Complementary wireless module WLAN / BT Standard Laminate SiP Module Series/Type:

Complementary wireless module WLAN / BT Standard Laminate SiP Module Series/Type:

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

Series/Type: R078 (WL1837) / D7020

Ordering code: B30931D7020Y918

Date:

Version:

2014-12-9

1.3

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Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

SAW IT

2014-12-9

1.3

EPCOS AG 2014. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

1.

Overview

This document details the specifications and features of R078 (WL1837) / D7020 SiP module. The R078

(WL1837) / D7020 SiP module is based on Texas Instruments WL1837 IC, specifically WL183x Data Sheet version 1.4, such that the SiP module specification is subject to any subsequent changes in applicable Texas

Instruments documentation and software.

The R078 (WL1837) / D7020 contains the WL1837 SoC, 2.4GHz and 5 GHz SPDT switches, 2.4GHz and 5GHz band pass filters / diplexer and necessary passive components for WLAN and BT in a highly integrated solution.

1.1 Features

 WLAN, BT, BLE on a single chip provide universal connectivity in small PCB footprint.

 Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC).

 Based on 45nm CMOS technology using proven core technology.

 Seamless integration with TI OMAP™ Application Processors.

 WLAN and Bluetooth cores software and hardware are compatible with prior WL127x and WL128x offerings, for smooth migration to Device.

 Shared HCI transport for BT/BLE over UART and SDIO for WLAN.

 Downloadable patches and firmware enables new features to be added for all functional block's.

 Temperature detection and compensation mechanism ensures minimal variation in the RF performance over the entire temperature range.

 Bluetooth 4.0, BLE and all audio processing features work in parallel and include full coexistence with

WLAN

1.2 Applications

Mobile phone and mobile computer device applications.

1.3 General Description

The R078 (WL1837) / D7020 is a highly integrated WLAN, BT, BLE device that forms a complete standalone communication system. The WL1837 is a highly integrated single-chip CMOS (45-nm process) incorporates the core functionality of the WL1271/3 and WL1281/3 devices.

The device is the 8th-generation WLAN/BT/BLE devices from Texas Instruments. As such, the WL1837 is based upon proven core technology and complements the TI integrated devices for connectivity portfolio.

R078 (WL1837) / D7020 is ideal for use in mobile phone and mobile computer device applications due to its low current, small area and cellular phone coexistence-friendly features.

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Please read Cautions and warnings and

Important notes at the end of this document.

Page 2 of 51

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Standard Laminate SiP Module

1.4 Terms and abbreviations

BPF

– Band-Pass Filter

BT

– Bluetooth

FE

– Front-End (refers to FE IC and BPF)

GND

– Ground

HCI

– Host Controller Interface

IC

– Integrated Circuit

I/O

– Input/Output interfaces

LDO

– Low Drop-Out (voltage regulator)

PCB

– Printed Circuit Board

Q

– Quality factor

RF

– Radio Frequency

RX

– Receive

SiP

– System in Package

SoC

– System on Chip

TX

– Transmit

Vbat

– Battery Voltage

VIO

– external pre-existing 1.8V IO power supply

WLAN

– Wireless Local Area Network

1.5 Reference documents

 Texas Instruments WL183x_Data_Manual_Rev_1_4.pdf

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Important notes at the end of this document.

Page 3 of 51

B30931D7020Y918

R078 (WL1837) / D7020

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

1.

OVERVIEW ................................................................................................................................................................... 2

1.1

F

EATURES

................................................................................................................................................................ 2

1.2

A

PPLICATIONS

.......................................................................................................................................................... 2

1.3

G

ENERAL

D

ESCRIPTION

........................................................................................................................................... 2

1.4

T

ERMS AND ABBREVIATIONS

.................................................................................................................................... 3

1.5

R

EFERENCE DOCUMENTS

......................................................................................................................................... 3

2 FUNCTIONAL BLOCK FEATURES ......................................................................................................................... 5

2.1

F

UNCTIONAL

B

LOCK

D

IAGRAM

............................................................................................................................... 5

2.2

WLAN F

EATURES

................................................................................................................................................... 6

2.3

B

LUETOOTH

F

EATURES

............................................................................................................................................ 6

2.4

BLE F

EATURES

........................................................................................................................................................ 6

3 DETAILED DESCRIPTION ........................................................................................................................................ 7

3.1

H

OST

I

NTERFACES

.................................................................................................................................................... 7

3.2

C

LOCKS AND

P

OWER

M

ANAGEMENT

..................................................................................................................... 11

3.3

WLAN F

UNCTIONAL

B

LOCK

................................................................................................................................. 14

3.4

B

LUETOOTH

F

UNCTIONAL

B

LOCK

......................................................................................................................... 16

3.5

T

ERMINAL

A

SSIGNEMENTS

.................................................................................................................................... 18

3.6

T

ERMINAL

F

UNCTIONS

........................................................................................................................................... 19

4 DESIGN GOAL SPECIFICATIONS ......................................................................................................................... 25

4.1

G

ENERAL

C

HIP

R

EQUIREMENTS AND

O

PERATION

.................................................................................................. 25

4.2

WLAN RF P

ERFORMANCE

.................................................................................................................................... 28

4.3

B

LUETOOTH

RF P

ERFORMANCE

............................................................................................................................. 32

4.4

BLE RF

PERFORMANCE

......................................................................................................................................... 36

4.5

I

NTERFACE

T

IMING

C

HARACTERISTICS

.................................................................................................................. 38

4.6

P

ACKAGE

M

ECHANICAL

D

RAWING

........................................................................................................................ 42

4.7

S

CHEMATIC

............................................................................................................................................................ 43

5 LEAD-FREE PRODUCT STATUS ........................................................................................................................... 44

6 RECOMMENDED REFLOW PROFILE ................................................................................................................. 45

7 PACKING INFORMATION ...................................................................................................................................... 46

8 REVISION HISTORY................................................................................................................................................. 49

DISPLAY OF ORDERING CODES FOR EPCOS PRODUCTS .................................................................................... 50

2014-12-9 SAW IT

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Page 4 of 51

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

2

Functional Block Features

B30931D7020Y918

R078 (WL1837) / D7020

2.1 Functional Block Diagram

Figure 2-1 shows a high-level view of R078 (WL1837) / D7020 along with its various configurations.

The flexibility of the R078 (WL1837) / D7020 based on WL1837 enables easy integration with various hostsystem topologies.

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Important notes at the end of this document.

Figure 2-1 High-Level System Diagram

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R078 (WL1837) / D7020

2.2 WLAN Features

 Integrated 2.4 & 5GHz power amplifiers for complete WLAN solution

 WLAN MAC Baseband Processor and RF transceiver - IEEE802.11a/b/g/n compliant

 WLAN 2.4 / 5 GHz SISO (20 / 40 MHz channels), 2.4 GHz MIMO (20 MHz channels).

 Baseband Processor

 IEEE Std 802.11a/b/g data rates and IEEE Std 802.11n data rates with 20 or 40 MHz SISO and 20

MHz MIMO.

 Fully calibrated system. No production calibration required.

 Medium-Access Controller (MAC)

 Embedded ARM™ Central Processing Unit (CPU)

 Hardware-Based Encryption/Decryption Using 64-, 128-, and 256-Bit WEP, TKIP or AES Keys,

 Supports requirements for Wi-Fi Protected Access (WPA and WPA2.0) and IEEE Std 802.11i

[Includes Hardware-Accelerated Advanced-Encryption Standard (AES)]

 Designed to work with IEEE Std 802.1x

 New advanced co-existence scheme with BT/BLE

 2.4/5.0 GHz Radio

 Internal LNA, PA and RF switch

 Supports: IEEE Std 802.11a, 802.11b, 802.11g and 802.11n

 Supports 4 bit SDIO host interface, including high speed (HS) and V3 modes

2.3 Bluetooth Features

 Supports Bluetooth 4.0 BLE

 Includes concurrent operation and built-in coexistence and prioritization handling of BT, BLE, audio processing and WLAN

 Dedicated Audio processor supporting on chip SBC encoding + A2DP:

 Assisted A2DP (A3DP) support - SBC Encoding implemented internally

 Assisted WB-Speech (AWBS) support - modified SBC codec implemented internally

2.4 BLE Features

 Fully compliant with BT4.0 BLE dual mode standard

 Support for all roles and role-combinations, mandatory as well as optional

 Supports up to 10BLE connection

 Independent buffering for LE allows having large number of multiple connections without affecting

BR/EDR performance

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Please read Cautions and warnings and

Important notes at the end of this document.

Page 6 of 51

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Complementary wireless module WLAN / BT

Standard Laminate SiP Module

3

Detailed Description

B30931D7020Y918

R078 (WL1837) / D7020

3.1 Host Interfaces

3.1.1 Device Host Interface Options

The following table summarizes the Host Controller interface options. All interfaces operate independently.

WLAN

Table 3-1 Host Controller Interface options

Shared HCI for BT Voice/Audio

BT

WLAN HS SDIO Over UART BT PCM

The Device incorporates UART module dedicated to the BT shared-transport Host Controller Interface (HCI) transport layer. The HCI interface is used to transport commands, events, and ACL between the Bluetooth device and its host using HCI data packets.

