Free Positioning, Qi Compliant Wireless Power Transmitter Manager bq500410A FEATURES DESCRIPTION

Free Positioning, Qi Compliant Wireless Power Transmitter Manager bq500410A FEATURES DESCRIPTION
bq500410A
www.ti.com
SLUSB96 – NOVEMBER 2012
Free Positioning, Qi Compliant Wireless Power Transmitter Manager
Check for Samples: bq500410A
FEATURES
DESCRIPTION
•
The bq500410A is a free-positioning digital wireless
power controller that integrates all functions required
to control wireless power transfer to a WPC compliant
receiver. It is WPC 1.1 ready and designed for 12-V
systems but applicable to other supply voltages. The
bq500410A pings the surrounding environment for
WPC compliant devices to be powered, safely
engages the device, reads the packet feedback from
the powered device, and manages the power
transfer. A charging area of at least 70 mm x 20 mm
provides flexible receiver placement on a transmitter
pad. The bq500410A supports both Parasitic Metal
Detection (PMOD) and Foreign Object Detection
(FOD) by continuously monitoring the efficiency of the
established power transfer, protecting from power lost
due to metal objects misplaced in the wireless power
transfer path. Should any abnormal condition develop
during power transfer, the bq500410A handles it and
provides fault indicator outputs. Comprehensive
protection features provide a robust design to protect
the system in all receiver placements.
1
•
•
•
•
•
•
•
Expanded Free Positioning Using Three Coil
Transmit Array
Intelligent Control of Wireless Power Transfer
Conforms to Wireless Power Consortium
(WPC) A6 Transmitter Specification
Digital Demodulation Reduces Components
WPC1.1 Ready, Including Foreign Object
Detection (FOD)
Enhanced Parasitic Metal Detection (PMOD)
Assures Safety
Over-Current Protection
LED Indication of Charging State and Fault
Status
APPLICATIONS
•
•
WPC 1.1 Ready Wireless Chargers for:
– Smart Phones and other Handhelds
– Hermetically Sealed Devices and Tools
– Cars and Other Vehicles
– Tabletop Charge Surfaces
See www.ti.com/wirelesspower for More
Information on TI's Wireless Charging
Solutions
The bq500410A is available in an area saving 48-pin,
7 mm x 7 mm QFN package and operates over a
temperature range from –40°C to 110°C.
Functional Diagram and Efficiency Versus System Output Current
80
Transmitter
Receiver
Power
AC-DC
Rectification
Voltage
Conditioning
Communication
BQ500410 A
Controller
Feedback
bq51k
Load
Efficiency (%)
70
Power
Stage
60
50
40
30
20
0
1
2
3
Output Power (W)
4
5
G000
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
bq500410A
SLUSB96 – NOVEMBER 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
OPERATING
TEMPERATURE
RANGE, TA
ORDERABLE PART NUMBER
PIN COUNT
SUPPLY
PACKAGE
TOP-SIDE
MARKING
bq500410ARGZR
48 pin
Reel of 2500
QFN
bq500410A
bq500410ARGZT
48 pin
Reel of 250
QFN
bq500410A
-40°C to 110°C
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VALUE
MIN
MAX
Voltage applied at V33D to DGND
–0.3
3.6
Voltage applied at V33A to AGND
–0.3
3.6
–0.3
3.6
–40
150
Voltage applied to any pin
(2)
Storage temperature, TSTG
(1)
(2)
2
UNIT
V
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to GND.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
bq500410A
www.ti.com
SLUSB96 – NOVEMBER 2012
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
3.3
V
Supply voltage during operation, V33D, V33A
3.0
TA
Operating free-air temperature range
–40
TJ
Junction temperature
MAX
UNIT
3.6
V
110
°C
110
THERMAL INFORMATION
bq500410A
THERMAL METRIC (1)
RGZ
UNITS
48 PINS
θJA
Junction-to-ambient thermal resistance (2)
27.1
θJCtop
Junction-to-case (top) thermal resistance (3)
12.9
(4)
θJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter (5)
0.2
ψJB
Junction-to-board characterization parameter (6)
4.3
θJCbot
Junction-to-case (bottom) thermal resistance (7)
0.6
(1)
(2)
(3)
(4)
(5)
(6)
(7)
4.3
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
3
bq500410A
SLUSB96 – NOVEMBER 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
V33A = 3.3 V
8
15
V33D = 3.3 V
42
55
V33D = V33A = 3.3 V
52
60
3.3
3.6
4
4.6
UNIT
SUPPLY CURRENT
IV33A
IV33D
Supply current
ITotal
mA
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
V33
3.3-V linear regulator
V33FB
3.3-V linear regulator feedback
IV33FB
Series pass base drive
Beta
Series NPN pass device
Emitter of NPN transistor
3.25
VIN = 12 V; current into V33FB pin
10
V
mA
40
EXTERNALLY SUPPLIED 3.3 V POWER
V33D
Digital 3.3-V power
TA = 25°C
3
3.6
V33A
Analog 3.3-V power
TA = 25°C
3
3.6
V33Slew
3.3-V slew rate
3.3-V slew rate between 2.3 V and 2.9 V,
V33A = V33D
0.25
V
V/ms
DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A-, COMM_B+, COMM_BVCM
Common mode voltage each pin
COMM+,
COMM-
–0.15
Modulation voltage digital resolution
REA
Input Impedance
Ground reference
0.5
IOFFSET
Input offset current
1-kΩ source impedance
–5
1.631
1
1.5
V
mV
3
MΩ
5
µA
0.36
V
ANALOG INPUTS: V_IN, V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR
VADC_OPEN
Voltage indicating open pin
LED_MODE, LOSS_THR open
VADC_SHORT
Voltage indicating pin shorted to GND
LED_MODE, LOSS_THR shorted to ground
2.37
VADC_RANGE
Measurement range for voltage monitoring
ALL ANALOG INPUTS
INL
ADC integral nonlinearity
Ilkg
Input leakage current
