XCL101 Series

XCL101  Series
XCL101 Series
ETR28004-003
Inductor Built-in Step-up “micro DC/DC” Converter
☆GreenOperation Compatible
■GENERAL DESCRIPTION
The XCL101 series is a synchronous step-up micro DC/DC converter which integrates an inductor and a control IC in one
tiny package (2.5mm×2.0mm, H=1.0mm). A stable step-up power supply is configured using only two capacitors connected
externally. An internal coil simplifies the circuit and enables minimization of noise and other operational trouble due to the
circuit wiring. The XCL101 series can be used in applications that start from a single alkaline or nickel-metal hydride battery
because the input voltage range is 0.9V ~ 5.5V. The output voltage can be set from 1.8V to 5.0V (±2.0%) in steps of 0.1V.
PFM control enables a low quiescent current, making these products ideal for portable devices that require high efficiency.
The XCL101 features a load disconnect function to break continuity between the input and output at shutdown (XCL101A),
and a bypass mode function to maintain continuity between the input and output (XCL101C).
■FEATURES
■APPLICATIONS
Input Voltage Range
●Wearable devices
:
0.9V~5.5V
Output Voltage Range
:
1.8V~5.0V (±2.0%) 0.1V increment
Output Current
:
100mA@VOUT=3.3V, VBAT=1.8V (TYP.)
●Mouses, Keyboards
Supply Current
:
6.3μA (VBAT=VOUT+0.5V)
●Remote controls
Control Method
:
PFM Control
●Portable information devices
PFM Switching Current
:
350mA
Functions
:
Load Disconnection Function or
●Mobile phones, Smart phones
●Game consoles
Bypass Mode Function
Ceramic Capacitor Compatible
■TYPICAL APPLICATION CIRCUIT
XCL101 Series
Operating Ambient Temperature
:
-40ºC ~ +85ºC
Package
:
CL-2025, CL-2025-02
Environmentally Friendly
:
EU RoHS Compliant, Pb Free
■ TYPICAL PERFORMANCE
CHARACTERISTICS
XCL101C501BR-G
7 L1
CL
10μF
1 Lx
VSS 6
2 VOUT
NC 5
3 VBAT
CE 4
80
VCE
8 L2
VIN
Efficiency:EFFI(%)
VOUT
100
4.2V
3.6V
60
VIN= 3.0V
40
20
CIN
10μF
VOUT =5.0V
0
0.01
(TOP VIEW)
0.1
1
10
100
1000
Output Current:IOUT (mA)
“L1 and Lx”, “L2 and VBAT” is connected by PCB pattern.
1/19
XCL101Series
■BLOCK DIAGRAM
XCL101A / XCL101C
L2
L1
Inductor
Load
Disconnection
Controller
LX
RFB1
CFB
PFM
Comparator
Current
Error
Sense
Amp.
Logic
VOUT
PFM
Controller
Logic
RFB2
Synch
Buffer
Drive
VSS
VREF
CE
VDD
CE and Bypass
Controller
Logic
VBAT
VDD MAX
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
■PRODUCTION CLASSIFICATION
●Ordering Information
XCL101①②③④⑤⑥-⑦(*1) PFM control
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
①
Product Type
②③
Output Voltage
18~50
④
Oscillation Frequency
1
BR-G(*2)
CL-2025 (3,000/Reel)
⑤⑥-⑦
Package
(Order Unit)
ER-G(*3)
CL-2025-02 (3,000/Reel)
A
Load Disconnection
C
VBAT Bypass
Output Voltage
e.g. VOUT=1.8V ⇒ ②=1、③=8
1.2MHz
(*1)The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
(*2) BR-G is storage temperature range "-40 ℃ ~ + 105 ℃".
(*3) ER-G is storage temperature range "-40 ℃ ~ + 125 ℃".
2/19
XCL101
Series
■PIN CONFIGURATION
7 L1
VSS 6
1 LX
NC 5
2 VOUT
* If the dissipation pad needs to be connected to other pins, it should be
CE 4
3 VBAT
* Please refer to pattern layout page for the connecting to PCB.
connected to the VSS pin.
