WAFER-CX700M 3.5" SBC Page i

Add to my manuals
207 Pages

advertisement

WAFER-CX700M 3.5" SBC Page i | Manualzz
WAFER-CX700M 3.5" SBC
Page i
WAFER-CX700M 3.5" SBC
Revision
Date
Version
Changes
February, 2008
1.00
Initial release
Page ii
WAFER-CX700M 3.5" SBC
Copyright
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.
Page iii
WAFER-CX700M 3.5" SBC
THIS PAGE IS INTENTIONALLY LEFT BLANK
Page iv
WAFER-CX700M 3.5" SBC
Manual Conventions
WARNING!
Warnings appear where overlooked details may cause damage to the equipment or result
in personal injury. Warnings should be taken seriously. Warnings are easy to recognize.
The word “warning” is written as “WARNING,” both capitalized and bold and is followed by
text. The text is the warning message. A warning message is shown below:
WARNING:
This is an example of a warning message. Failure to adhere to warning
messages may result in permanent damage to the WAFER-CX700M or
personal injury to the user. Please take warning messages seriously.
CAUTION!
Cautionary messages should also be heeded to help reduce the chance of losing data or
damaging the WAFER-CX700M. Cautions are easy to recognize. The word “caution” is
written as “CAUTION,” both capitalized and bold and is followed. The text is the cautionary
message. A caution message is shown below:
CAUTION:
This is an example of a caution message. Failure to adhere to cautions
messages may result in permanent damage to the WAFER-CX700M.
Please take caution messages seriously.
Page v
WAFER-CX700M 3.5" SBC
NOTE:
These messages inform the reader of essential but non-critical information. These
messages should be read carefully as any directions or instructions contained therein can
help avoid making mistakes. Notes are easy to recognize. The word “note” is written as
“NOTE,” both capitalized and bold and is followed by text. The text is the cautionary
message. A note message is shown below:
NOTE:
This is an example of a note message. Notes should always be read.
Notes contain critical information about the WAFER-CX700M. Please
take note messages seriously.
Page vi
WAFER-CX700M 3.5" SBC
Packing List
NOTE:
If any of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI reseller or
vendor you purchased the WAFER-CX700M from or contact an IEI
sales representative directly. To contact an IEI sales representative,
please send an email to [email protected].
The items listed below should all be included in the WAFER-CX700M package.
1 x WAFER-CX700M single board computer
1 x Mini jumper pack
1 x IDE flat cable 44-pin
2 x SATA cables
1 x SATA power cable
3 x RS-232 cable
1 x Keyboard/Mouse cable
2 x USB cable
1 x Audio cable
1 x Utility CD
1 x QIG (quick installation guide)
Images of the above items are shown in Chapter 3.
Page vii
WAFER-CX700M 3.5" SBC
THIS PAGE IS INTENTIONALLY LEFT BLANK
Page viii
WAFER-CX700M 3.5" SBC
Table of Contents
1
INTRODUCTION..................................................................................................... 1
1.1 INTRODUCTION .......................................................................................................... 2
1.2 BENEFITS ................................................................................................................... 2
1.3 FEATURES .................................................................................................................. 3
1.4 OVERVIEW ................................................................................................................. 4
1.5 PERIPHERAL CONNECTORS AND JUMPERS .................................................................. 5
1.6 TECHNICAL SPECIFICATIONS ...................................................................................... 6
2
DETAILED SPECIFICATIONS ............................................................................. 9
2.1 DIMENSIONS ............................................................................................................ 10
2.1.1 Board Dimensions............................................................................................ 10
2.1.2 External Interface Panel Dimensions ...............................................................11
2.2 DATA FLOW .............................................................................................................. 12
2.3 VIA® C7 CPU ......................................................................................................... 13
2.4 VIA® CX700M SYSTEM CHIPSET ........................................................................... 13
2.4.1 Graphics........................................................................................................... 14
2.4.1.1 VGA .......................................................................................................... 14
2.4.1.2 DVI ........................................................................................................... 15
2.4.1.3 LVDS ........................................................................................................ 15
2.4.2 Memory ............................................................................................................ 15
2.4.3 SATA................................................................................................................. 16
2.4.4 IDE Controller ................................................................................................. 16
2.4.4.1 CompactFlash® Slot .................................................................................. 16
2.4.4.2 IDE Slot .................................................................................................... 17
2.4.5 USB .................................................................................................................. 18
2.4.6 PCI Bus ............................................................................................................ 19
2.4.6.1 Realtek RTL8110SC GbE Controller ....................................................... 19
2.4.7 Keyboard/Mouse .............................................................................................. 20
2.4.8 LPC Bus ........................................................................................................... 21
2.4.8.1 BIOS Chipset ............................................................................................ 21
Page ix
WAFER-CX700M 3.5" SBC
2.4.8.2 Lattice Semiconductor LC4032V Digital I/O Chipset.............................. 22
2.4.8.3 Fintek F81216DG LPC Serial Port Chipset.............................................. 22
2.4.9 Audio ................................................................................................................ 23
2.4.9.1 VIA® VT1708A Audio Chipset................................................................. 24
2.5 ENVIRONMENTAL AND POWER SPECIFICATIONS ....................................................... 25
2.5.1 System Monitoring ........................................................................................... 25
2.5.2 Operating Temperature and Temperature Control........................................... 25
2.5.3 Power Consumption......................................................................................... 26
3
UNPACKING .......................................................................................................... 27
3.1 ANTI-STATIC PRECAUTIONS ...................................................................................... 28
3.2 UNPACKING PRECAUTIONS....................................................................................... 28
3.3 PACKAGE CONTENTS................................................................................................ 29
4
CONNECTOR PINOUTS...................................................................................... 31
4.1 PERIPHERAL INTERFACE CONNECTORS .................................................................... 32
4.1.1 Layout .............................................................................................................. 32
4.1.2 Peripheral Interface Connectors ..................................................................... 33
4.1.3 External Interface Panel Connectors............................................................... 34
4.2 INTERNAL PERIPHERAL CONNECTORS ...................................................................... 35
4.2.1 Audio Connector .............................................................................................. 35
4.2.2 Backlight Inverter Connector .......................................................................... 36
4.2.3 Battery Connector............................................................................................ 37
4.2.4 CompactFlash® Slot........................................................................................ 37
4.2.5 CD Audio Connector........................................................................................ 39
4.2.6 Digital Input/Output Connector....................................................................... 40
4.2.7 DVI Connector ................................................................................................. 41
4.2.8 Fan Connector ................................................................................................. 42
4.2.9 Front Panel Connector .................................................................................... 43
4.2.10 IDE Connector ............................................................................................... 44
4.2.11 LVDS Connector............................................................................................. 46
4.2.12 Mini PCI Slot ................................................................................................. 47
4.2.13 Power Connector ........................................................................................... 51
4.2.14 PS_ON Connector.......................................................................................... 51
4.2.15 Reset Button Connector ................................................................................. 52
Page x
WAFER-CX700M 3.5" SBC
4.2.16 SATA Drive Connectors ................................................................................. 53
4.2.17 Serial Port Connectors .................................................................................. 54
4.2.18 USB Connectors............................................................................................. 55
4.3 EXTERNAL PERIPHERAL INTERFACE CONNECTOR PANEL ......................................... 56
4.3.1 LAN Connectors............................................................................................... 57
4.3.2 Keyboard/Mouse Connector ............................................................................ 58
4.3.3 Serial Port Connectors .................................................................................... 59
4.3.4 VGA Connector ................................................................................................ 59
5
INSTALLATION .................................................................................................... 61
5.1 ANTI-STATIC PRECAUTIONS ...................................................................................... 62
5.2 INSTALLATION CONSIDERATIONS ............................................................................. 63
5.2.1 Installation Notices .......................................................................................... 63
5.2.2 Installation Checklist ....................................................................................... 64
5.2.3 Airflow.............................................................................................................. 65
5.3 UNPACKING PRECAUTIONS....................................................................................... 65
5.4 COOLING KIT AND DIMM INSTALLATION ................................................................ 66
5.4.1 Cooling Kit Installation ................................................................................... 66
5.4.2 SO-DIMM Installation ..................................................................................... 67
5.4.3 CF Card Installation........................................................................................ 68
5.5 JUMPER SETTINGS .................................................................................................... 69
5.5.1 AT/ATX Power Supply Selector........................................................................ 70
5.5.2 Clear CMOS Jumper........................................................................................ 71
5.5.3 LVDS Voltage Selection.................................................................................... 72
5.5.4 RS-232/422/485 Selection Jumper................................................................... 73
5.6 INTERNAL PERIPHERAL DEVICE CONNECTIONS........................................................ 74
5.6.1 Audio Cable Installation .................................................................................. 75
5.6.2 HDD Cable Connection................................................................................... 75
5.6.3 Serial Port Cable Connection.......................................................................... 76
5.6.4 SATA Drive Connection ................................................................................... 77
5.6.5 USB Cable (Dual Port without Bracket) ......................................................... 79
5.7 EXTERNAL PERIPHERAL INTERFACE CONNECTION ................................................... 80
5.7.1 Keyboard/Mouse Y-Cable Connection ............................................................. 81
5.7.2 LAN Connection............................................................................................... 82
5.7.3 Serial Device Connection ................................................................................ 82
Page xi
WAFER-CX700M 3.5" SBC
5.7.4 VGA Monitor Connection ................................................................................ 83
6
BIOS SETUP ........................................................................................................... 85
6.1 INTRODUCTION ........................................................................................................ 86
6.1.1 Starting Setup................................................................................................... 86
6.1.2 Using Setup ...................................................................................................... 86
6.1.3 Getting Help..................................................................................................... 87
6.1.4 Unable to Reboot After Configuration Changes.............................................. 87
6.1.5 BIOS Menu Bar................................................................................................ 87
6.2 MAIN ....................................................................................................................... 88
6.3 ADVANCED ............................................................................................................... 89
6.3.1 CPU Configuration.......................................................................................... 90
6.3.2 IDE Configuration ........................................................................................... 92
6.3.2.1 IDE Master, IDE Slave ............................................................................. 94
6.3.3 Super IO Configuration.................................................................................... 98
6.3.4 ACPI Configuration ....................................................................................... 101
6.3.5 APM Configuration........................................................................................ 102
6.3.6 Remote Access Configuration ........................................................................ 104
6.3.7 USB Configuration......................................................................................... 107
6.3.7.1 USB Mass Storage Device Configuration................................................110
6.4 PCI/PNP .................................................................................................................112
6.5 BOOT ......................................................................................................................115
6.5.1 Boot Settings Configuration............................................................................115
6.5.2 Boot Device Priority .......................................................................................119
6.5.3 Removable Drives ...........................................................................................119
6.6 SECURITY............................................................................................................... 120
6.7 CHIPSET ................................................................................................................. 122
6.7.1 Northbridge Configuration ............................................................................ 123
6.7.2 Southbridge Configuration ............................................................................ 125
6.8 EXIT ....................................................................................................................... 127
7
SOFTWARE DRIVERS ....................................................................................... 129
7.1 DRIVER CD AUTO-RUN .......................................................................................... 130
7.2 CHIPSET DRIVER INSTALLATION............................................................................. 132
7.3 GRAPHICS DRIVER INSTALLATION.......................................................................... 137
Page xii
WAFER-CX700M 3.5" SBC
7.4 NETWORK ADAPTER DRIVER INSTALLATION.......................................................... 141
7.5 AUDIO DRIVER INSTALLATION ............................................................................... 150
A
BIOS OPTIONS .................................................................................................... 157
B
TERMINOLOGY ................................................................................................. 161
C
DIGITAL I/O INTERFACE................................................................................. 165
C.1 INTRODUCTION ...................................................................................................... 166
C.2 DIO CONNECTOR PINOUTS ................................................................................... 166
C.3 ASSEMBLY LANGUAGE SAMPLES ........................................................................... 167
C.3.1 Enable the DIO Input Function..................................................................... 167
C.3.2 Enable the DIO Output Function .................................................................. 167
D
WATCHDOG TIMER .......................................................................................... 169
E
ADDRESS MAPPING.......................................................................................... 173
E.1 IO ADDRESS MAP .................................................................................................. 174
E.2 1ST MB MEMORY ADDRESS MAP ........................................................................... 174
E.3 IRQ MAPPING TABLE ............................................................................................ 175
E.4 DMA CHANNEL ASSIGNMENTS ............................................................................. 175
F
HAZARDOUS MATERIALS DISCLOSURE ................................................... 177
F.1 HAZARDOUS MATERIALS DISCLOSURE TABLE FOR IPB PRODUCTS CERTIFIED AS
ROHS COMPLIANT UNDER 2002/95/EC WITHOUT MERCURY ..................................... 178
Page xiii
WAFER-CX700M 3.5" SBC
THIS PAGE IS INTENTIONALLY LEFT BLANK
Page xiv
WAFER-CX700M 3.5" SBC
List of Figures
Figure 1-1: WAFER-CX700M..........................................................................................................2
Figure 1-2: WAFER-CX700M Overview (Front) ............................................................................4
Figure 1-3: WAFER-CX700M Overview (Solder Side) .................................................................5
Figure 2-1: WAFER-CX700M Dimensions (mm) ........................................................................10
Figure 2-2: External Interface Panel Dimensions (mm) ............................................................11
Figure 2-3: Data Flow Block Diagram .........................................................................................12
Figure 2-4: VIA® C7 Processor ...................................................................................................13
Figure 2-5: Graphics.....................................................................................................................14
Figure 2-6: 200-pin DDR2 SO-DIMM Sockets.............................................................................15
Figure 2-7: 1.5Gbps SATA Drive Connectors ............................................................................16
Figure 2-8: CompactFlash® Slot .................................................................................................17
Figure 2-9: IDE Slot.......................................................................................................................17
Figure 2-10: USB Ports ................................................................................................................18
Figure 2-11: Realtek PCI GbE Controllers..................................................................................19
Figure 2-12: BIOS Chipset ...........................................................................................................21
Figure 2-13: Lattice Semiconductor LC4064V Digital I/O Chipset...........................................22
Figure 2-14: Fintek F81216DG LPC Serial Port Chipset ...........................................................23
Figure 2-15: VIA® VT1708A High Definition Audio Chipset .....................................................24
Figure 4-1: Connector and Jumper Locations...........................................................................32
Figure 4-2: Connector and Jumper Locations (Solder Side) ...................................................33
Figure 4-3: Audio Connector Location (10-pin).........................................................................35
Figure 4-4: Panel Backlight Connector Pinout Locations ........................................................36
Figure 4-5: Battery Connector Location.....................................................................................37
Figure 4-6: CF Card Socket Location .........................................................................................38
Figure 4-7: Audio CD In Connector Pinouts (4-pin) ..................................................................39
Figure 4-8: DIO Connector Locations.........................................................................................40
Figure 4-9: DVI Connector Location ...........................................................................................41
Figure 4-10: Fan Connector Location.........................................................................................42
Figure 4-11: Front Panel Connector Location ...........................................................................43
Figure 4-12: IDE Device Connector Locations ..........................................................................45
Page xv
WAFER-CX700M 3.5" SBC
Figure 4-13: LVDS LCD Connector Pinout Locations...............................................................46
Figure 4-14: Mini PCI Slot Location ............................................................................................48
Figure 4-15: AT Power Connector Location ..............................................................................51
Figure 4-16: ATX Power Supply Enable Connector Location ..................................................52
Figure 4-17: Reset Button Connector Locations.......................................................................53
Figure 4-18: SATA Drive Connector Locations .........................................................................54
Figure 4-19: COM Connector Pinout Locations ........................................................................55
Figure 4-20: USB Connector Pinout Locations .........................................................................56
Figure 4-21: WAFER-CX700M External Peripheral Interface Connector.................................57
Figure 4-22: RJ-45 Ethernet Connector......................................................................................57
Figure 4-23: PS/2 Pinout and Configuration ..............................................................................58
Figure 4-24: COM1 Pinout Locations..........................................................................................59
Figure 4-25: VGA Connector .......................................................................................................60
Figure 5-1: SO-DIMM Installation ................................................................................................67
Figure 5-2: CF Card Installation ..................................................................................................69
Figure 5-3: Jumper Locations .....................................................................................................69
Figure 5-4: AT/ATX Power Supply Selector Location ...............................................................71
Figure 5-5: Clear CMOS Jumper .................................................................................................72
Figure 5-6: LVDS Voltage Selection Jumper Pinout Locations ...............................................73
Figure 5-7: RS-232/422/485 Selection Jumper...........................................................................74
Figure 5-8: Audio Cable Connection ..........................................................................................75
Figure 5-9: IDE Cable Connection...............................................................................................76
Figure 5-10: Single RS-232 Cable Installation ...........................................................................77
Figure 5-11: SATA Drive Cable Connection...............................................................................78
Figure 5-12: SATA Power Drive Connection..............................................................................79
Figure 5-13: Dual USB Cable Connection ..................................................................................80
Figure 5-14: PS/2 Keyboard/Mouse Connector .........................................................................81
Figure 5-15: LAN Connection ......................................................................................................82
Figure 5-16: Serial Device Connector.........................................................................................83
Figure 5-17: VGA Connector .......................................................................................................84
Figure 7-1: Introduction Screen ............................................................................................... 131
Figure 7-2: Available Drivers .................................................................................................... 131
Figure 7-3: Chipset and Graphics ............................................................................................ 132
Figure 7-4: Chipset or Platform Drivers .................................................................................. 133
Figure 7-5: VIA Hyperion........................................................................................................... 133
Page xvi
WAFER-CX700M 3.5" SBC
Figure 7-6: Setup File ................................................................................................................ 134
Figure 7-7: VIA Hyperion Welcome Screen............................................................................. 134
Figure 7-8: License Agreement ................................................................................................ 135
Figure 7-9: Select Drivers ......................................................................................................... 135
Figure 7-10: Start Driver Installation........................................................................................ 136
Figure 7-11: Installation Complete........................................................................................... 136
Figure 7-12: Finish Installation................................................................................................. 137
Figure 7-13: Chipset and Graphics .......................................................................................... 138
Figure 7-14: Integrated Graphics Drivers................................................................................ 138
Figure 7-15: 22.00.02a Folder ................................................................................................... 139
Figure 7-16: Installation Type Selection.................................................................................. 139
Figure 7-17: Setup File .............................................................................................................. 140
Figure 7-18: VIA Hyperion Welcome Screen........................................................................... 140
Figure 7-19: S3 Taskbar Icon.................................................................................................... 141
Figure 7-20: Start Menu............................................................................................................. 141
Figure 7-21: Control Panel........................................................................................................ 142
Figure 7-22: System Properties................................................................................................ 142
Figure 7-23: Device Manager.................................................................................................... 143
Figure 7-24: Ethernet Controller Properties Window............................................................. 143
Figure 7-25: Hardware Update Wizard..................................................................................... 144
Figure 7-26: Driver Location..................................................................................................... 144
Figure 7-27: Choose Audio Driver ........................................................................................... 145
Figure 7-28: Driver Selection.................................................................................................... 145
Figure 7-29: Default Network Drivers. ..................................................................................... 146
Figure 7-30: Install From Disk .................................................................................................. 146
Figure 7-31: Driver File Directory............................................................................................. 147
Figure 7-32: Select Operating System..................................................................................... 147
Figure 7-33: Windows Folder ................................................................................................... 147
Figure 7-34: InstallShield Folder .............................................................................................. 148
Figure 7-35: Operating System Folder .................................................................................... 148
Figure 7-36: Driver File.............................................................................................................. 148
Figure 7-37: Install From Disk .................................................................................................. 149
Figure 7-38: New Driver Found ................................................................................................ 149
Figure 7-39: Network Adapter Driver Installation Complete ................................................. 150
Figure 7-40: Audio Driver Folder.............................................................................................. 151
Page xvii
WAFER-CX700M 3.5" SBC
Figure 7-41: Operating System Folder .................................................................................... 151
Figure 7-42: Operating System Version .................................................................................. 152
Figure 7-43: Select 32-bit or 64-bit........................................................................................... 152
Figure 7-44: Audio Driver Folder.............................................................................................. 153
Figure 7-45: Audio Driver Setup File ....................................................................................... 153
Figure 7-46: Audio Driver Setup Welcome Screen................................................................. 154
Figure 7-47: Audio Driver Selection......................................................................................... 154
Figure 7-48: ................................................................................................................................ 155
Figure 7-49: Audio Driver Installation Complete .................................................................... 156
Page xviii
WAFER-CX700M 3.5" SBC
List of Tables
Table 1-1: Technical Specifications..............................................................................................8
Table 2-1: Supported HDD Specifications..................................................................................18
Table 2-2: Power Consumption...................................................................................................26
Table 3-1: Packing List Items ......................................................................................................30
Table 4-1: Peripheral Interface Connectors ...............................................................................34
Table 4-2: Rear Panel Connectors ..............................................................................................34
Table 4-3: Audio Connector Pinouts (10-pin) ............................................................................35
Table 4-4: Panel Backlight Connector Pinouts..........................................................................36
Table 4-5: Battery Connector Pinouts ........................................................................................37
Table 4-6: CF Card Socket Pinouts.............................................................................................39
Table 4-7: Audio CD In Connector Pinouts................................................................................40
Table 4-8: DIO Connector Pinouts ..............................................................................................41
Table 4-9: DVI Connector Pinouts...............................................................................................42
Table 4-10: +12V Fan Connector Pinouts...................................................................................43
Table 4-11: Front Panel Connector Pinouts...............................................................................44
Table 4-12: IDE Connector Pinouts.............................................................................................46
Table 4-13: LVDS LCD Port Connector Pinouts ........................................................................47
Table 4-14: Mini PCI Slot Pinouts................................................................................................51
Table 4-15: Power Connector Pinouts........................................................................................51
Table 4-16: ATX Power Supply Enable Connector Pinouts......................................................52
Table 4-17: Reset Button Connector Pinouts ............................................................................53
Table 4-18: SATA Drive Connector Pinouts...............................................................................54
Table 4-19: COM Connector Pinouts ..........................................................................................55
Table 4-20: USB Port Connector Pinouts...................................................................................56
Table 4-21: LAN Pinouts ..............................................................................................................57
Table 4-22: RJ-45 Ethernet Connector LEDs .............................................................................58
Table 4-23: Keyboard Connector Pinouts..................................................................................58
Table 4-24: RS-232 Serial Port (COM 1) Pinouts .......................................................................59
Table 4-25: VGA Connector Pinouts...........................................................................................60
Table 5-1: Jumpers .......................................................................................................................70
Page xix
WAFER-CX700M 3.5" SBC
Table 5-2: AT/ATX Power Supply Selector Settings .................................................................70
Table 5-3: Clear CMOS Jumper Settings....................................................................................72
Table 5-4: LVDS Voltage Selection Jumper Settings................................................................73
Table 5-5: RS-232/422/485 Selection Jumper Settings .............................................................74
Table 5-6: IEI Provided Cables ....................................................................................................74
Table 6-1: BIOS Navigation Keys ................................................................................................87
Page xx
WAFER-CX700M 3.5" SBC
BIOS Menus
BIOS Menu 1: Main .......................................................................................................................88
BIOS Menu 2: Advanced ..............................................................................................................90
BIOS Menu 3: CPU Configuration ...............................................................................................91
BIOS Menu 4: IDE Configuration.................................................................................................92
BIOS Menu 5: IDE Master and IDE Slave Configuration ...........................................................94
BIOS Menu 6: Super IO Configuration........................................................................................98
BIOS Menu 7: ACPI Configuration [Advanced Power Configuration].................................. 101
BIOS Menu 8:Advanced Power Management Configuration ................................................ 102
BIOS Menu 9: Remote Access Configuration [Advanced] .................................................... 105
BIOS Menu 10: USB Configuration .......................................................................................... 108
BIOS Menu 11: USB Mass Storage Device Configuration ..................................................... 110
BIOS Menu 12: PCI/PnP Configuration.................................................................................... 113
BIOS Menu 13: Boot .................................................................................................................. 115
BIOS Menu 14: Boot Settings Configuration .......................................................................... 116
BIOS Menu 15: Boot Device Priority Settings ........................................................................ 119
BIOS Menu 16: Removable Drives ........................................................................................... 120
BIOS Menu 17: Security ............................................................................................................ 121
BIOS Menu 18: Chipset ............................................................................................................. 122
BIOS Menu 19:Northbridge Chipset Configuration................................................................ 123
BIOS Menu 20:Southbridge Chipset Configuration ............................................................... 126
BIOS Menu 21: Exit.................................................................................................................... 127
Page xxi
WAFER-CX700M 3.5" SBC
THIS PAGE IS INTENTIONALLY LEFT BLANK
Page xxii
WAFER-CX700M 3.5" SBC
Chapter
1
1 Introduction
Page 1
WAFER-CX700M 3.5" SBC
1.1 Introduction
Figure 1-1: WAFER-CX700M
The WAFER-CX700M 3.5” motherboard is a VIA® Eden or VIA® C7 processor platform.
