LG U8290 Mobile Phone Service Manual
Below you will find brief information for Mobile Phone U8290. The LG U8290 is a GSM & WCDMA phone. This phone features a camera in the clamshell design, a 1.3 megapixel camera, Bluetooth and USB connectivity for data transfer.
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Date: August, 2005 / Issue 1.0
Service Manual
U8290
Table Of Contents
1. INTRODUCTION .............................. 6
1.1 Purpose................................................... 6
1.2 Regulatory Information............................ 6
3.5.9 GSM band Rx RF filter ................... 37
3.5.10 VCTCXO ....................................... 37
3.5.11 UMTS Rx VCO.............................. 37
3.5.12 Bluetooth....................................... 37
2. PERFORMANCE.............................. 8
2.1 System Overview .................................... 8
2.2 Usable Environment................................ 9
2.3 Radio Performance ................................. 9
2.4 Current Consumption............................ 15
2.5 RSSI Bar ............................................... 15
2.6 Battery Bar ............................................ 15
2.7 Sound Pressure Level........................... 16
2.8 Charging ............................................... 17
3. TECHNICAL BRIEF ....................... 18
3.1 General Description .............................. 18
3.2 GSM Mode............................................ 21
3.2.1 GSM Receiver ................................ 21
3.2.2 GSM Transmitter............................. 24
3.3 WCDMA Mode ...................................... 25
3.3.1 Receiver.......................................... 25
3.3.2 Transmitter...................................... 28
3.4 LO Phase-locked Loop ......................... 29
3.4.1 UMTS Rx PLL (PLL2) ..................... 29
3.4.2 Transceiver PLL (PLL1) .................. 30
3.5 Off-chip RF Components ...................... 31
3.5.1 Antenna switch module................... 31
3.5.2 UMTS duplexer .............................. 31
3.5.3 UMTS Power Amplifier.................... 32
3.5.4 Thermistor....................................... 33
3.5.5 UMTS transmit power detector ....... 33
3.5.6 Dual band GSM power amplifier .... 34
3.5.7 GSM transmit VCO ......................... 36
3.5.8 UMTS Rx RF filter........................... 36
3. BB Technical Description............. 39
3.6 Digital Baseband................................... 39
3.6.1 General Description ........................ 39
3.7 Hardware Architecture .......................... 40
3.7.1 Block Diagram ................................ 41
3.8 Subsystem(MSM6250) ......................... 42
3.8.1 ARM Microprocessor Subsystem.... 42
3.8.2 UMTS Subsystem ........................... 42
3.8.3 GSM Subsystem ............................. 42
3.8.4 RF Interface .................................... 42
3.8.5 Serial Bus Interface(SBI) ................ 42
3.8.6 Wideband CODEC.......................... 43
3.8.7 Vocoder Subsystem........................ 43
3.8.8 HKADC ........................................... 43
3.8.9 Mode Select and JTAG Interfaces .. 43
3.8.10 General-Purpose Input/Output
Interface ........................................ 43
3.8.11 UART ............................................ 44
3.8.12 USB .............................................. 44
3.9 External memory interface ................... 45
3.10 H/W Subsystem .................................. 46
3.10.1 RF Interface .................................. 46
3.10.2 MSM Subsystem........................... 48
3.10.3 Power Block .................................. 51
3.10.4 Key Pad ........................................ 56
3.10.5 Camera Interface .......................... 57
3.10.6 Folder ON/OFF Operation ............ 59
3.10.7 Camera Direction Detection.......... 60
3.10.8 Keypad Light ................................. 61
3.10.9 Camera Light Flash ...................... 62
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Table Of Contents
3.10.10 LCD Module ................................ 63
3.10.11 Audio and Sound ........................ 65
4.21 Audio Trouble Shooting .................... 125
4.22 Charger Trouble Shooting................. 144
4. TROUBLE SHOOTING .................. 78
4.1 RF Component...................................... 78
4.2 SIGNAL PATH ...................................... 80
4.3 Checking VCXO(19.2MHz) Block ......... 81
4.4 Checking Ant. SW Module Block .......... 83
4.5 Checking WCDMA Block ...................... 85
4.5.1 Checking VCXO Block ................... 86
4.5.2 Checking Ant. SW module .............. 86
4.5.3 Checking RF TX Level ................... 86
4.5.4 Checking PAM Block ...................... 88
4.5.5 Check RF Rx Level ........................ 89
4.6 Checking GSM Block ............................ 91
4.6.1 Checking TXVCO Block.................. 92
4.6.2 Checking Ant. SW Module ............. 94
4.6.3 Checking RF Tx level ..................... 94
4.6.4 Checking PAM Block ..................... 96
4.6.5 Checking RF Rx Block ................... 97
4.7 Bluetooth RF Block ............................... 99
4.8 LG-U8290 Main features..................... 102
4.9 LG-U8290 Main Component ............... 103
4.10 Power ON Trouble ............................ 107
4.11 USB Trouble ..................................... 109
4.12 SIM Detect Trouble ........................... 111
4.13 Key Sense Trouble ........................... 112
4.14 Camera Trouble ................................ 113
4.15 Main LCD Trouble............................. 114
4.16 Sub LCD Trouble .............................. 116
4.17 Keypad Backlight Trouble ................. 118
4.18 Folder ON/OFF Trouble .................... 119
4.19 Camera Direction Detection Trouble. 121
4.20 Camera Flash Trouble ...................... 123
5. BLOCK DIAGRAM ....................... 150
5.1 GSM & WCDMA RF Block.................. 150
5.2 Interface Diagram ............................... 152
6. DOWNLOAD ................................ 156
6.1 Introduction ......................................... 156
6.2 Downloading Procedure...................... 156
6.3 Troubleshooting Download Errors ...... 169
6.4 Caution................................................ 174
7. CALIBRATION ............................. 175
7.1 General Description ............................ 175
7.2 Pegasus Environment......................... 175
7.2.1 H/W Environment.......................... 175
7.2.2 S/W Environment .......................... 175
7.2.3 Configuration Diagram of
Calibration Environment................ 175
7.3 Calibration Explanation ....................... 176
7.3.1 Overview ....................................... 176
7.3.2 Calibration Items ........................... 176
7.3.3 EGSM 900 Calibration Items ........ 177
7.3.4 DCS 1800 Calibration Items ......... 179
7.3.5 PCS 1900 Calibration Items ......... 180
7.3.6 WCDMA Calibration Items ............ 182
7.4 Program Operation ............................. 187
7.4.1 Pegasus Program Overview ......... 187
7.4.2 Pegasus Function Description ...... 187
7.4.3 Calibration Procedure ................... 192
7.4.4 Calibration Result Message .......... 192
7.4.5 Pegasus Configuration File Format .. 193
8. CIRCUIT DIAGRAM ..................... 195
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9. PCB LAYOUT ............................... 203
10. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 208
10.1 EXPLODED VIEW ............................ 208
10.2 Replacement Parts
<Mechanic component>.................... 209
<Main component> ........................... 214
10.3 Accessory ......................................... 232
Table Of Contents
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1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
- 6 -
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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2. PERFORMANCE
2. PERFORMANCE
2.1 System Overview
Item
Shape
Size
Weight
Power
Talk Time
Standby Time
Antenna
LCD
LCD Backlight
Camera
Vibrator
LED Indicator
C-MIC
Receiver
Earphone Jack
Connectivity
Volume Key
External Memory
I/O Connect
Specification
GSM900/1800/1900 and WCDMA Folder Handset
89.2 X 47.8 X 24.5 mm
115 g (with Battery)
4.0V normal, 1400 mAh Li-Polymer
Over 170 min (WCDMA, Tx=12 dBm, Voice)
Over 220 min (GSM, Tx=Max, Voice)
Over 170 Hrs (WCDMA, DRX=1.28)
Over 250 Hrs (GSM, Paging period=9)
Fixed Type (Fixed Screw)
Main 176 X 220 pixel (TFT) / sub 96 X 96 pixel (CSTN)
White LED Back Light (2way ; main/sub common)
1.3 Mega pixel (CMOS)
Yes (Coin Type)
No
Yes
Yes
Yes (12 pin)
Bluetooth, USB
Push Type(+, -)
Trans-Flash
24 Pin
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2. PERFORMANCE
2.2 Usable environment
1) Environment
Item
Voltage
Operation Temp
Storage Temp
Humidity
Spec.
4.0 V(Typ), 3.38 V(Min), [Shut Down : 3.28 V]
-20 ~ +60
°C
-30 ~ +85
°C
85 % (Max)
2) Environment (Accessory)
Item
TA Power
* CLA : 12 ~ 24 V(DC)
Spec.
Available power
Min
100
Typ.
220
Max
240
Unit
Vac
2.3 Radio Performance
1) Transmitter - GSM Mode
No Item
MS allocated
Channel
100k~1GHz
1G~12.75GHz
1
Conducted
Spurious
Emission
Idle Mode
100k~880MHz
880M~915MHz
915M~1GHz
1G~[A]MHz
[A]M~[B]MHz
[B]M~12.5GHz
* In case of DCS : [A] -> 1710, [B] -> 1785
- 9 -
GSM DCS & PCS
9k ~ 1GHz -39dBm
-39dBm
1G~[A]MHz
[A]M~[B]MHz
-33dBm
[B]M~12.75GHz
-60dBm 100k~880MHz
-33dBm
-39dBm
-33dBm
-60dBm
-62dBm 880M~915MHz
-60dBm 915M~1GHz
-62dBm
-60dBm
-50dBm 1G~[A]MHz
-56dBm [A]M~[B]MHz
-50dBm
-56dBm
-50dBm [B]M~12.5GHz
-50dBm
* In case of PCS : [A] -> 1850, [B] -> 1910
2. PERFORMANCE
No
2
3
4
5
Radiated
Spurious
Emission
Item
MS allocated
Channel
Idle Mode
Frequency Error
Phase Error
Frequency Error
Under Multipath and
Interference Condition
30M ~ 1GHz
1G ~ 4GHz
915M~1GHz
1G~[A]MHz
[A]M~[B]MHz
[B]M~4GHz
±0.1ppm
±5(RMS)
±20(PEAK)
GSM
30M ~ 880MHz
880M ~ 915MHz
DCS & PCS
30M~1GHz -36dBm
-36dBm
1G~[A]MHz
[A]M~[B]MHz
-30dBm
[B]M~4GHz
-57dBm 30M~880MHz
-30dBm
-36dBm
-30dBm
-57dBm
-59dBm 880M~915MHz
-57dBm
-47dBm 1G~[A]MHz
-53dBm
915M~1GHz
[A]M~[B]MHz
-47dBm [B]M~4GHz
±0.1ppm
±5(RMS)
±20(PEAK)
-59dBm
-57dBm
-47dBm
-53dBm
-47dBm
3dB below reference sensitivity 3dB below reference sensitivity
RA250 : ±200Hz
HT100 : ±100Hz
RA250: ±250Hz
HT100: ±250Hz
TU50 : ±100Hz
TU3 : ±150Hz
0 ~ 100kHz
200kHz
+0.5dB
-30dB
TU50: ±150Hz
TU1.5: ±200Hz
0 ~ 100kHz
200kHz
6
Output RF
Spectrum
Due to
250kHz
400kHz modulation 600 ~ 1800kHz
Due to
Switching transient
* In case of DCS : [A] -> 1710, [B] -> 1785
-33dB
-60dB
250kHz
400kHz
1800 ~ 3000kHz
3000 ~ 6000kHz
≥6000kHz
400kHz
600kHz
1200kHz
-66dB 600 ~ 1800kHz
-69dB 1800 ~ 6000kHz
-71dB ≥6000kHz
-77dB
-19dB 400kHz
-21dB 600kHz
-21dB 1200kHz
1800kHz -24dB 1800kHz
* In case of PCS : [A] -> 1850, [B] -> 1910
+0.5dB
-30dB
-33dB
-60dB
-60dB
-65dB
-73dB
-22dB
-24dB
-24dB
-27dB
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2. PERFORMANCE
No
7
8
9
Item
Intermodulation attenuation
Transmitter Output Power
Burst timing
10
11
12
13
8
9
6
7
GSM
–
DCS & PCS
Frequency offset 800kHz
Intermodulation product should be Less than 55dB below the level of Wanted signal
Power control Power Tolerance Power control Power Tolerance
Level
5
(dBm)
33
(dB)
±3
Level
0
(dBm)
30
(dB)
±3
31
29
27
25
23
21
19
17
±3
±3
±3
±3
±3
±3
±3
±3
1
2
3
4
5
6
7
8
28
26
24
22
20
18
16
14
±3
±3
±3
±3
±3
±3
±3
±3
14
15
16
17
18
19
15
13
11
9
7
5
Mask IN
±3
±3
±5
±5
±5
±5
13
14
15
9
10
11
12
8
6
12
10
4
2
0
Mask IN
±4
±5
±5
±4
±4
±4
±4
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2. PERFORMANCE
2) Transmitter-WCDMA Mode
No
1
2
3
Maximum Output Power
Frequency Error
Item
Open Loop Power control in uplink
Specification
Class3: +24dBm(+1/-3dB)
Class4: +21dBm(±2dB)
±0.1ppm
±9dB@normal, ±12dB@extreme
Adjust output(TPC command) cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4.5
4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4.5
group(10equal command group)
+1 +8/+12 +16/+24
5 Minimum Output Power -50dBm(3.84MHz)
Qin/Qout : PCCH quality levels
6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB
Ton@DPCCH/Ior : -24 -> -18dB
7 Transmit OFF Power -56dBm(3.84MHz)
±25us
8 Transmit ON/OFF Time Mask
PRACH,CPCH,uplinlk compressed mode
±25us
9
10
11
12
Change of TFC
Power setting in uplink compressed
Occupied Bandwidth(OBW)
Spectrum emission Mask
Power varies according to the data rate
DTX : DPCH off
(minimize interference between UE)
±3dB(after 14slots transmission gap)
5MHz(99%)
-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz, 30k
-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz, 1M
-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz, 1M
-49 dBc@∆f=8.5~12.5MHz, 1M
- 12 -
2. PERFORMANCE
No Item
13 Adjacent Channel Leakage Ratio(ACLR)
14
Spurious Emissions
(*: additional requirement)
15 Transmit Intermodulation
16 Error Vector Magnitude(EVM)
17 Transmit OFF Power
Specification
33dB@5MHz, ACP>-50dBm
43dB@10MHz, ACP>-50dBm
-36dBm@f=9~150KHz, 1K BW
-36dBm@f=50KHz~30MHz, 10K BW
-36dBm@f=30MHz~1000MHz, 100K BW
-30dBm@f=1~12.5GHz, 1M BW
(*)-41dBm@f=1893.5~1919.6MHz, 300K
(*)-67dBm@f=925~935MHz, 100K BW
(*)-79dBm@f=935~960MHz, 100K BW
(*)-71dBm@f=1805~1880MHz, 100K BW
-31dBc@5MHz,Interferer -40dBc
-41dBc@10MHz, Interferer -40dBc
17.5%(>-20dBm)
(@12.2K, 1DPDCH+1DPCCH)
-15dB@SF=4.768Kbps, Multi-code transmission
3)Receiver - GSM Mode
No
1
2
Item
Sensitivity (TCH/FS Class II)
Co-Channel Rejection
(TCH/FS Class II, RBER, TU high/FH)
3 Adjacent Channel
Rejection
200kHz
400kHz
4
5
Intermodulation Rejection
Blocking Response
(TCH/FS Class II, RBER)
GSM
-105dBm
C/Ic=7dB
DCS & PCS
-105dBm
Storage -30 ~ +85
C/Ia1=-12dB
C/Ia2=-44dB
Wanted Signal: -98dBm
1st interferer: -44dBm
C/Ia1=-12dB
C/Ia2=-44dB
Wanted Signal: -96dBm
1st interferer: -44dBm
2nd interferer: -45dBm
Wanted Signal: -101dBm
2nd interferer: -44dBm
Wanted Signal: -101dBm
Unwanted : Depend on Frequency Unwanted : Depend on Frequency
- 13 -
2. PERFORMANCE
4) Receiver - WCDMA Mode
No Item
1 Reference Sensivitivity Level
2 Maximum Input Level
3 Adjacent Channel Selectivity(ACS)
4 In-band Blocking
5 Out-band Blocking
6 Spurious Response
7 Intermodulation Characteristic
8 Spurious Emissions
- 14 -
Specification
-106.7dBm(3.84 MHz)
-25dBm(3.84MHz)
-44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(Class3)
33dB
UE@+20dBm output power(Class3)
-56dBm/3.84MHz@10MHz
UE@+20dBm output power(Class3)
-44dBm/3.84MHz@15MHz
UE@+20dBm output power(Class3)
-44dBm/3.84MHz@f=2050~2095 and
2185~2230MHz
UE@+20dBm output power(Class3)
-30dBm/3.84MHz@f=2025~2050 and
2230~2255MHz
UE@+20dBm output power(Class3)
-15dBm/3.84MHz@f=1~2025 and
2255~12500MHz
UE@+20dBm output power(Class3)
-44dBm CW
UE@+20dBm output power(Class3)
-46dBm CW@10MHz
-46dBm/3.84MHz@20MHz
UE@+20dBm output power(Class3)
-57dBm@f=9KHz~1GHz, 100K BW
-47dBm@f=1~12.5GHz, 1M BW
-60dBm@f=1920MHz~1980MHz, 3.84M BW
-60dBm@f=2110MHz~2170MHz, 3.84M BW
2. PERFORMANCE
2.4 Current Consumption
WCDMA
GSM
Stand by
Under 8.5 mA
(DRX=1.28)
Under 6.3 mA
(Paging=9period)
Under 7.0 mA
(@Bluetooth Connected,
Paging=9period)
Voice Call
Under 450 mA
(Tx=12dBm)
Under 380 mA
(Tx=Max)
(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight Off)
(VT Test Condition : Speaker off, LCD backlight On)
2.5 RSSI Bar
Level Change
BAR 5
→ 4
BAR 4
→ 3
BAR 3
→ 2
BAR 2
→1
BAR 1
→ 0
WCDMA
-85 ±2 dBm
-90 ±2 dBm
-95 ±2 dBm
-98 ±2 dBm
-101 ±2 dBm
VT
Under 640mA
(Tx=12dBm)
GSM
-85 ±2 dBm
-90 ±2 dBm
-95 ±2 dBm
-100 ±2 dBm
-105 ±2 dBm
2.6 Battery Bar
Indication
Bar 4
Bar 4
→ 3
Bar 3
→ 2
Bar 2
→ 1
Bar 1
→ Empty
Low Voltage,
Warning message+ Blinking
Power Off
Standby
Over 3.83 ±0.05V
3.82 ±0.05V
3.74 ±0.05V
3.67 ±0.05V
3.49 ±0.05V
3.38 ±0.05V (Stand-by) / 3.49 ±0.05V (Talk)
[Interval : 3min(Stand-by) / 1min(Talk)]
3.28 ±0.05V
↓
- 15 -
2. PERFORMANCE
2.7 Sound Pressure Level
10
11
12
13
14
15
8
9
No
1
2
3
4
5
6
7
16
17
Test Item
Sending Loudness Rating (SLR)
Receiving Loudness Rating (RLR)
Side Tone Masking Rating (STMR)
Echo Loss (EL)
Sending Distortion (SD)
Receiving Distortion (RD)
Idle Noise-Sending (INS)
Idle Noise-Receiving (INR)
Sending Loudness Rating (SLR)
Receiving Loudness Rating (RLR)
Side Tone Masking Rating (STMR)
Echo Loss (EL)
Sending Distortion (SD)
Receiving Distortion (RD)
Idle Noise-Sending (INS)
Idle Noise-Receiving (INR)
TDMA Noise
-. GSM : Power Level : 5
DCS/PCS : Power Level : 0
(Cell Power : -90 ~ -105 dBm)
-,. Acoustic (Max Vol.)
MS/Headset SLR : 8 ±3dB
MS/Headset RLR : -18 ±3dB / -15dB
(SLR/RLR : Mid-value setting)
MS
Headset
Specification
8 ±3 dB
-7 ±3 dB Nor
Max
Min
-18 ±3 dB
17 dB
Min 40 dB
Refer to Table 30.3
Max
Refer to Table 30.4
-64 dBm0p
Nor
Max
Under -47 dBPA
Under -36 dBPA
Nor
Max
Min
8±3dB
-1 ±3 dB
-12 ±3 dB
25 dB
Min 40 dB
Refer to Table 30.3
Max
Refer to Table 30.4
-55 dBm0p
Nor
Max
Under -45 dBPA
Under -40 dBPA
MS and
Headset
Max -62 dBm
- 16 -
2.8 Charging
•
Charging Method : CC & CV (Constant Current and Constant Voltage)
•
Maximum Charging Voltage : 4.2 V
•
Maximum Charging Current : 600 mA
•
Normal Battery Capacity : 1400 mAh
•
Charging Time : Max 4.0 hours (except for trickle charging time)
•
Full charging indication current (charging icon stop current) : 60 mA
•
Cut-off voltage : 3.28 V
2. PERFORMANCE
- 17 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 General Description
The U8290 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and
PCS1900 transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
Figure 3.1-1 Block diagram of RF part
1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.
- 18 -
3. TECHNICAL BRIEF
A generic, high-level functional block diagram of U8290 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation).
The UMTS receive signal is amplified by the RFL6200 LNA then passes through a bandpass filter before being applied to the RFR6200 Receiver IC. On-chip circuits downconvert the received signal directly from RF to baseband using radioOne Zero-IF techniques. Generation of the UMTS downconverter LO is distributed between the RTR6250 (phase-locked loop), the RFR6200 (buffer amplifiers and LO distribution circuits) and external UHF VCO and loop filter circuits. The RFR6200 IC outputs analog baseband signals for further processing by the MSM device. This baseband interface is shared with the RTR6250 EGSM /DCS/PCS receiver outputs.
EGSM, DCS and PCS receive signals pass through their bandpass filters then are applied to the
RTR6250 IC. Similar to the UMTS path, RTR6250 circuits downconvert the received signals directly from RF to baseband. The EGSM/DCS/PCS downconverter LO is generated mostly within the
RTR6250 (PLL and distribution functions); the UMTS Rx CH VCO and loop filter are off-chip. The RTR analog baseband outputs are routed to the MSM6250 IC for further processing (an interface shared with the RFR).
The UMTS transmit path begins with analog baseband signals from the MSM device that drive the
RTR6250 IC. Integrated PLL and VCO circuits generate the Tx LO used in the quadrature upconverter that translates baseband signals directly to RF. The RTR6250 output driver stages deliver fairly highlevel signals that are filtered and applied to the power amplifiers (PA). The PA output is routed to the antenna through a duplexer and switch module.
The shared EGSM-900, DCS-1800, and PCS-1900 transmit path begins with the same baseband interface from the MSM6250 IC that is used for the UMTS band. A single EGSM/DCS/PCS quadrature upconverter translates the GMSK-modulated signal to a convenient intermediate frequency (IF) that forms one input to an offset phase-locked loop (OPLL). OPLL functions are split between the
RTR6250 IC and off-chip loop filter and dual Tx VCO circuits, and translate the GMSK-modulated signal to the desired EGSM-900, DCS-1800 or PCS-1900 channel frequency. This signal is applied to a dual power amplifier (only one is active at a time). The enabled path continues with the PA, an automated power control (APC) circuit that samples the transmit power and adjusts its level, the switch module (which includes a band-appropriate lowpass filter), and the antenna.
U8290 power supply voltages are managed and regulated by the PM6650 Power Management IC.
This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.
- 19 -
3. TECHNICAL BRIEF
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.
- 20 -
3. TECHNICAL BRIEF
3.2 GSM Mode
3.2.1 GSM Receiver
The Dual-mode U8290’s receiver functions are split between the three RFICs as follows:
• UMTS-2100 operation uses the RFL6200 LNA and RFR6200 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q).
• EGSM-900, DCS-1800, and PCS-1900 modes both use the RTR6250 IC only.
Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI 2 -controlled parameters.
RF Front end consists of antenna, antenna switch module(SFAY0004601), and three RX saw filters(GSM, DCS, and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In U8290, a common antenna connects to one of six paths: 1) UMTS-2100
Rx/Tx, 2) EGSM-900 Rx, 3) EGSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800,PCS-1900 Tx(High
Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. EGSM, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required.
GSM 900 TX
GSM 900 RX/W-CDMA
DCS 1800/PCS 1900 TX
DCS 1800 RX
PCS 1900 RX
ANT_SEL2 GPIO(11) ANT_SEL1 GPIO(10) ANT_SEL0 GPIO(9)
LOW
LOW
HIGH
LOW
HIGH
LOW
LOW
HIGH
HIGH
LOW
Table 3.2.1-1 Antenna Switch Module Control logic
HIGH
LOW
LOW
LOW
LOW
2 The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application
Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS
Software documentation for details.
- 21 -
3. TECHNICAL BRIEF
The EGSM, DCS, and PCS receiver inputs of RTR6250 are connected directly to the transceiver frontend circuits(filters and antenna switch module). EGSM, DCS, and PCS receiver inputs are similar to the RFR6200 UMTS Rx input in that they also use differential configurations to improve commonmode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins
Since EGSM, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers
- this is accomplished in the switch module.
The EGSM, DCS, and PCS receive signals are routed to the RTR6250 through band selection filters and matching networks that transform single-ended 50-
Ωsources to differential impedances optimized for gain and noise figure. Similar to the RFR, the RTR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance. The RTR6250 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections.
The filter outputs are buffered and passed on to the MSM6250 IC for further processing (an interface shared with the RFR6200 UMTS receiver outputs).
- 22 -
3. TECHNICAL BRIEF
Figure 3.2.1-1 RTR6250 IC Functional Block Diagram
- 23 -
3. TECHNICAL BRIEF
3.2.2 GSM Transmitter
The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6250 IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250. This upconverter translates the GMSKmodulated signal to a convenient intermediate frequency (IF) that forms one input to a frequency/phase detector circuit. This
IF signal is the reference input to an offset phase-locked loop (OPLL) circuit as shown in Figure 3.2.2-1.
Figure 3.2.2-1 Offset phase-locked loop interfaces
The feedback path of this OPLL circuit includes a downconversion from the RF output frequency range to the IF range. The two inputs to this downconversion mixer are formed as follows:
1. The dual Tx VCO output (operating in the desired RF output frequency range) is buffered within the
RTR6250 IC then applied to the mixer RF port.
2. The LO Generation and Distribution circuits that deliver the transmit path.s LO for the baseband-to-IF upconversion also provides the .offset LO. signal that is applied to the feedback path.s mixer LO port.
The mixer IF port output is the offset feedback signal - the variable input to the frequency/phase detector circuit. The detector compares its variable input to its reference input and generates an error signal that is lowpass filtered by the loop filter and applied to the dual Tx VCO tuning port to force the
VCO output in the direction that minimizes errors. As mentioned earlier, the VCO output is connected to the feedback path thereby creating a closed-loop control system that will force frequency and phase errors between the variable and reference inputs to zero.
- 24 -
3. TECHNICAL BRIEF
The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons:
1. Phase-locked loops provide a lowpass filter function from the reference input to the VCO output. This results in a bandpass function centered at the desired channel frequency that provides steep, wellcontrolled rejection of the out-of-band spectrum.
2. The resulting output bandpass function is virtually unchanged as the transmitter is tuned over channels spanning the GSM operating band.
The PA is a key component in any transmitter chain and must complement the rest of the transmitter precisely. For GSM band operation, the closed-loop transmit power control functions add even more requirements relative to the UMTS PA. In addition to gain control and switching requirements, the usual
RF parameters such as gain, output power level, several output spectrum requirements, and power supply current are critical. The gain must be sufficient and variable to deliver the desired transmitter output power given the VCO output level, the subsequent passive devices’ losses, and the control set point. The maximum and minimum transmitter output power levels depend upon the operating band class and mobile station class per the applicable standard. Transmitter timing requirements and inband and out-of-band emissions, all dominated by the PA, are also specified by the applicable standard.
The active dual Tx VCO output is applied to the dual power amplifier to continue the transmit path, and feedback to the RTR6250 IC to complete the frequency control loop. The PA operating band (EGSM or
DCS/PCS) is selected by the MSM device GPIO control (GSM_PA_BAND).
3.3 WCDMA Mode
3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RFL6200 device. These LNA functions are removed from the RFR6200 IC to improve mixer LO to RF isolation - a critical parameter in the Zero-IF architecture. Isolation is further improved using high reverse isolation circuits in the LNA designs. The LNA gain is incrementally and dynamically controlled by the MSM device to maximize receiver dynamic range.
- 25 -
3. TECHNICAL BRIEF
VDDA
R_BIAS
GND
UMTS_BIAS
Bias and
Control
Circuits
S
B
I
VDDM
SBCK
SBST
SBDT
UMTS_IN UMTS_OUT
Ground Slug
GND GND GND
Figure 3.3.1-1 RFL6200 IC functional block diagram
The UMTS LNA output is routed to the RFR6200 through a band selection filter that transforms a single-ended 50
Ω source to a differential impedanc e that is matched to the RFR6200 IC. The RFR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance. The RFR6200 input stages include MSM-controlled gain adjustments that further extend receiver dynamic range.
The RFR6200 IC (Figure 3.3.1-2) provides the UMTS Zero-IF receiver signal path, from RF to analog baseband. The input gain stage implements MSM controlled gain adjustments to extend receiver dynamic range. The amplifier output drives the RF port of the quadrature RF-to-baseband downconverter then the downconverted baseband outputs are routed to lowpass filters (one I and one
Q) whose passband and stopband characteristics are suitable for DS-WCDMA signals. The filter outputs are buffered and routed to the MSM device for further processing. This baseband interface is shared with the RTR6250 EGSM/DCS/PCS receiver outputs.
LO_INP LO_INM LO_OUT TCXO VDDA
UMTS_INP
UMTS_INM
LO Generation
& Distribution
Quadrature
Downconverter ctls
Control
Circuits
LPF
LPF
Bias
Ckts
S
B
I ground slug
GND
Figure 3.3.1-2 RFR6200 IC functional block diagram
R_BIAS
VDDM
SBCK
SBST
SBDT
RX_IP
RX_IM
RX_QP
RX_QM
- 26 -
3. TECHNICAL BRIEF
The RFR6200 IC includes LO generation and distribution circuitry to reduce offchip component requirements. The UMTS Rx LO source is created using an external UMTS Rx CH VCO that is closedloop controlled by the RTR6250 PLL2 via a discrete loop filter. The external UMTS_RX_VCO signal is processed by the LO generation and distribution circuits to create the quadrature downconverter LO signal. The LO signal applied at the mixer ports are at a frequency different than the VCO frequency.
This assures that the VCO frequency is different than the RF frequency, an important consideration for
Zero-IF processing. QUALCOMM.s Mobile Station Modem (MSM6250) device provides status and control signaling, employing power reduction features (such as selective circuit power-down, gain control, and bias control) to extend handset standby time.
- 27 -
3. TECHNICAL BRIEF
3.3.2 Transmitter
The UMTS transmit path begins with analog baseband signals from the MSM device that drive the
RTR6250 IC. The RTR6250 IC provides all the UMTS transmitter active signal-path circuits except the power amplifiers. Analog (I and Q) differential signals from the MSM device are buffered, filtered, and applied to Baseband-to-RF quadrature upconverters. Gain control is implemented on-chip.