This acts as a shared transport for BT/BLE functional blocks.

3.1.2 WLAN SDIO Transport Layer

The SDIO is the host interface for WLAN. The interface between the host and the D7020 uses an SDIO interface and supports a maximum clock rate of 50MHz.

The Device SDIO also supports the following features of the SDIO V3 specification:

 4 bit data bus

 Synchronous and Asynchronous In-Band-Interrupt

 Default and High-Speed (50MHz) timing

 Sleep/wake commands

SDIO timing specifications are given in specification section at end of document.

3.1.3 HCI UART Shared Transport Layers for BT

The HCI UART supports most baud rates (including all PC rates) for all fast clock frequencies - up to maximum of 4 Mbps. After power up the baud rate is set for 115.2 kbps, irrespective of fast clock frequency. The baud rate can then be changed by using a VS command. The Device responds with a Command Complete Event (still at

115.2 kbps), after which the baud rate change takes place.

HCI hardware includes the following features:

 Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions.

 Transmitter underflow detection.

 CTS/RTS hardware flow control.

 4 wire (H4)

Parameter

Bit rate

Value

115.2 kbps

Data length

Stop bit

Parity

8 bits

1

None

Table 3-2 UART Default Setting

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Important notes at the end of this document.

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Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

3.1.3.1 UART 4 Wire Interface - H4

The interface includes four signals: TXD, RXD, CTS and RTS. Flow control between the host and the Device is byte-wise by hardware.

Flow control is obtained by the following:

Figure 3-1 HCI UART Connection

When the

RX buffer of the Device passes the “flow control” threshold, it will set the HCI_RTS signal high to stop transmission from the host.

When the CTS signal is set high, the Device will stop its transmission on the interface. In case CTS is set high in the middle of transmitting a byte, the Device will finish transmitting the byte and stop the transmission.

3.1.3.2 BT function Firmware Low Power Mode Protocols

The Device includes a mechanism that handles the transition between operating mode and deep sleep lowpower mode. The protocol is done via the UART and is known as eHCILL (enhanced HCI Low Level) power management protocol.

This protocol is backward compatible with the TI BT HCILL Protocol, so a Host that implements the HCILL does not need to change anything in order to work with the Device. The "Enhanced" portion of the HCILL introduces changes that allow a simpler host implementation of this protocol. See SWRA288 eHCILL Four-Wire Power

Management Protocol.

3.1.4 BT Audio CODEC Interface

3.1.4.1 Overview

The CODEC interface is a fully dedicated programmable serial port, supporting the following:

 Two voice channels

 Master / slave modes

 Coding schemes: u-Law, A-Law, Linear, Transparent and SBC (for Assisted WBS operation)

 Long & short frames

 Different data sizes, order and positions

 Enlarged interface options to support a wider variety of Codecs

3.1.4.2 PCM Hardware Interface

The PCM interface is one implementation of the codec interface. It contains the following four lines:

 Clock--configurable direction (input or output)

 Frame Sync--configurable direction (input or output)

 Data In--Input

 Data Out--Output/Tri state

The Device can be either the master of the interface where it generates the clock and the frame-sync signals, or slave where it receives these two signals. The PCM interface is fully configured by means of a VS command.

For slave mode, clock input frequencies between 64KHz and 12 MHz are supported..

For master mode, the Device can generate any clock frequency between 64 kHz and 6 MHz.

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Please read Cautions and warnings and

Important notes at the end of this document.

Page 8 of 51

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Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

3.1.4.3 PCM Data Format

The data format is fully configurable:

 The data length can be from 8 to 320 bits, in 1 bit increments, when working with two channels, or up to

640 bits when using 1 channel. The data length can be set independently for each channel.

 The data position within a frame is also configurable with 1-clock (bit) resolution, and can be set independently (relative to the edge of the Frame Sync signal) for each channel.

 The Data_IN and Data_OUT bit order can be configured independently. For example; Data_IN can start with MSB while Data_OUT starts with LSB. Each channel is separately configurable. The inverse bit order

(i.e. LSB first) is supported only for sample sizes up to 24 bits.

 The data in and data out size do not necessarily have to be the same length.

 The Data_OUT line is configured as a „high-Z‟ output between data words. Data_OUT can also be set for permanent high-Z, irrespective of data out. This allows the Device to be a bus slave in a multi-slave PCM environment. At power up, Data_OUT is configured as high-Z.

3.1.4.4 PCM Frame-Idle Period

The CODEC interface has the capability for frameidle periods, where the PCM clock can “take a break” and become „0‟ at the end of the PCM frame, after all data has been transferred.

The Device supports frame-idle periods both as master and slave of the PCM bus.

When Device is the master of the interface, the frame-idle period is configurable. There are 2 configurable parameters:

 Clk_Idle_Start - Indicates the number of PCM clock cycles from the beginning of the frame till the beginning of the idle period. After Clk_Idle_Start clock cycles, the clock becomes „0‟.

 Clk_Idle_End - Indicates the time from the beginning of the frame till the end of the idle period. This time is given in multiples of PCM clock periods.

The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period. e.g. For PCM clock rate = 1 MHz, frame sync period = 10 kHz, Clk_Idle_Start = 60, Clk_Idle_End = 90.

Between each two-frame sync there are 70 clock cycles (instead of 100). The clock idle period starts 60 clock cycles after the beginning of the frame and lasts 90-60=30 clock cycles. This means that the idle period ends 100-90=10 clock cycles before the end of the frame. The data transmission must end prior to the beginning of the idle period.

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Please read Cautions and warnings and

Important notes at the end of this document.

Page 9 of 51

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Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

3.1.5 Two Channel PCM Bus Example

In the following figure, a 2-channel PCM bus is shown where the two channels have different word sizes and arbitrary positions in the bus‟ frame. (FT stands for Frame Timer).

Figure 3-2 2 Channels PCM Bus Timing

3.1.6 PCM Audio Encoding

The Device CODEC interface can use one of four audio coding patterns:

 A-Law (8-bit)

 µ-Law (8-bit)

 Linear (8 or 16-bit)

 SBC (16-bit)

Two BT voice channels are not supported when SBC encoding is selected.

3.1.6.1 BT PCM Clock Mismatch Handling

In BT RX, the Device receives RF voice packets and writes these to the CODEC I/F. If the Device receives data faster than the CODEC I/F output allows, an overflow occurs. In this case, the Device BT function has 2 possible behavior modes: “allow overflow” and “don‟t allow overflow”.

 If overflow is allowed, the Device BT function continues receiving data and overwrites any data not yet sent to the CODEC.

 If overflow is not allowed, RF voice packets received when buffer is full, are discarded.

When the Bluetooth functional block is master on the PCM and slave on the Bluetooth network, the Bluetooth functional block can measure the drift between the two clocks and apply compensation to the PCM clock in order to avoid underrun and overrun scenarios

3.1.6.2 BT Inter-IC Sound (BT I2S over PCM bus)

The Device can be configured as an Inter-IC Sound (I2S) serial interface to a I2S CODEC device. In this mode, the Device audio CODEC interface is configured as a bi-directional, full duplex interface, with two time slots per frame: Time slot 0 is used for the left channel audio data and time slot 1 for the right channel audio data. Each time slot is configurable up to 40 serial clock cycles in length and the frame is configurable up to 80 serial clock cycles in length.

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Important notes at the end of this document.

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3.2 Clocks and Power Management

B30931D7020Y918

R078 (WL1837) / D7020

3.2.1 Slow Clock / RTC clock

The slow clock is a free-running clock of 32.768 KHz which is supplied from an external clock source. It is connected to the RTC_CLK pin and is a digital square-wave signal in the range of 0-1.8V nom.

3.2.2 Fast Clock System

3.2.2.1 Fast clock using external crystal

The devices incorporate an internal crystal oscillator circuit for supporting a cost optimized crystal based fast clock scheme. Connection is as shown:

Figure 3-3 XTAL Connection

C1 = C2. Typically 8 -

22pF. Refer to Crystal manufacturer‟s recommendations.

R = 390K ohm (+/- 5% tolerance).

NOTE : this arrangement does not support 5GHz band functions.

3.2.2.2 Fast Clock using external oscillator

CLK_IN_P is the main system fast clock and must meet the specifications as described in "Fast clock specifications" at the end of this document.

The clock must be one of the specified frequencies and the device incorporates an internal mechanism to detect this. The clock can be AC or DC coupled, sine or square wave.

Crystal operation is supported as shown:

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Important notes at the end of this document.

Figure 3-4 Fast Clock Block Diagram

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3.2.3 Power Management

B30931D7020Y918

R078 (WL1837) / D7020

3.2.3.1 Block Diagram - internal DC2DC's

The Device incorporates three internal DC2DC's (switched-mode power supplies) to provide efficient internal and external supplies, derived from Vbat.

Figure 3-5

Internal DC2DC’s

3.2.4 Reset / Power up system

After Vbat and VIO are fed to Device and while BT_EN, WLAN_EN are de-asserted (LOW), the device is in

Shutdown state.

While in Shutdown state all functional blocks, internal DC2DC's and LDO's will be disabled. The power supplied to the functional blocks is cut off.

When one of the two signals BT_EN or WLAN_EN are asserted (High) a Power On Reset (POR) is performed.

