S29PL-J

S29PL-J
S29PL-J
128/128/64/32 Megabit (8/8/4/2M x 16-Bit)
CMOS 3.0 Volt-Only, Simultaneous-Read/Write
Flash Memory with Enhanced VersatileIO™ Control
S29PL-J Cover Sheet
Data Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S29PL-J_00
Revision A
Amendment 16
Issue Date April 18, 2013
D at a
S hee t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
S29PL-J
S29PL-J_00_A16 April 18, 2013
S29PL-J
128/128/64/32 Megabit (8/8/4/2M x 16-Bit)
CMOS 3.0 Volt-Only, Simultaneous-Read/Write
Flash Memory with Enhanced VersatileIO™ Control
Data Sheet
Distinctive Characteristics
Architectural Advantages
Performance Characteristics
 128/128/64/32 Mbit Page Mode devices
– Page size of 8 words: Fast page read access from random locations
within the page
 Single power supply operation
– Full Voltage range: 2.7 to 3.6 volt read, erase, and program operations
for battery-powered applications
 Dual Chip Enable inputs (only in PL129J)
– Two CE# inputs control selection of each half of the memory space
 Simultaneous Read/Write Operation
– Data can be continuously read from one bank while executing erase/
program functions in another bank
– Zero latency switching from write to read operations
 FlexBank Architecture (PL127J/PL064J/PL032J)
– 4 separate banks, with up to two simultaneous operations per device
– Bank A:
PL127J -16 Mbit (4 Kw x 8 and 32 Kw x 31)
PL064J - 8 Mbit (4 Kw x 8 and 32 Kw x 15)
PL032J - 4 Mbit (4 Kw x 8 and 32 Kw x 7)
– Bank B:
PL127J - 48 Mbit (32 Kw x 96)
PL064J - 24 Mbit (32 Kw x 48)
PL032J - 12 Mbit (32 Kw x 24)
– Bank C:
PL127J - 48 Mbit (32 Kw x 96)
PL064J - 24 Mbit (32 Kw x 48)
PL032J - 12 Mbit (32 Kw x 24)
– Bank D:
PL127J -16 Mbit (4 Kw x 8 and 32 Kw x 31)
PL064J - 8 Mbit (4 Kw x 8 and 32 Kw x 15)
PL032J - 4 Mbit (4 Kw x 8 and 32 Kw x 7)
 FlexBank Architecture (PL129J)
– 4 separate banks, with up to two simultaneous operations per device
– CE#1 controlled banks:
Bank 1A: PL129J - 16Mbit (4Kw x 8 and 32Kw x 31)
Bank 1B: PL129J - 48Mbit (32Kw x 96)
– CE#2 controlled banks:
Bank 2A: PL129J - 48 Mbit (32Kw x 96)
Bank 2B: PL129J - 16Mbit (4Kw x 8 and 32Kw x 31)
 Enhanced VersatileI/O (VIO) Control
– Output voltage generated and input voltages tolerated on all control
inputs and I/Os is determined by the voltage on the VIO pin
– VIO options at 1.8 V and 3 V I/O for PL127J and PL129J devices
– 3V VIO for PL064J and PL032J devices
 Secured Silicon Sector region
– Up to 128 words accessible through a command sequence
– Up to 64 factory-locked words
– Up to 64 customer-lockable words
 Both top and bottom boot blocks in one device
 Manufactured on 110 nm process technology
 Data Retention: 20 years typical
 Cycling Endurance: 1 million cycles per sector typical
 High Performance
– Page access times as fast as 20 ns
– Random access times as fast as 55 ns
 Power consumption (typical values at 10 MHz)
– 45 mA active read current
– 17 mA program/erase current
– 0.2 µA typical standby mode current
Publication Number S29PL-J_00
Revision A
Software Features
 Software command-set compatible with JEDEC 42.4 standard
– Backward compatible with Am29F, Am29LV, Am29DL, and AM29PDL
families and MBM29QM/RM, MBM29LV, MBM29DL, MBM29PDL
families
 CFI (Common Flash Interface) compliant
– Provides device-specific information to the system, allowing host
software to easily reconfigure for different Flash devices
 Erase Suspend / Erase Resume
– Suspends an erase operation to allow read or program operations in
other sectors of same bank
 Program Suspend / Program Resume
– Suspends a program operation to allow read operation from sectors
other than the one being programmed
 Unlock Bypass Program command
– Reduces overall programming time when issuing multiple program
command sequences
Hardware Features
 Ready/Busy# pin (RY/BY#)
– Provides a hardware method of detecting program or erase cycle
completion
 Hardware reset pin (RESET#)
– Hardware method to reset the device to reading array data
 WP#/ ACC (Write Protect/Acceleration) input
– At VIL, hardware level protection for the first and last two 4K word
sectors.
– At VIH, allows removal of sector protection
– At VHH, provides accelerated programming in a factory setting
 Persistent Sector Protection
– A command sector protection method to lock combinations of individual
sectors and sector groups to prevent program or erase operations within
that sector
– Sectors can be locked and unlocked in-system at VCC level
 Password Sector Protection
– A sophisticated sector protection method to lock combinations of
individual sectors and sector groups to prevent program or erase
operations within that sector using a user-defined 64-bit password
 Package options
– Standard discrete pinouts
11 x 8 mm, 80-ball Fine-pitch BGA (PL127J) (VBG080)
8.15 x 6.15 mm, 48-ball Fine pitch BGA (PL064J/PL032J)
(VBK048)
– MCP-compatible pinout
8 x 11.6 mm, 64-ball Fine-pitch BGA (PL127J)
7 x 9 mm, 56-ball Fine-pitch BGA (PL064J and PL032J)
Compatible with MCP pinout, allowing easy integration of RAM into
existing designs
– 20 x 14 mm, 56-pin TSOP (PL127J) (TS056)
Amendment 16
Issue Date April 18, 2013
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.
D at a
S hee t
General Description
The PL127J/PL129J/PL064J/PL032J is a 128/128/64/32 Mbit, 3.0 volt-only Page Mode and Simultaneous
Read/Write Flash memory device organized as 8/8/4/2 Mwords. The devices are offered in the following
packages:
– 11 mm x 8 mm, 80-ball Fine-pitch BGA standalone (PL127J)
– 8 mm x 11.6 mm, 64-ball Fine-pitch BGA multi-chip compatible (PL127J)
– 8.15 mm x 6.15 mm, 48-ball Fine-pitch BGA standalone (PL064J/PL032J)
– 7 mm x 9 mm, 56-ball Fine-pitch BGA multi-chip compatible (PL064J and PL032J)
– 20 mm x 14 mm, 56-pin TSOP (PL127J)
The word-wide data (x16) appears on DQ15-DQ0. This device can be programmed in-system or in standard
EPROM programmers. A 12.0 V VPP is not required for write or erase operations.
The device offers fast page access times of 20 to 30 ns, with corresponding random access times of 55 to
70 ns, respectively, allowing high speed microprocessors to operate without wait states. To eliminate bus
contention the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls.
Note: Device PL129J has 2 chip enable inputs (CE1#, CE2#).
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S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
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Table of Contents
Distinctive Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.
Simultaneous Read/Write Operation with Zero Latency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.1
Page Mode Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.2
Standard Flash Memory Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.
Simultaneous Read/Write Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.
Simultaneous Read/Write Block Diagram (PL129J) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.1
Special Package Handling Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2
80-Ball Fine-Pitch BGA—PL127J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3
64-Ball Fine-Pitch BGA—MCP Compatible—PL127J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4
48-Ball Fine-Pitch BGA, PL064J and PL032J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.5
56-Pin TSOP 20 x 14 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.6
56-Ball Fine-Pitch Ball Grid Array, PL064J and PL032J . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
9.
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
10.
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.1 Requirements for Reading Array Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.2 Simultaneous Read/Write Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.3 Writing Commands/Command Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.4 Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.5 Automatic Sleep Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.6 RESET#: Hardware Reset Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.7 Output Disable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.8 Autoselect Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.9 Selecting a Sector Protection Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
23
23
24
25
25
26
26
26
43
47
11.
Sector Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.1 Persistent Sector Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.2 Password Sector Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.3 WP# Hardware Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.4 Selecting a Sector Protection Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
48
48
48
48
48
12.
Persistent Sector Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.1 Persistent Protection Bit (PPB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2 Persistent Protection Bit Lock (PPB Lock). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.3 Dynamic Protection Bit (DYB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.4 Persistent Sector Protection Mode Locking Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
49
49
49
49
50
13.
Password Protection Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.1 Password and Password Mode Locking Bit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.2 64-bit Password . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3 Write Protect (WP#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.4 High Voltage Sector Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.5 Temporary Sector Unprotect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.6 Secured Silicon Sector Flash Memory Region . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.7 Hardware Data Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
51
51
51
52
52
54
54
56
14.
Common Flash Memory Interface (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
15.
Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
15.1 Reading Array Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
April 18, 2013 S29PL-J_00_A16
S29PL-J
17
17
17
18
19
20
21
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15.2
15.3
15.4
15.5
15.6
15.7
15.8
15.9
15.10
Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Autoselect Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Enter/Exit Secured Silicon Sector Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Word Program Command Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chip Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sector Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Erase Suspend/Erase Resume Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Program Suspend/Program Resume Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Command Definitions Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
60
60
60
61
62
63
64
65
65
16.
Write Operation Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.1 DQ7: Data# Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.2 RY/BY#: Ready/Busy#. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3 DQ6: Toggle Bit I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.4 DQ2: Toggle Bit II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.5 Reading Toggle Bits DQ6/DQ2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.6 DQ5: Exceeded Timing Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.7 DQ3: Sector Erase Timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
68
68
69
69
71
71
71
72
17.
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
18.
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
19.
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
20.
AC Characteristic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20.1 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20.2 Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20.3 Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20.4 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20.5 Erase/Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20.6 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21.
Protect/Unprotect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
21.1 Controlled Erase Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
22.
Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
22.1 BGA Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
22.2 TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
23.
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
23.1 VBG080—80-Ball Fine-pitch Ball Grid Array 8 x 11 mm Package (PL127J) . . . . . . . . . . . . .
23.2 VBH064—64-Ball Fine-pitch Ball Grid Array 8 x 11.6 mm package (PL127J). . . . . . . . . . . .
23.3 VBK048—48-Ball Fine-pitch Ball Grid Array 8.15 x 6.15 mm package
(PL032J and PL064J). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
23.4 VBU056—56-Ball Fine-pitch BGA 7 x 9mm package (PL064J and PL032J) . . . . . . . . . . . .
23.5 TS056—20 x 14 mm, 56-pin TSOP (PL127J) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
90
90
91
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.1 Revision A0 (January 29, 2004). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.2 Revision A1 (February 12, 2004) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.3 Revision A2 (February 17, 2004) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.4 Revision A3 (February 25, 2004) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.5 Revision A4 (February 27, 2004) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.6 Revision A5 (March 15, 2004) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.7 Revision A6 (August 30, 2004) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.8 Revision A7 (March 2, 2005) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.9 Revision A8 (July 29, 2005) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.10 Revision A9 (September 22, 2006) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.11 Revision A10 (September 7, 2007) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.12 Revision A11 (September 10, 2009) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.13 Revision A12 (December 18, 2009). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.14 Revision A13 (Febuary 1, 2011) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.15 Revision A14 (July 8, 2011) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24.16 Revision A15 (March 14, 2012) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
95
95
95
95
95
96
96
96
96
97
97
98
98
98
98
99
99
24.
6
S hee t
S29PL-J
76
76
76
77
79
80
81
92
93
94
S29PL-J_00_A16 April 18, 2013
Data
She et
24.17 Revision A16 (April 9, 2013) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
April 18, 2013 S29PL-J_00_A16
S29PL-J
7
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Figures
Figure 7.1
Figure 7.2
Figure 7.3
Figure 7.4
Figure 7.5
Figure 13.1
Figure 13.2
Figure 13.3
Figure 15.1
Figure 15.2
Figure 16.1
Figure 16.2
Figure 17.1
Figure 20.1
Figure 20.2
Figure 20.3
Figure 20.4
Figure 20.5
Figure 20.6
Figure 20.7
Figure 20.8
Figure 20.9
Figure 20.10
Figure 20.11
Figure 20.12
Figure 21.1
Figure 21.2
Figure 21.3
Figure 21.4
8
80-Ball Fine-Pitch BGA, Top View, Balls Facing Down—PL127J . . . . . . . . . . . . . . . . . . . . .
64-Ball Fine-Pitch BGA, MCP Compatible, Top View, Balls Facing Down—PL127J . . . . . .
48-Ball Fine-Pitch BGA, Top View, Balls Facing Down—PL064J—PL032J: C4(A21)=NC . . .
56-Pin TSOP 20 x 14 mm Configuration—PL127J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
56-ball Fine-Pitch BGA, Top View, Balls Facing Down,—PL064J and PL032J,. . . . . . . . . . .
In-System Sector Protection/Sector Unprotection Algorithms . . . . . . . . . . . . . . . . . . . . . . . .
Temporary Sector Unprotect Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Secured Silicon Sector Protect Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Program Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Erase Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data# Polling Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Toggle Bit Algorithm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Overshoot Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Test Setups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Waveforms and Measurement Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read Operation Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Page Read Operation Timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Program Operation Timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Accelerated Program Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chip/Sector Erase Operation Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Back-to-back Read/Write Cycle Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data# Polling Timings (During Embedded Algorithms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Toggle Bit Timings (During Embedded Algorithms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DQ2 vs. DQ6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temporary Sector Unprotect Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sector/Sector Block Protect and Unprotect Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . .
Alternate CE# Controlled Write (Erase/Program) Operation Timings . . . . . . . . . . . . . . . . . .
Timing Diagram for Alternating Between CE1# and CE2# Control . . . . . . . . . . . . . . . . . . . .
S29PL-J
17
18
19
20
21
53
54
55
62
63
69
70
73
76
77
77
77
79
81
81
82
83
83
84
84
85
86
87
88
S29PL-J_00_A16 April 18, 2013
Data
She et
Tables
Table 10.1
Table 10.2
Table 10.3
Table 10.4
Table 10.5
Table 10.6
Table 10.7
Table 10.8
Table 10.9
Table 10.10
Table 10.11
Table 10.12
Table 10.13
Table 10.14
Table 10.15
Table 14.1
Table 14.2
Table 14.3
Table 14.4
Table 15.1
Table 15.2
Table 16.1
Table 19.1
Table 20.1
Table 20.2
Table 20.3
Table 20.4
Table 20.5
Table 21.1
Table 21.2
Table 21.3
Table 21.4
April 18, 2013 S29PL-J_00_A16
PL127J Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PL129J Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Page Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bank Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PL127J Sector Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PL064J Sector Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PL032J Sector Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
S29PL129J Sector Architecture. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Secured Silicon Sector Addresses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Autoselect Codes (High Voltage Method) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Autoselect Codes for PL129J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PL127J Boot Sector/Sector Block Addresses for Protection/Unprotection . . . . . . . . . . . . . .
PL129J Boot Sector/Sector Block Addresses for Protection/Unprotection . . . . . . . . . . . . . .
PL064J Boot Sector/Sector Block Addresses for Protection/Unprotection . . . . . . . . . . . . . .
Sector Protection Schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CFI Query Identification String. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Interface String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Device Geometry Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Primary Vendor-Specific Extended Query . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Array Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sector Protection Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write Operation Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CMOS Compatible . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Test Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Key To Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read-Only Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Hardware Reset (RESET#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Erase and Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temporary Sector Unprotect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Alternate CE# Controlled Erase and Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . .
CE1#/CE2# Timing (S29PL129J only). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Erase And Programming Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
S29PL-J
23
23
24
24
26
33
36
38
43
44
44
45
46
47
48
57
57
58
58
66
67
72
75
76
76
77
79
80
85
87
88
88
9
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Simultaneous Read/Write Operation with Zero Latency
The Simultaneous Read/Write architecture provides simultaneous operation by dividing the memory space
into 4 banks, which can be considered to be four separate memory arrays as far as certain operations are
concerned. The device can improve overall system performance by allowing a host system to program or
erase in one bank, then immediately and simultaneously read from another bank with zero latency (with two
simultaneous operations operating at any one time). This releases the system from waiting for the completion
of a program or erase operation, greatly improving system performance.
The device can be organized in both top and bottom sector configurations. The banks are organized as
follows:
1.1
Bank
PL127J Sectors
PL064J Sectors
PL032J Sectors
A
16 Mbit (4 Kw x 8 and 32 Kw x 31)
8 Mbit (4 Kw x 8 and 32 Kw x 15)
4 Mbit (4 Kw x 8 and 32 Kw x 7)
B
48 Mbit (32 Kw x 96)
24 Mbit (32 Kw x 48)
12 Mbit (32 Kw x 24)
C
48 Mbit (32 Kw x 96)
24 Mbit (32 Kw x 48)
12 Mbit (32 Kw x 24)
D
16 Mbit (4 Kw x 8 and 32 Kw x 31)
8 Mbit (4 Kw x 8 and 32 Kw x 15)
4 Mbit (4 Kw x 8 and 32 Kw x 7)
Bank
PL129J Sectors
1A
16 Mbit (4 Kw x 8 and 32 Kw x 31)
CE# Control
CE1#
1B
48 Mbit (32 Kw x 96)
CE1#
2A
48 Mbit (32 Kw x 96)
CE2#
2B
16 Mbit (4 Kw x 8 and 32 Kw x 31)
CE2#
Page Mode Features
The page size is 8 words. After initial page access is accomplished, the page mode operation provides fast
read access speed of random locations within that page.
10
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
1.2
She et
Standard Flash Memory Features
The device requires a single 3.0 volt power supply (2.7 V to 3.6 V) for both read and write functions.
Internally generated and regulated voltages are provided for the program and erase operations.
The device is entirely command set compatible with the JEDEC 42.4 single-power-supply Flash standard.
Commands are written to the command register using standard microprocessor write timing. Register
contents serve as inputs to an internal state-machine that controls the erase and programming circuitry. Write
cycles also internally latch addresses and data needed for the programming and erase operations. Reading
data out of the device is similar to reading from other Flash or EPROM devices.
Device programming occurs by executing the program command sequence. The Unlock Bypass mode
facilitates faster programming times by requiring only two write cycles to program data instead of four. Device
erasure occurs by executing the erase command sequence.
The host system can detect whether a program or erase operation is complete by reading the DQ7 (Data#
Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is
ready to read array data or accept another command.
The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully erased when shipped from the factory.
Hardware data protection measures include a low VCC detector that automatically inhibits write operations
during power transitions. The hardware sector protection feature disables both program and erase operations
in any combination of sectors of memory. This can be achieved in-system or via programming equipment.
The Erase Suspend/Erase Resume feature enables the user to put erase on hold for any period of time to
read data from, or program data to, any sector that is not selected for erasure. True background erase can
thus be achieved. If a read is needed from the Secured Silicon Sector area (One Time Program area) after an
erase suspend, then the user must use the proper command sequence to enter and exit this region.
The Program Suspend/Program Resume feature enables the user to hold the program operation to read
data from any sector that is not selected for programming. If a read is needed from the Secured Silicon Sector
area, Persistent Protection area, Dynamic Protection area, or the CFI area, after a program suspend, then the
user must use the proper command sequence to enter and exit this region.
The device offers two power-saving features. When addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode. The system can also place the device into the standby
mode. Power consumption is greatly reduced in both these modes.
The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunneling. The data
is programmed using hot electron injection.
April 18, 2013 S29PL-J_00_A16
S29PL-J
11
D at a
2.
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Ordering Information
The order number (Valid Combination) is formed by a valid combinations of the following:
S29PL-J
55
BA
W
00
0
Packing Type
0 = Tray
1 = Tube
2 = 7-inch Tape and Reel
3 = 13-inch Tape and Reel
Model Number (Additional Ordering Options)
00 = 3.0V VIO, 80-ball 11 x 8 mm FBGA (VBG080)
01 = 1.8V VIO, 80-ball 11 x 8 mm FBGA (VBG080)
02 = 3.0V VIO, 64-ball 8 x 11.6 mm FBGA (VBH064)
12 = 3.0V VIO, 48-ball 8 x 6 mm FBGA (VBK048)
13 = 3.0V VIO, 56-pin 20 x 14 mm TSOP (TS056)
15 = 3.0V VIO, 56-ball 7 x 9 mm FBGA (VBU056)
Temperature Range
W = Wireless (–25°C to +85°C)
I = Industrial (–40°C to +85°C)
Package Type
BA = Fine-Pitch Grid Array (FBGA),
Standard
BF = Fine-Pitch Grid Array (FBGA)
Lead (Pb)-free
TA = Thin Small Outline Package (TSOP) Standard Pinout
Standard
TF = Thin Small Outline Package (TSOP) Standard Pinout
Lead (Pb)-free
Clock Speed
55 = 55 ns (Contact factory for availability)
60 = 60 ns
65 = 65 ns
70 = 70 ns
80 = 80 ns
Device Number/Description
128 Megabit (8 M x 16-Bit), 64 Megabit (4 M x 16-Bit), 32 Megabit (2 M x 16-Bit)
CMOS Flash Memory, Simultaneous-Read/Write, Page-Mode Flash Memory,
3.0 Volt-only Read, Program, and Erase
Valid Combinations to be Supported for this Device
128 Mb Products Based on 110 nm Floating Gate Technology
Device Number/
Description
Speed (ns)
Package
Type
Temperature
Range
Additional
Ordering Options
CE#
Configuration
S29PL127J
60, 65, 70
BA, BF, TA, TF
W, I
00, 13
Single CE#
S29PL127J
80
BA, BF
W, I
01
Single CE#
64 Mb Products Based on 110 nm Floating Gate Technology
Device Number/
Description
Speed (ns)
Package
Type
Temperature
Range
Additional
Ordering Options
S29PL064J
55, 60, 70
BA, BF
W, I
12, 15
32 Mb Products Based on 110 nm Floating Gate Technology
12
Device Number/
Description
Speed (ns)
Package
Type
Temperature
Range
Additional
Ordering Options
S29PL032J
55, 60, 70
BA, BF
W, I
12, 15
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
Valid Combinations for BGA Packages
Order Number (Note 1)
Speed (ns)
PL129J, PL127J,PL064J, PL032J
55, 60, 65, 70 (3)
VIO Range
2.7–3.6
PL129J, PL127J
80
1.65–1.95
Notes
1. Please contact the factory for PL129J availability.
2. BGA package marking omits leading S29 and packing type designator from ordering part number.
3. 55 ns speed only supported for PL032J and PL127J.
Valid Combinations for TSOP Packages
Order Number
Speed (ns)
VIO Range
S29PL127J
60, 70
2.7–3.6
Note
TSOP package markings omit packing type designator from ordering part number.
3. Product Selector Guide
Speed Option
Part Number →
S29PL032J/S29PL064J/S29PL0127J/S29PL129J
VCC,VIO = 2.7 V – 3.6 V
55
(See Note)
60
65
—
70
—
—
—
80
—
60
65
80
70
30
30
VCC = 2.7 V – 3.6 V,
VIO = 1.65 V – 1.95 V
(PL127J and PL129J only)
Max Access Time, ns (tACC)
55
Max CE# Access, ns (tCE)
(See Note)
Max Page Access, ns (tPACC)
20
(See Note)
Max OE# Access, ns (tOE)
25
Note
55 ns speed bin only supported for PL032J and PL064J.
