2012 RECOMMENDED 2011 RECOMMENDED Electronics Assembly Materials

2012 RECOMMENDED 2011 RECOMMENDED Electronics Assembly Materials
2011RECOMMENDED
RECOMMENDED
2012
ElectronicsAssembly
Assembly Materials
Materials
Electronics
Table of Contents
Table of Contents
2
Products
Pages
Solder Paste
Fluxes
Solder Wire
Bar Solder
Additional Flux Materials
TSF Products
Other products
Helpful Information
3-7
8-11
12-13
14-15
16
17
18
19
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Coming Soon: NXG3 & NXG5 Zero Halogen Solder Pastes
Formula
NXG3
Application
No-Clean Stencil Printing
Alloy
Product
Characteristics
Sn96.5Ag3.0Cu0.5
Zero halogen, lead-free, no-clean solder paste. NXG3
is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically
as bright as SnPb joints. Designed to be reflowable in
air as well as nitrogen.
Residue Characteristics
Light colored
Typical Metal Percentage and mesh size
88.5%, -325/+500 (Type 3)
Compliant Specifications
IPC/J-STD-004B Flux Designator ROL0
Suggested Packaging Style
500g jar or 600g cartridges
Formula
NXG5
Application
No-Clean Stencil Printing
Alloy
Product
Characteristics
Sn96.5Ag3.0Cu0.5
Zero halogen, lead-free, no-clean solder paste. NXG5
is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically
as bright as SnPb joints. Prints down to 01005 pad sites
for nitrogen reflow. Larger pad sizes reflowable in air
as well as nitrogen. ICT-friendly
Residue Characteristics
Light colored
Typical Metal Percentage and mesh size
88.5%, -400/+500 (Type 4)
Compliant Specifications
IPC/J-STD-004B Flux Designator ROL0
Suggested Packaging Style
500g jar or 600g cartridges
WWW.Kester.com | 800 253 7837 |
3
see Page 4 for details
Formula
Application
Alloy
NXG3
Kester Lead-Free, Halogen-Free
Product
Characteristics
Residue Characteristics
Typical Metal Percentage and mesh size
Compliant Specifications
Suggested Packaging Style
NXG33
No-Clean Stencil Printing
No-Clean Stencil Printing
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Designed to exceed customers' expectations for high yield le
Formula
NXG33
Zero halogen, lead-free, no-clean solder paste. NXG3 is engineered for
manufacturing. NXG33 is engineered for the high thermal de
the high thermal demands of assembling with lead-free alloys. Joints are of assembling with lead-free alloys. Joints are cosmetically b
No-Clean
Stencil
cosmetically brightApplication
as SnPb joints. Prints down to 01005 pad sites.
SnPb joints.
PrintsPrinting
down to 01005 pad sites. Designed to be
Designed to be reflowable
able
in air as well as nitrogen. Post soldering, the NXG33 off
Alloy in air as well as nitrogen.
Sn96.5Ag3.0Cu0.5
mized defects, including head-in-pillow and QFN/BGA voidin
Product
Designed to exceed customers’ expectations for high yield lead-free
Characteristics
manufacturing. NXG33 is engineered for the high thermal demands
Light colored
Light colored
of assembling with lead-free alloys. Joints are cosmetically as bright
as SnPb joints. Prints down
to 01005
pad sites.
to be reflow88.5%, -400/+500 (Type 4)
88.5%,
-400/+500
(TypeDesigned
4)
able in air as well as nitrogen. Post soldering, the NXG33 offers
minimized defects, including
head-in-pillow
and QFN/BGA voiding.
Telcordia Issue 1 GR-78-CORE
Telcordia
Issue 1 GR-78-CORE
IPC/J-STD-004B Flux
Designator
ROL0
IPC/J-STD-004B
Flux
Designator ROL0
Residue Characteristics
Light colored
Typicalcartridges
Metal Percentage and
500g jar; 600 or1400g
mesh size
88.5%, -400/+500 (Type
500g4)jar; 600 or1400g cartridges
Compliant Specifications
IPC/J-STD-004B Flux Designator ROL0
Suggested Packaging Style
500g jar or 600g cartridges
STANDARD SOLDER PASTE REFLOW PROFILE
STANDARD
SOLDERPASTE
PASTE REFLOW
PROFILE
FOR KESTER
CONTAINING
FOR KESTER PASTE CONTAINING
ALLOYS: Sn96.5Ag3.0Cu0.5
or Sn96.5Ag3.5
ALLOY: Sn96.5Ag3.0Cu0.5
Stage 1- Preheat Zone
(Rapid Heating Stage)
The purpose of this zone is to quickly bring the
Stage 1- Preheat Zone
assembly up to a temperature where solder pa
(Rapid Heating Stage)
can become highly chemically active.
The purpose of this zone is to quickly bring the
assembly up to a temperature where solder paste
Stagechemically
2- Soak active.
Zone
can become highly
(Temperature Equalization Stage)
TheZone
purpose of this stage is for the thermal ma
Stage 2- Soak
theEqualization
assembly to reach
(Temperature
Stage)a uniform temperature
so that
a verymass
small differentia
The purpose ofplateau
this stage
is forthere
the isthermal
between
theahottest
coldest soldering locat
of the assembly
to reach
uniformand
temperature
plateau so thatonthere
is a very small differential
the assembly.
between the hottest and coldest soldering locations on the assembly.
Stage 3- Reflow Zone
(Rapid Heating and Cooling)
Stage 3- Reflow
Zone of this stage is to rapidly heat the
The purpose
(Rapid Heating
and
assemblyCooling)
above the melting (liquidus) tempera
The purpose of this stage is to rapidly heat the asof the solder and subsequently cool the assemb
sembly above the melting (liquidus) temperature
down quickly to solidify the solder. Wetting of
of the solder and subsequently cool the assembly
onto teh substrate and component metalization
down quickly to solidify the solder. Wetting of
in theand
reflow
zone. metalsolder onto theoccurs
substrate
component
izations occurs in the reflow zone.
4
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Kester Lead-Free
Formula
Kester Lead-Free
NXG1
Application
EnviroMark™ 907
No-Clean Stencil Printing
Alloy
Formula
Sn96.5Ag3.0Cu0.5
No-Clean Stencil Printing
NXG1
Sn96.5Ag3.0Cu0.5
Product
Characteristics
Designed to exceed customers’ expectations for high yield
lead-free manufacturing. NXG1 is engineered for the high
thermal demands of assembling with lead-free alloys. Joints
are cosmetically as bright as SnPb joints. Prints down to 0201
pad sites. Designed to be reflowable in air as well as nitrogen.
EM907 is a first generation solder paste engineered for the high
thermal demands of assembling with lead-free alloys. Joints are
cosmetically as bright as SnPb joints. Prints down to 0201 pad
sites. Designed to be reflowable in air as well as nitrogen.
Residue Characteristics
Light colored
Light colored
Typical Metal Percentage
88.5%, -325/+500 (Type 3)
88.5%, -325/+500 (Type 3)
Compliant Specifications
Telcordia Issue 1 GR-78-CORE
IPC/J-STD-004B Flux Designator ROL1
Telcordia Issue 1 GR-78-CORE
IPC/J-STD-004B Flux Designator ROL0
Suggested Packaging Style
500g jar or 600g cartridges
500g jar; 600 or 750g DEK cartridges
Formula
EnviroMark™ 828
Application
Formula
Water-Soluble Stencil Printing
Alloy
EnviroMark™ 828
Sn96.5Ag3.0Cu0.5
Product
Characteristics
Kester EM828 provides excellent printability, activity, cleanability
and low-voiding behavior. EM828 is very robust and can tolerate a
wide variety of printing and reflow conditions. EM828 is a “state of
the art” water-soluble lead-free paste that combines superior activity, cleanability and low-voiding.
Residue Characteristics
Cleanable in warm water
Typical Metal Percentage
89.5%, -325/+500 (Type 3)
Compliant Specifications
IPC/J-STD-004B Flux Designator ORH1
Suggested Packaging Style
500g jar; 600 or 1400g cartridges
Kester Part # Description
Alloy
Packaging
7032130810
NXG1 No-Clean, Type 3, 88.5% metalsl
Sn96.5Ag3.0Cu0.5
500g jar
7032130811
NXG1 No-Clean, Type 3, 88.5% metalsl
Sn96.5Ag3.0Cu0.5
600g cartridge
7006050810
EM907 No-Clean, Type 3, 88.5% metal
Sn96.5Ag3.0Cu0.5
500g jar
7006050811
EM907 No-Clean, Type 3, 88.5% metal
Sn96.5Ag3.0Cu0.5
600g cartridge
7006050819
EM907 No-Clean, Type 3, 88.5% metal
Sn96.5Ag3.0Cu0.5
750g DEK
cartridge
7004030824
EM828 Water-Soluble, Type 3, 89.5% metal
Sn96.5Ag3.0Cu0.5
700g DEK
Cartridge
7004030810
EM828 Water-Soluble, Type 3, 89.5% metal
Sn96.5Ag3.0Cu0.5
500g jar
7004030811
EM828 Water-Soluble, Type 3, 89.5% metal
Sn96.5Ag3.0Cu0.5
600g cartridge
7035050910
NXG-33 Type 4, 88.5% metal
Sn96.5Ag3.0Cu0.5
500g jar
7035050911
NXG-33 Type 4, 88.5% metal
Sn96.5Ag3.0Cu0.5
600g cartridge
WWW.Kester.com | 800 253 7837 |
5
Solder Paste for Tin-lead
No-Clean
Water-Soluble
Solder Paste for Stencil Printing Applications
Formula Type
Alloy
Product
Characteristics
Residue
Removal
Easy
Profile®
Sn63Pb37
Easy Profile® 256
256HA
Sn62Pb36Ag2
Sn63Pb37
High activity no-clean paste specifically
engineered to provide excellent
solderability to lead free component
and board finishes.
