Package Lineup/ Forms/ Structures 1. Package Lineup

Package Lineup/ Forms/ Structures 1.   Package Lineup
Package Lineup/ Forms/
Structures
1. Package Lineup
2. Package Forms
3. Package Structures
DB81-10002-2E
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Package Lineup/ Forms/ Structures
1. Package Lineup
PACKAGE
1. Package Lineup
The packages are classified as follows, according to form, material, and the mounting methods
for which they are suited.
Packages
Lead inserted type
Matrix type
Standard
PGA
Surface mounted type
Flat type
Dual lead
SOP
TSOP I
TSOP II
LSSOP
TSSOP
Quad lead
QFP
LQFP
TQFP
UQFP
HQFP
Leadless chip carrier
Quad lead
Matrix type
QFN
BGA
FBGA
SPGA
Tape carrier
2
Dual lead
DTP
Quad lead
QTP
DB81-10002-2E
Package Lineup/ Forms/ Structures
1. Package Lineup
PACKAGE
Name of
package
Description
Lead pitch (mm)
PGA
Pin Grid Array Package
SOP
Small Outline Package (straight lead)
Small Outline L-Leaded Package
SSOP
Shrink Small Outline L-Leaded Package
0.65/0.80/1.00
TSOP (1)
Thin Small Outline L-Leaded Package (1)
0.50/0.55/0.60
TSOP (2)
Thin Small Outline L-Leaded Package (2)
0.50/0.80/1.00/1.27
SON
Small Outline Non-Leaded Package
QFP
Quad Flat Package (straight lead)
Quad Flat L-Leaded Package
1.27/2.54
1.27
0.50/1.00
0.40/0.50/0.65/0.80/1.00
LQFP*
Low-Profile Quad Flat L-Leaded Package
TQFP
Thin Quad Flat L-Leaded Package
HQFP
QFP with Heat Sink
LCC*
Leadless Chip Carrier
QFN
Quad Flat Non-Leaded Package
BGA
Ball Grid Array
FBGA
Fine pitch Ball Grid Array
0.8/0.75/0.65/0.5
DTP
Dual Tape Carrier Package
⎯
QTP
Quad Tape Carrier Package
⎯
0.40/0.50/0.65/0.80
0.40/0.50
0.40/0.50/0.65
1.016/1.27
1.27/1.0
*: Package name used by Fujitsu Microelectronics Limited
DB81-10002-2E
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Package Lineup/ Forms/ Structures
2. Package Forms
PACKAGE
2. Package Forms
Packages can be broadly classified into two types according to the mounting method used:
Lead inserted type: The leads on the package are inserted into through holes in a printed
circuit board, etc., and then soldered in place.
Surface mounted type: The device lays flat on surface of the circuit board and the leads are
soldered directly to the wires.
In addition, each of the various package forms has its own unique features.
Figure 1 Lead insertion types
Illustration
Name of
package
Features
The leads on this package extend
straight down from the bottom of the
package in a grid arrangement. This
package is suited for high-density
mounting of packages with 64 or more
pins. A special surface-mount version
of this package is available with a lead
pitch of 1.27mm.
PGA
Lead pitch
Standard : 2.54mm
Figure 2 Surface mounted types
Illustration
Name of
package
Features
Lead pitch
SOP
SOL *
The leads on these packages extend out
from two edges of the package; the
leads are either gullwing (L-shaped) or
straight.
Packages that conform with JEDEC
specifications are called "SOL".
Standard : 1.27mm
QFP
The leads on this package extend out
from four sides of the package; the
leads are either gullwing (L-shaped) or
straight.
1.00mm
0.80mm
0.65mm
SSOP
LQFP *
These packages are compact versions
of the SOP and QFP. (The lead pitch
and body size are smaller.)
SSOP : 0.65mm/0.80mm/
1.00mm
LQFP : 0.40mm/0.50mm
Package name used by Fujitsu Microelectronics Limited.
(Continued)
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DB81-10002-2E
Package Lineup/ Forms/ Structures
2. Package Forms
PACKAGE
(continued)
Illustration
Name of
package
Features
Lead pitch
TSOP
TQFP
These packages are thinner versions of
the SOP and QFP. (Mounted height:
1.27 mm max.)
TSOP : 0.50mm/0.55mm/
0.60mm
TQFP : 0.40mm/0.50mm
LCC
QFN
This package has no leads; instead, it
has only electrode pads for soldering.
A ceramic leadless chip carrier is a
compact, high-reliability representative
of this type of package.
Standard: 1.27mm
Among LCCs with
many pads, 1.016mm,
0.635mm and other
fine-pitch packages are
currently under
development.