The RF outputs include an integrated matching inductor, reducing the off-chip matching network to a single series capacitor.
The RTR6200 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in U8290 is “Load
Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.
The RTR6250 IC integrates LO generation and distribution circuits on-chip, substantially reducing offchip requirements. Various modes and programmable features result in a highly flexible transceiver LO output that supports not only UMTS transmissions, but all EGSM900 and DCS1800/PCS1900 Rx and
Tx modes as well.
The UMTS Tx LO (PLL1) is generated almost entirely on-chip, requiring only the loop filter off-chip
(two capacitors and two resistors); all UMTS Tx VCO and PLL circuits are on-chip. An internal
RTR6250 switch routes the internal VCO signal to the LO generation and distribution circuits to create the necessary UMTS Tx LO signals.
- 28 -
3. TECHNICAL BRIEF
3.4 LO Phase-locked Loop
Most LO functions are fully integrated on-chip, do not require user adjustment, and need not be considered by handset designers. QUALCOMM has established and implemented frequency plans and LO generation schemes that support the radioOne 6250-IIseries chipset while requiring minimal off-chip design effort. Only one area requires handset designer attention: the loop filters of each phase-locked loop (PLL).
3.4.1 UMTS Rx PLL (PLL2)
UMTS Rx LO functional blocks are distributed between the RFR6200 IC, RTR6250 IC, and external
UMTS_RX_CH_VCO and loop filter components (Figure 3.4.1-1).
The external UMTS_RX_CH_VCO must be enabled for UMTS Rx operation and disabled otherwise; a dedicated MSM6250 IC signal (UHF_VCO_EN ) enables the VCO.
Figure 3.4.1-1 UMTS Rx PLL functional block diagram
The RFR6200 IC accommodates single-ended or differential LO inputs; if singleended, either pin can be active. AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used in U8290). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6200 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter.
A sample of the downconverter LO is buffered and routed from RFR6200 IC pin 19 to RTR6250 IC pin
32 (RX_VCO_IN). This signal requires a terminating resistor near the RTR6250 IC input pin and an AC coupling capacitor that assures the internal RTR6250 IC biasing is not disrupted in the example. Good microstrip or stripline controlled-impedance techniques must be used
- 29 -
3. TECHNICAL BRIEF
Most UMTS Rx PLL circuits are included within the RTR6250 IC: reference divider, phase detector, charge pump, feedback divider, and digital logic that generate LOCK status. The buffered 19.2 MHz
TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase and frequency locked.
The reference is divided by the R-Counter to create a fixed frequency input to the phase detector, FR.
The other phase detector input (FV) varies as the loop acquires lock, and is generated by dividing the
RX_VCO_IN frequency using the feedback path.s N-Counter. The closed loop will force FV to equal
FR when locked. If the loop is not locked the error between FV and FR will create an error signal at the output of the charge pump. This error signal is filtered by the loop filter and applied to the VCO, tuning the output frequency such that the error is decreased. Ultimately the loop forces the error to approach zero and the PLL is phase and frequency locked.
Many key PLL performance characteristics are largely determined by the loop filter design - stability, transitory response, settling time, and phase noise.
3.4.2 Transceiver PLL (PLL1)
All LO functional blocks for the other handset modes(UMTS Tx, EGSM Tx/Rx, DCS Tx/Rx, PCS
Tx/Rx) are integrated into the RTR6250 IC except the loop filter components (Figure 3.4.2-1). On-chip circuits include reference divider, phase detector, charge pump, VCO, feedback divider, and digital logic status. The functional description given in Section 3.4.1 for the UMTS Rx PLL applies to the
Transceiver PLL as well.
Figure 3.4.2-1 Transceiver PLL functional block diagram
- 30 -
3. TECHNICAL BRIEF
The off-chip loop filter allows optimization of key PLL performance characteristics (stability, transitory response, settling time, and phase noise) for different applications. Guidelines are provided in the next subsection for proper implementation of this critical circuit.
3.5 Off-chip RF Components
3.5.1 Antenna switch module (U207 : LMSP43MA-288)
The antenna switch module allows multiple operating bands and modes to share the same antenna. In the U8290 design, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) EGSM
Rx, 3) DCS-1800 Rx, 4) PCS-1900 Rx, 5)EGSM Tx Tx, and 6) DCS-1800, PCS-1900 Tx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. GSM band of operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required. The module includes lowpass filters for the GSM bands transmit paths to reduce out-of-band emissions, PA harmonics in particular.
3.5.2 UMTS duplexer (U202 : DMF1950IHC)
A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include:
-. Insertion loss . this component is also in the receive and transmit paths; In the U8290 typical losses:
UMTS Tx = 1.2 dB, UMTS Rx = 1.5 dB.
-. Out-of-band rejection or attenuation . the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance:
-. Rx-band isolation . the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and
Rx-band losses between the PA and LNA. Typical duplexer Rx band isolation value is 45 dB.
-. Tx-band isolation . the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall inband to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Typical duplexer Tx-band isolation value is 50 dB.
-. Passband ripple . the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the band.s channels, and should be controlled.
- 31 -
3. TECHNICAL BRIEF
-. Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).
-. Power handling . high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance.
3.5.3 UMTS Power Amplifier (U204 : SKY77410)
The SKY77410 Load Insensitive Power Amplifier (LIPA TM ) module is a fully matched 16-pin surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient power amplifier packs full coverage of the 1850-1980 MHz bandwidth into a single compact package.
SKY77410 meets the stringent spectral linearity requirements of WCDMA transmission with high power added efficiency for power output of up to 28 dBm, even with a load mismatch of 4:1 VSWR eliminating the need for an isolator. A low current (VCONT) pin provides improved operating efficiency in the low RF power range. To further improve efficiency in this range, a separate VBIAS pin can be directly connected to the battery, which allows reducing VCC1 and VCC2 voltages to 0.8 V to achieve very low power consumption.
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. The output match is realized off-chip within the module package to optimize efficiency and power performance into a 50
Ω load. This device is manufactured with
Skyworks’ GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage
DC supply operation while maintaining high efficiency and good linearity.
Primary bias to the SKY77410 is supplied directly from a three-cell Ni-Cd, a singlecell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range.
Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with full primary voltage supplied from the battery.
- 32 -
3. TECHNICAL BRIEF
Figure 3.5.3-1 UMTS PA functional block diagram
An isolator between the Power Amplifier and the duplexer is highly recommended to provide constant load and source impedances (respectively) to those devices. This improves PA stability, ACPR performance, and harmonic suppression, as well as duplexer isolation, insertion loss, and ripple.
Transmitter performance is always improved when an isolator is included and is well worth the added cost.
3.5.4 Thermistor (RT200 : 68K_2012_10%)
This thermistor senses temperature variations around UMTS PA to adjust PA gain deviation for assure compliance with the applicable transmit power control standards. Negative temperature compensation thermistor is used in the U8290.
3.5.5 UMTS transmit power detector (U203 : LMV225TLX)
This detector couples PA output power level to calibrate the transmitter characteristic over the channel variation and temperature. Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level.
The U8290 uses National Semiconductor LMV225TLX power detector IC. In Figure 3.5.5-1, R1 is set to 1.8 resulting in an attenuation of 31.4dB. The output voltage is proportional to the logarithm of the input power. Figure 3.5.5-2 shows the output voltage versus PA output power of the LMV225TLX setup as depicted in Figure 3.5.5-1
- 33 -
3. TECHNICAL BRIEF
Figure 3.5.5-1 Block diagram of LMV225TLX with high resistive tap
Figure 3.5.5-2 Power detector response, Vout vs PA output power
3.5.6 Dual band GSM power amplifier (U209 : SKY77328)
The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.
The module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks, impedancematching circuitry for 50
Ω input and output impedances, and a Power Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal
PAC function and interface circuitry.
- 34 -
3. TECHNICAL BRIEF
Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM850/900 bands and the other supports the DCS1800 and PCS1900 bands.
Both PA blocks share common power supply pins to distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.
RF input and output ports of the SKY77328 are internally matched to a 50
Ω load to reduce the number of external components for a quad-band design.
leakage current (2.5
µA, typical) of the dual PA module maximizes handset standby time. The
SKY77328 also contains band-select switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal. In Figure 3.5.6-1 below, the BS pin selects the PA output (DCS/PCS OUT or GSM850/900 OUT) and the Analog Power Control (VAPC) controls the level of output power.
The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power amplifier control (iPAC TM ) function, which is insensitive to variations in temperature, power supply, process, and input power. The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.
Figure 3.5.6-1 GSM PA functional block diagram
- 35 -
3. TECHNICAL BRIEF
3.5.7 GSM transmit VCO (U210 : MQW5V0C869M)
The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts
PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet.
The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA. this is the low loss path, and 2) the OPLL feedback signal . this is the high loss path. See Figure 8-1 for recommended topology and resistor values.
The losses from the VCO outputs to the PA inputs must be factored into the output chain.s power budget. Each path includes a
π-pad that introduces approximately a 3-dB loss. The low band GSM πpad is formed by R235 plus R232, R228, and R229; the high band GSM
π-pad is formed by R236 plus
R232, R234, and R233. One leg of each
π-pad is used to couple the VCO output to form the feedback path as described below.
For a given VCO output drive level, the loss to the RTR6250 input must assure the specified input level is achieved (-18 to -12 dBm). Large resistors included in the
π-pads are used to lightly couple off the VCO outputs to create the feedback signal. Since the RTR6250 TX_VCO_FB pin presents fairly high impedance, an external terminating resistor is required (R232, 51
Ω). A series capacitor (82 pF)
AC couples the feedback signal into the RTR6250 IC.
3.5.8 UMTS Rx RF filter (FL200 : B7728)
An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include:
• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:
- Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.
- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage.
- Other frequencies of particular concern. bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.
• Phase and amplitude balance - the ZIF architecture requires well-balanced differential inputs to the
RFR6200 IC. This is accomplished by the RF filter which takes a single-ended output from the
RFL6200 IC and provides differential outputs having nominal 180° phase separation. Phase and/or amplitude imbalance causes degraded common-mode rejection and second-order nonlinearity, so their requirements are specified jointly.
-
±3 degrees and ± 1 dB
- -12 to + 3 degrees and
± 0.7 dB
Of course, passband ripple and return loss are still important in all cases for the same reasons explained in the antenna switch module and duplexer sections.
- 36 -
3. TECHNICAL BRIEF
3.5.9 GSM band Rx RF filter (FL201, FL202, FL203)
FL201 - B7037 925 ~ 960MHz EGSM Rx RF filter
FL202 - B7844 1805 ~1880MHz DCS1800 Rx RF filter
FL203 - B7846 1930 ~ 1990MHz PCS1900 Rx RF filter
The GSM mode RF filters are located before their LNAs, so their insertion losses are extremely critical
(1.5 dB typical). Other important parameters are:
• Out-of-band rejection or attenuation levels
- Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.
- Frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.
- GSM band receivers operate while the handset transmitters are off so there are no Tx-band leakage attenuation requirements.
• Phase and amplitude balance - the UMTS discussion presented above applies for GSM bands as well. See the data sheet for specific values. Of course, passband ripple and return loss are still important in all cases for the same reasons explained in the antenna switch module and duplexer sections.
3.5.10 VCTCXO (U206 : TG-5001LA-19.2MHz)
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the
MSM6250 IC. The 6250-series chipset requires a 19.2 MHz nominal VCTCXO frequency. The oscillator frequency is controlled by the MSM6250’s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control.
The filtered PDM signal results in an analog control signal into the VCTCXO tuning port whose voltage is directly proportional to the density of the digital bit stream. The MSM device varies the pulse density to change the analog control voltage that sets the oscillator frequency - all within a feedback control loop that minimizes handset frequency drift relative to the network.
3.5.11 UMTS Rx VCO (U208 : MQL302A1G71)
The UMTS Rx CH VCO is a key component within its phase-locked loop; VCO performance directlry impacts PLL and receiver performance. When the phone is not in the UMTS mode the unused VCO must be turned off by UHF_VCO_EN logic signal from MSM6250. Using only the external
UMTS_RX_VCO signal, the LO generation and distribution circuits create the necessary LO signals for the quadrature downconverter.
3.5.12 Bluetooth (U406 : LBDA254AN0, ANT400 : LDA31)
The MSM6250 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure 3.5.12-1 shows the bluetooth system architecture in the U8290.
- 37 -
3. TECHNICAL BRIEF
Figure 3.5.12-1 Bluetooth system architecture
- 38 -
3. TECHNICAL BRIEF
3. BB Technical Description
3.6 Digital Baseband(DBB/MSM6250)
3.6.1 General Description
A. Features(MSM6250)
• The ARM926EJ-S microprocessor can operate at up to 150 MHz with variable rate, software controlled clocks to provide greater standby time.
• Integrated PLL to provide additional on-chip clock frequencies
• Supports low-power, low-frequency crystal to enable TCXO shutoff
• Integrated USIM Controller for direct interface to USIM card
• Software-controlled power management feature
• Automatic access conversion of 32-bit data accesses to 16-bit devices
• Advanced 409-ball CSP packaging
• WCDMA Access
- Maximum of eight simultaneous transport channels
- Four coded composite transport channels (CCTrCH)
- PS data rates supporting 384kbps DL / 64kbps UL
• GSM/GPRS Access
- GSM/GPRS network signaling (from Layer 1 to 3)
- GSM AMR,EFR,FR
• Operation and Services
- SIM Interfaces
- General Purpose I/O (GPIO) Interface
- Dual Memory Buses(EBI1 & EBI2)
- JTAG
- RTC
• Data Communication
- IrDA ® (SIR)
- UARTs (ACB, EDB (RS232))
- Slave USB
- 39 -
3. TECHNICAL BRIEF
3.7 Hardware Architecture
USIM
PM6650
BLUETOOTH
ASM
SP7T
GSM
Quadba nd
PA
GSMQu ad
TX VCO
GSM TX
GSM
RX FILTER
GSM RX
RTR6250
WCDMA TX
UMTS
PA
UMTS
TX
FILTER
E
X
E
R
D
U
P
L
WCDMA RX
RFL
6200
UMTS
RX VCO
UMTS
RX
FILTER
RFR
6200
MSM6250
SPEAKER
Loud + Receiver
MIC
EAR
JACK(12pin)
1.3M
CAMERA
MAIN
LCD
SUB
LCD
SDRAM +
NAND
T-flash
CARD
Figure 3.7-1 Simplified Block Diagram
- 40 -
3. TECHNICAL BRIEF
3.7.1 Block Diagram(MSM6250)
19.2M
Tx/Rx I/Q
HK ADC
PLL
UMTS
GSM/
GPRS
ARM
Processor
Tx/Rx I/F
SBI
J-TAG I/F
VOCODER
CODEC
USIM
Controller
USB I/F
UART
General
Purpose
I/O
ROM/
RAM
Speaker
MIC
Figure 3.7.1-1 Simplified Block Diagram of MSM6200
- 41 -
3. TECHNICAL BRIEF
3.8 Subsystem(MSM6250)
3.8.1 ARM Microprocessor Subsystem
The MSM6250 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, and ROM devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the
RTR6250, RFR6200, RFL6200, and PM6650 devices.
3.8.2 UMTS Subsystem
The UMTS Subsystem performs the digital UMTS signal processing. Its components include:
• Searcher engine
• Demodulating fingers
• Combining block
• Frame deinterleaver
• Viterbi decoder
• Up-link subsystem
• Turbo decoder
On the down-link channel the UMTS subsystem searches, demodulates, and decodes incoming
CPICH, CCPCH, SCH, and Traffic Channel information. It extracts packet data from the downlink traffic channel and prepares the packet data for processing. For the up-link, the CDMA subsystem processes the packet data and modulates the up-link traffic channel (DCH).
3.8.3 GSM Subsystem
The GSM Subsystem performs the digital GSM signal processing.
3.8.4 RF Interface
The RF interface communicates with the mobile station’s external RF and analog baseband circuits.
Signals to these circuits control signal gain in the Rx and Tx signal path and maintain The system’s frequency reference.
3.8.5 Serial Bus Interface(SBI)
The MSM6250 device’s SBI is designed specifically to be a quick, low pin count control protocol for
QUALCOMM’s RTR6250, RFR6200, RFL6200, and PM6650 ASICs. Using the SBI, the RTR6250,
RFR6200, RFL6200, and PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode. The SBI also controls DC baseband offset errors.
- 42 -
3. TECHNICAL BRIEF
3.8.6 Wideband CODEC
The MSM6250 device integrates a wideband voice/audio CODEC into the mobile station modem
(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface on two single-ended earphone output. The CODEC integrates the microphone and earphone amplifiers into the MSM6250 device, reducing the external component count to just a few passive components. The microphone
(Tx) audio path consists of a two-stage amplifier with the gain of the second stage set externally. The
Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.
3.8.7 Vocoder Subsystem
The MSM6250 device’s QDSP4000 supports AMR vocoder. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo
Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6200 device’s integrated ARM7TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.
3.8.8 HKADC
TheMSM6250 device has an on-chip 8-bit analog-to-digital converter (ADC) which is intended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250 device has six analog input pins which are multiplexed to the input of the internal HKADC.
3.8.9 Mode Select and JTAG Interfaces
The mode pins to the MSM6250 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation, and ETM mode, which allows monitoring of the ARM bus and passes compressed information via the trace port to the MultiTrace trace port analyzer. The MSM6250 device complies with the ANSI/IEEE
1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.
3.8.10 General-Purpose Input/Output Interface
The MSM6250 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional
RAM, ROM, general-purpose chip selects, parallel LCD interface, and UART interface.
- 43 -
3. TECHNICAL BRIEF
3.8.11 UART
There are three UARTs in the MSM6250 ASIC:
• UART1 for data
• UART2 (can be used for USIM interface)
• UART3 (can be used for PM SBI interface)
3.8.12 USB
The MSM6250 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB function communicating with the USB host. The USB controller also supports digital audio through USB interface and connects directly to the QDSP4000 for the audio processing.
- 44 -
3. TECHNICAL BRIEF
3.9 External memory interface
A. MSM6250
The MSM6250 have two external memory interfaces with arbitration for the multi-layer AHB system and memory controllers. The EBI1 bus is a high performance bus that supports a wide variety of memories. EBI2 bus is targeted to be the interface for slow peripheral devices(i,.e., LCD) as well as the NAND flash memory.
• EBI1 Features
- 16 bit static and dynamic memory interface
- 32 bit dynamic memory interface
- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select
- Synchronous burst memories supported (burst NOR, burst PSRAM)
- Synchronous DRAM memories supported
- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses
- Pseudo SRAM (PSRAM) memory support
• EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).
- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).
- 2Mbytes of memory per chip select.
- Support for 8 bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(16 & 8 bit)
• 512Mb NAND flash memory + 512Mb SDRAM
• 2-CS(Chip Select) are used
Device
FLASH
SDRAM
Part Name
TY90009C00A0GG
TY90009C00A0GG
Interface Spec
Maker
Toshiba
Toshiba
Read Access Time Write Access Time
65 ns 65 ns
13 ns 13 ns
Table 3.9-1 Table External memory interface for U8290
- 45 -
3. TECHNICAL BRIEF
3.10 H/W SubSystem
3.10.1 RF Interface
A. RTR6250(WCDMA_Tx, GSM_Tx/Rx)
MSM6250 controls RF part(RTR6250) using these signals.
• SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset
• PAON : Power AMP on RF part
• RX_I/Q,TX_I/Q : I/Q for T/Rx of RF
• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier
TX_AGC_ADJ
TRK_LO_ADJ
TCXO_EN_GPIO[94]
PA_ON[0]
L14
H14
F18
B19
Q_OUT_N
Q_OUT
I_OUT_N
I_OUT
A13
B13
A14
B14
Q_IM_CH1(Reserved)
Q_IP_CH1(Reserved)
I_IM_CH1(Reserved)
I_IP_CH1(Reserved)
Q_IM_CH0
Q_IP_CH0
I_IM_CH0
I_IP_CH0
U21
U23
V25
W26
Y25
Y26
V21
W21
TCXO_EN
TX_QM
TX_QP
TX_IM
TX_IP
5.62K
R106
5.62K
R107
PA_RANGE[1]_GP_PDM[2]
PA_RANGE[0]_GP_PDM[1]
GRFC[14]_GPIO[83]
GRFC[13]_GPIO[82]
GRFC[12]_GPIO[81]
GRFC[11]_GPIO[80]
GRFC[10]_TX_ON
A20
H17
TRST_N
TCK
TMS
TDI
TDO
RTCK
H15
D16
F15
D15
F16
H16
J25
K23
J26
K19
H12
ANT_SEL2_N_GPIO[11]
ANT_SEL1_N_GPIO[10]
ANT_SEL0_N_GPIO[9]
TX_VCO_0_EN_N_GPIO[8]
TX_VCO_1_EN_N_GPIO[7]
UHF_BAND_SEL_GPIO[6]
GSM_PA_BAND_GPIO[5]
GSM_PA_EN_GPIO[4]
UHF_VCO_0_EN_GPIO[3]
B4
T23
R19
D11
H10
F10
D9
A8
B8
BT_CLK_GPIO[25]
BT_SBST_GPIO[24]
BT_SBCK_GPIO[23]
BT_SBDT_GPIO[22]
BT_TX_RN_N_GPIO[21]
BT_DATA_GPIO[20]
G23
F23
E26
E25
G21
D26
M_CAM_EN
RX_QM
RX_QP
RX_IM
RX_IP
FOLDER_DETECT
RF_ON_TX_ON
ANT_SEL2
ANT_SEL1
ANT_SEL0
BT_CLK
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
1K R115
2K R113
PA_ON
JTAG_TRST_N
JTAG_TCK
JTAG_TMS
JTAG_TDI
JTAG_TDO
JTAG_RTCK
C148
0.01u
GSM_PA_BAND
GSM_PA_EN
UHF_VCO_EN
C143
0.033u
PA_R0
TX_AGC_ADJ
TRK_LO_ADJ
VREG_RFTX_2.85V
VREG_MSMP_2.6V
GSM_TX_VCO_0_EN_N
GSM_TX_VCO_1_EN_N
Figure 3.10.1-1 Schematic of RF Interface of MSM6250
- 46 -
3. TECHNICAL BRIEF
B. RFR6200(WCDMA_Rx)
• SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset
• RX_I/Q, : I/Q for Rx of RF
C. RFL6200(WCDMA_Rx_LNA)
• SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset
D. the others
• UHF_VCO_BAND_SEL : WCDMA(3G)/GSM(2G) VCO Band Selection of UHF VCO
• UHF_VCO_EN : WCDMA(3G)/GSM(2G) UHF VCO Enable
• GSM_PA_BAND
• TRK_LO_ADJ
: DCS/GSM Band Selection of Power Amp
: TCXO(19.2M) Control
• PA_ON
• ANT_SEL[0-2]
• GSM_PA_RAMP
• GSM_PA_EN
: WCDMA TX Power Amp Enable
: Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS Tx/Rx)
: Power Amp Gain Control of APC_IC
: Power Amp Gain Control Enable of APC_IC
• GSM_TX_VCO_0_EN_N : GSM Band Tx VCO Enable of Dual VCO
• GSM_TX_VCO_1_EN_N : DCS Band Tx VCO Enable of Dual VCO
- 47 -
3. TECHNICAL BRIEF
3.10.2 MSM SubSystem
3.10.2.1 SIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
• USIM_CLK : USIM Clock
• USIM_Reset : USIM Reset
• USIM_Data : USIM Data T/Rx
MSM6250
USIM CLK
USIM Reset
USIM Data
PM6650
VREG_USIM 2.85V
USIM CLK
USIM Reset
USIM Data
USIM
Figure 3.10.2.1-1 SIM Interface
3.10.2.2 UART Interface
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.
GPIO_Map
GPIO_96
GPIO_95
Name
RX_M
TX_M
Table 3.10.2.2-1 UART Interface
Note
Data_Rx
Data_Tx
- 48 -
3. TECHNICAL BRIEF
3.10.2.3 USB
The MSM6250 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the
MSM6250 was designed to comply with the definition of a peripheral as specified in USB Specification,
Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB
Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the
MSM6250.
Name
USB_RCV
USB_DAT
USB_SE0
USB_OE_N
USB_VBUS
USB_D+
USB_D-
Note
Rx_Data to MSM
Data to/from MSM
Data to/from MSM
Out-Put Enable of Transceiver
USB_Power From Host(PC)
USB Data+ to Host
USB Data- to Host
Table 3.10.2.3-1 USB Signal Interface
PM_SBDT PM_SBST
1u
VBATT
BATT_FET_N
FLASH_ON
RESIN_N
USB_OE_N
USB_DAT
USB_D+
USB_SE0
USB_D-
VBATT_TEMP
R505 47K
C523
1608
4.7u
C519
1608
4.7u
10
11
12
13
7
8
9
18
19
20
21
14
15
16
17
VBAT
BAT_FET_N
FLSH_DRV_N
PON_RESET_N
VREG_USB
USB_ID
VREG_5V
USB_OE_N
VSW_5V
USB_CTL_N
USB_VBUS
USB_DAT
USB_D_P
USB_SE0
USB_D_M
GP1_DRV_N(MPP7)
U501
PM6650
Figure 3.10.2.3-1 Schematic of USB block(MSM6250 Side & PM6650 Side)
- 49 -
3. TECHNICAL BRIEF
3.10.2.4 HKADC(House Keeping ADC)
The MSM6250 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250 device has six analog input pins which are multiplexed to the input of the internal HKADC.
HKADC_CLK_SRC_SEL
TCXO (default) 0
USB_XTAL
1
MUX_SEL_IN
3
MSM
DIV / N
2
HKADC_CLK_DIV_SEL
DIV/M
2
HKADC_SETUP [6:5]
HKADC0
HKADC1
HKADC2
HKADC3
HKADC4
HKADC5
GSM_PA_PWR_REF
011
100
101
110
111
000
001
010
Vin
HKADC CLK
8-bit
ADC
Dout
8
EOC
HKADC_DATA [7:0]
HKADC_STATUS [0]
Vref
Vref
Gen
Vext
1.826 V
1.217 V
0.609 V
VDD_A
000
001
010
011
1xx
3
VREF_SEL
03-073
Figure 3.10.2.4-1 MSM6250 HKADC Block diagram
Ch
HKADC0
HKADC1
HKADC2
HKADC3
HKADC4
Signal
AMUX_OUT
VBATT_LEVEL
HDET1
MULTI_ADC
VBATT_SENSE
Note
RF PAM Temperature
Battery voltage level
RF PAM Power Level
Ear Remote control Key Detection
Battery Detection
Table 3.10.2.4-1 HKADC channel table
- 50 -
3. TECHNICAL BRIEF
3.10.3 Power Block
3.10.3.1 General
MSM6250, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of
MSM6260, MSM memory, RF block, Bluetooth, Camera, T-flash, USIM and TCXO.
Major power components are :
PM6650(U501) : Phone power supply
SI91841DT_18(U400) : MSM MIC Bias
SI91841DT_18(U606) : Camera Digital power
MIC5205-3.0(U607) : LCD Power
3.10.3.2 PM6650
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference.
A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions.
MSM device controls and statuses the PM6650 IC using a three-line Serial Bus Interface (SBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.
- 51 -
3. TECHNICAL BRIEF
USB_VBUS
VCHG
USB_CTL_N
CHG_CTL_N
ISNS_P
USB-OTG host power ckt
External Supply
Detector
VREG_5V
Charger
Control
VMAXSEL
IMAXSEL
ISNS_M
BAT_FET_N
VBAT
VCOIN
ADC_BYP
AMUX_IN1 (MPP1)
AMUX_IN2 (MPP2)
TCXO_EN
TCXO_IN
Under-Volt
Lockout
MUX
VREF diff
Battery
Control
Input Power
Management
Trickle Charger
VBATDET
THLVB
Coin Cell
Charger
Battery
Detectors
PON_RESET_N
I/F
VREF
SPKR_BYP
SPKR_IN_P
SPKR_IN_M
Vcoin to TCXO
Reg
TCXO
Controller
SMPS
Clock
Circuits
VREG_MSMP
General
Housekeeping
Offset and
Scaling
RC Osc
Circuits
VREF
Real Time Clock
DIV detect
I/F
VBACKUP
CBL1PWR_N (MPP4)
CBL0PWR_N (MPP3)
PS_HOLD
KPDPWR_N
SBCK
SBST
SBDT
AMUX_OUT
REF_OUT
(MPP8)
VREF
TCXO_OUT
SLEEP_CLK
USB_OE
USB_DAT
USB_SE0
RUIM_M_RST (MPP5)
RUIM_M_CLK (MPP9)
RUIM_M_IO (MPP11)
GND_SLUG
XTAL_OUT XTAL_IN
Voltage
Control
Ref
User
Interfaces
I/F
Power-on
Circuits
VDD_SPKR
VIB_DRV_N
KPD_DRV_N
LCD_DRV_N
FLSH_DRV_N
GP1_DRV_N
(MPP7)
SPKR_OUT_P
SPKR_OUT_M
PON_RESET_N
REF_ISET
REF_BYP
REF_GND
VDD_MSMC
VDD_MSME
VDD_PA
VDD_MSM
VDD_ANA
VDD_RUIM
Reference
Circuit
Output
Voltage
Regulation
+5V Boost
Regulator
VREG_5V
Core Buck
Regulator to internal analog ckts
VREG_5V
EBI Buck
Regulator
PA Buck
Regulator to / from
Power On Circuits
MSM_PAD
Regulator
MSM_Analog
Regulator
MMC
Regulator
RUIM
Regulator
USB
Regulator
VSW_5V
VREG_5V
VSW_MSMC
VREG_MSMC
VSW_MSME
VREG_MSME
VSW_PA
VREG_PA
VREG_MSMP to digital
I/O circuits
VREG_MSMA
VREG_MMC
VREG_RUIM
VREG_USB
Serial Bus
Interface
I/F
Interrupt
Manager
IC
Interfaces
USB-OTG
Transceiver
RUIM Level
Translator
Center Slug internal interface connections
MSM_INT_N
USB_D_P
USB_D_M
USB_ID
RUIM_RST (MPP6)
RUIM_CLK (MPP10)
RUIM_IO (MPP12)
VDD_RF
VDD_WLAN
VDD_MAIN
I/F from TCXO
Controller to internal logic ckts
RF_RX1
Regulator
RF_TX
Regulator
WLAN
Regulator
RF_RX2
Regulator
TCXO
Regulator
Synthesizer
Regulator
VREG_RFRX1
VREG_RFTX
VREG_WLAN
VREG_RFRX2
VREG_TCXO
VREG_SYNT
VREF
Figure 3.10.3.2-1 PM6650 Functional Block Diagram
- 52 -
3. TECHNICAL BRIEF
3.10.3.3 Charging control
A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and
ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.
4.2V~3.82V
100~75 (%)
3.81V~3.74V
75~50 (%)
3.73V~3.67V
50~25 (%)
3.66V~3.49V
25~2 (%)
U8290 Battery Bar Display(Stand By Condition)
- 53 -
3.48V~3.28V
2~0 (%)
3. TECHNICAL BRIEF
Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V). The charging current is set to 80mA.
