LG U8500 Mobile phone Service Manual
Below you will find brief information for Mobile phone U8500. The U8500 is a folder phone with a 1.3 megapixel camera and supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. It also has a Bluetooth connection and a USB port for data transfer.
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Date: February, 2006 / Issue 1.0
Service Manual
U8500
Table Of Contents
1. INTRODUCTION .............................. 5
1.1 Purpose................................................... 5
1.2 Regulatory Information............................ 5
2. PERFORMANCE...............................7
2.1 System Overview .....................................7
2.2 Usable environment .................................8
2.3 Radio Performance ..................................8
2.4 Current Consumption.............................14
2.5 RSSI BAR ..............................................14
2.6 Battery BAR ...........................................14
2.7 Sound Pressure Level............................15
2.8 Charging ................................................16
3. TECHNICAL BRIEF ........................17
3.1 General Description ...............................17
3.2 GSM Mode...........................................201
3.2.1 GSM Receiverv................................20
3.2.2 GSM Transmitter..............................22
3.3 WCDMA Mode .......................................23
3.3.1 Receiver...........................................23
3.3.2 Transmitter.......................................25
3.4 Phase-locked Loop ................................26
3.4.1 UMTS Rx PLL (PLL2) ......................26
3.4.2 Transceiver PLL (PLL1) ...................27
3.5 Off-chip RF Components .......................28
3.5.1 Front End Module(U1006) ...............28
3.5.2 UMTS duplexer (FL1000) ................29
3.5.3 UMTS Power Amplifier (U1002).......29
3.5.4 Thermistor (RT1000)........................31
3.5.5 UMTS transmit power detector
(U1001) ............................................31
3.5.6 Dual band GSM power amplifier
(U1005) ............................................32
3.5.7 GSM transmit VCO (U1003) ............34
3.5.8 UMTS Rx RF filter (FL1001) ............34
3.5.9 VCTCXO (X1000) ............................35
3.5.10 Bluetooth........................................35
3. BB Technical Description............. 37
3.6 Baseband(DBB/MSM6250)....................37
3.6.1 General Description .........................37
3.7 Hardware Architecture ...........................38
3.7.1 Block Diagram(MSM6250)...............39
3.8 Subsystem(MSM6250) ..........................40
3.8.1 ARM Microprocessor Subsystem.....40
3.8.2 UMTS Subsystem ............................40
3.8.3 GSM Subsystem ..............................40
3.8.4 RF Interface .....................................40
3.8.5 Serial Bus Interface(SBI) .................40
3.8.6 Wideband CODEC...........................41
3.8.7 Vocoder Subsystem.........................41
3.8.8 HKADC ............................................41
3.8.9 General-Purpose Input/Output
Interface ...........................................41
3.8.10 UART .............................................42
3.8.11 USB ...............................................42
3.9 External memory interface .....................43
3.10 H/W Sub System..................................44
3.10.1 RF Interface ...................................44
3.10.2 MSM Sub System ..........................46
3.10.3 Power Block ...................................50
3.10.4 Key Pad .........................................55
3.10.5 Camera Interface ...........................56
3.10.6 Folder ON/OFF Operation .............58
3.10.7 Camera Direction Detection...........59
3.10.8 Keypad Light ..................................60
3.10.9 LCD Module ...................................61
3.10.10 Display & LCD FPC Interface ......62
3.10.11 Audio and Sound .........................63
3.10.12 Trans Flash ..................................67
3.11 Main Features ......................................68
3.11.1 LG-U8500 Main features ...............68
3.11.2 LG-U8500 Main Components ........69
- 3 -
Table Of Contents
4. TROUBLE SHOOTING ...................74
4.1 RF Component.......................................74
4.2 SIGNAL PATH .......................................75
4.3 Checking VCXO Block ...........................76
4.4 Checking Ant. SW Module Block ...........79
4.5 Checking WCDMA Block .......................81
4.5.1 Checking VCXO Block .....................82
4.5.2 Checking Ant. SW module ...............82
4.5.3 Checking RF TX Level .....................82
4.5.4 Checking PAM Block .......................84
4.5.5 Check RF Rx Level ..........................85
4.6 Checking GSM Block .............................87
4.6.1 Checking VCO Block .......................88
4.6.2 Checking Ant. SW Module ...............90
4.6.3 Checking RF Tx level.......................90
4.6.4 Checking PAM Block .......................92
4.6.5 Checking RF Rx Block .....................93
4.7 Bluetooth RF Block ................................95
4.8 Power ON Trouble .................................98
4.9 USB Trouble ........................................100
4.10 SIM Detect Trouble ............................101
4.11 Key Sense Trouble ............................102
4.12 Camera Trouble .................................103
4.13 Main LCD Trouble..............................104
4.14 Keypad Backlight Trouble ..................106
4.15 Folder ON/OFF Trouble .....................107
4.16 Camera Direction Detection Trouble..108
4.17 Trans Flash Trouble...........................109
4.18 Audio Trouble Shooting .....................110
4.19 Charger Trouble Shooting..................120
6. BLOCK DIAGRAM ........................141
6.1 BLK diagram ........................................141
6.2 GSM & WCDMA RF Block...................142
6.3 Interface Diagram ................................144
7. Circuit Diagram ............................147
8. pcb layout .....................................155
9. CALIBRATION ..............................161
9.1 HOT KIMCHI........................................161
9.1.1 Directory structure..........................161
9.1.2 Setup file (Info_Db.txt) ...................162
9.1.3 Setup file item ................................163
9.1.4 Example for setting file ..................164
9.2 How to use Hot Kimchi.........................165
9.3 HOT KIMCHI Example.........................166
10. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 169
10.1 EXPLODED VIEW ............................ 169
10.2 Replacement Parts
<Mechanic component>.................... 171
<Main component> ........................... 175
10.3 Accessory ......................................... 194
5. DOWNLOAD .................................123
5.1 Introduction ..........................................123
5.2 Downloading Procedure.......................123
5.3 Troubleshooting Download Errors .......136
- 4 -
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
- 5 -
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
- 6 -
2. PERFORMANCE
2. PERFORMANCE
2.1 System Overview
Item
Shape
Size
Weight
Power
Talk Time
(with 800mAh)
Standby Time
(with 800mAh)
Antenna
LCD
LCD Backlight
Camera
Vibrator
LED Indicator
C-MIC
Receiver
Earphone Jack
Connectivity
Volume Key
External Memory
I/O Connect
Specification
GSM900/1800/1900 and WCDMA Folder Handset
98.8 X 49.0 X 18.2 mm
93 g (with 800mAh Battery)
4.0V normal, 800 mAh Li-Polymer
Over 125 min (WCDMA, Tx=12 dBm, Voice)
Over 160 min (GSM, Tx=Max, Voice)
Over 200 Hrs (WCDMA, DRX=1.28)
Over 220 Hrs (GSM, Paging period=9)
Internal type
Main 176 X 220 pixel (TFT) / sub 96 X 96 pixel (TFT)
White LED Back Light (2way ; main/sub common)
1.3 Mega pixel (CMOS)
Yes (Cylinder Type)
No
Yes
Yes
Yes (12 pin)
Bluetooth, USB
Push Type(+, -)
Trans-Flash
24 Pin
- 7 -
2. PERFORMANCE
2.2 Usable environment
1) Environment
Item
Voltage
Operation Temp
Storage Temp
Humidity
Specification
4.0 V(Typ), 3.38 V(Min), [Shut Down : 3.28 V]
-20 ~ +60
°C
-20 ~ +70
°C
85 % (Max)
2) Environment (Accessory)
Reference
TA Power
* CLA : 12 ~ 24 V(DC)
Spec.
Available power
Min
100
Typ.
220
Max
240
Unit
Vac
2.3 Radio Performance
1) Transmitter - GSM Mode
No Item
MS allocated
Channel
100k~1GHz
1G~12.75GHz
1
Conducted
Spurious
Emission
Idle Mode
100k~880MHz
880M~915MHz
915M~1GHz
1G~[A]MHz
[A]M~[B]MHz
[B]M~12.5GHz
* In case of DCS : [A] -> 1710, [B] -> 1785
- 8 -
GSM DCS & PCS
9k ~ 1GHz -39dBm
-39dBm
1G~[A]MHz
[A]M~[B]MHz
-33dBm
[B]M~12.75GHz
-60dBm 100k~880MHz
-33dBm
-39dBm
-33dBm
-60dBm
-62dBm 880M~915MHz
-60dBm 915M~1GHz
-62dBm
-60dBm
-50dBm 1G~[A]MHz
-56dBm [A]M~[B]MHz
-50dBm
-56dBm
-50dBm [B]M~12.5GHz
-50dBm
* In case of PCS : [A] -> 1850, [B] -> 1910
2. PERFORMANCE
No
2
3
4
5
Radiated
Spurious
Emission
Item
MS allocated
Channel
Idle Mode
Frequency Error
Phase Error
Frequency Error
Under Multipath and
Interference Condition
30M ~ 1GHz
1G ~ 4GHz
915M~1GHz
1G~[A]MHz
[A]M~[B]MHz
[B]M~4GHz
±0.1ppm
±5(RMS)
±20(PEAK)
GSM
30M ~ 880MHz
880M ~ 915MHz
DCS & PCS
30M~1GHz -36dBm
-36dBm
1G~[A]MHz
[A]M~[B]MHz
-30dBm
[B]M~4GHz
-57dBm 30M~880MHz
-30dBm
-36dBm
-30dBm
-57dBm
-59dBm 880M~915MHz
-57dBm
-47dBm 1G~[A]MHz
-53dBm
915M~1GHz
[A]M~[B]MHz
-47dBm [B]M~4GHz
±0.1ppm
±5(RMS)
±20(PEAK)
-59dBm
-57dBm
-47dBm
-53dBm
-47dBm
3dB below reference sensitivity 3dB below reference sensitivity
RA250 : ±200Hz
HT100 : ±100Hz
RA250: ±250Hz
HT100: ±250Hz
TU50 : ±100Hz
TU3 : ±150Hz
0 ~ 100kHz
200kHz
+0.5dB
-30dB
TU50: ±150Hz
TU1.5: ±200Hz
0 ~ 100kHz
200kHz
6
Output RF
Spectrum
Due to
250kHz
400kHz modulation 600 ~ 1800kHz
Due to
Switching transient
* In case of DCS : [A] -> 1710, [B] -> 1785
-33dB
-60dB
250kHz
400kHz
1800 ~ 3000kHz
3000 ~ 6000kHz
≥6000kHz
400kHz
600kHz
1200kHz
-66dB 600 ~ 1800kHz
-69dB 1800 ~ 6000kHz
-71dB ≥6000kHz
-77dB
-19dB 400kHz
-21dB 600kHz
-21dB 1200kHz
1800kHz -24dB 1800kHz
* In case of PCS : [A] -> 1850, [B] -> 1910
+0.5dB
-30dB
-33dB
-60dB
-60dB
-65dB
-73dB
-22dB
-24dB
-24dB
-27dB
- 9 -
2. PERFORMANCE
No
7
8
9
Item
Intermodulation attenuation
Transmitter Output Power
Burst timing
10
11
12
13
8
9
6
7
GSM
–
DCS & PCS
Frequency offset 800kHz
Intermodulation product should be Less than 55dB below the level of Wanted signal
Power control Power Tolerance Power control Power Tolerance
Level
5
(dBm)
33
(dB)
±3
Level
0
(dBm)
30
(dB)
±3
31
29
27
25
23
21
19
17
±3
±3
±3
±3
±3
±3
±3
±3
1
2
3
4
5
6
7
8
28
26
24
22
20
18
16
14
±3
±3
±3
±3
±3
±3
±3
±3
14
15
16
17
18
19
15
13
11
9
7
5
Mask IN
±3
±3
±5
±5
±5
±5
13
14
15
9
10
11
12
8
6
12
10
4
2
0
Mask IN
±4
±5
±5
±4
±4
±4
±4
- 10 -
2. PERFORMANCE
2) Transmitter - WCDMA Mode
No
1
2
3
Maximum Output Power
Frequency Error
Item
Open Loop Power control in uplink
Specification
Class3: +24dBm(+1/-3dB)
Class4: +21dBm(±2dB)
±0.1ppm
±9dB@normal, ±12dB@extreme
Adjust output(TPC command) cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4.5
4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4.5
group(10equal command group)
+1 +8/+12 +16/+24
5 Minimum Output Power -50dBm(3.84MHz)
Qin/Qout : PCCH quality levels
6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB
Ton@DPCCH/Ior : -24 -> -18dB
7 Transmit OFF Power -56dBm(3.84MHz)
±25us
8 Transmit ON/OFF Time Mask
PRACH,CPCH,uplinlk compressed mode
±25us
9
10
11
12
Change of TFC
Power setting in uplink compressed
Occupied Bandwidth(OBW)
Spectrum emission Mask
Power varies according to the data rate
DTX : DPCH off
(minimize interference between UE)
±3dB(after 14slots transmission gap)
5MHz(99%)
-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz, 30k
-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz, 1M
-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz, 1M
-49 dBc@∆f=8.5~12.5MHz, 1M
- 11 -
2. PERFORMANCE
No Item
13 Adjacent Channel Leakage Ratio(ACLR)
14
Spurious Emissions
(*: additional requirement)
15 Transmit Intermodulation
16 Error Vector Magnitude(EVM)
17 Transmit OFF Power
Specification
33dB@5MHz, ACP>-50dBm
43dB@10MHz, ACP>-50dBm
-36dBm@f=9~150KHz, 1K BW
-36dBm@f=50KHz~30MHz, 10K BW
-36dBm@f=30MHz~1000MHz, 100K BW
-30dBm@f=1~12.5GHz, 1M BW
(*)-41dBm@f=1893.5~1919.6MHz, 300K
(*)-67dBm@f=925~935MHz, 100K BW
(*)-79dBm@f=935~960MHz, 100K BW
(*)-71dBm@f=1805~1880MHz, 100K BW
-31dBc@5MHz,Interferer -40dBc
-41dBc@10MHz, Interferer -40dBc
17.5%(>-20dBm)
(@12.2K, 1DPDCH+1DPCCH)
-15dB@SF=4.768Kbps, Multi-code transmission
3)Receiver - GSM Mode
No
1
2
Item
Sensitivity (TCH/FS Class II)
Co-Channel Rejection
(TCH/FS Class II, RBER, TU high/FH)
3 Adjacent Channel
Rejection
200kHz
400kHz
4
5
Intermodulation Rejection
Blocking Response
(TCH/FS Class II, RBER)
GSM
-105dBm
C/Ic=7dB
DCS & PCS
-105dBm
Storage -30 ~ +85
C/Ia1=-12dB
C/Ia2=-44dB
Wanted Signal: -98dBm
1st interferer: -44dBm
C/Ia1=-12dB
C/Ia2=-44dB
Wanted Signal: -96dBm
1st interferer: -44dBm
2nd interferer: -45dBm
Wanted Signal: -101dBm
2nd interferer: -44dBm
Wanted Signal: -101dBm
Unwanted : Depend on Frequency Unwanted : Depend on Frequency
- 12 -
2. PERFORMANCE
4) Receiver - WCDMA Mode
No Item
1 Reference Sensivitivity Level
2 Maximum Input Level
3 Adjacent Channel Selectivity(ACS)
4 In-band Blocking
5 Out-band Blocking
6 Spurious Response
7 Intermodulation Characteristic
8 Spurious Emissions
- 13 -
Specification
-106.7dBm(3.84 MHz)
-25dBm(3.84MHz)
-44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(Class3)
33dB
UE@+20dBm output power(Class3)
-56dBm/3.84MHz@10MHz
UE@+20dBm output power(Class3)
-44dBm/3.84MHz@15MHz
UE@+20dBm output power(Class3)
-44dBm/3.84MHz@f=2050~2095 and
2185~2230MHz
UE@+20dBm output power(Class3)
-30dBm/3.84MHz@f=2025~2050 and
2230~2255MHz
UE@+20dBm output power(Class3)
-15dBm/3.84MHz@f=1~2025 and
2255~12500MHz
UE@+20dBm output power(Class3)
-44dBm CW
UE@+20dBm output power(Class3)
-46dBm CW@10MHz
-46dBm/3.84MHz@20MHz
UE@+20dBm output power(Class3)
-57dBm@f=9KHz~1GHz, 100K BW
-47dBm@f=1~12.5GHz, 1M BW
-60dBm@f=1920MHz~1980MHz, 3.84M BW
-60dBm@f=2110MHz~2170MHz, 3.84M BW
2. PERFORMANCE
2.4 Current Consumption
WCDMA
GSM
Stand by
Under 4.0 mA
(DRX=1.28)
Under 3.6 mA
(Paging=9period)
Under 5.3 mA
(@Bluetooth Connected,
Paging=9period)
Voice Call
Under 384 mA
(Tx=12dBm)
Under 300 mA
(Tx=Max)
(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight Off)
(VT Test Condition : Speaker off, LCD backlight On)
2.5 RSSI BAR
Level Change
BAR 4
→ 3
BAR 3
→ 2
BAR 2
→1
BAR 1
→ 0
WCDMA
-87 ±2 dBm
-97 ±2 dBm
-107 ±2 dBm
-111 ±2 dBm
VT
Under 533mA
(Tx=12dBm)
GSM
-91 ±2 dBm
-96 ±2 dBm
-101 ±2 dBm
-106 ±2 dBm
2.6 Battery BAR
Indication
Bar 4
Bar 4
→ 3
Bar 3
→ 2
Bar 2
→ 1
Bar 1
→ Empty
Low Voltage,
Warning message+ Blinking
Power Off
- 14 -
Standby
Over 3.82 ±0.03V
3.81 ±0.03V
3.74 ±0.03V
3.67 ±0.03V
3.50 ±0.03V
3.38 ±0.03V (Stand-by) / 3.50 ±0.03V (Talk)
[Interval : 3min(Stand-by) / 1min(Talk)]
3.28 ±0.03V
↓
2. PERFORMANCE
2.7 Sound Pressure Level
10
11
12
13
14
15
8
9
No
1
2
3
4
5
6
7
16
17
Test Item
Sending Loudness Rating (SLR)
Receiving Loudness Rating (RLR)
Side Tone Masking Rating (STMR)
Echo Loss (EL)
Sending Distortion (SD)
Receiving Distortion (RD)
Idle Noise-Sending (INS)
Idle Noise-Receiving (INR)
Sending Loudness Rating (SLR)
Receiving Loudness Rating (RLR)
Side Tone Masking Rating (STMR)
Echo Loss (EL)
Sending Distortion (SD)
Receiving Distortion (RD)
Idle Noise-Sending (INS)
Idle Noise-Receiving (INR)
TDMA Noise
-. GSM : Power Level : 5
DCS/PCS : Power Level : 0
(Cell Power : -90 ~ -105 dBm)
-. Acoustic (Max Vol.)
MS/Headset SLR : 8 ±3dB
MS/Headset RLR : -15 ±3dB / -12dB
(SLR/RLR : Mid-value setting)
MS
Headset
Specification
8 ±3 dB
-4 ±3 dB Nor
Max
Min
-15 ±3 dB
17 dB
Min 40 dB
Refer to Table 30.3
Max
Refer to Table 30.4
-64 dBm0p
Nor
Max
Under -47 dBPA
Under -36 dBPA
Nor
Max
Min
8±3dB
-1 ±3 dB
-12 ±3 dB
25 dB
Min 40 dB
Refer to Table 30.3
Max
Refer to Table 30.4
-55 dBm0p
Nor
Max
Under -45 dBPA
Under -40 dBPA
MS and
Headset
Max -62 dBm
- 15 -
2. PERFORMANCE
2.8 Charging
• Charging Method : CC & CV (Constant Current and Constant Voltage)
• Maximum Charging Voltage : 4.2 V
• Maximum Charging Current : 600 mA
• Normal Battery Capacity : 800 mAh
• Charging Time : Max 3.5 hours (except for trickle charging time)
• Full charging indication current (charging icon stop current) : 60 mA
• Cut-off voltage : 3.28 V
- 16 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 General Description
The U8500 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and
PCS1900 transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
U8500 high-level RF functional block diagram
1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.
- 17 -
3. TECHNICAL BRIEF
A generic, high-level functional block diagram of U8500 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation).
UMTS band signals at the antenna are switched to the relevant UMTS duplexer.
The UMTS receive band signals are amplified by the front-end LNAs of the RFR6250 IC before passing through a band-pass filter and being applied to the mixer inputs of the RFR6250 IC. On-chip circuits down-convert the received signal directly from RF to baseband using radioOne Zero-IF techniques. Generation and distribution of the UMTS LO, for the down-converter, is performed entirely on-chip (except for the loop filter).
The RFR6250 IC outputs analog baseband signals for processing by the MSM device. This baseband interface is shared with the RTR6250 GSM receiver outputs, but is separate from the GPS baseband interface.
EGSM, DCS and PCS receive signals from the antenna switch module pass through their band-pass filters, then are applied to the RTR6250 IC. In a similar fashion to the UMTS paths, RTR6250 IC circuits down-convert the received signals directly from RF to baseband.
The GSM LO for multiband down conversion is entirely generated within the RTR6250 IC (PLL and distribution functions) with exception of the off-chip loop filter. The RTR analog baseband outputs are routed to the MSM6250 IC for further processing (an interface shared with the RFR UMTS receive paths).
The UMTS transmit path begins with analog baseband signals from the MSM device that drive the
RTR6250 IC. Integrated PLL and VCO circuits generate the Tx LO used in the quadrature upconverter that translates baseband signals directly to RF. The RTR6250 output driver stages deliver fairly highlevel signals that are filtered and applied to the power amplifiers (PA). The PA output is routed to the antenna through a duplexer and switch module.
The shared EGSM-900, DCS-1800, and PCS-1900 transmit path begins with the same baseband interface from the MSM6250 IC that is used for the UMTS band. A single EGSM/DCS/PCS quadrature upconverter translates the GMSK-modulated signal to a convenient intermediate frequency (IF) that forms one input to an offset phase-locked loop (OPLL).
OPLL functions are split between the RTR6250 IC and off-chip loop filter and dual Tx VCO circuits, and translate the GMSK-modulated signal to the desired EGSM-900, DCS-1800 or PCS-1900 channel frequency. This signal is applied to a dual power amplifier (only one is active at a time).
The enabled path continues with the PA, an automated power control (APC) circuit that samples the transmit power and adjusts its level, the switch module (which includes a band-appropriate lowpass filter), and the antenna.
- 18 -
3. TECHNICAL BRIEF
U8500 power supply voltages are managed and regulated by the PM6650 Power Management IC.
This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.
- 19 -
3. TECHNICAL BRIEF
3.2 GSM Mode
3.2.1 GSM Receiver
The Dual-mode U8500’s receiver functions are split between the two RFICs as follows:
• UMTS-2100 operation uses the RFR6250 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q).
• EGSM-900, DCS-1800, and PCS-1900 modes both use the RTR6250 IC only.
Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled parameters.
The EGSM, DCS, and PCS receiver inputs of RTR6250 are connected directly to the transceiver frontend circuits(filters and antenna switch module). EGSM, DCS, and PCS receiver inputs are similar to the RFR6200 UMTS Rx input in that they also use differential configurations to improve commonmode rejection and second-order non-linearity performance.
The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins.
Since EGSM, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers
- this is accomplished in the switch module.
The EGSM, DCS, and PCS receive signals are routed to the RTR6250 through band selection filters and matching networks that transform single-ended 50-Ωsources to differential impedances optimized for gain and noise figure. Similar to the RFR, the RTR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance. The RTR6250 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections.
The filter outputs are buffered and passed on to the MSM6250 IC for further processing (an interface shared with the RFR6200 UMTS receiver outputs).
2 The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application
Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS
Software documentation for details.
- 20 -
- 21 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.2.2 GSM Transmitter
The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6250 IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250. This upconverter translates the GMSKmodulated signal to a convenient intermediate frequency (IF) that forms one input to a frequency/phase detector circuit. This
IF signal is the reference input to an offset phase-locked loop (OPLL) circuit as shown in Figure 1.2.2-1.
Figure 3.2.2-1 Offset phase-locked loop interfaces
The feedback path of this OPLL circuit includes a downconversion from the RF output frequency range to the IF range. The two inputs to this downconversion mixer are formed as follows:
1. The dual Tx VCO output (operating in the desired RF output frequency range) is buffered within the
RTR6250 IC then applied to the mixer RF port.
2. The LO Generation and Distribution circuits that deliver the transmit path.s LO for the baseband-to-IF upconversion also provides the .offset LO. signal that is applied to the feedback path.s mixer LO port.
The mixer IF port output is the offset feedback signal - the variable input to the frequency/phase detector circuit. The detector compares its variable input to its reference input and generates an error signal that is lowpass filtered by the loop filter and applied to the dual Tx VCO tuning port to force the
VCO output in the direction that minimizes errors. As mentioned earlier, the VCO output is connected to the feedback path thereby creating a closed-loop control system that will force frequency and phase errors between the variable and reference inputs to zero.
- 22 -
3. TECHNICAL BRIEF
The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons:
1. Phase-locked loops provide a lowpass filter function from the reference input to the VCO output. This results in a bandpass function centered at the desired channel frequency that provides steep, wellcontrolled rejection of the out-of-band spectrum.