3 V applied to pin
RIN
Input impedance
Ground reference
CIN
Input capacitance
0
-2.5
2.5
2.5
100
8
mV
nA
MΩ
10
pF
DIGITAL INPUTS/OUTPUTS
DGND1
+ 0.25
VOL
Low-level output voltage
IOL = 6 mA , V33D = 3 V
VOH
High-level output voltage
IOH = -6 mA , V33D = 3 V
VIH
High-level input voltage
V33D = 3 V
VIL
Low-level input voltage
V33D = 3.5 V
IOH(MAX)
Output high source current
4
IOL(MAX)
Output low sink current
4
V33D
- 0.6 V
2.1
V
3.6
1.4
mA
SYSTEM PERFORMANCE
VRESET
Voltage where device comes out of reset
V33D Pin
tRESET
Pulse width needed for reset
RESET pin
fSW
Switching Frequency
tdetect
Time to detect presence of device requesting
power
4
2.3
112
Submit Documentation Feedback
2.4
2
V
µs
205
kHz
0.5
s
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
bq500410A
www.ti.com
SLUSB96 – NOVEMBER 2012
DEVICE INFORMATION
Functional Block Diagram
bq500410A
LED Control /
Low Power
Supervisor
Interface
COMM _A+ 37
COMM_A- 38
COMM _B+ 39
7
MSP_RST/LED1
8
MSP_MISO/LED2
9
MSP_TEST
14 MSP_SYNC
18 MSP_CLK
Digital
Demodulation
25 MSP_MOSI/LPWR_EN
26 MSP_RDY
COMM_B- 40
12 DPWM_A
FOD
6
Controller
PMOD 13
PWM/
Coil_Select
V_IN 46
15 Coil 1.1
16 Coil 1.2
17 Coil 1.3
V_SENSE 45
I_SENSE 42
T_SENSE
2
COIL_PEAK
1
12-Bit
ADC
LOSS _THR 43
23 BUZ_AC
Buzzer
Control
24 BUZ_DC
Power
Control
LED_MODE 44
11 PMB_DATA
I2C
10 PMB_CLK
TEMP_INT
5
RESET
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
5
bq500410A
SLUSB96 – NOVEMBER 2012
www.ti.com
COMM_B-
COMM_A-
COMM_A+
38
37
RESERVED
41
COMM_B+
I_SENSE
42
39
LOSS_THR
43
40
LED_MODE
V_IN
46
44
GND
47
45
ADCREF
48
48-Pin RGZ (QFN) Package
(Top View)
COIL_PEAK
1
36
GND
T_SENSE
2
35
BPCAP
AD03
3
34
V33A
AD08
4
33
V33D
RESET
5
32
GND
FOD
6
bq500410A
RESERVED
30
RESERVED
MSP_RST/LED1
7
MSP_MISO/LED2
8
29
RESERVED
MSP _TEST
9
28
RESERVED
PMB_CLK
10
27
RESERVED
PMB _DATA
11
26
MSP _RDY
25
MSP _MOSI /LPWR_EN
EPAD 49
13
14
15
16
17
18
19
20
21
22
23
24
PMOD
MSP_SYNC
Coil 1.1
Coil 1.2
Coil 1.3
MSP_CLK
RESERVED
RESERVED
DOUT_TX
DOUT_RX
BUZ_AC
BUZ_DC
DPWM_A 12
6
31
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
bq500410A
www.ti.com
SLUSB96 – NOVEMBER 2012
Table 1. bq500410A Pin Description
PIN
NO.
NAME
1
COIL_PEAK
2
T_SENSE
3
AD03
4
5
6
FOD
7
MSP_RST/LED1
8
I/O
DESCRIPTION
I
Input from peak detect circuit
I
Sensor input. Device shuts down when below 1 V. If not used, keep above 1 V by simply
connecting to 3.3-V supply
I
This pin can be either connected to GND or left open. Connecting to GND can improve
layout grounding
AD08
I
Reserved. Connect to 3.3-V supply
RESET
I
Device reset. Use 10-kΩ to 100-kΩ pull-up resistor to 3.3-V supply
O
FOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It
controls the FOD threshold resistor read at startup.
I
A dual function pin. MSP – RST provides serial communication to the external supervisor.
LED1 -- If external MSP430 is not used, connect to a (green) LED via 470-Ω resistor for
status indication. Grounding pin 25 determines this pin's function.
I
A dual function pin. MSP – MISO provided serial communication to the external supervisor.
LED2 -- If external MSP430 is not used, connect to a (red) LED via 470-Ω resistor for status
indication. Grounding pin 25 determines this pin's function.
I
MSP – Test, If external MSP430 is not used, leave this pin open
MSP_MISO/LED2
9
MSP_TEST
10
PMB_CLK
I/O
10-kΩ pull-up resistor to 3.3-V supply. I2C/PMBus is for factory use only.
11
PMB_DATA
I/O
10-kΩ pull-up resistor to 3.3-V supply. I2C/PMBus is for factory use only.
12
DPWM_A
O
PWM Output to half bridge driver. Switching dead times must be externally generated.
13
PMOD
O
PMOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It
controls the PMOD threshold resistor read at startup.
14
MSP_SYNC
O
MSP SPI_SYNC, If external MSP430 is not used, leave this pin open
15
COIL 1.1
O
Enables the first coil drive train and COMM signal selector
16
COIL 1.2
O
Enables the second coil drive train and COMM signal selector
17
COIL 1.3
O
Enables the third coil drive train and COMM signal selector
18
MSP_CLK
I/O
MSP430 JTAG_CLK, SPI_CLK. Used for boot loading the MSP430 supervisor
19
RESERVED
O
Reserved, leave this pin open.
20
RESERVED
I
Reserved, connect to GND.
21
DOUT_TX
I
Reserved, leave this pin open
22
DOUT_RX
I
Reserved, leave this pin open
23
BUZ_AC
O
AC buzzer output. A 400-ms, 4-kHz AC pulse train when charging begins
24
BUZ_DC
O
DC buzzer output. A 400-ms DC pulse when charging begins. This could also be connected
to an LED via 470-Ω resistor.
25
MSP_MOSI/LPWR_EN
I/O
MSP-TDI, SPI-MOSI, Low Standby Power Supervisor Enable. Connect to GND if separate
MSP430 low power supervisor is not used.
26
MSP_RDY
I/O
MSP_RDY, MSP430 Programmed Indication
27
RESERVED
I/O
Reserved, leave this pin open
28
RESERVED
I/O
Reserved, leave this pin open
29
RESERVED
I/O
Reserved, leave this pin open
30
RESERVED
I/O
Reserved, leave this pin open
31
RESERVED
I/O
Reserved, connect 10-kΩ pull-down resistor to GND. Do not leave open.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
7
bq500410A
SLUSB96 – NOVEMBER 2012
www.ti.com
Table 1. bq500410A Pin Description (continued)
PIN
NO.
8
NAME
I/O
DESCRIPTION
32
GND
—
GND
33
V33D
—
Digital Core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as
possible.