The WAFER-CX700M features a VIA® CX700M system chipset, which combines both
Southbridge and Northbridge into a single package fitting the size of a standard
Northbridge. Support for VGA, LVDS and DVI displays provides diversified display
functionalities. Two Realtek RTL8110SC Gigabit Ethernet controllers ensure secure
network connectivity. Storage capabilities are provided by two SATA ports, an IDE port
and a CompactFlash® slot. A Mini PCI expansion card is easily connected to the system
through a Mini PCI expansion slot. Four USB 2.0 connectors, four serial ports provides
additional expansion options to the system ensuring a variety of USB 2.0 devices can be
connected to the WAFER-CX700M.
1.2 Benefits
Some of the benefits of the WAFER-CX700M include:
Ultra-low power consumption
High data throughput and high-speed DDR2
Network connectivity
Video outputs suitable for different applications
Page 2
WAFER-CX700M 3.5" SBC
1.3 Features
Some of the features of the WAFER-CX700M are listed below.
3.5” form factor
VIA® Eden or VIA® C7 CPU
VIA® CX700M system chipset
Multiple display options including
o
o
o
VGA
DVI
24-bit dual-channel LVDS
Multiple serial port connectors including:
o
o
Three RS-232
One RS-232/422/485
Multiple storage options including:
o
o
o
IDE hard drive slot
CompactFlash® type I/II slot
Two SATA II ports
Page 3
WAFER-CX700M 3.5" SBC
1.4 Overview
The WAFER-CX700M has a wide variety of peripheral interface connectors. Below is a
labeled photo of the peripheral interface connectors on the front side of the
WAFER-CX700M.
Figure 1-2: WAFER-CX700M Overview (Front)
Below is a photo of the peripheral interface connectors on the solder side of the
WAFER-CX700M.
Page 4
WAFER-CX700M 3.5" SBC
Figure 1-3: WAFER-CX700M Overview (Solder Side)
1.5 Peripheral Connectors and Jumpers
The WAFER-CX700M has the following connectors on-board:
1 x Audio connector
1 x Backlight inverter connector
1 x Battery connector
1 x CD audio input connector
1 x CompactFlash® Card socket (solder side)
1 x DDR2 SO-DIMM socket (solder side)
1 x Digital I/O connector
1 x DVI connector
1 x Fan connector
1 x Front panel connector
Page 5
WAFER-CX700M 3.5" SBC
1 x IDE connector
1 x LVDS LCD connector
1 x Mini PCI
1 x Power connector
1 x PS_ON connector
1 x Reset button connector
2 x RS-232 serial port connector
1 x RS-232/422/485 serial port connector
2 x SATA connector
2 x USB 2.0 connector
The WAFER-CX700M has the following external peripheral interface connectors on the
board rear panel.
2 x RJ-45 Ethernet connectors
1 x RS-232 serial port connector
1 x PS-2 connector
1 x VGA connector
The WAFER-CX700M has the following on-board jumpers:
AT/ATX power mode select jumper
COM2 RS-232/422/485 selection jumper
Clear CMOS jumper
LCD panel voltage selection jumper
1.6 Technical Specifications
WAFER-CX700M technical specifications are listed below. See Chapter 2 for details.
Specification
WAFER-CX700M
Form Factor
3.5”
System CPU
System Chipset
Page 6
1.5 GHz VIA® C7 CPU (with cooling fan)
1.0 GHz VIA® Eden ULV CPU (fanless)
VIA® CX700M
WAFER-CX700M 3.5" SBC
Specification
WAFER-CX700M
Memory
One 200-pin 1.0 GB (max.) 400/533 MHz DDR2 SO-DIMM
VGA through DB-15 connector
Display
DVI through pin-header
24-bit dual-channel LVDS through 20-pin crimp connector
BIOS
AMI BIOS
Audio
VIA® VT1708A
LAN
Dual Realtek RTL8110SC Gigabit Ethernet controllers
COM
USB2.0
Hard Disk Drives
Three RS-232 serial ports
One RS-232 or RS-422/485 serial port
Four USB ports via pin header
One 44-pin IDE connector
Two SATA II connectors
Digital I/O
One 8-bit digital I/0, 4-bit input/4-bit output
Expansion
Mini PCI expansion slot
Super I/O
Winbond W83627EHG
SSD
CompactFlash® Type I/II slot
Watchdog Timer
Power Supply
Power Consumption
Software programmable supports 1 sec. ~ 255 sec. system
reset.
AT and ATX support
5 V @ 4.1 A, 12 V @ 0.55 A, 5VSB @ 0.07 A
(VIA® C7 1.5 GHz, 1.0 GB 533 MHz DDR2, 3DMARK2001)
Ambient Temperature
0 °C ~ +60 °C
Humidity
5% ~ 95% non-condensing
Dimensions (W x L)
146 mm x 102 mm
Page 7
WAFER-CX700M 3.5" SBC
Specification
WAFER-CX700M
Weight (GW/NW)
600 g / 160 g
Table 1-1: Technical Specifications
Page 8
WAFER-CX700M 3.5" SBC
Chapter
2
2 Detailed Specifications
Page 9
WAFER-CX700M 3.5" SBC
2.1 Dimensions
2.1.1 Board Dimensions
The dimensions of the WAFER-CX700M are listed below.
Length: 102 mm
Width: 146 mm
Figure 2-1: WAFER-CX700M Dimensions (mm)
Page 10
WAFER-CX700M 3.5" SBC
2.1.2 External Interface Panel Dimensions
External interface panel connector dimensions are show below.
Figure 2-2: External Interface Panel Dimensions (mm)
Page 11
WAFER-CX700M 3.5" SBC
2.2 Data Flow
The diagram below shows the data flow between the onboard CPU, system chipset and
other components installed on the motherboard and described in the following sections of
this chapter.
Figure 2-3: Data Flow Block Diagram
Page 12
WAFER-CX700M 3.5" SBC
2.3 VIA® C7 CPU
The WAFER-CX700M has a VIA® C7 processor preinstalled.
Figure 2-4: VIA® C7 Processor
Some of the main specifications of the VIA® C7 CPU are listed below.
Full x86/x87 operating system and software application compatibility
Processor frequencies up to 2.0 GHz
VIA® V4 bus up to 800 MHz FSB
128 KB L2 cache
Sophisticated branch prediction mechanism
MMX, SSE, SSE2 and SSE3 instruction sets
NX execute protection
Two quantum-based random number generators
2.4 VIA® CX700M System Chipset
The VIA® CX700M combines a feature rich Southbridge and Northbridge into a single
package the same size as a typical Northbridge. The VIA® CX700M offers a full
multimedia experience with three different choices of graphical output including VGA, DVI
and LVDS, audio output and dedicated decoding of MPEG-2/4 and WMV9.
Page 13
WAFER-CX700M 3.5" SBC
2.4.1 Graphics
Figure 2-5: Graphics
The following video outputs are implemented on the WAFER-CX700M.
VGA..........................................................................................14
DVI ...........................................................................................15
LVDS ........................................................................................15
2.4.1.1 VGA
The VIA® CX700M chipset supports RGB video output through a DB-15 connector on the
external peripheral connector interface. The VGA port supports RGB output and HDTV
output.
Page 14
WAFER-CX700M 3.5" SBC
2.4.1.2 DVI
The VIA® CX700M chipset supports DVI video output via pin header on the
WAFER-CX700M. The DVI and LVDS video outputs share a video channel so only one
can be used at a time.
2.4.1.3 LVDS
The VIA® CX700M chipset supports LVDS video output via a 15-pin crimp header on the
WAFER-CX700M. The LVDS and DVI video outputs share a video channel so only one
can be used at a time.
2.4.2 Memory
The VIA® CX700M system chipset on the WAFER-CX700M supports one 200-pin DDR2
SO-DIMM with the following features:
One 200-pin SO-DIMM
DDR2 only (DO NOT install a DDR DIMM)
Capacities of 256MB, 512MB or 1GB
Transfer speeds of 400MHz or 533MHz
64-bit wide channel
The memory socket is shown below.
Figure 2-6: 200-pin DDR2 SO-DIMM Sockets
Page 15
WAFER-CX700M 3.5" SBC
2.4.3 SATA
The SATA controller supports two full duplex 3.0 Gbps dual channel SATA drives. The two
SATA drive connectors are shown below.
Figure 2-7: 1.5Gbps SATA Drive Connectors
2.4.4 IDE Controller
Up to two IDE devices are supported on the IDE bus. A single IDE hard drive and
CompactFlash® card can be installed on the system.
2.4.4.1 CompactFlash® Slot
The CompactFlash® socket supports standard CF Type I and CF Type II cards. The
chipset flash interface is multiplexed with an IDE interface and can be connected to an
array of industry standard NAND Flash or NOR Flash devices. The CompactFlash® card
is connected to the IDE bus.
Page 16
WAFER-CX700M 3.5" SBC
Figure 2-8: CompactFlash® Slot
2.4.4.2 IDE Slot
The single IDE connector supports two ATA-6 HDDs. An ATA-6 (Ultra ATA/100) compliant
IDE controller has a maximum transfer rate of 100MB/s. ATA-6 includes advancements in
error checking and ATA-6 drives are compatible with future interface additions.
Figure 2-9: IDE Slot
The onboard ATA-6 controller is able to support the following IDE HDDs:
Ultra ATA/100, with data transfer rates up to 100MB/s
Ultra ATA/66, with data transfer rates up to 66MB/s
Ultra ATA/33, with data transfer rates up to 33MB/s
Specification
Ultra ATA/100
Ultra ATA/66
Ultra ATA/33
IDE devices
2
2
2
Page 17
WAFER-CX700M 3.5" SBC
Specification
Ultra ATA/100
Ultra ATA/66
Ultra ATA/33
PIO Mode
0–4
0–4
0–4
PIO Max Transfer Rate
16.6 MB/s
16.6 MB/s
16.6 MB/s
DMA/UDMA designation
UDMA 5
UDMA 4
UDMA 2
DMA/UDMA Max Transfer
100MB/s
66MB/s
33MB/s
Controller Interface
5V
5V
5V
Table 2-1: Supported HDD Specifications
2.4.5 USB
Four USB pin headers on the WAFER-CX700M board are interfaced to the system chipset
USB controller. Four USB 1.1 or USB 2.0 devices can be connected simultaneously to the
WAFER-CX700M.
Figure 2-10: USB Ports
The chipset USB controller has the following specifications:
o
Page 18
4 USB ports
WAFER-CX700M 3.5" SBC
o
o
o
USB 1.1 and USB 2.0 compliant
3 host ports
1 host/device
2.4.6 PCI Bus
The PCI bus is connected to the components listed below:
Realtek RTL8110SC GbE Controller .......................................19
The PCI bus complies with PCI Local Bus Specification, Revision 2.2 and supports 33MHz
PCI operations.
2.4.6.1 Realtek RTL8110SC GbE Controller
Two PCI lanes are connected to two Realtek RTL8110SC GbE controllers shown below.
Figure 2-11: Realtek PCI GbE Controllers
The Realtek RTL8110SC PCI GbE controllers combine a triple-speed IEEE 802.3
compliant Media Access Controller (MAC) with a triple-speed Ethernet transceiver, 32-bit
Page 19
WAFER-CX700M 3.5" SBC
PCI bus controller, and embedded memory. With state-of-the-art DSP technology and
mixed-mode signal technology, they offer high-speed transmission over CAT 5 UTP cable
or CAT 3 UTP (10Mbps only) cable. Functions such as Crossover Detection &
Auto-Correction, polarity correction, adaptive equalization, cross-talk cancellation, echo
cancellation, timing recovery, and error correction are implemented to provide robust
transmission and reception capability at high speeds.
Some of the features of the Realtek RTL8110SC PCI GbE controllers are listed below.
Integrated 10/100/1000 transceiver
Auto-Negotiation with Next Page capability
Supports PCI rev.2.3, 32-bit, 33/66MHz
Supports pair swap/polarity/skew correction
Crossover Detection & Auto-Correction
Wake-on-LAN and remote wake-up support
Microsoft® NDIS5 Checksum Offload (IP, TCP, UDP) and largesend offload
support
Supports Full Duplex flow control (IEEE 802.3x)
Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Supports IEEE 802.1P Layer 2 Priority Encoding
Supports IEEE 802.1Q VLAN tagging
Serial EEPROM
3.3/1.8/1.5 V signaling, 5 V PCI I/O tolerant
0.15µm CMOS process
Transmit/Receive FIFO (8K/64K) support
Supports power down/link down power saving
Supports PCI Message Signaled Interrupt (MSI)
2.4.7 Keyboard/Mouse
The keyboard/mouse controller can execute the 8042 instruction set. Some of the
keyboard controller features are listed below:
The 8042 instruction is compatible with a PS/2 keyboard and PS/2 mouse
Gate A20 and Keyboard reset output
Supports multiple keyboard power on events
Page 20
WAFER-CX700M 3.5" SBC
Supports mouse double-click and/or mouse move power on events
2.4.8 LPC Bus
The LPC bus is connected to components listed below:
BIOS Chipset ...........................................................................21
Lattice Semiconductor LC4032V Digital I/O Chipset ...............22
Fintek F81216DG Serial Port Chipset......................................22
2.4.8.1 BIOS Chipset
The BIOS chipset has a licensed copy of AMI BIOS installed on the chipset.
Figure 2-12: BIOS Chipset
Some of the BIOS features are listed below:
AMI Flash BIOS
SMIBIOS (DMI) compliant
Console redirection function support
PXE (Pre-boot Execution Environment) support
USB booting support
Page 21
WAFER-CX700M 3.5" SBC
2.4.8.2 Lattice Semiconductor LC4032V Digital I/O Chipset
The Lattice Semiconductor digital I/O chipset enables a 24-bit Digital I/O. The LC4032V
chipset consists of multiple 36-input, 16 macrocell Generic Logic Blocks interconnected by
a Global Routing Pool. Output Routing Pools (ORPs) connect the GLBs to the I/O Blocks
that contain multiple I/O cells.
