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Product Guide Autumn 2013
Embedded Computing
Highlights
About congatec
02|03
congatec AG is the preferred global vendor for innovative
embedded solutions to enable competitive advantages
for our customers.
Letter from the CEO
Since the company’s inception in December
2004, congatec AG has established itself as a
globally recognized expert and reliable partner
for embedded computer-on-modules solutions,
coupled with excellent service and support. We
have secured second ranking worldwide in our
market segment within the space of just eight
years after our founding thanks to our clear
focus.
On our way to market leadership
congatec AG, headquartered in Deggendorf,
Germany, is a leading provider of computer-onmodules solutions for the Qseven, COM Express,
XTX and ETX standard form factors. congatec
products can be deployed in highly varied
industrial areas and applications such as industrial
automation, medical technology as well as the
aerospace and communication sectors. Besides
computing solutions based on the newest x86
and ARM technology, uniquely BIOS features and
related driver and board support packages form
congatec’s core expertise and technical knowhow. Our customers enjoy extensive product
lifecycle management right from the design-in
phase. Specialized service providers manufacture
our modules using the most up-to-date quality
standards.
1
Source: IMS Research: Embedded Computer Boards and Modules, 2012 Edition
congatec has already ranked among the Deloitte
Technology Fast 50 for the second consecutive
year1. This award distinguishes Germany’s
highest-growth technology companies. As a
result of this success, congatec is constantly
confronted by the challenge of rapidly adapting
its internal structures to new circumstances
on the market and also within the company, in
order to remain on its sustainable growth path
in the future.
Since Japan is one of congatec’s most important
sales markets in Asia, we opened a branch in
Tokyo in 2012. Major customers in this region
can now be serviced directly as a consequence.
This not only creates benefits for our Japanese
customers but also for globally operating major
customers. The visibility of the congatec brand
was also further optimized through strengthening
our marketing activities in Japan.
Moreover, we bolstered our sales presence in
Australia and New Zealand through opening
a new branch in Queensland. The Australian
market offers great potential, especially in the
segments of entertainment (gaming), agricultural
technology, transportation management and
medical technology, where congatec products
can be deployed optimally.
Following the opening of the branches in Japan
Australia, congatec is now represented with six
branches on four continents – Asia (Taiwan and
Japan), Australia, Europe (Germany and the
Czech Republic), as well as North America (USA).
This consistent expansion together with our
strong partner network secures close customer
relationships for us worldwide.
We will continue to focus on efficiency
enhancement through optimizing processes
and structures in the future. Through close
co-operation with our technology partners
Intel, AMD, Freescale and Adeneo Embedded,
congatec continued to prove its leading position
in technology and product innovations in 2012.
In order to push further ahead with our growth
strategy, we will offer products based on ARM
processes and “Modules Plus” as a further service
for our customers. This is just one example of new
product and support initiatives that congatec is
adopting in order to not only offer benefits for
customers, but also to further tap target markets.
This would all be impossible without our
employees’ commitment. I would like to take
this opportunity to again express my thanks to all
congatec employees. In the passion with which
they pursue their daily activities, and through
customer-orientation, creativity and team
spirit, they have already brought the company
to a leading position, and, together with the
company’s management, continue to stand for
a sustainable and partnership-based corporate
culture.
At the same time, I would also like to thank
our customers and business partners for the
confidence they invest in congatec, and for their
loyalty and cooperative joint work.
Gerhard Edi, Chief Executive Officer
About congatec – congatec AG international
04|05
www.congatec.com
congatec
Sales Partner
Solution Partner
The congatec rhythm is the driving force behind innovation and technology for embedded computer modules.
Economical Principal
congatec products and technologies offer inno­
vative solutions for the commercial and industrial
use of embedded computer technology.
Module Know-How
The congatec engineering teams are com­mitted to
embedded module technology. This vast amount
of knowledge allows for superior hard­ware and
software support for our customers.
Quality
congatec AG is certified in compliance with
ISO9001. All congatec products are made to meet
the highest quality standards.
Software and Driver Support
congatec offers advanced Board-Support-Pack­
ages, which include both the latest tested driv­
ers from silicon vendors and the congatec
specific drivers for accessing all of our additional
embedded module features.
BIOS Expertise
congatec has an experienced engineering staff for
BIOS UEFI and board controller firmware de­vel­
op­ment. The congatec implementations ex­pands
the functionality to enable professional industry
applications.
System Integration
When designing a system, special attention must
be paid to issues such as heat dis­si­pa­tion, elec­
tro­static / electromagnetic com­pat­i­bility, sig­nal
compliance, mechanical system design, and etc.
By using congatec products, you gain access to
congatec’s experience, which will help you deal
with these issues. You can also opt to utilize our
Module+ program to out-source single en­gi­neer­
ing tasks or a complete system design to congatec.
Design-In Support
The congatec teams are committed to provide
the best design-in support to customers. This en­
ables a perfect fit of the congatec Computer-OnModules to the customer’s carrier boards.
Lifecycle Support
congatec offers life cycle support for the com­
plete lifetime of the product. congatec pays close
attention to component life cycles in or­der to
provide advanced end-of-life product no­ti­fi­ca­
tions.
In addition, congatec focuses on efficient processing of repairs including, when applicable,
replacement modules.
Focussing on core competencies
Embedded computing is congatec’s passion. The
clear focus on Computer-On-Modules results in a
high degree of specialization for the experienced
congatec employees. Accessing this power and
industry knowledge allows for customers to
focus on their special application know-how and
industries.
ISO 9001
C
ER
T I F I C AT I O
N
TM
Technology Partnerships
Intel® Intelligent Systems Alliance Associate member
Intel® Technology Provider Platinum member
AMD® Fusion
Partner Premier
freescale™
Technology Partner
Adeneo Embedded
Software Partner
COM Express® design guide Rev. 1.0 editor
COM Express® Rev. 2.0 / 2.1 editor
Qseven® Founding member
Qseven® Specification & design guide editor
XTX™ Founding member
XTX™ Specification & design guide editor
SGET e.V. Founding Member
SGET e.V. Board Member
PICMG® Executive Member
Computer-On-Modules – the Concept
06|07
Embedded computer modules are small computer boards that can be integrated into almost any application without
a cable connection. Embedded computer modules are used when standard single board computers are not suitable
for mechanical reasons or due to a lack of expandability.
The difference between boards and modules
Embedded computer modules are small computer
boards that can be integrated in almost every
application without a cable connection. All signals
are transmitted via industrial board-to-board
connectors to a customer- or application-specific
carrier board. This carrier board contains all the
hardware expansions and also allows the cableless interface distribution.
Scalability
congatec offers modules from the lowest of
power consumption up to the highest of
computing performance. Not only is the computer
performance scalable, but so is the interface
configuration. The large product selection at
congatec allows you to get precisely the required
performance and interface configuration required
for your application.
Cooling
A heatspreader serves as a thermal interface
between the embedded computer module and
the cooling solution of the system. Thus, e.g. the
excess heat can be passed directly to the system
housing. The heatspreader is defined in the COM
specification and is uniformly implemented for all
modules. The heatspreader for high performance
modules utilize a congatec patented heatpipe
system in order to boost cooling performance and
system reliability.
Customer Specific Solution
The carrier board contains all of the special
functionalities required by the corresponding
embedded application. These functionalities can
include special interfaces, a unique power supply,
as well as the mechanical design and connector
placement. The embedded computer module
itself is plugged into the carrier board like a
component. This ”super component” represents a
complete computer that provides the intelligence
to the application.
Economical
By avoiding expensive and sensitive cable
connections, solutions based on embedded
computer modules provide optimal cost and
reliability, even for mid-sized quantities.
Flexible and robust mechanical solutions
Computer-On-Modules allow for very compact
solutions. Because the modules are firmly screwed
down, solutions are possible even for the most
difficult environmental conditions.
Long-term availability
The excellent long-term availability of all congatec
modules is further extended as a result of the
clearly defined module interface. As new silicon
platforms are released into the marketplace, a
next-generation computer module will be there to
continue the life-cycle of your product. Additional
End-Of-Lífe services allow for a smooth phase
out and replacement strategy.
Minimized development risk
The complexity of carrier board development is
significantly reduced when embedded computer
modules are used. With lower complexity, the
probability of error is naturally lower as well. This
means the cost and time frame of the project can
be met with a significantly lower risk.
Time-to-market
With a module-based solution, a complex CPU
board design with accompanying BIOS / UEFI
development is not necessary. Module-based
solutions therefore offer a significantly faster
time-to-market for the final product. To accelerate
the time-to-market even further, congatec offers
complete starter kits. The starter kits allow hardware and software development to get started
prior to having the production-based carrier
board completed. Appropriate board support
packages for all standard operating systems
provide an additional head start.
ACPI Battery Management
08|09
conga-SBM³
Power Button
MicroController
I²C / SMB
I²C / SMB
Ready to use Smart
Battery Manager Module
I²C, BAT_LOW#, PS_ON, PWR_BTN, S5
12 Volt
12V
Converter
Charger
Switch
SMART
Charger
5 Volt
Power MUX
Reverse
Voltage
Protection
SMART
Battery
#1
SMART
Battery
#2
..
..
5V
Converter
Standby
Application
OS
ACPI CGOS
CMB
congatec
Board
Controller
Computer-On-Module
SBM³
Carrier Board
DC Input 8-30V
=
~
AC/DC
110V AC
230V AC
In combination with an ACPI operating system, the battery functionality associated with mobile platforms is supported
by congatec embedded computers. Now it‘s much easier to build mobile embedded applications that have notebook
battery functionality.