Consistent print volume regardless of
process parameters and 0201 application
capable. Wide reflow process window.
Compatible with enclosed print
head systems.
Sn62Pb36Ag2
Standard no-clean paste for a wide
variety of reflow profiles and printing
conditions. Industry standard formula
that performs well in a variety of
applications. Compatible with enclosed
print head systems.
HydroMark 531
Sn63Pb37
R562
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
This highly-active, anti-slump paste is
produced consistently so that every batch Designed for maximum environmental
results in high yield manufacturing.
robustness and minimal void production,
HydroMark 531 also offers extremely
R562 has a stencil life of over 8 hours
robust printing, even with idle time up to
and may be used in a wide range
1 hour and print speeds of up to 6 in/sec.
of humidities (10 - 85% RH).
This very active formula is effective on a
Compatible with enclosed print
wide variety of metallizations, including
head systems.
palladium. Compatible with enclosed print
head systems.
Not normally required.
Not normally required.
Use de-ionized or soft tap water at
120-140°
Use de-ionized or soft tap water at
120-140°
Compliant
Specifications
Telcordia Issue 1 GR-78-CORE,
IPC/J-STD-004B
Classification ROL0
Telcordia Issue 1 GR-78-CORE,
IPC/J-STD-004B
Classification ROL0
IPC/J-STD-004B
Classification ORM0
IPC/J-STD-004B
Classification ORM0
Powder Mesh Size
-325/+500 (Type 3)
-325/+500 (Type 3)
-325/+500 (Type 3)
-325/+500 (Type 3)
Metal %
90%
90%
90%
90%
Suggested
Packaging Style
500g jar,
600 or 750g DEK cartridges
500g jar, 600g, 1400g or
750g DEK cartridges
500g jar,
600g cartridges
500g jar, 600g, 1400g or
750g DEK cartridges
Solder Paste for Syringe Dispensing Applications
Formula Type
R276
R500
Alloy
Sn63Pb37
Sn63Pb37
Product
Characteristics
Provides optimal performance in all types of dispensing applications. R276 is packaged void-free to ensure consistent dispensing in high speed automated processes.
Exhibits excellent dispensing characteristics with a wide range of needle diameters.
The activator package in this formula is aggressive enough to remove tenacious oxide
layers or solder to OSP coated boards. R500 delivers excellent wetting characteristics.
Residue Removal
Not normally required.
Use de-ionized or soft tap water at 49-60°C (120-140°F).
Compliant
Specifications
Telcordia Issue 1 GR-78-CORE,
IPC/J-STD-004B Classification ROL0
IPC/J-STD-004B
Classification ORM0
Powder Mesh Size
-325/+500 (Type 3)
-325/+500 (Type 3)
Metal %
87%
86%
Suggested
Packaging Style
35g and 100g syringes
35g syringes
*For lead based products, Kester produces solder powder in compliance
to J-STD-006B for alloy purity and particle size distribution.
6
| 800 253 7837 | WWW.kester.com
Solder Paste for Tin-leadDescription
Kester Part #
7002020510
Kester Part #
7002020310
7002020510
7002020511
7002020310
7002020311
Easy Profile® 256HA No-Clean, Type 3, 90% metal
Description
Easy Profile® 256HA® No-Clean, Type 3, 90% metal
Easy Profile 256HA No-Clean, Type 3, 90% metal
Easy Profile® 256HA® No-Clean, Type 3, 90% metal
Easy Profile 256HA No-Clean, Type 3, 90% metal
Easy Profile® 256HA® No-Clean, Type 3, 90% metal
7001020510 7002020311
7001020310 7002020519
7001020511
7001020510
7001020311
256HA No-Clean,
90% metal
Easy®Profile
Easy Profile
256 No-Clean,
Type 3,Type
90%3, metal
®
256HA No-Clean,
90% metal
Easy®Profile
256 No-Clean,
Type 3,Type
90%3, metal
Easy Profile
Type 3, 90% metal
Easy Profile® 256 No-Clean,
Easy Profile® 256 No-Clean, Type 3, 90% metal
Type 3, 90% metal
Easy Profile® 256 No-Clean,
®
7002020511
7001020310
7010020510 7001020511
7010020310 7001020311
7010020511 7001020518
7010020311
7010020510
Easy Profile 256HA No-Clean, Type 3, 90% metal
®
Easy Profile 256 No-Clean, Type 3, 90% metal
No-Clean,
3, 90%metal
metal
HydroMarkEasy
531Profile
Water 256
Soluble,
TypeType
3, 90%
®
No-Clean,
3, 90%metal
metal
HydroMarkEasy
531Profile
Water 256
Soluble,
TypeType
3, 90%
®
No-Clean,
3, 90%metal
metal
HydroMarkEasy
531Profile
Water 256
Soluble,
TypeType
3, 90%
HydroMark 531 Water Soluble, Type 3, 90% metal
®
HydroMark 531 Water Soluble, Type 3, 90% metal
7021020510 7010020310
7021020310 7010020511
7021020511 7010020311
7021020311
531 Water
Typemetal
3, 90% metal
R562HydroMark
Water Soluble,
TypeSoluble,
3, 90%
531 Water
Typemetal
3, 90% metal
R562HydroMark
Water Soluble,
TypeSoluble,
3, 90%
R562HydroMark
Water Soluble,
TypeSoluble,
3, 90%
531 Water
Typemetal
3, 90% metal
R562 Water Soluble, Type 3, 90% metal
7016070520 7021020310
7016070504 7021020511
7017080520 7021020311
7017080504 7021020519
R562 WaterType
Soluble,
Type 3,metal
90% metal
R276 No-Clean,
3, 87%
R562 WaterType
Soluble,
Type 3,metal
90% metal
R276 No-Clean,
3, 87%
R562Soluble,
Water Soluble,
3, 90%
metal
R500 Water
Type 3,Type
86%
metal
R500 Water
Type 3,Type
86%
metal
R562Soluble,
Water Soluble,
3, 90%
metal
7021020510
R562 Water Soluble, Type 3, 90% metal
Alloy
Sn63Pb37
Alloy
Sn62Pb36Ag2
Sn63Pb37
Sn63Pb37
Sn62Pb36Ag2
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn63Pb37
Sn62Pb36Ag2
Sn62Pb36Ag2
Packaging
500g jar
Packaging
500g jar
500g jar
600g cartridge
500g jar
600g cartridge
600g cartridge
600g cartridge
500g jar
750g DEK cartridge
500g jar
600g cartridge
600g cartridge
500g jar
500g jar
Sn63Pb37
Sn63Pb37
600g cartridge
500g jar
Sn62Pb36Ag2
Sn62Pb36Ag2
600g cartridge
500g jar
Sn63Pb37
Sn63Pb37
750g DEK 600g
cartridge
cartridge
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
Sn62Pb36Ag2
Sn63Pb37
600g cartridge
500g jar
500g jar 500g jar
600g cartridge
500g jar
600g cartridge
600g cartridge
600g cartridge
500g jar
Sn62Pb36Ag2
Sn63Pb37
500g jar
35g syringe
Sn63Pb37
Sn63Pb37
600g cartridge
100g syringe
Sn62Pb36Ag2
Sn63Pb37
600g cartridge
35g syringe
Sn63Pb37
Sn63Pb37
100g syringe
750g DEK cartridge
7016070520
R276 No-Clean, Type 3, 87% metal
Sn63Pb37
35g syringe
7016070504
R276 No-Clean, Type 3, 87% metal
Sn63Pb37
100g syringe
7017080520
R500 Water Soluble, Type 3, 86% metal
Sn63Pb37
35g syringe
WWW.Kester.com | 800 253 7837 |
7
Fluxes for Lead-Free
Lead-free wave and selective soldering systems require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead.
Kester liquid fluxes for lead-free assembly have new activator packages to enable rapid
wetting and hole-filling, ensuring reliable product output.