8 L2
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
1
LX
Switching
2
VOUT
Output Voltage
3
VBAT
Power Input
4
CE
Chip Enable
5
NC
No Connection
6
VSS
Ground
7
L1
8
L2
Inductor Electrodes
■CE PIN FUNCTION
PIN NAME
SIGNAL
CE
STATUS
H
Operation (All Series)
L
XCL101A Series:Stand-by
XCL101C Series:Bypass Mode
* Please do not leave the CE pin open.
■ ABSOLUTE MAXIMUM RATINGS
Ta=25ºC
PARAMETER
SYMBOL
RATINGS
UNITS
VBAT Pin Voltage
VBAT
-0.3 ~ +7.0
V
LX Pin Voltage
VLX
-0.3 ~ VOUT+0.3 or +7.0 (*1)
V
VOUT Pin Voltage
VOUT
-0.3 ~ +7.0
V
CE Pin Voltage
VCE
-0.3 ~ +7.0
V
LX Pin Current
ILX
700
mA
Power Dissipation
Pd
1000 (*2)
mW
Operating Ambient Temperature
Topr
- 40 ~ +85
ºC
- 40 ~ +105
ºC
- 40 ~ +125
ºC
Storage
Temperature(*3)
CL-2025
CL-2025-02
Tstg
All voltages are described based on the GND.
(*1) The maximum value should be either VOUT+0.3V or +7.0V in the lowest.
(*2) The power dissipation figure shown is PCB mounted (40mm x 40mm, t=1.6mm, Glass Epoxy FR-4).
(*3) Storage temperature, are divided by the product specification of the package.
3/19
XCL101Series
■ELECTRICAL CHARACTERISTICS
XCL101Axx1BR-G/XCL101Axx1ER-G
Ta=25 ºC
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
CIRCUIT
Input Voltage
VBAT
-
-
5.5
V
-
Output Voltage
VOUT(E)(*2)
V
①
Operation Start Voltage
VST1
IOUT=1mA
-
-
0.9
V
②
Operation Hold Voltage
VHLD
RL=1kΩ
-
0.7
-
V
②
Supply Current
Iq
μA
③
Input Pin Current
IBAT
VOUT=VOUT(T) (*1)+0.5V
-
0.25
1.0
μA
③
Stand-by Current
ISTB
VBAT=VLX=VOUT(T) (*1), VOUT=VCE=0V
-
0.1
1.0
μA
④
LX Leak Current
ILXL
VBAT=VLX=VOUT(T) (*1), VOUT=VCE=0V
-
0.1
1.0
μA
⑤
PFM Switching Current
IPFM
IOUT=3mA
295
350
405
mA
②
Maxixmum On Time
tONMAX
VPULL=1.5V, VOUT=VOUT(T) (*1)×0.98V
3.1
4.6
6.0
μs
①
LX SW “Pch” ON
Resistance (*3)
RLXP
VBAT=VCE=VLX=VOUT(E) (*2)+ 0.5V,
IOUT=200mA
Ω
⑦
LX SW “Nch” ON
Resistance (*4)
RLXN
VBAT=VOUT(E) (*2)=3.3V, VOUT=1.7V
VPULL=1.5V, Voltage to strat oscillation
while VOUT is decreasing
<E1>
Oscillation stops, VBAT=VCE=1.5V
VOUT=VOUT(T) (*1) +0.5V
VBAT=VPULL=1.5V
VOUT=VOUT(T) (*1)×0.98V
While VCE= 0.3→0.75V,
Voltage to start oscillation
VBAT=VPULL=1.5V
VOUT=VOUT(T) (*1)× 0.98V
While VCE=0.75 → 0.3V,
Voltage to stop oscillation
<E2>
<E3>
-
0.6
-
Ω
⑧
0.75
-
5.5
V
①
VSS
-
0.3
V
①
CE “High” Voltage
VCEH
CE “Low” Voltage
VCEL
CE “High” Current
ICEH
VBAT=VCE=VLX=VOUT=5.5V
-0.1
-
0.1
μA
①
CE “Low” Current
ICEL
VBAT=VLX=VOUT=5.5V, VCE=0V
-0.1
-
0.1
μA
①
Inductance Value
L
Test Frequency=1MHz
-
4.7
-
μH
-
(Inductor) Rated Current
IDC
∆T=+40℃
-
700
-
mA
-
Unless otherwise stated, VBAT= VCE= 1.5V
(*1) V
OUT(T) =Nominal Output Voltage
(*2) V
OUT(E) =Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output
voltage, including the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic
example.