COM Advantages when Compared to a Full Custom Design
COM Standard
Qseven ®
Size
70x70 mm²
Bus
PCI Express® 4 Lanes, LPC, I²C, CAN,
UART
PCI Express® max. 22 Lanes, PCI, LPC, I²C
PCI Express® max. 24 Lanes, LPC, I²C
PCI, ISA, I²C
PCI Express® 4 Lanes, PCI, LPC, I²C
2x / 1x
4x / -
4x / 1x
-/-
4x / -
8x (2x USB 3.0)/ 1x 1 GBit
8x / 1x 1 GBit
8x (4x USB 3.0)/ 1x 1 GBit
4x / 1x 100 MBit
6x / 1x 100 MBit
Digital (HDA)
Digital (AC‘97 / HDA)
Digital (AC‘97 / HDA)
Analog
Analog / Digital (AC‘97 / HDA)
LVDS (alt. eDP) / SDVO / DisplayPort /
HDMI
VGA / TVout / LVDS / 2x SDVO or PEG
VGA / LVDS (alt. eDP) / SDVO / 3x HDMI/
DP / PEG
~5.5 GByte/s
up to ~12.4 GByte/s
up to ~26.4 GByte/s
SATA/SDIO
USB 2.0 / Ethernet
Audio
Display Interface
I/O Bandwith over all
(no Panel Signals)
COM Express® Type2
ETX®
Basic 95x125 mm², Compact 95x95 mm²
Software Interface (API)
Homepage
COM Express® Type6
XTX™
95x114 mm²
VGA / TVout / LVDS
~0.6 GByte/s
~3.3 GByte/s
www.etx-ig.com
www.xtx-standard.org
cgos / EAPI
www.qseven-standard.org
www.sget.org
Lower Costs
COMs save money. The cost of the development
and end product are dramatically reduced. This
holds true for the product‘s entire life-cycle. COMs
provide a cost advantage from the very start.
• Lower engineering cost
• Lower product cost
• Lower cost of life cycle management
www.picmg.org
Reduced Risk
COMs minimize risk. Basic changes during the
design phase, or in the middle of a product‘s life
cycle, are easily managed. Simply plug in the nextgeneration COM module and continue. COMs
allow for easy upgrades.
• Lower design risk
• Lower transition risk
www.picmg.org
Improved Flexibility
COMs are flexible and can meet all performance
requirements. The modules support a wide range
of performance up to the Intel® Core™ i7 processor,
as well as future architectures. The COM standards
are well established and are already prepared for
the future.
Time-To-Market Advantage
COMs put you in a leading position. The use of
customized carrier boards reduces necessary
engineering effort by separating your design work
from the embedded PC technology. Use COMs
in your design and you can stay focused on your
own core competency.
• Scalability
• Performance upgrades are easy
• Technology upgrades are easy
• Faster time to market
• Faster engineering
• Faster reaction time to market changes
congatec Embedded BIOS/UEFI
10|11
Watchdog Events
ACPI
Event
Reset
Power
Button
Software
Shutdown
or Reset
Hardware
Reset
Switch
ON/Off
No Trigger
Power
Button
ON/Off
No Trigger
Multi Stage
Hardware
Reset
congatec System Utility
Multi Stage Watchdog Timer
Embedded computer users usually require more than the standard functionality of an office computer. congatec has
taken these requirements into account when designing BIOS / UEFI functionalities. Based on our large amount of
BIOS and UEFI experience, we have implemented the embedded requirements into our powerful congatec BIOS / UEFI
platform.
Optimized Power
ACPI Power Management and System Configuration is supported by the congatec BIOS / UEFI
according to the ACPI specification.
Multi Stage Watchdog Timer
All congatec modules are equipped with a multi
stage watchdog timer supporting different events
such as ACPI event, hardware reset or power
button. It can either assert a single event and/or
any combination of these events.
congatec Board Controller
An onboard μc fully isolates some of the
embedded features, such as system monitoring
or the I²C bus, from the x86 core architecture.
This results in higher embedded feature performance and higher overall system reliability.
Fast Mode I²C Bus
The I²C Bus is a simple serial bus interface often
used for sensors, converters or data storage in
embedded applications. All congatec modules
offer a 400 kHz multi-master I²C Bus that provides
maximum I²C bandwidth.
BIOS Setup Data Backup
The BIOS CMOS settings are held in flash memory
to allow battery-less applications.
Manufacturing Data Storage
The congatec board controller provides a rich data
set of manufacturing and board information: Serial
Number, Article Number, EAN Code, Manufacturing
and Repair Date, System Statistics and more. The
BIOS also keeps track of dynamically changing
running time and boot count data. All this data is
accessible by a uniform API.
User Data Storage Area
congatec modules provide 32 Bytes of non- volatile
storage in the EEPROM and a 64 kByte block in the
BIOS flash memory.
Hardware Monitoring
The congatec BIOS has the routines to monitor
critical components implemented. Fans, operating
voltages and several temperature sensors can be
monitored without incurring additional development costs.
Display Auto-detection
The LVDS flatpanel can be autodetected by the
BIOS via EDID support or set as fixed panel timing
in BIOS setup.
OEM BIOS Logo
The BIOS can display a custom logo instead of
the tradional diagnostic output during POST.
OEM Customization - Do It Yourself BIOS
The congatec embedded BIOS allows customers to
do create their own BIOS binary by adding OEM
code and data modules. These OEM modules help
reduce the need for customized BIOS versions.
OEM BIOS Code
Customer specific code can be executed while
booting the system. During power on self test
(POST) the congatec BIOS can give control to
customer specific code. This gives customers more
flexibility to initalize special hardware extensions.
OEM CMOS Defaults
The congatec embedded BIOS allows the customer
to store their own defaults in flash memory.
OEM Verb Table
To initialized HDA codecs on the carrier board from
BIOS level.
OEM SLP string and OEM SLIC Table
Helps to activate licensed copies of a Windows
operating system (OS) so end users of the
embedded system will not have to activate the OS
themselves.
OEM EDID for LVDS Panel
Create your own EDID data for any LVDS flat panel
and add to the list of predefined Timings offered in
the BIOS setup.
congatec System Utility
All Embedded BIOS features are accessible
through the use of a congatec Windows tool.
This includes all manufacturing and statistical
information; e.g. serial number, running hours,
boot counter etc. BIOS default settings, bootlogo
and flat panel configurations can easily be
programmed using this flexible and powerful tool.
32/64 Bit Uniform OS API
The congatec embedded BIOS Features are
accessible through the uniform APIs EAPI (a
PICMG® definition) and CGOS.
Board Support Packages
congatec offers advanced BSPs, which include
both the latest tested drivers from silicon vendors
and the congatec specific drivers for accessing
all of our additional embedded BIOS and module
features.
congatec Cooling Solutions
12|13
Heatpipe Chip
Heat absorber
Phase change
material
congatec’s smart cooling pipes pave the
way for unlimited performance growth
for COM Express® modules
Coil spring
Heatpipes CPU
Heatspreader block
Threaded stand-off
Cooling fins
The new cooling system based on cooling
pipes which are integrated in the standardized
heatspreader of the COM Express specification.
With this solution it becomes possible to cool next
generation high-performance processors with a
power dissipation of well over 35W TDP. The real
problem are the hot spots around the processor
and chipset. The congatec improved cooling
concept results in a lower processor temperature,
which is essential for a more frequent activation
of Intel® Turbo Boost 2 Technology to ensure
maximum COM performance and energy
efficiency. As a result, the processor can operate
at higher levels than the maximum permitted
thermal design power (TDP).“
Heatspreader and passive
cooling solution for Qseven®
Heatspreader Concept
The specifications for Qseven®, COM Express®,
XTX™ and ETX® embedded computer modules
include a heatspreader definition, which is
the mechanical thermal interface. All the heat
generated by power consuming components such
as chipsets and processors is transferred to the
system’s cooling via the heatspreader. This can be
achieved by either a thermal connection to the
casing, a heat pipe or a heat sink.
The advantages at a glance:
• Fast spot cooling for full performance
• Elimination of gap filler layer
• Elimination of mechanical stress leads to higher
quality
• Better cooling extends the life span of the
module
• Heat pipe principle enables innovative
customer-specific cooling concepts
congatec’s new heat pipe cooling design is
available in different variants comprising a passive,
active and customer-specific solution that creates
space for innovative ideas. For example, the heat
pipe can be designed in such a way that it can
be connected to a customer-specific heat sink.
Fanless designs are possible provided the casing
is equipped with appropriately sized cooling fins.
Ultimately, the design depends on the specific
application. The key features of the concept are
equally applicable to other electronic circuits. The
new cooling solution is also ideal for systems with
low power dissipation. The modules have a higher
thermal reserve, which increases their life span
and reliability. Average temperature reductions
of 5 Kelvin can double the statistical life span – a
convincing argument when considering the total
cost over the lifetime of a system.
Passive cooling solution
Heatspreader
Heatspreader Mounting
congatec heatspreader solution are optimized for
vertically and horizontally mounted applications.
All thermal stacks are fixed in place through the
use of pins to ensure that there is no movement.
Depending on top or bottom mounting versions
with through holes or threads are available.
Cooling Solutions
Compared with sandwich-type constructions for
heatspreaders and cooling systems, active and
passive cooling solutions remove one layer from
the process. The heatspreader and cooler are
manufactured as one unit, which enables them to
provide faster thermal conduction. For an active
cooling solution, a high performance quiet fan has
been integrated within the cooling fins.