April 18, 2013 S29PL-J_00_A16
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D at a
S hee t
4. Block Diagram
DQ15–DQ0
RY/BY#
VCC
VSS
Sector
Switches
VIO
RESET#
Input/Output
Buffers
Erase Voltage
Generator
WE#
State
Control
Command
Register
PGM Voltage
Generator
Chip Enable
Output Enable
Logic
CE#
OE#
Y-Decoder
Timer
Address Latch
VCC Detector
Amax–A3
X-Decoder
Data Latch
Y-Gating
Cell Matrix
A2–A0
Notes
1. RY/BY# is an open drain output.
2. Amax = A22 (PL127J), A21 (PL129J and PL064J), A20 (PL032J)
3. For PL129J there are two CE# (CE1# and CE2#)
14
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
5. Simultaneous Read/Write Block Diagram
VCC
VSS
OE#
Mux
Bank A
Bank B
X-Decoder
Amax–A0
Status
DQ15–DQ0
Control
Mux
DQ15–DQ0
CE#
WP#/ACC
STATE
CONTROL
&
COMMAND
REGISTER
X-Decoder
A22–A0
DQ0–DQ15
Bank C
Bank C Address
X-Decoder
Amax–A0
Bank D Address
Y-gate
RESET#
WE#
DQ15–DQ0
Bank B Address
DQ15–DQ0
RY/BY#
DQ15–DQ0
A22–A0
X-Decoder
Y-gate
Bank A Address
Amax–A0
Bank D
Mux
Note
Amax = A22 (PL127J), A21 (PL064J), A20 (PL032J)
April 18, 2013 S29PL-J_00_A16
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15
D at a
S hee t
6. Simultaneous Read/Write Block Diagram (PL129J)
VCC
VSS
OE#
CE1#=L
CE2#=H
Mux
Bank 1A
Bank 1B
X-Decoder
A21–A0
RESET#
WE#
CE1#
CE2#
WP#/ACC
STATE
CONTROL
&
COMMAND
REGISTER
Status
DQ15–DQ0
Control
Mux
DQ15–DQ0
CE1#=H
CE2#=L
X-Decoder
Bank 2A
Bank 2A Address
X-Decoder
Bank 2B Address
Y-gate
A21–A0
DQ0–DQ15
A21–A0
DQ15–DQ0
Bank 1B Address
DQ15–DQ0
RY/BY#
DQ15–DQ0
A21–A0
X-Decoder
Y-gate
Bank 1A Address
A21–A0
Bank 2B
Mux
Note
Amax = A21 (PL129J)
16
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
7.
She et
Connection Diagrams
7.1
7.1.1
Special Package Handling Instructions
TSOP, BGA, PDIP, SSOP, and PLCC Packages
Special handling is required for Flash Memory products in molded packages.
The package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
7.1.2
FBGA Packages
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
7.2
80-Ball Fine-Pitch BGA—PL127J
Figure 7.1 80-Ball Fine-Pitch BGA, Top View, Balls Facing Down—PL127J
A8
B8
C8
D8
E8
F8
G8
H8
J8
K8
L8
M8
NC
NC
NC
A22
NC
VIO
VSS
NC
NC
NC
NC
NC
A7
B7
C7
D7
E7
F7
G7
H7
J7
K7
L7
M7
NC
NC
A13
A12
A14
A15
A16
NC
DQ15
VSS
NC
NC
C6
D6
E6
F6
G6
H6
J6
K6
A9
A8
A10
A11
DQ7
DQ14
DQ13
DQ6
C5
D5
E5
F5
G5
H5
J5
K5
WE#
RESET#
A21
A19
DQ5
DQ12
VCC
DQ4
C4
D4
RY/BY# WP#/ACC
E4
F4
G4
H4
J4
K4
A18
A20
DQ2
DQ10
DQ11
DQ3
C3
D3
E3
F3
G3
H3
J3
K3
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
A2
B2
C2
D2
E2
F2
G2
H2
J2
K2
L2
M2
NC
NC
A3
A4
A2
A1
A0
CE#
OE#
VSS
NC
NC
A1
B1
C1
D1
E1
F1
G1
H1
J1
K1
L1
M1
NC
NC
NC
NC
NC
NC
NC
VIO
NC
NC
NC
NC
April 18, 2013 S29PL-J_00_A16
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7.3
S hee t
64-Ball Fine-Pitch BGA—MCP Compatible—PL127J
Figure 7.2 64-Ball Fine-Pitch BGA, MCP Compatible, Top View, Balls Facing Down—PL127J
A1
A10
NC
NC
D2
18
C3
C4
A7
RFU
D3
D4
A3
A6
RFU
E2
E3
E4
B5
B6
RFU
RFU
C5
C6
WP#/ACC WE#
D5
D6
RESET# RFU
E5
A2
A5
A18
F2
F3
F4
A1
A4
A17
E6
RY/BY # A20
C7
C8
A8
A11
D7
D8
D9
A19
A12
A15
E7
E8
E9
A13
A21
F7
F8
F9
A10
A14
A22
A9
G2
G3
G4
G7
G8
A0
VSS
DQ1
DQ6
RFU
G9
H2
H3
H4
H5
H6
H7
H8
H9
CE#f1
OE#
DQ9
DQ3
DQ4
DQ13
DQ15
VCCf
A16
J2
J3
J4
J5
J6
J7
J8
J9
RFU
DQ0
DQ10
VCCf
RFU
DQ12
DQ7
VSS
K3
K4
K5
K6
K7
K8
DQ8
DQ2
DQ11
RFU
DQ5
DQ14
L5
L6
RFU
RFU
M1
M10
NC
NC
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
7.4
She et
48-Ball Fine-Pitch BGA, PL064J and PL032J
Figure 7.3 48-Ball Fine-Pitch BGA, Top View, Balls Facing Down—PL064J—PL032J: C4(A21)=NC
A6
B6
C6
D6
E6
F6
G6
H6
A13
A12
A14
A15
A16
NC
DQ15
VSS
A5
B5
C5
D5
E5
F5
G5
H5
A9
A8
A10
A11
DQ7
DQ14
DQ13
DQ6
A4
B4
C4
D4
E4
F4
G4
H4
WE#
RESET#
A21
A19
DQ5
DQ12
VCC
DQ4
A3
B3
C3
D3
E3
F3
G3
H3
A18
A20
DQ2
DQ10
DQ11
DQ3
RY/BY# WP#/ACC
April 18, 2013 S29PL-J_00_A16
A2
B2
C2
D2
E2
F2
G2
H2
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
A1
B1
C1
D1
E1
F1
G1
H1
A3
A4
A2
A1
A0
CE#
OE#
VSS
S29PL-J
19
D at a
7.5
S hee t
56-Pin TSOP 20 x 14 mm
Figure 7.4 56-Pin TSOP 20 x 14 mm Configuration—PL127J
RESET#
RY/BY#
A0
A1
A2
A3
A4
A5
VCC
DQ0
DQ1
DQ2
DQ3
VSSQ
VCCQ
DQ4
DQ5
DQ6
DQ7
VSS
NC
A6
A7
A8
A9
A10
A11
A12
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
WP#/ACC
WE#
NC
A22
A21
A20
OE#
NC
CE#
VSS
DQ15
DQ14
DQ13
DQ12
VSSQ
VCCQ
DQ11
DQ10
DQ9
DQ8
VCC
A19
A18
A17
A16
A15
A14
A13
For this family of products, a single multi-chip compatible package (TSOP) is offered for each density to allow
both standalone and multi-chip qualification using a single, adaptable package. This new methodology allows
package standardization resulting in faster development. The multi-chip compatible package includes all the
pins required for standalone device operation and verification. In addition, extra pins are included for insertion
of common data storage or logic devices to be used for multi-chip products. If a standalone device is required,
the extra multi-chip specific pins are not connected and the standalone device operates normally. The multichip compatible package sizes were chosen to serve the largest number of combinations possible. There are
only a few cases where a larger package size would be required to accommodate the multi-chip combination.
This multi-chip compatible package set does not allow for direct package migration from the Am29BDS128H,
Am29BDS128G, Am29BDS640G products, which use legacy standalone packages.
20
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
7.6
She et
56-Ball Fine-Pitch Ball Grid Array, PL064J and PL032J
Figure 7.5 56-ball Fine-Pitch BGA, Top View, Balls Facing Down,—PL064J and PL032J,
April 18, 2013 S29PL-J_00_A16
A2
A3
A4
A5
A6
A7
A7
RFU
WP/ACC
WE#
A8
A11
B1
B2
B3
B4
B5
B6
B7
B8
A3
A6
RFU
RST#
RFU
A19
A12
A15
C1
C2
C3
C4
C5
C6
C7
C8
A2
A5
A18
RY/BY#
A20
A9
A13
A21
D1
D2
D3
D6
D7
D8
A1
A4
A17
A10
A14
RFU
E1
E2
E3
E6
E7
E8
A0
VSS
DQ1
DQ6
RFU
A16
F1
F2
F3
F4
F5
F6
F7
F8
CE1#f
OE#
DQ9
DQ3
DQ4
DQ13
DQ15
RFU
G1
G2
G3
G4
G5
G6
G7
G8
RFU
DQ0
DQ10
VCCf
RFU
DQ12
DQ7
VSS
H2
H3
H4
H5
H6
H7
DQ8
DQ2
DQ11
RFU
DQ5
DQ14
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D at a
8.
S hee t
Pin Description
Amax–A0
Address bus
DQ15–DQ0
16-bit data inputs/outputs/float
CE#
Chip Enable Inputs
OE#
Output Enable Input
WE#
Write Enable
VSS
Device Ground
NC
Not Connected. No device internal signal is connected to the package connector nor is there any future plan to
use the connector for a signal. The connection may safely be used for routing space for a signal on a Printed
Circuit Board (PCB).
RFU
Reserved for Future Use. Not currently connected internally but the pin/ball location should be left
unconnected and unused by PCB routing channel for future compatibility. The pin/ball may be
used by a signal in the future.
Ready/Busy output and open drain.
RY/BY#
When RY/BY#= VIH, the device is ready to accept read operations and commands. When RY/
BY#= VOL, the device is either executing an embedded algorithm or the device is executing a
hardware reset operation.
Write Protect/Acceleration Input.
WP#/ACC
VIO
VCC
RESET#
When WP#/ACC= VIL, the highest and lowest two 4K-word sectors are write protected regardless
of other sector protection configurations. When WP#/ACC= VIH, these sector are unprotected
unless the DYB or PPB is programmed. When WP#/ACC= VHH, program and erase operations
are accelerated.
Input/Output Buffer Power Supply
(1.65 V to 1.95 V (for PL127J and PL129J) or 2.7 V to 3.6 V (for all PLxxxJ devices))
Chip Power Supply
(2.7 V to 3.6 V or 2.7 to 3.3 V)
Hardware Reset Pin
Chip Enable Inputs.
CE1#, CE2#
CE1# controls the 64Mb in Banks 1A and 1B.
CE2# controls the 64 Mb in Banks 2A and 2B. (Only for PL129J)
Note
Amax = A22 (PL127J), A21 (PL129J and PL064J), A20 (PL032J)
9. Logic Symbol
max+1
Amax–A0
16
DQ15–DQ0
CE#
OE#
WE#
WP#/ACC
RESET#
RY/BY#
VIO (VCCQ)
22
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Data
She et
10. Device Bus Operations
This section describes the requirements and use of the device bus operations, which are initiated through the
internal command register. The command register itself does not occupy any addressable memory location.
The register is a latch used to store the commands, along with the address and data information needed to
execute the command. The contents of the register serve as inputs to the internal state machine. The state
machine outputs dictate the function of the device. Table 10.1 lists the device bus operations, the inputs and
control levels they require, and the resulting output. The following subsections describe each of these
operations in further detail.
Table 10.1 PL127J Device Bus Operations
Operation
CE#
OE#
WE#
RESET#
WP#/ACC
Addresses
(Amax–A0)
DQ15–
DQ0
DOUT
Read
L
L
H
H
X
AIN
Write
L
H
L
H
X (Note 2)
AIN
DIN
VIO±0.3 V
X
X
VIO ±0.3 V
X (Note 2)
X
High-Z
Output Disable
L
H
H
H
X
X
High-Z
Reset
X
X
X
L
X
X
High-Z
Temporary Sector Unprotect
(High Voltage)
X
X
X
VID
X
AIN
DIN
Standby
Table 10.2 PL129J Device Bus Operations
Operation
CE1#
CE2#
L
H
H
L
OE#
WE#
RESET#
WP#/ACC
Addresses
(A21–A0)
DQ15–
DQ0
L
H
H
X
AIN
DOUT
H
L
H
X
(Note 2)
AIN
DIN
Read
L
H
H
L
VIO±
0.3 V
VIO ±
0.3 V
X
X
VIO ±
0.3 V
X
X
High-Z
Output Disable
L
L
H
H
H
X
X
High-Z
Reset
X
X
X
X
L
X
X
High-Z
Temporary Sector Unprotect
(High Voltage)
X
X
X
X
VID
X
AIN
DIN
Write
Standby
Legend:
L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 8.5–9.5 V, X = Don’t Care, SA = Sector Address, AIN = Address In, DIN
= Data In, DOUT = Data Out
Notes
1. The sector protect and sector unprotect functions may also be implemented via programming equipment. See High Voltage Sector
Protection on page 52.
2. WP#/ACC must be high when writing to upper two and lower two sectors.
10.1
Requirements for Reading Array Data
To read array data from the outputs, the system must drive the OE# and appropriate CE# pins (For PL129J CE1#/CE2# pins) to VIL. In PL129J, CE1# and CE2# are the power control and select the lower (CE1#) or
upper (CE2#) halves of the device. CE# is the power control. OE# is the output control and gates array data
to the output pins. WE# should remain at VIH.
The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory content occurs during the power transition. No command is
necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses
on the device address inputs produce valid data on the device data outputs. Each bank remains enabled for
read access until the command register contents are altered.
Refer to Table 21.3 on page 88 for timing specifications and to Figure 20.3 on page 77 for the timing diagram.
ICC1 in the DC Characteristics table represents the active current specification for reading array data.
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10.1.1
S hee t
Random Read (Non-Page Read)
Address access time (tACC) is equal to the delay from stable addresses to valid output data. The chip enable
access time (tCE) is the delay from the stable addresses and stable CE# to valid data at the output inputs. The
output enable access time is the delay from the falling edge of the OE# to valid data at the output inputs
(assuming the addresses have been stable for at least tACC–tOE time).
10.1.2
Page Mode Read
The device is capable of fast page mode read and is compatible with the page mode Mask ROM read
operation. This mode provides faster read access speed for random locations within a page. Address bits
Amax–A3 select an 8 word page, and address bits A2–A0 select a specific word within that page. This is an
asynchronous operation with the microprocessor supplying the specific word location.
The random or initial page access is tACC or tCE and subsequent page read accesses (as long as the
locations specified by the microprocessor falls within that page) is equivalent to tPACC. When CE# (CE1# and
CE#2 in PL129J) is deasserted (=VIH), the reassertion of CE# (CE1# or CE#2 in PL129J) for subsequent
access has access time of tACC or tCE. Here again, CE# (CE1# /CE#2 in PL129J)selects the device and OE#
is the output control and should be used to gate data to the output inputs if the device is selected. Fast page
mode accesses are obtained by keeping Amax–A3 constant and changing A2–A0 to select the specific word
within that page.
Table 10.3 Page Select
10.2
Word
A2
A1
A0
Word 0
0
0
0
Word 1
0
0
1
Word 2
0
1
0
Word 3
0
1
1
Word 4
1
0
0
Word 5
1
0
1
Word 6
1
1
0
Word 7
1
1
1
Simultaneous Read/Write Operation
In addition to the conventional features (read, program, erase-suspend read, erase-suspend program, and
program-suspend read), the device is capable of reading data from one bank of memory while a program or
erase operation is in progress in another bank of memory (simultaneous operation). The bank can be
selected by bank addresses (PL127J: A22–A20, PL129J and PL064J: A21–A19, PL032J: A20–A18) with
zero latency.
The simultaneous operation can execute multi-function mode in the same bank.
Table 10.4 Bank Select
Bank
24
PL127J: A22–A20, PL064J: A21–A19, PL032J: A20–A18
Bank A
000
Bank B
001, 010, 011
Bank C
100, 101, 110
Bank D
111
Bank
CE1#
CE2#
PL129J: A21–A20
Bank 1A
0
1
00
Bank 1B
0
1
01, 10, 11
Bank 2A
1
0
00, 01, 10
Bank 2B
1
0
11
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
10.3
She et
Writing Commands/Command Sequences
To write a command or command sequence (which includes programming data to the device and erasing
sectors of memory), the system must drive WE# and CE# (CE1# or CE#2 in PL129J) to VIL, and OE# to VIH.
The device features an Unlock Bypass mode to facilitate faster programming. Once a bank enters the
Unlock Bypass mode, only two write cycles are required to program a word, instead of four. Word Program
Command Sequence on page 61 has details on programming data to the device using both standard and
Unlock Bypass command sequences.
An erase operation can erase one sector, multiple sectors, or the entire device. Table 10.4 on page 24
indicates the set of address space that each sector occupies. A “bank address” is the set of address bits
required to uniquely select a bank. Similarly, a “sector address” refers to the address bits required to uniquely
select a sector. Command Definitions on page 59 has details on erasing a sector or the entire chip, or
suspending/resuming the erase operation.
ICC2 in the DC Characteristics on page 75 represents the active current specification for the write mode. See
the timing specification tables and timing diagrams in section Reset on page 79 for write operations.
10.3.1
Accelerated Program Operation
The device offers accelerated program operations through the ACC function. This function is primarily
intended to allow faster manufacturing throughput at the factory.
If the system asserts VHH on this pin, the device automatically enters the aforementioned Unlock Bypass
mode, temporarily unprotects any protected sectors, and uses the higher voltage on the pin to reduce the
time required for program operations. The system would use a two-cycle program command sequence as
required by the Unlock Bypass mode. Removing VHH from the WP#/ACC pin returns the device to normal
operation. Note that VHH must not be asserted on WP#/ACC for operations other than accelerated
programming, or device damage may result. In addition, the WP#/ACC pin should be raised to VCC when not
in use. That is, the WP#/ACC pin should not be left floating or unconnected; inconsistent behavior of the
device may result.
10.3.2
Autoselect Functions
If the system writes the autoselect command sequence, the device enters the autoselect mode. The system
can then read autoselect codes from the internal register (which is separate from the memory array) on
DQ15–DQ0. Standard read cycle timings apply in this mode. Refer to the Table 10.9, Secured Silicon Sector
Addresses on page 43 and Autoselect Command Sequence on page 60 for more information.
10.4
Standby Mode
When the system is not reading or writing to the device, it can place the device in the standby mode. In this
mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state,
independent of the OE# input.
The device enters the CMOS standby mode when the CE# (CE1#,CE#2 in PL129J) and RESET# pins are
both held at VIO ± 0.3 V. (Note that this is a more restricted voltage range than VIH.) If CE# (CE1#,CE#2 in
PL129J) and RESET# are held at VIH, but not within VIO ± 0.3 V, the device will be in the standby mode, but
the standby current will be greater. The device requires standard access time (tCE) for read access when the
device is in either of these standby modes, before it is ready to read data.
If the device is deselected during erasure or programming, the device draws active current until the operation
is completed.
ICC3 in DC Characteristics on page 75 represents the CMOS standby current specification.
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25
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10.5
S hee t
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables
this mode when addresses remain stable for tACC + 30 ns. The automatic sleep mode is independent of the
CE#, WE#, and OE# control signals. Standard address access timings provide new data when addresses are
changed. While in sleep mode, output data is latched and always available to the system. Note that during
automatic sleep mode, OE# must be at VIH before the device reduces current to the stated sleep mode
specification. ICC5 in DC Characteristics on page 75 represents the automatic sleep mode current
specification.
10.6
RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of resetting the device to reading array data. When the
RESET# pin is driven low for at least a period of tRP, the device immediately terminates any operation in
progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse.
The device also resets the internal state machine to reading array data. The operation that was interrupted
should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity.
Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS±0.3 V, the device
draws CMOS standby current (ICC4). If RESET# is held at VIL but not within VSS±0.3 V, the standby current
will be greater.
The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash
memory, enabling the system to read the boot-up firmware from the Flash memory.
If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the
internal reset operation is complete, which requires a time of tREADY (during Embedded Algorithms). The
system can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is
asserted when a program or erase operation is not executing (RY/BY# pin is “1”), the reset operation is
completed within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after the
RESET# pin returns to VIH.
Refer to the tables in AC Characteristic on page 76 for RESET# parameters and to Figure 20.5 on page 79
for the timing diagram.
