1N5908 SM5908 Transil™ Features

1N5908 SM5908 Transil™ Features
1N5908
SM5908
Transil™
Features
■
Peak pulse power:
– 1500 W (10/1000 μs)
■
Stand off voltage: 5 V
■
Unidirectional
■
Operating Tj max: 175 °C
■
High power capability at Tj max:
– 1500 W (10/1000 µs)
■
JEDEC registered package outline
A
A
K
SMC
(JEDEC DO-214AB)
K
DO-201
Complies with the following standards
■
IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Description
■
IEC 61000-4-5
■
MIL STD 883G, method 3015-7 Class 3B
– 25 kV HBM (human body model)
■
Resin meets UL 94, V0
■
MIL-STD-750, method 2026 solderability
■
EIA STD RS-481 and IEC 60286-3 packing
■
IPC 7531 footprint
This Transil series has been designed to protect
sensitive equipment against electrostatic
discharges according to IEC 61000-4-2, and
MIL STD 883, method 3015, and electrical over
stress according to IEC 61000-4-4 and 5. These
devices are more generally used against surges
below 1500 W (10/1000 μs).
The Planar technology makes it compatible with
high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time.
They are packaged in SMC (SMC footprint in
accordance with IPC 7531 standard) and
DO-201.
TM: Transil is a trademark of STMicroelectroniocs
September 2011
Doc ID 2914 Rev 3
1/9
www.st.com
9
Characteristics
1N5908, SM5908
1
Characteristics
Table 1.
Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
1500
W
PPP
Peak pulse power dissipation (1)
Tstg
Storage temperature range
-65 to +175
°C
Tj
Operating junction temperature range
-55 to +175
°C
TL
Maximum lead temperature for soldering during 10 s.
260
°C
Tj initial = Tamb
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2.
Thermal resistances
Symbol
Rth(j-l)
Parameter
Value
SMC
15
DO-201
20
Junction to ambient on printed circuit on recommended pad layout
SMC
90
Junction to ambient
DO-201
75
Unit
Junction to leads
° C/W
Rth(j-a)
Figure 1.
Electrical characteristics - definitions
I
Symbol
VRM
VBR
VCL
IRM
IPP
aT
VF
RD
Figure 2.
Parameter
Stand-off voltage
Breakdown voltage
Clamping voltage
Leakage current @ VRM
Peak pulse current
Voltage temperature coefficient
Forward voltage drop
Dynamic resistance
IF
Pulse definition for electrical characteristics
Repetitive pulse current
tr = rise time (µs)
tp = pulse duration time (µs)
tr
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VF
VCL VBR VRM
tp
Doc ID 2914 Rev 3
IRM
IR
IPP
V
1N5908, SM5908
Table 3.
Characteristics
Electrical characteristics - parameter values (Tamb = 25 °C)
IRM @VRM
Order code
1N5908
SM5908
max
VBR @IR (1)
min
VCL @IPP,
10/1000 µs
max
VCL @IPP,
10/1000 µs
VCL @IPP,
10/1000 µs
αT (2)
C
max
max
max
typ
µA
V
V
mA
V
A(3)
V
A(3)
V
A(3)
10-4/ °C
pF
300
5
6
1
7.6
30
8
60
8.5
120
5.7
9500
1. Pulse tes: tp < 50 ms
2. To calculate VBR or VCL versus junction temperature, use the following formulas:
VBR @ TJ = VBR @ 25°C x (1 + αT x (TJ – 25))
VCL @ TJ = VCL @ 25°C x (1 + αT x (TJ – 25))
3. Surge capability given for both directions
Figure 3.
Peak pulse power dissipation
versus initial junction temperature
Ppp (W)
Figure 4.
100.0
2000
Peak pulse power versus
exponential pulse duration
(Tj initial = 25 °C)
PPP(kW)
Tj initial = 25 °C
1500
10.0
1000
1.0
500
Tj(°C)
tP(ms)
0
0.1
0
25
50
75
100
125
150
175
200
1.0E-03
Doc ID 2914 Rev 3
1.0E-02
1.0E-01
1.0E+00
1.0E+01
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Characteristics
Figure 5.