Active cooling solution
Standard cooling solution
Heatspreaders featuring Heatpipes
The congatec heatspreaders and cooling solutions
for the high performance modules are featuring
heatpipes in order to boost performance and
reliabiltiy. A copper block is mounted on the
chip to absorb heat and to mitigate the effects
of thermal peaks. Between the chip and the
copper block, a phase-change material is placed
to improve the heat transmission. To account for
different component heights and manufacturing
tolerances, the copper block is spring loaded to
apply an optimized pressure to the silicon dye. The
copper block and the cooling fins or heat plate are
connected by flexible flat heatpipes. All this results
in fast spot cooling, good thermal connections,
elimination of mechanical stress and greater
cooling performance. This leads to while retaining
geometric dimensions – achieving all these
Heatpipe Heatspreader
requirements sounds like asking the impossible.
However, congatec has mastered the challenge
by skilfully combining the classical solution with a
structurally modified heat pipe. Unlike the classical
design, a flattened heat pipe is used to transfer
heat from the chip to the heat spreader plate.
The heat pipe is attached directly to the cooling
blocks on the chip and the heatspreader plate.
As a result, more heat is transported from the
processor environment to the heatspreader, hot
spots are cooled more quickly and the processor is
cooled more optimally. Spiral springs with defined
spring tension, as well as the heat pipe itself with
its flexible height, put optimum pressure on the
processor chip.
Qseven® – the Mobile COM Definition
14|15
Qseven® also supports ARM processors for
mobile and ultra low power consumption
applications. Unlike COM Express®, XTX™
and ETX®, it is not limited to x86 processor
technology. One carrier board can be
equipped with x86 or ARM Qseven® modules.
conga-QMX6 original size
Targeting next generation ultra mobile embedded processors built using latest mobile chip technologies, the
Qseven® format complements the low power and small size of these processors. By exploiting the small form factor
of the industry’s latest processors, the Qseven® format offers high performance computing power, delivered in a
module measuring only 70x70 mm2.
70.00
Freedom
Qseven® allows for the use of non x86 processor
architectures. It supports the low power mobile
ARM processor architecture. Customers have the
freedom to use all kinds of Qseven® modules
without the need to change the carrier board.
Legacy Free
Qseven® is a legacy free standard focused on
high speed serial interfaces such as PCI Express®
and Serial ATA. Qseven® omits support for legacy
interfaces like EIDE and PCI, in order to provide
ideal support for today‘s, as well as future, CPU‘s
and chipsets.
40.00
70.00
Mobile Applications
70.00
Qseven
14.2
8.0
11.9
5.0
1.2
8.0
13.0
COM Express
21.0
7.8 mm
8.0
2.7
Compact Size
The module‘s dimensions are a mere 70x 70mm².
This means it can be easily integrated into size
constricted systems.
Low Power
Qseven® is defined for a maximum power
consumption of 12 Watts. It is designed to be
operated by single 5 Volt DC power and provides
all additional signals for battery management. This
simple power requirement allows for small mobile
solutions powered by compact two cell batteries.
Slim Design
Compared to COM Express®, Qseven® enables
slimmer mechanical housings.
µQseven
Qseven
1.2
Qseven® is unlike previous Computer-On-Modules
(COM) standards due to its primary focus being
directed towards mobile and ultra mobile
applications.
5.5 mm
Connector
Unlike most previous module standards, Qseven®
does not require an expensive board-to-board
connector. Instead, it utilizes a very affordable
MXM card slot with 230 pins in a 0.5 mm
configuration.
SGeT e.V.
The Qseven® Specification is hostet by the 2012
founded SGeT standardization group. congatec is
founding member, board member and Qseven®
development team member of the SGeT.
Ultra Mobile – Qseven®
16|17
conga-QA3
• Based on Next Generation Intel®
Atom™ Processor
• Up to 4 Cores / 2.0 GHz
conga-QMX6
conga-QAF
Formfactor
Freescale® i.MX6 Series ARM
Cortex A9
i.MX6 Quad, 4x 1.0 GHz
i.MX6 Dual, 2x 1.0 GHz
Dual Lite, 2x 1.0 GHz
i.MX6 Solo, 1.0 GHz
DRAM
max. 2 GByte DDR3 1066 MT/s
Chipset
I/O Interface
Serial ATA
PCI EXPRESS®
USB 2.0
USB 3.0
SDIO
LPC Bus
I²C Bus
AMD Embedded G-Series
Processors
G-T40E, 2x 1.0 GHz
G-T40R, 1.0 GHz
G-T16R, 615 MHz
Intel® Celeron® J1900 4x 2.0 GHz
Intel® Atom™ E3845 4x 1.91GHz
Intel® Atom™ E3827 2x 1.75GHz
Intel® Atom™ E3826 2x 1.46GHz
Intel® Atom™ E3825 2x 1.33GHz
Intel® Atom™ E3815 1.46GHz
Intel® Atom™ E600
Series Processor
E680T / E680, 1.6 GHz
E660T / E660, 1.3 GHz
E640T / E640, 1.0 GHz
E620T / E620, 600 MHz
Intel® Atom™ Z500
Series Processor
Z530, 1.6 GHz
Z510, 1.1 GHz
max. 8 GByte dual channel DDR3L 1333 MT/s
max. 2 GByte DDR2 667/800 MT/s
max. 1 GByte DDR2 400/533 MT/s
AMD A55E Controller Hub
Integrated in SoC
1x 1 Gigabit Ethernet
Gigabit Ethernet Intel® 82574
Gigabit Ethernet Intel® I210
Micrel® GBit Ethernet Phy KSZ9021RN
Gigabit Ethernet Realtek RTL8111
1x
2x
2x
2x
-
Intel® Platform Controller
Hub EG20/EG20T
Intel® SCH US15W
1x
4x
3x
3x
1x
4x and 1x USB OTG
8x
6x
8x
8x
-
-
1x
-
-
1x
1x
1x
1x
1x
-
1x
1x
1x
1x
2x
1x
1x
1x
1x
2x ExpressCard™
1x UART
1x CAN Bus
-
On board Solid State Drive (eMMC)
up to 8 GByte (optional),
on board MicroSD socket
On board SATA Solid State Drive
up to 32 GByte (optional)
eMMC 4.51 onboard flash
up to 32 GByte (optional)
On board SATA Solid State Drive
up to 32 GByte (optional)
On board ATA Solid State
max. 4 GByte (optional)
I²S, AC97
Integrated in Freescale i.MX6 Series
Video Interfaces
High Definition Audio Interface
Integrated AMD Radeon™ HD 6250,
DirectX®11 graphics with UVD 3.0,
Dual Simultaneous Display Support
LVDS 2x 24, HDMI
congatec Board Controller
U-Boot boot loader
Intel® HD Graphics
with 4 Execution Units
LVDS 2x 24, HDMI, DisplayPort
-
Embedded BIOS Feature
Intel® Graphics Core with 2 D
and 3 D Hardware Accelerator
Power Management
-
Operating Systems*
Android, Linux, Microsft® Windows
Embedded Compact 7
LVDS 1x18/1x24, Single channel SDVO interface
AMI-Aptio 4 MByte Flash BIOS with
congatec Embedded BIOS features
OEM Logo, OEM CMOS Defaults, LCD Control, Display Auto Detection,
Backlight Control, Flash Update
ACPI 3.0 compliant,
Smart Battery Management
based on AMIBIOS8®
ACPI 5 .0 compliant,
Smart Battery Management
Microsoft® Windows 8
Windows® CE 6.0
-
Typ. application ~3-5 Watt @ 5V
Typ. application: 4.5~10 Watt @ 5V
Typ. application: 4.5 W...12W
-
-
MIPI-CSI, UART
Operating: 0 to +60°C commercial grade
-40 to +85°C industrial grade
Storage: -40 to +85°C
Operating: 0 to +60°C
Storage: -20 to +80°C
Special
* Additional Operating Systems on request
ACPI 3.0 compliant,
Smart Battery Management
Microsoft® Windows 7, Microsoft® embedded Standard, Microsoft® Windows Embedded Compact 7, LINUX
Microsoft® Windows® XP
Power Consumption
Intel® Graphics Media Accelerator 500
(Intel® GMA 500)
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics,
I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
based on AMI Aptio UEFI
Temperature Range
conga-QA
1x CAN Bus, 1x UART, Android Buttons
Sound
Graphics
conga-QA6
max. 4 GByte DDR3L 1066 MT/s
-
Ethernet
Mass Storage
conga-QA3
Qseven® Form Factor, 70 x 70 mm2
CPU
Additional
N EW
conga-QA3
• Up to 8 GByte RAM
Operating: 0 to +60° C (opt. -40 to +85° C)
Storage: 0 to +80° C (opt. -40 to +85° C)
Microsoft® Windows® XP,
Typ. application -5 Watt @ 5V
-
Operating: 0 to +60°C
Storage: -20 to +80°C
Qseven® – Engineering Tools
18|19
conga-QKit
conga-QKIT/ARM
Qseven® Mobility Kit
This complete kit provides the ability to start evaluating Qseven®
modules immediately.
