Fujitsu LQFP-64P Network Card User Manual

FUJITSU SEMICONDUCTOR
SUPPORT SYSTEM
SS01-71060-1E
DSU-FR EMULATOR
LQFP-64P HEADER TYPE 2
MB2198-304
OPERATION MANUAL
PREFACE
Thank you for purchasing the LQFP-64P*1 header type 2 (MB2198-304) for the DSU-FR emulator.
This product is used together with the BGA-660P adapter for the DSU-FR emulator (MB2198300)*2 to connect the DSU-FR emulator (MB2198-01)*3 and DSU-FR cable (MB2198-10)*4 to a
user system that uses a MB91460 series Fujitsu FR*4 microcontroller (LQFP-64P)*5.
This manual describes how to use the LQFP-64P header type 2 for the DSU-FR emulator. Please read
the manual carefully before using. Please contact your Fujitsu sales or support representative for details on which production and evaluation MCU models can be used with this product.
*1 :
*2 :
*3 :
*4 :
*5 :
The lead pitch of package (FPT-64P-M23) is 0.65mm and the body size is 14mm × 14mm.
Referred to as the “adapter”
Referred to as the “emulator”
Referred to as the “DSU cable”
FR is an abbreviation of FUJITSU RISC CONTROLLER and is a product of Fujitsu Limited.
■ Handling and usage
The handling and use of this product and notes regarding safety use are included in the hardware
manual of the DSU-FR family emulator.
Follow the instructions in for the use of this product.
• DSU-FR EMULATOR MB2198-01 HARDWARE MANUAL
• DSU-FR EMULATOR DSU-FR CABLE MB2198-10 OPERATION MANUAL
• DSU-FR EMULATOR BGA-660P ADAPTER MB2198-300 OPERATION MANUAL
■ Caution of the products described in this manual
The following precautions apply to the product described in this manual.
CAUTION
The wrong use of a device will give an injury and may cause malfunction on customers system.
Cuts
This product has parts with sharp points that are exposed. Do not touch edge of
the product with your bare hands. There is a possibility that it may be injured.
Damage
When connect the header board to the user system, correctly position the index
mark (▲) on the NQPACK mounted on the user system with the index mark (▲)
on the header board, otherwise the emulator system and user system might be
damaged.
Damage
When mounting a mass production MCU, correctly position pin 1, otherwise the
mass production MCU and user system might be damaged.
i
• The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
• The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU
does not warrant proper operation of the device with respect to use based on such information. When you develop
equipment incorporating the device based on such information, you must assume any responsibility arising out of such
use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the information.
• Any information in this document, including descriptions of function and schematic diagrams, shall not be construed
as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right
of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property
right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
• The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)
for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in
connection with above-mentioned uses of the products.
• Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.
• If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be
required for export of those products from Japan.
Copyright ©2007 FUJITSU LIMITED All rights reserved
ii
1. Checking the Delivered Product
Before using the MB2198-304, confirm that the following components are included in the box:
•
•
•
•
•
•
•
LQFP-64P header board*1
Screws for securing the header board (M2 × 10mm, 0.4mm pitch)
Washers
NQPACK064SB*2
HQPACK064SB140*3
Operation manual (Japanese version)
Operation manual (English version, this manual)
:1
:4
:4
:1
:1
:1
:1
*1 : The YQPACK064SB is mounted on the header board (Tokyo Eletech Corporation, referred to
as the “YQPACK”).
*2 : The IC socket (manufactured by Tokyo Eletech Corporation, referred to as “NQPACK”). This
socket is supplied with a special screwdriver and 2 guide pins. Additionally, the relatively high
reliability NQPACK064SB-SL (Tokyo Eletech Corporation, sold separately) can be used by
preparing screw holes on the user system board for mounting the socket. For more information,
contact Tokyo Eletech Corporation.
*3 : The IC socket cover (manufactured by Tokyo Eletech Corporation, and referred to as “HQPACK”). This cover includes 4 screws for securing HQPACK (M2 × 6mm, 0.4mm pitch).
This product is used as an emulator system by combining with an optional emulator, DSU cable and
adapter.
Consult a sales or support representative from Fujitsu Limited for details on the adapter and emulator
for this product.
2. Handling Precautions
■ Handling precautions
The header board is precision-manufactured to improve dimensional accuracy and to ensure reliable
contact. The header is therefore sensitive to mechanical shock. To ensure correct use of the header
in the proper environment, observe the following points regarding its insertion and removal:
• To avoid placing stress on the NQPACK mounted on the user system during connecting the
header board.
