2 0 0 9 Environmental Report FUJITSU MICROELECTRONICS GROUP

2 0 0 9 Environmental Report FUJITSU  MICROELECTRONICS  GROUP
FUJITSU MICROELECTRONICS GROUP
http://jp.fujitsu.com/fml/en/
FUJITSU MICROELECTRONICS LIMITED
Environmental Promotion Office
Focus on Readability
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by Fujitsu to make the text and images more accessible to a wider
range of readers through highly accessible color combinations.
Akiruno Technology Center, 50 Fuchigami, Akiruno-shi Tokyo 197-0833, Japan
Tel. +81-42-532-1387
http://www.fujitsu.com/global/services/microelectronics/environment/
Focus on the Environment
This pamphlet uses paper made from trees harvested from certified
forests and is printed with non-VOC ink using a waterless process that
does not produce hazardous liquids.
● For inquiries regarding electronics devices contact:
FUJITSU ELECTRONICS INC.
Shin-yokohama Chuo Bldg. 100-45, Shin-yokohama 2-Chome,
Kohoku-ku Yokohama Kanagawa 222-8508, Japan
+81-120-198-610
Operating hours: 9:00 - 17:00
(except Saturdays, Sundays, national holidays, year-end and New Year holidays)
http://jp.fujitsu.com/group/fei/en/
C 2010 FUJITSU MICROELECTRONICS LIMITED
Printed in Japan
AD00-00022-2E January, 2010
Environmental
Report 2 0 0 9
Top Message
ECO is in our SEMICONDUCTORs
Working towards a business that delivers device solutions
with real value for the needs of the Environmental Age.
O ur Mission is Eco-Device Solutions
FUJITSU MICROELECTRONICS GROUP
Environmental Report
CON
2009
Global warming is becoming a serious problem worldwide. A comfortable lifestyle
and realization of a low-carbon society that protects the global environment are
big issues shared by all of society.
Fujitsu Group developed its midterm vision, Green Policy 2020, based on the
pledge at the July 2008 meeting of the G8 (the Hokkaido Toyako Summit) to halve
emissions of greenhouse gases worldwide by 2050. The Green Policy 2020 s goal
is to realize a prosperous, low-carbon society through both internal and societal
environmental innovation, centered on the key concepts of creation, collaboration
and change.
Fujitsu Microelectronics Group, as a member of Fujitsu Group, conducts business
based on the guidelines of Green Policy 2020. We believe it is our mission to help
our customers enhance their products contribution to a low-carbon society through
the development and supply of energy-efficient and compact eco-device solutions.
We will continue to pursue device solutions required by the Environmental Age.
ENTS
1 Top Message
2 Fujitsu Microelectronics Group’s Approach
4 Reducing Environmental Impact Across the Whole Lifecycle
Manufacturing that Contributes
to the Global Environment
6
■ The
Green Product and Super Green Product Creation
7
■ The
Environmental Efficiency Factor
■ Green
8
Procurement
■ Approach
to Green Distribution
■
Approach to Chemical Substances in Products
9
■
Representative Green Products
13
■
Examples of Environmental Contributions through LSI
Approach to the Environment
17
■ Green
Factory and Green Office
Global Warming Measures
Chemical and Waste Reduction Measures
Environmental Risk Management
20
■ Environmental
Communication
Environmental Social Contribution
External Awards and Environmental Awareness
22
■ Environmental
Management System
President
Editorial Policy
The Fujitsu Microelectronics Group Environmental
Report 2009 reports the company s environmental
philosophy, its approach and results in conjunction
with the electronic devices and semiconductors
it handles, based on the Fujitsu Group philosophy
and directive, FUJITSU Way.
We are also reporting on the Fujitsu
Microelectronics Group s activities as
understandably as possible on the company
website.
Reporting Period
This report covers activities in FY 2008 (from April 1,
2008 to March 31, 2009). However, a portion of the
content includes activities both prior to and after
April 1, 2009.
Organizations Covered in the Report
All 17 companies in the Fujitsu Microelectronics
Group (including overseas companies).
Environmental Management
FY 2008 Results
Business Activities and Environmental Impact (Material Balance)
Environmental Accounting
Appendix
See the last page for Fujitsu Microelectronics Group Corporate Profile
● Published:
January 2010 (Second edition)
● Head of Publishing: President Haruki Okada
Hiroshi Osuda, Environmental Promotion Office
Environmental Promotion Office,
FUJITSU MICROELECTRONICS GROUP
● Reference Guidelines:
Ministry of the Environment
“2007 Environmental Reporting Guidelines”
● Editor in Chief:
● Issuing Division:
L ifecycle is the Key Concept in Eco-Devices
Our device manufacturing business can impact the environment through greenhouse
gases and waste produced by factories, examples of what our device manufacturing
business can leave behind as impacts on the environment. To minimize these issues,
we are making continual improvements based on the environmental action plan
shared throughout the Fujitsu Group. In FY 2008, to curb emissions of gases with
high global warming potential, we extended the application of PFC (Perfluorocarbon)
gas removal equipment and successfully reduced greenhouse gases other than CO2
emissions by 22% from the preceding year.
In addition to making improvements to reduce environmental impact from our
group, we also strive to help customers reduce their environment impact, which
we consider another important mission for us. In so doing, we find it necessary to
develop measures such as alleviating the battery dependence of mobile devices that
incorporate our products and improving the fuel efficiency of automobiles. To make
this possible, we believe improvements that encompass the entire product lifecycle
are essential, including improvement in the manufacturing phase, energy-efficient
design in the design phase, green procurement in the materials procurement phase
and reduced packing in the shipping phase.
This environmental report includes the improvements Fujitsu Microelectronics
Group has made across the whole lifecycle in FY 2008.
Member of the Board and Corporate Senior
Vice President (Environmental Director)
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
|1
Fujitsu Microelectronics Group s Approach
Midterm Environmental Vision
Realization of a Prosperous, Low-Carbon Society
Fujitsu Microelectronics Group, based on Fujitsu Group s shared midterm
environmental vision, Green Policy 2020, aims to realize a prosperous,
Fujitsu Microelectronics Limited
low-carbon society by triggering environmental innovation in society
Environmental Policy
through internal innovation centered on the key concepts of creation,
collaboration and change.
With our customers, we contribute to the protection of a rich
global environment, using state-of-the-art technology to provide
semiconductor devices with superior environmental characteristics.
Inside
automobiles
Our Final Goal
Operation
Principles
Inside
digital home
appliances
We have another goal after the “realization of
a prosperous, low-carbon society.” This is the
realization of our corporate guidelines, the FUJITSU
Way, to “contribute to society and protect the global
environment.”
We strive to be a company that contributes to the
development of a prosperous, low-carbon society
through the pursuit of this midterm environmental
vision, and through this to contribute to the
preservation of the global environment.
Contributing to our
customers and society
through energy-efficiency,
compactness, lightness and
thinness
By applying the following principles, we work to prevent pollution of the global
environment and reduce the environmental burden of our products throughout their life-cycles,
including development, procurement, manufacture, sales, usage, and disposal:
Inside office
equipment
Inside mobile
devices
By reducing our
customers' and society's
environmental impact,
we contribute to the
preservation of the global
environment.
Fujitsu Group
Reducing our own environmental
impact
2|
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
Customers
Reducing our customers'
environmental impact
Society
Increasing the environmental
efficiency of society as a whole
1
Through aggressive promotion of Super Green Product development, we improve the environmental
characteristics of our products and actively contribute to reducing the burden on the global environment
and our customers.
2
We aggressively promote measures to counteract global warming and reduce
emissions of greenhouse gases (e.g. CO2, PFCs).
3
We aggressively promote chemical management and reduced emissions of volatile
organic compounds (VOCs).
4
We aggressively promote waste reduction and appropriate recycling.
5
We conform to environmental regulations around the world and keep our promises
to customers.
6
We work to improve the individual environmental consciousness of each of our
employees, to help them become good environmental citizens.
7
We expand the effectiveness and transparency of our environmental management
system, driving continuous improvement and development.