This complete kit provides the ability to start evaluating Qseven®
ARM modules immediately
This kit provides the ability to start immediately evaluating
Qseven® modules for all kinds of mobile applications.
conga-QEVAL evaluation carrier board
Qseven® module based on Freescale’s new i.MX6 ARM Cortex A9
processors conga-QMX6/QC-2G (PN: 016104)
Qseven® module based on AMD Embedded G-Series Processors
conga-QAF/T40R-2G (015300)
conga-QEVAL/ARM Qseven® evaluation carrier board for standard
Qseven® ARM modules
Mini carrier board for Qseven® conga-MCB/Qseven® DP (020731)
SATA-to-IDE converter
conga-LDVI/EPI LVDS to DVI converter board for digital flat panels
with onboard EEPROM
Adapter for generic LVDS panels
ATX power supply
conga-ACC/I2S Audio card adapter with I2S/HDA codec
Complete cable set
conga-HDMI ADD2 card to connect a HDMI display
congatec USB memory stick
MicroSDHC-Card 8 GByte
Contains a ready to go bootloader image (Ubuntu Oneiric)
conga-LDVI LVDS to DVI converter
conga-FPA2 evaluation flat panel adapter
SATA-to-CF card adapter
HDMI to DVI-D adapter
Standard ATX power supply (180 Watt)
Cable set
congatec Smart Battery Manager Module conga-SBM3/Qseven®
USB memory stick with the latest drivers
Universal power supply (19V, 90W),
Rechargeable Smart Li-Ion battery pack, 2 cells, 7.2V, 4.56Ah with
battery connector adapter
7" TFT widescreen touch monitor 800x480, LVDS
USB touch controller
Cable set
Qseven® Mini Carrier Board
conga-QEVAL
SMART Battery Manager Module
Mini Carrier Board for Qseven® with smart battery manager
interface for mobile ap­plica­tions and SDVO display interface
support for Intel® mobile platforms.
Evaluation board for Qseven® modules. To achieve a quick start
with Qseven® congatec offers an eval­uation carrier board, which
routes all the Qseven® signals to standard interface connectors.
conga-SBM³ is a complete battery manager sub system. It is
designed for the use with low power congatec COM Express®
compact modules and congatec Qseven® modules.
Small size: 95x145 mm
1x miniPCI Express Socket
4x PCI Express® x1, 1x ExpressCard, 1x Mini PCI 
Express Card, 1x SDIO Card Socket
Supports battery two smart batteries with configurations
2S up to 4S
1x RJ45 connector with GB Ethernet transformer
Gigabit Ethernet, 6x USB 2.0 + 1x client, 2x SATA
Dual charge and discharge for high efficiency
1x CFAST Socket, 1x SATA, 1x 8 bit SD Card socket
MIC, Line In, Line Out, SPDIF
S3 (Suspend to RAM) / S5 (Soft-Off) support
2x USB at the front panel, 4x USB on pin header
LPC POST code display, System speaker
Zero current from batteries in off mode
1x Display Port or 1x HDMI
Power button, Reset button, LID button, Sleep button
LEDs provide a direct view of charging and battery capacity status
Dual LVDS 18/24 bits
PCI Express® switch, external BIOS flash
Input voltage of 8 - 30V DC, with input power delimitation
High Definition Audio, two 3.5‘ Jack on front panel, SPDIF on
header
I²C EEPROM, aux signals for battery management
Output 12V / ~35W, 5V / ~20W
1x Dual Channel LVDS
1x SDVO, HDMI or Display Port
Battery charging max. 4A or 2x 2A in dual charge mode
CAN transceiver
Power button/reset button/mini card WIFI radio disable/sleep
button/LID button
Versions for SDVO (conga-QA & conga-QA6), DisplayPort
(conga-QAF) and ARM (conga-QMX6)
Backlight control
12 V single power input, ATX power input connector, CMOS battery
Temperature:
Operating: 0 .. +70°C, Storage: -25 .. +80°C
COM Express® – the Concept
COM Express
COM Express
Type 2 Type 2
Ethernet
Ethernet
LPC
LPC
IDE
IDE
COM Express
COM Express
Type 6 Type 6
Ethernet
Ethernet
LPC
LPC
SATA 0-3
SATA 0-3
SATA 0-3
SATA 0-3
I2C
I2C
I2C
I2C
HDA
HDA
HDA
HDA
PCI 32 Bit
PCI 32 Bit
USB 0-7USB 0-7
USB 0-7USB 0-7
ExpressCard
ExpressCard
ExpressCard
ExpressCard
PCIe 0-5
PCIe 0-5
PCIe 0-5
PCIe 0-5
GPIO GPIO
GPIO/SDIO
GPIO/SDIO
LVDS LVDS
PEG/SDVO
PEG/SDVO
LVDS/eDP
LVDS/eDP
KBD
KBD
SER 0-1SER
/ CAN
0-1 / CAN
SPI
SPI
SPI
Power Power
Power Power
20|21
Basic
Compact
125x95mm2
95x95mm2
USB 3.0USB
0-33.0 0-3
PCIe 6-7
PCIe 6-7
DDI 0-2DDI 0-2
PEG
PEG
SPI
Power Power
Power Power
COM Express® is a PICMG® standard that defines a Computer-On-Module, or COM, packaged as a super component.
The defined interfaces provide a smooth transition path from legacy interfaces to modern differential signals. This
includes DisplayPort, PCI Express®, USB 3.0 and Serial ATA. congatec was editor within the PICMG® for the
COM Express® specifications 2.0 /2.1 and for the COM Express® Design Guide.
New interfaces
COM Express® defines 440 interconnect pins
between the COM Express® module and the
carrier board. Legacy buses such as PCI, parallel
ATA are supported with type 2 modules. Type
6 modules feature additional PCI Express® 2.0
Lanes, USB 3.0, 3 DisplayPort/HDMI outputs and
no longer multiplexes the PEG port with graphic
signals.
Legacy Free
COM Express® is a legacy free standard. Outdated
interfaces such as floppy, PS/2 keyboard/mouse,
LPT are no longer supported. If required, these
legacy interfaces can be optionally generated on
the customized carrier board.
The Type 6 pin-out definition follows that path.
IDE and 32 Bit PCI Bus are replaced by the new
video interface DDI (switchable to DVI/HDMI or
DisplayPort), additional PCI Express® lanes and
the SuperSpeed signals for USB 3.0.
Size
COM Express® describes four different sizes. The
major form factors are the Compact (95x95mm²)
and the Basic (95x125mm²). The primary
difference between the modules is the overall
physical size and the performance envelope
supported by each.
Thermal Design
As with Qseven® and XTX/ETX, the COM Express®
definition includes a heatspreader that acts as a
thermal interface between the COM Express®
module and the system‘s cooling solution. All
heat generating components are thermally
conducted to the heatspreader in order to avoid
hot spots.
The heatspreaders and cooling solutions for the
high power modules utilize congatecs patented
high efficient flat heat pipes in order to allow for
maximum performance and highest reliability.
PCI Express®
COM Express® offers up to 24 PCI Express®
lanes. This allows the customer to equip
their embedded PC application with the next
generation of PC performance. PCI Express®
is a low pin count interface with maximum
bandwidth per pin. PCI Express® is defined for a
maximum bandwidth of up to 8 GBit/s per lane
and direction.
GPIO
COM Express® defines freely usable general
purpose inputs and outputs.
PCI Express® Graphics (PEG)
The PEG interface utilizes up to 16 PCI Express®
lanes in order to drive an external ultra high
performance graphic controller located on the
carrier board. The PEG Port is available with the
conga-BP77 Type 2 implementation and with
most Type 6 modules.
USB
The Type 2 modules feature up to 8 USB 2.0
ports. New with Type 6 are the additional
SuperSpeed signals for up to four USBs. Up to 4
USB 3.0 ports (including USB 2.0) and 4 USB 2.0
ports are available now.
Video Output
Common video outputs for Type 2 and Type 6
modules are VGA and LVDS for direct flat panel
support. With Type 6, the Intel® SDVO interface
was reduced to a maximum of 1 channel.
New for Type 6 is the implementation of 3
DDI (Digital Display Interface). Each of the DDI
can be switched to TMDS (for DVI or HDMI) or
DisplayPort. The current Intel® implementation
additionally allows the first DDI to be switched
to SDVO mode. Future Type 6 modules will also
allow for an embedded Displayport. This eDP
interface will be multiplexed with the LVDS A
channel.