2. The resulting output bandpass function is virtually unchanged as the transmitter is tuned over channels spanning the GSM operating band.
The PA is a key component in any transmitter chain and must complement the rest of the transmitter precisely. For GSM band operation, the closed-loop transmit power control functions add even more requirements relative to the UMTS PA. In addition to gain control and switching requirements, the usual
RF parameters such as gain, output power level, several output spectrum requirements, and power supply current are critical. The gain must be sufficient and variable to deliver the desired transmitter output power given the VCO output level, the subsequent passive devices’ losses, and the control set point. The maximum and minimum transmitter output power levels depend upon the operating band class and mobile station class per the applicable standard. Transmitter timing requirements and inband and out-of-band emissions, all dominated by the PA, are also specified by the applicable standard.
The active dual Tx VCO output is applied to the dual power amplifier to continue the transmit path, and feedback to the RTR6250 IC to complete the frequency control loop. The PA operating band (EGSM or
DCS/PCS) is selected by the MSM device GPIO control (GSM_PA_BAND).
3.3 WCDMA Mode
3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RFR6250 IC. The LNA gain is dynamically controlled by the MSM6250 IC to cover full receiver dynamic range and to save current consumption.
The UMTS LNA output is routed to the down conversion mixer inputs, in the RFR6250 IC, through a band selection filter that transforms a single-ended 50-Ω source to differential 100-Ω load impedance that is matched to the RFR6250 IC. The RFR input uses a differential configuration to improve secondorder inter-modulation and common mode rejection performance. The RFR6250 IC input stages include MSMcontrolled gain adjustments that further extend receiver dynamic range.
- 23 -
3. TECHNICAL BRIEF
The amplifier output drives the RF port of the quadrature RF-to-baseband downconverter.
The down-converted baseband outputs are routed to low-pass filters (one I and one Q) having passband and stop-band characteristics suitable for DSWCDMA processing. The filter outputs are buffered and passed on to the MSM6250 IC for further processing. This baseband interface is shared with the
RTR6250 GSM receiver outputs.
The RFR6250 IC includes LO generation and distribution circuitry to reduce offchip component requirements. The GPS RX LO source is created using the PLL control elements of the RTR6250
PLL2, via a discrete loop filter components, in tandem with the VCO in the RFR6250. Using only this
PLL signal, the RFR6250 LO generation and distribution circuits create the necessary LO signals for the UMTS quadrature down-converter. By definition, the ZIF down-converter requires FLO equal to
FRF, and the RTR6250/RFR6250 design achieves this without allowing FVCO to equal F
RF
.
Figure 3.3.1-1 RFR6250 IC functional block diagram
- 24 -
3. TECHNICAL BRIEF
3.3.2 Transmitter
The UMTS transmit path begins with analog baseband signals from the MSM device that drive the
RTR6250 IC. The RTR6250 IC provides all the UMTS transmitter active signal-path circuits except the power amplifiers. Analog (I and Q) differential signals from the MSM device are buffered, filtered, and applied to Baseband-to-RF quadrature upconverters. Gain control is implemented on-chip.
The RF outputs include an integrated matching inductor, reducing the off-chip matching network to a single series capacitor.
The RTR6250 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA.
The PA device used in U8500 is “Load Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.
The RTR6250 IC integrates LO generation and distribution circuits on-chip, substantially reducing offchip requirements. Various modes and programmable features result in a highly flexible transceiver LO output that supports not only UMTS transmissions, but all EGSM900 and DCS1800/PCS1900 Rx and
Tx modes as well.
The UMTS Tx LO (PLL1) is generated almost entirely on-chip, requiring only the loop filter off-chip
(two capacitors and two resistors); all UMTS Tx VCO and PLL circuits are on-chip. An internal
RTR6250 switch routes the internal VCO signal to the LO generation and distribution circuits to create the necessary UMTS Tx LO signals.
- 25 -
3. TECHNICAL BRIEF
3.4 Phase-locked Loop
Most LO functions are fully integrated on-chip, do not require user adjustment, and need not be considered by handset designers. QUALCOMM has established and implemented frequency plans and LO generation schemes that support the radioOne 6250-IIseries chipset while requiring minimal off-chip design effort. Only one area requires handset designer attention: the loop filters of each phase-locked loop (PLL).
3.4.1 UMTS Rx PLL (PLL2)
UMTS Rx LO functional blocks are distributed between the RFR6250 IC, RTR6250 IC, and external
UMTS_RX_CH_VCO and loop filter components (Figure 1.4.1-1).
The external UMTS_RX_CH_VCO must be enabled for UMTS Rx operation and disabled otherwise; a dedicated MSM6250 IC signal (UHF_VCO_EN ) enables the VCO.
Figure 3.4.1-1 UMTS Rx PLL functional block diagram
The RFR6250 IC accommodates single-ended or differential LO inputs; if singleended, either pin can be active. AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used in U8500). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6250 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter.
A sample of the downconverter LO is buffered and routed from RFR6250 IC pin 19 to RTR6250 IC pin
32 (RX_VCO_IN). This signal requires a terminating resistor near the RTR6250 IC input pin and an AC coupling capacitor that assures the internal RTR6250 IC biasing is not disrupted in the example. Good microstrip or stripline controlled-impedance techniques must be used
- 26 -
3. TECHNICAL BRIEF
Most UMTS Rx PLL circuits are included within the RTR6250 IC: reference divider, phase detector, charge pump, feedback divider, and digital logic that generate LOCK status. The buffered 19.2 MHz
TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase and frequency locked.
The reference is divided by the R-Counter to create a fixed frequency input to the phase detector, FR.
The other phase detector input (FV) varies as the loop acquires lock, and is generated by dividing the
RX_VCO_IN frequency using the feedback path.s N-Counter. The closed loop will force FV to equal
FR when locked.
If the loop is not locked the error between FV and FR will create an error signal at the output of the charge pump. This error signal is filtered by the loop filter and applied to the VCO, tuning the output frequency such that the error is decreased.
Ultimately the loop forces the error to approach zero and the PLL is phase and frequency locked.
Many key PLL performance characteristics are largely determined by the loop filter design - stability, transitory response, settling time, and phase noise.
3.4.2 Transceiver PLL (PLL1)
All LO functional blocks for the other handset modes(UMTS Tx, EGSM Tx/Rx, DCS Tx/Rx, PCS
Tx/Rx) are integrated into the RTR6250 IC except the loop filter components (Figure 1.4.2-1). On-chip circuits include reference divider, phase detector, charge pump, VCO, feedback divider, and digital logic status. The functional description given in Section 1.4.1 for the UMTS Rx PLL applies to the
Transceiver PLL as well.
Figure 3.4.2-1 Transceiver PLL functional block diagram
- 27 -
3. TECHNICAL BRIEF
The off-chip loop filter allows optimization of key PLL performance characteristics (stability, transitory response, settling time, and phase noise) for different applications. Guidelines are provided in the next subsection for proper implementation of this critical circuit.
3.5 Off-chip RF Components
3.5.1 Front End Module(U1006)
Front End module integrates antenna switch module and GSM Rx filter.
The antenna switch module allows multiple operating bands and modes to share the same antenna. In the U8500 design, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) EGSM
Rx, 3) DCS-1800 Rx, 4) PCS-1900 Rx, 5)EGSM Tx, and 6) DCS-1800, PCS-1900 Tx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. GSM band of operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required. The module includes lowpass filters for the GSM bands transmit paths to reduce out-of-band emissions, PA harmonics in particular.
The GSM mode RF filters are located before their LNAs, so their insertion losses are extremely critical
(1.5 dB typical). Other important parameters are:
• Out-of-band rejection or attenuation levels
- Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.
- Frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.
- GSM band receivers operate while the handset transmitters are off so there are no Tx-band leakage attenuation requirements.
• Phase and amplitude balance - the UMTS discussion presented above applies for GSM bands as well. See the data sheet for specific values. Of course, passband ripple and return loss are still important in all cases for the same reasons explained in the antenna switch module and duplexer sections.
- 28 -
3. TECHNICAL BRIEF
3.5.2 UMTS duplexer (FL1000)
A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include:
-. Insertion loss . this component is also in the receive and transmit paths; In the U8500 typical losses:
UMTS Tx = 1.2 dB, UMTS Rx = 1.5 dB.
-. Out-of-band rejection or attenuation . the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance:
-. Rx-band isolation . the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and
Rx-band losses between the PA and LNA. Typical duplexer Rx band isolation value is 45 dB.
-. Tx-band isolation . the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall inband to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Typical duplexer Tx-band isolation value is 50 dB.
-. Passband ripple . the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the band.s channels, and should be controlled.
-. Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).
-. Power handling . high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance.
3.5.3 UMTS Power Amplifier (U1002)
The SKY77410 Load Insensitive Power Amplifier (LIPA¢‚) module is a fully matched 16-pin surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient power amplifier packs full coverage of the 1850-1980 MHz bandwidth into a single compact package.
SKY77410 meets the stringent spectral linearity requirements of WCDMA transmission with high power added efficiency for power output of up to 28 dBm, even with a load mismatch of 4:1 VSWR eliminating the need for an isolator.
- 29 -
3. TECHNICAL BRIEF
A low current (VCONT) pin provides improved operating efficiency in the low RF power range. To further improve efficiency in this range, a separate VBIAS pin can be directly connected to the battery, which allows reducing VCC1 and VCC2 voltages to 0.8 V to achieve very low power consumption.
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. The output match is realized off-chip within the module package to optimize efficiency and power performance into a 50 Ω load. This device is manufactured with
Skyworks’ GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage
DC supply operation while maintaining high efficiency and good linearity.
Primary bias to the SKY77410 is supplied directly from a three-cell Ni-Cd, a singlecell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range.
Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with full primary voltage supplied from the battery.
Figure 3.5.3-1 UMTS PA functional block diagram
An isolator between the Power Amplifier and the duplexer is highly recommended to provide constant load and source impedances (respectively) to those devices.
This improves PA stability, ACPR performance, and harmonic suppression, as well as duplexer isolation, insertion loss, and ripple. Transmitter performance is always improved when an isolator is included and is well worth the added cost.
- 30 -
3. TECHNICAL BRIEF
3.5.4 Thermistor (RT1000)
This thermistor senses temperature variations around UMTS PA to adjust PA gain deviation for assure compliance with the applicable transmit power control standards. Negative temperature compensation thermistor is used in the U8500.
3.5.5 UMTS transmit power detector (U1001)
This detector couples PA output power level to calibrate the transmitter characteristic over the channel variation and temperature. Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level.
The U8500 uses National Semiconductor LMV225TLX power detector IC. In Figure 1.5.5-1, R1 is set to 1.8kΩ resulting in an attenuation of 31.4dB. The output voltage is proportional to the logarithm of the input power. Figure1.5.5-2 shows the output voltage versus PA output power of the LMV225TLX setup as depicted in Figure1.5.5-1
Figure 3.5.5-1 Block diagram of LMV225TLX with high resistive tap
- 31 -
3. TECHNICAL BRIEF
Figure 3.5.5-2 Power detector response, Vout vs PA output power
3.5.6 Dual band GSM power amplifier (U1005)
The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.
The module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks, impedancematching circuitry for 50 Ω input and output impedances, and a Power Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal
PAC function and interface circuitry.
Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM850/900 bands and the other supports the DCS1800 and PCS1900 bands.
Both PA blocks share common power supply pins to distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.
RF input and output ports of the SKY77328 are internally matched to a 50 Ω load to reduce the number of external components for a quad-band design.
Extremely low leakage current (2.5 µA, typical) of the dual PA module maximizes handset standby time. The SKY77328 also contains band-select switching circuitry to select GSM (logic 0) or DCS/PCS
(logic 1) as determined from the Band Select (BS) signal. In Figure 1.5.6-1 below, the BS pin selects the PA output (DCS/PCS OUT or GSM850/900 OUT) and the Analog Power Control (VAPC) controls the level of output power.
The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power amplifier control (iPAC™) function, which is insensitive to variations in temperature, power supply, process, and input power. The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.
- 32 -
3. TECHNICAL BRIEF
Figure 3.5.6-1 GSM PA functional block diagram
- 33 -
3. TECHNICAL BRIEF
3.5.7 GSM transmit VCO (U1003)
The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts
PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet.
The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA . this is the low loss path, and 2) the OPLL feedback signal . this is the high loss path. See Figure 8-1 for recommended topology and resistor values.
The losses from the VCO outputs to the PA inputs must be factored into the output chain.s power budget. Each path includes a π-pad that introduces approximately a 3-dB loss. The low band GSM πpad is formed by R235 plus R232, R228, and R229; the high band GSM π-pad is formed by R236 plus
R232, R234, and R233. One leg of each π-pad is used to couple the VCO output to form the feedback path as described below.
For a given VCO output drive level, the loss to the RTR6250 input must assure the specified input level is achieved (-18 to -12 dBm). Large resistors included in the π- pads are used to lightly couple off the
VCO outputs to create the feedback signal.
Since the RTR6250 TX_VCO_FB pin presents fairly high impedance, an external terminating resistor is required (R232, 51 Ω). A series capacitor (82 pF) AC couples the feedback signal into the RTR6250 IC.
3.5.8 UMTS Rx RF filter (FL1001)
An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include:
• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:
- out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.
- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage.
- Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.
• Phase and amplitude balance - the ZIF architecture requires well-balanced differential inputs to the
RFR6250 IC. This is accomplished by the RF filter which takes a single-ended output from the
RFL6250 IC and provides differential outputs having nominal 180° phase separation. Phase and/or amplitude imbalance causes degraded common-mode rejection and second-order nonlinearity, so their requirements are specified jointly.
-
±3 degrees and ± 1 dB
- -12 to + 3 degrees and
± 0.7 dB
Of course, passband ripple and return loss are still important in all cases for the same reasons explained in the antenna switch module and duplexer sections.
- 34 -
3. TECHNICAL BRIEF
3.5.9 VCTCXO (X1000)
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the
MSM6250 IC. The 6250-series chipset requires a 19.2 MHz nominal VCTCXO frequency. The oscillator frequency is controlled by the MSM6250’s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control.
The filtered PDM signal results in an analog control signal into the VCTCXO tuning port whose voltage is directly proportional to the density of the digital bit stream. The MSM device varies the pulse density to change the analog control voltage that sets the oscillator frequency - all within a feedback control loop that minimizes handset frequency drift relative to the network.
3.5.10 Bluetooth (U406 : LBDA254AN0, ANT400 : LDA31 )
The MSM6250 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.5.12-1 shows the bluetooth system architecture in the U8500.
- 35 -
3. TECHNICAL BRIEF
Figure 3.5.10-1 Bluetooth system architecture
- 36 -
3. TECHNICAL BRIEF
3. BB Technical Description
3.6 Baseband(DBB/MSM6250)
3.6.1 General Description
A. Features(MSM6250)
• The ARM926EJ-S microprocessor can operate at up to 150 MHz with variable rate, software controlled clocks to provide greater standby time.
• Integrated PLL to provide additional on-chip clock frequencies
• Supports low-power, low-frequency crystal to enable TCXO shutoff
• Integrated USIM Controller for direct interface to USIM card
• Software-controlled power management feature
• Automatic access conversion of 32-bit data accesses to 16-bit devices
• Advanced 409-ball CSP packaging
• WCDMA Access
- Maximum of eight simultaneous transport channels
- Four coded composite transport channels (CCTrCH)
- PS data rates supporting 384kbps DL / 64kbps UL
• GSM/GPRS Access
- GSM/GPRS network signaling (from Layer 1 to 3)
- GSM AMR,EFR,FR
• Operation and Services
- SIM Interfaces
- General Purpose I/O (GPIO) Interface
- Dual Memory Buses(EBI1 & EBI2)
- JTAG
- RTC
• Data Communication
- UARTs (ACB, EDB (RS232))
- Slave USB
- 37 -
3. TECHNICAL BRIEF
3.7 Hardware Architecture
USIM
PM6650
BLUETOOTH
GSM TX
GSM
Quadband
PA
GSM
Quad
TX VCO
E
X
E
R
D
U
P
L
ASM
SP7T
GSM RX
GSM
900/1800/1900
RX FILTER
WCDMA TX
UMTS
PA
UMTS
TX
FILTER
WCDMA RX
RTR6250
UMTS
RX
FILTER
RFR6250
MSM6250
Amp
SPEAKER
SPEAKER
RECEIVER
MIC
EAR
JACK(12pin)
1.3M
CAMERA
MAIN
LCD
SUB
LCD
SDRAM +
NAND
Trans-Flash
CARD
Figure 3.7-1 Simplified Block Diagram
- 38 -
3. TECHNICAL BRIEF
3.7.1 Block Diagram(MSM6250)
19.2M
Tx/Rx I/Q
HK ADC
PLL
UMTS
GSM/GP
RS
ARM
Processor
Tx/Rx I/F
SBI for
PM6650
SBI for
RF IC
VOCODER CODEC
USIM
Controller
USB I/F
UART
General
Purpose
I/O
NAND
&
SDRAM
Stereo
Speaker
Receiver
MIC
Figure 3.7.1-1 Simplified Block Diagram of MSM6250
- 39 -
3. TECHNICAL BRIEF
3.8 Subsystem(MSM6250)
3.8.1 ARM Microprocessor Subsystem
The MSM6250 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, and ROM devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the
RTR6250, RFR6200, RFL6200, and PM6650 devices.
3.8.2 UMTS Subsystem
The UMTS Subsystem performs the digital UMTS signal processing. Its components include:
• Searcher engine
• Demodulating fingers
• Combining block
• Frame deinterleaver
• Viterbi decoder
• Up-link subsystem
• Turbo decoder
On the down-link channel the UMTS subsystem searches, demodulates, and decodes incoming
CPICH, CCPCH, SCH, and Traffic Channel information. It extracts packet data from the downlink traffic channel and prepares the packet data for processing. For the up-link, the CDMA subsystem processes the packet data and modulates the up-link traffic channel (DCH).
3.8.3 GSM Subsystem
The GSM Subsystem performs the digital GSM signal processing.
3.8.4 RF Interface
The RF interface communicates with the mobile station’s external RF and analog baseband circuits.
Signals to these circuits control signal gain in the Rx and Tx signal path and maintain The system’s frequency reference.
3.8.5 Serial Bus Interface(SBI)
The MSM6250 device’s SBI is designed specifically to be a quick, low pin count control protocol for
QUALCOMM’s RTR6250, RFR6200, RFL6200, and PM6650 ASICs. Using the SBI, the RTR6250,
RFR6200, RFL6200, and PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode. The SBI also controls DC baseband offset errors.
- 40 -
3. TECHNICAL BRIEF
3.8.6 Wideband CODEC
The MSM6250 device integrates a wideband voice/audio CODEC into the mobile station modem
(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface on two single-ended earphone output. The CODEC integrates the microphone and earphone amplifiers into the MSM6250 device, reducing the external component count to just a few passive components.
The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.
3.8.7 Vocoder Subsystem
The MSM6250 device’s QDSP4000 supports AMR vocoder. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo
Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6200 device’s integrated ARM7TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.
3.8.8 HKADC
TheMSM6250 device has an on-chip 8-bit analog-to-digital converter (ADC) which is intended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250 device has six analog input pins which are multiplexed to the input of the internal HKADC.
3.8.9 General-Purpose Input/Output Interface
The MSM6250 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional
RAM, ROM, general-purpose chip selects, parallel LCD interface, and UART interface.
- 41 -
3. TECHNICAL BRIEF
3.8.10 UART
There are three UARTs in the MSM6250 ASIC:
• UART1 for data
• UART2 (can be used for USIM interface)
• UART3 (can be used for PM SBI interface)
3.8.11 USB
The MSM6250 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB function communicating with the USB host. The USB controller also supports digital audio through USB interface and connects directly to the QDSP4000 for the audio processing.
- 42 -
3. TECHNICAL BRIEF
3.9 External memory interface
A. MSM6250
The MSM6250 have two external memory interfaces with arbitration for the multi-layer AHB system and memory controllers. The EBI1 bus is a high performance bus that supports a wide variety of memories. EBI2 bus is targeted to be the interface for slow peripheral devices(i,.e., LCD) as well as the NAND flash memory.
• EBI1 Features
- 16 bit static and dynamic memory interface
- 32 bit dynamic memory interface
- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select
- Synchronous burst memories supported (burst NOR, burst PSRAM)
- Synchronous DRAM memories supported
- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses
- Pseudo SRAM (PSRAM) memory support
• EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).
- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).
- 2Mbytes of memory per chip select.
- Support for 8 bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(16 & 8 bit)
• 1GMb NAND flash memory + 512Mb SDRAM
• 2-CS(Chip Select) are used
Device
FLASH
SDRAM
Part Name
TY9000AC00C0GG
TY9000AC00C0GG
Interface Spec
Maker
Toshiba
Toshiba
Read Access Time Write Access Time
35 ns/Bytes 50 ns/Bytes
107 ns/4Double Word 53 ns/4Double Word
Table 3.9-1 External memory interface for U8500
- 43 -
3. TECHNICAL BRIEF
3.10 H/W Sub System
3.10.1 RF Interface
A. RTR6250(WCDMA_Tx, GSM_Tx/Rx)
MSM6250 controls RF part(RTR6250) using these signals.
• SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset
• PAON : Power AMP on RF part
• RX_I/Q,TX_I/Q : I/Q for T/Rx of RF
• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier
SBST1_GPIO[93]
H18
TX_AGC_ADJ
TRK_LO_ADJ
TCXO_EN_GPIO[94]
PA_ON[0]
L14
H14
F18
B19
Q_OUT_N
Q_OUT
I_OUT_N
I_OUT
A13
B13
A14
B14
Q_IM_CH1(Reserved)
Q_IP_CH1(Reserved)
I_IM_CH1(Reserved)
I_IP_CH1(Reserved)
Q_IM_CH0
Q_IP_CH0
I_IM_CH0
I_IP_CH0
U21
U23
V25
W26
Y25
Y26
V21
W21
PA_RANGE[1]_GP_PDM[2]
PA_RANGE[0]_GP_PDM[1]
A20
H17
TRST_N
TCK
TMS
TDI
TDO
RTCK
H15
D16
F15
D15
F16
H16
GRFC[14]_GPIO[83]
GRFC[13]_GPIO[82]
GRFC[12]_GPIO[81]
GRFC[11]_GPIO[80]
GRFC[10]_TX_ON
J25
K23
J26
K19
H12
ANT_SEL2_N_GPIO[11]
ANT_SEL1_N_GPIO[10]
ANT_SEL0_N_GPIO[9]
TX_VCO_0_EN_N_GPIO[8]
TX_VCO_1_EN_N_GPIO[7]
UHF_BAND_SEL_GPIO[6]
GSM_PA_BAND_GPIO[5]
GSM_PA_EN_GPIO[4]
UHF_VCO_0_EN_GPIO[3]
B4
T23
R19
D11
H10
F10
D9
A8
B8
BT_CLK_GPIO[25]
BT_SBST_GPIO[24]
BT_SBCK_GPIO[23]
BT_SBDT_GPIO[22]
BT_TX_RN_N_GPIO[21]
BT_DATA_GPIO[20]
G23
F23
E26
E25
G21
D26
SPK_AMP_EN
TP201
TCXO_EN
TX_QM
TX_QP
TX_IM
TX_IP
RX_QM
RX_QP
RX_IM
RX_IP
TP204
FOLDER_DETECT
RF_ON_TX_ON
ANT_SEL2
ANT_SEL1
ANT_SEL0
BT_CLK
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
1K R206
2K R207
PA_ON
C226 C225
0.01u
33n
TX_AGC_ADJ
TRK_LO_ADJ
VREG_MSMP_2.7V
PA_R0
VREG_MSMP_2.7V
GSM_TX_VCO_0_EN_N
GSM_TX_VCO_1_EN_N
GSM_PA_BAND
GSM_PA_EN
Figure 3.10.1-1 Schematic of RF Interface of MSM6250
- 44 -
3. TECHNICAL BRIEF
B. RFR6250(WCDMA_Rx)
• SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset
• RX_I/Q, : I/Q for Rx of RF
C. the others
• GSM_PA_BAND
• TRK_LO_ADJ
• PA_ON
• ANT_SEL[0-2]
: DCS/GSM Band Selection of Power Amp
: TCXO(19.2M) Control
: WCDMA TX Power Amp Enable
: Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS Tx/Rx)
• GSM_PA_RAMP
• GSM_PA_EN
: Power Amp Gain Control of APC_IC
: Power Amp Gain Control Enable of APC_IC
• GSM_TX_VCO_0_EN_N : GSM Band Tx VCO Enable of Dual VCO
• GSM_TX_VCO_1_EN_N : DCS Band Tx VCO Enable of Dual VCO
- 45 -
3. TECHNICAL BRIEF
3.10.2 MSM Sub System
3.10.2.1 SIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
• USIM_CLK : USIM Clock
• USIM_Reset : USIM Reset
• USIM_Data : USIM Data T/Rx
MSM6250
USIM CLK
USIM Reset
USIM Data
PM6650
VREG_USIM 2.85V
USIM CLK
USIM Reset
USIM Data
USIM
Figure 3.10.2.1-1 UART Interface
3.10.2.2 UART Interface
UART signals are connected to MSM GPIO through IO connector with 115,200 bps speed.