*Formula
985M
959T
2220-VF VOC-Free
2235
No-Clean
No-Clean
Water-Soluble
Water-Soluble
Application
Spray or Wave Fluxer
Spray or Foam
Spray, Wave or Foam
Spray or Foam
Halide Content %
Halide - Free
Halide - Free
1.6
1.6
Specific Gravity
0.805
0.794
1.060
0.856
Solids %
3.6
2.9
7
11
Compliant
IPC/J-STD-004B
IPC/J-STD-004B
IPC/J-STD-004B
IPC/J-STD-004B
Flux Designator ROL0 Flux Designator ORL0 Flux Designator ORH1 Flux Designator ORH1
Kester Part #
Description
Packaging
63-0004-0985
985M No-Clean
1 gallon
64-0004-0985
985M No-Clean
5 gallon
65-0004-0985
985M No-Clean
53 gallon drum
63-0020-0959
959T No-Clean
1 gallon
64-0020-0959
959T No-Clean
5 gallon
65-0020-0959
959T No-Clean
53 gallon drum
63-0056-2220
2220-VF VOC-Free Water-Soluble
1 gallon
64-0056-2220
2220-VF VOC-Free Water-Soluble
5 gallon
65-0056-2220
2220-VF VOC-Free Water-Soluble
53 gallon drum
63-0000-2235
2235 Water-Soluble
1 gallon
64-0000-2235
2235 Water-Soluble
5 gallon
65-0000-2235
2235 Water-Soluble
53 gallon drum
*These products are designed specifically for high performance lead-free applications.
8
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No-Clean Fluxes
No-Clean Fluxes
Alcohol Based
VOC-Free
Formula
985M
959T
951
979
977
Flux Type
Low Solids
No-Clean
Low Solids
No-Clean
Rosin-Free
Low Solids, No Clean
VOC-Free
No-Clean
VOC-Free
No-Clean
Percent Solids
3.6
2.9
2.0
4.2
3.25
VOCs (g/liter)
776
770
792
0
0
Specific Gravity
0.805
0.794
0.814
1.015
1.012
Designed for the wave
soldering applications
and gives excellent
hole fill on thick board
assemblies.
Designed for the
wave soldering of
conventional and SMT
board assemblies.
Developed to minimize
the formation of microsolderballs.
Very low solids,
rosin free, foam
and spray application
flux. Practically
no residue after the
soldering process.
Developed to reduce bottomside
micro-solder balling and bridging
on glossy laminates and between
connector pins. Designed as a spray
flux, 979’s activation system provides excellent wetting producing
complete and consistent hole-fill.
Developed to reduce bottomside
micro-solder balling and bridging.
The wetting system is designed to allow for a larger process window and
can survive the longer dwell times
in extremely turbulent chip waves.
Designed for spray applications.
Compliant
Specifications
Telcordia Issue 1
GR-78-CORE &
IPC/J-STD-004B Flux
designator ROL0
Telcordia Issue 1
GR-78-CORE &
IPC/J-STD-004B Flux
designator ORL0
Telcordia Issue 1
GR-78-CORE &
IPC/J-STD-004B Flux
designator ORL0
Telcordia Issue 1
GR-78-CORE &
IPC/J-STD-004B
Flux designator ORL0
Telcordia Issue 1
GR-78-CORE &
IPC/J-STD-004B
Flux designator ORL0
Residue
Removal
(not normally
required)
Wash with Kester’s
#5768 Bio-Kleen®
saponifier at 2%
concentration.
Wash with Kester’s
#5768 Bio-Kleen®
saponifier at 2%
concentration.
Wash with Kester’s
#5768 Bio-Kleen®
saponifier at 2%
concentration.
Wash with hot de-ionized water
at 49-60°C (140-160°F) or use
1% solution of Kester’s #5768
Bio-Kleen®
Wash with hot de-ionized water
at 49-60°C (140-160°F) or use
1% solution of Kester’s #5768
Bio-Kleen®
Thinner
4662
4662
110
De-ionized Water
De-ionized Water
Flux Test Kit
PS-20
PS-22
PS-22
PS-20
PS-20
Product
Characteristics
Kester Part #
Description
Packaging
63-0000-0951
951 No-Clean
1 gallon
64-0000-0951
951 No-Clean
5 gallon
65-0000-0951
951 No-Clean
53 gallon drum
63-0004-0985
985M No-Clean
1 gallon
64-0004-0985
985M No-Clean
5 gallon
65-0020-0959
985M No-Clean
53 gallon drum
63-0020-0959
959T No-Clean
1 gallon
64-0020-0959
959T No-Clean
5 gallon
65-0020-0959
959T No-Clean
53 gallon drum
63-0000-0977
977 VOC - Free No Clean
1 gallon
64-0000-0977
977 VOC - Free No Clean
5 gallon
65-0000-0977
977 VOC - Free No Clean
53 gallon drum
63-0000-0979
979 VOC - Free No Clean
1 gallon
64-0000-0979
979 VOC - Free No Clean
5 gallon
65-0000-0979
979 VOC - Free No Clean
53 gallon drum
WWW.Kester.com | 800 253 7837 |
9
Water-Soluble Fluxes
Water-Soluble Fluxes
10
Formula
2331-ZX
2235
2120
Flux Type
Neutral pH Organic Water-Soluble
Organic Water-Soluble
Organic Water-Soluble
Percent Solids
33
11
24
VOCs (g/liter)
729
763
670
Specific Gravity
0.899 ± 0.005
0.856 ± 0.005
0.862 ± 0.005
Percent Halides
2.2
1.5
Halide-Free
Product
Characteristics
Original pH neutral organic flux
for automated wave and drag
soldering processes.
Highly active flux for surface mount
assemblies designed to help reduce
skips on bottom side surface
mount pads.
Highly active, organic flux designed for automated
wave soldering applications. This halide-free formula
produces bright, shiny joints and high ionic cleanliness after water cleaning
Compliant
Specifications
IPC/J-STD-004
Flux designator ORH1
IPC/J-STD-004
Flux designator ORH1
IPC/J-STD-004
Flux designator ORH0
Residue Removal
Residue removal is required. Use soft
or de-ionized water at temperatures of
49-66°C (120-150°F).
Residue removal is required. Use soft
or de-ionized water at temperatures of
49-66°C (120-150°F).
Residue removal is required. Use soft or
de-ionized water at temperatures of 49-66°C (120150°F).
Thinner
4662
4662
4662
Kester Part #
63-0097-2331
64-0097-2331
65-0097-2331
Description
2331-ZX Water-Soluble
2331-ZX Water-Soluble
2331-ZX Water-Soluble
Packaging
1 gallon
5 gallon
53 gallon drum
63-0000-2235
64-0000-2235
65-0000-2235
2235 Water-Soluble
2235 Water-Soluble
2235 Water-Soluble
1 gallon
5 gallon
53 gallon drum
63-0000-2120
65-0000-2120
2120 Water-Soluble
2120 Water-Soluble
1 gallon
53 gallon drum
| 800 253 7837 | WWW.kester.com
Rosin Based Fluxes
Rosin Fluxes
Formula
186
1544
Flux Type
Rosin Mildly Activated
(RMA)
Activated Rosin
(RA)
Percent Solids
36
50
Specific Gravity
0.879 ± 0.005
Rosin Based Fluxes
186
Formula
Percent Halides
Flux Type
Rosin Mildly Activated (RMA)
Percent Solids
Specific Gravity
Percent Halides
Product
Characteristics
Compliant
Specifications
Residue Removal
0.929 ± 0.005
1544
0.02
Activated Rosin (RA)
0.44
Kester's active, Non-corrosive rosin type
Product 36 Designed for high thermal stability and 50
flux. Used on surfaces that are more
Characteristics
0.879 ± 0.005 superior solderability.
0.928 ± 0.005 difficult to solder.
0.02
0.44
superior solderability.
flux. Used on surfaces that are more
Compliant
IPC/J-STD-004
IPC/J-STD-004
Designed
for high thermal stability
Kester’s
rosindesignator
type ROM1
Specifications
Fluxand
designator
ROL0 active, Non-corrosiveFlux
Residue is non-corrosive, but may be
difficultResidue
to solder.
is non-corrosive, but may be removed
removed with solvent or with Kester’s
®
with
solvent
®
IPC/J-STD-004
IPC/J-STD-004 or with Kester’s 5768 Bio-Kleen
Residue Removal
5768 Bio-Kleen saponifier at 7-10%
saponifier
at 7-10% solution in de-ionized or
Flux designatorsolution
ROL0 in de-ionized or soft water
Fluxatdesignator
ROM1
soft water at temperatures of 49-60°C
temperatures
(120Residue is non-corrosive, but
may be of 49-60°C
Residue
is non-corrosive, but may(120-140°)F.
be
removed with solvent or with Kester’s 5768 removed with solvent or with Kester’s 5768
Thinner
120
104
Bio-Kleen® saponifier at
Bio-Kleen® saponifier at
7-10% solution in de-ionized or
7-10% solution in de-ionized or
soft water at temperatures of
soft water at temperatures of
49-60°C (120-140°F).