34
V33A
—
Analog 3.3-V supply. This pin can be derived from V33D supply, decouple with 22-Ω resistor
and additional bypass capacitors
35
BPCAP
—
Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND
36
GND
—
GND
37
COMM_A+
I
Digital demodulation noninverting input A, connect parallel to input B+
38
COMM_A-
I
Digital demodulation inverting input A, connect parallel to input B-
39
COMM_B+
I
Digital demodulation noninverting input B, connect parallel to input A+
40
COMM_B-
I
Digital demodulation inverting input B, connect parallel to input A-
41
RESERVED
I
Reserved, leave this pin open
42
I_SENSE
I
Transmitter input current, used for parasitic loss calculations. Use 20-mΩ sense resistor and
A=50 gain current sense amp
43
LOSS_THR
I
Input to program foreign metal object detection (FOD) threshold
44
LED_MODE
I
LED Mode Select
45
V_SENSE
I
Transmitter power train input voltage, used for FOD and Loss calculations. Voltage sample
point should be after current input sense resistor. Use 76.8-kΩ to 10-kΩ divider to minimize
quiescent loss.
46
V_IN
I
System input voltage selector. Connect this input to GND for 12-V operation.
47
GND
—
48
ADCREF
49
EPAD
I
—
GND
External reference voltage input. Connect this input to GND.
Flood with copper GND plane and stitch vias to PCB internal GND plane
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
bq500410A
www.ti.com
SLUSB96 – NOVEMBER 2012
Principles of Operation
Fundamentals
The principle of wireless power transfer is simply an open cored transformer consisting of a transmitter and
receiver coils. The transmitter coil and electronics are typically built into a charger pad and the receiver coil and
electronics are typically built into a portable device, such as a cell-phone.
When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs once the transmitter coil is
driven. The flux is coupled into the secondary coil which induces a voltage and current flows. The secondary
voltage is rectified, and power can be transferred effectively to a load, wirelessly. Power transfer can be
managed via any of various familiar closed-loop control schemes.
Wireless Power Consortium (WPC)
The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC
Standard was developed to facilitate cross compatibility of compliant transmitters and receivers. The standard
defines the physical parameters and the communication protocol to be used in wireless power. For more
information, or to download a copy of the WPC specification, go to http://www.wirelesspowerconsortium.com/.
Power Transfer
Power transfer depends on coil coupling. Coupling is dependant on the distance between coils, alignment, coil
dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency and duty cycle.
Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer.
The closer the space between the coils is, the better the coupling. However, the practical distance is set to be
less than 5 mm, as defined within the WPC Specification, to account for housing and interface surfaces.
Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the
coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to
contain the fields to avoid coupling to other adjacent system components.
Regulation can be achieved by controlling any one of the coil coupling parameters. However, for WPC
compatibility, the transmitter-side coils and capacitance are specified and the resonant frequency point is fixed.
Power transfer is thus regulated by changing the frequency along the resonance curve from 112 kHz to 205 kHz,
(that is the higher the frequency is, the lower the power). Duty cycle remains constant at 50% throughout the
power band and is reduced only once 205 kHz is reached.
The WPC standard describes the dimensions, materials of the coils and information regarding the tuning of the
coils to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system
efficiency.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
9
bq500410A
SLUSB96 – NOVEMBER 2012
www.ti.com
Principles of Operation (continued)
Communication
Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to
send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to
increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM),
sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual
message and a checksum, as defined by the WPC standard.
The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in
the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter-side
electronics and the frequency of its coil-drive output is adjusted to close the regulation loop. The bq500410A
features internal digital demodulation circuitry.
The modulated impedance network on the receiver can either be resistive or capacitive. Figure 1 shows the
resistive modulation approach, where a resistor is periodically added to the load, Figure 2 shows the resulting
amplitude change in the transmitter voltage. Figure 2 shows the capacitive modulation approach, where a
capacitor is periodically added to the load and the resulting amplitude change in the transmitter voltage.
Rectifier
Receiver Coil
Receiver
Capacitor
Amax
Modulation
Resitor
Operating state at logic “0”
A(0)
Operating state at logic “1”
A(1)
Comm
Fsw
a)
F, kHz
b)
Figure 1. Receiver Resistive Modulation Circuit
Rectifier
Receiver Coil
Receiver
Capacitor
Modulation
Capacitors
Amax
Comm
A(0)
Operating state at logic “ 0”
A(1)
Operating state at logic “ 1”
Fsw
F, kHz
Fo(1) < Fo(0)
a)
b)
Figure 2. Receiver Capacitive Modulation Circuit
10
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
bq500410A
www.ti.com
SLUSB96 – NOVEMBER 2012
The bq500410A
Description of Operation
The bq500410A pings the surroundings in 400-ms intervals by sequentially firing the three coils in the array. The
COMM feedback signal is multiplexed through analog switches and is synchronized to the coil being driven. To
select the best coil match, the bq500410A looks for the strongest COMM signal. The coil is engaged and driven,
note that only one coil is driven at a time. The driven coil is tolerant of slight misalignment of the RX while power
is being transferred. Actually displacing the RX to an adjacent coil while charging is allowable, the sequential
ping sequence and detection to determine the best matching coil to drive continues to repeat.
Capacitor Selection
Capacitor selection is critical to proper system operation. The total capacitance value of 2 nF x 68 nF (+5.6-nF
center coil) is required in the resonant tank. This is the WPC system compatibility requirement, not a guideline.
NOTE
A total capacitance value of 2 nF x 68 nF/100 V (68 nF + 5.6 nF center coil) (C0G
dielectric type) is required in the resonant tank to achieve the correct resonance
frequency.
The capacitors chosen must be rated for at least 100 V and must be of a high quality C0G dielectric (sometimes
also called NP0). These are typically available in a 5% tolerance, which is adequate. The use of X7R types or
below is not recommended if WPC compliance is required because critical WPC Certification Testing, such as
the minimum modulation or ensured power requirements, might fail.
The designer can combine capacitors to achieve the desired capacitance value. Various combinations can work
depending on market availability. All capacitors must be of C0G types, not mixed with any other dielectric types.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
11
bq500410A
SLUSB96 – NOVEMBER 2012
www.ti.com
A6 Coil Specification
The coil and matching capacitor specification for the A6 transmitter has been established by WPC Standard. This
is fixed and cannot be changed on the transmitter side.
The bq500410A is primarily intended to drive a 3 coil array but it can also be used to drive a single coil. For
single coil operation the two outer coils and associated electronics are simply omitted. Please refer to the
application schematic at the end of this datasheet (See Figure 6).