Figure 2-13: Lattice Semiconductor LC4064V Digital I/O Chipset
Some of the features of the Lattice Semiconductor LC4032V chipset are listed below:
Up to four global clock pins with programmable clock polarity control
400MHz maximum operating frequency
Operates with 3.3 V, 2.5 V or 1.8 V power
2.4.8.3 Fintek F81216DG LPC Serial Port Chipset
The Fintek F81216DG chipset enables the addition of four additional UART serial ports
(COM1, COM2, COM3 and COM4). UART includes 16-byte send/receive FIFO. The
Fintek serial port chipset is interfaced to the system chipset through the LPC bus.
Page 22
WAFER-CX700M 3.5" SBC
Figure 2-14: Fintek F81216DG LPC Serial Port Chipset
Some of the features of the Fintek chipset are listed below:
Supports LPC interface
Totally provides 4 UART (16550 asynchronous) ports
o
o
3 x Pure UART
1 x UART+IR
One Watch dog timer with WDTOUT# signal
One Frequency input 24/48 MHz
Powered by 3 Vcc
2.4.9 Audio
The High Definition Audio is interfaced to the onboard audio connector through the VIA®
VT1708A audio chipset.
Page 23
WAFER-CX700M 3.5" SBC
2.4.9.1 VIA® VT1708A Audio Chipset
The VIA® VT1708A High Definition Audio chipset supports 8-channel, 24-bit, 192 KHz
audio content. The audio chipset features a 100dB S/N ratio and complies with the Intel®
High Definition Audio Rev. 1.0 specification. VIA® HD Audio codecs include a high quality
headphone amplifier, enhanced recording support, and advanced power management
features, ideal for mobile devices.
Figure 2-15: VIA® VT1708A High Definition Audio Chipset
Some of the features of the audio chipset are listed below:
Supports 44.1 KHz, 48 KHz, 96 KHz and 192 KHz DAC independent sample
rates
Built-in headphone amplifier
4 stereo DACs support 24-bit, 192 KHz samples
DAC with 100dB S/N ratio
2 stereo ADCs support 24-bit, 192KHz samples
ADC with 95dB S/N Ratio
High quality differential CD input
HPF in ADC path for DC removal
Analog CD input path for compatibility
Supports EAPD (External Amplifier Power Down)
Power management and enhanced power saving features
Digital: 3.3 V; Analog: 3.3 V / 5.0 V
Page 24
WAFER-CX700M 3.5" SBC
2.5 Environmental and Power Specifications
2.5.1 System Monitoring
The thermal inputs on the WAFER-CX700M monitor the following temperatures:
System temperature
Power temperature
CPU temperature
The voltage inputs on the WAFER-CX700M monitor the following voltages:
Vcore
+2.5V
+3.3V
+5.0V
+12.0V
DDR Vtt
+1.5V
5VSB
The following voltages are also monitored:
VBAT
The WAFER-CX700M also monitors the following fan speeds:
CPU Fan speed
The values for the above environmental parameters are all recorded in the BIOS
Hardware Health Configuration menu.
2.5.2 Operating Temperature and Temperature Control
The maximum and minimum operating temperatures for the WAFER-CX700M are listed
below.
Minimum Operating Temperature: 0ºC (32°F)
Maximum Operating Temperature: 60°C (140°F)
Page 25
WAFER-CX700M 3.5" SBC
A cooling fan and heat sink must be installed on the system. Thermal paste must be
smeared on the lower side of the heat sink before it is mounted. The stock heat sink and
fan cover both the system chipset and CPU.
2.5.3 Power Consumption
The table below shows the power consumption parameters for the WAFER-CX700M
running with a 1.5 GHz VIA® C7 and 1.0 GB of 533 MHz DDR2 memory.
Voltage
Current
+5V
4.1 A
+12V
0.55 A
5 VSB
0.07 A
Table 2-2: Power Consumption
Page 26
WAFER-CX700M 3.5" SBC
Chapter
3
3 Unpacking
Page 27
WAFER-CX700M 3.5" SBC
3.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the
WAFER-CX700M
may
result
in
permanent
damage
to
the
WAFER-CX700M and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-CX700M. Dry climates are particularly susceptible to ESD. It is
therefore critical that whenever the WAFER-CX700M or any other electronic component is
handled, the following anti-static precautions are strictly adhered to:
Wear and anti-static wristband: - Wearing a simple anti-static wristband can
help to prevent ESD from damaging the WAFER-CX700M.
Self-grounding: - Before handling the WAFER-CX700M touch any grounded
conducting material. During the time of handling, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: - When configuring the WAFER-CX700M, place it on
an anti-static pad. This reduces the possibility of ESD damaging the
WAFER-CX700M.
Only handle the PCB by the edges: - When handling the PCB, hold the PCB
by it’s edges.
3.2 Unpacking Precautions
When the WAFER-CX700M is unpacked, please do the following:
Follow the anti-static precautions outline in Section 3.1.
Make sure the packing box if facing upwards so the WAFER-CX700M does
not fall out of the box.
Make sure all of the components shown in the next section are present.
Page 28
WAFER-CX700M 3.5" SBC
3.3 Package Contents
NOTE:
If any of the components listed in the checklist below are missing, do
not proceed with the installation. Contact the IEI reseller or vendor that
the WAFER-CX700M was purchased from, or contact and IEI sales
representative directly by sending an email to [email protected].
The WAFER-CX700M is shipped with the following components.
Quantity
Item and Part Number
1
WAFER-CX700M
1
Audio cable
Image
(P/N: 32000-072100-RS)
2
SATA cable
(P/N: 32000-062800-RS)
1
SATA power cable
(P/N: 32100-088600-RS)
2
Dual USB cable (wo bracket)
(P/N: 32000-070300-RS)
1
HDD cable (44-pin)
(P/N: 32200-000009-RS)
3
Single COM port (w/o bracket)
(P/N: 32200-000049-RS)
1
KB/MS PS/2 Y-cable
(P/N: 32000-000138-RS)
Page 29
WAFER-CX700M 3.5" SBC
Quantity
Item and Part Number
1
Utility CD
1
Quick Installation Guide
1
Mini jumper pack (2.0mm)
(P/N: 33100-000033-RS)
Table 3-1: Packing List Items
Page 30
Image
WAFER-CX700M 3.5" SBC
Chapter
4
4 Connector Pinouts
Page 31
WAFER-CX700M 3.5" SBC
4.1 Peripheral Interface Connectors
Section 4.1.1 shows peripheral interface connector locations. Section 0 lists all the
peripheral interface connectors seen in Section 4.1.1.
4.1.1 Layout
The figures below show the on-board peripheral connectors, rear panel peripheral
connectors and on-board jumpers.
Figure 4-1: Connector and Jumper Locations
Page 32
WAFER-CX700M 3.5" SBC
Figure 4-2: Connector and Jumper Locations (Solder Side)
4.1.2 Peripheral Interface Connectors
Table 4-1 shows a list of the peripheral interface connectors on the WAFER-CX700M.
Connector
Type
Label
Audio connector
10-pin header
CN3
Backlight inverter connector
6-pin wafer
CN1
Battery connector
2-pin wafer
CN5
CompactFlash® slot (solder side)
CF card slot
CN18
CD audio connector
4-pin wafer
CN2
DDR2 SO-DIMM socket (solder side)
200-pin SO-DIMM slot
J1
Digital I/O connector
10-pin header
CN8
DVI connector
26-pin header
DVI1
Fan connector
3-pin wafer
FAN1
Front panel connector
8-pin header
CN4
Page 33
WAFER-CX700M 3.5" SBC
Connector
Type
Label
IDE Interface connector
40-pin header
CN6
LVDS connector
30-pin crimp header
LVDS1
Mini PCI connector
Mini PCI connector
MINIPCI1
Power connector
4-pin Molex connector
CN7
PS_ON connector
3-pin wafer
CN9
Reset button connector
2-pin wafer
CN13
Serial ATA drive connector
7-pin SATA
SATA1
Serial ATA drive connector
7-pin SATA
SATA2
Serial port connector
10-pin header
CN10
Serial port connector
10-pin header
CN11
Serial port connector
10-pin header
CN12
USB connectors
8-pin header
USB1
USB connectors
8-pin header
USB2
Table 4-1: Peripheral Interface Connectors
4.1.3 External Interface Panel Connectors
Table 4-2 lists the rear panel connectors on the WAFER-CX700M.
Connector
Type
Label
Ethernet connector
RJ-45
LAN1
Ethernet connector
RJ-45
LAN2
Keyboard/Mouse connector
PS/2
CN16
Serial port connector
DB-9
CN17
VGA connector
15-pin female
VGA1
Table 4-2: Rear Panel Connectors
Page 34
WAFER-CX700M 3.5" SBC
4.2 Internal Peripheral Connectors
Internal peripheral connectors are found on the motherboard and are only accessible
when the motherboard is outside of the chassis. This section has complete descriptions of
all the internal peripheral connectors on the WAFER-CX700M.
4.2.1 Audio Connector
CN Label:
CN3
CN Type:
10-pin header (2 x 5)
CN Location:
See Figure 4-3
CN Pinouts:
See Table 4-3
The 10-pin audio header is connected to external audio devices. The audio pin header
provides a connection for microphone input, line level stereo input and amplified stereo
output.
Figure 4-3: Audio Connector Location (10-pin)
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
AUDIO OUT RIGHT
2
AUDIO OUT LEFT
3
GROUND
4
GROUND
5
LINE IN RIGHT
6
LINE IN LEFT
7
MIC IN RIGHT
8
MIC IN LEFT
9
GROUND
10
GROUND
Table 4-3: Audio Connector Pinouts (10-pin)
Page 35
WAFER-CX700M 3.5" SBC
4.2.2 Backlight Inverter Connector
CN Label:
CN1
CN Type:
6-pin header (1 x 6)
CN Location:
See Figure 4-4
CN Pinouts:
See Table 4-4
The backlight inverter connector provides the backlight on the LCD display connected to
the WAFER-CX700M with +12V of power.
Figure 4-4: Panel Backlight Connector Pinout Locations
PIN NO.
DESCRIPTION
1
12 V
2
12 V
3
BACKLIGHT ON
4
BACKLIGHT ADJUST
5
GROUND
6
GROUND
Table 4-4: Panel Backlight Connector Pinouts
Page 36
WAFER-CX700M 3.5" SBC
4.2.3 Battery Connector
CN Label:
CN5
CN Type:
2-pin box header (1x2)
CN Location:
See Figure 4-5
CN Pinouts:
See Table 4-5
The battery connector is connected to a backup battery. The battery connector is also
used to reset the CMOS memory if the incorrect BIOS settings have been made and the
system cannot boot up.
Figure 4-5: Battery Connector Location
PIN NO.
DESCRIPTION
1
Battery+
2
Ground
Table 4-5: Battery Connector Pinouts
4.2.4 CompactFlash® Slot
CN Label:
CN18
CN Type:
50-pin header (2x25)
CN Location:
See Figure 4-6
CN Pinouts:
See Table 4-6
Page 37
WAFER-CX700M 3.5" SBC
A CF Type I or Type II memory card is inserted to the CF socket on the solder side of the
WAFER-CX700M.
Figure 4-6: CF Card Socket Location
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
GROUND
26
CD1#
2
DATA 3
27
DATA 11
3
DATA 4
28
DATA 12
4
DATA 5
29
DATA 13
5
DATA 6
30
DATA 14
6
DATA 7
31
DATA 15
7
CE#
32
CE2#
8
N/C
33
VS1#
9
OE#
34
IOR#
10
A9
35
IOW#
11
A8
36
WE#
12
A7
37
IRQ
13
VCC1
38
VCC2
14
A6
39
CSEL#
Page 38
WAFER-CX700M 3.5" SBC
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
15
A5
40
VS2#
16
A4
41
RESET#
17
A3
42
WAIT#
18
A2
43
INPACK#
19
A1
44
REG#
20
A0
45
BVD2
21
DATA 0
46
BVD1
22
DATA 1
47
DATA 8
23
DATA 2
48
DATA 9
24
IOCS16#
49
DATA 10
25
CD2#
50
GROUND
Table 4-6: CF Card Socket Pinouts
4.2.5 CD Audio Connector
CN Label:
CN2
CN Type:
4-pin header (1 x 4)
CN Location:
See Figure 4-7
CN Pinouts:
See Table 4-7
The 4-pin audio CD in connector is connected to an external audio CD device for the input
and output of audio signals from a CD player to the system.
Figure 4-7: Audio CD In Connector Pinouts (4-pin)
Page 39
WAFER-CX700M 3.5" SBC
PIN NO.
DESCRIPTION
1
CD Signal (Right)
2
Ground
3
Ground
4
CD Signal (Left)
Table 4-7: Audio CD In Connector Pinouts
4.2.6 Digital Input/Output Connector
CN Label:
CN8
CN Type:
10-pin header (2x5)
CN Location:
See Figure 4-8
CN Pinouts:
See Table 4-8
The digital input/output connector is managed through a Super I/O chip. The DIO
connector pins are user programmable.
Figure 4-8: DIO Connector Locations
PIN NO. DESCRIPTION
PIN NO. DESCRIPTION
1
GND
2
VCC
3
Output 3
4
Output 2
5
Output 1
6
Output 0
Page 40
WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION
PIN NO. DESCRIPTION
7
Input 3
8
Input 2
9
Input 1
10
Input 0
Table 4-8: DIO Connector Pinouts
4.2.7 DVI Connector
CN Label:
DVI1
CN Type:
26-pin header (2 x 13)
CN Location:
See Figure 4-9
CN Pinouts:
See Table 4-9
The DVI connects to a monitor that is accepts DVI input signals.
Figure 4-9: DVI Connector Location
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
-DATA2
14
5V
2
DATA2
15
GND
3
GND
16
DVI DETECT
4
N/C
17
-DATA0
5
N/C
18
DATA0
6
DDCCLK
19
GND
7
DDCDATA
20
N/C
8
N/C
21
N/C
Page 41
WAFER-CX700M 3.5" SBC
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
9
-DATA1
22
GND
10
DATA1
23
CLOCK
11
GND
24
-CLOCK
12
-DATA3
25
GND
13
DATA3
26
N/C
Table 4-9: DVI Connector Pinouts
4.2.8 Fan Connector
CN Label:
FAN1
CN Type:
3-pin wafer (1 x 3)
CN Location:
See Figure 4-10
CN Pinouts:
See Table 4-10
The cooling fan connector provides a 12V, 500mA current to a system cooling fan. The
connector has a "rotation" pin to get rotation signals from fans and notify the system so the
system BIOS can recognize the fan speed. Please note that only specified fans can issue
the rotation signals.
Figure 4-10: Fan Connector Location
Page 42
WAFER-CX700M 3.5" SBC
PIN NO.
DESCRIPTION
1
Rotation Signal
2
+12V
3
GND
Table 4-10: +12V Fan Connector Pinouts
4.2.9 Front Panel Connector
CN Label:
CN4
CN Type:
8-pin header (2 x 4)
CN Location:
See Figure 4-11
CN Pinouts:
See Table 4-11
The front panel connector connects to external switches and indicators to monitor and
controls the motherboard. These indicators and switches include:
Power button
Reset button
Power LED
HDD LED
Figure 4-11: Front Panel Connector Location
Page 43
WAFER-CX700M 3.5" SBC
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
GND
2
PW_BN
3
GND
4
-EXTSMI
5
BUZZER-
6
BUZZER+
7
GND
8
AT_FUNCTION
Table 4-11: Front Panel Connector Pinouts
4.2.10 IDE Connector
CN Label:
CN6
CN Type:
44-pin header (2 x 22)
CN Location:
See Figure 4-12
CN Pinouts:
See Table 4-12
One 40-pin IDE device connector on the WAFER-CX700M supports connectivity to two
hard disk drives.
Page 44
WAFER-CX700M 3.5" SBC
Figure 4-12: IDE Device Connector Locations
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
RESET#
2
GROUND
3
DATA 7
4
DATA 8
5
DATA 6
6
DATA 9
7
DATA 5
8
DATA 10
9
DATA 4
10
DATA 11
11
DATA 3
12
DATA 12
13
DATA 2
14
DATA 13
15
DATA 1
16
DATA 14
17
DATA 0
18
DATA 15
19
GROUND
20
N/C
21
IDE DRQ
22
GROUND
23
IOW#
24
GROUND
25
IOR#
26
GROUND
27
IDE CHRDY
28
GROUND
29
IDE DACK
30
GROUND–DEFAULT
31
INTERRUPT
32
N/C
33
SA1
34
N/C
Page 45
WAFER-CX700M 3.5" SBC
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
35
SA0
36
SA2
37
HDC CS0#
38
HDC CS1#
39
HDD ACTIVE#
40
GROUND
41
VCC
42
VCC
43
GROUND
44
N/C
Table 4-12: IDE Connector Pinouts
4.2.11 LVDS Connector
CN Label:
LVDS1
CN Type:
30-pin crimp (2 x 15)
CN Location:
See Figure 4-13
CN Pinouts:
See Table 4-13
The 30-pin LVDS LCD connector can be connected to single channel or dual channel,
18-bit or 36-bit LVDS panel.
Figure 4-13: LVDS LCD Connector Pinout Locations
Page 46
WAFER-CX700M 3.5" SBC
PIN NO. DESCRIPTION
PIN NO.
DESCRIPTION
1
GROUND
2
GROUND
3
LVDSA_DATA0
4
LVDSA_DATA#0
5
LVDSA_DATA1
6
LVDSA_ DATA#1
7
LVDSA_DATA2
8
LVDSA_ DATA#2
9
LVDSA_CLK
10
LVDSA_CLK#
11
LVDSA_DATA3
12
LVDSA_DATA#3
13
GROUND
14
GROUND
15
LVDSB_DATA0
16
LVDSB_DATA0#
17
LVDSB_DATA1
18
LVDSB_DATA1#
19
LVDSB_DATA2
20
LVDSB_DATA2#
21
LVDSB_CLK
22
LVDSB_CLK#
23
LVDSB_DATA3
24
LVDSB_DATA3#
25
GROUND
26
GROUND
27
VCC/VCC3
28
VCC/VCC3
29
VCC/VCC3
30
VCC/VCC3
Table 4-13: LVDS LCD Port Connector Pinouts
4.2.12 Mini PCI Slot
CN Label:
MINIPCI1
CN Type:
124-pin Mini PCI Slot
CN Location:
See Figure 4-14
CN Pinouts:
See Table 4-14: Mini PCI Slot Pinouts
The Mini PCI slot enables a Mini PCI expansion module to be connected to the board.
Page 47
WAFER-CX700M 3.5" SBC
Figure 4-14: Mini PCI Slot Location
Page 48
WAFER-CX700M 3.5" SBC
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
NC
2
NC
3
NC
4
NC
5
NC
6
NC
7
NC
8
NC
9
NC
10
NC
11
NC
12
NC
13
NC
14
NC
15
GND
16
NC
17
PINTD#
18
VCC5
19
VCC3
20
PINTC#
21
NC
22
NC
23
GND
24
VCC3SB
25
CLK_MPCI
26
PCI_RST1#
27
GND
28
VCC3
29
PCI_REQ2#
30
PCI_GNT2#
31
VCC3
32
GND
33
PAD31
34
PPME#
35
PAD29
36
NC
37
GND
38
PAD30
39
PAD27
40
VCC3
41
PAD25
42
PAD28
43
NC
44
PAD26
45
PC/BE3#
46
PAD24
47
PAD23
48
PAD29
49
GND
50
GND
51
PAD21
52
PAD22
53
PAD19
54
PAD20
55
GND
56
PPAR
57
PAD17
58
PAD18
59
PC/BE2#
60
PAD16
Page 49
WAFER-CX700M 3.5" SBC
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
61
PIRDY#
62
GND
63
VCC3
64
PFRAME#
65
NC
66
PTRDY#
67
SERR#
68
PSTOP#
69
GND
70
VCC3
71
PERR#
72
PDEVSEL#
73
PC/BE1#
74
GND
75
PAD14
76
PAD15
77
GND
78
PAD13
79
PAD12
80
PAD11
81
PAD10
82
GND
83
GND
84
PAD9
85
PAD8
86
PC/BE0#
87
PAD7
88
VCC3
89
VCC3
90
PAD6
91
PAD5
92
PAD4
93
NC
94
PAD2
95
PAD3
96
PAD0
97
VCC5
98
NC
99
PAD1
100
NC
101
GND
102
GND
103
NC
104
NC
105
NC
106
NC
107
NC
108
NC
109
NC
110
NC
111
NC
112
NC
113
NC
114
GND
115
NC
116
NC
117
NC
118
NC
119
NC
120
NC
121
NC
122
NC
Page 50
WAFER-CX700M 3.5" SBC
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
123
NC
124
VCC3SB
Table 4-14: Mini PCI Slot Pinouts
4.2.13 Power Connector
CN Label:
CN7
CN Type:
4-pin AT power connector (1x4)
CN Location:
See Figure 4-15
CN Pinouts:
See Table 4-15
The 4-pin AT power connector is connected to an AT power supply.