10.7
Output Disable Mode
When the OE# input is at VIH, output from the device is disabled. The output pins (except for RY/BY#) are
placed in the highest Impedance state
Table 10.5 PL127J Sector Architecture (Sheet 1 of 7)
Bank A
Bank
26
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA0
00000000000
4
000000h–000FFFh
SA1
00000000001
4
001000h–001FFFh
SA2
00000000010
4
002000h–002FFFh
SA3
00000000011
4
003000h–003FFFh
SA4
00000000100
4
004000h–004FFFh
SA5
00000000101
4
005000h–005FFFh
SA6
00000000110
4
006000h–006FFFh
SA7
00000000111
4
007000h–007FFFh
SA8
00000001XXX
32
008000h–00FFFFh
SA9
00000010XXX
32
010000h–017FFFh
SA10
00000011XXX
32
018000h–01FFFFh
SA11
00000100XXX
32
020000h–027FFFh
SA12
00000101XXX
32
028000h–02FFFFh
SA13
00000110XXX
32
030000h–037FFFh
SA14
00000111XXX
32
038000h–03FFFFh
SA15
00001000XXX
32
040000h–047FFFh
SA16
00001001XXX
32
048000h–04FFFFh
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
Table 10.5 PL127J Sector Architecture (Sheet 2 of 7)
Bank B
Bank A
Bank
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA17
00001010XXX
32
050000h–057FFFh
SA18
00001011XXX
32
058000h–05FFFFh
SA19
00001100XXX
32
060000h–067FFFh
SA20
00001101XXX
32
068000h–06FFFFh
SA21
00001110XXX
32
070000h–077FFFh
SA22
00001111XXX
32
078000h–07FFFFh
SA23
00010000XXX
32
080000h–087FFFh
SA24
00010001XXX
32
088000h–08FFFFh
SA25
00010010XXX
32
090000h–097FFFh
SA26
00010011XXX
32
098000h–09FFFFh
SA27
00010100XXX
32
0A0000h–0A7FFFh
SA28
00010101XXX
32
0A8000h–0AFFFFh
SA29
00010110XXX
32
0B0000h–0B7FFFh
SA30
00010111XXX
32
0B8000h–0BFFFFh
SA31
00011000XXX
32
0C0000h–0C7FFFh
SA32
00011001XXX
32
0C8000h–0CFFFFh
SA33
00011010XXX
32
0D0000h–0D7FFFh
SA34
00011011XXX
32
0D8000h–0DFFFFh
SA35
00011100XXX
32
0E0000h–0E7FFFh
SA36
00011101XXX
32
0E8000h–0EFFFFh
SA37
00011110XXX
32
0F0000h–0F7FFFh
SA38
00011111XXX
32
0F8000h–0FFFFFh
SA39
00100000XXX
32
100000h–107FFFh
SA40
00100001XXX
32
108000h–10FFFFh
SA41
00100010XXX
32
110000h–117FFFh
SA42
00100011XXX
32
118000h–11FFFFh
SA43
00100100XXX
32
120000h–127FFFh
SA44
00100101XXX
32
128000h–12FFFFh
SA45
00100110XXX
32
130000h–137FFFh
SA46
00100111XXX
32
138000h–13FFFFh
SA47
00101000XXX
32
140000h–147FFFh
SA48
00101001XXX
32
148000h–14FFFFh
SA49
00101010XXX
32
150000h–157FFFh
SA50
00101011XXX
32
158000h–15FFFFh
SA51
00101100XXX
32
160000h–167FFFh
SA52
00101101XXX
32
168000h–16FFFFh
SA53
00101110XXX
32
170000h–177FFFh
SA54
00101111XXX
32
178000h–17FFFFh
SA55
00110000XXX
32
180000h–187FFFh
SA56
00110001XXX
32
188000h–18FFFFh
SA57
00110010XXX
32
190000h–197FFFh
SA58
00110011XXX
32
198000h–19FFFFh
SA59
00110100XXX
32
1A0000h–1A7FFFh
SA60
00110101XXX
32
1A8000h–1AFFFFh
SA61
00110110XXX
32
1B0000h–1B7FFFh
SA62
00110111XXX
32
1B8000h–1BFFFFh
SA63
00111000XXX
32
1C0000h–1C7FFFh
SA64
00111001XXX
32
1C8000h–1CFFFFh
SA65
00111010XXX
32
1D0000h–1D7FFFh
April 18, 2013 S29PL-J_00_A16
S29PL-J
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Table 10.5 PL127J Sector Architecture (Sheet 2 of 7)
Bank B
Bank A
Bank
28
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA17
00001010XXX
32
050000h–057FFFh
SA18
00001011XXX
32
058000h–05FFFFh
SA19
00001100XXX
32
060000h–067FFFh
SA20
00001101XXX
32
068000h–06FFFFh
SA21
00001110XXX
32
070000h–077FFFh
SA22
00001111XXX
32
078000h–07FFFFh
SA23
00010000XXX
32
080000h–087FFFh
SA24
00010001XXX
32
088000h–08FFFFh
SA25
00010010XXX
32
090000h–097FFFh
SA26
00010011XXX
32
098000h–09FFFFh
SA27
00010100XXX
32
0A0000h–0A7FFFh
SA28
00010101XXX
32
0A8000h–0AFFFFh
SA29
00010110XXX
32
0B0000h–0B7FFFh
SA30
00010111XXX
32
0B8000h–0BFFFFh
SA31
00011000XXX
32
0C0000h–0C7FFFh
SA32
00011001XXX
32
0C8000h–0CFFFFh
SA33
00011010XXX
32
0D0000h–0D7FFFh
SA34
00011011XXX
32
0D8000h–0DFFFFh
SA35
00011100XXX
32
0E0000h–0E7FFFh
SA36
00011101XXX
32
0E8000h–0EFFFFh
SA37
00011110XXX
32
0F0000h–0F7FFFh
SA38
00011111XXX
32
0F8000h–0FFFFFh
SA39
00100000XXX
32
100000h–107FFFh
SA40
00100001XXX
32
108000h–10FFFFh
SA41
00100010XXX
32
110000h–117FFFh
SA42
00100011XXX
32
118000h–11FFFFh
SA43
00100100XXX
32
120000h–127FFFh
SA44
00100101XXX
32
128000h–12FFFFh
SA45
00100110XXX
32
130000h–137FFFh
SA46
00100111XXX
32
138000h–13FFFFh
SA47
00101000XXX
32
140000h–147FFFh
SA48
00101001XXX
32
148000h–14FFFFh
SA49
00101010XXX
32
150000h–157FFFh
SA50
00101011XXX
32
158000h–15FFFFh
SA51
00101100XXX
32
160000h–167FFFh
SA52
00101101XXX
32
168000h–16FFFFh
SA53
00101110XXX
32
170000h–177FFFh
SA54
00101111XXX
32
178000h–17FFFFh
SA55
00110000XXX
32
180000h–187FFFh
SA56
00110001XXX
32
188000h–18FFFFh
SA57
00110010XXX
32
190000h–197FFFh
SA58
00110011XXX
32
198000h–19FFFFh
SA59
00110100XXX
32
1A0000h–1A7FFFh
SA60
00110101XXX
32
1A8000h–1AFFFFh
SA61
00110110XXX
32
1B0000h–1B7FFFh
SA62
00110111XXX
32
1B8000h–1BFFFFh
SA63
00111000XXX
32
1C0000h–1C7FFFh
SA64
00111001XXX
32
1C8000h–1CFFFFh
SA65
00111010XXX
32
1D0000h–1D7FFFh
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
Table 10.5 PL127J Sector Architecture (Sheet 3 of 7)
Bank B
Bank
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA66
00111011XXX
32
1D8000h–1DFFFFh
SA67
00111100XXX
32
1E0000h–1E7FFFh
SA68
00111101XXX
32
1E8000h–1EFFFFh
SA69
00111110XXX
32
1F0000h–1F7FFFh
SA70
00111111XXX
32
1F8000h–1FFFFFh
SA71
01000000XXX
32
200000h–207FFFh
SA72
01000001XXX
32
208000h–20FFFFh
SA73
01000010XXX
32
210000h–217FFFh
SA74
01000011XXX
32
218000h–21FFFFh
SA75
01000100XXX
32
220000h–227FFFh
SA76
01000101XXX
32
228000h–22FFFFh
SA77
01000110XXX
32
230000h–237FFFh
SA78
01000111XXX
32
238000h–23FFFFh
SA79
01001000XXX
32
240000h–247FFFh
SA80
01001001XXX
32
248000h–24FFFFh
SA81
01001010XXX
32
250000h–257FFFh
SA82
01001011XXX
32
258000h–25FFFFh
SA83
01001100XXX
32
260000h–267FFFh
SA84
01001101XXX
32
268000h–26FFFFh
SA85
01001110XXX
32
270000h–277FFFh
SA86
01001111XXX
32
278000h–27FFFFh
SA87
01010000XXX
32
280000h–287FFFh
SA88
01010001XXX
32
288000h–28FFFFh
SA89
01010010XXX
32
290000h–297FFFh
SA90
01010011XXX
32
298000h–29FFFFh
SA91
01010100XXX
32
2A0000h–2A7FFFh
SA92
01010101XXX
32
2A8000h–2AFFFFh
SA93
01010110XXX
32
2B0000h–2B7FFFh
SA94
01010111XXX
32
2B8000h–2BFFFFh
SA95
01011000XXX
32
2C0000h–2C7FFFh
SA96
01011001XXX
32
2C8000h–2CFFFFh
SA97
01011010XXX
32
2D0000h–2D7FFFh
SA98
01011011XXX
32
2D8000h–2DFFFFh
SA99
01011100XXX
32
2E0000h–2E7FFFh
SA100
01011101XXX
32
2E8000h–2EFFFFh
SA101
01011110XXX
32
2F0000h–2F7FFFh
SA102
01011111XXX
32
2F8000h–2FFFFFh
SA103
01100000XXX
32
300000h–307FFFh
SA104
01100001XXX
32
308000h–30FFFFh
SA105
01100010XXX
32
310000h–317FFFh
SA106
01100011XXX
32
318000h–31FFFFh
SA107
01100100XXX
32
320000h–327FFFh
SA108
01100101XXX
32
328000h–32FFFFh
SA109
01100110XXX
32
330000h–337FFFh
SA110
01100111XXX
32
338000h–33FFFFh
SA111
01101000XXX
32
340000h–347FFFh
SA112
01101001XXX
32
348000h–34FFFFh
SA113
01101010XXX
32
350000h–357FFFh
SA114
01101011XXX
32
358000h–35FFFFh
April 18, 2013 S29PL-J_00_A16
S29PL-J
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Table 10.5 PL127J Sector Architecture (Sheet 4 of 7)
Bank C
Bank B
Bank
30
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA115
01101100XXX
32
360000h–367FFFh
SA116
01101101XXX
32
368000h–36FFFFh
SA117
01101110XXX
32
370000h–377FFFh
SA118
01101111XXX
32
378000h–37FFFFh
SA119
01110000XXX
32
380000h–387FFFh
SA120
01110001XXX
32
388000h–38FFFFh
SA121
01110010XXX
32
390000h–397FFFh
SA122
01110011XXX
32
398000h–39FFFFh
SA123
01110100XXX
32
3A0000h–3A7FFFh
SA124
01110101XXX
32
3A8000h–3AFFFFh
SA125
01110110XXX
32
3B0000h–3B7FFFh
SA126
01110111XXX
32
3B8000h–3BFFFFh
SA127
01111000XXX
32
3C0000h–3C7FFFh
SA128
01111001XXX
32
3C8000h–3CFFFFh
SA129
01111010XXX
32
3D0000h–3D7FFFh
SA130
01111011XXX
32
3D8000h–3DFFFFh
SA131
01111100XXX
32
3E0000h–3E7FFFh
SA132
01111101XXX
32
3E8000h–3EFFFFh
SA133
01111110XXX
32
3F0000h–3F7FFFh
SA134
01111111XXX
32
3F8000h–3FFFFFh
SA135
10000000XXX
32
400000h–407FFFh
SA136
10000001XXX
32
408000h–40FFFFh
SA137
10000010XXX
32
410000h–417FFFh
SA138
10000011XXX
32
418000h–41FFFFh
SA139
10000100XXX
32
420000h–427FFFh
SA140
10000101XXX
32
428000h–42FFFFh
SA141
10000110XXX
32
430000h–437FFFh
SA142
10000111XXX
32
438000h–43FFFFh
SA143
10001000XXX
32
440000h–447FFFh
SA144
10001001XXX
32
448000h–44FFFFh
SA145
10001010XXX
32
450000h–457FFFh
SA146
10001011XXX
32
458000h–45FFFFh
SA147
10001100XXX
32
460000h–467FFFh
SA148
10001101XXX
32
468000h–46FFFFh
SA149
10001110XXX
32
470000h–477FFFh
SA150
10001111XXX
32
478000h–47FFFFh
SA151
10010000XXX
32
480000h–487FFFh
SA152
10010001XXX
32
488000h–48FFFFh
SA153
10010010XXX
32
490000h–497FFFh
SA154
10010011XXX
32
498000h–49FFFFh
SA155
10010100XXX
32
4A0000h–4A7FFFh
SA156
10010101XXX
32
4A8000h–4AFFFFh
SA157
10010110XXX
32
4B0000h–4B7FFFh
SA158
10010111XXX
32
4B8000h–4BFFFFh
SA159
10011000XXX
32
4C0000h–4C7FFFh
SA160
10011001XXX
32
4C8000h–4CFFFFh
SA161
10011010XXX
32
4D0000h–4D7FFFh
SA162
10011011XXX
32
4D8000h–4DFFFFh
SA163
10011100XXX
32
4E0000h–4E7FFFh
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
Table 10.5 PL127J Sector Architecture (Sheet 5 of 7)
Bank C
Bank
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA164
10011101XXX
32
4E8000h–4EFFFFh
SA165
10011110XXX
32
4F0000h–4F7FFFh
SA166
10011111XXX
32
4F8000h–4FFFFFh
SA167
10100000XXX
32
500000h–507FFFh
SA168
10100001XXX
32
508000h–50FFFFh
SA169
10100010XXX
32
510000h–517FFFh
SA170
10100011XXX
32
518000h–51FFFFh
SA171
10100100XXX
32
520000h–527FFFh
SA172
10100101XXX
32
528000h–52FFFFh
SA173
10100110XXX
32
530000h–537FFFh
SA174
10100111XXX
32
538000h–53FFFFh
SA175
10101000XXX
32
540000h–547FFFh
SA176
10101001XXX
32
548000h–54FFFFh
SA177
10101010XXX
32
550000h–557FFFh
SA178
10101011XXX
32
558000h–15FFFFh
SA179
10101100XXX
32
560000h–567FFFh
SA180
10101101XXX
32
568000h–56FFFFh
SA181
10101110XXX
32
570000h–577FFFh
SA182
10101111XXX
32
578000h–57FFFFh
SA183
10110000XXX
32
580000h–587FFFh
SA184
10110001XXX
32
588000h–58FFFFh
SA185
10110010XXX
32
590000h–597FFFh
SA186
10110011XXX
32
598000h–59FFFFh
SA187
10110100XXX
32
5A0000h–5A7FFFh
SA188
10110101XXX
32
5A8000h–5AFFFFh
SA189
10110110XXX
32
5B0000h–5B7FFFh
SA190
10110111XXX
32
5B8000h–5BFFFFh
SA191
10111000XXX
32
5C0000h–5C7FFFh
SA192
10111001XXX
32
5C8000h–5CFFFFh
SA193
10111010XXX
32
5D0000h–5D7FFFh
SA194
10111011XXX
32
5D8000h–5DFFFFh
SA195
10111100XXX
32
5E0000h–5E7FFFh
SA196
10111101XXX
32
5E8000h–5EFFFFh
SA197
10111110XXX
32
5F0000h–5F7FFFh
SA198
10111111XXX
32
5F8000h–5FFFFFh
SA199
11000000XXX
32
600000h–607FFFh
SA200
11000001XXX
32
608000h–60FFFFh
SA201
11000010XXX
32
610000h–617FFFh
SA202
11000011XXX
32
618000h–61FFFFh
SA203
11000100XXX
32
620000h–627FFFh
SA204
11000101XXX
32
628000h–62FFFFh
SA205
11000110XXX
32
630000h–637FFFh
SA206
11000111XXX
32
638000h–63FFFFh
SA207
11001000XXX
32
640000h–647FFFh
SA208
11001001XXX
32
648000h–64FFFFh
SA209
11001010XXX
32
650000h–657FFFh
SA210
11001011XXX
32
658000h–65FFFFh
SA211
11001100XXX
32
660000h–667FFFh
SA212
11001101XXX
32
668000h–66FFFFh
April 18, 2013 S29PL-J_00_A16
S29PL-J
31
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Table 10.5 PL127J Sector Architecture (Sheet 6 of 7)
Bank D
Bank C
Bank
32
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA213
11001110XXX
32
670000h–677FFFh
SA214
11001111XXX
32
678000h–67FFFFh
SA215
11010000XXX
32
680000h–687FFFh
SA216
11010001XXX
32
688000h–68FFFFh
SA217
11010010XXX
32
690000h–697FFFh
SA218
11010011XXX
32
698000h–69FFFFh
SA219
11010100XXX
32
6A0000h–6A7FFFh
SA220
11010101XXX
32
6A8000h–6AFFFFh
SA221
11010110XXX
32
6B0000h–6B7FFFh
SA222
11010111XXX
32
6B8000h–6BFFFFh
SA223
11011000XXX
32
6C0000h–6C7FFFh
SA224
11011001XXX
32
6C8000h–6CFFFFh
SA225
11011010XXX
32
6D0000h–6D7FFFh
SA226
11011011XXX
32
6D8000h–6DFFFFh
SA227
11011100XXX
32
6E0000h–6E7FFFh
SA228
11011101XXX
32
6E8000h–6EFFFFh
SA229
11011110XXX
32
6F0000h–6F7FFFh
SA230
11011111XXX
32
6F8000h–6FFFFFh
SA231
11100000XXX
32
700000h–707FFFh
SA232
11100001XXX
32
708000h–70FFFFh
SA233
11100010XXX
32
710000h–717FFFh
SA234
11100011XXX
32
718000h–71FFFFh
SA235
11100100XXX
32
720000h–727FFFh
SA236
11100101XXX
32
728000h–72FFFFh
SA237
11100110XXX
32
730000h–737FFFh
SA238
11100111XXX
32
738000h–73FFFFh
SA239
11101000XXX
32
740000h–747FFFh
SA240
11101001XXX
32
748000h–74FFFFh
SA241
11101010XXX
32
750000h–757FFFh
SA242
11101011XXX
32
758000h–75FFFFh
SA243
11101100XXX
32
760000h–767FFFh
SA244
11101101XXX
32
768000h–76FFFFh
SA245
11101110XXX
32
770000h–777FFFh
SA246
11101111XXX
32
778000h–77FFFFh
SA247
11110000XXX
32
780000h–787FFFh
SA248
11110001XXX
32
788000h–78FFFFh
SA249
11110010XXX
32
790000h–797FFFh
SA250
11110011XXX
32
798000h–79FFFFh
SA251
11110100XXX
32
7A0000h–7A7FFFh
SA252
11110101XXX
32
7A8000h–7AFFFFh
SA253
11110110XXX
32
7B0000h–7B7FFFh
SA254
11110111XXX
32
7B8000h–7BFFFFh
SA255
11111000XXX
32
7C0000h–7C7FFFh
SA256
11111001XXX
32
7C8000h–7CFFFFh
SA257
11111010XXX
32
7D0000h–7D7FFFh
SA258
11111011XXX
32
7D8000h–7DFFFFh
SA259
11111100XXX
32
7E0000h–7E7FFFh
SA260
11111101XXX
32
7E8000h–7EFFFFh
SA261
11111110XXX
32
7F0000h–7F7FFFh
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
Table 10.5 PL127J Sector Architecture (Sheet 7 of 7)
Bank D
Bank
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA262
11111111000
4
7F8000h–7F8FFFh
SA263
11111111001
4
7F9000h–7F9FFFh
SA264
11111111010
4
7FA000h–7FAFFFh
SA265
11111111011
4
7FB000h–7FBFFFh
SA266
11111111100
4
7FC000h–7FCFFFh
SA267
11111111101
4
7FD000h–7FDFFFh
SA268
11111111110
4
7FE000h–7FEFFFh
SA269
11111111111
4
7FF000h–7FFFFFh
Table 10.6 PL064J Sector Architecture (Sheet 1 of 4)
Bank B
Bank A
Bank
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA0
0000000000
4
000000h–000FFFh
SA1
0000000001
4
001000h–001FFFh
SA2
0000000010
4
002000h–002FFFh
SA3
0000000011
4
003000h–003FFFh
SA4
0000000100
4
004000h–004FFFh
SA5
0000000101
4
005000h–005FFFh
SA6
0000000110
4
006000h–006FFFh
SA7
0000000111
4
007000h–007FFFh
SA8
0000001XXX
32
008000h–00FFFFh
SA9
0000010XXX
32
010000h–017FFFh
SA10
0000011XXX
32
018000h–01FFFFh
SA11
0000100XXX
32
020000h–027FFFh
SA12
0000101XXX
32
028000h–02FFFFh
SA13
0000110XXX
32
030000h–037FFFh
SA14
0000111XXX
32
038000h–03FFFFh
SA15
0001000XXX
32
040000h–047FFFh
SA16
0001001XXX
32
048000h–04FFFFh
SA17
0001010XXX
32
050000h–057FFFh
SA18
0001011XXX
32
058000h–05FFFFh
SA19
0001100XXX
32
060000h–067FFFh
SA20
0001101XXX
32
068000h–06FFFFh
SA21
0001110XXX
32
070000h–077FFFh
SA22
0001111XXX
32
078000h–07FFFFh
SA23
0010000XXX
32
080000h–087FFFh
SA24
0010001XXX
32
088000h–08FFFFh
SA25
0010010XXX
32
090000h–097FFFh
SA26
0010011XXX
32
098000h–09FFFFh
SA27
0010100XXX
32
0A0000h–0A7FFFh
0A8000h–0AFFFFh
SA28
0010101XXX
32
SA29
0010110XXX
32
0B0000h–0B7FFFh
SA30
0010111XXX
32
0B8000h–0BFFFFh
SA31
0011000XXX
32
0C0000h–0C7FFFh
SA32
0011001XXX
32
0C8000h–0CFFFFh
SA33
0011010XXX
32
0D0000h–0D7FFFh
SA34
0011011XXX
32
0D8000h–0DFFFFh
SA35
0011100XXX
32
0E0000h–0E7FFFh
SA36
0011101XXX
32
0E8000h–0EFFFFh
April 18, 2013 S29PL-J_00_A16
S29PL-J
33
D at a
S hee t
Table 10.6 PL064J Sector Architecture (Sheet 2 of 4)
Bank C
Bank B
Bank
34
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA37
0011110XXX
32
0F0000h–0F7FFFh
SA38
0011111XXX
32
0F8000h–0FFFFFh
SA39
0100000XXX
32
100000h–107FFFh
SA40
0100001XXX
32
108000h–10FFFFh
SA41
0100010XXX
32
110000h–117FFFh
SA42
0100011XXX
32
118000h–11FFFFh
SA43
0100100XXX
32
120000h–127FFFh
SA44
0100101XXX
32
128000h–12FFFFh
SA45
0100110XXX
32
130000h–137FFFh
SA46
0100111XXX
32
138000h–13FFFFh
SA47
0101000XXX
32
140000h–147FFFh
SA48
0101001XXX
32
148000h–14FFFFh
SA49
0101010XXX
32
150000h–157FFFh
SA50
0101011XXX
32
158000h–15FFFFh
SA51
0101100XXX
32
160000h–167FFFh
SA52
0101101XXX
32
168000h–16FFFFh
SA53
0101110XXX
32
170000h–177FFFh
SA54
0101111XXX
32
178000h–17FFFFh
SA55
0110000XXX
32
180000h–187FFFh
SA56
0110001XXX
32
188000h–18FFFFh
SA57
0110010XXX
32
190000h–197FFFh
SA58
0110011XXX
32
198000h–19FFFFh
SA59
0110100XXX
32
1A0000h–1A7FFFh
SA60
0110101XXX
32
1A8000h–1AFFFFh
SA61
0110110XXX
32
1B0000h–1B7FFFh
SA62
0110111XXX
32
1B8000h–1BFFFFh
SA63