And, used for RF calibration and Data download.
GPIO_Map
GPIO_96
GPIO_95
Name
RX_M
TX_M
Table 3.10.2.2-1 UART Interface
Note
Data_Rx
Data_Tx
- 46 -
3. TECHNICAL BRIEF
3.10.2.3 USB
The MSM6250 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the
MSM6250 was designed to comply with the definition of a peripheral as specified in USB Specification,
Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB
Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the
MSM6250. U8500’s USB interface uses the PM6650 internal logic for USB Transceiver.
Name
USB_RCV
USB_DAT
USB_SE0
USB_OE_N
USB_VBUS
USB_D+
USB_D-
Note
Rx_Data to MSM
Data to/from MSM
Data to/from MSM
Out-Put Enable of Transceiver
USB_Power From Host(PC)
USB Data+ to Host
USB Data- to Host
Table 3.10.2.3-1 USB Signal Interface
MSM6250
USB_OE_N
USB_DAT
USB_SE0
PM6650
USB_VBUS
USB_D+
USB_D-
IO
Connector
Figure 3.10.2.3-1 SIM Interface
- 47 -
3. TECHNICAL BRIEF
MSM6250_USB Block PM6650_USB Block
1005
USB_VBUS
RESET_IN_N
C412 1u
USB_OE_N
D401
USB_CNT_N
4.7u
C450
RB521S-30
USB_DAT
USB_D+
USB_SE0
USB_D-
VBAT_TEMP
R408
C413
47K
1u
KYBD_BACKLIGHT
PM_ON_SW_N
13
14
15
16
17
18
19
20
21
10
11
12
8
9
FLSH_DRV_N
PON_RESET_N
VREG_USB
USB_ID
VREG_5V
USB_OE_N
VSW_5V
USB_CTL_N
USB_VBUS
USB_DAT
USB_D_P
USB_SE0
USB_D_M
GP1_DRV_N(MPP7)
Figure 3.10.2.3-2 Schematic of USB block(MSM6250 Side & PM6650 Side)
- 48 -
3. TECHNICAL BRIEF
3.10.2.4 HKADC(House Keeping ADC)
The MSM6250 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250 device has six analog input pins which are multiplexed to the input of the internal HKADC.
ADC Ch#
HKADC0
HKADC1
HKADC2
HKADC3
HKADC4
HKADC5
Figure 3.10.2.4-1 MSM6250 HKADC Block diagram
Signal Name
AMUX_OUT
VBATT_LEVEL
HDET1
MULTI_ADC
PCB REVISION
VBAT_TEMP
Note
RF PAM Temperature sensing
Battery voltage level sensing
RF WCDMA PAM Power Level sensing
Headset type Detection
MAIN PCB Revision checking
Battery Temperature sensing
Table 3.10.2.4-1 HKADC channel table
- 49 -
3. TECHNICAL BRIEF
3.10.3 Power Block
3.10.3.1 General
MSM6250, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of
MSM6250, MSM memory, RF block, Bluetooth, Trans flash, USIM and TCXO.
Major power components are :
PM6650(U402) : Phone power supply
BH28FB1WHFV(U411) : LCD Power supply
QST4(Q403,Q404) : External charger supply switching
SI3493DV (Q402) : Main Battery charging control
SI8402DB,SI8407DB(Q400,Q401) : WCDMA PAM power selection control
MIC2211(U501) : Camera power supply
3.10.3.2 PM6650
The PM6650 device integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference.
A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions.
MSM device controls and statuses the PM6650 IC using a three-line Serial Bus Interface (SBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.
- 50 -
3. TECHNICAL BRIEF
Figure 3.10.3.2-1 PM6650 Functional Block Diagram
- 51 -
3. TECHNICAL BRIEF
3.10.3.3 Charging control
A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and
ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.
4.2V~3.82V
100~75 (%)
3.81V~3.75V
75~50 (%)
3.74V~3.68V
50~25 (%)
3.67V~3.51V
25~2 (%)
U8500 Battery Bar Display(Stand By Condition)
- 52 -
3.50V~3.28V
2~0 (%)
3. TECHNICAL BRIEF
3.10.3.3.1 Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V
DD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V). The charging current is set to 80mA.
Parameter
Trickle Current
Min
60
Typ
80
Max
100
Unit
mA
- 53 -
3. TECHNICAL BRIEF
3.10.3.3.2 Constant Current Charging
The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.
3.10.3.3.3 Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.
The end of constant voltage charging is commonly detected 10% of the full charging current (60mA)
• Charging Method : CC & CV (Constant Current & Constant Voltage)
• Maximum Charging Voltage : 4.2V
• Maximum Charging Current : 600mA
• Nominal Battery Capacity : 800 mAh
• Charger Voltage : 4.6V
• Charging time : Max 3.5h (Except time trickle charging)
• Full charge indication current (icon stop current) : 60mA
• Low battery POP UP : Idle - 3.38V, Dedicated(GSM/WCDMA) - 3.50V
• Low battery alarm interval : Idle - 3 min, Dedicated - 1min
• Cut-off voltage : 3.28V
- 54 -
3. TECHNICAL BRIEF
3.10.4 Key Pad
There are 26 buttons and 3 side keys in Figure. Shows the Keypad circuit. ‘END’Key is connected
On_SW to PMIC(PM6650) and MSM(GPIO76).
ROW0
ROW1
ROW2
ROW3
ROW4
COL0 COL1 COL2 COL3
HOT1 (VT) HOT2 (H3G) HOT3 (MENU) CLR (Clear)
1 2 3 LEFT
4
7
HOT4 (*)
5
8
0
6
9
HOT5(#)
OK
SEND
DN
COL4
FUNC_1
UP
RIGHT
FUNC_2
BACK
COL5
Side key (camera)
Side key (Down)
Side Key (Up)
Table 3.10.4-1 Key Matrix Mapping Table
VREG_MSMP_2.7V
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_COL(0)
KEY_ROW(4)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
R603
10K
CAMERA_SIDE_KEY
RA600
10K
HOT1
1
1
7
7
4
4
HOT4
HOT4
KEY
HOT2
8
8
5
5
0
0
2
2
HOT3
3
3
9
9
6
6
HOT5
HOT5
CLR
CLR
LEFT
LEFT
OK
OK
SND
SND
DN
DN
MENU
MENU
UP
UP
RIGHT
RIGHT
SEARCH
KEY_ROW(0)
R671
100
EVLC14S02050
SIDE_KEY_COL(5)
VA600
NA
VA618
KEY_COL(5)
R673 100
CN602
1
2
SIDE_KEY_COL(5)
VOLUME_SIDE_KEY
SEARCH
BACK
BACK
R685
KEY_ROW(2)
EVLC14S02050
SIDE_KEY_COL(5)
100
EVLC14S02050
R672
KEY_ROW(1)
VA601
100
VA602
CN601
1
2
3
EVLC14S02050 VA619
Figure 3.10.4-1 Keypad Circuit
- 55 -
3. TECHNICAL BRIEF
3.10.5 Camera Interface
U8500 Installed a 1.3M Pixel CMOS VGA Camera.
Below figure show the camera board to board connector and camera I/F signal.
VREG_MSMP_2.7V
CAM_DATA(7)
CAM_DATA(6)
I2C_SDA
CAM_HSYNC
CAM_RESET_N
I2C_SCL
VREG_CAM_2.7V
R564 0
NA
FB501
R581
HH-1M1005-601JT
CAM
CONNECTOR
19
18
17
16
15
14
13
24
23
22
21
20
G2
CN501
G1
8
9
6
7
4
5
1
2
3
10
11
12
G4 G3
HB-1M1005-600JT
FB502
FB500
HB-1M1005-600JT
R565 0
CAM_P_DOWN
CAM_MCLK
CAM_DATA(3)
CAM_DATA(0)
CAM_PCLK
CAM_DATA(2)
CAM_DATA(1)
CAM_VSYNC
CAM_DATA(5)
CAM_DATA(4)
VREG_CAM_1.8V
Figure 3.10.5-1 Camera Board to Board Connector
+VPWR
CAM_PWR_EN
C503
1u
C502
0.01u
CAM_LDO
1
U501
VIN
2
EN1
3
EN2
4
BYP
5
NC1
MIC2211-LGYML
10
VOUT1
VOUT2
9
NC3
8
NC2
GND
BGND
7
6
11
C500
1u
C501
1u
VREG_CAM_2.7V
VREG_CAM_1.8V
Figure 3.10.5-2 Camera LDO(1.8V/2.7V)
- 56 -
3. TECHNICAL BRIEF
The Camera module is connected to main board with 24pin Board to Board connector (AXK7L24227).
Its interface is dedicated camera interface port in MSM6250. The camera port supply 24MHz master clock to camera module and receive 12MHz pixel clock (30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6250.
6
7
4
5
No Name
1 GND
2
3
CAM_P_DOWN
CAM_MCLK
CAM_DATA(3)
CAM_DATA(0)
CAM_PCLK
CAM_DATA(2)
8
9
CAM_DATA(1)
CAM_VSYNC
10 CAM_DATA(5)
11 CAM_DATA(4)
12 VREG_CAM_1.8V
13 GND
14 GND
15 VREG_CAM_2.7V
16 GND
17 I2C_SCL
18 CAM_RESET_N
19 VREG_CAM_2.6V
20 CAM_HSYNC
21 I2C_SDA
22 CAM_DATA(6)
23 CAM_DATA(7)
24 GND
Port
GND
I
I
O
O
O
O
O
O
O
O
I
GND
GND
I
GND
I
I
I
O
I/O
O
O
GND
Note
GND
Camera power down enable
Master Clock(24M)
Data
Data
Clock for Camera Data Out
Data
Data
Vertical Synch
Data
Data
Camera Digital Power
GND
GND
Camera Analog, I/O Power
GND
I2C Clock
Camera reset signal
Camera Analog, I/O Power
Horizontal Sync
I2C command
Data
Data
GND
Table 3.10.5-3 Interface between Camera Module and Main Board (in camera module)
- 57 -
3. TECHNICAL BRIEF
3.10.6 Folder ON/OFF Operation
There is a magnet to detect the folder status, opened or closed.
If a magnet is close to the hall-effect switch, the voltage at pin1 of U600 goes to 0V. Otherwise, 2.7V.
This folder signal is delivered to MSM6250 GPIO80.
VREG_MSMP_2.7V
FOLDER_SENSE
R600
62
1
2
3
U600 A3212EEH-T
OUTPUT
NC1
VDD
NC2
6
5
4
GND2
7
GND1 PGND
FOLDER_DETECT
C601
0.1u
Figure 3.10.6-1 Schematic of Folder ON/OFF detection circuit
- 58 -
3. TECHNICAL BRIEF
3.10.7 Camera Direction Detection
CAM_SENSE detects the Camera Direction (front or back)
VREG_MSMP_2.7V
R508
62
CAM_HALL_IC
U500
MRSS32W
VCC
OUT
GND
CAM_SENSE
C512
0.1u
C513
10p
Figure 3.10.7-1 Camera Direction Detection
- 59 -
3. TECHNICAL BRIEF
3.10.8 Keypad Light
There are 22 blue LEDs on Top side in board backlight circuit, which are driven by
KEYBD_BACKLIGHT line form PM6650(note, one LED is not mounted).
Key Pad backlight controlled by PM6650.
+VPWR
0
R607
LD616
LEBB-S14H
LD618
LEBB-S14H
LD621
LEBB-S14H
R666
47
LEBB-S14H
LD600
LEBB-S14H
LD603
R651
47
LEBB-S14H
LD601
LEBB-S14H
LD605
R654
47
R657
47
R660
47
LEBB-S14H
LD611
R663
47
R668
47
R674
47
KEY_BACK_LIGHT
LD617
R667
LEBB-S14H
LD610
47
R652
47
LEBB-S14H
LD606
R655
47
LEBB-S14H
LD609
R658
47
LEBB-S14H
LD607
R661
47
LEBB-S14H
LD615
R664
47
LEBB-S14H
LD619
LEBB-S14H
R669
47
LD602
LEBB-S14H
LD613
R650
47
R653
47
LEBB-S14H
LD608
R656
47
LEBB-S14H
LD612
R659
47
LEBB-S14H
LD614
R662
47
LEBB-S14H
LD604
R665
47
LEBB-S14H
LD620
LEBB-S14H
R670
47
KYBD_BACKLIGHT
Figure 3.10.8-1 Keypad Backlight Circuit
- 60 -
3. TECHNICAL BRIEF
3.10.9 LCD Module
Vibrator
Receiver
LOUD SPK
LOUD SPK
LCD
MODULE
Figure 3.10.9-1 LCD Module Block Diagram
MAIN
LCD
Back
Light
SUB
LCD
MAIN LCD
MODULE
260K Color TFT
176 * 220 Pixel
SUB LCD
MODULE
65K Color TFT
(260K Color support)
96 * 96 Pixel
HD66784(RENESAS) Graphic Controller Driver Main & Sub LCD Panel
(note, one Driver IC control both Main and Sub LCD).
Figure 3.10.9-2 LCD Module(Main & Sub LCD)
- 61 -
3. TECHNICAL BRIEF
3.10.10 Display & LCD FPC Interface
LCD module is connected to Main board with 50-pin BtoB connector
(CN600_AXT450164) and Speaker, Receiver, Vibrator are connected by soldering the leads to pads in
LCD FPCB module.
The LCD is controlled by 16-bit EBI2 in MSM6250
1 : NC
2 : VCC_2.8V : LCD Power
3 : VCC_2.8V : LCD Power
4 : GND
5 : DATA(0)
6 : DATA(1)
7 : DATA(2)
8 : DATA(3)
9 : DATA(4)
10 : DATA(5)
11 : DATA(6)
12 : DATA(7)
13 : LCD MAKER ID
14 : GND
15 : +VPWR : Vibrator Power
16 : GND
17 : KEY_COL(6) : MOD KEY
18 : WLED_PWR : LCD Back light power
19 : WLED_PWR : LCD Back light power
20 : GND
21 : SPK_R+ : Loud speaker Right
22 : SPK_R- : Loud speaker Right
23 : SPK_L+ : Loud speaker Left
24 : SPK_L- : Loud speaker Left
25 : KEY_ROW(1) : MOD KEY
26 : KEY_ROW(3) : MOD_KEY
27 : KEY_COL(2) : MOD_KEY
28 : WLED_4 : LCD Back light control
29 : WLED_3 : LCD Back light control
30 : WLED_2 : LCD Back light control
31 : WLED_1 : LCD Back light control
32 : MOTOR_PWR- : MOTOR control
33 : RCV- : Receiver
34 : RCV+ : Receiver
35 : GND
36 : DATA(15)
37 : DATA(14)
38 : DATA(13)
39 : DATA(12)
40 : DATA(11)
41 : DATA(10)
42 : DATA(9)
43 : DATA(8)
44 : OE_N : Read_Enable
45 : WE_N : Write_Enable
46 : GND
47 : ADS : Address strobe
48 : LCD_CS_N : Chip select
49 : LCD_RESET_N
50 : LCD_IF_MODE : LCD Data interface control
- 62 -
3. TECHNICAL BRIEF
3.10.11 Audio and Sound
3.10.11.1 Overview of Audio & Sound path
MSM6250
(U200)
SUB b'd
Conn.
LCD Conn
LCD Conn
Head Set
Jack
Head_Set
LCD
Module
Receiver
LCD
Module
Stereo Speaker
SUB b'd
Conn.
Head Set
Jack
Figure 3.10.11.1-1 Audio & Sound Path Block Diagram
MIC
Head_set MIC
- 63 -
3. TECHNICAL BRIEF
3.10.11.2 Audio Signal Processing & Interface
Audio signal processing is divided Uplink path and downlink path.
The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (MSM6250).
This transmitted signal is reformed to fit in GSM & WCDMA Frame format and delivered to RF Chip.
The downlink path amplifies the signal from DBB chip (MSM6250) and outputs it to Receiver (or
Speaker).
The receive path can be directed to either one of two earphone amplifiers or the auxiliary output.
The outputs earphone1 (EAR1OP, EAR1ON) and Auxiliary out (AUXOP, AUXON) are differential outputs. Earphone2 (EAR2O) is a single-ended output stage designed to drive a headset speaker.
The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.
Figure 3.10.11.2-1 Audio Interface Detailed Diagram(MSM6250)
- 64 -
3. TECHNICAL BRIEF
R201
150K
MSM6250 BLK
VREG_MSMP_2.7V
Near to MSM
MIC_Feedback
MICFBP
MICINN
MICOUTP
C246 0.1u
470K
R216
MICOUTN
MICINP
MICFBN
C244 0.1u
C247 0.1u
C248 0.015u
180K
R215
C240 0.015u
C245 0.1u
180K
R214
U8500 schematics
DAUGHTER_HEADSET
Head Set Jack BLK
R905
2.2K
13
CN901
15
17
1
8
9
6
7
4
5
2
3
10
11
12
14
16
18
C-1827541
C915
10p
C917
10p
10u C914
R903
R907
10K
2.2K
C911 33u
C907 33u
C931
47p
C932
47p
2
3
1
D901
UCLAMP0505A
6
5
4
VREG_MSMP_2.7V
MICBIAS
MIC2P
MIC2N
HP_OUT_L
HP_OUT_R
EAR_SENSE_N
MULTI_ADC
HOOK_SENSE_N
Figure 3.10.11.2-2 U8500 SUB b’d schematics
- 65 -
3. TECHNICAL BRIEF
Handset main MIC BLK
U505
SP0102BE3
G3
PWR
G2
G1
OUT
5
4
3
2
1
MIC
MICBIAS
C538
10u
C537
47p
0.022u
C534
0.022u
C535
C536
NA
MIC1N
MIC1P
C533
NA
Audio Amp for loud Speaker
HPL_R
SPK_AMP_EN
C507 0.022u
C509 0.022u
Audio AMP
80.6K
R504
C1
U502
IN-
80.6K
R507
A1
IN+
C2
_SHDN
TPA2010D1YZF
B1
VDD
B2
PVDD
VO-
VO+
A3
C3
C506
1u
R500
R501
0
0
AMP_PWR
SPK_R+
SPK_R-
⇒
Speaker
HPL_L
SPK_AMP_EN
C504 0.022u
C508 0.022u
80.6K
R505
80.6K
R506
C1
U503
IN-
A1
IN+
C2
_SHDN
TPA2010D1YZF
B1
VDD
B2
PVDD
VO-
VO+
A3
C3
C505
1u
R502
R503
0
0
AMP_PWR
SPK_L+
SPK_L-
⇒
Speaker
- 66 -
3.10.12 Trans Flash
MSM6250 BLK
3. TECHNICAL BRIEF
BT_CLK_GPIO[25]
BT_SBST_GPIO[24]
BT_SBCK_GPIO[23]
BT_SBDT_GPIO[22]
BT_TX_RN_N_GPIO[21]
BT_DATA_GPIO[20]
G23
F23
E26
E25
G21
D26
Trans Flash BLK
S900
GND
500873-0802
DAT2_RSV
CD_DAT3_CS
CMD_DI
VDD
CLK_SCLK
VSS
DAT0_DO
DAT1_RSV
GND
R920
0
VREG_MMC_3.0V
<= from PM6650
MMC_CD
MMC_CMD
MMC_CLK
MMC_DATA
C905
0.1u
U8500 SUB b’d schematics
- 67 -
3. TECHNICAL BRIEF
3.11 Main Features
3.11.1 LG-U8500 Main features
- Folder Type
- WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode
- Dual color LCD(Main:260K TFT, Sub:65K TFT)
- 1.3M Pixel CMOS VGA Camera
- 15*14 pi Stereo speaker
- Stereo Head_set
- Video telephony in WCDMA with camera
- Loud Speaker phone(in GSM and WCDMA)
- 64 Poly Sound
- MP3/AAC/WMA decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Support Bluetooth, USB
- 98.2 X 49.0 X 18.2 mm
- 800 mAh(Li-Poly)
- 68 -
3. TECHNICAL BRIEF
3.11.2 LG-U8500 Main Components
SUB Top Side
MAIN Bottom Side MAIN Top Side SUB Bottom Side
1.3M Camera Module
U8500
Stereo Headset
- 69 -
LCD & Folder Assy
3. TECHNICAL BRIEF
3.11.2.1 Main Top Side
U411
U600
RA600
CN601
Reference
U411
U600
RA600
CN601
Description
LCD 2.8V LDO
Reference
U601
Folder close(Flip) detection IC U502, U503
Key Sense control signal(ROW[])
CN602
Pull Up Resistor
Volume Side Key LD614
Description
LCD Backlight power charge pump
Audio Amp(D-class)
Camera hot side key
Keypad backlight LED
- 70 -
U601
U502,U503
CN602
LD614
3. TECHNICAL BRIEF
3.11.2.2 Main Bottom Side
U501
D602,D603
CN501
U400
U301
X400
U402
Q400,Q401
U401
Q404
CN503
Q403
Q402
Reference
U501
D602, D603
CN501
U400
U301
X400
U402
Description
Camera Dual LDO(2.7V/1.8V)
Diode for On Sw detection
24pin camera connector
Inverter for buffering
1G NAND + 512M SDRAM
Sleep crystal(32.768KHz)
PMIC(PM6650)
Reference
U500
FL600
CN600
CN500
D600
U200
X200
Description
Camera direction detection IC
High freq. Noise filtering EMI filter
50pin connector for LCD Module
24pin connector for SUB PCB
ESD Filter
MSM6250
48MHz Crystal for USB
- 71 -
U500
FL600
CN600
CN500
D600
U200
X200
TR1000
U300
X1000
J300
U505
Cn502
3. TECHNICAL BRIEF
3.11.2.2 Main Bottom Side(continued)
U501
D602,D603
CN501
U400
U301
X400
U402
Q400,Q401
U401
Q404
CN503
Q403
Q402
Reference Description
Q400, Q401 N/P-MOS FET for WCDMA PAM power control
U401 TVS for USB signal
Q404
CN503
Q403
Q402
TR for USB charging control
IO Connector
TR for TA Charging control
FET for Battery charging control
Reference
TR1000
U300
X1000
J300
U505
CN502
Description
TR for signal Buffering
TVS for USIM signal
19.2MHz Main Crystal
6pin SIM connector
MIC
Battery connector
- 72 -
TR1000
U300
X1000
J300
U505
CN502
U500
FL600
CN600
CN500
D600
U200
X200
3. TECHNICAL BRIEF
3.11.2.3 SUB Bottom Side
S900
U901
D901
3.11.2.4 SUB Top Side
CN902
Reference
S900
U901
D901
CN902
Description
Trans Flash Socket
TVS for Trans flash data signal
TVS for audio signal
24pin connector for MAIN PCB
Reference
CN901
BAT900
- 73 -
Description
Headset Jack
Back Up battery
CN901
BAT900
XXX
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
X1000
U1000
U1004
U1003
ANT500
RF component (Bottom)
Reference
X1000
U1000
U1004
U1003
ANT500
ANT1000/1001
Description
VCTCXO(19.2MHz)
WCDMA Receiver IC(RFR6250)
GSM/WCDMA Transceiver IC
GSM TX VCO
Bluetooth ANT
ANT contact pad
Reference
U1001
FL1000
U1002
U1006
SW1002
U1005
Description
HDET IC
WCDMA Duplexer
WCDMA PAM
Front End Module
ANT S/W
U1001
FL1000
U1002
U1006
SW1002
ANT1001
U1005
ANT1000
- 74 -
4. TROUBLE SHOOTING
4.2 SIGNAL PATH
WCDMA Tx PATH
WCDMA Rx PATH
GSM Tx PATH
DCS/PCS Tx PATH
GSM/DCS/PCS Rx PATH
GSM Rx P ATH
DCS Rx PATH
PCS Rx PATH
- 75 -
4. TROUBLE SHOOTING
4.3 Checking VCXO Block
The reference frequency (19.2MHz) from X1000 (VCXO) is used WCDMA TX part,
GSM part and BB part.
- 76 -
4. TROUBLE SHOOTING
Check 1. Crystal part
If you already check this crystal part, you can skip check 1.
TP3 TP4
TP5
TP1
TP2
Test Point (Crystal Part)
TP3
TP4
C1010
1000p
C1009
1000p
TP1
C1004
1000p
C1003
0.1u
19.2MHz
4
VCC
X1000
GND
2
OUT VCONT
3 1
TG-5001LA-19.2MHz
VREG_TCXO_2.85V
R1002
100
C1005
0.01u
TRK_LO_ADJ
TP2
C1011 100p
TCXO_PM
TCXO_BT_IN
TP5
Schematic of the Crystal Part
- 77 -
4. TROUBLE SHOOTING
Check TP1
VCC of VCXO
VCC ≥ 2.8V
Yes
Check TP2
TRK_LO _ADJ
No
3V≥Voltage≥0V
Yes
Check TP3,4 ,5
With Oscilloscope
No
3V≥Voltage≥0V
Yes
VCXO is OK
Check oth er part
No
Check PMIC
Check MSM
Check solde ring and compon ents
- 78 -
4. TROUBLE SHOOTING
4.4 Checking Ant. SW Module Block
ANT_SEL2
ANT_SEL1
ANT_SEL0
VREG_RFRX_0_2.85V
Antenna Switch Block(Bottom)
ANT1001
L1035
4.7nH
C1230
L1034
15nH
15p
C1112
0.5p
G2
ANT
G1
SW1002
RF
KMS-512
ANT1000
C1111 33p
VREG_RFRX_0_2.85V
ANT_SEL0
ANT_SEL1
ANT_SEL2
L1031 7.5nH
C1108
0.1u
FXL4T245BQX
1
14
VCCA
VCCB
7
8
15
GND1
GND2
BGND
13
12
11
10
B0
B1
B2
B3
U1008
_OE
9
T__R
6
A0
A1
A2
A3
4
5
2
3
2
4
11
20
CTRL1
CTRL2
CTRL3
CTRL4
8
UMTS
M054E
U1006
RX_DCS1
RX_DCS2
RX_PCS1
RX_PCS2
RX_EGSM1
RX_EGSM2
12
13
14
15
16
17
TX_DCSPCS
TX_EGSM
3
1
M054E
Schematic of the Antenna Switch Block
Mode
EGSM TX
EGSM RX
DCS/PCS TX
DCS RX
PCS RX
UMTS
ANT_SEL0
LOW
HIGH
LOW
LOW
HIGH
LOW
Logic Table of the Antenna Switch
ANT_SEL1
LOW
LOW
HIGH
LOW
LOW
LOW
- 79 -
ANT_SEL2
LOW
LOW
LOW
LOW
LOW
HIGH
4. TROUBLE SHOOTING
Checking Switch Block power source
Check Soldering of
ANT_SEL0, 1, 2 High Level
2.5V < Voltgae < 3.0V
NO
Check VCC
TP1 VREG_RFRX_0_2.85V
YES
Check the Logic in each mode
- 80 -
4.5 Checking WCDMA Block
START
1. Check VCXO 19.2MHz
2.
1.
2. Check ANT. SW Module
ANT_SEL0, 1, 2
5.
3. Check RF Tx Level
4. Check PAM Block
5. Check RF Rx Level
6. Re-download SW & CA L.
4. TROUBLE SHOOTING
3. 4.
- 81 -
4. TROUBLE SHOOTING
4.5.1 Checking VCXO Block
Refer to 4.3
4.5.2 Checking Ant. SW module
Refer to 4.4
4.5.3 Checking RF TX Level
TP4
TP3
TP2
TP1
ANT1001
Test Point (RF TX Level)
TP1
ANT1000
L1035
4.7nH
C1230
L1034
15nH
15p
C1112
0.5p
G2
ANT
G1
SW1002
RF
KMS-512
C1111 33p
VREG_RFRX_0_2.85V
ANT_SEL0
ANT_SEL1
ANT_SEL2
L1031 7.5nH
C1108
0.1u
FXL4T245BQX
1
14
VCCA
VCCB
7
8
15
GND1
GND2
BGND
13
12
11
10
B0
B1
B2
B3
U1008
_OE
9
T__R
6
A0
A1
A2
A3
4
5
2
3
2
4
11
20
CTRL1
CTRL2
CTRL3
CTRL4
8
UMTS
M054E
U1006
RX_DCS1
RX_DCS2
RX_PCS1
RX_PCS2
RX_EGSM1
RX_EGSM2
12
13
14
15
16
17
TX_DCSPCS
TX_EGSM
3
1
TP3
TP4
TP2
WCDMA
5.6nH
L1002
12p C1113
C1114
NA
SKY77410
U1002
11
RF_OUT RF_IN
3
C1026
10u
VREG_W_PA
TX_AGC_ADJ
R1011 270
C1028
0.01u
+VPWR
C1037
0.01u
C1001
27p
C1032
0.01u
ANT
G1
G2
G3
G4
G5
G6
G7
1.8K
R1013
PA_ON
C1031 100p
R1012
10K
HDET
A1
U1001 LMV225TLX
RFIN_EN VDD
A2
B1
GND OUT
B2
C1030
1200p
ILNA_OUT
C1007
27p
TR1000
UMC4N
PA_ON
VREG_RFTX_2.85V
VREG_RFTX_2.85V
HDET1
13
14
15
16
PLNA_OUT
ILNA_OUT
PLNA_BIAS
C1215
12p
C1034
NA
R1015
0
FL1002
4
G3
OUT
G2
IN
G1
5 2
1
R1031
0
C1082
5.6p
L1013
8.2nH
PGND
GLNA_BIAS
GLNA_IN
49
48
47
IMT_RX_P
IMT_RX_M
VREG_TCXO_RFR
- 82 -
4. TROUBLE SHOOTING
For testing, Max power output is needed.
Set the Phon e Tx is ON and PDM is 450
Check TP1
Over 21dBm ?
NO
Check TP2
Over 19dBm ?
NO
Check TP3
Over 16dBm ?
YES
YES
YES
NO
Check TP4
Over -5dBm ?
NO
Chan ge th e board
YES
RF Tx Lev el is OK
Check FEM
Check Du ple xer
Check PAM Block
Refer to 3.5. 4
- 83 -
4. TROUBLE SHOOTING
4.5.4 Checking PAM Block
PAM control signal
PA_ON : WCDMA Tx Power Detect IC(HDET) Enable
TX_AGC_ADJ : WCDMA Tx Power Amp Gain Control
PA_ON
TX_AGC_ADJ
PA_ON must be HIGH(over 2.5V)
PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V)
PAM IN/OUT Signal
PAM OUT must be over 16dBm
PAM IN must be over -5dBm
- 84 -
PAM_OUT
PAM_IN
4. TROUBLE SHOOTING
4.5.5 Check RF Rx Level
Bias1
TP4
TP3
TP2
TP1
Test Point (RF Rx Level)
TP1
ANT1001
L1035
4.7nH
C1230
L1034
15nH
15p
SW1002
G2
ANT
G1
RF
KMS-512
C1112
0.5p
ANT1000
C1111
33p
VREG_RFRX_0_2.85V
ANT_SEL0
ANT_SEL1
ANT_SEL2
L1031 7.5nH
C1108
0.1u
FXL4T245BQX
1
14
VCCA
VCCB
7
8
15
GND1
GND2
BGND
13
12
11
10
B0
B1
B2
B3
U1008
_OE
9
T__R
6
A0
A1
A2
A3
4
5
2
3
2
4
11
20
CTRL1
CTRL2
CTRL3
CTRL4
8
UMTS
M054E
U1006
RX_DCS1
RX_DCS2
RX_PCS1
RX_PCS2
RX_EGSM1
RX_EGSM2
12
13
14
15
16
17
TX_DCSPCS
TX_EGSM
3
1
ILNA_OUT
TP4
C1047
8.2p
L1005
2.2nH
R1048
0
FL1001
2 3
1
IN
G1
G2
LN04A
5
O1
O2
4
C1055 33p
L1007
33nH
C1060 0.1u
C1054 33p
L1011
3.9nH
L1010
3.9nH
IMT_RX_P
IMT_RX_M
TP2
C1001
27p
ANT
G1
G2
G3
G4
G5
G6
G7
1.8K
R1013
PA_ON
C1031 100p
R1012
10K
A1
U1001 LMV225TLX
A2
RFIN_EN VDD
B1
GND OUT
B2
L1001 2.7nH
L1004
ILNA_OUT
100nH
C1008 12p
R1003
0
C1043
1.2p
C1045
680p
C1030
1200p
TP3
VREG_RFRX_1_2.85V
C1049
0.1u
C1048
10p
C1058
0.1u
C1056
10p
C1007
27p
C1014
0.1u
C1012
100p
VREG_RFTX_2.85V
HDET1
18
19
20
21
22
23
24
13
14
15
16
17
PLNA_OUT
ILNA_OUT
PLNA_BIAS
PLNA_IN
ILNA_BIAS
ILNA_IN
VDDRF3
RX_IP
RX_IM
RX_QP
RX_QM
VDDA2
EUSY0246001
U1000
PGND
GLNA_BIAS
GLNA_IN
R_BIAS
VDDA8
SBST
SBDT
SBCK
VDDM
GRX_IP
GRX_IM
GRX_QP
GRX_QM
49
48
47
46
45
44
43
42
41
40
39
38
37
R1008
11K
RX_QM
RX_QP
RX_IM
RX_IP
R1004
0
C1016
470p
C1017
3.9n
C1018
0.01u
VREG_TCXO_RFR
SBST
SBDT
SBCK
C1020
10p
C1019
1u
- 85 -
4. TROUBLE SHOOTING
Set the Phon e Rx is ON
Check bias1
Over 2V ?
YES
Check TP1
Signal exist?
YES
Check TP2
Signal exist?
NO
NO
NO
YES
Check TP3
Signal exist?
YES
Check TP4
Signal exist?
YES
Chan ge th e board
NO
NO
Check bias block soldering
Check RF s/ w
Check FEM
Check Du plexe r
Check RF R6250
- 86 -
4.6 Checking GSM Block
START
1. Check TXVCO Block
1.
.
2.
.
3..
2. Check ANT. SW
Module
3. Check Tx PAM Block
4. Check RF Rx Level
5. Re-download SW
& C AL.
4. TROUBLE SHOOTING
4..
- 87 -
4. TROUBLE SHOOTING
4.6.1 Checking VCO Block
TP4
TP2
TP1
TP3
TP6
TP5
R1027
24
R1032
15
R1034
51
TP6
TP5
TP1
Test Point (TXVCO Level)
TP3
TP4
TP2
925-960 MHz
L1028 10nH
MQW5V0C869M
10
VC
1
5
OUT_GSM
OUT_DCSPCS
U1003
3
VB
SW1
SW2
9
11
8
12
13
14
GND5
GND6
GND7
GND8
GND1
GND2
GND3
GND4
2
4
6
7
L1015
9.1nH
C1086
1000p
R1037
82
C1083
120p
C1085
1000p
C1084
22n
(PPS)
FB1000
R1036
47
VREG_RFTX_2.85V
R1025 100
R1026 100
GSM_TX_VCO_0_EN_N
GSM_TX_VCO_1_EN_N
R1030
VREG_MSMP_2.7V
51
VREG_RFTX_2.85V
C1073
10u
C1077 C1080
0.1u
100p
C1079
82p
38
39
40
41
42
VDDA11
TX_MOD_CP
VDDA12
TX_VCO_FB
C1076
0.1u
C1081
0.01u
C1072
22p
Schematic of RF TXVCO
- 88 -
4. TROUBLE SHOOTING
START
Check TP1
0.5V < TP1 < 2.5V
NO
YES
Check TP2, TP3
If GSM TP2=High , TP3=Low
If DCS/PCS TP2=Low , TP3=High
NO
Check RTR6250
Check Soldering
& MSM6250
YES
Check TP4
2.8V < TP4 < 3.0V
YES
Check TP5, TP6
0dBm < TP5, TP6 < 5dBm
YES
TXVCO(U210) is OK
Check other parts
NO
NO
Check PMIC(U501)
Check Soldering of
TXVCO(U210)
- 89 -
4. TROUBLE SHOOTING
4.6.2 Checking Ant. SW Module
Refer to chapter 3.4
4.6.3 Checking RF Tx level
TP1
TP2
TP3
TP1
Test Point (RF Tx Level)
ANT1001
L1035
4.7nH
C1230
L1034
15nH
15p
ANT
G2
G1
SW1002
RF
KMS-512
C1112
0.5p
ANT1000
C1111
33p
VREG_RFRX_0_2.85V
ANT_SEL0
ANT_SEL1
ANT_SEL2
L1031 7.5nH
C1108
0.1u
FXL4T245BQX
1
14
VCCA
VCCB
7
8
15
GND1
GND2
BGND
13
12
11
10
B0
B1
B2
B3
U1008
_OE
9
T__R
6
A0
A1
A2
A3
4
5
2
3
2
4
11
20
CTRL1
CTRL2
CTRL3
CTRL4
8
UMTS
M054E
U1006
RX_DCS1
RX_DCS2
RX_PCS1
RX_PCS2
RX_EGSM1
RX_EGSM2
12
13
14
15
16
17
TX_DCSPCS
TX_EGSM
3
1
GSM 900 TX
GSM 900 RX/WCDMA
DCS1800/PCS1900 TX
DCS 1800 RX
PCS 1900 RX
ANT_SEL2
LOW
LOW
HIGH
LOW
HIGH
ANT_SEL1 ANT_SEL0
LOW
LOW
HIGH
LOW
HIGH
HIGH
LOW
LOW
LOW
LOW
TP2
L1026
NA
R1050
0
R1049
0
L1025
NA
C1102
68p
C1104
0.01u
C1100
68u
C1098
0.01u
C1070
10u
+VPWR
15
DCS_PCS_OUT
11
GSM_OUT
U1005
DCS_PCS_IN
3
GSM_IN
4
19
RSVD_GND
SKY77328 ENABLE
BS
18
1
100 R1041
R1044 100
C1103
15p
C1101
15p
GSM_PA_EN
GSM_PA_BAND
TP3
GSM/DCS/PCS
Schematic of RF Tx Level
- 90 -
4. TROUBLE SHOOTING
START
Check TP1
If GSM over 31dBm ?
If DCS/PCS over 28dBm ?
NO
Check TP2, TP3
If TP2 over 29dBm ?
If TP3 over 25dBm ?
NO
YES
YES
GSM/DCS/PCS
Tx is Ok
Check other part
Check ANT. SW
Module (U207)
Refer to chapter 3.4
Check PAM Block (U209)
OK ?
Refer to chapter 3.6.4
NO
Check Soldering of
PAM (U209) Block.
If pr oblems stiil exist, replace the
PAM.
NO
Problems resolved?
YES
YES
Check TXVCO (U210)
Refer t o chapter 3.6.1
GSM/DCS/PCS
Tx is OK
NO
Change the Board
- 91 -
4. TROUBLE SHOOTING
4.6.4 Checking PAM Block
PAM Control Signal
TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V,
TP2. GSM_PA_EN : Power Amp Enable
(Power ON : higher than 2.5V , Power OFF : lower than 0.7V)
TP3. GSM_PA_BAND : Power Amp Band Selection Control
(GSM Mode : lower than 0.7V , DCS/PCS Mode : higher than 2.5V)
TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.28V
TP4
TP2
TP1
TP3
Test Point (RF Tx Level)
TP1
L1026
NA
R1050
0
R1049
0
+VPWR
C1104
0.01u
C1100
68u
L1025
NA
C1102
68p
C1098
0.01u
C1070
10u
TP2
TP3
15
DCS_PCS_OUT
11
GSM_OUT
19
RSVD_GND
SKY77328
DCS_PCS_IN
3
U1005
GSM_IN
4
ENABLE
BS
18
1
100
R1041
R1044 100
C1103
15p
C1101
15p
GSM_PA_EN
GSM_PA_BAND
Schematic of PAM block
- 92 -
4. TROUBLE SHOOTING
4.6.5 Checking RF Rx Block
DCS.RX
PCS.RX
GSM.RX
Test Point (RF Rx Level)
L1032 3.3nH
1930-1990 MHz
L1018
3.6nH
L1019
3.6nH
C1088
1000p
L1033 3.3nH
VREG_RFTX_2.85V
C1093
33p
L1029 5.1nH
VREG_RFRX_0_2.85V
925-960 MHz
1805-1880 MHz
L1030 5.1nH
L1027 10nH
L1014
9.1nH
L1015
9.1nH
C1086
1000p
L1016
7.5nH
L1017
7.5nH
C1087
1000p
L1028 10nH
C1089
0.1u
C1092
0.1u
R1037
82
C1083
120p
C1085
1000p
C1084
22n
(PPS)
R1036
R1038
0
R1039
11K (1%)
C1079
82p
33
34
35
36
37
29
30
31
32
38
39
40
41
42
CP_HOLD2
CP2
VDDA9
RX_VCO_IN
R_BIAS
GSM1800_INN
GSM1800_INP
VDDA10
GSM900_INP
GSM900_INN
VDDA11
TX_MOD_CP
VDDA12
TX_VCO_FB
Schematic of GSM/DCS/PCS Rx Block
- 93 -
4. TROUBLE SHOOTING
Set the Phon e Rx is ON
Check soldering
YES
Check
FEM & buffer
YES
Chan ge th e board
NO
NO
Resoldering
Chan ge FEM & buffer
- 94 -
4. TROUBLE SHOOTING
4.7 Bluetooth RF Block
TC-3000A (Bluetooth Tester)
1. Set phone to bluetooth test-mode
: Enter Test Mode(277634#*#)
→ Module Test Set → BT DUT → BT DUT ON
2. Connect phone to bluetooth tester
3. Set channel to 39
4. Measure output-power
5. Check TP1 : output-power > -6 dBm
TP5
TP3
TP4
TP2
TP1
Test Point (Bluetooth Block )
- 95 -
4. TROUBLE SHOOTING
TP1
NA
C591
TP402
C590
2.5p
1p
C592 BT_CLK
1u
TP2
BLUETOOTH
R513
0
R514
0
VREG_MSMP_2.7V
VREG_BT_2.85V
TP3
TP411
TP412
TP413
UART_TXD
UART_RXD
PM_ON_SW_N
U504
9
12
14
CLK_REF SBST
SBCK
SBDT VDD_MSM
VDD_A
SYNC_DET_TX_EN
RX_BB_TX_BB
6
10
11
5
8
2
LDO1
3
LDO2
XTAL_IN
NC
4
13
C514 1000p
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
TCXO_BT
TP4
RB06A
TP5
TCXO_BT_IN
C402
1000p
C401
1000p
R401
100K
2
U400
VCC
5
4
3
GND
TC7S04FU
VREG_BT_2.85V
TCXO_BT
Schematic of Bluetooth RF Block
- 96 -
4. TROUBLE SHOOTING
Set the Phone Rx is ON
NO
TP1 < -6dBm
YES
TP2 > 2.5V
NO
YES
TP3 > 2.8V
NO
YES
@TP4
19.2MHz ?
YES
Repla ce BT module
(U504)
NO
Check BT Antenn a soldering
Replace PCB
Replace PMIC
@TP5
19.2MHz ?
YES
Chan ge U400
NO
Replace PCB
- 97 -
4. TROUBLE SHOOTING
4.8 Power ON Trouble
Power On sequence of U8500 is :
PWR(END) key press -> PM_ON_SW_N go to low(D603),PM6650 KPDPWR_N pin(24) -> PM6650
Power Up -> VREG_MSMC_1.375V(C406), VREG_MSME_1.8V(C408), VREG_MSMP_2.7V(C436),
VREG_MSMA_2.6V(C434), VREG_TCXO_2.85V(C416) power up and system reset assert to MSM ->
Phone booting and PS_HOLD(D400) assert High to PMIC(PM6650).
Start
Battery voltg . higher than 3.28V?
YES
Press PWR key
Keypad LED on?
YES
D603 high to low when key press?
YES
NO
NO
NO
Change or charging the
Battery
Follow the LED trouble shoot
Check the Diode
VREG_MSMC_1.375V,
VREG_MSMP_2.7V, VREG_MSME_1.8V
VREG_TCXO_2.85V,
VREG_MSMA_2.6V
power up?
NO
Change the Main board
YES
Is clock ok?
R413,C402 : 19.2M
X400 : 32.768Khz
YES
Change the Main board
NO
Check the TXCO
- 98 -
4. TROUBLE SHOOTING
19.2MHz(C402)
VREG_MSME_1.8V
VREGC_MSMP_2.7V
VREGC_MSMA_2.6V
VREG_TCXO_2.85V
PM6650
MSM6250
VREG_MSMC_1.375V
19.2MHz(R413)
32.768KHz
- 99 -
4. TROUBLE SHOOTING
4.9 USB Trouble
USB Initial sequence of U8500 is :
USB connected to U8500 -> USB_VBUS(U401 Pin_4) go to 5V -> USB_D+(U401 Pin_1) go to 3.3V ->
48M Crystal on -> USB_DATA(TP_200) is triggered -> USB work.
Start
Cable is insert?
YES
USB_VBUS is about to 5V?
YES
USB_D+ is about to 3.3V?
YES
48M is run?
YES
Change the Main board
NO
NO
NO
NO
Cable insert
Check U401,D401,USB cable
Check U401
Check X200
USB_DATA
(TP200)
USB_D-
USB_D+
USB_VBUS
X200(48MHz)
- 100 -
4. TROUBLE SHOOTING
4.10 SIM Detect Trouble
USB Initial sequence of U8500 is :
VREG_USIM_2.85V(C409 of PM6650) go to 3.0V -> USIM_CLK,USIM_RST,USIM_DATA triggered ->
USIM IF work(Schematic and place are refer to SIM technical brief)
Start
Re-insert the SIM card
Yes
Work well?
No
VREG_USIM_2.85V is 3.0V?
USIM_P_CLK is run?
YES
Change SIM card
NO
Work well?
No
Change the Main board
Yes
End
Check J300,U300
TP208,TP209,
VREG_USIM_2.85V
End
VREG_USIM_2.85V(J300 Pin 1)
U300
USIM_P_RST
(J300 Pin 2)
USIM_P_CLK
(J300 Pin 3)
USIM_P_DATA
(U408 Pin 6)
- 101 -
4. TROUBLE SHOOTING
4.11 Key Sense Trouble
Key Sense sequence of U8500 is :
Default condition ROW(0-4) is 2.7V -> Press the key -> Corresponding row(x) and col(x) go to 0V ->
Key sensing
Start
Change the side key pcb
Work well?
NO
Check the RA600,
R603 with no key press
Yes
ROW(0-4) is 2.7V?
YES
Check the RA600,
R603 with key press
NO
Change the Main board
NO
End
Check RA600,R603
RA600
R603
Side Key
For Camera
Side Key
For Volume
- 102 -
4. TROUBLE SHOOTING
4.12 Camera Trouble
Camera control signals are generated by MSM6250 and directly connected with MSM6250.
Start
Check the camera conn . and reconnect the camera
Yes
Camera is OK?
NO
Check VREG_CAM_2.7V,
VREG_CAM_1.8V
Yes
Check the DSP_CLK
(FB502)
Yes
Change the camera
NO
NO
Yes
Camera is OK
NO
Change the Main board
END
Change the U501
Change the Main board
END
U501(Dual LDO for Camera)
CAM_2.7V
CAM_1.8V
Camera connector
FB502
- 103 -
4. TROUBLE SHOOTING
4.13 Main LCD Trouble
Main LCD control signals are generated by MSM6250. Those signal’s path are :
MSM6250 -> MAIN B’d -> CN600 -> LCD FPCB and LCD Module
START
Press END key to turn the power on
No
Is the circuit powered?
Yes
Disconnect and reconnect the LCD Connector
And check the LCD connector
LCD display OK?
No
Change LCD Module
Yes
Follow the Power ON trouble shooting
Yes
LCD display OK?
No
Change LCD FPCB
Yes
The LCD works LCD display OK?
No
Change Main Board
- 104 -
4. TROUBLE SHOOTING
LCD Control data flow
40pin LCD connector
LCD Module
FPCB for LCD Module
CN600(50pin LCD connector)
- 105 -
4. TROUBLE SHOOTING
4.14 Keypad Backlight Trouble
Key Pad Back Light is on as below :
Key pressing -> KEYD_BACKLIGHT go to about 1V -> LED On
Key Pad Led controlled by PM6650.
Start
Key press
Signal VPWR is OK?
Yes
Signal KEYD_BACKLIGHT is OK?
Yes
NO
NO
Check R607
Change the Main board
R607(VPWR for Key LED)
Signal KYBD_BACKLIGHT
Serial Resister for Key LED control
- 106 -
4. TROUBLE SHOOTING
4.15 Folder ON/OFF Trouble
Folder On/Off(Close/Open) is worked as below :
Folder On/Off Event -> Flip(U600 pin 1) is triggered(Open : about 2.6V, Close : 0V) -> MSM6250
Sense the Folder Flip Event.
Sensing signal is directly connected to MSM6250.
Start
Check the magnet in folder Assy
Yes
Approach the magnet
to U600
NO
Insert the magnet
FLIP(U600 pin 1) is 0V?
Yes
Change the Main b'd
NO
Check the U600
And check the R600 for VREG_MSMP_2.7V
U600(Flip sense IC)
R600(VREG_MSMP_2.7V)
- 107 -
4. TROUBLE SHOOTING
4.16 Camera Direction Detection Trouble
Camera direction detection is worked as below :
Camera direction change Event -> CAM_SENSE(U500 pin out) is triggered as this (Cam front side view : 0V, Cam back side view : about 2.5V) -> MSM6250 Sense the Camera direction change Event
Start
Check the magnet in the mechanics of camera module
And Change the camera direction for front
Yes
CAM_SENSE is 0V?
NO
Check U500 and
VCC of U500
Yes
Sense is OK?
NO
Change the Main B'd
Yes
Sense is OK?
NO
Change the Main B'd
END
Yes
END
This pictureís direction is back side viewing
U500
- 108 -
4. TROUBLE SHOOTING
4.17 Trans Flash Trouble
Trans Flash is worked as below :
Trans Flash insertion -> VREG_MMC_3.0V is 3.0V -> MMC_CD go to High ->
Trans Flash Insertion detecting by MSM6250 -> go working
Start
Check the B -to -B connector for SUB PCB
Insert the Trans Flash Card
Trans Flash insertion
Detection is correct ?