(*3) L SW “Pch” ON resistance =(V -V
X
LX OUTpin measurement voltage) / 200mA
(*4) L SW “Nch” ONresistance measurement method is shown in the measurement circuit diagram.
X
4/19
XCL101
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XCL101Cxx1BR-G/XCL101Cxx1ER-G
Ta=25 ºC
PARAMETER
SYMBOL
Input Voltage
VBAT
Output Voltage
VOUT(E)(*2)
Operation Start Voltage
VST1
IOUT=1mA
-
-
Operation Hold Voltage
VHLD
RL=1kΩ
-
0.7
Supply Current
Iq
Input Pin Current
IBAT
VBAT=VCE=1.5V, VOUT=VOUT(E)(*2)+0.5V
-
0.25
Bypass Mode Current
IBYP
VBAT=VLX=5.5V, VCE=0V
-
PFM Switching Current
IPFM
IOUT=3mA
Maxixmum On Time
tONMAX
VPULL=1.5V, VOUT=VOUT(T)(*1)×0.98V
LX SW “Pch” ON
Resistance (*3)
RLXP
LX SW “Nch” ON
Resistance (*4)
RLXN
CONDITIONS
-
MIN.
TYP.
MAX.
UNITS
CIRCUIT
-
-
5.5
V
-
V
①
0.9
V
②
-
V
②
μA
③
1.0
μA
③
3.5
6.1
μA
⑥
295
350
405
mA
②
3.1
4.6
6.0
μs
①
Ω
⑦
VPULL=1.5V, Voltage to strat oscillation
while VOUT is decreasing
<E1>
Oscillation stops,
<E2>
VOUT=VOUT(T)+0.5V (*1)
VBAT=VLX=VCE=VOUT(E)(*2)+
0.5V,
<E3>
IOUT=200mA
VBAT=VOUT(E)(*2)=3.3V, VOUT=1.7V
VBAT=VPULL=1.5V
VOUT=VOUT(T)(*1)×0.98V
While VCE=0.3→0.75V,
Voltage to start oscillation
VBAT=VPULL=1.5V
VOUT=VOUT(T) (*1)× 0.98V
While VCE=0.75 → 0.3V,
Voltage to stop oscillation
-
0.6
-
Ω
⑧
0.75
-
5.5
V
①
VSS
-
0.3
V
①
CE “High” Voltage
VCEH
CE “Low” Voltage
VCEL
CE “High” Current
ICEH
VBAT=VCE=VLX=VOUT=5.5V
-0.1
-
0.1
μA
①
CE “Low” Current
ICEL
VBAT=VLX=VOUT=5.5V, VCE=0V
-0.1
-
0.1
μA
①
Inductance Value
L
Test Frequency=1MHz
-
4.7
-
μH
-
(Inductor) Rated Current
IDC
∆T=+40℃
-
700
-
mA
-
Unless otherwise stated, VBAT= VCE= 1.5V
(*1) V
OUT(T) =Nominal Output Voltage
(*2) V
OUT(E) =Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output
voltage, including the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic
example.
(*3) L SW “Pch” ON resistance =(V -V
X
LX OUTpin measurement voltage) / 200mA
(*4) L SW “Nch” ONresistance measurement method is shown in the measurement circuit diagram.
