Data Sheet ACFF-1024 ISM Bandpass Filter (2401 – 2482 MHz)

Data Sheet ACFF-1024 ISM Bandpass Filter (2401 – 2482 MHz)
ACFF-1024
ISM Bandpass Filter (2401 – 2482 MHz)
Data Sheet
Description
Features
The Avago ACFF-1024 is a miniaturized Bandpass Filter
designed for use in the 2.4 GHz Industrial, Scientific and
Medical (ISM) band.
•50 Ω Input/Output
The ACFF-1024 is designed to enable concurrent operation of Wireless LAN and Bluetooth applications that coexist with other wireless standards, such as 2.5 GHz WiMAX,
PCS, and LTE Bands 7 and 40, without performance degradations due to interference.
• No external matching required
• Low Insertion Loss, High Interference Rejection
- Enables concurrent use of other 2.5 GHz Bands
• Subminiature Size
- 1.1 x 1.4 mm Footprint
- 0.80 mm Max Height
The ACFF-1024 is designed with Avago Technologies’ innovative Film Bulk Acoustic Resonator (FBAR) technology,
which makes possible ultra-small, high-Q filters at a fraction of their usual size.
• High Power Rating
The ACFF-1024 also utilizes Avago Technologies’ advanced
Microcap bonded-wafer technology. This chip scale miniaturization process results in a package size of only 1.4 x
1.1 mm and maximum height of 0.80 mm.
-–40 °C to +85 °C
•Environmental
The ACFF-1024 is compatible with high volume, lead-free
SMT soldering processes and can be direct surface mounted to a PCB or a transfer molded module.
- TBBPA Free
Specifications
Functional Block Diagram
• Performance guaranteed –30 °C to +85 °C
Port 1
Port 2
TX/RX
(Pin 1)
ANT
(Pin 4)
- +27 dBm Abs Max Input Power
• Operating Temperature Range
- RoHS 6 Compliant
- Halogen free
• Low Insertion Loss
• High Interferer Rejection
Applications
802.11 b/g/n WLAN Access Point and Small Cell BTS with
embedded WLAN functionality
ACFF-1024 Electrical Specifications [2], Z0 = 50 Ω, Tc [1]
-30 °C to +85 °C
Units Min Typ [3]
Max
Symbol
Parameter
S21
Insertion Loss [4]
2402.5 – 2421.5 MHz
2407.5 – 2426.5 MHz
2412.5 – 2471.5 MHz
2457.5 – 2476.5 MHz
2462.5 – 2481.5 MHz
ΔS21
Amplitude Ripple (p-p) [4], +25 °C
2402.5 – 2421.5 MHz (Wi-Fi Ch 1)
2407.5 – 2426.5 MHz (Wi-Fi Ch 2)
2412.5 – 2471.5 MHz (Wi-Fi Ch 3 – 11)
2457.5 – 2476.5 MHz (Wi-Fi Ch 12)
2462.5 – 2481.5 MHz (Wi-Fi Ch 13)
dB
S21
Attenuation, 800 – 2300 MHz
dB
S21
Attenuation [5] in LTE Band 40, 2300 – 2365 MHz
dB
S21
Attenuation [5] in LTE Band 40, 2365 – 2370 MHz
–40 °C
–30 °C to +25 °C
+25 °C to +55 °C
+55 °C to +85 °C
dB
Attenuation [5] in LTE Band 7 (WiMAX), 2500 – 2505 MHz
–40 °C
–30 °C to –10 °C
–10 °C to +25 °C
+25 °C to +85 °C
dB
S21
Attenuation [5] in LTE Band 7 (WiMAX), 2505 – 2690 MHz
S21
Attenuation [5] in LTE Band 38, 2570
S21
2H
S11, S22
S21
dB
(Wi-Fi Ch 1)
(Wi-Fi Ch 2)
(Wi-Fi Ch 3 – 11)
(Wi-Fi Ch 12)
(Wi-Fi Ch 13)
1.6
1.4
1.3
1.5
1.7
2.6
2.2
2.0
2.1
3.0
-40 °C
Typ
1.8
1.6
1.3
1.5
1.6
1.0
0.8
0.7
0.6
1.0
1.4
1.1
0.9
0.7
0.9
45
54
54
50
53
52
50
43
30
58
58
53
42
52
55
56
59
64
dB
57
67
68
dB
55
68
68
Attenuation, 2690 – 7500 MHz
dB
40
55
55
2nd Harmonic Level, CW Tone, 2442 MHz, 22.5 dBm at Port 1
dBc
57
67
Return Loss (SWR), 2402.5 – 2481.5 MHz, +25 °C
dB
9
16 (1.4)
– 2620 MHz
58
64
(2.1) 16 (1.4)
Notes:
1.Tc is the case temperature and is defined as the temperature of the underside of the Filter where it makes contact with the circuit board.