Type 2
Type 6
6x PCI Express®
PCI Express®
Graphics (PEG x16)
4x SATA
8x USB 2.0
-
8x PCI Express®
PCI Express®
Graphics (PEG x16)
4x SATA
8x USB 2.0
4x USB 3.0 Signals
2x ExpressCard
1x Ethernet 100/1000
AC’97/HDA
Flatpanel (2x24Bit LVDS)
VGA
2x ExpressCard
1x Ethernet 100/1000
HDA
VGA
TVout
I²C
Low Pin Count Bus (LPC)
System Management Bus
(SMB)
8x GPIO
2x SDVO
(shared with PEG)
-
I²C
Low Pin Count Bus (LPC)
System Management Bus
(SMB)
8x GPIO
1x SDVO/HDMI/DP
2x HDMI/DP
IDE
PCI 32 Bit
VCC
(+12V primary,
+5V standby, 3,3V RTC)
VCC
(+12V primary,
+5V standby, 3,3V RTC)
COM Express® Type 6 Basic Modules
22|23
conga-TS87
• 4th Gen. Intel® Core™ Processor
• Up to quad core 3.7 GHz
• Patented cooling solutions for
N EW
conga-TS87
max. use of Intel® Turbo Boost 2
conga-TFS
conga-TS87
Formfactor
conga-TS77
conga-TM67
conga-TS67
Intel® Core™ i7-2710QE, 4 x 2.1 GHz
Intel® Core™ i5-2510E, 2 x 2.5 GHz
Intel® Core™ i3-2330E, 2 x 2.2 GHz
Intel® Celeron® B810, 2 x 1.6 GHz
Intel® Celeron® 807UE, 1.0 GHz
Intel® Celeron® 827E,1.4 GHz
Intel® Celeron® 847E, 2x 1.1 GHz
Intel® Celeron® B810E, 2x 1.6 GHz
Intel® Core™ i3-2340UE, 2x 1.3 GHz
Intel® Core™ i7-2610UE, 2x 1.5 GHz
Intel® Core™ i7-2655LE, 2x 2.2 GHz
COM Express® Basic, (95 x 125 mm2), Type 6 Connector Layout
CPU
AMD Embedded R-464L, 4x 2.3 GHz
AMD Embedded R-460H, 4x 1.9 GHz
AMD Embedded R-272F, 2x 2.7 GHz
Intel® Core™ i7-4700EQ, 4x 2.4 / 3.7 GHz
Intel® Core™ i5-4400E 2x 2.7 / 3.3 GHzT
Intel® Core™ i5-4402E 2x 1.6 / 2.7 GHz
Intel® Core™ i3-4100E 2x 2.4 GHz
Intel® Core™ i3-4102E 2x 1.6 GHz
Intel® Core™ i7-4850EQ 4x 1.6 / 3.20 GHz
(Product with limited long term availability)
DRAM
max. 16 GByte DDR3 1600 MHz
Intel® Celeron® 847E, 2x 1.1 GHz
Intel® Celeron® 827E, 1x 1.4 GHz
Intel® Celeron® 927UE, 1x 1.5 GHz
Intel® Celeron® 1020E, 2x 2.2 GHz
Intel® Celeron® 1047UE, 2x 1.4 GHz
Intel® Core™ i7-3615QE, 4x 2.3 GHz
Intel® Core™ i7-3612QE, 4x 2.1 GHz
Intel® Core™ i7-3555LE, 2x 2.5 GHz
Intel® Core™ i7-3517UE, 2x 1.7 GHz
Intel® Core™ i5-3610ME, 2x 2.7 GHz
Intel® Core™ i3-3120ME, 2x 2.4 GHz
Intel® Core™ i3-3217UE, 2x 1.6 GHz
max. 16 GByte DDR3L 1600 MHz
max. 16 GByte DDR3 1600 MHz
Chipset
AMD A70M
Intel® QM87
Intel® QM77
Intel® QM67 / Intel® HM65 (Intel® Celeron® version)
Ethernet
Realtek RTL8111GN GbE LAN Controller
Intel® I217-LM GbE LAN Controller with
AMT 9.0 support
Intel® 82579 GbE LAN Controller with
AMT 8.0 support
Intel® 82579 GbE LAN Controller with AMT 7.0 support
I/O Interface
Serial ATA
4x
4x
4x
4x
4x
PCI EXPRESS®
7x
7x
7x
7x
7x
PEG
1x
1x 3.0
1x
1x
1x
USB 3.0
4x
4x
4x
-
-
USB 2.0
8x
8x
8x
8x
8x
Express Card®
2x
2x
2x
2x
2x
Sound
Graphics
Digital High Definition Audio Interface
AMD Radeon™ HD 7000G Graphics
supporting DirectX® 11, OpenGL 4.2 and
OpenCL™ 1.1
Intel® HD Graphics 4600
up to Intel® Iris™ Pro graphics 5200
-
-
OpenCLTM 1.1, OpenGL 3.1
and DirectX® 11 support
Video Interface
LVDS 2x 24 bit, analog VGA
1x DisplayPort / HDMI / SDVO
3x DisplayPort/HDMI
congatec Board Controller
2x DisplayPort/HDMI
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup, Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
Embedded BIOS Feature
Security
Intel® Flexible Display Interface (FDI), OpenGL 3.0 and DirectX® 10.1 support
AMI Aptio® UEFI 2.x firmware
All congatec COM Express® Basic boards can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048
bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Power Management
ACPI 3.0 with battery support
Operating Systems*
Power Consumption typ.
Temperature
Humidity
* Additional Operating Systems on request
ACPI 4.0 with battery support
Microsoft® Windows 8, Microsoft® Windows 7, Linux, Microsoft® Windows® embedded Standard
Microsoft® Windows XP
-
Microsoft® Windows XP
Processor TDP: 35 W
Processor TDP: 25 .. 47 W
Processor TDP: 17 .. 45 W
Operating: 0 .. +60°C
Operating: 10 - 90 % r. H. non cond.
Processor TDP: 35 .. 45 W
Storage: -20 .. +80°C
Storage: 5 - 95 % r. H. non cond.
Processor TDP: 17 .. 25 W
COM Express® Type 6 Compact Module
24|25
conga-TCA3
• Based on Next Generation
Intel® Atom™ Processor
• Up to 4 Cores / 2.0 GHz
conga-TCA3
N EW
N EW
conga-TCA3
• Up to 8 GByte RAM
conga-TC87
conga-TCG
Formfactor
conga-TCA
COM Express® Compact, (95 x 95 mm2), Type 6 Connector Layout
CPU
Intel® Atom™ E3845 4x 1.91GHz
Intel® Atom™ E3827 2x 1.75GHz
Intel® Atom™ E3826 2x 1.46GHz
Intel® Atom™ E3825 2x 1.33GHz
Intel® Atom™ E3815 1.46GHz
Intel® Celeron® J1900 4x 2 GHz
DRAM
max. 8 GByte DDR3L 1333MHz
Intel® Core™ i7-4650U 2x 1.7 / 3.3 GHz
Intel® Core™ i5-4300U 2x 1.9 / 2.9 GHz
Intel® Core™ i3-4010U 2x 1.7 GHz
Intel® Celeron® 2980U 2x 1.6 GHz
Embedded G-Series Processors
AMD GX-420CA SoC, 4x 2.0 GHz
AMD GX-415GA SoC, 4x 1.5 GHz
AMD GX-217GA SoC, 2x 1.65 GHz
AMD GX-210HA SoC, 2x 1.0 GHz
Intel® Atom™ D2550 2x 1.86 GHz
Intel® Atom™ N2800 2x 1.86 GHz
Intel® Atom™ N2600 2x 1.6 GHz
max. 16 GByte DDR3L 1600 MHz
max. 8 GByte DDR3L ECC 1600 MHz
max. 4 GByte DDR3 1066 MHz
Chipset
Integrated in SoC
Intel® QM87
Integrated in SoC
Intel® NM 10
Ethernet
Intel® I210 Gigabit Ethernet
Intel® I217-LM GbE LAN Controller with
AMT 9.5 support
GBE
GBE Realtek 8111E
4x
2x
2x
4x
4x
5x
I/O Interface
Serial ATA
-
PCI EXPRESS®
5x
PEG
-
-
-
-
USB 3.0 (optional)
1x
2x
2x
2x
USB 2.0
8x
8x
8x
8x
-
2x
2x
2x
AMD Radeon™ HD 8000E Graphics supporting
DirectX® 11.1, OpenGL 4.2 and OpenCL™ 1.2
OpenGL 3.0 and DirectX® 9 support
Express Card
®
Sound
Digital High Definition Audio Interface
Graphics
Intel® HD Graphics
Video Interface
congatec Board Controller
LVDS 2x 24 bit
LVDS 2x 24 bit
LVDS 2x 24 bit, VGA
LVDS 1x 24 bit
2x DisplayPort/HDMI
3x DisplayPort/HDMI
1x DisplayPort/HDMI
2x DisplayPort/HDMI
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup, Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
Embedded BIOS Feature
Security
up to Intel® HD graphics 5000
AMI Aptio® UEFI 2.x firmware, 8 MByte serial SPI firmware flash
AMI Aptio® UEFI 2.x firmware,
4 MByte serial SPI firmware flash
All congatec COM Express® Compact boards can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to
2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Power Management
ACPI 5.0 with battery support
Operating Systems*
Power Consumption typ.
ACPI 4.0 with battery support
Ultra low standby power
ACPI 3.0 with battery support
Microsoft® Windows8, Microsoft® Windows7, Linux
Microsoft® Windows® Embedded Standard, Windows® Embedded Compact 7
-
-
Processor TDP: tbd
Processor TDP: 11.5 .. 15W
-
Microsoft® Windows XP
Processor TDP: 9.0 .. 25W
Processor TDP: 3.5 .. 10W
see manual for full details, CMOS Battery Backup
Temperature
Power Management
* Additional Operating Systems on request
Operating: 0 .. +60°C
Operating: 10 - 90 % r. H. non cond.
Storage: -20 .. +80°C
Storage: 5 - 95 % r. H. non cond.