Stable Slow Clock, VIO and Vbat are pre-requisites for successful POR.

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Important notes at the end of this document.

Page 12 of 51

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3.2.4.1 Chip Top-level Power Up Sequence

B30931D7020Y918

R078 (WL1837) / D7020

Figure 3-6 Chip Top-level Power Up Sequence

3.2.4.2 WLAN Power Up Sequence

Figure 3-7 WLAN Power Up Sequence

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Page 13 of 51

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3.2.4.3 BT/BLE Power Up Sequence

B30931D7020Y918

R078 (WL1837) / D7020

Figure 3-8 BT Power Up Sequence

3.3 WLAN Functional Block

3.3.1 WLAN MAC

R078 (WL1837) / D7020 MAC implements the IEEE standard 802.11 MAC sub-layer using both dedicated hardware and embedded firmware. The MAC hardware implements real-time functions, including access protocol management, encryption and decryption.

3.3.2 WLAN Baseband Processor

R078 (WL1837) / D7020 baseband processor implements the IEEE 802.11a/b/g/n PHY sub layers and has been optimized to perform well in conditions of high multipath and noise.

3.3.3 WLAN RF Radio

R078 (WL1837) / D7020 WLAN radio is a highly integrated radio processor designed for 802.11a/b/g/n applications, including internal front-end PA's.

3.3.4 Coexistence BT/BLE - WLAN

R078 (WL1837) / D7020 has been designed to support simultaneous operation of each of the major on-chip core functions. This operational coexistence is based on extensive frequency planning for each of the on-chip core functions, as well as a sophisticated MAC co-ordination scheme between Bluetooth and WLAN subsystems that allows operation in the same ISM frequency band.

3.3.5 WLAN RF Configuration and Power Options

The R078 (WL1837) / D7020 includes all RF switches, band pass filters and diplexer for complete WLAN

(SISO) and BT RF system. Optional MIMO configuration is also supported with external band pass filter.

2014-12-9 SAW IT

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Important notes at the end of this document.

Page 14 of 51

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

Figure 3-9 R078 (WL1837) / D7020 SISO/MIMO configuration options

3.3.5.1 MIMO and SISO options (WL1837 device)

The diagram above shows WLAN and BT pins in standard SISO application and also for optional MIMO.

Standard configuration for SISO:

 WLAN 2.4/5GHz + BT

 WLAN/BT 2.4GHz simultaneous RX/RX

Optional configuration for MIMO:

 WLAN 2.4/5GHz + BT

 WLAN/BT 2.4GHz simultaneous RX/RX

 WLAN 2.4GHz MIMO

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Important notes at the end of this document.

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3.4 Bluetooth Functional Block

B30931D7020Y918

R078 (WL1837) / D7020

3.4.1 BT Digital Radio Processor (DRP)

The Device uses 8th-generation TI Bluetooth technology, with new features and improved radio performance.

3.4.2 BT Receiver

The receiver uses near-zero-IF architecture to convert the RF signal to baseband data. Received signal from the external antenna is input to an internal RF switch and a differential LNA (low-noise amplifier).

This signal is then passed to a mixer which down-converts the signal to an IF, followed by a filter and amplifier.

The signal is then quantized by a sigma-delta ADC. The quantized signal is further processed to reduce the interference level.

The demodulator digitally down-converts the signal to zero IF and recovers the data stream by an adaptive decision mechanism. The demodulator includes EDR processing with state-of-the-art performance. It includes a maximum-likelihood sequence estimator (MLSE) for improved performance of basic-rate BR sensitivity, and adaptive equalization to enhance EDR modulation.

3.4.3 BT Transmitter

The transmitter is based on an all-digital sigma-delta PLL with a digitally controlled oscillator (DCO) as the RF frequency clock. The modulation is achieved by directly modulating the digital PLL. The power amplifier is also digitally controlled.

For EDR modulation, the transmitter uses a Polar-Modulation technique. In this mode, in addition to the frequency modulation that controls the direct-modulated ADPLL, an amplitude control modulates the PA, using the Digital-Transmitter block. This block receives the input bit-stream and converts these signals to phasemodulated control-words. The phase-modulated digital signal is then processed to provide frequencymodulation control to the ADPLL.

3.4.4 Class 1.5 Application

Device provides on-chip support for Class 2 and Class 1.5 applications. Class 1.5 is the normal operating mode after the initialization script has been sent to the Device.

It is called Class 1.5 as Device can transmit more than 4dBm on any BT modulation.

Refer to Bluetooth RF Performance specifications at end of document for more information.

3.4.5 Advanced Audio features

The Device includes Audio and Voice Processor (AVPR) targeted for off-loading the host CPU from coding voice/audio samples when running A2DP and WBS profiles.

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Important notes at the end of this document.

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3.4.5.1 Assisted Wideband (WB) speech

 Encode/Decode 16kHz PCM audio samples to/from 64kbps SBC frames

 Fully compliant with the BT SIG Wideband speech profile

B30931D7020Y918

R078 (WL1837) / D7020

Figure 3-10 Device Wideband speech support

3.4.5.2 Assisted A2DP

 Encode 44.1/48kHz PCM audio samples to Low/Mid/High Quality A2DP stream

 Fully compliant with the BT SIG A2DP profile

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Figure 3-11 Device Assisted A2DP

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3.5 Terminal Assignements

The view is from top side:

A B C D

12 GND

BT_AUD_

FSYNC_S

B_DATA

GND VIO

E

GND

F

GND

11 GND

BT_AUD_I

N_SB_CL

K

GND GND GND

G

GND

H

GND

SDIO_D2_

WL

SDIO_CLK

_WL

GND

10 GND

BT_AUD_

CLK

GND

FUNC2_B

T

J

NC

BT_AUD_

OUT

K

NC

GND

L

NC

NC

GND

SDIO_D3_

WL

SDIO_D0_

WL

GND

DC2DC_R

EQ_MODE

_SOC

CLK_REQ

_OUT

GND

9

8

WLAN_BG

2

7

6

GND

GND

NC

GND

GND

GND

GND

GND

FUNC1_B

T

GND

SDIO_CM

D_WL

SDIO_D1_

WL

GND

SLOW_CL

K

NC

NC

PBIAS_TE

STP_W

NC

GND

GND

NC

GND

GND

GND

GND GND

COEX_M

WS_BT_W

L_TX_O

COEX_M

WS_FRAM

E_SYNC

COEX_M

WS_ACTI

VE

RX_SW_F

EM_WL

COEX_M

WS_RX_P

RI

NC

DC2DC_R

EQ_OUT_

SOC

WLAN_IR

Q

UART_DE

BUG

GPIO_2

NC

NC

NC

5 GND GND

PDET_TE

STM_W

GND GND GND

WLAN_EN

_SOC

FEM_PA_

EN_WL

NC GPIO_1

NC

NC

GND

NC

GND

4 GND GND NC

M

NC

GND

GND

GND

GND

GND

GND

GND

N

GND

GND

GND

GND

GND

GND

GND

GND

B30931D7020Y918

R078 (WL1837) / D7020

P

GND 12

NC 11

GND 10

NC 9

NC 8

NC 7

NC 6

GND 5

GND

BT_EN_S

OC

BT_HCI_R

X

BT_HCI_T

X

BT_HCI_R

TS

BT_HCI_C

TS

GPIO_3 GND VBAT1 VBAT2 VBAT3 4

DIGITAL

RF

Power

GND

CLOCK

DIGITAL

High

Speed

Not Used

NC

3

11abg_AN

T_1

GND GND GND GND GND GND GND GND GND GND GND GND GND 3

2 GND GND GND GND GND CLK_IN_P CLK_IN_M GND GND GND GND GND GND GND 2

1 GND

A

GND

B

GND

C

GND

D

GND

E

GND GND GND

PA_DC2D

C_IN

PA_DC2D

C_OUT

GND GND

F K L G H J

Top view

Figure 3-12 Terminal Assignements

M

GND

N

GND

P

1

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 18 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

3.6 Terminal Functions

Pin names and pin numbers in bracket apply to WSP pin out.

Table 3-3 Terminal Functions

Module Pin Name

(WSP Pin Name)

Module

Pin No.

(WSP ball no.)

I/O

Type

Shut

Down state after

POR

WLAN pins: I/O signals

SDIO_CLK_WL (SDIO_CLK_WL) G11 (E11) IN HiZ HiZ

Type

[mA]

SDIO_CMD_WL(SDIO_CMD_WL) F9 (D8) IN

SDIO_D0_WL (SDIO_D0_WL) G10 (E10) I/O HiZ HiZ

SDIO_D1_WL (SDIO_D1_WL) G9 (E9) I/O HiZ HiZ

SDIO_D2_WL (SDIO_D2_WL) F11 (D11) I/O HiZ HiZ

SDIO_D3_WL (SDIO_D3_WL) F10 (D10) I/O HiZ PU

WLAN_IRQ (IRQ_WL)

GPIO_1 (GPIO1)

GPIO_2 (GPIO2)

G6

(E3)

HiZ HiZ

OUT PD Drive 0

K5 (H1) I/O PD PD

J6 (H2) I/O PD PD

Description

WLAN SDIO clock. Must be driven by the host.