X
5/19
XCL101Series
■ELECTRICAL CHARACTERISTICS (Continued)
SYMBOL
E1
E2
E3
PARAMETER
OUTPUT VOLTAGE
SUPPLY CURRENT
LX SW “Pch” ON
RESISTANCE
UNITS:V
UNITS:V
UNITS:μA
UNITS:Ω
OUTPUT
VOLTAGE
MIN
MAX
1.8
1.764
1.836
1.9
1.862
1.938
2.0
1.960
2.040
2.1
2.058
2.142
2.2
2.156
2.244
2.3
2.254
2.346
2.4
2.352
2.448
2.5
2.450
2.550
2.6
2.548
2.652
2.7
2.646
2.754
2.8
2.744
2.856
2.9
2.842
2.958
3.0
2.940
3.060
3.1
3.038
3.162
3.2
3.136
3.264
3.3
3.234
3.366
3.4
3.332
3.468
3.5
3.430
3.570
3.6
3.528
3.672
3.7
3.626
3.774
3.8
3.724
3.876
3.9
3.822
3.978
4.0
3.920
4.080
4.1
4.018
4.182
4.2
4.116
4.284
4.3
4.214
4.386
4.4
4.312
4.488
4.5
4.410
4.590
4.6
4.508
4.692
4.7
4.606
4.794
4.8
4.704
4.896
4.9
4.802
4.998
5.0
4.900
5.100
6/19
TYP
MAX
TYP
MAX
6.1
9.4
0.84
1.08
6.2
9.7
0.75
0.97
6.3
10.0
0.65
0.85
6.4
10.2
0.61
0.78
6.5
10.4
0.57
0.74
6.7
10.7
0.53
0.72
XCL101
Series
■TEST CIRCUITS
<Test Circuit No.①>
CE
L2
<Test Circuit No.⑤>
VBAT
L2
CE
VBAT
A
VOUT
NC
GND
Lx
L1
Waveform check point
CL
Rpull
GND
V
L2
VBAT
CL
A
CIN
V
Waveform check point
A
V
RL
L2
NC
GND
GND
*External conpornents
CIN:4.7μF(Ceramic)
CL:10μF(Ceramic)
L:4.7μH(Selected goods)
VBAT
CE
VOUT
NC
Lx
L1
VBAT
L1
Lx
A
<Test Circuit No.⑦>
<Test Circuit No.③>
CE
A
VOUT
NC
Lx
L1
L2
CE
L
GND
Lx
<Test Circuit No.⑥>
VOUT
NC
L1
*External conpornents
CIN:4.7μF(Ceramic)
CL:10μF(Ceramic)
Rpull:100 ohm
Vpull
<Test Circuit No.②>
CE
VOUT
NC
CIN
A
A
L2
VBAT
VOUT
GND
L1
Lx
V
CIN
↓
*External conpornents
CIN:4.7μF(Ceramic)
<Test Circuit No.⑧>
<Test Circuit No.④>
CE
L2
NC
GND
L2
VBAT
CE
VOUT
NC
Lx
GND
L1
A
VBAT
VOUT
L1
Lx
Rpull V1 CL
CIN
Vpull
Waveform check point
<LX SW “Nch” ON Resistance Measurement Method>
*External conpornents
CIN:4.7μF(Ceramic)
CL:10μF(Ceramic)
Rpull:4.7 ohm
Use Test Circuit No.8 to adjust Vpull so that the LX pin voltage becomes 100mV when the Nch drive Tr is ON and then the
voltage at both ends of Rpull is measured to find the Lx SW "Nch" ON resistance.
RLXN=0.1 / {(V1 - 0.1) / 4.7)}
Note that V1 is the Rpull previous voltage when the Nch driver Tr is ON. Use an oscilloscope or other instrument to measure the
LX pin voltage and V1.
7/19
XCL101Series
■TYPICAL APPLICATION CIRCUIT
(TOP VIEW)
* The embedded coil is optimized for XCL101 series. Please do not use for other purposes.
【Recommended External Components】
MANUFACTURE
TDK
CIN, CL
TAIYO YUDEN
8/19
PRODUCT NUMBER
VALUE
L×W (mm)
C1608JB1A106K
10μF/10V
1.60 × 0.80
C1608X5R1A106K
10μF/10V
1.60 × 0.80
C2012JB1A106K
10μF/10V
2.00 × 1.25
C2012X5R106K
10μF/10V
2.00 × 1.25
LMK107BBJ106MALT
10μF/10V
1.60 × 0.80
LMK212ABJ106KG
10μF/10V
2.00 × 1.25
LMK212BBJ226MG
22μF/10V
2.00 × 1.25
JMK212BBJ476MG
47μF/6.3V
2.00 × 1.25
XCL101
Series
■OPERATION EXPLANATION
The XCL101 Series consists of a standard voltage source, a PFM comparator, a Nch driver Tr, a Pch synchronous rectifier switch Tr, a current
sense circuit, a PFM control circuit and a CE control circuit, etc. (refer to the block diagram below.)
