 8.08 5.79 9.73
Note
1. Package body dimensions “D'' and `'E'' do not include mold and metal protrusions. Allowable protrusion is 0.25 mm per side.
2. Lead width dimensions `'b'' and `'b1'' do not include dambar protrusions. Allowable dambar protrusion is 0.25 mm in total per lead.
3. Dimension A4 is measured with respect to bottom of the heatsink DATUM H. Positive value means that the bottom of the heatsink is
higher than the bottom of the lead.
Outline
version
y
13.5 1.10 2.07
0.1
13.2 0.95 2.02 0.25 0.25
12.9 0.80 1.97
scale
Dimensions (mm are the original dimensions)
Lp
References
IEC
JEDEC
JEITA
European
projection
sot1212-2_po
Issue date
15-01-14
15-06-09
SOT1212-2
Fig 17. Package outline SOT1212-2 (HSOP16)
BLM8G0710S-30PB_S-30PBG#3
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
15 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
10. Handling information
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
11. Abbreviations
Table 11.
Abbreviations
Acronym
Description
AM
Amplitude Modulation
3GPP
3rd Generation Partnership Project
CCDF
Complementary Cumulative Distribution Function
CW
Continuous Wave
DPCH
Dedicated Physical CHannel
ESD
ElectroStatic Discharge
GEN8
Eighth Generation
LDMOS
Laterally Diffused Metal Oxide Semiconductor
MMIC
Monolithic Microwave Integrated Circuit
MTF
Median Time to Failure
PAR
Peak-to-Average Ratio
PM
Phase Modulation
VSWR
Voltage Standing-Wave Ratio
W-CDMA
Wideband Code Division Multiple Access
12. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
BLM8G0710S-30PB_S-30PBG#3
20150901
Product data sheet
Modifications:
Change notice
Supersedes
BLM8G0710S-30PB_S
-30PBG v.2
•
The format of this document has been redesigned to comply with the new
identity guidelines of Ampleon.
•
Legal texts have been adapted to the new company name where appropriate.
BLM8G0710S-30PB_S-30PBG v.2
20150701
Product data sheet
-
BLM8G0710S-30PB_
S-30PBG v.1
BLM8G0710S-30PB_S-30PBG v.1
20150123
Product data sheet
-
-
BLM8G0710S-30PB_S-30PBG#3
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
16 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.ampleon.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Ampleon does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Ampleon sales office. In
case of any inconsistency or conflict with the short data sheet, the full data
sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Ampleon and its customer, unless Ampleon and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be valid
in which the Ampleon product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, Ampleon does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. Ampleon takes no responsibility for
the content in this document if provided by an information source outside of
Ampleon.
In no event shall Ampleon be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lost profits,
lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Ampleon’ aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale of Ampleon.
Right to make changes — Ampleon reserves the right to make changes to
information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — Ampleon products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction of an
Ampleon product can reasonably be expected to result in personal injury,
death or severe property or environmental damage. Ampleon and its
suppliers accept no liability for inclusion and/or use of Ampleon products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Ampleon makes no representation
or warranty that such applications will be suitable for the specified use without
further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Ampleon products, and Ampleon accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Ampleon product is suitable and
fit for the customer’s applications and products planned, as well as for the
planned application and use of customer’s third party customer(s). Customers
should provide appropriate design and operating safeguards to minimize the
risks associated with their applications and products.
Ampleon does not accept any liability related to any default, damage, costs or
problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Ampleon products in order to
avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Ampleon does not accept any
liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — Ampleon products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.ampleon.com/terms, unless otherwise agreed in a valid written
individual agreement. In case an individual agreement is concluded only the
terms and conditions of the respective agreement shall apply. Ampleon
hereby expressly objects to applying the customer’s general terms and
conditions with regard to the purchase of Ampleon products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
BLM8G0710S-30PB_S-30PBG#3
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
17 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
Non-automotive qualified products — Unless this data sheet expressly
states that this specific Ampleon product is automotive qualified, the product
is not suitable for automotive use. It is neither qualified nor tested in
accordance with automotive testing or application requirements. Ampleon
accepts no liability for inclusion and/or use of non-automotive qualified
products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without Ampleon’ warranty of the product for such
automotive applications, use and specifications, and (b) whenever customer
uses the product for automotive applications beyond Ampleon’ specifications
such use shall be solely at customer’s own risk, and (c) customer fully
indemnifies Ampleon for any liability, damages or failed product claims
resulting from customer design and use of the product for automotive
applications beyond Ampleon’ standard warranty and Ampleon’ product
specifications.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Any reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own Any
reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own
trademarks.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14. Contact information
For more information, please visit:
http://www.ampleon.com
For sales office addresses, please visit:
http://www.ampleon.com/sales
BLM8G0710S-30PB_S-30PBG#3
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 3 — 1 September 2015
© Ampleon The Netherlands B.V. 2015. All rights reserved.
18 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
15. Contents
1
1.1
1.2
1.3
2
2.1
2.2
3
4
5
6
7
8
8.1
8.2
8.3
8.4
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 5
Possible circuit topologies . . . . . . . . . . . . . . . . 8
Ruggedness in class-AB operation . . . . . . . . . 9
Impedance information . . . . . . . . . . . . . . . . . . 10
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Handling information. . . . . . . . . . . . . . . . . . . . 16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Ampleon The Netherlands B.V. 2015.
All rights reserved.
For more information, please visit: http://www.ampleon.com
For sales office addresses, please visit: http://www.ampleon.com/sales
Date of release: 1 September 2015
Document identifier: BLM8G0710S-30PB_S-30PBG#3
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