WLAN SDIO command in. Host must pull up.

WLAN SDIO data bit 0. Host must pull up.

WLAN SDIO data bit 1. Host must pull up.

WLAN SDIO data bit 2. Host must pull up.

WLAN SDIO data bit 3. Changes state to PU at WL_EN or BT_EN assertion for card detect. Later disabled by the SW during init.

Host must pull up.

SDIO available, interrupt out.

Active high. To use

WL_RS232_TX/RX lines, need to pull up with 10K resistor.

Option: WL_RS232_TX (when

IRQ_WL = 1 at power up)

Option: WL_RS232_RX (when

IRQ_WL = 1 at power up)

WLAN logger Option: GPIO3

NC

GPIO_3 (UART_DBG_WL)

FEM_PA_EN_WL

(GPIO13)

RX_SW_FEM_WL

K4 (G4) OUT PU PU

H5 (F2)

G7 (F3)

(SW_CTRL_BG_IO1)

PBIAS_TESTP_W

(PABIAS_OUT_FEM_TESTP_WL)

C6 (C7) ANA

C5 (C6) ANA PDET_TESTM_W

(PDET_IN_FEM_TESTM_WL)

WLAN Pins: RF antenna

11abg_ANT_1 A3 RF

NC

NC

NC

WLAN_BG2 A8 RF

WLAN ABG / BT RX and TX 50

Ω input and output. No external matching required.

Second 2.4GHz WLAN BG input and output for MIMO functionality.

Requires external RF filter.

BT pins: I/O Signals

BT_HCI_RX (HCI_RX_BT) F4 (E7) IN PU PU

BT_HCI_TX (HCI_TX_BT) G4 (F7) OUT PU PU

HCI UART RX from host. Shared

HCI I/F for BT.

NC if not used.

HCI UART TX to host. Shared HCI

I/F.NC if not used.

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 19 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

Module Pin Name

(WSP Pin Name)

BT_HCI_RTS (HCI_RTS_BT)

BT_HCI_CTS (HCI_CTS_BT)

UART_DEBUG

(UART_DEBUG_BT)

FUNC1_BT (FUNC1_BT)

FUNC2_BT (FUNC2_BT)

BT_AUD_CLK (AUD_CLK_BT)

BT_AUD_FSYNC_SB_DATA

(AUD_FSYNC_BT)

BT_AUD_IN_SB_CLK

Module

Pin No.

(WSP ball

I/O

Type

Shut

Down state after

POR no.)

H4 (G6) OUT PU PU

Type

[mA]

J4 (F6)

H6 (G2)

D9 (E8)

IN

D10 (B11) IN

PU

OUT PU

OUT PD

PD

B10 (G11) OUT PD

B12 (H11) OUT PD

PU

PU

PD

PD

PD

PD

B11 (G9) IN PD PD

(AUD_IN_BT)

BT_AUD_OUT (AUD_OUT_BT) J11 (G10) OUT PD PD

Description

HCI UART RTS to host. Shared

HCI I/F. NC if not used.

HCI UART CTS from host. Shared

HCI I/F. NC if not used.

BT UART debug (logger). NC if not used.

Optional: BT_HOST_WAKE_UP signal to wake-up the HOST from

BT. NC if not used.

Optional: BT_WAKE_UP Bluetooth wakeup from HOST.

NC if not used.

BT PCM/I2S bus clock.

NC if not used.

BT PCM/I2S bus frame sync. NC if not used.

BT PCM/I2S bus data input.

NC if not used.

BT PCM/I2S bus data output.

NC if not used.

JTAG pins

JTAG_TCK

JTAG_TMS

JTAG_TDI

JTAG_TDO

Clock pins

CLK_IN_P

C8 (F11) IN

C7 (F8) IN

F2 (E4) ANA

PD

PD

PD

PD

C4 (F9) IN PD PD

D8 (F10) OUT PD PD

JTAG_TCK NC if not used

JTAG_TMS NC if not used

JTAG_TDI NC if not used

JTAG_TDO NC if not used

CLK_IN_M

SLOW_CLK (RTC_CLK)

CLK_REQ_OUT

G2 (E5)

J9 (H8)

ANA

ANA

K10 (K11) OUT PD PD

FREF/TCXO input for all functional blocks

Connect to GND

Sleep clock 32.768 kHz

Request external fast clock

NC if not used.

Enable pins

BT_EN_SOC (BT_EN)

WLAN_EN_SOC (WLAN_EN)

Power management pins

VBAT1

VBAT2

VBAT3

VIO

PA_DC2DC_IN

PA_DC2DC_OUT

DC2DC_REQ_OUT_SOC (NU)

E4 (E2)

G5 (E1)

M4

N4

P4

D12

J1

K1

F6 (D3)

IN

IN

POW

POW

POW

POW

POW

POW

DC2DC_REQ_MODE_SOC (NU) J10 (J10)

PD

PD

PD

PD

High = enable

High = enable

Battery voltage

Battery voltage

Battery voltage

1.8V I/O power supply

PA power supply input, with internal PA_DC2DC connect to pin

PA_DC2DC_OUT K1.

DC2DC output for PA supply, with internal PA_DC2DC connect to pin

PA_DC2DC_IN J1.

NC

NC

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 20 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

Module Pin Name

(WSP Pin Name)

Module

Pin No.

(WSP ball

I/O

Type no.)

Shut

Down state after

POR

GND

GND

GND

GND

GND

GND

GND

GND

NU

NU

NU

NU

NU

NU

NU

NU

NU

Co-existence signals

COEX_MWS_RX_PRI

(COEX_MWS_UART_RX)

COEX_MWS_BT_WL_TX_O

(COEX_MWS_UART_TX)

COEX_MWS_ACTIVE

(COEX_MWS_PRE_TX)

COEX_MWS_FRAME_SYNC

(COEX_MWS_FRAME_SYNC)

Not used pins

NU

NU

NU

NU

NU

NU

NU

NU

NU

NU

NU

Ground pins

GND

GND

GND

GND

GND

GND

H7 (G5)

H8 (G7)

F7 (G8)

J8 (H7)

K9

K12

L6

L8

L9

L11

L12

M12

P6

P7

P8

P9

P11

A6

J5

J7

J12

K6

K7

K8

A10

A11

A12

B1

B2

B3

B4

B5

A1

A2

A4

A5

A7

A9

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

PU PU

PU PU

PU PU

PU PU

Type

[mA]

Description

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

General purpose IO.

NC if not used.

General purpose IO.

NC if not used.

General purpose IO.

NC if not used.

General purpose IO.

NC if not used.

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 21 of 51

2014-12-9

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

Module Pin Name

(WSP Pin Name)

B30931D7020Y918

R078 (WL1837) / D7020

E12

F1

F3

F5

F8

F12

G1

G3

G8

G12

E5

E6

E7

E8

E9

E10

E11

D4

D5

D6

D7

D11

E1

E2

E3

C9

C10

C11

C12

D1

D2

D3

Module

Pin No.

(WSP ball

I/O

Type no.)

B6 GND

Shut

Down state after

POR

B7

B8

B9

GND

GND

GND

C1

C2

C3

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

Type

[mA]

Description

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 22 of 51

2014-12-9

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

Module Pin Name

(WSP Pin Name)

B30931D7020Y918

R078 (WL1837) / D7020

N1

N2

N3

N5

N6

N7

N8

N9

N10

N11

M5

M6

M7

M8

M9

M10

M11

L3

L4

L5

L7

L10

M1

M2

M3

J2

J3

K2

K3

K11

L1

L2

Module

Pin No.

(WSP ball

I/O

Type no.)

H1 GND

Shut

Down state after

POR

H2

H3

H9

GND

GND

GND

H10

H11

H12

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

Type

[mA]

Description

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 23 of 51

2014-12-9

GND

GND

GND

GND

GND

GND

GND

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

Module Pin Name

(WSP Pin Name)

B30931D7020Y918

R078 (WL1837) / D7020

Module

Pin No.

(WSP ball

I/O

Type no.)

N12 GND

Shut

Down state after

POR

P1

P2

P3

GND

GND

GND

P5

P10

P12

GND

GND

GND

Type

[mA]

Description

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 24 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

4

Design Goal Specifications

Section Disclaimer

This Specification is based upon the Texas Instruments WL183x Data Sheet version 1.4, and is subject to any subsequent changes in applicable Texas Instruments documentation and software.

Any parameter marked TBD indicates that this is yet to be determined by TDK design/testing. Any parameter marked TBC indicates that this is yet to be determined in an update of Texas Instruments documentation.

4.1 General Chip Requirements and Operation

All parameters are measured as follows unless stated otherwise: VlO=1.8V

4.1.1 Absolute Maximum Ratings

(1)

VBAT

(2)

VIO

Input voltage to Analog pins

(3)

Input voltage to all other pins

Value

-0.5 to 5.5

-0.5 to 2.1

-0.5 to 2.1

(4)

Unit

V

V

V

V

Operating ambient temperature range

ESD Stress Voltage

(6)

Human Body Model

(7)

RF pins

Other

Charged Device Model

(8)

RF pins

-0.5 to (VDD_IO +

0.5V)

-40 to +85

(5)

>500

>1000

>300

°C

V

V

V

Other >250 V

(

1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The following signals are from the VBAT group: VBAT1, VBAT2, VBAT3

(3) Analog pins: WLAN_BG2, 11abg_ANT_1.

