USBLC6-4SC6Y Automotive very low capacitance ESD protection Datasheet production data Features ■ 4 data-line protection ■ Protects VBUS ■ Very low capacitance: 3 pF ■ Very low leakage current: 10 nA ■ SOT23-6L package ■ RoHS compliant ■ AEC Q101 qualified SOT23-6L USBLC6-4SC6Y(JEDEC MO178AB) Figure 1. Functional diagram Benefits ■ Very low capacitance between lines to GND for optimized data integrity and speed ■ Low PCB space consumption, 9 mm² maximum foot print ■ Enhanced ESD protection: ISO10605 up to 25 kV guaranteed at device level ■ ESD protection of VBUS ■ High reliability offered by monolithic integration ■ Fast response time ■ Consistent D+ / D- signal balance: – Very low capacitance matching tolerance I/O to GND = 0.015 pF – Compliant with USB 2.0 requirements Complies with the following standards ■ ISO10605, C = 150 pF, R = 330 – 25 kV (air discharge) – 15 kV (contact discharge) ■ ISO10605, C = 330 pF, R = 330 – 15 kV (air discharge) – 15 kV (contact discharge) ■ ISO 7637-3 – Pulse 3a: Vs = -150 V – Pulse 3b: Vs = +100 V This is information on a product in full production. 1 1 6 I/O4 GND 2 5 VBUS I/O2 3 4 I/O3 Applications ■ USB 2.0 ports up to 480 Mb/s (high speed) ■ Compatible with USB 1.1 low and full speed ■ High-speed data lines in smart junction boxes ■ Ethernet port: 10/100 Mb/s ■ Video line protection Description The USBLC6-4SC6Y is a monolithic device dedicated to ESD protection of high speed interfaces, such as USB 2.0, Ethernet links and video lines. TM: Transil is a trademark of STMicroelectronics September 2012 I/O1 Its very low line capacitance secures a high level of signal integrity without compromising in protecting sensitive chips against the most stringent characterized ESD strikes. Doc ID 023199 Rev 2 1/10 www.st.com 10 Characteristics 1 USBLC6-4SC6Y Characteristics Table 1. Absolute maximum ratings (tamb = 25 °C) - Generic parameters Symbol VPP 1 Value ISO10605 (C = 330 pF, R = 330 ): air discharge contact discharge ISO10605 (C = 150 pF, R = 330 : air discharge contact discharge Peak pulse voltage 15 15 kV 25 15 -55 to +150 °C Tj Operating junction temperature range -40 to +150 °C TL Lead solder temperature (10 seconds duration) 260 °C For a surge greater than the maximum values, the diode will fail in short-circuit. Figure 2. Electrical characteristics (definitions) I IF Symbol VBR IRM VRM IPP Cline = = = = = Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Peak pulse current Line capacitance VF VCL VBR VRM IRM IR Slope:1/Rd 2/10 Unit Storage temperature range Tstg Note: Parameter Doc ID 023199 Rev 2 IPP V USBLC6-4SC6Y Table 2. Characteristics Electrical characteristics (Tamb = 25 °C) Value Symbol Parameter Test Conditions Unit Min. IRM Leakage current VRM = 5.25 V VBR Breakdown voltage between VBUS and GND IR = 1 mA Forward voltage IF = 10 mA VF VCL Typ. Max. 10 150 nA 6 V 0.86 V IPP = 1 A, 8/20 µs Any I/O pin to GND 12 V IPP = 5 A, 8/20 µs Any I/O pin to GND 17 V Clamping voltage Ci/o-GND Capacitance between I/O and GND VR = 1.65 V 3 pF Ci/o-GND 0.015 Capacitance between I/O Ci/o-i/o VR = 1.65 V 1.85 2.7 pF Ci/o-i/o Figure 3. 4 0.04 Capacitance versus voltage (typical values) Figure 4. Line capacitance versus frequency (typical values) C(pF) C(pF) 5.0 5.0 F=1MHz VOSC=30mVRMS Tj=25°C 4.5 4.0 VOSC=30mVRMS Tj=25°C 4.5 VCC=0V 4.0 3.5 3.5 CO=I/O-GND VCC=1.65V 3.0 3.0 2.5 2.5 Cj=I/O-I/O 2.0 2.0 1.5 1.5 1.0 1.0 0.5 0.5 Data line voltage (V) 0.0 F(MHz) 0.0 0.0 0.5 Figure 5. 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Relative variation of leakage current versus junction temperature (typical values) 1 10 Figure 6. IRM[Tj] / IRM[Tj=25°C] 0.00 100 100 1000 Frequency response S21(dB) VBUS=5V -5.00 -10.00 10 -15.00 F(Hz) Tj(°C) 1 -20.00 25 50 75 100 125 100.0k Doc ID 023199 Rev 2 1.0M 10.0M 100.0M 1.0G 3/10 Application and design guidelines USBLC6-4SC6Y Figure 7. ESD response to ISO10605, C= 150 pF, R = 330 (+15 kV air discharge) Figure 9. Analog crosstalk results Figure 8. ESD response to ISO10605, C = 150 pF, R = 330 (-15 kV air discharge) 0.00 dB - 30.00 - 60.00 - 90.00 F (Hz) - 120.00 100.0k 2 1.0M 10.0M f/Hz 100.0M 1.0G Application and design guidelines More information is available in the STMicroelectronics Application note AN2689, “Protection of automotive electronics from electrical hazards, guidelines for design and component selection”. 4/10 Doc ID 023199 Rev 2 USBLC6-4SC6Y 3 Ordering information scheme Ordering information scheme Figure 10. Ordering information scheme USB LC 6 - 4 SC6 Y Product designation Low capacitance Breakdown voltage 6 = 6.1 V Number of lines protected 4 = 4 lines Package SC6 = SOT23-6L Automotive grade Doc ID 023199 Rev 2 5/10 Package information 4 USBLC6-4SC6Y Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at:www.st.com. ECOPACK® is an ST trademark. Table 3. SOT23-6L dimensions Dimensions Ref. Millimeters Min. c A Typ. Min. Typ. Max. A 0.90 H A1 0 E A2 0.90 1.30 0.035 0.051 b 0.30 0.50 0.012 0.02 C 0.09 0.20 0.004 0.008 D 2.80 3.05 0.110 0.120 E 1.50 1.75 0.059 0.069 A1 θ L e D b e e A2 0.15 0.006 0 0.037 2.60 3.00 0.102 0.118 L 0.30 0.60 0.012 0.024 0° 10° 1.20 2.30 0.057 H 0.60 3.50 1.45 0.035 0.95 Figure 11. SOT23-6L footprint (mm) 6/10 Max. Inches 0.95 Doc ID 023199 Rev 2 1.10 0° 10° USBLC6-4SC6Y Recommendation on PCB assembly 5 Recommendation on PCB assembly 5.1 Solder paste 5.2 5.3 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Doc ID 023199 Rev 2 7/10 Recommendation on PCB assembly 5.4 USBLC6-4SC6Y Reflow profile Figure 12. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 8/10 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Doc ID 023199 Rev 2 USBLC6-4SC6Y 6 Ordering information Ordering information Table 4. 7 Ordering information Order code Marking Package Weight Base qty Delivery mode USBLC6-4SC6Y UL4Y SOT23-6L 16.7 mg 3000 Tape and reel Revision history Table 5. Document revision history Date Revision Changes 14-May-2012 1 First issue. 06-Sep-2012 2 Updated dimensions A1 max, b min., and L min. in Table 3. 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UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 Doc ID 023199 Rev 2 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: STMicroelectronics: USBLC6-4SC6Y
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