L2
L1
Inductor
Load
Disconnection
Controller
LX
RFB1
CFB
PFM
Comparator
Current
Error
Sense
Amp.
Logic
VOUT
PFM
Controller
Logic
RFB2
Synch
Buffer
Drive
VSS
VREF
VDD
CE and Bypass
Controller
Logic
CE
VDD MAX
VBAT
Current limit PFM control is used for the control method to make it difficult for the output voltage ripple to increase even when the switching
current is superimposed, so the product can be used within a wide voltage and current range. Further, because PFM control is used, it has
excellent transient response to support low capacity ceramic capacitors to realize a compact, high-performance boost DC/DC converter.
The synchronous driver and rectifier switch Tr efficiently sends the coil energy to the capacitor connected to the VOUT pin to achieve highly
efficient operation from low to high loads.
The electrical characteristics actual output voltage VOUT(E) is the PFM comparator threshold voltage shown in the block diagram. Therefore, the
booster circuit output voltage average value, including the peripheral components, depends on the ripple voltage, so this must be carefully
evaluated before being used in the actual product.
VBAT=VCE=2.0V、VOUT=3.3V、IOUT=20mA、L=4.7μH、CL=10μF、Ta=25℃
VOUT Voltage
Average
VBAT=VCE=2.0V、VOUT=3.3V、IOUT=70mA、L=4.7μH、CL=10μF、Ta=25℃
VLX
VLX
VOUT
VOUT
VLX:2V/div
VOUT Voltage
VOUT:50mV/div
Average
ILX:200mA/div
VOUT(E)
VOUT(E)
IPFM
ILX
ILX
2[μs/div]
2[μs/div]
< Reference Voltage Source (VREF)>
The reference voltage source (VREF voltage) provides the reference voltage to ensure stable output voltage of the DC/DC converter.
< PFM Control >
①The voltage from the output voltage divided by the division resistors RFB1 and RFB2 in the IC is used as feedback voltage (FB voltage), and the
PFM comparator is compared with the FB voltage and VREF. If the FB voltage is lower than VREF, the signal is sent to the buffer driver via the PFM
control circuit and the Nch driver Tr is turned ON. If the FB voltage is higher than VREF, the PFM comparator sends a signal that does not turn ON
the Nch driver Tr.
②The current sense circuit monitors the current flowing in the Nch driver Tr connected to the Lx pin when the Nch driver Tr is ON. When the
prescribed PFM switching current (IPFM) is reached, the signal is sent to the buffer driver via the PFM control circuit to turn OFF the Nch driver Tr
and turn ON the Pch synchronous rectifier switch Tr.
③The Pch synchronous rectifier switch Tr ON time (off time) is dynamically optimized internally. After the off time has passed, when the PFM
comparator confirms the VOUT voltage has exceeded the set voltage, a signal that does not allow the Nch driver Tr to be turned on is sent from the
PFM comparator to the PFM control circuit, but if the VOUT voltage remains lower than the set voltage, then Nch driver Tr ON is started.
The intervals of the above ①②③ linked operations are continuously adjusted in response to the load current to ensure the output voltage is kept
stable from low to high loads and that it is done with good efficiency.
9/19
XCL101Series
■OPERATION EXPLANATION (Continued)
<PFM Switching Current>
The PFM switching current unit monitors the current flowing in the Nch driver Tr and functions to limit the current flowing in the Nch driver Tr, but if
the load current becomes much larger than the PFM switching energy, the VOUT voltage becomes lower and prevents the coil current in the Nch
driver Tr OFF period from lowering, which affects the internal circuit delay time and results in an excessive current that is larger than the PFM
switching current flowing in the Nch driver Tr and Pch synchronous rectifier switch Tr.