(4) 5.5V up to 10s cumulative in 7 years. 5V cumulative to 250s, 4.8V cumulative to 2.33 years

– all includes charging dips and peaks.

(5) Operating free-air temperature range. The device can be reliably operated for 7 years at T ambient

of 85

˚C, assuming 25% active mode and

75% sleep mode (15,400 cumulative active power-on hours).

(6) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.

(7) Level listed is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 500V HBM is possible if necessary precautions are taken. Pins listed as 1000V may actually have higher performance.

(8) Level listed is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process, and manufacturing with less than 250V CDM is possible if necessary precautions are taken. Pins listed as 250 V may actually have higher performance.

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 25 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

4.1.2 Recommended Operating Conditions

Rating

1.8V core supply voltage

Vbat

Condition

DC supply range for all modes

IO high-level input voltage

IO low-level input voltage

Enable inputs high-level input voltage

Enable inputs low-level input voltage

High-level output voltage @4 mA

@ 1 mA

Sym Min

VIH

VIL

1.7

3.4

Max

1.95

4.3

0.65 x VDD_IO VDD_IO

0 0.35 x VDD_IO

VDD_IO

Low-level output voltage

@0.3 mA

@4 mA

@ 1 mA

Vil_en 0 0.4

VOH VDD_lO

– 0.45 VDD_IO

VDD_lO

– 0.112 VDD_IO

VDD_IO- 0.033 VDD_IO

VOL 0 0.45

0 0.112

0.01

10 Input transitions time Tr/Tf from 10% to 90% (Digital IO)

(1)

Output rise time from 10% to 90%

(Digital pins)

(1)

@0.09 mA

CL <25 pF Tr

Output fall time from 10% to 90%

(Digital pins)

(1)

Ambient operating temperature

CL <25 pF Tf

(1) Applies to all Digital lines except SDIO, SPI, UART, I2C, PCM and slow clock lines

0

Tr/Tf 1

-40

5.3

4.9

+85

Unit

V ns ns

°C

4.1.3 External Digital Slow Clock Requirements (-40°C to +85°C)

The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input.

Characteristics

Input slow clock frequency

Input slow clock accuracy

(initial + temp + aging)

Condition

WLAN, BT

Sym Min Typ

32768

Max

±250

Unit

Hz ppm

Input transition time Tr/Tf -lO% to 90%

Frequency input duty cycle

Input voltage limits Square wave,

DC-coupled

Tr/Tf

Vih

Vil

15

0.65xVDD_I

O

0

50

100

85 ns

%

VDD_IO Vpeak

Input impedance

Input capacitance

1

0.35xVDD_I

O

5

MΩ pF

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 26 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

4.1.4 External fast clock Crystal Requirements and operation (-40°C to +85°C)

Characteristics Condition Min Typ Max Unit

Supported frequencies

Frequency accuracy

Load capacitance, C

L

(1)

Equivalent Series Resistance, ESR

Initial + temp + aging

26, 38.4

5

±20

13

60

MHz ppm pF ohms

Drive level 100 uW

1) Load capacitance, CL = [C1.C2] / [C1 + C2] + CP, where C1, C2 are the capacitors connected on CLK_IN_P & CLK_IN_M respectively and CP is the parasitic capacitance (typically 1-2pF).

For example, for C1 = C2 = 12pF and CP = 2pF, then CL = 8pF.

4.1.5 External TCXO CLK Requirements (-40°C to +85°C)

Parameter

Supported frequency

Frequency accuracy

Input voltage limits (TCXO_P)

Conditions

Total short and long term

Sine wave/ ac-coupled

5GHz WLAN

Min

26, 38.4

2.4GHz WLAN 0.2

0.8

Typ Max

±20

1.4

1.4

Input impedance,

26 MHz

RP

CP

Input resistance

Input capacitance

20

2.5

Input impedance,

38.4 MHz

RP

CP

Input resistance

Input capacitance

Power-up time

(1)

Phase noise 2.4GHz for 38.4MHz

20MHz SISO

(2)

Measured at 1 KHz offset

Measured at 10 KHz offset

Measured at 100 KHz offset

15

Unit

MHz ppm

Vp-p

2.5 kΩ pF kΩ pF

5 ms

-120 dBc/Hz

-130

-135 dBc/Hz dBc/Hz

Phase noise 2.4GHz for 38.4MHz

40MHz SISO

(2)

Measured at 1 KHz offset

Measured at 10 KHz offset

Measured at 100KHZ offset

Phase noise 2.4GHz for 38.4MHz

20MHz MIMO

(2)

Measured at 1 KHz offset

Measured at 10 KHz offset

-125

-139 dBc/Hz

-132 dBc/Hz

-136.5 dBc/Hz

-125 dBc/Hz dBc/Hz

Phase noise 5GHz for 38.4MHz,

20/40MHz SISO

(2)

Measured at 100KHZ offset

Measured at 1 KHz offset

-144

-125 dBc/Hz dBc/Hz

Measured at 10 KHZ offset -142 dBc/Hz

Measured at 100KHZ offset -145 dBc/Hz

(1) Power-up time is calculated from the time CLK_REQ_OUT asserted till the time the TCXO_CLK amplitude is within voltage limit specified above and TCXO_CLK frequency is within

0.1 ppm of final steady state frequency.

(2) The phase noise numbers listed here must be met at 38.4 MHz. For other frequencies the phase noise requirement is corrected by adding 20 x log10(f

TCXO

/ 38.4e6) dB. Specifically, for 26 MHz TCXO, the correction factor would be -3.4 dB.

* The slope of the clock at zero-crossings should not be less than that of a 200 mVp-p sine-wave (800 mVp-p for 11a band). i.e. 26MHz clock: 16V/μs (for 11bg band) 38.4MHz clock: 24V/μs (for 11bg band)

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 27 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

4.2 WLAN RF Performance

All specifications in this draft data sheet are design goal level and subject to change. All specifications have been measured using TDK CB (Carrier Board) and are given at the module pins (Carrier Board insertion loss is de-embedded). All measurements have been performed over VBAT voltage range from 3.4V to 4.3V and over temperature range from -40°C to +85°C.

* MIMO function is confirmed by only WL183x.

* 11n 40MHz bandwidth function is available. However the RF performance is guaranteed by only WL183x.

4.2.1 WLAN 2.4 GHz Radio Characteristics

4.2.1.1 WLAN 2.4 GHz Receiver RF Characteristics

Characteristics

Operation frequency range

Sensitivity (ANT1)

20MHz bandwidth.

At < 10% PER limit

Max Input Level

At < 10% PER limit

Adjacent Channel Rejection at sensitivity level +3 for OFDM and

+6 for CCK

LO leakage

Condition

1 Mbps DSSS

54 Mbps OFDM

MCS7

OFDM (11g/n)

CCK

2Mbps

11 Mbps

54 Mbps

Min

2400

–19

–4

42.7

37.9

2

Typ

–80

Max

2480

-91

-70

-65

Unit

MHz dBm dBm dB dBm

4.2.1.2 WLAN 2.4 GHz Receiver Blocking Characteristics Per Band

The R078 (WL1837) / D7020 is designed to coexist with co-located cellular transmitters. Table below lists typical cellular interference sources and the corresponding maximum power from the cellular interference source that can be present at the input terminal of R078 (WL1837) / D7020, such that WLAN receiver sensitivity is not degraded by more than 1 dB. (Further improvement is achieved by antenna isolation)

Characteristics Condition Min Typ Max Unit

Blocking performance at other bands dBm 776 to 794 MHz (CDMA)

824 to 849 MHz (GMSK)

824 to 849 MHz (EDGE)

824 to 849 MHz (CDMA)

880 to 915 MHz (GMSK)

880 to 915 MHz (EDGE)

1710 to 1785 MHz (GMSK)

1710 to 1785 MHz (EDGE)

1850 to 1910 MHz (GMSK)

1850 to 1910 MHz (EDGE)

1850 to 1910 MHz (CDMA)

1850 to 1910 MHz (WCDMA)

1920 to 1980 MHz (WCDMA)

+10

+10

+10

+10

+21

+21

+3

+3

-3

-3

-10

-10

-10

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 28 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

4.2.1.3 WLAN 2.4 GHz Transmitter power

RF transmission (Tx) tests are done in continuous transmission.

Characteristics Condition

Maximum output power 1 Mbps

-Notice that

11Mbps

WLAN_BG2 path requires external RF filter.

+12

+12

6 Mbps at EVM: -10 dB, +10

54 Mbps at EVM: -25 dB +9

MCS0 (Greenfield) at +9

EVM: -10 dB

+8 MCS7 (Greenfield) at

EVM: -28 dB

Output power accuracy

11abg_ANT_1 pin

Min Typ Max

+15

+15

+13

+12

+13

+11

±1.5

Transmit power control resolution

0.125

B30931D7020Y918

R078 (WL1837) / D7020

WLAN_BG2 pin

Min Typ Max

Unit

dBm

+16 +19

+13.5 +15

+15.6 +19

+12.1 +14

±1.5

0.125 dB dB

4.2.1.4 WLAN 2.4 GHz Transmitter out-of-band emissions

Table below shows 2.4GHz WLAN transmitter out-of-band emissions for each band listed in the Condition column. The wideband noise at 2.4GHz WLAN antenna port is also listed.