DTP
QTP
This type of package, generally called a
"TAB package," consists of an IC chip
mounted by means of TAB technology
on a tape on which the wiring pattern is
formed; the chip is then coated with
resin. This package is suited for the
increasing number of pins required in
chips and for high-density mounting.
There are three tape widths: 35 mm, 48
mm, and 70 mm.
0.50 to 0.15mm
160-01
JAPAN
This package has a grid of equally
spaced leads (solder ball) on the
underside of the package.
The BGA package is suitable for high
density mounting and includes the
following types:
BGA
FBGA
DB81-10002-2E
E-BGA: The package is die bonded
directly to a heat sink for improved heat
dissipation.
T-BGA: A low-profile package with a
metal-rich construction that provides
excellent heat-withstanding and
thermal resistance characteristics.
FC-BGA: A high pin count package
that uses flip chip bonding technology.
Same as the BGA package but with a
finer lead pitch.
1.00mm
1.27mm
0.5mm
0.65mm
0.75mm
0.8mm
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Package Lineup/ Forms/ Structures
3. Package Structures
PACKAGE
3. Package Structures
3.1
Structure diagrams
Structure diagrams for typical packages are shown below.
Ceramic PGA (laminated)
Cap
(ceramic, metal)
Seal
(Low melting point braze metal)
Metalize
(tungusten)
Laminated ceramic
(alumina)
Pin (Kovar)
Lead finish
Au plating or
solder dip
Plastic FBGA
Chip
Resin
Au wires
Print board
Die attach
Solder balls
Plastic BGA (mold type)
Chip
Resin
Au wires
Solder balls
Printed substrate
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DB81-10002-2E
Package Lineup/ Forms/ Structures
3. Package Structures
PACKAGE
Plastic BGA (cavity down type)
Chip
Resin
Au wires
Solder balls
Multilayer printed substrate
Stage
Plastic LCC (BCC type)
Chip
AU bump
AU wires
Resin
Pin
Lead finish
Pd/Ni/Pd plating
Plastic QFP
Chip
Resin
Au wiring
Lead frame
(Fe-Ni alloy or Cu alloy)
Lead finish
DB81-10002-2E
Solder plating
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Package Lineup/ Forms/ Structures
3. Package Structures
PACKAGE
Tape carrier package
Resin
Chip
Inner lead (Cu)
Outer lead(Cu)
Test pad
Lead finish
8
Sn plating
DB81-10002-2E
Package Lineup/ Forms/ Structures
3. Package Structures
PACKAGE
3.2
Sample Assembly Process
Sample assembly process for a Lead frame type IC chip
(From primary testing)
Completed wafers are
checked electrically before
entering the assembly process.
Spindle
Grinding
Wafer
Reverse side grinding
Wafers are ground to an
appropriate thickness for
packaging.
Stage
Dicing blade
Wafer
Dicing
Individual chips are
separated using a dicer.
Die collet
Die bonding
The chip is attached to a
lead frame with a silver paste.
Wire bonding
Gold wires are placed
between the chip and leads
Inner lead
Silver paste
Molding
Stage
Chip
Wires
Inner leads
The package is molded
using epoxy resin
Top
Resin
Lead frame
External plating
Embossing
External lead formation
(To final testing)
DB81-10002-2E
External leads are solder
plated to make them easier
to solder during mounting
The manufacturer’s name, country
of origin, model and lot number are
embossed on the package
Bottom
F
JAPAN
MBXXXX
The LSI is separated from the lead
frame and external leads are
formed, completing the assembly
process
Products are electrically
tested before shipment
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Package Lineup/ Forms/ Structures
3. Package Structures
PACKAGE
Sample assembly process for a BGA type IC chip
Wire bonding
Up to the wire bonding stage, the
process is the same as for a lead
frame type IC
Only the top side is molded
Molding
Top
Base board
Resin
Bottom
Embossing
The manufacturer, model
and lot number are
embossed on the package
Solder balls
Ball mount
Dicing
(To final testing)
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Solder balls are mounted on
the terminals of the package
board
Package boards are diced to
separate IC’s, and the assembly
process is finished.
Dicing blade
Package board
Products are electrically
tested before shipment
DB81-10002-2E
Package Lineup/ Forms/ Structures
3. Package Structures
PACKAGE
3.3
Structural materials
Some of the materials of which packages are composed are described below.
Alumina
Al2O3 90 to 95%. Used as a substrate material in typical ceramic packages. Substrates are
divided into several different types according to the percentage content of Al2O3, with
each demonstrating slightly different physical properties.
Low melting
point glass
Primary components include PbO, B2O3 , SiO2 , and Al2O3 . Primarily used for seal
between the ceramic substrate and the lead frame in cerdip packages, or for sealing the
ceramic cap on a laminated ceramic package.
Epoxy resin
Raw material for plastic packages; phenol-hardened epoxy resin is primarily used.
Kovar
An iron-nickel-copper alloy. Because it has a coefficient of thermal expansion near that of
ceramics, it is used primarily for metal caps and external leads in laminated ceramic
packages.
42 alloy
Iron-nickel alloy (42% nickel). Generally used as the lead frame material in cerdip
packages and plastic packages. Also used as external lead material in laminated ceramic
packages.
Copper (Cu)
A copper alloy (a copper-nickel-tin alloy) is used as the lead frame material in plastic
packages. Also used as a structural material in ceramic packages. When lowering thermal
resistance is an objective, a copper film, a copper-molybdenum compound or a copper
alloy may be used as the intermediate metallic material between the bottom of the chip and
the heat dissipation fins. Copper has also recently gained attention for use in bonding
wires.
Tungsten (W)
Raw material for metallized paste used in the wiring patterns (internal wiring) of laminated
ceramic packages. The paste is screen printed on the unsintered ceramic substrate and is
then sintered simultaneously with the ceramic.
Silver (Ag)
There are partially silver-plated inner pattern tips and portions of the stage with chip in the
lead frame of a plastic package. Silver is also used in the metallized paste used in the chip
mount in a cerdip package. A silver paste is also used as an adhesive between the chip and
substrate.
Aluminum (Al)
Used as a wire material for wire bonding (ultrasonic type). In addition, aluminum is
sometimes vapor deposited or pressed onto the tips of the inner pattern of the lead frame in
a cerdip package for its bonding characteristics. Aluminum is also often used for heat
dissipation fins.
Gold (Au)
Used as a wire material for wire bonding (nailhead type). Gold plating is also often used
for the metallized pattern and external leads in a laminated ceramic package.
Tin (Sn)
The external leads of most cerdip packages are often tin-plated. A gold-tin alloy (20% tin)
is also used as a sealing solder for the metal cap on a ceramic package.
Lead-tin (solder)
A variety of solders with differing characteristics can be obtained by changing the ratio of
lead-tin composition. At present, lead-tin amalgam solders (normally called solder plating)
are used for external lead processing of plastic packages. Also used for sealing metal caps
on ceramic packages. In addition, used for solder dip processes for external leads.
Tin-bismuth
(solder)
A lead-free solder, used for external lead processing of plastic packages in lead-free
mounting operation.
Tin-silvercopper (solder)
A lead-free solder, used for solder balls on BGA packages.
Polyimide tape
This is the primary material in the tape used for TCP. This tape is generally made from
pyromellitic dianhydride and aromatic diamine. In addition to the ability to withstand high
temperatures, this tape also possesses excellent mechanical, electrical, and chemical
characteristics.
DB81-10002-2E
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Package Lineup/ Forms/ Structures
3. Package Structures
PACKAGE
■ Lead-Free Packages
The use of lead-free electronic components is mentioned as a significant issue in global
environment assessments.
Lead is a harmful heavy metal, which if absorbed and accumulated in the body is reported to
cause damage including inhibited growth in children and psychological damage in adults.
In particular, lead can leach from electronic products that have been disposed of in land fills,
from contact with acid rainwater. This can lead to contamination of rivers and ground water,
and can thereby enter the body through drinking water.
At Fujitsu, we have actively addressed this problem by starting the production of lead-free
products with semiconductor packages completely free of lead as of October, 2000.
(1) Lead-free Products
QFP package
Tin-bismuth solder used in solder plating
for external lead treatment
solder plating
BGA package
Tin-silver-copper balls used in solder
balls for external leads
solder ball
Caution
Lead-free materials are still under development for other applications including die
bonding materials for power devices, and sealing materials for ceramic packages.
(2) Heat Resistance in Lead Free Packages
In general, lead-free solder has a higher melting point than eutectic solders, requiring
the mounting temperature to be increased by 10 to 20 °C. For this reason Fujitsu has
addressed improvement of package heat resistance as part of the development of
lead-free packaging.
(3) Differentiation from Previous Products
Lead-free products are distinguished from previous products in the following ways :
1. The classification code “E1” is added to the end of the product name.
2. The letters “E1” are added to the embossed code on the product (excluding some
products on which there is no space available) .
3. Packaging material is labeled to indicate that the product is lead-free.
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DB81-10002-2E
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