Figure 4-15: AT Power Connector Location
PIN NO.
DESCRIPTION
1
+12 V
2
GND
3
GND
4
+5 V
Table 4-15: Power Connector Pinouts
4.2.14 PS_ON Connector
CN Label:
CN9
Page 51
WAFER-CX700M 3.5" SBC
CN Type:
3-pin wafer (1x3)
CN Location:
See Figure 4-16
CN Pinouts:
See Table 4-16
The ATX power supply enable connector enables the WAFER-CX700M to be connected
to an ATX power supply. In default mode, the WAFER-CX700M can only us an AT power
supply. To enable an ATX power supply the AT Power Select jumper must also be
configured. Please refer to Chapter 3 for more details.
Figure 4-16: ATX Power Supply Enable Connector Location
PIN NO.
DESCRIPTION
1
+5V Standby
2
GND
3
PS-ON
Table 4-16: ATX Power Supply Enable Connector Pinouts
4.2.15 Reset Button Connector
CN Label:
CN13
CN Type:
2-pin wafer (1x2)
CN Location:
See Figure 4-17
CN Pinouts:
See Table 4-17
The reset button connector is connected to a reset switch on the system chassis to enable
users to reboot the system when the system is turned on.
Page 52
WAFER-CX700M 3.5" SBC
Figure 4-17: Reset Button Connector Locations
PIN NO.
DESCRIPTION
1
Reset Switch
2
GND
Table 4-17: Reset Button Connector Pinouts
4.2.16 SATA Drive Connectors
CN Label:
SATA1 and SATA2
CN Type:
7-pin SATA drive connectors
CN Location:
See Figure 4-18
CN Pinouts:
See Table 4-18
The SATA drive connectors are each connected to second generation SATA drives.
Second generation SATA drives transfer data at speeds as high as 3.0 Gb/s. The SATA
drives can be configured in a RAID configuration.
Page 53
WAFER-CX700M 3.5" SBC
Figure 4-18: SATA Drive Connector Locations
PIN NO.
DESCRIPTION
1
GND
2
TX+
3
TX-
4
GND
5
RX-
6
RX+
7
GND
Table 4-18: SATA Drive Connector Pinouts
4.2.17 Serial Port Connectors
CN Label:
CN10, CN11 and CN12
CN Type:
10-pin header (2x5)
CN Location:
See Figure 4-19
CN Pinouts:
See Table 4-19
The 10-pin serial port connectors provide RS-232 serial communications channels. The
serial port connector can be connected to external RS-232 serial port devices.
Page 54
WAFER-CX700M 3.5" SBC
Figure 4-19: COM Connector Pinout Locations
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
Data Carrier Direct (DCD)
2
Data Set Ready (DSR)
3
Receive Data (RXD)
4
Request To Send (RTS)
5
Transmit Data (TXD)
6
Clear To Send (CTS)
7
Data Terminal Ready (DTR)
8
Ring Indicator (RI)
9
Ground (GND)
Table 4-19: COM Connector Pinouts
4.2.18 USB Connectors
CN Label:
USB1 and USB2
CN Type:
8-pin header (2x4)
CN Location:
See Figure 4-20
CN Pinouts:
See Table 4-20
The 2x4 USB pin connectors each provide connectivity to two USB 1.1 or two USB 2.0
ports. Each USB connector can support two USB devices. Additional external USB ports
are found on the rear panel. The USB ports are used for I/O bus expansion.
Page 55
WAFER-CX700M 3.5" SBC
Figure 4-20: USB Connector Pinout Locations
PIN NO. DESCRIPTION
PIN NO.
DESCRIPTION
1
VCC
2
GND
3
DATA-
4
DATA+
5
DATA+
6
DATA-
7
GND
8
VCC
Table 4-20: USB Port Connector Pinouts
4.3 External Peripheral Interface Connector Panel
Figure 4-21 shows the WAFER-CX700M external peripheral interface connector (EPIC)
panel. The WAFER-CX700M EPIC panel consists of the following:
2 x RJ-45 LAN connectors
1 x PS/2 connector
1 x Serial port connector
1 x VGA connector
Page 56
WAFER-CX700M 3.5" SBC
Figure 4-21: WAFER-CX700M External Peripheral Interface Connector
4.3.1 LAN Connectors
CN Label:
LAN1 and LAN2
CN Type:
RJ-45
CN Location:
See Figure 4-21
CN Pinouts:
See Table 4-21
The WAFER-CX700M is equipped with two built-in RJ-45 Ethernet controllers. The
controllers can connect to the LAN through two RJ-45 LAN connectors. There are two
LEDs on the connector indicating the status of LAN. The pin assignments are listed in the
following table:
PIN
DESCRIPTION
PIN
DESCRIPTION
1
TXA+
5
TXC-
2
TXA-
6
TXB-
3
TXB+
7
TXD+
4
TXC+
8
TXD-
Table 4-21: LAN Pinouts
Figure 4-22: RJ-45 Ethernet Connector
Page 57
WAFER-CX700M 3.5" SBC
The RJ-45 Ethernet connector has two status LEDs, one green and one yellow. The green
LED indicates activity on the port and the yellow LED indicates the port is linked. See
Table 4-22.
STATUS
DESCRIPTION
STATUS
DESCRIPTION
GREEN
Activity
YELLOW
Linked
Table 4-22: RJ-45 Ethernet Connector LEDs
4.3.2 Keyboard/Mouse Connector
CN Label:
CN16
CN Type:
PS/2
CN Location:
See Figure 4-21
CN Pinouts:
See Table 4-23
The keyboard and mouse connector is a standard PS/2 connector.
Figure 4-23: PS/2 Pinout and Configuration
PIN
DESCRIPTION
1
KB DATA
2
MS DATA
3
GND
4
VCC
5
KB CLOCK
6
MS CLOCK
Table 4-23: Keyboard Connector Pinouts
Page 58
WAFER-CX700M 3.5" SBC
4.3.3 Serial Port Connectors
CN Label:
CN16
CN Type:
DB-9 connectors
CN Location:
See Figure 4-21
CN Pinouts:
See Table 4-24 and Figure 4-24
The 9-pin DB-9 CN16 serial port connector is connected to RS-232 serial communications
devices.
PIN NO. DESCRIPTION
PIN NO.
DESCRIPTION
1
DCD
6
DSR
2
RX
7
RTS
3
TX
8
CTS
4
DTR
9
RI
5
GND
Table 4-24: RS-232 Serial Port (COM 1) Pinouts
Figure 4-24: COM1 Pinout Locations
4.3.4 VGA Connector
CN Label:
VGA1
CN Type:
15-pin Female
CN Location:
See Figure 4-21
CN Pinouts:
See Figure 4-25 and Table 4-25
Page 59
WAFER-CX700M 3.5" SBC
The WAFER-CX700M has a single 15-pin female connector for connectivity to standard
display devices.
Figure 4-25: VGA Connector
PIN
DESCRIPTION
PIN
DESCRIPTION
1
RED
2
GREEN
3
BLUE
4
NC
5
GND
6
GND
7
GND
8
GND
9
VCC / NC
10
GND
11
NC
12
DDC DAT
13
HSYNC
14
VSYNC
15
DDCCLK
Table 4-25: VGA Connector Pinouts
Page 60
WAFER-CX700M 3.5" SBC
Chapter
5
5 Installation
Page 61
WAFER-CX700M 3.5" SBC
5.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the
WAFER-CX700M
may
result
in
permanent
damage
to
the
WAFER-CX700M and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-CX700M. Dry climates are particularly susceptible to ESD. It is
therefore critical that whenever the WAFER-CX700M or any other electronic component is
handled, the following anti-static precautions are strictly adhered to:
Wear and anti-static wristband: - Wearing a simple anti-static wristband can
help to prevent ESD from damaging the WAFER-CX700M.
Self-grounding: - Before handling the WAFER-CX700M touch any grounded
conducting material. During the time of handling, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: - When configuring the WAFER-CX700M, place it on
an anti-static pad. This reduces the possibility of ESD damaging the
WAFER-CX700M.
Only handle the PCB by the edges: - When handling the PCB, hold the PCB
by it’s edges.
Page 62
WAFER-CX700M 3.5" SBC
5.2 Installation Considerations
NOTE:
The following installation notices and installation considerations should
be read and understood before the WAFER-CX700M in installed. All
installation notices pertaining to the installation of the WAFER-CX700M
should be strictly adhered to. Failing to adhere to these precautions
may lead to severe damage of the WAFER-CX700M and injury to the
person installing the motherboard.
5.2.1 Installation Notices
WARNING:
The installation instructions described in this manual should be
carefully followed in order to prevent damage to the WAFER-CX700M
and its accessories, and prevent injury to the user.
Before and during the installation please DO the following:
Read the user manual:
o
The user manual provides a complete description of the
WAFER-CX700M installation instructions and configuration options.
Wear an electrostatic discharge cuff (ESD):
o
Electronic components are easily damaged by ESD. Wearing an ESD cuff
removes ESD from the body and helps prevent ESD damage.
Place the WAFER-CX700M on an antistatic pad:
o
When installing or configuring the motherboard, place it on an antistatic
pad. This helps to prevent potential ESD damage.
Turn all power to the WAFER-CX700M off:
Page 63
WAFER-CX700M 3.5" SBC
o
When working with the WAFER-CX700M, make sure that it is
disconnected from all power supplies and that no electricity is being fed
into the system.
Before and during the installation of the WAFER-CX700M DO NOT do the following:
DO NOT remove any of the stickers on the PCB board. These stickers are
required for warranty validation.
DO NOT use the product before verifying all the cables and power connectors
are properly connected.
DO NOT allow screws to come in contact with the PCB circuit, connector pins,
or its components.
5.2.2 Installation Checklist
The following checklist is provided to ensure the WAFER-CX700M is properly installed.
All the items in the packing list are present
The CPU is installed
The CPU cooling kit is properly installed
A compatible memory module is properly inserted into the slot
The jumpers have been properly configured
The WAFER-CX700M is inserted into a chassis with adequate ventilation
The correct power supply is being used
The following devices are properly connected
o
o
o
o
o
o
o
o
Primary and secondary IDE device
SATA drives
Keyboard and mouse cable
Audio kit
Power supply
USB cable
Serial port cable
Parallel port cable
The following external peripheral devices are properly connected to the
chassis:
o
Page 64
DVI screen
WAFER-CX700M 3.5" SBC
o
o
o
Keyboard
Mouse
LAN
5.2.3 Airflow
WARNING:
Airflow is critical to the cooling of the CPU and other onboard
components. The chassis in which the WAFER-CX700M is installed
must have air vents to allow cool air into the system and hot air to move
out.
The WAFER-CX700M must be installed in a chassis with ventilation holes on the sides
allowing airflow to travel through the heat sink surface. In a system with an individual
power supply unit, the cooling fan of a power supply can also help generate airflow
through the board surface.
5.3 Unpacking Precautions
When the WAFER-CX700M is unpacked, please do the following:
Follow the anti-static precautions outlined above.
Make sure the packing box is facing upwards so the WAFER-CX700M does
not fall out of the box.
Make sure all the components in the checklist shown in Chapter 3 are
present.
Page 65
WAFER-CX700M 3.5" SBC
NOTE:
If some of the components listed in the checklist in Chapter 3 are
missing, please do not proceed with the installation. Contact the IEI
reseller or vendor you purchased the WAFER-CX700M from or contact
an IEI sales representative directly. To contact an IEI sales
representative, please send an email to [email protected].
5.4 Cooling Kit and DIMM Installation
WARNING:
A CPU should never be turned on without the specified cooling kit
being installed. If the cooling kit (heat sink and fan) is not properly
installed and the system turned on, permanent damage to the CPU,
WAFER-CX700M and other electronic components attached to the
system may be incurred. Running a CPU without a cooling kit may also
result in injury to the user.
The CPU, CPU cooling kit and DIMM are the most critical components of the
WAFER-CX700M. If one of these component is not installed the WAFER-CX700M cannot
run.
5.4.1 Cooling Kit Installation
The WAFER-CX700M comes with a cooling kit preinstalled. The cooling kit is attached to
the WAFER-CX700M with three screws. The cooling fan is attached to the heatsink with
two metal clips. Three wires attach the cooling fan to the cooling fan power connector on
the board. The cooling kit is custom designed for the WAFER-CX700M and should not be
replaced with an alternate cooling kit.
Page 66
WAFER-CX700M 3.5" SBC
5.4.2 SO-DIMM Installation
WARNING:
Using incorrectly specified SO-DIMM may cause permanent damage to
the WAFER-CX700M. Please make sure the purchased SO-DIMM
complies with the memory specifications of the WAFER-CX700M.
SO-DIMM specifications compliant with the WAFER-CX700M are listed
in Chapter 2.
To install a SO-DIMM into a SO-DIMM socket, please follow the steps below and refer to
Figure 5-1.
Figure 5-1: SO-DIMM Installation
Step 1: Locate the SO-DIMM socket. Place the WAFER-CX700M on an anti-static pad
with the solder side facing up.
Step 2: Align the SO-DIMM with the socket. The SO-DIMM must be oriented in such a
way that the notch in the middle of the SO-DIMM must be aligned with the
plastic bridge in the socket.
Step 3: Insert the SO-DIMM. Push the SO-DIMM chip into the socket at an angle. (See
Figure 5-1)
Step 4: Open the SO-DIMM socket arms. Gently pull the arms of the SO-DIMM socket
out and push the rear of the SO-DIMM down. (See Figure 5-1)
Page 67
WAFER-CX700M 3.5" SBC
Step 5: Secure the SO-DIMM. Release the arms on the SO-DIMM socket. They clip into
place and secure the SO-DIMM in the socket.Step 0:
5.4.3 CF Card Installation
NOTE:
The WAFER-CX700M can support both CF Type I cards and CF Type
II cards. For the complete specifications of the supported CF cards
please refer to Chapter 2.
To install the a CF card (Type 1 or Type 2) onto the WAFER-CX700M, please follow the
steps below:
Step 1: Locate the CF card socket. Place the WAFER-CX700M on an anti-static pad
with the solder side facing up. Locate the CF card slot.
Step 2: Align the CF card. Make sure the CF card is properly aligned with the CF cards
slot.
Step 3: Insert the CF card. Gently insert the CF card into the socket making sure the
socket pins are properly inserted into the socket. See Figure 5-2. Step 0:
Page 68
WAFER-CX700M 3.5" SBC
Figure 5-2: CF Card Installation
5.5 Jumper Settings
NOTE:
A jumper is a metal bridge used to close an
electrical circuit. It consists of two or three metal
pins and a small metal clip (often protected by a
plastic cover) that slides over the pins to connect
them. To CLOSE/SHORT a jumper means
connecting the pins of the jumper with the plastic
clip and to OPEN a jumper means removing the
plastic clip from a jumper.
Figure 5-3: Jumper Locations
Before the WAFER-CX700M is installed in the system, the jumpers must be set in
accordance with the desired configuration. The jumpers on the WAFER-CX700M are
listed below.
Page 69
WAFER-CX700M 3.5" SBC
Description
Label
Type
AT/ATX power selection
CN4 (pins 7 & 8)
2-pin header
Clear CMOS
JP1
2-pin header
LVDS voltage selection
JP2
3-pin header
RS-232/422/485 selector switch
SW1
10 switch selector
Table 5-1: Jumpers
5.5.1 AT/ATX Power Supply Selector
Jumper Label:
CN4 (pins 7 & 8)
Jumper Type:
2-pin header
Jumper Settings:
See Table 5-2
Jumper Location:
See Figure 5-4
The AT/ATX Power Supply Selector switch chooses whether an AT or ATX power supply
is used. ATX power supplies allow the motherboard to turn the computer off and offer
power management features. AT power supplies are turned off directly at the power
source Table 5-2.
AT/ATX Power Selector
Description
Open
ATX power supply
Short 7 – 8
AT power supply
Default
Table 5-2: AT/ATX Power Supply Selector Settings
The AT/ATX Power Supply Selector jumper location is shown in Figure 5-4 below.
Page 70
WAFER-CX700M 3.5" SBC
Figure 5-4: AT/ATX Power Supply Selector Location
5.5.2 Clear CMOS Jumper
Jumper Label:
JP1
Jumper Type:
3-pin header
Jumper Settings:
See Table 5-3
Jumper Location:
See Figure 5-5
If the WAFER-CX700M fails to boot due to improper BIOS settings, the clear CMOS
jumper clears the CMOS data and resets the system BIOS information. To do this, use the
jumper cap to close pins 2 and 3 for a few seconds then reinstall the jumper clip back to
pins 1 and 2.
If the “CMOS Settings Wrong” message is displayed during the boot up process, the fault
may be corrected by pressing the F1 to enter the CMOS Setup menu. Do one of the
following:
Enter the correct CMOS setting
Load Optimal Defaults
Load Failsafe Defaults.
After having done one of the above, save the changes and exit the CMOS Setup menu.
The clear CMOS jumper settings are shown in Table 5-3.
Page 71
WAFER-CX700M 3.5" SBC
AT Power Select
Description
Short 1 - 2
Keep CMOS Setup
Short 2 - 3
Clear CMOS Setup
Default
Table 5-3: Clear CMOS Jumper Settings
The location of the clear CMOS jumper is shown in Figure 5-5 below.
Figure 5-5: Clear CMOS Jumper
5.5.3 LVDS Voltage Selection
WARNING:
Permanent damage to the screen and WAFER-CX700M may occur if the
wrong voltage is selected with this jumper. Please refer to the user guide
that cam with the monitor to select the correct voltage.
Jumper Label:
JP2
Jumper Type:
3-pin header
Jumper Settings:
See Table 5-4
Jumper Location:
See Figure 5-6
Page 72
WAFER-CX700M 3.5" SBC
The LVDS Voltage Selection jumper allows the LVDS screen voltage to be set. The
LVDS Voltage Selection jumper settings are shown in Table 5-4.
LVDS Voltage Select
Description
Short 1-2
+3.3V LVDS
Short 2-3
+5V LVDS
Default
Table 5-4: LVDS Voltage Selection Jumper Settings
The LVDS Voltage Selection jumper location is shown in Figure 5-6.
Figure 5-6: LVDS Voltage Selection Jumper Pinout Locations
5.5.4 RS-232/422/485 Selection Switch
Jumper Label:
SW1
Jumper Type:
10-switch selector
Jumper Settings:
See Table 5-4
Jumper Location:
See Figure 5-6
The RS-232/422/485 Selection Switch allows the function of COM2 to be set. The
RS-232/422/485 Selection Jumper settings are shown in Table 5-4.