Doo
Dol
Doe
Diw
Dow
Dil
Figure 3. Coil Specification Drawing
Table 2. Coil Specification
PARAMETER
SYMBOL
SPECIFICATION
Outer length
Dol
53.2, (±0.5)
Inner length
Dil
27.5, (±0.5)
Outer width
Dow
45.2, (±0.5)
Inner width
Diw
19.5, (±0.5)
Thickness
Dc
1.5, (±0.5)
Turns
N
12
Layers
-
1
Odd displacement
Doo
49.2, (±4)
Even displacement
Doe
24.6, (±2)
UNIT
mm
Turns
mm
NOTE
The performance of an A6 transmitter can vary based on the design of the A6 coil set. For
best performance with small receiver coils under heavy loading, it is best to design the coil
set such that the Doo dimension is on the low end of the specified tolerance.
For a current list of coil vendors please see:
• bqTESLA Transmitter Coil Vendors, Texas Instruments Literature Number SLUA649
12
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
bq500410A
www.ti.com
SLUSB96 – NOVEMBER 2012
Option Select Pins
Two pins (pin 43 and pin 44) on the bq500410A are allocated to program the Loss Threshold and the LED mode
of the device. At power up, a bias current is applied to pins LED_MODE and LOSS_THR and the resulting
voltage measured in order to identify the value of the attached programming resistor. The values of the operating
parameters set by these pins are determined using Table 4. For LED_MODE, the selected bin determines the
LED behavior based on Table 3; for the LOSS_THR, the selected bin sets a threshold used for parasitic metal
object detection (see Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD) section).
bq500410A
LED_MODE
Resistors
to set
options
44
LOSS_THR 43
To 12-bit ADC
Figure 4. Option Programming
LED Modes
The bq500410A can directly drive two LED outputs (pin 7 and pin 8) through a simple current limit resistor
(typically 470 Ω), based on the mode selected. The two current limit resistors can be individually adjusted to tune
or match the brightness of the two LEDs. Do not exceed the maximum output current rating of the device.
The selection resistor connected between pin 44 and GND selects one of the desired LED indication schemes
presented in Table 3.
Table 3. LED Modes
OPERATIONAL STATES
LED
CONTROL
OPTION
LED
SELECTION
RESISTOR
0
<36.5 kΩ
LEDs off
1
42.2 kΩ
Generic
2
3
4
48.7 kΩ
56.2 kΩ
64.9 kΩ
> 75 kΩ
(1)
(2)
DESCRIPTION
LED
STANDBY
POWER
TRANSFER
CHARGE
COMPLETE
FAULT
LED1, Green
Off
Blink slow (1)
On
Off
Off
LED2, Red
Off
Off
Off
On
Blink fast (2)
LED1, Green
On
Blink slow (1)
On
Off
Off
LED2, Red
On
Off
Off
On
Blink fast (2)
LED1, Green
Off
Off
On
Off
Off
LED2 Red
Off
On
Off
Blink fast (2)
On
LED1, Green
Off
On
Off
Off
Off
LED2 Red
Off
Off
Off
On
Blink fast (2)
Generic + standby
Generic Opt 1
Generic Opt 2
PMOD or FOD
WARNING
Reserved
Blink slow = 0.625 Hz
Blink fast = 2.5 Hz
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
13
bq500410A
SLUSB96 – NOVEMBER 2012
www.ti.com
Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD)
The bq500410A is WPC1.1 ready and supports both enhanced PMOD and FOD features by continuously
monitoring the input voltage and current to calculate input power. Combining input power, known losses, and the
value of power reported by the RX device being charged, the bq500410A can estimate how much power is
unaccounted for and presumed lost due to metal objects placed in the wireless power transfer path. If this
unexpected loss exceeds the threshold set by the LOSS_THR resistor, a fault is indicated and power transfer is
halted. Whether the PMOD or the FOD algorithm is used is determined by the ID packet of the receiver being
charged.
PMOD has certain inherent weaknesses as rectified power is not ensured to be accurate per WPC1.0
Specification. The user has the flexibility to adjust the LOSS_THR resistor or to disable PMOD by leaving pin 43
open should issues with compliance or interoperability arise.
The FOD algorithm uses information from an in-system characterized and WPC1.1 certified RX and it is therefore
more accurate. Where the WPC1.0 specification requires merely the Rectified Power packet, the WPC1.1
specification additionally uses the Received Power packet which more accurately tracks power used by the
receiver.
As default, PMOD and FOD share the same LOSS_THR setting resistor for which the recommended starting
point is 400 mW (selected by a 56.2-kΩ resistor on the LOSS_THR option pin 43). If, for some reason, the
application requires disabling one or the other or setting separate PMOD and FOD thresholds, Figure 5 can be
used.
Resistor R39 sets the FOD threshold and R24 sets the PMOD threshold in this configuration. The control lines
(FOD and PMOD) are driven briefly at power-up when the resistor values are read.
To selectively disable PMOD support, R24 and Q8-B should be omitted from the above design.
14
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
bq500410A
www.ti.com
SLUSB96 – NOVEMBER 2012
Table 4. Option Select Bins
BIN NUMBER
RESISTANCE (kΩ)
LOSS THRESHOLD
(mW)
0
<36.5
250
1
42.2
300
2
48.7
350
3
56.2
400
4
64.9
450
5
75.0
500
6
86.6
550
7
100
600
8
115
650
9
133
700
10
154
750
11
178
800
12
205
850
13
>237
Feature Disabled
SEE_NOTE
SEE_NOTE
R22
R39
Q8-A
FOD
R24
Q8-B
AGND
PMOD
Figure 5. LOSS_THR Connection Circuits
NOTE
Either one of these circuits is connected to LOSS_THR, but not both.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
15
bq500410A
SLUSB96 – NOVEMBER 2012
www.ti.com
Shut Down by Thermal Sensor or Trigger
Typical applications of the bq500410A does not require additional thermal protection. This shutdown feature is
provided for enhanced applications and is not limited to thermal shutdown. The key parameter is the 1.0-V
threshold on pin 2. Voltage below 1.0 V on pin 2 causes the device to shut down.
The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is
straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are
connected to the bq500410A device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the
system shuts down and a fault is indicated (depending on LED mode chosen).
To
1.
2.
3.
4.
implement this feature follow these steps:
Consult the NTC datasheet and find the resistence vs temperature curve.
Determine the actual temperature where the NTC will be placed by using a thermal probe.
Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC.
Use the following formula to determine the upper leg resistor (R_Setpoint):
R _ Setpoint = 2.3 ´ R _ NTC
(1)
The system restores normal operation after approximately five minutes or if the receiver is removed. If the feature
is not used, this pin must be pulled high.
NOTE
Pin 2 must always be terminated, else erratic behavior may result.