<Load Disconnection Function, Bypass Mode>
When "L" voltage is input to the CE pin, the XCL101A type enters into standby mode and the XCL101C type enters into bypass mode to stop the
circuit required for the boost operation. In the standby mode the load cut-off function operates and both the Nch driver Tr and Pch synchronous
rectifier switch Tr are turned OFF, which cuts off the current to the LX pin and VOUT pin and the parasitic diode control circuit connects the parasitic
diode cathode of the Pch synchronous rectifier switch Tr to the LX pin ①. In the bypass mode the Nch driver Tr is OFF, the Pch synchronous
rectifier switch Tr is ON when VLX > VOUT, and the parasitic diode control circuit connects the parasitic diode cathode of the Pch synchronous
rectifier switch Tr to the VOUT pin ②. Also, when VLX < VOUT, the Pch synchronous rectifier switch Tr is turned OFF and the parasitic diode cathode
is connected to the VOUT pin ②.
Note: Except for the moment when the VBAT voltage rises up under a start-up condition.
①
②
< VBAT-VOUT Voltage Detection Circuit>
The VBAT-VOUT voltage detection circuit compares the VBAT pin voltage with the VOUT pin voltage, and whichever is the highest is operated to
become the IC power supply (VDD). In addition, if, during normal operation, the input voltage becomes higher than the output voltage, the Nch
driver Tr is turned OFF and the Pch synchronous rectifier switch Tr is kept ON so that the input voltage pass through to the output voltage
(through mode). When the input voltage becomes lower than the output voltage, the circuit automatically returns to the normal boost operation.
This detection circuit does not operate when in the standby mode.
<Inrush Current Protection Function>
When the VBAT or VCE power supply is input, CL is charged via the stable current that results from the inrush current protection function (refer to
graphs below). Therefore, this function minimizes potential over current from the VBAT pin to the VOUT pin. Also, this current value depends on the
VBAT voltage. After CL is charged by the aforementioned stable current and VOUT reaches around the VBAT voltage level, the inrush current
protection function will be released after several hundred μs ~ several ms and the IC will then move to step-up mode, by pass mode or through
mode.
Inrush Current Protection Characteristics
CIN=4.7μF(LMK107BJ475MA)
CIN=4.7μF(LMK107BJ475MA)
CL=10μF(LMK107BJ106MA)
CL=10μF(LMK107BJ106MA)
IOUT=1mA, Ta=25℃
IOUT=1mA, Ta=25℃
10/19
XCL101
Series
■NOTE ON USE
1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC.
2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally connected
components, so refer to the specifications of each component and be careful when selecting the components. Be especially careful of the
characteristics of the capacitor used for the load capacity CL and use a capacitor with B characteristics (JIS Standard) or an X7R/X5R (EIA
Standard) ceramic capacitor.
3. Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could cause the IC
operation to become unstable, so reinforce the area around the GND pin of the IC in particular.
4. Mount the externally connected components in the vicinity of the IC. Also use short, thick wires to reduce the wire impedance.
5. An excessive current that is larger than the PFM switching current flowing in the Nch driver Tr and Pch synchronous rectifier switch Tr, which
could destroy the IC.
6. When in the bypass mode, the internal Pch synchronous rectifier switch Tr turns ON to allow current to flow to the Lx pin and VOUT pin. When an
excessive current comes from the VOUT pin when this bypass operates, it could destroy the Pch synchronous rectifier switch Tr.
7. The CE pin does not have an internal pull-up or pull-down, etc. Apply the prescribed voltage to the CE pin.
8. The embedded coil is optimized for XCL101 series. Please do not use for other purposes.
9. At high temperatures, the product performance could vary causing the efficiency to decline. Evaluate this carefully before use if the product will
be used at high temperatures.
10. Please note that the leak current of the Pch synchronous rectifier switch Tr during high-temperature standby operation could cause the output
voltage to increase.
11. When the voltage difference between VIN and VOUT is small, switching energy increases and there is a possibility that the ripple voltage
will betoo large. And when the ripple voltage becomes big by influence of a load current, please add the CL capacitor.
12. When the booster circuit is activated by a low input voltage, during the time until the output voltage reaches about 1.7V, the PFM switching
current function might not operate causing the coil current to be superimposed. (See the figure below.)