49-60°C (120-140°F).
Thinner
120
104
Kester Part #
Description
Packa
63-0000-0186
186 RMA
1 gal
64-0000-0186
Packaging
186 RMA
5 gal
186 RMA
65-0000-0186
1 gallon
186 RMA
53 gallon
64-0000-0186
186 RMA
5 gallon
63-0000-1544
1544 RA
1 gal
65-0000-0186
186 RMA
64-0000-1544
53 gallon drum
1544 RA
5 gal
65-0000-1544
1544 RA
53 gallon
Kester Part #
Description
63-0000-0186
63-0000-1544
1544 RA
1 gallon
64-0000-1544
1544 RA
5 gallon
65-0000-1544
1544 RA
53 gallon drum
Kester Flux-Pen®
Kester Flux-Pen®
®
Kester Flux-Pen
is a unique
tool for rework
andIttouch-up
soldering. It allows
The Kester Flux-Pen® isThea unique
tool for rework
and touch-up
soldering.
allows controlled
controlled application of flux, eliminating the mess from flux bottles. Flux-Pens
application of flux, eliminating the mess from flux bottles. Flux-Pens are ideally suited for
ideally suited for typical hand-soldering applications. The five available
typical hand-soldering are
applications.
The five available formulas are listed below.
formulas are listed below.
Kester Part #
Description
Kester Part #985M Low Solids No-Clean (20
Description
pens/carton)
83-1004-0985
83-1004-0985951 Low985M
Solids No-Clean
(20 pens/carton)
SolidsLow
No-Clean
(20 pens/carton)
83-1000-0951
83-1000-0951 186-18951
Solids No-Clean
(20 pens/carton)
RMALowNo-Clean
(20 pens/carton)
83-1018-0186
83-1018-0186
186-18 RMA No-Clean (20 pens/carton)
83-1000-0186
186 RMA No-Clean (20 pens/carton)
83-1097-2331
2331-ZX Neutral pH Water-Soluble (20 pens/carton)
83-1020-0959
959T Low Solids ®No-Clean (20 pens/carton)
83-1046-0952
952 D6 Low Solids No-Clean (20 pens/carton)
83-1000-0186
186 RMA No-Clean (20 pens/carton)
83-1097-2331
2331-ZX Neutral pH Water-Soluble (20pens/carton)
53-0000-0225
Flux-Pen Replacement Tips (25 tips/bag)
WWW.Kester.com | 800 253 7837 |
11
1
STD-004
OL0
Kester Lead-Free
Kester Lead-Free
Solder Wires for Lead-Free Assembly
Formula
48
Flux Content
Activated
Rosin
Availability
No-Clean
Activated Rosin
Water-Soluble
<0.05%
1.0%
1.25%
See
Below
66 core
(3.3%)
66 core
(3.3%)
Water-Soluble
1.0%
Compliant
Specifications
66 core
1.25%Telcordia Issue 1
IPC/J-STD-004 IPC/J-STD-004
GR-78-CORE
7
IPC/J-STD-004
Flux
Designator Flux designator
66 core
(3.3%)
Flux Designator ROLO
ROM1
ORH1
(3.3%)
IPC/J-STD-004
Flux Designator ROM1
IPC/J-STD-004
Flux designator ORH1
“275” No-Clean Core 1 lb. with K100LD
Part #
Alloy
Diameter
24-9574-7609
K100LD
.015
K100LD
.020
66
K100LD
.025
24-7068-7603
66
Sn96.5Ag3.0Cu0.5
66
K100LD
24-7068-7617
.031
Sn96.5Ag3.0Cu0.5
66
66
K100LD
24-7068-7601
.050
66
.062
66
Sn96.5Ag3.0Cu0.5
24-9574-7610
Diameter
24-9574-7619
.020
LD
.025
24-9574-7618
LD
24-9574-7613
LD
331
331
LD
LD
48
Halide Percentage
an Core 1 lb. with K100LD
y
275
.031
.050
24-9574-7615
.062
Core Size
66
66
K100LD
Part #
24-7068-7606
24-7068-7607
Core Size
66
“275” No-Clean Core 1 lb. with SAC305
66
Alloy
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Diameter
Core Size
“275” No-Clean
58Alloy
Diameter
Core Size
24-7068-7608
Sn96.5Ag3.0Cu0.5
.015
58
24-7068-7603
.050
Sn96.5Ag3.0Cu0.5
58
.020
58
.062
24-7068-7617
58
Sn96.5Ag3.0Cu0.5
.025
58
24-7068-7601
Sn96.5Ag3.0Cu0.5
.031
58
24-7068-7606
Sn96.5Ag3.0Cu0.5
.050
58
Diameter
24-7068-7607
Core Size
Sn96.5Ag3.0Cu0.5
.062
58
.015
66
.025
.031
“48” Activated Rosin 1 lb. with K100LD
"48" Activated Rosin 1 lb. with SAC305
d Rosin 1 lb. with K100LD
Part #
Diameter
oy
Core Size Alloy
Diameter
Part #
Core SizeAlloy
0LD
.020
24-9574-1401
66
K100LD
24-7068-1401
.020
Sn96.5Ag3.0Cu0.5
66
0LD
.025
24-9574-1406
66
K100LD
24-7068-1406
.025
Sn96.5Ag3.0Cu0.5
66
.031
66
.050
24-7068-1400
66
Sn96.5Ag3.0Cu0.5
.062
66
0LD
0LD
0LD
.031
66
.050
66
24-9574-1402
24-9574-1404
.062
66
24-9574-1400
K100LD
K100LD
K100LD
luble Core 1 lb. with K100LD
“331” Water-Soluble
Diameter
Core Size
oy
0LD
.020
Part #
66
Alloy
0LD
.025
24-9574-6401
66
0LD
0LD
0LD
.031
24-9574-6417
.050
24-9574-6403
.062
66
66
24-7068-1402
24-7068-1404
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Alloy
.025
.031
.050“48”
66
Sn96.5Ag3.0Cu0.5
66
66
Activated
Rosin 1 lb. with SAC305
66
Part.062
#
66Alloy
Diameter
Core Size
24-7068-1407
Sn96.5Ag3.0Cu0.5
.015
66
Sn96.5Ag3.0Cu0.5
.020
66
Diameter
Core Size
.025
66
Sn96.5Ag3.0Cu0.5
24-7068-1402
.025
Sn96.5Ag3.0Cu0.5
66
.031
66
Sn96.5Ag3.0Cu0.5
24-7068-1404
.031
Sn96.5Ag3.0Cu0.5
66
.050
66
.050
24-7068-1400
66
Sn96.5Ag3.0Cu0.5
.062
66
K100LD
24-7068-6417
.020
K100LD
24-7068-6403
.025
24-7068-6409
66
Sn96.5Ag3.0Cu0.5
66
66
Sn96.5Ag3.0Cu0.5
24-9574-6409
K100LD
.050
66
24-9574-6411
K100LD
.062
66
| 800 253 7837 | WWW.kester.com
58
Sn96.5Ag3.0Cu0.5
CoreSn96.5Ag3.0Cu0.5
Size
.031
24-7068-6411
12
24-7068-7609
58
24-7068-1406
24-7068-6401
Diameter
K100LD
66
.020
“331” Water-Soluble Core 1 24-7068-1401
lb. with SAC305
Core 1 lb.Part
with
# K100LD
Core 1 lb. with SAC305
Part.020#
.020
.062
66
66
“331” Water-Soluble Core 1 lb. with SAC305
Part #
Alloy
Diameter
Core Size
24-7068-6422
Sn96.5Ag3.0Cu0.5
.015
66
24-7068-6401
Sn96.5Ag3.0Cu0.5
.020
66
24-7068-6417
Sn96.5Ag3.0Cu0.5
.025
66
24-7068-6403
Sn96.5Ag3.0Cu0.5
.031
66
24-7068-6409
Sn96.5Ag3.0Cu0.5
.050
66
24-7068-6411
Sn96.5Ag3.0Cu0.5
.062
66
"245" No-Clean
"275" No-Clean
"245" is a halide-free; rosin based no-clean core flux that
provides excellent wetting combined with optimal reliability
and cosmetics. "245" is compliant to Bellcore GR-78-CORE
and is classified as ROL0 per J-STD-004B.
"275" provides superior wetting performance leaving an
extremely clear post-soldering residue. "275" is designed
to be a low splattering core flux. "275" is classified as
ROL0 per J-STD-004B.
Solder Wire
“245” No-Clean Core 1 lb.
“245” No-Clean
“275” No-Clean Core 1 lb.
“245”Part
is a#halide-free;Alloy
rosin basedDiameter
no-clean core Core
fluxSize
that
Part #
Alloy
Diameter
Core Size
24-6337-7604
Sn63Pb37
.015
50
24-6337-7602
Sn63Pb37
.020
50
24-6337-7616
Sn63Pb37
.025
50
50
24-6337-7600
Sn63Pb37
.031
50
50
24-6337-7612
Sn63Pb37
.050
50
24-6337-7614
Sn63Pb37
.062
50
24-6337-8806
Sn63Pb37
50
provides
excellent wetting
combined .015
with optimal reliability
24-6337-8807
50
and
cosmetics. “245”Sn63Pb37
is compliant to.020
Bellcore
24-6337-8834
Sn63Pb37
.020
58
GR-78-CORE and is classified as ROL0 per J-STD-004B.
24-6337-8809
Sn63Pb37
.025
“245”Sn63Pb37
No-Clean Core
24-6337-8800
.031
24-6337-8801
Part #
Sn63Pb37
Alloy
1 lb.
.031
Diameter
24-6337-8802
Sn63Pb37 .031.015
24-6337-8806 Sn63Pb37
58 Size
Core
6650
24-6337-8813
Sn63Pb37
.040
50
24-6337-8814
Sn63Pb37
.050
50
.062
50
24-6337-8807
Sn63Pb37
Sn63Pb37
24-6337-8834 Sn63Pb37
24-6337-8817
.020
“275” No-Clean
“275” provides superior
wetting performance leaving an
Kester “44”®
extremely clear
post-soldering
residue. “275” is designed
Rosin “44”® is a high activity RA core flux designed for
to be a low splattering core flux. “275” is classified as
excellent instant wetting action, even on Nickel surfaces.
ROL0 per J-STD-004B.
Although “44”® is a RA-based material, the residues are
®
non-corrosive
if not cleaned.
Per Core
J-STD-004B,
“275”
No-Clean
1 lb. “44” is
classified as ROM1 flux.
Part #
Alloy
Diameter Core Size
50
.020
58
24-6337-8809
Sn63Pb37
24-6337-8800
Sn63Pb37
.031
50
24-6337-8801
Sn63Pb37
.031
58
.025
50
"331"
Water Soluble
Sn63Pb37
24-6337-8802
.031
66
"331" is a high-activity water-soluble core flux for soldering
.040 cleanability,
50
24-6337-8813
difficult
metals. "331" isSn63Pb37
designed for optimal
Sn63Pb37
.050
50
24-6337-8814
along
with minimal smoke
and odor. The
residues from
"331"
must
be
removed.
"331"
is
classified
as
ORH1
.062
50
24-6337-8817 Sn63Pb37
per J-STD-004B.
®
RA Core 1 lb.
Sn63Pb37
.015
24-6337-7604 “44”
Part #
Sn63Pb37
24-6337-7602
24-6337-0007
Sn63Pb37
Sn63Pb37
.031
24-6337-6411
Sn63Pb37
.062
“331” Water-Soluble
Core
Part #
Alloy
24-6337-6422
Sn63Pb37
24-6337-6401
"285"
RMA
Diameter Core Size
Sn63Pb37
.015
.020
66
66
.025 wetting
66
24-6337-6417
"285"
is an RMA basedSn63Pb37
core flux that provides
action
comparable
to
that
of
typical
RA
fluxes.
Although
.031
66
24-6337-6403 Sn63Pb37
"285" is an RMA-based material, the residues are nonSn63Pb37
.062 as ROL0
66
24-6337-6411
corrosive
if not cleaned.
"285" is categorized
per J-STD-004B.
“285” RMA
“285” is an RMA based
core
fluxCore
that1 provides
wetting ac“285”
RMA
lb.
tion comparable
to
that
of
typical
RA
fluxes.
Although”285”
Part #
Alloy
Diameter
Core Size
is24-6337-9703
an RMA-based material,
the residues
are non-corrosive
if
Sn63Pb37
.015
66
not
cleaned.
“285”
is
categorized
as
ROL0
per
J-STD-004B.
24-6337-9702
Sn63Pb37
.020
66
24-6337-9718“285”
Sn63Pb37
RMA
Core.0251 lb.
66
24-6337-9710
Sn63Pb37
.031
66
24-6337-9713
Sn63Pb37
.031
58
Part #
24-6337-9703
Alloy
Sn63Pb37
Diameter Core Size
.015
.015
66
.025
.031
66
50
Kester’s solid wire solder, without flux core,
is manufactured to strict quality control standards. Conforming to IPC/J-STD-006B
66
24-6337-0039
Sn63Pb37
.040
66
Sn63Pb37
.062
.050
50
50
66
24-6337-0061
Sn63Pb37
.062
66
Sn60Pb40
.020
66
24-6040-0061
Sn60Pb40
Rosin
“44”® is a highSn60Pb40
activity RA core.025
flux designed66for
24-6040-0018
excellent
instant
wetting
action,
even
on
24-6040-0027
Sn60Pb40
.031Nickel surfaces.
66
®
Although
“44”
is
a
RA-based
material,
are
24-6040-0039
Sn60Pb40
.040the residues 66
®
non-corrosive
if
not
cleaned.
Per
J-STD-004B,
“44”
24-6040-0053
Sn60Pb40
.050
66
is classified as ROM1 flux.
®
24-6040-0066 “44”
Sn60Pb40
RA
24-6337-0007
Part # solid wire solder,
Alloy without
Diameter
Kester's
flux core, is manufac24-6337-0010
tured using virginSn63Pb37
metals and strict.015
quality control stan14-6337-0015
24-6337-0018
dards. Conforming
to IPC/J-STD-006B
Sn63Pb37
.031
14-6337-0031
24-6337-0027
.062
14-6337-0062 Sn63Pb37
Solid Wire 5 lbs.
24-6337-0039
14-6337-0125
Part # Sn63Pb37 Alloy.125
Diameter
24-6337-0053
16-6337-0062Sn60Pb40 Sn63Pb37
.062
.062
14-6040-0062
16-6337-0125
Sn63Pb37
.125
24-6337-0061
Sn60Pb40
.125
14-6040-0125
16-6040-0062
Sn60Pb40
.062
24-6040-0010
Solid Wire 5 lbs.
.050
24-6040-0010
Kester
“44”®
Part #
Sn60Pb40
50
66
.031
KesterSolid
SolidWire
Wire1 lb.
16-6040-0125
.025
.020
50
Sn63Pb37
Sn63Pb37
24-6337-7614
24-6337-0053
Sn63Pb37
Kester Solid Wire
.020
24-6337-0027
24-6337-7612
66
1 lb. 66
Core Size
24-6337-0018
Sn63Pb37
Sn63Pb37
24-6337-7600
“331”Part
is a#high-activityAlloy
water-soluble
coreflux forCore Size
Diameter
soldering
difficult
metals.
“331”
is
designed
for optimal
24-6337-6422
Sn63Pb37
.015
66
cleanability,along with minimal smoke and odor.
24-6337-6401
Sn63Pb37
.020
66
The residues from”331” must be removed. “331” is
24-6337-6417
Sn63Pb37
.025
66
classified as ORH1per J-STD-004B.
50
Diameter
Sn63Pb37
24-6337-7616
24-6337-0010
Sn63Pb37
“331” Water
Soluble
“331”
Water-Soluble Core 1 lb.
24-6337-6403
Alloy
.125
.062
Core .093
1 lb.
Alloy
66
Diameter Core Size
Sn63Pb37Solid Wire
.0151 lb.
Part #
Sn63Pb37
66
Alloy
.020
66
Diameter
66
14-6337-0015
Sn63Pb37
Sn63Pb37
.025
.015
66
14-6337-0031
Sn63Pb37
Sn63Pb37
.031
.031
66
14-6337-0062
Sn63Pb37
Sn63Pb37
.040
.062
66
14-6337-0125
Sn63Pb37
Sn63Pb37
.050
.125
66
Sn63Pb37
14-6040-0062
.062
Sn60Pb40
66
.062
Sn60Pb40
.020
14-6040-0125
Sn60Pb40
66
.125
24-6040-0018
Sn60Pb40
.025
66
66
Part #
Alloy
Diameter
24-6040-0027
Sn60Pb40
.031
66
24-6337-9702
Sn63Pb37
.020
66
16-6337-0062
Sn63Pb37
.062
24-6040-0039
Sn60Pb40
.040
66
24-6337-9718
Sn63Pb37
.025
66
16-6337-0125
Sn63Pb37
.125
24-6040-0053
Sn60Pb40
.050
66
24-6337-9710
Sn63Pb37
.031
66
16-6040-0062
Sn60Pb40
.062
24-6040-0061
Sn60Pb40
.062
66
24-6337-9713
Sn63Pb37
.031
58
16-6040-0125
Sn60Pb40
.125
24-6040-0066
Sn60Pb40
.093
66
WWW.Kester.com | 800 253 7837 |
13
.
Ultrapure® K100LD Lead-Free Solder Bar
K100LD is a new patent-pending low-cost lead-free solder alloy for use in
wave soldering, selective soldering, and tip tinning operations. K100LD has
the Lowest Copper
Dissolution amongst all common solder alloys, including
®
Ultrapure
Lead-Free
Solder
Barprovides the
SN63, SAC305, K100LD
and other lead-free
options. Kester
K100LD
lowest
cost
for
wave
soldering
operations.