Parameter
Trickle Current
Min
60
Typ
80
Max
100
Unit
mA
- 54 -
3. TECHNICAL BRIEF
Constant Current Charging
The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.
Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.
The end of constant voltage charging is commonly detected 10% of the full charging current (110mA)
• Charging Method : CC & CV (Constant Current & Constant Voltage)
• Maximum Charging Voltage : 4.2V
• Maximum Charging Current : 600mA
• Nominal Battery Capacity : 1400 mAh
• Charger Voltage : 4.6V
• Charging time : Max 3.5h (Except time trickle charging)
• Full charge indication current (icon stop current) : 110mA
• Low battery POP UP : Idle - 3.38V, Dedicated(GSM/WCDMA) - 3.49V
• Low battery alarm interval : Idle - 3 min, Dedicated - 1min
• Cut-off voltage : 3.28V
- 55 -
3. TECHNICAL BRIEF
3.10.4 Key Pad
There are 26 buttons and 3 side keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected
On_SW to PMIC(PM6650) and MSM(GPIO76).
ROW0
ROW1
ROW2
ROW3
ROW4
COL0
1
4
7
HOT4 (*)
COL1
2
5
8
0
COL2
3
6
9
HOT5(#)
COL3
CLR (Clear)
LEFT
OK
SEND
DN
COL4
MENU
UP
RIGHT
SEARCH
BACK
COL5
Side key (camera)
Side key (Down)
Side Key (Up)
Table 3.10.4-1 Key Matrix Mapping Table
VREG_MSMP_2.6V
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_COL(0)
KEY_ROW(4)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
R4
10K
RA1
10K
7
7
HOT4
HOT4
4
4
1
1
8
8
0
0
5
5
2
2
9
9
HOT5
HOT5
3
3
6
6
SND
SND
DN
DN
CLR
CLR
LEFT
LEFT
OK
OK
MENU
MENU
UP
UP
RIGHT
RIGHT
SEARCH
SEARCH
BACK
BACK
KEY_ROW(2)
KEY_ROW(1)
KEY_ROW(0)
KEY_COL(5)
VA7
AVLC14S02050
VA4
AVLC14S02050
VA5
AVLC14S02050
ZD2 INSTPAR
Figure 3.10.4-1 Keypad Circuit
2
3
1
CN3
4
- 56 -
3. TECHNICAL BRIEF
3.10.5 Camera Interface
U8290 Installed a 1.3M Pixel CMOS VGA Camera.
Below figure show the camera board to board connector and camera I/F signal.
VREG_CAM_2.6V
HH-1M1608-121JT
FB300
C317
10u
C320
0.01u
I2C_SDA
CAM_DATA(7)
CAM_DATA(6)
CAM_HSYNC
CAM_RESET_N
I2C_SCL
VREG_CAM_2.6V
CAM
CONNECTOR
FB305
HB-1M1005-601JT
20
19
18
17
G2
24
23
22
21
16
15
14
13
G4
CN301
G1
1
4
5
2
3
6
7
8
9
10
G3
11
12
C659
10p
C658
1
39p
CN303
AXK7L24227J
HB-1M1005-600JT
FB303
CAM_DATA(3)
CAM_DATA(0)
CAM_DATA(2)
CAM_DATA(1)
CAM_VSYNC
CAM_DATA(5)
CAM_DATA(4)
R605
0
C646
47p
HB-1M1005-600JT
FB301
CAM_PCLK
C318
NA
VREG_CAM_1.8V
CAM_DSP_CLK
Figure 3.10.5-1 Camera Board to Board Connector
- 57 -
3. TECHNICAL BRIEF
The Camera module is connected to main board with 24pin Board to Board connector (AXK7L24227).
Its interface is dedicated camera interface port in MSM6250. The camera port supply 24MHz master clock to camera module and receive 12MHz pixel clock (30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6250.
3
4
5
No Name
1 GND
2 GND
CAM_DSP_CLK
CAM_DATA(3)
CAM_DATA(0)
8
9
6
7
CAM_PCLK
CAM_DATA(1)
CAM_DATA(2)
CAM_VSYNC
10 CAM_DATA(5)
11 CAM_DATA(4)
12 VREG_CAM_1.8V
13 GND
14 GND
15 VREG_CAM_2.6V
16 GND
17 I2C_SCL
18 CAM_RESET_N
19 VREG_CAM_2.6V
20 CAM_HSYNC
21 I2C_SDA
22 CAM_DATA(6)
23 CAM_DATA(7)
24 GND
Port
GND
GND
I
O
O
O
O
O
O
O
O
I
GND
GND
I
GND
I
I
I
O
I/O
O
O
GND
Note
GND
GND
Master Clock(24M)
Data
Data
Clock for Camera Data Out
Data
Data
Vertical Synch
Data
Data
Camera Digital Power
GND
GND
Camera Analog, I/O Power
GND
I2C Clock
Camera reset signal
Camera Analog, I/O Power
Horizontal Sync
I2C command
Data
Data
GND
Table 3.10.5-1 Interface between Camera Module and Main Board (in camera module)
- 58 -
3. TECHNICAL BRIEF
3.10.6 Folder ON/OFF Operation
There is a magnet to detect the folder status, opened or closed.
If a magnet is close to the hall-effect switch, the voltage at pin2 of U604 goes to 0V. Otherwise, 2.6V.
This folder signal is delivered to MSM6250 GPIO80.
VREG_MSMP_2.6V
FOLDER DETECT
R616
U604
A3212ELH
VDD
62
GND
OUT
FOLDER_DETECT
C612
0.1u
C639
10p
Figure 3.10.6-1 Schematic of Folder ON/OFF detection circuit on keypad
- 59 -
3. TECHNICAL BRIEF
3.10.7 Camera Direction Detection
CAM_SENSE detects the Camera Direction (front or back)
VREG_MSMP_2.6V
CAM_SENSOR
R403
62
VDD
TR400
A3212ELH
GND
OUT
CAM_SENSE
C405
0.1u
C403
10p
Figure 3.10.7-1 Camera Direction Detection
- 60 -
3. TECHNICAL BRIEF
3.10.8 Keypad Light
There are 17 blue LEDs in key board backlight circuit, which are driven by KEYBD_BACKLIGHT line form PM6650.
+VPWR
LD1
LEBB-S14H
LD2
LEBB-S14H
LD3
LEBB-S14H
LD4
LEBB-S14H
LD13
LEBB-S14H
LD11
LEBB-S14H
LD5
LEBB-S14H
LD6
LEBB-S14H
LD7
LEBB-S14H
LD14
LEBB-S14H
LD12
LEBB-S14H
LD8
LEBB-S14H
LD9
LEBB-S14H
LD10
LEBB-S14H
LD15
LEBB-S14H
LD16
LEBB-S14H
LD17
LEBB-S14H
KYBD_BACKLIGHT
Figure 3.10.8-1 Keypad Backlight Circuit
- 61 -
3. TECHNICAL BRIEF
3.10.9 Camera Light Flash
There is White LED in U8290 Folder Upper, and Drive circuit is in Main Board, which are showed below. Flash lighted by FLASH_ON Signal of FLASH_DRV_N in PM6650.
- 62 -
3. TECHNICAL BRIEF
3.10.10 LCD Module
Vibrator
Receiver
LOUD SPK
LCD
MODULE
Camera
Flash
Figure 3.10.10-1 LCD Module Block Diagram
MAIN
LCD
Back
Light
SUB
LCD
MAIN LCD
MODULE
260K Color TFT
176 * 220 Pixel
SUB LCD
MODULE
65K Color STN
96 * 96 Pixel
Gate Drive IC
Renesas
HD66789R
Gate Drive IC
Renesas
HD66789R
Drive IC
SEC
ST7624
Figure 3.10.10-2 LCD Module(Main & Sub LCD)
- 63 -
3. TECHNICAL BRIEF
3.10.10.1 Display & LCD FPC Interface
LCD module is connected to key board with 60-pin BtoB connector (CN300_24_5087_060_007_829) and Speaker, Receiver, Vibrator, Camera Flash is connected by soldering the leads to pads in LCD module. The LCD is controlled by 16-bit EBI2 in MSM6250
1 : GND
2 : SPK+ : Loud Speaker +
3 : SPK- : Loud Speaker -
4 : RCV+ : 8ohm SPK+
5 : RCV- : 8ohm SPK-
6 : MAIN_LCD_CS_N : Sub LCD chip select
7 : SUB_LCD_CS_N : Main LCD chip select
8 : LCD_IF_MODE : LCD interface selection (9bit or 16bit)
9 : KBYD_BACKLIGHT : Keypad LED Turn on/off control
10 : ON_SW* : Power On Key
11 : GND
12 : LCD_BACK_EN : LCD Backlight LED Turn on/off control
13 : LCD_RESET_N : Reset for main and sub LCD
14 : MOT_PWR- : Motor Turn on/off control
15 : LCD_ADS : Command or Data For Main and sub LCD
16 : EBI2_OE_N : LCD Read Enable signal
17 : EBI2_WE_N : LCD Write Enable signal
18 : LCD_MAKER_ID : Sub LCD Module Vendor selection
19 : VREG_5V : Camera flash Power (+5V)
20 : GND
21 : GND
22 : FLASH_ON : Camera flash turn on/off control
23 : GND
24 : VREG_LCD_3.0V : Main and sub LCD power (+3.0V)
25 : VREG_MSMP_2.6V : Not Used(+2.6V)
26 : GND
27 : +VPWR : LCD module Power source (+3.0V ~ +4.2V)
28 : +VPWR : LCD module Power source (+3.0V ~ +4.2V)
29 : +VPWR : LCD module Power source (+3.0V ~ +4.2V)
30 : GND
31 : GND
32 : KEY_COL(5) : Keypad Column
33 : KEY_COL(4) : Keypad Column
34 : KEY_COL(3) : Keypad Column
35 : KEY_COL(2) : Keypad Column
36 : KEY_COL(1) : Keypad Column
37 : KEY_COL(0) : Keypad Column
38 : GND
39 : KEY_ROW(4) : Keypad Row
40 : KEY_ROW(3) : Keypad Row
41 : KEY_ROW(2) : Keypad Row
42 : KEY_ROW(1) : Keypad Row
43 : KEY_ROW(0) : Keypad Row
44 : EBI2_DATA(0) : Data Line
45 : EBI2_DATA(1) : Data Line
46 : EBI2_DATA(2) : Data Line
47 : EBI2_DATA(3) : Data Line
48 : EBI2_DATA(4) : Data Line
49 : EBI2_DATA(5) : Data Line
50 : EBI2_DATA(6) : Data Line
51 : EBI2_DATA(7) : Data Line
52 : EBI2_DATA(8) : Data Line
53 : EBI2_DATA(9) : Data Line
54 : EBI2_DATA(10) : Data Line
55 : EBI2_DATA(11) : Data Line
56 : EBI2_DATA(12) : Data Line
57 : EBI2_DATA(13) : Data Line
58 : EBI2_DATA(14) : Data Line
59 : EBI2_DATA(15) : Data Line
60 : GND
- 64 -
3. TECHNICAL BRIEF
3.10.11 Audio and Sound
3.10.11.1 Overview of Audio & Sound path
MSM6250
(U100)
Head_Set
Voice
MIDI_Bell
AMP
(U304)
Key PCB
(B’d to B’d
Conn.)
MIC
Receiver
LCD
Module
(B’d to B’d
Conn.)
Loud Speaker
Head_set MIC
Voice + MP3 + MIDI
Figure 3.10.11.1-1 Audio & Sound Path Block Diagram
- 65 -
3. TECHNICAL BRIEF
3.10.11.2 Audio Signal Processing & Interface
Audio signal processing is divided Uplink path and downlink path.
The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (MSM6250). This transmitted signal is reformed to fit in GSM &
WCDMA Frame format and delivered to RF Chip. The downlink path amplifies the signal from DBB chip (MSM6250) and outputs it to Receiver (or Speaker).
The receive path can be directed to either one of two earphone amplifiers or the auxiliary output.
The outputs earphone1 (EAR1OP, EAR1ON) and Auxiliary out (AUXOP, AUXON) are differential outputs. Earphone2 (EAR2O) is a single-ended output stage designed to drive a headset speaker.
The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.
Figure 3.10.11.2-1 Audio Interface Detailed Diagram(MSM6200)
- 66 -
3. TECHNICAL BRIEF
39p
C621
FB502 FB503
39p
C622
MSM6250 BLK
Near to MSM
MICFBP
MICINN
MICOUTP
C108 0.1u
MIC_Feedback
C100 0.1u
C101 0.015u
180K
R101
470K
R100
MICOUTN
MICINP
MICFBN
C107 0.1u
C106 0.015u
C105 0.1u
180K
R104
EAR JACK
MICBIAS_LDO_1.8V
VREG_MSMP_2.6V
MIC2P
MIC2N
HEADPHONE_L
HEADPHONE_R
EAR_SENSE*
MULTI_ADC
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_COL(6)
10K R625
0
22n C102
33u
C115
22n
C626
R624
33u C627
To prevent from
TDMA noise.
R640 600
R641 600
7
8
5
6
9
10
11
12
13
15
CN304
3
4
1
2
14
16
C654
39p
VA8
C653
39p
AVLC14S02050
D503
Figure 3.10.11.2-2 Audio Section scheme
D599
- 67 -
3. TECHNICAL BRIEF
VREG_MSMA_2.6V
MICBIAS
C400
1u
MIC
U400
1
VIN
2
GND
3
_SD
SI91841DT-18-T1
5
VOUT
BP
4
C402
0.01u
1u
C625
MIC1
1
2
OBG-415S42-C1033
UCLAMP0505A
4 3
5
6
2
U401
1
C619 C618
39p 39p
22n C401
22n C404
MIC1P
MIC1N
MICBIAS_LDO_1.8V
HEADPHONE_R
HEADPHONE_L
R648
1K
R649
1K
C651
0.015u
C652
0.015u
C633
0.01u
C634
0.01u
R623
80.6K
R622
80.6K
C648
22n
R644
39K
LOUD_SPK_EN
Audio AMP
(TPA2005D)
D1
C1
U605
IN-
IN+
A1
_SD
TPA2005D1ZQYR
B4
VDD1
VDD2
C4
B1
NC
VO-
A4
VO+
D4
C632
10u
+VPWR
SPK-
SPK+
⇒
Speaker
Figure 3.10.11.2-3 Audio Section scheme
- 68 -
3. TECHNICAL BRIEF
3.10.11.3 Audio Mode
Audio Mode includes three states.( Voice call, Video Telephony, Midi, MP3). And each states is sorted by followed Detail Mode according to external Devices (Receiver, Loud, Headset).
MODE
Voice Call
(GSM & WCDMA)
Video Telephony
(Only WCDMA)
MIDI
MP3
Device
Receiver Mode
Loud Mode
Head_Set
Loud Mode
Head_Set
Loud Mode
Head_Set
Loud Mode
Head_Set
Detail MODE
Receiver Voice Call
Speaker Phone
Head_Set Voice Call
Speaker Phone Video Telephony
Head_Set Video Telephony
Speaker MIDI Bell
Head_Set MIDI Bell
Speaker MP3
Head_Set MP3
Table 3.10.11.3-1 Audio Mode
- 69 -
3. TECHNICAL BRIEF
Voice Call Receiver Mode Path
MSM6250
(U100)
Head_Set
Voice
MIDI_Bell
AMP
(U650)
Key PCB
(B’d to B’d
Conn.)
MIC
Receiver
LCD
Module
(B’d to B’d
Conn.)
Loud Speaker
Head_set MIC
Voice + MP3 + MIDI
=> Voice Call Receiver Mode is Implemented as bellow
C621,C622(MSM6250 EAR1ON,EAR1OP) -> B’d to B’d Connector -> Key PCB -> B’d to B’d
Connector -> LCD Module -> Receiver
- 70 -
Voice Call Head_Set Mode Path & Head video Telephony Mode
3. TECHNICAL BRIEF
MSM6250
(U100)
Head_Set
Voice
MIDI_Bell
AMP
(U650)
Key PCB
(B’d to B’d
Conn.)
MIC
Receiver
LCD
Module
(B’d to B’d
Conn.)
Loud Speaker
Head_set MIC
Voice + MP3 + MIDI
=> Voice Call Head_Set Mode is Implemented as bellow
MSM6250 (HPH_L, HPH_R) -> C626, C627 -> Ear_Jack -> Head_Set
- 71 -
3. TECHNICAL BRIEF
Voice Call Speaker Phone Mode & Video Telephony Mode
MSM6250
(U100)
Head_Set
Voice
MIDI_Bell
AMP
(U650)
Key PCB
(B’d to B’d
Conn.)
MIC
Receiver
LCD
Module
(B’d to B’d
Conn.)
Loud Speaker
Head_set MIC
Voice + MP3 + MIDI
=> Voice Call Speaker Phone Mode is Implemented as bellow
MSM6250 (HPH_L, HPH_R) -> R648, R649 -> C633, C634 -> R622, R623-> AMP(U605) -> B’d to
B’d Connector -> Key PCB -> B’d to B’d Connector -> LCD Module -> Loud Speaker
- 72 -
3. TECHNICAL BRIEF
MIDI Ring Tone (Speaker)
MSM6250
(U100)
Head_Set
Voice
MIDI_Bell
AMP
(U650)
Key PCB
(B’d to B’d
Conn.)
MIC
Receiver
LCD
Module
(B’d to B’d
Conn.)
Loud Speaker
Head_set MIC
Voice + MP3 + MIDI
=> MIDI Ring tone for speaker
MSM6250 (HPH_L, HPH_R) -> R648, R649 -> C633, C634 -> R622, R623-> AMP(U605) -> B’d to
B’d Connector -> Key PCB -> B’d to B’d Connector -> LCD Module -> Loud Speaker
- 73 -
3. TECHNICAL BRIEF
MIDI Ring Tone (Head_Set)
MSM6250
(U100)
Head_Set
Voice
MIDI_Bell
AMP
(U650)
Key PCB
(B’d to B’d
Conn.)
MIC
Receiver
LCD
Module
(B’d to B’d
Conn.)
Loud Speaker
Head_set MIC
Voice + MP3 + MIDI
=> MIDI Ring tone for head_set
MSM6250 (HPH_L, HPH_R) -> C626, C627 -> Ear_Jack -> Head_Set
- 74 -
3. TECHNICAL BRIEF
MP3 Play (Speaker)
MSM6250
(U100)
Head_Set
Voice
MIDI_Bell
AMP
(U650)
Key PCB
(B’d to B’d
Conn.)
MIC
Receiver
LCD
Module
(B’d to B’d
Conn.)
Loud Speaker
Head_set MIC
Voice + MP3 + MIDI
=> MP3 play path for speaker
MSM6250 (HPH_L, HPH_R) -> R648, R649 -> C633, C634 -> R622, R623-> AMP(U605) -> B’d to
B’d Connector -> Key PCB -> B’d to B’d Connector -> LCD Module -> Loud Speaker
- 75 -
3. TECHNICAL BRIEF
MP3 Play (Head_set)
MSM6250
(U100)
Head_Set
Voice
MIDI_Bell
AMP
(U650)
Key PCB
(B’d to B’d
Conn.)
MIC
Receiver
LCD
Module
(B’d to B’d
Conn.)
Loud Speaker
Head_set MIC
Voice + MP3 + MIDI
=> MP3 play path for speaker
MSM6250 (HPH_L, HPH_R) -> C626, C627 -> Ear_Jack -> Head_Set
- 76 -
3. TECHNICAL BRIEF
Audio & Sound Main Component
There are 6 components in U8290 schematic Diagram. Part Number marked on U8290 Schematic
Diagram.
3
4
1
2
5
6
Component
MSM6250
TPA2005D
Loud Speaker
Receiver
MIC
Head_Set
Design No.
Maker Part No.
U100
U605
MSM6250
TPA2005D1ZQYR
MIC1
EMD1740C DP1P
EMD1740C DP1P
OBG-415S42-C1033
EM-LG911ST
Tabel 3.10.11.3-2 Audio Component List
Note
Base-Band Modem
Differential Audio Amp
8ohm Speaker
32ohm Speaker
Stereo Head_Set
- 77 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
U204
Q200
U205
U206
FL200
U201
U200
U202
FL204
U203
FL201
FL202
FL203
Reference
U200
U201
U202
U203
U204
U205
U206
RF component (Top)
Description
WCDMA Receiver IC
WCDMA Rx LNA IC
WCDMA Duplexer
WCDMA HDET IC
WCDMA Tx PAM
WCDMA/GSM Transceiver IC
VCTCXO(19.2MHz)
Reference
Q200
FL200
FL201
FL202
FL203
FL204
Description
WCDMA PAM Vcc Switch
WCDMA Rx SAW Filter
GSM Rx SAW Filter
DCS Rx SAW Filter
PCS Rx SAW Filter
WCDMA Tx SAW Filter
- 78 -
4. TROUBLE SHOOTING
ANT200
RF200
U207
U209
U208
ANT400
U406
U210
Reference
ANT200
RF200
U207
U208
RF component (Bottom)
Description
ANT. Contact point
Test Connector
ANT. Switch Module
WCDMA Rx VCO
Reference
U209
U210
U406
ANT400
Description
EGSM/DCS Tx Dual PAM
EGSM/DCS TX Dual VCO
Bluetooth RF Module
Bluetooth ANT.
- 79 -
4. TROUBLE SHOOTING
4.2 SIGNAL PATH
WCDMA Tx PATH
WCDMA Rx PATH
GSM Tx PATH
DCS/PCS Tx PATH
GSM/DCS/PCS Rx PATH
GSM Rx PATH
DCS Rx PATH
PCS Rx PATH
- 80 -
4. TROUBLE SHOOTING
4.3 Checking VCXO(19.2MHz) Block
The reference frequency (19.2MHz) from U206 (VCXO) is used WCDMA TX part, GSM part and BB part.
TP3
TP5
TP1
TP2
TP4
Test Point (Crystal Part)
TP1
TP3
C265
1000p
C276
1000p
C274
0.1u
4
VCC
19.2MHz
GND
2
3
OUT VCONT
TG-5001LA-19.2MHz
U206
1
VREG_TCXO_2.85V
R219
100
C275
0.01u
TRK_LO_ADJ
TP4
C206
1000p
C287 100p
TCXO_PM
TCXO_BT_IN
Schematic of the Crystal Part
TP2
TP5
- 81 -
4. TROUBLE SHOOTING
Check TP1
VCC of VCXO
VCC ≥ 2.8V
Yes
Check TP2 TRK_LO_ADJ
No
CHECK R540 of PMIC (U509)
2V ≥ Voltage ≥ 1V
Yes
Check TP3.4.5
With Oscilloscope
2V ≥ Voltage ≥ 1V
Yes
VCXO is OK
Check other part
No
Check R227 of MSM(U208)
No
Check soldering and components
- 82 -
4. TROUBLE SHOOTING
4.4 Checking Ant. SW Module Block
ANT_SEL0
TP1
ANT_SEL1
ANT_SEL2
Antenna Switch Block(Bottom)
ANT200
1p
C283
R221
2.2nH
L229
10nH
G2
ANT
G1
RF200
RF
KMS-507
C279 33p
VREG_RFTX_2.85V
ANT_SEL0
ANT_SEL2
ANT_SEL1
Q507
TP1
VREG_RFRX_0_2.85V
C286
0.1u
R224
0 C285
100p
R223
0 C277
100p
R222
0 C281
100p
C284
27p
10
VDD
9
8
5
VC1
VC2
VCG
U207
GSM900_RX
GSM1800_RX
GSM1900_RX
1
2
3
4
WCDMA
GSM18001900_TX
GSM900_TX
12
13
SFAY0004601
UMC4N
Schematic of the Antenna Switch Block
GSM 900 TX
GSM 900 RX/WCDMA
DCS1800/PCS1900 TX
DCS 1800 RX
PCS 1900 RX
ANT_SEL2
LOW
LOW
HIGH
LOW
HIGH
Logic Table of the Antenna Switch
ANT_SEL1
LOW
LOW
HIGH
HIGH
LOW
- 83 -
ANT_SEL0
HIGH
LOW
LOW
LOW
LOW
4. TROUBLE SHOOTING
Checking Switch Block power source
Check Soldering of
ANT_SEL 0, 1, 2 High Level
2.5V < Voltgae < 3.0V
YES
Check the Logic in each mode
NO
Check VCC
TP1 VREG_RFRX_0_2.85V
- 84 -
4.5 Checking WCDMA Block
START
1. Check VCXO 19..2MHz
2. Check ANT. SW Module
ANT_SEL0, 1, 2
3. Check RF Tx Level
3.
1.
4. Check PAM Block
2.
5. Check RF Rx L evel
6. Re-download SW & CAL.
- 85 -
4. TROUBLE SHOOTING
4.
5.
4. TROUBLE SHOOTING
4.5.1 Checking VCXO Block
Refer to 4.3
4.5.2 Checking Ant. SW module
Refer to 4.4
4.5.3 Checking RF TX Level
TP4
TP 3
TP 1
TP 2
Test Point (RF TX Level)
ANT200
TP1
1p
C283
R221
2.2nH
L229
10nH
ANT
G2
RF200
RF
G1
KMS-507
C279 33p
VREG_RFTX_2.85V
ANT_SEL0
ANT_SEL2
ANT_SEL1
Q507
UMC4N
VREG_RFRX_0_2.85V
C286
0.1u
R224
0 C285
100p
R223
0 C277
100p
R222
0 C281
100p
C284
27p
10
VDD
9
8
5
VC1
VC2
VCG
U207
GSM900_RX
GSM1800_RX
GSM1900_RX
WCDMA
4
1
2
3
GSM18001900_TX
GSM900_TX
12
13
SFAY0004601
TP2
C295
0.01u
C296
100u
C289
NFM21PC105B1A3
2
OUT IN
1
4
G2 G1
3
+VPWR
C638
NA
47p
C292
22p
C293
C280
NA
C299
68p
C305
0.01u
C297
100u
15
DCS_PCS_OUT
11
GSM_OUT
19
RSVD_GND
U209
DCS_PCS_IN
3
SKY77328
GSM_IN
4
ENABLE
BS
18
1
100
R225
R227 100
C298
15p
C304
15p
GSM_PA_EN
GSM_PA_BAND
GSM/DCS/PCS
WCDMA
DMF1950IHC
RX
GND
U202
TX
L504
NA
27p C642
L503
NA
SMPY0008201
U204
11
RF_OUT
TP3
TX_AGC_ADJ
R212
270
C251
0.01u
+VPWR
C245
RF_IN
3
C282
4.7u
SI3493DV
Q200
VREG_PA
C259
10u
+VPWR
0
R214
PA_FET_N
L214 7.5nH
C224 6p
B7844
FL202
1
2 3
G1 O1
IN
G2 O2
5 4
1805-1880 MHz
L209
8.2nH
L215 7.5nH
L212 15nH
R234
R233
200
24
R228
R229
15
R236
150
270
R235
220
R232
51
C227 9p
L211
22nH
FL201
B7837
2 3
1
IN
G1
G2
O1
O2
5 4
925-960 MHz
L213 15nH
8
12
13
14
MQW5V0C869M
10
VC
1
5
OUT_GSM
OUT_DCSPCS
U210
VB
SW1
SW2
3
9
11
GND5
GND6
GND7
GND8
GND1
GND2
GND3
GND4
2
4
6
7
L216
22nH
L217
22nH
FL204
EFCH1950TDC1
4
G3
1
OUT
G2 G1
IN
5 2
TP4
C255
6p
- 86 -
4. TROUBLE SHOOTING
For testing, Max power output is needed.
S et the Phone Tx is ON
and PDM is 450
Check TP 1
Over 21dB m ?
NO
Check TP 2
Over 19dB m ?
NO
Ch eck TP3
Over 16dB m ?
NO
Check TP 4
Over -5dBm ?
NO
Chan ge the board
YES
YES
YES
YES
RF Tx L e
Chec
M o vel is OK k ANT. SW dule U207
Chec k Duplexer U202
Check PAM Bloc refer to 4.5.4
k
- 87 -
4. TROUBLE SHOOTING
4.5.4 Checking PAM Block
PAM control signal
PA_ON : WCDMA Tx Power Detect IC(U203:HDET) Enable
PA_FET_N : WCDMA PAM Vcc Control Signal (Q200)
TX_AGC_ADJ : WCDMA Tx Power Amp Gain Control
PA_FET_N
PA_ON
TX_AGC_ADJ
PA_ON must be HIGH(over 2.5V)
PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V)
PAM IN/OUT Signal
PAM_OUT
PAM_IN
PAM OUT must be over 16dBm
PAM IN must be over -5dBm
- 88 -
4. TROUBLE SHOOTING
4.5.5 Check RF Rx Level
TP1
TP3
Bias1
i
TP4
TP2
Test Point (RF Rx Level)
TP1
ANT200
1p
C283
R221
2.2nH
L229
10nH
ANT
G2
G1
RF200
RF
KMS-507
C279 33p
VREG_RFRX_0_2.85V
C286
0.1u
VREG_RFTX_2.85V
ANT_SEL0
ANT_SEL2
ANT_SEL1
Q507
R224
0 C285
100p
R223
0 C277
100p
R222
0 C281
100p
UMC4N
TP2
C284
27p
10
VDD
9
8
5
VC1
VC2
VCG
U207
GSM900_RX
GSM1800_RX
GSM1900_RX
1
2
3
4
WCDMA
GSM18001900_TX
GSM900_TX
12
13
SFAY0004601
DMF1950IHC
RX
GND
U202
TX
Bias1
C205 100p
R201
5.62K
(1%)
U201
RFL6200
C202 12p L201 2.2nH
L200
C200
1p
C645
0.5p
8.2nH
C203
100p
1
2
3
4
GND1
DNC
UMTS_BIAS
UMTS_IN
GND4
UMTS_OUT
SBDT
VDDM
12
11
10
9
TP3
TP4
L208
47nH
VREG_RFRX_0_2.85V
C217
100p
C218
0.1u
C219
4.7u
R203
22
C211 1p
L206
10nH
L205 4.7nH
SBDT
C209
0.1u
100
R200
C210 12p
1
B7728
FL200
2
G1
IN
G2
3
O1
O2
5 4
C207
4.7u
VREG_MSMP_TCXO
Bias2
L203
10nH
C213 0.1u
C215 1p
L202
3.9nH
L204
3.9nH
L207
47nH
C208
100p
- 89 -
4. TROUBLE SHOOTING
S et the Phone Rx is ON
Chec k bias1,2
Over 2V ?
YES
Chec k TP1
Signal exist ?
YES
Chec k TP2
Signal exist ?
YES
Chec k TP3
Signal exist ?
YES
Chec k TP4
Signal exist ?
YES
Change the boar d
NO
NO
NO
NO
NO
Che
Chec
Che ck bias block so ldering
Check RF200 k ANT. SW
Module U207 ck Duplexer U202
Chec k RFL 6200 U201
- 90 -
4.6 Checking GSM Block
START
1. Check TXV CO Block
2. Check ANT. SW
Module
3. Check Tx PAM Block
4. Check RF Rx Level
2..
