Cypress CY7C64215 Network Card User Manual

CY7C64215
enCoRe™ III Full Speed USB Controller
Features
■
Powerful Harvard Architecture Processor
❐ M8C Processor Speeds to 24 MHz
❐ Two 8x8 Multiply, 32-bit Accumulate
❐ 3.0V to 5.25V Operating Voltage
❐ USB 2.0 USB-IF certified. TID# 40000110
❐ Operating Temperature Range: 0°C to +70°C
■
Additional System Resources
2
❐ I C™ Slave, Master, and Multi-Master to 400 kHz
❐ Watchdog and Sleep Timers
❐ User-Configurable Low Voltage Detection
❐ Integrated Supervisory Circuit
❐ On-Chip Precision Voltage Reference
■
Advanced Peripherals (enCoRe™ III Blocks)
❐ 6 Analog enCoRe III Blocks provide:
• Up to 14-bit Incremental and Delta-Sigma ADCs
❐ Programmable Threshold Comparator
❐ 4 Digital enCoRe III Blocks provide:
• 8-bit and 16-bit PWMs, timers and counters
• I2C Master
• SPI Master or Slave
• Full Duplex UART
• CYFISNP and CYFISPI modules to talk to Cypress CYFI
radio
■
Complete Development Tools
❐ Free Development Software (PSoC® Designer™)
❐ Full-Featured, In-Circuit Emulator and Programmer
❐ Full Speed Emulation
❐ Complex Breakpoint Structure
❐ 128K Bytes Trace Memory
■
Complex Peripherals by Combining Blocks
■
Full-Speed USB (12 Mbps)
❐ Four Unidirectional Endpoints
❐ One Bidirectional Control Endpoint
❐ Dedicated 256 Byte Buffer
❐ No External Crystal Required
❐ Operational at 3.0V – 3.6V or 4.35V – 5.25V
■
Flexible On-Chip Memory
❐ 16K Flash Program Storage 50,000 Erase/Write Cycles
❐ 1K SRAM Data Storage
❐ In-System Serial Programming (ISSP)
❐ Partial Flash Updates
❐ Flexible Protection Modes
❐ EEPROM Emulation in Flash
■
Programmable Pin Configurations
❐ 25-mA Sink on all GPIO
❐ Pull up, Pull down, High- Z, Strong, or Open Drain Drive
Modes on all GPIO
❐ Configurable Interrupt on all GPIO
■
Precision, Programmable Clocking
❐ Internal ±4% 24 and 48 MHz Oscillator
❐ Internal Oscillator for Watchdog and Sleep
❐ 0.25% Accuracy for USB with no External Components
Cypress Semiconductor Corporation
Document 38-08036 Rev. *C
•
198 Champion Court
Block Diagram
enCoRe III Core
•
San Jose, CA 95134-1709
•
408-943-2600
Revised December 08, 2008
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CY7C64215
■
■
■
PC HID devices
❐ Mouse (Optomechanical, Optical, Trackball)
❐ Keyboards
❐ Joysticks
Gaming
❐ Game Pads
❐ Console Keyboards
General Purpose
❐ Barcode Scanners
❐ POS Terminal
❐ Consumer Electronics
❐ Toys
❐ Remote Controls
❐ USB to Serial
enCoRe III Functional Overview
communication. A low power 32 kHz ILO (internal low speed
oscillator) is provided for the Sleep timer and WDT. The clocks,
together with programmable clock dividers (as a System
Resource), provide the flexibility to integrate almost any timing
requirement into the enCoRe III. In USB systems, the IMO
self-tunes to ±0.25% accuracy for USB communication.
enCoRe III GPIOs provide connection to the CPU, digital and
analog resources of the device. Each pin’s drive mode may be
selected from eight options, allowing great flexibility in external
interfacing. Every pin also has the capability to generate a
system interrupt on high level, low level, and change from last
read.
The Digital System
The Digital System is composed of four digital enCoRe III blocks.
Each block is an 8-bit resource that is used alone or combined
with other blocks to form 8, 16, 24, and 32-bit peripherals, which
are called user module references.
Figure 1. Digital System Block Diagram
The enCoRe III is based on flexible PSoC architecture and is a
full-featured, full-speed (12 Mbps) USB part. Configurable
analog, digital, and interconnect circuitry enable a high level of
integration in a host of consumer, and communication applications.
Port 7
Port 5
Port 3
Port 4
Port 1
Port 2
To System Bus
Digital Clocks
From Core
This architecture allows the user to create customized peripheral
configurations that match the requirements of each individual
application. Additionally, a fast CPU, Flash program memory,
SRAM data memory, and configurable IO are included in both
28-pin SSOP and 56-pin QFN packages.
Port 0
To Analog
System
DIGITAL SYSTEM
Digital enCoRe III Block Array
8
8
Row 0
DBB00
DBB01
DCB02
4
DCB03
4
GIE[7:0]
GIO[7:0]
GlobalDigital
Interconnect
Row Output
Configuration
The enCoRe III architecture, as illustrated in Figure , is
comprised of four main areas: enCoRe III Core, Digital System,
Analog System, and System Resources including a full-speed
USB port. Configurable global busing allows all the device
resources to combine into a complete custom system. The
enCoRe III CY7C64215 can have up to seven IO ports that
connect to the global digital and analog interconnects, providing
access to 4 digital blocks and 6 analog blocks.
Row Input
Configuration
Applications
8
8
GOE[7:0]
GOO[7:0]
enCoRe III Core
The enCoRe III Core is a powerful engine that supports a rich
feature set. The core includes a CPU, memory, clocks, and
configurable GPIO (General Purpose IO).
The M8C CPU core is a powerful processor with speeds up to 24
MHz, providing a four MIPS 8-bit Harvard architecture microprocessor. The CPU utilizes an interrupt controller with up to 20
vectors, to simplify programming of real-time embedded events.
Program execution is timed and protected using the included
Sleep and Watch Dog Timers (WDT).
Memory encompasses 16K of Flash for program storage, 1K of
SRAM for data storage, and up to 2K of EEPROM emulated
using the Flash. Program Flash utilizes four protection levels on
blocks of 64 bytes, allowing customized software IP protection.
enCoRe III incorporates flexible internal clock generators,
including a 24 MHz IMO (internal main oscillator) accurate to 8%
over temperature and voltage. The 24 MHz IMO is doubled to 48
MHz for use by the digital system, if needed. The 48 MHz clock
is required to clock the USB block and must be enabled for USB
Document 38-08036 Rev. *C
Digital configurations that can be built from the blocks include
those listed below.
■
PWMs, Timers and Counters (8-bit and 16-bit)
■
UART 8-bit with selectable parity
■
SPI master and slave
■
I2C Master
■
RF Interface: Interface to Cypress CYFI Radio
The digital blocks is connected to any GPIO through a series of
global buses that can route any signal to any pin. The buses also
allow for signal multiplexing and for performing logic operations.
This configurability frees your designs from the constraints of a
fixed peripheral controller.
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The Analog System
The Analog Multiplexer System
The Analog System is composed of six configurable blocks,
comprised of an opamp circuit allowing the creation of complex
analog signal flows. Analog peripherals are very flexible and are
customized to support specific application requirements.
enCoRe III analog function supports the Analog-to-digital
converters (with 6 to 14-bit resolution, selectable as Incremental,
and Delta Sigma) and programmable threshold comparator).
The Analog Mux Bus can connect to every GPIO pin in ports 0–5.
Pins which are connected to the bus individually or in any combination. The bus also connects to the analog system for analysis
with comparators and analog-to-digital converters. It is split into
two sections for simultaneous dual-channel processing. An
additional 8:1 analog input multiplexer provides a second path to
bring Port 0 pins to the analog array.
Analog blocks are arranged in two columns of three, with each
column comprising one CT (Continuous Time - AC B00 or AC
B01) and two SC (Switched Capacitor - ASC10 and ASD20 or
ASD11 and ASC21) blocks, as shown in Figure 2.
Additional System Resources
Figure 2. Analog System Block Diagram
All IO
(Except Port 7)
P0[6]
P0[5]
P0[4]
P0[3]
P0[2]
P0[1]
P0[0]
Analog
Mux Bus
AGNDIn RefIn
P0[7]
P2[3]
P2[1]
System Resources provide additional capability useful to
complete systems. Additional resources include a multiplier,
decimator, low voltage detection, and power-on reset. Brief
statements describing the merits of each resource follow.
■
Full-Speed USB (12 Mbps) with five configurable endpoints and
256 bytes of RAM. No external components required except
two series resistors.
■
Two multiply accumulates (MACs) provide fast 8-bit multipliers
with 32-bit accumulate, to assist in both general math and
digital filters.
■
The decimator provides a custom hardware filter for digital
signal processing applications including the creation of Delta
Sigma ADCs.
■
Digital clock dividers provide three customizable clock
frequencies for use in applications. The clocks are routed to
both the digital and analog systems.
■
The I2C module provides 100 and 400 kHz communication over
two wires. Slave, master, and multi-master modes are all
supported.
■
Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR (Power
On Reset) circuit eliminates the need for a system supervisor.
P2[6]
P2[4]
P2[2]
P2[0]
enCoRe III Device Characteristics
ACI0[1:0]
enCoRe III devices have four digital blocks and six analog
blocks. The following table lists the resources available for
specific enCoRe III device.
ACI1[1:0]
Array Input
Configuration
ACB00
ACB01
Digital
Rows
Digital
Blocks
Analog
Inputs
Analog
Outputs
SRAM
Size
Flash
Size
ASC10
ASD11
CY7C64215 up to
-28PVXC
22
1
4
22
2
2
6
1K
16K
ASD20
ASC21
CY7C64215 up to
50
-56LFXC
1
4
48
2
2
6
1K
16K
Part
Number
Getting Started
Analog Reference
Interface to
Digital System
RefHi
Ref Lo
AGND
Reference
Generators
M8C Interface (Address Bus, Data Bus, Etc.)
Document 38-08036 Rev. *C
Digital
IO
Block
Array
Analog
Columns
Analog
Blocks
Table 1. enCoRe III Device Characteristics
AGNDIn
Ref In
Bandgap
The quickest path to understanding enCoRe III silicon is by
reading this data sheet and using the PSoC Designer Integrated
Development Environment (IDE). This data sheet is an overview
of the enCoRe III integrated circuit and presents specific pin,
register, and electrical specifications. enCoRe III is based on the
architecture of the CY8C24794. For in-depth information, along
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CY7C64215
with detailed programming information, reference the PSoC™
Mixed-Signal Array Technical Reference Manual.
For up-to-date Ordering, Packaging, and Electrical Specification
information, reference the latest enCoRe III device data sheets
on the web at http://www.cypress.com.
Figure 3. PSoC Designer Subsystems
PSoCTM
Designer
Development Tools
PSoC Designer is a Microsoft® Windows® based, integrated
development environment for enCoRe III. The PSoC Designer
IDE and application runs on Windows NT 4.0, Windows 2000,
Windows Millennium (Me), or Windows XP. (Refer to the PSoC
Designer Functional Flow diagram below).
PSoC Designer helps the customer to select an operating configuration for the enCoRe III, write application code that uses the
enCoRe III, and debug the application. This system provides
design database management by project, an integrated
debugger with In-Circuit Emulator, in-system programming
support, and the CYASM macro assembler for the CPUs. PSoC
Designer also supports a high-level C language compiler
developed specifically for the devices in the family.
Commands
Development Kits are available from the following distributors:
Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store
contains development kits, C compilers, and all accessories for
enCoRe III development. Go to the Cypress Online Store web
site at http://www.cypress.com, click the Online Store shopping
cart icon at the bottom of the web page, and click USB (Universal
Serial Bus) to view a current list of available items.
Results
Development Kits
Context
Sensitive
Help
Graphical Designer
Interface
Importable
Design
Database
Device
Database
Application
Database
PSoC
Configuration
Sheet
PSoCTM
Designer
Core
Engine
Manufacturing
Information
File
Project
Database
User
Modules
Library
Emulation
Pod
In-Circuit
Emulator
Device
Programmer
PSoC Designer Software Subsystems
Device Editor
The Device Editor subsystem allows the user to select different
onboard analog and digital components called user modules
using the enCoRe III blocks. Examples of user modules are
ADCs, SPIM, UART, and PWMs.
The device editor also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic configuration allows for changing configurations at run time.
PSoC Designer sets up power-on initialization tables for selected
enCoRe III block configurations and creates source code for an
application framework. The framework contains software to
operate the selected components and, if the project uses more
than one operating configuration, contains routines to switch
between different sets of enCoRe III block configurations at run
time. PSoC Designer can print out a configuration sheet for a
given project configuration for use during application
programming in conjunction with the Device Data Sheet. Once
the framework is generated, the user can add application-specific code to flesh out the framework. It is also possible
to change the selected components and regenerate the
framework.
Document 38-08036 Rev. *C
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Application Editor
In the Application Editor you can edit your C language and
Assembly language source code. You can also assemble,
compile, link, and build.
Assembler. The macro assembler allows the assembly code to
merge seamlessly with C code. The link libraries automatically
use absolute addressing or is compiled in relative mode, and
linked with other software modules to get absolute addressing.
C Language Compiler. A C language compiler is available that
supports the enCoRe III family of devices. Even if you have never
worked in the C language before, the product quickly allows you
to create complete C programs for the enCoRe III devices.
The embedded, optimizing C compiler provides all the features
of C tailored to the enCoRe III architecture. It comes complete
with embedded libraries providing port and bus operations,
standard keypad and display support, and extended math
functionality.
Debugger
The PSoC Designer Debugger subsystem provides hardware
in-circuit emulation, allowing the designer to test the program in
a physical system while providing an internal view of the enCoRe
III device. Debugger commands allow the designer to read and
program and read and write data memory, read and write IO
registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The
debugger also allows the designer to create a trace buffer of
registers and memory locations of interest.
Designing with User Modules
The development process for the enCoRe III device differs from
that of a traditional fixed-function microprocessor. The configurable analog and digital hardware blocks give the enCoRe III
architecture a unique flexibility that pays dividends in managing
specification change during development and by lowering
inventory costs. These configurable resources, called enCoRe
III Blocks, have the ability to implement a wide variety of
user-selectable functions. Each block has several registers that
determine its function and connectivity to other blocks, multiplexers, buses and to the IO pins. Iterative development cycles
permit you to adapt the hardware and software. This substantially lowers the risk of having to select a different part to meet
the final design requirements.
To speed the development process, the PSoC Designer
Integrated Development Environment (IDE) provides a library of
pre-built, pre-tested hardware peripheral functions, called “User
Modules.” User modules make selecting and implementing
peripheral devices simple, and come in analog, digital, and
mixed signal varieties.
The user module library contains the following digital and analog
module designs:
■
Analog Blocks
❐ Incremental ADC (ADCINC)
❐ Delta Sigma ADC (DelSig)
❐ Programmable Threshold Comparator (CMPPRG)
■
Digital Blocks
❐ Counters: 8-bit and 16-bit (Counter8 and Counter 16)
❐ PWMs: 8-bit and 16-bit (PWM8 and PWM16)
❐ Timers: 8-bit and 16-bit (Timer8 and Timer 16)
2
2
❐ I C Master (I Cm)
❐ SPI Master (SPIM)
❐ SPI Slave (SPIS)
❐ Full Duplex UART (UART)
❐ RF (CYFISNP and CYFISPI)
■
System Resources
❐ Protocols:
• USBFS
• I2C Bootheader (Boothdr I2C)
• USB Bootheader (BoothdrUSBFS)
• USBUART
❐ Digital System Resources
• E2PROM
• LCD
• LED
• 7-segment LED (LED7SEG)
• Shadow Registers (SHADOWREG)
• Sleep Timer
Online Help System
The online help system displays online, context-sensitive help
for the user. Designed for procedural and quick reference, each
functional subsystem has its own context-sensitive help. This
system also provides tutorials and links to FAQs and an Online
Support Forum to aid the designer in getting started.
Hardware Tools
In-Circuit Emulator
A low cost, high functionality ICE Cube is available for development support. This hardware has the capability to program
single devices.
The emulator consists of a base unit that connects to the PC by
way of a USB port. The base unit is universal which operates with
all enCoRe III devices.
Document 38-08036 Rev. *C
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Each user module establishes the basic register settings that
implement the selected function. It also provides parameters that
allow you to tailor its precise configuration to your particular
application. For example, a Pulse Width Modulator User Module
configures one or more digital PSoC blocks, one for each 8 bits
of resolution. The user module parameters permit the designer
to establish the pulse width and duty cycle. User modules also
provide tested software to cut development time. The user
module application programming interface (API) provides
high-level functions to control and respond to hardware events
at run-time. The API also provides optional interrupt service
routines that is adapted as needed.
The API functions are documented in user module data sheets
that are viewed directly in the PSoC Designer IDE. These data
sheets explain the internal operation of the user module and
provide performance specifications. Each data sheet describes
the use of each user module parameter and documents the
setting of each register controlled by the user module.
The development process starts when you open a new project
and bring up the Device Editor/Chip Layout View, a graphical
user interface (GUI) for configuring the hardware. You pick the
user modules you need for your project and map them onto the
PSoC blocks with point-and-click simplicity. Next, you build
signal chains by interconnecting user modules to each other and
the IO pins. At this stage, you also configure the clock source
connections and enter parameter values directly or by selecting
values from drop-down menus. When you are ready to test the
hardware configuration or move on to developing code for the
project, you perform the “Generate Application” step. This
causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the
high-level user module API functions.
Figure 4. User Module and Source Code Development Flows
Device Editor
User
Module
Selection
Placement
and
Parameter
-ization
Source
Code
Generator
Generate
Application
Application Editor
Project
Manager
Source
Code
Editor
Build
Manager
Build
All
Debugger
Interface
to ICE
Storage
Inspector
Event &
Breakpoint
Manager
The next step is to write your main program, and any
sub-routines using PSoC Designer’s Application Editor
subsystem. The Application Editor includes a Project Manager
that allows you to open the project source code files (including
all generated code files) from a hierarchal view. The source code
editor provides syntax coloring and advanced edit features for
both C and assembly language. File search capabilities include
simple string searches and recursive “grep-style” patterns. A
single mouse click invokes the Build Manager. It employs a
professional-strength “makefile” system to automatically analyze
all file dependencies and run the compiler and assembler as
necessary. Project level options control optimization strategies
used by the compiler and linker. Syntax errors are displayed in a
console window. Double clicking the error message takes you
directly to the offending line of source code. When all is correct,
the linker builds a HEX file image suitable for programming.
The last step in the development process takes place inside the
PSoC Designer’s Debugger subsystem. The Debugger
downloads the HEX image to the In-Circuit Emulator (ICE CUBE)
where it runs at full speed. Debugger capabilities rival those of
systems costing many times more. In addition to traditional
single-step, run-to-breakpoint and watch-variable features, the
Debugger provides a large trace buffer and allows you define
complex breakpoint events that include monitoring address and
data bus values, memory locations and external signals.
Document 38-08036 Rev. *C
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Document Conventions
Units of Measure
Acronyms Used
A units of measure table is located in the Electrical Specifications
section. Table 5 on page 13 lists all the abbreviations used to
measure the enCoRe III devices.
The following table lists the acronyms that are used in this
document.
Acronym
Description
AC
alternating current
ADC
analog-to-digital converter
API
application programming interface
CPU
central processing unit
CT
continuous time
ECO
external crystal oscillator
Numeric Naming
Hexadecimal numbers are represented with all letters in
uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (For example, 01010100b’ or
‘01000011b’). Numbers not indicated by an ‘h’ or ‘b’ are decimal.
EEPROM electrically erasable programmable read-only
memory
FSR
full scale range
GPIO
general purpose IO
GUI
graphical user interface
HBM
human body model
LSb
least-significant bit
LVD
low voltage detect
MSb
most-significant bit
PC
program counter
PLL
phase-locked loop
POR
power on reset
PPOR
precision power on reset
PSoC
Programmable System-on-Chip™
PWM
pulse width modulator
SC
switched capacitor
SRAM
static random access memory
ICE
in-circuit emulator
ILO
internal low speed oscillator
IMO
internal main oscillator
IO
input/output
IPOR
imprecise power on reset
Document 38-08036 Rev. *C
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56-Pin Part Pinout
The CY7C64215 enCoRe III device is available in a 56-pin package which is listed and illustrated in the following table. Every port pin
(labeled “P”) is capable of Digital IO. However, Vss and Vdd are not capable of Digital IO.
Table 2. 56-Pin Part Pinout (MLF*)
CY7C64215 56-Pin enCoRe III Device
M
M
M
M
I,
I,
I,
I,
P2[5], M
P2[7], M
P0[1], A,
P0[3], A,
P0[5], A,
P0[7], A,
Vss
Vdd
P0[6], A,
P0[4], A,
P0[2], A,
P0[0], A,
P2[6], M
P2[4], M
Supply voltage.
I2C Serial Data (SDA), ISSP-SDATA.
3
4
5
6
7
8
9
10
11
12
13
14
42
41
40
39
38
37
36
35
34
33
MLF
(Top View)
Type
Pin
No. Digital Analog
44
IO
M
45
IO
I, M
46
IO
I, M
47
IO
I, M
48
IO
I, M
49
Power
50
Power
51
IO
I, M
52
IO
IO, M
53
IO
IO, M
Direct switched capacitor block input. 54
IO
I, M
Direct switched capacitor block input. 55
IO
M
External Analog Ground (AGND) in- 56
IO
M
put.
Name
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
Vdd
Vss
P0[7]
P0[5]
P0[3]
P0[1]
P2[7]
P2[5]
25
26
27
28
1
2
56
55
54
53
52
51
50
49
48
47
46
45
44
43
P2[3]
P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
32
31
30
29
P2[2],
P2[0],
P4[6],
P4[4],
P4[2],
P4[0],
P3[6],
P3[4],
P3[2],
P3[0],
P5[6],
P5[4],
P5[2],
P5[0],
A, I, M
A, I, M
M
M
M
M
M
M
M
M
M
M
M
M
Vdd
P7[7]
P7[0]
M, I2C SDA, P1[0]
M, P1[2]
M, P1[4]
M, P1[6]
I2C Serial Clock (SCL), ISSP-SCLK.
Ground connection.
A, I, M,
A, I, M,
M,
M,
M,
M,
M,
M,
M,
M,
M,
M,
M,
M,
15
16
17
18
19
20
21
22
23
24
I2C Serial Clock (SCL).
I2C Serial Data (SDA).
I, M
IO, M
IO, M
I, M
Description
Direct switched capacitor block input.
Direct switched capacitor block input.
P1[7]
P1[5]
P1[3]
P1[1]
Vss
D+
D-
Name
P2[3]
P2[1]
P4[7]
P4[5]
P4[3]
P4[1]
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
P1[7]
P1[5]
P1[3]
P1[1]
Vss
D+
DVdd
P7[7]
P7[0]
P1[0]
P1[2]
P1[4]
P1[6]
P5[0]
P5[2]
P5[4]
P5[6]
P3[0]
P3[2]
P3[4]
P3[6]
P4[0]
P4[2]
P4[4]
P4[6]
P2[0]
P2[2]
P2[4]
M, I2C SCL,
M, I2C SDA,
M,
M, I2C SCL,
Type
Pin
No. Digital Analog
1
IO
I, M
2
IO
I, M
3
IO
M
4
IO
M
5
IO
M
6
IO
M
7
IO
M
8
IO
M
9
IO
M
10
IO
M
11
IO
M
12
IO
M
13
IO
M
14
IO
M
15
IO
M
16
IO
M
17
IO
M
18
IO
M
19
Power
20
USB
21
USB
22
Power
23
IO
24
IO
25
IO
M
26
IO
M
27
IO
M
28
IO
M
29
IO
M
30
IO
M
31
IO
M
32
IO
M
33
IO
M
34
IO
M
35
IO
M
36
IO
M
37
IO
M
38
IO
M
39
IO
M
40
IO
M
41
IO
I, M
42
IO
I, M
43
IO
M
Description
External Voltage Reference (VREF) input.
Analog column mux input.
Analog column mux input and column output.
Analog column mux input and column output.
Analog column mux input.
Supply voltage.
Ground connection.
Analog column mux input.
Analog column mux input and column output
Analog column mux input and column output.
Analog column mux input.
LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input.
* The MLF package has a center pad that must be connected to ground (Vss).
Document 38-08036 Rev. *C
Page 8 of 30
[+] Feedback
CY7C64215
28-Pin Part Pinout
The CY7C64215 enCoRe III device is available in a 28-pin package which is listed and illustrated in the following table. Every port pin
(labeled with a “P”) is capable of Digital IO. However, Vss and Vdd are not capable of Digital IO.
Table 3. 28-Pin Part Pinout (SSOP)
Type
Pin
No. Digital Analog
1
Power
2
IO
I, M
3
IO
IO,M
4
IO
IO,M
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
IO
I,M
IO
M
IO
M
IO
M
IO
M
IO
M
IO
M
IO
M
Power
USB
USB
Power
IO
M
IO
M
IO
M
IO
M
IO
M
IO
M
IO
M
IO
M
IO
M
26
IO
27
28
IO
M
Power
M
CY7C64215 28-Pin enCoRe III Device
Name
Description
GND Ground connection
P0[7] Analog column mux input.
P0[5] Analog column mux input and column
output
P0[3] Analog column mux input and column
output.
P0[1] Analog column mux input.
P2[5]
P2[3] Direct switched capacitor block input.
P2[1] Direct switched capacitor block input.
P1[7] I2C Serial Clock (SCL).
P1[5] I2C Serial Data (SDA).
P1[3]
P1[1] I2C Serial Clock (SCL), ISSP-SCLK.
GND Ground connection
D+
DVdd Supply voltage.
P1[0] I2C Serial Data (SDA), ISSP-SDATA.
P1[2]
P1[4]
P1[6]
P2[0] Direct switched capacitor block input.
P2[2] Direct switched capacitor block input.
P2[4] External Analog Ground (AGND) input.
P0[0] Analog column mux input.
P0[2] Analog column mux input and column
output.
P0[4] Analog column mux input and column
output.
P0[6] Analog column mux input.
Vdd Supply voltage.
Vss
AI,P0[7]
AIO,P0[5]
AIO,P0[3]
AI,P0[1]
P2[5]
AI,P2[3]
AI,P2[1]
I2CSCL,P1[7]
I2CSDA,P1[5]
P1[3]
I2CSCL, P1[1]
Vss
D+
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SSOP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Vdd
P0[6],AI
P0[4],AI
P0[2],AI
P0[0],AI
P2[4]
P2[2],AI
P2[0],AI
P1[6]
P1[4]
P1[2]
P1[0],I2CSDA
Vdd
D-
LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input.
* The MLF package has a center pad that must be connected to ground (Vss).
Document 38-08036 Rev. *C
Page 9 of 30
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CY7C64215
Register Reference
Register Mapping Tables
The register conventions specific to this section are listed in the
following table.
Table 4. Register Conventions
Convention
R
Description
Read register or bit(s)
W
Write register or bit(s)
L
Logical register or bit(s)
C
Clearable register or bit(s)
#
Access is bit specific
Document 38-08036 Rev. *C
The enCoRe III device has a total register address space of 512
bytes. The register space is referred to as IO space and is
divided into two banks. The XOI bit in the Flag register (CPU_F)
determines which bank the user is currently in. When the XOI bit
is set the user is in Bank 1.
Note In the following register mapping tables, blank fields are
Reserved and should not be accessed.
Page 10 of 30
[+] Feedback
CY7C64215
Register Map Bank 0 Table: User Space
Name
PRT0DR
PRT0IE
PRT0GS
PRT0DM2
PRT1DR
PRT1IE
PRT1GS
PRT1DM2
PRT2DR
PRT2IE
PRT2GS
PRT2DM2
PRT3DR
PRT3IE
PRT3GS
PRT3DM2
PRT4DR
PRT4IE
PRT4GS
PRT4DM2
PRT5DR
PRT5IE
PRT5GS
PRT5DM2
Addr (0,Hex) Access
Name
00
RW
PMA0_DR
01
RW
PMA1_DR
02
RW
PMA2_DR
03
RW
PMA3_DR
04
RW
PMA4_DR
05
RW
PMA5_DR
06
RW
PMA6_DR
07
RW
PMA7_DR
08
RW
USB_SOF0
09
RW
USB_SOF1
0A
RW
USB_CR0
0B
RW
USBIO_CR0
0C
USBIO_CR1
RW
0D
RW
0E
EP1_CNT1
RW
0F
EP1_CNT
RW
10
EP2_CNT1
RW
11
EP2_CNT
RW
12
EP3_CNT1
RW
13
EP3_CNT
RW
14
EP4_CNT1
RW
15
EP4_CNT
RW
16
EP0_CR
RW
17
EP0_CNT
RW
18
EP0_DR0
19
EP0_DR1
1A
EP0_DR2
1B
EP0_DR3
1C
EP0_DR4
PRT7DR
RW
1D
EP0_DR5
PRT7IE
RW
1E
EP0_DR6
PRT7GS
RW
1F
EP0_DR7
PRT7DM2
RW
DBB00DR0 20
#
AMX_IN
DBB00DR1 21
W
AMUXCFG
DBB00DR2 22
RW
DBB00CR0 23
#
ARF_CR
DBB01DR0 24
#
CMP_CR0
DBB01DR1 25
W
ASY_CR
DBB01DR2 26
RW
CMP_CR1
DBB01CR0 27
#
DCB02DR0 28
#
DCB02DR1 29
W
DCB02DR2 2A
RW
DCB02CR0 2B
#
DCB03DR0 2C
#
TMP_DR0
DCB03DR1 2D
W
TMP_DR1
DCB03DR2 2E
RW
TMP_DR2
DCB03CR0 2F
#
TMP_DR3
30
ACB00CR3
31
ACB00CR0
32
ACB00CR1
33
ACB00CR2
34
ACB01CR3
35
ACB01CR0
36
ACB01CR1
37
ACB01CR2
38
39
3A
3B
3C
3D
3E
3F
Blank fields are Reserved and should not be accessed.
Document 38-08036 Rev. *C
Addr (0,Hex)
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
Access
RW
RW
RW
RW
RW
RW
RW
RW
R
R
RW
#
RW
#
RW
#
RW
#
RW
#
RW
#
#
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
#
#
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Name
ASC10CR0
ASC10CR1
ASC10CR2
ASC10CR3
ASD11CR0
ASD11CR1
ASD11CR2
ASD11CR3
Addr (0,Hex)
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
ASD20CR0 90
ASD20CR1 91
ASD20CR2 92
ASD20CR3 93
ASC21CR0 94
ASC21CR1 95
ASC21CR2 96
ASC21CR3 97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
MUL1_X
A9
MUL1_Y
AA
MUL1_DH
AB
MUL1_DL
ACC1_DR1 AC
ACC1_DR0 AD
ACC1_DR3 AE
ACC1_DR2 AF
B0
RDI0RI
B1
RDI0SYN
B2
RDI0IS
B3
RDI0LT0
B4
RDI0LT1
B5
RDI0RO0
B6
RDI0RO1
B7
B8
B9
BA
BB
BC
BD
BE
BF
# Access is bit specific.
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
W
W
R
R
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Name
CUR_PP
STK_PP
IDX_PP
MVR_PP
MVW_PP
I2C_CFG
I2C_SCR
I2C_DR
I2C_MSCR
INT_CLR0
INT_CLR1
INT_CLR2
INT_CLR3
INT_MSK3
INT_MSK2
INT_MSK0
INT_MSK1
INT_VC
RES_WDT
DEC_DH
DEC_DL
DEC_CR0
DEC_CR1
MUL0_X
MUL0_Y
MUL0_DH
MUL0_DL
ACC0_DR1
ACC0_DR0
ACC0_DR3
ACC0_DR2
CPU_F
DAC_D
CPU_SCR1
CPU_SCR0
Addr (0,Hex)
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
Access
RW
RW
RW
RW
RW
RW
#
RW
#
RW
RW
RW
RW
RW
RW
RW
RW
RC
W
RC
RC
RW
RW
W
W
R
R
RW
RW
RW
RW
RL
RW
#
#
Page 11 of 30
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CY7C64215
Register Map Bank 1 Table: Configuration Space
Name
Addr
(1,Hex)
Access
Name
Addr
(1,Hex)
Access
Name
Addr
(1,Hex)
Access
Name
Addr
(1,Hex)
Access
PRT0DM0
00
RW
PMA0_WA
40
RW
ASC10CR0
80
RW
USBIO_CR2
C0
RW
PRT0DM1
01
RW
PMA1_WA
41
RW
ASC10CR1
81
RW
USB_CR1
C1
#
PRT0IC0
02
RW
PMA2_WA
42
RW
ASC10CR2
82
RW
PRT0IC1
03
RW
PMA3_WA
43
RW
ASC10CR3
83
RW
PRT1DM0
04
RW
PMA4_WA
44
RW
ASD11CR0
84
RW
EP1_CR0
C4
#
PRT1DM1
05
RW
PMA5_WA
45
RW
ASD11CR1
85
RW
EP2_CR0
C5
#
PRT1IC0
06
RW
PMA6_WA
46
RW
ASD11CR2
86
RW
EP3_CR0
C6
#
PRT1IC1
07
RW
PMA7_WA
47
RW
ASD11CR3
87
RW
EP4_CR0
C7
#
PRT2DM0
08
RW
48
88
C8
PRT2DM1
09
RW
49
89
C9
PRT2IC0
0A
RW
4A
8A
CA
PRT2IC1
0B
RW
4B
8B
CB
PRT3DM0
0C
RW
4C
8C
CC
PRT3DM1
0D
RW
4D
8D
CD
PRT3IC0
0E
RW
4E
8E
CE
PRT3IC1
0F
RW
4F
8F
PRT4DM0
10
RW
PMA0_RA
50
RW
PRT4DM1
11
RW
PMA1_RA
51
RW
ASD20CR1
91
PRT4IC0
12
RW
PMA2_RA
52
RW
ASD20CR2
PRT4IC1
13
RW
PMA3_RA
53
RW
PRT5DM0
14
RW
PMA4_RA
54
CF
90
GDI_O_IN
D0
RW
RW
GDI_E_IN
D1
RW
92
RW
GDI_O_OU
D2
RW
ASD20CR3
93
RW
GDI_E_OU
D3
RW
RW
ASC21CR0
94
RW
D4
PRT5DM1
15
RW
PMA5_RA
55
RW
ASC21CR1
95
RW
D5
PRT5IC0
16
RW
PMA6_RA
56
RW
ASC21CR2
96
RW
D6
PRT5IC1
17
RW
PMA7_RA
57
RW
ASC21CR3
97
RW
D7
18
58
98
MUX_CR0
D8
RW
19
59
99
MUX_CR1
D9
RW
1A
5A
9A
MUX_CR2
DA
RW
1B
5B
9B
MUX_CR3
DB
RW
PRT7DM0
1C
RW
5C
9C
PRT7DM1
1D
RW
5D
9D
OSC_GO_EN
DD
RW
PRT7IC0
1E
RW
5E
9E
OSC_CR4
DE
RW
PRT7IC1
1F
RW
5F
9F
OSC_CR3
DF
RW
DBB00FN
20
RW
CLK_CR0
60
RW
A0
OSC_CR0