VBAT=VCE=0→0.9V、 VOUT=1.8V、 IOUT=1mA、 L=4.7μH、 CL=10μF、 Ta=25℃
V OUT
V BAT =V CE
VBAT=VCE:1.0V/div
V LX
VOUT:1.0V/div
VLX:2.0V/div
ILX:200mA/div
ILX
200[μs/div]
V OUT
V BAT =V CE
VBAT=VCE:1.0V/div
V LX
Zoom
VOUT:1.0V/div
VLX:2.0V/div
ILX:200mA/div
ILX
50[μs/div]
V BAT=V CE=0→1.7V、 VOUT=1.8V 、IOUT=1mA、 L=4.7μH、CL=10μF、 Ta=25℃
V BAT =V CE
V LX
V BAT=V CE:1.0V/div
V OUT
VOUT:1.0V/div
VLX:2.0V/div
ILX
ILX:200mA/div
200[μs/div]
V BAT =V CE
V LX
V OUT
VBAT=VCE:1.0V/div
V OUT:1.0V/div
Zoom
VLX:2.0V/div
ILX
ILX:200mA/div
50[μs/div]
11/19
XCL101Series
■NOTE ON USE (Continued)
13. If the CL capacity or load current becomes excessively large, the output voltage start-up time, when the power is turned on, will increase, so
the coil current might be superimposed during the time it takes for the output voltage to become sufficiently higher than the VBAT voltage.
14. If the input voltage is higher than the output voltage, then the circuit automatically enters the through mode. When the input voltage becomes
close to the output voltage, there could be repeated switching between the boost mode and through mode causing the ripple voltage to
fluctuate. (Refer to the graphic below)
V BAT=V CE=3.316V,VOUT=3.412V,IOUT=3mA,L=4.7μH,CL=10μF,Ta=25℃
VOUT
V OUT:100mV/div
VBAT
V BAT:100mV/div
VLX
V LX:2.0V/div
200[μs/div]
15. If a different power supply is connected from an external source to the XCL101A/XCL101C, the IC could be destroyed.
16. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded.
17. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging
protection treatment when using Torex products in their systems.
18. With the XCL101A, when the VBAT or VCE power supply is input, if the VOUT pin voltage does not exceed VBAT -0.35V, which can happen due to
the load current being more than the inrush protection current, step-up mode or through mode operations won’t function correctly.
19. With the XCL101C, when the VBAT power supply is input, if the VOUT pin voltage does not exceed VBAT -0.35V, which can happen due to the
load current being more than the inrush protection current, by pass mode operations won’t function correctly.
12/19
XCL101
Series
■NOTE ON USE (Continued)
●Instruction of pattern layouts
1. In order to stabilize VBAT voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VBAT and ground pins.
2. Please mount each external component as close to the IC as possible.
3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
4. Make sure that the ground traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of
switching may result in instability of the IC.
5. Internal driver transistors bring on heat because of the transistor current and ON resistance of the driver transistors.
●Recommended Pattern Layout
<Top view>
<Bottom view>
13/19
XCL101Series
■TYPICAL PERFORMANCE CHARACTERISTICS
1) Output Voltage vs. Output Current
XCL101C501BR-G
XCL101C331BR-G
5.8
Ta=25℃
Output Voltage:V OUT(V)
Output Voltage:V OUT(V)
3.7
3.5
3.3
VIN=1.5V
3.1
1.8V
3.0V
2.9
Ta=25℃
5.4
5.0
VIN=3.0V
4.6
3.6V
4.2V
4.2
0.01
0.1
1
10
100
1000
0.01
0.1
Output Current:IOUT (mA)
1
10
100
1000
Output Current:IOUT (mA)
2) Efficiency vs. Output Current
XCL101C501BR-G
100
100
80
80
60
3.0V
1.8V
VIN= 1.5V
40
Efficiency:EFFI(%)
Efficiency:EFFI(%)
XCL101C331BR-G
4.2V
3.6V
60
VIN= 3.0V
40
20
20
Ta=25℃
Ta=25℃
0
0.01
0.1
1
10
100
0
0.01
1000
0.1
1
10
100
1000
Output Current:IOUT (mA)