Characteristics

Cellular bands out-of-band broadband emissions(1)

Cellular bands out-of-band spurious emissions

Condition

746 to 764 MHz (CDMA1)

869 to 894 MHz (GSM850)

925 to 960 MHz (EGSM900)

1570 to 1580 MHz (GPS)

1596 to 1609 MHz (GLONASS)

1805 to 1880 MHz (DCS1800)

1930 to 1990 MHz (PCS1900)

2110 to 2170 MHz

746 to 764 MHz (CDMA)

869 to 894 MHz (CDMA, GSM850)

925 to 960 MHz (EGSM900)

1570 to 1580 MHz (GPS)

1805 to 1880 MHz (DCS1800)

1930 to 1990 MHz (PCS1900, CDMA)

Spurious emission during operation at

1MHz RBW

2110 to 2170 MHz

30MHz

– 1GHz

2 nd

harmonic

3 rd

harmonic

4 th

harmonic

5 th

harmonic

(1) Figures are for max transmission power for all available modulations. The setup noise floor is -167dBm/Hz.

Min Typ Max Unit

-145 dBm/Hz

-145

-138

-142

-130

-140

-120

-129

-44.2

-44.2

(4)

(4)

dBm

-44.2

-44.2

(4)

(4)

-44.2

-44.2

-44.2

(4)

(4)

(4)

–55

(2)

–33

(3) dBm

–33

(3)

–33

–33

(3)

(3)

(2) Based on TI IC performance

(3) ETSI limit plus 3dB margin

(4) FCC conductive limit plus 3dB margin

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 29 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

4.2.1.5 2.4GHz WLAN Current Consumption

Active Current

Spec item

(1)

Tx 11CCK @15dBm

Tx 54OFDM @12dBm

MIN TYP

345

MAX Units

380 mA

320 mA

290

Rx 65 75 mA

(1) All measured at ANT1 and the 3.6V VBAT rail of the solution. TCXO current included.

B30931D7020Y918

R078 (WL1837) / D7020

4.2.2 WLAN 5 GHz Radio Characteristics

4.2.2.1 WLAN 5 GHz Receiver RF Characteristics

Characteristics

Operation frequency range

Sensitivity

(1)

Condition

54 Mbps OFDM

Notes:

-20MHz bandwidth.

MCS7

-At < 10% PER limit

Max Input Level 802.11a/n

Adjacent channel rejection 54 Mbps

LO leakage

(1) The sensitivity is guaranteed at only 36ch (5180MHz).

Min

4910

–27

2

Typ

–53

Max

5835

-70

-65

Unit

MHz dBm dBm dBm

4.2.2.2 WLAN 5 GHz Receiver Blocking Characteristics Per Band

The R078 (WL1837) / D7020 is designed to coexist with co-located cellular transmitters. Table below lists typical cellular interference sources and the corresponding maximum power from the cellular interference source that can be present at the input terminal of R078 (WL1837) / D7020, such that WLAN receiver sensitivity is not degraded by more than 1 dB. (Further improvement is achieved by antenna isolation)

Characteristics Condition Min Typ Max Unit

Blocking performance at other bands dBm 776 to 794 MHz (CDMA)

824 to 849 MHz (GMSK)

824 to 849 MHz (EDGE)

824 to 849 MHz (CDMA)

880 to 915 MHz (GMSK)

880 to 915 MHz (EDGE)

1710 to 1785 MHz (GMSK)

1710 to 1785 MHz (EDGE)

1850 to 1910 MHz (GMSK)

1850 to 1910 MHz (EDGE)

-10

-10

-10

-10

-10

-10

-10

-18

-39

-39

1850 to 1910 MHz (CDMA)

1850 to 1910 MHz (WCDMA)

1920 to 1980 MHz (WCDMA)

-39

-39

-23

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 30 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

4.2.2.3 WLAN 5 GHz Transmitter power

RF transmission (Tx) tests are done in continuous transmission.

Characteristics Condition

6 Mbps at EVM: -10 dB,

Min Typ

+10 +12

54 Mbps at EVM: -25 dB +6

MCS0 (Greenfield) at EVM: -10 dB +8

MCS7 (Greenfield) at EVM: -28 dB +7

-1.5

+9

+11

+14

Output power accuracy

Transmit power control resolution

0.125

Max Unit

dBm

+1.5 dB dB

4.2.2.4 WLAN 5 GHz Transmitter out-of-band emissions

Table below shows 5GHz WLAN transmitter out-of-band emissions for each band listed in the Condition column.

The wideband noise at 5GHz WLAN antenna port is also listed.

Characteristics

Cellular bands out-of-band broadband emissions

Cellular bands out-of-band spurious emissions

Condition

746 to 764 MHz (CDMA2000)

869 to 894 MHz (GSM850)

925 to 960 MHz (EGSM900)

1570 to 1580 MHz (GPS)

1570 to 1580 MHz (GLONASS)

1805 to 1880 MHz (DCS1800)

1930 to 1990 MHz (PCS1900)

2110 to 2170 MHz (WCDMA FDD)

746 to 764 MHz (CDMA2000)

869 to 894 MHz (GSM850)

925 to 960 MHz (EGSM900)

1570 to 1580 MHz (GPS)

1570 to 1580 MHz (GLONASS)

1805 to 1880 MHz (DCS1800)

1930 to 1990 MHz (PCS1900, CDMA)

2110 to 2170 MHz (WCDMA FDD)

2 nd harmonic 11an

(1) Figures are for max transmission power for all available modulations. The setup noise floor is -167dBm/Hz.

Min Typ Max Unit

-143 dBm/Hz

-143

-143

-145

-145

-110

-105

-142

-44.2

(4) dBm

-44.2

(4)

-44.2

(4)

-44.2

(4)

-44.2

(4)

-44.2

(4)

-44.2

(4)

-44.2

(4)

–33

(3) dBm

(2) Based on TI IC performance

(3) ETSI Limit plus 3dB margin

(4) FCC conductive Limit plus 3dB margin

4.2.2.5 5GHz WLAN Current Consumption

Active Current

Spec item

(1)

Tx 6 OFDM @ 12dBm

Tx 54OFDM @ 9dBm

Rx

MIN

(1) All measured at the 3.6V VBAT rail of the solution. TCXO current included.

TYP

420

375

75

MAX

460

415

85

Units mA mA mA

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 31 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

4.3 Bluetooth RF Performance

All specifications in this draft data sheet are design goal level and subject to change. All specifications have been measured using TDK CB (Carrier Board) and are given at the module pins (Carrier Board insertion loss is de-embedded). All measurements have been performed over VBAT voltage range from 3.4V to 4.3V and over temperature range from -40°C to +85°C.

4.3.1 Bluetooth BR, EDR Receiver Characteristics

—In-Band Signals

Characteristics Condition Min Typ

Operation frequency range

Channel spacing

Input impedance

Sensitivity (1)

Dirty TX on

BR, BER = 0.1%

EDR2, BER = 0.01%

EDR3, BER = 0.01%

EDR2, BER = 0.1%

2402

–86

–85

–78

1e-6

1

50

–90

–89

–82

EDR BER floor at sensitivity + 10 dB, dirty TX off (for

1,600,00 bits)

Maximum useable input power

EDR3, BER = 0.1%

BR, BER = 0.1%

EDR2, BER = 0.1%

EDR3, BER = 0.1%

Level of interferers

For n = 3, 4, and 5

1e-6

–5

–10

–10

–36 –30

Intermodulation characteristics

C/I performance

Note: Numbers show

BR, co-channel

EDR, co-channel EDR2 wanted-signal to

EDR, adjacent

–2MHz,

EDR3 interfering-signal

BR, adjacent ±1 MHz ratio. Smaller numbers indicate better C/I performance. Image =

–1 MHz

EDR, adjacent

±1MHz, (image)

BR, adjacent +2 MHz

EDR, adjacent

+2MHz

EDR2

EDR3

EDR2

EDR3

BR, adjacent

–2 MHz

EDR2

EDR3

BR, adjacent | ±3 | MHz

EDR, adjacent EDR2

8

9.5

16.5

–10

–10

–5

–38

–38

–38

–28

–28

–22

–45

–45

–44

| ±3 | MHz

EDR3

RF return loss

(1) Sensitivity degradation up to

–3 dBm may occur due to fast clock harmonics with dirty Tx on.

Max

2480

Bluetooth Unit

Spec

MHz

10

12

20

–3

–3

2

–33

–33

–28

–22

–20

–13

–42

–42

–36

–10

–70

–70

–70

1e-5

1e-5

–20

–20

–20

–39

11

13

21

0

0

5

–30

–30

–25

–20

–20

–13

–40

–40

–33

MHz

Ω dBm dBm dBm dB dB

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 32 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

4.3.2 Bluetooth Receiver Characteristics

—General Blocking

Characteristics Condition Min

Blocking performance over full range, according to

Bluetooth specification

(1)

30 to 2000 MHz

2000 to 2399 MHz

-6

-6

2484 to 3000 MHz -6

3 to 12.75 GHz -6

(1) Exceptions taken out of the total 24 allowed in the Bluetooth spec.