3..
5. Re -download SW
& CA L.
- 91 -
4. TROUBLE SHOOTING
4..
1..
4. TROUBLE SHOOTING
4.6.1 Checking TXVCO Block
TP4
TP5
TP6
TP3
TP1
TP2
Test Point (TXVCO Level)
TP5
TP6
TP1 TP4 TP2 TP3
R233
200
R234
24
R228
R229
15
R236 R235
150 220
270
R232
51
8
12
13
14
MQW5V0C869M
10
VC
1
5
OUT_GSM
OUT_DCSPCS
U210
VB
SW1
SW2
3
9
11
GND5
GND6
GND7
GND8
GND1
GND2
GND3
GND4
6
7
2
4
R239
C316
82
120p
C310
1000p
C313
(PPS)
22n
ECHU1C223JX5
FB201
R240 100
R237 100
R238
47
VREG_RFTX_2.85V
GSM_TX_VCO_0_EN_N
GSM_TX_VCO_1_EN_N
Schematic of RF TXVCO
- 92 -
4. TROUBLE SHOOTING
START
Check TP1
0.5V < TP1 < 2.5V
NO
YES
Check TP2, TP3
I f GSM TP2=High , TP3=Low
If DCS/PCS TP2=Low , TP3=High
NO
Check RTR6250
Check Soldering
& MSM6250
YES
Check TP4
2.8V < TP4 < 3.0V
YES
Check TP5, TP6
0dBm < TP5, TP6 < 5dBm
YES
TXVCO(U210) is OK
Check other parts
NO
NO
Check PMI C(U501)
Check Soldering of
TXVCO(U210)
- 93 -
4. TROUBLE SHOOTING
4.6.2 Checking Ant. SW Module
Refer to chapter 4.4
4.6.3 Checking RF Tx level
TP1
TP2
TP3
Test Point (RF Tx Level)
TP1
ANT200
1p
C283
R221
2.2nH
ANT
G2
G1
RF200
RF
KMS-507
L229
10nH
C279
33p
VREG_RFTX_2.85V
ANT_SEL0
ANT_SEL2
ANT_SEL1
Q507
UMC4N
VREG_RFRX_0_2.85V
C286
0.1u
R224
0 C285
100p
R223
0 C277
100p
R222
0 C281
100p
C284
27p
10
VDD
9
8
5
VC1
VC2
VCG
U207
GSM900_RX
GSM1800_RX
GSM1900_RX
1
2
3
4
WCDMA
GSM18001900_TX
GSM900_TX
12
13
SFAY0004601
TP3
C295
0.01u
C296
100u
C289
NFM21PC105B1A3
2
OUT IN
1
4
G2 G1
3
+VPWR
TP2
C638
NA
47p
C292
22p
C293
C280
NA
C299
68p
C305
0.01u
C297
100u
15
DCS_PCS_OUT
11
GSM_OUT
U209
DCS_PCS_IN
3
GSM_IN
4
19
RSVD_GND
SKY77328 ENABLE
BS
18
1
100 R225
R227 100
C298
15p
C304
15p
GSM_PA_EN
GSM_PA_BAND
Schematic of RF Tx Level
- 94 -
4. TROUBLE SHOOTING
START
Check TP1
If GSM over 31dBm ?
If DCS/PCS over 28dBm ?
NO
Check TP2, TP3
If TP2 over 29dBm ?
If TP3 over 25dBm ?
NO
YES
YES
GSM/DCS/PCS
Tx is Ok
Check other part
Check ANT. SW
Module (U207)
Refer to chapter 4.4
Check PAM Block (U209)
OK ?
Refer to chapter 4.6.4
NO
Check Solder ing of
PAM (U209) Block.
If pro blems stiil exist, replace the
PAM .
NO
Problems resolved?
YES
YES
Check TXVCO (U210)
Refer to chapter 4.6.1
GSM/DCS/PCS
Tx is OK
NO
Change the Board
- 95 -
4. TROUBLE SHOOTING
4.6.4 Checking PAM Block
PAM Control Signal
TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V,
TP2. GSM_PA_EN : Power Amp Enable
(Power ON : higher than 2.5V , Power OFF : lower than 0.7V)
TP3. GSM_PA_BAND : Power Amp Band Selection Control
(GSM Mode : lower than 0.7V , DCS/PCS Mode : higher than 2.5V)
TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.28V
TP4
Test Point (RF Tx Level)
TP1
C295
0.01u
C296
100u
TP4
C289
NFM21PC105B1A3
2
OUT IN
4
1
G2 G1
3
+VPWR
NA
47p
C292
22p
C293
C280
NA
C299
68p
C305
0.01u
C297
100u
TP2
TP3
15
DCS_PCS_OUT
11
GSM_OUT
19
RSVD_GND
U209
DCS_PCS_IN
3
SKY77328
GSM_IN
4
ENABLE
BS
18
1
100 R225
R227 100
C298
15p
C304
15p
GSM_PA_EN
GSM_PA_BAND
TP2
TP1
TP3
Schematic of PAM block
- 96 -
4. TROUBLE SHOOTING
4.6.5 Checking RF Rx Block
TP1. GSM Rx SAW Input
TP2. DCS Rx SAW Input
TP3. PCS Rx SAW Input
TP1
TP2
TP3
Test Point (RF Rx Level)
L220 7.5nH
TP3
C226 8p
1
FL203
2
G1
IN
G2
3
O1
O2
5 4
L210
8.2nH
B7846
1930-1990 MHz
L221 7.5nH
L222
12nH
L223
12nH
C241
1000p
VREG_RFTX_2.85V
TP2
C253
33p
TP1
C224 6p
C227 9p
L209
8.2nH
L211
22nH
FL201
B7837
1
2 3
G1 O1
IN
G2 O2
5 4
925-960 MHz
B7844
1
FL202
2
G1
3
O1
IN
G2 O2
5 4
1805-1880 MHz
L213 15nH
MQW5V0C869M
10
VC
L214 7.5nH
L215 7.5nH
L212 15nH
U210
VB
3
L216
22nH
L217
22nH
C232
1000p
L218
33nH
L219
33nH
C233
1000p
FB201
R240 100
RX_VCO_IN
R239
C316
120p
82
C310
1000p
R230
1.8K
R231
3.3K
C306
10n
ECHU1C103JX5
(PPS)
C301
820p
C308
C313
22n
27p
(PPS)
ECHU1C223JX5
C302
0.01u
C300
100p
R210
C237
33p
11K
(1%) 33
34
35
36
37
38
39
29
30
31
32
40
41
42
C307
82p
CP_HOLD2
CP2
VDDA9
RX_VCO_IN
R_BIAS
GSM1800_INN
GSM1800_INP
VDDA10
GSM900_INP
GSM900_INN
VDDA11
TX_MOD_CP
VDDA12
TX_VCO_FB
R238
47
VREG_RFTX_2.85V
RTR6250
U205
DAC_REF
C264
0.1u
R215
10
RX_IN
RX_IP
RX_QN
RX_QP
VDDA4
VCO_TUNE
VTUNE_REF
VDDA3
TCXO
VDDA2
VDDA1
FAQ1
CP1
CP_HOLD1
3
2
1
6
5
8
7
4
10
9
14
13
12
11
Schematic of GSM/DCS/PCS Rx Block
- 97 -
4. TROUBLE SHOOTING
START
TP1, TP2, TP3 signals exist ?
NO
Check ANT. SW
Module (U207) and solder ing of TPs
YES
Rx still has problems ?
NO
GSM/D CS/PCS
Rx is OK
YES
Re-download & CAL.
- 98 -
4. TROUBLE SHOOTING
4.7 Bluetooth RF Block
TC-3000A (Bluetooth Tester)
1. Set phone to bluetooth test-mode
: Enter Test Mode(277634#*#)
→ Module Test Set → BT DUT → BT DUT ON
2. Connect phone to bluetooth tester
3. Set channel to 39
4. Measure output-power
5. Check TP1 : output-power > -6 dBm
TP6
TP1
TP2
TP5
TP4
TP3
TP7
- 99 -
4. TROUBLE SHOOTING
TP1
L507
1.5nH
TP2
VREG_MSMP_TCXO
VREG_BT_2.85V
TP5
2.2u
1608
1u
U406
16
13
ANT
NC
2
3
LDO1
LDO2
SBST
SBCK
SBDT
SYNC_DET_TX_EN
RX_BB_TX_BB
XTAL_IN
CLK_REF
6
10
4
9
11
5
8
C406 1000p
RB06A
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
TCXO_BT
BT_CLK
TP6
TP4
TP3
TCXO_EN
VREG_MSMP_2.6V
Q504
UMC4N
VREG_MSMP_TCXO
TP7
TCXO_BT_IN
C503
1000p
C542
1000p
R500
100K
2
U500
VCC
5
4
3
GND
TC7S04FU
VREG_BT_2.85V
TCXO_BT
Schematic of Bluetooth RF Block
- 100 -
4. TROUBLE SHOOTING
START
TP1 level > -6dBm ?
YES
Check BT ANT.
(ANT400) soldering
NO
TP2 > 2.5V
YES
NO
TP3 > 2.5V
& TP4 > 2.0V
YES
Replace Q504
NO
TP5 > 2.8V
YES
NO
TP6 19.2MH z exist?
NO
Replace PM6650
(U501)
TP7 19.2MHz exist?
YES
Replace U406
NO
YES
Replace U500
Replace Board
- 101 -
4. TROUBLE SHOOTING
4.8 LG-U8290 Main features
- Folder Type
- WCDMA + GSM(900,1800) + PCS(1900) Triple mode
- Dual color LCD(Main:260K TFT, Sub:65K STN)
- 1.3M Pixel CMOS VGA Camera
- 17 pi single way speaker
- Stereo Head_set
- Video telephony in WCDMA with camera
- Loud Speaker phone(in GSM and WCDMA)
- 64 Poly Sound
- MP3/AAC decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Support Bluetooth, USB
- 89.5 X 47.5 X 24.5 mm
- 1,400 mAh(Li-Poly)
- 102 -
4. TROUBLE SHOOTING
4.9 LG-U8290 Main Component
Key B’d Bottom Side & Top Side
Dual Color LCD Module
(LCD, 17 Pi Speaker, 12 Pi Motor)
1.3M Camera
Stereo Head_Set
Shied Frame Main B dBottom Side Main B’d Top Side
- 103 -
4. TROUBLE SHOOTING
TOP Side
U206
U606
U100-1
X100
U601
S600
CN300
BAT500
U607
U400
Reference
X100
U100-1
U601
U206
S600
Description
USB Clock(48Mhz)
MSM6250
NAND Flash+SDRAM
(64M + 64M)
TCXO (19.2Mhz)
T-Flash Socket
Reference
U606
U607
U400
CON300
BAT500
Description
Camera LDO
LCD LDO
MIC bias LDO
KEY PCB Connector
Coin-cell battery
- 104 -
4. TROUBLE SHOOTING
BOTTOM Lower Side
U605
X500
U501
Q500
R503
CN302
U407
Reference
U501
U605
CN302
R503
Description
PM6650 (PMIC)
Audio AMP
IO Connector
Current Sensing R
Reference
X500
Q500
U407
Description
Sleep X-tal (32.768Khz)
Charger TR
USIM Connector
- 105 -
4. TROUBLE SHOOTING
BOTTOM Upper Side
TR400
CN301
Reference
CN301
TR400
Description
Camera Connector
Camera Direction
Sense TR
Reference
CN304
U406
Description
Head_Set Jack
Bluetooth Module
- 106 -
CN304
U406
4. TROUBLE SHOOTING
4.10 Power ON Trouble
Power On sequence of U8290 is :
PWR key press(Key PCB)
→ On_SW_PM* go to low(D500),PM6650 KPDPWR_N pin(24) → PM6650
Power Up
→ VREG_MSMC_1.375V(C539), VREG_MSME_1.8V(C537), VREG_MSMP_2.6V(C522),
VREG_MSMA_2.6V(C520) VREG_TCXO_2.85V(C512) power up and system reset assert to MSM
→
Phone booting and PS_HOLD(U100) assert to PMIC
Start
Batte ry voltg. higher than 3.28V?
YES
Press PW R key
Keypad LED on?
YES
D500(pin2) high to low when key press?
YES
VREG_MSMC_1.375V,
VREG_MSMP_2.6V,
VREG_MSME_1.8V VREG_TCXO_2.85V
VREG_MSMA_2.6V power up?
NO
NO
NO
NO
Change or charging the
Batte ry
Follow the LCD tr ouble shoot
Check t he b'd to b'd conne ctor
Change the Main boa rd
YES
Is clock ok ?
R504 : 19.2M
TP502 : 32.768Kh z
YES
Change the Main boa rd
NO
Check t he TXCO
- 107 -
4. TROUBLE SHOOTING
19.2MHz
VREGC_MSMA_2.6V
VREGC_MSMP_2.6V
VREG_TCXO_2.85V
PM6650
VREG_MSME_1.8V
VREG_MSMC_1.375V
32.768KHz
- 108 -
4. TROUBLE SHOOTING
4.11 USB Trouble
USB Initial sequence of U8290 is :
USB connected to U8290
→ USB_VBUS(D520) go to 5V → USB_D+ go to 3.3V → 48M Crystal on →
USB_VP and USB_VN is triggered
→ USB work.
Start
Cable is insert?
YES
USB_VBUS is about to 5V?
YES
USB_D+ is about to 3.3V?
YES
48M is run?
YES
Change the Main board
NO
NO
NO
NO
Cable insert
Check U404,D520,USB cable
Check U404
Check X100
- 109 -
4. TROUBLE SHOOTING
USB_VBUS
USB_D+
USB_D-
X100 : 48M
48MHz
- 110 -
4. TROUBLE SHOOTING
4.12 SIM Detect Trouble
USB Initial sequence of U8290 is :
USIM_CLK,USIM_RST,USIM_DATA triggered
→ VREG_USIM_2.85V go to 3.0V → USIM IF work
Start
Re-insert the SIM card
Work well?
No
VREG_USIM_2.85V is 3.0V?
USIM_P_CLK is run?
YES
Change SIM card
Yes
NO
Work well?
No
Change the Main board
Yes
End
Check U407,
U408
End
VREG _USIM_2.85V(U408 Pin 5)
USIM_P_RST(U408 Pin 3)
USIM_P_CLK(U408 Pin 1)
- 111 -
USIM_P_DATA
(U408 Pin 6)
4. TROUBLE SHOOTING
4.13 Key Sense Trouble
Key Sense sequence of U8290 is :
Default condition ROW(0-4) is 2.6V
→ Press the key → Corresponding row(x) go to 0V → Key sensing
CN2
ROW[0-4]
COL[0-5]
Start
Change the side key pcb
Work well?
NO
Check the CN2
YES
ROW(0-4) is 2.6V?
Yes
NO
NO
YES
Check the CN300?
NO
Change the Main board
Yes
End
Change the Key pcb
Check RA1 And R4
Change the Main board
CN300
RA1(ROW[0-4])
R4
- 112 -
4. TROUBLE SHOOTING
4.14 Camera Trouble
Camera control signals are generated by MSM6250.
Start
Check t he camera conn. and reconnect the camera
Yes
Camera is OK?
NO
VREG_CAM_2.6V is 2.6V?
(C317)
Yes
Check t he DSP_CLK
(FB301)
Yes
Change t he camera
NO
NO
Yes
Camera is OK
NO
Change the Main boa rd
END
Change the Main boa rd
Change the Main boa rd
END
FB301
C317
- 113 -
4. TROUBLE SHOOTING
4.15 Main LCD Trouble
Main LCD control signals are generated by MSM6250. Those signal’s path are :
MSM6250
→ MAIN B’d → CN300 → CN2 → Key Pcb → CN1 → LCD Module
START
Press END key to turn the power on
Is the circuit powered?
Yes
Disconnect and reconnect the LCD Connector
No
Follow the Power ON trouble shooting
Yes
LCD display OK?
No
Change Keypad
Yes
LCD display OK?
No
Change LCD Module
Yes
The LCD works
LCD display OK?
No
Change Main Board
- 114 -
LCD Control data flow
4. TROUBLE SHOOTING
- 115 -
4. TROUBLE SHOOTING
4.16 Sub LCD Trouble
Sub LCD control signals are generated by MSM6250. Those signal’s path are :
MSM6250
→ MAIN B’d → CN300 → CN2 → Key Pcb → CN1 → LCD Module
START
Press END key to turn the power on
No
Follow the Power ON trouble shooting
Is the circuit powered?
Yes
Disconnect and reconnect the LCD Connector
Yes
Sub LCD display OK?
No
Change Keypad
Yes
Sub LCD display OK?
No
Change LCD Module
Yes
Sub LCD display OK?
No
Change Main Board
The LCD works
- 116 -
LCD Control data flow
4. TROUBLE SHOOTING
- 117 -
4. TROUBLE SHOOTING
4.17 Keypad Backlight Trouble
Key Pad Back Light is on as below :
Key pressing
→ KEYD_BACKLIGHT go to 0V → B’d to B’d connector → LED On
Start
Key p ress
Signal VPWR is ab ove 3.2V?
Yes
Signal KEYD_B ACKLIGHT is 0V?
Yes
Change the Key Pcb
NO
NO
Check CN300,CN1
Yes
Check CN300,CN1
Yes
Change the Main boa rd
VPWR
KEYD_BACKLIGHT
- 118 -
4. TROUBLE SHOOTING
4.18 Folder ON/OFF Trouble
Folder On/Off is worked as below :
Folder On/Off Event
→ Flip(U604 pin 2) is triggered(On : about 2.1V, Off : 0V) → MSM6250 Sense the
Folder Event
Start
Check t he mag net in fold er Assy
Yes
Appr oach the magne t to
U604
NO
Insert the mag net
FLIP(U604 pin 2) is 0V?
NO
Check t he U604 higher t han 2.6V
Yes
Change the Main b'd
Yes
Work w ell?
Yes
Check CN300,CO N504
NO
Change the Key Pcb
Change the Main b'd
- 119 -
4. TROUBLE SHOOTING
VREG_MSMP_2.6V
FOLDER DETECT
R616
U604
A3212ELH
VDD
62
GND
OUT
To MSM6250
←
FOLDER_DETECT
C612
0.1u
C639
10p
U601
- 120 -
4. TROUBLE SHOOTING
4.19 Camera Direction Detection Trouble
Camera direction detection is worked as below :
Camera direction change Event
→ CAM_SENSE(TR400 pin 2) is triggered(On : about 2.1V, Off : 0V)
→ MSM6250 Sense the Camera direction change Event
Start
Change t he camera direct ion
Yes
CAM_SENSE is 0V?
NO
Sense is OK?
NO
Change th e Main B'd
R403 is 2.6V?
Yes
Change t he Camera
NO
Yes
Sense is OK?
NO
Change th e Main B'd
Check R403
END
Yes
END
- 121 -
4. TROUBLE SHOOTING
TR400
- 122 -
4. TROUBLE SHOOTING
4.20 Camera Flash Trouble
Camera Flash is worked as below :
PM6650 control the camera flash in Folder Assy
→ PM6650 Port 8(FLSH_DRV_N) →
CN300(Flash_On)
→ CN2(Flash_On) → CN1 → LCD Module → FLASH LED FPCB Module
Start
Check t he Flash FPCB
Module in folde r Assy
Yes
NO
Reso ld er the FPCB
VREG_5V of FPCB is higher t han 3.3V?
NO
Work w ell?
Yes
Change the FPCB
Yes
NO
Work w ell?
VREG_5V is 5V o n Key PCB?
Yes
Check t he
CN1, CN2 or Change the Key pc b
NO
Yes
Check t he CN2 or Change the Key pc b
FLAS H_ON of C N1 pin 17 is 0V?
NO
FLASH_ON of CN300 pin 22 is 0V?
Yes
Yes
Check t he CN300
Change the Main boa rd End
- 123 -
4. TROUBLE SHOOTING
Flash LED
CN1
- 124 -
FLASH_ON from
Main B’d PM6650
4. TROUBLE SHOOTING
4.21 Audio Trouble Shooting
Audio & Sound Signal Path are followed as below figure.
We can check the trouble point corresponded error audio & sound mode.
MSM6250
(U100)
Head_Set
Voice
MIDI_Bell
AMP
(U304)
Key PCB
(B’d to B’d
Conn.)
MIC
Receiver
LCD
Module
(B’d to B’d
Conn.)
Loud Speaker
Head_set MIC
Voice + MP3 + MIDI
♣ Note : It is recommended that engineer should check the soldering of R, L, C along the corresponding path before every step.
- 125 -
4. TROUBLE SHOOTING
Receiver Path
Voice Receiver path as below:
MSM6250 Ear1ON/Ear1OP
→ CN300(b’d to b’d connector) → CN2(b’d to b’d connector) → CN1(LCD b’d to b’d connector)
→ LCD module → Speaker
Start
Connect the phone to network
Equipment and setup call
Setup 1 KHz tone out
The sine wave appear at
FB502,FB503?
YES
The sine wave appear at
CN 301 pin 4,5?
YES
The sine wave appear at
CN2 pin 4 ,5?
NO
Change the Main board
NO
Check F B502,FB503 or
Change the Main board
NO
Change the Key p cb
NO
Change the LCD Module
The sine wave appear at
RCV+/RCV- in LCD modul e?
YES
Sold erin g if sp eaker O K?
YES
Can y ou he ar the tone ?
YES
END
NO
NO
Reso ld ering speaker
Change the sp eaker
- 126 -
CN500
CN1
CN2
- 127 -
4. TROUBLE SHOOTING
FB503
FB502
4. TROUBLE SHOOTING
Receiver Path for Head_set
Voice Receiver & video telephony path for Head_Set as below:
MSM6250 HPH_R, HPH_L
→ C626, C627 → CN304(Head_Set Jack)
Start
Conne ct the phone to ne twork
Equipment and setup call
Setup 1 KHz tone out
An d in sert head_Set
EAR_SENSE*(R624) is 0V?
YES
The sine wave appear at
C626, C627?
YES
The sine wave appear at
CN304 pin 4,5?
YES
Can you hear the tone ?
YES
END
NO
NO
NO
NO
Change the Main boa rd
Change the Main board
Check C626, C627
Change the Head_Set
- 128 -
- 129 -
4. TROUBLE SHOOTING
CN304
Head_set
Out put
Pin(4,5)
R624
C627
C626
4. TROUBLE SHOOTING
Voice Speaker Phone & Video telephony path
Voice Speaker Phone & Video telephony path as below:
MSM6250 HPH_R, HPH_L
→ R648, R649 → C633, C634 → R622, R623 → U605(Amp) → CN300 →
CN2
→ CN1 → LCD module → speaker
Start
Connect the pho ne to netw ork
Equipment and setu p call
Setup 1KHz tone out
The si ne w ave appear at
R648, R649?
YES
The si ne w ave appear at
C633, C634?
YES
LOUD_SPK_EN is
2.6V?
YES
The si ne w ave appear at
CN300 pin 2,3?
YES
The si ne w ave appear at
CN2 pin 2, 3?
NO
NO
NO
NO
NO
NO
The si ne w ave appear at
SPK+/SPK- in LCD mod ule?
YES
Solder ing if sp eaker OK?
YES
Can you hear the ton e?
YES
END
NO
NO
Change th e Main board
Check R 648,R649 or
Change th e Main b oard
Change the Main b oard
Check
R648,R649,C633,C634,
R622,R623 or
Change the Main b oard
Change the Key pcb
Change the LCD Module
Resolder ing speaker
Change the sp eaker
- 130 -
CN300
4. TROUBLE SHOOTING
U605
R622
C634
R649
R648
R623 C633
CN1
CN2
- 131 -
4. TROUBLE SHOOTING
MIDI Ring tone for speaker
MIDI Ring tone speaker path as below:
MSM6250 HPH_R, HPH_L
→ R648, R649 → C633, C634 → R622, R623 → U605(Amp) → CN300 →
CN2
→ CN1 → LCD module → speaker
Start
Play Th e Ring tone
The Ring t one appe ar at
R648, R649?
YES
The Ring Tone app ear at
C633, C634?
YES
LOUD_SPK_EN is
2.6V?
YES
The Ring Tone app ear at
CN300 pin 2,3?
YES
The Ring Tone app ear at
CN2 pin 2, 3?
NO
NO
NO
NO
NO
NO
The Ring Tone app ear at
SPK+/SPK- in LCD mod ule?
YES
Solder ing if speaker OK?
YES
Can you hear the tone?
YES
END
NO
NO
Change the Main b oard
Check R 648,R649 or
Change the Main board
Change the Main board
Check
R648,R649,C633,C634,
R622,R623 or
Change the Main b oard
Change the Key pcb
Change the LCD Module
Resoldering speaker
Change the sp eaker
- 132 -
CN300
4. TROUBLE SHOOTING
U605
R622
C634
R649
R648
R623 C633
CN1
CN2
- 133 -
4. TROUBLE SHOOTING
MIDI Ring tone for Head_Set
MIDI Ring tone Head_Set path as below:
Voice Receiver & video telephony path for Head_Set as below:
MSM6250 HPH_R, HPH_L
→ C626, C627 → CN304(Head_Set Jack)
Start
Play t he Ring tone and i nsert the Head_set
The Ring t one wave appear at C626,C627?
YES
The Ring t one wave appeare at CN304 Pin 4,5?
YES
Can you hear the tone?
YES
END
NO
NO
NO
Check R624 i s 0V? o r
Change t he Main board
Check C626,C627 or
Change t he Main board
Change t he Head_Set
- 134 -
- 135 -
4. TROUBLE SHOOTING
CN304
Head_set
Out put
Pin(4,5)
R624
C627
C626
4. TROUBLE SHOOTING
MP3 play for speaker
MP3 play for speaker path as below:
MSM6250 HPH_R, HPH_L
→ R648, R649 → C633, C634 → R622, R623 → U605(Amp) → CN300 →
CN2 -> CN1
→ LCD module → speaker
Start
Play Th e MP3
The MP3 appear at
R648, R649?
YES
The MP3 appear at
C633, C634?
YES
LOUD_SPK_EN is
2.6V?
YES
The MP3 appear at
CN300 pin 2,3?
YES
The MP3 appear at
CN2 pin 2, 3?
The MP3 appear at
SPK+/SPK- in LCD mod ule?
YES
Solder ing if speaker OK?
YES
Can you hear th e ton e?
YES
END
NO
NO
NO
NO
NO
NO
NO
NO
Change th e Main b oard
Check R 648,R649 or
Change the Main board
Change the Main b oard
Check
R648,R649,C633,C634,
R622,R623 or
Change th e Main b oard
Change the Key pcb
Change th e LCD Module
Resolder ing speaker
Change the sp eaker
- 136 -
CN300
4. TROUBLE SHOOTING
U605
R622
C634
R649
R648
R623 C633
CN1
CN2
- 137 -
4. TROUBLE SHOOTING
MP3 play for Head_Set
39p
C621
FB502 FB503
39p
C622
EAR JACK
MICBIAS_LDO_1.8V
VREG_MSMP_2.6V
MIC2P
MIC2N
HEADPHONE_L
HEADPHONE_R
EAR_SENSE*
MULTI_ADC
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_COL(6)
Near to MSM
10K R625
22n C102
33u
C115
22n
C626
0 R624
33u C627
C654
39p
VA8
C653
39p
AVLC14S02050
D503
To prevent from
TDMA noise.
R640 600
R641 600
13
CN304
15
7
8
9
5
6
10
11
12
3
4
1
2
14
16
D599
Start
Play t he MP3 and in sert the Head_set
The MP3 wave ap pear at
C626,C627?
YES
Can y ou he ar the tone ?
YES
END
NO
NO
Check R624 is 0V? or
Change the Main boa rd
Change the Head_Set
- 138 -
- 139 -
4. TROUBLE SHOOTING
CN304
Head_set
Out put
Pin(4,5)
R624
C627
C626
4. TROUBLE SHOOTING
Microphone for Main MIC
Main Microphone path as below:
MIC
→ MIC pad(MIC1) → C401,C402 → MSM6250 → MIC feed back gain logic → MSM internal
CODEC
39p
C621
FB502 FB503
39p
C622
VREG_MSMA_2.6V
MICBIAS
C400
1u
MIC
U400
1
VIN
2
GND
3
_SD
SI91841DT-18-T1
5
VOUT
BP
4
C402
0.01u
1u
C625
MICBIAS_LDO_1.8V
Near to MSM
MIC1
1
2
OBG-415S42-C1033
UCLAMP0505A
4 3
5
6
2
U401
1
C619
39p
C618
39p
22n C401
22n C404
MIC1P
MIC1N
Start
Make a call
MIC_BIAS(R400) is 1.8V
YES make some sound or voi ce to MIC
NO
Check R400, U5400(pi n 5)
NO
Change t he MIC
Can you scoping so me sound signal a t C401,C402
YES
Change th e Main B'd
NO
Work well ?
YES
END
- 140 -
4. TROUBLE SHOOTING
- 141 -
MIC
Contact
C404
C401
4. TROUBLE SHOOTING
Microphone for Head_Set
MIC for Head_Set path as below:
Insert Headset
→ Ear_Sense(R624) go 0V → MSM6250 sense Head_Set insertion → MIC signal go to MSM(C102, C115)
EAR JACK
MICBIAS_LDO_1.8V
VREG_MSMP_2.6V
MIC2P
MIC2N
HEADPHONE_L
HEADPHONE_R
EAR_SENSE*
MULTI_ADC
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_COL(6)
10K R625
22n C102
33u
C115
22n
C626
0 R624
33u C627
C654
39p
VA8
C653
39p
AVLC14S02050
D503
To prevent from
TDMA noise.
R640 600
R641 600
10
11
7
8
9
5
6
13
15
CN304
3
4
1
2
12
14
16
D599
Start
Make a call
OK
Try change the head set
NO
Ear_sen se(R624) is 0V?
Yes
EXT_MIC is b iased about 2 .0V?
Yes
Change the Main B'd
NO
NO
END
Check R624 o r ch ange the Main B'd
Check Head P hone
- 142 -
- 143 -
4. TROUBLE SHOOTING
CN304
Head_Phone
Input
Pin(2,3)
R624
C115
C102
4. TROUBLE SHOOTING
4.22 Charger Trouble Shooting
C2
4
C1
2
Q500
3
E
B
1
2SB1424
CHG_CNT_N
+5V_PWR
TA
(4.6V)
ICHARGE
4.2~4.25V
Charging Procedure
- Connecting TA
- Control the charging current by PM6050 IC
- Charging Current flows into the battery
Check Point
- Connection of TA
- Charging current path
- Battery
Trouble Shooting Setup
- Connect TA and battery to the phone
Trouble Shooting Procedure
- Check the charger connector
- Check the charging current Path
- Check the battery
Q502
ICHARGEOUT
+VPWR
VBATT
Main
SI3493DV
BATT_FET_N
- 144 -
4. TROUBLE SHOOTING
Start
Check t he pin and ba ttery
Connect terminals of I/O connect or
Connect ion O K?
Yes
Is the TA volt age 4.6V
Yes
Is it charging p roper ly
Af ter chang ing Q 500, Q502?
