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Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Omni 10
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes
Quantity of items included
in product
1 Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
With a surface greater than 10 sq cm
Main PCB
All types including standard alkaline and lithium coin or button style batteries Main Battery
1
Mercury-containing components 0
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height
External electrical cables and cords
For example, mercury in lamps, display backlights, scanner lamps, switches, batteries
Includes background illuminated displays with gas discharge lamps 10.1" panel
1
0
0
0
0
0
0
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing refractory ceramic fibers
Include the cartridges, print heads, tubes, vent chambers, and service stations.
0
0
0
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Screwdriver
Spade Bar
Description #3
Description #4
Description #5
#1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove back cover
2. Peel off acid tape*3
3. Pull out Camera FPC (Rear and Front camera)
4. Pull out antenna cable connectors*2
5. Pull out FFC*3(Audio, TS, Vol)
6. Pull out Micro SIM/SD FPC
7. Pull out Battery cable
8. Dis-fasten Battery screw*10
9. Remove Battery
10. Dis-fasten power board screw*1
11. Disassemble Vol board
12. Disassemble sensor board and Rear camera
13. Dis-fasten front camera brkt screw*1
14. Remove front camera
15. Dis-fasten audio brkt scrwe*2
16. Remove Audio board
17. Dis-fasten left speaker scrwe*2
18. Pull out wire cable connector (left speaker)
19. Remove left speaker
20. Pull out wire cable connector (Vibrator cable)
21. Remove vibrator cable
22. Dis-fasten Micro SIM/SD board screw*2
23. Remove Micro SIM/SD board
24. Pull out wire cable connector (right speaker)
25. Dis-fasten right speaker scrwe*2
26. Remove right speaker
27. Pull out LVDS connector*2
28. Remove LVDS FPC
29. Dis-fasten Main board scrwe*3
30. Remove Main board.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Total part disassembly
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.22 Remove back cover
3.23 Remove Battery
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.24 Remove Main board
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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