Yes
Change the Main B'd
NO
Check the VREG_MMC_3.0V,MMC_CD signal
Or change the SUB bíd
- 109 -
4. TROUBLE SHOOTING
4.18 Audio Trouble Shooting
4.18.1 Receiver Path
Voice Receiver path as below:
MSM6250 Ear1ON/Ear1OP -> R605,R606 -> CN600(b’d to b’d connector for LCD Module) -> LCD b’d to b’d connector of LCD FPCB -> LCD module -> Receiver
Start
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
Hear the tone to the receiver
NO
Change the Receiver
YES
NO
The sine wave appear at
R605,R606?
YES
The sine wave appear at
Receiver line of LCD FPCB?
NO
Check connector pin or change the LCD FPCB
END
Change the Main board
Can you hear the tone?
YES
END
- 110 -
4. TROUBLE SHOOTING
Receiver
R605,R606(receiver signal serial resistor)
FPCB for LCD Module
CN600(50pin LCD connector)
- 111 -
4. TROUBLE SHOOTING
4.18.2 Voice and Sound Path for Head_set
Voice and Multimedia Sound path for Head_Set as below:
MSM6250 HPH_R, HPH_L -> CN500 pin 17,18 for SUB b;d -> C907,C911 in SUB b’d ->
CN901 headset Jack pin 4,5 in SUB b’d
Start
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
And insert head_Set
Headset insertion detection in the Main LCD Display OK?
YES
The sine wave appear at
CN500 pin 17,18 ?
YES
The sine wave appear at
C907,C911 in SUB b' d?
YES
Can you hear the tone?
YES
END
NO
NO
NO
NO
Check CN901 pin 6 or
Change the SUB b' d
Change the Main board
Check the connector pin or change the SUB b' d
Check the CN901 or change the SUB b' d
- 112 -
4. TROUBLE SHOOTING
CN901
C907,C911
R605,R606(receiver signal serial resistor)
CN600(50pin LCD connector)
- 113 -
4. TROUBLE SHOOTING
4.18.3 Loud Speaker path(voice speaker phone, VT, multimedia play, etc)
Loud speaker path as below:
MSM6250 HPH_R, HPH_L -> C508,C509 -> R506,R507 -> U502,U503(amp) -> R500,R501,
R502,R503 -> CN600 -> LCD FPCB -> Speaker
Start
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
Set phone with speaker Phone mode
The sine wave appear at
C508,C509?
YES
The sine wave appear at
R506,R507?
YES
The sine wave appear at
R500,501,502,503?
YES
The sine wave appear at
Speaker side in FPCB
YES
Can you hear the tone?
YES
END
NO
NO
NO
NO
NO
Change the Main board
Check C508,C509,R506,R507 or
Change the Main board
Check U502,U503
Check the connector or
Change the FPCB
Change the speaker
- 114 -
Loud Speaker
4. TROUBLE SHOOTING
U502,U503(Amp)
- 115 -
4. TROUBLE SHOOTING
4.18.4 Microphone for Main MIC
Main Microphone path as below:
MIC -> C534,C535 -> MSM6250 -> MIC feed back gain logic -> MSM internal CODEC
MIC
MICBIAS
C538
10u
C537
47p
U505
SP0102BE3
G3
PWR
G2
G1
OUT
3
2
1
5
4
0.022u
C534
0.022u
C535
C536
NA
MIC1N
MIC1P
Near to MSM
C533
NA
Start
Make a call
MIC_BIAS(C537) is 1.8V
YES
make some sound or voice to MIC
Can you scoping some sound signal at C534,C535
YES
Change the Main B'd
NO
NO
NO
Change the Main B'd
Change the MIC
Work well?
YES
END
- 116 -
4. TROUBLE SHOOTING
U505
SP0102BE3
G3
PWR
G2
G1
OUT
5
4
3
2
1
MIC
MICBIAS
C538
10u
C537
47p
0.022u
C534
0.022u
C535
C536
NA
MIC1N
MIC1P
C533
NA
- 117 -
U505(MIC for Handset)
4. TROUBLE SHOOTING
4.18.5 Microphone for Head_Set
MIC for Head_Set path as below:
Insert Headset -> EAR_SENSE_N(pin6) go 0V -> MSM6250 sense Head_Set insertion ->
MIC signal go to MSM(C200, C201) by through b-to-b connector
DAUGHTER_HEADSET
R905
2.2K
8
9
10
11
12
5
6
3
4
7
13
CN901
15
17
1
2
14
16
18
C-1827541
C915
10p
C917
10p
10u C914
R903
R907
10K
2.2K
C911 33u
C907 33u
C931
47p
C932
47p
1
D901
6
2
3
UCLAMP0505A
5
4
VREG_MSMP_2.7V
MICBIAS
MIC2P
MIC2N
HP_OUT_L
HP_OUT_R
EAR_SENSE_N
MULTI_ADC
HOOK_SENSE_N
Near to MSM
Start
Make a call
OK
Try change the head set
NO
EAR_SENSE_N is 0V?
Yes
MIC_BIAS is 1.8V ?
Yes
Change the Main B'd
NO
NO
END
Change the SUB b' d
Change the SUB b' d
- 118 -
C200,C201 for
MIC serial capacitor
- 119 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.19 Charger Trouble Shooting
6 5 4
1
C1
2
C2 3
B
6 5 4
1
C1
2
C2 3 B
USB_VBUS
Pass control Tr
(ON)
USB_CNT_N
+5V_PWR
Pass control Tr
(ON)
CHG_CNT_N
ICHARGE
4.2~4.25V
ICHARGEOUT
+VPWR
VBATT
Battery FET
(ON)
BATT_FET_N
USB Cable
(5.0V)
USB Charging control
TA
(4.6V)
TA Charging control
Charging current sensing
Main
Battery
Battery charging control
Charging Procedure
- Connecting TA or USB Cable
- Control the charging current by PM6050 IC using USB_CNT_N or CHG_CNT_N signal
- Charging Current flows into the battery by control BATT_FET_N
Check Point
- Connection of TA or USB Cable
- Charging current path
- Battery
Trouble Shooting Setup
- Connect TA or USB Cable and battery to the phone
Trouble Shooting Procedure
- Check the charger connector
- Check the charging current Path
- Check the battery
- 120 -
4. TROUBLE SHOOTING
Start
Check the pin and battery
Connect terminals of I/O connector
Connection OK?
Yes
Is the TA voltage 4.6V?
Is the USB voltage 5.0V?
Yes
Check the Q402,Q403,Q404
Yes
Charging OK?
NO
Change the board
NO
NO
Yes
Change I/O connector
Change TA/USB cable
END
- 121 -
4. TROUBLE SHOOTING
Q404
Q403
Q402
GND VBATT
- 122 -
5. DOWNLOAD
5. DOWNLOAD
5.1 Introduction
LGMDP is a download tool with capabilities to upload image files to the handset.
LGMDP is desinged to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.
5.2 Downloading Procedure
1) Connecting to PC
1. Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Select a country where the LGMDP will be used. After select the country, click on the “OK” button. The selected country name will be displayed at the bottom of left corner screen. The user can also select the country on the “Preferences” under File menu for later usage.
- 123 -
5. DOWNLOAD
2. For instance, if the selected country is “Italy”, then LGMDP will operate based on the Italy Setting
Values. In this case. the figure shown in the below will be displayed.
3. LGMDP User Guide for U8500 7/32 Click on the “Select Port” and check if state shows “Enable” for the port in the “Select Port” window. The current security status will be displayed under Security column. Make sure that the selected country is valid. If the selected country is invalid, select the country name again. Integrity is automatically checked for the following country. Italy, United
Kingdom, Hong Kong, and Austria. Integrity + Ciphering is checked for Australia, Sweden, and
Denmark. Then click on the “Connect” button. (The port number(COM4) shall be different from that of the port number in the snapshot.)
- 124 -
5. DOWNLOAD
4. The status “Ready” is displayed when the application is ready for downloading.
While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed.
U8500
Function Description
1) Image Folder indicates location where all image files are placed.
2) Image files to be downloaded.
3) NV Backup/Restore: NV Backup/Restore always have to be done.
Store and Backup the Calibration data
4) Reset Database: Reset the setting and data in the phone
5) Reset Contents: Erasing the content in the phone
6) Additional Options: It is internal to LGE.
7) Clear: Clearing all directory paths of images in the dialog.
8) Start : Starting downloading.
U8500
1)
2)
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3)
6)
4)
5)
8)
7)
- 125 -
5. DOWNLOAD
2) Choosing image files
1. Select the image folder, where all the image files are located, by clicking on the “Browse...” button.
(The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.)
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2. Select the path, where AMSS Modem Image file is located by clicking on the “Browse...” button.
Make sure that you have chosen correct file. In case of wrong AMSS Modem file is selected, the phone may not work.
(The file name shall be different from that of the file name in the snapshot.)
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- 126 -
5. DOWNLOAD
3. Select the path, where Media Image file is located by clicking on the “Browse...” button. Make sure that you have chosen the right media image file.
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- 127 -
5. DOWNLOAD
4. Confirm the information on the message box.
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Caution) Application will popup Error message if you choose improper file.
- 128 -
5. Choose a Module Image file after clicking on the “Browse...” button.
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5. DOWNLOAD
- 129 -
5. DOWNLOAD
6. Confirm the information on the message box.
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Caution) Application will popup Error message if you choose improper file.
7. Click on the “START” button to download.
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- 130 -
5. DOWNLOAD
3) Downloading
This is whole process for downloading. You will see snapshots for each step in the succeeding slides .
Download Start
(NV Backup)
Erase MODULE directory
(Erase EFS)
(NV Restore)
Reset
Erase MEDIA directory
Download MEDIA
Download MODULE
Reset
Download MODEM
Download End
Reset
<Download process>
- 131 -
5. DOWNLOAD
• This message box informs that a new file for
NV backup will be created in the mentioned local directory as shown.
• NV backup in progress.
• Erasing the existing directories and files before the Module Image is downloaded.
- 132 -
5. DOWNLOAD
• Downloading the AMSS Modem image
• Rebooting and waiting for a while
• Performing NV restore
- 133 -
5. DOWNLOAD
• Rebooting the phone and waiting for a while
• Erasing the existing directories and files before downloading the Media Image
• Download of Media image in progress
- 134 -
5. DOWNLOAD
• Download of Module image in progress
• Download process has completed successfully
- 135 -
5. DOWNLOAD
5.3 Troubleshooting Download Errors
1) When the phone does not work after downloading has been completed.
2) Media Erasing Error
3) NV Restore Error
• Reboot the phone in the emergency mode (Simultaneously press “2”, “5” and “PWR” red keys) and then try to download all the images again including AMSS Modem, Media, and Module image. This is emergency download process.
• The phone supports a special mode named emergency mode. In this mode, minimum units for downloading is running so that users can download the images again in case of emergency situation.
(AMSS Modem, Media and Module Images can not be running in this mode.)
When the phone does not work
1. Port selection parameters when phone is booted in Emergency mode.
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- 136 -
5. DOWNLOAD
MEDIA Erasing error
1. Snapshot showing the “MEDIA Erasing error” before downloading the Media Image.
Next slide shows the remedial procedure to adopt.
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2. Reboot the phone and then try to download only the Media and Module images again. Both Media and Moule Image have to be downloaded at the same time.
- 137 -
5. DOWNLOAD
NV Restore error
1. Snapshot showing the “NV Restore error”. Next slide shows the remedial procedure to adopt.
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2. Connect the handset and Press the Connect button in the Select Port window.
(Enable state in the window indicates that the Phone has been detected and is ready to download.)
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- 138 -
5. DOWNLOAD
3. Click on “NV Restore”. A list of NV Backup files(*.nv2) will be shown. These files were saved everytime NV Backup option was selected. The name is based on the time when NV Backup was done.
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4. Select the appropriate file and click on “Restore”.
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- 139 -
5. DOWNLOAD
5. Snapshot showing the error, Reading the NV file and restore NV.
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1) Not recommended that multi-downloading using the USB hub.
2) Recommended that the Module and Media Image have to be downloaded at the same time.
3) “Erase EFS” option will erase everything (media, module, NV Items and user data) in the EFS area.
- 140 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
6.1 BLK diagram
USIM
PM6650
BLUETOOTH
GSM TX
GSM
Quadband
PA
GSM
Quad
TX VCO
E
X
E
R
D
U
P
L
ASM
SP7T
GSM RX
GSM
900/1800/1900
RX FILTER
WCDMA TX
UMTS
PA
UMTS
TX
FILTER
WCDMA RX
RTR6250
UMTS
RX
FILTER
RFR6250
MSM6250
Amp
SPEAKER
SPEAKER
RECEIVER
MIC
EAR
JACK(12pin)
1.3M
CAMERA
MAIN
LCD
SUB
LCD
SDRAM +
NAND
Trans-Flash
CARD
- 141 -
6. BLOCK DIAGRAM
6.2 GSM & WCDMA RF Block
MSM6250 tls SBI & c logic
T DE PH
SW
UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram
- 142 -
6. BLOCK DIAGRAM
Block
Common
Bluetooth
WCDMA
GSM
ANT500
FL1000
FL1001
U1000
FL1002
U1002
U1004
U1001
U1005
U1003
Ref. Name
U1006
SW1002
X1000
U504
Part Name
M054E
KMS512
TG5001LA-19.2MHz
RB06A
-
ACMD7601
LN04A
RFR6250
EFCH1950TDC1
SKY77410
RTR6250
LMV225TLX
SKY77328
MQW5V0C869M
Function
FrontEnd Module
Test Connector
VCTCXO
Bluetooth RF
Transceiver
Antenna
Duplexer
RX SAW Filter
RF Receiver IC
TX SAW Filter
TX PAM
RF Transceiver IC
Power Detect
TX Dual PAM
VCO
Comment
ASM+Rx saw
Calibration, etc
19.2MHz
Bluetooth TRX
Bluetooth antenna
TRX
RX
RX
TX
TX
TRX
TX
TX
Dual TX VCO
RF Block Component
- 143 -
6. BLOCK DIAGRAM
6.3 Interface Diagram
U8500 Interface Diagram
- 144 -
6. BLOCK DIAGRAM
Main RF signal (black)
GSM TX : GSM Tx RF signal
GSM RX : GSM Rx RF signal
DCS TX : DCS Tx RF signal
DCS RX : DCS Rx RF signal
PCS TX : PCS Tx RF signal
PCS RX : PCS Rx RF signal
UMTS TX : UMTS Tx RF signal
UMTS RX : UMTS Rx RF signal
TX_I/Q : I/Q for Tx of RF
RX_I/Q : I/Q for Rx of RF
Control signal(red)
ANT_SEL 0,1,2 : Ant Switch Module Mode Selection
(WCDMA, GSM Tx/Rx, DCS Tx/Rx, PCS Tx/Rx)
GSM PA_CTL signal
GSM_PA_BAND : DCS or PCS /GSM Mode Selection
GSM_PA_EN : Power Amp Gain Control Enable
GSM_PA_RAMP : Power Amp Gain Control
GSM/DCS_VCO_EN
GSM_VCO_EN : GSM band Tx VCO Enable
DCS_VCO_EN : DCS band Tx VCO Enable
UMTS PA_CTL signal
PA_ON : WCDMA Tx Power Amp Enable
PA_RANGE0 : WCDMA Tx Power Amp Gain Control
TRK_LO_ADJ : TCXO(19.2M) Control
UHF_VCO_BAND_SEL : WCDMA(3G)/GSM(2G) VCO Band Selection of UHF VCO
- 145 -
- 146 -
7. CIRCUIT DIAGRAM
ANT1000
ANT1001
L1035
4.7nH
C1230
L1034
15nH
15p
G2
ANT
G1
SW1002
RF
KMS-512
C1112
0.5p
VREG_RFRX_0_2.85V
ANT_SEL0
ANT_SEL1
ANT_SEL2
L1031 7.5nH
C1108
0.1u
FXL4T245BQX
1
VCCA
14
VCCB
7
8
15
GND1
GND2
BGND
13
12
11
10
B0
B1
B2
B3
U1008
_OE
9
T__R
6
A0
A1
A2
A3
4
5
2
3
C1111 33p
11
20
2
4
CTRL1
CTRL2
CTRL3
CTRL4
8
UMTS
M054E
U1006
RX_DCS1
RX_DCS2
RX_PCS1
RX_PCS2
RX_EGSM1
RX_EGSM2
12
13
14
15
16
17
TX_DCSPCS
TX_EGSM
3
1
L1026
NA
R1050
0
R1049
0
L1025
NA
C1102
68p
C1104
0.01u
C1100
68u
C1098
0.01u
C1070
10u
15
DCS_PCS_OUT
11
GSM_OUT
19
RSVD_GND
U1005
SKY77328
GSM 900 TX
GSM 900 RX/WCDMA
DCS1800/PCS1900 TX
DCS 1800 RX
PCS 1900 RX
ANT_SEL2
LOW
ANT_SEL1 ANT_SEL0
LOW HIGH
LOW
HIGH
LOW
HIGH
LOW
HIGH
HIGH
LOW
LOW
LOW
LOW
LOW
GSM_PA_BAND
LOW
HIGH
MODE
GSM
DCS/PCS
DCS_PCS_IN
3
GSM_IN
4
ENABLE
BS
18
1
+VPWR
100 R1041
R1044 100
C1103
15p
C1101
15p
GSM_PA_EN
GSM_PA_BAND
R1027
24
R1032
15
GSM900
DCS1800/PCS1900
OFF
TX_VCO_EN_0_N
HIGH
LOW
HIGH
TX_VCO_EN_1_N
LOW
HIGH
HIGH
R1034
51
L1032 3.3nH
DAC_REF
L1018
3.6nH
TX_IM
TX_IP
1930-1990 MHz
L1019
3.6nH
C1088
1000p
L1033 3.3nH
VREG_RFTX_2.85V
C1093
33p
C1091
0.1u
R1022
10
VREG_RFTX_2.85V
L1029 5.1nH
VREG_RFRX_0_2.85V
C1089
0.1u
L1016
7.5nH
C1052
0.1u
1805-1880 MHz
925-960 MHz
L1030 5.1nH
L1027 10nH
L1028 10nH
8
12
13
14
MQW5V0C869M
10
VC
1
5
OUT_GSM
OUT_DCSPCS
U1003
VB
3
SW1
SW2
9
11
GND5
GND6
GND7
GND8
GND1
GND2
GND3
GND4
6
7
2
4
L1014
9.1nH
L1015
9.1nH
C1086
1000p
L1017
7.5nH
C1087
1000p
R1037
82
C1083
120p
C1092
0.1u
C1085
1000p
C1084
22n
(PPS)
FB1000
R1025
R1036
47
VREG_RFTX_2.85V
100
R1026 100
GSM_TX_VCO_0_EN_N
GSM_TX_VCO_1_EN_N
R1030
VREG_MSMP_2.7V
51
VREG_RFTX_2.85V
C1073
10u
C1077 C1080
0.1u
100p
R1038
0
R1039
11K (1%)
C1079
82p
33
34
35
36
37
29
30
31
32
38
39
40
41
42
CP_HOLD2
CP2
VDDA9
RX_VCO_IN
R_BIAS
GSM1800_INN
GSM1800_INP
VDDA10
GSM900_INP
GSM900_INN
VDDA11
TX_MOD_CP
VDDA12
TX_VCO_FB
C1076
0.1u
C1081
0.01u
C1072
22p
RF_ON_TX_ON
C1078
100p
RTR6250
U1004
C1074
33p
C1075
4700p
R1017
1K
RX_IN
RX_IP
RX_QN
RX_QP
VDDA4
VCO_TUNE
VTUNE_REF
VDDA3
TCXO
VDDA2
VDDA1
FAQ1
CP1
CP_HOLD1
7
6
14
13
12
11
10
9
8
3
2
1
5
4
C1042
33p
TX_AGC_ADJ
R1018
6.2K
C1044
0.01u
RX_IM
RX_IP
RX_QM
RX_QP
R1019
6.2K
C1046
3.9n
(PPS)
C1040
390p
C1035
100p
C1039
0.1u
C1057
0.1u
C1064
1u
C1059
0.1u
TX_QM
TX_QP
VREG_SYNTH_2.85V
R1024
C1062
47p
10
C1061
33p
VREG_RFTX_2.85V
VREG_RFTX_2.85V
VREG_RFTX_2.85V
GSM/DCS/PCS
WCDMA
C1001
27p
5.6nH
L1002
12p C1113
C1114
NA
SKY77410
U1002
11
RF_OUT
TX_AGC_ADJ
R1011
270
C1028
0.01u
+VPWR
C1037
0.01u
ANT
G1
G2
G3
G4
G5
G6
G7
1.8K
R1013
PA_ON
C1031 100p
R1012
10K
C1008 12p
R1003
0
HDET
A1
U1001 LMV225TLX
A2
RFIN_EN VDD
B1
GND OUT
B2
L1001 2.7nH
L1004
ILNA_OUT
100nH
C1043
1.2p
C1045
680p
C1032
0.01u
C1030
1200p
RF_IN
3
TR1000
UMC4N
C1007
27p
C1026
10u
VREG_W_PA
PA_ON
VREG_RFTX_2.85V
VREG_RFTX_2.85V
HDET1
C1215
12p
C1034
NA
R1015
0
FL1002
EFCH1950TDC1
G3
4 1
OUT
G2 G1
IN
5 2
R1031
0
C1082
5.6p
L1013
8.2nH
IMT_RX_P
IMT_RX_M
17
18
19
20
21
22
23
24
13
14
15
16
PLNA_OUT
ILNA_OUT
PLNA_BIAS
PLNA_IN
ILNA_BIAS
ILNA_IN
VDDRF3
RX_IP
RX_IM
RX_QP
RX_QM