1N5908, SM5908
Clamping voltage versus peak pulse current (exponential waveform, typical values)
I PP(A )
1000.0
8/20 µs
Tj initial=25 °C
10/1000 µs
100.0
10.0
1.0
VCL(V)
0.1
1
Figure 6.
10
Junction capacitance versus
reverse applied voltage
(typical values)
100
Figure 7.
C(nF)
1.0E+02
10
Peak forward voltage drop
versus peak forward current
(typical values)
IFM(A)
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
1.0E+01
Tj =125 °C
Tj =25 °C
1.0E+00
VFM(V)
VR(V)
1
1.0E-01
1
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2
3
4
5
0.0
Doc ID 2914 Rev 3
0.5
1.0
1.5
2.0
2.5
3.0
1N5908, SM5908
Figure 8.
Characteristics
Relative variation of thermal
impedance, junction to ambient,
versus pulse duration (SMC)
Figure 9.
Zth(j-a) / Rth(j-a)
1.00
1.00
Relative variation of thermal
impedance, junction to ambient,
versus pulse duration (DO-201)
Zth(j-a) / Rth(j-a)
Recommended pad layout
PCB FR4, copper thickness = 35 µm
0.10
0.10
tP(s)
tP(s)
0.01
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead (SMC)
0.01
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 11. Leakage current versus junction
temperature (typical values)
Rth(j-a) (°C/W)
IR (µA)
100
1.E+02
PCB FR4, copper thickness = 35 µm
90
80
70
60
1.E+01
50
40
30
20
Tj(°C)
10
SCU(cm²)
1.E+00
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
25
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50
75
100
125
150
175
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Package information
2
1N5908, SM5908
Package information
●
Case: JEDEC DO-214AB molded plastic over planar junction
●
Terminals: solder plated, solderable per MIL-STD-750, Method 2026
●
Polarity: for unidirectional types the band indicates cathode
●
Flammability: epoxy is rated UL94V-0
●
RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 4.
SMC dimensions
Dimensions
Ref.
E1
D
E
A1
A2
C
E2
L
b
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
2.90
3.2
0.114
0.126
c
0.15
0.41
0.006
0.016
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
D
5.55
6.25
0.218
0.246
L
0.75
1.60
0.030
0.063
Figure 12. SMC footprint dimensions mm Figure 13. SMC marking layout(1)
(inches)
1.54
(0.061)
5.11
(0.201)
1.54
(0.061)
Cathode bar
3.14
(0.124)
8.19
(0.322)
1. Marking layout can vary according to assembly location.
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Doc ID 2914 Rev 3
x x x
z y ww
: ECOPACK status
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
1N5908, SM5908
Package information
Table 5.
DO-201 Dimensions
Dimensions
B
B
A
Ref.
ØD
ØC
Table 6.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
8.5
9.5
0.335
0.374
B
25.4
ØC
4.8
5.3
0.189
0.209
ØD
0.96
1.06
0.038
0.042
1
DO-201 marking layout
Cathode bar
x x x x x
x x x x
x x
m m m y w w
e, G : Ecopack status
x: Marking
mmm : Manufacturing location
y: Year
ww: week
Doc ID 2914 Rev 3
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Ordering information
3
1N5908, SM5908
Ordering information
Table 7.
Ordering information
Order code
4
Marking
Package
Weight
Base qty
Delivery mode
SM5908
MDC
SMC
0.25 g
2500
Tape and reel
1N5908
1N5908
DO-201
0.9 g
600
Ammopack
Revision history
02-Jul
Table 8.
Document revision history
Date
Revision
Aug-1999
2A
20-Sep-2011
8/9
3
Changes
Previous release
Added cathode bands. Added standards compliance
statements. Updated Description. Updated Table 1 and Table 2.
Updated Figures 3 through 11. Updated Section 2: Package
information.
Doc ID 2914 Rev 3
1N5908, SM5908
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