ESDALC6V1W5 Quad TRANSIL™ array for data protection Main applications SOT323-5L

ESDALC6V1W5 Quad TRANSIL™ array for data protection Main applications SOT323-5L
ESDALC6V1W5
Quad TRANSIL™ array for data protection
Main applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as :
■
Computers
■
Printers
■
Communication systems
■
Cellular phones and accessories
■
Wireline and wireless telephone sets
■
Set top boxes
Features
■
4 Unidirectional Transil functions
■
Breakdown voltage:
VBR = 6.1 V minimum
■
Low leakage current: < 1 µA
■
Low capacitance: 7.5 pF at 3 V
■
Very small PCB area < 4.2 mm2 typically
SOT323-5L
Order codes
Part Number
Marking
ESDALC6V1W5
C61
ESDALC6V1W5 Functional diagram
I/01
I/04
GND
I/02
I/03
Description
The ESDALCxxxWx are monolithic suppressors
designed to protect components connected to
data and transmission lines against ESD.
Complies with the following standards
These devices clamp the voltage just above the
logic level supply for positive transients, and to a
diode drop below ground for negative transients.
IEC61000-4-2
Benefits
MIL STD 883E - Method 3015-7 Class 3
■
High ESD protection level: up to 25 kV
■
High integration
Level 4
15 kV (air discharge)
8 kV(contact discharge)
25 kV HBM (Human Body Model)
TM: TRANSIL is a trademark of STMicroelectronics
January 2006
Rev 5
1/7
www.st.com
7
ESDALC6V1W5
1 Characteristics
1
Characteristics
Table 1.
Absolute Ratings (Tamb = 25°C)
Symbol
PPP
Tj
Tstg
Parameter
Value
Unit
Peak pulse power (8/20 µs)
25
W
Junction temperature
150
°C
-55 to +150
°C
260
°C
-40 to +150
°C
Storage temperature range
TL
Maximum lead temperature for soldering during 10s
Top
Operating temperature range(1)
1. The values of the operating parameters versus temperature are given through curves and αT parameter.
1.1
Electrical Characteristics (Tamb = 25°C)
Symbol
Parameter
VRM
Stand-off voltage
VBR
Breakdown voltage
VCL
Clamping voltage
IRM
Leakage current
IPP
Peak pulse current
IR
Reverse leakage current
IF
Forward current
αT
Voltage temperature coefficient
VF
Forward voltage drop
C
Capacitance
Rd
Dynamic resistance
I
IF
VF
VCL VBR
ESDALC6V1W5
Slope: 1/Rd
IRM @ VRM
Rd
αT
typ.(1)
max.(2)
C
typ.
max.
V
V
mA
µA
V
Ω
10-4/°C
pF
6.1
7.2
1
1
3
1.1
6
7.5
2. VBR = aT* (Tamb - 25 °C) * VBR (25 °C)
max.
IPP
min.
1. Square pulse lpp = 15 A, tp = 2.5 µs
2/7
V
IRM
[email protected] IR
Part Numbers
VRM
3V bias
ESDALC6V1W5
Figure 1.
1.1
1 Characteristics
Peak power dissipation versus
initial junction temperature
Figure 2.
Peak pulse power versus
exponential pulse duration
(Tj initial = 25°C)
Ppp(W)
Ppp[Tj initial] / Ppp [Tj initial = 25°C]
100
Tj initial = 25°C
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
tp(µs)
Tj(°C)
0.0
10
0
25
Figure 3.
50
75
100
125
150
175
1
10
Clamping voltage versus peak pulse Figure 4.
current (Tj initial = 25°C, rectangular
waveform, tp = 2.5 µs)
Ipp(A)
100
Capacitance versus reverse applied
voltage (typical values)
C(pF)
100.0
14
13
F=1MHz
Vosc=30mVRMS
Tj=25°C
12
11
10
9
10.0
8
7
6
5
4
3
2
1.0
tp=2.5µs
Tj initial =25°C
Vcl(V)
1
0
0.1
0
Figure 5.
10
20
30
40
50
60
VR(V)
0.0
0.5
Relative variation of leakage current Figure 6.
versus junction temperature
(typical values)
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Peak forward voltage drop versus
peak forward current (typical
values)
I FM (A)
IR [Tj] / IR [Tj=25°C]
1.E+00
100
1.E-01
10
1.E-02
VFM(V)
Tj(°C)
1
25
50
75
1.E-03
100
125
150
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
3/7
ESDALC6V1W5
2 Ordering information scheme
Figure 7.
2
ESD response to IEC61000-4-2 (air
discharge 15 kV, positive surge)
Ordering information scheme
ESDA
ESD Array
Low capacitance
Breakdown Voltage
6V1 = 6.1 Volts min
Package
W5 = SOT323-5L
4/7
LC
6V1 W5
ESDALC6V1W5
3 Package mechanical data
3
Package mechanical data
3.1
SOT323-5L package
DIMENSIONS
A
REF.
Millimeters
Inches
E
Min.
Max.
Min.
Max.
A
0.8
1.1
0.031
0.043
A1
0
0.1
0
0.004
A2
0.8
1
0.031
0.039
b
0.15
0.3
0.006
0.012
c
0.1
0.18
0.004
0.007
D
1.8
2.2
0.071
0.086
E
1.15
1.35
0.045
0.053
e
b
D
e
A1
A2
Q1
c
e
HE
Figure 8.
0.65 Typ.
0.025 Typ.
HE
1.8
2.4
0.071
0.094
Q1
0.1
0.4
0.004
0.016
Footprint dimensions
0.3
1.0
2.9
1.0
0.35
Dimensions in mm
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com.
5/7
ESDALC6V1W5
4 Ordering information
4
5
Ordering information
Part Number
Marking
Package
Weight
Base qty
Delivery mode
ESDALC6V1W5
C61
SOT323-5L
5.4 mg
3000
Tape & reel
Revision history
Date
Revision
Jun-2002
4A
10-Jan-2006
6/7
5
Changes
Previous issue
Reformatted to current template.
Figure 5: Range of Tj extended to 150 °C.
Figure 6: Peak forward voltage drop versus peak forward current (typical
values) added.
ESDALC6V1W5
5 Revision history
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
7/7
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement