Products and solutions for Factory automation and control

Products and solutions for Factory automation and control
Products and solutions for
Factory automation
and control
Content
Introduction................................................................................ 3
Trends in factory and process automation...................................... 4
Factory automation and standards: how to implement safety........ 4
ST and factory automation: a strong link......................................... 5
Supervisor layer ....................................................................... 6
Touch sensors................................................................................. 7
Display and LED controllers............................................................. 7
RF interfaces.................................................................................... 8
Control layer............................................................................ 10
Control unit................................................................................... 11
Analog and Digital IO................................................................... 18
Data communication interface ICs............................................... 24
Serial real-time clock (RTC ) ICs, reset and supervisor ICs.............. 27
Memories...................................................................................... 28
Power supplies.............................................................................. 28
Protection devices......................................................................... 31
Field layer................................................................................. 34
Field bus and industrial Ethernet HW implementation................... 35
IO-Link........................................................................................... 36
Local control................................................................................. 37
Monitoring and sensing................................................................ 39
Actuators and motor control......................................................... 43
Signal conditioning....................................................................... 51
Introduction
ain
dom
Field layer
Standard
industrial
layers
Industrial Ethern
et MCU stacks
8/32-bit MCUs,
IO-Link
Sensors, signal
Intelligent power conditioning, gate drivers
switc
Power MOSFETs hes, LV motor control ASSP
DC-DC converte , IGBTs, power modules, SiC
rs, diodes, thyris
tors, AC switche
s
ST's industrial ke
ain
om
ed
tim
al-
l
ria
ust net
d
In her
Et
Re
32-bit MCUs
Ethernet PHY, RT
Analog to digita C
l inputs
RF and serial da
ta comm interfac
es
Power supply, pr
otection device
s
me
Control layer
MCU
RF ICs
Touch sensors
Display/LED cont
rollers
-ti
eal
nr
No
Supervisor layer
t
rne
e
Eth
ld
Fie
3
ial
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In ork
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Overview
This reference guide covers ST’s portfolio for factory automation, and
how ST’s devices and solutions can help you.
The world of factory automation uses electronic equipment to get
the best process performances, the safest working environment
for human operators and the best economic conditions for the
industrial plant. ST is a key semiconductor player in this field and
offers tens of thousands of devices, together with support tools
including reference designs, demonstration boards and application
software.
The structure of the brochure is organized following the standard
model depicted in Figure 1. Starting from the top of the CIM
(computer integrated manufacturing) diagram, the chapters are
organized as the layers of the pyramid and each of them contains
an introductory block diagram (to clarify the application) followed
by the ICs ST suggests for implementation.
s
bu
Stay up-to-date
For more information and up-to-date
material, visit the factory automation
application page on ST’s website at:
www.st.com/factory-automation
MORE INFO
The CIM model presented here was
introduced in the 1980s to establish
a hierarchy in the manufacturing
industries.
Trends in factory and process automation
Factory automation, control and motor drives is a global market estimated at about 12 B$ in 2014 (Semicast Research, 2012), resulting in the
production of around 500 million systems, ranging from power converters and sensors to PLCs and robotic systems.
The global semiconductor market is divided into 4 major regions: Americas, Europe, Japan and Asia Pacific. The Asia Pacific growth rate is twice
that of the other regions.
4
In today’s industrial automation market,
upcoming trends, such as green energy,
energy saving, increased labor safety with
decreased labor costs, have opened up
many new opportunities for industrial system
developers. System designers can address
these evolving challenges using advanced
semiconductor technologies and their derived
system-oriented products.
The challenges of reliability, safety, EMC
environment and product life require close
cooperation between the semiconductor
expert and system design expert. The
combined expertise results in ST’s highly
advanced system-oriented products.
ST provides the factory and process
automation industry with an extensive
product portfolio ranging from the highly
popular ARM-based microcontrollers,
through memories, discrete power products,
supported by analog ICs for dedicated
industrial drivers, interfaces, wireless
transceivers and amplifiers.
Americas
1544.2
Asia Pacific
3171.1
3750.2
Europe
3360.5
Japan
The global market for semiconductors in factory automation, control and motor drives by region in 2014 (Semicast Research, 2012)
Our leading-edge smart power and power
semiconductor process technology, coupled
with significant manufacturing capacity, allow
us to offer products proven under the harsh
industrial environment so our customers can
design outstanding products.
By offering tailored solutions, a rich
ecosystem of products, software tools,
reference designs and support, we enable
industrial system developers to design robust
automation applications.
Factory automation and standards: how to implement safety
Safety is the cornerstone of factory automation: ST’s ICs are designed accordingly
Factory automation environments must be
intrinsically safe: ST, as a semiconductor
company, has a key role to play, and makes
safety a cornerstone for its product offering.
The main standard for functional safety
is EN61508, which concerns electrical,
electronics and programmable electronics
devices (E/E/PE) and all the branches
dedicated to factory automation.
This standard also defines the safety
integrity levels (SIL) which measure how
safe a system is in terms of the reduction
in risk for the operators. ST’s ICs take
into consideration EMI disturbances and
comply with IEC 61800-3. Complex power
Key standards
management stages can thus be designed
• IEC 61010: Safety requirements for electrical equipment for measurement, control
with a high level of robustness.
and laboratory use
At ST, functional safety is not only built
into the hardware, but also our MCU and
• EN61508: Functional safety of electrical/electronic/programmable electronic
MPU software. Effectively, our processing
safety-related systems
ICs come with software libraries to help
• IEC 61800: Adjustable speed electrical power drive systems
designers in their development, and all
• ISO 13849-1: machinery standard
this software is certified according to
primary targeted safety standards to ensure
• IEC 62061: dedicated to factory automation systems
functional safety.
ST and factory automation: a strong link
A broad spectrum IC provider, ST is a valued partner with wide experience and specific know-how
ST has strong links with the factory
automation world. ST offers thousands of
dedicated devices, from drivers, power
transistors and protection devices, to highend MCUs. We also support development
with dedicated evaluation tools. In addition,
we have many partnerships with key
players in associations and consortiums, as
described here.
As an example, ST is part of the IO-Link
association, aimed at implementing a
standard communication protocol at low
level among end units, such as sensors and
control units. It involves strong links with
many key players in industrial automation as
shown in the figure. As an active member,
ST has developed transceivers implementing
the protocol’s physical layer, as well as the
associated evaluation boards and software
tools.
On the industrial Ethernet side, protocols,
such as Profinet, Powerlink, EtherCAT and
many others, are supported by third parties
with complete hardware/software resources,
embedding our high-performance MCUs.
These are just some examples of the effort
ST dedicates to industrial Ethernet. Others
could be given, such as CANopen, to
show the extent of ST’s involvement in the
industrial world, through partnerships and
the most important associations.
Evaluation boards
Evaluation boards for the industrial segment can be found at:
www.st.com/web/en/catalog/tools/FM116/SC1076
5
Supervisor layer
HMI core
Touch
screen control
Control unit
Display/LED
control
Power
supply
RTC reset
supervisor
User
interface
Memory
Data communication interface
Wi-Fi
6
Bluetooth
RF
Ethernet
RS-232
RS-485
Control layer
Using the CIM pyramid for the industrial environment, we start with a typical supervisor layer. Humanmachine interfaces (HMI) and, in general, user-friendly interfaces are primordial at this level. The aim is to
simplify and get shorter execution time for the first level commands associated with the supervisor.
The main device families associated with these interfaces are:
• Touch sensors
• Display/LED controllers
• RF interfaces
These devices are covered in this chapter, whereas other parts such as the control unit, data
communication interfaces or power supply that are common to the other levels are treated in the
following chapters.
Touch sensors
Touch sensing libraries for 32-bit MCUs
To complement the traditional MCU functions, STM32 F0, F3, L1 series are now equipped with a Touch Sensing Controller (TSC). TSC
use capacitive technology and manages capacitive sensing acquisition automatically without CPU intervention. Up to 24 touches can be
implemented such as touchkeys and/or linear/rotary touch sensor.
To ease development the corresponding Touch sensing libraries are available:
• 32F3-TOUCH-LIB: touch library for STM32 F3 series (64kB to 256kB - 48, 64, 100 pins)
• 32F0-TOUCH-LIB: touch library for STM32 F0 series (16kB to 128kB - 32, 48, 64, 100 pins)
• 32L1-TOUCH-LIB: touch library for STM32 L1 series (16kB to 512kB - 32, 48, 63, 64, 100, 132, 144 pins)
Display and LED controllers
LED drivers and monitor ICs
ST offers a large portfolio of energy-efficient LED drivers for general lighting, display backlighting, signage and industrial panels. Ideal for both
parallel and series configurations, they enable high-efficiency, high-current accuracy, low-noise and small-size solutions. Topologies include
buck regulator LED drivers, boost regulator LED drivers, offline LED drivers, and more.
(www.st.com/led)
ST’s extensive portfolio of monitor ICs is available at www.st.com/displays.
7
RF interfaces
BlueNRG: Bluetooth® 4.0 low energy network processor
Targeted for security and proximity applications, the BlueNRG is a very low-power Bluetooth
low energy (BLE) single-mode network processor, compliant with Bluetooth specification v4.0.
This device is also suitable in the lower levels of any Industrial environment.
Ultra low-power sleep modes and very short transition time between operating modes allow
very low average current consumption, resulting in longer battery life
(www.st.com/bluemodules).
Key features
•B
luetooth specification v4.0 compliant
master and slave single-mode Bluetooth
low-energy network processor
• Embedded Bluetooth low energy
protocol stack: GAP, GATT, SM, L2CAP,
LL, RF-PHY
• Bluetooth low energy profiles provided
separately
• Operating supply voltage:2.0 to 3.6 V
• 8.2 mA maximum Tx current
(@ 0 dBm, 3.0 V)
• Down to 1.7 μA current consumption
with active BLE stack
8
• Integrated linear regulator and DC-DC
step-down converter
• Up to +8 dBm available output power
(at antenna connector)
• Excellent RF link budget (up to 96 dB)
• Accurate RSSI to allow power control
• Integrated general-purpose ADC
• Proprietary application controller interface
(ACI), SPI based, allows interfacing with an
external host application microcontroller
• Full link controller and host security
• High-performance, ultra-low-power
Cortex-M0 32-bit based architecture core
• On-chip non-volatile Flash memory
• AES security coprocessor
• Low-power modes
• 16 or 32 MHz crystal oscillator
• 12 MHz ring oscillator
• 32 kHz crystal oscillator
• 32 kHz ring oscillator
• Battery voltage monitor and
temperature sensor
• Compliant with the following radio
frequency regulations: ETSI EN 300
328, EN 300 440, FCC CFR47 Part 15,
ARIB STD-T66
• Available in QFN32 (5 x 5 mm)
package
• Operating temperature range:
-40 to 85 °C
STBT2632C Bluetooth modules
Bluetooth modules are also available for both class-1 and class-2 specifications. Already optimized and ready to use, they come with the
following common features:
Key features
• Bluetooth radio
•Fully
embedded Bluetooth v3.0
with profiles
•Class 1 or 2 module
•Complete RF ready module
•128-bit encryption security
•Integrated antenna
•Multipoint capability
• Cortex-M3 microprocessor
up to 72 MHz
• Memory
•256-Kbyte
Flash memory
•48-Kbyte RAM memory
• Data rate
•1.5
Mbit/s maximum data rate
• Serial interface
•UART
•SPI
up to 2.0 Mbit/s
interface
• General I/O
•Up
•1
to 16 general-purpose I/Os
LPO input (SPBT2632C2A)
SPBT2632C1A
Bluetooth® technology class-1 module
• User interface
•AT2
command set (abSerial)
upgrade over UART
•Firmware
• FCC and Bluetooth qualified
• EPL (end product listing) fulfilled
• Single voltage supply: 2.5 V typical
• Operating temperature range:
-40 to 85 °C
SPBT2632C2A
Bluetooth® technology class-2 module
Wi-Fi modules
ST’s latest series of Wi-Fi modules offers a fast, flexible and affordable Plug&Play solution for integration of 802.11 b/g/n and TCP/IP
technologies in IoT devices.
The modules integrate a complete TCP/IP stack and a user-friendly application layer that ensures a simple and effective way to use the
modules via AT commands. The modules are configured around a single-chip 802.11 transceiver with integrated PA and an STM32 32-bit
microcontroller with extensive GPIO support. The modules also incorporate timing clocks and voltage regulators. Multiple antenna options are
available.
With reduced power consumption and small form factor, the modules are ideal for both fixed and mobile wireless applications.
The modules are fully qualified and RoHS compliant.
SPWF01SA
SPWF01SC
These modules are the ideal choice for industrial control and data acquisition.
9
Control layer
PLC core
Field layer
sensors
Analog/Digital
inputs
interfaces
Analog/Digital
outputs
interfaces
Control unit
RTC reset
supervisor
Power
supply
Field layer
actuators
Display
interface
User
interface
Memory
Data communication interface
10
RS-232
RS-485
CAN
Field layer
Ethernet
Supervisor
layer
Perhaps the single most important device that represents factory automation is the PLC (programmable
logic controller). Introduced in the late 1960s, PLCs are designed for real-time processing of a large
number of IO in industrial plants. What differentiates a PLC in the market is its IO capacitance (identified
by the number of IO and the related scan rate) and its computational performances.
The control layer is a key market for ST: the TAM (total available market) for 2017 is forecast at 4 B$ (IHS
iSuppli industrial electronics Q4 2012 market tracker).
Over the years, ST has developed thousands of ICs dedicated to factory automation, and the current
portfolio is the result of continuous improvements, compliance with the latest electrical and safety
standards, customers’ needs and R&D activity.
The product families shown in the block diagram are covered in dedicated sections.
See also www.st.com/factory-automation.
Each section contains a list of ICs and the related tools, as well as evaluation boards.
Control unit
MCU portfolio
By choosing one of ST’s microcontrollers for your embedded application, you gain from our leading expertise in MCU architecture, technology,
multi-source manufacturing and support.
ST’s product portfolio contains a comprehensive range of microcontrollers, from robust, low-cost 8-bit MCUs, the STM8 family, up to 32-bit
ARM-based Cortex™-M0, Cortex™-M0+, Cortex™-M3, Cortex™-M4 Flash microcontrollers with a rich choice of peripherals, the STM32 family.
Only the STM32 family is covered in this section, whilst the STM8 family is the subject of the field layer section.
Extensive support through a combination of flexible and powerful development tools, training courses, consultancy and web support gives you a
plus for a faster time to market.
STM32 32-bit microcontrollers
The STM32 family of 32-bit Flash microcontrollers based on the ARM Cortex™-M processor is designed to offer new degrees of freedom to
MCU users. By bringing a complete 32-bit product range that combines high-performance, real-time, low-power and low-voltage operation,
while maintaining full integration and ease of development, the STM32 family helps you create new applications and design in the innovations
you have long been dreaming about.
Common core peripherals
and architecture:
Communication
peripherals:
USART, SPI, I²C
Multiple generalpurpose timers
Integrated reset and
brown-out warning
Multiple DMA
2x watchdogs
Real-time clock
Integrated regulator
PLL and clock circuit
Up to
180 MHz
Cortex-M4
DSP/FPU
Up to
2-Mbyte
Flash
SDIO
Up to
2x USB
1x 12-bit 2x CAN 2x I²S
Ethernet LCD-TFT
256-Kbyte 2.0 OTG
IEEE 1588 SDRAM I/F
audio
AMC timer 2.0B
SRAM
FS/HS
Camera IF
STM32 F3 series - Mixed-signal with DSP (STM32F301/302/303/373/x8
72 MHz
Up to
Up to
3x 16-bit
Up to
Cortex-M4
64-Kbyte
USB
CAN 7x comparator
512-Kbyte
AMC timer
with DSP
SRAM
2.0 FS
2.0B 4x 12-bit DAC
Flash
(144 MHz)
4x PGA
and FPU
CCM-SRAM
HDMI
CEC
120 MHz
Cortex-M3
CPU
Up to
1-Mbyte
Flash
Up to
128-Kbyte
SRAM
SDIO
2x USB
1x 12-bit 2x CAN 2x I²S
Ethernet
2.0 OTG
IEEE 1588
audio
AMC timer 2.0B
FS/HS
Camera IF
Up to
72 MHz
Cortex-M3
CPU
Up to
1-Mbyte
Flash
Up to
96-Kbyte
SRAM
Up to
USB 2.0 1x 12-bit
2x CAN
OTG FS AMC timer
2.0B
3x 16-bit
∑∆ ADC
STM32 F4
STM32 F3
11
Crypto
STM32 F2
Up to 19x 12-bit DAC
Up to 4x 12-bit ADC
(Up to 5 MSPS)
Main oscillator and
32 kHz oscillator
Low-speed and
high-speed internal
RC oscillators
-40 to +85 °C and
up to 105 °C
operating
temperature range
SDIO
2x I²S
audio
Ethernet
IEEE 1588
STM32 F1
STM32 F0 series - Entry-level (STM32F030/x1/x2/x8)
USB
48 MHz
Up to
Up to
USB
2.0 FS CAN
DAC
Cortex-M0 128-Kbyte 16-Kbyte SRAM clock
Crystal 2.0B comparator
CPU
Flash
20-byte backup data free
less
Low voltage
2.0 to 3.6 V
or 1.65/1.7 to 3.6 V
(depending on series)
32 MHz
Up to
Up to
Cortex-M3 512-Kbyte 80-Kbyte
CPU
Flash
SRAM
Temperature sensor
STM32 L0 series - Ultra-low-power (STM32L0x1/x2/x3)
32 MHz
Up to
Cortex-M0+ 64-Kbyte
Flash
CPU
Up to
8-Kbyte
SRAM
Up to
USB 2.0
16-Kbyte
FS device
EEPROM
Up to
2-Kbyte
EEPROM
USB 2.0
Crystal
less
CEC
STM32 F0
LCD
Op-amps
8x40
comparator
4x44
BOR
MSI
VScal
AES
128-bit
STM32 L1
LCD
8x28
4x32
BOR
MSI
VScal
AES
128-bit
STM32 L0
True
RNG
Before presenting some of the MCUs from the STM32 family, the diagram below shows how our microcontrollers are designated.
STM32
F
32‑bit MCUs
8‑bit MCUs
Pin count (pins)
F
G
K
T
H
S
C
U
R
J
M
O
V
Q
Z
20
28
32
36
40
44
48 and 49
63
64 and 66
72
80
90
100
132
144
176 and 201
I
(176 + 25 pins)
B 208
N 216
X 256
Depends on product series
None exhaustive list.
Product type
A
F
L
P
S
T
W
R
Specific features
(3 digits)
Family
STM32
STM8
051
Automotive
Foundation
Ultra-low power
Pre-programmed
Standard
Touch sensing
Wireless
STM32x...
051 Entry-level
103 STM32 Foundation
103 upgraded with
303
DSP and Analog
High-performance
407
and DSP with FPU
152 Ultra-low-power
STM8x... / STM8Ax...
103 Access line
52 Automotive CAN
31 Automotive low-end
T
Code size
(Kbytes)
Packaging
0 1
1 2
2 4
3 8
4 16
5 24
6 32
7 48
8 64
9 72
A 96 or 128*
B 128
Z 192
C 256
D 384
E 512
F 768
G 1024
H 1536
I 2048
Note:
* For STM8A only
Automotive
8 48
9 64
A 80
12
8
6
Temperature range
B Plastic DIP*
D Ceramic DIP*
G Ceramic QFP
UFBGA or
H
TFBGA
I UFBGA
M Plastic SO
P TSSOP
Q Plastic QFP
T Plastic TQFP
U UQFN
Y CSP
*Dual in‑line package
6 and A
7 and B
3 and C
D
‑40 to +85 °C
‑40 to +105 °C
‑40 to +125 °C
-40 to +150 °C
Including the ultra-low-power STM32 Lx series, the STM32 is divided into 7 product series and around 500 part numbers.
The table below shows only a few examples dedicated to industrial automation.
The STM32 devices listed in the table below are ordered by part name, in ascending order of complexity.
Part number
Flash
size
(Kbytes)
Timer functions
Internal
RAM
Package 16-/32-bit
size
Others
timers
(Kbytes)
STM32F103ZC
256
48
STM32F103VG
1024
96
STM32F107VC
256
64
STM32F205RE
512
128
STM32F207IF
768
128
STM32F215VE2
512
128
STM32F217IE2
512
128
Serial interface
Supply current (ICC)
Maximum
Supply Lowest
USB FS
Run
operating
USART
Ethernet
ADC
DAC I/Os
voltage power mode
or USB CAN
2
2
temperature
SPI
IS IC
+
SDIO MAC
(V)
OTG FS + 2.0B
mode (per MHz) range (°C)
UART
10/100
FS/HS
(µA)
(µA)
STM32 F1 series - ARM Cortex™-M3 mainstream MCUs
LFBGA144,
8x16‑bit
21x12‑bit 2x12‑bit 112 3
2
2 3+2
1
1
1
LQFP144
2x WDG,
LQFP100 14x16-bit RTC, 24‑bit 16x12‑bit 2x12‑bit 80
3
2
2 3+2
1
1
1
downcounter
LFBGA100,
7x16-bit
16x12‑bit 2x12‑bit 80
3
2
2 3+2
OTG
2
LQFP100
STM32 F2 series - ARM Cortex™-M3 high-performance MCUs
2x WDG,
LQFP64, 12x16-bit,
RTC, 24‑bit 16x12‑bit 2x12‑bit 51
3
2
3 4+2
2
2
1
WLCSP64 2x32-bit
downcounter
STM32F207/217 line: 2x USB OTG (FS/HS1), camera IF, crypto/hash processor² - 120 MHz CPU
UFBGA176
3
2
2
4+2
2
2
1
LQFP100
3
2
3
4+2
2
2
1
3
2
2
4+2
2
2
1
24x12‑bit 2x12‑bit 140
2x WDG,
12x16‑bit,
RTC, 24‑bit 16x12-bit 2x12‑bit 82
2x32‑bit
downcounter
UFBGA176
24x12‑bit 2x12‑bit 140
STM32F303VC
256
48
LQFP100
9x16‑bit,
1x32‑bit
STM32F373RB
128
24
LQFP64
9x16‑bit,
2x32‑bit
STM32F401CC
256
64
STM32F401VC
256
64
STM32F427ZG
1024
256
STM32F429BG
1024
256
STM32F429NG
1024
256
Yes
Yes
Yes
STM32 F3 series - ARM Cortex™-M4 mixed-signal MCUs with DSP and FPU
Up to
2x half
39x12-bit 2x12‑bit 87
3
2
5
1
1
duplex
SysTick,
I2S
2x WDG,
Up to
RTC
8x16‑bit/
3x half
2
3
1
1
3x12‑bit 52
3
16x12-bit
duplex
I2S
STM32 F4 series - ARM Cortex™-M4 high-performance MCUs with DSP and FPU
STM32F401 line: USB OTG (FS), low power (11 μA typ. in Stop mode) - 84 MHz CPU
WLCSP49
2x WDG,
10x12‑bit
UFQFPN48 6x16‑bit, RTC, 24‑bit
2x32‑bit
downcounter 16x12‑bit
LQFP100
36
3
2
3
3
1
79
4
2
3
3
1
2.0 to 3.6
1.9
421
2.0 to 3.6
1.9
421
2.0 to 3.6
1.9
393
1.7/1.8 to
3.6
2.5
188
1.8 to 3.6
2.5
188
1.8 to 3.6
2.5
188
1.8 to 3.6
2.5
188
2.0 to 3.6
0.5
390
2.0 to 3.6
0.5
420
1.8 to 3.6
1.7
140
1.8 to 3.6
1.7
140
-40 to +105
-40 to +105
-40 to +105
-40 to +105
1
-40 to +105
STM32F429/439 line: 2x USB OTG (FS/HS1), camera IF, crypto/hash processor², TFT LCD controller, SDRAM interface, dual-bank Flash - 180 MHz CPU
STM32F429BI
2048
256
STM32F437ZI2
2048
256
LQFP144
24x12‑bit 2x12‑bit 114
2
3
4+4
2
2
1
Yes
1.7 to 3.6
2.5
260
LQFP208
24x12‑bit 2x12‑bit 168
2
3
4+4
2
2
1
Yes
1.7 to 3.6
2.5
260
2
3
4+4
2
2
1
Yes
1.7 to 3.6
2.5
260
6
6+1
SAI
2x WDG,
12x16‑bit,
6+1
RTC, 24‑bit 24x12‑bit 2x12‑bit 168
TFBGA216
2x32‑bit
SAI
downcounter
6+1
LQFP208
24x12‑bit 2x12‑bit 168
SAI
LQFP144
24x12‑bit 2x12‑bit 114 6
2
3
4+4
2
2
1
Yes
1.7 to 3.6
2.5
260
2
3
4+4
2
2
1
Yes
1.7 to 3.6
2.5
260
-40 to 105
ST and its partners offer a wide range of tools to help you develop applications:
• 15+ IDE (integrated development environment) amongst the most used in the developers’ community (see diagram below)
• 25+ RTOS (real time operating system) and stack providers (see diagram below)
IDE solutions for the STM32, other solutions are: AIJI System, CooCox
HighIntegritySystems
13
Embedded software partners for the STM32, other partners are: Alpwise, ANDREA Informatique, ARCCORE, eForce, Embedded Solutions, IS2T,
MicroControl, Micro Digital, Oryx Embedded, Tapko Technologies, YOGITECH
Many technical documents are available to start with the STM32, as well as free software libraries and examples fitting the most common
requirements and more.
A collection of drivers for each peripheral is available with the CMSIS and peripheral library. This makes it easy to understand how an STM32 is
working and how it fits in your design.
ST and its partners offer a wide range of middleware bricks, especially for communication: TCP/IP, USB, Bluetooth, crypto, and more. Some
of these bricks implement standard specifications, such as USB or Bluetooth stacks, while others bring added value in specific areas such as
industrial protocols with Profinet, Ethercat, and more.
Below is a selection of evaluation boards for STM32 MCUs: this selection presents boards for a first inexpensive hands-on experience of our
MCUs (dimensions of the boards in the pictures are not to scale). For more information, see www.st.com/stm32.
Part number
Description
STM32-PRIMER
Complete Primer ready to use from Raisonance for easy evaluation
and development with STM32 MCUs
32F0308DISCOVERY
Discovery kit for STM32 F030 Value line - with STM32F030R8 MCU
Image
Part number
14
Description
32F072BDISCOVERY
Discovery kit for STM32F072 line microcontrollers
STM32F3DISCOVERY
Discovery kit for STM32F303xx microcontrollers
32L100CDISCOVERY
Discovery kit for STM32L100 Value line - with STM32L100RC MCU
32L152DISCOVERY
Discovery kit for STM32L151/152 line - with STM32L152RC MCU
STM32VLDISCOVERY
Discovery kit for STM32F100 Value Line - with STM32F100RB MCU
32F401CDISCOVERY
Discovery kit for STM32F401 line - with STM32F401VC MCU
32F429IDISCOVERY
Discovery kit for STM32 F429/439 lines - with STM32F429ZI MCU
STM32100E-EVAL
Evaluation board for STM32F100 (512KB Flash) Value Line MCUs
STM32429I-EVAL
Evaluation board for STM32F429 line - with STM32F429x
STM32303C-EVAL
Evaluation board for STM32F303xx microcontrollers
STM32439I-EVAL
Evaluation board for STM32F439 line - with STM32F439NI MCU
Image
Part number
Description
Image
STM32401G-EVAL
Evaluation board for STM32F417 line - with STM32F417IG MCU
STM32373C-EVAL
Evaluation board for STM32F373VCT6
STM320518-EVAL
Evaluation board for STM32 F0 series - with STM32F051R8 MCU
STM32 development tools: STM32 Nucleo and STM32Cube™
ST is introducing two new hardware and software development platforms: the STM32 Nucleo and the STM32Cube.
STM32 Nucleo, the highly affordable STM32 boards, allows to try out new ideas and to quickly create prototypes on any STM32 MCU. Sharing
Arduino™ connectors and ST Morpho headers, STM32 Nucleo boards can easily be extended with a large number of application related
hardware add-ons. The STM32 Nucleo boards come with an integrated ST-Link debugger/programmer; no need for an external probe. The
boards work with a wide range of development environments including IAR EWARM, Keil MDK, mbed, GCC-based IDEs (Atollic TrueStudio).
STM32 Nucleo users have free access to the mbed online compiler, the mbed online C/C++ SDK and the developer community at mbed.org,
allowing to build a complete application in only a few minutes. More at www.st.com/stm32nucleo
High
performance
Mainstream
15
NUCLEO-F401RE
NUCLEO-F3*
NUCLEO-F103RB
NUCLEO-F030R8
NUCLEO-F0*
Ultra-low-power
NUCLEO-L152RE
NUCLEO-L0*
64 KB
128 KB
512 KB
Flash size
Note: * support for STM32 L0, STM32 F3 and more STM32 F0 coming soon
STM32 Nucleo portfolio
STM32 Nucleo board open development platform
Mini USB
ST-LINK/V2-1
SWD
Morpho extension
headers
IO
Arduino
connector
STM32
IO
Morpho extension
headers
IO
IO
STM32 Nucleo block diagram
Arduino
connector
STM32Cube is a powerful new free
design tool and software for its STM32
microcontroller portfolio. The new
STM32Cube™ development platform
comprises the STM32CubeMX graphical
configurator and initialization C-code
generator that provides step-by-step
guidance for users and a set of rich
embedded-software components that save
integrating software from multiple sources.
The software includes a new Hardware
Abstraction Layer (HAL) that simplifies
porting from one STM32 device to another.
ST is also introducing the STM32CubeF4
firmware, with the middleware and HAL
supporting, for the high-performance STM32
F4. Further releases will roll out during the
year, more at www.st.com/stm32cube
STM32Cube eases STM32 development
STM32 dedicated Motor Control libraries
STM32 support tools are enhanced by a rich libraries set to develop any Motor Control application faster.
In this family, the STM32 PMSM FOC SDK v3.x is a Motor Control Software Development Kit (SDK) for 3-phase Permanent Magnet Synchronous
Motors (PMSM) based on Field Oriented Control (FOC) supporting STM32F103, STM32F100, STM32F2xx, STM32F4xx, STM32F0xx and
STM32F30x.
Dual simultaneous
FOC
16
STM32F1xx
STM32F2xx
STM32F4xx
STM32F0xx
STM32F30x
Key features of the the STM32 PMSM FOC SDK v3.x are:
• Single/Dual simultaneous vector control
• Wide range of motor control algorithms
• Any combination of current reading
• Application example based on FreeRTOS
(FOC)
STM32
PMSM
FOC SDK
v3.x
ST MC
Workbench
topologies and/or speed/position sensors is
supported
implemented for specific applications
• Increase code safety through
• Wide range of STM32 microcontrollers
C rules 2004 compliancy
C compliancy
•New object oriented FW architecture
(better code encapsulation, abstraction and
modularity)
•Strict ANSI
families supported
• Full customization and real time
Algorithms
improvements
•MISRA
communication through PC software ST
MC Workbench
The partitioning below, shows how it is designed the ST MC FOC SDK (version 3.4), in order to understand how it is tailored for the different
MCUs, making it possible to choose the best trade-off in terms of resources usage and the characteristics of the final application.
STM32F103x HD/XL, STM32F2xx, STM32F4xx, STM32F30x
STM32F103x LD/MD
STM32F100x, STM32F0xx
Flux
IPMSM
1shunt
Weakening
MTPA
Feed
Forward
Sensor-less
(STO + PLL)
Sensor-less
(STO + Cordic)
Encoder
Hall sensors
Debug &
Tuning
ST MC
Workbench
support
USART based
com protocol
add-on
Max FOC
F100 ~11 kHz
F0xx ~12 kHz
3shunt
Dual FOC
Max FOC
F103, F2xx
F103 ~23 kHz
F2xx ~40 kHz
F30x ~ 30 kHz
F4xx ~50 kHz
ICS
Max FOC dual
FreeRTOS
Max FOC
~23 kHz
F103 ~20 kHz
F2xx ~36 kHz
F30x ~27 kHz
F4xx~45 kHz
ST Motor Control Workbench
The ST Motor Control Workbench is a PC software making faster the STM32 PMSM FOC firmware library configuration. Accordingly to the
application needs, the user will set all the parameters and headers files through an intuitive PC GUI.
Motor
Power Stage
Drive Management
Control Stage
The ST Motor Control Workbench allows Real-time communication: for example, setting a speed ramp or send start/stop commands is possible
from the GUI for first lab tests. Advanced tabs allow to fine tuning of parameters, i.e. PID control, as well as firmware debug, while it is possible
to plot significant motor control variables, like target or measured motor speed, using the embedded virtual oscilloscope.
17
Analog and Digital IO
Digital inputs
Modern control systems are highly complex applications. The trend is to use as many integrated solutions as possible in such designs, either
to increase the density or to reduce physical dimensions of the modules. Either way results in more stringent requirements regarding the total
power dissipation of the module.
CLT devices form a new series of intelligent protected terminations designed for digital-input modules and proximity-sensor interfaces in
industrial and building automation systems. Today’s designers face the challenge of increasing the number of I/Os per volume unit and
increasing the I/O-interface features. The CLT series offers highly robust EMC compliant solutions according to:
• Surge IEC 61000-4-5: 1 kV
• ESD IEC 61000-4-2: 15 kV
• EFT burst IEC 61000-4-4: 4 kV
Robustness is also a key parameter for CLT devices, including the CLT01-38S4, that operates with all types of sensor according to IEC 61131-2,
type 1 and 3, with a 2.35 mA limited current, and type 2, using two inputs per sensor with the correct RREF.
VCS
RPD
VCC
SPI
Voltage
regulator
COMP
RI
VIN
IN1
8/16-bit
State transfer
SPI
8-input
Type 1/3
CLT
18
CPHA = 0
CPOL = 0
IN8
RREF
CLT01-38S4
VDD
VC
RC
VI
UVA
REF
COMS
SCK
O-T
/CS
O-T
MISO
O-T
Field bus
Controller
RS
MOSI
SPM
DVR
LD1
LD8
CLT01-38S4 wiring diagram
O-T = opto-transistor or isolator
The CLT series and its related evaluation boards, as well as the basic documentation, is shown in the table below, together with the most
important features of the devices. More information about current limiters is available at www.st.com/protection.
xCLT product
CLT3-4BT6
PCLT-2AT4
SCLT3-8BT8
CLT01-38S4
Number of inputs
4
2
8
8
Input IEC 61131-2
Type 1 and 3
Type 1, 2 and 3
Type 1, 2 and 3
Type 1, 2 and 3
Output type
Isolated
Isolated
Non-isolated
Output drive
Opto transistor
Opto transistor
CMOS compatible
Isolated
Non-isolated
SPI serialized transfer
Opto transistor
Electromagnetic isolator
CMOS compatible
Isolated
Non-isolated
SPI serialized transfer
Opto transistor
Electromagnetic isolator
CMOS compatible
2.8 mA
2.5 to 7.5 mA
2.35 mA
2.35 mA
25%
18%
10%
10%
Yes, using type 1
Yes
Yes
Yes
> 1 kV
Type 3: 1 kV
Type 2: 0.5 kV
> 1 kV
> 1 kV
ESD level
8 kV
15 kV
15 kV
15 kV
Package
TSSOP-20
TSSOP-14
HTSSOP-38
HTSSOP-38
Input datarate
10 kbit/s
10 kbit/s
40 kbit/s
400 kbit/s
Evaluation board
STEVAL-IPF008V1
STEVAL-IPF004V1
STEVAL-IPF007V1
STEVAL-IPF023V1
Application note
AN2527
AN2482
AN2846 and AN3031
-
Input current limiter
Current tolerance
Front-end LED status
Surge level
Order code
Device series
Picture
Features
STEVAL-IFP008V1
CLT3-4B
With a front end display LED - type 1
operation
STEVAL-IFP004V1
PCLT-2A
Designed to pass EMC tests in opto and
CMOS mode
STEVAL-IFP007V1
SCLT3-8
Designed to meet real environment conditions
• E MI proof above 4 kV EFT
•W
ith opto-transistor
CLT01
Designed to meet real environment conditions
• E MI proof above 4 kV EFT
•W
ith opto-transistor
• 4 00 kbps input speed
STEVAL-IFP023V1
19
Digital outputs
In this large family of products, we find intelligent power switches (IPS). These integrate a control part (logic interface, high-side drivers, and
protection) with a power stage. IPSs are based on ST-patented technologies, including bipolar, multipower BCD and VIPower M0 technologies.
This provides increased system reliability, part count reduction, space saving and built-in protection, with smaller IPS devices that are housed
in tiny, flat, no-lead plastic packages (DFN, QFN). The high thermal capacitance of the power packages such as PowerSO-36, PowerSSO24 and
PowerSSO12 allows the absorption of high-energy pulses when an inductive load is driven without any external freewheeling diode.
As an example, the block diagram below shows one of our latest IPSs, the VN808, designed in our proprietary VIPower technology.
Undervoltage
Vcc
VN808
IN 1
Vcc
clamp
Clamp
IN 2
GND
Current limitation
Logic
Junction temperature
detection
IN 8
Case temperature
detection
Status
A recent introduction to the IPS family is the ISO8200B, a galvanic isolated 8-channel driver featuring a very low RDS(on) for the power stage.
It contains 2 independent galvanic isolated voltage domains (VCC for the power stage and VDD for the digital stage). Additional embedded
functions are loss-of-GND and loss-of-channels over-temperature protection and case over-temperature protection, undervoltage shutdown with
hysteresis, reset function for IC output disable, overvoltage protection (VCC clamping), direct and syncronous control mode, fast demagnetization
for inductive loads, and ESD protection.
The IC is intended to drive any kind of load with one side connected to ground with 3.3/5 V compatible inputs. Active channel current limitation
combined with thermal shutdown (independent for each channel) and automatic restart protect the device against overload and short circuits.
In overload conditions, if the junction temperature exceeds the threshold, the channel involved is turned off and then automatically on again
after the IC temperature decreases below the reset threshold. If this condition causes the case temperature to reach the threshold limit, TCR, the
overloaded channel is turned off and only restarts when the case and junction temperature decrease below the reset thresholds. Non-overloaded
channels continue to operate normally. An internal circuit provides an OR-wired unlatched common fault indicator signaling the channel overtemperature. The fault pin is an open-drain active-low fault indication pin.
Vdd
Power
management
Undervoltage
detection
Vcc
Vcc clamp
SYNC
LOAD
OUT_EN
IN 1
Outpup clamp
Logic
Logic
Current limit
IN 8
Junction
temperature
detection
ISO8200B device
FAULT
GNDdd
Case
temperature
detection
ISO8200B block diagram
OUTi
Rpd
20
OUT
X8
GNDcc
Some single-channel IPSs
Part number
VCC
RDSON (Ω)
IOUT (A)
Technology
Package
Channels
TDE1737DP
8 to 50
-
0.5/Adj.
Bipolar
DIP-8
1 (low side)
TDE1747FP
10 to 60
-
0.45/Adj.
Bipolar
SO-14
1 (high side)
TDE1787ADP
6 to 60
-
0.3/Adj.
Bipolar
DIP-8
1 (high side)
TDE1798DP
6 to 50
-
0.5/0.7
Bipolar
DIP-8
1 (high side)
TDE1897RFTP
18 to 50
0.4
0.5/0.75
MultiBCD
SO-20
1 (high side)
L6370Q
9.5 to 50
0.1
2.5/Adj.
MultiBCD
QFN 48L 7x7
1 (high side)
L6375D
8 to 50
0.4
0.5/0.75
MultiBCD
SO-20
1 (high side)
L6377D
8 to 50
0.4
0.5/Adj.
MultiBCD
SO-14
1 (high side)
5.5 to 41
0.060
2/2.5
VIPower
PPAK/SO-8
1 (high side)
VCC
RDSON (Ω)
IOUT (A)
Technology
Package
Channels
9 to 36
0.08
1.0
VIPower
PowerSSO-12
2
L6374
10.8 to 35
4.0
0.1
MultiBCD
SO-20
4
L6376
9.5 to 35
0.64
0.5
MultiBCD
PowerSO-20
4
VNI4140K
10.5 to 36
0.08
0.7
VIPower
PowerSSO-24
4
VNI4140K-32
10.5 to 36
0.08
1.0
VIPower
PowerSSO-24
4
VNQ860
5.5 to 36
0.27
0.25
VIPower
SO-20/PowerSO-10
4
VN808/-32
10.5 to 36
0.15/0.16
0.7/1.0
VIPower
PowerSO-36
8
VN808CM/-32
10.5 to 36
0.15/0.16
0.7/1.0
VIPower
PowerSO-36
8
VNI8200XP
45
0.11
0.7
VIPower
PowerSSO-36
8
ISO8200B
45
0.11
0.7
MultiBCD + VIPower
PowerSSO-36
8
VN751PT/S
Some MULTI-channel IPSs
Part number
VNI2140J
21
VCC clamp
Clamp power
SPI
Logic
Current limiter
Junction temp
detection
Case temp
detection
LED
driving
TWARN
22
Undervoltage and
power good
COL0
COL1
SEL1/IN1
WD_EN/IN2
OUT_EN/IN3
WD/IN4
SDI/IN5
CLK/IN6
SS/IN7
SDO/IN8
SEL2
VREG
ROW0
ROW1
ROW2
ROW3
DC/DC
converter
FAULT
GND
FB
PG
VCC
PHASE
BOOT
DCVDD
VREF
A new generation of IPS is being developed in our proprietary BCD8SP technology, making it possible to implement both high-side and low-side
drivers. The first devices are the IPS4200L and IPS4200H, respectively low- and high-side 4-channel drivers.
The VNI8200XP is an octal, high-side smart power solid-state relay, with a serial/parallel selectable interface on chip (8-/16-bit SPI interface
for IC command and control diagnostics). The IC, built using ST’s VIPower™ technology, is designed to drive any kind of load with one side
connected to ground. Active channel current limitation combined with thermal shutdown, independent for each channel, and automatic restart,
protect the device against overload. Additional embedded functions are loss-of-GND protection that automatically turns off the device outputs
should ground be disconnected, undervoltage shutdown with hysteresis, power good diagnostics for valid supply voltage range recognition,
output enable function for immediate power output on/off, and programmable watchdog function for MCU safe operation.
Pull-down
resistor
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
VNI8200XP block diagram
IPS devices are designed to safely drive every kind of load in low-voltage applications (up to 55 V), handling data in and out of the
microcontroller by means of status/input signals. IPS devices are designed to comply with the following international standards:
• IEC 61000-4-4 (electrical fast transient/burst)
• IEC 61000-4-2 (ESD, immunity test contact/air)
• IEC 61000-4-5 (surge test immunity requirements)
• IEC 61000-4-6 (current injection test)
• IEC 61131-2 (programmable controller, equipment requirements and tests)
Another important trend addressed in factory automation to achieve safety is the SIL (safety integrity level). Within our IPS family, SIL standards
for functional safety are taken into account with the IPS160H, a high-side driver (65 VCC max) that is compliant with SIL-3 specification (devices
within this level in the SIL specification are able to implement fail-safe systems, these being systems in which one failure does not cause an
unsafe state). IPS devices come with evaluation boards available on Internet, and some examples are given below (www.st.com/ips).
Order code
Device series
Picture
Features
VNI8200XP
To provide a user-friendly way to test the VNI8200XP’s functionality, a GUI (graphic user
interface) interface is also developed and associated to this board. To use the GUI it is
necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a
communication board (part number STEVAL-PCC009V2).
The STEVAL-IFP022V1 demonstration board meets EFT standard requirements
IEC 61000-4-2, IEC 61000-4-4, IEC 61000-4-5.
STEVAL-IFP001V1
VN808CM
The STEVAL-IFP001V1 is compliant with international electromagnetic compatibility (EMC)
specifications as well as EMC immunity proof 4 kV level EFT (IEC 61000-4-4), and 2 kV
voltage surge (IEC 61000-4-5), and has been tested at different typical ambient temperatures.
It is suitable for use in programmable logic controllers to produce the related digital outputs
according to IEC standards.
STEVAL-IFP006V1
VN4140K
Suitable for use in programmable logic controllers (PLCs) as well as to drive generic loads
which require up to 0.7 A of nominal current (the typical current limitation is 0.7 to 1.7 A).
STEVAL-IFP010V3
VNI2140J
This tool evaluates the VNI2140J’s features, in particular embedded self-protection, powerhandling capabilities, operation and diagnostic feedback, thermal behavior and conformity to
EMC immunity standards.
STEVAL-IFS006V2
TDE1708DFT
Inductive proximity switch application based on the principle of metal body detection using
the eddy current effect on the HF losses of a coil. The design consists of a single transistor
HF oscillator, an ST7LITEUS5 microcontroller, an intelligent TDE1708DFT power switch, and a
SPT01-335DEE triple Transil™ array.
STEVAL-IFP022V1
23
STEVAL-IFP015V2
ISO8200B
The STEVAL-IFP015V2 demonstration board works in combination with the STEVALPCC009V2
or STEVAL-PCC009V1 interface board to allow evaluation of all the features of the
ISO8200B device. A large GND area on the printed circuit board has been designed to
minimize noise effects and ensure good thermal performance.
Some other IPS devices will be treated in the field layer section, as they are used as industrial transceiver ICs for IO-Link and SIO (Standard IO)
mode.
Analog IO
Amplifiers and comparators
ST’s op amps enhance the signal chain by being perfect companion chips to ST’s
microcontrollers and sensors. Below a first overview of these products, further details are
available in the signal conditioning paragraph at pages 47 and 48.
Portfolio Highlights
• High precision Op-Amps
• High Speed Comparators
• High-Side Current Sensing
Amplifiers
• Micropower
• 5 V and 16 V CMOS technology
• Tiny DFN/QFN packages
Best precision micropower op-amp
ST’s TSZ121 zero drift CMOS amplifier is the first member of the TSZ12 series of highprecision op amps featuring very low offset voltages with virtually zero drift over time and
temperature. The TSZ121 is ideal for sensor interfaces, sensing current on very low resistance
shunts and driving analog-to-digital converters, while minimizing the power consumption.
Features
• Low offset VIO: 5 µV max
• dVIO/dT = 30 nV/°C max
• Operating range: 1.8 to 5.5 V
• Temperature range: -40 to +125 °C
• 40 µA (typ at 5 V) / GBW 400 kHz
• Low bias current: 1 pA
• Rail-to-rail input/output
• High ESD protection: 4 kV HBM
• Tiny SC70/SOT23-5 packages
High-speed comparator
ST’s TS3011 single comparator achieves a propagation delay of 8 ns while consuming only
470 µA of supply current at 5 V, which is 50% lower than other solutions in the market.
The TS3011 addresses applications where fast response time is critical such as threshold
detectors/discriminators, high-speed sampling, or zero-crossing detectors.
Features
• Propagation delay: 8 ns
• Low current consumption: 470 µA
• Rail-to-rail input
• Push-pull output
• Supply voltage: 2.2 to 5 V
• Temperature range: -40 to +125 °C
24
• ESD tolerance: 2 kV HBM
• SOT23-5 and SC70-5 packages
Data communication interface ICs
A PLC (or any modern control system) interfaces with several kinds of network depending on the overall system dimensions.
Router/Switch
Gateway
Server
PC
Enterprice network
Switch
Gateway
Industrial controller or PLC
Industrial network
Gateway
Fieldbus: sensors/actuators network
Sensors
Actuators
IO Modules
Gigabit Ethernet and
other non specifically
Industrial networks
• ModBus+
• Ethway
• Fipway
• DeviceNet
• PROFINET
• EtherCAT
• Powerlink
• ...others
• RS485
• MODBUS
• IO-Link
• Profibus PA
• HART
• Analog 4-20 mA
• Seriplex
• Interbus
• Sercos
• EtherCAT
• Profibus
• DeviceNet
• CANOpen
• ...others
As can be seen from the diagram, there are many different networks. The different protocols developed over the years by consortiums,
associations and private companies have become standard networks, sometimes complementing each other, or more often alternatives to each
other. More at www.st.com/communication.
This section only covers the communication interfaces, while the implementation of the most common protocols in the industrial arena is part of
the field layer section, in which the various industrial Ethernet stacks are enabled through our most advanced MCUs.
In this complex world, ST is positioned as a key partner in several associations and as a solution provider, with a very wide offer:
• I/O and network interface ICs
• Data storage ASICs
• ASI circuits
• Programmable transmitters
• Power management ICs
• Protection devices
• Ethernet transceivers
• Dedicated circuits for Ethernet interfaces
• Wireless modules
• LAN adapters
• Powerful ARM Cortex MCUs
• High-performance transceivers
• Routers and switches
• Modem circuits
for sub-Ghz applications
These last devices are finding a place in the industrial monitoring field and are addressed by our SPIRIT1:
• Frequency bands:
• Adjacent channel selectivity:
169, 315, 433, 868, 915, 920 MHz
55 dB at 12.5 kHz channel spacing
(1% PER – 20-byte packet length)
• Configurable data rate
• Integrated SMPS allows very low power
from 1 to 500 Kbit/s
consumption
• SPI interface
• Integrated packet handler
• Supply voltage: 1.8 to 3.6 V
•Support
for automatic acknowledgment,
retransmission, low duty cycle protocol
and timeout protocol
• Modulation schemes:
2-FSK, GFSK, MSK, GMSK, OOK, ASK
• Suitable for systems targeting compliance
•Wireless
MBUS standard
•ETSI EN 300 220, FCC CFR47
Part 15, ARIB STD-67
• Automatic clear channel assessment
(CCA) engine
•Channel access mechanism, based
on the rule listen-before-talk systems;
embedded CSMA/CA protocol
• Output power:
-36 to +11 dBm, in 0.5 dB steps
• AES 128-bit encryption coprocessor for
secure data transfer
• Frequency hopping under MCU control
•Calibration
can be made each time the
MCU changes frequency or MCU can
save and restore calibration data to make
the frequency hopping faster
• Separate 96-byte Rx/Tx FIFOs
• Supports automatic antenna selection
through an integrated antenna diversity
switching mechanism
25
• Fully-integrated ultra-low-power
RC oscillator
• Excellent receiver sensitivity:
-120 dBm (1.2 Kbit/s – 169 MHz)
The application diagram is shown below.
SPIRIT1
VBAT and GND
MISO
MOSI
CLK
SPI
Digital domain
decoupling
LDOs
and
SMPS
SMPS
LC filter
CSN
STM32
STM8
GPIO 0
Power choke
TX
GPIO 1
GPIO 2
GPIO
GPIO 3
SHUTDOWN
RF
SDN
XO
XTAL
RXp
RXn
LC Balun/
Matching
Network
LC Filter/
Matching
Network
USB transceivers and interfaces
ST’s USB interface family includes high-speed USB OTG ULPI transceivers, full speed OTG transceivers and USB charger detection interfaces.
They provide a complete solution to connect a digital USB-OTG and ULPI controller to the physical universal serial bus.
For example, the diagram below shows a typical application circuit using the STUSB03E.
VIF
System
Supply voltage
VCC
RSEL
VTRM
VBUS
VBUS
VBUSDET
VPU
CON
OE#
USB
controller
RCV
VP
VM
D+
SPD
D-
SUS
GND
RS = 20 Ω
D+
D-
RS = 20 Ω
GND
+
+
4.7 µF
1 µF
CS24770
The STUSB03E is a single-chip transceiver that complies with the physical layer specifications of the Universal Serial Bus (USB) v2.0 standard. It
has an integrated 5 V to 3.3 V regulator which allows direct powering from VBUS. The transceiver has an integrated voltage detector to detect the
presence of VBUS and features an internal D+ pull-up resistor implemented in accordance with the 27% resistor ECN.
26
Ethernet primary protection
For advanced protection devices, the SLVU2.8 series has been designed to protect Ethernet lines. Their low capacitance makes them compatible
with gigabit Ethernet.
In this family, the SLVU2.8-4A1 is designed to be compatible with gigabit Ethernet and gigabit PoE by using two SO-8 packages, and can be
used on 10/100 Mbit/s Ethernet with a single device. Surge capability is compatible with IEC 61000-4-5 class 2 (1 kV, 42 Ω, 24 A).
Secondary protection
Primary protection
Tranceiver
RJ45
V
The diagram shows use the SLVU2.8-4A1 implementing a 10/100 Mbit/s Ethernet protection.
RS-485/RS-232 protection
The following table presents some examples in decreasing complexity of dedicated ICs, such as the ST485Ex, a family of ±15 kV ESD protected,
low-power RS-485/RS-422 transceivers, for industrial applications (www.st.com/interface).
Temperature
range (°C)
Supply voltage(V)
Data rate min
(Mbit/s)
Communication
standard supported
Number of
nodes
Number of
drivers/receivers
Package
ST485EBDR
-40 to 85
5
5
RS485, RS422
256
1/1
SO-8
ST485EXDR
-55 to 125
5
5
RS485, RS422
256
1/1
SO-8
ST232EB
-40 to 85
4.5
230 (Kbaud)
RS232
-
2/2
SO-16, TSSOP 16
Part number
Serial real-time clock (RTC) ICs, reset and supervisor ICs
Widest portfolio of RTC offers unlimited designs solutions
In applications where the clock must not drift, and time has to be kept for very long periods when unplugged, with minimal backup battery,
a standalone RTC is significantly better than an embedded RTC in the MCU. An extended range of products with the latest technological
innovations is available, including ultra-low-power devices, embedded crystals, analog and digital callibration and automatic temperature
compensation. RTC functions include programmable alarm, battery switchover and many useful supervisory functions that enhance the
application’s reliability: oscillator fail detect, battery low detect, early power fail warning, reset, watchdog, and more (www.st.com/rtc).
Reset and supervisor ICs keep applications running and under control
ST’s portfolio of microprocessor supervisors and reset ICs are designed to keep your application processor under control and your application
running. Our product portfolio of microprocessor supervisors and reset ICs ranges from basic, single-voltage resets, to smarter resets with a
watchdog or an early power-fail detection function. We also offer highly-integrated devices that include reset, battery switchover and tamperdetect functions (www.st.com/reset).
RTC, reset and supervisor key products
Family
RTC
Sub-families
Parts
Key features
Applications
Low Power
M41T6x
Low standby current
World’s smallest RTC with crystal
Small packages
Portable HMI
Enhanced
industry-standard
M41T81S
M41T00S
M41T01
M41T80
M41T11
M41T82/83/93
M41T00CAP
Automatic battery switchover
Analog calibration
Embedded crystal
Sub-metering
HMI
Highly-integrated
M41ST85W
M41T94
M41T00AUD
M41ST87W
Embedded NVRAM
Internal and external RAM clear
MCU supervising functions
Tamper detect with timestamp
PLC
Local Control
Servers
Data Storage
Security
27
Memories
Compact non-volatile memories
ST offers a wide range of non-volatile memories. The serial EEPROM family ranges from 1 Kbit to 2 Mbits and offers different serial interfaces:
I2C, SPI, Microwire. The wide range of products is also automotive compliant, and very thin packages are available for applications where space
is critical.
NVRAMs are battery-backed SRAMs that range from 16 Kbits to 32 Mbits, housed in DIP packages that include a battery, or surface-mount
SOIC packages that allow for a SNAPHAT replaceable battery. Timekeeping and clock functions are also available (www.st.com/memories).
Family
Sub-families
Application
specific serial
EEPROM
Serial
EEPROM
Key features
M342xx
Two EEPROM in a single package 4 and 18 Kbits
M34Exx
Serial presence detect (SPD) for DRAM modules 2 and 4 Kbits
M34F04
Half array write protect 4 Kbits
Applications
M35B32
Fast write operations 32 Kbits
M24 series
I2C, with densities ranging from 1 Kbit to 2 Mbits, and a bus speed of 1 MHz or 400 kHz
M95 series
SPI, a faster bus that features a chip select input, with densities ranging from 1 Kbit to 2 Mbits,
and a bus speed from 2 MHz to 20 MHz (depending on VCC)
M93 series
Microwire, a legacy bus, with densities ranging from 1 Kbit to 16 Kbits
ZEROPOWER
M48Zxx
ST’s ZEROPOWER products integrate low-power SRAMs with a power-fail control circuit and a
long-life lithium battery (available in CAPHAT or SOIC plus SNAPHATS packages).
From 16 to 256 Kbits
Battery Options
M4Zxx-BR00SH
Two SNAPHATS packages (compatible with SOIC) which embed 48 or 120 mAh lithium batteries
Standard serial
EEPROM
NVRAM
Part
Portable HMI
HMI
PLC
Local control
Servers
Data storage
Power supplies
28
Focus on industrial DC-DC converters
ST’s power management devices enable energy-saving, high-power density and lower standby
power design solutions. Our product portfolio includes highly-integrated AC-DC converters,
switching DC-DC converters, linear voltage regulators, battery management ICs, LED drivers,
photovoltaic ICs, MOSFET and IGBT drivers, motor drivers and more. These integrated solutions
reduce the design cycle and ST’s eDesignSuite (www.st.com/edesign) allows you to rapidly
select and simulate the optimal configuration for your power management design, bringing a
further advantage in time-to-market (www.st.com/powermanagement).
Matching the requirements of the industrial market, ST provides a complete family of stepdown monolithic DC-DC converters with an input voltage range compliant to 24 V buses, and
able to provide a continuous output current up to 3 A with high switching frequency
(up to 2 MHz). A full set of protection features is embedded (overcurrent, overvoltage, overtemperature) to increase the MTBF and reduce the number of external components
(www.st.com/dcdc).
ST’s DC-DC converters for industrial buses offer a wide choice of input voltage ranges
(VIN_max from 38 V to 61 V) and features. The new 61 V series (L7987/L) has been designed
to provide maximum reliability in fail-safe applications.
The new synchronous DC-DC converter for industrial applications, the L6986, is the best
choice when efficiency is of prime importance, both at full load (thanks to synchronous
rectification) and at light load (thanks to the low standby consumption). Evaluation boards are
available upon request.
There are multiple package options, all offering compactness and high thermal performances
to fit different applications.
VFQFPN8 3x3
HSOP exposed pad
HTSSOP16 (RTH = 40 °C/W)
The following table orders this wide offering according to the different voltage bus levels, while some examples are provided further on.
Voltage bus range
Device family
Maximum output current
Synchronous rectification
Low consumption at light load
Package
4.5 to 38 V
L7985/6
2/3 A
No
No
HSOP8, VFQFPN10-3x3
4 to 38 V
L6986
2A
Yes
Yes
HTSSOP16
5.5 to 48 V
ST1S14
3A
No
No
HSOP8
4.5 to 61 V
L7987/L
2/3 A (with adj. current limit)
No
No
HTSSOP16
L7987/L features
L6986 features
• 4.5 to 61 V input voltage range
• 4 to 38 V input voltage range
• up to 3 A DC output current (2 A
• up to 2 A DC output current
for L7987L)
• Adjustable peak current limit
• Adjustable switching frequency
(250 kHz to 1.5 MHz) with
synchronization capability
• Adjustable soft start
• Synchronous rectification
• Very low quiescent current (~30 µA typ.)
• Adjustable switching frequency (250 kHz to 2 MHz) with synchronization capability
• Adjustable soft start
• Power good with adjustable delay
• Power good
Linear voltage regulators
ST offers fixed and adjustable output linear
regulators featuring an optimal combination
of low dropout voltage, quiescent current,
transient response and low noise. They are
ideal for battery-powered applications
(i.e. industrial hand-held equipments) where
both optimum heat dissipation and small
dimensions are key factors.
ST’s series of low quiescent current LDO
regulators is ideal for portable consumer and
battery-powered applications where they
extend the application’s battery lifetime and
keep good dynamic performance, all in a
small footprint. Package options include the
SC70, SOT666, CSP 4 bumps,
DFN6L-1.2x1.3 and DFN6L-2x2
Iq (µA)
50
LD59015
LD39115
LD39015
LDLN015
20
15
5
ST715
STLQ50
1
0
0
29
LD39020
STLQ015
50
100
LD39030
LD39050
LD39130
200
300
LD39100
Maximum
current (mA)
500
1000
The new LD39200, is a high PSRR, ULDO with reverse current protection:
• Input voltage: from 1.25V to 6 V
• Fixed and adjustable Vout from 0.5 V
• Reverse current protection
• Output current: 2 A
• High PSRR: 70 dB at 1kHz
• Package: DFN 6L- 3x3 mm, DFN 8L 4x4
• 1% output voltage accuracy at 25 °C
• Fast transient response
• Ultra low drop voltage: 200 mV at 2 A
• Enable and power good pins
Finally, the new LDFM, LDF series, are the new, very low drop linear regulators:
• Input voltage: from 2.5 V to 16 V
• Low quiescent current: 200 μA at full load
• Logic controlled enable pin
• Output current: 0.5 A and 1 A
• Wide output voltage range choice:
• Power good function
• Very low dropout voltage:
300 mV at 500 mA output current
ADJ (Vref = 0.8 V) or fixed
from 0.8 V to 12 V
• Stable with low ESR ceramic capacitors
eDesignSuite development tool
Power supply ICs and not only, strongly benefit from our online development tool, conceived to build a design since the very first go.
From ST’s product selector to applications’ design is possible in few steps with our eDesignSuite 7.1.0.
ICs or better, applications, around this tool are:
• Power Supply
• LED driving
• Photovoltaic
• Battery Charger
Specification page
Circuit page
30
www.st.com/edesignsuite
BOM page
Power losses page
Start your new design from time 0:
• Go to www.st.com/edesignsuite
• Register to get your free login and password
• Now start creating a new project from choosing your
application scope
• Only high level specifications are needed, in terms of IO and
selected ICs
What can you get?
• Fully and interactive Bill of Material
• Definitive application schematics
• Circuit diagrams and analysis:
Simulation, Efficiency, Bode diagrams, losses
Protection devices
Power and data line protection
In harsh factory automation environments, protection devices are the key to system reliability. ST offers a wide range of protection devices
dedicated to power lines or data lines. More at www.st.com/protection
Power lines
Overvoltages and glitches appearing on power mains are modelized by the IEC 61000-4-5 international standard, also known as 8/20 µs current
waveform. Able to protect up to 500 A (8/20µs), the STIEC45 series is the ideal surge suppressor solution for factory automation power lines.
VBR @IR
Order code
Min.
STIEC45-24AS
STIEC45-26AS
STIEC45-27AS
STIEC45-28AS
STIEC45-30AS
STIEC45-33AS
Typ.
V
28.2
30.3
31.6
32.6
35
38.6
26.7
28.9
30
31.1
33.3
36.7
VCL @IPP 8/20 μs, 1.2/50 μs
Max.
V
A
42
500
45
500
47
500
49
500
55
500
59
500
Max.
mA
1
1
1
1
1
1
29.5
31.9
33.2
34.3
36.8
40.6
As well as the robust and reliable performances during voltage surges, ST’s discrete TVS (transient voltage suppressors) exhibit an excellent
power derating versus temperature. As an example, ST’s SM15T series (1500 W, 10/1000 µs) operates at full performance up to 115 °C.
Peak pulse power dissipation versus initial junction temperature (printed circuit board)
2000
PPP (W)
10/1000 µs
1500
1000
31
500
0
Tj (°C)
0
25
50
75
100
125
150
175
ST’s large portfolio of EOS power 10/1000 µs transient voltage surge suppressors (TVS)
VRM (V)
400 W
376 V
600 W
1500 W
3000 W
5000 W
1.5KE
5 x 19 mm
BZW04
P6KE
3.25 x 16 mm
3.25 x 16 mm
188 V
180 V
SMC30J
5.9 x 7.95 mm
SMCJ/SM15T
5.9 x 7.95 mm
40 V
SMBJ/SM6T
3.6 x 5.35 mm
33 V
SMAJ
SMA6J
2.55 x 5.05 mm
6V
BZW50
9 x 19 mm
2.55 x 5.05 mm
SMM4F
1.9 x 3.8 mm
Power 10/1000 µs
Data lines
Communication buses, with long wire lengths, are particularly sensitive to electrostatic discharge (ESD). ST proposes multiline solutions in a
single package, with various parasitic capacitance and voltage compromises, to address a wide range of industrial communication interfaces as
shown below.
ASI interface
Seriplex interface
Actuator and sensor Interface
RS-232 interface
Modbus®
GND
A+
A
K
SMM4F33A
ESD with +/- 30 kV contact
CTS
TxD
RTS
RxD
DATA
CLK
V+
COM
SHIELD
A-
ESD6V1/14/25xx
ESDA14/25xx
ESD protection in SOT666/323/23
ESD protection in SOT666/323/23
CAN interface
RS-422 and RS-485 interface
Modbus®, Modbus Plus™, PROFIBUS®
CANopen, DeviceNet™
CAN_H
RxDTxDRxD+
TxD+
RTS+
RTSCST+
CSTGND
32
CAN_L
ESDA5V1L/6V1L/ESDALC6V1
ESD protection in SOT666/SOT23
ESDA6V1/14/25xx
ESD protection in SOT666/323/23
Ethernet protection
SLVU2.8-4A1
SLVU2.8 or DSL01
3 triple Trisil in one SO8/
Transil + Trisil in one package
SO-8
RJ45 connector
100 Mbps Ethernet Transceiver
100 Mbps Ethernet Transformer
Up to 1 Gbps
Proximity sensor protection
ST has developed specific and dedicated 200 W (10/1000 µs) multi-line TVS for 2 and 3-wire proximity sensors. The SPT series provides
reverse polarity and surge protection in compliance with IEC 61000-4-5, IEC 61131-2 and EN 60947-5-2.
3-wire sensor: SPT01-335DEE
Input
VCC
VS+
Sensor
output stage
Load
LS
V+
LS
D2
VCC
D1
Power supply
VHS
HS
D3
K
GND
A
VS2-wire sensor: SPT02-236DDB
Sensor
Process control
Detector
VCC
LS
Power supply
33
D2
D1
GND
HS
Load
2 FEATURES:
Factory automation needs:
Surge protection
• 2-/3-line protection
Reverse battery protection
• 36 V VRM required (even if Vsupply = 24 V typ)
• VCL @ IPP = 46 V @ 2 A
• Diode specified in forward mode
E-fuses
E-fuses are electronic fuses that can replace larger conventional fuses or other discrete protection devices, reducing ownership costs in
production and in the field.
Unlike fuses, they offer programmable protection and flexible management of the fault, without requiring replacement after actuation. They thus
help to improve equipment uptime and availability and also reduce maintenance costs and false returns.
Product family is composed by STEF033 (3.3 V line), STEF05 (5 V line), STEF4S (3.3 V and 5 V lines) and STEF12 (12 V line), all in 3 x 3 mm
VDFPN 10 package. STEF033 is also offered in very tiny 1.2 x 1.2 mm CSP 9 bumps package.
Field layer
Actuation & motor control
Power modules
Power switches
DC power bus
M
Speed
sensing
Current
sensing
Driver
Power
supply
34
Monitoring & sensing
Driver
Driver
Sensor
and signal
conditioning
Local control
Temperature
sensors
Motion MEMS
Proximity
detectors
Control unit
Detectors
management
Data communication interface
IO-Link
CAN
Ethernet
RS-232
RS-485
Control layer
Despite its operational- and task-oriented nature, the field layer of any factory automation plant is
more than a collection of tools and switches. Over the years, this level has been enriched, making the
complexity of this level comparable to the control layer. One of the key criteria is the packages: usually at
this level there is a strong interest in thermal management, due to the high power required in the field.
Some of the device families are repeated for clarity but, in some cases where they are considered as
redundant, they are treated briefly in order not to miss the connections between the various parts.
Field bus and industrial Ethernet HW implementation
We look here at the devices and solutions
to implement field buses. Architectures are
based around MCUs and DSPs, and the
following considerations are fundamental:
• Flexibility for the different protocols
MCU based
architecture
Control
unit
MCU + ASIC (or ASSP)
architecture
PHY
Memory
PHY
Memory
Control
unit
ASIC or
ASSP
• Real-time implementation
• Functional safety of the solution
MCU + FPGA
architecture
• Power and space versus cost
These considerations result in the final
implementation which can have different
levels of scalability:
•••
•••
•••
•••
• MCU: lowest implementation cost
• MCU + FPGA: the use of an FPGA as glue
FPGA
Control
unit
SoC based
architecture
PHY
Memory
Memory
PHY
logic enhances protocol flexibility and I/O
extension
Industrial Ethernet HW Implementation
• Best technology trade-off • Functional Safety
• Deterministic
• Open Standards
• Dedicated Real-Time data • Scalability
• HW and SW partitioning
• Development Time + Cost
• High reliability
• Consortiums and Partners
• MCU + ASIC or ASSP: a dedicated platform
is often the result of consortium choices in
building new standards
• System on chip: optimized solution
resulting in best efficiency and
performances
The diagram above is an attempt to define a very complex scenario, focusing on the four main architectural concepts previously introduced.
For designers involved in developing an industrial protocol stack, the question often concerns which MCU has the features that best fit the
required protocol. To answer this question, we give here a complete list of the industrial solutions with application field, provider and solution
name (the protocol to be implemented), firstly for the STM32 family and then for our STM8 MCUs.
Solution name
Provider
Application
Model
Cost
35
STM32 series and availability
F1
F2
F4
L1
CANopen
eCosCentric
Factory automation
Sources
License
Y
Y
Y
N
CANopen
IXXAT
Automation, Medical
Source
License
Y
Y
Y
N
CANopen
MicroControl
Factory automation
Binaries
License + royalties
Y
Y
Y
N
CANopen
Port
Factory automation
Source
License
Y
Y
Y
N
DALI
ST
Lighting
Source
Free
Y
Y
Y
Y
DeviceNet
IXXAT
Factory automation
Source
License
Y
Y
Y
N
DeviceNet
MicroControl
Factory automation
Binaries
License + royalties
Y
Y
Y
N
DeviceNet
DLMS / COSEM
DMX
Port
Factory automation
Source
License
Y
Y
Y
N
Andrea Informatique
Metering
Binaries
License
Y
Y
Y
Y
ST
Lighting/home & building automation
Source
Free
Y
N
N
N
eCosCentric
Factory automation
Sources
License
Y
Y
Y
N
EtherCAT
IXXAT
Factory automation
Source
License
Y
Y
Y
Y
EtherCAT
MicroControl
Factory automation
Binaries
License + royalties
N
Y
Y
N
EtherCAT3
Port
Factory automation
Source
License
Y
Y
Y
N
Ethernet/IP
IXXAT
Factory automation
Source
License
N
Y
Y
N
Ethernet/IP3
Port
Factory automation
Source
License
Y
Y
Y
N
eCosPro-CAN
Ethernet/IP
HART Master/Slave
IEEE 1588 PTP
1
TMG
Factory automation
Source
License + royalties
N
Y
Y
N
MESCO
Process automation
Source
License + royalties
Y
Y
Y
N
IXXAT
Factory automation
Source
License
Y
Y
Y
N
IO-Link
TEConcept
Factory automation
Binaries
License + royalties
Y
N
N
N
IO-Link
TEConcept
Factory automation
Source
License
Y
Y
Y
Y
Solution name
J1939
Provider
Application
Model
STM32 series and availability
Cost
F1
F2
F4
L1
IXXAT
Commercial vehicles
Source
License
Y
Y
Y
N
MESCO
Factory automation
Source
License + royalties
Y
N
N
N
Modbus RTU/ASCII
Embedded Solutions
Factory automation
Binaries
License + royalties
Y
Y
Y
N
Modbus RTU/ASCII
Port
Factory automation
Source
License
Y
Y
Y
N
IXXAT
Factory automation
Source
License
Y
Y
Y
N
Modbus TCP
Port
Factory automation
Source
License
Y
Y
Y
N
µC/Modbus
Micrium
Factory automation
Source
License
Y
Y
Y
N
Modbus
Modbus TCP
3
OPC-UA server
Embedded Labs
Factory and building automation
Binaries
License + royalties
N
Y
Y
N
openSAFETY
IXXAT
Factory automation
Open source
Free
Y
Y
Y
N
POWERLINK
IXXAT
Factory automation
Source
License
Y
Y
Y
N
POWERLINK3
Port
Factory automation
Source
License
Y
Y
Y
N
Profibus PA
MESCO
Factory automation
Binaries
License + royalties
Y
N
N
Y
TEConcept
Factory automation
Source
License
Y
Y
Y
Y
IXXAT
Factory automation
Source
License
N
N
N
N
PROFINET
Port
Factory automation
Source
License
N
Y
Y
N
PROFINET
TMG
Factory automation
Source
License + royalties
N
Y
Y
N
PTPd
PTPd
Factory automation
Open source (BSD)
free
Y
N
N
N1
Sercos III
IXXAT
Factory automation
Source
License
Y
Y
Y
Y
Profibus DP and PA
PROFINET
4
2
2
1
1
Note:1: Please contact provider
2: Possible with external memory usage
3: With external MAC or with ESC1100/1200 (EtherCAT)
4: PTPd ported on STM32 by ST
Industrial communication solutions with STM8 MCUs
36
Solution name
DALI
Provider
Application
Model
Cost
ST
Lighting
Source
Free
STM8 series and availability
S
A
L
Y
N
Y
IO-Link
TEConcept
Factory automation
Binaries
License
Y
N
Y
IO-Link
TEConcept
Factory automation
Source
License
Y
Y
Y
TAPKO
Building automation
Binaries
License + royalties
N
N
Y
KNX
IO-Link
The L6360 and L6362A are the key products in the implementation of the IO-Link communication standard, inherent to the field layer.
The IO-Link communication standard is now ready for the factory automation market.
By definition, the communication is organized among a master and some slaves (called devices in the standard).
Vcc
Vdd1
UART
32-bit
microcontroller
(STM32)
I²C
L6360
GPIO
Master
L+
C/Qo
C/Qi
LI/Q
Vdd2
Network DC-DC
converter
L+
C/Q
UART
L6362A
LI/Q
Device (Slave)
GPIO
8-bit or 32-bit
microcontroller
(STM8, STM32)
Sensor
By using a state-of-the-art technology (MultiPower BCD) that allows the design of the logic part, and robust LV power MOSFETs in the same
chip, ST offers an efficient, compact and cost-effective solution to drive any 3-wire digital sensor.
Modern sensors and actuators require:
• Remote service
• Standardization
• Sensor functionality verification
• Diagnostics
• Monitoring
The L6360 and L6362A (which is in advanced development status) I/O industrial transceiver ICs meet all these requirements. These new ICs
offer the market IO-Link sensors/actuators that work without special cables. They feature an advanced solution that can be integrated even in
old systems, that is neutral to any field bus, and keeps P2P communication.
Industrial transceiver ICs are designed to be compliant with burst tests, surge tests and ESD immunity tests, based on the IO-Link specification
and SIO mode requirements.
Industrial transceiver IC product range
Supply
voltage
(V)
Part number
L6360 (Master)
VDD
(V)
18 to 32.5 3.3/5
L6362A (Device)*
5 to 40
3.3/5
Output
Imax
Output
current linear reg. Technology
channels
(A)
(mA)
Input
channels
0.5
65
MultiBCD
2
2
0.2
8
MultiBCD
1
1
Package
QFN 26L
3.5 x 5
DFN 12L
3x3
Note: * in development
IO-Link evaluation boards
Order code
Application
notes
Description
STEVAL-IFP016V2
IO-Link communication master transceiver demonstration board
based on the L6360
37
AN4075
Local control
This section highlights the devices commonly used in this layer. Traditionally, this is the field of simple control tasks, where a minimum set of
peripherals and no great computational capacity is required to the control stage. Our powerful 8-bit MCU family is ideal here, while the
STM32 F0 and L1 series from ST’s 32-bit STM32 family finds a place in cost-effective, field layer applications.
A few examples for the industrial environment from our portfolio of around 120 devices are provided below (www.st.com/stm8s). The STM8L
series, ST’s 8-bit ultra-low-power MCU family, is proposed with devices embedding an LCD display controller (4 x 44/8 x 40) (www.st.com/stm8l).
Flash Internal Data
Part number
size RAM size EEPROM
(Kbytes) (Kbytes) (bytes)
Timer functions
Package
16-/32-bit
timers
Others
Serial interface
ADC
DAC
I/Os
UART (IrDA,
CAN SPI I2C
ISO 7816)
Supply
voltage
(V)
Supply current (ICC)
Maximum
operating
Lowest
Run mode temperature
power mode
(per MHz) (µA) range (°C)
(µA)
STM8S003/005/007 Value line – 16 MHz CPU
STM8S003F3
8
1
128
STM8S007C8
64
6
128
STM8S103F2
4
1
640
STM8S105C4
STM8S105S6
16
32
2
2
1024
1024
STM8S207C6
STM8S208C6
STM8S207M8
STM8S208R8
STM8S208RB
32
32
64
64
128
6
6
6
6
6
1024
2048
2048
2048
2048
STM8S903F3
8
1
640
STM8L151C2
STM8L152M8*
STM8L162M8
STM8L162R8
4
64
64
64
1
4
4
4
256
2048
2048
2048
TSSOP20,
UFQFPN20
LQFP48
1x8-bit, 2x16-bit 2 x WDG, 5x10-bit
16
beeper
1x8-bit, 3x16-bit
10x10-bit
38
STM8S103/105 Access line – 16 MHz CPU
1
1
1
2.95 to 5.5
230
421
1
1
2
2.95 to 5.5
500
421
1
1
2.95 to 5.5
5
230
1
1
1
1
2.95 to 5.5
2.95 to 5.5
5
5
430
430
1
1
1
1
1
2
2
2
2
2
2.95 to 5.5
2.95 to 5.5
2.95 to 5.5
2.95 to 5.5
2.95 to 5.5
5
5
5
5
5
500
500
500
500
500
-40 to +125
1
1
2.95 to 5.5
5
230
-40 to +125
1
1
1
1
1
3
3
3
1.65 to 3.6
1.65 to 3.6
1.65 to 3.6
1.65 to 3.6
0.35
0.4
0.4
0.4
180
200
200
200
-40 to +125
SO20, TSSOP20,
1x8-bit, 2x16-bit
5x10-bit
16
1
UFQFPN20
2 x WDG,
LQFP48
1x8-bit, 3x16-bit beeper 10x10-bit
38
1
LQFP44
1x8-bit, 3x16-bit
9x10-bit
34
1
STM8S207/208 Performance line - 24 MHz CPU
LQFP48
1x8-bit, 3x16-bit
10x10‑bit
38
1
LQFP48
1x8-bit, 3x16-bit
10x10‑bit
38 1
1
2 x WDG,
LQFP80
1x8-bit, 3x16-bit
16x10‑bit
68
1
beeper
LQFP64
1x8-bit, 3x16-bit
16x10‑bit
52 1
1
LQFP64
1x8-bit, 3x16-bit
16x10‑bit
52 1
1
STM8S903 Application specific line - 16 MHz CPU
SO20, TSSOP20,
2 x WDG,
1x8-bit, 2x16-bit
5x10‑bit
16
1
beeper
UFQFPN20
STM8L series – ultra-low-power MCUs - 16 MHz CPU
28x12-bit
41
1
LQFP48
1x8-bit, 2x16-bit
2 x WDG,
LQFP80
1x8-bit, 4x16-bit
28x12-bit 2x12-bit 68
2
AWU, RTC,
LQFP80
1x8-bit, 4x16-bit
28x12-bit 2x12-bit 68
2
beeper
LQFP64
1x8-bit, 4x16-bit
28x12-bit 2x12-bit 54
2
Note: * this device is provided with a 4 x 44/8 x 40 display controller (LCD)
-40 to +85
-40 to +125
A wide choice of free C compilers and IDEs is available for STM8 MCUs (www.st.com/stm8tools).
Free tools suites, software libraries and examples
Development environment
C-Compilers
NA
Free up to 32-Kbyte
One year renewable
Free up to 8-Kbyte
On month full size
IDE
STVD
IDEA
EWSTM8
A wide offer of hardware solutions and starter kits is also available for our 8-bit MCU families: the STM8 S, STM8 A (the automotive line),
as well as the STM8 L.
The full list of evaluation boards is available at www.st.com/stm8tools.
Part number
Description
ST-LINK/V2
The ST-LINK/V2 is an in-circuit debugger and programmer for the STM8 and STM32 MCU
families. The single wire interface module (SWIM) and JTAG/serial wire debugging (SWD)
interfaces are used to communicate with any STM8 or STM32 microcontroller located on an
application board.
ST-LINK/V2-ISOL
In-circuit debugger/programmer with digital isolation
STX-RLINK
The RLink (STX-RLINK) is Raisonance’s versatile, low-cost, in-circuit debugger and
programmer for the complete range of ST’s MCUs (STM8, ST7, STM32, STR7 and STR9).
It connects to application or evaluation boards for in-circuit programming and debugging
via an industry standard JTAG-SWD connection for ARM® core-based microcontrollers, via
ST’s SWIM connection for STM8, or via an in-circuit communication (ICC) connection for ST7
microcontrollers. ST72C devices are not supported.
STEVAL-IFN004V1
The STEVAL-IFN004V1 demonstration board is based on ST’s STM8S105 MCU and the DMOS
fully integrated 3-phase motor driver L6230 implementing 6-step scalar control of BLDC
motors.
STEVAL-IAS003V1
The STEVAL-IAS003V1 counter demonstration board is intended as an example for
applications where a directly-driven LCD with the associated programmable functionality is
needed.
STEVAL-ICB003V1
The STEVAL-ICB003V1 demonstration board is a general-purpose front panel solution, using a
TLED316S LED driver, STMPE1208S capacitive touch sensor and an 8 bit STM8S207K6 MCU.
38
Image
Application notes, free software examples, dedicated application libraries including motor control, are also available for free download
(www.st.com/stm8). To complete the picture, some examples of the entry-level, 32-bit STM32 F0 MCUs (www.st.com/stm32f0) as well as
STM32 L1 series (www.st.com/stm32l1), are provided in the table below.
Internal
RAM
size
(Kbytes)
Maximum
Supply current (ICC)
Supply
operating
voltage Lowest power Run mode
temperature
16-/32-bit timers
Others
SPI
I2S I2C USART CEC
(V)
mode (µA) (per MHz) (µA) range (°C)
STM32 L1 series ARM® Cortex™-M3-based – ultra-low-power 32 MHz CPU1
6x16‑bit
16x12‑bit 2x12‑bit 37
2
2
3
1.8 to 3.6
0.3
230
SysTick,
6x16‑bit
12x12‑bit 2x12‑bit 36
2
2
3
1.65 to 3.6
0.3
230
2 x WDG,
-40 to 85
39x12‑bit 2x12‑bit 108 3
2
2
5
1.65 to 3.6
0.3
230
RTC
8x16‑bit/1x32- bit
21x12-bit 2x12‑bit 50
3
2
2
5
1.65 to 3.6
0.3
230
STM32 F0 series ARM® Cortex™-M0-based – STM32F051 line with 48 MHz CPU and DAC
6x16-bit
1x12-bit
55
2
2
2
2.4 to 3.6
3.4
250
-40 to 85
5x16-bit/1x32-bit
13x12-bit
39
1
1
1
1
2.0 to 3.6
1.7
250
7x16-bit/1x32-bit
19x12-bit
1x12‑bit
55
1
1
1
1
1
2.0
to
3.6
1.65
250
SysTick,
7x16-bit/1x32-bit
19x12-bit 1x12‑bit 55
2
1
2
2
1 2.0 to 3.6
1.7
250
2x WDG,
RTC, 24-bit 13x12-bit 1x12‑bit 27
7x16-bit/ 1x32-bit
1
1
1
2
1 2.0 to 3.6
1.65
250
-40 to 105
9x16-bit/1x32-bit downcounter 19x12-bit 1x12‑bit 87
2
1
2
4
1 2.0 to 3.6
1.8
260
8x16-bit/1x32-bit
19x12-bit 2x12‑bit 51
2
2
2
4
1 2.0 to 3.6
1.8
260
8x16-bit/1x32-bit
19x12-bit 2x12‑bit 87
2
2
2
4
1 2.0 to 3.6
1.8
260
Timer functions
Part number
Flash
size
(Kbytes)
STM32L100C6
32
4
STM32L151C8
64
10
STM32L152QD
STM32L162RD2
384
384
48
48
UFQFPN48
LQFP48,
UFQFPN48
UFBGA132
LQFP64
STM32F030R8
STM32F031C4
STM32F051R4
STM32F051R8
STM32F051K8
STM32F071VB
STM32F072RB3
STM32F072VB3
64
16
16
64
64
128
128
128
8
4
4
8
8
16
16
16
LQFP64
LQFP48
LQFP64
LQFP64
UFQFPN32
LQFP100
LQFP64
LQFP100
Package
Serial interface
ADC
DAC
I/Os
Notes: 1: Packages reported in this column are only one example of the packages’ availability of the corresponding device.
2: STM32L162 line includes LCD and AES. The STM32L162RD embeds 16384Kbytes data, 1x USB FS, 1x SDIO, 1x FSMC and a 4x32 / 8x28 LCD controller.
3: STM32F072RB and STM32F072VB includes CAN interface and USB 2.0 full-speed interface.
STM32 F0 MCUs are supported with evaluation tools to shorten design time (www.st.com/stm32f0discovery).
The STM32 F0 Discovery kit, 32F0308DISCOVERY, features
• STM32F051R8T6 microcontroller with
64-Kbyte Flash, 8-Kbyte RAM in an
LQFP64 package
• On-board ST-LINK/V2 with selection mode
switch to use the kit as a standalone
STLINK/V2 (with SWD connector for
programming and debugging)
• Board power supply: through USB bus or
from an external 5 V supply
• External application power supply:
3 V and 5 V
• Four LEDs:
•LD1
(red) for 3.3 V power on
(red/green) for USB communication
•LD3 (green) for PC9 output
•LD4 (blue) for PC8 output
•LD2
• Two pushbuttons (user and reset)
• Extension header for all LQFP64 I/Os for
39
quick connection to prototyping board
and easy probing
• An additional board is provided that can be
connected to the extension connector for
even easier prototyping and probing
Monitoring and sensing
MEMS motion sensors
ST’s MEMS (micro electromechanical sensors) portfolio includes accelerometers, gyroscopes, digital compasses and inertial modules
(www.st.com/mems). ST is a worldwide leader for these devices thanks to:
• A unique sensor portfolio, from discrete to
fully-integrated solutions, to meet every
design need
• High-volume manufacturing capacity to
provide cost-competitive solutions, fast
time-to-market and security of supply
• High performance sensor fusion to improve
the accuracy of multi-axis sensor systems
to enable new emerging and highlydemanding applications, such as indoor
navigation and location based services
• High-level quality products, already tested
in different application fields, including
mobile, portable, gaming, consumer,
automotive, healthcare and industrial
segments (more than 3 billion pieces
shipped worldwide)
• Multiple dedicated sites for MEMS foundry,
assembly and testing lines, with complete
in-house dual sourcing
MEMS motion sensors (accelerometers, gyroscopes, digital compasses and inertial modules) are finding uses in advanced industrial
applications, including:
• Robotics and automation (accelerometers,
gyroscopes)
•Inertial navigation, to increase the accuracy
of wheel encoders, self-balance robots
•Condition monitoring of industrial
equipment and transportation
(high g accelerometers)
• Asset and parcel tracking and monitoring
(high g accelerometers, gyroscopes)
•Impact detection and logging
• Building and structure monitoring
(accelerometers)
•Vibration and tilt monitoring
• Seismic exploration and geophones/
idrophones (accelerometers)
monitoring
•Vibration
• Drill (accelerometers, gyroscopes)
•Safety, detecting
excessive rotation on
the body of the drill if chuck gets stuck
•Tilt detection
Part number
Full scale
Noise density (Typ.)
Package size (mm)
Key features
LIS2DH
±2, ±4, ±8, ±16 g
220 μg/√Hz
2 x 2 x 1 LGA-14
12-bit, embedded FIFO
LIS3DSH
±2, ±4, ±8, ±16 g
150 μg/√Hz
3 x 3 x 1 LGA-16
16-bit, state machine, embedded FIFO
LIS331HH
±6, ±12, ±24 g
650 μg/√Hz
3 x 3 x 1 LGA-16
16-bit, up to ±24g full scale
H3LIS331DL
±100, ±200, ±400 g
15000 μg/√Hz
3 x 3 x 1 TFLGA-16L
16-bit, up to ±400g full scale, low power, high shock survivability
LIS344ALH
±2, ±6 g
50 μg/√Hz
4 x 4 x 1.5 LGA-16L
Analog output
AIS328DQ
±2, ±4, ±8 g
218 μg/√Hz
4 x 4 x 1.8 QFN 24
AEC-Q100 qualification*, 16-bit, temp. range: -40 to 105 °C
Accelerometers
Gyroscopes
L3GD20
±250, ±500, ±2000 dps
0.03 °/s/√Hz
±245 dps
0.03 °/s/√Hz
A3G4250D
4 x 4 x 1 LGA-16
Immunity to audio noise, embedded FIFO
4 x 4 x 1 LGA-16
AEC-Q100 qualification(*)
Magnetometer
LIS3MDL
±4/ ±8/ ±12/ ±16 gauss
X, Y axes: 3.2* mgauss
Z axis: 4.1* mgauss
±2, ±4, ±8, ±16 g
±250, ±500, ±2000 dps
±2, ±4, ±8, ±16 g
±250, ±500, ±2000 dps
±2, ±4, ±8, ±16 g
±250, ±500, ±2000 dps
±1.3 to ±8.1 Gauss
220 μg/√Hz
0.03 °/s/√Hz
220 μg/√Hz
0.03 °/s/√Hz
220 μg/√Hz
0.03 °/s/√Hz
2 mgauss (resolution)
±2, ±4, ±8, ±16 g
±2, ±4, ±8, ±12 gauss
150 μg/√Hz
5 mgauss
2 x 2 x 1 LGA-12
16-bit data output, interrupt generator, self-test
Inertial modules
LSM330DLC
LSM330D
INEMO-M1
4 x 5 x 1.1 LGA-28L
3 x 5.5 x 1 LGA-28L
13 x 13 x 2 PCB
6-axis system in package (SiP) with embedded FIFO, temperature
sensor and programmable interrupt generators
6-axis system in package (SiP) with embedded FIFO, temperature
sensor and programmable interrupt generators
9-axis system on board (SoB) with all the features and power of the
STM32F103 32-bit MCU in a solderable module,
Temp. range: -40 to +85 ºC
Digital compasses
LSM303D
3 x 3 x 1 LGA-16L
Embedded FIFO and temperature sensor
Programmable interrupt generators
Note: * Automotive qualification is suitable in some specific industrial applications due to its inherent extended features’ range
40
iNEMO® software engine features multi-sensor motion data fusion
The iNEMO engine sensor fusion suite is a filtering and predictive software. It uses advanced algorithms to integrate outputs from multiple MEMS
sensors in a smart way, independently of environmental conditions, to reach the best performances. Real-time motion-sensor data fusion is set to
significantly improve the user experience, increasing accuracy, resolution, stability and response time in advanced motion-based applications in
consumer, computer, industrial and medical fields.
The iNEMO engine can be combined with ST’s iNEMO inertial modules to create the industry’s first complete and customizable hardware/
software multi-axis MEMS sensor solutions for enhanced motion and accurate heading recognition. Equipment manufacturers across different
market segments can now easily and quickly deploy robust and reliable high-performance motion detection systems with up to 10 degrees of
freedom, comprising 3-axis sensing of linear, angular, and magnetic motion with barometer/altitude readings from a pressure sensor, enabling
true augmented-reality applications (www.st.com/inemo-engine).
BENEFITS
• Absolute point tracking and motion
tracking accuracy
• Immunity to magnetic interference
for high performance in real-world
conditions
• Few user-calibration interruptions,
enabling innovative and
longer game play
• Reliable compass heading for
accurate navigation
• Accurate direction, enabling true
augmented-reality applications
iNEMO® software
Software version
INEMO-ENG-M1LI3
iNEMOENgine_PW8
iNEMOEngine_PI3P
Platform independent
iNEMOENgine_PAAP
Description
Sensor fusion library code
Lite version for INEMO-M1: Based on the Kalman filter theory applied to MEMS sensors, iNEMO M1 lite software
library is a free source code that can be used for the STM32 and for customizable HW/SW solutions.
Pro version: This firmware running on the STM32 manages sensors on Windows 8 using standard human
interface devices (HID) over USB/I²C.
Allows sensor plug-and-play recognition and new application development using Windows 8 standard APIs.
(Compatible with Intel x86 and ARM processors)
Pro version: This firmware allows you to develop new custom applications running on the STM32 or to collect
real-time sensor fusion data thorough Virtual COM from any platform (platform independent).
Pro version: This is a complete solution to support Android platforms by providing the hardware abstraction layer,
sensor drivers and sensor fusion library.
Source code
Compiled code
Compiled code
Compiled code
MEMS sensor evaluation kit
ST has deep expertise in sensor integration and development of new applications and can assist customers in design-in. ST’s evaluation kits and
firmware provide a real-time evaluation of sensor performance in your applications (www.st.com/mems-boards and www.st.com/mems-drivers).
Evaluation KIT
USB connector
ST offers a complete evaluation kit
including:
MEMS-sensor
adapter
• A motherboard compatible with all
STM32
microcontroller
ST MEMS adapters, based on a
high-performance
32-bit microcontroller
(order code: STEVAL-MKI109V2)
• A full set of MEMS sensor
adapters, that are complementary
to the motherboard and can mount
all sensors
41
• An innovative graphic user interface
JTAG/SWD
for direct and real-time access to
the sensor configuration registers.
Part number
Test points
Description
Board type
STEVAL-MKI119V1
Motherboard + adapter board:
STEVAL-MKI119V1 kit includes STEVAL-MKI109V2 (motherboard) + STEVAL-MKI108V2
(9-axis module, L3GD20 and LSM303DLHC)
STEVAL-MKI109V2
MEMS motherboard based on STM32F103 high-performance ARM 32-bit Cortex™-M3 MCU
Interfaces: USB connector, JTAG/SWD for debug Ready to support iNEMO Engine DFU
compatible for USB microprocessor firmware update, compatible with all of ST’s MEMS
adapters
STEVAL-MKI108V2
(9-axis)
For all standalone sensors and modules, an adapter board designed to be plugged into the
motherboard
Board pinout compatible with a standard DIL24 socket
Completed list is available on ST’s web site.