NO
Change the board
NO
NO
Yes
Change I/O connector
Change TA
END
- 145 -
4. TROUBLE SHOOTING
4.6V
4.6V
Receptacle
- 146 -
4. TROUBLE SHOOTING
4.23 Bluetooth RF Block
TC-3000A (Bluetooth Tester)
1. Set phone to bluetooth test-mode
: Enter Test Mode(277634#*#)
→ Module Test Set → BT DUT → BT DUT ON
2. Connect phone to bluetooth tester
3. Set channel to 39
4. Measure output-power
5. Check TP1 : output-power > -6 dBm
TP6 TP1
TP2
TP5
TP4
TP3 TP7
- 147 -
4. TROUBLE SHOOTING
Test Point (Bluetooth Block )
TP1
L507
1.5nH
TP2
VREG_MSMP_TCXO
VREG_BT_2.85V
TP5
2.2u
1608
1u
U406
16
13
ANT
NC
2
3
LDO1
LDO2
SBST
SBCK
SBDT
SYNC_DET_TX_EN
RX_BB_TX_BB
XTAL_IN
CLK_REF
8
4
9
6
10
11
5
C406 1000p
RB06A
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
TCXO_BT
BT_CLK
TP6
TP4
TP3
TCXO_EN
VREG_MSMP_2.6V
Q504
UMC4N
VREG_MSMP_TCXO
TP7
TCXO_BT_IN
C503
1000p
C542
1000p
R500
100K
2
U500
VCC
5
4
3
GND
TC7S04FU
VREG_BT_2.85V
TCXO_BT
Schematic of Bluetooth RF Block
- 148 -
4. TROUBLE SHOOTING
START
TP1 level > -6dBm ?
YES
Check BT ANT.
(ANT400) soldering
NO
TP2 > 2.5V
YES
NO
TP3 > 2.5V
& TP4 > 2.0V
YES
Replace Q504
NO
TP5 > 2.8V
YES
NO
TP6 19.2MH z exist?
NO
Replace PM6650
(U501)
TP7 19.2MHz exist?
YES
Replace U406
NO
YES
Replace U500
Replace Board
- 149 -
5. BLOCK DIAGRAM
5. BLOCK DIAGRAM
5.1 GSM & WCDMA RF Block
Fig 5.1-1.UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram
- 150 -
5. BLOCK DIAGRAM
Block
Common
Bluetooth
WCDMA
GSM
U208
U205
U203
U209
U210
FL201
FL202
FL203
ANT400
U202
U201
FL200
U200
FL204
U204
Ref. Name
U207
RF200
U206
U406
LDA31
DMF1950IHC
RFL6200
B7728
RFR6200
WTDA1
SKY77410
MQL302A1G71
RTR6250
LMV225TLX
SKY77328
MQW5V0C869M
B7837
B7844
B7846
Part Name
SFAY0004601
KMS-507
TG-5001LA-19.2MHz
LBDA254AN0
Function
Switch
Test Connector
VCTCXO
Bluetooth RF
Transceiver
Antenna
Duplexer
RF LNA IC
RX SAW Filter
RF Receiver IC
TX SAW Filter
TX PAM
VCO
RF Transceiver IC
Power Detect
TX Dual PAM
VCO
RX SAW Filter
RX SAW Filter
RX SAW Filter
Comment
Band select
Calibration, etc
19.2MHz
Bluetooth TRX
Bluetooth antenna
TRX
RX
RX
RX
TX
TX
UMTS Rx CH VCO
TRX
TX
TX
Dual TX VCO
EGSM RX
DCS RX
PCS RX
Table 5.1-1. RF Block Component
- 151 -
5. BLOCK DIAGRAM
5.2 Interface Diagram
RF200
ANT_SEL0,1,2
PA_RAMP
PA_EN
PA_BAND
VCO_EN
GSM TX
DCS/PCS TX
Dual
PAM
GSM
Dual
TXVCO
TX I/Q
RTR6250
ANT.
SW
Module
Duplexer
GSM/DCS/PCS
RX
GSM/DCS/PCS
Rx SAW Filter
UMTS
PAM
HDET
RX I/Q
UMTS
Tx SAW
Filter
MSM6250
UMTS TX
TX_AGC_ADJ
UHF_VCO_EN
UMTS
Rx VCO
VCTCXO
19.2MHz
TRK_LO_ADJ
HDET
UMTS RX
RFL6200
UMTS
Rx SAW
Filter
RFR6200
U8290 Interface Diagram
- 152 -
5. BLOCK DIAGRAM
Main RF signal (black)
GSM TX : GSM Tx RF signal
GSM RX : GSM Rx RF signal
DCS TX : DCS Tx RF signal
DCS RX : DCS Rx RF signal
PCS TX : PCS Tx RF signal
PCS RX : PCS Rx RF signal
UMTS TX : UMTS Tx RF signal
UMTS RX : UMTS Rx RF signal
TX_I/Q : I/Q for Tx of RF
RX_I/Q : I/Q for Rx of RF
Control signal(red)
ANT_SEL 0,1,2 : Ant Switch Module Mode Selection
(WCDMA, GSM Tx/Rx, DCS Tx/Rx, PCS Tx/Rx)
GSM PA_CTL signal
GSM_PA_BAND : DCS or PCS /GSM Mode Selection
GSM_PA_EN : Power Amp Gain Control Enable
GSM_PA_RAMP : Power Amp Gain Control
GSM/DCS_VCO_EN
GSM_VCO_EN : GSM band Tx VCO Enable
DCS_VCO_EN : DCS band Tx VCO Enable
UMTS PA_CTL signal
PA_ON : WCDMA Tx Power Amp Enable
PA_RANGE0 : WCDMA Tx Power Amp Gain Control
TRK_LO_ADJ : TCXO(19.2M) Control
UHF_VCO_BAND_SEL : WCDMA(3G)/GSM(2G) VCO Band Selection of UHF VCO
- 153 -
5. BLOCK DIAGRAM
Top Side
- 154 -
Bottom Side
5. BLOCK DIAGRAM
- 155 -
6. DOWNLOAD
6. DOWNLOAD
6.1 Introduction
LGMDP(Ver 1.4)is a software for downloading image files to the phone from Microsoft Windows 2000 or Microsoft Windows XP where the LG USB Modem driver (Ver 4.5 or later) is installed.
6.2 Downloading Procedure
1) Connecting to PC
1. Connect the phone to your desktop PC using the L/T cable and execute the LGMDP application.
2. Click on ‘Select Port’ and check if state shows “Enable” for the port in the “Select Port” window.
Then click on ‘Connect’. (The port number(COM4) can be different from yours.)
- 156 -
1-2) It is ready for downloading.
6. DOWNLOAD
1-3) Choosing image folder
Choose a Image folder after clicking on ‘Browse’.
- 157 -
6. DOWNLOAD
2) Choosing image files
1. Choose a Boot loader Image file after clicking on ‘Browse’.
(The file name can be different from yours.)
• It’s very important to choose the correct file. The phone NEVER can work with the wrong bootloader file.
Caution) Error message will show if you choose improper file.
- 158 -
6. DOWNLOAD
2. Choose a Boot shell file after clicking on ‘Browse’. (The file name can be different from yours.)
• It’s very important to choose the correct file. The phone NEVER can work with the wrong bootlshell file.
Caution) Error message will show if you choose improper file.
- 159 -
6. DOWNLOAD
3. Choose a AMSS Modem Image file after clicking on ‘Browse’.
(The file name can be different from yours.)
Caution) Error message will show if you choose improper file.
- 160 -
6. DOWNLOAD
4. Choose a Media Image after clicking on ‘Browse’. (The file name can be different from yours.)
Caution) Error message will show if you choose improper file.
- 161 -
6. DOWNLOAD
5. Choose a Module Image file after clicking on ‘Browse’.
(The file name can be different from yours.)
Caution) Error message will show if you choose improper file.
- 162 -
6. Click on ‘Download’ to download.
6. DOWNLOAD
- 163 -
6. DOWNLOAD
3) Downloading
This is whole process for downloading. You will see pictures for each step from the next .
Download Start
(NV backup)
Erase MODULE directory
(EFS Erase)
Download BOOTLOADER
Download BOOTSHELL
Download MODEM
Reset
(NV restore)
Reset
Erase MEDIA directory
Download MEDIA
Download MODULE
Reset
Download End
< Download process>
- 164 -
- 165 -
6. DOWNLOAD
•• A message box which informs a new file for
NV backup is created in the local directory is shown.
•• Doing NV backup.
6. DOWNLOAD
- 166 -
•• Downloading the AMSS Modem image
followed by the Bootloader and Bootshell images.
•• Rebooting and waiting for a while.
•• Unless the UE reboots, you should reboot
by yourself
•• Doing NV restore.
- 167 -
6. DOWNLOAD
•• Rebooting and wating for a while.
•• Erasing the existing directory and files for
the Media Image.
•• Downloading the Media image.
6. DOWNLOAD
•• Downloading the Module image.
•• Finally Download has been complete.
- 168 -
6. DOWNLOAD
6.3 Troubleshooting Download Errors
1) When the phone does not work after downloading
2) Media Erasing Error
3) NV Restore Error
→ Reboot the phone as the emergency mode (keep pressing “2” and “5” key while the phone is being booted). and then try to download the images again.
• The phone supports a special mode named emergency mode. In this mode, minimum units for
downloading is running so that users can download the images again in case of emergency situation.
(AMSS Modem, Media and Module Images don’t be running in this mode.)
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6. DOWNLOAD
When you meet the “MEDIA Erasing error” before downloading Media Image,
→ Reboot the phone and then try to download the Media Image again with Module Image.
• Both have to be downloaded at the same time.
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When you meet the “NV Restore error”,
6. DOWNLOAD
→ Connect to the phone.
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6. DOWNLOAD
→ Click on ‘Cancel’.
→ Click on ‘NV Restore’ then several NV Backup files(*.nv2) are shown.
• The files are saved every NV Backup. The name is based on the time when NV Backup is done.)
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→ Select the proper file and click on ‘Restore’.
6. DOWNLOAD
→ Reading the NV file and restore NV.
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6. DOWNLOAD
6.4 Caution
1) Multi-downloading using the USB hub is not recommendable.
2) The Module and Media Image have to be downloaded at the same time.
3) ‘EFS Erase’ option will be erase everything (media, module, NV Items and user data) in EFS area.
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7. CALIBRATION
7. CALIBRATION
7.1 General Description
This document describes the construction and the usage of the software used for the calibration of
LG’s GSM/GPRS/WCDMA Multimedia Mobile Phone (U8290). The calibration menu and their results are displayed in PC terminal by Mobile phone.
This calibration software includes GSM, DCS, PCS, WCDMA Band RF parts calibration. This calibration software was called “Pegasus”. From now on, the calibration software will be called
Pegasus in this document.
7.2 Pegasus Environment
7.2.1 H/W Environment
- PC with RS-232 Interface & GPIB card installed
- GSM/GPRS/WCDMA Multimedia Mobile Phone (U8290)
- Agilent 8960 Series 10 E5515C Instrument (E1985B Ver B.06.25)
- Power Supply
- ETC (GPIB cable, Serial cable, RF cable, Power cable, Dummy battery)
7.2.2 S/W Environment
- National Instrument GPIB & VISA (Ver 2.60 full) driver install
- Agilent 8960 VXI driver(E1960) install
- PEGASUS.EXE, CalInit.cfg, and dacTable.cfg files (Three files should be located in the same folder)
- OS : Window98, Window2000, WindowXP
- Serial port configuration :
Baud rate: 115200 / Char length: 8bit / No Parity/ No Flow control Stop bits: 1 bit
7.2.3 Configuration Diagram of Calibration Environment
Test Set(8960)
GPIB Cable
U8290
Mobile Switch Cable
Power Supply
Battery Simulator
Jig
PC
Figure 7-1. Calibration Configuration
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7. CALIBRATION
7.3 Calibration Explanation
7.3.1 Overview
In this section, it is explained each calibration item in the Pegasus. Also the explanation includes technical information such as basic formula of calibration and settings for key parameters related with
Pegasus’s internal calibration process.
At first, when any of calibration process is done, the results are displayed in the Pegasus result window. Then, output from the calibration process is stored in non-volatile (NV) memory.
7.3.2 Calibration Items
A. EGSM 900 Band
- GSM Ramp Up/Down Calibration
- GSM Freq. Comp. Calibration
- GSM RX Gain Range Calibration
B. DCS 1800 Band
- DCS Ramp Up/Down Calibration
- DCS Freq. Comp. Calibration
- DCS RX Gain Range Calibration
C. PCS 1900 Band
- PCS Ramp Up/Down Calibration
- PCS Freq. Comp. Calibration
- PCS RX Gain Range Calibration
D. WCDMA Band
- TX Linearity Calibration
- TX HDET Calibration
- TX Freq. Comp. Calibration
- TX Freq. Limit Calibration
- RX Linearity Calibration
- RX Freq. Calibration
- RX LNA Calibration
- RX LNA Freq. Calibration
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7. CALIBRATION
7.3.3 EGSM 900 Calibration Items
A. GSM Ramp Up/Down Calibration
- Purpose
This item contains the GSM normal Tx burst up/down-ramp DAC values for each power level.
When a GSM Tx burst is generated, it shall pass the ETSI standard power mask as well as Output RF
Spectrum due to Modulation and Switching (OSRF).
- Procedure Proposal
1. Set phone to GSM mode. Determine the DAC codes for each power level during steady state (flat part of the burst). Each power level has a tolerance limit as shown in Table 7-1.
2. Let’s call X the power levels and Y(x) (i) the up ramp DAC value of X power level at iteration i ( we have 30). We then have the following:
NV_GSM_TX_BURST_UP_RAMP_INDEX_X = (X, Y(x) (i) ), where X is a power level For
Power Control Level X= 5 to 19
For i = 1 to 30 (Number of step for Ramp Up)
NV_GSM_TX_BURST_UP_RAMP_INDEX_X[X, Y(x) (i)] = GSM_PA_DAC_CODE[X] - DAC
Table [X,Y(x) (i)]
Next i
Next x
3. Turn PA off
4. Write NV_GSM_TX_BURST_UP_RAMP_INDEX_X[X, Y(x) (i)] to an NV file.
Power
Control Level
5 (33 dBm)
6 (31 dBm)
7 (29 dBm)
8 (27 dBm)
9 (25 dBm)
10 (23 dBm)
11 (21 dBm)
12 (19 dBm)
13 (17 dBm)
14 (15 dBm)
15 (13 dBm)
16 (11 dBm)
17 (9 dBm)
18 (7 dBm)
19 (5 dBm)
Passing Limits
(tolerances)
±0.2 dB
±0.4 dB
±0.4 dB
±0.4 dB
±0.4 dB
±0.4 dB
±0.4 dB
±0.4 dB
±0.4 dB
±0.4 dB
±0.4 dB
±0.5 dB
±0.5 dB
±0.5 dB
±0.5 dB
Table 7-1. Tolerances for each power level
PA DAC code[x]
(RF Cal Station) x x x x x x x x x x x x x x x
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7. CALIBRATION
B. GSM Freq. Comp. Calibration
- Purpose
This item contains the change in Tx power of 7 ARFCN (Absolute Radio Frequency Channel Number) relative to a reference ARFCN (channel 49).
NOTE 7 ARFCN + 1 ref channel = 8 channels.
- Procedure Proposal
1. Load the highest DCS power as defined in the standard.
2. Measure frequency response of the phone across 8 different ARFCN.
3. The data structure for all Tx frequency-compensated NV items are laid out as in the following example.
NV_GSM_TX_FREQ_COMP
-8,-2,0,3,5,5,-7,-6
NOTE The first data index will correspond to channel index 0 and so on until the last index is reached for all channels. The data point for the reference channel will always be 0.
C. GSM RX Gain Range Calibration
- Purpose
This item specifies the RX gain from the antenna to the MSM for 8 frequencies in the GSM band.
- Procedure Proposal
1. Command the signal generator to output a signal level, Pin (recommended value is -65 dBm) at the phone antenna port.
2. Command the signal generator to one of the 8 specified channels plus an offset of 33 kHz.
3. Command the phone to one of the 8 specified channels.
4. Command the phone to set up gain range 0 ( 1, 2, or 3 ).
5. Command the phone to retrieve RSSI. Let’s call this value Xrssi.
6. Calculate and record (in 1/16 dB units) the absolute gain from antenna to MDSP using the following equation.
NV_GSM_RX_GAIN_RANGE_1_FREQ_COMP = 16*( 10Log(xrssi) - Pin)
7. Repeat steps above for the next ARFCN in the NV_GSM_CAL_ARFCN item.
8. The data structure for all Rx frequency-compensated NV items are laid out as in the following example.
NV_GSM_RX_GAIN_RANGE_1_FREQ_COMP
2036,2039,2035,2039,2036,2026,2031,2037
NOTE The first data index will correspond to channel index 0 and so on until the last index is reached for all channels. Rx frequency-compensated NV items are absolute measurement, not relative measurement like Tx NV items.
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7. CALIBRATION
7.3.4 DCS 1800 Calibration Items
A. DCS Ramp Up/Down Calibration
- Purpose
This item contains the DCS normal Tx burst up/down-ramp DAC values for each power level.
When a DCS Tx burst is generated, it shall pass the ETSI standard power mask as well as Output RF
Spectrum due to Modulation and Switching (OSRF).
- Procedure Proposal
1. Set phone to DCS mode. Determine the DAC codes for each power level during steady state (flat part of the burst). Each power level has a tolerance limit as shown in Table 7-2.
2. Let’s call X the power levels and Y(x) (i) the up ramp DAC value of X power level at iteration i ( we have 30). We then have the following:
NV_DCS_TX_BURST_UP_RAMP_INDEX_X = (X, Y(x) (i) ), where X is a power level For
Power Control Level X= 5 to 19
For i = 1 to 30 (Number of step for Ramp Up)
NV_DCS_TX_BURST_UP_RAMP_INDEX_X[X, Y(x) (i)] = DCS_PA_DAC_CODE[X] - DAC
Table [X,Y(x) (i)]
Next i
Next x
3. Turn PA off
4. Write NV_DCS_TX_BURST_UP_RAMP_INDEX_X[X, Y(x) (i)] to an NV file.
Power
Control Level
0 (30 dBm)
1 (28 dBm)
2 (26 dBm)
3 (24 dBm)
4 (22 dBm)
5 (20 dBm)
6 (18 dBm)
7 (16 dBm)
8 (14 dBm)
9 (12 dBm)
10 (10 dBm)
11 (8 dBm)
12 (6 dBm)
13 (4 dBm)
14 (2 dBm)
15 (0 dBm)
Passing Limits
(tolerances)
±3 dB
±3 dB
±4 dB
±4 dB
±4 dB
±4 dB
±4 dB
±5 dB
±5 dB
±3 dB
±3 dB
±3 dB
±3 dB
±3 dB
±3 dB
±3 dB
Table 7-2. Tolerances for each power level
PA DAC code[x]
(RF Cal Station) x x x x x x x x x x x x x x x x
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7. CALIBRATION
B. DCS Freq. Comp. Calibration
- Purpose
This item contains the change in Tx power of 15 ARFCN (Absolute Radio Frequency Channel
Number) relative to a reference ARFCN (channel 663).
NOTE 15 ARFCN + 1 ref channel = 16 channels.
- Procedure Proposal
1. Load the highest DCS power as defined in the standard.
2. Measure frequency response of the phone across 16 different ARFCN.
3. The data structure for all Tx frequency-compensated NV items are laid out as in the following example.
NV_DCS_TX_FREQ_COMP
-8,-2,0,3,5,5,-7,-6
NOTE The first data index will correspond to channel index 0 and so on until the last index is reached for all channels. The data point for the reference channel will always be 0.
C. DCS RX Gain Range Calibration
- Purpose
This item specifies the RX gain from the antenna to the MSM for 16 frequencies in the DCS band.
- Procedure Proposal
Same as in previous section in GSM except this time set the gain range and phone mode to DCS with injected power of -65 dBm. In DCS we will frequency compensate over 16 channels.
7.3.5 PCS 1900 Calibration Items
A. PCS Ramp Up/Down Calibration
- Purpose
This item contains the PCS normal Tx burst up/down-ramp DAC values for each power level.
When a PCS Tx burst is generated, it shall pass the ETSI standard power mask as well as Output RF
Spectrum due to Modulation and Switching (OSRF).
- Procedure Proposal
1. Set phone to PCS mode. Determine the DAC codes for each power level during steady state (flat part of the burst). Each power level has a tolerance limit as shown in Table 7-1.
2. Let’s call X the power levels and Y(x) (i) the up ramp DAC value of X power level at iteration i ( we have 30). We then have the following:
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7. CALIBRATION
NV_GSM_1900_TX_BURST_UP_RAMP_INDEX_X = (X, Y(x) (i) ), where X is a power level
For Power Control Level X= 5 to 19
For i = 1 to 30 (Number of step for Ramp Up)
NV_GSM_1900_TX_BURST_UP_RAMP_INDEX_X[X, Y(x) (i)] = DCS_PA_DAC_CODE[X] -
DAC Table [X,Y(x) (i)]
Next i
Next x
3. Turn PA off
4. Write NV_GSM_1900_TX_BURST_UP_RAMP_INDEX_X[X, Y(x) (i)] to an NV file.
B. PCS Freq. Comp. Calibration
- Purpose
This item contains the change in Tx power of 15 ARFCN (Absolute Radio Frequency Channel
Number) relative to a reference ARFCN (channel 633).
NOTE 15 ARFCN + 1 ref channel = 16 channels.
- Procedure Proposal
1. Load the highest PCS power as defined in the standard.
2. Measure frequency response of the phone across 16 different ARFCN.
3. The data structure for all Tx frequency-compensated NV items are laid out as in the following example.
NV_GSM_1900_TX_FREQ_COMP
-8,-2,0,3,5,5,-7,-6
NOTE The first data index will correspond to channel index 0 and so on until the last index is reached for all channels. The data point for the reference channel will always be 0.
C. PCS RX Gain Range Calibration
- Purpose
This item specifies the RX gain from the antenna to the MSM for 16 frequencies in the PCS band.
- Procedure Proposal
Same as in previous section in GSM except this time set the gain range and phone mode to PCS with injected power of -65 dBm. In DCS we will frequency compensate over 16 channels.
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7. CALIBRATION
7.3.6 WCDMA Calibration Items
A. TX Linearity Calibration
- Purpose
This item contains the TX_AGC_ADJ PDM values that make up the Tx Master Linearizer for low (or high) PA gain state (PA Range 0 or 1). The linearizer is made up of 37 values for 37 equally spaced Tx power levels, 33 points over the phone true dynamic range, 2 points on the high side of the dynamic range, and 2 points on the low side of the dynamic range. These values represent 9 bits unsigned
PDM values (0 to 511) that produce the correct Tx AGC amplifier gain corresponding to the transmit power of interest (see Figure 7-2).
Figure 7-2. TX_AGC_ADJ PDM values
- Procedure Proposal
1. Set phone in WCDMA mode.
2. Set phone to a reference channel.
3. Set the spectrum analyzer to that reference channel’s frequency.
4. Turn on PA.
5. Set PA to low-gain (or high-gain) state.
6. Turn on WCDMA Tx waveform.
7. Adjust TX_AGC_ADJ PDM for each of the 32 (start at index = 2) Tx power levels (Dynamic
Range/32)
8. Extrapolate for the 2 lowest power points and 2 highest power points, index = 0, 1, ... 35, 36
9. At each power level (i) store TX_AGC_ADJ PDM in item
NV_WCDMA_TX_LIN_MASTER0[i]
NOTE Index zero (0) is the lowest Tx power.
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7. CALIBRATION
B. TX HDET Calibration
- Purpose
This item is for building a lookup table, which indexes Tx power estimation via a scaled TX_GAIN_CTL
(representing the desired Tx power), to associated HDET circuit values at reference temperature and the reference frequency.
- NV Items
There are three NV items stored in non-volatile (NV) memory as following
1. NV_WCDMA_EXP_HDET_VS_AGC_I
2. NV_WCDMA_HDET_OFF_I
3. NV_WCDMA_HDET_SPN_I
C. TX Freq. Comp. Calibration
- Purpose
This item contains the change in Tx power of 15 channels relative to a reference channel, for the lowest PA gain state. These values should be considered as 8-bit signed values, stored in 1/12 dB resolution.
- Procedure Proposal
1. Set phone in WCDMA mode.
2. Set phone to a reference channel.
3. Set the spectrum analyzer to that of the reference channel’s frequency.
4. Turn on PA.
5. Set PA to low (or high) gain state.
6. Turn on WCDMA Tx waveform.
7. Adjust TX_AGC_ADJ PDM to reach desired Tx reference power level and store it in a variable called Tx_Reference_Power.
8. Step through all 15 frequencies and read Tx power. Remember to change the spectrum analyzer’s frequencies accordingly.
9. Store NV_WCDMA_TX_COMP_VS_FREQ_0[i] = (Tx Power(i) - Tx_Reference_Power)
(1024/Dynamic Range)
D. TX Freq. Limit Calibration
- Purpose
The NV item NV_CDMA_TX_LIM_VS_FREQ contains a table of 16 adjustment values for the Tx power limit, based on frequency. The Tx power limit is heavily based on the feedback from the HDET circuit. Because the ADC readings of the HDET circuit may have some frequency dependencies, this
NV item can be used to compensate for such dependencies.
- Procedure Proposal
1. Adjust the TX_AGC_ADJ PDM and write a value to the PDM causing the phone to produce a large output power, near or at the power level where limiting should occur.
2. Keep the PDM value constant. At reference frequency, measure the output power at the antenna (in units of dBm). Let’s call this power level PowerRef. Also measure the HDET reading from the appropriate ADC. Let’s call this reading HdetRef.
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7. CALIBRATION
3. Store the NV item such that: NV_CDMA_TX_LIM_VS_FREQ[i] = 12*(PowerRef - Power[i])
Note that the first index will correspond to the lowest frequency.
E. RX Linearity Calibration
- Purpose
This item contains the DVGA gain value that makes the RSSI of the DVGA equal to the corresponding power levels at the antenna port, at ambient temperature, and reference frequency. This value is represented by a 10-bit signed two’s complement number in 1/12 dB units. Once calibrated, our DVGA gain value will have an ideal mapping of min RSSI to -512 and max RSSI to 511 (see Figure 7-3).
Figure 7-3. DVGA gain value
- Procedure Proposal
1. Set phone in WCDMA mode.
2. Set phone to a reference channel (a reference channel usually is in the middle of the band).
3. Set signal generator frequency to a reference channel plus an offset of 685 kHz.
4. Set to highest LNA gain state.
5. Set LNA offset 1,2 and 3 to zero.
6. Set input power to recommended value of -80 dBm, let’s call this value ‘rxInput’
7. Set VGA gain offset to 0.
8. Read RSSI.
9. vgaGainOffset = { RSSI - [-512 - (RxLinMinPwr - rxInput) * (1024/dynamicRange) ] }
10. Set VGA gain offset to vgaGainOffset
11. Read RSSI again and we should see a value of approximately -200.
NV_WCDMA_VGA_GAIN_OFFSET = vgaGainOffset
NOTE Assuming a dynamic range of 85.3 dB, RxLinMinPwr = -106 dBm, we have -200 = -512 - -(-106 -
(-80) ) * (1024/85.3).
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7. CALIBRATION
F. RX Freq. Calibraion
- Purpose
This item contains 15 VGA gain offset values relative to a reference frequency. These values are represented by an 8-bit signed number. The values are the change between the reference frequency
VGA gain offset value and the VGA gain offset value at the frequency of interest. These values, once calibrated, ensure that the RSSI will align with received frequency.
- Procedure Proposal
1. Complete all the steps in previous section
2. Change the phone’s channel and the signal generator frequency to match that of the phone’s channel + 685 kHz and read RSSI
If channel = reference channel, make
NV_WCDMA_VGA_GAIN_OFFSET_VS_FREQ[refChannelIndex] value = 0 Else
NV_WCDMA_VGA_GAIN_OFFSET_VS_FREQ[ChannelIndex] = RSSI[ChannelIndex] - theoretical
RSSI (i.e -200 for our case, refer to previous section to see how -200 was obtained)
NOTE Reference frequency will have a 0 value at index 7, assuming counting from 0. This will be applied to every frequency compensated NV item in this document.
Recommended channels for calibration are:
Channel_index_0 = 9609, Channel_index_1 = 9628, Channel_index_2 = 9646,
Channel_index_3 = 9664, Channel_index_4 = 9685, Channel_index_5 = 9703,
Channel_index_6 = 9720, Channel_index_7 = 9739 (reference channel)
NOTE Reference channel is changeable, but ensure that its value is always on the 8th index for any frequency compensated NV item.
G. RX LNA Calibration
- Purpose
This item contains the gain step for LNA state low (mid or high) gain to mid (or high) gain.
This value is represented by a 16-bit signed 2’s complement number in 1/12 dB unit.
- Procedure Proposal
1. Set WCDMA RX input power at a reference frequency to a value equal to
NV_WCDMA_LNA_RANGE_RISE_[i] value.
2. Set phone mode to WCDMA.
3. Set to the reference channel.
4. Call the FTM Command Get LNA Offset with index [i].
5. Store the return value as NV_WCDMA_LNA_RANGE_OFFSET_[i].
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7. CALIBRATION
H. RX LNA Freq. Calibration
- Purpose
This item contains 15 adjustment values relative to the reference frequency for the
NV_WCDMA_LNA_RANGE_OFFSET item. These NV values should be considered as adjustments for gain variation of the LNA gain step based on the frequency index. These values are represented by an 8-bit signed number. The values are the change between the reference frequency LNA gain-step and the LNA gain-step at the frequency index of interest.
- Procedure Proposal
1. Set phone in WCDMA mode.
2. Set LNA offset 1 to zero.
3. Set phone to a reference channel (a reference channel usually is in the middle of the band).
4. Set signal generator frequency to a reference channel plus an offset of 685 kHz.
5. Set Rx Power at phone antenna connector to the mid-point of LNA_RISE_1 and LNA_FALL _1
((LNA_RISE_1 + LNA_FALL_1)/2).
a. Load calibrated and frequency compensated DVGA for index [i] b. Set LNA in state 0.
c. Read and store RSSI in (A[i]) d. Set LNA in state 1.
e. Read and store RSSI in (B[i]) f. Store NV_WCDMA_LNA_OFFSET_VS_FREQ[i] = (A[i]-B[i]) -
NV_WCDMA_LNA_RANGE_OFFSET
6. Repeat steps a. through f. for all 15 frequencies and set reference frequency to a value of 0
Reference documents
QUALCOMM, MSM6200 WCDMA RF NV Items (80-V5216-3 Rev. C)
QUALCOMM, MSM6200 GSM RF NV Items (80-V5216-2 Rev. A)
QUALCOMM, MSM6250¢‚ RF NV Items (80-V4690-25 Rev. C)
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7. CALIBRATION
7.4 Program Operation
7.4.1 Pegasus Program Overview
When you try to calibrate the U8290 mobile phone, you should make a configuration of calibration environment as shown in Figure 7-1. And if you finish making configuration, please execute the
Pegasus program. Running the Pegasus program, you should show Pegasus program window like shown in Figure 7-4.