The Earth
Contributing to preservation
of the global environment
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
|3
Reducing Environmental Impact Across the Whole Lifecycle
Reducing Environmental Impact Across the Whole Lifecycle
From development and design to manufacture and usage –
Constructing a business process with low environmental impact across the whole lifecycle
of the semiconductor product
Development and design
Material procurement
● Low-power ICs
・Multiple power source design technology
that reduces power consumption while
active
・Power-gating design technology that
reduces power consumption when idle
・ RDF V4.0, a development system loaded
with the features of a multiple power
source design and power-gating design
● Green procurement
・Working with our partners to promote
green procurement, under the Fujitsu
Group's green procurement standards
・Supporting our partners' construction
of CMS (central management systems)
based on the JGPSSI*1 "Guidelines for the
Management of Chemical Substances in
Products"
Manufacturing (front-end)
● Green processes
・Process improvement reducing the
amount of chemicals and gas used
・Reduction of process energy expenditure
・Clarification of improvement priorities
using the CG index*2
● Green factories
・Saving energy to reduce CO2 emissions
・Changing from PFC gas*3 to gases of low
global warming potential, and installing
manufacturing lines equipped with PFC
gas harm removal equipment
・Curtailing sludge waste emissions with
the introduction of a "Fluorine Recovery
and Reuse System"
・Reducing emissions of VOC (volatile
organic compounds)
Manufacturing (back-end)
● Green processes
・Massive time-saving and
productivity increases
・Coordination with production innovation
project (Toyota production system)
● Green factories
・Reducing greenhouse gas emissions
・Reducing waste emissions
・Reducing emissions of VOC (volatile
organic compounds)
Distribution and sales
Usage
● Green distribution
● Green products and
Super Green Products
・Shipping with low CO2 emissions
・Products adapted to our special
environmental awareness standards
・Products with improved environmental
efficiency
・Environmental improvement solutions
using ICs of superior environmental
performance
・Terminals installed on vehicles to improve
fuel efficiency
● Packing
・Usage of specialized reusable boxes
・Application of cobalt-chloride-free
humidity indicators
*1 JGPSSI: Japan Green Procurement Survey Standardization Initiative
*2 Cost Green index. Fujitsu Group's unique index calculated by multiplying the following three factors: material input per
unit of product, unit value, and degree of environmental impact.
*3 Perfluorocarbon gas. Used in the manufacturing of semiconductors; it has a global-warming potential approximately
10,000 times higher than that of CO2.
Business Facilities
4|
Development and design bases
Manufacturing bases
● FUJITSU
MICROELECTRONICS LTD. (Headquarters/Akiruno Technology Center)
● FUJITSU
MICROELECTRONICS LTD. (Mie Plant/Aizuwakamatsu Plant/Iwate Plant)
● FUJITSU
ELECTRONICS INC.
● FUJITSU
SEMICONDUCTOR TECHNOLOGY, INC.
● FUJITSU
VLSI LTD.
● e-Shuttle,
● FUJITSU
LSI TECHNOLOGY LTD.
● FUJITSU
LSI SOLUTIONS LTD.
● FUJITSU
MICROELECTRONICS SOLUTIONS LTD.
● FUJITSU
MICROELECTRONICS AMERICA, INC.
● FUJITSU
MICROELECTRONICS EUROPE GmbH
● FUJITSU
MICROELECTRONICS ASIA PTE. LTD.
● FUJITSU
MICROELECTRONICS PACIFIC ASIA LTD.
● FUJITSU
MICROELECTRONICS (SHANGHAI) CO., LTD.
● FUJITSU
MICROELECTRONICS KOREA LTD.
● FUJITSU
GLOBAL MOBILE PLATFORM INC. FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
Inc.
● FUJITSU
INTEGRATED MICROTECHNOLOGY LTD. (Aizu Plant/Miyagi Plant/Kyushu Plant)
● FUJITSU
FACILITIES ENGINEERING LTD.
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
|5
Manufacturing that Contributes
to the Global Environment
The Environmental Efficiency Factor
In FY 2007, Fujitsu Group introduced the Environmental Efficiency Factor
as an index to gauge the environmental performance of its products, which
Fujitsu Microelectronics subsequently adopted for implementation.
Product performance and function,
including basic design, etc.
Product value
Environmental Efficiency Factor Methodology
The Green Product and Super Green Product Creation
When developing new LSIs, Fujitsu Microelectronics Group aims to reduce the
environmental impact of the customer product that incorporates the LSI, and
to reduce the environment impact of the final use of the product, thereby
reducing the environmental impact on all of society.
To realize these goals, Fujitsu Microelectronics Group utilizes the framework
of Green Product and Super Green Product Creation to create eco-friendly
products.
Green Product and Super Green Product Evaluation Framework
All products undergo a Green Product Assessment before development
to evaluate factors such as energy efficiency and chemical suitability. After
making design improvements to bring the assessment score to 90 or higher,
development begins.
After development, a follow-up evaluation is conducted to verify that the
original goals have been achieved.
LSIs with energy efficiency, 3R score and chemical suitability, etc. that are
superior to other products on the market other Fujitsu Microelectronic Group
products are certified as Super Green Products and actively promoted to
customers.
Step 3
Step 2
Step 1
6|
Evaluation of environmental factors
based on the definition of
Super Green Product
where environmental factors
correspond with
Super Green Product definition
Implementation of
Green Product Evaluation
where all evaluation criteria
have been met
(Top environmental products)
Lower environmental
impact
Impact
(New vs. old product)
Power consumption, etc.
VOICE
FUJITSU MICROELECTRONICS
SOLUTIONS LTD.
SoC Technology Dept. Development Div.Ⅰ
Takayoshi Kyono
Our environmental philosophy is to “refine our
technology and contribute to the global environment
and society.” To reduce our environmental impact,
our team is applying low-energy methods to our LSI
development ahead of competitors and pursuing
technology for even further energy savings.
VOICE
FUJITSU ELECTRONICS INC.
Eastern Japan Sales Div.Ⅲ
Tatsuya Yoshida
How Sales Workforce Can Contribute to the
Environment
Our clients who develop mobile devices have a strong
demand for low power consumption. The change to
low power consumption not only contributes to the
environment, but also allows the package to be more
compact and extends continuous usage time. In sales,
we work daily to contribute to the environment and
consumer products by offering and having low-power
products adopted. As an individual, I use a multi-outlet
extension cord with a switch to reduce the required
standby electricity.
Super Green Products
The Environmental Efficiency Factor is calculated with the ratio of product
value divided by the environmental impact.
Higher value
(New vs. old product)
Environmental
efficiency factor = Environmental
Green Procurement
To provide environmentally efficient products and services to our
customers, we promote green procurement in the materials procurement
and outsourced services involved in product development and design,
manufacturing, distribution and sales while receiving assistance from our
business partners.
Enhanced Environmental Activities in the Supply Chain
Through the procurement of outsourcing services involved in product
development, design and manufacturing, our environmental activities aim at:
・The promotion of an improved EMS (Environmental Management System) at
our business partners.
・The promotion of the building of a CMS (Chemical Substances Management
System)
Our goal is to achieve and maintain 100% procurement from business
partners with complete EMS and 100% CMS completion as our materials
providers.
EMS-complete business partners have a Level 1 or higher EMS rating (for
material providers, Level 2 or higher is required), and CMS-complete business
partners have received a CMS audit by Fujitsu Microelectronics Group and
have a rating of Level B or higher.
Furthermore, for business partners that are not shared with Fujitsu, we
conduct an EMS level survey, request and encourage them to pursue a higher
level of accreditation, and promote the signing of a Green Procurement
Agreement demonstrating the completion of CMS.
VOICE
FUJITSU MICROELECTRONICS LTD.
Business Planning & Promotion Div.
Chisa Ubagai (Left)
Chie Yamazaki (Right)
We handle the EMS environmental survey and signing
of CMS “Green Procurement Agreements.” We are
engaged in environmental activities including the CMS
management of partner manufacturers that directly use
regulated materials and the EMS management of all
business partners including non-manufacturers. We
plan to continue to support the activities of our business
partners and to enhance the Green Procurement
activities of Fujitsu Microelectronics Group.
● Results of FY 2008 Activities
EMS-complete business partners
Level 1:
13
CMS-complete business partners
30%
Level A:
15
100%
Level 2:
3
7%
Level B:
0
─
Level 3:
27
63%
Level C:
0
─
Levels 1-3 total
43
100%
Levels A-C:
15
100%
Green Products
(Highly environmentally-conscious products)
Implementation of Green
Product Assessment
where overall score is
90 points or higher
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
|7
Manufacturing that Contributes to the Global Environment
Approach to Green Distribution
Representative Green Products
We consider the environment even in the distribution of our products.