■ Precautions when operating on the sub clock
When using this product, the evaluation MCU cannot be supplied with a sub clock from the user system.
When the evaluation MCU is operating using the sub clock, use the sub clock on the adapter.
Refer to the operation manual for the adapter for more details.
1
3. Notes on Designing
■ Notes on designing the printed circuit board for the user system
If the header board is connected to a user system, the heights of parts mounted around the
header board are restricted.
When designing the printed circuit board of the user system, consider the heights of components
within the range of the header board, as shown in Figure 1, so that the components mounted on the
user system do not interfere with the header board.
88.0mm
23.0mm
42.0mm
150.0mm
52.0mm
Adapter
Header
User
system
Insulating plate
Approx.
17.0mm*
1.6mm
Approx.
13.0mm*
NQPACK064SB
* : The height differs slightly depending on how the sockets are engaged.
Figure 1 Header board dimensions
2
10.0mm
■ MCU footprint design notes
Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the printed circuit board of the user system.
The printed circuit board of the user system must be designed with due consideration given to this
footprint as well as to the mass production MCU.
For more information, contact the Tokyo Eletech Corporation.
0.65mm × 15 = 9.75mm
0.65mm
12.0mm
5.0mm
φ2.2mm*2
3-φ1.0mm*1
0.65mm × 15 = 9.75mm
1.8mm
0.4mm
1.8mm
No.1 pin
5.0mm
12.0mm
1.8mm
1.8mm
*1 : Position of the guide pin hole (φ1.0) when mounting the NQPACK.
These holes do not need to be fabricated if the guide pins are not used.
*2 : Position of the hole (φ2.2) for the screw for affixing the IC socket when the NQPACK064SB-SL
(Tokyo Eletech Corporation, sold separately) is mounted instead of the NQPACK064SB-SL.
This hole does not need to be fabricated if the NQPACK064SB-SL is not used.
Figure 2 Recommended dimensions of the footprint for mounting the NQPACK
3
4. Procedure for Connecting to the User System
Before using the MB2198-304, mount the supplied NQPACK on the user system.
Connect the header board directly to the adapter. Refer to the operation manual of the adapter for
details on how to connect the adapter.
■ Connecting
1. To connect the header board to the user system, align pin 1 indicated by the index mark (▲) on
the NQPACK mounted on the user system with the index mark (▲) on the header board and then
insert it (See Figure 3) .
The YQPACK pins are thin and easy to bend. Check that the YQPACK pins are not bent before
inserting it into the NQPACK.
2. Insert each of the screws for securing the header board through a washer and into each of the four
holes in the header board. Partially tighten one of the screws with the special screwdriver supplied
with the NQPACK and then partially tighten the screw in the diagonally opposite corner. Partially
tighten the two remaining screws. Finally repeat the process making the screws equally tight.
(See Figure 4) .
Take care not to overtighten the screws as this may cause a faulty connection.
Adapter I/F connector 1
Adapter I/F connector 2
YQPACK
(It mounts at the back)
NQPACK
Index mark (▲)
Header board
Index mark (▲)
Figure 3 Index position
4
Screws for securing
the header board
Header board
Washer
YQPACK
User system
NQPACK
Figure 4 Header board connection
■ Disconnection
To disconnect the header board from the user system, remove all four screws, and then pull the
header board straight out of the NQPACK.
5
5. Mounting Mass Production MCUs
Use the supplied HQPACK to mount a mass production MCU on the user system.
■ Mounting
1. To mount a mass production MCU on the user system, align the index mark (▲) on the NQPACK
mounted on the user system with the index mark (●) on the mass production MCU.
2. Confirm that the mass production MCU is correctly mounted on the NQPACK, and then align the
index mark (the only corner with an angle cut-out) of the HQPACK with the index mark of the
NQPACK, and insert it (See “Figure 5”).
The HQPACK pins are thin and easy to bend. Check that the HQPACK pins are not bent before
inserting it into the NQPACK.
3. Insert each of the screws for securing the HQPACK into each of the four screw holes on the HQPACK and tighten the diagonally opposite screws in turn.
To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten
the four screws in sequence. Tightening the screws too tight might result in a defective contact.
Screws for securing
the HQPACK
HQPACK
Mass production MCU
User system
NQPACK
Figure 5 Mounting a mass production MCU
■ Disconnection
To remove the HQPACK, remove all of the four screws, and pull the HQPACK vertically out from
the NQPACK.
6
6. Connector Pin Assignment
The signals from the evaluation MCU mounted on the adapter board are connected to the YQPACK
(the same assignments as mass production MCU) via adapter I/F connectors 1 and 2 on the header
board.