It
also
provides
solder
K100LD is a new patent-pending low-cost lead-free solder alloy for
use injoints
wavewith
soldering,
no
shrinkage
effects,
excellent
through-hole
penetration
and
topside
selective soldering, and tip tinning operations. K100LD has the Lowest Copperfillet,
Dissolution
and provides
a lowsolder
drossalloys,
rate. including SN63, SAC305, and other lead-free options.
amongst
all common
Kester K100LD provides the lowest cost for wave soldering operations. It also provides
solder joints with no shrinkage effects, excellent through-hole penetration and topside
fillet, and provides a low dross rate.
14
Kester Part #
Alloy
Each Bar
Sold As
04-9574-0050
K100LD
1 2/3 lbs.
25 lbs.
1 2/3
1 2/3
lbs.lbs.
2525lbs.lbs.
1 2/3 lbs.
25 lbs.
Kester Part #
Alloy
04-9574-0050 Sn96.5Ag3.0Cu0.5
K100LD
04-7068-0000
04-7068-0000
Sn96.5Ag3.0Cu0.5
Each Bar
Sold As
Common Lead-Free Alloys
*Alloys
Melt Temperature
Application
Common
Lead-Free
Alloys
~227°C/441°F
Wave/Hand Soldering
K100LD
*Alloys
Sn96.5Ag3.0Cu0.5
K100LD
Sn96.5Ag3.5
Sn96.5Ag3.0Cu0.5
Melt Temperature
217°C/423°F
~227°C/441°F
221°C/430°F
217°C/423°F
Application
SMT/Hand/Wave
Wave/Hand Soldering
SMT/Hand Soldering
SMT/Hand/Wave
* These are the most common lead-free alloys used in the industry. Kester can also produce a multitude of lead-free alloys as Sn96.5Ag3.5
221°C/430°F
SMT/Hand Soldering
specified by individual
requirements.
| 800 253 7837 | WWW.kester.com
* These are the most common lead-free alloys used in the industry. Kester can also produce a multitude of
lead-free alloys as specified by individual requirements.
Bar Solder
Kester ULTRAPURE®
Manufactured by a special process that controls the inclusions of oxides and metallic
and non-metallic impurities, Kester Ultrapure® is the industry standard bar solder for
use in high tech electronic applications where lower surface tension and hole filling
ability are essential. The purity of Kester Ultrapure® meets the requirements of
IPC/J-STD-006B.
Kester Solder Analysis Program
Kester’s Solder Analysis Program is a prepaid method for rapid response
solder sample analysis. It allows customers to document solder pot impurities for conformance to Federal Specifications or ISO quality requirements.
Option C: This option includes monitoring tin, antimony, copper, gold,
lead,cadmium, aluminum, zinc, iron, arsenic, bismuth, silver, and nickel.
Kester Part #
Alloy
Each Bar
Sold As
04-6337-0050
Sn63Pb37
1 2/3 lbs.
25 lbs.
Kester Part #
Description
04-6040-0050
Sn60Pb40
1 2/3 lbs.
25 lbs.
53-0000-0041
Option C
Kester Ultra Low Dross
This bar solder is manufactured using the Ultrapure® process and containing the same
metal purity as Kester Ultrapure®. Kester Ultra Low Dross is formulated with a special low dross additive that dramatically decreases dross formation on the solder pot.
Kester Part #
Alloy
Each Bar
Sold As
04-6337-0030
Sn63Pb37
1 2/3 lbs.
25 lbs.
#5744 Solder Saver®
Kester Flo-Bar
Flo-Bar is an extruded 8.5 or 10 lb. bar manufactured specifically for situations
where a larger size is more conveniently managed on certain automatic solder feeding systems. Flo-Bar is available in Ultrapure® and Ultra Low Dross grade solder.
A chloride-free, inorganic white powder formulated to remove dross,
which is the oxide of solder, from still solder pots and wave soldering
machines. It does not decompose to sticky residues that are harder to
remove than the original dross. The product is low fuming and is stable
at molten solder temperatures.
Kester Part #
Alloy
Each Bar
Sold As
Kester Part #
Description
07-6337-0050
Ultrapure Sn63Pb37
10 lbs.
50 lbs.
56-0005-5744
5744 Solder Saver 5 lb.
07-6337-1930
Ultra Low Dross Sn63Pb37
8.5 lbs.
42.5 lbs.
56-0025-5744
5744 Solder Saver 25 lb.
07-6337-0030
Ultra Low Dross Sn63Pb37
10 lbs.
50 lbs.
®
WWW.Kester.com | 800 253 7837 |
15
Additional Flux Materials
Kester Rework Fluxes
Kester’s two rework formulas are specifically formulated for PCB rework
operations. Kester’s No-Clean RF-741 and Water Soluble RF-771 rework
fluxes are all that’s needed to handle any surface mount or through-hole
rework applications. Available only in 30 gram syringe packaging.
Kester Flux Thinners
Selecting the correct thinner for reducing solids or replacing evaporated
solvent will result in maximum efficiency of the flux. To select at
thinner,find the flux you are using from the chart below:
Thinner
Use with Soldering Flux
104
1544 Activated Rosin Flux
110
951 No-Clean Flux
120
186 Series Rosin Mildly Activated Flux
2331-ZX Organic Water-Soluble Flux
4662
2235 Organic Water-Soluble Flux
2120 Organic Water-Soluble Flux
959 No-Clean Flux
958 No-Clean Flux
Kester Part #
Description
Packaging
7025010003
RF-741 No-Clean
30g syringe
7026010003
RF-771 Water-Soluble
30g syringe
Kester Part #
Description
Packaging
63-0000-0104
104 Flux Thinner
1 gallon
65-0000-0104
104 Flux Thinner
53 gallon drum
63-0000-0110
110 Flux Thinner
1 gallon
64-0000-0110
110 Flux Thinner
5 gallon
65-0000-0110
110 Flux Thinner
53 gallon drum
63-0000-0120
120 Flux Thinner
1 gallon
64-0000-0120
120 Flux Thinner
5 gallon
65-0000-0120
120 Flux Thinner
53 gallon drum
63-0000-4662
4662 Flux Thinner
1 gallon
64-0000-4662
4662 Flux Thinner
5 gallon
65-0000-4662
4662 Flux Thinner
53 gallon drum
Kester Flux Test Kits
Control of the flux concentration in the flux becomes more critical when
using a low solids flux. The accuracy problems encountered with automatic specific gravity controllers in conjunction with low-solids “no-clean”
fluxes make the flux kit a better alternative for process control. Good
control is necessary to assure a consistent amount of flux is applied to
the circuit boards, consistent soldering results are obtained, and the least
amount of flux residue remains after soldering. Kester PS-20 and PS-22
flux kits provide a simple method for process control.
Flux Test Kit
PS-20
PS-22
16
| 800 253 7837 | WWW.kester.com
Use with Soldering Flux
959 No-Clean Flux
985M No-Clean Flux
958 No-Clean Flux
979 VOC-Free No-Clean Flux
977 VOC-Free No-Clean Flux
951 No-Clean Flux
959T No-Clean Flux
Kester Part #
Description
53-0000-0200
PS-20 Flux Test Kit
53-0000-0220
PS-22 Flux Test Kit
Tacky Soldering Fluxes
Page 17
Tacky Soldering Fluxes
Tacky Soldering Fluxes
Kester Tacky Soldering Fluxes
Kester Tacky Soldering Fluxes
Kester Tacky Soldering Fluxes
Kester's TSFs are the industry standard for attachment of spheres to BGA and µ
tions to solder flip chip components to PWB substrates. Kester's TSF portfolio i
Kester’s TSFs are the industry standard for attachment of spheres to BGA and µBGA packages. The TSFs are also used in electronics assembly
being
andused
stencil
printed, dotassembly
dispensed,
or thin film transfer process
Kester's TSFs are the industry standard for attachment of spheres to BGA and µBGA packages.ofThe
TSFsscreen
are also
in electronics
operaoperations to solder flip chip components to PWB substrates. Kester’s TSF portfolio includes a complete line of no clean and water-soluble products
tions
to
solder
flip
chip
components
to
PWB
substrates.
Kester's
TSF
portfolio
includes
a
complete
line
of
no
clean
and
water-soluble
products
capable
capable of being screen and stencil printed, dot dispensed, or thin film transfer processed.
of being screen and stencil printed, dot dispensed, or thin film transfer processed.
TSF-6592LV Lead-Free No-Clean
TSF-6592LV Lead-Free No-Clean
(For Screen Printing/Stencil Printing/Pin Transfer)
(Foris Screen
Printing/Pin
TSF-6592LV
compatiblePrinting/Stencil
with lead and lead-free
solder alloysTransfer)
such as SnAg,SnCu,
compatible
withinlead
and lead-free
such as SnAg,
SnAgCu,TSF-6592LV
SnAgBi, andiscan
be reflowed
nitrogen
or air withsolder
peakalloys
temperatures
up
SnAgCu,are
SnAgBi,
can be reflowed
nitrogen or air with peak
to 270ºC.SnCu,
The residues
clear,and
non-conductive,
and innon-corrosive.
temperatures up to 270ºC. The residues are clear, non-conductive, and
non-corrosive.