0111000XXX
32
1C0000h–1C7FFFh
SA64
0111001XXX
32
1C8000h–1CFFFFh
SA65
0111010XXX
32
1D0000h–1D7FFFh
SA66
0111011XXX
32
1D8000h–1DFFFFh
SA67
0111100XXX
32
1E0000h–1E7FFFh
SA68
0111101XXX
32
1E8000h–1EFFFFh
SA69
0111110XXX
32
1F0000h–1F7FFFh
SA70
0111111XXX
32
1F8000h–1FFFFFh
SA71
1000000XXX
32
200000h–207FFFh
SA72
1000001XXX
32
208000h–20FFFFh
SA73
1000010XXX
32
210000h–217FFFh
SA74
1000011XXX
32
218000h–21FFFFh
SA75
1000100XXX
32
220000h–227FFFh
SA76
1000101XXX
32
228000h–22FFFFh
SA77
1000110XXX
32
230000h–237FFFh
SA78
1000111XXX
32
238000h–23FFFFh
SA79
1001000XXX
32
240000h–247FFFh
SA80
1001001XXX
32
248000h–24FFFFh
SA81
1001010XXX
32
250000h–257FFFh
SA82
1001011XXX
32
258000h–25FFFFh
SA83
1001100XXX
32
260000h–267FFFh
SA84
1001101XXX
32
268000h–26FFFFh
SA85
1001110XXX
32
270000h–277FFFh
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
Table 10.6 PL064J Sector Architecture (Sheet 3 of 4)
Bank D
Bank C
Bank
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA86
1001111XXX
32
278000h–27FFFFh
SA87
1010000XXX
32
280000h–287FFFh
SA88
1010001XXX
32
288000h–28FFFFh
SA89
1010010XXX
32
290000h–297FFFh
SA90
1010011XXX
32
298000h–29FFFFh
SA91
1010100XXX
32
2A0000h–2A7FFFh
SA92
1010101XXX
32
2A8000h–2AFFFFh
SA93
1010110XXX
32
2B0000h–2B7FFFh
SA94
1010111XXX
32
2B8000h–2BFFFFh
SA95
1011000XXX
32
2C0000h–2C7FFFh
SA96
1011001XXX
32
2C8000h–2CFFFFh
SA97
1011010XXX
32
2D0000h–2D7FFFh
SA98
1011011XXX
32
2D8000h–2DFFFFh
SA99
1011100XXX
32
2E0000h–2E7FFFh
SA100
1011101XXX
32
2E8000h–2EFFFFh
SA101
1011110XXX
32
2F0000h–2F7FFFh
SA102
1011111XXX
32
2F8000h–2FFFFFh
SA103
1100000XXX
32
300000h–307FFFh
SA104
1100001XXX
32
308000h–30FFFFh
SA105
1100010XXX
32
310000h–317FFFh
SA106
1100011XXX
32
318000h–31FFFFh
SA107
1100100XXX
32
320000h–327FFFh
SA108
1100101XXX
32
328000h–32FFFFh
SA109
1100110XXX
32
330000h–337FFFh
SA110
1100111XXX
32
338000h–33FFFFh
SA111
1101000XXX
32
340000h–347FFFh
SA112
1101001XXX
32
348000h–34FFFFh
SA113
1101010XXX
32
350000h–357FFFh
SA114
1101011XXX
32
358000h–35FFFFh
SA115
1101100XXX
32
360000h–367FFFh
SA116
1101101XXX
32
368000h–36FFFFh
SA117
1101110XXX
32
370000h–377FFFh
SA118
1101111XXX
32
378000h–37FFFFh
SA119
1110000XXX
32
380000h–387FFFh
SA120
1110001XXX
32
388000h–38FFFFh
SA121
1110010XXX
32
390000h–397FFFh
SA122
1110011XXX
32
398000h–39FFFFh
SA123
1110100XXX
32
3A0000h–3A7FFFh
SA124
1110101XXX
32
3A8000h–3AFFFFh
SA125
1110110XXX
32
3B0000h–3B7FFFh
SA126
1110111XXX
32
3B8000h–3BFFFFh
SA127
1111000XXX
32
3C0000h–3C7FFFh
SA128
1111001XXX
32
3C8000h–3CFFFFh
SA129
1111010XXX
32
3D0000h–3D7FFFh
SA130
1111011XXX
32
3D8000h–3DFFFFh
SA131
1111100XXX
32
3E0000h–3E7FFFh
SA132
1111101XXX
32
3E8000h–3EFFFFh
SA133
1111110XXX
32
3F0000h–3F7FFFh
SA134
1111111000
4
3F8000h–3F8FFFh
April 18, 2013 S29PL-J_00_A16
S29PL-J
35
D at a
S hee t
Table 10.6 PL064J Sector Architecture (Sheet 4 of 4)
Bank D
Bank
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA135
1111111001
4
3F9000h–3F9FFFh
SA136
1111111010
4
3FA000h–3FAFFFh
SA137
1111111011
4
3FB000h–3FBFFFh
SA138
1111111100
4
3FC000h–3FCFFFh
SA139
1111111101
4
3FD000h–3FDFFFh
SA140
1111111110
4
3FE000h–3FEFFFh
SA141
1111111111
4
3FF000h–3FFFFFh
Table 10.7 PL032J Sector Architecture (Sheet 1 of 2)
Bank B
Bank A
Bank
36
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
SA0
000000000
4
000000h–000FFFh
SA1
000000001
4
001000h–001FFFh
SA2
000000010
4
002000h–002FFFh
SA3
000000011
4
003000h–003FFFh
SA4
000000100
4
004000h–004FFFh
SA5
000000101
4
005000h–005FFFh
SA6
000000110
4
006000h–006FFFh
SA7
000000111
4
007000h–007FFFh
SA8
000001XXX
32
008000h–00FFFFh
SA9
000010XXX
32
010000h–017FFFh
SA10
000011XXX
32
018000h–01FFFFh
SA11
000100XXX
32
020000h–027FFFh
SA12
000101XXX
32
028000h–02FFFFh
SA13
000110XXX
32
030000h–037FFFh
SA14
000111XXX
32
038000h–03FFFFh
SA15
001000XXX
32
040000h–047FFFh
SA16
001001XXX
32
048000h–04FFFFh
SA17
001010XXX
32
050000h–057FFFh
SA18
001011XXX
32
058000h–05FFFFh
SA19
001100XXX
32
060000h–067FFFh
SA20
001101XXX
32
068000h–06FFFFh
SA21
001110XXX
32
070000h–077FFFh
SA22
001111XXX
32
078000h–07FFFFh
SA23
010000XXX
32
080000h–087FFFh
SA24
010001XXX
32
088000h–08FFFFh
SA25
010010XXX
32
090000h–097FFFh
SA26
010011XXX
32
098000h–09FFFFh
SA27
010100XXX
32
0A0000h–0A7FFFh
SA28
010101XXX
32
0A8000h–0AFFFFh
SA29
010110XXX
32
0B0000h–0B7FFFh
SA30
010111XXX
32
0B8000h–0BFFFFh
SA31
011000XXX
32
0C0000h–0C7FFFh
SA32
011001XXX
32
0C8000h–0CFFFFh
SA33
011010XXX
32
0D0000h–0D7FFFh
SA34
011011XXX
32
0D8000h–0DFFFFh
SA35
011100XXX
32
0E0000h–0E7FFFh
SA36
011101XXX
32
0E8000h–0EFFFFh
SA37
011110XXX
32
0F0000h–0F7FFFh
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
Table 10.7 PL032J Sector Architecture (Sheet 2 of 2)
Sector
Sector Address (A22-A12)
Sector Size (Kwords)
Address Range (x16)
Bank B
SA38
011111XXX
32
0F8000h–0FFFFFh
SA39
100000XXX
32
100000h–107FFFh
SA40
100001XXX
32
108000h–10FFFFh
SA41
100010XXX
32
110000h–117FFFh
SA42
100011XXX
32
118000h–11FFFFh
SA43
100100XXX
32
120000h–127FFFh
SA44
100101XXX
32
128000h–12FFFFh
SA45
100110XXX
32
130000h–137FFFh
SA46
100111XXX
32
138000h–13FFFFh
SA47
101000XXX
32
140000h–147FFFh
SA48
101001XXX
32
148000h–14FFFFh
SA49
101010XXX
32
150000h–157FFFh
SA50
101011XXX
32
158000h–15FFFFh
SA51
101100XXX
32
160000h–167FFFh
SA52
101101XXX
32
168000h–16FFFFh
SA53
101110XXX
32
170000h–177FFFh
SA54
101111XXX
32
178000h–17FFFFh
SA55
110000XXX
32
180000h–187FFFh
SA56
110001XXX
32
188000h–18FFFFh
SA57
110010XXX
32
190000h–197FFFh
Bank D
Bank C
Bank
SA58
110011XXX
32
198000h–19FFFFh
SA59
110100XXX
32
1A0000h–1A7FFFh
SA60
110101XXX
32
1A8000h–1AFFFFh
SA61
110110XXX
32
1B0000h–1B7FFFh
SA62
110111XXX
32
1B8000h–1BFFFFh
SA63
111000XXX
32
1C0000h–1C7FFFh
SA64
111001XXX
32
1C8000h–1CFFFFh
SA65
111010XXX
32
1D0000h–1D7FFFh
SA66
111011XXX
32
1D8000h–1DFFFFh
SA67
111100XXX
32
1E0000h–1E7FFFh
SA68
111101XXX
32
1E8000h–1EFFFFh
SA69
111110XXX
32
1F0000h–1F7FFFh
SA70
111111000
4
1F8000h–1F8FFFh
SA71
111111001
4
1F9000h–1F9FFFh
SA72
111111010
4
1FA000h–1FAFFFh
SA73
111111011
4
1FB000h–1FBFFFh
SA74
111111100
4
1FC000h–1FCFFFh
SA75
111111101
4
1FD000h–1FDFFFh
SA76
111111110
4
1FE000h–1FEFFFh
SA77
111111111
4
1FF000h–1FFFFFh
April 18, 2013 S29PL-J_00_A16
S29PL-J
37
D at a
S hee t
Table 10.8 S29PL129J Sector Architecture (Sheet 1 of 6)
Bank 1B
Bank 1A
Bank
38
Sector
CE1#
CE2#
Sector Address (A21-A12)
Sector Size (Kwords)
Address Range (x16)
SA1-0
0
1
0000000000
4
000000h–000FFFh
SA1-1
0
1
0000000001
4
001000h–001FFFh
SA1-2
0
1
0000000010
4
002000h–002FFFh
SA1-3
0
1
0000000011
4
003000h–003FFFh
SA1-4
0
1
0000000100
4
004000h–004FFFh
SA1-5
0
1
0000000101
4
005000h–005FFFh
SA1-6
0
1
0000000110
4
006000h–006FFFh
SA1-7
0
1
0000000111
4
007000h–007FFFh
SA1-8
0
1
0000001XXX
32
008000h–00FFFFh
SA1-9
0
1
0000010XXX
32
010000h–017FFFh
SA1-10
0
1
0000011XXX
32
018000h–01FFFFh
SA1-11
0
1
0000100XXX
32
020000h–027FFFh
SA1-12
0
1
0000101XXX
32
028000h–02FFFFh
SA1-13
0
1
0000110XXX
32
030000h–037FFFh
SA1-14
0
1
0000111XXX
32
038000h–03FFFFh
SA1-15
0
1
0001000XXX
32
040000h–047FFFh
SA1-16
0
1
0001001XXX
32
048000h–04FFFFh
SA1-17
0
1
0001010XXX
32
050000h–057FFFh
SA1-18
0
1
0001011XXX
32
058000h–05FFFFh
SA1-19
0
1
0001100XXX
32
060000h–067FFFh
SA1-20
0
1
0001101XXX
32
068000h–06FFFFh
SA1-21
0
1
0001110XXX
32
070000h–077FFFh
SA1-22
0
1
0001111XXX
32
078000h–07FFFFh
SA1-23
0
1
0010000XXX
32
080000h–087FFFh
SA1-24
0
1
0010001XXX
32
088000h–08FFFFh
SA1-25
0
1
0010010XXX
32
090000h–097FFFh
SA1-26
0
1
0010011XXX
32
098000h–09FFFFh
SA1-27
0
1
0010100XXX
32
0A0000h–0A7FFFh
0A8000h–0AFFFFh
SA1-28
0
1
0010101XXX
32
SA1-29
0
1
0010110XXX
32
0B0000h–0B7FFFh
SA1-30
0
1
0010111XXX
32
0B8000h–0BFFFFh
SA1-31
0
1
0011000XXX
32
0C0000h–0C7FFFh
SA1-32
0
1
0011001XXX
32
0C8000h–0CFFFFh
SA1-33
0
1
0011010XXX
32
0D0000h–0D7FFFh
SA1-34
0
1
0011011XXX
32
0D8000h–0DFFFFh
SA1-35
0
1
0011100XXX
32
0E0000h–0E7FFFh
0E8000h–0EFFFFh
SA1-36
0
1
0011101XXX
32
SA1-37
0
1
0011110XXX
32
0F0000h–0F7FFFh
SA1-38
0
1
0011111XXX
32
0F8000h–0FFFFFh
SA1-39
0
1
0100000XXX
32
100000h–107FFFh
SA1-40
0
1
0100001XXX
32
108000h–10FFFFh
SA1-41
0
1
0100010XXX
32
110000h–117FFFh
SA1-42
0
1
0100011XXX
32
118000h–11FFFFh
SA1-43
0
1
0100100XXX
32
120000h–127FFFh
SA1-44
0
1
0100101XXX
32
128000h–12FFFFh
SA1-45
0
1
0100110XXX
32
130000h–137FFFh
SA1-46
0
1
0100111XXX
32
138000h–13FFFFh
SA1-47
0
1
0101000XXX
32
140000h–147FFFh
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
Table 10.8 S29PL129J Sector Architecture (Sheet 2 of 6)
Bank 1B
Bank
Sector
CE1#
CE2#
Sector Address (A21-A12)
Sector Size (Kwords)
Address Range (x16)
SA1-48
0
1
0101001XXX
32
148000h–14FFFFh
SA1-49
0
1
0101010XXX
32
150000h–157FFFh
SA1-50
0
1
0101011XXX
32
158000h–15FFFFh
SA1-51
0
1
0101100XXX
32
160000h–167FFFh
SA1-52
0
1
0101101XXX
32
168000h–16FFFFh
SA1-53
0
1
0101110XXX
32
170000h–177FFFh
SA1-54
0
1
0101111XXX
32
178000h–17FFFFh
SA1-55
0
1
0110000XXX
32
180000h–187FFFh
SA1-56
0
1
0110001XXX
32
188000h–18FFFFh
SA1-57
0
1
0110010XXX
32
190000h–197FFFh
SA1-58
0
1
0110011XXX
32
198000h–19FFFFh
SA1-59
0
1
0110100XXX
32
1A0000h–1A7FFFh
1A8000h–1AFFFFh
SA1-60
0
1
0110101XXX
32
SA1-61
0
1
0110110XXX
32
1B0000h–1B7FFFh
SA1-62
0
1
0110111XXX
32
1B8000h–1BFFFFh
SA1-63
0
1
0111000XXX
32
1C0000h–1C7FFFh
SA1-64
0
1
0111001XXX
32
1C8000h–1CFFFFh
SA1-65
0
1
0111010XXX
32
1D0000h–1D7FFFh
SA1-66
0
1
0111011XXX
32
1D8000h–1DFFFFh
SA1-67
0
1
0111100XXX
32
1E0000h–1E7FFFh
1E8000h–1EFFFFh
SA1-68
0
1
0111101XXX
32
SA1-69
0
1
0111110XXX
32
1F0000h–1F7FFFh
SA1-70
0
1
0111111XXX
32
1F8000h–1FFFFFh
SA1-71
0
1
1000000XXX
32
200000h–207FFFh
SA1-72
0
1
1000001XXX
32
208000h–20FFFFh
SA1-73
0
1
1000010XXX
32
210000h–217FFFh
SA1-74
0
1
1000011XXX
32
218000h–21FFFFh
SA1-75
0
1
1000100XXX
32
220000h–227FFFh
SA1-76
0
1
1000101XXX
32
228000h–22FFFFh
SA1-77
0
1
1000110XXX
32
230000h–237FFFh
SA1-78
0
1
1000111XXX
32
238000h–23FFFFh
SA1-79
0
1
1001000XXX
32
240000h–247FFFh
SA1-80
0
1
1001001XXX
32
248000h–24FFFFh
SA1-81
0
1
1001010XXX
32
250000h–257FFFh
SA1-82
0
1
1001011XXX
32
258000h–25FFFFh
SA1-83
0
1
1001100XXX
32
260000h–267FFFh
SA1-84
0
1
1001101XXX
32
268000h–26FFFFh
SA1-85
0
1
1001110XXX
32
270000h–277FFFh
SA1-86
0
1
1001111XXX
32
278000h–27FFFFh
SA1-87
0
1
1010000XXX
32
280000h–287FFFh
SA1-88
0
1
1010001XXX
32
288000h–28FFFFh
SA1-89
0
1
1010010XXX
32
290000h–297FFFh
SA1-90
0
1
1010011XXX
32
298000h–29FFFFh
SA1-91
0
1
1010100XXX
32
2A0000h–2A7FFFh
2A8000h–2AFFFFh
SA1-92
0
1
1010101XXX
32
SA1-93
0
1
1010110XXX
32
2B0000h–2B7FFFh
SA1-94
0
1
1010111XXX
32
2B8000h–2BFFFFh
SA1-95
0
1
1011000XXX
32
2C0000h–2C7FFFh
SA1-96
0
1
1011001XXX
32
2C8000h–2CFFFFh
April 18, 2013 S29PL-J_00_A16
S29PL-J
39
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Table 10.8 S29PL129J Sector Architecture (Sheet 3 of 6)
Bank 2A
Bank 1B
Bank
40
Sector
CE1#
CE2#
Sector Address (A21-A12)
Sector Size (Kwords)
Address Range (x16)
SA1-97
0
1
1011010XXX
32
2D0000h–2D7FFFh
SA1-98
0
1
1011011XXX
32
2D8000h–2DFFFFh
SA1-99
0
1
1011100XXX
32
2E0000h–2E7FFFh
SA1-100
0
1
1011101XXX
32
2E8000h–2EFFFFh
SA1-101
0
1
1011110XXX
32
2F0000h–2F7FFFh
SA1-102
0
1
1011111XXX
32
2F8000h–2FFFFFh
SA1-103
0
1
1100000XXX
32
300000h–307FFFh
SA1-104
0
1
1100001XXX
32
308000h–30FFFFh
SA1-105
0
1
1100010XXX
32
310000h–317FFFh
SA1-106
0
1
1100011XXX
32
318000h–31FFFFh
SA1-107
0
1
1100100XXX
32
320000h–327FFFh
SA1-108
0
1
1100101XXX
32
328000h–32FFFFh
SA1-109
0
1
1100110XXX
32
330000h–337FFFh
SA1-110
0
1
1100111XXX
32
338000h–33FFFFh
SA1-111
0
1
1101000XXX
32
340000h–347FFFh
SA1-112
0
1
1101001XXX
32
348000h–34FFFFh
SA1-113
0
1
1101010XXX
32
350000h–357FFFh
SA1-114
0
1
1101011XXX
32
358000h–35FFFFh
SA1-115
0
1
1101100XXX
32
360000h–367FFFh
SA1-116
0
1
1101101XXX
32
368000h–36FFFFh
SA1-117
0
1
1101110XXX
32
370000h–377FFFh
SA1-118
0
1
1101111XXX
32
378000h–37FFFFh
SA1-119
0
1
1110000XXX
32
380000h–387FFFh
SA1-120
0
1
1110001XXX
32
388000h–38FFFFh
SA1-121
0
1
1110010XXX
32
390000h–397FFFh
SA1-122
0
1
1110011XXX
32
398000h–39FFFFh
SA1-123
0
1
1110100XXX
32
3A0000h–3A7FFFh
SA1-124
0
1
1110101XXX
32
3A8000h–3AFFFFh
SA1-125
0
1
1110110XXX
32
3B0000h–3B7FFFh
SA1-126
0
1
1110111XXX
32
3B8000h–3BFFFFh
SA1-127
0
1
1111000XXX
32
3C0000h–3C7FFFh
SA1-128
0
1
1111001XXX
32
3C8000h–3CFFFFh
SA1-129
0
1
1111010XXX
32
3D0000h–3D7FFFh
SA1-130
0
1
1111011XXX
32
3D8000h–3DFFFFh
SA1-131
0
1
1111100XXX
32
3E0000h–3E7FFFh
SA1-132
0
1
1111101XXX
32
3E8000h–3EFFFFh
SA1-133
0
1
1111110XXX
32
3F0000h–3F7FFFh
SA1-134
0
1
1111111XXX
32
3F8000h–3FFFFFh
SA2-0
1
0
0000000XXX
32
000000h–007FFFh
SA2-1
1
0
0000001XXX
32
008000h–00FFFFh
SA2-2
1
0
0000010XXX
32
010000h–017FFFh
SA2-3
1
0
0000011XXX
32
018000h–01FFFFh
SA2-4
1
0
0000100XXX
32
020000h–027FFFh
SA2-5
1
0
0000101XXX
32
028000h–02FFFFh
SA2-6
1
0
0000110XXX
32
030000h–037FFFh
SA2-7
1
0
0000111XXX
32
038000h–03FFFFh
SA2-8
1
0
0001000XXX
32
040000h–047FFFh
SA2-9
1
0
0001001XXX
32
048000h–04FFFFh
SA2-10
1
0
0001010XXX
32
050000h–057FFFh
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
Table 10.8 S29PL129J Sector Architecture (Sheet 4 of 6)
Bank 2A
Bank
Sector
CE1#
CE2#
Sector Address (A21-A12)
Sector Size (Kwords)
Address Range (x16)
SA2-11
1
0
0001011XXX
32
058000h–05FFFFh
SA2-12
1
0
0001100XXX
32
060000h–067FFFh
SA2-13
1
0
0001101XXX
32
068000h–06FFFFh
SA2-14
1
0
0001110XXX
32
070000h–077FFFh
SA2-15
1
0
0001111XXX
32
078000h–07FFFFh
SA2-16
1
0
0010000XXX
32
080000h–087FFFh
SA2-17
1
0
0010001XXX
32
088000h–08FFFFh
SA2-18
1
0
0010010XXX
32
090000h–097FFFh
SA2-19
1
0
0010011XXX
32
098000h–09FFFFh
SA2-20
1
0
0010100XXX
32
0A0000h–0A7FFFh
SA2-21
1
0
0010101XXX
32
0A8000h–0AFFFFh
SA2-22
1
0
0010110XXX
32
0B0000h–0B7FFFh
SA2-23
1
0
0010111XXX
32
0B8000h–0BFFFFh
SA2-24
1
0
0011000XXX
32
0C0000h–0C7FFFh
SA2-25
1
0
0011001XXX
32
0C8000h–0CFFFFh
SA2-26
1
0
0011010XXX
32
0D0000h–0D7FFFh
SA2-27
1
0
0011011XXX
32
0D8000h–0DFFFFh
SA2-28
1
0
0011100XXX
32
0E0000h–0E7FFFh
SA2-29
1
0
0011101XXX
32
0E8000h–0EFFFFh
SA2-30
1
0
0011110XXX
32
0F0000h–0F7FFFh
SA2-31
1
0
0011111XXX
32
0F8000h–0FFFFFh
SA2-32
1
0
0100000XXX
32
100000h–107FFFh
SA2-33
1
0
0100001XXX
32
108000h–10FFFFh
SA2-34
1
0
0100010XXX
32
110000h–117FFFh
SA2-35
1
0
0100011XXX
32
118000h–11FFFFh
SA2-36
1
0
0100100XXX
32
120000h–127FFFh
SA2-37
1
0
0100101XXX
32
128000h–12FFFFh
SA2-38
1
0
0100110XXX
32
130000h–137FFFh
SA2-39
1
0
0100111XXX
32
138000h–13FFFFh
SA2-40
1
0
0101000XXX
32
140000h–147FFFh
SA2-41
1
0
0101001XXX
32
148000h–14FFFFh
SA2-42
1
0
0101010XXX
32
150000h–157FFFh
SA2-43
1
0
0101011XXX
32
158000h–15FFFFh
SA2-44
1
0
0101100XXX
32
160000h–167FFFh
SA2-45
1
0
0101101XXX
32
168000h–16FFFFh
SA2-46
1
0
0101110XXX
32
170000h–177FFFh
SA2-47
1
0
0101111XXX
32
178000h–17FFFFh
SA2-48
1
0
0110000XXX
32
180000h–187FFFh
SA2-49
1
0
0110001XXX
32
188000h–18FFFFh
SA2-50
1
0
0110010XXX
32
190000h–197FFFh
SA2-51
1
0
0110011XXX
32
198000h–19FFFFh
SA2-52
1
0
0110100XXX
32
1A0000h–1A7FFFh
SA2-53
1
0
0110101XXX
32
1A8000h–1AFFFFh
SA2-54
1
0
0110110XXX
32
1B0000h–1B7FFFh
SA2-55
1
0
0110111XXX
32
1B8000h–1BFFFFh
SA2-56
1
0
0111000XXX
32
1C0000h–1C7FFFh
SA2-57
1
0
0111001XXX
32
1C8000h–1CFFFFh
SA2-58
1
0
0111010XXX
32
1D0000h–1D7FFFh
SA2-59
1
0
0111011XXX
32
1D8000h–1DFFFFh
April 18, 2013 S29PL-J_00_A16
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Table 10.8 S29PL129J Sector Architecture (Sheet 5 of 6)
Bank 2B
Bank 2A
Bank
42
Sector
CE1#
CE2#
Sector Address (A21-A12)
Sector Size (Kwords)
Address Range (x16)
SA2-60
1
0
0111100XXX
32
1E0000h–1E7FFFh
SA2-61
1
0
0111101XXX
32
1E8000h–1EFFFFh
SA2-62
1
0
0111110XXX
32
1F0000h–1F7FFFh
SA2-63
1
0
0111111XXX
32
1F8000h–1FFFFFh
SA2-64
1
0
1000000XXX
32
200000h–207FFFh
SA2-65
1
0
1000001XXX
32
208000h–20FFFFh
SA2-66
1
0
1000010XXX
32
210000h–217FFFh
SA2-67
1
0
1000011XXX
32
218000h–21FFFFh
SA2-68
1
0
1000100XXX
32
220000h–227FFFh
SA2-69
1
0
1000101XXX
32
228000h–22FFFFh
SA2-70
1
0
1000110XXX
32
230000h–237FFFh
SA2-71
1
0
1000111XXX
32
238000h–23FFFFh
SA2-72
1
0
1001000XXX
32