SW1
1
2
3
4
5
6
7
8
9
10
RS-232
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
RS-422
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
Page 73
WAFER-CX700M 3.5" SBC
SW1
1
2
3
4
5
6
7
8
9
10
RS-485
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
Table 5-5: RS-232/422/485 Selection Jumper Settings
The RS-232/422/485 Selection Jumper location is shown in Figure 5-6.
Figure 5-7: RS-232/422/485 Selection Jumper
5.6 Internal Peripheral Device Connections
The cables listed in Table 5-6 are shipped with the WAFER-CX700M.
Quantity
Type
1
Audio cable
1
IDE cable (44-pin)
1
Keyboard/Mouse Y-cable
3
RS-232 cable
2
SATA drive cable
1
SATA drive power cable
2
USB cable
Table 5-6: IEI Provided Cables
Page 74
WAFER-CX700M 3.5" SBC
5.6.1 Audio Cable Installation
The Audio Kit that came with the WAFER-CX700M connects to the 10-pin audio
connector on the WAFER-CX700M. The audio kit consists of three audio jacks. One audio
jack, Mic In, connects to a microphone. The remaining two audio jacks, Line-In and
Line-Out, connect to two speakers. To install the audio kit, please refer to the steps below:
Step 1: Locate the audio connector. The location of the 10-pin audio connector is
shown in Chapter 3.
Step 2: Align pin 1. Align pin 1 on the on-board connector with pin 1 on the audio kit
connector. Pin 1 on the audio kit connector is indicated with a white dot. See
Figure 5-8.
Figure 5-8: Audio Cable Connection
Step 3: Connect the audio devices. Connect one speaker to the line-in audio jack, one
speaker to the line-out audio jack and a microphone to the mic-in audio jack.Step0:
5.6.2 HDD Cable Connection
The 44-pin flat IDE cable connects the WAFER-CX700M to an IDE device. To connect an
IDE HDD to the WAFER-CX700M please follow the instructions below.
Page 75
WAFER-CX700M 3.5" SBC
Step 1: Locate the IDE connector. The location/s of the IDE device connector/s is/are
shown in Chapter 3.
Step 2: Insert the connector. Connect the IDE cable connector to the on-board
connector. See Figure 5-9. A key on the front of the cable connector ensures it
can only be inserted in one direction.
Figure 5-9: IDE Cable Connection
Step 3: Connect the cable to an IDE device. Connect the two connectors on the other
side of the cable to one or two IDE devices. Make sure that pin 1 on the cable
corresponds to pin 1 on the connector.Step0:
5.6.3 Serial Port Cable Connection
The RS-232/422/485 cable consists of a D-sub 9-pin male connector attached to a single
board connector. To install the RS-232/422/485 cable, please follow the steps below.
Step 1: Locate the connectors. The locations of the RS-232 connectors are shown in
Chapter 3.
Page 76
WAFER-CX700M 3.5" SBC
Step 2: Insert the cable connectors. Insert one connector into each serial port box
headers. A key on the front of the cable connectors ensures the connector can
only be installed in one direction.
Figure 5-10: Single RS-232 Cable Installation
Step 3: Secure the connectors. Both single RS-232 connectors have two retention
screws that must be secured to a chassis or bracket.
Step 4: Connect the serial device. Once the single RS-232 connectors are connected
to a chassis or bracket, a serial communications device can be connected to the
system.Step0:
5.6.4 SATA Drive Connection
The WAFER-CX700M is shipped with two SATA drive cables and one SATA drive power
cable. To connect the SATA drives to the connectors, please follow the steps below.
Step 1: Locate the connectors. The locations of the SATA drive connectors are shown
in Chapter 3.
Page 77
WAFER-CX700M 3.5" SBC
Step 2: Insert the cable connector. Press the clip on the connector at the end of the
SATA cable and insert the cable connector into the onboard SATA drive
connector. See Figure 5-11.
Figure 5-11: SATA Drive Cable Connection
Step 3: Connect the cable to the SATA disk. Connect the connector on the other end
of the cable to the connector at the back of the SATA drive. See Figure 5-12.
Step 4: Connect the SATA power cable. Connect the SATA power connector to the
back of the SATA drive.Step0:
Page 78
WAFER-CX700M 3.5" SBC
Figure 5-12: SATA Power Drive Connection
5.6.5 USB Cable (Dual Port without Bracket)
The WAFER-CX700M is shipped with a dual port USB 2.0 cable. To connect the USB
cable connector, please follow the steps below.
Step 1: Locate the connectors. The locations of the USB connectors are shown in
Chapter 3.
WARNING:
If the USB pins are not properly aligned, the USB device can burn out.
Step 2: Align the connectors. The cable has two connectors. Correctly align pin 1on
each cable connector with pin 1 on the WAFER-CX700M USB connector.
Page 79
WAFER-CX700M 3.5" SBC
Step 3: Insert the cable connectors. Once the cable connectors are properly aligned
with the USB connectors on the WAFER-CX700M, connect the cable
connectors to the on-board connectors. See Figure 5-13.
Figure 5-13: Dual USB Cable Connection
Step 4: Attach the USB connectors to the chassis. The USB 2.0 connectors each of
two retention screw holes. To secure the connectors to the chassis please refer
to the installation instructions that came with the chassis.Step0:
5.7 External Peripheral Interface Connection
The following external peripheral devices can be connected to the external peripheral
interface connectors.
RJ-45 Ethernet cable connectors
USB devices
VGA monitors
To install these devices, connect the corresponding cable connector from the actual
device to the corresponding WAFER-CX700M external peripheral interface connector
making sure the pins are properly aligned.
Page 80
WAFER-CX700M 3.5" SBC
5.7.1 Keyboard/Mouse Y-Cable Connection
The WAFER-CX700M has a PS/2 connector on the external peripheral interface panel.
The dual PS/2 connector is connected to the PS/2 Y-cable that came with the
WAFER-CX700M. One of the PS/2 cables is connected to a keyboard and the other to a
mouse to the system. Follow the steps below to connect a keyboard and mouse to the
WAFER-CX700M.
Step 1: Locate the dual PS/2 connector. The location of the PS/2 connector is shown
in Chapter 3.
Step 2: Insert the keyboard/mouse connector. Insert the PS/2 connector on the end
of the PS/2 y-cable into the external PS/2 connector. See Figure 5-14.
Figure 5-14: PS/2 Keyboard/Mouse Connector
Step 3: Connect the keyboard and mouse. Connect the keyboard and mouse to the
appropriate connector. The keyboard and mouse connectors can be
distinguished from each other by looking at the small graphic at the top of the
connector.Step0:
Page 81
WAFER-CX700M 3.5" SBC
5.7.2 LAN Connection
There are two external RJ-45 LAN connectors. The RJ-45 connectors enable connection
to an external network. To connect a LAN cable with an RJ-45 connector, please follow
the instructions below.
Step 1: Locate the RJ-45 connectors. The locations of the USB connectors are shown
in Chapter 4.
Step 2: Align the connectors. Align the RJ-45 connector on the LAN cable with one of
the RJ-45 connectors on the WAFER-CX700M. See Figure 5-15.
Figure 5-15: LAN Connection
Step 3: Insert the LAN cable RJ-45 connector. Once aligned, gently insert the LAN
cable RJ-45 connector into the onboard RJ-45 connector.Step0:
5.7.3 Serial Device Connection
The WAFER-CX700M has a single female DB-9 connector on the external peripheral
interface panel for a serial device. Follow the steps below to connect a serial device to the
WAFER-CX700M.
Page 82
WAFER-CX700M 3.5" SBC
Step 1: Locate the DB-9 connector. The location of the DB-9 connector is shown in
Chapter 3.
Step 2: Insert the serial connector. Insert the DB-9 connector of a serial device into
the DB-9 connector on the external peripheral interface. See Figure 5-16.
Figure 5-16: Serial Device Connector
Step 3: Secure the connector. Secure the serial device connector to the external
interface by tightening the two retention screws on either side of the connector.Step0:
5.7.4 VGA Monitor Connection
The WAFER-CX700M has a single female DB-15 connector on the external peripheral
interface panel. The DB-15 connector is connected to a CRT or VGA monitor. To connect
a monitor to the WAFER-CX700M, please follow the instructions below.
Step 1: Locate the female DB-15 connector. The location of the female DB-15
connector is shown in Chapter 3.
Page 83
WAFER-CX700M 3.5" SBC
Step 2: Align the VGA connector. Align the male DB-15 connector on the VGA screen
cable with the female DB-15 connector on the external peripheral interface.
Step 3: Insert the VGA connector. Once the connectors are properly aligned with the
insert the male connector from the VGA screen into the female connector on the
WAFER-CX700M. See Figure 5-17.
Figure 5-17: VGA Connector
Step 4: Secure the connector. Secure the DB-15 VGA connector from the VGA
monitor to the external interface by tightening the two retention screws on either
side of the connector. Step 0:
Page 84
WAFER-CX700M 3.5" SBC
Chapter
6
6 BIOS Setup
Page 85
WAFER-CX700M 3.5" SBC
6.1 Introduction
A licensed copy of AMI BIOS is preprogrammed into the ROM BIOS. The BIOS setup
program allows users to modify the basic system configuration. This chapter describes
how to access the BIOS setup program and the configuration options that may be
changed.
6.1.1 Starting Setup
The AMI BIOS is activated when the computer is turned on. The setup program can be
activated in one of two ways.
1. Press the DELETE key as soon as the system is turned on or
2. Press the DELETE key when the “Press Del to enter SETUP”
message appears on the screen. 0.
If the message disappears before the DELETE key is pressed, restart the computer and try
again.
6.1.2 Using Setup
Use the arrow keys to highlight items, press ENTER to select, use the PageUp and
PageDown keys to change entries, press F1 for help and press ESC to quit. Navigation
keys are shown in.
Key
Function
Up arrow
Move to previous item
Down arrow
Move to next item
Left arrow
Move to the item on the left hand side
Right arrow
Move to the item on the right hand side
Esc key
Main Menu – Quit and not save changes into CMOS
Status Page Setup Menu and Option Page Setup Menu -Exit current page and return to Main Menu
Page Up key
Increase the numeric value or make changes
Page Dn key
Decrease the numeric value or make changes
Page 86
WAFER-CX700M 3.5" SBC
Key
Function
F1 key
General help, only for Status Page Setup Menu and Option
Page Setup Menu
F2 /F3 key
Change color from total 16 colors. F2 to select color
forward.
F10 key
Save all the CMOS changes, only for Main Menu
Table 6-1: BIOS Navigation Keys
6.1.3 Getting Help
When F1 is pressed a small help window describing the appropriate keys to use and the
possible selections for the highlighted item appears. To exit the Help Window press ESC or
the F1 key again.
6.1.4 Unable to Reboot After Configuration Changes
If the computer cannot boot after changes to the system configuration is made, CMOS
defaults. Use the jumper described in Chapter 5.
6.1.5 BIOS Menu Bar
The menu bar on top of the BIOS screen has the following main items:
Main Changes the basic system configuration.
Advanced Changes the advanced system settings.
PCIPnP Changes the advanced PCI/PnP Settings
Boot Changes the system boot configuration.
Security Sets User and Supervisor Passwords.
Chipset Changes the chipset settings.
Exit Selects exit options and loads default settings
The following sections completely describe the configuration options found in the menu
items at the top of the BIOS screen and listed above.
Page 87
WAFER-CX700M 3.5" SBC
6.2 Main
The Main BIOS menu (BIOS Menu 1) appears when the BIOS Setup program is entered.
The Main menu gives an overview of the basic system information.
BIOS Menu 1: Main
System Overview
The System Overview lists a brief summary of different system components. The fields in
System Overview cannot be changed. The items shown in the system overview include:
AMI BIOS: Displays auto-detected BIOS information
o
o
o
Version: Current BIOS version
Build Date: Date the current BIOS version was made
ID: Installed BIOS ID
Processor: Displays auto-detected CPU specifications
Page 88
WAFER-CX700M 3.5" SBC
o
o
o
Type: Names the currently installed processor
Speed: Lists the processor speed
Count: The number of CPUs on the motherboard
System Memory: Displays the auto-detected system memory.
o
Size: Lists memory size
The System Overview field also has two user configurable fields:
System Time [xx:xx:xx]
Use the System Time option to set the system time. Manually enter the hours, minutes
and seconds.
System Date [xx/xx/xx]
Use the System Date option to set the system date. Manually enter the day, month and
year.
6.3 Advanced
Use the Advanced menu (BIOS Menu 2) to configure the CPU and peripheral devices
through the following sub-menus:
WARNING:
Setting the wrong values in the sections below may cause the system
to malfunction. Make sure that the settings made are compatible with
the hardware.
CPU Configuration ...................................................................90
IDE Configuration.....................................................................92
Super IO Configuration ............................................................98
ACPI Configuration ..................................................................101
APM Configuration ...................................................................102
Remote Access Configuration..................................................104
USB Configuration ...................................................................107
Page 89
WAFER-CX700M 3.5" SBC
BIOS Menu 2: Advanced
6.3.1 CPU Configuration
Use the CPU Configuration menu (BIOS Menu 3) to view detailed CPU specifications
and configure the CPU.
Page 90
WAFER-CX700M 3.5" SBC
BIOS Menu 3: CPU Configuration
The CPU Configuration menu (BIOS Menu 3) lists the following CPU details:
Manufacturer: Lists the name of the CPU manufacturer
Frequency: Lists the CPU processing speed
FSB Speed: Lists the FSB speed
Cache L1: Lists the CPU L1 cache size
Cache L2: Lists the CPU L2 cache size
CMPXCHG8B Instruction Support [Enabled]
Use the CMPXCHG8B Instruction Support option to enable or disable this instruction.
Intel® processors prior to the Pentium® Pro were vulnerable to a bug with this instruction.
The instruction compares the value of registers edx and adx with an 8-bit value in
memory. If a register smaller than 8-bit is used for the destination operand then the
Page 91
WAFER-CX700M 3.5" SBC
instruction results in an exception. When used in combination with the lock instruction
(used in multi-processor systems) the exception handler is never called, the processor
stops servicing interrupts, and the system has to be rebooted to recover. Processors since
the Pentium® Pro have not been effected by this bug.
Enabled
DEFAULT
Disabled
The CMPXCHG8B instruction can be performed
The CMPXCHG8B instruction cannot be performed
6.3.2 IDE Configuration
Use the IDE Configuration menu (BIOS Menu 4) to change and/or set the configuration
of the IDE devices installed in the system.
BIOS Menu 4: IDE Configuration
Page 92
WAFER-CX700M 3.5" SBC
ATA/IDE Configurations [Compatible]
Use the ATA/IDE Configurations option to configure the ATA/IDE controller.
Disables the on-board ATA/IDE controller.
Disabled
Compatible
Configures the on-board ATA/IDE controller to be in
DEFAULT
compatible mode. In this mode, a SATA channel will
replace one of the IDE channels. This mode supports up
to 4 storage devices.
Configures the on-board ATA/IDE controller to be in
Enhanced
Enhanced mode. In this mode, IDE channels and SATA
channels are separated. This mode supports up to 6
storage devices. Some legacy OS do not support this
mode.
Legacy IDE Channels [SATA Pri, PATA Sec]
SATA Only
SATA Pri., PATA Sec
DEFAULT
PATA Only
IDE Master and IDE Slave
When entering setup, BIOS auto detects the presence of IDE devices. BIOS displays the
status of the auto detected IDE devices. The following IDE devices are detected and are
shown in the IDE Configuration menu:
Primary IDE Master
Primary IDE Slave
Secondary IDE Master
Secondary IDE Slave
The IDE Configuration menu (BIOS Menu 4) allows changes to the configurations for the
IDE devices installed in the system. If an IDE device is detected, and one of the above
listed four BIOS configuration options are selected, the IDE configuration options shown in
Section 6.3.2.1 appear.
Page 93
WAFER-CX700M 3.5" SBC
6.3.2.1 IDE Master, IDE Slave
Use the IDE Master and IDE Slave configuration menu to view both primary and
secondary IDE device details and configure the IDE devices connected to the system.
BIOS Menu 5: IDE Master and IDE Slave Configuration
Type [Auto]
Use the Type BIOS option select the type of device the AMIBIOS attempts to boot from
after the Power-On Self-Test (POST) is complete.
Not Installed
BIOS is prevented from searching for an IDE disk
drive on the specified channel.
Page 94
WAFER-CX700M 3.5" SBC
Auto
DEFAULT
The BIOS auto detects the IDE disk drive type
attached to the specified channel. This setting should
be used if an IDE hard disk drive is attached to the
specified channel.
The CD/DVD option specifies that an IDE CD-ROM
CD/DVD
drive is attached to the specified IDE channel. The
BIOS does not attempt to search for other types of
IDE disk drives on the specified channel.
This option specifies an ATAPI Removable Media
ARMD
Device. These include, but are not limited to:
ZIP
LS-120
LBA/Large Mode [Auto]
Use the LBA/Large Mode option to disable or enable BIOS to auto detects LBA (Logical
Block Addressing). LBA is a method of addressing data on a disk drive. In LBA mode, the
maximum drive capacity is 137 GB.
BIOS is prevented from using the LBA mode control on
Disabled
the specified channel.
Auto
DEFAULT
BIOS auto detects the LBA mode control on the specified
channel.
Block (Multi Sector Transfer) [Auto]
Use the Block (Multi Sector Transfer) to disable or enable BIOS to auto detect if the
device supports multi-sector transfers.
BIOS is prevented from using Multi-Sector Transfer on the
Disabled
specified channel. The data to and from the device occurs
one sector at a time.
Auto
DEFAULT
BIOS auto detects Multi-Sector Transfer support on the
Page 95
WAFER-CX700M 3.5" SBC
drive on the specified channel. If supported the data
transfer to and from the device occurs multiple sectors at
a time.
PIO Mode [Auto]
Use the PIO Mode option to select the IDE PIO (Programmable I/O) mode program timing
cycles between the IDE drive and the programmable IDE controller. As the PIO mode
increases, the cycle time decreases.
Auto
DEFAULT
BIOS auto detects the PIO mode. Use this value if the IDE disk
drive support cannot be determined.
0
PIO mode 0 selected with a maximum transfer rate of 3.3MBps
1
PIO mode 1 selected with a maximum transfer rate of 5.2MBps
2
PIO mode 2 selected with a maximum transfer rate of 8.3MBps
3
PIO mode 3 selected with a maximum transfer rate of 11.1MBps
4
PIO mode 4 selected with a maximum transfer rate of 16.6MBps
(This setting generally works with all hard disk drives
manufactured after 1999. For other disk drives, such as IDE
CD-ROM drives, check the specifications of the drive.)
DMA Mode [Auto]
Use the DMA Mode BIOS selection to adjust the DMA mode options.
Auto
DEFAULT
BIOS auto detects the DMA mode. Use this value if the IDE
disk drive support cannot be determined.
