SMX1J Transil™ Features

SMX1J Transil™ Features
SMX1J
Transil™
Features
A
■
Peak pulse power:
– 85 W (10/1000 µs)
– 800 W (8/20 µs)
■
Stand off voltage 7.5 V
■
Unidirectional
■
Low leakage current:
– 1 µA at 25 °C
– 2 µA at 85 °C
■
Operating Tj max: 150 °C
■
High power capability at Tj max: 78 W
K
µQFN-2L
Figure 1.
Functional diagram (top view)
Complies with the following standards
■
IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■
MIL STD 883G - Method 3015-7 Class 3B:
– 25 kV HBM (human body model)
Description
The SMX1J Transil has been designed to protect
sensitive equipment against electro-static
discharges according to IEC 61000-4-2,
MIL STD 883 Method 3015, and electrical over
stress such as IEC 61000-4-4 and 5. They are
generally for surges below 85 W 10/1000 µs.
The Planar technology makes it compatible with
high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time.
The SMX1J is packaged in µQFN-2L.
TM: Transil is a trademark of STMicroelectronics
October 2010
Doc ID 16180 Rev 3
1/11
www.st.com
11
Characteristics
SMX1J
1
Characteristics
Table 1.
Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
85
W
PPP
Peak pulse power dissipation (1)
Tstg
Storage temperature range
-65 to +150
°C
Tj
Operating junction temperature range
-55 to +150
°C
TL
Maximum lead temperature for soldering during 10 s.
260
°C
Tj initial = Tamb
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Figure 2.
Symbol
VBR
IRM
VRM
VCL
Rd
IPP
IR
αT
VF
Table 2.
Electrical characteristics (definitions)
Parameter
Breakdown voltage
Leakage current @ VRM
Stand-off voltage
Clamping voltage
Dynamic impedance
Peak pulse current
Breakdown current
Voltage temperature coefficient
Forward voltage drop
=
=
=
=
=
=
=
=
=
25 °C 85 °C
µA
SMX1J7.5A
IF
Slope = 1/ Rd
I PP
1
2
VBR @IR min(1)
min
VCL @IPP(2)
10/1000 µs
RD (3)
10/1000 µs
max
VCL @IPP(2)
8/20 µs
RD (3)
8/20 µs
max
αT (4)
max
V
V
mA
V
A
Ω
V
A
Ω
10-4/ °C
7.5
8.3
1
14
6.2
0.3
20
40
0.2
6.5
2. Surge capability given for both directions for unidirectional and bidirectional types
3. To calculate maximum clamping voltage at other surge level, use the following formula
VCLmax = VCL - RD x ( IPP - IPPappli) where IPPappli is the surge current in the application
4. To calculate VBR or VCL versus junction temperature, use the following formule:
VBR @ Tj = VBR @ 25 °C x (1 + αT x (Tj – 25))
VCL @ Tj = VCL @ 25 °C x (1 + αT x (Tj – 25))
Pulse waveform
%Ipp
100
Repetitive pulse current
tr = rise time (µs)
tp = pulse duration time (µs)
50
0
2/11
V
I RM
IR
1. Pulse test : tp < 50 ms
Figure 3.
VF
VCL VBR VRM
Electrical characteristics - parameter values (Tamb = 25 °C)
IRM [email protected]
Type
I
tr
tp
Doc ID 16180 Rev 3
SMX1J
Characteristics
Figure 4.
Peak pulse power dissipation
versus initial junction temperature
PPP(W)
100.0
Figure 5.
10000
Peak pulse power versus
exponential pulse duration
PPP(W)
Tjinitial = 25 °C
90.0
80.0
70.0
1000
60.0
50.0
40.0
100
30.0
20.0
10.0
Tj(°C)
0.0
0
Figure 6.
25
50
75
100
125
150
Clamping voltage versus peak
pulse current (exponential
waveform, typical values)
1
10
Figure 7.
IPP(A)
10
TP(µs)
10
175
100
1000
10000
Junction capacitance versus
reverse applied voltage
(typical values)
C(pF)
400
F = 1 MHz
VOSC = 30 mVRMS
Tj = 25 °C
375
350
325
300
275
250
Tjinitial = 25 °C
10/1000 µs
225
200
175
150
125
VCL(V)
1
10
9
Figure 8.
10
VLINE (V)
100
12
11
Forward voltage drop versus peak
forward current (typical values)
0
1
Figure 9.