Semiconductors are packed and shipped in square-shaped trays or rolled onto
tubes in tape-shaped containers. We are environmentally conscious about our
shipping materials, reusing these trays and using plant-based resins in our tape.
We also use specialized containers to reduce the use of cardboard boxes in
our packaging.
Product Category
1
DC Brushless Motor Control MCU
Model: MB91490 series
■ Product Overview
The MB91490 series maintains the CPU function of the MB91470/480 series
microcontrollers used for high-performance motor control while achieving fewer
pin counts and smaller packages. Specifications have been optimized from
previous products to reduce power consumption. With the newly added lowvoltage detection interrupt/reset function, the product is fail-safe compatible.
Increase Rate of Tray Reuse
To increase our rate of tray reuse, we strive to collect shipped trays with the
cooperation of a collection company. We also strive to increase their strength so
the trays may be used over a long period of time. In 2008, we achieved a reuse
rate of 50%.
Microcontrollers
A cargo container
● Packing materials and reducing CO2 in distribution
■ Application: Industrial uses, and air-conditioner and washer-dryer motors
During shipping from our semiconductor factories to our
distribution centers, we use reusable cargo containers instead
of cardboard boxes. As a result of this reduction in cardboard
box use and improvement of our loading ratio, we have been
able to reduce CO2 in distribution.
Environmental Characteristics
❶ Part mounting area reduced
by approximately 66mm2*1
❷ Power consumption reduced
by approximately 15%*2
*1: Corresponds to two low-voltage detection devices
*2: Compared with former Fujitsu Microelectronics Group products
Approach to Chemical Substances in Products
In addition to strictly following legal bans and regulations on chemical substances, Fujitsu
Microelectronics Group takes a precautionary principle approach to manufacture and provides
products free of harmful chemical substances by maintaining policies for handling chemical
substances that may be hazardous.
As a member of the Fujitsu Group, Fujitsu Microelectronics Group defines legally
regulated substances as Fujitsu Group Designated Prohibited Substances and
only provides products that do not contain prohibited substances. We also
define substances that may be harmful as Fujitsu Group Designated Controlled
Substances and control the amount of their inclusion.
Approach to legal regulations
In the divisions assuming product-related responsibilities such as the products,
quality assurance, purchasing and environmental divisions, a CMS*1 has been put
in place to ensure thorough chemical substances management in each process
from design to shipping, working daily to provide products that are compliant
with various regulations including Europe s RoHS*2, China s RoHS*3 and REACH*4.
In the semiconductor manufacturing process, we do use chemicals containing
PFOS*5, which can have negative effects on ecosystems. Their controlled use in
semiconductors is deemed acceptable in international and domestic regulations
such as the POPs treaty*6 and the Act on the Evaluation of Chemical Substances
and Regulation of Their Manufacture.*7 The Fujitsu Microelectronics Group
thoroughly manages the use of chemicals containing PFOS while seeking a
transition to safer chemicals.
8|
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
Product Category
2
Koji Takenouchi
The installation of various fail-safe functions*3
is becoming the industry standard in the white
home appliance these days. One of these fail-safe
functions is low-voltage detection interrupt/reset.
Previously low-voltage detection devices and the
microcontroller needed to be installed individually.
But with the MB91490 series, the function is
included in the microcontroller, reducing the
number of parts and the footprint of the board. The
MB91490 series is positioned as a less-pin version
of the MB91470/480 series while maintaining
the same 80MHz CPU function, meaning small
installation area and the fast, real-time information
processing compared to prior products.
I hope to continue to develop microcontrollers
that are both eco-friendly and valuable when
incorporated into customers’ products and systems.
*3: Function that ensures constant safe functioning when the
system or devices undergo interruptions due to incorrect
operation or malfunctions.
Universal DC/DC Converter IC
■ Product Overview
Two-channel power IC for digital consumer electronics that allows safe, highspeed operations even during rapid high-current load changes. Used in doublespeed and full-HD big-screen television and fast image-processing, highperformance video game consoles.
*1: CMS: chemical substances management
*2: European RoHS Directive (EU regulations): A set of directives
restricting the use of specified Harmful Substances contained in
electric and electronic devices
*3: China RoHS (Chinese regulations): Administration on the Control
of Pollution Caused by Electronic Information Products
*4: REACH: A regulation regarding the Registration, Evaluation,
Authorisation, and Restriction of Chemicals
*5: PFOS: Per-fluorooctane sulfonate
*6: POPs treaty (international treaty): Stockholm Convention on
persistent organic pollutants (POPs)
*7: Act on the Evaluation of Chemical Substances and Regulation of
Their Manufacture, etc.: Japanese regulatory act
FUJITSU MICROELECTRONICS LTD.
Standard MCU Design Dept.
Security & Ecology Business Div.
Analog
Model: MB39A138
Meeting on chemical
substance handling
VOICE
■ Application: Digital televisions, Blu-ray recorders, DVD recorders, television
converters, video game consoles, projectors, copy machines
Environmental Characteristics
❶ Conversion efficiency: 96% (input: 12V, output: 5V)
❷ Current consumption: Reduced by 55%*1
VOICE
FUJITSU MICROELECTRONICS LTD.
Analog Products Marketing &
Application Eng. Dept. Security &
Ecology Business Div.
Shu Yi
Our “bottom detection comparator system”
constantly compares the feedback voltage from the
output and the reference voltage by a high-speed
comparator, maintaining a fixed output voltage by
fixing the ON period and controlling the OFF period.
As a result, during output voltage changes resulting
from rapid load changes, the operating frequency is
immediately adjusted to ensure constant stabilization
of the output voltage frequency. Use of this system
results in superior power conversion efficiency and
voltage stability compared to previous voltage/
current control systems. As a result, the system
is supplied with stable current, and the number of
smoothing output capacitors is greatly reduced,
contributing to overall parts cost reduction for the set.
❸ Reduced board area/reduced number of parts:
Use of the bottom detection comparator system makes
the phase compensation circuit unnecessary.
Also includes a bootstrap diode.
*1: Compared with previous Fujitsu Microelectronics Group products
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
|9
Manufacturing that Contributes to the Global Environment
Product Category
3
ASSP (Automobiles)
5
Automobile Graphics Display Controller
ASSP (Security)
Ultra-High-Speed Security Processors
Model: MB86298
Model: MB86C61/60A
■ Product Overview
■ Product Overview
Industry-leading drawing function and OpenGL ES2.0 compatible graphics
function support the even higher quality display of three-dimensional vehicle
navigation. Also, through four display outputs and four video inputs, images
from multiple cameras around the vehicle can be composed and converted in
real time to be displayed as one image on the dashboard.
■ Application: Digital dashboard and vehicle navigation systems
Environmental Characteristics
❶ Multiple image input/output function possible on one chip,
contributing to reduced number of parts of PCBs*1.
❷ Support for suspend mode*2 (when in suspend mode,
energy consumption can be reduced by 500mW)
*1: Print circuit board
*2: Only DDR2 IF
Product Category
4
Product Category
VOICE
The MB86C61/60A is a security processor that connects with Ethernet and
conducts encryption processing. Through architecture optimized for packet
processing, we achieved duplex 1Gbps full-wire IPsec processing at the
low operating frequency of 150MHz with reduced power consumption of
approximately 600mW.
FUJITSU MICROELECTRONICS LTD.
Graphics and Imaging Dept.
Automotive Business Div.
Kouwa Shibata
The issue was how to achieve a powerful video
input/output function and high-end image processing
IC in a single chip. What’s more, it needed to fit in
the same size package as before and to guarantee
function at temperatures of 85ºC when used in
automobiles. In the course of development, we
decided to stop each and every one of the clocks
on individual modules when not in use, reduced
energy consumption, employed a new package to
improve the thermal resistance, conducted heat
analysis while simulating as closely as possible the
conditions of use by the customer, and fit the LSIs
into the same package as used previously. Use of
this product can reduce the total number of system
parts, achieve improved mileage by lightening the
system, and support eco-drive through the display
of mileage and driving conditions.
■ Application: Network equipment
Model: MB88395
FUJITSU MICROELECTRONICS LTD.
Solution Engineering Dept.
Automotive Business Div.
■ Product Overview
Makes wide-area transmissions possible through conversion of the physical
layer to 800Mbs and an increased compression rate for SmartCODEC, allowing
multiple signals (including Blu-ray disk, digital television, HD video, as well as
highly detailed displays of vehicle navigation), to be transmitted simultaneously
on a single network without a sense of delay.
■ Application: Car entertainment systems such as Blu-ray and car navigation
systems
Environmental Characteristics
❶ Reduced energy consumption by 46%* 930mW to 500mW
❷ Part mounting area reduced by 62%*1 676mm2 to 256mm2
1
❸ Compatible with Ultra Low Power Mode
Standby current of below 40 A
*1: Compared with previous MB88388A
Hideo Makabe
In converting to an FBGA package to reduce the
part mounting area, problems with increasing
thermal resistance were encountered. To guarantee
proper operation at 95ºC, the issue became how
to reduce the energy consumption sufficiently. By
using the 90nm process to reduce internal logic
voltage, reducing the speed of the SmartCODEC
operation clock and reducing the energy
consumption of the analog circuits, we were able
to reduce energy consumption compared with
previous products by 46%. Use of this product can
reduce the overall number of system parts and the
number of wire harnesses, can improve mileage
through the lightening of the vehicle and can reduce
CO2, contributing to the environment.
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
Norio Abe
The ultra-high-speed security processor
MB86C61/60A that we have developed provides the
rapidly enlarging IP network security with both high
performance and low energy consumption. Our
day-to-day work in the environment and security has
been highly praised, winning 2nd Place in the 2009
“Semiconductor of the Year” contest. We hope
to continue to provide products that contribute to
“building a comfortable and safe network society.”
*1: When processing the same performance with software
6
ASSP (imaging)
H.264/MPEG-2 Full HD Transcoder LSA
Model: MB86H57/58
■ Product Overview
Product that converts full-HD (1920 dots x 1080 lines) MPEG-2 format and H.264
format video and sound data. Through proprietary transcoding technology,
we have achieved industry-leading low power consumption of 1.0W during
transcoding including the power consumption of in-package memory.
■ Application: Digital recording equipment
Environmental Characteristics
❶ Energy consumption reduced by
65%*1 (approximately 1.7W) through
proprietary transcoding technology
and SiP with FCRAM
❷ Function required for recording of
digital broadcasts included in one chip,
with mounting area reduced by 75%*2
through the use of compact packages.
*1: Compared with previous Fujitsu Microelectronics Group products
*2: For H57. Compared with previous Fujitsu Microelectronics Group products
10 |
Broadband Security Development Dept.
❶ Reduced energy consumption
from 6W to 600mW*1
Energy consumption reduced by 90%
through low operating frequency
processing
Product Category
VOICE
FUJITSU LSI SOLUTION LTD.
Environmental Characteristics
ASSP
1394 Automotive Controller IC
VOICE
VOICE
FUJITSU MICROELECTRONICS LTD.
Digital Imaging Design Dept.
Infotainment Solution Div.
Toshio Hosoi
This product converts between the MPEG-2
format and H.264 format video and sound data
for electronic equipment with digital broadcast
recording functions such as hard disk recorders and
personal computers. Power consumption increased
during high-speed processing of large amounts
of video and sound data in previous products,
including those of our competitors, and the need for
large amounts of external memory were also issues.
The product we have developed this time provides
high image quality and low energy consumption
simultaneously through the use of our proprietary
transcoding technology. It also utilizes the 65nm
process and our firm’s high-speed, low-energy
memory FCRAM installed as SiP, realizing further
reduced energy consumption and compactness.
As a result, this product can be installed in mobile
devices such as personal computers.
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
| 11
Manufacturing that Contributes to the Global Environment
Product Category
7
ASSP (communications)
Mobile WiMAX Baseband LSIs
VOICE
Model: MB86K23
FUJITSU MICROELECTRONICS LTD.
WiMAX SoC Design Dept.
Mobile Solution Div.
■ Product Overview
We developed a Mobile WiMAX baseband LSI targeting mobile devices, the
market for which is expected to grow. Through the combination of our firm s
RF LSI (MB86K52) and power LSIs, we have achieved a compact mobile WiMAX
terminal and extended operation.
■ Application: Mobile WiMAX communication devices
Environmental Characteristics
❶ Operating power reduced by 36%*1
(part mounting area reduced by 60%)
❷ Energy-saving mode equipped.
Reduced to 0.5mA*2 during
Power
intermittent operation
with chipset level.
Active
*1: Compared with previous
products (MB86K21)
Motohisa Ikeda
In battery-driven mobile devices, low-power design
in intermittent operation (the autonomous repeating
of communication activity and static activity), a
challenge unique to this field, was an important issue.
This product uses low-power technology including
65nm generation CMOS low-energy process
technology and power gating in the baseband LSIs.
It also combines our firm’s RF-LSI and power LSI.
By optimizing design through baseband internal
processor software that includes energy-reduction
control, we have achieved a low-energy chipset.
We plan to continue to pursue energy-reducing
technology in both hardware and software and to
contribute to the extended use of mobile devices.
Active
down
*2: In energy-saving mode when
combining our firm s RF-LSI and
power LSI
up
Ave.
Standby
Time
Product Category
8
Memory
Consumer FCRAM
VOICE
Model: MB81EDS516545
FUJITSU MICROELECTRONICS LTD.
FCRAM Design & Characterization Dept.
Infotainment Solution Div.
■ Product Overview
This low-power memory is for digital consumer electronics using a 512M-bit, lowpower DDR interface. With this product, we have realized SiP solutions by memory
which previously had temperature-range constraints through the ability to operate
at 125ºC. We also reduced energy use by 50% compared to two DDR2 SDRAMs.
■ Application: Digital consumer electronics
Environmental Characteristics
*1: Compared to two DDR2 SDRAMs
*2: Based on 20% of LCD televisions shipped
worldwide in 2009 using FCRAM
*3: Compared to two LCD television DDR memory
locations converted to SiP
30
CO2 Emissions
(thousands of tons)
❶ Energy reduction of around 54%*1
Yearly CO2 emission reduction of 14.6K
tons*2 possible
❷ Printed circuit board mounting area
reduced 22% through conversion to
SiP*3
Around
a 54%
reduction
25
20
15
27.2
10
12.6
5
Using SDRAM
12 |
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
Using FCRAM
Daisuke Kitayama
With this product, we were the first in the industry
to realize the 125°C operation in memory with a
DDR interface. In development, we struggled with
the fact that the unique variation became more
pronounced as the temperature range widened,
requiring very precise design. Furthermore, since
we had no experience in developing memory chips
with the 125°C operation, a complete review of
the environment and methods for testing, property
evaluation and reliability evaluation was required.
The fact that we solved these technological
challenges and were able to meet the development
schedule was very encouraging for the entire team.
We believe products with superior features
such as low power consumption contribute to
the environment. We plan to continue to develop
FCRAM products that benefit both the end product
for the customer and the environment.
Examples of Environmental Contributions through LSI
Fujitsu Microelectronics Group provides optimal low-power LSIs and high-performance, varied
device solutions that achieve compact, lightweight products for the customer through the
combination of high-performance, environmentally focused design technology.
1
Example
Applying the low-power design flow RDF4.0 to microcontrollers
As the demand for further low-power consumption in LSIs
becomes more and more intense, the leak current of the
transistor while the device is idle is increasing, a result of
resulting from the miniaturization process. In products where
battery life is an issue such as mobile devices, this problem
cannot be ignored. Fujitsu Microelectronics Group uses lowpower design flow RDF4.0 to significantly reduce standby
current in our microcontroller products.
We have dramatically facilitated the logic and physical design
of multiple power supply design and power gating by
supporting the industry-standard power supply description
format, "CPF" ahead of others in the industry.
Also, in our power-gating technology, we have developed
a proprietary power-supply switch control circuit and switchparameter-adjustment method to reduce noise generated
when the power supply shutoff switch is on. Through
this technology, power-gating products can be operated
more stably.
This technology also applies to microcontroller design,
making reduced low power consumption and reduced
power consumption especially during standby achievable
without large delays in the design period.*1
*1: The most difficult evaluation processes are reduced
to around 1/10th the time.
LSI specification
Multiple power supply specification
Library selection
Multiple power
RTL*1 design power
supply sources
supply domain definition Power verification
Logic synthesis
Test synthesis
CPF*2
Voltage consideration and
synthesis
DFT*3 by power domain
Layout
Power supply gating insertion
Level shifter/isolator insertion
Optimization
Verification
Sign-off verification
Multi-Vdd sign off verification
LVS verification
*1: RTL (register transfer level): process to convert user specifications into
register transfer level notation
*2: CPF (common power format): common format to notate circuit
specifications and restricting conditions in circuits used to achieve
lower power consumption such as control circuits for leaked current.
*3: DFT (design for test): method of including structures to identify
defects in semiconductor circuit design in the manufacturing phase
VOICE
FUJITSU MICROELECTRONICS LTD.
Design Innovation Engineering Dept.
ENVM Technology Development &
Products Engineering Div.
Tsutomu Nakamori
With this successful application of the lowpower consumption Flow RDF 4.0 technology to
microcontroller design, we are proud of the fact that
we have contributed to making customer products
low power, reducing CO2 emissions and improving
the environment a little.
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
| 13
Manufacturing that Contributes to the Global Environment
2
Example
3
Development of green exposure technology
that does not use photo mask
In the photolithography technology used in semiconductor
manufacturing, a photo mask composed of materials such
as fused silica wafer or chromium is required for the pattern
forming. The light source used in developing is Excimer Laser
light such as KrF or ArF.
Our EB ( electron beam ) exposure technology uses an
electron beam as the exposure light source, allowing us to
create a pattern from the digital data directly on the wafer
without using a mask. In LSI manufacturing, particularly
in the development phase, some masks are not used in
manufacturing, but are used only in development such
as for design mistakes, spec changes, and defects during
production. While we already encouraged the reuse of these
masks through recycling, by changing to EB exposure for the
photolithography used in the development process, we have
reduced the number of masks used in production.
Example
our environmental impact by reducing resources. In FY 2009,
EB exposure was also applied to the wiring and bulk layer,
and we further reduced our impact on the global
environment. We aim to double the number of reduced
masks from 102 in FY 2008 to 214 in FY 2009.
Light exposure (comprehensive diagram)
Excimer Laser
Mask
Green exposure technology system
With the refinement of photo mask technology from 90nm
to 65nm to 45nm, production gas become more difficult,
and longer delivery periods and increasing prices become an
issue.
Against this backdrop, there is a demand for reduced turnaround time and cost through the use of maskless exposure
technology, particularly in the product development stage of
cutting-edge technology. In FY 2008, we reduced our use of
masks in the interconnection layers for 90nm/65nm product
prototypes using EB exposure for 90nm/65nm product
prototypes, meeting our customers needs while reducing
Wafer
EB exposure (etching)
In EB exposure no mask is
needed. This is because
the circuit pattern is etched
directly with an electronic
beam, making control
possible through the applied
voltage of the electrode by
modifying the pattern or
orientation directly from the
digital data.
Laser
e-
Beam forming
}
Mask not
needed
In equipment used in the bump-forming process in
semiconductor manufacturing, we adopted a fluxless reflow
system. The bump-forming process removes the oxide film
on solder bump electrodes and forms a bump pattern. In our
equipment, we do not use flux, which makes heavy use of
solvents. Our fluxless reflow systems are currently being used
for mass production of 300mm wafers at our Mie Plant. By
not using flux, the previous process of coating, drying and
washing becomes unnecessary; the amount of energy input
is greatly reduced; and CO2 emissions in the bump-forming
process are reduced by 70%.
CO2 reduction through improved
processing methods
(reducing environmental impact
by not using cleaning agents)
Reducing CO2 by eliminating processing steps
(Shortening the process from 8 to 4.5 hours)
Being environmentally conscious through the
fluxless reflow process
In the former bump-forming process, as shown in the
diagram, the following processing steps were required: flux
coating, flux drying, reflow processing, and solvent cleaning.
However, with our fluxless reflow in which no flux is applied,
the process is complete with only reflow processing, reducing
both waste and the impact on the environment. The bumpforming process for 50 wafers, which used to take from 8-10
hours, has been reduced by around half to 4.5 hours, reducing
CO2 emissions and improving productivity improvement
through reduced resources and energy.
With the change to the fluxless reflow process, we have
eliminated processing steps and improved our processing
method, successfully reducing CO2 emissions in the bumpforming process by approximately 70%.
Former bump reflow and fluxless reflow
Wafer
Former bump reflow
Fluxless reflow
Flux
coating
Flux
coating
Flux
drying
Flux
drying
Reflow
processing
Reflow
processing
Photomask: formed from silica or chromium
Solvent
cleaning
Enlarged EB development
14 |
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
VOICE
e-Shuttle, Inc.
EB Manufacturing Development Dept.
Yasushi Takahashi
Application of maskless EB exposure technology
We are conducting process development to expand
the types of products and layers in which the process
may be used and are aiming to reduce mask use.
We also make sure to always turn off my monitors
and the lights to reduce our environmental impact.
Formic acid exhaust was dissolved
in industrial-use water and acid
neutralization implemented in the
factory
Formic acid atmosphere reflow
Takashi Maruyama
Increased throughput is a particularly important
mission. We are the only company in the world
really engaged in product development using EB
exposure, which makes our work worthwhile. The
mask cost for 65nm reaches into hundreds of
millions of yen. Making these unnecessary would
provide a low-cost development environment for
customers while reducing the number of masks
made from formed silica and chromium. We plan
on continuing to improve our etching performance
through technological development, expand our
market, and use academic conferences and lectures
to stimulate the industry and expand green EB
exposure technology in the world.
The former reflow process using flux required that the
applied flux be cleaned with organic solvents. Furthermore,
after cleaning when these solvents were incinerated as waste
materials, a large amount of CO2 was released. The fluxless
reflow system includes only the reflow process that allows
the factory to be neutralized with formic acid, realizing both
solder bump forming and a large reduction in CO2 emissions.
Beam direction
VOICE
e-Shuttle, Inc.
Shuttle Business Div.
Use of fluxless reflow equipments in 300mm wafers to
reduce CO2 emissions by 70%
Solvent
cleaning
VOICE
FUJITSU MICROELECTRONICS LTD.
Advance Packaging R&D Dept.Ⅱ
LSI Packaging Div.
Hiroyuki Matsui
Introduction of this technology eliminated
incineration of the organic cleaning agents used
during flux cleaning and reduced resources and
energy by shortening the bump-forming process,
reducing CO2 emissions by 70%. We are also
promoting lead-free application and embossing tape
in our packaging made from plant-based plastic
that does not contain petroleum products. We plan
to continue to reduce our environmental impact and
provide eco-friendly products.
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
| 15
Manufacturing that Contributes to the Global Environment
Example
4
Approach to the Environment
Environmental IC packages
In the design of IC packages, use of packaging technology
that introduces cutting-edge technology reduced the total
number of parts and lowered the environmental impact.
We also offer a wide package lineup, providing the optimal
package for our customers needs. Furthermore, we provide
information on the chemical substances our products
contain.
Package on package
Package on Package
Resistor or capacitor
embedded in module
Module Package
FUJITSU MICROELECTRONICS LTD.
Product Development Dept.
LSI Packaging Div.
Chip embedded in package
Embedded Package
Embedded chip exposed
on base
TEQFP
In the 5th Environmental Action Plan created by the
Fujitsu Group, we made it our goal that all business
locations reach at least the 2-star level in the green
factory or green office system by the end of FY 2009.
Fujitsu Microelectronics Group is utilizing this system
not only in our factories, but in our offices as well. By
comprehensively evaluating the level of environmental
friendliness and the independent efforts of our business
locations, we are working to continually improve
environmental friendliness.
16 |
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
Green
Factory
★★★
Three Stars
Further points added for items
unique to the business site
Face
Green
Office
Reduced resource usage (materials, water,
natural energy, paperless operation)
Communication with
the local region
Environmental enlightenment
and education
Safe operation
(environmental risk)
Green purchasing
Soil and groundwater
contamination countermeasures
★★
Two Stars
Targets achieved and basic levels
met for the required items (Each item
is evaluated on a five-point scale in
which five is the best score).
Energy savings and reduction of CO2 emissions
Waste reduction (zero emissions, recycling)
Chemicals and
greenhouse gases
Activities that make contributions to society
Voluntary management
standards
★
Acquisition of ISO 14001 certification
(EMS construction and operation), compliance with laws.
Base
IC chip size mounting possible
WL-CSP
G lobal Warming Measures
Fujitsu Microelectronics Group works to reduce the greenhouse
gases emitted in the business activities at our factories and
offices. We are also making efforts to prevent global warming
in all areas of our business activities while contributing to the
reduction of greenhouse gas emissions by our customers and
society as a whole through the development of low-power IC
products (see P.9).
Energy-saving measures centered on our machinery for power
generation (Installation of energy-saving facilities, free cooling, etc.)
● Installation of co-generation conversion facilities
● Improved efficiency through manufacturing process review
● Appropriate office temperature settings, energy saving with
lighting and office equipment
As a result of these efforts, total CO2 emissions from energy
consumption in FY 2008 was 529 thousand tons. This amounted to
a 10% reduction from the previous fiscal year.
●
● Emissions of CO2 from energy consumption
Reduce emissions of CO2 from energy consumption
Akihiko Murata
As the regulatory and market demands on the
chemical substances included in our products
increase, I believe that developing technology
to reduce the impact on the environment and
providing information related to the environment
is our corporate responsibility. Responses based
on REACH have become the norm of late, and an
efficient and precise response is important. We are
always conscious of reducing our environmental
burden during package development.
Certification level image
One Star
Heat spreader
embedded
TEBGA
VOICE
Green Factory and Green Office
QFP-Type
Required item examples
Multiple IC chips are stacked and combined in one package.
The structure (SiP*, PoP*) also incorporates peripheral parts,
achieving ultra-high-density packaging. A large reduction in
materials is also possible.
Furthermore, by optimizing the structure, thermal
dissipation is improved, and the heat sink that used to be
required can be eliminated, enabling it to be embedded
inside the package (TEQFP, TEBGA) or enabling the same-size
IC chip to be loaded directly in a chip size package (WL-CSP),
reducing the environmental impact in various ways.
* SiP: System in package
* PoP: Package on package.
BGA-Type
Unique item examples
High-density packaging through leading
technology and comprehensive design, packages
that achieve reduced component materials
Different types of chips layered
System in Package
■ Basic philosophy
Fujitsu Microelectronics Group is working to reduce emissions
of CO2 from energy consumption at our factories and offices by
Fujitsu Group s 5th Environmental Action Plan.
■ FY 2008 results
Our group implemented the following measures in FY 2008:
(CO2 ten thousand of tons)
70
60
58.6
52.9
50
52.7
40
30
20
10
0
2007
Base level
2008
Result
2010
Goal
(FY)
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
| 17
Approach to the Environment
Reduction of greenhouse gases other than CO2
■ Basic philosophy
Fujitsu Microelectronics Group follows Fujitsu Group s 5th
Environmental Action Plan and action plans established
independently by the semiconductor industry for the reduction of
greenhouse gases such as PFCs, HFCs and SF6 in factories.
■ FY 2008 results
In FY 2008, with assistance from NEDO (New Energy and Industrial
Technology Development Organization, an independent
administrative agency in Japan), we set up PFC gas removal
systems at new and existing manufacturing lines and converted to
gases with lower global warming potential.
As a result of these efforts, our group-wide emissions in FY 2008
fell to 428,000 tons after conversion
using the global warming potential
index (GWP). This represented a 22%
reduction from the previous fiscal
year.
PFC gas abatement equipment
C hemical and Waste Reduction Measures
We are working to reduce the materials used, and chemicals
and waste emitted, by our business processes and to minimize
manufacturing costs.
Chemical substances management
■ Basic philosophy
As a member of the Fujitsu Group, based on the chemical
substance management guidelines of preventing environmental
risks from the use of hazardous chemical substances that can lead
to pollution of the natural environment and health hazards, we
manage the use of chemical substances at our business locations
and work to reduce and appropriately manage emissions.
■ FY 2008 results
In according with the 5th Environmental Action Plan of the Fujitsu
Group, our group is working to reduce atmospheric emissions of
VOC (volatile organic compounds) at our business locations.
In FY 2008, group-wide VOC atmospheric emissions totaled 150
tons. This was a 4% increase from the previous fiscal year, but in
FY 2009 we plan to work to reduce emissions by increasing the
efficiency of organic solvent collection equipment and promoting
the thorough and appropriate management of VOC substances.
E nvironmental Risk Management
Comprehensive risk response
Our group has always identified natural risks (e.g., earthquakes,
typhoons) and latent risks such as environment pollution caused
by aging plant buildings and environmental facilities, assigned
priorities and implemented scheduled improvements. In FY 2008,
we also began to evaluate these latent risks from the standpoint of
business continuity. We plan to continue our activities to decrease
risk.
Managing PCB waste
For equipment containing PCBs (see chart below) based on the
Law Concerning Special Measures Against PCB Waste (PCB Law),
each plant reports the quantity to the relevant administration and
carefully stores the waste. Furthermore, for highly concentrated
PCB waste whose processing method is stipulated by the PCB Law,
we have already completed early registration with the PCB waste
processing company Japan Environmental Safety Corporation. The
waste will be processed one by one based on the plan.
Storage amount (units)
Type
High
PCB concentration
Low
PCB concentration
Transformer
0
20
Capacitor
22
5
Fluorescent ballasts
0
1,875
Response to soil and groundwater pollution issues
Our group monitors the groundwater on the grounds of our
facilities based on the soil and groundwater survey, response
and disclosure regulations set forth by the Fujitsu Group. We will
continue our monitoring, cleanup and response based on the
situation at the business location in the event pollution has been
verified, and coordinate with public administration to disclose
information.
Soil and groundwater surveys and response
● Emissions of greenhouse gases other than CO2
(GWP ten thousand of tons)
60
48.8
50
30
42.8
38.1
40
Reducing the amount of waste generated
54.9
25.9
■ Basic philosophy
23.3
20
10
0
1995
Base level
2005
2006
2007
2008
Result
2010 (FY)
Goal
VOICE
FUJITSU FACILITIES ENGINEERING LTD.
Engineering Dept.
Aizuwakamatsu Office
Yoshinori Ozawa
Every day through trial and error we aim to optimize operations
of the super-clean-room climate-control equipment at the Fujitsu
Microelectronics Aizu-Wakamatsu plant to minimize the effect on
products and reduce energy consumption as much as possible.
We also try to conserve energy in our everyday lives, never forgetting
to unplug.
18 |
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
As a member of the Fujitsu Group, based on the basic guidelines of
the 3Rs (Reduce, Reuse, Recycle) to create a recycling-based society,
we are promoting the separation of waste by each employee to
take an even more elevated approach to the 3Rs.
■ FY 2008 results
In keeping with the 5th Environmental Action Plan of the Fujitsu
Group, our group is working to reduce the waste generated by our
business locations.
In FY 2008, group-wide waste generation totaled 11,000 tons.
This was a 22% decrease from the previous fiscal year. This was due
to not only to converting things like waste plastic and waste acid
into valuable resources, but also to significant market changes.
As the result of an independent survey at the Mie Plant, fluoride
contamination in the groundwater and lead contamination in the
soil were discovered and reported to public administration. As this
pollution was discovered in the center of the plant grounds, there
were no problems with the groundwater at the border line of the
lot. The groundwater pollution was discovered in the standing
water of a detection hole (a hole several meters deep dug near the
plant to detect leaks in underground holding tanks and pipes) at
the plant.
However, a comprehensive survey of the history of the land use
and chemical substances, determined that the soil pollution was
caused naturally. In this case, we reported the pollution situation
and our response to the neighboring residents and relevant
administration.
Furthermore, with the closing of the Fujitsu Integrated
Microtechnology Ltd. Monden Plant, as a result of a survey based
on the Article 3 of the Soil Contamination Countermeasures Act,
it was determined that there was no soil pollution. This result was
reported to the relevant administration.
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
| 19
Approach to the Environment
Environmental Communication
Fujitsu Microelectronics Group works to ensure that each of us acts as a good member of
society even before acting as an employee, aiming for mutually beneficial relationships with
both the international and local communities.
E nvironmental Social Contribution
Environmental conservation activities
Fujitsu Microelectronics Group, as a member of society, contributes
to the local community through environmental social contributions
such as regional cleanup activities and tree planting activities.
Furthermore, recognizing the importance of the natural
environment, our employees participate in environmental
conservation activities to preserve nature for the next generation and
give lessons on the environment to children of neighborhood
schools.
Through regional contribution activities, environmental
conservation activities and environmental education activities, we
continue to deepen exchanges with the international and local
community and promote broad social contribution activities.
Our group s employees also participate in the Fujitsu Group groupwide activities such as tree planting and forest conservation.