VDDA2
EUSY0246001
U1000
PGND
GLNA_BIAS
GLNA_IN
R_BIAS
VDDA8
SBST
SBDT
SBCK
VDDM
GRX_IP
GRX_IM
GRX_QP
GRX_QM
40
39
38
37
45
44
43
42
41
49
48
47
46 R1008
11K
VREG_TCXO_RFR
VREG_TCXO_RFR
C1051
10p
10u 0.1u
C1013
5p
C1023
10p
SBST
SBDT
SBCK
R1009
C1020
10p
51
C1019
1u
VREG_MSMP_2.7V
ILNA_OUT
C1047
8.2p
L1005
2.2nH
R1048
0
FL1001
2
G1
3
O1
1
IN
G2 O2
LN04A 5 4
C1021
0.1u
C1053
100p
C1055 33p
L1007
33nH
C1060 0.1u
L1011
3.9nH
C1054 33p
L1010
3.9nH
4.7
R1021
C1063
10u
IMT_RX_P
C1010
1000p
IMT_RX_M
VREG_TCXO_2.85V
C1009
1000p
C1004
1000p
C1003
0.1u
19.2MHz
4
VCC
X1000
GND
2
OUT VCONT
3 1
TG-5001LA-19.2MHz
VREG_TCXO_2.85V
R1002
100
C1005
0.01u
TRK_LO_ADJ
C1011 100p
TCXO_PM
TCXO_BT_IN
VREG_RFTX_2.85V
R1040
80.6K
(1%)
RT1000
R1043
470K
(1%)
68K
C1097
0.068u
PA_THERM
U8500
VREG_RFRX_1_2.85V
C1049
0.1u
C1058
0.1u
C1048
10p
C1056
10p
C1014
0.1u
C1012
100p
RX_QM
RX_QP
RX_IM
RX_IP
R1004
0
C1016
470p
C1017
3.9n
C1018
0.01u
- 147 -
7. CIRCUIT DIAGRAM
< USB 48M CLK >
27p C202
CS325
48MHz
27p C203
X200
USB_XTAL_IN
USB_XTAL_OUT
SDRAM_ADDR(0:14)
SDRAM_DATA(0:31)
EBI2_DATA(0:15)
LCD_CS_N
NAND_CLE
NAND_CS_N
EBI2_OE_N
EBI2_WE_N
NAND_ALE
NAND_READY
EBI2_DATA(15)
EBI2_DATA(14)
EBI2_DATA(13)
EBI2_DATA(12)
EBI2_DATA(11)
EBI2_DATA(10)
EBI2_DATA(9)
EBI2_DATA(8)
EBI2_DATA(7)
EBI2_DATA(6)
EBI2_DATA(5)
EBI2_DATA(4)
EBI2_DATA(3)
EBI2_DATA(2)
EBI2_DATA(1)
EBI2_DATA(0)
SDRAM_DATA(31)
SDRAM_DATA(30)
SDRAM_DATA(29)
SDRAM_DATA(28)
SDRAM_DATA(27)
SDRAM_DATA(26)
SDRAM_DATA(25)
SDRAM_DATA(24)
SDRAM_DATA(23)
SDRAM_DATA(22)
SDRAM_DATA(21)
SDRAM_DATA(20)
SDRAM_DATA(19)
SDRAM_DATA(18)
SDRAM_DATA(17)
SDRAM_DATA(16)
SDRAM_DATA(15)
SDRAM_DATA(14)
SDRAM_DATA(13)
SDRAM_DATA(12)
SDRAM_DATA(11)
SDRAM_DATA(10)
SDRAM_DATA(9)
SDRAM_DATA(8)
SDRAM_DATA(7)
SDRAM_DATA(6)
SDRAM_DATA(5)
SDRAM_DATA(4)
SDRAM_DATA(3)
SDRAM_DATA(2)
SDRAM_DATA(1)
SDRAM_DATA(0)
LCD_ADS
SDRAM1_D[31]
SDRAM1_D[30]
SDRAM1_D[29]
SDRAM1_D[28]
SDRAM1_D[27]
SDRAM1_D[26]
SDRAM1_D[25]
SDRAM1_D[24]
SDRAM1_D[23]
SDRAM1_D[22]
SDRAM1_D[21]
SDRAM1_D[20]
SDRAM1_D[19]
SDRAM1_D[18]
SDRAM1_D[17]
SDRAM1_D[16]
SDRAM1_D[15]
SDRAM1_D[14]
SDRAM1_D[13]
SDRAM1_D[12]
SDRAM1_D[11]
SDRAM1_D[10]
SDRAM1_D[9]
SDRAM1_D[8]
SDRAM1_D[7]
SDRAM1_D[6]
SDRAM1_D[5]
SDRAM1_D[4]
SDRAM1_D[3]
SDRAM1_D[2]
SDRAM1_D[1]
SDRAM1_D[0]
G2
J6
J8
H6
G4
J1
K6
J2
J4
H1
H4
E1
F4
W4
V6
Y2
Y1
W2
W1
V4
U6
L6
L8
K4
R8
T2
T1
R6
R4
T8
T6
T4
AA14
AF14
XMEM2_CS_N[1]
LCD2_CS_N_GPIO[38]
AE4
W14
AF7
AF4
AC5
AE16
NAND2_CLE_UB2_N
NAND2_CS_N_XMEM2_CS_N[0]
OE2_N_NAND2_RE_N
WE2_N
LB2_N_NAND2_ALE_A2[0]
NAND2_FLASH_READY_GPIO[33]
W9
AA8
AC7
AF5
AC6
AE5
AA7
AF3
AD1
AB4
AC9
AF8
AE8
AC8
AE7
AA9
EBI2_DATA[15]
EBI2_DATA[14]
EBI2_DATA[13]
EBI2_DATA[12]
EBI2_DATA[11]
EBI2_DATA[10]
EBI2_DATA[9]
EBI2_DATA[8]
EBI2_DATA[7]
EBI2_DATA[6]
EBI2_DATA[5]
EBI2_DATA[4]
EBI2_DATA[3]
EBI2_DATA[2]
EBI2_DATA[1]
EBI2_DATA[0]
AA15
AC13
AF13
AE13
AA13
W13
T13
AC12
AA12
AF11
AE11
W12
AC11
AA11
W11
AC10
AF9
AA10
AE9
W10
EBI2_ADD[20]_GPIO[34]
EBI2_ADD[19]
EBI2_ADD[18]
EBI2_ADD[17]
EBI2_ADD[16]
EBI2_ADD[15]
EBI2_ADD[14]
EBI2_ADD[13]
EBI2_ADD[12]
EBI2_ADD[11]
EBI2_ADD[10]
EBI2_ADD[9]
EBI2_ADD[8]
EBI2_ADD[7]
EBI2_ADD[6]
EBI2_ADD[5]
EBI2_ADD[4]
EBI2_ADD[3]
EBI2_ADD[2]
EBI2_ADD[1]
PCB_Rev_ADC
U200-1
MSM6250_A
R200
680K
R201
150K
VREG_MSMP_2.7V
Near to MSM
MICFBP
MICINN
MICOUTP
C246 0.1u
470K
R216
MICOUTN
MICINP
MICFBN
C244 0.1u
C247 0.1u
C248 0.015u
180K
R215
C240 0.015u
180K
C245 0.1u
R214
SBCK1_GPIO[0]
SBDT1_GPIO[1]
PA_ON[1]_GPIO[2]
ANT_SEL3_N_GPIO[12]
GP_MN_GPIO[13]
GPS_TCXO_GPIO[28]
USB_RX_DATA_GPIO[29]
XMEM2_CS_N[2]_GPIO[35]
XMEM2_CS_N[3]_GPIO[36]
LCD2_EN_GPIO[37]
ETM_PIPESTAT1B_GPIO[43]
ETM_TRACESYNC_GPIO[65]
BACKLIGHT_ETM_TRACECLK_GPIO[66]
XMEM1_CS_N[1]_GPIO[76]
SDRAM1_CS_N[1]_XMEM1_CS_N[3]_GPIO[77]
UART3_RFR_N_GPIO[87]
UART2_DP_RX_DATA_USIM_PWR_EN_GPIO[89]
GP_PDM[0]_GPIO[92]
SBST1_GPIO[93]
H25
G26
A19
D5
H21
A5
N23
AC15
AF16
T14
H9
D18
F8
AB1
Y6
L25
C1
F19
H18
R270
NA
TP203
TX_AGC_ADJ
TRK_LO_ADJ
TCXO_EN_GPIO[94]
PA_ON[0]
L14
H14
F18
B19
TP201
Q_OUT_N
Q_OUT
I_OUT_N
I_OUT
A13
B13
A14
B14
Q_IM_CH1(Reserved)
Q_IP_CH1(Reserved)
I_IM_CH1(Reserved)
I_IP_CH1(Reserved)
Q_IM_CH0
Q_IP_CH0
I_IM_CH0
I_IP_CH0
U21
U23
V25
W26
Y25
Y26
V21
W21
LCD_MAKER_ID
LCD_LDO_EN
CAM_IF_PROBE
LCD_RESET_N
MMC_CD
HOOK_SENSE_N
EAR_SENSE_N
CAM_P_DOWN
ON_SW_N
CAM_PWR_EN
LCD_IF_MODE
NAND_WP_N
LCD_BACK_EN
SPK_AMP_EN
TCXO_EN
TX_QM
TX_QP
TX_IM
TX_IP
RX_QM
RX_QP
RX_IM
RX_IP
PA_RANGE[1]_GP_PDM[2]
PA_RANGE[0]_GP_PDM[1]
A20
H17
H15
D16
F15
D15
F16
H16
GRFC[14]_GPIO[83]
GRFC[13]_GPIO[82]
GRFC[12]_GPIO[81]
GRFC[11]_GPIO[80]
GRFC[10]_TX_ON
ANT_SEL2_N_GPIO[11]
ANT_SEL1_N_GPIO[10]
ANT_SEL0_N_GPIO[9]
TX_VCO_0_EN_N_GPIO[8]
TX_VCO_1_EN_N_GPIO[7]
UHF_BAND_SEL_GPIO[6]
GSM_PA_BAND_GPIO[5]
GSM_PA_EN_GPIO[4]
UHF_VCO_0_EN_GPIO[3]
B4
T23
R19
D11
H10
F10
D9
A8
B8
BT_CLK_GPIO[25]
BT_SBST_GPIO[24]
BT_SBCK_GPIO[23]
BT_SBDT_GPIO[22]
BT_TX_RN_N_GPIO[21]
BT_DATA_GPIO[20]
G23
F23
E26
E25
G21
D26
J25
K23
J26
K19
H12
TP204
FOLDER_DETECT
RF_ON_TX_ON
ANT_SEL2
ANT_SEL1
ANT_SEL0
BT_CLK
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
1K R206
2K R207
PA_ON
C226 C225
0.01u
33n
TX_AGC_ADJ
TRK_LO_ADJ
VREG_MSMP_2.7V
PA_R0
VREG_MSMP_2.7V
GSM_TX_VCO_0_EN_N
GSM_TX_VCO_1_EN_N
GSM_PA_BAND
GSM_PA_EN
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
A1
A2
A25
A26
B1
B2
B3
B24
B25
B26
C2
C25
D4
D23
F6
F21
H8
H19
K10
L11
L12
L16
L15
M11
M12
M13
M14
M15
M16
N12
N13
N14
N15
P12
P13
U200-2
MSM6250_B
DAC_REF
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
W19
AA6
AA21
AA25
AC4
AC23
AD2
AD25
AE1
AE2
AE3
AE17
AE21
AE24
AE25
AE26
AF1
AF2
AF25
AF26
P14
P15
R11
R12
R13
R14
R15
R16
T11
T12
T15
T16
U25
W8
MODE_1
WDOG_EN
BOOT_MODE
U8500
- 148 -
7. CIRCUIT DIAGRAM
SDRAM_DATA(0:31)
EBI2_DATA(0:7)
SDRAM_DATA(0)
SDRAM_DATA(1)
SDRAM_DATA(2)
SDRAM_DATA(3)
SDRAM_DATA(4)
SDRAM_DATA(5)
SDRAM_DATA(6)
SDRAM_DATA(7)
SDRAM_DATA(8)
SDRAM_DATA(9)
SDRAM_DATA(10)
SDRAM_DATA(11)
SDRAM_DATA(12)
SDRAM_DATA(13)
SDRAM_DATA(14)
SDRAM_DATA(15)
SDRAM_DATA(16)
SDRAM_DATA(17)
SDRAM_DATA(18)
SDRAM_DATA(19)
SDRAM_DATA(20)
SDRAM_DATA(21)
SDRAM_DATA(22)
SDRAM_DATA(23)
SDRAM_DATA(24)
SDRAM_DATA(25)
SDRAM_DATA(26)
SDRAM_DATA(27)
SDRAM_DATA(28)
SDRAM_DATA(29)
SDRAM_DATA(30)
SDRAM_DATA(31)
SDRAM_DQM(0)
SDRAM_DQM(1)
SDRAM_DQM(2)
SDRAM_DQM(3)
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
M11
M13
L10
L12
J9
H12
H10
G12
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC11
NC12
NC13
NC14
NC15
NC16
NC17
NC18
NC19
NC20
NC21
NC22
NC23
NC24
NC25
NC26
NC27
NC28
NC29
B1
B2
B3
B4
B11
B12
B13
B14
C1
C2
C5
C13
C14
D1
D14
E1
E7
E8
E9
E10
E11
A1
A2
A3
A4
A11
A12
A13
A14
TP300
TP310
U4
T4
T5
V5
U5
TP303
U12
P3
TP322
R3
P4
R4
P5
R5
P6
R6
P9
P10
R10
P11
R11
P12
R12
R13
T6
V6
U7
T9
T10
V10
T11
U11
V11
T12
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
TP321 U8
T8
TP324 V7
U9
DQM0
DQM1
DQM2
DQM3
MEMORY
U301
TY9000AC10AOGG
USIM
L6
M2
D8
C4
D4
K6
D5
D6
E6
C8
E5
D7
M3
M4
M9
M10
_WPN
_WEN
_RAS
_WED
_CAS
CLK
_CS0
_CS1
ALE
CLE
_CEN
_REN
R__BN
CKE
BA0
BA1
A9
A10
A11
A12
A0
A1
A2
A3
A4
A5
A6
A7
A8
C3
D3
E3
E2
D12
C12
D11
C11
D10
C10
E4
D9
C9
VCCD1
VCCD2
VCCD3
VCCD4
VCCD5
VCCD6
C7
D2
D13
V3
V8
V12
VCCQD1
VCCQD2
V4
V9
VCCN1
VCCN2
J12
K12
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
C6
F7
G2
G13
L13
P2
P13
R8
U2
U6
U10
U13
NC71
NC72
NC73
NC74
NC75
NC76
NC77
NC78
NC79
NC80
NC81
NC82
NC83
NC84
NC85
NC86
NC87
NC88
NC89
K4
K5
K9
K10
K11
K13
K14
L1
L2
L3
L4
L5
L9
L11
L14
M5
M6
M12
N2
TP320
TP323
TP325
TP317
TP312
TP306
TP308
SDRAM_ADDR(0)
SDRAM_ADDR(1)
SDRAM_ADDR(2)
SDRAM_ADDR(3)
SDRAM_ADDR(4)
SDRAM_ADDR(5)
SDRAM_ADDR(6)
SDRAM_ADDR(7)
SDRAM_ADDR(8)
SDRAM_ADDR(9)
SDRAM_ADDR(10)
SDRAM_ADDR(11)
SDRAM_ADDR(12)
R370
EBI2_WE_N
SDRAM_RAS_N
SDRAM_WE_N
SDRAM_CAS_N
SDRAM_CLK
SDRAM_CS_N(0)
R301 100K
SDRAM_ADDR(0:12)
0
NAND_WP_N
RESOUT_N
VREG_MSMP_2.7V
NAND_ALE
NAND_CLE
EBI2_OE_N
SDRAM_CLK_EN
SDRAM_ADDR(13)
SDRAM_ADDR(14)
R305
0
NAND_CS_N
NAND_READY
VREG_MSME_1.8V
USIM_P_DATA
R300
0
VREG_MSMP_2.7V
USIM_P_DATA
VREG_USIM_2.85V
JTAG_TDI
JTAG_TMS
JTAG_TRST_N
RESET_IN_N
JTAG_TCK
JTAG_PS_HOLD
JTAG_RTCK
JTAG_TDO
MODE_1
R303
4.7K
4
5
6
GND
VPP
I_O
J300
VCC
RST
CLK
1
2
3
6
5
4
U300
1
2
3
RCLAMP0504F
USIM_P_CLK
USIM_P_RST_N
UART2
2.5G
3G
5
6
3
4
1
2
9
10
7
8
11
12
GND
VBAT
NC2
NC3
GND
RX
TX
RX
TX
NC1 UFLS
ON_SW ON_SW
VBAT
PWR
URXD
UTXD
NC4
DSR
RTS
CTS
USB_D+
USB_D-
USB_VBUS
VBATT
PM_ON_SW_N
UART_TXD
UART_RXD
VREG_USIM_2.85V
USIM_P_RST_N
USIM_P_CLK
OJ1000 OJ3000 OJ4000
6
5
4
3
2
1
12
11
10
9
8
7
CTS
RTS
DSR
NC4
NC3
UTXD
URXD
NC2
VBAT
PWR
VBAT
ON_SW ON_SW
NC1
TX
RX
GND
UFLS
TX
RX
GND
2.5G
3G
UART1
U8500
- 149 -
7. CIRCUIT DIAGRAM
LCD_LDO_EN
+VPWR
1
2
3
U411
STBY
GND
VIN
BH28FB1WHFV
NC
5
BGND
6
4
VOUT
0 R412
VREG_LCD_2.8V
VREG_MSMP_2.7V
C419
33u
+VPWR
+5V_PWR
1u
C427
1005
USB_VBUS
C415
0.1u
ICHARGE
CHG_CNT_N
ICHARGEOUT
VBATT
BATT_FET_N
RESET_IN_N
C412 1u
USB_OE_N
D401 USB_CNT_N
4.7u
C450
RB521S-30
USB_DAT
USB_D+
USB_SE0
USB_D-
VBAT_TEMP
R408
C413
47K
1u
KYBD_BACKLIGHT
PM_ON_SW_N
MOTOR_PWR-
USIM_P_DATA
+VPWR
VREG_PA
10
11
12
6
7
8
9
4
5
1
2
3
17
18
19
20
21
13
14
15
16
ADC_BYP
VCHG
ISNS_P
CHG_CTL_N
ISNS_M
VBAT
BAT_FET_N
FLSH_DRV_N
PON_RESET_N
VREG_USB
USB_ID
VREG_5V
USB_OE_N
VSW_5V
USB_CTL_N
USB_VBUS
USB_DAT
USB_D_P
USB_SE0
USB_D_M
GP1_DRV_N(MPP7)
R460
10K
C411
4.7u
1608 smd_2520h1_6_r
4.7uH
L400
C404
1000p
R403
0
Q400
SI8402DB
PA_FET_N
Q401
SI8407DB-T2-E1
VREG_PA +VPWR
C400
10u
U402
PM6650
VREG_W_PA
100K
R402
R400
C403
0.1u
1K
PA_FET_N
REF_BYP
REF_GND
REF_ISET
VCOIN
MSM_INT_N
TCXO_IN
PS_HOLD
VREG_MSMA
TCXO_EN
VDD_ANA
TCXO_OUT
VDD_MSM
SBST
VREG_MSMP
SBCK
VBACKUP
SBDT
XTAL_OUT
SLEEP_CLK
XTAL_IN
RUIM_RST(MPP6)
55
54
53
52
60
59
58
57
56
63
62
61
51
50
49
48
47
46
45
44
43
51
0.1u
R414
TP400
R413
C431
121K
PM_INT_N
TCXO_PM
TCXO_EN
+VPWR
BUFF_TCXO
+VPWR
PM_SBST
PM_SBCK
1u C437
V_BACK_UP
PM_SBDT
TP401
SLEEP_CLK
USIM_P_RST_N
C435
27p
C438
27p
4
X400
1
R416 470K
RB521S-30
D400
4.7u
C434 smd_1608h_9_r
0
3
2
MC-146_12.5pF
32.768KHz
R415
JTAG_PS_HOLD
PS_HOLD
VREG_MSMA_2.6V
VREG_MSMP_2.7V
C432
2.2u
C409
2.2u
+VPWR
USIM_RST_N
USIM_P_CLK
USIM_CLK
USIM_DATA
VREG_USIM_2.85V
VREG_MMC_3.0V
TCXO_BT_IN
C402
1000p
C401
1000p
R401
100K
2
U400
VCC
5
4
3
GND
TC7S04FU
VREG_BT_2.85V
TCXO_BT
USB_D-
USB_VBUS
6
5
4
U401
1
2
3
RCLAMP0504F
USB_D+
USB_VBUS
6 5 4
1
C1
2
C2 3
B
6 5 4
1
C1
2
C2 3 B
USB_CNT_N
+5V_PWR
CHG_CNT_N
ICHARGE
ICHARGEOUT
+VPWR
VBATT
BATT_FET_N
U8500
- 150 -
7. CIRCUIT DIAGRAM
+VPWR
CAM_PWR_EN
C503
1u
CAM_LDO
C502
0.01u
1
U501
VIN
2
EN1
3
EN2
4
BYP
5
NC1
MIC2211-LGYML
VOUT1
10
VOUT2
9
NC3
8
NC2
GND
BGND
7
6
11
VREG_MSMP_2.7V
C500
1u
C501
1u
VREG_CAM_2.7V
VREG_CAM_1.8V
CAM_DATA(7)
CAM_DATA(6)
I2C_SDA
CAM_HSYNC
CAM_RESET_N
I2C_SCL
VREG_CAM_2.7V
R564 0
NA
FB501
R581
HH-1M1005-601JT
CAM
CONNECTOR
24
23
22
21
20
19
18
17
16
15
14
13
G2
CN501
G1
1
2
3
4
5
6
7
8
9
10
11
12
G4 G3
HB-1M1005-600JT
FB502
FB500
HB-1M1005-600JT
R565 0
CAM_P_DOWN
CAM_MCLK
CAM_DATA(3)
CAM_DATA(0)
CAM_PCLK
CAM_DATA(2)
CAM_DATA(1)
CAM_VSYNC
CAM_DATA(5)
CAM_DATA(4)
VREG_CAM_1.8V
VREG_MSMP_2.7V
CAM_SENSE
U505
SP0102BE3
G3
PWR
G2
G1
OUT
3
2
1
5
4
R508
62
CAM_HALL_IC
U500
MRSS32W
VCC
OUT
GND
C533
NA
C512
0.1u
C513
10p
MIC
C538
10u
C537
47p
MICBIAS
0.022u
0.022u
C534
C535
C536
NA
MIC1N
MIC1P
HPL_R
SPK_AMP_EN
NA
C591
TP402
C590
2.5p
1p
C592
BT_CLK
BLUETOOTH
R513
0
R514
0
VREG_MSMP_2.7V
VREG_BT_2.85V
U504
9
12
14
2
3
CLK_REF SBST
SBCK
VDD_MSM
VDD_A
SBDT
SYNC_DET_TX_EN
RX_BB_TX_BB
5
8
6
10
11
4
LDO1 XTAL_IN
LDO2 NC
13
C514 1000p
TP411
TP412
TP413
1u
RB06A
UART_TXD
UART_RXD
PM_ON_SW_N
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
TCXO_BT
VREG_MSMP_2.7V
PM_ON_SW_N
+5V_PWR
VBAT_SENSE
USB_D-
UART_RXD
UART_TXD
USB_D+
USB_VBUS
UART_DCD_N
UART_RI
UART_RFR_N
UART_CTS_N
UART_DTR
VBATT
SD05-TCT
D604
R515 0
C507 0.022u
C509 0.022u
Audio AMP
80.6K
R504
C1
U502
IN-
80.6K
R507
A1
IN+
C2
_SHDN
TPA2010D1YZF
B1
VDD
B2
PVDD
VO-
VO+
A3
C3
C506
1u
R500
R501
0
0
AMP_PWR
SPK_R+
SPK_RVBAT_TEMP
VREG_MSMP_2.7V
R1056
80.6K
HPL_L
SPK_AMP_EN
C504 0.022u
C508 0.022u
80.6K
R505
80.6K
R506
C1
U503
IN-
A1
IN+
C2
_SHDN
TPA2010D1YZF
VDD
B1
B2
PVDD
VO-
VO+
A3
C3
C505
1u
R502
R503
0
0
AMP_PWR
SPK_L+
SPK_L-
AMP_PWR
R523
0
C550
10u
+VPWR
C530
2
OUT IN
1
4
G2
3
G1
NFM21PC105B1A3
VREG_MMC_3.0V
MMC_DATA
MMC_CD
VREG_MSMP_2.7V
MULTI_ADC
HOOK_SENSE_N
EAR_SENSE_N
B TO B CONNECTOR
10
11
12
6
7
4
5
8
9
1
2
3
CN500
24
23
22
21
20
19
18
17
16
15
14
13
0 R570
MMC_CMD
MMC_CLK
MICBIAS
HPL_L
HPL_R
V_BACK_UP
MIC2P
MIC2N
AXK724345G
I/O CONNECTOR
R520 0
R519 1K
25
CN503
13
14
15
16
17
9
10
11
12
5
6
3
4
7
8
1
2
18
19
20
21
22
23
24
BATT_ID
HF_MODE
DSR
PWR_+5V_1
PWR_+5V_2
ON_SW1
PCM_RXA_IN
PCM_CLK
PCM_SYNC
USB_RX
PCM_TXA_OUT
PWR_GND_1
RXD
TXD
USB_TX
USB_PWR
DCD
RI_TMS
PWR_GND_2
RFR_RTS
PWR_+4.2V_1
PWR_+4.2V_2
CTS
DTR
26
5
CN502
1
2
4
3
VBAT
VBAT_GND
U8500
- 151 -
7. CIRCUIT DIAGRAM
VREG_MSMP_2.7V
FOLDER_SENSE
R600
62
1
2
3
U600
NC1
A3212EEH-T
OUTPUT VDD
NC2
GND2
6
5
4
7
GND1 PGND
FOLDER_DETECT
C601
0.1u
+VPWR
WLED_PWR
LCD_BACK_EN
LCD_BACK_LIGHT_CHARGE_PUMP
R602
0
R604
0
8
U601
IN
AAT3152IWP
3
C1+
C604 1u
5
OUTCP C1-
C2+
4
6
2
9
13
EN_SET
GND
PGND
C2-
ISINK1
ISINK2
ISINK3
ISINK4
7
10
11
12
1
C603 1u
ON_SW_N
WLED_1
WLED_2
WLED_3
WLED_4
D602
RB521S-30
ON_SW
END
END
PM_ON_SW_N
CAMERA_SIDE_KEY
KEY_ROW(0)
R671
100
EVLC14S02050
SIDE_KEY_COL(5)
VA600
NA
VA618
R673 100
KEY_COL(5)
CN602
1
2
SIDE_KEY_COL(5)
VOLUME_SIDE_KEY
R685
KEY_ROW(2)
100
EVLC14S02050
R672
VA601
KEY_ROW(1)
100
EVLC14S02050 VA602
SIDE_KEY_COL(5)
EVLC14S02050 VA619
CN601
1
2
3
VREG_MSMP_2.7V
R603
10K
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_COL(0)
KEY_ROW(4)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
KEY_ROW(4)
KEY_ROW(3)
KEY_ROW(2)
KEY_ROW(1)
KEY_ROW(0)
KEY_COL(4)
KEY_COL(3)
KEY_COL(2)
KEY_COL(1)
KEY_COL(0)
RA600
10K
HOT1
4
4
1
1
7
7
HOT4
HOT4
KEY
5
5
8
8
2
2
0
0
HOT2
+VPWR
HOT3
6
6
3
3
9
9
HOT5
HOT5
0
R607
OK
OK
SND
SND
DN
DN
CLR
CLR
LEFT
LEFT
MENU
MENU
UP
UP
RIGHT
RIGHT
SEARCH
SEARCH
BACK
BACK
VREG_LCD_2.8V
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
LCD_MAKER_ID
+VPWR
KEY_COL(6)
WLED_PWR
WLED_PWR
SPK_R+
SPK_R-
SPK_L+
SPK_L-
KEY_ROW(1)
LD616
R666
47
LEBB-S14H
LD600
R651
47
LEBB-S14H
LD601
LEBB-S14H
LD605
R654
47
R657
47
LEBB-S14H
LD603
R660
47
LEBB-S14H
LD611
R663
47
LEBB-S14H
LD618
R668
47
LEBB-S14H
LD621
LEBB-S14H
R674
47
KEY_BACK_LIGHT
LD617
R667
LEBB-S14H
LD610
47
R652
47
LEBB-S14H
LD606
R655
47
LEBB-S14H
LD609
R658
47
LEBB-S14H
LD607
R661
47
LEBB-S14H
LD615
R664
47
LEBB-S14H
LD619
LEBB-S14H
R669
47
LD602
LEBB-S14H
LD613
R650
47
R653
47
LEBB-S14H
LD608
R656
47
LEBB-S14H
LD612
R659
47
LEBB-S14H
LD614
R662
47
LEBB-S14H
LD604
R665
47
LEBB-S14H
LD620
LEBB-S14H
R670
47
SPK_L+
SPK_R-
SPK_R+
KYBD_BACKLIGHT
LCD_CONNECTOR
FL603
1
2
3
4
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
ICVE21184E150R500FR
9
INOUT_B1
8
INOUT_B2
7
INOUT_B3
6
INOUT_B4
FL604
3
4
1
2
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
ICVE21184E150R500FR
9
INOUT_B1
8
INOUT_B2
7
INOUT_B3
6
INOUT_B4
VA605 UCLAMP0501H
INSTPAR
ZD600
EVLC14S02050
1
2
3
4
5
6
7
8
9
14
15
16
17
18
10
11
12
13
19
20
21
22
23
24
25
CN600
51 52
53 54
41
40
39
38
37
36
35
34
33
50
49
48
47
46
45
44
43
42
32
31
30
29
28
27
26
AXT450124
C600
0.1u
6
5
D600
1
2
4 3
UCLAMP0505A
SPK_L-
LCD_RESET_N
LCD_IF_MODE
LCD_RESET_N
4
3
2
1
INOUT_A4
INOUT_A3
INOUT_A2
INOUT_A1
FL600
INOUT_B4
INOUT_B3
INOUT_B2
INOUT_B1
6
7
8
9
ICVE21184E150R500FR
LCD_CS_N
LCD_ADS
EBI2_WE_N
EBI2_OE_N
4
3
2
1
INOUT_A4
INOUT_A3
INOUT_A2
INOUT_A1
FL601
INOUT_B4
INOUT_B3
INOUT_B2
INOUT_B1
6
7
8
9
ICVE21184E150R500FR
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
4
3
2
1
INOUT_A4
INOUT_A3
INOUT_A2
INOUT_A1
FL602
INOUT_B4
INOUT_B3
INOUT_B2
INOUT_B1
6
7
8
9
ICVE21184E150R500FR
0 R605
0 R606
L610 56nH
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
RCV+
RCV-
MOTOR_PWR-
WLED_1
WLED_2
WLED_3
WLED_4
KEY_ROW(2)
KEY_ROW(3)
+VPWR
U8500
- 152 -
7. CIRCUIT DIAGRAM
S900
GND
500873-0802
DAT2_RSV
CD_DAT3_CS
CMD_DI
VDD
CLK_SCLK
VSS
DAT0_DO
DAT1_RSV
GND
T-FLASH SOCKET
R920
0
VREG_MMC_3.0V
MMC_CD
MMC_CMD
MMC_CLK
MMC_DATA
C905
0.1u
MMC_CD
MMC_DATA
1
2
3
U901
6
5
4
RCLAMP0504F
MMC_CMD
MMC_CLK
DAUGHTER_HEADSET
R905
2.2K
9
10
11
12
7
8
5
6
13
CN901
15
17
1
2
3
4
14
16
18
C-1827541
C915
10p
C917
10p
10u C914
R903
R907
10K
2.2K
C911 33u
C907 33u
C931
47p
C932
47p
1
2
D901
3
UCLAMP0505A
4
6
5
BACK_UP BATTERY
V_BACK_UP
BAT900
ML414RH-F9CE
VA901
EVLC14S02050
VREG_MSMP_2.7V
MICBIAS
MIC2P
MIC2N
HP_OUT_L
HP_OUT_R
EAR_SENSE_N
MULTI_ADC
HOOK_SENSE_N
VREG_MMC_3.0V
MMC_DATA
MMC_CD
VREG_MSMP_2.7V
MULTI_ADC
HOOK_SENSE_N
EAR_SENSE_N
DAUGHTER B-TO-B
VREG_MSMP_2.7V
6
7
4
5
8
1
2
3
9
10
11
12
CN902
24
23
22
21
20
19
18
17
16
15
14
13
AXK824145YG
MMC_CMD
MMC_CLK
MICBIAS
HP_OUT_L
HP_OUT_R
V_BACK_UP
MIC2P
MIC2N
U8500
- 153 -
7. CIRCUIT DIAGRAM
VREG_LCD_2.8V
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
LCD_ID
+VPWR
KEY_COL(6)
WLED_PWR
WLED_PWR
SPK_R+
SPK_R-
SPK_L+
SPK_L-
KEY_ROW(1)
1
2
3
4
5
6
7
12
13
14
15
16
10
11
8
9
17
18
19
20
21
22
23
24
25
CN 1
51 52
53 54
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
AXT350164G
Main Connector
LCD_IF_MODE
LCD_RESET_N
LCD_CS_N
LCD_ADS
EBI2_WE_N
EBI2_OE_N
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
RCV+
RCV-
MOTOR_PWR-
WLED_1
WLED_2
WLED_3
WLED_4
KEY_ROW(2)
KEY_ROW(3)
TP?