When Pegasus program would be executed, it checks the connection of instruments and initializes them automatically.
Pegasus supports three functions.
- Calibration of EGSM 900, DCS 1800, PCS1900, and WCDMA band
- Agilent8960 control
- UART communication with U8290 mobile phone
Debug
Screen
Figure 7-4. Pegasus Window
7.4.2 Pegasus Function Description
Pegasus window is classified into 9 functional sections: Serial Port Setup, Phone Mode, Phone Select,
RF Setup, GPIB Setup, Cable Loss, Calibration Type, Calibration Items, and MISC Set. NOTE Most of functions are not recommended to operate directly .
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7. CALIBRATION
A. Serial Port Setup
- Function
As shown in Figure 7-5, Serial Port Setup section supports setting the connection between PC and U8290.
Figure 7-5. Serial Port Setup
- Procedure Proposal
1. First you have to setup your hardware: connect interface cable to one of the serial communication ports
(so COM1, COM2, COM3, or COM4) of your PC.
2. Setup the port number of PC.
3. Setup the baud-rate of 115200 bps (recommended value).
4. Click the ‘Connect’ button.
B. Phone Mode
- Function
As shown in Figure 7-6, Phone Mode Setup section supports the switching Advanced Mode Subscriber
Software (AMSS) mode and Factory Test Mode (FTM) mode. FTM is a mode of operation that allows a user to perform diagnostic or design verification functionality by exposing functions not discretely available to the user in AMSS mode. FTM does not provide the ability to make phone calls and is not driven by the
Advanced Mode Subscriber Software Call Processing State Machine.
Figure 7-6. Phone Mode Setup
- Procedure Proposal
1. Make sure the phone’s connection to PC.
2. To run calibration process, you should switch the phone mode of FTM mode. To switch FTM mode, click the ‘FTM’ button. When the switching is done, the massage, “Set Phone FTM Status = SUCCESS!” on debug screen blow and “FTM MODE” on status box near ‘Read’ button is displayed. If the mode switching is fail, the message, “Set Phone FTM Status = FAIL!” is displayed on debug screen.
3. To make phone calls, you should switch the phone mode of AMSS mode. To switch AMSS mode, click the ‘AMSS’ button. When the switching is done, the massage, “Set Phone AMSS Status = SUCCESS!” on debug screen blow and “AMSS MODE” on status box near ‘Read’ button is displayed. If the mode switching is fail, the message, “Set Phone AMSS Status = FAIL!” is displayed on debug screen.
4. To know phone’s mode, click the ‘Read’ button. The status box displays phone’s mode. When disconnected phone and PC, the status box displays “UNKOWN MODE”.
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C. Phone Select
7. CALIBRATION
- Function
As shown in Figure 7-7, Phone Select Setup section supports selecting phone’s model to calibrate.
- Procedure Proposal
1. Select phone’s model (default: U8290) to calibrate phone.
Figure 7-7. Phone Select Setup
2. To backup calibrated NV items, type in your phone’s serial number on ‘NUM’ box. Typed number would be the file name of backup data (NUM_[time].xls).
D. RF Setup
- Function
As shown in Figure 7-8, Phone Select Setup section supports switching RF mode of phone.
- Procedure Proposal
1. Setup RF mode (band): WCDMA_IMT (default), WCDMA_1900A, WCDMA_1900B, GSM900, DCS1800, or PCS1900.
Figure 7-8. RF Setup
2. Setup uplink channel. Downlink channel would be automatically changed.
3. Check the checkbox, ‘Test set Connect’.
E. GPIB Setup
- Function
As shown in Figure 7-9, General Purpose Interface Bus (GPIB) Setup section supports switching phone’s
GPIB address. GPIB provides a standard interface for communication between instruments from different sources.
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7. CALIBRATION
Figure 7-9. GPIB Setup
- Procedure Proposal
1. Turn on the test set (Agilent 8960). If it is already on, we recommend you reset the test set by pressing the blue ‘SHIFT’ key and then the green ‘Preset’ key.
2. Press the ‘SYSTEM CONFIG’ key.
3. Read GPIB address on SYSTEM CONFIG SCREEN of test set.
4. Switch GPIB address that you read (Address 7 is recommended for Pegasus).
Note You can also set test set’s GPIB address by pressing ‘Instrument Setup’ (F1) key.
F. Cable Loss
- Function
As shown in Figure 7-10, Cable Loss Setup section supports selecting test RF cable loss between phone and test set (Agilent 8960).
Figure 7-10. Cable Loss
- Procedure Proposal
1. Select cable loss of each band.
2. Using recommended RF cable(Hirose co., 30cm), the recommended values are shown in Figure 7-10
(WCDMA: -0.6, GSM: -0.4, DCS: -0.6, and PCS: -0.6).
G. Calibration Type
- Function
As shown in Figure 7-11, Calibration Type Setup section supports selecting calibration band.
Figure 7-11. Calibration Type
- Procedure Proposal
1. Check the radio button to calibrate band.
Note To calibrate U8290, check ‘WCDMA+GSM’ is recommended.
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7. CALIBRATION
H. Calibration Items
- Function
As shown in Figure 7-12, Calibration Items Setup section supports running calibration process for single NV item.
Figure 7-12. Calibration Type
- Procedure Proposal
1. Click wanted single calibration NV item on Calibration Items section.
I. MISC Set
- Function
As shown in Figure 7-13, MISC Set section supports calibration data backup and manual setting of specified
NV items related to temperature.
Figure 7-13. MISC Set
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7. CALIBRATION
- Procedure Proposal
1. Click ‘Read’ button to save calibration data. Saved data file is stored in ‘CalData’ folder.
2. Temperature or battery power (depends on ADC’s channel) may be converted into specified values and displayed in ‘ADC’ box.
3. If you click ‘Load’ button, Pegasus loads initialized NV constant values related with temperature. It is not recommend to click this button without H/W engineer’s approval.
7.4.3 Calibration Procedure
Calibration procedure of Pegasus was the same as below procedure.
1. Setup instruments and U8290 mobile phone as depicted in Figure 7-1.
2. Turn on all instruments and U8290 mobile phone.
3. Setup Com ‘Port’ and ‘Baudrate’. Then, click ‘Connect’ button to setup serial port connection from
PC to U8290 in Serial Port Set section.
4. Setup ‘Phone Model’ as U8290 in Phone Select section
5. Setup ‘GPIB’ address and click ‘GPIB connect’ button in GPIB Setup section.
6. Setup ‘Cable Loss’. Recommended values: WCDMA -0.6, GSM -0.4, DCS -0.6, and PCS - 0.6 in
Cable Loss section.
7. Check ‘WCDMA+GSM’ radio button in Calibration Type section.
8. Click ‘Calibration Run’ button as shown in Figure 7-14. If you would follow 1 to 7 steps, you may not setup configuration step ( 1 to 7) next time, NOTE Most of functions (buttons) are not recommended to operate (clicked) directly .
Figure 7-14. Calibration Run button
7.4.4 Calibration Result Message
If the calibration is over without error, “PASS” message window would appear like depicted Figure 8-
15 (a). On the contrary, if the calibration is over with some error, “FAIL” message window will appear like depicted Figure 7-15 (b).
Additionally, in all of the cases, it is possible to check the calibration result with Debug Screen.
- 192 -
7. CALIBRATION
Figure 7-15. (a) Calibration PASS Message Window and
(b) Calibration FAIL Message Window
7.4.5 Pegasus Configuration File Format
A. “CalInit.cfg” file
The initial values of Pegasus can be set by changing configuration file (CalInit.cfg). Therefore, the configuration file should be located with Pegasus in the same folder. The configuration file includes items related to Pegasus’s internal variables such as default channel, default cable loss, temperature offset values and etc. The configuration file format is shown below. For example, in case of changing initial cable loss of
WCDMA band from -0.6 to -0.8, you just changing ‘m_strWCableLoss’ values as -0.8. The character ‘W’ in
‘m_strWCableLoss’ means WCDMA. Similarly, the character ‘G’ means GSM, the character ‘D’ means
DCS, and the character ‘P’ means PCS.
Figure 7-16. Pegasus Configuration “CalInit.cfg” file format
- 193 -
7. CALIBRATION
B. “dacTable.cfg” file
The format of “dacTable.cfg” file is shown below. The values of this file make the characteristic of “Power vs
Time” shape for GSM(ESGM/DCS/PCS) Modes to let the ETSI standard specification passed. Therefore it is not recommend to change this values without H/W engineer’s approval.
Figure 7-16. Pegasus Configuration “dacTable.cfg” file format
- 194 -
8. CIRCUIT DIAGRAM
27p
< USB 48M CLK >
C142
FA-238
48MHz
27p C141
X100
USB_XTAL_IN
USB_XTAL_OUT
SDRAM_ADDR(0:14)
SDRAM_DATA(0:31)
EBI2_DATA(0:15)
SUB_LCD_CS_N
MAIN_LCD_CS_N
NAND_CLE
NAND_CS_N
EBI2_OE_N
EBI2_WE_N
NAND_ALE
NAND_READY
EBI2_DATA(15)
EBI2_DATA(14)
EBI2_DATA(13)
EBI2_DATA(12)
EBI2_DATA(11)
EBI2_DATA(10)
EBI2_DATA(9)
EBI2_DATA(8)
EBI2_DATA(7)
EBI2_DATA(6)
EBI2_DATA(5)
EBI2_DATA(4)
EBI2_DATA(3)
EBI2_DATA(2)
EBI2_DATA(1)
EBI2_DATA(0)
SDRAM_DATA(31)
SDRAM_DATA(30)
SDRAM_DATA(29)
SDRAM_DATA(28)
SDRAM_DATA(27)
SDRAM_DATA(26)
SDRAM_DATA(25)
SDRAM_DATA(24)
SDRAM_DATA(23)
SDRAM_DATA(22)
SDRAM_DATA(21)
SDRAM_DATA(20)
SDRAM_DATA(19)
SDRAM_DATA(18)
SDRAM_DATA(17)
SDRAM_DATA(16)
SDRAM_DATA(15)
SDRAM_DATA(14)
SDRAM_DATA(13)
SDRAM_DATA(12)
SDRAM_DATA(11)
SDRAM_DATA(10)
SDRAM_DATA(9)
SDRAM_DATA(8)
SDRAM_DATA(7)
SDRAM_DATA(6)
SDRAM_DATA(5)
SDRAM_DATA(4)
SDRAM_DATA(3)
SDRAM_DATA(2)
SDRAM_DATA(1)
SDRAM_DATA(0)
LCD_ADS
H4
G2
J6
J8
H6
G4
E1
F4
J1
K6
J2
J4
H1
U6
L6
L8
K4
R8
T2
T1
R6
R4
T8
T6
T4
W4
V6
Y2
Y1
W2
W1
V4
SDRAM1_D[31]
SDRAM1_D[30]
SDRAM1_D[29]
SDRAM1_D[28]
SDRAM1_D[27]
SDRAM1_D[26]
SDRAM1_D[25]
SDRAM1_D[24]
SDRAM1_D[23]
SDRAM1_D[22]
SDRAM1_D[21]
SDRAM1_D[20]
SDRAM1_D[19]
SDRAM1_D[18]
SDRAM1_D[17]
SDRAM1_D[16]
SDRAM1_D[15]
SDRAM1_D[14]
SDRAM1_D[13]
SDRAM1_D[12]
SDRAM1_D[11]
SDRAM1_D[10]
SDRAM1_D[9]
SDRAM1_D[8]
SDRAM1_D[7]
SDRAM1_D[6]
SDRAM1_D[5]
SDRAM1_D[4]
SDRAM1_D[3]
SDRAM1_D[2]
SDRAM1_D[1]
SDRAM1_D[0]
AA14
AF14
XMEM2_CS_N[1]
LCD2_CS_N_GPIO[38]
AE4
W14
AF7
AF4
AC5
AE16
NAND2_CLE_UB2_N
NAND2_CS_N_XMEM2_CS_N[0]
OE2_N_NAND2_RE_N
WE2_N
LB2_N_NAND2_ALE_A2[0]
NAND2_FLASH_READY_GPIO[33]
W9
AA8
AC7
AF5
AC6
AE5
AA7
AF3
AD1
AB4
AC9
AF8
AE8
AC8
AE7
AA9
EBI2_DATA[15]
EBI2_DATA[14]
EBI2_DATA[13]
EBI2_DATA[12]
EBI2_DATA[11]
EBI2_DATA[10]
EBI2_DATA[9]
EBI2_DATA[8]
EBI2_DATA[7]
EBI2_DATA[6]
EBI2_DATA[5]
EBI2_DATA[4]
EBI2_DATA[3]
EBI2_DATA[2]
EBI2_DATA[1]
EBI2_DATA[0]
AA15
AC13
AF13
AE13
AA13
W13
T13
AC12
AA12
AF11
AE11
W12
AC11
AA11
W11
AC10
AF9
AA10
AE9
W10
EBI2_ADD[20]_GPIO[34]
EBI2_ADD[19]
EBI2_ADD[18]
EBI2_ADD[17]
EBI2_ADD[16]
EBI2_ADD[15]
EBI2_ADD[14]
EBI2_ADD[13]
EBI2_ADD[12]
EBI2_ADD[11]
EBI2_ADD[10]
EBI2_ADD[9]
EBI2_ADD[8]
EBI2_ADD[7]
EBI2_ADD[6]
EBI2_ADD[5]
EBI2_ADD[4]
EBI2_ADD[3]
EBI2_ADD[2]
EBI2_ADD[1]
PM_SBDT PM_SBST
U100-1
MSM6250_A
39p
C621
FB502 FB503
39p
C622
Near to MSM
MICFBP
MICINN
MICOUTP
C108 0.1u
470K
R100
MICOUTN
C107 0.1u
MICINP
MICFBN
C100 0.1u
C101 0.015u
180K
R101
C106 0.015u
C105 0.1u
180K
R104
SBCK1_GPIO[0]
SBDT1_GPIO[1]
PA_ON[1]_GPIO[2]
ANT_SEL3_N_GPIO[12]
GP_MN_GPIO[13]
GPS_TCXO_GPIO[28]
USB_RX_DATA_GPIO[29]
XMEM2_CS_N[2]_GPIO[35]
XMEM2_CS_N[3]_GPIO[36]
LCD2_EN_GPIO[37]
ETM_PIPESTAT1B_GPIO[43]
ETM_TRACESYNC_GPIO[65]
BACKLIGHT_ETM_TRACECLK_GPIO[66]
XMEM1_CS_N[1]_GPIO[76]
SDRAM1_CS_N[1]_XMEM1_CS_N[3]_GPIO[77]
UART3_RFR_N_GPIO[87]
UART2_DP_RX_DATA_USIM_PWR_EN_GPIO[89]
GP_PDM[0]_GPIO[92]
SBST1_GPIO[93]
H25
G26
A19
D5
H21
A5
AB1
Y6
L25
C1
F19
H18
N23
AC15
AF16
T14
H9
D18
F8
TX_AGC_ADJ
TRK_LO_ADJ
TCXO_EN_GPIO[94]
PA_ON[0]
L14
H14
F18
B19
Q_OUT_N
Q_OUT
I_OUT_N
I_OUT
A13
B13
A14
B14
Q_IM_CH1(Reserved)
Q_IP_CH1(Reserved)
I_IM_CH1(Reserved)
I_IP_CH1(Reserved)
Q_IM_CH0
Q_IP_CH0
I_IM_CH0
I_IP_CH0
U21
U23
V25
W26
Y25
Y26
V21
W21
LCD_MAKER_ID
IrDA_EN
LCD_RESET_N
MMC_CD
EAR_SENSE*
IrDA_SD
HF_N
LCD_IF_MODE
LCD_BACK_EN
LOUD_SPK_EN
TCXO_EN
TX_QM
TX_QP
TX_IM
TX_IP
5.62K
R106
5.62K
R107
RX_QM
RX_QP
RX_IM
RX_IP
PA_RANGE[1]_GP_PDM[2]
PA_RANGE[0]_GP_PDM[1]
A20
H17
TRST_N
TCK
TMS
TDI
TDO
RTCK
H15
D16
F15
D15
F16
H16
GRFC[14]_GPIO[83]
GRFC[13]_GPIO[82]
GRFC[12]_GPIO[81]
GRFC[11]_GPIO[80]
GRFC[10]_TX_ON
J25
K23
J26
K19
H12
ANT_SEL2_N_GPIO[11]
ANT_SEL1_N_GPIO[10]
ANT_SEL0_N_GPIO[9]
TX_VCO_0_EN_N_GPIO[8]
TX_VCO_1_EN_N_GPIO[7]
UHF_BAND_SEL_GPIO[6]
GSM_PA_BAND_GPIO[5]
GSM_PA_EN_GPIO[4]
UHF_VCO_0_EN_GPIO[3]
B4
T23
R19
D11
H10
F10
D9
A8
B8
BT_CLK_GPIO[25]
BT_SBST_GPIO[24]
BT_SBCK_GPIO[23]
BT_SBDT_GPIO[22]
BT_TX_RN_N_GPIO[21]
BT_DATA_GPIO[20]
G23
F23
E26
E25
G21
D26
M_CAM_EN
FOLDER_DETECT
RF_ON_TX_ON
ANT_SEL2
ANT_SEL1
ANT_SEL0
BT_CLK
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
1K R115
2K R113
PA_ON
JTAG_TRST_N
JTAG_TCK
JTAG_TMS
JTAG_TDI
JTAG_TDO
JTAG_RTCK
C148
0.01u
C143
0.033u
GSM_PA_BAND
GSM_PA_EN
UHF_VCO_EN
PA_R0
ON_SW_N_MSM
TX_AGC_ADJ
TRK_LO_ADJ
VREG_RFTX_2.85V
VREG_MSMP_2.6V
GSM_TX_VCO_0_EN_N
GSM_TX_VCO_1_EN_N
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
A1
A2
A25
A26
B1
B2
B3
B24
B25
B26
C2
C25
D4
D23
F6
F21
H8
H19
K10
L11
L12
L16
L15
M11
M12
M13
M14
M15
M16
N12
N13
N14
N15
P12
P13
2012
U100-2
MSM6250_B
DAC_REF
AC4
AC23
AD2
AD25
AE1
AE2
AE3
AE17
AE21
AE24
AE25
AE26
AF1
AF2
AF25
AF26
P14
P15
R11
R12
R13
R14
R15
R16
T11
T12
T15
T16
U25
W8
W19
AA6
AA21
AA25
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC MODE_1
WDOG_EN
VREG_MSMP_2.6V
2012
- 195 -
8. CIRCUIT DIAGRAM
ANT200
1p
C283
R221
2.2nH
L229
10nH
G2
ANT
G1
RF200
RF
KMS-507
C279 33p
VREG_RFTX_2.85V
ANT_SEL0
ANT_SEL2
ANT_SEL1
Q507
UMC4N
R224
0 C285
100p
R223
0 C277
100p
R222
0 C281
100p
VREG_RFRX_0_2.85V
C286
0.1u
C284
27p
10
VDD
9
8
5
VC1
VC2
VCG
U207
GSM900_RX
GSM1800_RX
GSM1900_RX
1
2
3
WCDMA
4
GSM18001900_TX
GSM900_TX
12
13
SFAY0004601
C638
NA
47p
C292
22p
C293
C280
NA
C299
68p
15
11
19
GSM 900 TX
GSM 900 RX/WCDMA
DCS1800/PCS1900 TX
DCS 1800 RX
PCS 1900 RX
ANT_SEL2
LOW
LOW
HIGH
LOW
HIGH
ANT_SEL1 ANT_SEL0
LOW HIGH
LOW
HIGH
HIGH
LOW
LOW
LOW
LOW
LOW
GSM_PA_BAND
LOW
HIGH
MODE
GSM
DCS/PCS
C295
0.01u
C296
100u
C289
NFM21PC105B1A3
2
OUT IN
1
4
G2 G1
3
C305
0.01u
C297
100u
DCS_PCS_OUT
GSM_OUT
U209
DCS_PCS_IN
3
GSM_IN
4
RSVD_GND
SKY77328 ENABLE
BS
18
1
+VPWR
100
R225
R227 100
C298
15p
C304
15p
GSM_PA_EN
GSM_PA_BAND
GSM900
DCS1800/PCS1900
OFF
TX_VCO_EN_0_N
HIGH
LOW
HIGH
TX_VCO_EN_1_N
LOW
HIGH
HIGH
L220 7.5nH
DAC_REF
C226 8p
L222
12nH
TX_IM
FL203
2
G1
1
IN
G2
3
O1
O2
5 4
L210
8.2nH
B7846
1930-1990 MHz
L223
12nH
C241
1000p
C256
47p
TX_IP
TX_QM
L221 7.5nH
C262
47p
TX_QP
C224
C227
R233
200
R234
24
R228
R229
15
R236
150
270
R235
220
R232
51
9p
6p
VREG_RFTX_2.85V
C253
33p
C264
0.1u
R215
10
VREG_RFTX_2.85V
L214 7.5nH
L209
8.2nH
L211
22nH
R230
1.8K
FL201
B7837
2
G1
3
O1
1
IN
G2 O2
5 4
925-960 MHz
B7844
1
FL202
2
IN
G1
G2
3
O1
O2
5 4
1805-1880 MHz
L212
L213
L215 7.5nH
15nH
15nH
8
12
13
14
MQW5V0C869M
10
VC
1
5
OUT_GSM
OUT_DCSPCS
GND5
GND6
GND7
GND8
GND1
GND2
GND3
GND4
U210
VB
3
SW1
SW2
9
11
6
7
2
4
L216
22nH
L218
33nH
L217
22nH
C232
1000p
L219
33nH
C233
1000p
FB201
R240 100
RX_VCO_IN
R237 100
R239
C316
82
120p
C310
1000p
R231
3.3K
C306
10n
ECHU1C103JX5
(PPS)
C301
820p
C308
27p
C313
(PPS)
22n
ECHU1C223JX5
C302
0.01u
C300
100p
R210
C237
33p
11K (1%)
29
30
31
32
33
34
35
36
37
38
39
40
41
42
C307
82p
CP_HOLD2
CP2
VDDA9
RX_VCO_IN
R_BIAS
GSM1800_INN
GSM1800_INP
VDDA10
GSM900_INP
GSM900_INN
VDDA11
TX_MOD_CP
VDDA12
TX_VCO_FB
R238
47
VREG_RFTX_2.85V
GSM_TX_VCO_0_EN_N
GSM_TX_VCO_1_EN_N
VREG_MSMP_TCXO
R211
51 C244
0.01u
C246
1000p
VREG_RFTX_2.85V
C257
4.7u
C240
0.1u
C238
100p
RF_ON_TX_ON
C247
100p
RTR6250
U205
C248
33p
C252
4700p
R213
1K
RX_IN
RX_IP
RX_QN
RX_QP
VDDA4
VCO_TUNE
VTUNE_REF
VDDA3
TCXO
VDDA2
VDDA1
FAQ1
CP1
CP_HOLD1
6
5
8
7
4
3
2
1
14
13
12
11
10
9
C258
33p
R216
TX_AGC_ADJ
R217
10
C268 33p
C261
0.01u
C263
100p
RX_IM
RX_IP
RX_QM
RX_QP
3.3K
C269
0.1u
R218
6.2K
C273
3.9n
(PPS)
C260
100p
C270
4.7u
C267
390p
C271
0.1u
C272
4.7u
C266
0.1u
VREG_SYNTH_2.85V
VREG_RFTX_2.85V
VREG_RFTX_2.85V
GSM/DCS/PCS
WCDMA
DMF1950IHC
RX
GND
U202
TX
SMPY0008201
U204
11
RF_OUT RF_IN
3
L504
NA
27p C642
L503
NA
Q200
C259
10u
+VPWR
C282
4.7u
SI3493DV
TX_AGC_ADJ
R212
270
C251
0.01u
0
R214
PA_FET_N
+VPWR
C245
0.01u
C250
0.01u
VREG_PA
Q505
UMC4N
PA_ON
C202 12p L201 2.2nH
L200
C200
1p
C645
0.5p
8.2nH
C231
R209
10K
100p
C205 100p
R201
5.62K
(1%)
C203
100p
HDET
A1
B1
U203 LMV225TLX
A2
RFIN_EN VDD
B2
GND OUT
U201
RFL6200
1
2
3
4
GND1
DNC
UMTS_BIAS
UMTS_IN
GND4
UMTS_OUT
SBDT
VDDM
12
11
10
9
PA_ON
VREG_RFTX_2.85V
VREG_RFTX_2.85V
HDET1
C236
1500p
C234
27p
L208
47nH
VREG_RFRX_0_2.85V
C217
100p
C218
0.1u
C219
4.7u
R203
22
C211 1p
L206
10nH
L205
SBDT
4.7nH
C210 12p
1
FL200
2
G1
3
O1
IN
G2 O2
B7728
5 4
C209
0.1u
100
R200
C207
4.7u
VREG_MSMP_TCXO
L203
10nH
C213 0.1u
C215 1p
L202
3.9nH
L204
3.9nH
L207
47nH
C208
100p
7
8
9
10
5
6
3
4
1
2
GND1
DNC1
GND2
VDDA1
GND3
UMTS_INP
GND4
UMTS_INM
GND5
DNC2
U200
RFR6200
RX_IM
VDDA7
TCXO
VDDA6
SBDT
SBCK
SBST
VDDM
GND8
DNC4
24
23
22
21
27
26
25
30
29
28
C221
100p
G2
FL204
EFCH1950TDC1
G3
3
4
OUT IN
1
G1
5 2
UHF_VCO_EN
11K
(1%)
R220
C255
6p
C220
12p
R205
5.1
C223
100p
C222
0.1u
RX_VCO_IN
MQL302A1G71
1
OUT
U208
VCC
7
3
SWITCH CON
5
8
6
GND4
GND3
GND1
GND2
2
4
RX_QP
RX_QM
RX_IP
RX_IM
C290
33p
C294
0.01u
FB200
C288
4.7u
VREG_SYNTH_2.85V
SBDT
SBCK
SBST
C201
100p
C204
0.1u
C212
100p
R202
C216
0.1u
51
VREG_MSMP_TCXO
VREG_RFRX_0_2.85V
C265
1000p
C206
1000p
C276
1000p
C274
0.1u
4
VCC
19.2MHz
GND
2
OUT VCONT
3
TG-5001LA-19.2MHz
U206
1
VREG_TCXO_2.85V
R219
100
C275
0.01u
TRK_LO_ADJ
C287 100p
TCXO_PM
TCXO_BT_IN
VREG_RFTX_2.85V
R206
80.6K
(1%) RT200
68K_2012_10%
R207
470K
(1%)
C225
0.068u
PA_THERM
- 196 -
8. CIRCUIT DIAGRAM
VREG_MSMP_2.6V
C649
1u
M_CAM_EN
SPK+
SPK-
RCV+
RCV-
SUB_LCD_CS_N
MAIN_LCD_CS_N
LCD_IF_MODE
KBYD_BACKLIGHT
ON_SW_KEY*
LCD_BACK_EN
LCD_RESET_N
MOT_PWR-
LCD_ADS
EBI2_OE_N
EBI2_WE_N
LCD_MAKER_ID
VREG_5V
FLASH_ON
VREG_LCD_3.0V
VREG_MSMP_2.6V
+VPWR
+VPWR
JTAG_PS_HOLD
R651
0
VREG_CAM_2.6V
VREG_MSMP_2.6V
1
2
3
U606
VIN
GND
_SD
SI91841DT-18-T1
VOUT
5
BP
4
C643
0.01u
C650
4.7u
VREG_CAM_1.8V
B TO B CONNECTOR
64
42
41
40
39
38
37
36
35
34
33
32
31
54
53
52
51
50
49
48
47
46
45
44
43
62
60
59
58
57
56
55
11
12
13
14
9
10
7
8
15
16
17
18
1
2
3
4
5
6
CN300
61
23
24
25
26
19
20
21
22
27
28
29
30
63
24-5087-060-007-829
EBI2_DATA(15)
EBI2_DATA(14)
EBI2_DATA(13)
EBI2_DATA(12)
EBI2_DATA(11)
EBI2_DATA(10)
EBI2_DATA(9)
EBI2_DATA(8)
EBI2_DATA(7)
EBI2_DATA(6)
EBI2_DATA(5)
EBI2_DATA(4)
EBI2_DATA(3)
EBI2_DATA(2)
EBI2_DATA(1)
EBI2_DATA(0)
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_ROW(4)
KEY_COL(0)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
KEY_COL(5)
1
2
3
U607
VIN
GND
EN
VOUT
BYP
5
4
MIC5205-3.0BM5
C656
470p
C655
4.7u
VREG_LCD_3.0V
USB_VBUS
HF_MODE
HF_N
B
C
E
Q506
DTC114EE
VREG_CAM_2.6V
HH-1M1608-121JT
FB300
C317
10u
C320
0.01u
I2C_SDA
CAM_DATA(7)
CAM_DATA(6)
CAM_HSYNC
CAM_RESET_N
I2C_SCL
VBATT_SENSE
C624
0.068u
AUXON_HF
AUXOP_HF
AUXIN_HF
AUXIP_HF
HF_MODE
+5V_PWR
VREG_MSMP_2.6V
R610 NA
R628
NA
VREG_MSMP_2.6V
RESIN_N
JTAG_TRST_N
JTAG_PS_HOLD
JTAG_TDI
7
5
3
1
2
C611
OUT IN
1
4
G2 G1
3
NFM21PC105B1A3
AR300 0
8
6
4
2
JTAG_TCK
JTAG_TMS
JTAG_TDO
JTAG_RTCK
UART_RXD
UART_TXD
USB_D+
UART_DCD_N
UART_RI
UART_RFR_N
UART_CTS_N
UART_DTR
R613 470K
VBATT
R303
R304
470
470
7
5
3
1
AR301 0
8
6
4
2
R305
R306
R307
470
470
470
R308
R309
470
0
CAM
CONNECTOR
FB305
HB-1M1005-601JT
20
19
18
17
G2
24
23
22
21
16
15
14
13
G4
CN301
G1
1
4
5
2
3
6
7
8
9
10
G3
11
12
C659
10p
C658
39p
1
CN303
AXK7L24227J
HB-1M1005-600JT
FB303
CAM_DATA(3)
CAM_DATA(0)
CAM_DATA(2)
CAM_DATA(1)
CAM_VSYNC
CAM_DATA(5)
CAM_DATA(4)
R605
0
C646
47p
HB-1M1005-600JT
FB301
CAM_PCLK
C318
NA
VREG_CAM_1.8V
CAM_DSP_CLK
ON_SW_PM*
USB_D-
I/O CONNECTOR
ENEY0004102
29
CN302
25
5
6
3
4
1
2
7
8
9
10
11
12
17
18
19
20
21
22
23
24
13
14
15
16
BATT_ID
HF_MODE
DSR
PWR_+5V_1
PWR_+5V_2
ON_SW1
PCM_RXA_IN
PCM_CLK
PCM_SYNC
USB_RX
PCM_TXA_OUT
PWR_GND_1
RXD
TXD
USB_TX
USB_PWR
DCD
RI_TMS
PWR_GND_2
RFR_RTS
PWR_+4.2V_1
PWR_+4.2V_2
CTS
DTR
26 27
28
VBAT_GND_1
VBAT_GND_2
VBATT_LEVEL
R633
470K
C647
0.068u
- 197 -
8. CIRCUIT DIAGRAM
VREG_MSMP_2.6V
Tx_IrDA
UART_TXM
IrDA_EN
UART_TXD
BLUETOOTH
VREG_MSMP_TCXO
VREG_BT_2.85V
L507
1.5nH
2.2u
1608
1u
U406
16
ANT
13
NC
2
3
LDO1
LDO2
SBST
SBCK
SBDT
SYNC_DET_TX_EN
RX_BB_TX_BB
XTAL_IN
CLK_REF
4
9
5
8
6
10
11
C406 1000p
RB06A
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
TCXO_BT
BT_CLK
VREG_MSMP_TCXO
IrDA_SD
RX_IrDA
TX_IrDA
R404
4.7
IRDA
7
U405
RPM840-H11
GND
6
VCC
5
SD
4
3
RXD
SHIELD
TXD
8
2
TX-RC
1
LEDA
U603
NLAS4684MR2
1
V+ NO2
10
2
NO1
3
COM1
4
IN1
5
NC1
COM2
9
IN2
8
NC2
7
GND
6
Rx_IrDA
UART_RXM
IrDA_EN
UART_RXD
VREG_MSMP_2.6V
CAM_SENSOR
R403
62
VDD
TR400
A3212ELH
GND
OUT
CAM_SENSE
C405
0.1u
C403
10p
VREG_USIM_2.85V
USIM_P_RST_N
USIM_P_CLK
USIM
U407
3
4
11
12
1
2
P1
P2
P3
P4
GND3
GND4
P5
P6
P7
P8
GND1
GND2
5
6
7
8
9
10
KPD9D-8S-2.54SF
R611
15K
VREG_MSMP_2.6V
FOLDER DETECT
R616
U604
A3212ELH
VDD
62
GND
OUT
R405
51
USIM_P_DATA
FOLDER_DETECT
C612
0.1u
C639
10p
USIM_P_DATA
VREG_USIM_2.85V
5
4
6
U408
1
2
3
RCLAMP0504F
USIM_P_CLK
USIM_P_RST_N
USB_D-
USB_VBUS
5
4
U404
6 1
2
3
RCLAMP0504F
USB_D+
VREG_MSMA_2.6V
MICBIAS
C400
1u
MIC
U400
1
VIN
2
GND
3
_SD
SI91841DT-18-T1
VOUT
5
BP
4
C402
0.01u
1u
C625
MIC1
1
2
OBG-415S42-C1033
UCLAMP0505A
4 3
5
6
2
U401
1
C619
39p
C618
39p
22n C401
22n C404
MIC1P
MIC1N
MICBIAS_LDO_1.8V
EAR JACK
MICBIAS_LDO_1.8V
VREG_MSMP_2.6V
MIC2P
MIC2N
HEADPHONE_L
HEADPHONE_R
EAR_SENSE*
MULTI_ADC
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_COL(6)
10K R625
22n C102
33u
C115
22n
C626
0 R624
33u C627
C654
39p
VA8
C653
39p
AVLC14S02050
D503
To prevent from
TDMA noise.