For details on the mass production MCU pins, refer to the data sheet or hardware manual of each
MCU.
■ Pin assignment
Tables 1 to 4 show the correspondence between the pin numbers for adapter I/F connectors 1 and 2,
the evaluation MCU on the adapter board, and the mass production MCU.
The following explanations apply to these tables. Row A corresponds to the side of the connector
that displays the polarity. Row B corresponds to the opposite side.
*1 : No connection. These are not connected on either evaluation MCUs or mass production MCUs.
*2 : Pin 18 on mass production MCUs is connected to pins AA38, Y37, Y36, and Y35 on evaluation
MCUs.
- : Unconnected (open) pin
: VCC
The evaluation MCU power supply pins (VCC) are as follows:
VCC=Y38, W38, W36, W35, G5, L5, AR7, AM35, H35, D8, R5, W5, AC5, AG5, AP11,
AP19, AP23, AP31, AH34, AD34, T34, H34, E32, E28, E20, E12, G4, AL4, AR31,
D32, AL5, AP7, AP15, AP27, AR7, AM34, Y34, M34, E24, E16, E8, AP33, AP29,
AP25, AP21,AP13, AA5, D15, D25, R35, AE35, AR24, P4, AP17, AP9, AN5, AJ5,
AE5, U5, N5, J5,AR14, AD4, AK34, AF34, AB34, V34, P34, K34, F34, E30, E26, E22,
E18, E14, E10, E6
The mass production MCU power supply (VCC) pin numbers are 16 and 48.
: VSS
The evaluation MCU ground pins (VSS) are as follows:
VSS = E11, E15, E19, E23, E27, E31, G34, L34, R34, W34, AA34, AE34, M5, C3, B37, T5,
Y5, AD5, AJ34, AH5, AT36, AT3, AU37, AU2, AK5, AP8, AP12, AP16, AP20, AP24,
AP28, AP30, AL34, A1, B1, AU1, AV1, AV2, AV37, AV38, AU38, B38, A38, A37,
A2, C36, D4, AR4, AR35, D35, E5, K5, P5, V5, AB5, AF5, AM5, AP5, AP6, AP10,
AP14, AP18, AP22, AP26, AP32, AP34, AN34, AG34, AC34, U34, N34, J34, E34,
E33, E29, E25, E21, E17, E13, E7
The mass production MCU ground (VSS) pin numbers are 17, 33, and 49.
7
Table 1 Adapter I/F Connector 1 (Row A)
Connector
Pin No.
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
A32
A33
A34
A35
A36
A37
A38
A39
A40
A41
A42
A43
A44
A45
A46
A47
A48
A49
A50
8
Mass Production Evaluation MCU
MCU Pin No.
Pin No.
VCC
VCC
J36
H37
K36
J35
J83
K35
J37
K38
GND
GND
E38
F37
F38
G35
G38
H36
G37
H38
GND
GND
C38
D37
D38
E35
F36
F35
E37
G36
GND
GND
C34
A36
C35
B35
D36
B36
E36
C37
GND
GND
C32
A34
C33
B33
D33
B34
D34
A35
Connector
Pin No.
A51
A52
A53
A54
A55
A56
A57
A58
A59
A60
A61
A62
A63
A64
A65
A66
A67
A68
A69
A70
A71
A72
A73
A74
A75
A76
A77
A78
A79
A80
A81
A82
A83
A84
A85
A86
A87
A88
A89
A90
A91
A92
A93
A94
A95
A96
A97
A98
A99
A100
Mass Production Evaluation MCU
MCU Pin No.
Pin No.
GND
GND
C30
A32
C31
D30
B31
D31
B32
A33
GND
GND
61
D28
62
A30
59
D29
60
C28
B29
C29
B30
A31
GND
GND
32
C26
31
A28
42
C27
41
D26
B27
D27
A29
B28
AC38
AB36
AC36
AC35
GND
AF38
AD36
AE36
AG38
AD3
AC3
VCC
GND
40
AD1
GND
AD2
GND
NC*1
Table 2 Adapter I/F Connector 1 (Row B)
Connector
Pin No.
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
B32
B33
B34
B35
B36
B37
B38
B39
B40
B41
B42
B43
B44
B45
B46
B47
B48
B49
B50
Mass Production Evaluation MCU
MCU Pin No.
Pin No.
B23
A26
B24
C24
B25
C25
B26
A27
GND
GND
51
C22
52
A24
47
C23
50
B21
45
D23
46
B22
43
A25
44
D24
GND
GND
D20
B20
D21
A21
C21
A22
D22
A23
GND
GND
D18
A18
D19
B19
C19
A19
C20
A20
GND
GND
26
D16
25
A16
C17
27
D17
29
C18
28
B17
A17
30
B18
Connector
Pin No.