COM Express® Type 2 Basic – Product Overview
26|27
conga-BS77
•COM Express® Type 2 Module
•Up to 3rd Gen. Intel® Core™ i7
Processor 4x 3.3 GHz
•Congatec patented cooling for
conga-BS77
maximum use of Intel® Turbo Boost
conga-BP77
conga-BS77
Formfactor
conga-BM67/conga-BS67
conga-BM57/conga-BS57
COM Express® Basic, (95 x 125 mm2), Type II connector layout
CPU
Intel® Core™ i7-3612QE 4x 2.1/3.1 GHz
Intel® Core™ i7-3555LE 2x 2.5/3.2 GHz
Intel® Core™ i7-3517UE 2x 1.7/2.8 GHz
Intel® Core™ i5-3610ME 2x 2.7/3.3 GHz
Intel® Core™ i3-3120ME 2x 2.4 GHz
Intel® Core™ i7-3615QE 4x 2.3/3.3 GHz
Intel® Core™ i7-3612QE 4x 2.1/3.1 GHz
Intel® Core™ i7-3555LE 2x 2.5/3.2 GHz
Intel® Core™ i7-3517UE 2x 1.7/2.8 GHz
Intel® Core™ i5-3610ME 2x 2.7/3.3 GHz
Intel® Core™ i3-3120ME 2x 2.4 GHz
Intel® Core™ i3-3217UE 2x 1.6 GHz
Intel® Celeron® 927UE, 1x 1.5 GHz
Intel® Celeron® 1020E, 2x 2.2 GHz
Intel® Celeron® 1047UE, 2x 1.4 GHz
conga-BM67:
Intel® Core™ i7-2710QE, 4x 2.1/3.0 GHz
Intel® Core™ i5 -2510E, 2x 2.5/3.1 GHz
Intel® Core™ i3-2330E, 2x 2.2 GHz
Intel® Celeron® B810, 2x 1.6 GHz
conga-BS67:
Intel® Core™ i7-2655LE, 2.2/2.9 GHz
Intel® Core™ i7-2610UE, 1.5/2.4 GHz
Intel® Core™ i3-2340UE, 1.3 GHz
Intel® Celeron® 847E, 1.1 GHz
Intel® Celeron® 827E, 1.4 GHz
conga-BM57:
Intel® Core™ i7-620M, 2x 2.66/3.33 GHz
Intel® Core™ i5-520M, 2x 2.4/2.93 GHz
Intel® Celeron® P4500, 2x 1.86 GHz
conga-BS57:
Intel® Core™ i7-620LE, 2x 2.0/2.8 GHz
Intel® Core™ i7-620UE, 2x 1.06/2.13 GHz
Intel® Core™ i3-330E, 2x 2.13 GHz
Intel® Celeron® U3405, 2x 1.07 GHz
DRAM
max. 16 GByte DDR3 1600 MHz
max. 16 GByte DDR3 1333 MHz
max. 8 GByte DDR3 1333 MHz
Chipset
Intel® QM77
Intel® QM67 / Intel® HM65
(Intel® Celeron® version)
Intel® HM55
Ethernet
Intel® 82579 GbE
Intel® 82579 GbE LAN Controller
with AMT 7.0 support
Intel® 82577LM Ethernet PHY
I/O Interface
Serial ATA
4x
4x
4x
3x
PCI EXPRESS®
6x
6x
6x
5x
PEG
1x
-
-
-
USB 2.0
8x
8x
8x
8x
-
-
2x
2x
1x
1x
1x
1x
Express Card®
EIDE
Sound
Digital High Definition Audio Interface
Graphics
Intel® HD Graphics 4000
Intel® HD Graphics / Intel® HD Graphics 3000
Video Interface
LVDS 2x24 bit, analog VGA
congatec Board Controller
-
1x Display Port / HDMI / SDVO
-
2x Display Port/HDMI
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup, Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
Embedded BIOS Feature
Security
Mobile Intel® 5 Series HD Graphics
AMI Aptio® UEFI 2.x firmware, 8 MByte serial SPI firmware flash
AMI Aptio® UEFI 2.x firmware,
4 MByte serial SPI firmware flash
All congatec COM Express® Basic boards can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048
bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Power Management
ACPI 3.0 with battery support
Operating Systems*
Microsoft® Windows8, Microsoft® Windows7, Microsoft® Windows® embedded Standard, Microsoft® Windows XP, Linux
Power Consumption typ.
Processor TDP: 17 .. 25 W
Processor TDP: 17 .. 45 W
see user‘s guide for full details, CMOS Battery Backup
Temperature
Humidity
* Additional Operating Systems on request
Operating: 0 .. +60°C
Operating: 10 - 90 % r. H. non cond.
Storage: -20 .. +80°C
Storage: 5 - 95 % r. H. non cond.
Processor TDP: 17...35 W
COM Express® Type 2 Basic – Product Overview
28|29
conga-BAF
•COM Express® Type 2 Module
•AMD Embedded G Series Processors
•Integrated high performance graphics
conga-BAF
with OpenCL™ support
conga-BAF
conga-BM45
Formfactor
conga-B945
conga-BA945
COM Express® Basic, (95 x 125 mm2), Type II connector layout
CPU
Embedded G-Series Processors
AMD G-T56N, 2x 1.6 GHz
AMD G-T40N, 2x 1.0 GHz
AMD G-T44R, 1.2 GHz
AMD G-T40R, 1.0 GHz
AMD G-T40E, 2x 1.0 GHz
Intel® Core™ 2 Duo T9400, 2x 2.53 GHz
Intel® Core™ 2 Duo P8400, 2x 2.26 GHz
Intel® Celeron® 575, 2.0 GHz
Intel® Celeron® T3100, 2x 1.9 GHz
Intel® Core™ 2 Duo T7400, 2x 2.16 GHz
Intel® Core™ 2 Duo L7400 LV, 2x 1.5 GHz
Intel® Core™ 2 Duo U7500 ULV, 2x. 1.06 GHz
Intel® Core™ Duo L2400 LV, 2x 1.66 GHz
Intel® Celeron® M440, 1.86 GHz
Intel® Celeron® M423, 1.06 GHz
Intel® Atom™ N270, 1.6 GHz
DRAM
max. 8 GByte DDR3 1066 MHz
max. 8 GByte DDR3 1067 MHz
max. 4 GByte DDR2 667 MHz
Chipset
AMD A55E Controller Hub
Intel® GM45 / ICH9M-E, Intel® GL40 / ICH9M-E
Intel® 945GME / ICH7M-DH
Ethernet
Realtek RTL8111E
Intel® 82567LM Phy
Realtek RTL8111
I/O Interface
Serial ATA
4x
PCI EXPRESS®
6x
5x
5x
5x
-
1x
1x
1x
PEG
conga-BM57
conga-BS57
3x
conga-BAF
2x
2x
USB 2.0
8x
8x
8x
8x
Express Card®
2x
2x
2x
2x
EIDE
1x
1x
1x
1x
Integrated High Performance Video
Mobile Intel® Graphics Media Accelerator
4500MHD
Sound
Digital High Definition Audio Interface
Graphics
Video Interface
Intel® Graphics Media Accelerator 950
LVDS 2x 24 bit, analog VGA
1x Display Port / HDMI / SDVO
2x Display Port/HDMI
congatec Board Controller
-
-
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup, Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
Embedded BIOS Feature
Security
2x SDVO (shared with PEG port)
1x Display Port / SDVO
AMI Aptio® UEFI BIOS
OEM Logo, OEM CMOS Defaults, LCD Control, Display Auto Detection, Backlight Control, Flash Update, Based on AMIBIOS8®
All congatec COM Express® Basic boards can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048
bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Power Management
ACPI 3.0 with battery support
ACPI 2.0 with battery support
Operating Systems*
Microsoft® Windows 8
Microsoft® Windows 7
Microsoft® Windows XP, Microsoft® Windows® embedded Standard , Linux
Power Consumption typ.
Microsoft® Windows® CE 6.0, Windows®
Embedded Compact 7
-
Processor TDP: 5.5 .. 18 W
Processor TDP: 25 .. 35 W
Microsoft® Windows® CE 6.0, Windows® Embedded Compact 7
Processor TDP: 5.5 .. 34 W
see user‘s guide for full details, CMOS Battery Backup
Temperature
Humidity
* Additional Operating Systems on request
Operating: 0 .. +60°C
Operating: 10 - 90 % r. H. non cond.
Storage: -20 .. +80°C
Storage: 5 - 95 % r. H. non cond.
<10 W
COM Express® Type 2 Compact – Product Overview
30|31
conga-CCA
• COM Express® Type 2 Module
• Low power dual core Intel® Atom®Processor
• 3.5 Watt processor TDP
conga-CCA
for 2x 1.6 GHz performance
conga-CCA
conga-CA945
Formfactor
conga-CA6
conga-CA
conga-CAx
Intel® Atom™ Z530, 1.6 GHz
Intel® Atom™ Z510, 1.1 GHz
Intel® Atom™ Z510PT, 1.1 GHz
Intel® Atom™ Z520PT, 1.33 GHz
COM Express® Compact, (95 x 95 mm2), Type II connector layout
CPU
Intel® Atom™ D2550 2x 1.86 GHz
Intel® Atom™ N2800 2x 1.86 GHz
Intel® Atom™ N2600 2x 1.6 GHz
Intel® Atom™ N270, 1.6 GHz
Intel® Atom™ E680T / E680, 1.6 GHz
Intel® Atom™ E660T / E660, 1.3 GHz
Intel® Atom™ E640T / E640, 1.0 GHz
Intel® Atom™ E620T / E620, 600 MHz
DRAM
max. 4 GByte DDR3 1066 MHz
max. 2 GByte DDR2 533 MHz
max. 2 GByte DDR2 667/800 MHz
Chipset
Intel® NM 10
Intel® 945GSE / ICH7-M
Intel® Platform Controller Hub EG20T
Intel® System Controller Hub US15W
Intel® System Controller Hub US15WPT
Ethernet
GBE Realtek 8111E
Realtek RTL8111
Micrel Gbit Ethernet Phy KSZ9021RN
Realtek RTL8111
Intel® 82574L
I/O Interface Serial ATA
2x
2x
2x
2x
-
PCI EXPRESS®
4x
3x
2x
2x
2x
-
-
-
-
-
PEG
max. 1 GByte DDR2 533 MHz
USB 2.0
8x
8x
6x
8x
8x
Express Card®
2x
2x
-
-
-
EIDE
1x
1x
1x (optional)
1x
1x
OpenGL 3.0 and DirectX® 9 support
Intel® GMA 950
LVDS 2x 24 bit
LVDS 2x 18 bit, VGA
Sound
Graphics
Digital High Definition Audio Interface
Video Interface
Intel® Graphics Core
LVDS 1x 24 bit
1x Display Port HDMI SDVO
congatec Board Controller
1x SDVO
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
Embedded BIOS Feature
Security
Intel® GMA 500
AMI Aptio® UEFI 2.x firmware,
4 MByte serial SPI firmware flash
-
All congatec COM Express® Compact boards can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to
2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Power Management
ACPI 3.0 with battery support
Operating Systems*
ACPI 2.0 with battery support
ACPI 3.0 with battery support
Microsoft® Windows 7, Microsoft® Windows XP, Microsoft® Windows® Embedded Compact 7, Microsoft® Windows® embedded Standard, Linux
Microsoft® Windows 8
Power Consumption typ.
