NTC thermistors for temperature measurement Miniature sensors with bendable wires

NTC thermistors for temperature measurement Miniature sensors with bendable wires
NTC thermistors for
temperature measurement
Miniature sensors
with bendable wires
Series/Type:
B57861S
Date:
March 2013
© EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Temperature measurement
B57861S
Miniature sensors with bendable wires
Applications
Temperature measurement
Features
Short response time
High measuring accuracy
Tight B value tolerances
available
Epoxy resin encapsulation
PTFE-insulated leads of
silver-plated nickel wire,
AWG 30 (50 mm)
PTFE-insulated leads of
silver-plated Cu wire
(19 x 0.07 mm),
AWG 28 (350 mm)
UL approval (E69802)
Options
Alternative lead lengths on
request
S861
Dimensional drawings
Length
50 mm
350 mm
Dimensions in mm
Delivery mode
Bulk
General technical data
Climatic category
Max. power
Resistance tolerance
Rated temperature
Dissipation factor
Thermal cooling time constant
Heat capacity
(IEC 60068-1)
(at 25 °C)
(in air)
(in air)
P25
∆RR/RR
TR
δth
τc
Cth
1) For PTFE-insulated leads of silver-plated Cu wire (19 x 0.07 mm), AWG 28 (350 mm).
Please read Cautions and warnings and
Important notes at the end of this document.
Page 2 of 20
55/155/56
60
±1, ±3, ±5
25
approx. 1.5 / 3.21)
approx. 15 / 121)
approx. 22.5 / 38.41)
mW
%
°C
mW/K
s
mJ/K
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Electrical specification and ordering codes
R25
Ω
Component length
mm
No. of R/T
characteristic
B25/100
K
B value tolerance = 0.3%, resistance tolerance = ±1%
5k
50
8016
3988 ±0.3%
10 k
50
8016
3988 ±0.3%
30 k
50
8018
3964 ±0.3%
B value tolerance = 1%, resistance tolerance = ±1%
10 k
350
8016
3988 ±1%
B value tolerance = 1.0%, resistance tolerance = ±1%, ±3% or ±5%
2k
50
1008
3560 ±1%
3k
50
8016
3988 ±1%
5k
50
8016
3988 ±1%
10 k
50
8016
3988 ±1%
30 k
50
8018
3964 ±1%
50 k
50
2901
3760 ±1%
Ordering code
B57861S0502F045
B57861S0103F045
B57861S0303F045
B57861S0103A039
B57861S0202+040
B57861S0302+040
B57861S0502+040
B57861S0103+040
B57861S0303+040
B57861S0503+040
+ = Resistance tolerance
F = ±1%
H = ±3%
J = ±5%
Reliability data
Test
Standard
Storage in
dry heat
IEC
60068-2-2
Storage in damp
heat, steady state
Rapid temperature
cycling
Endurance
Long-term stability
(empirical value)
Test conditions
Storage at upper
category temperature
T: 155 °C
t: 1000 h
IEC
Temperature of air: 40 °C
60068-2-78 Relative humidity of air: 93%
Duration: 56 days
IEC
Lower test temperature: 55 °C
60068-2-14 Upper test temperature: 155 °C
Number of cycles: 100
Pmax: 60 mW
t: 1000 h
Temperature: 70 °C
t: 10000 h
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 20
∆R25/R25
(typical)
< 2%
Remarks
< 1%
No visible
damage
< 1%
No visible
damage
< 3%
No visible
damage
No visible
damage
< 2%
No visible
damage
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Reliability data according to AEC Q200, Rev. D
Test
Standard
High temperature
exposure (storage)
Biased humidity
MIL-STD-202,
method 108
MIL-STD-202,
method 103
Operational life
Temperature
cycling
Terminal strength
(leaded)
Test conditions
Storage at T = +125 °C
t = 1000 h
T = 85 °C
Relative humidity of air 85%
t = 1000 h
Test voltage max. 0.3 V DC on
NTC1)
MIL-STD-202, T = +125 °C
method 108
t = 1000 h
Test voltage max. 0.3 V DC on
NTC1)
JESD 22,
Lower test temperature: 55 °C
method JA-104 Upper test temperature: 125 °C
1000 cycles
Dwell time: max. 30 min at each
temperature
Transition time in air: max. 1 min
MIL-STD-202, Test leaded device integrity
method 211
Condition A: 2.27 N2)
Mechanical shock
MIL-STD-202,
method 213,
condition C
Vibration
MIL-STD-202,
method 204
Acceleration: 40 g 2)
Pulse duration: 6 ms
Number of bumps: 3, each
direction
Acceleration: 5 g
t = 20 min
12 cycles in each of 3 directions
Frequency range: 10 to 2000 Hz
∆R25/R25
(typical)
< 2%
<2%
Remarks
No visible
damage
No visible
damage
< 2%
No visible
damage
< 2%
No visible
damage
< 1%
No visible
damage
< 1%
No visible
damage
< 1%
No visible
damage
1) Self heating of the NTC thermistor must not exceed 0.2 K, steady state. Test conditions deviating from AEC Q200, Rev. D.
2) Deviating from AEC Q200, Rev. D.
Note
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be
ensured that no water enters the NTC thermistors (e.g. through plug terminals).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
R/T characteristics
R/T No.
T (°C)
1008
2901
B25/100 = 3560 K
B25/100 = 3760 K
RT/R25
α (%/K) RT/R25
α (%/K)
55.0
50.0
45.0
40.0
35.0
53.104
39.318
29.325
22.03
16.666
6.1
6.0
5.8
5.7
5.5
63.969
46.179
33.738
24.927
18.611
6.7
6.4
6.2
6.0
5.8
30.0
25.0
20.0
15.0
10.0
12.696
9.7251
7.5171
5.8353
4.5686
5.4
5.2
5.1
4.9
4.8
14.033
10.679
8.198
6.3123
4.9014
5.6
5.4
5.3
5.2
5.1
5.0
0.0
5.0
10.0
15.0
3.605
2.8665
2.2907
1.8438
1.492
4.7
4.5
4.4
4.3
4.1
3.821
3.0027
2.3801
1.9
1.5257
4.9
4.7
4.6
4.5
4.3
20.0
25.0
30.0
35.0
40.0
1.2154
1.0000
0.82976
0.68635
0.57103
4.0
3.9
3.8
3.7
3.6
1.233
1.0000
0.81679
0.67166
0.55527
4.3
4.1
4.0
3.9
3.8
45.0
50.0
55.0
60.0
65.0
0.48015
0.40545
0.3417
0.28952
0.24714
3.5
3.4
3.3
3.2
3.1
0.46095
0.38459
0.32184
0.27068
0.22907
3.8
3.7
3.6
3.5
3.3
70.0
75.0
80.0
85.0
90.0
0.21183
0.18194
0.1568
0.13592
0.11822
3.1
3.0
2.9
2.8
2.8
0.19468
0.16607
0.14221
0.12218
0.10533
3.2
3.1
3.1
3.0
2.9
95.0
100.0
105.0
110.0
115.0
0.1034
0.090741
0.079642
0.070102
0.061889
2.7
2.6
2.6
2.5
2.4
0.09123
0.079284
0.069062
0.06034
0.052886
2.8
2.8
2.7
2.7
2.6
120.0
125.0
130.0
135.0
140.0
0.054785
0.048706
0.043415
0.038722
0.034615
2.4
2.3
2.3
2.2
2.2
0.046482
0.040985
0.036233
0.032101
0.02851
2.5
2.5
2.5
2.4
2.4
145.0
150.0
155.0
0.031048
0.02791
0.025193
2.1
2.1
2.0
0.025373
0.022633
0.020231
2.3
2.3
2.3
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
R/T No.
T (°C)
160.0
165.0
S861
1008
2901
B25/100 = 3560 K
RT/R25
α (%/K)
0.02279
2.0
0.020667
2.0
B25/100 = 3760 K
RT/R25
α (%/K)
170.0
175.0
180.0
185.0
190.0
0.01878
0.01709
0.015582
0.014227
0.013012
1.9
1.9
1.8
1.8
1.8
195.0
200.0
205.0
210.0
215.0
0.011934
0.010964
0.0101
0.0093191
0.0085949
1.7
1.7
1.7
1.6
1.6
220.0
225.0
230.0
235.0
240.0
0.0079384
0.0073411
0.006798
0.0063087
0.0058623
1.6
1.5
1.5
1.5
1.5
245.0
250.0
0.0054487
0.0050705
1.4
1.4
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
R/T characteristics
R/T No.
T (°C)
8016
8018
55.0
50.0
45.0
40.0
35.0
96.3
67.01
47.17
33.65
24.26
7.4
7.2
6.9
6.7
6.4
30.24
22.1
6.3
6.1
30.0
25.0
20.0
15.0
10.0
17.7
13.04
9.707
7.293
5.533
6.2
6.0
5.8
5.6
5.5
16.32
12.17
9.153
6.945
5.313
5.9
5.8
5.6
5.4
5.2
5.0
0.0
5.0
10.0
15.0
4.232
3.265
2.539
1.99
1.571
5.3
5.1
5.0
4.8
4.7
4.097
3.183
2.491
1.963
1.557
5.1
4.9
4.8
4.7
4.6
20.0
25.0
30.0
35.0
40.0
1.249
1.0000
0.8057
0.6531
0.5327
4.5
4.4
4.3
4.1
4.0
1.244
1.0000
0.8083
0.6572
0.5373
4.4
4.3
4.2
4.1
4.0
45.0
50.0
55.0
60.0
65.0
0.4369
0.3603
0.2986
0.2488
0.2083
3.9
3.8
3.7
3.6
3.5
0.4418
0.365
0.303
0.2527
0.2118
3.9
3.7
3.7
3.6
3.5
70.0
75.0
80.0
85.0
90.0
0.1752
0.1481
0.1258
0.1072
0.09177
3.4
3.3
3.2
3.2
3.1
0.1783
0.1508
0.128
0.1091
0.0933
3.4
3.3
3.2
3.2
3.1
95.0
100.0
105.0
110.0
115.0
0.07885
0.068
0.05886
0.05112
0.04454
3.0
2.9
2.9
2.8
2.7
0.08016
0.0691
0.05974
0.05183
0.04512
3.0
2.9
2.9
2.8
2.8
120.0
125.0
130.0
135.0
140.0
0.03893
0.03417
0.03009
0.02654
0.02348
2.6
2.6
2.5
2.5
2.4
0.0394
0.0345
0.03032
0.02672
0.02361
2.7
2.6
2.6
2.5
2.5
145.0
150.0
155.0
0.02083
0.01853
0.01653
2.4
2.3
2.3
0.02091
0.01857
0.016537
2.4
2.4
2.3
B25/100 = 3988 K
B25/100 = 3964 K
RT/R25
α (%/K) RT/R25
α (%/K)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Mounting instructions
1
Soldering
1.1
Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering
Iron soldering
Bath temperature
max. 260 °C
max. 360 °C
Soldering time
max. 4 s
max. 2 s
Distance from thermistor
min. 6 mm
min. 6 mm
Under more severe soldering conditions the resistance may change.
1.2
Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
should be used. In addition, soldering methods should be employed which permit short soldering
times.
1.3
SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommended as well as a proper cleaning of the PCB.
Nickel barrier termination
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is suitable for all commonly-used soldering methods.
Note: SMD NTCs with AgPd termination are not approved for lead-free soldering.
Figure 1
SMD NTC thermistors, structure of nickel barrier
termination
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
1.3.1
S861
Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas ≥95%.
Solder
Bath temperature (°C)
Dwell time (s)
SnPb 60/40
215 ±3
3 ±0.3
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
245 ±3
3 ±0.3
1.3.2
Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges ≤1/3.
Solder
Bath temperature (°C)
Dwell time (s)
SnPb 60/40
260 ±5
10 ±1
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
260 ±5
10 ±1
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Wave soldering
Temperature characteristic at component terminal with dual wave soldering
Solder joint profiles for silver/nickel/tin terminations
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Reflow soldering
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature
Preheat and soak
- Temperature min
- Temperature max
- Time
Average ramp-up rate
Liquidous temperature
Time at liquidous
Peak package body temperature
Time (tP)3) within 5 °C of specified
classification temperature (Tc)
Average ramp-down rate
Time 25 °C to peak temperature
Tsmin
Tsmax
tsmin to tsmax
Tsmax to Tp
TL
tL
Tp1)
Tp to Tsmax
Sn-Pb eutectic assembly
Pb-free assembly
100 °C
150 °C
60 ... 120 s
3 °C/ s max.
183 °C
60 ... 150 s
220 °C ... 235 °C2)
150 °C
200 °C
60 ... 180 s
3 °C/ s max.
217 °C
60 ... 150 s
245 °C ... 260 °C2)
20 s3)
30 s3)
6 °C/ s max.
maximum 6 min
6 °C/ s max.
maximum 8 min
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Solder joint profiles for silver/nickel/tin terminations
1.3.3
Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size
inch/mm
A
B
C
0402/1005
0.6
0.6
1.7
0603/1608
1.0
1.0
3.0
0805/2012
1.3
1.2
3.4
1206/3216
1.8
1.2
4.5
1.3.4
Notes
Iron soldering should be avoided, hot air methods are recommended for repair purposes.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
2
S861
Conductive adhesion
An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of
this method is that it involves no thermal stress. The adhesives used must be chemically inert.
3
Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
4
Robustness of terminations (leaded types)
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Tensile strength:
Test Ua1:
Leads
0.25 <
0.35 <
0.50 <
0.80 <
∅ ≤0.25 mm = 1.0 N
∅ ≤0.35 mm = 2.5 N
∅ ≤0.50 mm = 5.0 N
∅ ≤0.80 mm = 10.0 N
∅ ≤1.25 mm = 20.0 N
Bending strength: Test Ub:
Two 90°-bends in opposite directions at a weight of 0.25 kg.
Torsional strength: Test Uc: severity 2
The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body.
The bending radius of the leads should be approx. 0.75 mm. Two torsions of
180° each (severity 2).
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Twisting of leads
The twisting (torsion) by 180° of a lead bent by 90° is permissible at 6 mm from the bottom of the
thermistor body.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
5
S861
Sealing and potting
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
6
Cleaning
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
7
Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature:
25 °C up to 45 °C
Relative humidity (without condensation):
≤75% annual mean
<95%, maximum 30 days per annum
Solder the thermistors listed in this data book after shipment from EPCOS within the time specified:
SMDs with nickel barrier termination: 12 months
SMDs with AgPd termination:
6 months
Leaded components:
24 months
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
8
S861
Placement and orientation of SMD NTC thermistors on PCB
a) Component placement
It is recommended that the PC board
should be held by means of some
adequate supporting pins such as
shown left to prevent the SMDs from
being damaged or cracked.
b) Cracks
When placing a component near an
area which is apt to bend or a grid
groove on the PC board, it is advisable
to have both electrodes subjected to
uniform stress, or to position the
component's electrodes at right angles
to the grid groove or bending line (see
c) Component orientation).
c) Component orientation
Choose a mounting position that
minimizes the stress imposed on the
chip during flexing or bending of the
board.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Cautions and warnings
See "Important notes".
Storage
Store thermistors only in original packaging. Do not open the package prior to storage.
Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative
humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is
inadmissible.
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the
packing material may be deformed or components may stick together, causing problems during
mounting.
Avoid contamination of thermistor surface during storage, handling and processing.
Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).
Use the components as soon as possible after opening the factory seals, i.e. the
polyvinyl-sealed packages.
Solder thermistors within the time specified after shipment from EPCOS.
For leaded components this is 24 months, for SMD components with nickel barrier termination
12 months, for SMD components with AgPd termination 6 months.
Handling
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused
during handling of NTCs.
Do not touch components with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
Bending / twisting leads
A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from
the component head or housing. When bending ensure the wire is mechanically relieved at the
component head or housing. The bending radius should be at least 0.75 mm.
Twisting (torsion) by 180° of a lead bent by 90° is permissible at 6 mm from the bottom of the
thermistor body.
Soldering
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Mounting
Ensure that no thermo-mechanical stress occurs due to production processes (curing or
overmolding processes) when thermistors are sealed, potted or overmolded or during their
subsequent operation. The maximum temperature of the thermistor must not be exceeded.
Ensure that the materials used (sealing/potting compound and plastic material) are chemically
neutral.
Electrodes/contacts must not be scratched or damaged before/during/after the mounting
process.
Contacts and housing used for assembly with the thermistor must be clean before mounting.
Ensure that adjacent materials are designed for operation at temperatures comparable to the
surface temperature of the thermistor. Be sure that surrounding parts and materials can
withstand the temperature.
Avoid contamination of the thermistor surface during processing.
The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to
an environment with normal atmospheric conditions.
Tensile forces on cables or leads must be avoided during mounting and operation.
Bending or twisting of cables or leads directly on the thermistor body is not permissible.
Avoid using chemical substances as mounting aids. It must be ensured that no water or other
liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based
substances (e.g. soap suds) must not be used as mounting aids for sensors.
Operation
Use thermistors only within the specified operating temperature range.
Use thermistors only within the specified power range.
Environmental conditions must not harm the thermistors. Only use the thermistors under
normal atmospheric conditions or within the specified conditions.
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be
ensured that no water enters the NTC thermistors (e.g. through plug terminals). For
measurement purposes (checking the specified resistance vs. temperature), the component
must not be immersed in water but in suitable liquids (e.g. Galden).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Bending or twisting of cables and/or wires is not permissible during operation of the sensor in
the application.
Be sure to provide an appropriate fail-safe function to prevent secondary product damage
caused by malfunction.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 17 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Symbols and terms
Symbol
English
German
A
AWG
Area
American Wire Gauge
Fläche
Amerikanische Norm für Drahtquerschnitte
B
B25/100
B value
B value determined by resistance
measurement at 25 °C and 100 °C
B-Wert
B-Wert, ermittelt durch Widerstandsmessungen bei 25 °C und 100 °C
Cth
Heat capacitance
Wärmekapazität
I
Current
Strom
N
Number (integer)
Anzahl (ganzzahliger Wert)
P25
Pdiss
Pel
Pmax
Maximum power at 25 °C
Power dissipation
Electrical power
Maximum power within stated
temperature range
Maximale Leistung bei 25 °C
Verlustleistung
Elektrische Leistung
Maximale Leistung im
angegebenenTemperaturbereich
∆RB/RB
Resistance tolerance caused by
spread of B value
Insulation resistance
Parallel resistance
Rated resistance
Resistance tolerance
Series resistance
Resistance at temperature T
(e.g. R25 = resistance at 25 °C)
Widerstandstoleranz, die durch die
Streuung des B-Wertes verursacht wird
Isolationswiderstand
Parallelwiderstand
Nennwiderstand
Widerstandstoleranz
Serienwiderstand
Widerstand bei Temperatur T
(z.B. R25 = Widerstand bei 25 °C)
T
∆T
t
TA
Tmax
Temperature
Temperature tolerance
Time
Ambient temperature
Upper category temperature
Tmin
Lower category temperature
Temperatur
Temperaturtoleranz
Zeit
Umgebungstemperatur
Obere Grenztemperatur
(Kategorietemperatur)
Untere Grenztemperatur
(Kategorietemperatur)
Top
TR
Tsurf
Operating temperature
Rated temperature
Surface temperature
Betriebstemperatur
Nenntemperatur
Oberflächentemperatur
V
Vins
Vop
Vtest
Voltage
Insulation test voltage
Operating voltage
Test voltage
Spannung
Isolationsprüfspannung
Betriebsspannung
Prüfspannung
Rins
RP
RR
∆RR/RR
RS
RT
Please read Cautions and warnings and
Important notes at the end of this document.
Page 18 of 20
Temperature measurement
B57861S
Miniature sensors with bendable wires
S861
Symbol
English
German
α
Temperature coefficient
Temperaturkoeffizient
∆
Tolerance, change
Toleranz, Änderung
δth
Dissipation factor
Wärmeleitwert
τc
τa
Thermal cooling time constant
Thermal time constant
Thermische Abkühlzeitkonstante
Thermische Zeitkonstante
Abbreviations / Notes
Symbol
English
German
Surface-mounted devices
Oberflächenmontierbares Bauelement
*
To be replaced by a number in ordering Platzhalter für Zahl im Bestellnummerncodes, type designations etc.
code oder für die Typenbezeichnung.
+
To be replaced by a letter.
Platzhalter für einen Buchstaben.
All dimensions are given in mm.
Alle Maße sind in mm angegeben.
The commas used in numerical values
denote decimal points.
Verwendete Kommas in Zahlenwerten
bezeichnen Dezimalpunkte.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 19 of 20
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association
(ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS,
DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC,
MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
Page 20 of 20
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