Fault Handling and Indication
The following is a table of End Power Transfer (EPT) packet responses, fault conditions, the duration how long
the condition lasts until a retry in attempted. The LED mode selected determines how the LED indicates the
condition or fault.
Table 5. Fault Handling and Indication
16
CONDITION
DURATION
(before retry)
EPT-00
Immediate
Unknown
EPT-01
5 seconds
Charge complete
EPT-02
Infinite
Internal fault
EPT-03
5 minutes
Over temperature
EPT-04
Immediate
Over voltage
EPT-05
Immediate
Over current
HANDLING
EPT-06
Infinite
Battery failure
EPT-07
Not applicable
Reconfiguration
EPT-08
Immediate
No response
OVP (over voltage)
Immediate
OC (over current)
1 minute
NTC (external sensor)
5 minutes
PMOD/FOD warning
12 seconds
PMOD/FOD
5 minutes
10 seconds LED only,
2 seconds LED +
buzzer
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
bq500410A
www.ti.com
SLUSB96 – NOVEMBER 2012
Power Transfer Start Signal
The bq500410A features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms
duration, 4-kHz square wave for driving low cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400
ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized
indication scheme. Do not exceed 4 mA loading from either of these pins which is more than adequate for small
signaling and actuation. If not used, these pins should be left open.
Power-On Reset
The bq500410A has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles
the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed.
External Reset, RESET Pin
The bq500410A can be forced into a reset state by an external circuit connected to the RESET pin. A logic low
voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 VCC with a 10-kΩ
pull-up resistor.
Trickle Charge and CS100
CS100 is supported. If CS100 is reported by the RX, the bq500410A indicates that charge is complete.
The WPC specification provides an End-of-Power Transfer message (EPT) to indicate charge complete. Upon
receipt of the charge complete message, the bq500410A changes the LED indication to solid green LED output
and halt power transfer for 5 seconds. Subsequently, transmitters pings the receiver again to see if its status has
changed, assuming it receives another EPT, the LED mode stays the same.
The WPC specification also provides reporting of the level of battery charge (Charge Status). In some battery
charging applications there is a benefit to continue the charging process in trickle-charge mode to top off the
battery. The bq500410A changes the LED indication to reflect charge complete when a 'Charge Status 100%'
message is received, but unlike the response to an EPT message, it does not halt power transfer while the LED
is solid green. The RX, the mobile device being charged, uses a CS100 packet to enable trickle charge mode.
Current Monitoring Requirements
The bq500410A is WPC1.1 ready. In order to enable the PMOD or FOD features, current monitoring must be
provided in the design.
Current monitoring is optional however, it is used for the foreign metal protection features and over current
protection. The system designer can choose not to include the current monitor and remain WPC1.0 compliant.
Alternately, the additional current monitoring circuitry can be added to the hardware design but not loaded. This
would enable a forward migration path to future WPC1.1 compatibility.
For proper scaling of the current monitor signal, the current sense resistor should be 20 mΩ and the current
shunt amplifier should have a gain of 50, such as the INA199A1. The current sense resistor has a temperature
stability of ±200 PPM. Proper current sensing techniques in the application hardware should also be observed.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
17
bq500410A
SLUSB96 – NOVEMBER 2012
www.ti.com
Over-Current Protection
The bq500410A has an integrated current protection feature which monitors the input current reported by the
current sense resistor and amplifier. If the input current exceeds a safety threshold, a fault is indicated and power
transfer is halted for one minute.
If this feature is desired, the sense resistor and amplifier are required. If this feature is not desired, the I_SENSE
input pin to the bq500410A (pin 42) should be grounded.
NOTE
Always terminate the I_SENSE pin (pin 42), either with the output of a current monitor
circuit or by connecting to ground.
MSP430G2101 Low Power Supervisor
This is an optional low-power feature. By adding the MSP430G2101, as recommended in the bq500410A
application schematic, the bq500410A device is periodically shut down to conserve power, yet all relevant states
are recalled and all running LED status indicators remain active.
Since the bq500410A needs an external low-power mode to significantly reduce power consumption, the most
direct way to reduce power is to remove its supply and completely shut it down. In doing so, however, the
bq500410A goes through a reset and any data in memory would be lost. Important information regarding charge
state, fault condition, operating mode and indicator pins driven would be cleared.
The MSP430G2101, in its role as a low-power supervisor, is used to provide accurate 'ping' timing, retains
charge state, operating mode, fault condition and all relevant operation states. The LEDs are now driven and
controlled by the MSP430, not the bq500410A, which directly drives and maintains the LED status indication
during the bq500410A reset periods. Since the LED indicators are now driven by the MSP430G2101, care
should be taken not to exceed the pin output current drive limit.
Using the suggested circuitry, a standby power reduction from 300 mW to less than 90 mW can be expected
making it possible to achieve Energy Star rating.
The user does not need to program the MSP430G2101, an off-the-shelf part can be used. The required
MSP430G2101 firmware is embedded in the bq500410A and is boot loaded at first power up, similar to a field
update. The MSP430G2101 code cannot be modified by the user.
NOTE
The user cannot program the MSP430G2101 in this system.
All Unused Pins
All unused pins can be left open unless otherwise indicated. Please refer to Table 1. Grounding of unused pins, if
it is an option, can improve PCB layout.
18
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
bq500410A
www.ti.com
SLUSB96 – NOVEMBER 2012
APPLICATION INFORMATION
Overview
The application schematic for the transmitter with reduced standby power is shown in Figure 7.
CAUTION
Please check the bq500410A product page for the most up-to-date schematic and list
of materials reference design package before starting a new project.
Input Regulator
The bq500410A requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down
from the 12-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements
with respect to cost or efficiency.
The application example circuit utilizes a low-cost buck regulator, TPS54231.
Power Trains
The bq500410A drives three independent half bridges. Each half bridge drives one coil from the coil set
assembly. The TPS28225 is the recommended driver device for this application. It features high-side drive
capability which enables the use of N-channel MOSFETs throughout. Gate-drive supply can be derived from a
primitive active voltage divider. A highly regulated supply is not required to drive MOSFET gates.
Signal Processing Components
The COMM signal used to control power transfer is derived from the coil voltage. Each coil has its own signal
processing chain. The coil voltage is AC coupled and divided down to a manageable level and biased to a 1-V
offset. Series connected diodes are provided for protection from any possible transients. The three signal
processing chains are then multiplexed together via analog switches. Thus, the correct signal processing chain
and COMM signal used to control power transfer is from the coil being driven.