Processor TDP: 3.5 .. 10 W
Microsoft® Windows CE 6.0
<10 W
tbd
<5 W
<5 W
Operating: 0 .. +60°C
Storage: -20 .. +80°C
Operating: -40 to +85°C;
Storage: -40 to +85°C
see user‘s guide for full details, CMOS Battery Backup
Temperature
Humidity
* Additional Operating Systems on request
Operating: 0 .. +60°C
Storage: -20 .. +80°C
per.: 0 .. +60°C (opt. -40 to +85°C)
Storage: -20 .. +80°C (opt. -40 to +85°C)
Operating: 10 - 90 % r. H. non cond.
Storage: 5 - 95 % r. H. non cond.
COM Express® – Engineering Tools
32|33
conga-MCB|COM Express® –
Mini Carrier Board
conga-CEVAL
conga-TEVAL
Full featured carrier board for COM Express® Compact Type 2.
Evaluation carrier board for COM Express® Type 2 modules
Evaluation carrier board for COM Express® Type 6 modules.
1x miniPCI Express Socket
To achieve a quick start with COM Express® congatec offers
an evaluation carrier board, which routes all the COM Express®
signals to standard interface connectors. Supports COM Express®
Compact and Basic modules using connector Pinout Type 2.
To achieve a quick start with COM Express® congatec offers
an evaluation carrier board, which routes all the COM Express®
signals to standard interface connectors. Supports COM Express®
Compact and Basic modules using connector Pinout Type 6.
On board PC speaker, Line Out, Mic In at front panel
4x1 PCI Express®, 1x Express Card, 1x 16 PCI Express® Graphics
(PEG), 1x Mini PCI Express® Card, 4x 32 bit PCI
6x1 PCI Express®, 1x Express Card, 1x 16 PCI Express® Graphics
(PEG), 1x Mini PCI Express® Card
1x Display Port from DDI port C and 1x HDMI from SDVO port B
Gigabit Ethernet
Gigabit Ethernet
LVDS interface (EPI - Embedded Panel Interface) 40 pin 1 mm 2
rows box header
6x USB
6x USB
HDA compatible codec
XXXX
Backlight connector, 4 pin 2.00 mm box header
AC97 optional via connector
XXXX
On board lithium battery for CMOS backup and real time clock
4x SATA, 1x PATA
XXXX
All signals for ACPI battery support (conga-SBMC3) at the feature
connector
2x COM, 1x LPT, 1x GPIO/SDIO, LPC Postcode display
System speaker, Power button, Reset button, CMOS Battery
5pin Micro-Fit Power Connector, 3pin Fan header, 12V, tacho signal
2x COM, 1x LPT, 1x Floppy, PS2 kbd./mouse
PCI/LPC Postcode display
System speaker, Power button, Reset button, CMOS Battery
Size 145 x 95 mm
CRT connector, LVDS interface
1x RJ45 connector with integrated Gigabit Ethernet Transformer
1x CFAST Socket, 2x SATA, 1x 4 bit SD Card Socket
2x USB at the front panel, 4x USB pin header
CRT connector, LVDS interface
conga-CKIT
conga-Cdebug
This complete kit provides the ability to start evaluating COM Express® modules immediately.
COM Express® Debug Platform. The conga-Cdebug provides a debug platform for your application
specific carrier board. Simply use it as a transparent debug interface between your carrier board and
the COM Express® module.
conga-CEVAL evaluation carrier board
Postcode display for LPC or PCI
conga-Cdebug Post-Code and debug card with cables
LPC Firmware Hub Flash (FWH)
conga-FPA2 flat panel adapter with cables
2x SATA connector
HDA (High Definition Audio) adapter card
Power connector for carrier board independent operation
Dual DVI-D ADD2 card
VGA
ATX power supply with cables
2x USB
USB Memory Stick
Power and reset switch
Cable set for IDE, SATA
LED`s: 4x GPIO status , 4x Command Byte Enable (CBE=PCI bus activity)
Size 95 x 95 mm
COM Express® – Engineering Tools
34|35
conga-FPA2
SMART Battery Manager Module
Universal flat panel adapter board that has been designed to be EPI (Embedded Panel Interface)
compliant. It can be used for either prototyping, demonstration purposes, or for debugging certain
issues. It may also serve as a reference for the implementation of panel adaptations on customer
specific carrier boards.
conga-SBM³ is a complete battery manager sub system. It is designed for the use with low power
congatec COM Express® compact modules and congatec Qseven® modules.
Multiple I/O Combinations
Supports battery two smart batteries with configurations 2S up to 4S
LVDS to TTL
Dual charge and discharge for high efficiency
18 and 24 Bit single-pixel support
S3 (Suspend to RAM) / S5 (Soft-Off) support
Configuration Memory
EPI compliant EEPROM for custom panel settings
Zero current from batteries in off mode
Power Management
All typ. supply voltages selectable
Input voltage of 8 - 30V DC, with input power delimitation
Fully s/w controlled power sequencing
Backlight Connector: Supports most backlight converters
Software controlled brightness adjustment
LEDs provide a direct view of charging and battery capacity status
Output 12V / ~35W, 5V / ~20W
Battery charging max. 4A or 2x 2A in dual charge mode
Temperature: Operating: 0 .. +70°C, Storage: -25 .. +80°C
conga-HDMI / DisplayPort adapter
conga-LDVI
Add2 Card for DisplayPort
The conga-ADD2DP provides two DisplayPort and two HDMI interfaces
DVI Converter Module for LVDS. Compact module to convert LVDS to DVI-D. It can be used with either
Express®, Qseven®, XTX™ or ETX® modules. It`s now possible to realize a dual port DVI-D system
independent of the typical Video Output Ports (SDVO or DVO).
Single DVI-D ADD2 Card
Dual DVI-D ADD2 Card
ADD2 display adapter card with single DVI-D digital output. Suitable for all Intel® based platforms that
support Serial Digital Display Outputs (SDVO) on the standard x16 PCI Express® Graphics (PEG) port.
ADD2 display adapter card with dual independent DVI-D output. Suitable for all Intel® based platforms
that support Serial Digital Display Outputs (SDVO) on the standard x16 PCI Express® Graphics (PEG)
port.
XTX™ – the Concept
36|37
Pinout X2 - XTX™ versus ETX®
4x PCI Express®
4x Serial ATA
2x USB 2.0
(2x ExpressCard)
High Definition Audio
LPC Bus
Ext. System Management
Fan Control
EIDE 1+2
Ethernet
SM Bus
I²C Bus 400 kHz
Speaker
Power Control
Power Management
ISA - Bus
VGA
TV-Out
LCD (LVDS or TTL)
COM1+2
IrDA
LPT/Floppy (shared)
PCI Bus
4x USB 2.0
Mic In (Mono)
Line In (Stereo)
Line Out (Stereo)
XTX™ is an expansion and continuation of the well established and highly successful ETX® standard. XTX™ offers the
latest I/O technologies on this proven form factor. Modern embedded applications rarely use the ISA bus and XTX™
implements the PCI Express® bus on the X2 connector, thus guaranteeing longevity for XTX™.
XTX™ – Advantages
PCI Express®
In addition to the 32 bit parallel PCI bus, XTX™
offers 4 PCI Express® lanes. This allows the
customer to equip their embedded PC application
with next generation of PC performance. PCI
Express® is a low pin count interface with
maximum bandwidth per pin.
Serial ATA Interfaces (SATA)
SATA is an enhancement of the parallel ATA
therefore offering higher performance. As a
result of this enhancement the traditional
restrictions of parallel ATA are overcome with
respect to speed and EMI.
High Speed USB
XTX™ offers two additional USB 2.0 ports thereby
increasing the total amount of USB ports available
to 6.
Backwards Compatible to ETX®
XTX™ is 100 % backwards compatible to the
ETX® standard. Most customer specific carrier
boards will not require a redesign in order to use
congatec’s XTX™ modules. The ISA bus can be
implemented through the use of a PCI-ISA bridge
on the customer specific carrier board. As an
alternative to this the customer can use the readily
available XTX™ LPC bus.
LPC Bus
As a replacement to the no longer supported ISA
bus, XTX™ offers the LPC (Low Pin Count) bus. The
LPC bus corresponds approximately to a serialized
ISA bus yet with a significantly reduced number of
signals.
Identical Mechanics to ETX®
The size (95x114 mm), the mounting, the height,
the connectors and the heatspreader are exactly
the same as defined in the ETX® specification.
Existing ETX® solutions can easily switch to the
innovative XTX™ platform without any mechanical
change.
Upgrade to XTX™
Applications which do not utilize the ISA bus can
directly upgrade to XTX™ modules. The signals
at connectors X1, X3 and X4 are equal to ETX®.
Only the signals at the X2 connector have been
redefined in order to support PCI Express®, SATA,
LPC and more. Existing ETX® carrier boards can
easily be upgraded to take advantage of these new
and fast interfaces.
The ETX® standard
ETX® was one of the very first Computer-On-Module concepts ever. It was defined in 1998 by JUMPtec as an open
standard. ETX® is a well established and highly successful standard. It offers most standard PC I/O’s on a compact
form factor. ETX® is the best module standard when legacy interfaces i.e. ISA are required.