R640 600
R641 600
10
11
12
7
8
9
5
6
13
15
CN304
1
2
3
4
14
16
D599
- 198 -
8. CIRCUIT DIAGRAM
VREG_MSMP_TCXO
R509
68K
(1%)
C541
0.068u
VBATT_TEMP
C534
33u
+VPWR
USB_VBUS
+5V_PWR
1u
C514
1005
C513
0.1u
ICHARGE
CHG_CNT_N
ICHARGEOUT
VBATT
BATT_FET_N
FLASH_ON
RESIN_N
VREG_5V
D520
RB551V-30TE-17
R570
NA
+VPWR
C518
RB551V-30TE-17
D501
1u
USB_OE_N
USB_DAT
USB_D+
USB_SE0
USB_D-
VBATT_TEMP
R505 47K
C523
1608
4.7u
C519
1608
4.7u
KBYD_BACKLIGHT
ON_SW_PM*
MOT_PWR-
USIM_P_DATA
VREG_PA
Change to SI2312BDS-T1
SI2312DS-T1-E3
Q511
11
12
13
14
15
9
10
7
8
16
17
18
19
20
21
3
4
5
6
1
2
ADC_BYP
VCHG
ISNS_P
CHG_CTL_N
ISNS_M
VBAT
BAT_FET_N
FLSH_DRV_N
PON_RESET_N
VREG_USB
USB_ID
VREG_5V
USB_OE_N
VSW_5V
USB_CTL_N
USB_VBUS
USB_DAT
USB_D_P
USB_SE0
USB_D_M
GP1_DRV_N(MPP7)
4.7uH
L505
C538
4.7u
C644
0.1u
PA_FET_N
VREG_BT_2.85V
TCXO_BT_IN
C503
1000p
C542
1000p
R500
100K
2
U500
VCC
5
4
3
GND
TC7S04FU
TCXO_BT
U501
PM6650
HEADPHONE_R
HEADPHONE_L
R648
1K
R649
1K
C651
0.015u
C652
0.015u
C633
0.01u
C634
0.01u
R623
80.6K
R622
80.6K
C648
22n
R644
39K
LOUD_SPK_EN
D1
U605
IN-
C1
IN+
A1
_SD
TPA2005D1ZQYR
VDD1
B4
VDD2
NC
C4
B1
VO-
A4
VO+
D4
+VPWR
SPK-
SPK+
C632
10u
C2
C1
4
2
Q500
3
E
B
1
2SB1424
CHG_CNT_N
+5V_PWR
ICHARGE
REF_BYP
REF_GND
REF_ISET
VCOIN
MSM_INT_N
TCXO_IN
PS_HOLD
VREG_MSMA
TCXO_EN
VDD_ANA
TCXO_OUT
VDD_MSM
SBST
VREG_MSMP
SBCK
VBACKUP
SBDT
XTAL_OUT
SLEEP_CLK
XTAL_IN
RUIM_RST(MPP6)
49
48
47
46
45
44
43
57
56
55
54
53
52
51
50
63
62
61
60
59
58
51
0.1u
120K
R504
C517
R501
PM_INT_N
TCXO_PM
TCXO_EN
+VPWR
BUFF_TCXO
+VPWR
PM_SBST
1u C500
BAT500
ML414RH-F9CE
RB551V-30TE-17
D504
4.7u
C520 smd_1608h_9_r
TP500
PM_SBCK
X500
PM_SBDT
4
3
SLEEP_CLK
1 2
TP502
USIM_P_RST_N
C525
24p
C524
27p
MC-146_12.5pF
32.768KHz
Load=12.5p
JTAG_PS_HOLD
PS_HOLD
VREG_MSMA_2.6V
VREG_MSMP_2.6V
+VPWR
USIM_RST_N
USIM_P_CLK
USIM_CLK
USIM_DATA
VREG_USIM_2.85V
VREG_BT_2.85V
C536
2.2u
C535
2.2u
ON_SW_N_MSM
Q502
ICHARGEOUT
+VPWR
VBATT
SI3493DV
BATT_FET_N
+VPWR
D510
RB551V-30TE-17
R550
10K
RB551V-30TE-17
D500
ON_SW_PM*
ON_SW_KEY*
TCXO_EN
VREG_MSMP_2.6V
Q504
UMC4N
VREG_MSMP_TCXO
- 199 -
8. CIRCUIT DIAGRAM
SDRAM_DATA(0:31)
EBI2_DATA(0:7)
SDRAM_DATA(0)
SDRAM_DATA(1)
SDRAM_DATA(2)
SDRAM_DATA(3)
SDRAM_DATA(4)
SDRAM_DATA(5)
SDRAM_DATA(6)
SDRAM_DATA(7)
SDRAM_DATA(8)
SDRAM_DATA(9)
SDRAM_DATA(10)
SDRAM_DATA(11)
SDRAM_DATA(12)
SDRAM_DATA(13)
SDRAM_DATA(14)
SDRAM_DATA(15)
SDRAM_DATA(16)
SDRAM_DATA(17)
SDRAM_DATA(18)
SDRAM_DATA(19)
SDRAM_DATA(20)
SDRAM_DATA(21)
SDRAM_DATA(22)
SDRAM_DATA(23)
SDRAM_DATA(24)
SDRAM_DATA(25)
SDRAM_DATA(26)
SDRAM_DATA(27)
SDRAM_DATA(28)
SDRAM_DATA(29)
SDRAM_DATA(30)
SDRAM_DATA(31)
SDRAM_DQM(0)
SDRAM_DQM(1)
SDRAM_DQM(2)
SDRAM_DQM(3)
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
M11
M13
L10
L12
J9
H12
H10
G12
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
A1
A2
A3
A4
A11
A12
A13
A14
B1
B2
B3
B4
B11
B12
B13
B14
C1
C2
C5
C13
C14
D1
D14
E1
E7
E8
E9
E10
E11
NC21
NC22
NC23
NC24
NC25
NC26
NC27
NC28
NC29
NC13
NC14
NC15
NC16
NC17
NC18
NC19
NC20
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC11
NC12
U4
T6
V6
U7
T9
T10
T4
T5
V5
U5
V10
T11
U11
V11
T12
U12
P3
R3
P4
R4
P5
R5
P6
R6
P9
P10
R10
P11
R11
P12
R12
R13
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
U8
T8
V7
U9
DQM0
DQM1
DQM2
DQM3
MEMORY
U601
TY90009C00SOGG
_WPN
_WEN
_RAS
_WED
_CAS
CLK
_CS0
_CS1
ALE
CLE
_CEN
_REN
R__BN
CKE
BA0
BA1
C8
E5
D7
M3
M4
L6
K6
D5
D6
E6
M9
M10
M2
D8
C4
D4
VCCD1
VCCD2
VCCD3
VCCD4
VCCD5
VCCD6
C7
D2
D13
V3
V8
V12
C3
D3
E3
E2
D12
C12
D11
C11
D10
C10
E4
D9
C9
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
VCCQD1
VCCQD2
V4
V9
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VCCN1
VCCN2
J12
K12
C6
F7
G2
G13
L13
P2
P13
R8
U2
U6
U10
U13
L1
L2
L3
L4
L5
L9
L11
L14
M5
M6
M12
N2
K4
K5
K9
K10
K11
K13
K14
NC79
NC80
NC81
NC82
NC83
NC84
NC85
NC86
NC87
NC88
NC89
NC71
NC72
NC73
NC74
NC75
NC76
NC77
NC78
SDRAM_ADDR(0)
SDRAM_ADDR(1)
SDRAM_ADDR(2)
SDRAM_ADDR(3)
SDRAM_ADDR(4)
SDRAM_ADDR(5)
SDRAM_ADDR(6)
SDRAM_ADDR(7)
SDRAM_ADDR(8)
SDRAM_ADDR(9)
SDRAM_ADDR(10)
SDRAM_ADDR(11)
SDRAM_ADDR(12)
RESOUT_N
EBI2_WE_N
SDRAM_RAS_N
SDRAM_WE_N
SDRAM_CAS_N
SDRAM_CLK
SDRAM_CS_N(0)
NAND_ALE
NAND_CLE
EBI2_OE_N
SDRAM_CLK_EN
SDRAM_ADDR(13)
SDRAM_ADDR(14)
SDRAM_ADDR(0:12)
VREG_MSMP_2.6V
NAND_CS_N
NAND_READY
VREG_MSME_1.8V
VREG_MSMP_TCXO
MMC_CD
T-Flash Socket
(In case of V31, R and C is DNI)
MMC_DATA
S600
GND
SCHA1A0100
DAT2_RSV
CD_DAT3_CS
CMD_DI
VDD
CLK_SCLK
VSS
DAT0_DO
DAT1_RSV
GND
1
2
3
U600
6
5
4
RCLAMP0504F
MMC_CMD
VREG_T-FLASH_3.0V
MMC_CLK
VREG_T-FLASH_3.0V
C600
0.1u
R617
390K
MMC_CD
MMC_CMD
MMC_CLK
MMC_DATA
VBATT
ON_SW_PM*
USB_VBUS
USB_D-
USB_D+
UART1
2.5G
3G
9
10
11
12
7
8
5
6
3
4
1
2
GND
RxD
TxD
VBAT
RPW
_WR
TDO_0
TCK
TMS
TDO_1
TDI
JT_EN
GND
RxD
TxD
VBAT
ONS
UFL
PWR
URxD
UTxD
OJ600 OJ602
OJ603 OJ601
- 200 -
8. CIRCUIT DIAGRAM
+VPWR
VREG_MSMP_2.6V
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_COL(0)
KEY_ROW(4)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
KEY_ROW(3)
KEY_ROW(2)
KEY_ROW(1)
KEY_ROW(0)
KEY_COL(2)
KEY_COL(1)
KEY_COL(0)
KEY_ROW(4)
KEY_COL(5)
KEY_COL(4)
KEY_ROW(3)
LD1
LEBB-S14H
LD2
LEBB-S14H
LD3
LEBB-S14H
LD4
LEBB-S14H
LD13
LEBB-S14H
LD11
LEBB-S14H
LD5
LEBB-S14H
LD6
LEBB-S14H
LD7
LEBB-S14H
LD14
LEBB-S14H
LD12
LEBB-S14H
LD8
LEBB-S14H
LD9
LEBB-S14H
LD10
LEBB-S14H
LD15
LEBB-S14H
LD16
LEBB-S14H
LD17
LEBB-S14H
R4
10K
RA1
10K
VA15 AVNC18S05Q050
3
4
1
2
P1
P2
P3
P4
P8
P7
P6
P5
8
7
6
5
VA12 AVNC18S05Q050
1
2
3
4
P1
P2
P3
P4
P8
P7
P6
P5
8
7
6
5
VA13 AVNC18S05Q050
3
4
1
2
P1
P2
P3
P4
P8
P7
P6
P5
8
7
6
5
1
1
7
7
4
4
HOT4
HOT4
8
8
0
0
5
5
2
2
VM_LED1
VM_LED2
VM_LED3
VM_LED4
3
3
9
9
6
6
HOT5
HOT5
+VPWR
SPK+
SPK-
KYBD_BACKLIGHT
OK
OK
SND
SND
DN
DN
CLR
CLR
LEFT
LEFT
MENU
MENU
UP
UP
RIGHT
RIGHT
SEARCH
SEARCH
BACK
BACK
SPK+
SPK-
RCV+
RCV-
MAIN_LCD_CS_N
SUB_LCD_CS_N
LCD_IF_MODE
KYBD_BACKLIGHT
ON_SW*
LCD_BACK_EN
LCD_RESET_N
MOT_PWR-
LCD_ADS
EBI2_OE_N
EBI2_WE_N
LCD_MAKER_ID
VREG_5V
FLASH_ON
VREG_LCD_3.0V
VREG_MSMP_2.6V
+VPWR
6
5
4
D1
1
2
3
UCLAMP0505A
RCV+
RCV-
ON_SW*
+VPWR
VREG_LED
C5
4.7u
C6
4.7u
14
13
10
7
U1
DIN1
DIN2
DIN3
DIN4
5
VIN
2
VOUT
1
12
17
PGND
GND
BGND
SM8132AB
C2P
4
C4 1u
C2M
3
C1P
15
C1 1u
C1M
16
NC1
NC2
6
9
ISET
EN
11
8
R2 20K
LCD_BACK_EN
END
END
OJ2
OJ4
OJ3
OJ1
FLASH_ON
VREG_LED
VREG_LCD_3.0V
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
VREG_5V
+VPWR
LCD_MAKER_ID
B TO B CONNECTOR
13
14
15
16
9
10
11
12
17
18
19
20
4
5
6
7
8
1
2
3
25
26
27
28
21
22
23
24
29
30
CN2
61
62
48
47
46
45
44
43
42
41
52
51
50
49
60
59
58
57
56
55
54
53
40
39
38
37
36
35
34
33
32
31
14-5087-060-020-829
VM_LED2
VM_LED3
VM_LED4
EBI2_DATA(15)
EBI2_DATA(14)
EBI2_DATA(13)
EBI2_DATA(12)
EBI2_DATA(11)
EBI2_DATA(10)
EBI2_DATA(9)
EBI2_DATA(8)
EBI2_DATA(7)
EBI2_DATA(6)
EBI2_DATA(5)
EBI2_DATA(4)
EBI2_DATA(3)
EBI2_DATA(2)
EBI2_DATA(1)
EBI2_DATA(0)
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_ROW(4)
KEY_COL(0)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
KEY_COL(5)
ZD1
INSTPAR
UCLAMP0501H
1
2
3
4
FL2 AVRC_14S_05Q_030_100R
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
INOUT_B1
9
8
INOUT_B2
7
INOUT_B3
6
INOUT_B4
3
4
1
2
FL1
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
AVRC_14S_05Q_030_100R
9
INOUT_B1
8
INOUT_B2
7
INOUT_B3
INOUT_B4
6
14
15
16
17
18
19
20
9
10
11
12
13
1
2
3
4
7
8
5
6
AXK740145J
31
30
29
28
27
26
25
24
23
22
21
40
39
38
37
36
35
34
33
32
CN1
KEY_ROW(2)
KEY_ROW(1)
KEY_ROW(0)
KEY_COL(5)
VA7
AVLC14S02050
VA4
AVLC14S02050
VA5
AVLC14S02050
ZD2 INSTPAR
UCLAMP0501H
2
3
CN3
1
4
FL6
3
4
1
INOUT_A1
2
INOUT_A2
INOUT_A3
INOUT_A4
AVRC_14S_05Q_030_100R
INOUT_B1
9
8
INOUT_B2
INOUT_B3
7
6
INOUT_B4
LCD_IF_MODE
LCD_RESET_N
MAIN_LCD_CS_N
LCD_ADS
FL5
1
2
3
INOUT_A3
4
INOUT_A1
INOUT_A2
INOUT_A4
AVRC_14S_05Q_030_100R
9
INOUT_B1
INOUT_B2
8
7
INOUT_B3
INOUT_B4
6
SUB_LCD_CS_N
EBI2_WE_N
FL3
1
INOUT_A1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
VM_LED1
AVRC_14S_05Q_030_100R
9
INOUT_B1
8
INOUT_B2
7
INOUT_B3
INOUT_B4
6
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
FL4
1
2
3
4
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
AVRC_14S_05Q_030_100R
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
9
8
7
6
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
SPK+
SPK-
RCV+
RCV-
MOT_PWR-
- 201 -
8. CIRCUIT DIAGRAM
VREG_LCD_3.0V
VREG_LED
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
LCD_MAKER_ID
VM_LED2
VREG_5V
VM_LED3
FLASH_ON
VM_LED4
+VPWR
AXK840145J
12
13
14
15
16
10
11
8
9
17
18
19
20
6
7
4
5
1
2
3
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
CN1
BOARD
LCD_IF_MODE
LCD_RESET_N
MAIN_LCD_CS_N
LCD_ADS
SUB_LCD_CS_N
EBI2_WE_N
VM_LED1
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
SPK+
SPK-
RCV+
RCV-
MOT_PWR-
VREG_LCD_3.0V
LCD_RESET_N
SUB_LCD_CS_N
LCD_IF_MODE
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
VM_LED4
VM_LED3
VM_LED2
VM_LED1
VREG_LED
VREG_5V
AXK8L44125J
G1
12
13
14
15
16
17
7
8
9
10
11
5
6
3
4
1
2
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
G2
CN2
LCD
SPK+
SPK-
RCV+
RCV-
+VPWR
MOT_PWR-
LCD_MAKER_ID
LCD_ADS
MAIN_LCD_CS_N
EBI2_WE_N
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
FLASH_ON
Connector Vision mark
TP1 TP2 TP3 TP4
- 202 -
9. PCB LAYOUT
- 203 -
9. PCB LAYOUT
- 204 -
9. PCB LAYOUT
- 205 -
9. PCB LAYOUT
- 206 -
9. PCB LAYOUT
- 207 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
10.1 EXPLODED VIEW
1
22
23
24
25
23
26
29
30
2
3
31
13
10
7
6
4
5
8
9
20
81
14
21
15
18
17
16
11
19
35
32
33
36
34
37
38
40
39
56
48
51
50
49
53
52
82
57
54
55
58
44
45
46
44
47
43
42
41
77
69
68
44
72
71
28
73
74
75
76
78
79
66
70
80
65
67
61
64
27
59
62
63
84
60
- 208 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
10.2 Replacement Parts
<Mechanic component>
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
3
2
3
Level
Location
No.
1
Description
IMT,FOLDER
2
3
AAAY00
MCJA
ADDITION
COVER,BATTERY
4
MLAC00
APEY00
LABEL,BARCODE
PHONE
ACGG00 COVER ASSY,FOLDER
ACGH00
COVER ASSY,
FOLDER(LOWER)
5 MBFF00 BRACKET,LCD
Part Number
TIFF0010601
AAAY0118401
MCJA0018001
Specification
MLAC0003001 LABEL,BARCODE(for IMEI 4piece)
APEY0230501
ACGG0056903
ACGH0031901
MBFF0005901
5
5
5
5
5
MBIB00 BUSHING,HINGE
MCJH00 COVER,FOLDER(LOWER)
MBIB0002601
MCJH0025401
MFBB00 FILTER,RECEIVER
MMAZ00 MAGNET
MPBG00 PAD,LCD
MFBB0010201
MMAZ0000101
MPBG0037601
D3*1.5t
5 MPBJ00 PAD,MOTOR MPBJ0023701
5 MPBN00 PAD,RECEIVER
5 MICC00 INSERT,FRONT(UPPER)
MPBM0008901
5
4
5
5
5
5
5
5
5
MTAD00 TAPE,WINDOW
ACGJ00
COVER ASSY,
FOLDER(UPPER)
MCJJ00 COVER,FOLDER(UPPER)
MDAE00 DECO,FOLDER(UPPER)
MDAE01 DECO,FOLDER(UPPER)
MDAJ00 DECO,HINGE
MDAJ01 DECO,HINGE
MDAN00 DECO,SPEAKER
MFBC00 FILTER,SPEAKER
MTAD0034801
ACGJ0043701
MCJJ0032401
MDAE0028701
MDAE0028801
MDAJ0007801
MDAJ0007901
MDAN0005401
MFBC0014701
MICC0008401
Silver Snow
Silver
Black
Silver
Silver
Silver
Without
Color
Without
Color
Without
Color
Without
Color
Without
Color
Without
Color
Silver Snow
Color
Silver Snow
Remark
Black
Black 79
Metal Silver
Silver Snow
Black
Silver Snow
Without
Color
Without
Color
Silver Snow
Without
Color
32
36
38
39
35
31
34
33
40
11
6
2
15
13
9
17
20
- 209 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
Level
5
5
5
5
5
5
Location
No.
Description
MICC01 INSERT,FRONT(UPPER)
MPBJ00 PAD,MOTOR
MPBN00 PAD,SPEAKER
MPBQ00 PAD,LCD(SUB)
MPBS00 PAD,FOLDER
MTAA00 TAPE,DECO
Part Number
MICC0008501
MPBJ0023601
MPBN0018201
MPBQ0021501
MPBS0003801
MTAA0075801
MTAA0075901
MTAA0076001
MTAA0076101
Specification
5 MTAA01 TAPE,DECO
5 MTAA02 TAPE,DECO
5 MTAA03 TAPE,DECO
5 MTAA04 TAPE,DECO
5 MTAE00 TAPE,WINDOW(SUB)
MTAA0076201
MTAE0021801
7
7
7
5
5
5
4
5
5
6
5
4
7
5
4
MWAH00 WINDOW,FLASH
ACGK00 COVER ASSY,FRONT
ABGC00 BUTTON ASSY,SIDE
MCJK00 COVER,FRONT
MWAH0000801
ACGK0050403
ABGC0008901
MCJK0045701
MICA00 INSERT,FRONT MICA0018001
MSGY01 STOPPER
ALAY00 LCD ASSY
SACY00 PCB ASSY,FLEXIBLE
SACE00 PCB ASSY,FLEXIBLE,SMT
ENBY00
CONNECTOR,BOARD TO
BOARD
ENBY01
CONNECTOR,BOARD TO
BOARD
ERHY00 RES,CHIP
SPCY00 PCB,FLEXIBLE
SVLM00 LCD MODULE
MSGY0010602
ALAY0010001
SACY0035301
SACE0031101
ENBY0013004
ENBY0030001
40 PIN,0.4 mm,ETC ,Au over Ni ,
44 PIN,0.4 mm,ETC , ,H=0.9
ERHY0000131 20K ohm,1/16W,F,1005,R/TP
SPCY0057901 POLYI ,0.5 mm,MULTI-5 ,Silver Coating
SVLM0011601
MAIN ,M:2.0"(176*220) S:1.04"(96*96)
,38.95*52.15*4.9(5.54) ,65k ,TFT ,TM ,M_HD66789R ,
S_ST7624 ,TFT + 65K CSTN
AWAZ00 WINDOW ASSY AWAZ0006301
Color
Without
Color
Without
Color
Without
Color
Without
Color
Silver
Without
Color
Without
Color
Without
Color
Without
Color
Without
Color
Without
Color
Without
Color
Silver Snow
Without
Color
Silver Snow
Without
Color
Silver
Aqua Silver
Remark
19
18
16
21
81
14
12
7
3
8
5
10
62
59
61
60
30
Without
Color
- 210 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
5
Description
BFAA00 FILM,INMOLD
5 MWAF00 WINDOW,LCD(SUB)
4 GMEY00 SCREW MACHINE,BIND
4 MCCH00 CAP,SCREW
4 MCCH01 CAP,SCREW
4 MCCZ00 CAP
4 MDAL00 DECO,WINDOW
Part Number
BFAA0028901 U8200
MWAF0026301
Specification
GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK
MCCH0048801
MCCH0048901
MCCZ0011501
MDAL0004701
4 MGAD01 GASKET,SHIELD FORM
4 MHFD00 HINGE,FOLDER
4
4
4
MIDA02 INSULATOR,LCD
MIDZ00 INSULATOR
MKAZ00 KEYPAD
4 MPBG00 PAD,LCD
MGAD0081501
MHFD0008801
MIDA0015301
MIDZ0051201
MKAZ0024701
MPBG0032001
4
4
MSAZ00
MTAA00
SHEET
TAPE,DECO
4 MTAB00 TAPE,PROTECTION
4 MTAB01 TAPE,PROTECTION
MSAZ0022301
MTAA0076501
MTAB0064801
MTAB0064901
4 MTAC00 TAPE,SHIELD
4 MTAC01 TAPE,SHIELD
MTAC0027101
MTAC0021901
4
4
4
MWAC00 WINDOW,LCD
SJMY00 VIBRATOR,MOTOR
MWAC0051001
SJMY0002602 3.0 V,80 mA,12*3.4 ,
SUVT00 TWO-WAY MODE SPEAKER SUVT0005601 8 ohm,32 ohm,89 dB,115 dB,17 mm,
3 ACGM00 COVER ASSY,REAR
4 GMEY00 SCREW MACHINE,BIND
ACGM0050201
GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK
Without
Color
Without
Color
Without
Color
Without
Color
Color
Unfixed
Color
Unfixed
Color
Aluminum
Silver
Remark
Without
Color
Without
Color
4
Color
Unfixed
Color
Unfixed
Without
Color
Color
Unfixed
Without
Color
Color
Unfixed
Without
Color
Blue Green
Color
Unfixed
Without
Color
Without
Color
45
46
24
43
23
37
27
63
22
25
42
1
47
26
29
41
Color
Unfixed
Without
Color
44
- 211 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
4
Description
MCCC00 CAP,EARPHONE JACK
Part Number
MCCC0023301
4 MCCG00 CAP,MULTIMEDIA CARD MCCG0002001
Specification
4 MCIA00 CONTACT,ANTENNA MCIA0014001
MCJN0034301 4 MCJN00 COVER,REAR
4
4
4
4
4
MICZ
MLAN00
MLEA00
MPBT00
MSDC00
INSERT
LABEL,QUALCOMM
LOCKER,BATTERY
PAD,CAMERA
SPRING,LOCKER
MICZ0014901
MLAN0000601 Black,95C
MLEA0022501
MPBT0016801
MSDC0008301
4
4
5
4
3
5
MTAZ00 TAPE
SNGF00 ANTENNA,GSM,FIXED
ACGN00 COVER ASSY,CAMERA
ACGP00
COVER ASSY,
CAMERA(FRONT)
MCJP00 COVER,CAMERA(FRONT)
MMAZ00 MAGNET
MTAZ0074301
SNGF0006901
3.0 ,-2.0 dBd,black_silver ,fixed,
GSM/DCS/PCS/WCDMA2100
ACGN0003501
ACGP0002201
MCJP0003801
MMAZ0002001
5 MTAA00 TAPE,DECO MTAA0076301
4
4
4
4
4
MBIC00 BUSHING,CAMERA(LEFT)
MBIZ00 BUSHING
MCCK00 CAP,CAMERA
MDAD00 DECO,CAMERA
MPBT00 PAD,CAMERA
MBIC0001201
MBIZ0002001
MCCK0002301
MDAD0011101
MPBT0014701
4
4
4
MPBT01 PAD,CAMERA
MSDZ00 SPRING
MWAE00 WINDOW,CAMERA
3
3
3
GMEY00 SCREW MACHINE,BIND
MCCF00 CAP,MOBILE SWITCH
MCCH00 CAP,SCREW
MPBT0018801
MSDZ0000801 0.15t
MWAE0007901
GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK
MCCF0023701
MCCH0049101
- 212 -
Color
Color
Unfixed
Color
Unfixed
Without
Color
Color
Unfixed
Color
Unfixed
Transparent
Without
Color
Black
Without
Color
Without
Color
Remark
69
70
72
67
28
74
68
73
80
71
Silver Snow
Silver Snow
Silver Snow
Without
Color
Without
Color
Without
Color
Silver Snow
Without
Color
Silver
Without
Color
Without
Color
Gold
Without
Color
Without
Color
Silver
Silver
48
50
57
58
55
51
53
82
56
49
76
77
10. EXPLODED VIEW & REPLACEMENT PART LIST
Level
3
Location
No.
Description
MCCH01 CAP,SCREW
3
3
5
MFEA00
MLAK00
ADCA00
FRAME,SHIELD
LABEL,MODEL
DOME ASSY,METAL
Part Number
MCCH0049201
MFEA0007001
MLAK0010701 G7200 (CE0889)
ADCA0039401
Specification Color
Silver
Without
Color
White
Without
Color
Remark
78
65
75
- 213 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
10.2 Replacement Parts
<Main component>
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
4
Location
No.