Output Current:IOUT (mA)
3) Ripple Voltage vs. Output Current
XCL101C501BR-G
XCL101C331BR-G
160
120
VIN=1.5V
1.8V
3.0V
80
40
0
0.01
0.1
1
10
Output Current:IOUT (mA)
14/19
200
Ta=25℃
Ripple Voltage:Vr(mV)
Ripple Voltage:Vr(mV)
200
100
1000
160
Ta=25℃
VIN=3.0V
3.6V
4.2V
120
80
40
0
0.01
0.1
1
10
Output Current:IOUT (mA)
100
1000
XCL101
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
4) Bypass Voltage vs. Output Current
XCL101C331BR-G
3.8
VIN=3.6V
CE=0V
-40℃
3.6
Ta=25℃
3.5
VIN=5.0V
CE=0V
5.1
Output Voltage : V OUT (V)
3.7
Output Voltage : V OUT (V)
XCL101C501BR-G
5.2
85℃
3.4
3.3
3.2
3.1
5.0
-40℃
Ta=25℃
85℃
4.9
4.8
4.7
4.6
4.5
0
50
100
150
200
250
300
0
50
Output Current: IOUT (mA)
100
150
200
250
300
Output Current: IOUT (mA)
5) Load Transient Response
XCL101C331BR-G
XCL101C331BR-G
IOUT= 1.0mA→50mA
IOUT= 50mA→1.0mA
VOUT
VOUT
IOUT =50mA
IOUT SW
IOUT SW
IOUT =50mA
IOUT =1.0mA
IOUT =1.0mA
VBAT=VCE=1.8V, VOUT=3.3V, Ta=25℃, CIN=4.7μF, CL=10μF
VBAT=VCE=1.8V, VOUT=3.3V, Ta=25℃, CIN=4.7μF, CL=10μF
VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs
VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs
XCL101C501BR-G
XCL101C501BR-G
IOUT= 1.0mA→50mA
IOUT= 1.0mA→50mA
VOUT
VOUT
IOUT =50mA
IOUT SW
IOUT =1.0mA
IOUT SW
IOUT =50mA
IOUT =1.0mA
VBAT=VCE=3.0V, VOUT=5.0V, Ta=25℃, CIN=4.7μF, CL=10μF
VBAT=VCE=3.0V, VOUT=5.0V, Ta=25℃, CIN=4.7μF, CL=10μF
VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs
VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs
15/19
XCL101Series
■PACKAGING INFORMATION
●CL-2025 (unit: mm)
External Lead
●Reference Pattern Layout (unit:mm)
16/19
External Lead
●Reference Metal Mask Design (unit:mm)
XCL101
Series
■PACKAGING INFORMATION
●CL-2025-02 (unit: mm)
External Lead
●Reference Pattern Layout (unit:mm)
●Reference Metal Mask Design (unit:mm)
*Implementation of CL-2025-02 is recommended within accuracy 0.05mm.
17/19
XCL101Series
■MARKING RULE
① represents products series
1
6
①
③
⑤
3
②
④
2
5
4
MARK
PRODUCT SERIES
1
XCL101******-G
② represents integer portion of the output voltage
XCL101A*****
XCL101C*****
VOUT (V)
MARK
VOUT (V)
1.x
1
1.x
MARK
B
2.x
2
2.x
C
3.x
3
3.x
D
4.x
4
4.x
E
5.x
5
5.x
F
CL-2025/CL-2025-02
③ represents the decimal part of output voltage
VOUT(V)
MARK
PRODUCT SERIES
X.0
0
XCL101**0***-G
X.1
1
XCL101**1***-G
X.2
2
XCL101**2***-G
X.3
3
XCL101**3***-G
X.4
4
XCL101**4***-G
X.5
5
XCL101**5***-G
X.6
6
XCL101**6***-G
X.7
7
XCL101**7***-G
X.8
8
XCL101**8***-G
X.9
9
XCL101**9***-G
Example (mark②, ③)
MARK
XCL101A33***-G
XCL101C28***-G
XCL101A50***-G
②
③
②
③
②
③
3
3
C
8
5
0
④, ⑤ represents production lot number
01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
18/19
XCL101
Series
1. The products and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising
from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in
force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with such
equipment whose failure of malfunction can be reasonably expected to directly endanger the life of,
or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and
associated safety equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use
the products under conditions exceeding the specifications, please consult us or our
representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior
permission of TOREX SEMICONDUCTOR LTD.
TOREX SEMICONDUCTOR LTD.
19/19
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