Fujitsu to Launch ARM1176 Prototyping Kit

Fujitsu to Launch ARM1176 Prototyping Kit
Fujitsu Microelectronics Limited
Fujitsu to Launch ARM1176 Prototyping Kit
Tokyo, May 8, 2008 - Fujitsu Microelectronics Limited (FML) today announced that it will
launch an ARM1176 prototyping kit, designed to shorten the development lead time for
customers using FML's ASIC(1) and COT(2) services to develop system LSIs that
include the ARM1176JZF-S™, ARM926EJ-S™, or ARM946E-S™ processor cores. The
new prototyping kit will include an evaluation board loaded with chips for trying out the
ARM1176JZF-S processor, a FPGA(3) reference design, and sample programs. FML's
prototyping kit will enable customers to debug their logic circuits and develop device
drivers before fabrication of their chips, resulting in a faster system-LSI design process.
The new kit will be available from July 2008, and will be exhibited at the 11th Embedded
Systems Expo, to be held from May 14 to 16, 2008 at Tokyo Big Sight.
As digital audio-visual equipment increasingly features higher and more multiple
functionalities, embedded system LSIs have become larger and more complicated,
heightening the importance and need for more streamlined development cycles.
In order to shorten development lead times for system LSIs used in digital audio-visual
equipment that process still or moving images - such as digital still cameras, digital video
cameras, and mobile phones - in addition to logic simulation, it is mandatory to execute
verification in an environment that resembles as closely as possible the actual resulting
system LSI.
Through its ASIC and COT services, for customers developing system LSIs using the
ARM926EJ-S and ARM946E-S processor cores, FML already offers a prototyping kit
that includes an evaluation board with LSIs and FPGAs for evaluation, as well as an
FPGA reference design. FML will offer a new prototyping kit for the ARM1176JZF-S, for
which demand is growing.
Customers can use the prototyping kit when developing high-performance system LSIs
capable of image processing, for example, to debug both their hardware and software in
an environment that closely resembles the actual system LSI, thereby enabling
"first-shot full operation" of engineering samples, thus further shortening the
development lead time.
Press Contacts
Fujitsu Semiconductor Limited
Inquiries :
Figure 1: Visual overview of the ARM1176 Prototyping Kit
Sample Price and Availability
Product Name
ARM1176 Prototyping Kit 4.3 million JPY From July 2008
Product Features
1. Verification can be performed in near real conditions
Performance of the external AXI bus - which connects the evaluation LSI for ARM
processors on the evaluation board with the FPGA loaded with the customer's logic
circuit - was improved by a range of from 8 times to up to 16 times (FML comparison)
compared to previously available products. This makes it possible for customers to verify
their own logic under conditions that closely resemble the resulting system LSI. Due to
the fact that system LSIs for still images or video processing take a considerable amount
of time to verify using logic simulation, practical testing that resembles the actual system
LSI environment can shorten the development lead time.
2. FPGA reference design helps shorten LSI development lead time
Because the FPGA reference design includes dummy modules that comply with
industry-standard advanced microcontroller bus architecture (AMBA (4)), customers can
simply switch the dummy modules with their own modules to easily build a prototype
design of a system LSI based on the ARM1176JZF-S.
Using this FPGA, customers can verify their custom logic and develop device drivers
before the system LSI has been fabricated, thereby reducing the development lead time.
The evaluation board is compatible with the HapsTrak specification of the prototyping
board from Synplicity, with an expandable FPGA domain.
Application-specific IC. A custom IC for specific applications (customers).
2 COT:
Customer-owned tooling. Refers to customers designing and developing their own chips.
Unlike mere foundry business, the LSI manufacturer collaborates with the customer from
the design stage.
FieldField-programmable gate array. A chip in which logical operation can be
reprogrammed after manufacture.
Advanced microcontroller bus architecture. An industry-standard SoC (System on Chip)
on-chip bus from ARM.
Press Contact:
Public and Investor Relations
Fujitsu Limited
About Fujitsu Microelectronics (FML)
Fujitsu Microelectronics Limited designs and manufactures semiconductors, providing highly
reliable, optimal solutions and support to meet the varying needs of its customers. Products and
services include ASICs/COT, ASSPs, power management ICs, and flash microcontrollers, with
wide-ranging expertise focusing on imaging, wireless, automotive and security applications.
Fujitsu Microelectronics also drives power efficiency and environmental initiatives.
Headquartered in Tokyo, Fujitsu Microelectronics Limited was established as a subsidiary of
Fujitsu Limited on March 21, 2008. Through its global sales and development network, with sites
in Japan and throughout Asia, Europe, and the Americas, Fujitsu Microelectronics offers
All company or product names mentioned herein are trademarks or registered trademarks of
their respective owners. Information provided in this press release is accurate at time of issue
and is subject to change without advance notice.
Key Specifications of the ARM1176 Prototyping Kit
Evaluation Board
External Bus
LSI used to evaluate
ARM processor
Flash memory 32MB
Mobile DDR SDRAM 128 MB
External Interface
Ethernet, UART, ICE
Multi-core processor
ARM1176JZF-S (max. 500 MHz),
ARM926EJ-S (max. 400 MHz),
ARM946E-S (max. 400 MHz)
Process technology
CMOS 90nm
low power-consumption process
FCBGA (*2) 1156 (35mm x 35mm)
Power consumption
ARM processors evaluation LSI and
64 bit External AXI (*1) (DDR, max.
100 MHz)
1.2 W (ARM1176JZF-S: operating at
500MHz, typ.)
FPGA reference design, sample program, simulation model, user’s
Advanced eXtensible Interface. A high-speed bus conforming to
ARM’s AMBA 3.0 specification. Used as processor bus for
A multi-pin package that includes flip-chip bonding technologies.
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