SWDMA0
Single Word DMA mode 0 selected with a maximum data
transfer rate of 2.1MBps
SWDMA1
Single Word DMA mode 1 selected with a maximum data
transfer rate of 4.2MBps
SWDMA2
Single Word DMA mode 2 selected with a maximum data
transfer rate of 8.3MBps
Page 96
WAFER-CX700M 3.5" SBC
Multi Word DMA mode 0 selected with a maximum data
MWDMA0
transfer rate of 4.2MBps
Multi Word DMA mode 1 selected with a maximum data
MWDMA1
transfer rate of 13.3MBps
Multi Word DMA mode 2 selected with a maximum data
MWDMA2
transfer rate of 16.6MBps
Ultra DMA mode 0 selected with a maximum data transfer
UDMA1
rate of 16.6MBps
Ultra DMA mode 1 selected with a maximum data transfer
UDMA1
rate of 25MBps
Ultra DMA mode 2 selected with a maximum data transfer
UDMA2
rate of 33.3MBps
Ultra DMA mode 3 selected with a maximum data transfer
UDMA3
rate of 44MBps (To use this mode, it is required that an
80-conductor ATA cable is used.)
Ultra DMA mode 4 selected with a maximum data transfer
UDMA4
rate of 66.6MBps (To use this mode, it is required that an
80-conductor ATA cable is used.)
Ultra DMA mode 5 selected with a maximum data transfer
UDMA5
rate of 99.9MBps (To use this mode, it is required that an
80-conductor ATA cable is used.)
S.M.A.R.T [Auto]
Use the S.M.A.R.T option to auto-detect, disable or enable Self-Monitoring Analysis and
Reporting Technology (SMART) on the drive on the specified channel. S.M.A.R.T predicts
impending drive failures. The S.M.A.R.T BIOS option enables or disables this function.
Auto
DEFAULT
BIOS auto detects HDD SMART support.
Disabled
Prevents BIOS from using the HDD SMART feature.
Enabled
Allows BIOS to use the HDD SMART feature
Page 97
WAFER-CX700M 3.5" SBC
32Bit Data Transfer [Enabled]
Use the 32Bit Data Transfer BIOS option to enables or disable 32-bit data transfers.
Prevents the BIOS from using 32-bit data transfers.
Disabled
Enabled
DEFAULT
Allows BIOS to use 32-bit data transfers on supported
hard disk drives.
6.3.3 Super IO Configuration
Use the Super IO Configuration menu (BIOS Menu 6) to set or change the
configurations for the parallel ports and serial ports.
BIOS Menu 6: Super IO Configuration
Page 98
WAFER-CX700M 3.5" SBC
Serial Port1 Address [3F8]
Use the Serial Port1 Address option to select the Serial Port 1 base address.
No base address is assigned to Serial Port 1
Disabled
3F8
DEFAULT
Serial Port 1 I/O port address is 3F8
3E8
Serial Port 1 I/O port address is 3E8
2E8
Serial Port 1 I/O port address is 2E8
Serial Port1 IRQ [4]
Use the Serial Port1 IRQ option to select the Serial Port 1 IRQ.
Disabled
No IRQ is assigned to Serial Port 1
3
Serial Port 1 interrupt address is IRQ4
4
DEFAULT
Serial Port 1 interrupt address is IRQ3
Serial Port2 Address [2F8]
Use the Serial Port2 Address option to select the Serial Port 2 base address.
No base address is assigned to Serial Port 2
Disabled
2F8
DEFAULT
Serial Port 2 I/O port address is 3F8
3E8
Serial Port 2 I/O port address is 3E8
2E8
Serial Port 2 I/O port address is 2E8
Serial Port2 IRQ [3]
Use the Serial Port2 IRQ option to select the Serial Port 2 IRQ.
No IRQ is assigned to Serial Port 2
Disabled
3
4
DEFAULT
Serial Port 2 interrupt address is IRQ3
Serial Port 2 interrupt address is IRQ4
Page 99
WAFER-CX700M 3.5" SBC
Serial Port3 Address [3E8]
Use the Serial Port3 Address option to select the base addresses for serial port 3
Disabled
No base address is assigned to serial port 3
3F8
Serial port 3 I/O port address is 3F8
2F8
Serial port 3 I/O port address is 2F8
3E8
DEFAULT
Serial port 3 I/O port address is 3E8
Serial port 3 I/O port address is 2E8
2E8
Serial Port3 IRQ [4]
Use the Serial Port3 IRQ option to select the interrupt address for serial port 3.
Serial port 3 IRQ address is 3
3
4
DEFAULT
Serial port 3 IRQ address is 4
Serial Port4 Address [2E8]
Use the Serial Port4 IRQ option to select the interrupt address for serial port 4.
Disabled
No base address is assigned to serial port 3
3F8
Serial port 4 I/O port address is 3F8
2F8
Serial port 4 I/O port address is 2F8
3E8
Serial port 4 I/O port address is 3E8
2E8
DEFAULT
Serial port 4 I/O port address is 2E8
Serial Port4 IRQ [3]
Use the Serial Port4 IRQ option to select the interrupt address for serial port 4.
3
4
Page 100
DEFAULT
Serial port 4 IRQ address is 3
Serial port 4 IRQ address is 4
WAFER-CX700M 3.5" SBC
6.3.4 ACPI Configuration
The ACPI Configuration menu (BIOS Menu 7) configures the Advanced Configuration
and Power Interface (ACPI) option.
BIOS Menu 7: ACPI Configuration [Advanced Power Configuration]
Suspend Mode [S1(POS)]
Use the Suspend Mode option to specify the sleep state the system enters when it is not
being used.
S1 (POS)
DEFAULT
The system enters S1(POS) sleep state. The system
appears off. The CPU is stopped; RAM is refreshed; the
system is running in a low power mode.
S3 (STR)
System appears off. The CPU has no power; RAM is in
Page 101
WAFER-CX700M 3.5" SBC
slow refresh; the power supply is in a reduced power
mode.
6.3.5 APM Configuration
The APM Configuration menu (BIOS Menu 8) allows the advanced power management
options to be configured.
BIOS Menu 8:Advanced Power Management Configuration
Power Supply Type [ATX]
Use the Power Supply Type BIOS to specify the kind of power supply used for the
system.
ATX
DEFAULT
An ATX power supply allows the system to be powered
up or shut down using the power button connectors on
Page 102
WAFER-CX700M 3.5" SBC
the motherboard. Other advanced power features are
also enabled.
Power is turned on/off directly by the power supply only.
AT
Power Button Mode [On/Off]
Use the Power Button Mode BIOS to specify how the power button functions.
On/Off
DEFAULT
When the power button is pressed the system is either
turned on or off
When the power button is pressed the system goes into
Suspend
suspend mode
Restore on AC Power Loss [Last State]
Use the Restore on AC Power Loss BIOS option to specify what state the system
returns to if there is a sudden loss of power to the system.
Power Off
The system remains turned off
Power On
The system turns on
Last State
DEFAULT
The system returns to its previous state. If it was on, it
turns itself on. If it was off, it remains off.
Resume on LAN/Ring [Disabled]
Use the Resume on LAN/Ring BIOS option to enable activity on the RI (ring in) modem
line or on the network to rouse the system from a suspend or standby state. That is, the
system will be roused by an incoming call on a modem or a special signal over the
network.
Disabled
DEFAULT
Wake event not generated by an incoming call, or
special network signal.
Enabled
Wake event generated by an incoming call or
network signal.
Page 103
WAFER-CX700M 3.5" SBC
Resume on PME# [Disabled]
Use the Resume on PME# BIOS option to enable activity on the PCI PME (power
management event) controller to rouse the system from a suspend or standby state.
Disabled
DEFAULT
Wake event not generated by PCI PME controller
activity
Wake event generated by PCI PME controller activity
Enabled
Resume On RTC Alarm [Disabled]
Use the Resume On RTC Alarm option to specify the time the system should be roused
from a suspended state.
Disabled
DEFAULT
The real time clock (RTC) cannot generate a wake
event
Enabled
If selected, the following appears with values that
can be selected:
RTC Alarm Date (Days)
RTC Alarm Time
After setting the alarm, the computer turns itself on
from a suspend state when the alarm goes off.
6.3.6 Remote Access Configuration
Use the Remote Access Configuration menu (BIOS Menu 9) to configure remote
access parameters. The Remote Access Configuration is an AMIBIOS feature and
allows a remote host running a terminal program to display and configure the BIOS
settings.
Page 104
WAFER-CX700M 3.5" SBC
BIOS Menu 9: Remote Access Configuration [Advanced]
Remote Access [Disabled]
Use the Remote Access option to enable or disable access to the remote functionalities
of the system.
Disabled
Enabled
DEFAULT
Remote access is disabled.
Remote access configuration options shown below
appear:
Serial Port Number
Serial Port Mode
Redirection after BIOS POST
Page 105
WAFER-CX700M 3.5" SBC
Terminal Type
These configuration options are discussed below.
Serial Port Number [COM1]
Use the Serial Port Number option allows users to select the serial port used for remote
access.
COM1
DEFAULT
System is remotely accessed through COM1
COM2
System is remotely accessed through COM2
COM3
System is remotely accessed through COM3
COM4
System is remotely accessed through COM4
COM5
System is remotely accessed through COM5
NOTE: Make sure the selected COM port is enabled through the Super I/O configuration
menu.
Base Address, IRQ [3F8h,4]
The Base Address, IRQ option cannot be configured and only shows the interrupt
address of the serial port listed above.
Serial Port Mode [115200 8,n,1]
Use the Serial Port Mode option to select baud rate through which the console redirection
is made. The following configuration options are available
115200 8,n,1 DEFAULT
57600 8,n,1
38400 8,n,1
19200 8,n,1
09600 8,n,1
Page 106
WAFER-CX700M 3.5" SBC
NOTE:
Identical baud rate setting musts be set on the host (a management
computer running a terminal software) and the slave
Redirection After BIOS POST [Always]
Use the Redirection After BIOS POST option to specify when console redirection should
occur.
Disabled
The console is not redirected after POST
Boot Loader
Redirection is active during POST and during Boot
Loader
Always
DEFAULT
Redirection is always active (Some OSes may not
work if set to Always)
Terminal Type [ANSI]
Use the Terminal Type BIOS option to specify the remote terminal type.
ANSI
DEFAULT
The target terminal type is ANSI
VT100
The target terminal type is VT100
VT-UTF8
The target terminal type is VT-UTF8
6.3.7 USB Configuration
Use the USB Configuration menu (BIOS Menu 10) to read USB configuration
information and configure the USB settings.
Page 107
WAFER-CX700M 3.5" SBC
BIOS Menu 10: USB Configuration
USB Configuration
The USB Configuration field shows the system USB configuration. The items listed are:
Module Version: x.xxxxx.xxxxx
USB Devices Enabled
The USB Devices Enabled field lists the USB devices that are enabled on the system
USB Function [Enabled]
Use the USB Function BIOS option to enable or disable the USB function.
Disabled
Page 108
USB function support disabled
WAFER-CX700M 3.5" SBC
2 USB Ports
2 USB ports are enabled
4 USB Ports
4 USB ports are enabled
6 USB Ports
DEFAULT
6 USB ports are enabled
USB2.0 Ports Enable [Enabled]
Use the USB2.0 Ports Enable option to enable and disable USB 2.0.
Enabled
DEFAULT
USB 2.0 is enabled
USB 2.0 is disabled
Disabled
Legacy USB Support [Enabled]
Use the Legacy USB Support BIOS option to enable USB mouse and USB keyboard
support.
Normally if this option is not enabled, any attached USB mouse or USB keyboard does not
become available until a USB compatible operating system is fully booted with all USB
drivers loaded. When this option is enabled, any attached USB mouse or USB keyboard
can control the system even when there is no USB driver loaded onto the system.
Legacy USB support disabled
Disabled
Enabled
DEFAULT
Legacy USB support enabled
Legacy USB support disabled if no USB devices are
Auto
connected
USB2.0 Controller Mode [HiSpeed]
Use the USB2.0 Controller Mode option to set the speed of the USB2.0 controller.
The controller is capable of operating at 12Mb/s
FullSpeed
HiSpeed
DEFAULT
The controller is capable of operating at 480Mb/s
Page 109
WAFER-CX700M 3.5" SBC
6.3.7.1 USB Mass Storage Device Configuration
Use the USB Mass Storage Device Configuration menu (BIOS Menu 11) to configure
USB mass storage class devices.
BIOS Menu 11: USB Mass Storage Device Configuration
USB Mass Storage Reset Delay [20 Sec]
Use the USB Mass Storage Reset Delay option to set the number of seconds POST
waits for the USB mass storage device after the start unit command.
POST waits 10 seconds for the USB mass storage
10 Sec
device after the start unit command.
20 Sec
DEFAULT
POST waits 20 seconds for the USB mass storage
device after the start unit command.
Page 110
WAFER-CX700M 3.5" SBC
POST waits 30 seconds for the USB mass storage
30 Sec
device after the start unit command.
POST waits 40 seconds for the USB mass storage
40 Sec
device after the start unit command.
Device ##
The Device## field lists the USB devices that are connected to the system.
Emulation Type [Auto]
Use the Emulation Type BIOS option to specify the type of emulation BIOS has to
provide for the USB device.
NOTE:
Please note that the device’s formatted type and the emulation type
provided by the BIOS must match for a device to boot properly. If both
types do not match then device’s behavior is undefined. To make sure both
types match, format the device using BIOS INT13h calls after selecting the
proper emulation option in BIOS setup. The FORMAT utility provided by
Microsoft® MS-DOS®, Microsoft® Windows® 95, and Microsoft®
Windows® 98 can be used for this purpose.
Auto
Floppy
DEFAULT
BIOS auto-detects the current USB.
The USB device will be emulated as a floppy drive.
The device can be either A: or B: responding to
INT13h calls that return DL = 0 or DL = 1
respectively.
Forced FDD
Allows a hard disk image to be connected as a
floppy image. This option works only for drives
formatted with FAT12, FAT16 or FAT32.
Hard Disk
Allows the USB device to be emulated as hard disk
Page 111
WAFER-CX700M 3.5" SBC
responding to INT13h calls that return DL values of
80h or above.
CDROM
Assumes the CD-ROM is formatted as bootable
media. All the devices that support block sizes
greater than 512 bytes can only be booted using this
option.
6.4 PCI/PnP
Use the PCI/PnP menu (BIOS Menu 12) to configure advanced PCI and PnP settings.
WARNING!
Setting wrong values for the BIOS selections in the PCIPnP BIOS menu
may cause the system to malfunction.
Page 112
WAFER-CX700M 3.5" SBC
BIOS Menu 12: PCI/PnP Configuration
IRQ#
Use the IRQ# address to specify what IRQs can be assigned to a particular peripheral
device.
Available
The specified IRQ is available to be used by
PCI/PnP devices
Reserved
The specified IRQ is reserved for use by Legacy ISA
devices
Available IRQ addresses options are:
IRQ3
IRQ4
Page 113
WAFER-CX700M 3.5" SBC
IRQ5
IRQ7
IRQ9
IRQ10
IRQ 11
IRQ 14
IRQ 15
DMA Channel# [Available]
Use the DMA Channel# option to assign a specific DMA channel to a particular PCI/PnP
device.
Available
DEFAULT
The specified DMA is available to be used by
PCI/PnP devices
The specified DMA is reserved for use by Legacy
Reserved
ISA devices
Available DMA Channels are:
DM Channel 0
DM Channel 1
DM Channel 3
DM Channel 5
DM Channel 6
DM Channel 7
Reserved Memory Size [Disabled]
Use the Reserved Memory Size BIOS option to specify the amount of memory that
should be reserved for legacy ISA devices.
Disabled
Page 114
DEFAULT
No memory block reserved for legacy ISA devices
16K
16KB reserved for legacy ISA devices
32K
32KB reserved for legacy ISA devices
WAFER-CX700M 3.5" SBC
64K
54KB reserved for legacy ISA devices
6.5 Boot
Use the Boot menu (BIOS Menu 13) to configure system boot options.
BIOS Menu 13: Boot
6.5.1 Boot Settings Configuration
Use the Boot Settings Configuration menu (BIOS Menu 14) to configure advanced
system boot options.
Page 115
WAFER-CX700M 3.5" SBC
BIOS Menu 14: Boot Settings Configuration
Quick Boot [Enabled]
Use the Quick Boot BIOS option to make the computer speed up the boot process.
No POST procedures are skipped
Disabled
Enabled
DEFAULT
Some POST procedures are skipped to decrease
the system boot time
Quiet Boot [Disabled]
Use the Quiet Boot BIOS option to select the screen display when the system boots.
Disabled
Enabled
Page 116
DEFAULT
Normal POST messages displayed
OEM Logo displayed instead of POST messages
WAFER-CX700M 3.5" SBC
AddOn ROM Display Mode [Force BIOS]
Use the AddOn ROM Display Mode option to allow add-on ROM (read-only memory)
messages to be displayed.
Force BIOS
DEFAULT
The system forces third party BIOS to display
during system boot.
The system displays normal information during
Keep Current
system boot.
Bootup Num-Lock [On]
Use the Bootup Num-Lock BIOS option to specify if the number lock setting must be
modified during boot up.
Does not enable the keyboard Number Lock automatically. To
Off
use the 10-keys on the keyboard, press the Number Lock key
located on the upper left-hand corner of the 10-key pad. The
Number Lock LED on the keyboard lights up when the Number
Lock is engaged.
On
DEFAULT
Allows the Number Lock on the keyboard to be enabled
automatically when the computer system boots up. This allows
the immediate use of the 10-key numeric keypad located on
the right side of the keyboard. To confirm this, the Number
Lock LED light on the keyboard is lit.
PXE Remote Boot [Disabled]
Use the PXE Remote Boot option to enable the system to be rebooted and restarted over
the network.
Disabled
Enabled
DEFAULT
The system cannot be booted over the network
The system can be rebooted and started over the
network
Page 117
WAFER-CX700M 3.5" SBC
LAN Function [LAN1+LAN2]
The LAN Function option allows the LAN ports on the board to be disabled or enabled.
Lan1+Lan2
DEFAULT
Both LAN ports are enabled
Both LAN ports are disabled
Disabled
Spread Spectrum Function [Disabled]
The Spread Spectrum Mode option can help to improve CPU EMI issues.
The spread spectrum mode is disabled
Disabled
Enabled
Page 118
DEFAULT
The spread spectrum mode is enabled
WAFER-CX700M 3.5" SBC
6.5.2 Boot Device Priority
Use the Boot Device Priority menu (BIOS Menu 15) to specify the boot sequence from
the available devices. Possible boot devices may include:
USB
HDD
CD/DVD
BIOS Menu 15: Boot Device Priority Settings
6.5.3 Removable Drives
Use the Removable Drives menu (BIOS Menu 16) to specify the boot sequence of the
available USB devices. When the menu is opened, the USB devices connected to the
system are listed as shown below:
1st Drive
[1st USB]
Page 119
WAFER-CX700M 3.5" SBC
2nd Drive
[2nd USB]
NOTE:
Only the drives connected to the system are shown. For example, if only
one USB device is connected only “1st Drive” is listed.
The boot sequence from the available devices is selected. If the “1st Drive” option is
selected a list of available USB devices is shown. Select the first USB device the system
boots from. If the “1st Drive” is not used for booting this option may be disabled.
BIOS Menu 16: Removable Drives
6.6 Security
Use the Security menu (BIOS Menu 17) to set system and user passwords.
Page 120
WAFER-CX700M 3.5" SBC
BIOS Menu 17: Security
Change Supervisor Password
Use the Change Supervisor Password to set or change a supervisor password. The
default for this option is Not Installed. If a supervisor password must be installed, select
this field and enter the password. After the password has been added, Install appears
next to Change Supervisor Password.
Change User Password
Use the Change User Password to set or change a user password. The default for this
option is Not Installed. If a user password must be installed, select this field and enter the
password. After the password has been added, Install appears next to Change User
Password.
Page 121
WAFER-CX700M 3.5" SBC
Clear User Password
Use the Clear User Password to clear a user’s password. The default for this option is
Not Installed. If a user password must be cleared, use this option.
