STPS745 Power Schottky rectifier Main product characteristics Features and Benefits

STPS745 Power Schottky rectifier Main product characteristics Features and Benefits
STPS745
Power Schottky rectifier
Main product characteristics
A
IF(AV)
7.5 A
VRRM
45 V
Tj (max)
150° C
VF(max)
0.57 V
K
A
NC
D2PAK
STPS745G
Features and Benefits
■
Very small conduction losses
■
Negligible switching losses
■
Extremely fast switching
■
Insulated package: TO-220FPAC
Insulating voltage = 2000 V DC
Capacitance = 12 pF
■
K
A
Avalanche capability specified
A
K
K
TO-220AC
STPS745D
Description
Single Schottky rectifier suited for Switch Mode
Power Supply and high frequency DC to DC
converters.
TO-220FPAC
STPS745FP
’’‘
Packaged either in TO-220AC, TO-220FPAC or
D2PAK, this device is intended for use in low
voltage, high frequency inverters, free wheeling
and polarity protection applications.
March 2007
Rev 7
1/9
www.st.com
9
Characteristics
1
STPS745
Characteristics
’
Table 1.
Absolute Ratings (limiting values)
Symbo
l
Parameter
Repetitive peak reverse voltage
VRRM
IF(RMS) RMS forward voltage
Average forward current
δ = 0.5
IF(AV)
Tc = 160° C
TO-220FPAC
Tc = 145° C
45
V
20
A
7.5
A
150
A
Surge non repetitive forward current
tp = 10 ms Sinusoidal
IRRM
Repetitive peak reverse current
tp = 2 µs square F = 1 kHz
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
2
A
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25° C
2700
W
-65 to +
175
°C
175
°C
10000
V/µs
Storage temperature range
Maximum operating junction temperature (1)
Tj
dV/dt
dPtot
--------------dTj
Critical rate of rise of reverse voltage
<
Table 2.
1
-------------------------Rth ( j – a )
thermal runaway condition for a diode on its own heatsink
Thermal resistances
Symbol
Rth (j-c)
Table 3.
Symbol
IR(1)
VF(1)
Parameter
Value
TO-220AC / D2PAK
3.0
TO-220FPAC
5.5
Junction to case
Unit
°C/W
Static electrical characteristics (per diode)
Parameter
Reverse leakage current
Test Conditions
Tj = 25° C
Tj = 125° C
Forward voltage drop
VR = VRRM
Tj = 125° C
IF = 7.5 A
Tj = 25° C
IF = 15 A
Tj = 125° C
IF = 15 A
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.42 x IF(AV) + 0.020 IF2(RMS)
2/9
Unit
IFSM
Tstg
1.
TO-220AC /
D2PAK
Value
Min.
Typ.
Max.
Unit
100
µA
5
15
mA
0.5
0.57
0.84
0.65
0.72
V
STPS745
Characteristics
Figure 1.
Average forward power dissipation Figure 2.
versus average forward current
Average forward current versus
ambient temperature (δ = 0.5)
IF(AV)(A)
PF(AV)(W)
9
6
δ = 0.1
δ = 0.2
δ = 0.05
5
δ = 0.5
8
Rth(j-a)=Rth(j-c)
TO-220AC
7
TO-220FPAC
δ=1
4
6
Rth(j-a)=15°C/W
5
3
Rth(j-a)=40°C/W
4
2
3
T
T
2
1
δ=tp/T
IF(AV)(A)
1
tp
0
δ=tp/T
0
0
1
2
3
Figure 3.
4
5
6
7
8
9
10
Normalized avalanche power
derating versus pulse duration
0
25
50
Figure 4.
PARM(tp)
PARM(1µs)
Tamb(°C)
tp
75
100
125
150
175
Normalized avalanche power
derating versus junction
temperature
PARM(tp)
PARM(25°C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
Figure 5.
1
0
10
100
25
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values)
(TO-220AC and D2PAK)
50
Figure 6.
75
100
125
150
Non repetitive surge peak
forwardcurrent versus overload
duration (maximum values)
(TO-220FPAC)
IM(A)
IM(A)
80
120
70
100
60
80
50
60
TC=50°C
40
TC=100°C
30
TC=50°C
TC=100°C
40
20
TC=150°C
IM
t
1E-2
TC=150°C
IM
10
t(s)
δ=0.5
0
1E-3
20
t
t(s)
δ=0.5
1E-1
1E+0
0
1E-3
1E-2
1E-1
1E+0
3/9
Characteristics
Figure 7.
STPS745
Figure 8.
Relative variation of thermal
transient impedance junction to
case versus pulse duration
(TO-220AC and D2PAK)
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
1.0
0.8
0.8
0.6
Relative variation of thermal
transient impedance junction to
case versus pulse duration
(TO-220FPAC)
0.6
δ = 0.5
0.4
δ = 0.5
0.4
δ = 0.2
δ = 0.2
T
δ = 0.1
0.2
tp(s)
Single pulse
0.0
1E-4
1E-3
Figure 9.
δ=tp/T
1E-2
tp
1E-1
T
δ = 0.1
0.2
tp(s)
Single pulse
1E+0
Reverse leakage current versus
reverse voltage applied (typical
values)
0.0
1E-3
1E-2
δ=tp/T
1E-1
tp
1E+0
1E+1
Figure 10. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
IR(µA)
1000
5E+4
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=150°C
1E+4
Tj=125°C
1E+3
500
Tj=100°C
Tj=75°C
1E+2
Tj=50°C
1E+1
200
Tj=25°C
1E+0
VR(V)
1E-1
VR(V)
100
0
5
10
15
20
25
30
35
40
45
Figure 11. Forward voltage drop versus
forward current (maximum values)
1
2
5
10
20
50
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board, copper thickness: 35 µm)
IFM(A)
Rth(j-a)(°C/W)
100.0
80
Tj=125°C
(typical values)
70
60
Tj=25°C
10.0
50
Tj=125°C
40
30
1.0
20
10
S(Cu)(cm²)
VFM(V)
0
0.1
0.0
4/9
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
2
4
6
8
10
12
14
16
18
20
STPS745
2
Package information
Package information
●
Epoxy meets UL94, V0
●
Cooling method: by conduction (C)
●
Recommended torque value: 0.55 Nm
●
Maximum torque value: 0.70 Nm
Table 4.
D2PAK dimensions
Dimensions
Ref
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
R
V2
0.40 typ.
0°
8°
0.016 typ.
0°
8°
Figure 13. Footprint (dimensions in millimeters)
16.90
10.30
5.08
1.30
8.90
3.70
5/9
Package information
Table 5.
STPS745
TO-220FPAC dimensions
Dimensions
Ref
A
B
H
Dia
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.70
0.018
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.70
0.045
0.067
G
4.95
5.20
0.195
0.205
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
L6
L7
L2
L3
L5
F1
D
L4
L2
F
G1
G
6/9
E
16 Typ.
0.63 Typ.
L3
28.6
30.6
0.126
1.205
L4
9.8
10.6
0.386
0.417
L5
2.9
3.6
0.114
0.142
L6
15.9
16.4
0.626
0.646
L7
9.00
9.30
0.354
0.366
Dia.
3.00
3.20
0.118
0.126
STPS745
Package information
Table 6.
TO-220AC dimensions
Dimensions
Ref
A
H2
ØI
C
L5
L7
L6
L2
F1
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
F2
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
G1
2.40
2.70
0.094
0.106
H2
10
10.40
0.393
0.409
D
L9
L4
F
L2
M
E
G
Millimeters
16.4 typ.
0.645 typ.
L4
13
14
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
Diam.
2.6 typ.
3.75
3.85
0.102 typ.
0.147
0.151
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
7/9
Ordering information
3
4
8/9
STPS745
Ordering information
Ordering type
Marking
Package
Weight
Base qty
Delivery
mode
STPS745D
STPS745D
TO-220AC
1.86 g
50
Tube
STPS745G
STPS745G
D2PAK
1.48 g
50
Tube
STPS745G-TR
STPS745G
D2PAK
1.48 g
1000
Tape & reel
STPS745FP
STPS745FP
TO-220FPAC
1.9 g
50
Tube
Revision history
Date
Revision
Jul-2003
6G
22-Mar-2007
7
Description of Changes
Last release.
Removed ISOWATT package.
STPS745
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