MP34DT01 MEMS audio sensor omnidirectional digital microphone Description

MP34DT01  MEMS audio sensor omnidirectional digital microphone Description
MP34DT01
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
Description
The MP34DT01 is an ultra-compact, low-power,
omnidirectional, digital MEMS microphone built
with a capacitive sensing element and an IC
interface.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.
Features
•
•
•
•
•
•
•
•
Single supply voltage
Low power consumption
120 dBSPL acoustic overload point
63 dB signal-to-noise ratio
Omnidirectional sensitivity
–26 dBFS sensitivity
PDM output
HCLGA package
−
Top-port design
−
SMD-compliant
−
EMI-shielded
®
−
ECOPACK , RoHS, and “Green”
compliant
Applications
•
•
•
•
•
•
•
•
•
Mobile terminals
Laptop and notebook computers
Portable media players
VoIP
Speech recognition
A/V eLearning devices
Gaming and virtual reality input devices
Digital still and video cameras
Antitheft systems
February 2015
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
The MP34DT01 has an acoustic overload point of
120 dBSPL with a 63 dB signal-to-noise ratio and
–26 dBFS sensitivity.
The MP34DT01 is available in a top-port, SMDcompliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Table 1: Device summary
Order codes
Temp.
range [°C]
Package
Packing
MP34DT01
-40 to +85
HCLGA
(3x4 x1 mm)
4LD
Tray
MP34DT01TR
-40 to +85
HCLGA
(3x4x1 mm)
4LD
Tape
and reel
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This is information on a product in full production.
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www.st.com
Contents
MP34DT01
Contents
1
Pin description ................................................................................ 5
2
Acoustic and electrical specifications ........................................... 6
2.1
Acoustic and electrical characteristics............................................... 6
2.2
Timing characteristics ....................................................................... 7
2.3
Frequency response ......................................................................... 8
3
Carrier tape mechanical specifications ......................................... 9
4
5
Process recommendations ........................................................... 10
Sensing element ............................................................................ 12
6
Absolute maximum ratings........................................................... 13
7
Functionality .................................................................................. 14
7.1
8
9
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L/R channel selection ...................................................................... 14
Package information ..................................................................... 15
8.1
Soldering information ...................................................................... 15
8.2
HCLGA package information........................................................... 16
Revision history ............................................................................ 19
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MP34DT01
List of tables
List of tables
Table 1: Device summary ........................................................................................................................... 1
Table 2: Pin description .............................................................................................................................. 5
Table 3: Acoustic and electrical characteristics .......................................................................................... 6
Table 4: Distortion specifications ................................................................................................................ 6
Table 5: Timing characteristics ................................................................................................................... 7
Table 6: Frequency response mask for digital microphones ...................................................................... 8
Table 7: Absolute maximum ratings ......................................................................................................... 13
Table 8: L/R channel selection ................................................................................................................. 14
Table 9: Recommended soldering profile limits ........................................................................................ 15
Table 10: HCLGA (3 x 4 x 1 mm) 4-lead package dimensions ................................................................ 17
Table 11: Document revision history ........................................................................................................ 19
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List of figures
MP34DT01
List of figures
Figure 1: Pin connections ........................................................................................................................... 5
Figure 2: Timing waveforms ....................................................................................................................... 7
Figure 3: Frequency response and mask ................................................................................................... 8
Figure 4: Carrier tape without microphone (top view) ................................................................................. 9
Figure 5: Carrier tape with microphone (top view) ...................................................................................... 9
Figure 6: Recommended picking area ...................................................................................................... 10
Figure 7: Recommended picker design .................................................................................................... 11
Figure 8: Recommended soldering profile limits ...................................................................................... 15
Figure 9: HCLGA (3 x 4 x 1 mm) 4-lead package outline ......................................................................... 16
Figure 10: Land pattern............................................................................................................................. 18
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MP34DT01
1
Pin description
Pin description
Figure 1: Pin connections
Table 2: Pin description
Pin #
Pin name
Function
1
Vdd
Power supply
2
LR
Left/Right channel selection
3
CLK
Synchronization input clock
4
DOUT
Left/Right PDM data output
5 (ground ring)
GND
0 V supply
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Acoustic and electrical specifications
MP34DT01
2
Acoustic and electrical specifications
2.1
Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25
°C, unless otherwise noted.