6.7 Chipset
Use the Chipset menu to access the Northbridge and Southbridge submenus.
WARNING!
Setting the wrong values for the Chipset BIOS selections in the Chipset
BIOS menu may cause the system to malfunction.
BIOS Menu 18: Chipset
Page 122
WAFER-CX700M 3.5" SBC
6.7.1 Northbridge Configuration
Use the Northbridge Chipset Configuration menu (BIOS Menu 19) to configure the
Northbridge chipset.
BIOS Menu 19:Northbridge Chipset Configuration
DRAM Frequency [Auto]
Use the DRAM Frequency option to specify the DRAM frequency or allow the system to
automatically detect the DRAM frequency.
Auto
DEFAULT
Automatically selects the DRAM frequency
200MHz
Sets the DRAM frequency to 200MHz
266MHz
Sets the DRAM frequency to 266MHz
Page 123
WAFER-CX700M 3.5" SBC
333MHz
Sets the DRAM frequency to 333MHz
400MHz
Sets the DRAM frequency to 400MHz
533MHz
Sets the DRAM frequency to 533MHz
AGP Aperture Size [128MB]
Use the AGP Aperture Size option to select the size of the AGP aperture. The aperture is
a portion on the PCI memory address range dedicated for use as AGP memory address.
The following options are available.
32 MB
64 MB
128 MB
Default
256 MB
512 MB
1.0 GB
VGA Frame Buffer [64MB]
Use the VGA Frame Buffer option to specify the amount of system memory that can be
used by the Internal graphics device.
8 MB
16 MB
32 MB
64 MB
Default
128 MB
Select Display Device [CRT+DVI]
Use the Select Display Device BIOS feature to determine what displays are used. Dual
display functionality is enabled here. Dual display configuration options are listed below:
CRT
LCD
DVI
CRT + LCD
Page 124
WAFER-CX700M 3.5" SBC
CRT + DVI
DEFAULT
LCD + DVI
Flat Panel Type [1024x768 18b]
Use the Flat Panel Type option to select the type of flat panel connected to the system.
Configuration options are listed below.
00
640 x 480, 18-bit
01
800 x 600, 18-bit
02
DEFAULT
1024 x 768, 18-bit
04
1280 x 1024, 36-bit
08
800 x 480, 18-bit
10
1024 x 768, 24-bit
13
1280 x 1024, 48-bit
6.7.2 Southbridge Configuration
The Southbridge Configuration menu (BIOS Menu 20) allows the Southbridge chipset
to be configured.
Page 125
WAFER-CX700M 3.5" SBC
BIOS Menu 20:Southbridge Chipset Configuration
Serial ATA IDE Controller [IDE]
Use the Serial ATA IDE Controller BIOS option to set the mode for the SATA ports.
IDE
DEFAULT
Drives connected to the SATA ports are treated like IDE
drives, no RAID arrays can be created
RAID
A RAID array can be created using two hard drives
connected to the SATA ports
High Definition Audio [Auto]
Use the High Definition Audio option to enable the high definition audio controller. If the
HDA device has been connected to the system, this option should be enabled.
Page 126
WAFER-CX700M 3.5" SBC
Auto
DEFAULT
Disabled
The High Definition Audio is enabled automatically
The High Definition Audio is disabled
6.8 Exit
Use the Exit menu (BIOS Menu 21) to load default BIOS values, optimal failsafe values
and to save configuration changes.
BIOS Menu 21: Exit
Save Changes and Exit
Use the Save Changes and Exit option to save the changes made to the BIOS options
and to exit the BIOS configuration setup program.
Page 127
WAFER-CX700M 3.5" SBC
Discard Changes and Exit
Use the Discard Changes and Exit option to exit the BIOS configuration setup program
without saving the changes made to the system.
Discard Changes
Use the Discard Changes option to discard the changes and remain in the BIOS
configuration setup program.
Load Optimal Defaults
Use the Load Optimal Defaults option to load the optimal default values for each of the
parameters on the Setup menus. F9 key can be used for this operation.
Load Failsafe Defaults
Use the Load Failsafe Defaults option to load failsafe default values for each of the
parameters on the Setup menus. F8 key can be used for this operation.
Page 128
WAFER-CX700M 3.5" SBC
Chapter
7
7 Software Drivers
Page 129
WAFER-CX700M 3.5" SBC
NOTE:
The content of the CD may vary throughout the life cycle of the product
and is subject to change without prior notice. Visit the IEI website or
contact technical support for the latest updates.
The following drivers can be installed on the system:
Intel® chipset driver
VGA driver
LAN drivers
Audio driver
SATA driver
Intel® Active Management Technology (AMT) driver
Installation instructions are given below.
7.1 Driver CD Auto-run
All the drivers for the WAFER-CX700M are on the CD that came with the system. To
install the drivers, please follow the steps below.
Step 1: Insert the CD into a CD drive connected to the system.
NOTE:
If the system does not initiate the "autorun" program when the CD is
inserted, click the Start button, select Run, then type X:\autorun.exe
(where X:\ is the system CD drive) to access the IEI Driver CD main
menu.
Step 2: The driver main menu appears (Figure 7-1).
Page 130
WAFER-CX700M 3.5" SBC
Figure 7-1: Introduction Screen
Step 3: Click WAFER-CX700M.
Step 4: A new screen with a list of available drivers appears (Figure 7-2).
Figure 7-2: Available Drivers
Page 131
WAFER-CX700M 3.5" SBC
Step 5: Select the driver to install from the list in Figure 7-2. Detailed driver installation
instructions follow below. Step 0:
7.2 Chipset Driver Installation
The chipset driver installs drivers needed by the system chipset. To install the system
chipset drivers, follow the instructions below.
Step 1: Select “1-Chipset & Graphic“ in Figure 7-1.
Step 2: Double-click the directory of your operating system (in this case Windows).
Figure 7-3: Chipset and Graphics
Page 132
WAFER-CX700M 3.5" SBC
Step 3: Double-click “Chipset or Platform driver Drivers”.
Figure 7-4: Chipset or Platform Drivers
Step 4: Double-click “VIA_Hyperion Pro_v515A”.
Figure 7-5: VIA Hyperion
Page 133
WAFER-CX700M 3.5" SBC
Step 5: Double-click ”SETUP.EXE”.
Figure 7-6: Setup File
Step 6: Click NEXT in the Welcome screen to continue the installation.
Figure 7-7: VIA Hyperion Welcome Screen
Page 134
WAFER-CX700M 3.5" SBC
Step 7: Select “I Agree” then NEXT to continue installation.
Figure 7-8: License Agreement
Step 8: Make sure all the drivers are selected and click NEXT to continue.
Figure 7-9: Select Drivers
Page 135
WAFER-CX700M 3.5" SBC
Step 9: Click NEXT to start the driver installation. The installation will take a few
moments.
Figure 7-10: Start Driver Installation
Step 10: The driver installation report screen appears. This screen gives information on
whether or not the drivers were installed correctly. Click NEXT to continue.
Figure 7-11: Installation Complete
Page 136
WAFER-CX700M 3.5" SBC
Step 11: Click FINISH to complete the installation. Step0:
Figure 7-12: Finish Installation
7.3 Graphics Driver Installation
The graphics drivers are used by the system chipset for display functions. To install the
graphics drivers, follow the instructions below.
Step 1: Select “1-Chipset & Graphic“ in Figure 7-1.
Page 137
WAFER-CX700M 3.5" SBC
Step 2: Double-click the directory of your operating system (in this case Windows).
Figure 7-13: Chipset and Graphics
Step 3: Double-click “Integrated Graphics Drivers”.
Figure 7-14: Integrated Graphics Drivers
Page 138
WAFER-CX700M 3.5" SBC
Step 4: Double-click “22.00.02a”.
Figure 7-15: 22.00.02a Folder
Step 5: There are four options for installation. Below are the options for each installation.
1
Capture
Supports SAMM, TV Large Font. No rotation function.
2
NoSAMM
Supports TV Large Font. No SAMM and no rotation function.
3
nTVLargeFont
Normal TV Font. No SAMM and no rotation function.
4
rotation
Supports TV Large Font, SAMM and rotation.
Figure 7-16: Installation Type Selection
Page 139
WAFER-CX700M 3.5" SBC
Step 6: Double-click ”SETUP.EXE”.
Figure 7-17: Setup File
Step 7: The installation progresses automatically and the Installation Wizard
Complete windows appears when done. Click FINISH to finish the installation.
Figure 7-18: VIA Hyperion Welcome Screen
Step 8: After installation a small S3 icon will appear in the Windows taskbar at the
bottom right of the screen. Step0:
Page 140
WAFER-CX700M 3.5" SBC
Figure 7-19: S3 Taskbar Icon
7.4 Network Adapter Driver Installation
There is no automatic installation for the network adapter drivers. To install the network
adapter drivers, please follow the steps for manual driver installation below.
Step 1: Select START>>CONTROL PANEL.
Figure 7-20: Start Menu
Page 141
WAFER-CX700M 3.5" SBC
Step 2: Double-click the System icon in the Control Panel window.
Figure 7-21: Control Panel
Step 3: Select the Hardware tab. Click on DEVICE MANAGER.
Figure 7-22: System Properties
Page 142
WAFER-CX700M 3.5" SBC
Step 4: Under “Other Devices” devices without drivers are listed. Select the “Ethernet
Controller” then click the “Properties” icon to change the driver’s properties.
Figure 7-23: Device Manager
Step 5: In the “Ethernet Controller Properties” window, select the “General” tab the
click on REINSTALL DRIVER…
Figure 7-24: Ethernet Controller Properties Window
Page 143
WAFER-CX700M 3.5" SBC
Step 6: The “Hardware Update Wizard” appears. Select “No, not this time.” Click on
NEXT to continue the driver update process.
Figure 7-25: Hardware Update Wizard
Step 7: Select “Install from a list or specific location (Advanced)” Click NEXT to
continue.
Figure 7-26: Driver Location
Page 144
WAFER-CX700M 3.5" SBC
Step 8: Select “Don’t search. I will choose the driver to install.” Click NEXT to
continue.
Figure 7-27: Choose Audio Driver
Step 9: Select “Network Adapters” from the list. Click NEXT to continue.
Figure 7-28: Driver Selection
Page 145
WAFER-CX700M 3.5" SBC
Step 10: A list of available drivers appears. Don’t select any of these drivers. Click “Have
Disk” to select the correct driver file.
Figure 7-29: Default Network Drivers.
Step 11: Click the BROWSE button to select the correct driver from the installation CD.
Figure 7-30: Install From Disk
Page 146
WAFER-CX700M 3.5" SBC
Step 12: Select “D:\2-LAN\Realtek\RTL8110SC” where D: is the CD drive’s letter.
Figure 7-31: Driver File Directory
Step 13: Double-click the directory for your operating system (in this case Windows).
Figure 7-32: Select Operating System
Step 14: Double-click the WIN98_ME_2K_XP_XP64 folder.
Figure 7-33: Windows Folder
Page 147
WAFER-CX700M 3.5" SBC
Step 15: Double-click the PCI_InstallShield_5649_060919 folder.
Figure 7-34: InstallShield Folder
Step 16: Double-click the folder corresponding to your system’s operating system.
Figure 7-35: Operating System Folder
Step 17: Select the driver file and click OPEN to continue.
Figure 7-36: Driver File
Page 148
WAFER-CX700M 3.5" SBC
Step 18: Click OK.
Figure 7-37: Install From Disk
Step 19: Select the ” Realtek RTL8169/8110 Family Gigabit Ethernet NIC” driver. Click
NEXT to continue.
Figure 7-38: New Driver Found
Page 149
WAFER-CX700M 3.5" SBC
Step 20: Click FINISH to complete the Installation of the network adapter driver. Repeat
the same steps to install the drivers for the second network adapter. Step0:
Figure 7-39: Network Adapter Driver Installation Complete
7.5 Audio Driver Installation
To install the audio drivers, please follow the instructions below.
Step 1: Select “3-Audio“from the menu in Figure 7-1.
Page 150
WAFER-CX700M 3.5" SBC
Step 2: Double-click the VT1708A folder.
Figure 7-40: Audio Driver Folder
Step 3: Double-click the folder for your operating system (in this case, Windows).
Figure 7-41: Operating System Folder
Page 151
WAFER-CX700M 3.5" SBC
Step 4: Double-click the folder that corresponds to the specific version of your operating
system (in the figure, Windows XP).
Figure 7-42: Operating System Version
Step 5: Double-click 32-bit for a standard Windows XP install.
Figure 7-43: Select 32-bit or 64-bit
Page 152
WAFER-CX700M 3.5" SBC
Step 6: Double-click the HDA_V500b folder.
Figure 7-44: Audio Driver Folder
Step 7: Double-click SETUP.EXE to start to the InstallShield audio driver installation.
Figure 7-45: Audio Driver Setup File
Page 153
WAFER-CX700M 3.5" SBC
Step 8: The Audio Driver Setup Welcome screen appears. Select Install/Update then
click NEXT to proceed with the installation.
Figure 7-46: Audio Driver Setup Welcome Screen
Step 9: Click NEXT to install the standard set of drivers.
Figure 7-47: Audio Driver Selection
Page 154
WAFER-CX700M 3.5" SBC
Step 10: Review the installation settings and click NEXT to continue.
Figure 7-48:
Page 155
WAFER-CX700M 3.5" SBC
Step 11: The drivers are now installed. The drivers only take effect after the compute ris
restarted. Select the “Yes, I want to restart my computer now” option then
click FINISH to complete the installation. Step0:
Figure 7-49: Audio Driver Installation Complete
Page 156
WAFER-CX700M 3.5" SBC
Appendix
A
A BIOS Options
Page 157
WAFER-CX700M 3.5" SBC
Below is a list of BIOS configuration options in the BIOS chapter.
System Overview .................................................................................................................88
System Time [xx:xx:xx] .......................................................................................................89
System Date [xx/xx/xx] ........................................................................................................89
CMPXCHG8B Instruction Support [Enabled] ....................................................................91
ATA/IDE Configurations [Compatible]...............................................................................93
Legacy IDE Channels [SATA Pri, PATA Sec] ....................................................................93
IDE Master and IDE Slave....................................................................................................93
Type [Auto] ...........................................................................................................................94
ZIP..........................................................................................................................................95
LS-120 ...................................................................................................................................95
LBA/Large Mode [Auto].......................................................................................................95
Block (Multi Sector Transfer) [Auto] ..................................................................................95
PIO Mode [Auto]...................................................................................................................96
DMA Mode [Auto].................................................................................................................96
S.M.A.R.T [Auto]...................................................................................................................97
32Bit Data Transfer [Enabled].............................................................................................98
Serial Port1 Address [3F8] ..................................................................................................99
Serial Port1 IRQ [4] ..............................................................................................................99
Serial Port2 Address [2F8] ..................................................................................................99
Serial Port2 IRQ [3] ..............................................................................................................99
Serial Port3 Address [3E8]............................................................................................... 100
Serial Port3 IRQ [4] ........................................................................................................... 100
Serial Port4 Address [2E8]............................................................................................... 100
Serial Port4 IRQ [3] ........................................................................................................... 100
Suspend Mode [S1(POS)]................................................................................................. 101
Power Supply Type [ATX] ................................................................................................ 102
Power Button Mode [On/Off]............................................................................................ 103
Restore on AC Power Loss [Last State] ......................................................................... 103
Resume on LAN/Ring [Disabled]..................................................................................... 103
Resume on PME# [Disabled] ........................................................................................... 104
Resume On RTC Alarm [Disabled].................................................................................. 104
RTC Alarm Date (Days)..................................................................................................... 104
RTC Alarm Time ................................................................................................................ 104
Page 158
WAFER-CX700M 3.5" SBC
Remote Access [Disabled]............................................................................................... 105
Serial Port Number ........................................................................................................... 105
Serial Port Mode................................................................................................................ 105
Redirection after BIOS POST........................................................................................... 105
Terminal Type.................................................................................................................... 106
Serial Port Number [COM1].............................................................................................. 106
Base Address, IRQ [3F8h,4]............................................................................................. 106
Serial Port Mode [115200 8,n,1]....................................................................................... 106
Redirection After BIOS POST [Always] .......................................................................... 107
Terminal Type [ANSI]........................................................................................................ 107
USB Configuration............................................................................................................ 108
USB Devices Enabled....................................................................................................... 108
USB Function [Enabled]................................................................................................... 108
USB2.0 Ports Enable [Enabled] ....................................................................................... 109
Legacy USB Support [Enabled]....................................................................................... 109
USB2.0 Controller Mode [HiSpeed]................................................................................. 109
USB Mass Storage Reset Delay [20 Sec] ........................................................................ 110
Device ##............................................................................................................................ 111
Emulation Type [Auto]...................................................................................................... 111
IRQ#.................................................................................................................................... 113
DMA Channel# [Available] ............................................................................................... 114
Reserved Memory Size [Disabled] .................................................................................. 114
Quick Boot [Enabled] ....................................................................................................... 116
Quiet Boot [Disabled] ....................................................................................................... 116
AddOn ROM Display Mode [Force BIOS] ....................................................................... 117
Bootup Num-Lock [On] .................................................................................................... 117
PXE Remote Boot [Disabled] ........................................................................................... 117
LAN Function [LAN1+LAN2] ............................................................................................ 118
Spread Spectrum Function [Disabled] ........................................................................... 118
Change Supervisor Password ......................................................................................... 121
Change User Password.................................................................................................... 121
Clear User Password ........................................................................................................ 122
DRAM Frequency [Auto] .................................................................................................. 123
AGP Aperture Size [128MB] ............................................................................................. 124
VGA Frame Buffer [64MB]................................................................................................ 124
Page 159
WAFER-CX700M 3.5" SBC
Select Display Device [CRT+DVI] .................................................................................... 124
Flat Panel Type [1024x768 18b] ....................................................................................... 125
Serial ATA IDE Controller [IDE] ....................................................................................... 126
High Definition Audio [Auto]............................................................................................ 126
Save Changes and Exit .................................................................................................... 127
Discard Changes and Exit................................................................................................ 128
Discard Changes............................................................................................................... 128
Load Optimal Defaults...................................................................................................... 128
Load Failsafe Defaults...................................................................................................... 128
Page 160
WAFER-CX700M 3.5" SBC
Appendix
B
B Terminology
Page 161
WAFER-CX700M 3.5" SBC
AC ’97
Audio Codec 97 (AC’97) refers to a codec standard developed by Intel®
in 1997.
ACPI
Advanced Configuration and Power Interface (ACPI) is an OS-directed
configuration, power management, and thermal management interface.
AHCI
Advanced Host Controller Interface (AHCI) is a SATA Host controller
register-level interface.
ATA
The Advanced Technology Attachment (ATA) interface connects storage
devices including hard disks and CD-ROM drives to a computer.
ARMD
An ATAPI Removable Media Device (ARMD) is any ATAPI device that
supports removable media, besides CD and DVD drives.
ASKIR
Amplitude Shift Keyed Infrared (ASKIR) is a form of modulation that
represents a digital signal by varying the amplitude (“volume”) of the
signal. A low amplitude signal represents a binary 0, while a high
amplitude signal represents a binary 1.
BIOS
The Basic Input/Output System (BIOS) is firmware that is first run when
the computer is turned on and can be configured by the end user
CODEC
The Compressor-Decompressor (CODEC) encodes and decodes digital
audio data on the system.
CompactFlash®
CompactFlash® is a solid-state storage device. CompactFlash® devices
use flash memory in a standard size enclosure. Type II is thicker than
Type I, but a Type II slot can support both types.