Low-Power Supervisor
Power reduction is achieved by periodically disabling the bq500410A while LED and housekeeping control
functions are continued by U4, the low-cost, low quiescent current micro controller MSP430G2101. When U4 is
present in the circuit (which is set by a pull-up resistor on bq500410A pin 25), the bq500410A at first power-up
boots the MSP430G2101 with the necessary firmware and the two chips operate in tandem. During standby
operation, the bq500410A periodically issues SLEEP command, Q1 pulls the supply to the bq500410A, therefore
eliminating its power consumption. Meanwhile, the MSP430G2101 maintains the LED indication and stores
previous charge state during this bq500410A reset period. This bq500410A off period is set by the
MSP430G2101. WPC compliance mandates the power transmitter controller, bq500410A, awakes every 400 ms
to produce an analog ping and check if a valid device is present. This time constant can not be altered to further
reduce power.
Disabling Low-Power Supervisor Mode
For lowest cost or if the low-power supervisor is not needed, please refer to Figure 8 for an application schematic
example.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
19
bq500410A
SLUSB96 – NOVEMBER 2012
www.ti.com
Input Power Requirements
For full wireless power system capability and WPC compliance, the AC power adapter selected for the
application should have a minimum rating of 12 V at 750 mA.
PCB Layout
Careful PCB layout practice is critical to proper system operation. There are many references on proper PCB
layout techniques. A few good tips are repeated here:
The TX layout requires a 4-layer PCB layout for best ground plane technique. A 2-layer PCB layout can be
achieved though not as easily. Ideally, the approach to the layer stack-up has been:
• Layer 1 component placement and as much ground plane as possible.
• Layer 2 clean ground.
• Layer 3 finish routing.
• Layer 4 clean ground.
Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also
provides a noise free voltage reference plane for device operation.
Keep as much copper as possible. Make sure the bq500410A GND pins and the power pad have a continuous
flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also
acts as a heat sink for the bq500410A. A good GND reference is necessary for proper bq500410A operation,
such as analog-digital conversion, clock stability and best overall EMI performance.
Separate the analog ground plane from the power ground plane and use only ONE tie point to connect grounds.
Having several tie points defeats the purpose of separating the grounds!
The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce
stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as
differential routing and shielding, but the COMM signal lines do not need to be impedance matched.
The DC-to-DC buck regulator used from the 12-V input supplies the bq500410A with 3.3 V. Typically a singlechip controller solution with integrated power FET and synchronous rectifier or outboard diode is used. Pull in the
buck inductor and power loop as close as possible to create a tight loop. Likewise, the power-train, full-bridge
components should be pulled together as tight as possible. See the bq500410A EVM for an example of a good
layout technique.
References
1. Technology, Wireless Power Consortium, http://www.wirelesspowerconsortium.com/
2. Analog Applications Journal, An Introduction to the Wireless Power Consortium Standard and TI’s Compliant
Solutions, Johns, Bill, (Texas Instruments Literature Number SLYT401)
3. Datasheet, Qi Compliant Wireless Power Transmitter Manager, (Texas Instruments Literature Number
SLUSAL8)
4. Datasheet, Integrated Wireless Power Supply Receiver, Qi (WPC) Compliant, bq51011, bq51013, (Texas
Instruments Literature Number SLVSAT9)
5. Application Note, Building a Wireless Power Transmitter, (Texas Instruments Literature Number SLUA635)
6. Application Note, bqTESLA Transmitter Coil Vendors, Texas Instruments Literature Number SLUA649
20
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: bq500410A
2
1
12V-IN
DC in
J2
N/C
D7
C28
D3
BAT54SW
D2
4
7
N/C
C4
C26
C32
R37
76.8k
6
5
8
1
7
6
5
4
3
2
1
COMM+
R10
NoPop
R33
76.8K
R31
10.0K