TP?
TP?
TP?
VISION MARK
VREG_LCD_2.8V
LCD_RESET_N
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
WLED_PWR
WLED_1
WLED_2
WLED_3
WLED_4
CN 2
G1
11
12
13
14
15
16
17
18
19
20
1
5
6
7
8
2
3
4
9
10
30
29
28
27
26
25
24
23
22
21
40
39
38
37
36
35
34
33
32
31
G2
G4 G3
AXT340164
LCD Connector
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_COL(6)
MOD Key
FF
REW
PLAY / PAUSE
EBI2_WE_N
LCD_CS_N
LCD_ADS
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
LCD_IF_MODE
VREG_LCD_2.8V
LCD_ID
EBI2_OE_N
SPK_RP
SPK_RN
SPK_LP
SPK_LN
RCV_P
RCV_N
VPWR
M_PWR
U8500
- 154 -
8. PCB LAYOUT
- 155 -
8. PCB LAYOUT
- 156 -
8. PCB LAYOUT
- 157 -
8. PCB LAYOUT
- 158 -
8. PCB LAYOUT
U8500
- 159 -
8. PCB LAYOUT
U8500
- 160 -
9. CALIBRATION
9. CALIBRATION
9.1 HOT KIMCHI
9.1.1 Directory structure
HOT KIMCHI PROJECT Hot_Kimchi
RFAuto
Equipment name
: Directory
Model
Info_Db.txt
: File
Hot_KimchiD.exe
CmMqDll.dll
ShieldBox_DllD.dll
ComLMPLib_06.dll
image
Main_SequenceD.dll
Dll_SerialATD.dll
DLL_PwrControlD.dll
DLL_E5515CD.DLL
At_Serial_Cmd.xml
PwrSupply_Cmd.xml
image
Setup_RF_AutoTest.xml
Execution
Ezlooks
Tescom S/B Dll
Auto line dll
Hot kichi graphic
Model main
Serial communication
Power supply control
E5515C equipment control
AT Serial command
Power supply command
Graphic image
Auto set up
U8500
B2000
Model folder 1
Model folder 2
: Summary
- 161 -
9. CALIBRATION
9.1.2 Setup file (Info_Db.txt)
/*auto*/[Default]=[U8500]
➀ ➁ ➂
/*cal*/[2.75G_ADI_A7150_EDGE]=[..
Cal_Model 2.75G_ADI_A7150_EDGE_Ver0.5_Ezlooks
Main_Seq uence.dll]
/*auto*/[U8500]=[..
RF_Auto Main_SequenceD.dll]
/*auto*/[C1300]=[..
RF_Auto Main_SequenceD.dll]
[ezlooks]=[on]
[batcal]=[off]
You can change this as ‘on’ or ‘off’
(should be in lower case; on, off)
[svc]=[off]
[standalone]=[off]
[tescom]=[off]
You can change this as ‘auto’ or ‘cal’
(should be in lower case; on, off)
[process]=[auto]
➃ ➄
[U8500]=[..
Auto_Model U8500 Procedure_U8500.xml,..
Auto_Model U8500
Spec_U8500.xml,..
Auto_Model U8500 AutoSetup.xml]
1 : Indication of ‘cal process’ or ‘auto process’.
2 : Model name which is displayed on Hot Kimchi program
3 : Relative path of Main_Sequence.dll from Hot_KimchiD.exe
4 : Auto model name
5 : Relative path of auto model procedure, spec, setting file from Hot_KimchiD.exe
- 162 -
9.1.3 Setup file item
[ezlooks] => If you use ezlooks, turn it on
Domestic : ‘on’, Oversea : ‘off’
[batcal] => Battery calibration on/off
[svc] => If you use this program in svc, turn it on.
Domestic : ‘off’, Service Center : ‘on’
[standalone] => Oversea factory or SVC : ‘on’, Domestic factory :‘off’
[tescom] => If you use TESCOM shiedbox, turn it on.
[process] => auto process or cal process
[U8500] => procedure, spec, setup file name (auto process only)
9. CALIBRATION
- 163 -
9. CALIBRATION
9.1.4 Example for setting file
CAL Process
Ex1) Service center
Ex2) Oversea factory or repair
[ezlooks]=[off]
[batcal]=[on]
[svc]=[off]
[standalone]=[on]
[tescom]=[off]
[process]=[cal]
Ex3) Domestic factory
[ezlooks]=[off]
[batcal]=[off]
[svc]=[on]
[standalone]=[off]
[tescom]=[off]
[process]=[cal]
[ezlooks]=[on]
[batcal]=[on]
[svc]=[off]
[standalone]=[off]
[tescom]=[off]
[process]=[cal]
AUTO Process
Ex1) Service center, Oversea factory, repair
[ezlooks]=[off]
[batcal]=[off]
[svc]=[off]
[standalone]=[off]
[tescom]=[off]
[process]=[auto]
Ex2) Domestic factory
[ezlooks]=[on]
[batcal]=[off]
[svc]=[off]
[standalone]=[off]
[tescom]=[off]
[process]=[auto]
*. If Tescom S/B is used, it should be [tescom]=[on].
- 164 -
9. CALIBRATION
9.2 How to use Hot Kimchi
3
2
U8500
1
Flow
1.Click the menu which you want.
2.Click APPLY button
3.Click STRAT button
This program supports 1024*768*16.
- 165 -
9. CALIBRATION
9.3 HOT KIMCHI Example
U8500_ver1.1
U8500
U8500
U8500
Choose_U8500
U8500
U8500
U8500_ver1.1
Click APPLY button
- 166 -
U8500
U8500
U8500
U8500_ver1.1
Click START button
9. CALIBRATION
U8500
- 167 -
*. Click.
- 168 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
10.1 EXPLODED VIEW
92 93 94
95 96 97
98
99 100
1
101
4
5
6
7
39
40
41
9
10
11
12
13
14
15
25
26
27
28
29
31
32
34
35
36 37 38
79
80
42
81
43
82
83
44
45
46
47
89
88
49
50
51
52
2
3
53
54
55
103
58
59
60
61
16
17
18
19
66
64
30
24
23
20
21
22
67
68
69
71
102
33
73
74
75
72
76
77
84
85
86
87
90
78
91
48
56
57
65
70
62
104
63
- 169 -
- 170 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
10.2 Replacement Parts
<Mechanic component>
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2
3
4
Level
Location
No.
1
Description
GSM(FOLDER)
2
3
3
AAAY00 ADDITION
SBPP
BATTERY PACK,
LI-POLYMER
SBPP00
BATTERY PACK,
LI-POLYMER
4
APEY02G PHONE
ACGG00 COVER ASSY,FOLDER
ABGA00 BUTTON ASSY,DIAL
ACGH00
COVER ASSY,
FOLDER(LOWER)
MCJH00 COVER,FOLDER(LOWER)
MDAF00 DECO,FOLDER(LOWER)
MDAH00 DECO,RECEIVER
4
MFEZ00
MMAZ00
MPBG00
MPBN00
FRAME
MAGNET
PAD,LCD
PAD,SPEAKER
MPBZ00 PAD
MTAA00 TAPE,DECO
MTAA01 TAPE,DECO
MTAD00 TAPE,WINDOW
ACGJ00
COVER ASSY,
FOLDER(UPPER)
ABGB00 BUTTON ASSY,FUNCTION
MCJJ00 COVER,FOLDER(UPPER)
MDAC0 DECO,SIDE
MDAC00 DECO,SIDE
MDAE00 DECO,FOLDER(UPPER)
MICA00 INSERT,FRONT
MPBM00 PAD,RECEIVER
MPBN00 PAD,SPEAKER
Part Number
TGFF0069601
AAAY0093501
SBPP0012501
APEY0212501
ACGG0060201
ABGA0004901
ACGH0034601
MCJH0027201
MDAF0007201
MDAH0013401
MFEZ0005901 Diecasting
MMAZ0000101 D3*1.5t
MPBG0035201
MPBN0023701 Frame
MPBZ0092701
MTAA0087901 Folder(Lower)_Right
MTAA0087501 Receiver_Left
MTAD0037801 Folder(Lower)
ACGJ0046001
ABGB0002501 MOD Key
MCJJ0042101
MDAC0014101 LEFT
MDAC0014201 RIGHT
MDAE0035001
MICA0018801 M1.4*2(Phi2.4)
MPBM0009601
MPBN0020601
Specification
SBPP0013001
3.7 V,1040 mAh,1 CELL,PRISMATIC ,Muse(U880) Middle
Battery, Silver
3.7 V,800 mAh,1 CELL,PRISMATIC ,MUSE(U8200),
BATTERY
Color
Dark Blue
Silver
Silver
Dark Blue
Black
Dark Blue
Black
Dark Blue
Dark Blue
Dark Blue
Dark Blue
Black
Black
Dark Blue
Black
Dark Blue
Dark Blue
Dark Blue
Dark Blue
Dark Blue
Black
Black
Remark
64
34
35
32
33
37
41
43
36
39
42
40
3
9
11
14
6
16
19
18
- 171 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
4
4
4
4
4
5
5
5
5
4
5
5
5
5
5
5
4
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Level
5
Location
No.
Description
MPBQ00 PAD,LCD(SUB)
5
5
MTAA
MTAA0
TAPE,DECO
TAPE,DECO
MTAA00
MTAB00
MTAC00
MTAE00
TAPE,DECO
TAPE,PROTECTION
TAPE,SHIELD
TAPE,WINDOW(SUB)
ACGK00 COVER ASSY,FRONT
MBFP00 BRACKET,CAMERA
MBJN00 BUTTON,VOLUME
MBJP00 BUTTON,SHUTTER
MCJK00 COVER,FRONT
MDAG DECO,FRONT
MDAG0 DECO,FRONT
MDAG001 DECO,FRONT
MICA0 INSERT,FRONT
MICA00 INSERT,FRONT
MIDZ INSULATOR
MIDZ0 INSULATOR
MIDZ00 INSULATOR
MPBH00
MSGY00
MTAA00
MTAB0
PAD,MIKE
STOPPER
TAPE,DECO
TAPE,PROTECTION
MTAB00 TAPE,PROTECTION
MTAC00 TAPE,SHIELD
APGZ00 PLATE ASSY
MPFZ00 PLATE
MTAZ00 TAPE
GMEY00
MCCH
MCCH0
MHFD00
MIDA
SCREW MACHINE,BIND
CAP,SCREW
CAP,SCREW
HINGE,FOLDER
INSULATOR,LCD
Part Number
MPBQ0022901
MTAA0087301 Side_Left
MTAA0087201 Folder(Upper)
MTAA0087401 Side_Right
MTAB0074901 MOD Key
MTAC0031001 SUB LCD
MTAE0022901
ACGK0054501
MBFP0003101 FRONT
MBJN0005401
MBJP0002801 Camera
MCJK0042401
MDAG0012901 LEFT
MDAG0013001 RIGHT
MDAG0013102 Cr Plate No Hologram
MICA0018901 M1.4*7(Phi2.4)
Specification
MICA0018801 M1.4*2(Phi2.4)
MIDZ0072101 Front
MIDZ0074101 Front _ Side
MIDZ0073001
MPBH0016301
MSGY0012201
MTAA0087101 Front
MTAB0093301 Front,Side_Left
MTAB0079701 Front_Side
MTAC0029401 Front
APGZ0001601
MPFZ0017401 MOD Key
MTAZ0086001 MOD Key
GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK
MCCH0055901 Folder_Low
MCCH0055701 Folder_Up_Left
MHFD0011301
MIDA0018801
- 172 -
Black
Dark Blue
Dark Blue
Dark Blue
Dark Blue
Dark Blue
Dark Blue
Black
Color
Black
Gold
13
2
17
5
Remark
12
10
7
Dark Blue
Dark Blue
Dark Blue
Black
Blue
Gold
56
57
50
103
16
55
60
53
104
59
62
63
49
52
51
58
61
54
Dark Blue
Dark Blue
30
24
Dark Blue
Dark Blue
48
46
38
10. EXPLODED VIEW & REPLACEMENT PART LIST
4
4
4
5
4
5
5
4
4
4
4
4
3
4
4
4
4
4
4
4
3
4
4
4
4
4
4
4
4
4
Level
4
Location
No.
Description
MIDA00 INSULATOR,LCD
4
4
MIDZ
MIDZ0
INSULATOR
INSULATOR
MIDZ00
MLAC00
MPBF00
MPBZ00
INSULATOR
LABEL,BARCODE
PAD,FLEXIBLE PCB
PAD
MPFB00 PLATE,COVER
MTAB TAPE,PROTECTION
MTAB00 TAPE,PROTECTION
MTAC00 TAPE,SHIELD
MWAC00 WINDOW,LCD
MWAF00
ACGM00
MBFP00
MBIZ00
WINDOW,LCD(SUB)
COVER ASSY,REAR
BRACKET,CAMERA
BUSHING
MCCC00 CAP,EARPHONE JACK
MCCE00 CAP,RECEPTACLE
MCCG00 CAP,MULTIMEDIA CARD
MCJN00 COVER,REAR
4
MLAN00
MLEA00
MLEY00
MPBZ00
LABEL,QUALCOMM
LOCKER,BATTERY
LOCKER
PAD
MSDC SPRING,LOCKER
ACGN00 COVER ASSY,CAMERA
ACGP00
COVER ASSY,
CAMERA(FRONT)
MCJP00 COVER,CAMERA(FRONT)
MMAZ00 MAGNET
MTAD00 TAPE,WINDOW
MBIC00 BUSHING,CAMERA(LEFT)
MCCK00 CAP,CAMERA
MGAD00 GASKET,SHIELD FORM
MPBT00 PAD,CAMERA
Part Number
MIDA0018301 0.35T
MIDZ0056801
MIDZ0072701 FPCB_22mm*4mm
Specification
MIDZ0063401 FPCB_5.5mm*4mm
MLAC0003401 EZ LOOKS(user for mechanical)
MPBF0012501
MPBZ0104501
MPFB0001901 0.35T
MTAB0075001 Folder
MTAB0075101 Phone
MTAC0028601
MWAC0054501
MWAF0028101
ACGM0054401
MBFP0003201 REAR
MBIZ0002401 Handstrap
MCCC0025501
MCCE0020501
MCCG0003301
MCJN0038101
MLAN0000603 White,95C
MLEA0024501
MLEY0000801 SIM LOCKER
MPBZ0106701 Rear
MSDC0008301
ACGN0003601
ACGP0002601
MCJP0004201
MMAZ0001601
MTAD0037901
MBIC0001401
MCCK0002901
MGAD0092201
MPBT0020201
Camera(Front)
- 173 -
Color
White
Remark
26
20
15
Dark Blue
Black
Gold
Dark Blue
Dark Blue
Black
Dark Blue
Dark Blue
Dark Blue
Dark Blue
Dark Blue
Dark Blue
Transparent
Dark Blue
Silver
Dark Blue
28
65
23
47
1
29
44
4
88
85
87
77
83
82
81
79
78
84
80
Black
Black
Dark Blue
Dark Blue
Dark Blue
Gold
Black
97
98
101
94
95
100
92
10. EXPLODED VIEW & REPLACEMENT PART LIST
5
5
5
5
3
5
3
3
Level
4
Location
No.
Description
MWAE00 WINDOW,CAMERA
3
3
GMEY00
MCCF00
SCREW MACHINE,BIND
CAP,MOBILE SWITCH
MCCH CAP,SCREW
MCCH0 CAP,SCREW
MLAK00 LABEL,MODEL
ADCA00 DOME ASSY,METAL
MIDZ00 INSULATOR
MTAC00 TAPE,SHIELD
MLAB00 LABEL,A/S
MLAC00 LABEL,BARCODE
Part Number
MWAE0009801
Specification
GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK
MCCF0030901
MCCH0056001 Main_Bracket
MCCH0056101 Main_Up
MLAK0017701
ADCA0035601
MIDZ0063501 FPCB_10.1mm*3.6mm
MTAC0028701
MLAB0000601 HUMIDITY STICKER
MLAC0003301 EZ LOOKS(use for PCB ASSY MAIN(hardware))
Color
Dark Blue
Remark
99
Black
45
86
Dark Blue
Dark Blue
White
Dark Blue
89
Gold
90
66
67
70
- 174 -
4
5
5
4
4
3
4
5
7
6
4
4
4
4
10. EXPLODED VIEW & REPLACEMENT PART LIST
10.2 Replacement Parts
<Main component>
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Color
BROWN
GOLD
Remark
25
Aqua Silver
Dark Blue
27
22
21
31
76
96
69
- 175 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C1008
Description
CAP,CERAMIC,CHIP
6
6
C1009
C1010
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C1011
C1012
C1013
C1014
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C1015
C1016
C1017
C1018
C1019
C1020
C1021
C1022
C1023
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,FILM,MPP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C1024 CAP,CERAMIC,CHIP
C1025 CAP,CERAMIC,CHIP
C1026 CAP,TANTAL,CHIP
C1027 CAP,CERAMIC,CHIP
C1028 CAP,CERAMIC,CHIP
C1029 CAP,CERAMIC,CHIP
C1030 CAP,CERAMIC,CHIP
C1031 CAP,CERAMIC,CHIP
C1032 CAP,CERAMIC,CHIP
C1035 CAP,CERAMIC,CHIP
C1036 CAP,CERAMIC,CHIP
C1037 CAP,CERAMIC,CHIP
C1038 CAP,CERAMIC,CHIP
C1039 CAP,CERAMIC,CHIP
C1040 CAP,CERAMIC,CHIP
C1041 CAP,CERAMIC,CHIP
C1042 CAP,CERAMIC,CHIP
C1043 CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000111 12 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000106 5 pF,50V,C,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP
ECFD0000703 3900 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000144 1.2 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000701 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
- 176 -
Color Remark
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C1044
Description
CAP,CERAMIC,CHIP
6
6
C1045
C1046
CAP,CERAMIC,CHIP
CAP,FILM,MPP
C1047
C1048
C1049
C1050
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C1051
C1052
C1053
C1054
C1055
C1056
C1057
C1058
C1059
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C1060 CAP,CERAMIC,CHIP
C1061 CAP,CERAMIC,CHIP
C1062 CAP,CERAMIC,CHIP
C1063 CAP,TANTAL,CHIP
C1064 CAP,CERAMIC,CHIP
C1065 CAP,CERAMIC,CHIP
C1066 CAP,CERAMIC,CHIP
C1067 CAP,CERAMIC,CHIP
C1068 CAP,CERAMIC,CHIP
C1069 CAP,TANTAL,CHIP
C1070 CAP,TANTAL,CHIP
C1071 CAP,CERAMIC,CHIP
C1072 CAP,CERAMIC,CHIP
C1073 CAP,TANTAL,CHIP
C1074 CAP,CERAMIC,CHIP
C1075 CAP,CERAMIC,CHIP
C1076 CAP,CERAMIC,CHIP
C1077 CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000141 680 pF,50V,K,X7R,HD,1005,R/TP
ECFD0000703 3900 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP
ECZH0000846 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000151 4.7 nF,25V,K,X7R,HD,1005,R/TP
ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Color Remark
- 177 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C1078
Description
CAP,CERAMIC,CHIP
6
6
C1079
C1080
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C1081
C1082
C1083
C1084
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,FILM,MPP
C1085
C1086
C1087
C1088
C1089
C1090
C1091
C1092
C1093
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C1094 CAP,CERAMIC,CHIP
C1095 CAP,CERAMIC,CHIP
C1096 CAP,CERAMIC,CHIP
C1097 CAP,CERAMIC,CHIP
C1098 CAP,CERAMIC,CHIP
C1100 CAP,TANTAL,CHIP,MAKER
C1101 CAP,CERAMIC,CHIP
C1102 CAP,CERAMIC,CHIP
C1103 CAP,CERAMIC,CHIP
C1104 CAP,CERAMIC,CHIP
C1108 CAP,CERAMIC,CHIP
C1111 CAP,CERAMIC,CHIP
C1112 CAP,CHIP,MAKER
C1113 CAP,CERAMIC,CHIP
C1119 CAP,CERAMIC,CHIP
C1120 CAP,CERAMIC,CHIP
C1215 CAP,CERAMIC,CHIP
C1230 CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP
ECFD0001001 22 nF,10V ,J ,NI ,SMD ,2012 mm,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000130 150 pF,50V ,J ,SL ,TC ,1005 ,R/TP
ECCH0000130 150 pF,50V ,J ,SL ,TC ,1005 ,R/TP
ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECTZ0000322 68 uF,6.3V ,M ,L_ESR ,ETC ,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000126 68 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
ECCH0000111 12 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000111 12 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
- 178 -
Color Remark
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C202
Description
CAP,CERAMIC,CHIP
6
6
C203
C204
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C205
C206
C207
C208
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C209
C210
C211
C212
C213
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C214
C215
C216
C217
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C218
C219
C220
C221
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C222
C223
C224
C225
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
C226
C227
C228
C229
C230
C231
C232
C234
C235
C236
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0002003 33 nF,16V ,K ,B ,TC ,1005 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Color Remark
- 179 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C237
Description
CAP,CERAMIC,CHIP
6
6
C238
C239
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C240
C241
C242
C243
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C244
C245
C246
C247
C248
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C249
C300
C301
C302
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C303
C304
C305
C306
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C307
C308
C309
C310
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C311
C312
C400
C401
C402
C403
C404
C405
C406
C407
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP
ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP
ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP
ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP
ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP
ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP
ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
- 180 -
Color Remark
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C408
Description
CAP,CERAMIC,CHIP
6
6
C409
C410
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C411
C412
C413
C414
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C415
C416
C417
C418
C419
C420
C421
C422
C423
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C437
C438
C450
C500
C432
C433
C434
C435
C436
C501
C428
C429
C430
C431
C424
C425
C426
C427
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Color Remark
- 181 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C502
Description
CAP,CERAMIC,CHIP
6
6
C503
C510
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C511
C514
C515
C516
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C517
C518
C519
C520
C521
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C522
C523
C529
C530
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
FILTER,EMI/POWER
6
6
6
6
6
C532
C534
C535
C537
C538
C577
C578
C590
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C592 CAP,CERAMIC,CHIP
C600 CAP,CERAMIC,CHIP
CN500
CONNECTOR,
BOARD TO BOARD
CN501
CONNECTOR,
BOARD TO BOARD
CN502 CONNECTOR,ETC
CN503 CONNECTOR,I/O
CN600
CONNECTOR,
BOARD TO BOARD
6 D400 DIODE,SWITCHING
Part Number Specification
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
SFEY0006501 SMD ,3 TERMINAL EMI FILTER
ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP
ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP
ECCH0004906 2.5 pF,50V ,C ,X7R ,TC ,1005 ,R/TP
ECCH0000102 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ENBY0021001 24 PIN,0.4 mm,ETC , ,H=2.5
ENBY0020401 24 PIN,0.4 mm,ETC , ,H=0.9, Socket
ENZY0016901 3 PIN,2.5 mm,ETC , ,H=2.7
ENRY0004501 24 PIN,0.5 mm,ETC , ,0.8 Offset type
ENBY0028801 50 PIN,.4 mm,ETC , ,H=1.5, P4S Header
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
Color Remark
- 182 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
Location
No.
6 D401
Description
DIODE,SWITCHING
6 D500 DIODE,TVS
6
6
D600
D601
DIODE,TVS
DIODE,SWITCHING
6
6
6
6
6
6
6
6
D602 DIODE,SWITCHING
D603 DIODE,SWITCHING
D604 DIODE,TVS
FB1000 FILTER,BEAD,CHIP
FB500 FILTER,BEAD,CHIP
FB501 FILTER,BEAD,CHIP
FB502 FILTER,BEAD,CHIP
FL1000 DUPLEXER,GSM
FL1001 FILTER,SAW
FL1002 FILTER,SAW
FL600 FILTER,EMI/POWER
FL601 FILTER,EMI/POWER
FL602 FILTER,EMI/POWER
FL603 FILTER,EMI/POWER
FL604 FILTER,EMI/POWER
J300 CONN,SOCKET
L1001 INDUCTOR,CHIP
L1002 INDUCTOR,CHIP
L1003 INDUCTOR,CHIP
L1004 INDUCTOR,CHIP
L1005 INDUCTOR,CHIP
L1007 INDUCTOR,CHIP
L1008 INDUCTOR,CHIP
L1009 INDUCTOR,CHIP
Part Number Specification
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
EDTY0006201
SOD-323 ,12 V,350 W,R/TP ,Single Line TVS Diode for
ESD
EDTY0007601
SC-89 ,5 V,100 W,R/TP ,5 Channel Array , Vc 12V , 75pF ,
1.6*1.625*0.58
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
EDTY0001901 SOD-323 ,6 V,350 W,R/TP ,Junction capacitance:350 pF
SFBH0000903 600 ohm,1005 ,
SFBH0000909 60 ohm,1005 ,
SFBH0009801 600 ohm,1005 ,DC Res.0.6ohm, R.C.500mA
SFBH0000909 60 ohm,1005 ,
SDGY0000701
1950 MHz,2140 MHz,1.6 dB,1 dB,45 dB,51 dB,3.8*3.8*1.4
,SMD ,WCDMA (FBAR)
SFSY0025601 2140 MHz,2.0*1.4*0.68 ,SMD ,Balanced Output (100ohm)
SFSY0023001 1950 MHz,2.0*1.4*0.8 ,SMD ,5pin, Unbal-Unbal, 50//50
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pbfree
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pbfree
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pbfree
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pbfree
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pbfree
ENSY0001602 6 PIN,ETC ,5 IRECTIONAL ,2.54 mm,K(GC200)
ELCH0005002 2.7 nH,S ,1005 ,R/TP ,
ELCH0005014 5.6 nH,S ,1005 ,R/TP ,
ELCH0001426 8.2 nH,J ,1005 ,R/TP ,PBFREE
ELCH0005009 100 nH,J ,1005 ,R/TP ,
ELCH0001427 2.2 nH,S ,1005 ,R/TP ,Pb Free
ELCH0005006 33 nH,J ,1005 ,R/TP ,
ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE
ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE
Color Remark
- 183 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
L1010
Description
INDUCTOR,CHIP
6
6
L1011
L1013
INDUCTOR,CHIP
INDUCTOR,CHIP
L1014
L1015
L1016
L1017
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
L1018
L1019
L1020
L1021
L1022
L1023
L1024
L1027
L1028
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
L400
L401
L402
L410
L610
L1029 INDUCTOR,CHIP
L1030 INDUCTOR,CHIP
L1031 INDUCTOR,CHIP
L1032 INDUCTOR,CHIP
L1033 INDUCTOR,CHIP
L1034 INDUCTOR,CHIP
L1035 INDUCTOR,CHIP
L302 INDUCTOR,CHIP
INDUCTOR,SMD,POWER
INDUCTOR,SMD,POWER
INDUCTOR,SMD,POWER
INDUCTOR,CHIP
INDUCTOR,CHIP
6
6
Q400
Q401
TR,FET,N-CHANNEL
TR,FET,P-CHANNEL
6
6
Q402 TR,FET,P-CHANNEL
Q403 TR,BJT,PNP
Part Number Specification
ELCH0001420 3.9 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001420 3.9 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001426 8.2 nH,J ,1005 ,R/TP ,PBFREE
ELCH0003818 9.1 nH,J ,1005 ,R/TP ,
ELCH0003818 9.1 nH,J ,1005 ,R/TP ,
ELCH0003817 7.5 nH,J ,1005 ,R/TP ,
ELCH0003817 7.5 nH,J ,1005 ,R/TP ,
ELCH0003816 3.6 nH,S ,1005 ,R/TP ,
ELCH0003816 3.6 nH,S ,1005 ,R/TP ,
ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE
ELCH0010401 2.2 uH,M ,1005 ,R/TP ,
ELCH0010401 2.2 uH,M ,1005 ,R/TP ,
ELCH0010401 2.2 uH,M ,1005 ,R/TP ,
ELCH0010401 2.2 uH,M ,1005 ,R/TP ,
ELCH0001409 10 nH,J ,1005 ,R/TP ,PBFREE
ELCH0001409 10 nH,J ,1005 ,R/TP ,PBFREE
ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005
ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005
ELCH0003817 7.5 nH,J ,1005 ,R/TP ,
ELCH0001405 3.3 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001405 3.3 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE
ELCH0005013 4.7 nH,S ,1005 ,R/TP ,
ELCH0001550 56 nH,J ,1608 ,R/TP ,
ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE
ELCH0001022 56 nH,J ,1005 ,R/TP ,Pb Free
EQFN0006901
BGA (2*2, 0.8 PITCH) 4PIN ,1.47 W,20 V,5.3 A,R/TP ,Low
ON-Rds=0.031ohm, N-ch MOSFET, Pb-free
EQFP0006801 MICRO FOOT ,1.47 W,-20 V,-5.8 A,R/TP ,
EQFP0004701
TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S)
MOSFET, Pb free
EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680
Color Remark
- 184 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
Q404
Description
TR,BJT,PNP
6
6
R1001
R1002
RES,CHIP
RES,CHIP
R1003
R1004
R1005
R1006
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R1008
R1009
R1011
R1012
R1013
R1015
R1017
R1018
R1019
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R1021 RES,CHIP
R1022 RES,CHIP
R1024 RES,CHIP
R1025 RES,CHIP
R1026 RES,CHIP
R1027 RES,CHIP
R1028 RES,CHIP
R1029 RES,CHIP
R1030 RES,CHIP
R1031 RES,CHIP
R1032 RES,CHIP
R1033 RES,CHIP
R1034 RES,CHIP
R1035 RES,CHIP
R1036 RES,CHIP
R1037 RES,CHIP
R1038 RES,CHIP
R1039 RES,CHIP
Part Number Specification
EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000250 3.3K ohm,1/16W,J,1005,R/TP
ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP
ERHY0011601 11 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0000214 51 ohm,1/16W,J,1005,R/TP
ERHY0000228 270 ohm,1/16W,J,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0000245 1.8K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000241 1K ohm,1/16W,J,1005,R/TP
ERHY0000256 6.2K ohm,1/16W,J,1005,R/TP
ERHY0000256 6.2K ohm,1/16W,J,1005,R/TP
ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP
ERHY0000203 10 ohm,1/16W,J,1005,R/TP
ERHY0000203 10 ohm,1/16W,J,1005,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHY0008201 24 ohm,1/16W ,J ,1005 ,R/TP
ERHY0000223 150 ohm,1/16W,J,1005,R/TP
ERHY0000225 200 ohm,1/16W,J,1005,R/TP
ERHY0000214 51 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000205 15 ohm,1/16W,J,1005,R/TP
ERHY0000226 220 ohm,1/16W,J,1005,R/TP
ERHY0000214 51 ohm,1/16W,J,1005,R/TP
ERHY0000228 270 ohm,1/16W,J,1005,R/TP
ERHY0000213 47 ohm,1/16W,J,1005,R/TP
ERHY0000218 82 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0011601 11 Kohm,1/16W ,F ,1005 ,R/TP
Color Remark
- 185 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R1040
Description
RES,CHIP
6
6
R1041
R1042
RES,CHIP
RES,CHIP
R1043
R1044
R1048
R1049
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R1050 RES,CHIP
R1056 RES,CHIP
R1057 RES,CHIP
R202
R203
RES,CHIP
RES,CHIP
R204
R205
R206
R207
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R208
R209
R210
R211
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R213
R214
R215
R216
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R217
R218
R219
R300
R301
R303
R305
R306
R307
R370
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
Part Number Specification
ERHY0000151 80.6K ohm,1/16W,F,1005,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHY0000263 15K ohm,1/16W,J,1005,R/TP
ERHY0000169 470000 ohm,1/16W ,F ,1005 ,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000151 80.6K ohm,1/16W,F,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0000208 22 ohm,1/16W,J,1005,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000112 1K ohm,1/16W,F,1005,R/TP
ERHY0000246 2K ohm,1/16W,J,1005,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000125 10K ohm,1/16W,F,1005,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000160 180K ohm,1/16W,F,1005,R/TP
ERHY0000160 180K ohm,1/16W,F,1005,R/TP
ERHY0000169 470000 ohm,1/16W ,F ,1005 ,R/TP
ERHY0000125 10K ohm,1/16W,F,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
- 186 -
Color Remark
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R400
Description
RES,CHIP
6
6
R401
R402
RES,CHIP
RES,CHIP
R403
R404
R405
R406
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R407
R408
R409
R411
R413
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R414
R415
R416
R460
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
RES,CHIP
R513
R514
R515
R516
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R517
R519
R520
R528
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
RES,CHIP
R564
R565
R570
R605
R606
R671
RT1000
SW1002
TR1000
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
THERMISTOR
CONN,RF SWITCH
TR,BJT,ARRAY
6 U1000 IC
Part Number Specification
ERHY0000241 1K ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000273 47K ohm,1/16W,J,1005,R/TP
ERHY0008602 0.1 ohm,1/4W ,J ,2012 ,R/TP
ERHY0000125 10K ohm,1/16W,F,1005,R/TP
ERHY0000214 51 ohm,1/16W,J,1005,R/TP
ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000292 470K ohm,1/16W,J,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000169 470000 ohm,1/16W ,F ,1005 ,R/TP
ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP
ERHY0000241 1K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
SETY0000903 NTC ,68000 ohm,SMD ,+/- 10% / 2012 SIZE, Pb Free
ENWY0002304 STRAIGHT ,SMD ,0.8 dB,MUSE MODEL
EQBA0000301 SC-88A,0.15W,R/TP,NPN/PNP DUAL
EUSY0246001
QFN ,48 PIN,R/TP ,UMTS-1900/-2100 and GPS RF
Receiver IC
Color Remark
- 187 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
Location
No.
6 U1001 IC
Description
6 U1002 PAM
6
6
U1003
U1004
VCO
IC
U1005 PAM
U1006 FILTER,SEPERATOR
U1008 IC
U200 IC
U300 DIODE,TVS
U301 IC
U400 IC
U401 DIODE,TVS
U402 IC
U500 IC
U501
U504
IC
MODULE,ETC
U505 MICROPHONE
VA500 VARISTOR
VA501 VARISTOR
VA502 VARISTOR
VA505 VARISTOR
VA506 VARISTOR
VA507 VARISTOR
VA508 VARISTOR
VA509 VARISTOR
VA514 VARISTOR
VA520 VARISTOR
VA521 VARISTOR
VA600 VARISTOR
VA603 VARISTOR
Part Number Specification
EUSY0186101
4-Bump micro SMD ,4 PIN,R/TP ,RF POWER DETECTOR
FOR CDMA/WCDMA
SMPY0008201
28 dBm,42.0 %,0.07 A,-52.0 dBc,27.5 dB,4*4*1.5 ,SMD
,LOAD INSENSITIVE PAM FOR WCDMA (1850-1980M)
EXSC0009201
MHz, PPM, pF,SMD ,5.5*4.8*1.5 ,824MHz ~ 915MHz,
1710MHz ~ 1910MHz, 14pin
EUSY0203802
QFN ,56 PIN,R/TP ,GSM/WCDMA TRANSMITTER & GSM
RECEIVER
SMPY0008301
35 dBm,53 %,0.0000025 A, dBc,50 dB,6.0*6.0*1.2 ,SMD
,FOR QUAD BAND GSM AND GPRS
SFAY0005201
800.1800 ,1900.2000 ,1.4 dB,1.7 dB,35 dB,30 dB,ETC
,7.2*5.0*1.8 Size
EUSY0222701
DQFN ,14 PIN,R/TP ,LOW VOLTAGE DUAL SUPPLY 4-BIT
SIGNAL TRANSLATOR, Pb Free
EUSY0202101 BALL CSP ,409 PIN,R/TP ,WCDMA/GSM/GPRS MODEM
Color
EDTY0007801 SC-70 ,5 V,150 W,R/TP ,LOW CAPACITANCE TVS ARRAY
EUSY0222204
FBGA ,225 PIN,ETC ,1G(90 NANO/HP)
NAND+512M(256*2/32 BITS IO) SDRAM / PB FREE
EUSY0084701 SSOP5-P-A ,6 PIN,R/TP ,Inverter, Pb Free
EDTY0007801 SC-70 ,5 V,150 W,R/TP ,LOW CAPACITANCE TVS ARRAY
EUSY0203701 BCC ,84 PIN,R/TP ,POWER MANAGEMENT IC
EUSY0197202
2.0 x 2.1 x 0.8 ,3 PIN,R/TP ,MR SENSOR / 1.8V
OPERATION, Pb Free
EUSY0254901 MLF ,10 PIN,R/TP ,Dual(2.7V/150mA,1.8V/300mA) LDO
SMZY0009501 Bluetooth RF Module, 5.0*4.0*1.1
SUMY0010601 UNIT ,42 dB,6.15*3.76*1.65 ,Bottom Silicon SMD
SEVY0003801 18 V, ,SMD ,
SEVY0003801 18 V, ,SMD ,
SEVY0003801 18 V, ,SMD ,
SEVY0003801 18 V, ,SMD ,
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
Remark
- 188 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
Level
6
Location
No.
VA604
Description
VARISTOR
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
5
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
VA605
VA606
VA607
VA630
X1000
X200
X400
ZD600
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VCTCXO
X-TAL
X-TAL
DIODE,TVS
SAFD00 PCB ASSY,MAIN,SMT TOP
C1216 CAP,CERAMIC,CHIP
C1217 CAP,CERAMIC,CHIP
C200
C201
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C455
C456
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C504
C505
C506
C507
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C508
C509
C512
C513
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C550
C581
C582
C601
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C602
C603
C604
C605
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
LD600 DIODE,LED,CHIP
Part Number Specification
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0000702 14 V,10% ,SMD ,
SEVY0000702 14 V,10% ,SMD ,
SEVY0001001 14 V, ,SMD ,50pF, 1005
EXSK0005003 19.2 MHz,2 PPM,10 pF,SMD ,3.2*2.5*1.1 ,
EXXY0021501 48 MHz,30 PPM,7 pF,50 ohm,SMD ,3.2*2.5*0.7 ,
EXXY0004602
.032768 MHz,20 PPM,12.5 pF,65000 ohm,SMD
,6.9*1.4*1.3 ,
EDTY0007301
SOD-523 ,5 V,240 W,R/TP ,SINGLE LINE TVS DIODE FOR
ESD
SAFD0050801
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP
ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP
ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP
ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
Color Remark
- 189 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
LD601
Description
DIODE,LED,CHIP
6
6
LD602
LD603
DIODE,LED,CHIP
DIODE,LED,CHIP
LD604
LD605
LD606
LD607
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
LD608
LD609
LD610
LD611
LD612
LD613
LD614
LD615
LD616
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
LD617 DIODE,LED,CHIP
LD618 DIODE,LED,CHIP
LD619 DIODE,LED,CHIP
LD620 DIODE,LED,CHIP
R200
R201
R412
R457
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
RES,CHIP
R500
R501
R502
R503
R504
R505
R506
R507
R508
R509
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP,MAKER
RES,CHIP
Part Number Specification
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP
ERHY0000284 150K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000292 470K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000151 80.6K ohm,1/16W,F,1005,R/TP
ERHY0000151 80.6K ohm,1/16W,F,1005,R/TP
ERHY0000151 80.6K ohm,1/16W,F,1005,R/TP
ERHY0000151 80.6K ohm,1/16W,F,1005,R/TP
ERHZ0000500 62 ohm,1/16W ,J ,1005 ,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
- 190 -
Color Remark
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R510
Description
RES,CHIP
6
6
R511
R512
RES,CHIP
RES,CHIP
R523
R550
R600
R601
RES,CHIP
RES,CHIP
RES,CHIP,MAKER
RES,CHIP
R602
R603
R604
R607
R620
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R650
R651
R652
R653
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R654
R655
R656
R657
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R658
R659
R660
R661
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R662
R663
R664
R665
R666
R667
R668
R669
R670
R672
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
Part Number Specification
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP
ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHZ0000500 62 ohm,1/16W ,J ,1005 ,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
Color Remark
- 191 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
Level
6
Location
No.
R673
Description
RES,CHIP
6
6
R685
RA600
RES,CHIP
RES,ARRAY,R
6 U411 IC
6 U502 IC
U503 IC
U600
U601
IC
IC
VA503 VARISTOR
VA504 VARISTOR
VA601 VARISTOR
VA602 VARISTOR
VA608 VARISTOR
VA609 VARISTOR
VA610 VARISTOR
VA611 VARISTOR
VA612 VARISTOR
VA613 VARISTOR
VA614 VARISTOR
VA615 VARISTOR
VA616 VARISTOR
VA617 VARISTOR
VA619 VARISTOR
SPFY00 PCB,MAIN
WSYY00 SOFTWARE
SAJY00 PCB ASSY,SUB
SAJB00 PCB ASSY,SUB,INSERT
AFBA00 FRAME ASSY,SHIELD
MFEA00 FRAME,SHIELD
MTAC00 TAPE,SHIELD
MTAZ TAPE
MTAC00 TAPE,SHIELD
SAJE00 PCB ASSY,SUB,SMT
6
6
6
4
5
5
3
6
5
6
5
4
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Part Number Specification
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERNR0000403 10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP
EUSY0223002
HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT
CONTROL / 2.8V
EUSY0278601
QFN ,9 PIN,R/TP ,9 PIN,R/TP ,2.5W Mono D-Class Audio
AMP
EUSY0278601
QFN ,9 PIN,R/TP ,9 PIN,R/TP ,2.5W Mono D-Class Audio
AMP
EUSY0200301 Leadless chip ,6 PIN,R/TP ,Hall S/W, Pb Free
EUSY0236901 DFN ,12 PIN,R/TP ,1x/1.5x/2x Charge pump(Sink type)
SEVY0003801 18 V, ,SMD ,
SEVY0003801 18 V, ,SMD ,
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SPFY0100901 FR-4 ,1.0 mm,STAGGERED-8 ,3-6BVH,MUSE
WSYY0294301 U880-V10a-OCT-27-2005-H3G-IT+01
SAJY0013001
SAJB0005101
AFBA0003701
MFEA0008101
MTAC0032101 0.1t
MTAZ0094701
MTAC0032701 Shield Frame _ Rib
SAJE0007601
Color
Gold
Black
Remark
75
71
73
74
102
- 192 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
5
6
6
6
6
6
6
6
6
6
6
6
6
6
5
6
6
6
6
6
6
6
6
Level
5
Location
No.
Description
SAJC00
PCB ASSY,SUB,SMT
BOTTOM
6
6
BAT900
C905
BATTERY,CELL,LITHIUM
CAP,CERAMIC,CHIP
6
6
C907
C911
CAP,TANTAL,CHIP
CAP,TANTAL,CHIP
6
C912
C913
C914
C915
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
C916
C917
C931
C932
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CN901
CONN,JACK/PLUG,
EARPHONE
6 D901 DIODE,TVS
R901
R903
R904
R905
R906
R907
R916
R917
R920
S900
U901
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
CONN,SOCKET
DIODE,TVS
VA900 VARISTOR
VA901 VARISTOR
VA902 VARISTOR
SAJD00 PCB ASSY,SUB,SMT TOP
CN902
CONNECTOR,
BOARD TO BOARD
SPJY00 PCB,SUB
Part Number
SAJC0006101
Specification
SBCL0001305 3 V,1 mAh,COIN ,SMT Temp.260 degree. PB-Free B/B
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP
ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP
ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP
ENJE0003603 12 ,12 PIN,MMIC CONN.12P
EDTY0007601
SC-89 ,5 V,100 W,R/TP ,5 Channel Array , Vc 12V , 75pF ,
1.6*1.625*0.58
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000186 2.2 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0000292 470K ohm,1/16W,J,1005,R/TP
ERHY0000186 2.2 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ENSY0014101 8 PIN,ETC , ,1.1 mm,T-Flash Memory Socket
EDTY0007801 SC-70 ,5 V,150 W,R/TP ,LOW CAPACITANCE TVS ARRAY
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SAJD0007201
ENBY0019601 24 PIN,.4 mm,ETC , ,H=1.5, Header
SPJY0016301 FR-4 ,0.8 mm,MLB ,MUSE
Color Remark
- 193 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
10.3 Accessory
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Level
3
3
3
3
Location
No.
SBPP
SBPP00
Description
BATTERY PACK,
LI-POLYMER
BATTERY PACK,
LI-POLYMER
Part Number Specification
SBPP0013001
3.7 V,1040 mAh,1 CELL,PRISMATIC ,Muse(U880) Middle
Battery, Silver
SBPP0012501
3.7 V,800 mAh,1 CELL,PRISMATIC ,MUSE(U8200),
BATTERY
SGDY00 DATA CABLE SGDY0010701 DC-US02K ,USB Datacable(ground contact first)
SGEY00 EAR PHONE/EAR MIKE SET SGEY0003707 U880,8550 ,GRAY-AIR CAP,2.0TMMI12P
3 SSAD00 ADAPTOR,AC-DC SSAD0007848 FREE ,50 Hz,4.6 V,0.8 A,CE ,3G
Color
Silver
Remark
Silver
- 194 -
Note
Note

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Key features
- UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900 support
- 1.3 megapixel camera
- Bluetooth connection
- USB port for data transfer
- Folder design
- White LED Backlight
- Vibrator
- Trans-Flash external memory