CMOS
Complimentary metal-oxide-conductor is an integrated circuit used in
chips like static RAM and microprocessors.
COM
COM refers to serial ports. Serial ports offer serial communication to
expansion devices. The serial port on a personal computer is usually a
male DB-9 connector.
DAC
The Digital-to-Analog Converter (DAC) converts digital signals to analog
signals.
DDR
Double Data Rate refers to a data bus transferring data on both the rising
and falling edges of the clock signal.
Page 162
WAFER-CX700M 3.5" SBC
DMA
Direct Memory Access (DMA) enables some peripheral devices to
bypass the system processor and communicate directly with the system
memory.
DIMM
Dual Inline Memory Modules are a type of RAM that offer a 64-bit data
bus and have separate electrical contacts on each side of the module.
DIO
The digital inputs and digital outputs are general control signals that
control the on/off circuit of external devices or TTL devices. Data can be
read or written to the selected address to enable the DIO functions.
EHCI
The Enhanced Host Controller Interface (EHCI) specification is a
register-level interface description for USB 2.0 Host Controllers.
EIDE
Enhanced IDE (EIDE) is a newer IDE interface standard that has data
transfer rates between 4.0 MBps and 16.6 MBps.
EIST
Enhanced Intel® SpeedStep Technology (EIST) allows users to modify
the power consumption levels and processor performance through
application software. The application software changes the bus-to-core
frequency ratio and the processor core voltage.
FSB
The Front Side Bus (FSB) is the bi-directional communication channel
between the processor and the Northbridge chipset.
GbE
Gigabit Ethernet (GbE) is an Ethernet version that transfers data at 1.0
Gbps and complies with the IEEE 802.3-2005 standard.
GPIO
General purpose input
HDD
Hard disk drive (HDD) is a type of magnetic, non-volatile computer
storage device that stores digitally encoded data.
ICH
The Input/Ouput Controll Hub (ICH) is an Intel® Southbridge chipset.
IrDA
Infrared Data Association (IrDA) specify infrared data transmission
protocols used to enable electronic devices to wirelessly communicate
with each other.
L1 Cache
The Level 1 Cache (L1 Cache) is a small memory cache built into the
system processor.
L2 Cache
The Level 2 Cache (L2 Cache) is an external processor memory cache.
Page 163
WAFER-CX700M 3.5" SBC
LCD
Liquid crystal display (LCD) is a flat, low-power display device that
consists of two polarizing plates with a liquid crystal panel in between.
LVDS
Low-voltage differential signaling (LVDS) is a dual-wire, high-speed
differential electrical signaling system commonly used to connect LCD
displays to a computer.
POST
The Power-on Self Test (POST) is the pre-boot actions the system
performs when the system is turned-on.
RAM
Random Access Memory (RAM) is volatile memory that loses data when
power is lost. RAM has very fast data transfer rates compared to other
storage like hard drives.
SATA
Serial ATA (SATA) is a serial communications bus designed for data
transfers between storage devices and the computer chipsets. The SATA
bus has transfer speeds up to 1.5 Gbps and the SATA II bus has data
transfer speeds of up to 3.0 Gbps.
S.M.A.R.T
Self Monitoring Analysis and Reporting Technology (S.M.A.R.T) refers to
automatic status checking technology implemented on hard disk drives.
UART
Universal Asynchronous Receiver-transmitter (UART) is responsible for
asynchronous communications on the system and manages the system’s
serial communication (COM) ports.
UHCI
The Universal Host Controller Interface (UHCI) specification is a
register-level interface description for USB 1.1 Host Controllers.
USB
The Universal Serial Bus (USB) is an external bus standard for
interfacing devices. USB 1.1 supports 12Mbps data transfer rates and
USB 2.0 supports 480Mbps data transfer rates.
VGA
The Video Graphics Array (VGA) is a graphics display system developed
by IBM.
Page 164
WAFER-CX700M 3.5" SBC
Appendix
C
C Digital I/O Interface
Page 165
WAFER-CX700M 3.5" SBC
C.1 Introduction
The DIO connector on the [MODEL NAME] is interfaced to GPIO ports on the IT8712F
Super I/O chipset. The DIO has both 4-bit digital inputs and 4-bit digital outputs. The digital
inputs and digital outputs are generally control signals that control the on/off circuit of
external devices or TTL devices. Data can be read or written to the selected address to
enable the DIO functions.
NOTE:
For further information, please refer to the datasheet for the IT8712F
Super I/O chipset.
C.2 DIO Connector Pinouts
The following table describes how the DIO connector pins are connected to the Super I/O
GPIO port 1.
Pin
Description
Super I/O Pin
Super I/O Pin Description
1
Ground
N/A
N/A
2
VCC
N/A
N/A
3
Output 3
GP27
General purpose I/O port 2 bit 7.
4
Output 2
GP26
General purpose I/O port 2 bit 6.
5
Output 1
GP25
General purpose I/O port 2 bit 5.
6
Output 0
GP24
General purpose I/O port 2 bit 4.
7
Input 3
GP23
General purpose I/O port 2 bit 3.
8
Input 2
GP22
General purpose I/O port 2 bit 2
9
Input 1
GP21
General purpose I/O port 2 bit 1
10
Input 0
GP20
General purpose I/O port 2 bit 0
Page 166
WAFER-CX700M 3.5" SBC
C.3 Assembly Language Samples
C.3.1 Enable the DIO Input Function
The BIOS interrupt call INT 15H controls the digital I/O. An assembly program to enable
digital I/O input functions is listed below.
MOV
AX, 6F08H
Sets the digital port as input
INT
15H
Initiates the INT 15H BIOS call
C.3.2 Enable the DIO Output Function
The BIOS interrupt call INT 15H controls the digital I/O. An assembly program to enable
digital I/O output functions is listed below.
MOV
AX, 6F09H
MOV
BL, 09H
INT
15H
Sets the digital port as output
Initiates the INT 15H BIOS call
Page 167
WAFER-CX700M 3.5" SBC
THIS PAGE IS INTENTIONALLY LEFT BLANK
Page 168
WAFER-CX700M 3.5" SBC
Appendix
D
D Watchdog Timer
Page 169
WAFER-CX700M 3.5" SBC
NOTE:
The following discussion applies to DOS environment. IEI support is contacted
or the IEI website visited for specific drivers for more sophisticated operating
systems, e.g., Windows and Linux.
The Watchdog Timer is provided to ensure that standalone systems can always recover
from catastrophic conditions that cause the CPU to crash. This condition may have
occurred by external EMIs or a software bug. When the CPU stops working correctly,
Watchdog Timer either performs a hardware reset (cold boot) or a Non-Maskable Interrupt
(NMI) to bring the system back to a known state.
A BIOS function call (INT 15H) is used to control the Watchdog Timer.
INT 15H:
AH – 6FH Sub-function:
AL – 2:
Sets the Watchdog Timer’s period.
BL:
Time-out value (Its unit-second is dependent on the item “Watchdog
Timer unit select” in CMOS setup).
Table D-1: AH-6FH Sub-function
Call sub-function 2 to set the time-out period of Watchdog Timer first. If the time-out value
is not zero, the Watchdog Timer starts counting down. When the timer value reaches zero,
the system resets. To ensure that this reset condition does not occur, calling sub-function
2 must periodically refresh the Watchdog Timer. However, the watchdog timer is disabled
if the time-out value is set to zero.
A tolerance of at least 10% must be maintained to avoid unknown routines within the
operating system (DOS), such as disk I/O that can be very time-consuming.
Page 170
WAFER-CX700M 3.5" SBC
NOTE:
When exiting a program it is necessary to disable the Watchdog Timer,
otherwise the system resets.
Example program:
; INITIAL TIMER PERIOD COUNTER
;
W_LOOP:
MOV
AX, 6F02H
;setting the time-out value
MOV
BL, 30
;time-out value is 48 seconds
INT
15H
;
; ADD THE APPLICATION PROGRAM HERE
;
CMP
EXIT_AP, 1
;is the application over?
JNE
W_LOOP
;No, restart the application
MOV
AX, 6F02H
;disable Watchdog Timer
MOV
BL, 0
;
INT
15H
;
; EXIT ;
Page 171
WAFER-CX700M 3.5" SBC
THIS PAGE IS INTENTIONALLY LEFT BLANK
Page 172
WAFER-CX700M 3.5" SBC
Appendix
E
E Address Mapping
Page 173
WAFER-CX700M 3.5" SBC
E.1 IO Address Map
I/O address
Description
Range
000-01F
DMA Controller
020-021
Interrupt Controller
040-043
System time
060-06F
Keyboard Controller
070-07F
System CMOS/Real time Clock
080-09F
DMA Controller
0A0-0A1
Interrupt Controller
0C0-0DF
DMA Controller
0F0-0FF
Numeric data processor
1F0-1F7
Primary IDE Channel
2F8-2FF
Serial Port 2 (COM2)
378-37F
Parallel Printer Port 1 (LPT1)
3B0-3BB
SiS661CX Graphics Controller
3C0-3DF
SiS661CX Graphics Controller
3F6-3F6
Primary IDE Channel
3F7-3F7
Standard floppy disk controller
3F8-3FF
Serial Port 1 (COM1)
Table E-1: IO Address Map
E.2 1st MB Memory Address Map
Memory address
Description
00000-9FFFF
System memory
A0000-BFFFF
VGA buffer
F0000-FFFFF
System BIOS
1000000-
Extend BIOS
Table E-2: 1st MB Memory Address Map
Page 174
WAFER-CX700M 3.5" SBC
E.3 IRQ Mapping Table
IRQ0
System Timer IRQ8
RTC clock
IRQ1
Keyboard
IRQ9
ACPI
IRQ2
Available
IRQ10
LAN
IRQ3
COM2
IRQ11
LAN/USB2.0/SATA
IRQ4
COM1
IRQ12
PS/2 mouse
IRQ5
SMBus
IRQ13
FPU
Controller
IRQ6
FDC
IRQ14
Primary IDE
IRQ7
Available
IRQ15
Secondary IDE
Table E-3: IRQ Mapping Table
E.4 DMA Channel Assignments
Channel
Function
0
Available
1
Available
2
Floppy disk (8-bit transfer)
3
Available
4
Cascade for DMA controller 1
5
Available
6
Available
7
Available
Table E-4: IRQ Mapping Table
Page 175
WAFER-CX700M 3.5" SBC
THIS PAGE IS INTENTIONALLY LEFT BLANK
Page 176
WAFER-CX700M 3.5" SBC
Appendix
F
F Hazardous Materials
Disclosure
Page 177
WAFER-CX700M 3.5" SBC
F.1 Hazardous Materials Disclosure Table for IPB Products
Certified as RoHS Compliant Under 2002/95/EC Without Mercury
The details provided in this appendix are to ensure that the product is compliant with the
Peoples Republic of China (China) RoHS standards. The table below acknowledges the
presences of small quantities of certain materials in the product, and is applicable to China
RoHS only.
A label will be placed on each product to indicate the estimated “Environmentally Friendly
Use Period” (EFUP). This is an estimate of the number of years that these substances
would “not leak out or undergo abrupt change.” This product may contain replaceable
sub-assemblies/components which have a shorter EFUP such as batteries and lamps.
These components will be separately marked.
Please refer to the table on the next page.
Page 178
WAFER-CX700M 3.5" SBC
Part Name
Toxic or Hazardous Substances and Elements
Lead
Mercury
Cadmium
Hexavalent
Polybrominated
Polybrominated
(Pb)
(Hg)
(Cd)
Chromium
Biphenyls
Diphenyl Ethers
(CR(VI))
(PBB)
(PBDE)
Housing
X
O
O
O
O
X
Display
X
O
O
O
O
X
Printed Circuit
X
O
O
O
O
X
Metal Fasteners
X
O
O
O
O
O
Cable Assembly
X
O
O
O
O
X
Fan Assembly
X
O
O
O
O
X
Power Supply
X
O
O
O
O
X
O
O
O
O
O
O
Board
Assemblies
Battery
O:
This toxic or hazardous substance is contained in all of the homogeneous materials for the part is
below the limit requirement in SJ/T11363-2006
X:
This toxic or hazardous substance is contained in at least one of the homogeneous materials for
this part is above the limit requirement in SJ/T11363-2006
Page 179
WAFER-CX700M 3.5" SBC
此附件旨在确保本产品符合中国 RoHS 标准。以下表格标示此产品中某有毒物质的含量符
合中国 RoHS 标准规定的限量要求。
本产品上会附有”环境友好使用期限”的标签,此期限是估算这些物质”不会有泄漏或突变”的
年限。本产品可能包含有较短的环境友好使用期限的可替换元件,像是电池或灯管,这些元
件将会单独标示出来。
部件名称
有毒有害物质或元素
铅
汞
镉
六价铬
多溴联苯
多溴二苯醚
(Pb)
(Hg)
(Cd)
(CR(VI))
(PBB)
(PBDE)
壳体
X
O
O
O
O
X
显示
X
O
O
O
O
X
印刷电路板
X
O
O
O
O
X
金属螺帽
X
O
O
O
O
O
电缆组装
X
O
O
O
O
X
风扇组装
X
O
O
O
O
X
电力供应组装
X
O
O
O
O
X
电池
O
O
O
O
O
O
O: 表示该有毒有害物质在该部件所有物质材料中的含量均在 SJ/T11363-2006 标准规定的限量要求以下。
X: 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T11363-2006 标准规定的限量要求。
Page 180
WAFER-CX700M 3.5" SBC
Index
Page 181
WAFER-CX700M 3.5" SBC
dual RS-232...........................................76
A
ACPI ........................................................101
AGP .........................................................124
AT power connector...................................51
location and pinouts ..............................51
AT power select jumper .............................52
AT/ATX power mode select jumper .............6
ATA flat cable .............................................75
ATX power supply enable connector .........52
location and pinouts ..............................52
audio connector ...........................................5
audio connector CD in ...............................39
location and pinouts ..............................39
audio kit .....................................................75
installation..............................................75
B
backlight inverter connector...................5, 36
location and pinouts ..............................36
SATA drive .............................................77
SATA drive power ..................................77
CF card ......................................................68
installation..............................................68
socket ....................................................38
CF Card socket ............................................5
chassis .......................................................65
clear CMOS jumper ...................................71
location ..................................................72
settings ..................................................71
CMOS ................................................. 37, 71
clear CMOS connector ..........................37
clear CMOS jumper ...............................71
COM 1/2 pin 9 setting jumper ....................70
location ..................................................70
COM1
pin 9 setup jumper .................................70
COM1 and COM2 serial RI port and voltage
selection jumper ......................................6
COM2
backup battery ...........................................37
pin 9 setup jumper .................................70
battery connector ...................................5, 37
CompactFlash............................................16
location and pinouts ..............................37
socket ....................................................16
reset CMOS...........................................37
BIOS .21, 86, 87, 88, 93, 107, 112, 117, 122,
connectors, external
LAN connector.......................................57
RJ-45 connector ....................................57
127
connectors, pinouts and location
C
cables
ATA flat cable.........................................75
dual port USB ........................................79
Page 182
AT power................................................51
backlight inverter ...................................36
battery....................................................37
COM 2 serial port ..................................54
CompactFlash .......................................37
WAFER-CX700M 3.5" SBC
digital input/output .................................40
H
fan..........................................................42
LVDS LCD (30-pin)................................46
hard disk drives
reset button ...........................................52
SATA......................................................53
serial port (COM 2)................................54
HDD LED ...................................................43
USB (internal)........................................55
cooling fan .................................................42
I
IDE connector ..............................................6
D
IDE connector, 40-pin ................................44
DB-15 connector........................................83
location and pinouts...............................44
DB-9 connector..........................................83
IDE controller .............................................17
digital input/output connector.....................40
IDE device........................................... 75, 76
location and pinouts ..............................40
ATA flat cable .........................................75
dual port USB cable...................................79
connector........................................ 75, 76
installation checklist ...................................64
E
J
Ethernet
RJ-45 connector ......................................6
jumper ........................................................69
Ethernet connector, external......................57
AT power select .....................................52
Ethernet controllers....................................57
clear CMOS ...........................................71
external indicators......................................43
COM 1/2 pin 9 setting............................70
external peripheral interface
jumper configuration ..............................69
connectors.............................................80
LVDS voltage selection................... 72, 73
External Peripheral Interface Connectors
Keyboard/Mouse ...................................58
external switches .......................................43
F
fan connector .........................................5, 42
location and pinouts ..............................42
front panel connector .............................5, 43
location and pinouts ..............................43
FSB ............................................................91
K
keyboard controller ....................................20
L
LAN connection..........................................82
LAN connector ...........................................57
LCD display................................................36
backlight inverter connector ..................36
LCD panel voltage select jumper.................6
Page 183
WAFER-CX700M 3.5" SBC
LED
R
HDD.......................................................43
power.....................................................43
RAID ..........................................................53
LPC bus ...............................................19, 21
reset button ................................................43
LVDS display .......................................72, 73
reset button connector ...............................52
voltage select ..................................72, 73
location and pinouts...............................52
LVDS LCD connector.............................6, 46
RJ-45 connection .......................................82
location and pinouts ..............................46
single connector ....................................82
LVDS panel ................................................46
RJ-45 connector.........................................57
18-bit......................................................46
RJ-45 connector.........................................58
36-bit......................................................46
RJ-45 Ethernet connector............................6
dual channel ..........................................46
RJ-45 LAN connector ................................57
single channel .......................................46
RS-232.......................................... 54, 59, 76
LVDS voltage selection jumper............72, 73
cable connection....................................76
location ............................................73, 74
COM 1 location and pinouts ..................59
settings ..................................................73
COM 2 location and pinouts ..................54
connector location and pinouts....... 54, 59
M
dual cable ..............................................76
serial port devices..................................54
memory module installation .......................67
Mini PCI slot...............................................47
location and pinouts ..............................47
RS-232 connector........................................6
RS-232 serial port connector .......................6
RS-232 serial port devices.........................54
RS-422/485 connector.................................6
P
RS-422/485 serial port connector ................6
power button ..............................................43
S
Power Button Mode .........................102, 103
power input connector .................................6
power LED .................................................43
power supply........................................51, 52
AT power supply ..............................51, 52
ATX power supply .................................52
PS/2 keyboard and mouse
connection .............................................81
SATA drive..................................................77
cables ....................................................77
connection .............................................77
power cable ...........................................77
SATA drive connector.................................53
location and pinouts...............................53
SATA drives................................................53
Serial Device
Page 184
WAFER-CX700M 3.5" SBC
connection .............................................82
devices ..................................................55
serial port connector ........................6, 54, 59
port.................................................. 18, 55
location and pinouts ........................54, 59
USB 1.1 .......................................... 19, 55
SODIMM ....................................................67
USB 2.0 .......................................... 19, 55
installation..............................................67
USB 1.1............................................... 19, 55
specifcations..........................................67
USB 2.0............................................... 19, 55
USB 2.0 connector.......................................6
T
technical specifications................................6
U
USB cable
dual port.................................................79
USB connector.............................................6
USB connector, internal .............................55
location and pinouts...............................55
Ultra ATA ....................................................17
Ultra ATA /100........................................17
Ultra ATA /33..........................................17
Ultra ATA /66..........................................17
Ultra ATA/100 .............................................17
USB ................ 18, 55, 56, 79, 107, 108, 109
cable
dual port ...................................... 79
cable ......................................................79
cable connection ...................................80
V
VGA ...........................................................83
VGA connector...................................... 6, 60
VGA monitor...............................................83
connection .............................................83
W
warranty validation .....................................64
connectors.............................................79
Page 185

advertisement

Was this manual useful for you? Yes No
Thank you for your participation!

* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertisement