FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71060-1E DSU-FR EMULATOR LQFP-64P HEADER TYPE 2 MB2198-304 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P*1 header type 2 (MB2198-304) for the DSU-FR emulator. This product is used together with the BGA-660P adapter for the DSU-FR emulator (MB2198300)*2 to connect the DSU-FR emulator (MB2198-01)*3 and DSU-FR cable (MB2198-10)*4 to a user system that uses a MB91460 series Fujitsu FR*4 microcontroller (LQFP-64P)*5. This manual describes how to use the LQFP-64P header type 2 for the DSU-FR emulator. Please read the manual carefully before using. Please contact your Fujitsu sales or support representative for details on which production and evaluation MCU models can be used with this product. *1 : *2 : *3 : *4 : *5 : The lead pitch of package (FPT-64P-M23) is 0.65mm and the body size is 14mm × 14mm. Referred to as the “adapter” Referred to as the “emulator” Referred to as the “DSU cable” FR is an abbreviation of FUJITSU RISC CONTROLLER and is a product of Fujitsu Limited. ■ Handling and usage The handling and use of this product and notes regarding safety use are included in the hardware manual of the DSU-FR family emulator. Follow the instructions in for the use of this product. • DSU-FR EMULATOR MB2198-01 HARDWARE MANUAL • DSU-FR EMULATOR DSU-FR CABLE MB2198-10 OPERATION MANUAL • DSU-FR EMULATOR BGA-660P ADAPTER MB2198-300 OPERATION MANUAL ■ Caution of the products described in this manual The following precautions apply to the product described in this manual. CAUTION The wrong use of a device will give an injury and may cause malfunction on customers system. Cuts This product has parts with sharp points that are exposed. Do not touch edge of the product with your bare hands. There is a possibility that it may be injured. Damage When connect the header board to the user system, correctly position the index mark (▲) on the NQPACK mounted on the user system with the index mark (▲) on the header board, otherwise the emulator system and user system might be damaged. Damage When mounting a mass production MCU, correctly position pin 1, otherwise the mass production MCU and user system might be damaged. i • The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. • The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the information. • Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. • The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. • Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. • If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. Copyright ©2007 FUJITSU LIMITED All rights reserved ii 1. Checking the Delivered Product Before using the MB2198-304, confirm that the following components are included in the box: • • • • • • • LQFP-64P header board*1 Screws for securing the header board (M2 × 10mm, 0.4mm pitch) Washers NQPACK064SB*2 HQPACK064SB140*3 Operation manual (Japanese version) Operation manual (English version, this manual) :1 :4 :4 :1 :1 :1 :1 *1 : The YQPACK064SB is mounted on the header board (Tokyo Eletech Corporation, referred to as the “YQPACK”). *2 : The IC socket (manufactured by Tokyo Eletech Corporation, referred to as “NQPACK”). This socket is supplied with a special screwdriver and 2 guide pins. Additionally, the relatively high reliability NQPACK064SB-SL (Tokyo Eletech Corporation, sold separately) can be used by preparing screw holes on the user system board for mounting the socket. For more information, contact Tokyo Eletech Corporation. *3 : The IC socket cover (manufactured by Tokyo Eletech Corporation, and referred to as “HQPACK”). This cover includes 4 screws for securing HQPACK (M2 × 6mm, 0.4mm pitch). This product is used as an emulator system by combining with an optional emulator, DSU cable and adapter. Consult a sales or support representative from Fujitsu Limited for details on the adapter and emulator for this product. 2. Handling Precautions ■ Handling precautions The header board is precision-manufactured to improve dimensional accuracy and to ensure reliable contact. The header is therefore sensitive to mechanical shock. To ensure correct use of the header in the proper environment, observe the following points regarding its insertion and removal: • To avoid placing stress on the NQPACK mounted on the user system during connecting the header board. ■ Precautions when operating on the sub clock When using this product, the evaluation MCU cannot be supplied with a sub clock from the user system. When the evaluation MCU is operating using the sub clock, use the sub clock on the adapter. Refer to the operation manual for the adapter for more details. 1 3. Notes on Designing ■ Notes on designing the printed circuit board for the user system If the header board is connected to a user system, the heights of parts mounted around the header board are restricted. When designing the printed circuit board of the user system, consider the heights of components within the range of the header board, as shown in Figure 1, so that the components mounted on the user system do not interfere with the header board. 88.0mm 23.0mm 42.0mm 150.0mm 52.0mm Adapter Header User system Insulating plate Approx. 17.0mm* 1.6mm Approx. 13.0mm* NQPACK064SB * : The height differs slightly depending on how the sockets are engaged. Figure 1 Header board dimensions 2 10.0mm ■ MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the printed circuit board of the user system. The printed circuit board of the user system must be designed with due consideration given to this footprint as well as to the mass production MCU. For more information, contact the Tokyo Eletech Corporation. 0.65mm × 15 = 9.75mm 0.65mm 12.0mm 5.0mm φ2.2mm*2 3-φ1.0mm*1 0.65mm × 15 = 9.75mm 1.8mm 0.4mm 1.8mm No.1 pin 5.0mm 12.0mm 1.8mm 1.8mm *1 : Position of the guide pin hole (φ1.0) when mounting the NQPACK. These holes do not need to be fabricated if the guide pins are not used. *2 : Position of the hole (φ2.2) for the screw for affixing the IC socket when the NQPACK064SB-SL (Tokyo Eletech Corporation, sold separately) is mounted instead of the NQPACK064SB-SL. This hole does not need to be fabricated if the NQPACK064SB-SL is not used. Figure 2 Recommended dimensions of the footprint for mounting the NQPACK 3 4. Procedure for Connecting to the User System Before using the MB2198-304, mount the supplied NQPACK on the user system. Connect the header board directly to the adapter. Refer to the operation manual of the adapter for details on how to connect the adapter. ■ Connecting 1. To connect the header board to the user system, align pin 1 indicated by the index mark (▲) on the NQPACK mounted on the user system with the index mark (▲) on the header board and then insert it (See Figure 3) . The YQPACK pins are thin and easy to bend. Check that the YQPACK pins are not bent before inserting it into the NQPACK. 2. Insert each of the screws for securing the header board through a washer and into each of the four holes in the header board. Partially tighten one of the screws with the special screwdriver supplied with the NQPACK and then partially tighten the screw in the diagonally opposite corner. Partially tighten the two remaining screws. Finally repeat the process making the screws equally tight. (See Figure 4) . Take care not to overtighten the screws as this may cause a faulty connection. Adapter I/F connector 1 Adapter I/F connector 2 YQPACK (It mounts at the back) NQPACK Index mark (▲) Header board Index mark (▲) Figure 3 Index position 4 Screws for securing the header board Header board Washer YQPACK User system NQPACK Figure 4 Header board connection ■ Disconnection To disconnect the header board from the user system, remove all four screws, and then pull the header board straight out of the NQPACK. 5 5. Mounting Mass Production MCUs Use the supplied HQPACK to mount a mass production MCU on the user system. ■ Mounting 1. To mount a mass production MCU on the user system, align the index mark (▲) on the NQPACK mounted on the user system with the index mark (●) on the mass production MCU. 2. Confirm that the mass production MCU is correctly mounted on the NQPACK, and then align the index mark (the only corner with an angle cut-out) of the HQPACK with the index mark of the NQPACK, and insert it (See “Figure 5”). The HQPACK pins are thin and easy to bend. Check that the HQPACK pins are not bent before inserting it into the NQPACK. 3. Insert each of the screws for securing the HQPACK into each of the four screw holes on the HQPACK and tighten the diagonally opposite screws in turn. To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten the four screws in sequence. Tightening the screws too tight might result in a defective contact. Screws for securing the HQPACK HQPACK Mass production MCU User system NQPACK Figure 5 Mounting a mass production MCU ■ Disconnection To remove the HQPACK, remove all of the four screws, and pull the HQPACK vertically out from the NQPACK. 6 6. Connector Pin Assignment The signals from the evaluation MCU mounted on the adapter board are connected to the YQPACK (the same assignments as mass production MCU) via adapter I/F connectors 1 and 2 on the header board. For details on the mass production MCU pins, refer to the data sheet or hardware manual of each MCU. ■ Pin assignment Tables 1 to 4 show the correspondence between the pin numbers for adapter I/F connectors 1 and 2, the evaluation MCU on the adapter board, and the mass production MCU. The following explanations apply to these tables. Row A corresponds to the side of the connector that displays the polarity. Row B corresponds to the opposite side. *1 : No connection. These are not connected on either evaluation MCUs or mass production MCUs. *2 : Pin 18 on mass production MCUs is connected to pins AA38, Y37, Y36, and Y35 on evaluation MCUs. - : Unconnected (open) pin : VCC The evaluation MCU power supply pins (VCC) are as follows: VCC=Y38, W38, W36, W35, G5, L5, AR7, AM35, H35, D8, R5, W5, AC5, AG5, AP11, AP19, AP23, AP31, AH34, AD34, T34, H34, E32, E28, E20, E12, G4, AL4, AR31, D32, AL5, AP7, AP15, AP27, AR7, AM34, Y34, M34, E24, E16, E8, AP33, AP29, AP25, AP21,AP13, AA5, D15, D25, R35, AE35, AR24, P4, AP17, AP9, AN5, AJ5, AE5, U5, N5, J5,AR14, AD4, AK34, AF34, AB34, V34, P34, K34, F34, E30, E26, E22, E18, E14, E10, E6 The mass production MCU power supply (VCC) pin numbers are 16 and 48. : VSS The evaluation MCU ground pins (VSS) are as follows: VSS = E11, E15, E19, E23, E27, E31, G34, L34, R34, W34, AA34, AE34, M5, C3, B37, T5, Y5, AD5, AJ34, AH5, AT36, AT3, AU37, AU2, AK5, AP8, AP12, AP16, AP20, AP24, AP28, AP30, AL34, A1, B1, AU1, AV1, AV2, AV37, AV38, AU38, B38, A38, A37, A2, C36, D4, AR4, AR35, D35, E5, K5, P5, V5, AB5, AF5, AM5, AP5, AP6, AP10, AP14, AP18, AP22, AP26, AP32, AP34, AN34, AG34, AC34, U34, N34, J34, E34, E33, E29, E25, E21, E17, E13, E7 The mass production MCU ground (VSS) pin numbers are 17, 33, and 49. 7 Table 1 Adapter I/F Connector 1 (Row A) Connector Pin No. A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 A32 A33 A34 A35 A36 A37 A38 A39 A40 A41 A42 A43 A44 A45 A46 A47 A48 A49 A50 8 Mass Production Evaluation MCU MCU Pin No. Pin No. VCC VCC J36 H37 K36 J35 J83 K35 J37 K38 GND GND E38 F37 F38 G35 G38 H36 G37 H38 GND GND C38 D37 D38 E35 F36 F35 E37 G36 GND GND C34 A36 C35 B35 D36 B36 E36 C37 GND GND C32 A34 C33 B33 D33 B34 D34 A35 Connector Pin No. A51 A52 A53 A54 A55 A56 A57 A58 A59 A60 A61 A62 A63 A64 A65 A66 A67 A68 A69 A70 A71 A72 A73 A74 A75 A76 A77 A78 A79 A80 A81 A82 A83 A84 A85 A86 A87 A88 A89 A90 A91 A92 A93 A94 A95 A96 A97 A98 A99 A100 Mass Production Evaluation MCU MCU Pin No. Pin No. GND GND C30 A32 C31 D30 B31 D31 B32 A33 GND GND 61 D28 62 A30 59 D29 60 C28 B29 C29 B30 A31 GND GND 32 C26 31 A28 42 C27 41 D26 B27 D27 A29 B28 AC38 AB36 AC36 AC35 GND AF38 AD36 AE36 AG38 AD3 AC3 VCC GND 40 AD1 GND AD2 GND NC*1 Table 2 Adapter I/F Connector 1 (Row B) Connector Pin No. B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46 B47 B48 B49 B50 Mass Production Evaluation MCU MCU Pin No. Pin No. B23 A26 B24 C24 B25 C25 B26 A27 GND GND 51 C22 52 A24 47 C23 50 B21 45 D23 46 B22 43 A25 44 D24 GND GND D20 B20 D21 A21 C21 A22 D22 A23 GND GND D18 A18 D19 B19 C19 A19 C20 A20 GND GND 26 D16 25 A16 C17 27 D17 29 C18 28 B17 A17 30 B18 Connector Pin No. B51 B52 B53 B54 B55 B56 B57 B58 B59 B60 B61 B62 B63 B64 B65 B66 B67 B68 B69 B70 B71 B72 B73 B74 B75 B76 B77 B78 B79 B80 B81 B82 B83 B84 B85 B86 B87 B88 B89 B90 B91 B92 B93 B94 B95 B96 B97 B98 B99 B100 Mass Production Evaluation MCU MCU Pin No. Pin No. GND GND 57 B13 58 A14 C15 56 B14 54 B15 55 C16 B16 53 A15 GND GND 22 B11 21 A12 24 C13 23 B12 13 C9 12 B8 A13 D14 GND GND B9 A10 C11 B10 D11 C12 D12 A11 AD38 AA37 AB37 AD35 AE38 AC37 AD37 AE37 GND L4 L3 VCC 18 *2 NC*1 9 Table 3 Adapter I/F Connector 2 (Row A) Connector Pin No. A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 A32 A33 A34 A35 A36 A37 A38 A39 A40 A41 A42 A43 A44 A45 A46 A47 A48 A49 A50 10 Mass Production Evaluation MCU MCU Pin No. Pin No. VCC VCC 11 B7 10 A8 C14 D13 15 C10 14 D9 20 A9 19 D10 GND GND E2 F2 D1 F4 C1 E4 D2 E3 GND GND H4 J4 F1 H2 E1 G2 F3 G3 GND GND K3 K4 H1 K2 G1 J2 H3 J3 GND GND D5 A3 D6 A4 C7 C6 A5 B5 Connector Pin No. A51 A52 A53 A54 A55 A56 A57 A58 A59 A60 A61 A62 A63 A64 A65 A66 A67 A68 A69 A70 A71 A72 A73 A74 A75 A76 A77 A78 A79 A80 A81 A82 A83 A84 A85 A86 A87 A88 A89 A90 A91 A92 A93 A94 A95 A96 A97 A98 A99 A100 Mass Production Evaluation MCU MCU Pin No. Pin No. GND GND 3 J1 2 L2 5 C2 4 D3 7 B3 6 C4 9 B4 8 C5 GND GND L1 N2 N4 N3 M4 M3 K1 M2 GND GND N1 P1 R3 T2 P3 R2 M1 P2 AF37 AF36 AG36 AG37 GND AK38 AH36 AJ36 AL38 39 AE1 37 AE2 63 A6 64 C8 64 E9 VCC GND AB38 GND GND Table 4 Adapter I/F Connector 2 (Row B) Connector Pin No. B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46 B47 B48 B49 B50 Mass Production Evaluation MCU MCU Pin No. Pin No. R1 U4 V2 U3 U2 T3 R4 T4 GND GND W2 W3 V1 W4 U1 V4 T1 V3 GND GND AA1 AB1 Y2 AA4 Y1 Y4 W1 Y3 GND GND AC1 AC2 AB4 AC4 AB2 AB3 AA2 AA3 GND GND L36 K37 L35 M36 M35 L38 Connector Pin No. B51 B52 B53 B54 B55 B56 B57 B58 B59 B60 B61 B62 B63 B64 B65 B66 B67 B68 B69 B70 B71 B72 B73 B74 B75 B76 B77 B78 B79 B80 B81 B82 B83 B84 B85 B86 B87 B88 B89 B90 B91 B92 B93 B94 B95 B96 B97 B98 B99 B100 Mass Production Evaluation MCU MCU Pin No. Pin No. L37 M38 M37 GND N35 N36 P35 P36 P38 N38 GND N37 R36 P37 R37 T36 T37 R38 T35 T38 U35 GND U37 U36 V37 V36 V38 U38 GND V35 AH38 AF35 AG35 AH37 AJ38 AH35 AJ35 AJ37 GND 38 AF2 1 D7 1 B6 63 A7 VCC GND 34 AA36 GND 35 AB35 11 SS01-71060-1E FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM DSU-FR EMULATOR LQFP-64P HEADER TYPE 2 MB2198-304 OPERATION MANUAL February 2007 the first edition Published FUJITSU LIMITED Electronic Devices Edited Business Promotion Dept.