STEVAL-MKI115V1
System ready for any wireless extension
External Bluetooth dongle available
Extender board
STEVAL-MKI121V1
Evaluation board for INEMO-M1 that includes a pressure sensor LPS331AP representing a
complete 10-DoF open platform; USB and SWD connectors for debugging and programming
Discovery-M1
Development kit
Motherboard
Example of daughter board
Temperature sensors
ST’s temperature sensors include both analog and digital temperature sensor ICs. Both types are suitable for use in a wide range of applications,
including the industrial segment (www.st.com/tempsensors).
Part number
Full scale
Type
Resolution
Key features
Package size (mm)
STLM20
-55 to +130 °C
Analog
Accuracy: 1.5 °C max at 25 °C (±0.5 °C typ)
Ultra-low current 2.4 V precision
analog temperature sensor
1 x 1.3 x 0.5 UDFN-4L
2 x 2.1 SOT323-5L
STTS751
-40 to +125 °C
Digital
Accuracy: ±1.0 °C (typ) from 0 to +85 °C,
±2.0 °C (typ) from -40 to +125 °C
2.25 V low-voltage local digital
temperature sensor
2 x 2 x 0.5 UDFN-6L
2.9 x 2.8 SOT23-6L
Proximity detectors
Proximity sensors fall into three main categories: capacitive sensors, inductive sensors, and ultrasonic sensors.
IO-Link technology is the first standardized IO technology worldwide (IEC 61131-9) for communication with these sensors, as well as actuators.
This powerful point-to-point communication is based on the long established 3-wire sensor and actuator connection, without additional
requirements regarding the cable material. ST has developed physical layer interfaces according to the IO-Link system specification supporting
this technology.
With our MCU families STM8 and STM32 plus IO-link stack, ST offers an unique product spectrum for this future technology.
The simplified block diagram below presents a complete system compliant with the IEC 60947-5-2 design recommendation. ST offers, for the
front end block, BCD smart-power technology, able to match most ASIC specifications.
Inductive proximity detectors block diagram
Driving circuits
Front end
Driving circuits
Control part
Driver
Protection
Cable
Proximity
sensor
42
Part number
Function
STM8L
Description
Package
8-bit MCU
LQFP, TFBGA, TSSOP 20, UFQFPN, WLCSP
32-bit MCU
LQFP, TSSOP 20, UFQFPN
Control unit
STM32F0
TDE1707
SO8
Driver
Intelligent power switches
TDE1708DFT
L6362A
DFN 4x4mm
Transceiver
SPT01-335DEE
IO-Link device
Triple diode array for power bus protection
DFN 12L 3x3mm
QFN3x3-6L 3x3x1 mm
Protection
SPT02-236DDB
Double diode array for switch protection and reverse blocking
The STEVAL-IFS006V2 demonstration board is an inductive proximity switch application based
on metal body detection using the eddy current effect on the HF losses of a coil.
This evaluation board represents a very simple, compact and cost-effective solution for an
inductive proximity switch with wide temperature range, supply voltage variation and noise
immunity in industrial environments.
μQFN-2L 3.3x1.5x0.8 mm
Actuators and motor control
ST has a wide portfolio and long experience in motor control. Smooth operation and high efficiency are the key factors driving development in this
market. In particular, the growing demand for higher efficiency is these days supported by developments in advanced motor control algorithms
such as field oriented control (FOC) for PMSM, BLDC and induction motors. This requires high-performance MCUs coupled either with motor
drivers (such as intelligent power modules or monolithic ICs) or power transistors and gate drivers. For positioning or very low-speed applications,
new highly-integrated controller/driver ICs for stepper motors run them more smoothly and with higher positioning precision.
Key enabling products are:
• Power MOSFETs and IGBTs
• Diodes
• SCR, Triacs and AC switches
• Gate drivers
• 8 and 32-bit microcontrollers
• Power modules
• Motor drivers ICs
Low voltage monolithic motor driver
M
Sensor and
signal
conditioning
Sensor and
signal
conditioning
Gate drivers
Gate drivers
Gate drivers
Speed
feedback
Sensing and
HW protections
43
Motor driver control unit
Power
supply
User
interface
Control unit
Bus
transceiver
Actuation and motor control mean also microstepping. Factory automation is dominated by thousands of tools driven by DC stepper motors,
differing primarily in the sequence needed to drive the motor and the respective circuit topology. Stepper motors can be driven in full step, half
step and microstepping modes.
ST has provided drive ICs for all circumstances over many years. These drives have an associated demonstration board with our xSPIN families.
cSPIN
easySPIN
powerSPIN
L6208/Q
Full set of
protections
Full set of
protections
L6474
Microstepping
driver
Adaptive decay
SPI
-programmable,
diagnostics
flexSPIN
dSPIN
L6460
DC and
Microstepping
driver
L6470/2
Digital core for
motion control
4 configurable full
bridge drivers
DC-DC, GPIO,
OP-Amp, DAC, ADC
Performance and integration
L6480/2
Controller for
8xMosFET 85 V Bus
Digital core for
motion control
Microstepping
driver
Microstepping
driver
SPI
-programmable,
diagnostics
SPI
-programmable,
diagnostics
Motor control is too broad an application segment to be treated fully here. A full and self-contained documentation is available at
www.st.com/powerspin.
ST also provides evaluation tools for motor control, based on the STM32 MCU family.
The STM32100B-MCKIT supports field oriented control (FOC) of 3-phase permanent magnet
synchronous motors (PMSM). Single-shunt resistor current measurement is supported out-ofthe-box allowing closed-loop torque control. Position measurement can be implemented using
quadrature encoder sensors, Hall effect sensors or sensorless algorithms.
The STM32100B-MCKIT starter kit can be run either as a plug-and play, out-of-the-box demo
with the provided PMSM motor, in sensorless torque or speed control mode; or in conjunction
with a third-party IDE and C compiler, as a development kit for creating your own motor control
application based on the STM32F100.
The STM3210B-MCKIT motor control starter kit comes ready-to-run with a PMSM motor or an
AC induction motor (accessory). You can modify the demonstration application and develop your
own motor control applications using the dedicated software libraries provided in the starter kit
in conjunction with a third-party IDE and C compiler.
Also available are the ST MC Workbench (STSW-STM32003) PC GUI configuration tool for the
STM32 PMSM FOC SDK motor control library (STSW-STM32100).
The Segger J-Link is included in the kit so you can connect to a host PC via an industry
standard 20-pin JTAG connection. When connected to a host PC, the opto-isolation board
provides galvanic isolation for the host PC and development tools on the 20-pin industrystandard JTAG connection.
44
Power transistors
Leading-edge power technologies for low
(<150 V), high (600/650 V) and very high
voltage (1200 V and over) applications
combined with a full package range and
innovative die bonding technologies exemplify
ST’s innovation in power transistors.
Our portfolio includes MOSFETs ranging
from -500 to 1500 V, silicon carbide (SiC)
MOSFETs featuring the industry’s highest
temperature rating of 200 °C, IGBTs with
breakdown voltages ranging from 350 to
1300 V and a wide range of power bipolar
transistors.
For power applications up to 650 V, key ST
technologies are the MDmesh II and V (low
gate charge and the lowest RDS(on) in the
market) for the MOSFETs and the V-series
for IGBTs, while the future is our GaN HEMT*
(high electron mobility transistor) technology,
approaching an ideal switch.
Very high voltage applications are traditionally
the domain of IGBTs and now also of SiC
MOSFETs. Newly developed technologies
for IGBTs are the STD series (PowerMESH
technology) and the new H-series technology
(175 °C rated, trench-gate field-stop, for
high frequency applications). SiC MOSFETs
are addressed by a new technology with
temperature ratings up to 200 °C.
Note: * in development
High voltage
Hight current
kW
25
GTO
10
IGBT
1.0
BJT
MOSFET
0.1
0
1
100
1000
High frequency
Power MOSFETs
ST’s offering of power MOSFETs includes hundreds of devices. The table below presents a selection with different packages and our latest silicon
technologies, with voltages up to 650 V (and over). The following diagram indicates part number assignment.
ST
x
Package
B
D
D8
E
F
FW
H
I
IF
L
N
P
Q
S
U
W
Y
D PAK
DPAK
DIP-8
ISOTOP®
TO-220FP
TO-3PF
H2PAK (2 to 7 leads)
I2PAK
I2PAKFP
PowerFLAT™
(3.3x3.3; 5x5; 5x6; 8x8)
SOT-223
TO-220
TO-92
SO-8
IPAK (-S for short leads)
TO-247
Max247®
2
45
N
Indicative
current range
65
Breakdown voltage ÷ 10
(with the exception
of non 10 multiples)
Channel polarity
N
P
NS
or PS
DNS
or DPS
N...N
N...P
DN
or DP
CN
N-channel
P-channel
N-Ch or P-Ch plus Schottky diode
(electrically connected, monolithic included)
N-Ch or P-Ch plus Schottky diode
(not electrically connected, monolithic included)
Two different N-channel dice
Complementary pair
Dual N-Ch or dual P-Ch
Dual MOSFET common drain
y
M5
Technology
H5
H6
H7
F3
F4
F5
F6
F7
M5
K3
K5
U
STripFET™ V 10 - 30 V
STripFET™ VI DeepGate™ 20 - 30 V
STripFET™ VII DeepGate™ 20 - 30 V
STripFET™ III 33 - 150 V
STripFET™ DeepGate™
STripFET™ V 40 V
STripFET™ VI DeepGate™ 33 - 80 V
STripFET™ VII DeepGate™ 55 - 150 V
Mdmesh™ V > 200 V
SuperMESH3™ > 300 V
SuperMESH5™ > 900 V up to 1500 V
UltraFASTmesh™ ≥ 500 V
Special features
V
L
LL
T
C
D
Z
Super logic level (2.5 V - 2.7 V drive)
Logic level 5 V drive optimized
Logic level 4.5 V drive optimized
Temperature sensing
Current sensing
Fast recovery diode
Clamped by Zener diode 33 - 150 V
45
Part number
Package
VDSS (V)
RDS(on) (@ VGS = 10 V)
max (Ω)
Drain current (Dc)
(I_D) max (A)
Total power dissipation
(PD) max (W)
Total gate charge (Qg)
typ (nC)
STL160N3LLH6
PowerFLAT 5x6
30
.0013
45
4.8
120
STH160N4LF6/2
H2PAK-2
40
.0032
120
150
180
STH320N4F6-2
H2PAK-2
40
.0013
200
300
160
STP270N8F7
TO-220
80
.0025
180
315
193
STS5N15F4
STL52N25M5
STD6N52K3
SO-8
150
.063
5
2.5
48
PowerFLAT 5x6
250
.076
4.2
2.5
47
DPAK
400
1.2
4.4
70
17
STW36N55M5
TO-247
550
.08
33
190
72
STY100NM60N
Max247
600
.029
98
625
330
STI34N65M5
I2PAK
650
.110
29
190
70
STW20N95K5
TO-247
950
.33
17.5
250
40
STW6N120K3
TO-247
1200
2.4
6
150
34
STFW4N150
TO-3PF
1500
7
4
63
30
STW3N170*
TO-247
1700
12
2.3
160
28
Note: * preview
A wide choice of p-channel power MOSFETs, in a voltage range from -500 to -20 V, is also available (www.st.com/powermosfets).
Part number
Package
VDSS (V)
RDS(on) (@ VGS = 10 V)
max (Ω)
Drain current (Dc)
(I_D) max (A)
Total power dissipation
(PD) max (W)
Total gate charge (Qg)
typ (nC)
STU10P6F6
IPAK
-60
.16
-10
35
6.4
STS10P3LLH6
SO-8
-30
.014
-10
2.5
50
SOT23-6L
-20
-
-3
1.6
5.5
STT3P2UH7
SiC MOSFETs
Based on the advanced and innovative
properties of wide bandgap materials,
ST’s silicon carbide (SiC) MOSFETs feature
very low RDS(on) * area for the 1200 V
rating combined with excellent switching
performances, translating into more efficient
and compact systems. Compared with silicon
MOSFETs, SiC MOSFETs exhibit low on-state
resistance * area even at high temperatures
and excellent switching performances
versus the best-in-class 1200 V IGBTs in all
temperature ranges, simplifying the thermal
design of power electronic systems.
The main features and benefits of our SiC MOSFETs include:
• Very high temperature handling capability (Tjmax = 200 °C) leading to reduced PCB form
factors (simplified thermal management) as well as improved system reliability
• Significantly reduced switching losses (minimal variation versus temperature) resulting in
more compact designs (with smaller passive components)
• Low on-state resistance (80 mΩ typical at 25 °C) resulting in higher system efficiency
(reduced cooling requirements)
• Simple to drive (cost-effective network driving)
• Very fast and robust intrinsic body diode (no need for external freewheeling diode, thus more
compact systems)
IGBTs
With breakdown voltages ranging from 350 V to 1300 V, ST’s IGBTs feature the optimal trade-off between switching performance and on-state
behavior due to their proprietary technology. They enable greater all round energy-efficient system designs in applications such as motor control,
photovoltaics, UPS, automotive, induction heating, welding, lighting and others (www.st.com/igbt).
Some of the features of our IGBT portfolio are as follows:
• Low VCE(SAT) for reduced conduction losses
• Improved switch-off energy spread versus increasing temperature resulting in reduced switching losses
• Tight parameter distribution for design simplification and easy paralleling
• Co-packaged, tailored anti-parallel diode option for improved power dissipation and best thermal management
46
These IGBTs are based on both standard punch-through technology, ideal for white goods, and the newly introduced trench-gate field-stop
technology which enables extremely fast turn-off times with minimal tail currents, stable behavior over temperature, and a low VCE(SAT) that,
coupled with the positive de-rating with temperature, improves the applications’ efficiency.
STG
x
Package
B
D
E
F
FW
I
L
P
U
W
WT
Y
D2PAK
DPAK
ISOTOP®
TO-220FP
TO-3PF
I2PAK
PowerFLAT™ (8x8)
TO-220
IPAK (-S for short leads)
TO-247
TO-3P
Max247®
Note: * For soft-switching applications only
60
V
Max continuos
current @ 100 °C
60
y
DD
F
Breakdown
voltage ÷ 10
Technology
generation
F
IGBT technology speed
H
H...B
V
M
High speed (10 ÷ 35 kHz)
High speed improved (8 ÷ 50 kHz)
Very high speed (20 ÷ 120 kHz)
Low loss (up to 20 kHz)
z
Special features (if any)
C
T
Z
L
Current sensing
Temperature sensing
Clamped by Zener diode
Logic level
Trench gate field stop
Diode options
D Very fast rescovery
DR Ultra fast recovery
DL Low fast voltage*
Part number
Switching
frequency range
FRD
option
175°C
V (20 - 120kHz)
Very fast
175°C
V (20 - 120kHz)
Very fast
0.55
175°C
V (20 - 120kHz)
0.48
175°C
HB (8 - 50kHz)
0.63
175°C
HB (8 - 50kHz)
1.6
1.2
175°C
2.1
0.45
175°C
25
2.1
0.8
40
2.1
1.3
BVCES (V)
ICN1 (A)
VCE(SAT)2 (V) Eoff3 (mJ) Max TJ (°C)
STGx30V60DF
600
30
1.85
0.23
STGx40V60DF
600
40
1.8
0.41
STGx60V60DF
600
60
1.85
STGx40H65DFB
650
40
1.6
STGx60H65DFB
650
60
1.6
STGx80H65DFB
650
80
STGx15H120DF2
1200
15
STGx25H120DF2
1200
STGx40H120DF2
1200
Package
D2PAK TO-220 TO-247 TO-3P Max247 TO-3PF
B
P
W
WT
FW
W
WT
FW
Very fast
W
WT
Very fast
W
WT
Very fast
W
WT
HB (8 - 50kHz)
Very fast
W
WT
H (15 - 50kHz)
Very fast
W
175°C
H (15 - 50kHz)
Very fast
W
175°C
H (15 - 50kHz)
Very fast
W
Y
Note:1: ICN : IGBT nominal collector current @ TJ = 100 °C
2: VCE(SAT) : typical conduction losses @ ICN, TJ = 25 °C
3: Eoff : switching-off energy @ ICN, TJ = 25 °C on capacitive load (33 nF)
Almost 30 through hole packages are available as well as a variety of SMD (surface mounted devices) for our power transistors. For example, the
PowerFLATTM 8x8 mm is a leadless SMD package for high-voltage power transistors:
• 64 mm2 footprint
• Operating Tj between -55 and 150 °C
• Low profile with 1 mm thickness
• Lead finishing: pure tin plating (Sn 100%)
• Bottom exposed metal drain pad for
• Halogen free
efficient heat dissipation and improved
thermal performances
• Enables end products with
greater power density
• Unequalled low RDS(on)* area
• Creepage distance: 2.7 mm
• RoHS compliant
• MSL level 3
• Suited for wave soldering
• Provided in 13” tape and reel
• Low parasitic inductances
Diodes
We present here an overview of ST’s diode offering. We recommend that you visit www.st.com/diodes, to get more information.
The diagram below gives an idea of how many part numbers are available to fit all application needs.
ST offers Schottky and ultrafast rectifier
IO (A)
solutions for all market requirements. ST’s
latest developments include our M series,
240 A
based on Schottky technology, with improved
200 A
avalanche rating and the integration of
higher currents in low-profile PowerFLAT™
packages.
Power Schottky diodes
Our range of small-signal Schottky diodes
60 A
Ultrafast bipolar
with flip-chip and SOD-923 devices helps
rectifiers
meet the most stringent space-saving
Field-effect
20 A
requirements, especially for portable
rectifiers
SiC diodes
communication equipment.
4A
3A
For high-efficiency rectification or
1 A Signal Schottky diodes
freewheeling functions, our new field effect
>1
A
rectifier diodes, the FERD family, improve the
power density capability of the converters.
15 V 40 V 60 V 100 V
150 V
200 V
600 V
1200 V VRRM (V)
For power converter applications where
silicon diodes reach the limits of their
operating temperature and power density,
ST’s first- and second-generation siliconcarbide devices offer optimal reliability.
47
ST
aa
Technology
PS Power Schottky
PSC SiC
TH Ultrafast
bb
c
ddd
Current rating
e
f
Connection type
Current: 0.5 A to 240 A
Void Two-lead configuration
C
dual common cathode
S
single in three-lead package
Code: 0.5 to 240
Packing type
Series
Void
H
For Schottky diodes (STPS)
medium VF/IH
L
high temperature (<120 V only)
low VF from IO/2 to IO (<120 V only)
M
low VF from IO/4 to IO2
S
low leakage current
low VF up to IO/4
SM
Void
L
For ultrafast diodes (STTH)
medium VF and Qrr
low VF (600 V mainly)
R
low Qrr recovery
LCD
transistor mode PFC
transistor
R trade-off mainly used for
Nota:
400 V and 600 V
48
Breakdown voltage
STPS (power Schottky)
code: VRRM = 15 V to 600 V
STPSC (SiC)
code: VRRM = 600 V
Void
first generation
Second generation
H
with highet surge
current capability
STPSC (SiC)
code: VRRM divided by 100
200 V to 1200 V
02 to 12
Through-hole packages
Void Axial: D0-41, DO-15, DO-201
D
TO-220AC
DI
TO-220I
T
TO-220AB
FP TO-220FPAB
PI
DOP3I
R
I2PAK
W
TO-247, DO-247
SMD packages
A
SMA
U
SMB
S
SMC
B
DPAK
G
D2PAK
TV1 ISOTOP (longitudinal)
TV2 ISOTOP (lateral)
g
h
Automotive grade
Void standard diode
automotive-grade
-Y
diode
Packing option
Void for axis-bulk
for SMA/B/C:
Void
tape and reel
Void for other packages: tube
tape and reel, for axial
RL
packages
tape and reel, for other
TR
packages
ST’s silicon-carbide diodes take advantage of SiC’s superior physical characteristics over Si, with 4 times better dynamic characteristics and 15%
less forward voltage, VF.
Their low reverse recovery characteristics make ST’s SiC diodes a key contributor to energy savings in SMPS applications and in emerging
domains such as solar energy conversion, EV or HEV charging stations, and other applications such as welding equipment and air conditioners.
ST’s SiC product portfolio includes a 20 A, 600 V diode, housed in a halogen-free TO-247 package, to extend its 4- to 12-amp, through-hole and
SMD package offer.
ST’s silicon-carbide diodes are now entering the second generation, with a 6 A, 1200 V device, and a 650 V series.
Current
SiC diode
Time
ST tandem diode
Si diode
SiC diodes provide zero recovery time
with negligible switching losses
Power modules
Starting from power switches, considered
in dice form, ST has also developed power
modules (www.st.com/modules).
With the aim of benefitting from device
integration and state-of-the-art materials to
optimize thermal spread, electrical efficiency
and bill of material, ST’s offer today is based
on molded modules as well as on plastic
packages. While the first are useful for
powers up to 3 kW and can integrate some
intelligence on board, plastic power modules
are suited for the industrial environment, and
are able to support currents up to 100 A.
The family of small low-loss intelligent
molded modules with power up to 3 kW is
named SLIMM™.
Bridge rectifier
Microcontroller
Gate driver
Half bridge
Gate driver
Half bridge
Gate driver
Half bridge
NTC
temperature
monitoring
SLLIMM™
M
Feedback
The key features of this first family of power modules are:
• DBC (direct bonded copper) and vacuum soldering process
• Deadtime and interlocking function
• Smart shutdown function
• Undervoltage lock out function
• Comparators for fault protection against overcurrent and short circuit
• Op amp for advanced current sensing
• Integrated bootstrap diodes
• NTC sensor for temperature control
ST’s power module offer is enriched with some devices dedicated to the industrial environment. The STA3 power module package is available
in Al2O3 DBC as insulating material, a proprietary package with an integrated copper baseplate. It is similar in dimensions to the most common
in the market, but with some characteristic making it very attractive, especially from the customization point of view, and a state-of-the-art
mechanical robustness (thanks to innovative features introduced in the mechanical screwing of plastic and metallic parts).
Available today in the well-known 6-Pack
configuration, with 1200 V, 40 A trench-field
stop IGBTs as switches, integrated NTC
temperature sensor and shunt resistors to
sense the current in each phase of the motor,
already embedded in the DBC, the module is
proposed also in a press-fit pin package.
Dedicated solutions in this package are
delivered with a short lead time for first
prototypes.
Full traceability of each part is guaranteed per single module. Footprint dimensions are 105.00 x 46.00 x 17.00 mm.
Gate drivers
ST’s success in motor driving is the result
of our leadership in SoC (system on chip)
solutions for smart power ICs, combined with
deep system know-how, design methodology
and application expertise. An example is our
proprietary BCD technology (bipolar CMOS
DMOS), that allows the coexistence of both
power and logic in the same chip. A new
gapDRIVE™ platform in this technology will
soon be available, being the first galvanic
isolated gate drivers in ST.
Transmitter
LV IC
Receiver
HV IC
BCD technology principle
49
The device is offered for a first evaluation with HW and SW tools, which are available for this first step upon specific request.
Some features include:
• Input to output propagation delay: < 150 ns
• High-voltage rail: up to 1.5 kV
• Positive drive voltage: up to 36 V
• Driver current capability: 5 A sink, source
• SPI interface for parameter programming
• Overcurrent and over-temperature
• Active Miller clamp and desaturation
• Output 2-level turn off
and diagnostics, daisy chaining possibility
protection
detection
current at 25 °C
VREG
3VC
voltage reg
DESATcurr
DESAT
VREGISO
VREG
DESATth
SD
IN+
IN-/DIAG2
DIAG1
VH
UVLO
VH
Control
logic
Floating
section
control
logic
Solation
GON
GOFF
Level
shifter
CLAMP
VL
GND
UVLO
VL
GND
50
2LVTOth
GNDISO
Flooting group
CLAMPth
CS
CK
SDI
SENSE
SPI
SENSEth
SDO
A standard offering of IGBT and MOSFET gate drivers is summarized in the table below.
Part
number
L6384E
L6385E
L6386E
L6386AD
L6387E
L6388E
L6390
L6391
L6392
L6393
L6395
L6398
TD350
TD351
TD352
Logic interface
Input configuration
Configuration
Single in, SD
HIN and LIN
5, 15 V
5, 15 V
HIN, LIN, SD
5, 15 V
HIN and LIN
HIN and LIN
HIN, LIN, SD
HIN, LIN, SD
HIN, LIN, SD
Phase, brake, SD
HIN and LIN
HIN and LIN
5, 15 V
3.3, 5, 15 V
3.3, 5, 15 V
3.3, 5, 15 V
3.3, 5, 15 V
3.3, 5, 15 V
3.3, 5, 15 V
3.3, 5, 15 V
Single in (opto/pulse trans compatible)
Single in (opto/pulse trans compatible
Single in (opto compatible)
5V
5V
5V
VCC max UVLO on
(V)
VCC (V)
UVLO on
VBOOT (V)
Half-bridge drivers
18
10/12
18
8.3/9.6
8.2/9.5
10/12
9.9/11.9
18
8.3/9.6
8.2/9.5
18
5.5/6
18
8.3/9.6
8.2/9.5
21
10.5/12
10/11.5
21
10.5/12
10/11.5
21
10.5/12
10/11.5
21
8.0/9.5
8/9
20
8.8/9.5
8/8.6
21
8.0/9.5
8/9
Single-channel drivers
26
11
26
11
26
11
-
Interlocking DT (µs)
Op
amp
Comparator
# pins
0.5 ÷ 2.7
-
No
No
No
No
8
8
9.9/11.9
No
Yes, uncommitted
14
Interlocking
0.32
0.18 ÷ 3
0.18 ÷ 3
0.18 ÷ 3
0.18 ÷ 3
0.32
No
No
Yes
No
Yes
No
No
No
No
No
Yes, committed to fault + SSD
Committed to fault + SSD
No
Yes, uncommitted
No
No
8
8
16
14
14
14
8
8
-
No
No
No
No
No
14
8
8
Thyristors and AC switches
ST offers a complete range of thyristors and AC switches with voltage ratings up to 1200 V, current ratings up to 120 A and a range of packages
from miniature surface-mounted packages to high power dissipation isolated and non-isolated packages (www.st.com/thyristors).
To address the ever increasing number of AC loads in industrial control, ST has developed the T series Triac family. The T series meets both
the immunity and high-commutation needs, offering a cost-sensitive solution. Both immunity (dV/dt) and commutation capability (dI/dt)c are
specified at 150 °C for the 800 V series, as well low gate current. This last parameter is key, as it helps optimize the power supply and allows
direct drive capability through a single resistance between the microcontroller and the Triac, for all 10 mA gate types.
In addition, the trade-off of ITSM versus immunity and commutation capability is improved. This is one step ahead of the usual offer, and a unique
range on the market.
Up to 5
Up to 2.3
The key T series features are:
times better
times better
• ITRMS from 4 to 16 A
• 4 ranges of IGT
•10 mA directly driven from a
• VDRM/VRRM up to 800 V
microcontroller
• VDSM/VRSM up to 900 V
•20 mA Snubberless™
•25 mA standard 4 quadrants
• TJ
•35 mA Snubberless
•150 °C @ VDRM/VRRM up to 600 V (dual TJ
devices only)
•125 °C for 220 V mains, VDRM/VRRM up to
800 V (dual TJ devices only)
T series Triacs have better noise immunity (dV/dt) up to 2 kV, which is up to 5 times above
market standards. Commutation capability, (dI/dt)c, is increased up to 16 A/ms, which is up to
2.3 times above market standards. The table below compares a standard Triac
(BTA08-600CWRG) with a T series Triac (T835T-8FP)
Part number
T835T
BTA08-600CWRG
Current
IT(RMS) (A)
8
Immunity dV/dt
(w/o snubber) (V/µs)
x5
Commutation (dl/dt)c (A/ms
x 1.8
2000
400
Immunity
8
4.5
Commutation
Standard Triacs
T series Triacs
Signal conditioning
Operational amplifiers
ST is a reliable high-volume supplier of both standard and high-performance op amps (www.st.com/opamps):
• Complete 5 V and 16 V CMOS portfolio
including precision and wide bandwidth op
amps
GBP
5 MHz
TSV629x
• Space-saving packages, such as DFN,
QFN, SOT-23 and SC-70
Our JFET, bipolar, CMOS and BiCMOS
technologies allow our products to support:
1 MHz
• Wide supply range, from 1.5 V to 36 V
• High ratios of performance-to-power
consumption
100 kHz
TS94x
TSU10x
TSV7 – TSZ12x
TSX5 – TSX6 – TSX7
TSX9
LMX3
TSV85x
TSV52x
TSV73x
TSV63x
TSV62x
TSZ12x
TSV619x
TSX63x
TSV71x
TSV61x
TS93x
500 nA 1 µA 10 µA
VCC 5.5 V Low Vio
Op-amp series
TSV5 – TSV6
TSV8 – TSV9
TSV639x
100 µA
VCC 5.5 V
Main features
Micropower, high merit factor, and wideband 5 V CMOS rail-to-rail
High precision
Micropower 5 V CMOS
Micropower, high merit factor, wideband and precision 16 V CMOS rail-to-rail
Excellent power/bandwidth ratio
LMV82x
LMV3
TS91x
200 µA
VCC 10 V
LMV3..L
TSX56x
Icc
VCC 16 V
Applications
Sensor signal conditioning
Battery-operated devices
Sensor signal conditioning
Handheld equipment
Power applications (12 V, 15 V, +/-5 V)
AFE for high-voltage sensors
51
Comparators
ST is a leading supplier of comparators, and our portfolio offers:
• High-speed comparators, with response
Response time
times as fast as 8 ns
TS881
• Micropower comparators with operating
currents as low as 210 nA
1 µs
• High-temperature (150 °C) qualified
TS7211
TS7221
TS86x
devices
• Guaranteed specified min/max electrical
500 ns
performances
LM2901/2903
TS391
LM393/339
TS339/393
TS3702/3704
100 ns
TS372/374
TS331/332/334
10 ns
1.0 µA 10 µA
VCC 5 V
Comparators Highlight
LMV331/393/339
TS3021/3022
50 µA
VCC 10 V
100 µA
VCC 16 V
Main features
Nanopower
Very low voltage
Nano-second response time
High efficiency
TS881
TS3011
TS3011
500 µA
VCC 36 V
Icc
Applications
Gas, CO detectors
Battery-operated security systems
Optical modules
High-frequency systems
High-side current sensing (TSC series)
Accurate sensing of currents is central to enhancing application safety. Controlling the current within set boundaries avoids overheating and
short circuits. Current measurement is also an essential part of energy metering.
The main features of our growing high-side current-sense amplifier portfolio are:
• Up to 70 V line monitoring
• Robust devices that do not require external
• Integrated solutions (for example, inclusion of EMI filtering on output) for faster design times
and a reduced BOM
protection
• Automotive-grade qualified current-sense
amplifiers
Battery or power
source
Rsense
Vp
Vsense
Highlight: TSC103
Iload
• Common-mode voltage:
2.9 to 70 V
Load
Vm
• Optional dual-supply configuration
5V
Vcc
to reach -2.1 V to 65 V
common-mode range
Vreg
• Rugged input pin sustain
Out
• Pin-selectable gain: 20 V/V, 25 V/V,
ADC
GND
50 V/V, 100 V/V
GND
TSCxxx
Vout
Order code
-16 to +75 V and 2.5 kV ESD
Vcc
• Low current consumption: 360 µA
Microcontroller
Description
Documentation
STEVAL-ISQ007V1
High-side current-sense amplifier demonstration board based on TSC101
AN2727
STEVAL-ISQ013V1
Low-side current sensing based on TS507
AN3222
© STMicroelectronics - February 2014 - Printed in United Kingdom - All rights reserved
The STMicroelectronics corporate logo is a registered trademark of the STMicroelectronics group of companies
All other names are the property of their respective owners
Order code: BRFACTORY0214
For more information on ST products and solutions, visit www.st.com
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