2
3
4
5
Leakage current versus junction
temperature (typical values)
Ir
I (nA)
I FM (A)
500
400
1
300
200
0.1
100
VFM (V)
0.01
0.5
1.0
1.5
2.0
0
25
Doc ID 16180 Rev 3
Tj (°C)
°
50
75
100
125
150
3/11
Ordering information scheme
2
SMX1J
Ordering information scheme
Figure 10. Ordering information scheme
SM
Surface Mount
Package
X = µQFN-2L
Peak Pulse Power
1 = 100 W (typical value)
Stand off voltage
7.5 = 7.5 V
Type
A = Unidirectional
Delivery mode
TR = Tape and reel
4/11
Doc ID 16180 Rev 3
X
1 J7.5 A
-
TR
SMX1J
3
Package information
Package information
●
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
●
Flammability: Epoxy is rated UL94V-0
●
RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 3.
µQFN-2L dimensions
Dimensions
b1
Ref
Millimetres
Inches
L1
Min
Typ
Max
Min
Typ
Max
A
0.51
0.55
0.60 0.020 0.022 0.024
A1
0.00
0.02
0.05 0.000 0.001 0.002
b1
0.25
0.30
0.35 0.010 0.012 0.014
Pin 1 ID
e
A
A1
D
E
Figure 11. Footprint dimensions in mm
(inches)
D
1.45
0.057
E
1.00
0.039
e
0.95
1.00
1.05 0.037 0.039 0.041
L1
0.75
0.80
0.85 0.030 0.031 0.033
Figure 12. Marking
1.72
(0.067)
0.83
(0.033)
Pin 1
L
Pin 2
0.55
0.62
0.55
(0.022) (0.024) (0.022)
Note:
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin
1 mark is to be used for this purpose
Doc ID 16180 Rev 3
5/11
Package information
SMX1J
Figure 13. Tape and reel specifications
L
L
L
Doc ID 16180 Rev 3
L
L
L
L
6/11
SMX1J
Recommendation on PCB assembly
4
Recommendation on PCB assembly
4.1
Stencil opening design
1.
General recommendation on stencil opening design
a)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 14. Stencil opening dimensions
L
T
b)
W
General design rule
Stencil thickness (T) = 75 ~ 125 µm
W
Aspect Ratio = ----- ≥ 1.5
T
L×W
Aspect Area = ---------------------------- ≥ 0.66
2T ( L + W )
2.
Reference design
a)
Stencil opening thickness: 100 µm
b)
Stencil opening for leads: Opening to footprint ratio - between 65% and 70%.
Figure 15. Recommended stencil windows position
T=100 µm
95 µm
95 µm
0.62
135 µm
560 µm
830 µm
0.83
0.55
360 µm
1.72
135 µm
Footprint
550 µm
Stencil window
Footprint
Doc ID 16180 Rev 3
7/11
Recommendation on PCB assembly
4.2
4.3
4.4
8/11
SMX1J
Solder paste
1.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2.
Solder paste without cleaning flux is recommended.
3.
Offers a high tack force to resist component movement during high speed.
4.
Solder paste with fine particles: powder particle size is 20-45 µm.
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering
3.
Standard tolerance of ± 0.05 mm is recommended.
4.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
PCB design preference
1.
To control the solder paste amount, the closed via is recommended instead of open
vias.
2.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Doc ID 16180 Rev 3
SMX1J
4.5
Recommendation on PCB assembly
Reflow profile
Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
125 °C
2°C/s recommended
2°C/s recommended
6°C/s max
6°C/s max
3°C/s max
3°C/s max
0
0
1
2
3
4
5
10-30 sec
90 to 150 sec
Note:
6
7
Time (min)
90 sec max
Minimize air convection currents in the reflow oven to avoid component movement.
Doc ID 16180 Rev 3
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Ordering information
5
Ordering information
Table 4.
6
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
SMX1J7.5A-TR
L
µQFN-2L
2.3 mg
12000
Tape and reel
Revision history
Table 5.
10/11
SMX1J
Document revision history
Date
Revision
Changes
26-Oct-2009
1
First issue.
03-Nov-2009
2
Updated : Features, Table 2, Table 4 and Figure 11.
27-Oct-2010
3
Updated base quantity Table 4.
Doc ID 16180 Rev 3
SMX1J
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Doc ID 16180 Rev 3
11/11
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