Typ

B30931D7020Y918

R078 (WL1837) / D7020

Bluetooth Spec Unit

-10

-27 dBm

-27

-10

4.3.3 Bluetooth Receiver Characteristics

—GFSK, EDR2, EDR3 Blocking Per Band

Characteristics

Blocking performance for various cellular bands.

Condition

776 to 794 MHz (CDMA) (1)

Min Typ Unit

+13

824 to 849 MHz (GMSK) (1)

Hopping on.

824 to 849 MHz (EDGE) (1)

Wanted signal: -3 dB from sensitivity, with modulated continuous blocking signal.

824 to 849 MHz (CDMA,QPSK)

BER = 0.1% for BT BR, BER = 0.01% for BT EDR,

880 to 915 MHz (GMSK)

PER = 1%

880 to 915 MHz (EDGE)

+22

+14

(1) +13

+11

+10

1710 to 1875 MHz (GMSK) +17 dBm

1710 to 1875 MHz (EDGE)

1850 to 1910 MHz (GMSK)

1850 to 1910 MHz (EDGE)

+3

-3

-5

1850 to 1910 MHz (CDMA,QPSK) -5

1850 to 1910 MHz (WCDMA,QPSK) -1

1920 to 1980 MHz (WCDMA,QPSK) -2

(1) Expect for frequencies where (3 x F_BLOCKER falls within the BT band (2400-2483.5 MHz).

4.3.4 Bluetooth Transmitter, BR, Class 1.5

Characteristics Min

RF output power

Gain control range

Power control step

Adjacent channel power |M

–N| = 2

Adjacent channel power |M

–N| > 2

4.3.5 Bluetooth Transmitter, EDR, Class 1.5

Characteristics

EDR relative power

Gain control range

Power control step

Adjacent channel power |M

–N| = 1

Adjacent channel power |M

–N| = 2

Adjacent channel power |M

–N| > 2

9

2

Typ

11

30

5

–43

–48

Max

8

–35

–40

Bluetooth

Spec

2 to 8

<

–20

<

–40

Unit

dBm dB dBm

2

Min Typ Max Bluetooth

–2

30

1

Units

Spec

–4 to +1 dB

5 8 2 to 8

–36 –30 <–26

–30 –23 <–20

–42 –40 <–40 dBm

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 33 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

4.3.6 Bluetooth Modulation, BR

—Class 1.5

Characteristics Condition Sym Min

–20 dB BW

Average deviation detector bandwidth

10 MHz

Instantaneous deviation

Mod Data = 4-1, 4-0

1111000011110000... dF1 avg 145

Mod data =

10101…

1010101... dF2 max 120 dF2/dF1

Carrier frequency drift DH1

DH3 and DH5 lfk+5

– fkl , k = 0 ….

Drift rate

Initial carrier frequency tolerance

85

-25

-35

-25

Typ

925

160

130

88

4.3.7 Bluetooth Modulation, EDR, Class 1.5

Characteristics Condition Min

Carrier frequency stability

Initial carrier frequency tolerance

RMS DEVM (1) EDR2

99% DEVM (1)

EDR3

EDR2

Peak DEVM (1)

EDR3

EDR2

EDR3

-5

-25

Typ

9

9

4

4

4.3.8 Bluetooth Transceiver, Out-of-Band Emissions

Characteristics Condition

TX out-of-band emissions 746 to 764 MHz (CDMA)

869 to 894 MHz (CDMA1, GSM)

925 to 960 MHz (E-GSM)

Typ

1570 to 1580 MHz (GPS)

1598 to 1607 MHz (GLONASS)

1805 to 1880 MHz (DCS,

WCDMA)

1930 to 1990 MHz (PCS)

2110 to 2170 MHz (WCDMA)

Max

5

25

15

10

30

20

25

18

25

35

15

25

Max

-143

-141

-140

-137

-137

-133

-131

-121

B30931D7020Y918

R078 (WL1837) / D7020

Max

995

170

Bluetooth Unit

Spec

1000 kHz

140 to 175 kHz

> 115 kHz

> 80 %

< ±25 kHz

< ±40

< 20 kHz/ 50µs

<± 75 s

Bluetooth spec

≤10

± 75

Unit

kHz kHz

20

13

30

20

35

25

%

%

%

%

%

%

Unit

dBm/Hz

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 34 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

4.3.9 Bluetooth Transceiver, Spurious Emissions

Characteristics

out-of-band spurious emissions

Condition

76 to 108 MHz (FM)

746 to 764 MHz (CDMA)

869 to 894 MHz (CDMA1, GSM)

925 to 960 MHz (E-GSM)

1570 to 1580 MHz (GPS)

1805 to 1880 MHz (GSM)

1930 to 1990 MHz (GSM, CDMA1, WCDMA)

2110 to 2170 MHz (WCDMA)

Typ

B30931D7020Y918

R078 (WL1837) / D7020

Max

-44.2

-44.2

-44.2

-44.2

-44.2

-44.2

-44.2

-44.2

Unit

dBm

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 35 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

4.4 BLE RF performance

All specifications in this draft data sheet are design goal level and subject to change. All specifications have been measured using TDK CB (Carrier Board) and are given at the module pins (Carrier Board insertion loss is de-embedded). All measurements have been performed over VBAT voltage range from 3.4V to 4.3V and over temperature range from -40°C to +85°C.

* BLE function is available. However the RF performance is guaranteed by only WL183x.

4.4.1 BLE Receiver Characteristics

—In-Band Signals

Characteristics

Operation frequency range

Channel spacing

Input impedance

Sensitivity

(1)

Dirty TX on

Maximum useable

Condition

(2) dirty Tx on input power

Intermodulation characteristics

C/I performance

Level of interferers

For n = 3, 4, and 5

BLE, co-channel

Note: Numbers show wanted-signal to interfering-signal ratio. Smaller numbers indicate better C/I performance. Image =

–1 MHz

BLE, adjacent ±1 MHz

BLE, adjacent +2 MHz

BLE, adjacent

–2 MHz

BLE, adjacent

≥|±3| MHz

Min

2402

-88

-5

-36

Typ

2

50

–91

-30

8

–5

–45

–22

–47

(1) Sensitivity degradation up to

–3 dBm may occur due to fast clock harmonics with dirty Tx on.

Max

2480

12

0

–38

–15

–40

BLE

Spec

≤ -70

≥ -10

≥ -50

≤ 21

≥ 15

≤ -17

≤ -15

≤ -27

(2) BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to BLE test spec.

4.4.2 BLE Receiver Characteristics

—General Blocking

Characteristics

Blocking performance over full range, according to BLE specification (1)

Condition

30 to 2000 MHz

2000 to 2399 MHz

2484 to 3000 MHz

Min

-15

-15

-15

3 to 12.75 GHz

(1) Exceptions taken out of the total 10 allowed for fbf_1, according to the BT LE Spec.

-15

BLE spec

-30

-35

-35

-30

Unit

MHz

MHz

Ω dBm dBm dBm dB

Unit

dBm

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 36 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

4.4.3 BLE Receiver Characteristics

—Blocking Per Band

Same as BT BR with following conditions:

- Hopping off.

- Desired signal: -3dB from sensitivity, with modulated continuous blocking signal. PER = 30.8%

4.4.4 BLE Transmitter

Characteristics Min Typ Max BLE

Spec

Unit

RF output power

Adjacent channel power |M

–N| = 2

Adjacent channel power |M

–N| > 2

6 8

-51

-54

–43

–46

<10

<

<

–30 dBm

–20 dBm

(1) BLE spec = 10dBm max can be achieved using normal system losses due to filters etc, or by reducing value through VS command.

4.4.5 BLE Modulation

Characteristics Condition

(1)

Min

BLE modulation characteristics

ΔF1 avg

Mod Data = 4-1, 4-0;

1111000011110000...

240

ΔF2 max ≥ limit for at least 99.9% of all

∆f2max

ΔF2avg / ΔF1avg lf0

– fnl , n = 2,3 ….K

BLE carrier frequency drift

BLE drift rate

BLE initial carrier frequency tolerance lf1

– f0l and lfn – fn-

5l, n = 6,7….K fn

– ftx

Mod data = 10101... 195

85

–25

-25

(1) Performance figures at maximum power.

4.4.6 BLE Transceiver, Out-Of-Band and Spurious Emissions

Same as BT basic rate.

Typ

250

215

90

Max

260

25

15

25

BLE

Spec

225 to

275

> 185

> 80

<±50

< 20

<±150

Unit

kHz kHz

% kHz kHz/50µs kHz

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 37 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

4.5 Interface Timing Characteristics

4.5.1 UART timing

B30931D7020Y918

R078 (WL1837) / D7020

Figure 4-1 UART timing diagram

Parameter

Baud rate

Baud rate accuracy per byte

Baud rate accuracy per bit

CTS low to TX_DATA on

CTS high to TX_DATA off

CTS High Pulse Width

RTS low to RX_DATA on

RTS high to RX_DATA off

Table 4-1 UART timing

Condition

Receive/Transmit

Receive/Transmit

Hardware flow control

Interrupt set to ¼ FIFO

Symbol Min

t4 t6 t1 t2 t3

1

0

37.5

-2.5

-12.5

0

Typ

2

2

Max Unit

4364

+1.5

Kbps

%

+12.5 %

µs

1

16

Byte

Bit

µs

Bytes

 STR

-

 D0..Dn -

 PAR

 STP

-

-

Start bit

Data bits (LSB first)

Parity bit (if used)

Stop bit

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 38 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

4.5.2 SDIO timing specifications

B30931D7020Y918

R078 (WL1837) / D7020

4.5.2.1 SDIO Switching Characteristics - Default rate input and output

Specification is over recommended operating conditions. Parameters are for default clock frequency.

Figure 4-2 SDIO default input timing

Figure 4-3 SDIO default output timing

Table 4-2 SDIO Switching Characteristics

– Deault Rate

Parameter

fclock

DC tTLH tTHL tISU t

IH tODLY

CI

Clock frequency, CLK

Low/high duty cycle

Rise time, CLK

Fall time, CLK

Setup time, input valid before CLK

Hold time, input valid after CLK

Delay time, CLK

↓ to output valid

Capacitive load on outputs

Min

0

40

3

2

2.5

Max

26

60

10

10

14.8

15

Unit

MHz

% ns ns ns ns ns pF

Note: Option to change data out clock edge from falling edge (default) to rising edge, by setting configuration bit.

2014-12-9 SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 39 of 51

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

4.5.2.2 SDIO Switching Characteristics - High Rate

Specification is over recommended operating conditions. Parameters are for maximum clock frequency.

Figure 4-4 SDIO HS input timing

Figure 4-5 SDIO HS output timing

Parameter

fclock

DC tTLH tTHL tISU t

IH tODLY

CI

Table 4-3 SDIO Switching Characteristics

– High Rate

Clock frequency, CLK

Low/high duty cycle

Rise time, CLK

Fall time, CLK

Setup time, input valid before CLK

Hold time, input valid after CLK

Delay time, CLK

↓ to output valid

Capacitive load on outputs

3

Min

0

40%

2

2.5

3

3

Max

50

60%

14

10

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 40 of 51

Unit

MHz ns ns ns ns ns pF

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

4.5.3 BT Codec/PCM (audio) timing specifications

B30931D7020Y918

R078 (WL1837) / D7020

Figure 4-6 PCM Interface Timing

t is t ih t op t op

CI t

Symbol Parameter

tclk w

Cycle time

High or low pulse width

AUD_IN setup time

Table 4-5 PCM Master

AUD_IN hold time

AUD_OUT propagation time

AUD_FSYNC_OUT propagation time

Capacitive loading on outputs

0

0

0

Min

166.67 (6.144

MHz)

35% of Tclk min

10.6

Max Unit

15625 (64 kHz) ns

15

15

40 pF t is t ih t is t ih t op

CI

Symbol Parameter

tclk t w

Cycle time

High or low pulse width

AUD_IN setup time

AUD_IN hold time

AUD_FSYNC setup time

AUD_FSYNC hold time

AUD_OUT propagation time

Capacitive loading on outputs

Table 4-6 PCM Slave

0

5

0

Min Max

81 (12.288Hz))

35% of Tclk min

5

0 19

40

Unit

ns pF

SAW IT

Please read Cautions and warnings and

Important notes at the end of this document.

Page 41 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

4.6 Package Mechanical Drawing

Land Grid Array (LGA) Module

B30931D7020Y918

R078 (WL1837) / D7020

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Important notes at the end of this document.

Page 42 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

4.7 Schematic

B30931D7020Y918

R078 (WL1837) / D7020

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Important notes at the end of this document.

Page 43 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

5

Lead-free Product Status

All Epcos modules in mass production are lead-free. This is achieved by using only materials with lead contamination below 1000 ppm. The applied lead-free solder alloy is the main source of Pb-contamination, which together gives Pb-levels much below 50 ppm per module.

A comprehensive qualification for these lead-free module packages has been done. The related AQTP documentation is available from Epcos on request.

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Important notes at the end of this document.

Page 44 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

6

Recommended Reflow Profile

Profile Feature

Average Ramp-Up Rate (Ts

max

to Tp)

Preheat:

-Temperature Min (Ts

min

)

-Temperature Max (Ts

max

)

-Time (ts

min

to ts

max

)

Time maintained above:

-Temperature (T

L

)

-Time (t

L

)

Peak Temperature (Tp)

Time within 5°C of actual Peak

Temperature (Tp)

Ramp-Down Rate

Time 25°C to Peak Temperature

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Important notes at the end of this document.

Page 45 of 51

B30931D7020Y918

R078 (WL1837) / D7020

Range

3°C/second max.

150°C

200°C

60-120 seconds

217°C

60-150 seconds

245-250°C

20-40 seconds

6°C/second max.

8 minutes max.

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

7

Packing Information

7.1.1 Packaging flow

B30931D7020Y918

R078 (WL1837) / D7020

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Page 46 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

7.1.2 Outer Box

B30931D7020Y918

R078 (WL1837) / D7020

7.1.3 Inner Box

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Page 47 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

7.1.4 Tape drawing

B30931D7020Y918

R078 (WL1837) / D7020

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Page 48 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

8

Revision History

Version

0.1

0.2

0.3

0.3b

Date

7.1.2013

18.2.2013

18.4.2013

11.6.2013

9.10.2013

Status

Preliminary

Preliminary

Preliminary

Preliminary

Preliminary

0.4

0.5

0.6

0.7

0.8

18.10.2013

25.10.2013

07.03.2014

30.5.2014

Preliminary

Preliminary

Preliminary

Preliminary

B30931D7020Y918

R078 (WL1837) / D7020

Note

Initial

Update from TI - FM support removed

Update from TI - 5GHz WLAN RX MIMO support removed

LTE co-existence removed

4.2.1.1 remove MIMO description adding ANT2 description remove MCS8,15,32 change spec for 1Mbps change spec for 54Mbps change spec for MCS7

4.2.1.3 remove MIMO description remove MCS8,15,32 change spec for all rate

4.2.2.1 remove MCS8,15,32

4.2.2.3 remove MCS32 adding Notes

4.6 update Package Mechanical Drawing

Removed ANT function

Removed 802. 11d,e,h,k,r function

Removed Cisco support

Removed 802.11v support

4.2.1.1 removed 11Mbps,6Mpbs,MCS0

4.2.1.3 spec update

4.2.1.5 removed inactive current and update

4.2.2.1 removed 6Mpbs,MCS0

4.2.2.3 spec update

4.2.2.5 Current Consumption spec update

4.6 update Package Mechanical Drawing

Updated 3.2.4.2 WLAN Power Up Sequence

Updated Table 3-3 WLAN_IRQ (IRQ_WL)

Updated 4.1.2 DC supply range

Ambient operating temperature

Removed 11n BW40MHz function

Removed BLE function

Removed external Xtal option

Updated operation condition

(3.4 to 4.3V / -15 to +55degree C)

Updated all RF performance table

Updated tape drawing

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Important notes at the end of this document.

Page 49 of 51

2014-12-9

Complementary wireless module WLAN / BT

Standard Laminate SiP Module

B30931D7020Y918

R078 (WL1837) / D7020

Version

1.0

1.1

1.2

1.3

Date

3.6.2014

3.9.2014

25.9.2014

9.12.2014

Status

Official Release

Official Release

Official Release

Official Release

Display of ordering codes for EPCOS products

Note

Updated 11n BW40MHz function

Updated BLE function

Updated external Xtal option

Changed 4.1.1 Absolute Maximum Ratings

Operating ambient temperature range : -15 to +55 °C

Changed the template of the data sheet

Updated operation temperature range : -30 to +85

Updated 4.2.1.3 WLAN 2.4 GHz Transmitter power (1Mbps and 11Mbps)

Updated 4.2.2.3 WLAN 5 GHz Transmitter power (MCS7)

Updated operation temperature range : -40 to +85

The ordering code for one and the same EPCOS product can be represented differently in data sheets, data books, other publications, on the EPCOS website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the

ordering codes are due to different processes employed and do not affect the specifications of

the respective products. Detailed information can be found on the Internet under

www.epcos.com/orderingcodes

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Important notes at the end of this document.

Page 50 of 51

2014-12-9

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical

requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding

statements about the suitability of our products for a particular customer application. As a

rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or failure

before the end of their usual service life cannot be completely ruled out in the current state

of the art, even if they are operated as specified. In customer applications requiring a very high

level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this

publication may contain substances subject to restrictions in certain jurisdictions (e.g.

because they are classed as hazardous). Useful information on this will be found in our Material

Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available.

The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of

the ―General Terms of Delivery for Products and Services in the Electrical Industry‖

published by the German Electrical and Electronics Industry Association (ZVEI).

7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPlas, CSMP, CSSP, CTVS,

DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap,

PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT, SIFI, SIKOREL,

SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP, ThermoFuse,

WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks.

Page 51 of 51

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Authorized Distributor

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EPCOS / TDK

:

B30931D7020Y918

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