Table 3: Acoustic and electrical characteristics
Symbol
Parameter
Test condition
Vdd
Supply voltage
Idd
Current consumption in normal
mode
IddPdn
Current consumption in power(2)
down mode
Scc
Short-circuit current
AOP
Acoustic overload point
So
Min.
Typ.
1.64
1.8
Mean value
(1)
-29
PSR
Power supply rejection
Clock
Input clock frequency
(4)
Turn-on time
Top
Operating temperature range
VIOL
Low-level logic input/output
voltage
VIOH
High-level logic input/output
voltage
V
mA
20
µA
10
-26
dBSPL
-23
(2)
dB
Guaranteed by design
-70
dBFS
1
3.25
MHz
10
ms
-40
+85
°C
Iout = 1 mA
-0.3
0.35xVdd
V
Iout = 1 mA
0.65xVdd
Vdd+0.3
V
Guaranteed by design
2.4
Typical specifications are not guaranteed.
Input clock in static mode.
(3)
Duty cycle: min = 40% max = 60%.
(4)
Time from the first clock edge to valid output data.
Table 4: Distortion specifications
6/20
dBFS
63
Notes:
(1)
mA
A-weighted at 1 kHz,
1 Pa
(3)
Ton
3.6
120
Sensitivity
Signal-to-noise ratio
Unit
0.6
1
SNR
Max.
Parameter
Test condition
Value
Distortion
100 dBSPL (50 Hz - 4 kHz)
< 1% THD + N
Distortion
115 dBSPL (1 kHz)
< 5% THD + N
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MP34DT01
2.2
Acoustic and electrical specifications
Timing characteristics
Table 5: Timing characteristics
Parameter
Description
fCLK
Clock frequency for normal mode
fPD
Clock frequency for power-down mode
TCLK
TR,EN
Data enabled on DATA line, L/R pin = 1
Data disabled on DATA line, L/R pin = 1
TL,DIS
Max.
Unit
1
3.25
MHz
0.23
MHz
1000
ns
Clock period for normal mode
TR,DIS
TL,EN
Min.
Data enabled on DATA line, L/R pin = 0
308
18
18
Data disabled on DATA line, L/R pin = 0
(1)
ns
16
(1)
16
(1)
(1)
ns
ns
ns
Notes:
(1)
From design simulations
Figure 2: Timing waveforms
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Acoustic and electrical specifications
2.3
MP34DT01
Frequency response
Figure 3: Frequency response and mask
Table 6: Frequency response mask for digital microphones
Frequency / Hz
(1)
Lower limit
Upper limit
Unit
100...4000
-2
+2
dBr 1 kHz
4000...10000
-2
+4
dBr 1 kHz
Notes:
(1)
8/20
At T = 20 °C and acoustic stimulus = 1 Pa (94 dB SPL)
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MP34DT01
3
Carrier tape mechanical specifications
Carrier tape mechanical specifications
Figure 4: Carrier tape without microphone (top view)
Figure 5: Carrier tape with microphone (top view)
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Process recommendations
4
MP34DT01
Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with the
following recommendations:
•
•
•
•
•
•
•
The recommended pick-up area for the MP34DT01 package must be defined using
the worst case (ie. no device alignment during the picking process). This area has
been defined considering all the tolerances of the components involved (reel,
package, sound inlet). The picker tolerance shall be considered as well.
To prevent damage to the MEMS membrane or incorrect pick-up and placement, do
not pick up the component on the inlet area
For the package outline please refer to Figure 5: "Carrier tape with microphone (top
view)". Nozzle shape, size, and placement accuracy are the other key factors to
consider when deciding on the coordinates for picking.
Device alignment before picking is highly recommended.
A vacuum force greater than 7 psi must be avoided
1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.0098 atm
All recommended dimensions (device safe-picking area) do not include the pick-andplace equipment tolerances
Figure 6: Recommended picking area
To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.
The following picker ensures that the holes for the vacuum and the air stream are ALWAYS
away from the porthole of the device (4 vacuum ports located at each corner of the device).
The recommended nozzle also has a recess, in the form of a cross, which guarantees that
the porthole is always left at atmospheric pressure. By using the recommended nozzle, the
membrane will not suffer any sudden air disturbances during the picking or placing of the
devices in the tape and reel.