2. Min/Max specifications are guaranteed at the indicated temperature, unless otherwise noted.
3. Unless otherwise noted, Typical data is the average value (arithmetic mean) of the parameter over the indicated band at 25 °C.
4. Channel average Insertion Loss, which is obtained by averaging |S21| over the center 19 MHz of channels and converting to dB value.
5. Channel average Insertion Loss, which is obtained by averaging |S21| over 5 MHz channels and converting to dB value.
Absolute Maximum Ratings [1]
Parameter
Unit
Value
Storage temperature
°C
–40 to +125
Maximum RF Input Power to Pin 1
(Port 1, Tx/Rx) [4]
dBm
+27
Maximum Recommended Operating Conditions [2]
Parameter
Unit
Value
Operating temperature, Tc [3]
°C
–40 to +85
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not
guaranteed to meet electrical specifications.
3.Tc is defined as case temperature, the temperature of the underside of the Filter where it makes contact with the circuit board.
4. The ACFF-1024 is not symmetrical. Port 1 (Pin 1) is designed for higher power handling and is connected to the Tx/Rx blocks; Port 2 (Pin 4) is
connected to the system antenna.
2
0
0
-0.5
-5
-1.0
-10
Return Loss (dB)
Insertion Loss (dB)
ACFF-1024 Typical Performance at Tc = 25 °C
-1.5
-15
-2.0
-25
-3.0
2400
2410
2420
2430 2440 2450
Frequency (MHz)
2460
2470
2420
2430 2440 2450
Frequency (MHz)
2460
2470
2480
Figure 2. Input, Output Port Return Loss, 2400 – 2482 MHz
0
0
-10
-10
-20
-20
Insertion Loss (dB)
Insertion Loss (dB)
-30
2400 2410
2480
Figure 1. Insertion Loss, 2400 – 2482 MHz
-30
-40
-50
-60
-70
-30
-40
-50
-60
-70
-80
2350
2400
2450
Frequency (MHz)
2500
-80
2550
Figure 3. Attenuation, 2350 – 2550 MHz
0
0
-10
-10
-20
-20
-30
-40
-50
-60
-30
-40
-50
-60
-70
-70
-80
1000 2000 3000 4000 5000 6000 7000 8000
Frequency (MHz)
Figure 4. Wideband Attenuation, 100 – 8000 MHz
Insertion Loss (dB)
Insertion Loss (dB)
S22
-20
-2.5
800
1000
1200 1400 1600
Frequency (MHz)
Figure 5. Attenuation, 800 – 2300 MHz
3
S11
1800
2000
2200
-80
2300
2310
2320
2330 2340 2350
Frequency (MHz)
Figure 6. Rejection in LTE Band 40 (2300 – 2370 MHz)
2360
2370
0
0
-10
-10
-20
-20
Insertion Loss (dB)
Insertion Loss (dB)
ACFF-1024 Typical Performance at Tc = 25 °C
-30
-40
-50
-60
-70
2550
2600
Frequency (MHz)
-50
-60
-80
2570
2650
Figure 7. Rejection in 2.5 GHz WiMAX and LTE Band 7 (2500 – 2690 MHz)
-10
Group Delay (s)
-20
-30
-40
-50
-60
-70
3000
4000
5000
6000
Frequency (MHz)
0.8
1
2590
2600
Frequency (MHz)
7000
50n
45n
40n
35n
30n
25n
20n
15n
10n
5n
0
2410 2420 2430 2440 2450 2460 2470 2480