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
VCC
2700pF
R40
100K
330pF
MSP_MISO
MSP_CLK
475
475
475
R9
R32
R3
NoPop
C29
COMP
VSENS
PH
BOOT
U5
TPS54231D
GND
SS
EN
0.01uF
GND ties
JP1
JP2
JP3
0.1uF
10uF
3
C25
STATUS
C6
2
PILOT
VIN
3V3_VCC
2
R4
3.16k
C31
4.7nF
R5
10.0K
NTC
3V3_VCC
14
C11
4.7uF
C33
MSP_TEST
MSP_SYNC
R13
10.0K
COMM+
COMM-
MSP_CLK
MSP_RST
4.7nF MSP_MISO
MSP_TEST
I_SENSE
0.1uF
C22
10.0K
R25
RESET
1.0uF
37 COMM_A+
38 COMM_A39 COMM_B+
40 COMM_B-
18 MSP_CLK
21 DOUT_TX
22 DOUT_RX
6
FOD
7
MSP_RST/LED1
8
MSP_MISO/LED2
9
MSP_TEST
46 V_IN
45 V_SENSE
42 I_SENSE
3V3_VCC
4.7uF
4
AD08
3
AD03
2
T_SENSE
1
COIL_PEAK
5
41 RESERVED
48 ADCREF
C1
C19
2.2nF
C7 47p
26
25
24
23
12
13
14
15
16
17
LED_MODE 44
LOSS_THR 43
MSP_RDY
MSP_MOSI/LPWR_EN
BUZ_DC
BUZ_AC
DPWM_A
PMOD
MSP_SYNC
COIL1.1
COIL1.2
COIL1.3
RESERVED 20
RESERVED 19
11
PMB_DATA
10
PMB_CLK
35
31
30
29
28
27
1.0uF
C3
BPCAP
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
4.7uF
C5
R22
100K
R7 10.0K
C20
I_SENSE
R23
42.2k
R45
10.0K
MSP_RDY
MSP_MOSI
COIL1.2
MSP_SYNC
BUZ
R12
10.0K
R67
150k
R68
249k
R17
10.0K
TP18
R11
10.0K
R8
10.0
Q14
BC847CL
12V-IN
C30
0.01uF
3V3_VCC
3V3_VCC
TP14
C78
0.1uF
3V3_VCC
R71
1.00k
V+
R18
1.00
VIN_BRD
C69
0.1uF
R15
1.00
REF
GND
U17
INA199A1
MSP_RST
1.0uF
1.0nF
C34
3V3_VCC
Q2
BSS215P
R21
10.0K
Q1
BSS215P
R6 100K
U11
BQ500410A
22
R46
MSP_RDY
R20
10.0K
R19
10.0
1.0
MSP_MOSI
C12
R14
47K
0.1uF
R29
9
3V3_VCC
C10
0.01uF
C2
47uF
VCC
8
10
11
12
13
C16
P1.6
P1.7
RST
TEST
XOUT
XIN
GND
10.0K
R1
D1
MBR0540
L1
330uH
U4
MSP430G2101
0.1uF
VIN_BRD
IN-
12V-IN
V33D 33
IN+
1
OUT
J1
V33A 34
GND
GND
GND
EPAD
R69
0.020
DPWM-1A
0.1uF
C70
COIL1.2
DPWM-1A
TP32
0.1uF
C72
V_GATE
6
4
7
3
GND
EN/PG
PWM
VDD
LGATE
PHSE
BOOT
UGATE
U18
TPS28225D
1
C73
TP34
0.22uF
R27
10.0
R35 0
5
8
2
COMM-
COMM+
Q15
TP31
Q13
F
R72
10.0
R2
10.0
C79
R66
10.0K
R28
200k
4700pF
C76
0.068uF
C75
0.068uF
TP33
R70
33pF
C74
D5
BAT54SW
23.2k
C77
22uF
3V3_VCC
C23
5.6nF
C21
5.6nF
VIN_BRD
www.ti.com
47
36
32
49
TP16
TP15
12V-IN
bq500410A
SLUSB96 – NOVEMBER 2012
bq500410A Single, Low-Power and Low-Cost Schematics
Figure 6. bq500410A Single Coil Application Diagram
Submit Documentation Feedback
21
DC in
J2
2
1
12V-IN
D7
C28
D3
BAT54SW
D2
7
VIN
GND
SS
EN
0.01uF
GND ties
JP1
JP2
JP3
0.1uF
10uF
4
2
N/C
3
C25
STATUS
C6
1
PILOT
475
R32
N/C
C4
C26
C32
R37
76.8k
6
5
7
6
5
4
3
2
1
R33
76.8K
R4
3.16k
C31
4.7nF
R5
10.0K
FOD
NTC
3V3_VCC
C11
4.7uF
MSP_TEST
MSP_SYNC
MSP_TEST
MSP_MISO
Q8-A
COMM+
COMM-
4.7nF
MSP_RST
FOD
I_SENSE
0.1uF
C22
10.0K
R25
R39
MSP_CLK
DOUT_TX
DOUT_RX
R13
10.0K
RESET
Q8-B
PMOD
COMM_A+
COMM_ACOMM_B+
COMM_B-
SEE_NOTE
37
38
39
40
18 MSP_CLK
21 DOUT_TX
22 DOUT_RX
R24
1.0uF
6
FOD
7
MSP_RST/LED1
8
MSP_MISO/LED2
9
MSP_TEST
46 V_IN
45 V_SENSE
42 I_SENSE
3V3_VCC
4.7uF
4
AD08
3
AD03
2
T_SENSE
1
COIL_PEAK
5
41 RESERVED
48 ADCREF
C1
C19
2.2nF
12
13
14
15
16
17
20
19
11
10
AGND
R22
LED_MODE 44
LOSS_THR 43
MSP_RDY 26
MSP_MOSI/LPWR_EN 25
BUZ_DC 24
BUZ_AC 23
DPWM_A
PMOD
MSP_SYNC
COIL1.1
COIL1.2
COIL1.3
RESERVED
RESERVED
PMB_DATA
PMB_CLK
35
31
30
29
28
27
1.0uF
C3
BPCAP
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
4.7uF
SEE_NOTE
LOSS_THR
1
C7 47p
R23
42.2k
R45
10.0K
MSP_RDY
MSP_MOSI
PMOD
MSP_SYNC
COIL1.1
COIL1.2
COIL1.3
Parts labeled "NoPop" are not installed
R7 10.0K
C20
I_SENSE
C69
0.1uF
C78
0.1uF
BUZ
R12
10.0K
R8
10.0
R67
150k
R17
10.0K
TP18
R11
10.0K
3V3_VCC
C30
0.01uF
3V3_VCC
R18
1.00
TP14
V+
3V3_VCC
R71
1.00k
REF
GND
U17
INA199A1
MSP_RST
1.0uF
1.0nF
C34
Q2
BSS215P
R21
10.0K
C5
R6 100K
U11
BQ500410A
22
R46
MSP_MOSI
R20
10.0K
R19
10.0
8
C12
R14
47K
0.1uF
C33
1.0
MSP_RDY
3V3_VCC
C10
0.01uF
47uF
C2
R29
9
10
11
12
13
14
C16
P1.6
P1.7
RST
TEST
XOUT
XIN
GND
10.0K
R1
D1
MBR0540
L1
330uH
U4
MSP430G2101
0.1uF
R15
1.00
R68
249k
TP32
COIL1.3
DPWM-1A
COIL1.2
DPWM-1A
0.1uF
COIL1.1
DPWM-1A
C70
DPWM-1A
Q14
BC847CL
12V-IN
0.1uF
C90
V_GATE
0.1uF
C82
V_GATE
0.1uF
C72
V_GATE
6
4
7
3
6
4
7
3
6
4
7
3
VDD
GND
1
LGATE
PHSE
BOOT
UGATE
COIL1.1
LGATE
PHSE
BOOT
UGATE
C73
C83
A
VCC
S
C91
3V3_VCC
A
VCC
S
U23
C97
0.1uF
TP42
0.22uF
U21
C89
0.1uF
R82
10.0
R41 0
5
8
2
1
U19
0.22uF
TP38
3V3_VCC
R36 0
5
8
2
1
A
VCC
S
C81
0.1uF
R74
10.0
3V3_VCC
TP34
0.22uF
R27
10.0
R35 0
5
8
2
U22
TPS28225D
COIL1.2
EN/PG
PWM
VDD
GND
LGATE
PHSE
BOOT
UGATE
U20
TPS28225D