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MP34DT01
Process recommendations
Figure 7: Recommended picker design
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Sensing element
5
MP34DT01
Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound
pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
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MP34DT01
6
Absolute maximum ratings
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 7: Absolute maximum ratings
Symbol
Ratings
Vdd
Supply voltage
Vin
Input voltage on any control pin
TSTG
Storage temperature range
ESD
Electrostatic discharge protection
DocID022331 Rev 12
Maximum value
Unit
-0.3 to 6
V
-0.3 to Vdd +0.3
V
-40 to +125
°C
2 (HBM)
kV
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Functionality
MP34DT01
7
Functionality
7.1
L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 8: "L/R
channel selection". The L/R pin must be connected to Vdd or GND.
Table 8: L/R channel selection
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L/R
CLK low
CLK high
GND
Data valid
High impedance
Vdd
High impedance
Data valid
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MP34DT01
8
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
8.1
Soldering information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards
and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
Figure 8: Recommended soldering profile limits
Table 9: Recommended soldering profile limits
Description
Average ramp rate
Preheat
Minimum temperature
Maximum temperature
Time (TSMIN to TSMAX)
Ramp-up rate
Parameter
Pb free
TL to TP
3 °C/sec max
TSMIN
TSMAX
tS
150 °C
200 °C
60 sec to 120 sec
TSMAX to TL
Time maintained above liquids temperature
Liquids temperature
tL
TL
60 sec to 150 sec
217 °C
Peak temperature
TP
260 °C max
Time within 5 °C of actual peak temperature
20 sec to 40 sec
Ramp-down rate
6 °C/sec max
Time 25 °C (t25 °C) to peak temperature
8 minutes max
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Package information
8.2
MP34DT01
HCLGA package information
Figure 9: HCLGA (3 x 4 x 1 mm) 4-lead package outline
Note: The MEMS microphone plastic cap can exhibit some level of variation in color when
the device is subjected to thermal processes.
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MP34DT01
Package information
Table 10: HCLGA (3 x 4 x 1 mm) 4-lead package dimensions
mm
Symbol
Min.
Typ.
Max.
A
0.90
1.00
1.10
A1
0.00
-
0.05
b
0.35
0.45
0.50
D
3.90
4.00
4.10
D1
3.05
3.10
3.15
D2
3.75
3.80
3.85
D3
0.30
0.50
0.70
E
2.90
3.00
3.10
E1
2.05
2.10
2.15
E2
2.75
2.80
2.85
E3
-0.20
0.00
0.20
e1
1.30
1.35
1.40
e2
0.80
0.85
0.90
h
0.25
0.30
0.35
L
0.90
0.95
1.00
L1
-
0.10
-
N
4
R1
0.30
0.40
0.50
R2
-
0.40
-
aaa
0.15
ccc
0.10
eee
0.08
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Package information
MP34DT01
Figure 10: Land pattern
0.85
GND
0.85
0.35
1.30
0.35
GND
Pad + solder paste
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2.30
GND
LR
Vdd
0.95
CLK
GND
DOUT
0.40
MP34DT01
9
Revision history
Revision history
Table 11: Document revision history
Date
Revision
Changes
06-Oct-2011
1
Initial release
18-Nov-2011
2
Removed “stereo” from title, Section "Features", and Section "Description"
29-Nov-2011
3
Updated Section "Features" and Section "Description"
04-Jan-2012
4
Updated
Added So limits to Table 3: "Acoustic and electrical characteristics"
Minor textual updates
23-Mar-2012
5
Updated Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package outline"
Pin 1 indicator removed from top view of package on page 1 and Figure 1: "Pin
connections"
Updated Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package dimensions"
06-Apr-2012
6
Updated maximum supply voltage in Table 3: "Acoustic and electrical
characteristics"
07-May-2012
7
Added VIOL, VIOH to Table 3: "Acoustic and electrical characteristics"
18-May-2012
8
Updated Table 5: "Timing characteristics"
05-Jul-2012
9
Added Section 5: "Sensing element"
Added Figure 10: "Land pattern"
Updated temperature range to -40 to +85 °C throughout datasheet
21-Feb-2013
10
Updated dimension T2 in Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package
dimensions"
07-Jun-2013
11
Updated
- Figure 3: "Frequency response and mask"
- Table 6: "Frequency response mask for digital microphones"
- HCLGA mechanical data Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package
outline" and Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package dimensions"
Added
- Section 3: "Carrier tape mechanical specifications"
- Section 4: "Process recommendations"
27-Feb-2015
12
Minor textual updates
Added note below Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package outline"
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MP34DT01
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