XTX™ – Product Overview
38|39
XTX™ Modules
•Enhanced lifetime for ETX®
•Featuring PCI Express® and SATA
•High scalability
conga-XAF
•ETX® compatible, no ISA Bus
conga-XAF
conga-X945
Formfactor
conga-XA945
conga-X915
conga-XLX
ETX® Spec 2.7. without ISA Support, XTX™ Extensions, 95 x 114 mm2
CPU
Embedded G-Series Processors
AMD G-T56N, 2x 1.6 GHz
AMD G-T52R, 1x 1.5 GHz
AMD G-T40R, 1x 1.0 GHz
AMD G-T40E, 2x 1.0 GHz
Intel® Core™ 2 Duo L7400 LV, 2x 1.5 GHz
Intel® Core™ 2 Duo U7500 ULV, 2x 1.06 GHz
Intel® Core™ Duo L2400 LV, 2x 1.66 GHz
Intel® Celeron® M440, 1.86 GHz
Intel® Celeron® M423, 1.06 GHz®
Intel® Atom™ N270, 1.6 GHz
Intel® Pentium® M 745, 1,8 GHz
Intel® Pentium® M 738, 1.4 GHz
Intel® Celeron® M 373, 1.0 GHz
Intel® Celeron® M, 600 MHz
AMD Geode™ LX 800, 500 MHz
DRAM
max. 4 GByte DDR3 1066 MHz
max. 2 GByte DDR2 667 MHz
max. 2 GByte DDR2 400 MHz
max. 1 GByte DDR333
Chipset
AMD A55E Controller Hub
Intel® 945GME / ICH7-M
Intel® 915GME / ICH6-M
AMD Geode™ CS5536
Ethernet
Realtek RTL8105E
IEEE 802.3u 100Base-Tx, Fast Ethernet compatible
I/O Interface
Serial ATA
4x
2x
2x
2x
2x
PCI EXPRESS®
4x
4x
4x
4x
-
USB 2.0
6x
6x
6x
6x
4x
Express Card®
2x
2x
2x
2x
-
EIDE
2x
1x
1x
1x
2x
Sound
Graphics
Digital High Definition Audio Interface with support for multiple audio codecs
Integrated High Performance Video
Intel® Graphics Media Accelerator 950
Video Interface
AC‘97 digital audio interface
Intel® Graphics Media Accelerator 900
VGA
LVDS 2x 24 bit
LVDS 1x 18 bit
1x DisplayPort/HDMI
congatec Board Controller
Embedded BIOS Feature
2x SDVO
-
Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup, Data Backup, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control
AMI-Aptio UEFI BIOS
-
Security
Integrated in chipset
OEM Logo, OEM CMOS Defaults, LCD Control, (Auto Detection, Backlight Control), Flash Update
Serial Port Console Redirection, for Remote Setup and Installation, Based on AMIBIOS8®
This congatec XTX™ modules can be optionally equipped with a discrete „Trusted Platform Module“ (TPM). It is capable of calculating efficient hash
and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications
such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Power Management
ACPI 3.0 with Battery support
Operating Systems*
Microsoft® Windows 8
Based on Insyde XpressROM
-
ACPI 2.0 with Battery support
-
-
Microsoft® Windows 7
-
-
-
-
Microsoft® Windows XP, Microsoft® Windows CE 6.0, Microsoft® Windows® embedded Standard, Linux
Windows Embedded Compact 7
Power Consumption typ.
Processor TDP: 9 .. 18 W
Processor TDP: 5.5 .. 27 W
-
Typ. application: <10 W
Processor TDP: 5.5 .. 21 W
see user‘s guide for full details, CMOS Battery Backup
Temperature
Humidity
* Additional Operating Systems on request
Operating: 0 .. +60°C
Operating: 10 - 90 % r. H. non cond.
Storage: -20 .. +80°C
Storage: 5 - 95 % r. H. non cond.
< 5W
ETX® – Product Overview
40|41
conga-EAF
•Full featured ETX® 3.02 module
•Native ISA support for max. compatibility
•AMD Embedded G Series Processor
up to dual core 1.6 GHz
•High performance integrated graphics
conga-EAF
with OpenCL™ support
conga-EAF
conga-ELX
conga-ELXeco
Formfactor
ETX® Spec 3.02, 95 x 114 mm
ETX® Spec 2.7, 95 x 114 mm
CPU
Embedded G-Series Processors
AMD G-T56N, 2x1.6 GHz
AMD G-T40N, 2x1.0 GHz
AMD G-T40R, 1x1.0 GHz
AMD G-T40E, 2x1.0 GHz
AMD G-T16R, 1x 615 MHz
AMD Geode™ LX 800, 500 MHz
DRAM
up to one 4 Gbyte DDR3 1066 MHz
Chipset
AMD A55E Controller Hub
AMD Geode™ CS5536
Ethernet
Realtek RTL8105E
IEEE 802.3u 100Base-Tx, Fast Ethernet compatible
2x
-
I/O Interface
Serial ATA
EIDE
USB 2.0
up to 1 Gbyte DDR333
On board 256 MB
2x (UDMA-66/100)
1x (UDMA-66/100)
1x (UDMA-33)
4x
4x
4x
Compact Flash®
-
1x
1x
PCI Bus



Sound
Graphics
Video Interface
High Definition Audio Interface
AC‘97 Rev.2.2 compatible, Line In, Line Out, Mic In
Integrated High Performance Video
Integrated in chipset up to 254 MByte graphic memory (UMA)
LVDS 2x24 bit, VGA
LVDS 1x18 bit, VGA
DisplayPort/HDMI
-
congatec Board Controller
Embedded BIOS Feature
Multi Stage Watchdog, Non-volatile User Data Storage, Manufacturing and Board information,
Board Statistics, BIOS Setup, Data Backup, I²C (Fast Mode, 400 kHz, Multi Master), Power Loss Control
AMI-Aptio UEFI BIOS
OEM Logo, OEM CMOS Defaults, LCD Control (Auto Detection, Backlight Control),
Flash Update, Based on Insyde XpressROM
Power Management
ACPI 3.0 with battery support
APM 1.2
Operating Systems*
Microsoft® Windows8, Microsoft® Windows7,
Windows Embedded Compact 7
-
Microsoft® Windows CE 6.0, Microsoft® Windows XP, Microsoft® Windows® embedded Standard, Linux
Power Consumption typ.
Processor TDP: 9 .. 18 W
<5 W
see user‘s guide for full details, CMOS Battery Backup
Temperature
Humidity
* Additional Operating Systems on request
Operating: 0 .. +60°C, Storage: -20 .. +80°C
Operating: 10 - 90 % r. H. non cond., Storage: 5 - 95 % r. H. non cond.
<5 W
Online
42|43
Find more in depth information at: www.congatec.com
Or visit our video channel at www.congatec.com/youtube
Product search and overview
Product videos
All data sheets
Technical videos
All users manuals
Webinars
Design guides
Educational videos
Schematics for the evaluation carrier boards
Trade show videos
Drivers and board support packages for all major operating systems
Partner videos
All accessories
Design qualification videos
Application notes
... and some more
... always up to date
YOUTUBE LOGO SPECS
PRINT
main red
gradient bottom
C0 M96 Y90 K2
C13 M96 Y81 K54
PMS 1795C
on dark backgrounds
standard
standard
no gradients
no gradients
PMS 1815C
white
black
C0 M0 Y0 K0
C100 M100 Y100 K100
WHITE
on light backgrounds
BLACK
© 2013 congatec
Rev. 2013_10_30 KS
watermark AG. All rights reserved.
watermark
conga, congatec and XTX™ are registered trademarks of congatec AG.
Intel®, Pentium
and Intel® Atom™
are trademarks of Intel Corporation
stacked logo (for sharing only)
stacked logo (for sharing only)
in the U.S. and other countries. AMD is a trademark of Advanced Micro
Devices, Inc. COM Express® is a registered trademark of PICMG®. Express
Card is a registered trademark of the Personnel Computer Memory Card
international Association (PCMCIA). PCI Express® is a registered trademark
of the Peripheral Component Interconnect Special Interest Group (PCISIG).
CompactFlash is a registered trademark of the Compact Flash Association.
Winbond is a registered trademark of the Winbond Electronics corps. AVR
is a registered trademark of the Atmel corporation. ETX® is a registered
trademark of Kontron Embedded Modules GmbH. AMICORE8 is a registered
trademark of American Megatrends inc. Microsoft®, Windows®, Windows
NT®, Windows CE and Windows XP® are registered trademarks of Microsoft
corporation. VxWorks is a registered trademark of WindRiver. AMD, Fusion
and eOntaria are registered trademarks of AMD. I.MX and Freescal™e are
registered trademarks of Freescale™ Semiconductor, Inc. All product names
and logos are property of the respective manufacturers. All data is for
information purposes only. Although all the information contained within
this document is carefully checked no guarantee of correctness is implied
or expressed.
www.congatec.com
Headquarters:
Subsidiaries:
congatec AG
congatec Asia Ltd.
congatec, Inc.
congatec Australia Pty Ltd.
congatec Japan K.K.
congatec s.r.o.
Auwiesenstraße 5
94469 Deggendorf,
Germany
12F-5, No. 270, Sec 4,
Zhongxiao E. Rd.
106 Taipei City, Taiwan
6262 Ferris Square
San Diego
CA 92121 USA
Unit 6, 92 Township Drive
West Burleigh
Queensland 4219, Australia
Shiodome building 301,
Minato-ku Hamamatsucho 1-2-7
105-0013 Tokyo-to, Japan
Zahradnicka 6
Phone + 49 (991) 2700-0
Fax
+ 49 (991) 2700 -111
Phone + 886 2 2775 4645
Fax
+ 886 2 2775 3263
Phone + 1 858-457-2600
Fax
+ 1 858-457-2602
Phone + 61 755200841
Fax + 61 755201578
Phone + 81 3 6435 9250
Fax + 81 3 6435 9251
[email protected]
www.congatec.com
[email protected]
www.congatec.tw
[email protected]
www.congatec.us
[email protected]
www.congatec.com.au
[email protected]
www.congatec.jp
603 00 Brno
Czech Republic
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
congatec:
conga-TS87/i7-4850EQ
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