Frequency (MHz)
0.8
1.5
1
1.5
0.6
2
0.4
2
0.4
3
3
4
0.2
4
5
0.2
0.4
0.6 0.8 1
1.5
2
3 4 5
0.2
5
10
20
50
10 2050
-50
-20
-10
-0.2
-5
-4
0.2
0.4
0.6 0.8 1
1.5
2
3 4 5
10
20
50
10 2050
-50
-20
-10
-0.2
-5
-4
-3
-0.4
-3
-0.4
-2
-0.6
-0.8
-1
-1.5
Figure 11. Input Port Impedance, 2400 – 2482 MHz
4
2610
Figure 10. Group Delay (ns), 2400 – 2482 MHz
Figure 9. Attenuation, 2690 – 7500 MHz
0.6
2580
Figure 8. Rejection in LTE Band 38 (2570 – 2620 MHz)
0
Insertion Loss (dB)
-40
-70
-80
2500
-80
-30
-2
-0.6
-0.8
-1
-1.5
Figure 12. Output Port Impedance, , 2400 – 2482 MHz
ACFF-1024 Performance at Low Temperature
Typical performance of the ACFF-1024 at low temperature is shown in Figure 13 and Figure 14 for Tc = 25 °C and –40 °C.
0
0
-10
-1.0
Insertion Loss (dB)
Insertion Loss (dB)
-0.5
Tc = –40 °C
-1.5
Tc = +25 °C
-2.0
-2.5
Tc = –40 °C
-20
Tc = +25 °C
-30
-40
-50
-60
-70
-3.0
2400 2410
2420
2430 2440 2450
Frequency (MHz)
2460
-80
2350
2470 2480
Figure 13. Insertion Loss, 2400 – 2482 MHz, +25 °C and –40 °C
2400
2450
Frequency (MHz)
2500
2550
Figure 14. Attenuation, 2350 – 2550 MHz, +25 °C and –40 °C
Note: These data are measured on units different from those in previous performance graphs.
1.40
(1.48 MAX)
GND
(3)
0.69
(0.80 MAX)
0.500
0.500
GND
(2)
BYW
XXXX
ANT
(4)
PIN 1 MARK
(2)
TX/RX
(1)
(3)
(1)
1.10
(1.18 MAX)
0.575
0.288
GND
(5)
(5)
(4)
0.075
TOP VIEW
Notes:
1. Dimensions in millimeters
2. Tolerance: X.XX ± 0.05
X.XXX ± 0.025
3. Dimensions nominal unless otherwise noted
4. Contact areas are gold plated
5. Package marking:
A = Avago logo
B = ACFF-1024
Y = Year (last digit)
W = Work Week
XXXX = Lot number
Figure 15. Package Outline Drawing and Marking
5
SIDE VIEW
BOTTOM VIEW
Pin Connections:
0.325
1
Port 1 (TX/RX)
2, 3, 5 GND
4
Port 2 (ANT)
0.250
PAD DETAIL
0.100
4×9×2 ARRAY, 0.500 PITCH
Ø 0.250 THRU VIAS
0.245
Notes:
1. Dimensions in mm
2. Top View
Ø 0.100 µVIA ARRAY
0.200 PITCH, LAYERS 1-2
PLUGGED AND SMOOTHED
0.180
0.109
0.109
Figure 16. PCB Layout
A circuit board layout using the principles illustrated in
Figure 16 is recommended to optimize performance of
the ACFF-1024.
Note: The ACFF-1024 is not symmetrical. Pin 1 (Port 1) is
designed for higher power handling and should be connected to the Tx/Rx block; Pin 4 (Port 2) is connected to
the system antenna.
High isolation between Input and Output is achieved by:
Due to the limitation of the PCB via to PCB thickness aspect ratio, micro vias (Ǿ 0.100) are used in the area between land pads to connect metal Layer1 and Layer2. For
all other areas, larger thru vias are used to connect all layers.