Kester Part #
Description
Packaging
300303
TSF-6592LV No-Clean
30g syringe
300304
TSF-6592LV No-Clean
300305
300304
TSF-6592LV
No-Clean
TSF-6592LV
No-Clean
300305
TSF-6592LV No-Clean
Kester Part #
300303
Description
TSF-6592LV No-Clean
Packaging
100g jar
30g syringe
150g cartridge
100g jar
150g cartridge
TSF-6502 No-Clean
(Lower
Viscosity for Screen
TSF-6502
No-Clean
Film Deposition)
(LowerPrinting/Thin
Viscosity for Screen
TSF-6502
is
a
no-clean
tacky soldering flux formula designed for
Printing/Thin Film Deposition)
screensoldering
printing,flux
sphere/pin
for repair and
TSF-6502BGA/CSP/PGA
is a no-clean tacky
formula processing
designed foror BGA/CSP/PGA
reballing/repinning.
It
possesses
a
high
activity
level,
allowing
it to solder
screen printing, sphere/pin processing or for repair and reballing/repinning.
It
possessesnickel
a highsurfaces.
activity level,
allowing
it to solder
wetting
The robust
wetting
action nickel
of thesurfaces.
TSF-6502The
willrobust
allow OSP
action of treated
the TSF-6502
treated
copper,copper,
as wellsurfaces
as heavily
oxidizedgood
copper,will
as allow
well asOSP
heavily
oxidized
to exhibit
copper, surfaces
exhibit goodeven
soldering
evencycles.
after 2TSF-6502
or 3 thermal
cycles.
solderingto properties,
after 2properties,
or 3 thermal
is designed
TSF-6502foris designed
for aofwide
range of temperature
and humidity conditions.
a wide range
temperature
and humid conditions.
Kester Part #
Description
Packaging
Kester Part
#
300103
Description
TSF-6502 No-Clean
Packaging
30g syringe
300103300104
TSF-6502TSF-6502
No-Clean
No-Clean
30g syringe
100g jar
300104300105
No-Clean
TSF-6502TSF-6502
No-Clean
300105
TSF-6502 No-Clean
TSF-6852 Lead-Free Water Soluble
TSF-6592LV Lead-Free No-Clean
(For Screen or Stencil Printing)
(For Screen Printing/Stencil Printing/Pin Transfer)
TSF-6850 is an aggressive synthetic flux with residues that are easily and completely
TSF-6592LV
is compatible
with
lead
and lead-free
TSF-6852
Lead-Free
Water
Soluble
cleaned with water
temperatures
ranging
from
20-65ºC
yielding solder
bright,alloys
shiny such
joints.as SnAg,
SnAgCu,
SnAgBi,
andalloys
can bethat
reflowed
in nitrogen
peak
Screen
or Stencil
Printing)
TSF-6852(For
is aSnCu,
drop-in
solution
for solder
will have
a liquidusorupairtowith
300ºC.
upshelf
to 270ºC.
The flux
residues
are
clear,
non-conductive,
and
aggressive
synthetic
residues
that
are
easily and
TSF-6852TSF-6850
alsotemperatures
has isa 6anmonth
life
when
storedwith
between
0-25ºC
(refrigerated
or
non-corrosive.
completely
cleaned with water temperatures ranging from 20-65ºC yielding
room temperature).
bright, shiny joints. TSF-6852 is a drop-in solution for solder alloys that will
have a liquidus up to 300ºC. TSF-6852 also has a 6 month shelf life when
stored Part
between
or room
temperature).
Kester
Part #(refrigerated
Description
Packaging
Kester
# 0-25ºC
Description
Packaging
300203
300303
300304
Kester Part
#
TSF-6592LV No-Clean
TSF-6852 Water-Soluble
30g syringe30g syringe
TSF-6592LV No-Clean
Description
300204
TSF-6852 Water-Soluble
300206
300204
TSF-6852
Water-Soluble
TSF-6852
Water-Soluble
300206
TSF-6852 Water-Soluble
300203300305
TSF-6852TSF-6592LV
Water-Soluble
No-Clean
100g jar
Packaging
100g jar
30g syringe
150g cartridge
165g cartridge
100g jar
165g cartridge
TSF-6502 No-Clean
(Lower Viscosity for Screen
Printing/Thin Film Deposition)
TSF-6502 is a no-clean tacky soldering flux formula designed for
BGA/CSP/PGA screen printing, sphere/pin processing or for repair and
reballing/repinning. It possesses a high activity level, allowing it to solder
nickel surfaces. The robust wetting action of the TSF-6502 will allow OSP
treated copper, as well as heavily oxidized copper, surfaces to exhibit good
soldering properties, even after 2 or 3 thermal cycles. TSF-6502 is designed
for a wide range of temperature and humid conditions.
Kester Part #
Description
Packaging
300103
TSF-6502 No-Clean
30g syringe
300104
TSF-6502 No-Clean
100g jar
300105
TSF-6502 No-Clean
150g cartridge
150gjarcartridge
100g
150g cartridge
WWW.Kester.com | 800 253 7837 |
17
8
Kester Solderforms®
TC-533 Peelable Solder Mask
This is a high-temperature flexible solder masking compound specially formulated of natural latex rubber. It is extremely versatile as it can be used as a
temporary solder mask, conformal coating maskant, and a potting compound
mold seal.
® Part #
Kester
Kester Solderforms
Description
Kester Solderforms® are stamped, extruded, compacted
53-4000-0533
TC-533
or formed pieces of pure soft solder alloys manufactured
53-4001-0533
TC-533
with strict known tolerances to customer specifications.
Packaging
½ pint
1 pint
TC-533
1 gallon
Solderforms® may be produced as flux cored, solid metal,
coating.
TC-527 is a high-temperature flexible solder masking compound formulated of and with or without a flux 53-4000-0527
TC-527
½ pint
53-4003-0533
TC-527 Hi-Temp Flexible Solder Mask
natural latex rubber to protect delicate components. The latex is heat stable
53-4001-0527
TC-527
water soluble, RMA, and
and tacky enough to be applied to those areas of circuit boards that require Fluxes available are no-clean,
53-4003-0527
RA chemistries. External dyes are also available for TC-527
masking during a wave soldering process. Can be applied by automatic dip,
identification or to aid in determining the solder melt point.
brush or flow methods, direct from applicator bottle or by automated dispensing machines. It can easily be peeled away without leaving a residue.
Solderform®
Solderform®
Ribbons
Cut-Offs
Washers
Discs
Pellets
Ribbons Width
Thickness
Cut-Offs
Minimum (mm)
Width
Minimum (mm)
Maximum (mm)
0.50 ± 0.13
0.50 ± 0.13
76.20 ± 0.75
0.0762 ± 0.03
3.18 ± 0.13
Thickness
0.0762 ± 0.03
Width
Width
0.50
± 0.13
Thickness
Thickness
0.0762
± 0.03
± 0.13
76.200.50
± 0.75
3.180.0762
± 0.13± 0.03
Length
0.762
± 0.25
Length
5000.762
± 1.25± 0.25
Outside Diameter
0.889Diameter
± 0.05
Outside
63.50.889
± 0.13± 0.05
Washers
Inside Diameter
0.38
± 0.05
Inside
Diameter
58.420.38
± 0.13
± 0.05
Thickness
0.0762 ± 0.03
6.35 ± 0.25
Outside Diameter
0.41 ± 0.05
65 ± 0.05
0.0762 ± 0.03
6.35 ± 0.25
0.254 ± 0.03
12.7 ± 0.13
Discs Thickness
Diameter
Pellets Length
Description
Stampings
Stampings
Thickness
Outside Diameter
Thickness
Diameter
0.50 ± 0.13
Length
0.0762 ± 0.03
0.41 ± 0.05
0.0762 ± 0.03
152.40.254
± 0.76± 0.03
0.50 ± 0.13
18
| 800 253 7837 | WWW.kester.com
Maximum (mm)
Kester Solderforms®
76.20 ± 0.75
Kester Solderforms® are stamped, extruded, compact
3.18 ± 0.13
formed pieces of pure soft solder alloys manufacture
with strict 76.20
known± tolerances
to customer specification
0.75
Kester also3.18
creates
other preforms such as collars, rib
± 0.13
forms, rings, and wireforms.
500 ± 1.25
®
± 0.13
may
be produced as flux cored, solid m
Solderforms63.5
and with or58.42
without
a flux coating.
± 0.13
6.35 ± 0.25
Fluxes available are no-clean, water soluble, RMA, a
65 ± 0.05
RA chemistries.
External dyes are also available for
6.35or±to0.25
identification
aid in determining the solder mel
point.
12.7 ± 0.13
152.4 ± 0.76
Stampings use special dies that are customer specific
and require
a customer’s engineering
drawing
Description
Stampings
use and
special dies that are customer specific
specification.
and require a customer’s engineering drawing and
specification.
1 pint
1 gallon
Technical Data
Table 1
Metal Solderability Chart
Solder PasteTechnical
and Tacky
Soldering Fluxes
Data
Category
If trying to solder to this
metal surface:
1
Platinum, Gold, Copper, Tin,
Solder, Silver
All products can solder these metal
surfaces.
2
Nickel, Cadmium, Brass,
Lead, Bronze, Rhodium,
Beryllium Copper, Palladium,
Immersion Tin, Immersion Silver
EniviroMark™ 907, EnviroMark™ 828
Easy Profile®256 & 256HA
HydroMark 531, TSF 6592LV,
TSF 6800 Series
3
Nickel-Iron, Kovar
Base metal must be plated.
4
Zinc, Mild Steel, Chromium, Inconel,
Monel, Stainless Steel
Category
If trying to solder to this
metal surface:
Base metal must be plated.
Liquid Fluxes and Flux-Pen®
Formulas
Cored Wire
All products can solder these metal
surfaces.
All products can solder these metal
surfaces.
186, 1544, 2120,
2331-ZX, 2235, 2224-25,
44, 48, 331, OR-421
2222, 2220-VF
Table 1
2222,
48, 331, OR-421
Metal2220-VF
Solderability Chart
Call Kester’s
Customer
Solder
Paste andService
Liquid Fluxes and
48
Tacky
Soldering Fluxes
Flux-Pen® Formulas
Department
Gold, Copper,
can solder
these CopperAllrequires
products can
solder
these
EXAMPLE 1: When soldering Beryllium Copper to Tin, you could1 use any ofPlatinum,
the products
listedTin,
in Category All
2, products
3, or 4 since
Beryllium
more
active
Solder, Silver
metal surfaces.
metal surfaces.
products than Tin.
Cadmium,
Brass,of Kester’s
EniviroMark™
907, EnviroMark™
EXAMPLE 2: If you were soldering Solder coated leads to a Copper surface,Nickel,
you could
use any
products (Category
1, 2, 3,828or 4). 186, 1544, 2120,
®
2
Lead, Bronze, Rhodium,
Beryllium Copper, Palladium,
Immersion Tin, Immersion Silver
Easy Profile 256 & 256HA
HydroMark 531, TSF 6592LV,
TSF 6800 Series
Cored Wire
All products can solder th
metal surfaces.
44, 48, 331, OR-421
2331-ZX, 2235, 2224-25,
2222, 2220-VF
Nickel-Iron,
Kovar
Base metal must be plated. WEIGHTS 2222,
AND2220-VF
MEASURES
ALLOY TEMPERATURE CHART: SOLDER 3ALLOYS AND
AVAILABLE
FORMS
ALLOY: TIN-LEAD
MELTING RANGE °F/°C
Sn63Pb37
361/183
Sn60Pb40
361-374/183-190
Sn50Pb50
361-420/183-214
Sn40Pb60
WIRE
4
COMMON
CONVERSIONS
Zinc, Mild Steel, Chromium,
Call Kester's
Customer Service
BAR
SOLDERPASTE PREFORMS
Base metal must be plated.
Inconel, Monel, Stainless Steel
X
X
X
X
X
X
361-460/183-238
X
X
X
Sn30Pb70
361-496/183-258
X
X
No. 123
366-503/186-262
Sn05Pb95
574-597/301-314
X
X
LEAD-FREE
MELTING RANGE °F/°C
WIRE
BAR
Sn96.5Ag3.5
430/221
Sn96Ag04
430-444/221-229
Sn95Ag05
430-473/221-245
100%Sn
450/232
Sn99.3Cu0.7
Sn96.5Ag3.0Cu0.5
K100LD
To Change
Department
To
Multiply By:
48
EXAMPLE 1: When soldering Beryllium Copper to Tin, you could use any of the products listed in Category 2, 3, or 4 since Beryllium Copper
Gallons (US)
Liters
3.7853
X requiresX more active products than Tin.
X
EXAMPLE 2: If you were soldering Solder coated leads to a Copper surface, you could
use(liquid)
any of Kester's products
2, 3, or 4).
Quarts
Liters (Category 1,0.9463
X
Sn95Sb05
48, 331, OR-421
Pounds (avdp.)
Grams
453.592
X
Pounds (avdp.)
Kilograms
0.4536
Pounds (avdp.)
Ounce (troy)
14.5833
X
Ounces (avdp.)
Grams
28.3495
X
SOLDERPASTE PREFORMS
X
X
WEIGHTS
AND
X
XMEASURES
COMMON CONVERSIONS
X
X
To Change
Gallons (US)
X
To
X
Liters
450-464/232-240
Quarts (liquid) X
LitersX
440/227 Pounds (avdp.) X
X
3.7853
X
X
0.9463
X
GramsX
453.592
X
Pounds (avdp.) X Kilograms
422-428/217-220
X
0.4536
X
X
14.5833
X
28.3495
X
440/227 Pounds (avdp.) X Ounce (troy)
X
Ounces (avdp.)
Grams
SAF-A-LLOY
428-454/219-235
X
OTHER ALLOYS
MELTING RANGE °F/°C
WIRE
Sn62Pb36Ag02
354-372/179-189
X
X
Sn10Pb88Ag02
514-570/268-299
X
X
X
Sn05Pb93.5Ag1.5
565-574/296-301
X
X
X
Celsius = 5/9 (F-32)
X
Fahrenheit = 9/5 (C) + 32
BAR
FORMULA FOR ADDING TIN TO
FORMULA FOR ADDING TIN TO
TIN-LEAD SOLDER POTS
X
Multiply By:
Celsius = 5/9 (F-32) Fahrenheit = 9/5 (C) + 32
TIN-LEAD SOLDER POTS
Tin can be added to solder to replace tin lost by oxidation.
Tin can be added
to replace
tin lost
oxidation.
Thebars
pot should
temperature should be
The topotsolder
temperature
should
beatbyleast
460°F. Tin
at least 460°F.beTinadded
bars slowly
shouldand
be added
slowly
andbethemixed
solderwell.
should be mixed well.
the solder
should
T = W(A - B)
(100 - A)
EXAMPLE
900 (63 - 61.6) = 1260 = 34 lbs. of
(100 - 63)
37
Tin to add
Pounds of
of Tin
W =WPounds
of solder
on poton pot
TT==Pounds
Tin totoadd
add
= Pounds
of solder
A = Percentage of Tin desired B = Percentage of Tin in pot
A = Percentage of Tin desired
B = Percentage of Tin in pot
SOLDERPASTE PREFORMS
X
X
Please visit www.kester.com and click on
Lead-Free Solutions™ for a worksheet to
Please visit www.kester.com and click on Lead-Free Solutions™
balance Lead-Free alloy systems.
for a worksheet to balance Lead-Free alloy systems.
WWW.Kester.com | 800 253 7837 |
19
GLOBAL
HEADQUARTERS
EUROPEAN
HEADQUARTERS
ASIA-PACIFIC
HEADQUARTERS
USA
Germany
Singapore
800 West Thorndale Avenue
Itasca, IL 60143-1341
Zum Plom 5
08541 Neuensalz
Germany
500 Chai Chee Lane
Singapore 4690224
Phone: (+1) 630-616-4000
Fax: (+1) 630-616-4044
Email: [email protected]
Phone: (+49) 3741 4233-0
Fax: (+49) 3741 4233-111
Email: [email protected]
Phone: (+65) 6 449-1133
Fax: (+65) 6 242-9036
Email: [email protected]
Customer Service
Phone: 800-2-KESTER
Fax: (+1) 630-616-4044
Mexico
Taiwan
Japan
Carretera Internacional Km. 6.5
Esquina Boulevard del Castillo
Parque Industrial
Nogales, Son. 84000
Mexico
4th Floor, No. 128
Lane 235
Pao-Chiao Road
Hsien-Tien City
Taipei Hsien, Taiwan
20-11 YokoKawa 2-Chome,
Sumida-ku
Tokyo 130, Japan
For customer service call the
Global Headquarters facility
Tel: (+886) 2-8912-1066
Fax: (+886) 2-8912-1072
Tel: (+81) 3-3624-5351
Fax (+81) 3-3626-6253
Email: [email protected]
Email: [email protected]
JOHORBAHRU, MALAYSIA
PLO 113, Fasa 3
Kawasan Perindustria Senai
81400 Senai, Johor, Malaysia
Tel: (+60) 7-598-4113
Fax: (+60) 7-598-3103
Kester Vision Statement
Smart Products.
Great Service.
No Boundaries.
Kester will be the leading global supplier of high performance interconnecting materials and
related services for the electronic assembly and component assembly markets.
To achieve this we will focus on customer-driven innovation and exceptional service worldwide.
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