COIL1.1
EN/PG
PWM
VDD
GND
EN/PG
PWM
U18
TPS28225D
B1
GND
B2
B1
GND
B2
B1
GND
B2
TP15
COMM+
Q17
COMM+
Q19
TP40
Q18
COMM-
C79
R66
10.0K
R28
200k
4700pF
COMM-
COMM-
R84
10.0K
R83
200k
4700pF
C96
R78
10.0K
R77
200k
4700pF
C88
Middle Coil
TP36
Q16
TP16
COMM+
Q15
TP31
Q13
C76
0.068uF
C93
0.068uF
TP41
C94
0.068uF
C85
0.068uF
TP37
C86
0.068uF
C75
0.068uF
TP33
R70
D5
R79
D10
R85
D11
33pF
C92
BAT54SW
23.2k
3V3_VCC
C27
NoPop
22uF
C95
VIN_BRD
C24
NoPop
33pF
C84
BAT54SW
23.2k
3V3_VCC
C15
5.6nF
22uF
C87
VIN_BRD
C14
5.6nF
33pF
C74
BAT54SW
23.2k
C77
22uF
3V3_VCC
C23
NoPop
C21
NoPop
VIN_BRD
SLUSB96 – NOVEMBER 2012
Note: Either one of these circuits is connected to LOSS_THR but not both
R31
10.0K
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
VCC
R10
NoPop
COMM+
330pF
MSP_MISO
1
8
2700pF
R40
100K
475
R9
MSP_CLK
475
R3
NoPop
C29
COMP
VSENS
PH
BOOT
Q1
BSS215P
3V3_VCC
VIN_BRD
IN-
2
3V3_VCC
IN+
VCC
OUT
J1
VIN_BRD
R69
0.020
10.0
U5
TPS54231D
V33A 34
R72
R80
12V-IN
V33D 33
47 GND
36 GND
32 GND
49 EPAD
10.0
F
10.0
F
10.0
F
R2
R73
R81
Product Folder Links: bq500410A
10.0
Submit Documentation Feedback
10.0
22
R86
12V-IN
bq500410A
www.ti.com
Figure 7. bq500410A Low-Power Application Diagram
Copyright © 2012, Texas Instruments Incorporated
D3
BAT54SW
N/C
DC in
R10
NoPop
COMM+
330pF
C4
R40
100K
J2
2
1
R33
76.8K
N/C
R31
10.0K
C31
4.7nF
D2
4
7
COMM+
COMM-
R32
1
C32
R37
76.8k
6
5
8
RESET
37
38
39
40
COMM_A+
COMM_ACOMM_B+
COMM_B-
18 MSP_CLK
21 DOUT_TX
22 DOUT_RX
6
FOD
7
MSP_RST/LED1
8
MSP_MISO/LED2
9
MSP_TEST
46 V_IN
45 V_SENSE
42 I_SENSE
4
AD08
3
AD03
2
T_SENSE
1
COIL_PEAK
5
41 RESERVED
48 ADCREF
4.7uF
1.0uF
C1
DPWM_A
PMOD
MSP_SYNC
COIL1.1
COIL1.2
COIL1.3
12
13
14
15
16
17
RESERVED 20
RESERVED 19
11
PMB_DATA
10
PMB_CLK
BPCAP
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
1.0uF
C3
35
31
30
29
28
27
4.7uF
C5
LED_MODE 44
LOSS_THR 43
MSP_RDY 26
MSP_MOSI/LPWR_EN 25
BUZ_DC 24
BUZ_AC 23
U11
BQ500410A
22
R46
10.0K
R1
D1
MBR0540
L1
330uH
R4
3.16k
VCC
0.1uF
C19
C26
2700pF
475
R9 475
0.1uF
C22
10.0K
R25
VCC
NoPop
C29
COMP
VSENS
PH
BOOT
U5
TPS54231D
GND
SS
EN
VIN
0.01uF
C28
GND ties
JP1
JP2
JP3
C25
0.1uF
C6
12V-IN
10uF
2
3
1
2
VCC
12V-IN
VCC
12V-IN
V33A 34
C2
C33
0.1uF
R23
42.2k
COIL1.1
COIL1.2
COIL1.3
1.0uF
R7 10.0K
C20
47uF
VCC
R17
10.0K
TP18
R11
10.0K
VCC
R8
10.0
R12
10.0K
VCC
R67
150k
DPWM-1A
R68
249k
COIL1.3
DPWM-1A
COIL1.2
DPWM-1A
0.1uF
C70
COIL1.1
DPWM-1A
TP32
0.1uF
C90
V_GATE
0.1uF
C82
V_GATE
0.1uF
C72
V_GATE
4
7
3
6
4
7
3
6
4
7
3
6
GND
LGATE
PHSE
BOOT
UGATE
COIL1.1
LGATE
PHSE
BOOT
UGATE
C73
1
C83
1
A
VCC
S
C91
3V3_VCC
A
VCC
S
U23
C97
0.1uF
TP42
0.22uF
U21
C89
0.1uF
R82
10.0
R41 0
5
8
2
U19
0.22uF
TP38
3V3_VCC
R36 0
5
8
2
A
VCC
S
C81
0.1uF
R74
10.0
3V3_VCC
TP34
0.22uF
R27
10.0
R35 0
5
8
2
1
U22
TPS28225D
COIL1.2
EN/PG
PWM
VDD
GND
LGATE
PHSE
BOOT
UGATE
U20
TPS28225D
COIL1.1
EN/PG
PWM
VDD
GND
EN/PG
PWM
VDD
U18
TPS28225D
B2
B1
GND
B2
B1
GND
B2
B1
GND
TP15
COMM+
Q17
COMM+
Q19
TP40
Q18
COMM-
C79
R66
10.0K
R28
200k
4700pF
COMM-
COMM-
R84
10.0K
R83
200k
4700pF
C96
R78
10.0K
R77
200k
4700pF
C88
Middle Coil
TP36
Q16
TP16
COMM+
Q15
TP31
Q13
10.0
Q14
BC847CL
R72
R80
J1
STATUS
V33D 33
47 GND
36 GND
32 GND
49 EPAD
10.0
F
10.0
F
10.0
F
R2
R73
R81
Product Folder Links: bq500410A
10.0
Copyright © 2012, Texas Instruments Incorporated
10.0
C76
0.068uF
C93
0.068uF
TP41
C94
0.068uF
C85
0.068uF
TP37
C86
0.068uF
C75
0.068uF
TP33
R70
R79
R85
33pF
C92
D11
BAT54SW
23.2k
3V3_VCC
C27
NoPop
22uF
C95
VIN_BRD
C24
NoPop
33pF
C84
D10
BAT54SW
23.2k
3V3_VCC
C15
5.6nF
22uF
C87
VIN_BRD
C14
5.6nF
33pF
C74
D5
BAT54SW
23.2k
C77
22uF
3V3_VCC
C23
NoPop
C21
NoPop
VIN_BRD
www.ti.com
R86
12V-IN
bq500410A
SLUSB96 – NOVEMBER 2012
Figure 8. bq500410A Low-Cost Application Diagram
Submit Documentation Feedback
23
PACKAGE OPTION ADDENDUM
www.ti.com
12-Nov-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Samples
(3)
(Requires Login)
BQ500410ARGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
BQ500410ARGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BQ500410ARGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
BQ500410ARGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ500410ARGZR
VQFN
RGZ
48
2500
367.0
367.0
38.0
BQ500410ARGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising