SMX1J Transil™ Features A ■ Peak pulse power: – 85 W (10/1000 µs) – 800 W (8/20 µs) ■ Stand off voltage 7.5 V ■ Unidirectional ■ Low leakage current: – 1 µA at 25 °C – 2 µA at 85 °C ■ Operating Tj max: 150 °C ■ High power capability at Tj max: 78 W K µQFN-2L Figure 1. Functional diagram (top view) Complies with the following standards ■ IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) ■ MIL STD 883G - Method 3015-7 Class 3B: – 25 kV HBM (human body model) Description The SMX1J Transil has been designed to protect sensitive equipment against electro-static discharges according to IEC 61000-4-2, MIL STD 883 Method 3015, and electrical over stress such as IEC 61000-4-4 and 5. They are generally for surges below 85 W 10/1000 µs. The Planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. The SMX1J is packaged in µQFN-2L. TM: Transil is a trademark of STMicroelectronics October 2010 Doc ID 16180 Rev 3 1/11 www.st.com 11 Characteristics SMX1J 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit 85 W PPP Peak pulse power dissipation (1) Tstg Storage temperature range -65 to +150 °C Tj Operating junction temperature range -55 to +150 °C TL Maximum lead temperature for soldering during 10 s. 260 °C Tj initial = Tamb 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Figure 2. Symbol VBR IRM VRM VCL Rd IPP IR αT VF Table 2. Electrical characteristics (definitions) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Breakdown current Voltage temperature coefficient Forward voltage drop = = = = = = = = = 25 °C 85 °C µA SMX1J7.5A IF Slope = 1/ Rd I PP 1 2 VBR @IR min(1) min VCL @IPP(2) 10/1000 µs RD (3) 10/1000 µs max VCL @IPP(2) 8/20 µs RD (3) 8/20 µs max αT (4) max V V mA V A Ω V A Ω 10-4/ °C 7.5 8.3 1 14 6.2 0.3 20 40 0.2 6.5 2. Surge capability given for both directions for unidirectional and bidirectional types 3. To calculate maximum clamping voltage at other surge level, use the following formula VCLmax = VCL - RD x ( IPP - IPPappli) where IPPappli is the surge current in the application 4. To calculate VBR or VCL versus junction temperature, use the following formule: VBR @ Tj = VBR @ 25 °C x (1 + αT x (Tj – 25)) VCL @ Tj = VCL @ 25 °C x (1 + αT x (Tj – 25)) Pulse waveform %Ipp 100 Repetitive pulse current tr = rise time (µs) tp = pulse duration time (µs) 50 0 2/11 V I RM IR 1. Pulse test : tp < 50 ms Figure 3. VF VCL VBR VRM Electrical characteristics - parameter values (Tamb = 25 °C) IRM [email protected] Type I tr tp Doc ID 16180 Rev 3 SMX1J Characteristics Figure 4. Peak pulse power dissipation versus initial junction temperature PPP(W) 100.0 Figure 5. 10000 Peak pulse power versus exponential pulse duration PPP(W) Tjinitial = 25 °C 90.0 80.0 70.0 1000 60.0 50.0 40.0 100 30.0 20.0 10.0 Tj(°C) 0.0 0 Figure 6. 25 50 75 100 125 150 Clamping voltage versus peak pulse current (exponential waveform, typical values) 1 10 Figure 7. IPP(A) 10 TP(µs) 10 175 100 1000 10000 Junction capacitance versus reverse applied voltage (typical values) C(pF) 400 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C 375 350 325 300 275 250 Tjinitial = 25 °C 10/1000 µs 225 200 175 150 125 VCL(V) 1 10 9 Figure 8. 10 VLINE (V) 100 12 11 Forward voltage drop versus peak forward current (typical values) 0 1 Figure 9. 2 3 4 5 Leakage current versus junction temperature (typical values) Ir I (nA) I FM (A) 500 400 1 300 200 0.1 100 VFM (V) 0.01 0.5 1.0 1.5 2.0 0 25 Doc ID 16180 Rev 3 Tj (°C) ° 50 75 100 125 150 3/11 Ordering information scheme 2 SMX1J Ordering information scheme Figure 10. Ordering information scheme SM Surface Mount Package X = µQFN-2L Peak Pulse Power 1 = 100 W (typical value) Stand off voltage 7.5 = 7.5 V Type A = Unidirectional Delivery mode TR = Tape and reel 4/11 Doc ID 16180 Rev 3 X 1 J7.5 A - TR SMX1J 3 Package information Package information ● Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 ● Flammability: Epoxy is rated UL94V-0 ● RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. µQFN-2L dimensions Dimensions b1 Ref Millimetres Inches L1 Min Typ Max Min Typ Max A 0.51 0.55 0.60 0.020 0.022 0.024 A1 0.00 0.02 0.05 0.000 0.001 0.002 b1 0.25 0.30 0.35 0.010 0.012 0.014 Pin 1 ID e A A1 D E Figure 11. Footprint dimensions in mm (inches) D 1.45 0.057 E 1.00 0.039 e 0.95 1.00 1.05 0.037 0.039 0.041 L1 0.75 0.80 0.85 0.030 0.031 0.033 Figure 12. Marking 1.72 (0.067) 0.83 (0.033) Pin 1 L Pin 2 0.55 0.62 0.55 (0.022) (0.024) (0.022) Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose Doc ID 16180 Rev 3 5/11 Package information SMX1J Figure 13. Tape and reel specifications L L L Doc ID 16180 Rev 3 L L L L 6/11 SMX1J Recommendation on PCB assembly 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 14. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio - between 65% and 70%. Figure 15. Recommended stencil windows position T=100 µm 95 µm 95 µm 0.62 135 µm 560 µm 830 µm 0.83 0.55 360 µm 1.72 135 µm Footprint 550 µm Stencil window Footprint Doc ID 16180 Rev 3 7/11 Recommendation on PCB assembly 4.2 4.3 4.4 8/11 SMX1J Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. Solder paste without cleaning flux is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Doc ID 16180 Rev 3 SMX1J 4.5 Recommendation on PCB assembly Reflow profile Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec Note: 6 7 Time (min) 90 sec max Minimize air convection currents in the reflow oven to avoid component movement. Doc ID 16180 Rev 3 9/11 Ordering information 5 Ordering information Table 4. 6 Ordering information Order code Marking Package Weight Base qty Delivery mode SMX1J7.5A-TR L µQFN-2L 2.3 mg 12000 Tape and reel Revision history Table 5. 10/11 SMX1J Document revision history Date Revision Changes 26-Oct-2009 1 First issue. 03-Nov-2009 2 Updated : Features, Table 2, Table 4 and Figure 11. 27-Oct-2010 3 Updated base quantity Table 4. 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