E0
RW
DBB00IN
21
RW
CLK_CR1
61
RW
A1
OSC_CR1
E1
RW
DBB00OU
22
RW
ABF_CR0
62
RW
A2
OSC_CR2
E2
RW
AMD_CR0
63
RW
A3
VLT_CR
E3
RW
CMP_GO_EN
64
RW
A4
VLT_CMP
E4
R
65
RW
A5
E5
AMD_CR1
66
RW
A6
E6
ALT_CR0
67
RW
A7
23
DBB01FN
24
RW
DBB01IN
25
RW
DBB01OU
26
RW
27
DC
E7
DCB02FN
28
RW
68
A8
IMO_TR
E8
W
DCB02IN
29
RW
69
A9
ILO_TR
E9
W
DCB02OU
2A
RW
6A
AA
BDG_TR
EA
RW
6B
AB
ECO_TR
EB
W
2B
DCB03FN
2C
RW
TMP_DR0
6C
RW
AC
MUX_CR4
EC
RW
DCB03IN
2D
RW
TMP_DR1
6D
RW
AD
MUX_CR5
ED
RW
DCB03OU
2E
RW
TMP_DR2
6E
RW
AE
2F
TMP_DR3
6F
RW
30
ACB00CR3
70
RW
RDI0RI
B0
RW
F0
31
ACB00CR0
71
RW
RDI0SYN
B1
RW
F1
32
ACB00CR1
72
RW
RDI0IS
B2
RW
F2
33
ACB00CR2
73
RW
RDI0LT0
B3
RW
F3
34
ACB01CR3
74
RW
RDI0LT1
B4
RW
F4
35
ACB01CR0
75
RW
RDI0RO0
B5
RW
F5
36
ACB01CR1
76
RW
RDI0RO1
B6
RW
37
ACB01CR2
77
RW
EE
AF
B7
EF
F6
CPU_F
F7
RL
38
78
B8
F8
39
79
B9
F9
3A
7A
BA
FA
3B
7B
BB
FB
3C
7C
BC
3D
7D
BD
DAC_CR
FD
RW
3E
7E
BE
CPU_SCR1
FE
#
3F
7F
BF
CPU_SCR0
FF
#
Blank fields are Reserved and should not be accessed.
Document 38-08036 Rev. *C
FC
# Access is bit specific.
Page 12 of 30
[+] Feedback
CY7C64215
Electrical Specifications
This section presents the DC and AC electrical specifications of the CY7C64215 enCoRe III. For the most up to date electrical
specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com.
Specifications are valid for 0°C < TA < 70°C and TJ < 100°C, except where noted. Specifications for devices running at greater than
12 MHz are valid for 0°C < TA < 70°C and TJ < 82°C.
Figure 5. Voltage versus CPU Frequency
5.25
Valid operating region
Vdd Voltage (V)
4.75
4.35
[1]
Valid operating region
3.60
Valid operating region
3.00
93kHz
12MHz
24MHz
CPU Frequency
The following table lists the units of measure that are used in this section.
Table 5. Units of Measure
Symbol
°C
dB
fF
Hz
KB
Kbit
kHz
kΩ
MHz
MΩ
μA
μF
μH
μs
Unit of Measure
degree Celsius
decibels
femto farad
hertz
1024 bytes
1024 bits
kilohertz
kilohm
megahertz
megaohm
microampere
microfarad
microhenry
microsecond
Symbol
μW
mA
ms
mV
nA
ns
nV
W
pA
pF
pp
ppm
ps
sps
Unit of Measure
microwatts
milliampere
millisecond
millivolts
nanoampere
nanosecond
nanovolts
ohm
picoampere
picofarad
peak-to-peak
parts per million
picosecond
samples per second
Note
1. This is a valid operating region for the CPU, but USB hardware is non-functional in the voltage range from 3.60V – 4.35V.
Document 38-08036 Rev. *C
Page 13 of 30
[+] Feedback
CY7C64215
Table 5. Units of Measure (continued)
Symbol
μV
μVrms
Unit of Measure
microvolts
microvolts root-mean-square
Symbol
s
V
Unit of Measure
sigma: one standard deviation
volts
Absolute Maximum Ratings
Table 6. Absolute Maximum Ratings
Parameter
Description
Storage Temperature
TSTG
TA
Vdd
VIO
VIO2
IMIO
IMAIO
ESD
LU
Ambient Temperature with Power Applied
Supply Voltage on Vdd Relative to Vss
DC Input Voltage
DC Voltage Applied to Tri-state
Maximum Current into any Port Pin
Maximum Current into any Port Pin
Configured as Analog Driver
Electro Static Discharge Voltage
Latch Up Current
Min
–55
Typ
–
Max
+100
Unit
°C
0
–0.5
Vss – 0.5
Vss – 0.5
–25
–50
–
–
–
–
–
–
+70
+6.0
Vdd + 0.5
Vdd + 0.5
+50
+50
°C
V
V
V
mA
mA
2000
–
–
–
–
200
V
mA
Min
0
0
Typ
–
–
Max
+70
+88
Unit
°C
°C
Notes
Higher storage temperatures
reduces data retention time.
Human Body Model ESD.
Operating Temperature
Table 7. Operating Temperature
Parameter
Description
Ambient Temperature
TA
TJ
Junction Temperature
Document 38-08036 Rev. *C
Notes
The temperature rise from
ambient to junction is
package specific. See
“Thermal Impedance” on
page 28. The user must limit
the power consumption to
comply with this
requirement.
Page 14 of 30
[+] Feedback
CY7C64215
DC Electrical Characteristics
DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 8. DC Chip-Level Specifications
Parameter
Description
Vdd
Supply Voltage
Min
3.0
IDD5
Supply Current, IMO = 24 MHz (5V)
–
IDD3
Supply Current, IMO = 24 MHz (3.3V)
–
ISB
Sleep (Mode) Current with POR, LVD, Sleep
Timer, and WDT.[2]
–
ISBH
Sleep (Mode) Current with POR, LVD, Sleep
Timer, and WDT at high temperature.[2]
–
Typ Max Unit
Notes
–
5.25
V See DC POR and LVD specifications, Table
16 on page 19. USB hardware is not
functional when Vdd is between 3.6V - 4.35V.
14
27
mA Conditions are Vdd = 5.0V, TA = 25°C, CPU
= 3 MHz, SYSCLK doubler disabled, VC1 =
1.5 MHz, VC2 = 93.75 kHz, VC3 = 93.75 kHz,
analog power = off.
8
14
mA Conditions are Vdd = 3.3V, TA = 25°C, CPU
= 3 MHz, SYSCLK doubler disabled, VC1 =
1.5 MHz, VC2 = 93.75 kHz, VC3 = 0.367 kHz,
analog power = off.
3
6.5
μA Conditions are with internal slow speed oscillator, Vdd = 3.3V, 0°C < TA < 55°C, analog
power = off.
4
25
μA Conditions are with internal slow speed oscillator, Vdd = 3.3V, 55°C < TA < 70°C, analog
power = off.
DC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 9. DC GPIO Specifications
Parameter
Description
RPU
Pull-Up Resistor
Pull-Down Resistor
RPD
High Output Level
VOH
VOL
Low Output Level
VIL
VIH
VH
IIL
CIN
COUT
Input Low Level
Input High Level
Input Hysteresis
Input Leakage (Absolute Value)
Capacitive Load on Pins as Input
Capacitive Load on Pins as Output
Min
4
4
Vdd – 1.0
Typ
5.6
5.6
–
–
–
–
2.1
–
–
–
–
–
–
60
1
3.5
3.5
Max Unit
Notes
8
kΩ
8
kΩ
–
V IOH = 10 mA, Vdd = 4.75 to 5.25V (8 total loads, 4
on even port pins (for example, P0[2], P1[4]), 4 on
odd port pins (for example, P0[3], P1[5])). 80 mA
maximum combined IOH budget.
0.75
V IOL = 25 mA, Vdd = 4.75 to 5.25V (8 total loads, 4
on even port pins (for example, P0[2], P1[4]), 4 on
odd port pins (for example, P0[3], P1[5])). 150 mA
maximum combined IOL budget.
0.8
V Vdd = 3.0 to 5.25.
V Vdd = 3.0 to 5.25.
–
mV
–
nA Gross tested to 1 μA.
10
pF Package and pin dependent. Temp = 25°C.
10
pF Package and pin dependent. Temp = 25°C.
Note
2. Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This should be compared with devices that have similar
functions enabled.
Document 38-08036 Rev. *C
Page 15 of 30
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CY7C64215
DC Full-Speed USB Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 10. DC Full-Speed (12 Mbps) USB Specifications
Parameter
Description
USB Interface
Differential Input Sensitivity
VDI
Differential Input Common Mode Range
VCM
VSE
Single Ended Receiver Threshold
Transceiver Capacitance
CIN
High-Z State Data Line Leakage
IIO
REXT
External USB Series Resistor
Static Output High, Driven
VUOH
Min
Typ
Max
Unit
0.2
0.8
0.8
–
–10
23
2.8
–
–
–
–
–
–
–
–
2.5
2.0
20
10
25
3.6
V
V
V
pF
μA
Ω
V
VUOHI
Static Output High, Idle
2.7
–
3.6
V
VUOL
Static Output Low
–
–
0.3
V
ZO
VCRS
USB Driver Output Impedance
D+/D– Crossover Voltage
28
1.3
–
–
44
2.0
Ω
V
Notes
| (D+) – (D–) |
0V < VIN < 3.3V.
In series with each USB pin.
15 kΩ ± 5% to Ground. Internal pull-up
enabled.
15 kΩ ± 5% to Ground. Internal pull-up
enabled.
15 kΩ ± 5% to Ground. Internal pull-up
enabled.
Including REXT Resistor.
DC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 11. 5V DC Analog Output Buffer Specifications
Parameter
VOSOB
TCVOSOB
VCMOB
ROUTOB
Description
Min
Typ
Max
Unit
Notes
Input Offset Voltage (Absolute Value)
–
3
12
mV
Average Input Offset Voltage Drift
–
+6
–
μV/°C
Common-Mode Input Voltage Range
0.5
–
Vdd - 1.0
V
Output Resistance
–
0.6
–
W
Power = Low
–
0.6
–
W
Power = High
VOHIGHOB High Output Voltage Swing
(Load = 32 ohms to Vdd/2)
0.5 x Vdd + 1.1
–
–
V
Power = Low
0.5 x Vdd + 1.1
–
–
V
Power = High
VOLOWOB Low Output Voltage Swing
(Load = 32 ohms to Vdd/2)
Power = Low
–
–
0.5 x Vdd – 1.3 V
Power = High
–
–
0.5 x Vdd – 1.3 V
ISOB
Supply Current Including Bias Cell (No Load)
Power = Low
–
1.1
5.1
mA
Power = High
–
2.6
8.8
mA
PSRROB Supply Voltage Rejection Ratio
53
64
–
dB (0.5 x Vdd – 1.3) <
VOUT < (Vdd – 2.3).
Document 38-08036 Rev. *C
Page 16 of 30
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CY7C64215
Table 12. 3.3V DC Analog Output Buffer Specifications
Parameter
VOSOB
TCVOSOB
VCMOB
ROUTOB
Description
Min
Typ
Max
Unit
Notes
Input Offset Voltage (Absolute Value)
–
3
12
mV
Average Input Offset Voltage Drift
–
+6
–
μV/°C
Common-Mode Input Voltage Range
0.5
Vdd - 1.0
V
Output Resistance
Power = Low
–
1
–
W
Power = High
–
1
–
W
VOHIGHOB High Output Voltage Swing
(Load = 1K ohms to Vdd/2)
Power = Low
0.5 x Vdd + 1.0 –
–
V
Power = High
0.5 x Vdd + 1.0 –
–
V
VOLOWOB Low Output Voltage Swing
(Load = 1K ohms to Vdd/2)
Power = Low
–
– 0.5 x Vdd – 1.0
V
Power = High
–
– 0.5 x Vdd – 1.0
V
ISOB
Supply Current Including Bias Cell (No Load)
0.8
2.0
mA
Power = Low
2.0
4.3
mA
–
Power = High
PSRROB Supply Voltage Rejection Ratio
34
64
–
dB (0.5 x Vdd – 1.0) < VOUT
< (0.5 x Vdd + 0.9).
DC Analog Reference Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 13. 5V DC Analog Reference Specifications
Parameter
BG
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Description
Bandgap Voltage Reference
AGND = Vdd/2[3]
AGND = 2 x BandGap[3]
AGND = P2[4] (P2[4] = Vdd/2)[3]
AGND = BandGap[3]
AGND = 1.6 x BandGap[3]
AGND Block to Block Variation
(AGND = Vdd/2)[3]
RefHi = Vdd/2 + BandGap
RefHi = 3 x BandGap
RefHi = 2 x BandGap + P2[6] (P2[6] = 1.3V)
RefHi = P2[4] + BandGap (P2[4] = Vdd/2)
RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6]
= 1.3V)
RefHi = 3.2 x BandGap
RefLo = Vdd/2 – BandGap
RefLo = BandGap
RefLo = 2 x BandGap – P2[6] (P2[6] = 1.3V)
RefLo = P2[4] – BandGap (P2[4] = Vdd/2)
RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] =
1.3V)
Min
1.28
Vdd/2 – 0.04
2 x BG – 0.048
P2[4] – 0.011
BG – 0.009
1.6 x BG – 0.022
–0.034
Typ
1.30
Vdd/2 – 0.01
2 x BG – 0.030
P2[4]
BG + 0.008
1.6 x BG – 0.010
0.000
Max
1.32
Vdd/2 + 0.007
2 x BG + 0.024
P2[4] + 0.011
BG + 0.016
1.6 x BG + 0.018
0.034
Unit
V
V
V
V
V
V
V
Vdd/2 + BG – 0.10
Vdd/2 + BG
Vdd/2 + BG + 0.10
3 x BG – 0.06
3 x BG
3 x BG + 0.06
2 x BG + P2[6] – 0.113 2 x BG + P2[6] – 0.018 2 x BG + P2[6] + 0.077
P2[4] + BG – 0.130 P2[4] + BG – 0.016 P2[4] + BG + 0.098
P2[4] + P2[6] – 0.133 P2[4] + P2[6] – 0.016 P2[4] + P2[6]+ 0.100
V
V
V
V
V
3.2 x BG – 0.112
Vdd/2 – BG – 0.04
BG – 0.06
2 x BG – P2[6] – 0.084
P2[4] – BG – 0.056
P2[4] – P2[6] – 0.057
V
V
V
V
V
V
3.2 x BG
3.2 x BG + 0.076
Vdd/2 – BG + 0.04
Vdd/2 – BG + 0.024
BG
BG + 0.06
2 x BG – P2[6] + 0.025 2 x BG – P2[6] + 0.134
P2[4] – BG + 0.026 P2[4] – BG + 0.107
P2[4] – P2[6] + 0.026 P2[4] – P2[6] + 0.110
Note
3. AGND tolerance includes the offsets of the local buffer in the enCoRe III block. Bandgap voltage is 1.3V ± 0.02V.
Document 38-08036 Rev. *C
Page 17 of 30
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CY7C64215
Table 14. 3.3V DC Analog Reference Specifications
Parameter
BG
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Description
Bandgap Voltage Reference
AGND = Vdd/2[3]
AGND = 2 x BandGap[3]
AGND = P2[4] (P2[4] = Vdd/2)
AGND = BandGap[3]
AGND = 1.6 x BandGap[3]
AGND Column to Column Variation (AGND =
Vdd/2)[3]
RefHi = Vdd/2 + BandGap
RefHi = 3 x BandGap
RefHi = 2 x BandGap + P2[6] (P2[6] = 0.5V)
RefHi = P2[4] + BandGap (P2[4] = Vdd/2)
RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V)
RefHi = 3.2 x BandGap
RefLo = Vdd/2 – BandGap
RefLo = BandGap
RefLo = 2 x BandGap - P2[6] (P2[6] = 0.5V)
RefLo = P2[4] – BandGap (P2[4] = Vdd/2)
RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V)
Min
1.28
Vdd/2 – 0.03
P2[4] – 0.008
BG – 0.009
1.6 x BG – 0.027
–0.034
Typ
1.30
Vdd/2 – 0.01
Not Allowed
P2[4] + 0.001
BG + 0.005
1.6 x BG – 0.010
0.000
Max
1.32
Vdd/2 + 0.005
Unit
V
V
P2[4] + 0.009
BG + 0.015
1.6 x BG + 0.018
0.034
V
V
V
V
Not Allowed
Not Allowed
Not Allowed
Not Allowed
P2[4] + P2[6] – 0.075 P2[4] + P2[6] – 0.009 P2[4] + P2[6] + 0.057 V
Not Allowed
Not Allowed
Not Allowed
Not Allowed
Not Allowed
P2[4] – P2[6] – 0.048 P2[4] – P2[6] + 0.022 P2[4] – P2[6] + 0.092 V
DC Analog enCoRe III Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 15. DC Analog enCoRe III Block Specifications
Parameter
Description
Resistor Unit Value (Continuous Time)
RCT
CSC
Capacitor Unit Value (Switched Capacitor)
Document 38-08036 Rev. *C
Min
–
–
Typ
12.2
80
Max
–
–
Unit
kΩ
fF
Notes
Page 18 of 30
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CY7C64215
DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V or 3.3V at 25°C and are for
design guidance only.
Note The bits PORLEV and VM in the table below refer to bits in the VLT_CR register. See the PSoC Mixed-Signal Array Technical
Reference Manual for more information on the VLT_CR register.
Table 16. DC POR and LVD Specifications
Parameter
Description
VPPOR0R
VPPOR1R
VPPOR2R
Vdd Value for PPOR Trip (positive ramp)
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
VPPOR0
VPPOR1
VPPOR2
Vdd Value for PPOR Trip (negative ramp)
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
VPH0
VPH1
VPH2
PPOR Hysteresis
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
Vdd Value for LVD Trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
Min
Typ
Max
Unit
–
2.91
4.39
4.55
–
V
V
V
–
2.82
4.39
4.55
–
V
V
V
–
–
–
92
0
0
–
–
–
mV
mV
mV
2.86
2.96
3.07
3.92
4.39
4.55
4.63
4.72
2.92
3.02
3.13
4.00
4.48
4.64
4.73
4.81
2.98[4]
3.08
3.20
4.08
4.57
4.74[5]
4.82
4.91
V
V
V
V
V
V
V
V
Notes
Notes
4. Always greater than 50 mV above PPOR (PORLEV = 00) for falling supply
5. Always greater than 50 mV above PPOR (PORLEV = 10) for falling supply
Document 38-08036 Rev. *C
Page 19 of 30
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CY7C64215
DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 17. DC Programming Specifications
Parameter
Description
Min
Typ
Max
Unit
Notes
IDDP
Supply Current During Programming or
–
15
30
mA
Verify
VILP
Input Low Voltage During Programming or
–
–
0.8
V
Verify
VIHP
Input High Voltage During Programming or
2.1
–
–
V
Verify
IILP
Input Current when Applying Vilp to P1[0]
–
–
0.2
mA Driving internal pull-down resistor.
or P1[1] During Programming or Verify
IIHP
Input Current when Applying Vihp to P1[0]
–
–
1.5
mA Driving internal pull-down resistor.
or P1[1] During Programming or Verify
VOLV
Output Low Voltage During Programming
–
– Vss + 0.75 V
or Verify
VOHV
Output High Voltage During Programming Vdd – 1.0
–
Vdd
V
or Verify
FlashENPB Flash Endurance (per block)
50,000
–
–
– Erase/write cycles per block.
FlashENT Flash Endurance (total)[6]
1,800,000 –
–
– Erase/write cycles.
FlashDR
Flash Data Retention
10
–
–
Years
Note
6. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each,
36x2 blocks of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no
single block ever sees more than 50,000 cycles).
For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before
writing. Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
Document 38-08036 Rev. *C
Page 20 of 30
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AC Electrical Characteristics
AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 18. AC Chip-Level Specifications
Parameter
Description
Min
Typ
Max
[7, 8]
Unit
FIMO245V
Internal Main Oscillator Frequency for 24 MHz
(5V)
23.04
24
24.96
FIMO243V
Internal Main Oscillator Frequency for 24 MHz
(3.3V)
22.08
24
25.92[7,9]
FIMOUSB
Internal Main Oscillator Frequency with USB
Frequency locking enabled and USB traffic
present.
23.94
24
24.06[8]
FCPU1
CPU Frequency (5V Nominal)
0.93
24
24.96[7,8]
MHz
MHz
Notes
MHz Trimmed for 5V operation using
factory trim values.
MHz Trimmed for 3.3V operation
using factory trim values.
MHz 0°C < TA < 70°C
FCPU2
CPU Frequency (3.3V Nominal)
0.93
12
12.96[8, 9]
FBLK5
Digital PSoC Block Frequency (5V Nominal)
0
48
49.92[7, 8, MHz Refer to the AC Digital Block
10]
Specifications.
FBLK3
Digital PSoC Block Frequency (3.3V Nominal)
0
24
25.92[8, 10] MHz
F32K1
Internal Low Speed Oscillator Frequency
15
32
Jitter32k
32 kHz Period Jitter
–
100
Step24M
24 MHz Trim Step Size
Fout48M
48 MHz Output Frequency
64
kHz
ns
–
50
46.08
48.0
–
kHz
Jitter24M1 24 MHz Period Jitter (IMO) Peak-to-Peak
–
300
FMAX
Maximum frequency of signal on row input or
row output.
–
–
12.96
MHz
TRAMP
Supply Ramp Time
0
–
–
μs
49.92[7, 9] MHz Trimmed. Utilizing factory trim
values.
ps
Figure 6. 24 MHz Period Jitter (IMO) Timing Diagram
Jitter24M1
F24M
Notes
7. 4.75V < Vdd < 5.25V.
8. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range.
9. 3.0V < Vdd < 3.6V. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation
at 3.3V.
10. See the individual user module data sheets for information on maximum frequencies for user modules.
Document 38-08036 Rev. *C
Page 21 of 30
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CY7C64215
AC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 19. AC GPIO Specifications
Parameter
FGPIO
TRiseF
TFallF
TRiseS
TFallS
Description
GPIO Operating Frequency
Rise Time, Normal Strong Mode, Cload = 50 pF
Fall Time, Normal Strong Mode, Cload = 50 pF
Rise Time, Slow Strong Mode, Cload = 50 pF
Fall Time, Slow Strong Mode, Cload = 50 pF
Min
0
3
2
10
10
Typ
–
–
–
27
22
Max
12
18
18
–
–
Unit
MHz
ns
ns
ns
ns
Notes
Normal Strong Mode
Vdd = 4.5 to 5.25V, 10%–90%
Vdd = 4.5 to 5.25V, 10%–90%
Vdd = 3 to 5.25V, 10%–90%
Vdd = 3 to 5.25V, 10%–90%
Figure 7. GPIO Timing Diagram
90%
GPIO
Pin
Output
Voltage
10%
TRiseF
TRiseS
TFallF
TFallS
AC Full-Speed USB Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 20. AC Full-Speed (12 Mbps) USB Specifications
Parameter
TRFS
TFSS
TRFMFS
TDRATEFS
Description
Transition Rise Time
Transition Fall Time
Rise/Fall Time Matching: (TR/TF)
Full-Speed Data Rate
Document 38-08036 Rev. *C
Min
4
4
90
12 – 0.25%
Typ
–
–
–
12
Max
20
20
111
12 + 0.25%
Unit
Notes
ns
For 50 pF load.
ns
For 50 pF load.
%
For 50 pF load.
Mbps
Page 22 of 30
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CY7C64215
AC Digital Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 21. AC Digital Block Specifications
Function
Min
Typ
Max
Unit
50[11]
–
–
ns
Maximum Frequency, No Capture
–
–
49.92
MHz
Maximum Frequency, With Capture
–
–
25.92
MHz
50[11]
–
–
ns
Maximum Frequency, No Enable Input
–
–
49.92
MHz
Maximum Frequency, Enable Input
–
–
25.92
MHz
Asynchronous Restart Mode
20
–
–
ns
Synchronous Restart Mode
50[11]
–
–
ns
Disable Mode
50[12]
–
–
ns
Maximum Frequency
–
–
49.92
MHz
4.75V < Vdd < 5.25V.
CRCPRS Maximum Input Clock Frequency
(PRS
Mode)
–
–
49.92
MHz
4.75V < Vdd < 5.25V.
CRCPRS Maximum Input Clock Frequency
(CRC
Mode)
–
–
24.6
MHz
SPIM
Maximum Input Clock Frequency
–
–
8.2
MHz
SPIS
Maximum Input Clock Frequency
Timer
Counter
Dead
Band
Description
Capture Pulse Width
Enable Pulse Width
Notes
4.75V < Vdd < 5.25V.
4.75V < Vdd < 5.25V.
Kill Pulse Width:
Width of SS_ Negated Between Transmissions
–
–
4.1
MHz
50[11]
–
–
ns
Maximum data rate at 4.1 MHz due to
2 x over clocking.
Transmitter
Maximum Input Clock Frequency
–
–
24.6
MHz
Maximum data rate at 3.08 MHz due to
8 x over clocking.
Receiver
Maximum Input Clock Frequency
–
–
24.6
MHz
Maximum data rate at 3.08 MHz due to
8 x over clocking.
AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 22. AC External Clock Specifications
Parameter
Description
Min
Typ
Max
Unit
23.94
24
24.06
MHz
Duty Cycle
47
50
53
%
Power - up to IMO Switch
150
–
–
μs
FOSCEXT
Frequency for USB Applications
–
–
Notes
Note
11. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
Document 38-08036 Rev. *C
Page 23 of 30
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CY7C64215
AC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 23. 5V AC Analog Output Buffer Specifications
Parameter
Description
TROB
Rising Settling Time to 0.1%, 1V Step, 100 pF Load
Power = Low
Power = High
TSOB
Falling Settling Time to 0.1%, 1V Step, 100 pF Load
Power = Low
Power = High
SRROB
Rising Slew Rate (20% to 80%), 1V Step, 100 pF Load
Power = Low
Power = High
SRFOB
Falling Slew Rate (80% to 20%), 1V Step, 100 pF Load
Power = Low
Power = High
BWOBSS
Small Signal Bandwidth, 20mVpp, 3-dB BW, 100 pF Load
Power = Low
Power = High
BWOBLS
Large Signal Bandwidth, 1Vpp, 3-dB BW, 100 pF Load
Power = Low
Power = High
Min
Typ
Max
Unit
–
–
–
–
2.5
2.5
μs
μs
–
–
–
–
2.2
2.2
μs
μs
0.65
0.65
–
–
–
–
V/μs
V/μs
0.65
0.65
–
–
–
–
V/μs
V/μs
0.8
0.8
–
–
–
–
MHz
MHz
300
300
–
–
–
–
kHz
kHz
Min
Typ
Max
Unit
–
–
–
–
3.8
3.8
μs
μs
–
–
–
–
2.6
2.6
μs
μs
0.5
0.5
–
–
–
–
V/μs
V/μs
0.5
0.5
–
–
–
–
V/μs
V/μs
0.7
0.7
–
–
–
–
MHz
MHz
200
200
–
–
–
–
kHz
kHz
Notes
Table 24. 3.3V AC Analog Output Buffer Specifications
Parameter
Description
TROB
Rising Settling Time to 0.1%, 1V Step, 100 pF Load
Power = Low
Power = High
TSOB
Falling Settling Time to 0.1%, 1V Step, 100 pF Load
Power = Low
Power = High
SRROB
Rising Slew Rate (20% to 80%), 1V Step, 100 pF Load
Power = Low
Power = High
SRFOB
Falling Slew Rate (80% to 20%), 1V Step, 100 pF Load
Power = Low
Power = High
BWOBSS
Small Signal Bandwidth, 20mVpp, 3dB BW, 100 pF Load
Power = Low
Power = High
BWOBLS
Large Signal Bandwidth, 1Vpp, 3dB BW, 100 pF Load
Power = Low
Power = High
Document 38-08036 Rev. *C
Notes
Page 24 of 30
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CY7C64215
AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 25. AC Programming Specifications
Parameter
Description
Min
Typ
Max
Unit
Notes
TRSCLK
Rise Time of SCLK
1
–
20
ns
TFSCLK
Fall Time of SCLK
1
–
20
ns
TSSCLK
Data Set up Time to Falling Edge of SCLK
40
–
–
ns
THSCLK
Data Hold Time from Falling Edge of SCLK
40
–
–
ns
FSCLK
Frequency of SCLK
0
–
8
MHz
TERASEB
Flash Erase Time (Block)
–
10
–
ms
TWRITE
Flash Block Write Time
–
30
–
ms
TDSCLK
Data Out Delay from Falling Edge of SCLK
–
–
45
ns
Vdd > 3.6
TDSCLK3
Data Out Delay from Falling Edge of SCLK
–
–
50
ns
3.0 < Vdd < 3.6
AC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and 0°C < TA < 70°C, or 3.0V to 3.6V and 0°C < TA < 70°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are
for design guidance only.
Table 26. AC Characteristics of the I2C SDA and SCL Pins for Vdd
Parameter
Description
Min
Max
Fast Mode
Min
Max
Unit
0
100
0
400
kHz
THDSTAI2C Hold Time (repeated) START Condition. After
this period, the first clock pulse is generated.
4.0
–
0.6
–
μs
TLOWI2C
LOW Period of the SCL Clock
4.7
–
1.3
–
μs
THIGHI2C
HIGH Period of the SCL Clock
4.0
–
0.6
–
μs
TSUSTAI2C
Setup Time for a Repeated START Condition
4.7
–
0.6
–
μs
0
–
0
–
μs
FSCLI2C
SCL Clock Frequency
Standard Mode
THDDATI2C Data Hold Time
TSUDATI2C Data Setup Time
250
–
100[12]
–
ns
TSUSTOI2C Setup Time for STOP Condition
4.0
–
0.6
–
μs
TBUFI2C
Bus Free Time Between a STOP and START
Condition
4.7
–
1.3
–
μs
TSPI2C
Pulse Width of spikes are suppressed by the
input filter.
–
–
0
50
ns
Notes
Note
12. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT Š 250 ns must then be met. This automatically
be the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the
next data bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
Document 38-08036 Rev. *C
Page 25 of 30
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Figure 8. Definition for Timing for Fast/Standard Mode on the I2C Bus
SDA
TLOWI2C
TSUDATI2C
THDSTAI2C
TSPI2C
TBUFI2C
SCL
S THDSTAI2C THDDATI2C THIGHI2C
Document 38-08036 Rev. *C
TSUSTAI2C
Sr
TSUSTOI2C
P
S
Page 26 of 30
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CY7C64215
Packaging Information
This section illustrates the package specification for the CY7C64215 enCoRe III, along with the thermal impedance for the package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled
PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
Package Diagrams
Figure 9. 56-Pin (8x8 mm) QFN
001-12921**
Document 38-08036 Rev. *C
Page 27 of 30
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CY7C64215
Figure 10. 28-Pin Shrunk Small Outline Package
51-85079-*C
Thermal Impedance
Table 27. Thermal Impedance for the Package
Package
Typical θJA *
56 Pin MLF
20 oC/W
28 Pin SSOP
96 oC/W
* TJ = TA + POWER x θJA
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 28. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature*
Maximum Peak Temperature
56 Pin MLF
240°C
260°C
28 Pin SSOP
240°C
260°C
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220±5°C with
Sn-Pb or 245±5°C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
Document 38-08036 Rev. *C
Page 28 of 30
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CY7C64215
Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may
degrade device reliability.
Parameter
Description
TBAKETEMP
Bake Temperature
TBAKETIME
Bake Time
Min
See package label
Typical
Max
Unit
125
See package label
°C
72
hours
Ordering Information
Package
Ordering Code
Flash Size
SRAM (Bytes)
56-Pin MLF
CY7C64215-56LFXC
16K
1K
28-Pin SSOP
CY7C64215-28PVXC
16K
1K
Document 38-08036 Rev. *C
Page 29 of 30
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CY7C64215
Document History Page
Description Title: CY7C64215, enCoRe™ III Full Speed USB Controller
Document Number: 38-08036
Rev.
ECN No.
Submission
Date
Orig. of
Change
**
131325
See ECN
XGR
New data sheet
*A
385256
See ECN
BHA
Changed from Advance Information to Preliminary.
Added standard data sheet items.
Changed Part number from CY7C642xx to CY7C64215.
*B
2547630
08/04/08
AZIEL/PYRS Operational voltage range for USB specified under "Full-Speed USB
(12Mbps)". CMP_GO_EN1 register removed as it has no functionality on
Radon.
Figure "CPU Frequency" adjusted to show invalid operating region for USB
with footnote describing reason.
DC electrical characteristic, Vdd. Note added describing where USB
hardware is non-functional.
*C
2620679
12/12/08
CMCC/PYRS Added Package Handling information
Deleted note regarding link to amkor.com for MLF package dimensions
Description of Change
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at cypress.com/sales.
Products
PSoC
Clocks & Buffers
Wireless
Memories
Image Sensors
PSoC Solutions
psoc.cypress.com
clocks.cypress.com
General
Low Power/Low Voltage
psoc.cypress.com/solutions
psoc.cypress.com/low-power
wireless.cypress.com
Precision Analog
memory.cypress.com
LCD Drive
psoc.cypress.com/lcd-drive
CAN 2.0b
psoc.cypress.com/can
USB
psoc.cypress.com/usb
image.cypress.com
psoc.cypress.com/precision-analog
© Cypress Semiconductor Corporation, 2007-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document 38-08036 Rev. *C
Revised December 08, 2008
Page 30 of 30
enCoRe, PSoC, and Programmable System-on-Chip are trademarks of Cypress Semiconductor Corporation. Purchase of I2C components from Cypress or one of its sublicensed Associated
Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
All products and company names mentioned in this document may be the trademarks of their respective holders.
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