Ground vias under the ACFF-1024 mounting area also
provide heat sinking for the device to minimize shifting of
the pass band over temperature.
1. Maintaining a continuous ground plane around the I/O
connections and filter land print area, and
2. Surrounding the I/O ports with sufficient ground vias
to enclose the connections in a “Faraday cage.”
Table 1. PCB Stack-up
Layer
Type
Material
Thickness (mm)
Layer 1
Conductor
Copper
0.055
Dielectric
Nelco N4000 13EP
0.075
Conductor
Copper
0.040
Dielectric
Nelco N4000 13EP
0.590
Conductor
Copper
0.040
Dielectric
Nelco N4000 13EP
0.075
Conductor
Copper
0.055
Layer 2
Layer 3
Layer 4
6
Dielectric Constant (εr)
3.4
3.4
3.4
1.000
0.420
0.135
TYP*
2×0.250×0.325
LAND PAD
0.486
0.288
0.700
(REF)
2×0.550×0.070, CHAMFER 0.100×45°
GROUND PLANE OPENING FOR LAND PAD
Notes:
1. Dimensions in mm
2. Top View
3. Width of transmission line (*) is adjusted for 50 Ω
0.155
0.553
Figure 17. Recommended PCB Layout
A recommended PCB layout design is shown in Figure 17.
Transmission line dimensions (*) should be adjusted to
maintain Zo of 50 Ω.
The land pads of this PCB pattern are 1:1 with the ACFF1024 bottom metal pads.
5 x 0.250 x 0.325
0.575
0.200 (Typ)
0.500
0.500
Figure 18. Recommended Solder Mask (Dimensions in mm)
7
0.200 (Typ)
5 x 0.250 x 0.325
R 0.050 min
0.575
0.500
0.500
Figure 19. Recommended Solder Stencil (Dimensions in mm)
A minimum corner radius of 50 µm is recommended to
increase reliability of solder paste release from the stencil.
The recommended solder stencil is designed such that the
apertures match the opening in the solder mask 1:1.
2.00 ± 0.05
4.0 ± 0.10
∅ 1.50 + 0.10
4.0 ± 0.10
1.75 ± 0.10
3.50 ± 0.05
+0.30
8.00 –0.10
∅ 0.50 ± 0.05
Figure 20. SMT Tape Packing
PACKAGE PIN 1
ORIENTATION
POCKET
CAVITY
Figure 21. Orientation in Tape
8
BYW
XXXX
BYW
XXXX
BYW
XXXX
BYW
XXXX
BYW
XXXX
SPROCKET HOLES
TAPE
WIDTH
FRONT VIEW
1.5 min.
13.0 ± 0.2
21.0 ± 0.8
BACK VIEW
NOTES:
1. Reel shall be labeled with the following
information (as a minimum).
a. manufacturer’s name or symbol
b. Avago Technologies part number
c. purchase order number
d. date code
e. quantity of units
2. A certificate of compliance (c of c) shall
be issued and accompany each shipment
of product.
3. Reel must not be made with or contain
ozone depleting materials.
4. All dimensions in millimeters (mm)
Shading indicates
thru slots
18.4 max.
178 +0.4
-0.2
50 min.
25
min wide (ref)
Slot for carrier tape
insertion for attachment
to reel hub (2 places 180° apart)
Figure 22. SMT Reel Drawing
9
12.4 +2.0
-0.0
Package Moisture Sensitivity
Feature
Test Method
Performance
Moisture Sensitivity Level (MSL) at 260 °C
JESD22-A113D
Level 3
300
250
Temperature, °C
200
150
100
50
Tested profile shown.
0
0
50
100
150
200
250
300
PROFILE.GRF
PROFILE. WMF
6 February 2003
R. Waugh
Time, seconds
Figure 23. Verified SMT Solder Profile
Ordering Information
Part Number
No. of Devices
Container
ACFF-1024-BLK
100
Tape strip in Anti-static bag
ACFF-1024-TR1
3000
7-inch (178 mm) Reel
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved.
AV02-3973EN - October 2, 2014
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Avago Technologies:
ACFF-1024-BLK
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