Description
SVCY02 CAMERA
3
4
SAEY00 PCB ASSY,KEYPAD
SAEB00
PCB ASSY,
KEYPAD,INSERT
5
4
5
6
SAKY00
SAEE00
PCB ASSY,SIDEKEY
PCB ASSY,KEYPAD,SMT
SAEC00
PCB ASSY,KEYPAD,SMT
BOTTOM
C1 CAP,CERAMIC,CHIP
6
6
C4
C5
C6
CN1
CN2
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CONNECTOR,BOARD TO
BOARD
CONNECTOR,BOARD TO
BOARD
6 D1 DIODE,TVS
FL5
FL6
R2
R4
FL1
FL2
FL3
FL4
FILTER,EMI/POWER
FILTER,EMI/POWER
FILTER,EMI/POWER
FILTER,EMI/POWER
FILTER,EMI/POWER
FILTER,EMI/POWER
RES,CHIP
RES,CHIP
RA1
U1
RES,ARRAY,R
IC
VA10 VARISTOR
VA11 VARISTOR
VA14 DIODE,TVS
VA4
VA5
VARISTOR
VARISTOR
Part Number
SAEY0040903
SAEB0011002
SAKY0005601
SAEE0011202
SAEC0009202
ECCH0004904
ENBY0016801
Specification
SVCY0005701 CMOS ,MEGA ,1.3M Omnivision Sensor
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
40 PIN,0.4 mm,STRAIGHT ,AU ,FEMALE
ENBY0004202 60 PIN,0.5 mm,STRAIGHT ,Au ,B to B CNT(Header)
EDTY0007601
SC-89 ,5 V,100 W,R/TP ,5 Channel Array , Vc 12V , 75pF ,
1.6*1.625*0.58
SFEY0009401 SMD ,100ohm,30pF(total capacitance), Pb-free
SFEY0009401 SMD ,100ohm,30pF(total capacitance), Pb-free
SFEY0009401 SMD ,100ohm,30pF(total capacitance), Pb-free
SFEY0009401 SMD ,100ohm,30pF(total capacitance), Pb-free
SFEY0009401 SMD ,100ohm,30pF(total capacitance), Pb-free
SFEY0009401 SMD ,100ohm,30pF(total capacitance), Pb-free
ERHY0000131 20K ohm,1/16W,F,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERNR0000403 10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP
EUSY0253801 QFN ,16 PIN,R/TP ,4X20mALED CHARGEPUMP
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0006301 18 V, ,SMD ,50pF, 2012, 4 ARRAY VARISTOR
EDTY0007301
SOD-523 ,5 V,240 W,R/TP ,SINGLE LINE TVS DIODE FOR
ESD
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
Color Remark
52
64
- 214 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
Level
6
Location
No.
VA7
Description
VARISTOR
6 VA8 VARISTOR
6 ZD1 DIODE,TVS
SAED00
PCB ASSY,KEYPAD,SMT
TOP
LD1
LD10
LD11
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
LD12
LD13
LD14
LD15
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
LD16
LD17
LD2
LD3
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
LD4
LD5
LD6
LD7
LD8
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
LD9
VA12
DIODE,LED,CHIP
VARISTOR
VA13 VARISTOR
VA15 VARISTOR
VA6
VA9
VARISTOR
VARISTOR
SPEY00 PCB,KEYPAD
SAFY00 PCB ASSY,MAIN
SAFB00 PCB ASSY,MAIN,INSERT
SAFF00 PCB ASSY,MAIN,SMT
MLAB00 LABEL,A/S
5
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
5
3
6
6
4
4
6
6
6
6
5
5 MLAC00 LABEL,BARCODE
Part Number Specification
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
EDTY0007301
SOD-523 ,5 V,240 W,R/TP ,SINGLE LINE TVS DIODE FOR
ESD
Color
SAED0009502
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED
SEVY0006301 18 V, ,SMD ,50pF, 2012, 4 ARRAY VARISTOR
SEVY0006301 18 V, ,SMD ,50pF, 2012, 4 ARRAY VARISTOR
SEVY0006301 18 V, ,SMD ,50pF, 2012, 4 ARRAY VARISTOR
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SPEY0036501 FR-4 ,0.5 mm,BuildUp4 ,U8290 KEYPAD PCB
SAFY0127602
SAFB0042502
SAFF0054101
MLAB0000601 HUMIDITY STICKER
MLAC0003301 EZ LOOKS(use for PCB ASSY MAIN(hardware))
Without
Color
Without
Color
Remark
66
- 215 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
5
Location
No.
Description
SAFC00
PCB ASSY,MAIN,SMT
BOTTOM
6
6
ANT400
C102
ANTENNA,MOBILE,FIXED
CAP,CERAMIC,CHIP
6
6
C115
C145
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C146
C147
C148
C149
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C150
C151
C152
C153
C277
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C279
C281
C283
C284
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C285
C286
C287
C288
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
C289
C290
C291
C292
C293
C294
C295
C296
C297
C298
C299
C300
FILTER,EMI/POWER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP,MAKER
CAP,TANTAL,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number
SAFC0057101
Specification
SNMF0015901 2.1 ,-3.2 dB,Chip_Bluetooth_Ceramic(9*2.5*2)
ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000102 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP
SFEY0006501 SMD ,3 TERMINAL EMI FILTER
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECTZ0004204 100 uF,6.3V ,M ,STD ,3216 ,R/TP
ECTZ0004204 100 uF,6.3V ,M ,STD ,3216 ,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000126 68 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
- 216 -
Color Remark
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C301
Description
CAP,CERAMIC,CHIP
6
6
C302
C303
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C304
C305
C306
C307
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,FILM,MPP
CAP,CERAMIC,CHIP
C309
C310
C311
C312
C313
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,FILM,MPP
C314
C315
C316
C317
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
C319
C320
C324
C325
CAP,TANTAL,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C326
C328
C329
C330
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C331
C332
C403
C405
C406
C407
C408
C409
C410
C411
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000142 820 pF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECFD0000103 10 nF,16V ,J ,NI ,SMD ,2012 mm,R/TP
ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECFD0000102 22000 pF,16V ,J ,NI ,SMD ,3216 mm,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP
ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP
ECTZ0005601 33 uF,6.3V ,M ,L_ESR ,ETC ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP
ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP
ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP
ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP
ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
Color Remark
- 217 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C412
Description
CAP,CERAMIC,CHIP
6
6
C413
C414
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C420
C504
C505
C506
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C507
C508
C509
C510
C511
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C512
C513
C514
C515
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C516
C517
C518
C519
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C520
C521
C522
C523
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C524
C525
C526
C527
C528
C529
C530
C532
C534
C535
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP,MAKER
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000116 24 pF,50V,J,NP0,TC,1005,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECTZ0005601 33 uF,6.3V ,M ,L_ESR ,ETC ,R/TP
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
- 218 -
Color Remark
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C536
Description
CAP,CERAMIC,CHIP
6
6
C537
C538
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C539
C541
C542
C611
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
FILTER,EMI/POWER
C613
C614
C615
C624
C626
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP,MAKER
C627
C631
C632
C633
CAP,TANTAL,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP,MAKER
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
SFEY0006501 SMD ,3 TERMINAL EMI FILTER
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP
ECTZ0005601 33 uF,6.3V ,M ,L_ESR ,ETC ,R/TP
ECTZ0005601 33 uF,6.3V ,M ,L_ESR ,ETC ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECTZ0001302 10 uF,6.3V ,M ,STD ,2012 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6
6
6
6
C634
C644
C646
C648
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C651
C652
C653
C654
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C657
C658
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C659 CAP,CERAMIC,CHIP
CN301
CONNECTOR,BOARD TO
BOARD
CN302 CONN,RECEPTACLE
CN303 CONNECTOR,ETC
CN304
CONN,JACK/PLUG,
EARPHONE
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0007701 1 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ENBY0020401
ENEY0004102
ENZY0013006
ENJE0003602
24 PIN,0.4 mm,ETC , ,H=0.9, Socket
24 PIN,24 ,3 ,MOULD+SHIELD
1 PIN,4.2 mm,ETC ,SN ,TERMINAL GROUND(4.2*1.6)
12 ,12 PIN,MMIC CONN.12P
6
6
D300
D501
DIODE,TVS
DIODE,SWITCHING
EDTY0006201
SOD-323 ,12 V,350 W,R/TP ,Single Line TVS Diode for
ESD
EDSY0010001 UMD2 ,30 V,2 A,R/TP ,SCHOTTKY BARRIER DIODE
Color Remark
- 219 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
D502
Description
DIODE,TVS
6 D503 DIODE,TVS
D504
D505
D520
D599
DIODE,SWITCHING
DIODE,SWITCHING
DIODE,SWITCHING
DIODE,TVS
FB200 FILTER,BEAD,CHIP
FB201 FILTER,BEAD,CHIP
FB300 FILTER,BEAD,CHIP
FB301 FILTER,BEAD,CHIP
FB303 FILTER,BEAD,CHIP
L501
L502
L505
L506
L507
L508
Q500
FB305 FILTER,BEAD,CHIP
L229
L402
INDUCTOR,CHIP
FILTER,BEAD,CHIP
L403
L500
FILTER,BEAD,CHIP
INDUCTOR,SMD,POWER
INDUCTOR,SMD,POWER
INDUCTOR,SMD,POWER
INDUCTOR,SMD,POWER
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
TR,BJT,PNP
Q502 TR,FET,P-CHANNEL
Q506
Q507
TR,BJT,NPN
TR,BJT,ARRAY
Q511 TR,FET,N-CHANNEL
R114 RES,CHIP
R115
R221
R222
R223
RES,CHIP
INDUCTOR,CHIP
RES,CHIP
RES,CHIP
R224 RES,CHIP
Part Number Specification
EDTY0001901 SOD-323 ,6 V,350 W,R/TP ,Junction capacitance:350 pF
EDTY0007601
SC-89 ,5 V,100 W,R/TP ,5 Channel Array , Vc 12V , 75pF ,
1.6*1.625*0.58
EDSY0010001 UMD2 ,30 V,2 A,R/TP ,SCHOTTKY BARRIER DIODE
EDSY0010001 UMD2 ,30 V,2 A,R/TP ,SCHOTTKY BARRIER DIODE
EDSY0010001 UMD2 ,30 V,2 A,R/TP ,SCHOTTKY BARRIER DIODE
EDTY0007601
SC-89 ,5 V,100 W,R/TP ,5 Channel Array , Vc 12V , 75pF ,
1.6*1.625*0.58
SFBH0000903 600 ohm,1005 ,
SFBH0000903 600 ohm,1005 ,
SFBH0001501 120 ohm,1608 ,
SFBH0000909 60 ohm,1005 ,
SFBH0000909 60 ohm,1005 ,
SFBH0000903 600 ohm,1005 ,
ELCH0001001 10 nH,J ,1005 ,R/TP ,Pb Free
SFBH0008901 30 ohm,2012 ,3000mA, BEAD for LARGE CURRENT
SFBH0008901 30 ohm,2012 ,3000mA, BEAD for LARGE CURRENT
ELCP0006702 4.7 uH,M ,3.2 * 2.6 * 1.0 ,R/TP ,
ELCP0006702 4.7 uH,M ,3.2 * 2.6 * 1.0 ,R/TP ,
ELCP0006702 4.7 uH,M ,3.2 * 2.6 * 1.0 ,R/TP ,
ELCP0006702 4.7 uH,M ,3.2 * 2.6 * 1.0 ,R/TP ,
ELCH0005013 4.7 nH,S ,1005 ,R/TP ,
ELCH0005011 1.5 nH,S ,1005 ,R/TP ,
ELCH0005011 1.5 nH,S ,1005 ,R/TP ,
EQBP0008701 SC-62 ,0.6 W,R/TP ,PNP TRANSISTOR
EQFP0004701
TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S)
MOSFET, Pb free
EQBN0003901 EM3,0.15W,R/TP
EQBA0000301 SC-88A,0.15W,R/TP,NPN/PNP DUAL
EQFN0007002
SOT-23 ,0.75 W,20 V,4.9 A,R/TP ,0.33 at Vgs=4.5V, Pb
Free
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000112 1K ohm,1/16W,F,1005,R/TP
ELCH0001427 2.2 nH,S ,1005 ,R/TP ,Pb Free
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
Color Remark
- 220 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R225
Description
RES,CHIP
6
6
R226
R227
RES,CHIP
RES,CHIP
R228
R229
R230
R231
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R232
R233
R234
R235
R236
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R237
R238
R239
R240
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R300
R302
R303
R304
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
R305
R306
R307
R308
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R309
R401
R403
R405
R501
R502
R503
R504
R505
R509
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
RES,CHIP
Part Number Specification
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHY0000263 15K ohm,1/16W,J,1005,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHY0000205 15 ohm,1/16W,J,1005,R/TP
ERHY0000228 270 ohm,1/16W,J,1005,R/TP
ERHY0000245 1.8K ohm,1/16W,J,1005,R/TP
ERHY0000250 3.3K ohm,1/16W,J,1005,R/TP
ERHY0000214 51 ohm,1/16W,J,1005,R/TP
ERHY0000225 200 ohm,1/16W,J,1005,R/TP
ERHY0008201 24 ohm,1/16W ,J ,1005 ,R/TP
ERHY0000226 220 ohm,1/16W,J,1005,R/TP
ERHY0000223 150 ohm,1/16W,J,1005,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHY0000213 47 ohm,1/16W,J,1005,R/TP
ERHY0000218 82 ohm,1/16W,J,1005,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHZ0000530 5.1 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000530 5.1 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0000233 470 ohm,1/16W,J,1005,R/TP
ERHY0000233 470 ohm,1/16W,J,1005,R/TP
ERHY0000233 470 ohm,1/16W,J,1005,R/TP
ERHY0000233 470 ohm,1/16W,J,1005,R/TP
ERHY0000233 470 ohm,1/16W,J,1005,R/TP
ERHY0000233 470 ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0008202 62 ohm,1/16W ,J ,1005 ,R/TP
ERHY0000214 51 ohm,1/16W,J,1005,R/TP
ERHY0000154 120K ohm,1/16W,F,1005,R/TP
ERHY0000125 10K ohm,1/16W,F,1005,R/TP
ERHZ0003901 .1 ohm,1/4W ,F ,2012 ,R/TP
ERHY0000214 51 ohm,1/16W,J,1005,R/TP
ERHY0000273 47K ohm,1/16W,J,1005,R/TP
ERHY0000149 68K ohm,1/16W,F,1005,R/TP
Color Remark
- 221 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R605
Description
RES,CHIP
6
6
R609
R611
RES,CHIP
RES,CHIP
R613
R614
R622
R623
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R624
R625
R626
R627
R636
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R640
R641
R644
R648
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
RES,CHIP
RES,CHIP
R649
R652
RES,CHIP
RES,CHIP
RF200 CONN,RF SWITCH
RT500 THERMISTOR
TR400 IC
6 U207 FILTER,SEPERATOR
6 U208 VCO
6
6
U209
U210
U404
U406
U407
U408
U501
U605
PAM
VCO
DIODE,TVS
MODULE,ETC
CONN,SOCKET
DIODE,TVS
IC
IC
Part Number Specification
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0000263 15K ohm,1/16W,J,1005,R/TP
ERHY0000169 470000 ohm,1/16W ,F ,1005 ,R/TP
ERHY0000199 680 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0000151 80.6K ohm,1/16W,F,1005,R/TP
ERHY0000151 80.6K ohm,1/16W,F,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP
ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP
ERHY0000241 1K ohm,1/16W,J,1005,R/TP
SFBH0000903 600 ohm,1005 ,
SFBH0000903 600 ohm,1005 ,
ERHY0000141 39K ohm,1/16W,F,1005,R/TP
ERHY0000112 1K ohm,1/16W,F,1005,R/TP
ERHY0000112 1K ohm,1/16W,F,1005,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ENWY0003001 STRAIGHT ,SMD ,0.6 dB,3.8X3.0X3.6T
SETY0000903 NTC ,68000 ohm,SMD ,+/- 10% / 2012 SIZE, Pb Free
EUSY0129501 SC-74A ,3 PIN,R/TP ,HALL-EFFECT SWITCH, Pb Free
SFAY0004601
, , dB, dB, dB, dB,ETC ,16 PIN / 4.2*3.5*1.4 / GSM-WCDMA
SP6T
EXSC0008301
1712 MHz, PPM,22 pF,SMD ,5.0*4.0*1.3 ,1688MHz ~
1736MHz, 8pin
SMPY0008301
35 dBm,53 %,0.0000025 A, dBc,50 dB,6.0*6.0*1.2 ,SMD
,FOR QUAD BAND GSM AND GPRS
EXSC0009201
MHz, PPM, pF,SMD ,5.5*4.8*1.5 ,824MHz ~ 915MHz,
1710MHz ~ 1910MHz, 14pin
Color
EDTY0007801 SC-70 ,5 V,150 W,R/TP ,LOW CAPACITANCE TVS ARRAY
SMZY0009501 Bluetooth RF Module, 5.0*4.0*1.1
ENSY0009901
8 PIN,ETC ,SMD ,2.54 mm,2.2T UIM CONNECTOR WITH
BRIDGE
EDTY0007801 SC-70 ,5 V,150 W,R/TP ,LOW CAPACITANCE TVS ARRAY
EUSY0203701 BCC ,84 PIN,R/TP ,POWER MANAGEMENT IC
EUSY0160001
MicroStar Junior ,15 PIN,R/TP ,1.1W Class-D Mono Audio
AMP
Remark
- 222 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
Level
6
Location
No.
VA1
Description
VARISTOR
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
5
6
VA2
VA3
VA4
VA5
VA6
VA7
VA8
X500
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
X-TAL
SAFD00 PCB ASSY,MAIN,SMT TOP
BAT500 BATTERY,CELL,LITHIUM
C100
C101
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C103
C104
C105
C106
C107
CAP,TANTAL,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C108
C109
C110
C111
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C112
C113
C114
C116
C117
C118
C119
C120
C121
C122
C123
C124
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Specification
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
SEVY0001001 14 V, ,SMD ,50pF, 1005
EXXY0004602
.032768 MHz,20 PPM,12.5 pF,65000 ohm,SMD
,6.9*1.4*1.3 ,
SAFD0055001
SBCL0001305 3 V,1 mAh,COIN ,SMT Temp.260 degree. PB-Free B/B
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP
ECTZ0001302
ECCH0000167
ECCH0000167
ECCH0000157
ECCH0000167
10 uF,6.3V ,M ,STD ,2012 ,R/TP
0.1 uF,6.3V,K,X5R,HD,1005,R/TP
0.1 uF,6.3V,K,X5R,HD,1005,R/TP
15 nF,16V,K,X7R,HD,1005,R/TP
0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
Color Remark
- 223 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C125
Description
CAP,CERAMIC,CHIP
6
6
C126
C127
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C128
C129
C130
C131
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C132
C133
C134
C135
C136
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C137
C138
C139
C140
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C141
C142
C143
C144
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP,MAKER
C200
C201
C202
C203
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C204
C205
C206
C207
C208
C209
C210
C211
C212
C213
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP
ECTZ0001302 10 uF,6.3V ,M ,STD ,2012 ,R/TP
ECCH0000102 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000111 12 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000111 12 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000102 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
- 224 -
Color Remark
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C214
Description
CAP,CERAMIC,CHIP
6
6
C215
C216
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C217
C218
C219
C220
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
C221
C222
C223
C224
C225
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C226
C227
C228
C229
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C231
C232
C233
C234
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C235
C236
C237
C238
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C239
C240
C241
C242
C244
C245
C246
C247
C248
C249
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000102 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP
ECCH0000111 12 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP
ECZH0002909 9 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000145 1.5 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000111 12 pF,50V,J,NP0,TC,1005,R/TP
Color Remark
- 225 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C250
Description
CAP,CERAMIC,CHIP
6
6
C251
C252
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C253
C255
C256
C257
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
C258
C259
C260
C261
C262
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C263
C264
C265
C266
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Specification
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000151 4.7 nF,25V,K,X7R,HD,1005,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECTZ0001302 10 uF,6.3V ,M ,STD ,2012 ,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
C267
C268
C269
C270
C271
C272
C273
C274
C275
C276
C282
C308
C400
C401
C402
C404
C500
C503
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,FILM,MPP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP
ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP
ECFD0000703 3900 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
- 226 -
Color Remark
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C600
Description
CAP,CERAMIC,CHIP
6
6
C601
C602
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C603
C604
C605
C606
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C607
C608
C609
C610
C612
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C618
C619
C621
C622
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
6
C625
C639
C642
C643
C645
C647
C649
C650
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C655 CAP,TANTAL,CHIP
C656 CAP,CERAMIC,CHIP
CN300
CONNECTOR,BOARD TO
BOARD
D500
D510
DIODE,SWITCHING
DIODE,SWITCHING
FB502 FILTER,BEAD,CHIP
FB503 FILTER,BEAD,CHIP
6
6
FL200
FL201
FILTER,SAW
FILTER,SAW
Part Number Specification
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP
ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP
ENBY0004302 60 PIN,0.5 mm,STRAIGHT ,Au ,B to B CNT(Socket)
EDSY0010001 UMD2 ,30 V,2 A,R/TP ,SCHOTTKY BARRIER DIODE
EDSY0010001 UMD2 ,30 V,2 A,R/TP ,SCHOTTKY BARRIER DIODE
SFBH0000903 600 ohm,1005 ,
SFBH0000903 600 ohm,1005 ,
SFSY0016901 2140 MHz,2.5*2.0*0.8 ,SMD ,WCDMA RX RF SAW FILTER
SFSY0021701 942.5 MHz,2.0*1.4*0.68 ,SMD ,5pin, Unbal-Bal, 50//150
Color Remark
- 227 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
L221
L222
L223
L224
L225
L226
L227
L228
L217
L218
L219
L220
L213
L214
L215
L216
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
FL202
Description
FILTER,SAW
FL203 FILTER,SAW 6
6 FL204 FILTER,SAW
L200
L201
L202
L203
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
L204
L205
L206
L207
L208
L209
L210
L211
L212
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
6
6
Q200
Q504
TR,FET,P-CHANNEL
TR,BJT,ARRAY
Part Number Specification
SFSY0021801 1842.5 MHz,2.0*1.4*0.68 ,SMD ,5pin, Unbal-Bal, 50//150
SFSY0025501 1960 MHz,2.0*1.4*0.68 ,SMD ,Balanced Output (150ohm)
SFSY0023001 1950 MHz,2.0*1.4*0.8 ,SMD ,5pin, Unbal-Unbal, 50//50
ELCH0001004 8.2 nH,J ,1005 ,R/TP ,Pb Free
ELCH0001427 2.2 nH,S ,1005 ,R/TP ,Pb Free
ELCH0005012 3.9 nH,S ,1005 ,R/TP ,
ELCH0001001 10 nH,J ,1005 ,R/TP ,Pb Free
ELCH0005012 3.9 nH,S ,1005 ,R/TP ,
ELCH0005013 4.7 nH,S ,1005 ,R/TP ,
ELCH0001001 10 nH,J ,1005 ,R/TP ,Pb Free
ELCH0005119 47 nH,J ,1005 ,R/TP ,
ELCH0005119 47 nH,J ,1005 ,R/TP ,
ELCH0001004 8.2 nH,J ,1005 ,R/TP ,Pb Free
ELCH0001004 8.2 nH,J ,1005 ,R/TP ,Pb Free
ELCH0005004 22 nH,J ,1005 ,R/TP ,
ELCH0005113 15 nH,J ,1005 ,R/TP ,
ELCH0005113 15 nH,J ,1005 ,R/TP ,
ELCH0009301 7.5 nH,S ,1005 ,R/TP ,COIL
ELCH0009301 7.5 nH,S ,1005 ,R/TP ,COIL
ELCH0005004 22 nH,J ,1005 ,R/TP ,
ELCH0005004 22 nH,J ,1005 ,R/TP ,
ELCH0005006 33 nH,J ,1005 ,R/TP ,
ELCH0005006 33 nH,J ,1005 ,R/TP ,
ELCH0009301 7.5 nH,S ,1005 ,R/TP ,COIL
ELCH0009301 7.5 nH,S ,1005 ,R/TP ,COIL
ELCH0005003 12 nH,J ,1005 ,R/TP ,
ELCH0005003 12 nH,J ,1005 ,R/TP ,
ELCH0010401 2.2 uH,M ,1005 ,R/TP ,
ELCH0010401 2.2 uH,M ,1005 ,R/TP ,
ELCH0005014 5.6 nH,S ,1005 ,R/TP ,
ELCH0010401 2.2 uH,M ,1005 ,R/TP ,
ELCH0010401 2.2 uH,M ,1005 ,R/TP ,
EQFP0004701
TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S)
MOSFET, Pb free
EQBA0000301 SC-88A,0.15W,R/TP,NPN/PNP DUAL
Color Remark
- 228 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
Q505
Description
TR,BJT,ARRAY
6
6
R100
R101
RES,CHIP
RES,CHIP
R102
R103
R104
R105
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R106
R107
R108
R109
R110
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R111
R112
R113
R200
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R201
R202
R203
R204
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R205
R206
R207
R208
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R209
R210
R211
R212
R213
R214
R215
R216
R217
R218
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
Part Number Specification
EQBA0000301 SC-88A,0.15W,R/TP,NPN/PNP DUAL
ERHY0000169 470000 ohm,1/16W ,F ,1005 ,R/TP
ERHY0000160 180K ohm,1/16W,F,1005,R/TP
ERHY0000125 10K ohm,1/16W,F,1005,R/TP
ERHY0000125 10K ohm,1/16W,F,1005,R/TP
ERHY0000160 180K ohm,1/16W,F,1005,R/TP
ERHY0000208 22 ohm,1/16W,J,1005,R/TP
ERHY0005902 5.62 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0005902 5.62 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000274 51K ohm,1/16W,J,1005,R/TP
ERHY0000246 2K ohm,1/16W,J,1005,R/TP
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHY0005902 5.62 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0000214 51 ohm,1/16W,J,1005,R/TP
ERHY0000208 22 ohm,1/16W,J,1005,R/TP
ERHY0000106 100 ohm,1/16W,F,1005,R/TP
ERHY0008204 5.1 ohm,1/16W ,J ,1005 ,R/TP
ERHY0000151 80.6K ohm,1/16W,F,1005,R/TP
ERHY0000169 470000 ohm,1/16W ,F ,1005 ,R/TP
ERHY0000182 1.8 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0011601 11 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0000214 51 ohm,1/16W,J,1005,R/TP
ERHY0000228 270 ohm,1/16W,J,1005,R/TP
ERHY0000241 1K ohm,1/16W,J,1005,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000203 10 ohm,1/16W,J,1005,R/TP
ERHY0000250 3.3K ohm,1/16W,J,1005,R/TP
ERHY0000203 10 ohm,1/16W,J,1005,R/TP
ERHY0000256 6.2K ohm,1/16W,J,1005,R/TP
Color Remark
- 229 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R219
Description
RES,CHIP
6
6
R220
R400
RES,CHIP
RES,CHIP
R402
R404
R500
R550
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R600
R601
R603
R604
R615
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R616
R617
R633
R637
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
R651
R653
R654
R655
RT200
S600
U100
U200
U201
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
THERMISTOR
CONN,SOCKET
IC
IC
IC
6 U202 DUPLEXER,IMT
6 U203 IC
U204
U205
U206
U400
U401
PAM
IC
VCTCXO
IC
DIODE,TVS
Part Number Specification
ERHY0000220 100 ohm,1/16W,J,1005,R/TP
ERHY0011601 11 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP
ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP
ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0000261 10K ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0008202 62 ohm,1/16W ,J ,1005 ,R/TP
ERHY0006102 390 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0000169 470000 ohm,1/16W ,F ,1005 ,R/TP
ERHY0000199 680 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0000201 0 ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
ERHY0000280 100K ohm,1/16W,J,1005,R/TP
SETY0000903 NTC ,68000 ohm,SMD ,+/- 10% / 2012 SIZE, Pb Free
ENSY0014101 8 PIN,ETC , ,1.1 mm,T-Flash Memory Socket
EUSY0202101 BALL CSP ,409 PIN,R/TP ,WCDMA/GSM/GPRS MODEM
EUSY0161001 BCCP ,40 PIN,R/TP ,WCDMA RF TO B/B RECEIVER IC
EUSY0160901 BCCP ,16 PIN,R/TP ,WCDMA LNA IC
SDMY0000802
1950 MHz,2140 MHz,1.2 dB,1.5 dB,60 dB,48 dB,5.5*5.1*1.66 ,SMD ,Dielectric Duplexer
EUSY0186101
4-Bump micro SMD ,4 PIN,R/TP ,RF POWER DETECTOR
FOR CDMA/WCDMA
SMPY0008201
28 dBm,42.0 %,0.07 A,-52.0 dBc,27.5 dB,4*4*1.5 ,SMD
,LOAD INSENSITIVE PAM FOR WCDMA (1850-1980M)
EUSY0203801
QFN ,56 PIN,R/TP ,GSM/WCDMA TRANSMITTER & GSM
RECEIVER
EXSK0005003 19.2 MHz,2 PPM,10 pF,SMD ,3.2*2.5*1.1 ,
EUSY0176902 SOT23-5 ,5 PIN,R/TP ,1.8V 150mA LDO
EDTY0007601
SC-89 ,5 V,100 W,R/TP ,5 Channel Array , Vc 12V , 75pF ,
1.6*1.625*0.58
Color Remark
- 230 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
Level
6
Location
No.
U500 IC
6 U600
Description
DIODE,TVS
6 U601 IC
6
6
6
5
6
6
3
U603 IC
U604 IC
U606
U607
X100
SPFY
IC
IC
X-TAL
PCB,MAIN
SUMY00 MICROPHONE
Part Number Specification
EUSY0084701 SSOP5-P-A ,6 PIN,R/TP ,Inverter, Pb Free
EDTY0007801 SC-70 ,5 V,150 W,R/TP ,LOW CAPACITANCE TVS ARRAY
EUSY0216702
TFBGA ,225 PIN,ETC ,512M(X8) NAND+512M(256*2/32
BITS IO) SDRAM / LEAD FREE
EUSY0119001
10 uMAX ,10 PIN,R/TP ,DUAL SPDT ANALOG SWITCH,
Pb Free
EUSY0129501 SC-74A ,3 PIN,R/TP ,HALL-EFFECT SWITCH, Pb Free
EUSY0176902 SOT23-5 ,5 PIN,R/TP ,1.8V 150mA LDO
EUSY0008901 SOT-23-5 ,5 PIN,R/TP ,REGULATOR, PBFREE
EXXY0015501 48 MHz,50 PPM,12 pF,40 ohm,SMD ,3.2*2.5*0.7 ,
SPFY0098601 FR-4 ,0.85 mm,STAGGERED-8 ,3-6BVH
SUMY0010701 UNIT ,42 dB,4*1.5 ,Spring type
Color Remark
- 231 -
10. EXPLODED VIEW & REPLACEMENT PART LIST
10.3 Accessory
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Level
3
3
3
3
3
Location
No.
Description
MHBY00 HANDSTRAP
SBPL00
SGDY00
BATTERY PACK,LI-ION
DATA CABLE
Part Number Specification
MHBY0002101 T5100 RUSSV Square Coupling, Cow Leather
SBPL0072221
3.7 V,1400 mAh,1 CELL,PRISMATIC ,U8130 BATTERY(Li-
Polymer) 1400mA(Typical)
SGDY0005601 DK-40G ,K8000 24PIN I/O + USB A TYPE
Color
Metal Silver
Remark
Silver
SGEY00 EAR PHONE/EAR MIKE SET SGEY0005504 U8200,8210 ,REMOCON E-MIC
SSAD00 ADAPTOR,AC-DC SSAD0007848 FREE ,50 Hz,4.6 V,0.8 A,CE ,3G
- 232 -
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