B51
B52
B53
B54
B55
B56
B57
B58
B59
B60
B61
B62
B63
B64
B65
B66
B67
B68
B69
B70
B71
B72
B73
B74
B75
B76
B77
B78
B79
B80
B81
B82
B83
B84
B85
B86
B87
B88
B89
B90
B91
B92
B93
B94
B95
B96
B97
B98
B99
B100
Mass Production Evaluation MCU
MCU Pin No.
Pin No.
GND
GND
57
B13
58
A14
C15
56
B14
54
B15
55
C16
B16
53
A15
GND
GND
22
B11
21
A12
24
C13
23
B12
13
C9
12
B8
A13
D14
GND
GND
B9
A10
C11
B10
D11
C12
D12
A11
AD38
AA37
AB37
AD35
AE38
AC37
AD37
AE37
GND
L4
L3
VCC
18
*2
NC*1
9
Table 3 Adapter I/F Connector 2 (Row A)
Connector
Pin No.
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
A32
A33
A34
A35
A36
A37
A38
A39
A40
A41
A42
A43
A44
A45
A46
A47
A48
A49
A50
10
Mass Production Evaluation MCU
MCU Pin No.
Pin No.
VCC
VCC
11
B7
10
A8
C14
D13
15
C10
14
D9
20
A9
19
D10
GND
GND
E2
F2
D1
F4
C1
E4
D2
E3
GND
GND
H4
J4
F1
H2
E1
G2
F3
G3
GND
GND
K3
K4
H1
K2
G1
J2
H3
J3
GND
GND
D5
A3
D6
A4
C7
C6
A5
B5
Connector
Pin No.
A51
A52
A53
A54
A55
A56
A57
A58
A59
A60
A61
A62
A63
A64
A65
A66
A67
A68
A69
A70
A71
A72
A73
A74
A75
A76
A77
A78
A79
A80
A81
A82
A83
A84
A85
A86
A87
A88
A89
A90
A91
A92
A93
A94
A95
A96
A97
A98
A99
A100
Mass Production Evaluation MCU
MCU Pin No.
Pin No.
GND
GND
3
J1
2
L2
5
C2
4
D3
7
B3
6
C4
9
B4
8
C5
GND
GND
L1
N2
N4
N3
M4
M3
K1
M2
GND
GND
N1
P1
R3
T2
P3
R2
M1
P2
AF37
AF36
AG36
AG37
GND
AK38
AH36
AJ36
AL38
39
AE1
37
AE2
63
A6
64
C8
64
E9
VCC
GND
AB38
GND
GND
Table 4 Adapter I/F Connector 2 (Row B)
Connector
Pin No.
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
B32
B33
B34
B35
B36
B37
B38
B39
B40
B41
B42
B43
B44
B45
B46
B47
B48
B49
B50
Mass Production Evaluation MCU
MCU Pin No.
Pin No.
R1
U4
V2
U3
U2
T3
R4
T4
GND
GND
W2
W3
V1
W4
U1
V4
T1
V3
GND
GND
AA1
AB1
Y2
AA4
Y1
Y4
W1
Y3
GND
GND
AC1
AC2
AB4
AC4
AB2
AB3
AA2
AA3
GND
GND
L36
K37
L35
M36
M35
L38
Connector
Pin No.
B51
B52
B53
B54
B55
B56
B57
B58
B59
B60
B61
B62
B63
B64
B65
B66
B67
B68
B69
B70
B71
B72
B73
B74
B75
B76
B77
B78
B79
B80
B81
B82
B83
B84
B85
B86
B87
B88
B89
B90
B91
B92
B93
B94
B95
B96
B97
B98
B99
B100
Mass Production Evaluation MCU
MCU Pin No.
Pin No.
L37
M38
M37
GND
N35
N36
P35
P36
P38
N38
GND
N37
R36
P37
R37
T36
T37
R38
T35
T38
U35
GND
U37
U36
V37
V36
V38
U38
GND
V35
AH38
AF35
AG35
AH37
AJ38
AH35
AJ35
AJ37
GND
38
AF2
1
D7
1
B6
63
A7
VCC
GND
34
AA36
GND
35
AB35
11
SS01-71060-1E
FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM
DSU-FR EMULATOR
LQFP-64P HEADER TYPE 2
MB2198-304
OPERATION MANUAL
February 2007 the first edition
Published FUJITSU LIMITED Electronic Devices
Edited
Business Promotion Dept.