Overseas, with the goal of restoring the rainforest in Borneo,
Malaysia, we have planted dipterocarp, an old-growth species.
Through continued tree-planting activities, several species of
birds and monkeys that had disappeared from the rainforest have
returned. In Japan, we are involved in conservation activities such as
thinning operations and preparing areas for Shiitake mushrooms to
grow in the Hachioji Tobuki Northern Woods Conservation Area.
Distribution of organic fertilizers
to local communities
At the Miyagi Plant, raw garbage
from the employee cafeteria is turned
into fertilizer and distributed by
employees to elementary and middle
schools and the local soba producer
association in the local town of
Murata, deepening our relationship
with the local community.
Participation in local eco-forums
In Miyagi Prefecture, companies from different industries get together
in different areas, and eco-forum activities are conducted to share
environmental information and contribute to the local community. At
the Miyagi Plant, we participate in the Murata, Ogawara, Shibata EcoForum to promote community exchange on the environment.
FUJITSU INTEGRATED MICROTECHNOLOGY LTD.
Environmental education activities
Fujitsu VLSI Limited and Fujitsu Microelectronics Akiruno
Technology Center visit schools to give environmental lessons to
children. At elementary schools, children take apart computers
to learn about the 3Rs (Reduce, Reuse, Recycle) and deepen their
understanding of the environment.
Regional contribution activities
E xternal Awards and
Environmental Awareness
We would like to introduce the various awards Fujitsu
Microelectronics Group has received for its environmental activities
and our employee environmental awareness activities centered on
our FY 2008 activities.
External Awards
Fujitsu Microelectronics and Fujitsu LSI Solutions Limited were
awarded 2nd Place in the 2009 Semiconductor of the Year
contest held by The Semiconductor Industry News for their ultrahigh-speed security processor (MB86C61/60A).
Our group received the Award for 10 Years of a Continued
Environmental Management System" from the Japan Audit and
Certification Organization. This was given to entities that acquired
certification prior to March 1999 and continue their environmental
activities today.
Entities that received the award included Fujitsu Microelectronics
(Iwate Plant, Aizu-Wakamatsu Plant, Mie Plant), Fujitsu Integrated
Microtechnology Ltd. (Aizu Plant, Miyagi Plant, Kyushu Plant) and
Fujitsu VLSI Limited.
Looking to win the Flower Garden Contest for the third
straight year
We enter the Flower Garden Contest held by Aizuwakamatsu city
every year and received the highest award two years in a row from
2007 to 2008. A theme is selected at the start of each year, and in
2009 we began our flower garden design with the theme of refreshing
summer colors. We are working hard to win for the third straight year.
Meetings to read environmental
reports that start in the community
(Iwate Plant)
Planting lavender seedlings
(Aizuwakamatsu Plant)
Environmental lesson
Tree planting activities in
Malaysia
VOICE
Woodland conservation
activities
Park Adapt Program (Mie Plant)
FUJITSU INTEGRATED MICROTECHNOLOGY LTD.
Manufacturing Dept.Ⅰ
ENVN Products Manufacturing Div.
Eco Cap Program
(FUJITSU LSI TECHNOLOGY LTD.)
FUJITSU SEMICONDUCTOR TECHNOLOGY, INC.
Katsuichi Nishi
I am in charge of the process control for the back-end of the
semiconductor manufacturing at our plant. At the factory, to
contribute to energy saving and reduce costs, the rule is to turn off
power in idle equipment and turn off ancillary equipment on our
microscope when not in use. We also reduce waste by distributing
only a fixed number of masks and checking for air leaks, preventing
wasted resources and costs. Also, we work daily to actively do what
we can to “prevent global warming” and “go easy on our wallets”
by, for example, using a broom whenever possible to avoid using a
vacuum cleaner, and using rainwater to water flowers.
Misaka Kogen Clean Health Walk
(FUJITSU SEMICONDUCTOR
TECHNOLOGY, INC.)
20 |
Shin-Yokohama IT Cluster Exchange
(FUJITSU MICROELECTRONICS
SOLUTIONS LTD.)
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
Tree planting activities in Hong Kong
(FUJITSU MICROELECTRONICS ASIA LTD.)
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
| 21
Approach to the Environment
Environmental awareness activities
To increase the environmental awareness of each employee of
Fujitsu Microelectronics Group, we conduct various environmental
education and environmental awareness activities. In addition,
we also participate in the Fujitsu Group-wide education menu
such as environmental e-learning and waste management
representative seminars given by external lecturers. Furthermore,
group companies also offer independent environmental education.
In our environmental month, we conduct workshops through
video, to help learn about everyday environmental activities such
as container recycling, and to heighten environmental awareness.
We also conduct tours of environmental facilities, small
environmental exhibits and environmental seminars such as The
Current State and Function of the Forests, What We Can Do, given
by external lecturers.
To enhance environmental awareness in primary operations, Fujitsu
Microelectronics held an environmental lecture given by the head
of Fujitsu s Environmental Division entitled The Role of the IT
Industry in Preventing Global Warming. More than 200 employees
participated in the lecture, which connected the network between
headquarters and the Sendai and Osaka business locations.
F Y 2008 Results
Fujitsu Microelectronics Group has established clear targets that take
into account all group business areas based on the Stage V Fujitsu
Group Environmental Protection Plan, and is taking a planned and
continual approach to environmental conservation activities. In FY
2008, yearly objectives for all seven categories were achieved.
The Stage V Environmental Protection Plan was concluded in FY
2009. To achieve the mid-term plan, the group must come together
thorough environmental management.
Outstanding results for FY 2008
FUJITSU MICROELECTRONICS SOLUTIONS LTD.
Environmental Management System
In FY 2008, we paid particular attention to greenhouse gases
other than CO2 greenhouse reduction. This gas is unique to
semiconductor manufacturing, so we strongly believe that we have
to reduce it.
E nvironmental Management
Fujitsu Microelectronics Group participates in the comprehensive
environmental activities of the Fujitsu Group, and all of its domestic
group companies and many of its overseas groups companies have
received ISO14001 certification.
We promote environmental management through the operation
of the environmental management systems, efforts toward
continual improvement, environmental audits and environmental
education.
Environmental management system
In order to respond quickly to executive decisions, Fujitsu Group s
environmental management system (EMS) combines line activities
to promote environmental conservation activities in line with the
characteristics of each business based on the organization of each
business, and site activities for themes that are shared by each
factory and office.
Our firm and our group companies conduct similar activities
22 |
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
Improving the
environmental
value of products
and services
under the umbrella of the Fujitsu Group comprehensive EMS.
We are making preparations to consolidate EMS in our group as
well, to increase the sense of solidarity in semiconductor-focused
environmental activities.
ISO14001 certification acquisition
and environmental audits
At the end of FY 2004, Fujitsu Group acquired the international
EMS standard ISO14001 for its domestic consolidated subsidiaries,
and was conducting environmental activities based on the
management system at a total of 97 Fujitsu and domestic group
companies and 11 overseas group companies acquired the global
unification certification in FY 2005. Furthermore, to ensure the
objectivity and independence of internal audits at the Fujitsu
Group, a Management Audit Division that belongs to neither
reporting line took the central role in gathering auditors from
Fujitsu and Group companies to conduct internal audits. Our group
implemented internal audits at our domestic manufacturing and
office locations and overseas sales locations in FY 2008, identifying
12 minor nonconformances and making 33 observations, all of
which were corrected by April 2009.
VOICE
FUJITSU VLSI LTD
Design Dept.Ⅰ
Analog Products Development Div.
Kimitaka Yoshiyama
I am working on the “low-power design of automobile power ICs,”
and through my work, I am trying to reduce my the environmental
impact. I also conserve energy and recycle trash as part of my
everyday environmental activities. While these may be small,
by continuing with them I believe we can improve our living
environment.
● Stage V Fujitsu Group Environmental Protection Plan Progress in FY 2008
Five Priority Areas
Based on the frame-work of the Fujitsu Group environmental management system founded on
ISO14001, we are working to improve the environmental impact unique to the semiconductor
industry and improve the environmental characteristics of the semiconductor products we provide
to our customers.
We produced great results from our improvement efforts, and
received 1st Place in the FY 2008 Fujitsu Group Environmental
Contribution Awards. This was a case in which the environmental
management system activities produced great results.
Global warming
countermeasures
Environmental
contributions
to society
Achievement Related
Page
Status
FML Group
FY 2008 Targets
FML Group
FY 2008 Results
【Increase the number of Super Green Products】
Targeting the Green Products being newly developed in all
business units, by the end of FY 2009 we aim to increase by
over 50% the proportion of products that are Super Green
Products with top-class environmental characteristics.
● FML Group working for an environmental target of 100%
(all 9 products).
More than 33% (created
two product series)
Super Green Products
created from two series
○
6
【Achieve an improved environmental efficiency factor】
By FY 2009 we will strive to achieve an environmental
efficiency factor of 2 relative to products in FY 2005 for
newly developed Green Products in all business units.
● FML Group working for an environmental target of 1.5 .
Achieve environmental
efficiency factor of 1.4
Achieved environmental
efficiency factor for
target products of 1.95
and 6.67
○
7
【Reduce CO2 emissions from energy consumption】
Limit energy-consumption-related CO2 emissions at our
business sites to below FY 1990 levels by the end of FY 2010.
● FML Group working for an environmental target of a 10%
reduction compared to FY 2007 (527,000 tons of CO2).
Reduce CO2 emissions to
below 600,000 tons
CO2 emissions of
529,000 tons
○
17
【Reduce greenhouse gases other than CO2】
We will work to reduce emissions of greenhouse gases
other than CO2 by 10% relative to FY 1995 emissions by the
end of fiscal 2010.
● FML Group working for an environmental target of
reducing emissions to 233,000 tons GWP in FY 2010
compared to 259,000 tons GWP in FY 1995.
Reduce PFC emissions
to below 622,000 tons
FY 2008 PFC emissions
of 428,000 tons
○
18
【Reduce VOC emissions】
We aim to reduce volatile organic compound (VOC)
emissions by 30% relative to FY 2000 levels by FY 2009.
● FML Group working for an environmental target of
reducing emissions to 130 tons in FY 2009 compared to
110 tons in 2000.
Reduce VOC emissions
to below 230 tons
FY 2008 VOC emissions
of 150 tons
○
18
【Reduce waste generation】
We will strive to reduce waste generation by 3% relative to
2005 levels by the end of FY 2009.
● FML Group working for an environmental target of
10,000 tons of waste in FY 2009 compared to 13,000 tons
in FY 2005.
Reduce waste to below
16,000 tons
FY 2008 waste of
11,000 tons
○
18
【Activities for environmental contributions to society】
We will carry out locally attuned activities that make
environmental contributions to society and in which each
of our employees can play an important role.
One environmental
and social contribution
activity implemented at
each location yearly
One social contribution
activity is implemented
at each FML group
location yearly.
○
20
Stage V Environmental Protection Plan Targets
( FML Group in the chart refers to Fujitsu Microelectronics Group)
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
| 23
Approach to the Environment
B usiness Activities and Environmental
Impact (Material Balance)
INPUT
City gas
Kerosene
Heavy oil
726 kl
31,075 kl
3
1,746,311 m
Chemical
substances
Water
electricity
1,034,975 MWh
LPG
3
3
13,280,293 m
557 t
Purchased
156 m
Fujitsu Microelectronics Group
SOx emissions
NOx emissions
CO2 emissions
55.7 t
148.9 t
529,219 t
Chemical
substances
Waste water
3
Amount of
waste generated
12,576,136 m
3.5 t
10,665 t
Corporate Profile
E nvironmental Accounting
Fujitsu Microelectronics Group quantitatively measures input
and output in order to reduce the overall environmental impact
generated at each stage of production. The promotion of Groupwide environmental management and environmentally friendly
business activities is crucial to achieving this goal. It enables
the Group to take a planned approach to the reduction of
environmental impact related to materials procurement and the
use of energy, water resources and chemical substances.
Based on our environmental management system, through
the entire lifecycle from product development and design to the
collection and recycling/reuse of packing materials, we work to
reduce our environmental impact while effectively using limited
resources. And, by providing environmental semiconductors and
electronic devices, we work to reduce the environmental impact of
our customers product.
Fujitsu Microelectronics Group Corporate Profile
Our group calculates the cost and economic benefits of our
environmental activities in our business based on Fujitsu Group s
Environmental Accounting Guidelines, which implements
environmental accounting that evaluates the effects of
environmental investments. Through environmental accounting,
the results of the evaluation are reflected in group environmental
management. Long-term, continual environmental policies are
pursued, environmental investment made more efficient and
environmental conservation activities stimulated.
FY 2008 total results
FUJITSU MICROELECTRONICS LIMITED
Corporate name
Location of head office
Haruki Okada
President
Date of establishment
March 21, 2008
Business description
Design, development, manufacturing, and sale of LSI products
60,000 million yen
Capital
As shown in the chart, group environmental accounting in FY 2008
resulted in capital expenditures of 259 million yen, costs of 3,689
million yen and economic benefits of 4,707 million yen.
■ Amount of investment
In FY 2008, investment focused on pollution prevention measures
and global-warming-prevention measures (e.g., the installation of
PFC removal systems).
■ Costs
We are continuing to take a planned approach to making
improvements in energy conservation and reduced waste
measures, focused on air and water pollution costs (e.g.,
environmental analysis fees).
Pollution prevention, environmental conservation and
resource circulation cost are all part of the total cost because we
use chemical substances, and processing the waste generated
during and after the use of the chemical substances required for
semiconductor manufacturing. However, by analyzing results
of the environmental accounting totals, we are making efficient
environmental investments and reducing our environmental
impact.
FUJITSU MICROELECTRONICS LTD.
Group companies
・Akiruno Technology Center
・Mie Plant
・Aizuwakamatsu Plant
・Iwate Plant
FUJITSU ELECTRONICS INC.
FUJITSU INTEGRATED MICROTECHNOLOGY LTD.
・Aizu Plant
・Miyagi Plant
・Kyushu Plant
FUJITSU VLSI LTD.
FUJITSU LSI TECHNOLOGY LTD.
FUJITSU LSI SOLUTIONS LTD.
FUJITSU MICROELECTRONICS SOLUTIONS LTD.
FUJITSU SEMICONDUCTOR TECHNOLOGY, INC.
e-Shuttle, Inc.
FUJITSU FACILITIES ENGINEERING LTD.
OUTPUT
FUJITSU MICROELECTRONICS AMERICA, INC.
FUJITSU MICROELECTRONICS EUROPE GmbH
● Fujitsu Microelectronics Group Environmental Accounting Total Results (FY 2008)
Item
Nomura Fudosan Shin-yokohama Bldg. 10-23,
Shin-yokohama 2-Chome, Kohoku-ku Yokohama Kanagawa 222-0033, Japan
Main areas covered
Unit: million yen
Capital
investment
Cost
FUJITSU MICROELECTRONICS ASIA PTE. LTD.
Economic
benefits
FUJITSU MICROELECTRONICS PACIFIC ASIA LTD.
FUJITSU MICROELECTRONICS (SHANGHAI) CO., LTD.
63
1,744
1,557
175
678
648
FUJITSU MICROELECTRONICS KOREA LTD.
Disposal of waste, efficient utilization of resources, etc.
0
839
2,216
FUJITSU GLOBAL MOBILE PLATFORM INC.
Collection, recycling, reuse, and proper disposal of
products, etc.
Maintenance and operation of environmental
management systems, environmental education of
employees, etc.
Research and development of products that
contribute to environmental protection, etc.
0
5
49
0
401
36
0
0
1
Societal activity costs
Donations to, and support for, environmental
groups, etc.
0
0
0
Environmental remediation costs/benefits
Restoration and other measures related to soil and
groundwater contamination.
21
21
200
259
3,689
4,707
Business area
costs/benefits
Pollution prevention cost/benefits
Preventing air pollution/water pollution, etc.
Global environmental conservation
cost/benefits
Preventing global warming, saving energy, etc.
Resource circulation costs/benefits
Upstream/downstream cost/benefits
Administration cost/benefits
Research and development costs/benefits
Total
Survey Request
Thank you for reading Fujitsu Microelectronics Group Environmental Report 2009. To help us in creating the next report, we ask for your
cooperation in completing the survey found on the following link. Those completing the survey will be sent a copy of Fujitsu Microelectronics
Group Environmental Report 2010.
Survey link http://www.fujitsu.com/global/services/microelectronics/environment/
Note: Figures may not add to total due to rounding.
24 |
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
FUJITSU MICROELECTRONICS GROUP Environmental Report 2009
| 25
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