240000h–247FFFh
SA2-73
1
0
1001001XXX
32
248000h–24FFFFh
SA2-74
1
0
1001010XXX
32
250000h–257FFFh
SA2-75
1
0
1001011XXX
32
258000h–25FFFFh
SA2-76
1
0
1001100XXX
32
260000h–267FFFh
SA2-77
1
0
1001101XXX
32
268000h–26FFFFh
SA2-78
1
0
1001110XXX
32
270000h–277FFFh
SA2-79
1
0
1001111XXX
32
278000h–27FFFFh
SA2-80
1
0
1010000XXX
32
280000h–287FFFh
SA2-81
1
0
1010001XXX
32
288000h–28FFFFh
SA2-82
1
0
1010010XXX
32
290000h–297FFFh
SA2-83
1
0
1010011XXX
32
298000h–29FFFFh
SA2-84
1
0
1010100XXX
32
2A0000h–2A7FFFh
SA2-85
1
0
1010101XXX
32
2A8000h–2AFFFFh
SA2-86
1
0
1010110XXX
32
2B0000h–2B7FFFh
SA2-87
1
0
1010111XXX
32
2B8000h–2BFFFFh
SA2-88
1
0
1011000XXX
32
2C0000h–2C7FFFh
SA2-89
1
0
1011001XXX
32
2C8000h–2CFFFFh
SA2-90
1
0
1011010XXX
32
2D0000h–2D7FFFh
SA2-91
1
0
1011011XXX
32
2D8000h–2DFFFFh
SA2-92
1
0
1011100XXX
32
2E0000h–2E7FFFh
SA2-93
1
0
1011101XXX
32
2E8000h–2EFFFFh
SA2-94
1
0
1011110XXX
32
2F0000h–2F7FFFh
SA2-95
1
0
1011111XXX
32
2F8000h–2FFFFFh
SA2-96
1
0
1100000XXX
32
300000h–307FFFh
SA2-97
1
0
1100001XXX
32
308000h–30FFFFh
SA2-98
1
0
1100010XXX
32
310000h–317FFFh
SA2-99
1
0
1100011XXX
32
318000h–31FFFFh
SA2-100
1
0
1100100XXX
32
320000h–327FFFh
SA2-101
1
0
1100101XXX
32
328000h–32FFFFh
SA2-102
1
0
1100110XXX
32
330000h–337FFFh
SA2-103
1
0
1100111XXX
32
338000h–33FFFFh
SA2-104
1
0
1101000XXX
32
340000h–347FFFh
SA2-105
1
0
1101001XXX
32
348000h–34FFFFh
SA2-106
1
0
1101010XXX
32
350000h–357FFFh
SA2-107
1
0
1101011XXX
32
358000h–35FFFFh
SA2-108
1
0
1101100XXX
32
360000h–367FFFh
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
Table 10.8 S29PL129J Sector Architecture (Sheet 6 of 6)
Bank 2B
Bank
Sector
CE1#
CE2#
Sector Address (A21-A12)
Sector Size (Kwords)
Address Range (x16)
SA2-109
1
0
1101101XXX
32
368000h–36FFFFh
SA2-110
1
0
1101110XXX
32
370000h–377FFFh
SA2-111
1
0
1101111XXX
32
378000h–37FFFFh
SA2-112
1
0
1110000XXX
32
380000h–387FFFh
SA2-113
1
0
1110001XXX
32
388000h–38FFFFh
SA2-114
1
0
1110010XXX
32
390000h–397FFFh
SA2-115
1
0
1110011XXX
32
398000h–39FFFFh
SA2-116
1
0
1110100XXX
32
3A0000h–3A7FFFh
SA2-117
1
0
1110101XXX
32
3A8000h–3AFFFFh
SA2-118
1
0
1110110XXX
32
3B0000h–3B7FFFh
SA2-119
1
0
1110111XXX
32
3B8000h–3BFFFFh
SA2-120
1
0
1111000XXX
32
3C0000h–3C7FFFh
SA2-121
1
0
1111001XXX
32
3C8000h–3CFFFFh
SA2-122
1
0
1111010XXX
32
3D0000h–3D7FFFh
SA2-123
1
0
1111011XXX
32
3D8000h–3DFFFFh
SA2-124
1
0
1111100XXX
32
3E0000h–3E7FFFh
SA2-125
1
0
1111101XXX
32
3E8000h–3EFFFFh
SA2-126
1
0
1111110XXX
32
3F0000h–3F7FFFh
SA2-127
1
0
1111111000
4
3F8000h–3F8FFFh
SA2-128
1
0
1111111001
4
3F9000h–3F9FFFh
SA2-129
1
0
1111111010
4
3FA000h–3FAFFFh
SA2-130
1
0
1111111011
4
3FB000h–3FBFFFh
SA2-131
1
0
1111111100
4
3FC000h–3FCFFFh
SA2-132
1
0
1111111101
4
3FD000h–3FDFFFh
SA2-133
1
0
1111111110
4
3FE000h–3FEFFFh
SA2-134
1
0
1111111111
4
3FF000h–3FFFFFh
Table 10.9 Secured Silicon Sector Addresses
10.8
Sector Size
Address Range
Factory-Locked Area
64 words
000000h-00003Fh
Customer-Lockable Area
64 words
000040h-00007Fh
Autoselect Mode
The autoselect mode provides manufacturer and device identification, and sector protection verification,
through identifier codes output on DQ7–DQ0. This mode is primarily intended for programming equipment to
automatically match a device to be programmed with its corresponding programming algorithm. However, the
autoselect codes can also be accessed in-system through the command register.
When using programming equipment, the autoselect mode requires VID on address pin A9. Address pins
must be as shown in Table 10.10 on page 44 and Table 10.11 on page 44. In addition, when verifying sector
protection, the sector address must appear on the appropriate highest order address bits (see Table 10.4
on page 24). Table 10.10 and Table 10.11 show the remaining address bits that are don’t care. When all
necessary bits have been set as required, the programming equipment may then read the corresponding
identifier code on DQ7–DQ0. However, the autoselect codes can also be accessed in-system through the
command register, for instances when the device is erased or programmed in a system without access to
high voltage on the A9 pin. The command sequence is illustrated in Table 15.1 on page 66. Note that if a
Bank Address (BA) (on address bits PL127J: A22–A20, PL129J and PL064J: A21–A19, PL032J: A20–A18) is
asserted during the third write cycle of the autoselect command, the host system can read autoselect data
that bank and then immediately read array data from the other bank, without exiting the autoselect mode.
April 18, 2013 S29PL-J_00_A16
S29PL-J
43
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S hee t
To access the autoselect codes in-system, the host system can issue the autoselect command via the
command register, as shown in Table 15.1 on page 66. This method does not require VID. Refer to the
Autoselect Command Sequence on page 60 for more information.
Table 10.10 Autoselect Codes (High Voltage Method)
Description
CE#
OE#
WE#
Amax
to
A12
L
L
H
BA
Device ID
Manufacturer ID:
Spansion products
A10
A9
A8
A7
X
VI
X
L
A6
A5
to
A4
A3
A2
A1
A0
L
X
L
L
L
L
0001h
L
L
L
H
227Eh
H
H
H
L
2220h (PL127J)
2202h (PL064J)
220Ah (PL032J)
H
H
H
H
2200h (PL127J)
2201h (PL064J)
2201h (PL032J)
L
L
H
L
0001h (protected),
0000h (unprotected)
H
DQ7=1
(factory locked),
DQ6=1
(factory and
customer locked)
DQ15
to DQ0
D
Read Cycle 1
L
Read Cycle 2
L
L
H
BA
VI
X
X
L
L
L
D
Read Cycle 3
L
Sector Protection
Verification
L
L
H
SA
VI
X
X
L
L
L
D
Secured Silicon
L
Indicator Bit
(DQ7, DQ6)
L
H
BA
(See Note)
VI
X
X
X
L
X
L
L
H
D
Legend
L = Logic Low = VIL, H = Logic High = VIH, BA = Bank Address, SA = Sector Address, X = Don’t care.
Note
When Polling the Secured Silicon indicator bit the Bank Address (BA) should be set within the address range 004000h-03FFFFh.
Table 10.11 Autoselect Codes for PL129J
Description
Manufacturer ID:
Spansion
products
Device ID
Read
Cycle 1
CE1#
CE2#
L
H
H
L
L
H
H
L
Read
Cycle 2
L
H
H
L
Read
Cycle 3
L
H
H
L
L
H
Sector Protection
Verification
Secured Silicon
Indicator Bit
(DQ7, DQ6)
H
L
L
H
H
L
OE#
WE#
A21
to
A12
L
H
X
A10
A9
A8
A7
X
VI
X
L
A6
A5
to
A4
A3
A2
A1
A0
L
X
L
L
L
L
0001h
L
L
L
H
227Eh
H
H
H
L
2221h
H
H
H
H
2200h
L
0001h
(protected),
0000h
(unprotected)
H
DQ7=1
(factory locked),
DQ6=1
(factory and
customer locked)
DQ15
to DQ0
D
L
H
X
X
VI
X
L
L
L
D
L
H
SA
X
VI
X
L
L
L
L
L
H
D
L
H
X
(Note 1)
X
VI
X
X
L
X
L
D
L
H
Legend
L = Logic Low = VIL, H = Logic High = VIH, BA = Bank Address, SA = Sector Address, X = Don’t care.
Note
1. When Polling the Secured Silicon indicator bit the A21 to A12 should be set within the address range 004000h-03FFFFh.
2. The autoselect codes may also be accessed in-system by using the command sequences
44
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
Table 10.12 PL127J Boot Sector/Sector Block Addresses for Protection/Unprotection
Sector
A22-A12
Sector/
Sector Block Size
Sector
A22-A12
Sector/
Sector Block Size
SA0
00000000000
4 Kwords
SA131-SA134
011111XXXXX
128 (4x32) Kwords
SA1
00000000001
4 Kwords
SA135-SA138
100000XXXXX
128 (4x32) Kwords
SA2
00000000010
4 Kwords
SA139-SA142
100001XXXXX
128 (4x32) Kwords
SA3
00000000011
4 Kwords
SA143-SA146
100010XXXXX
128 (4x32) Kwords
SA4
00000000100
4 Kwords
SA147-SA150
100011XXXXX
128 (4x32) Kwords
SA5
00000000101
4 Kwords
SA151-SA154
100100XXXXX
128 (4x32) Kwords
SA6
00000000110
4 Kwords
SA155-SA158
100101XXXXX
128 (4x32) Kwords
SA7
00000000111
4 Kwords
SA159-SA162
100110XXXXX
128 (4x32) Kwords
SA8
00000001XXX
32 Kwords
SA163-SA166
100111XXXXX
128 (4x32) Kwords
SA9
00000010XXX
32 Kwords
SA167-SA170
101000XXXXX
128 (4x32) Kwords
SA10
00000011XXX
32 Kwords
SA171-SA174
101001XXXXX
128 (4x32) Kwords
SA11-SA14
000001XXXXX
128 (4x32) Kwords
SA175-SA178
101010XXXXX
128 (4x32) Kwords
SA15-SA18
000010XXXXX
128 (4x32) Kwords
SA179-SA182
101011XXXXX
128 (4x32) Kwords
SA19-SA22
000011XXXXX
128 (4x32) Kwords
SA183-SA186
101100XXXXX
128 (4x32) Kwords
SA23-SA26
000100XXXXX
128 (4x32) Kwords
SA187-SA190
101101XXXXX
128 (4x32) Kwords
SA27-SA30
000101XXXXX
128 (4x32) Kwords
SA191-SA194
101110XXXXX
128 (4x32) Kwords
SA31-SA34
000110XXXXX
128 (4x32) Kwords
SA195-SA198
101111XXXXX
128 (4x32) Kwords
SA35-SA38
000111XXXXX
128 (4x32) Kwords
SA199-SA202
110000XXXXX
128 (4x32) Kwords
SA39-SA42
001000XXXXX
128 (4x32) Kwords
SA203-SA206
110001XXXXX
128 (4x32) Kwords
SA43-SA46
001001XXXXX
128 (4x32) Kwords
SA207-SA210
110010XXXXX
128 (4x32) Kwords
SA47-SA50
001010XXXXX
128 (4x32) Kwords
SA211-SA214
110011XXXXX
128 (4x32) Kwords
SA51-SA54
001011XXXXX
128 (4x32) Kwords
SA215-SA218
110100XXXXX
128 (4x32) Kwords
SA55-SA58
001100XXXXX
128 (4x32) Kwords
SA219-SA222
110101XXXXX
128 (4x32) Kwords
SA59-SA62
001101XXXXX
128 (4x32) Kwords
SA223-SA226
110110XXXXX
128 (4x32) Kwords
SA63-SA66
001110XXXXX
128 (4x32) Kwords
SA227-SA230
110111XXXXX
128 (4x32) Kwords
SA67-SA70
001111XXXXX
128 (4x32) Kwords
SA231-SA234
111000XXXXX
128 (4x32) Kwords
SA71-SA74
010000XXXXX
128 (4x32) Kwords
SA235-SA238
111001XXXXX
128 (4x32) Kwords
SA75-SA78
010001XXXXX
128 (4x32) Kwords
SA239-SA242
111010XXXXX
128 (4x32) Kwords
SA79-SA82
010010XXXXX
128 (4x32) Kwords
SA243-SA246
111011XXXXX
128 (4x32) Kwords
SA83-SA86
010011XXXXX
128 (4x32) Kwords
SA247-SA250
111100XXXXX
128 (4x32) Kwords
SA87-SA90
010100XXXXX
128 (4x32) Kwords
SA251-SA254
111101XXXXX
128 (4x32) Kwords
SA91-SA94
010101XXXXX
128 (4x32) Kwords
SA255-SA258
111110XXXXX
128 (4x32) Kwords
SA95-SA98
010110XXXXX
128 (4x32) Kwords
SA259
11111100XXX
32 Kwords
SA99-SA102
010111XXXXX
128 (4x32) Kwords
SA260
11111101XXX
32 Kwords
SA103-SA106
011000XXXXX
128 (4x32) Kwords
SA261
11111110XXX
32 Kwords
SA107-SA110
011001XXXXX
128 (4x32) Kwords
SA262
11111111000
4 Kwords
SA111-SA114
011010XXXXX
128 (4x32) Kwords
SA263
11111111001
4 Kwords
SA115-SA118
011011XXXXX
128 (4x32) Kwords
SA264
11111111010
4 Kwords
SA119-SA122
011100XXXXX
128 (4x32) Kwords
SA265
11111111011
4 Kwords
SA123-SA126
011101XXXXX
128 (4x32) Kwords
SA127-SA130
011110XXXXX
128 (4x32) Kwords
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Table 10.13 PL129J Boot Sector/Sector Block Addresses for Protection/Unprotection
CE1# Control
46
CE2# Control
Sector Group
A21-12
Sector/Sector Block Size
Sector Group
A21-12
Sector/Sector Block Size
SA1-0
0000000000
4 Kwords
SA2-0–SA2-3
00000XXXXX
128 (4x32) Kwords
SA1-1
0000000001
4 Kwords
SA2-4–SA2-7
00001XXXXX
128 (4x32) Kwords
SA1-2
0000000010
4 Kwords
SA2-8–SA2-11
00010XXXXX
128 (4x32) Kwords
SA1-3
0000000011
4 Kwords
SA2-12–SA2-15
00011XXXXX
128 (4x32) Kwords
SA1-4
0000000100
4 Kwords
SA2-16–SA2-19
00100XXXXX
128 (4x32) Kwords
SA1-5
0000000101
4 Kwords
SA2-20–SA2-23
00101XXXXX
128 (4x32) Kwords
SA1-6
0000000110
4 Kwords
SA2-24–SA2-27
00110XXXXX
128 (4x32) Kwords
SA1-7
0000000111
4 Kwords
SA2-28–SA2-31
00111XXXXX
128 (4x32) Kwords
SA1-8
0000001XXX
32 Kwords
SA2-32–SA2-35
01000XXXXX
128 (4x32) Kwords
SA1-9
0000010XXX
32 Kwords
SA2-36–SA2-39
01001XXXXX
128 (4x32) Kwords
SA1-10
0000011XXX
32 Kwords
SA2-40–SA2-43
01010XXXXX
128 (4x32) Kwords
SA1-11 - SA1-14
00001XXXXX
128 (4x32) Kwords
SA2-44–SA2-47
01011XXXXX
128 (4x32) Kwords
SA1-15 - SA1-18
00010XXXXX
128 (4x32) Kwords
SA2-48–SA2-51
01100XXXXX
128 (4x32) Kwords
SA1-19 - SA1-22
00011XXXXX
128 (4x32) Kwords
SA2-52–SA2-55
01101XXXXX
128 (4x32) Kwords
SA1-23 - SA1-26
00100XXXXX
128 (4x32) Kwords
SA2-56–SA2-59
01110XXXXX
128 (4x32) Kwords
SA1-27 - SA1-30
00101XXXXX
128 (4x32) Kwords
SA2-60–SA2-63
01111XXXXX
128 (4x32) Kwords
SA1-31 - SA1-34
00110XXXXX
128 (4x32) Kwords
SA2-64–SA2-67
10000XXXXX
128 (4x32) Kwords
SA1-35 - SA1-38
00111XXXXX
128 (4x32) Kwords
SA2-68–SA2-71
10001XXXXX
128 (4x32) Kwords
SA1-39 - SA1-42
01000XXXXX
128 (4x32) Kwords
SA2-72–SA2-75
10010XXXXX
128 (4x32) Kwords
SA1-43 - SA1-46
01001XXXXX
128 (4x32) Kwords
SA2-76–SA2-79
10011XXXXX
128 (4x32) Kwords
SA1-47 - SA1-50
01010XXXXX
128 (4x32) Kwords
SA2-80–SA2-83
10100XXXXX
128 (4x32) Kwords
SA1-51 - SA1-54
01011XXXXX
128 (4x32) Kwords
SA2-84–SA2-87
10101XXXXX
128 (4x32) Kwords
SA1-55 - SA1-58
01100XXXXX
128 (4x32) Kwords
SA2-88–SA2-91
10110XXXXX
128 (4x32) Kwords
SA1-59 - SA1-62
01101XXXXX
128 (4x32) Kwords
SA2-92–SA2-95
10111XXXXX
128 (4x32) Kwords
SA1-63 - SA1-66
01110XXXXX
128 (4x32) Kwords
SA2-96–SA2-99
11000XXXXX
128 (4x32) Kwords
SA1-67 - SA1-70
01111XXXXX
128 (4x32) Kwords
SA2-100–SA2-103
11001XXXXX
128 (4x32) Kwords
SA1-71 - SA1-74
10000XXXXX
128 (4x32) Kwords
SA2-104–SA2-107
11010XXXXX
128 (4x32) Kwords
SA1-75 - SA1-78
10001XXXXX
128 (4x32) Kwords
SA2-108–SA2-111
11011XXXXX
128 (4x32) Kwords
SA1-79 - SA1-82
10010XXXXX
128 (4x32) Kwords
SA2-112–SA2-115
11100XXXXX
128 (4x32) Kwords
SA1-83 - SA1-86
10011XXXXX
128 (4x32) Kwords
SA2-116–SA2-119
11101XXXXX
128 (4x32) Kwords
SA1-87 - SA1-90
10100XXXXX
128 (4x32) Kwords
SA2-120–SA2-123
11110XXXXX
128 (4x32) Kwords
SA1-91 - SA1-94
10101XXXXX
128 (4x32) Kwords
SA2-124
1111100XXX
32 Kwords
SA1-95 - SA1-98
10110XXXXX
128 (4x32) Kwords
SA2-125
1111101XXX
32 Kwords
SA1-99 - SA1-102
10111XXXXX
128 (4x32) Kwords
SA2-126
1111110XXX
32 Kwords
SA1-103 - SA1-106
11000XXXXX
128 (4x32) Kwords
SA2-127
1111111000
4 Kwords
SA1-107 - SA1-110
11001XXXXX
128 (4x32) Kwords
SA2-128
1111111001
4 Kwords
SA1-111 - SA1-114
11010XXXXX
128 (4x32) Kwords
SA2-129
1111111010
4 Kwords
SA1-115 - SA1-118
11011XXXXX
128 (4x32) Kwords
SA2-130
1111111011
4 Kwords
SA1-119 - SA1-122
11100XXXXX
128 (4x32) Kwords
SA2-131
1111111100
4 Kwords
SA1-123 - SA1-126
11101XXXXX
128 (4x32) Kwords
SA2-132
1111111101
4 Kwords
SA1-127 - SA1-130
11110XXXXX
128 (4x32) Kwords
SA2-133
1111111110
4 Kwords
SA1-131 - SA1-134
11111XXXXX
128 (4x32) Kwords
SA2-134
1111111111
4 Kwords
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10.9
She et
Selecting a Sector Protection Mode
Table 10.14 PL064J Boot Sector/Sector Block Addresses for Protection/Unprotection
Sector
A21-A12
Sector/Sector Block Size
SA0
0000000000
4 Kwords
SA1
0000000001
4 Kwords
SA2
0000000010
4 Kwords
SA3
0000000011
4 Kwords
SA4
0000000100
4 Kwords
SA5
0000000101
4 Kwords
SA6
0000000110
4 Kwords
SA7
0000000111
4 Kwords
SA8
0000001XXX
32 Kwords
32 Kwords
SA9
0000010XXX
SA10
0000011XXX
32 Kwords
SA11-SA14
00001XXXXX
128 (4x32) Kwords
SA15-SA18
00010XXXXX
128 (4x32) Kwords
SA19-SA22
00011XXXXX
128 (4x32) Kwords
SA23-SA26
00100XXXXX
128 (4x32) Kwords
SA27-SA30
00101XXXXX
128 (4x32) Kwords
SA31-SA34
00110XXXXX
128 (4x32) Kwords
SA35-SA38
00111XXXXX
128 (4x32) Kwords
SA39-SA42
01000XXXXX
128 (4x32) Kwords
SA43-SA46
01001XXXXX
128 (4x32) Kwords
SA47-SA50
01010XXXXX
128 (4x32) Kwords
SA51-SA54
01011XXXXX
128 (4x32) Kwords
SA55-SA58
01100XXXXX
128 (4x32) Kwords
SA59-SA62
01101XXXXX
128 (4x32) Kwords
SA63-SA66
01110XXXXX
128 (4x32) Kwords
SA67-SA70
01111XXXXX
128 (4x32) Kwords
SA71-SA74
10000XXXXX
128 (4x32) Kwords
SA75-SA78
10001XXXXX
128 (4x32) Kwords
SA79-SA82
10010XXXXX
128 (4x32) Kwords
SA83-SA86
10011XXXXX
128 (4x32) Kwords
SA87-SA90
10100XXXXX
128 (4x32) Kwords
SA91-SA94
10101XXXXX
128 (4x32) Kwords
SA95-SA98
10110XXXXX
128 (4x32) Kwords
SA99-SA102
10111XXXXX
128 (4x32) Kwords
SA103-SA106
11000XXXXX
128 (4x32) Kwords
SA107-SA110
11001XXXXX
128 (4x32) Kwords
SA111-SA114
11010XXXXX
128 (4x32) Kwords
SA115-SA118
11011XXXXX
128 (4x32) Kwords
SA119-SA122
11100XXXXX
128 (4x32) Kwords
SA123-SA126
11101XXXXX
128 (4x32) Kwords
SA127-SA130
11110XXXXX
128 (4x32) Kwords
SA131
1111100XXX
32 Kwords
SA132
1111101XXX
32 Kwords
SA133
1111110XXX
32 Kwords
SA134
1111111000
4 Kwords
SA135
1111111001
4 Kwords
SA136
1111111010
4 Kwords
SA137
1111111011
4 Kwords
SA138
1111111100
4 Kwords
SA139
1111111101
4 Kwords
SA140
1111111110
4 Kwords
SA141
1111111111
4 Kwords
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The device is shipped with all sectors unprotected. Optional Spansion programming services enable
programming and protecting sectors at the factory prior to shipping the device. Contact your local sales office
for details.
It is possible to determine whether a sector is protected or unprotected. See the Table 10.9, Secured Silicon
Sector Addresses on page 43 for details.
Table 10.15 Sector Protection Schemes
DYB
PPB
PPB Lock
0
0
0
Unprotected—PPB and DYB are changeable
Sector State
0
0
1
Unprotected—PPB not changeable, DYB is changeable
0
1
0
1
0
0
1
1
0
0
1
1
1
0
1
1
1
1
Protected—PPB and DYB are changeable
Protected—PPB not changeable, DYB is changeable
11. Sector Protection
The PL127J, PL129J, PL064J, and PL032J features several levels of sector protection, which can disable
both the program and erase operations in certain sectors or sector groups:
11.1
Persistent Sector Protection
A command sector protection method that replaces the old 12 V controlled protection method.
11.2
Password Sector Protection
A highly sophisticated protection method that requires a password before changes to certain sectors or sector
groups are permitted
11.3
WP# Hardware Protection
A write protect pin that can prevent program or erase operations in sectors SA1-133, SA1-134, SA2-0 and
SA2-1.
The WP# Hardware Protection feature is always available, independent of the software managed protection
method chosen.
11.4
Selecting a Sector Protection Mode
All parts default to operate in the Persistent Sector Protection mode. The customer must then choose if the
Persistent or Password Protection method is most desirable. There are two one-time programmable nonvolatile bits that define which sector protection method will be used. If the Persistent Sector Protection
method is desired, programming the Persistent Sector Protection Mode Locking Bit permanently sets the
device to the Persistent Sector Protection mode. If the Password Sector Protection method is desired,
programming the Password Mode Locking Bit permanently sets the device to the Password Sector Protection
mode. It is not possible to switch between the two protection modes once a locking bit has been set. One of
the two modes must be selected when the device is first programmed. This prevents a program or virus from
later setting the Password Mode Locking Bit, which would cause an unexpected shift from the default
Persistent Sector Protection Mode into the Password Protection Mode.
The device is shipped with all sectors unprotected. Optional Spansion programming services enable
programming and protecting sectors at the factory prior to shipping the device. Contact your local sales office
for details.
It is possible to determine whether a sector is protected or unprotected. See Autoselect Mode on page 43 for
details.
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12. Persistent Sector Protection
The Persistent Sector Protection method replaces the 12 V controlled protection method in previous flash
devices. This new method provides three different sector protection states:
 Persistently Locked—The sector is protected and cannot be changed.
 Dynamically Locked—The sector is protected and can be changed by a simple command.
 Unlocked—The sector is unprotected and can be changed by a simple command.
To achieve these states, three types of “bits” are used:
 Persistent Protection Bit
 Persistent Protection Bit Lock
 Persistent Sector Protection Mode Locking Bit
12.1
Persistent Protection Bit (PPB)
A single Persistent (non-volatile) Protection Bit is assigned to a maximum four sectors (see the sector
address tables for specific sector protection groupings). All 4 Kword boot-block sectors have individual sector
Persistent Protection Bits (PPBs) for greater flexibility. Each PPB is individually modifiable through the PPB
Write Command.
The device erases all PPBs in parallel. If any PPB requires erasure, the device must be instructed to
preprogram all of the sector PPBs prior to PPB erasure. Otherwise, a previously erased sector PPBs can
potentially be over-erased. The flash device does not have a built-in means of preventing sector PPBs overerasure.
12.2
Persistent Protection Bit Lock (PPB Lock)
The Persistent Protection Bit Lock (PPB Lock) is a global volatile bit. When set to “1”, the PPBs cannot be
changed. When cleared (“0”), the PPBs are changeable. There is only one PPB Lock bit per device. The PPB
Lock is cleared after power-up or hardware reset. There is no command sequence to unlock the PPB Lock.
12.3
Dynamic Protection Bit (DYB)
A volatile protection bit is assigned for each sector. After power-up or hardware reset, the contents of all
DYBs is “0”. Each DYB is individually modifiable through the DYB Write Command.
When the parts are first shipped, the PPBs are cleared, the DYBs are cleared, and PPB Lock is defaulted to
power up in the cleared state – meaning the PPBs are changeable.
When the device is first powered on the DYBs power up cleared (sectors not protected). The Protection State
for each sector is determined by the logical OR of the PPB and the DYB related to that sector. For the sectors
that have the PPBs cleared, the DYBs control whether or not the sector is protected or unprotected. By
issuing the DYB Write command sequences, the DYBs will be set or cleared, thus placing each sector in the
protected or unprotected state. These are the so-called Dynamic Locked or Unlocked states. They are called
dynamic states because it is very easy to switch back and forth between the protected and unprotected
conditions. This allows software to easily protect sectors against inadvertent changes yet does not prevent
the easy removal of protection when changes are needed. The DYBs maybe set or cleared as often as
needed.
The PPBs allow for a more static, and difficult to change, level of protection. The PPBs retain their state
across power cycles because they are non-volatile. Individual PPBs are set with a command but must all be
cleared as a group through a complex sequence of program and erasing commands. The PPBs are also
limited to 100 erase cycles.
The PPB Lock bit adds an additional level of protection. Once all PPBs are programmed to the desired
settings, the PPB Lock may be set to “1”. Setting the PPB Lock disables all program and erase commands to
the non-volatile PPBs. In effect, the PPB Lock Bit locks the PPBs into their current state. The only way to
clear the PPB Lock is to go through a power cycle. System boot code can determine if any changes to the
PPB are needed; for example, to allow new system code to be downloaded. If no changes are needed then
the boot code can set the PPB Lock to disable any further changes to the PPBs during system operation.
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The WP#/ACC write protect pin adds a final level of hardware protection to sectors SA1-133, SA1-134, SA20 and SA2-1. When this pin is low it is not possible to change the contents of these sectors. These sectors
generally hold system boot code. The WP#/ACC pin can prevent any changes to the boot code that could
override the choices made while setting up sector protection during system initialization.
For customers who are concerned about malicious viruses there is another level of security - the persistently
locked state. To persistently protect a given sector or sector group, the PPBs associated with that sector need
to be set to “1”. Once all PPBs are programmed to the desired settings, the PPB Lock should be set to “1”.
Setting the PPB Lock automatically disables all program and erase commands to the Non-Volatile PPBs. In
effect, the PPB Lock “freezes” the PPBs into their current state. The only way to clear the PPB Lock is to go
through a power cycle.
It is possible to have sectors that have been persistently locked, and sectors that are left in the dynamic state.
The sectors in the dynamic state are all unprotected. If there is a need to protect some of them, a simple DYB
Write command sequence is all that is necessary. The DYB write command for the dynamic sectors switch
the DYBs to signify protected and unprotected, respectively. If there is a need to change the status of the
persistently locked sectors, a few more steps are required. First, the PPB Lock bit must be disabled by either
putting the device through a power-cycle, or hardware reset. The PPBs can then be changed to reflect the
desired settings. Setting the PPB lock bit once again will lock the PPBs, and the device operates normally
again.
The best protection is achieved by executing the PPB lock bit set command early in the boot code, and
protect the boot code by holding WP#/ACC = VIL.
Table 10.15 on page 48 contains all possible combinations of the DYB, PPB, and PPB lock relating to the
status of the sector.
In summary, if the PPB is set, and the PPB lock is set, the sector is protected and the protection can not be
removed until the next power cycle clears the PPB lock. If the PPB is cleared, the sector can be dynamically
locked or unlocked. The DYB then controls whether or not the sector is protected or unprotected.
If the user attempts to program or erase a protected sector, the device ignores the command and returns to
read mode. A program command to a protected sector enables status polling for approximately 1 µs before
the device returns to read mode without having modified the contents of the protected sector. An erase
command to a protected sector enables status polling for approximately 50 µs after which the device returns
to read mode without having erased the protected sector.
The programming of the DYB, PPB, and PPB lock for a given sector can be verified by writing a DYB/PPB/
PPB lock verify command to the device. There is an alternative means of reading the protection status. Take
RESET# to VIL and hold WE# at VIH. (The high voltage A9 Autoselect Mode also works for reading the status
of the PPBs). Scanning the addresses (A18–A11) while (A6, A1, A0) = (0, 1, 0) will produce a logical ‘1” code
at device output DQ0 for a protected sector or a “0” for an unprotected sector. In this mode, the other
addresses are don’t cares. Address location with A1 = VIL are reserved for autoselect manufacturer and
device codes.
12.4
Persistent Sector Protection Mode Locking Bit
Like the password mode locking bit, a Persistent Sector Protection mode locking bit exists to guarantee that
the device remain in software sector protection. Once set, the Persistent Sector Protection locking bit
prevents programming of the password protection mode locking bit. This guarantees that a hacker could not
place the device in password protection mode.
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13. Password Protection Mode
The Password Sector Protection Mode method allows an even higher level of security than the Persistent
Sector Protection Mode. There are two main differences between the Persistent Sector Protection and the
Password Sector Protection Mode:
When the device is first powered on, or comes out of a reset cycle, the PPB Lock bit set to the locked state,
rather than cleared to the unlocked state.
The only means to clear the PPB Lock bit is by writing a unique 64-bit Password to the device.
The Password Sector Protection method is otherwise identical to the Persistent Sector Protection method.
A 64-bit password is the only additional tool utilized in this method.
Once the Password Mode Locking Bit is set, the password is permanently set with no means to read,
program, or erase it. The password is used to clear the PPB Lock bit. The Password Unlock command must
be written to the flash, along with a password. The flash device internally compares the given password with
the pre-programmed password. If they match, the PPB Lock bit is cleared, and the PPBs can be altered. If
they do not match, the flash device does nothing. There is a built-in 2 µs delay for each “password check.”
This delay is intended to thwart any efforts to run a program that tries all possible combinations in order to
crack the password.
13.1
Password and Password Mode Locking Bit
In order to select the Password sector protection scheme, the customer must first program the password. The
password may be correlated to the unique Electronic Serial Number (ESN) of the particular flash device.
Each ESN is different for every flash device; therefore each password should be different for every flash
device. While programming in the password region, the customer may perform Password Verify operations.
Once the desired password is programmed in, the customer must then set the Password Mode Locking Bit.
This operation achieves two objectives:
Permanently sets the device to operate using the Password Protection Mode. It is not possible to reverse this
function.
Disables all further commands to the password region. All program, and read operations are ignored.
Both of these objectives are important, and if not carefully considered, may lead to unrecoverable errors. The
user must be sure that the Password Protection method is desired when setting the Password Mode Locking
Bit. More importantly, the user must be sure that the password is correct when the Password Mode Locking
Bit is set. Due to the fact that read operations are disabled, there is no means to verify what the password is
afterwards. If the password is lost after setting the Password Mode Locking Bit, there will be no way to clear
the PPB Lock bit.
The Password Mode Locking Bit, once set, prevents reading the 64-bit password on the DQ bus and further
password programming. The Password Mode Locking Bit is not erasable. Once Password Mode Locking Bit
is programmed, the Persistent Sector Protection Locking Bit is disabled from programming, guaranteeing that
no changes to the protection scheme are allowed.
13.2
64-bit Password
The 64-bit Password is located in its own memory space and is accessible through the use of the Password
Program and Verify commands (see “Password Verify Command”). The password function works in
conjunction with the Password Mode Locking Bit, which when set, prevents the Password Verify command
from reading the contents of the password on the pins of the device.
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S hee t
Write Protect (WP#)
The Write Protect feature provides a hardware method of protecting the upper two and lower two sectors
without using VID. This function is provided by the WP# pin and overrides the previously discussed High
Voltage Sector Protection on page 52 method.
If the system asserts VIL on the WP#/ACC pin, the device disables program and erase functions in the two
outermost 4 Kword sectors on both ends of the flash array independent of whether it was previously protected
or unprotected.
If the system asserts VIH on the WP#/ACC pin, the device reverts the upper two and lower two sectors to
whether they were last set to be protected or unprotected. That is, sector protection or unprotection for these
sectors depends on whether they were last protected or unprotected using the method described in the High
Voltage Sector Protection on page 52.
Note that the WP#/ACC pin must not be left floating or unconnected; inconsistent behavior of the device may
result.
13.3.1
Persistent Protection Bit Lock
The Persistent Protection Bit (PPB) Lock is a volatile bit that reflects the state of the Password Mode Locking
Bit after power-up reset. If the Password Mode Lock Bit is also set after a hardware reset (RESET# asserted)
or a power-up reset, the ONLY means for clearing the PPB Lock Bit in Password Protection Mode is to issue
the Password Unlock command. Successful execution of the Password Unlock command clears the PPB
Lock Bit, allowing for sector PPBs modifications. Asserting RESET#, taking the device through a power-on
reset, or issuing the PPB Lock Bit Set command sets the PPB Lock Bit to a “1” when the Password Mode
Lock Bit is not set.
If the Password Mode Locking Bit is not set, including Persistent Protection Mode, the PPB Lock Bit is cleared
after power-up or hardware reset. The PPB Lock Bit is set by issuing the PPB Lock Bit Set command. Once
set the only means for clearing the PPB Lock Bit is by issuing a hardware or power-up reset. The Password
Unlock command is ignored in Persistent Protection Mode.
13.4
High Voltage Sector Protection
Sector protection and unprotection may also be implemented using programming equipment. The procedure
requires high voltage (VID) to be placed on the RESET# pin. Refer to Figure 13.1 on page 53 for details on
this procedure. Note that for sector unprotect, all unprotected sectors must first be protected prior to the first
sector write cycle.
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Figure 13.1 In-System Sector Protection/Sector Unprotection Algorithms
START
START
Protect all sectors:
The indicated portion
of the sector protect
algorithm must be
performed for all
unprotected sectors
prior to issuing the
first sector
unprotect address
PLSCNT = 1
RESET# = VID
Wait 1 μs
Temporary Sector
Unprotect Mode
No
PLSCNT = 1
RESET# = VID
Wait 1 μs
No
First Write
Cycle = 60h?
First Write
Cycle = 60h?
Yes
Yes
Set up sector
address
No
All sectors
protected?
Sector Protect:
Write 60h to sector
address with
A7-A0 = 00000010
Yes
Set up first sector
address
Sector Unprotect:
Write 60h to sector
address with
A7-A0 =
01000010
Wait 150 µs
Increment
PLSCNT
Temporary Sector
Unprotect Mode
Verify Sector
Protect: Write 40h
to sector address
with A7-A0 =
00000010
Reset
PLSCNT = 1
Wait 15 ms
Read from
sector address
with A7-A0 =
00000010
Verify Sector
Unprotect: Write
40h to sector
address with
A7-A0 =
00000010
Increment
PLSCNT
No
No
PLSCNT
= 25?
Yes
Yes
No
Yes
Remove VID
from RESET#
PLSCNT
= 1000?
Protect another
sector?
No
Write reset
command
Sector Protect
complete
Device failed
Read from
sector address
with A7-A0 =
00000010
Data = 01h?
Yes
Remove VID
from RESET#
Remove VID
from RESET#
Write reset
command
Set up
next sector
address
No
Data = 00h?
Yes
Last sector
verified?
No
Yes
Write reset
command
Sector Protect
complete
Sector Protect
complete
Sector Protect
Algorithm
Device failed
Remove VID
from RESET#
Write reset
command
Sector Unprotect
complete
Sector Unprotect
Algorithm
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13.5
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Temporary Sector Unprotect
This feature allows temporary unprotection of previously protected sectors to change data in-system. The
Sector Unprotect mode is activated by setting the RESET# pin to VID. During this mode, formerly protected
sectors can be programmed or erased by selecting the sector addresses. Once VID is removed from the
RESET# pin, all the previously protected sectors are protected again. Figure 13.2 on page 54 shows the
algorithm, and Figure 21.1 on page 85 shows the timing diagrams, for this feature. While PPB lock is set, the
device cannot enter the Temporary Sector Unprotection Mode.
Figure 13.2 Temporary Sector Unprotect Operation
START
RESET# = VID
(Note 1)
Perform Erase or
Program Operations
RESET# = VIH
Temporary Sector
Unprotect Completed
(Note 2)
Notes:
1. All protected sectors unprotected (If WP#/ACC = VIL, upper two and lower two sectors will remain protected).
2. All previously protected sectors are protected once again
13.6
Secured Silicon Sector Flash Memory Region
The Secured Silicon Sector feature provides a Flash memory region that enables permanent part
identification through an Electronic Serial Number (ESN) The 128-word Secured Silicon sector is divided into
64 factory-lockable words that can be programmed and locked by the customer. The Secured Silicon sector
is located at addresses 000000h-00007Fh in both Persistent Protection mode and Password Protection
mode. Indicator bits DQ6 and DQ7 are used to indicate the factory-locked and customer locked status of the
part.
The system accesses the Secured Silicon Sector through a command sequence (see the Enter/Exit Secured
Silicon Sector Command Sequence on page 60). After the system has written the Enter Secured Silicon
Sector command sequence, it may read the Secured Silicon Sector by using the addresses normally
occupied by the boot sectors. This mode of operation continues until the system issues the Exit Secured
Silicon Sector command sequence, or until power is removed from the device. Once the Enter SecSi Sector
Command sequence has been entered, the standard array cannot be accessed until the Exit SecSi Sector
command has been entered or the device has been reset. On power-up, or following a hardware reset, the
device reverts to sending commands to the normal address space. Note that the ACC function and unlock
bypass modes are not available when the Secured Silicon Sector is enabled.
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13.6.1
She et
Factory-Locked Area (64 words)
The factory-locked area of the Secured Silicon Sector (000000h-00003Fh) is locked when the part is shipped,
whether or not the area was programmed at the factory. The Secured Silicon Sector Factory-locked Indicator
Bit (DQ7) is permanently set to a “1”. Optional Spansion programming services can program the factorylocked area with a random ESN, a customer-defined code, or any combination of the two. Because only
Spansion can program and protect the factory-locked area, this method ensures the security of the ESN once
the product is shipped to the field. Contact your local sales office for details on using Spansion’s programming
services. Note that the ACC function and unlock bypass modes are not available when the Secured Silicon
sector is enabled.
13.6.2
Customer-Lockable Area (64 words)
The customer-lockable area of the Secured Silicon Sector (000040h-00007Fh) is shipped unprotected, which
allows the customer to program and optionally lock the area as appropriate for the application. The Secured
Silicon Sector Customer-locked Indicator Bit (DQ6) is shipped as “0” and can be permanently locked to “1” by
issuing the Secured Silicon Protection Bit Program Command. The Secured Silicon Sector can be read any
number of times, but can be programmed and locked only once. Note that the accelerated programming
(ACC) and unlock bypass functions are not available when programming the Secured Silicon Sector.
The Customer-lockable Secured Silicon Sector area can be protected using one of the following procedures:
 Write the three-cycle Enter Secured Silicon Sector Region command sequence, and then follow the insystem sector protect algorithm as shown in Figure 13.1 on page 53, except that RESET# may be at either
VIH or VID. This allows in-system protection of the Secured Silicon Sector Region without raising any device
pin to a high voltage. Note that this method is only applicable to the Secured Silicon Sector.
 To verify the protect/unprotect status of the Secured Silicon Sector, follow the algorithm shown in Figure
on page 55.
 Once the Secured Silicon Sector is locked and verified, the system must write the Exit Secured Silicon
Sector Region command sequence to return to reading and writing the remainder of the array.
The Secured Silicon Sector lock must be used with caution since, once locked, there is no procedure
available for unlocking the Secured Silicon Sector area and none of the bits in the Secured Silicon Sector
memory space can be modified in any way.
13.6.3
Secured Silicon Sector Protection Bits
The Secured Silicon Sector Protection Bits prevent programming of the Secured Silicon Sector memory area.
Once set, the Secured Silicon Sector memory area contents are non-modifiable.
Figure 13.3 Secured Silicon Sector Protect Verify
START
RESET# =
VIH or VID
Wait 1 µs
Write 60h to
any address
Write 40h to SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
Read from SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
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If data = 00h,
SecSi Sector is
unprotected.
If data = 01h,
SecSi Sector is
protected.
Remove VIH or VID
from RESET#
Write reset
command
SecSi Sector
Protect Verify
complete
55
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13.7
S hee t
Hardware Data Protection
The command sequence requirement of unlock cycles for programming or erasing provides data protection
against inadvertent writes. In addition, the following hardware data protection measures prevent accidental
erasure or programming, which might otherwise be caused by spurious system level signals during VCC
power-up and power-down transitions, or from system noise.
13.7.1
Low VCC Write Inhibit
When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC
power-up and power-down. The command register and all internal program/erase circuits are disabled, and
the device resets to the read mode. Subsequent writes are ignored until VCC is greater than VLKO. The
system must provide the proper signals to the control pins to prevent unintentional writes when VCC is greater
than VLKO.
13.7.2
Write Pulse “Glitch” Protection
Noise pulses of less than 3 ns (typical) on OE#, CE#, (CE1#, CE2# in PL129J) or WE# do not initiate a write
cycle.
13.7.3
Logical Inhibit
Write cycles are inhibited by holding any one of OE# = VIL, CE# (CE1# = CE2# in PL129J)= VIH or
WE# = VIH. To initiate a write cycle, CE# (CE1# / CE2# in PL129J) and WE# must be a logical zero while
OE# is a logical one.
13.7.4
Power-Up Write Inhibit
If WE# = CE# (CE1#, CE2# in PL129J) = VIL and OE# = VIH during power up, the device does not accept
commands on the rising edge of WE#. The internal state machine is automatically reset to the read mode on
power-up.
14. Common Flash Memory Interface (CFI)
The Common Flash Interface (CFI) specification outlines device and host system software interrogation
handshake, which allows specific vendor-specified software algorithms to be used for entire families of
devices. Software support can then be device-independent, JEDEC ID-independent, and forward- and
backward-compatible for the specified flash device families. Flash vendors can standardize their existing
interfaces for long-term compatibility.
This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address
55h, any time the device is ready to read array data. The system can read CFI information at the addresses
given in Table 14.1 on page 57 to Table 14.4 on page 58. To terminate reading CFI data, the system must
write the reset command. The CFI Query mode is not accessible when the device is executing an Embedded
Program or embedded Erase algorithm.
The system can also write the CFI query command when the device is in the autoselect mode. The device
enters the CFI query mode, and the system can read CFI data at the addresses given in Table 14.1 to
Table 14.4. The system must write the reset command to return the device to reading array data.
For further information, please refer to the CFI Specification and CFI Publication 100. Contact your local sales
office for copies of these documents.
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Table 14.1 CFI Query Identification String
Addresses
Data
Description
10h
11h
12h
0051h
0052h
0059h
Query Unique ASCII string “QRY”
13h
14h
0002h
0000h
Primary OEM Command Set
15h
16h
0040h
0000h
Address for Primary Extended Table
17h
18h
0000h
0000h
Alternate OEM Command Set (00h = none exists)
19h
1Ah
0000h
0000h
Address for Alternate OEM Extended Table (00h = none exists)
Table 14.2 System Interface String
Addresses
Data
Description
1Bh
0027h
VCC Min. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Ch
0036h
VCC Max. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Dh
0000h
VPP Min. voltage (00h = no VPP pin present)
1Eh
0000h
VPP Max. voltage (00h = no VPP pin present)
1Fh
0003h
Typical timeout per single byte/word write 2N µs
20h
0000h
Typical timeout for Min. size buffer write 2N µs (00h = not supported)
21h
0009h
Typical timeout per individual block erase 2N ms
22h
0000h
Typical timeout for full chip erase 2N ms (00h = not supported)
23h
0004h
Max. timeout for byte/word write 2N times typical
24h
0000h
Max. timeout for buffer write 2N times typical
25h
0004h
Max. timeout per individual block erase 2N times typical
26h
0000h
Max. timeout for full chip erase 2N times typical (00h = not supported)
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Table 14.3 Device Geometry Definition
Addresses
Data
Description
27h
0018h (PL127J)
0018h (PL129J)
0017h (PL064J)
0016h (PL032J)
28h
29h
0001h
0000h
Flash Device Interface description (refer to CFI publication 100)
2Ah
2Bh
0000h
0000h
Max. number of byte in multi-byte write = 2N
(00h = not supported)
2Ch
0003h
Number of Erase Block Regions within device
2Dh
2Eh
2Fh
30h
0007h
0000h
0020h
0000h
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
31h
00FDh (PL127J)
00FDh (PL129J)
007Dh (PL064J)
003Dh (PL032J)
Device Size = 2N byte
Erase Block Region 2 Information
(refer to the CFI specification or CFI publication 100)
32h
33h
34h
0000h
0000h
0001h
35h
36h
37h
38h
0007h
0000h
0020h
0000h
Erase Block Region 3 Information
(refer to the CFI specification or CFI publication 100)
39h
3Ah
3Bh
3Ch
0000h
0000h
0000h
0000h
Erase Block Region 4 Information
(refer to the CFI specification or CFI publication 100)
Table 14.4 Primary Vendor-Specific Extended Query
Addresses
Data
40h
41h
42h
0050h
0052h
0049h
Description
Query-unique ASCII string “PRI”
43h
0031h
Major version number, ASCII (reflects modifications to the silicon)
44h
0033h
Minor version number, ASCII (reflects modifications to the CFI table)
45h
TBD
Address Sensitive Unlock (Bits 1-0)
0 = Required, 1 = Not Required
Silicon Revision Number (Bits 7-2)
58
46h
0002h
Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
47h
0001h
Sector Protect
0 = Not Supported, X = Number of sectors in per group
48h
0001h
Sector Temporary Unprotect
00 = Not Supported, 01 = Supported
49h
0007h (PLxxxJ)
Sector Protect/Unprotect scheme
07 = Advanced Sector Protection
4Ah
00E7h (PL127J)
00E7h (PL129J)
0077h (PL064J)
003Fh (PL032J)
Simultaneous Operation
00 = Not Supported, X = Number of Sectors excluding Bank 1
4Bh
0000h
4Ch
0002h (PLxxxJ)
4Dh
0085h
ACC (Acceleration) Supply Minimum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
4Eh
0095h
ACC (Acceleration) Supply Maximum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
Burst Mode Type
00 = Not Supported, 01 = Supported
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page
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Table 14.4 Primary Vendor-Specific Extended Query (Continued)
Addresses
Data
Description
4Fh
0001h
Top/Bottom Boot Sector Flag
00h = Uniform device, 01h = Both top and bottom boot with write protect,
02h = Bottom Boot Device, 03h = Top Boot Device,
04h = Both Top and Bottom
50h
0001h
Program Suspend
0 = Not supported, 1 = Supported
57h
0004h
Bank Organization
00 = Data at 4Ah is zero, X = Number of Banks
58h
0027h (PL127J)
0027h (PL129J)
0017h (PL064J)
000Fh (PL032J)
Bank 1 Region Information
X = Number of Sectors in Bank 1
59h
0060h (PL127J)
0060h (PL129J)
0030h (PL064J)
0018h (PL032J)
Bank 2 Region Information
X = Number of Sectors in Bank 2
5Ah
0060h (PL127J)
0060h (PL129J)
0030h (PL064J)
0018h (PL032J)
Bank 3 Region Information
X = Number of Sectors in Bank 3
5Bh
0027h (PL127J)
0027h (PL129J)
0017h (PL064J)
000Fh (PL032J)
Bank 4 Region Information
X = Number of Sectors in Bank 4
15. Command Definitions
Writing specific address and data commands or sequences into the command register initiates device
operations. Table 15.1 on page 66 defines the valid register command sequences. Writing incorrect
address and data values or writing them in the improper sequence may place the device in an unknown
state. A reset command is then required to return the device to reading array data.
All addresses are latched on the falling edge of WE# or CE# (CE1# / CE2# in PL129J), whichever happens
later. All data is latched on the rising edge of WE# or CE# (CE1# / CE2# in PL129J), whichever happens first.
Refer to AC Characteristic on page 76 for timing diagrams.
15.1
Reading Array Data
The device is automatically set to reading array data after device power-up. No commands are required to
retrieve data. Each bank is ready to read array data after completing an Embedded Program or Embedded
Erase algorithm.
After the device accepts an Erase Suspend command, the corresponding bank enters the erase-suspendread mode, after which the system can read data from any non-erase-suspended sector within the same
bank. The system can read array data using the standard read timing, except that if it reads at an address
within erase-suspended sectors, the device outputs status data. After completing a programming operation in
the Erase Suspend mode, the system may once again read array data with the same exception. See Erase
Suspend/Erase Resume Commands on page 64 for more information.
After the device accepts a Program Suspend command, the corresponding bank enters the programsuspend-read mode, after which the system can read data from any non-program-suspended sector within
the same bank. See Program Suspend/Program Resume Commands on page 65 for more information.
The system must issue the reset command to return a bank to the read (or erase-suspend-read) mode if DQ5
goes high during an active program or erase operation, or if the bank is in the autoselect mode. See the next
section, Reset Command on page 60, for more information.
See also Requirements for Reading Array Data on page 23 for more information. The table AC Characteristic
on page 76 provides the read parameters, and Figure 16.2 on page 70 shows the timing diagram.
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15.2
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Reset Command
Writing the reset command resets the banks to the read or erase-suspend-read mode. Address bits are don’t
cares for this command.
The reset command may be written between the sequence cycles in an erase command sequence before
erasing begins. This resets the bank to which the system was writing to the read mode. Once erasure begins,
however, the device ignores reset commands until the operation is complete.
The reset command may be written between the sequence cycles in a program command sequence before
programming begins. This resets the bank to which the system was writing to the read mode. If the program
command sequence is written to a bank that is in the Erase Suspend mode, writing the reset command
returns that bank to the erase-suspend-read mode. Once programming begins, however, the device ignores
reset commands until the operation is complete.
The reset command may be written between the sequence cycles in an autoselect command sequence.
Once in the autoselect mode, the reset command must be written to return to the read mode. If a bank
entered the autoselect mode while in the Erase Suspend mode, writing the reset command returns that bank
to the erase-suspend-read mode.
If DQ5 goes high during a program or erase operation, writing the reset command returns the banks to the
read mode (or erase-suspend-read mode if that bank was in Erase Suspend and program-suspend-read
mode if that bank was in Program Suspend).
15.3
Autoselect Command Sequence
The autoselect command sequence allows the host system to access the manufacturer and device codes,
and determine whether or not a sector is protected. The autoselect command sequence may be written to an
address within a bank that is either in the read or erase-suspend-read mode. The autoselect command may
not be written while the device is actively programming or erasing in the other bank.
The autoselect command sequence is initiated by first writing two unlock cycles. This is followed by a third
write cycle that contains the bank address and the autoselect command. The bank then enters the autoselect
mode. The system may read any number of autoselect codes without reinitiating the command sequence.
Table 15.1 on page 66 shows the address and data requirements. To determine sector protection
information, the system must write to the appropriate bank address (BA) and sector address (SA). Table 10.4
on page 24 shows the address range and bank number associated with each sector.
The system must write the reset command to return to the read mode (or erase-suspend-read mode if the
bank was previously in Erase Suspend).
15.4
Enter/Exit Secured Silicon Sector Command Sequence
The Secured Silicon Sector region provides a secured data area containing a random, eight word electronic
serial number (ESN). The system can access the Secured Silicon Sector region by issuing the three-cycle
Enter Secured Silicon Sector command sequence. The device continues to access the Secured Silicon
Sector region until the system issues the four-cycle Exit Secured Silicon Sector command sequence. The Exit
Secured Silicon Sector command sequence returns the device to normal operation. The Secured Silicon
Sector is not accessible when the device is executing an Embedded Program or embedded Erase algorithm.
Table 15.1 on page 66 shows the address and data requirements for both command sequences. See also
Secured Silicon Sector Flash Memory Region on page 54 for further information. Note that the ACC function
and unlock bypass modes are not available when the Secured Silicon Sector is enabled.
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Word Program Command Sequence
Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two
unlock write cycles, followed by the program set-up command. The program address and data are written
next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further
controls or timings. The device automatically provides internally generated program pulses and verifies the
programmed cell margin. Table 15.1 on page 66 shows the address and data requirements for the program
command sequence. Note that the Secured Silicon Sector, autoselect, and CFI functions are unavailable
when a [program/erase] operation is in progress.
When the Embedded Program algorithm is complete, that bank then returns to the read mode and addresses
are no longer latched. The system can determine the status of the program operation by using DQ7, DQ6, or
RY/BY#. Refer to Write Operation Status on page 68 for information on these status bits.
Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a
hardware reset immediately terminates the program operation. The program command sequence should be
reinitiated once that bank has returned to the read mode, to ensure data integrity. Note that the Secured
Silicon Sector, autoselect and CFI functions are unavailable when the Secured Silicon Sector is enabled.
Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed from
“0” back to a “1.” Attempting to do so may cause that bank to set DQ5 = 1, or cause the DQ7 and DQ6
status bits to indicate the operation was successful. However, a succeeding read will show that the data is still
“0.” Only erase operations can convert a “0” to a “1.”
15.5.1
Unlock Bypass Command Sequence
The unlock bypass feature allows the system to program data to a bank faster than using the standard
program command sequence. The unlock bypass command sequence is initiated by first writing two unlock
cycles. This is followed by a third write cycle containing the unlock bypass command, 20h. That bank then
enters the unlock bypass mode. A two-cycle unlock bypass program command sequence is all that is
required to program in this mode. The first cycle in this sequence contains the unlock bypass program
command, A0h; the second cycle contains the program address and data. Additional data is programmed in
the same manner. This mode dispenses with the initial two unlock cycles required in the standard program
command sequence, resulting in faster total programming time. Table 15.1 on page 66 shows the
requirements for the command sequence.
During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands are
valid. To exit the unlock bypass mode, the system must issue the two-cycle unlock bypass reset command
sequence. (See Table 15.2 on page 67)
The device offers accelerated program operations through the WP#/ACC pin. When the system asserts VHH
on the WP#/ACC pin, the device automatically enters the Unlock Bypass mode. The system may then write
the two-cycle Unlock Bypass program command sequence. The device uses the higher voltage on the WP#/
ACC pin to accelerate the operation. Note that the WP#/ACC pin must not be at VHH any operation other than
accelerated programming, or device damage may result. In addition, the WP#/ACC pin must not be left
floating or unconnected; inconsistent behavior of the device may result.
Figure 15.1 on page 62 illustrates the algorithm for the program operation. Refer to the table Erase/Program
Operations on page 80 for parameters, and Figure 20.6 on page 81 for timing diagrams.
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Figure 15.1 Program Operation
START
Write Program
Command Sequence
Data Poll
from System
Embedded
Program
algorithm
in progress
Verify Data?
No
Yes
Increment Address
No
Last Address?
Yes
Programming
Completed
Note
See Table 15.1 on page 66 for program command sequence.
15.6
Chip Erase Command Sequence
Chip erase is a six bus cycle operation. The chip erase command sequence is initiated by writing two unlock
cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip erase
command, which in turn invokes the Embedded Erase algorithm. The device does not require the system to
preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire
memory for an all zero data pattern prior to electrical erase. The system is not required to provide any
controls or timings during these operations. Table 15.1 on page 66 shows the address and data requirements
for the chip erase command sequence.
When the Embedded Erase algorithm is complete, that bank returns to the read mode and addresses are no
longer latched. The system can determine the status of the erase operation by using DQ7, DQ6, DQ2, or
RY/BY#. Refer to Write Operation Status on page 68 for information on these status bits.
Any commands written during the chip erase operation are ignored. Note that Secured Silicon Sector,
autoselect, and CFI functions are unavailable when a [program/erase] operation is in progress. However,
note that a hardware reset immediately terminates the erase operation. If that occurs, the chip erase
command sequence should be reinitiated once that bank has returned to reading array data, to ensure data
integrity.
Figure 15.2 on page 63 illustrates the algorithm for the erase operation. Refer to the tables in Erase/Program
Operations on page 80 for parameters, and Figure 20.8 on page 82 for timing diagrams.
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Sector Erase Command Sequence
Sector erase is a six bus cycle operation. The sector erase command sequence is initiated by writing two
unlock cycles, followed by a set-up command. Two additional unlock cycles are written, and are then followed
by the address of the sector to be erased, and the sector erase command. Table 15.1 on page 66 shows the
address and data requirements for the sector erase command sequence.
The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm
automatically programs and verifies the entire memory for an all zero data pattern prior to electrical erase.
The system is not required to provide any controls or timings during these operations.
After the command sequence is written, a sector erase time-out of 50 µs occurs. During the time-out period,
additional sector addresses and sector erase commands may be written. Loading the sector erase buffer may
be done in any sequence, and the number of sectors may be from one sector to all sectors. The time between
these additional cycles must be less than 50 µs, otherwise erasure may begin. Any sector erase address and
command following the exceeded time-out may or may not be accepted. It is recommended that processor
interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be
re-enabled after the last Sector Erase command is written. If any command other than 30h, B0h, F0h is
input during the time-out period, the normal operation will not be guaranteed. The system must rewrite
the command sequence and any additional addresses and commands. Note that Secured Silicon Sector,
autoselect, and CFI functions are unavailable when a [program/erase] operation is in progress.
The system can monitor DQ3 to determine if the sector erase timer has timed out (See the section on DQ3:
Sector Erase Timer). The time-out begins from the rising edge of the final WE# pulse in the command
sequence.
When the Embedded Erase algorithm is complete, the bank returns to reading array data and addresses are
no longer latched. Note that while the Embedded Erase operation is in progress, the system can read data
from the non-erasing bank. The system can determine the status of the erase operation by reading DQ7,
DQ6, DQ2, or RY/BY# in the erasing bank. Refer to Write Operation Status on page 68 for information on
these status bits.
Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands
are ignored. However, note that a hardware reset immediately terminates the erase operation. If that occurs,
the sector erase command sequence should be reinitiated once that bank has returned to reading array data,
to ensure data integrity.
Figure 7.2 on page 18 illustrates the algorithm for the erase operation. Refer to the tables in Erase/Program
Operations on page 80 for parameters, and Figure 20.8 on page 82 for timing diagrams.
Figure 15.2 Erase Operation
START
Write Erase
Command Sequence
(Notes 1, 2)
Data Poll to Erasing
Bank from System
No
Embedded
Erase
algorithm
in progress
Data = FFh?
Yes
Erasure Completed
Notes
1. See Table 15.1 on page 66 for erase command sequence.
2. See the section on DQ3 for information on the sector erase timer.
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Erase Suspend/Erase Resume Commands
The Erase Suspend command, B0h, allows the system to interrupt a sector erase operation and then read
data from, or program data to, any sector not selected for erasure. The bank address is required when writing
this command. This command is valid only during the sector erase operation, including the 50 µs time-out
period during the sector erase command sequence. The Erase Suspend command is ignored if written during
the chip erase operation or Embedded Program algorithm.
When the Erase Suspend command is written during the sector erase operation, the device requires a
maximum of 35 µs to suspend the erase operation. However, when the Erase Suspend command is written
during the sector erase time-out, the device immediately terminates the time-out period and suspends the
erase operation. Addresses are “don’t-cares” when writing the Erase suspend command.
After the erase operation has been suspended, the bank enters the erase-suspend-read mode. The system
can read data from or program data to any sector not selected for erasure. (The device “erase suspends” all
sectors selected for erasure.) Reading at any address within erase-suspended sectors produces status
information on DQ7–DQ0. The system can use DQ7, or DQ6 and DQ2 together, to determine if a sector is
actively erasing or is erase-suspended. Refer to Write Operation Status on page 68 for information on these
status bits.
After an erase-suspended program operation is complete, the bank returns to the erase-suspend-read mode.
The system can determine the status of the program operation using the DQ7 or DQ6 status bits, just as in
the standard Word Program operation. Refer to Write Operation Status on page 68 for more information.
In the erase-suspend-read mode, the system can also issue the autoselect command sequence. The device
allows reading autoselect codes even at addresses within erasing sectors, since the codes are not stored in
the memory array. When the device exits the autoselect mode, the device reverts to the Erase Suspend
mode, and is ready for another valid operation. Refer to Table 10.9, Secured Silicon Sector Addresses
on page 43 and Autoselect Command Sequence on page 60 for details.
To resume the sector erase operation, the system must write the Erase Resume command (address bits are
don’t care). The bank address of the erase-suspended bank is required when writing this command. Further
writes of the Resume command are ignored. Another Erase Suspend command can be written after the chip
has resumed erasing.
If the Persistent Sector Protection Mode Locking Bit is verified as programmed without margin, the Persistent
Sector Protection Mode Locking Bit Program Command should be reissued to improve program margin. If the
Secured Silicon Sector Protection Bit is verified as programmed without margin, the Secured Silicon Sector
Protection Bit Program Command should be reissued to improve program margin. µµAfter programming a
PPB, two additional cycles are needed to determine whether the PPB has been programmed with margin. If
the PPB has been programmed without margin, the program command should be reissued to improve the
program margin. Also note that the total number of PPB program/erase cycles is limited to 100 cycles.
Cycling the PPBs beyond 100 cycles is not guaranteed.
After erasing the PPBs, two additional cycles are needed to determine whether the PPB has been erased
with margin. If the PPBs has been erased without margin, the erase command should be reissued to improve
the program margin. The programming of either the PPB or DYB for a given sector or sector group can be
verified by writing a Sector Protection Status command to the device.
Note that there is no single command to independently verify the programming of a DYB for a given sector
group.
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Program Suspend/Program Resume Commands
The Program Suspend command allows the system to interrupt an embedded programming operation so that
data can read from any non-suspended sector. When the Program Suspend command is written during a
programming process, the device halts the programming operation within tPSL (program suspend latency)
and updates the status bits. Addresses are “don’t-cares” when writing the Program Suspend command. After
the programming operation has been suspended, the system can read array data from any non-suspended
sector. The Program Suspend command may also be issued during a programming operation while an erase
is suspended. In this case, data may be read from any addresses not in Erase Suspend or Program Suspend.
If a read is needed from the Secured Silicon Sector area, then user must use the proper command
sequences to enter and exit this region. The system may also write the autoselect command sequence when
the device is in Program Suspend mode. The device allows reading autoselect codes in the suspended
sectors, since the codes are not stored in the memory array. When the device exits the autoselect mode, the
device reverts to Program Suspend mode, and is ready for another valid operation. See Autoselect
Command Sequence on page 60 for more information. After the Program Resume command is written, the
device reverts to programming. The system can determine the status of the program operation using the DQ7
or DQ6 status bits, just as in the standard program operation. See Write Operation Status on page 68 for
more information. The system must write the Program Resume command (address bits are “don’t care”) to
exit the Program Suspend mode and continue the programming operation. Further writes of the Program
Resume command are ignored. Another Program Suspend command can be written after the device has
resumed programming.
15.10 Command Definitions Tables
Table 15.1 on page 66 contains the Memory Array Command Definitions.
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Command (Notes)
Cycles
Table 15.1 Memory Array Command Definitions
Addr
Data
Read (5)
1
RA
RD
Reset (6)
1
XXX
F0
Manufacturer ID
4
555
Device ID (10)
6
Secured Silicon Sector
Factory Protect (8)
Sector Group
Protect Verify(9)
Bus Cycles (Notes 1–4)
Data
Addr
Data
Addr
Data
AA
2AA
55
(BA)
555
90
(BA)
X00
01
555
AA
2AA
55
(BA)
555
90
(BA)
X01
227E
4
555
AA
2AA
55
(BA)
555
90
X03
(8)
4
555
AAA
2AA
55
(BA)
555
90
(SA) X02
XX00/
XX01
Program
4
555
AA
2AA
55
555
A0
PA
PD
Chip Erase
6
555
AA
2AA
55
555
80
555
Sector Erase
6
555
AA
2AA
55
555
80
555
Program/Erase Suspend (11)
1
BA
B0
Program/Erase Resume (12)
1
BA
30
CFI Query (13)
1
55
98
PD
555
20
Autoselect
(Note 7)
Addr
Accelerated Program (15)
2
XX
A0
PA
Unlock Bypass Entry (15)
3
555
AA
2AA
55
Unlock Bypass Program (15)
2
XX
A0
PA
PD
Unlock Bypass Erase (15)
2
XX
80
XX
10
XXX
00
Unlock Bypass CFI (13)(15)
1
XX
98
Unlock Bypass Reset (15)
2
XXX
90
Addr
Data
Addr
Data
(BA)
X0E
(10)
(BA)
X0F
(10)
AA
2AA
55
555
10
AA
2AA
55
SA
30
Legend
BA = Address of bank switching to autoselect mode, bypass mode, or erase operation. Determined by PL127J: Amax:A20, PL064J and
PL129J: Amax:A19, PL032J: Amax:A18.
PA = Program Address (Amax:A0). Addresses latch on falling edge of WE# or CE# (CE1#/CE2# for PL129J) pulse, whichever happens later.
PD = Program Data (DQ15:DQ0) written to location PA. Data latches on rising edge of WE# or CE# (CE1#/CE2# for PL129J) pulse,
whichever happens first.
RA = Read Address (Amax:A0).
RD = Read Data (DQ15:DQ0) from location RA.
SA = Sector Address (Amax:A12) for verifying (in autoselect mode) or erasing.
WD = Write Data. See “Configuration Register” definition for specific write data. Data latched on rising edge of WE#.
X = Don’t care
Notes
1. See Table 10.1 on page 23 for description of bus operations.
2. All values are in hexadecimal.
3. Shaded cells in table denote read cycles. All other cycles are write operations.
4. During unlock and command cycles, when lower address bits are 555 or 2AAh as shown in table, address bits higher than A11 (except
where BA is required) and data bits higher than DQ7 are don’t cares.
5. No unlock or command cycles required when bank is reading array data.
6. The Reset command is required to return to reading array (or to erase-suspend-read mode if previously in Erase Suspend) when bank is
in autoselect mode, or if DQ5 goes high (while bank is providing status information).
7. Fourth cycle of autoselect command sequence is a read cycle. System must provide bank address to obtain manufacturer ID or device ID
information. See Autoselect Command Sequence on page 60 for more information.
8. The data is DQ6=1 for factory and customer locked and DQ7=1 for factory locked.
9. The data is 00h for an unprotected sector group and 01h for a protected sector group.
10. Device ID must be read across cycles 4, 5, and 6. PL127J (X0Eh = 2220h, X0Fh = 2200h), PL129J (X0Eh = 2221h, X0Fh =
2200h),PL064J (X0Eh = 2202h, X0Fh = 2201h), PL032J (X0Eh = 220Ah, X0Fh = 2201h).
11. System may read and program in non-erasing sectors, or enter autoselect mode, when in Program/Erase Suspend mode. Program/Erase
Suspend command is valid only during a sector erase operation, and requires bank address.
12. Program/Erase Resume command is valid only during Erase Suspend mode, and requires bank address.
13. Command is valid when device is ready to read array data or when device is in autoselect mode.
14. WP#/ACC must be at VID during the entire operation of command.
15. Unlock Bypass Entry command is required prior to any Unlock Bypass operation. Unlock Bypass Reset command is required to return to
the reading array.
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Cycles
Table 15.2 Sector Protection Command Definitions
Addr
Data
1
XXX
F0
3
555
Secured Silicon
Sector Exit (16)
4
Secured Silicon
Protection Bit
Program (Notes 5, 6)
Bus Cycles (Notes 1-4)
Addr
Data
Addr
Data
Addr
Data
AA
2AA
55
555
88
555
AA
2AA
55
555
90
XX
00
6
555
AA
2AA
55
555
60
OW
Secured Silicon
Protection Bit Status
5
555
AA
2AA
55
555
60
Password Program
(Notes 5, 7, 8)
4
555
AA
2AA
55
555
Password Verify
(Notes 6, 8, 9)
4
555
AA
2AA
55
Password Unlock
(Notes 7, 10, 11)
7
555
AA
2AA
PPB Program
(Notes 5, 6, 11)
6
555
AA
PPB Status
4
555
All PPB Erase
(Notes 5, 6, 13, 14)
6
PPB Lock Bit Set
3
Command (Notes)
Reset
Secured Silicon
Sector Entry (16)
Addr
Data
Addr
Data
68
OW
48
OW
RD
(0)
OW
48
OW
RD
(0)
38
XX
[0-3]
PD
[0-3]
555
C8
PWA
[0-3]
PWD
[0-3]
55
555
28
PWA
[0]
PWD
[0]
PWA
[1]
PWD
[1]
PWA
[2]
PWD
[2]
2AA
55
555
60
(SA)
WP
68
(SA)
WP
48
(SA)
WP
RD(0)
AA
2AA
55
BA+
555
90
(SA)
WP
RD
(0)
555
AA
2AA
55
555
60
WP
60
(SA)
40
(SA)
WP
RD(0)
555
AA
2AA
55
555
78
58
SA
RD
(1)
X1
PL
RD(0)
SL
RD(0)
PPB Lock Bit Status (15)
4
555
AA
2AA
55
BA+
555
DYB Write (7)
4
555
AA
2AA
55
555
48
SA
DYB Erase (7)
4
555
AA
2AA
55
555
48
SA
X0
58
SA
RD
(0)
DYB Status (6)
4
555
AA
2AA
55
BA+
555
PPMLB Program
(Notes 5, 6, 12)
6
555
AA
2AA
55
555
60
PL
68
PL
48
PPMLB Status (5)
5
555
AA
2AA
55
555
60
PL
48
PL
RD
(0)
SPMLB Program
(Notes 5, 6, 12)
6
555
AA
2AA
55
555
60
SL
68
SL
48
SPMLB Status (5)
5
555
AA
2AA
55
555
60
SL
48
SL
RD
(0)
Addr
Data
PWA
[3]
PWD
[3]
Legend
DYB = Dynamic Protection Bit
OW = Address (A7:A0) is (00011010)
PD[3:0] = Password Data (1 of 4 portions)
PPB = Persistent Protection Bit
PWA = Password Address. A1:A0 selects portion of password.
PWD = Password Data being verified.
PL = Password Protection Mode Lock Address (A7:A0) is (00001010)
RD(0) = Read Data DQ0 for protection indicator bit.
RD(1) = Read Data DQ1 for PPB Lock status.
SA = Sector Address where security command applies. Address bits Amax:A12 uniquely select any sector.
SL = Persistent Protection Mode Lock Address (A7:A0) is (00010010)
WP = PPB Address (A7:A0) is (00000010)
X = Don’t care
PPMLB = Password Protection Mode Locking Bit
SPMLB = Persistent Protection Mode Locking Bit
Notes
1. See Table 10.1 on page 23 for description of bus operations.
2. All values are in hexadecimal.
3. Shaded cells in table denote read cycles. All other cycles are write operations.
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4. During unlock and command cycles, when lower address bits are 555 or 2AAh as shown in table, address bits higher than A11 (except
where BA is required) and data bits higher than DQ7 are don’t cares.
5. The reset command returns device to reading array.
6. Cycle 4 programs the addressed locking bit. Cycles 5 and 6 validate bit has been fully programmed when DQ0 = 1. If DQ0 = 0 in cycle 6,
program command must be issued and verified again.
7. Data is latched on the rising edge of WE#.
8. Entire command sequence must be entered for each portion of password.
9. Command sequence returns FFh if PPMLB is set.
10. The password is written over four consecutive cycles, at addresses 0-3.
11. A 2 µs timeout is required between any two portions of password.
12. A 100 µs timeout is required between cycles 4 and 5.
13. A 1.2 ms timeout is required between cycles 4 and 5.
14. Cycle 4 erases all PPBs. Cycles 5 and 6 validate bits have been fully erased when DQ0 = 0. If DQ0 = 1 in cycle 6, erase command must
be issued and verified again. Before issuing erase command, all PPBs should be programmed to prevent PPB overerasure.
15. DQ1 = 1 if PPB locked, 0 if unlocked.
16. Once the Secured Silicon Sector Entry Command sequence has been entered, the standard array cannot be accessed until the Exit
SecSi Sector command has been entered or the device has been reset.
16. Write Operation Status
The device provides several bits to determine the status of a program or erase operation: DQ2, DQ3, DQ5,
DQ6, and DQ7. Table 16.1 on page 72 and the following subsections describe the function of these bits. DQ7
and DQ6 each offer a method for determining whether a program or erase operation is complete or in
progress. The device also provides a hardware-based output signal, RY/BY#, to determine whether an
Embedded Program or Erase operation is in progress or has been completed.
16.1
DQ7: Data# Polling
The Data# Polling bit, DQ7, indicates to the host system whether an Embedded Program or Erase algorithm
is in progress or completed, or whether a bank is in Erase Suspend. Data# Polling is valid after the rising
edge of the final WE# pulse in the command sequence.
During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum
programmed to DQ7. This DQ7 status also applies to programming during Erase Suspend. When the
Embedded Program algorithm is complete, the device outputs the datum programmed to DQ7. The system
must provide the program address to read valid status information on DQ7. If a program address falls within a
protected sector, Data# Polling on DQ7 is active for approximately 1 µs, then that bank returns to the read
mode.
During the Embedded Erase algorithm, Data# Polling produces a “0” on DQ7. When the Embedded Erase
algorithm is complete, or if the bank enters the Erase Suspend mode, Data# Polling produces a “1” on DQ7.
The system must provide an address within any of the sectors selected for erasure to read valid status
information on DQ7.
After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Polling
on DQ7 is active for approximately 400 µs, then the bank returns to the read mode. If not all selected sectors
are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected
sectors that are protected. However, if the system reads DQ7 at an address within a protected sector, the
status may not be valid.
When the system detects DQ7 has changed from the complement to true data, it can read valid data at
DQ15–DQ0 on the following read cycles. Just prior to the completion of an Embedded Program or Erase
operation, DQ7 may change asynchronously with DQ15–DQ0 while Output Enable (OE#) is asserted low.
That is, the device may change from providing status information to valid data on DQ7. Depending on when
the system samples the DQ7 output, it may read the status or valid data. Even if the device has completed
the program or erase operation and DQ7 has valid data, the data outputs on DQ15–DQ0 may be still invalid.
Valid data on DQ15–DQ0 will appear on successive read cycles.
Table 16.1 on page 72 shows the outputs for Data# Polling on DQ7. Figure 16.1 on page 69 shows the Data#
Polling algorithm. Figure 20.10 on page 83 shows the Data# Polling timing diagram.
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Figure 16.1 Data# Polling Algorithm
START
Read DQ7–DQ0
Addr = VA
DQ7 = Data?
Yes
No
No
DQ5 = 1?
Yes
Read DQ7–DQ0
Addr = VA
DQ7 = Data?
Yes
No
FAIL
PASS
Notes
1. VA = Valid address for programming. During a sector erase operation, a valid address is any sector address within the sector being
erased. During chip erase, a valid address is any non-protected sector address.
2. DQ7 should be rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5.
16.2
RY/BY#: Ready/Busy#
The RY/BY# is a dedicated, open-drain output pin which indicates whether an Embedded Algorithm is in
progress or complete. The RY/BY# status is valid after the rising edge of the final WE# pulse in the command
sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a
pull-up resistor to VCC.
If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the
Erase Suspend mode.) If the output is high (Ready), the device is in the read mode, the standby mode, or one
of the banks is in the erase-suspend-read mode.
Table 16.1 on page 72 shows the outputs for RY/BY#.
16.3
DQ6: Toggle Bit I
Toggle Bit I on DQ6 indicates whether an Embedded Program or Erase algorithm is in progress or complete,
or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is
valid after the rising edge of the final WE# pulse in the command sequence (prior to the program or erase
operation), and during the sector erase time-out.
During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause
DQ6 to toggle. The system may use either OE# or CE# to control the read cycles. When the operation is
complete, DQ6 stops toggling.
After an erase command sequence is written, if all sectors selected for erasing are protected, DQ6 toggles for
approximately 400 µs, then returns to reading array data. If not all selected sectors are protected, the
Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are
protected.
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The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is erasesuspended. When the device is actively erasing (that is, the Embedded Erase algorithm is in progress), DQ6
toggles. When the device enters the Erase Suspend mode, DQ6 stops toggling. However, the system must
also use DQ2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use
DQ7 (see the DQ7: Data# Polling on page 68).
If a program address falls within a protected sector, DQ6 toggles for approximately 1 µs after the program
command sequence is written, then returns to reading array data.
DQ6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program
algorithm is complete.
Table 16.1 on page 72 shows the outputs for Toggle Bit I on DQ6. Figure 16.2 on page 70 shows the toggle
bit algorithm. Figure 20.11 on page 84 in shows the toggle bit timing diagrams. Figure 20.12 on page 84
shows the differences between DQ2 and DQ6 in graphical form. See also the DQ2: Toggle Bit II on page 71.
Figure 16.2 Toggle Bit Algorithm
START
Read Byte
(DQ7–DQ0)
Address =VA
Read Byte
(DQ7–DQ0)
Address =VA
Toggle Bit
= Toggle?
No
Yes
No
DQ5 = 1?
Yes
Read Byte Twice
(DQ7–DQ0)
Address = VA
Toggle Bit
= Toggle?
No
Yes
Program/Erase
Operation Not
Complete, Write
Reset Command
Program/Erase
Operation Complete
Note:
The system should recheck the toggle bit even if DQ5 = “1” because the toggle bit may stop toggling as DQ5 changes to “1.” See the DQ6:
Toggle Bit I on page 69 and DQ2: Toggle Bit II on page 71 for more information.
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DQ2: Toggle Bit II
The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing (that
is, the Embedded Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle Bit II is
valid after the rising edge of the final WE# pulse in the command sequence.
DQ2 toggles when the system reads at addresses within those sectors that have been selected for erasure.
(The system may use either OE# or CE# (CE1# / CE2# for PL129J) to control the read cycles.) But DQ2
cannot distinguish whether the sector is actively erasing or is erase-suspended. DQ6, by comparison,
indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors
are selected for erasure. Thus, both status bits are required for sector and mode information. Refer to
Table 16.1 on page 72 to compare outputs for DQ2 and DQ6.
Figure 16.2 on page 70 shows the toggle bit algorithm in flowchart form, and the DQ2: Toggle Bit II
on page 71 explains the algorithm. See also the DQ6: Toggle Bit I on page 69. Figure 20.11 on page 84
shows the toggle bit timing diagram. Figure 20.12 on page 84 shows the differences between DQ2 and DQ6
in graphical form.
16.5
Reading Toggle Bits DQ6/DQ2
Refer to Figure 16.2 on page 70 for the following discussion. Whenever the system initially begins reading
toggle bit status, it must read DQ7–DQ0 at least twice in a row to determine whether a toggle bit is toggling.
Typically, the system would note and store the value of the toggle bit after the first read. After the second
read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling,
the device has completed the program or erase operation. The system can read array data on DQ7–DQ0 on
the following read cycle.
However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the
system also should note whether the value of DQ5 is high (see the section on DQ5). If it is, the system should
then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as
DQ5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or
erase operation. If it is still toggling, the device did not completed the operation successfully, and the system
must write the reset command to return to reading array data.
The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has not
gone high. The system may continue to monitor the toggle bit and DQ5 through successive read cycles,
determining the status as described in the previous paragraph. Alternatively, it may choose to perform other
system tasks. In this case, the system must start at the beginning of the algorithm when it returns to
determine the status of the operation (top of Figure 16.2 on page 70).
16.6
DQ5: Exceeded Timing Limits
DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under
these conditions DQ5 produces a “1,” indicating that the program or erase cycle was not successfully
completed.
The device may output a “1” on DQ5 if the system tries to program a “1” to a location that was previously
programmed to “0.” Only an erase operation can change a “0” back to a “1.” Under this condition, the
device halts the operation, and when the timing limit has been exceeded, DQ5 produces a “1.”
Under both these conditions, the system must write the reset command to return to the read mode (or to the
erase-suspend-read mode if a bank was previously in the erase-suspend-program mode).
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DQ3: Sector Erase Timer
After writing a sector erase command sequence, the system may read DQ3 to determine whether or not
erasure has begun. (The sector erase timer does not apply to the chip erase command.) If additional sectors
are selected for erasure, the entire time-out also applies after each additional sector erase command. When
the time-out period is complete, DQ3 switches from a “0” to a “1.” See also the Sector Erase Command
Sequence on page 63.
After the sector erase command is written, the system should read the status of DQ7 (Data# Polling) or DQ6
(Toggle Bit I) to ensure that the device has accepted the command sequence, and then read DQ3. If DQ3 is
“1,” the Embedded Erase algorithm has begun; all further commands (except Erase Suspend) are ignored
until the erase operation is complete. If DQ3 is “0,” the device will accept additional sector erase commands.
To ensure the command has been accepted, the system software should check the status of DQ3 prior to and
following each subsequent sector erase command. If DQ3 is high on the second status check, the last
command might not have been accepted.
Table 16.1 shows the status of DQ3 relative to the other status bits.
Table 16.1 Write Operation Status
DQ7
(Note 2)
DQ6
DQ5
(Note 1)
DQ3
DQ2
(Note 2)
RY/BY#
DQ7#
Toggle
0
N/A
No toggle
0
0
Toggle
0
1
Toggle
0
1
No toggle
0
N/A
Toggle
1
Data
Data
Data
Data
Data
1
DQ7#
Toggle
0
N/A
N/A
0
Reading within
Program
Suspended Sector
Invalid
(Not Allowed)
Invalid
(Not Allowed)
Invalid
(Not Allowed)
Invalid
(Not Allowed)
Invalid
(Not Allowed)
1
Reading within
Non-program
Suspended Sector
Data
Data
Data
Data
Data
1
Status
Standard
Mode
Erase
Suspend
Mode
Embedded Program
Algorithm
Embedded Erase
Algorithm
Erase
SuspendRead
Erase
Suspended
Sector
Non-Erase
Suspended
Sector
Erase-Suspend
-Program
Program
Suspend
Mode
(Note 3)
Notes:
1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. Refer to DQ5:
Exceeded Timing Limits on page 71 for more information.
2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
3. When reading write operation status bits, the system must always provide the bank address where the Embedded Algorithm is in
progress. The device outputs array data if the system addresses a non-busy bank.
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17. Absolute Maximum Ratings
Storage Temperature Plastic Packages
–65°C to +150°C
Ambient Temperature with Power Applied
–65°C to +125°C
Voltage with Respect to Ground
VCC (Note 1)
–0.5 V to +4.0 V
A9, OE#, and RESET# (Note 2)
–0.5 V to +12.5 V
WP#/ACC (Note 2)
–0.5 V to +10.5 V
–0.5 V to VCC +0.5 V
All other pins (Note 1)
Output Short Circuit Current (Note 3)
200 mA
Notes:
1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, input or I/O pins may overshoot VSS to –2.0 V for periods of
up to 20 ns. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC
+2.0 V for periods up to 20 ns. See Figure 17.1 on page 73.
2. Minimum DC input voltage on pins A9, OE#, RESET#, and WP#/ACC is –0.5 V. During voltage transitions, A9, OE#, WP#/ACC, and
RESET# may overshoot VSS to –2.0 V for periods of up to 20 ns. See Figure 17.1 on page 73. Maximum DC input voltage on pin A9,
OE#, and RESET# is +12.5 V which may overshoot to +14.0 V for periods up to 20 ns. Maximum DC input voltage on WP#/ACC is +9.5 V
which may overshoot to +12.0 V for periods up to 20 ns.
3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second.
4. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is
not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability
Figure 17.1 Maximum Overshoot Waveforms
20 ns
20 ns
20 ns
VCC
+2.0 V
VCC
+0.5 V
+0.8 V
–0.5 V
–2.0 V
2.0 V
20 ns
20 ns
Maximum Negative Overshoot Waveform
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20 ns
Maximum Positive Overshoot Waveform
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18. Operating Ranges
Operating ranges define those limits between which the functionality of the device is guaranteed.
Industrial (I) Devices
Ambient Temperature (TA) ................–40°C to +85°C
Wireless (W) Devices
Ambient Temperature (TA) ................–25°C to +85°C
Supply Voltages
VCC ...................................................2.7–3.6 V
VIO (see Note) ...................................1.65–1.95 V (for PL127J and PL129J) or 2.7–3.6 V (for all PLxxxJ
devices)
Note:
For all AC and DC specifications, VIO = VCC; contact your local sales office for other VIO options.
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19. DC Characteristics
Table 19.1 CMOS Compatible
Parameter
Description (notes)
Parameter
Test Conditions
Min
Typ
Max
Unit
±1.0
µA
ILI
Input Load Current
VIN = VSS to VCC,
VCC = VCC max
ILIT
A9, OE#, RESET#
Input Load Current
VCC = VCC max; VID= 12.5 V
35
µA
ILR
Reset Leakage Current
VCC = VCC max; VID= 12.5 V
35
µA
ILO
Output Leakage Current
VOUT = VSS to VCC, OE# = VIH
VCC = VCC max
±1.0
µA
ICC1
VCC Active Read Current
(1, 2)
OE# = VIH, VCC = VCC max
ICC2
VCC Active Write Current (2, 3)
ICC3
VCC Standby Current (2)
ICC4
5 MHz
20
30
10 MHz
45
55
OE# = VIH, WE# = VIL
15
25
mA
CE#, RESET#, WP#/ACC
= VIO ± 0.3 V
0.2
5
µA
VCC Reset Current (2)
RESET# = VSS ± 0.3 V
0.2
5
µA
ICC5
Automatic Sleep Mode
(Notes 2, 4)
VIH = VIO ± 0.3 V;
VIL = VSS ± 0.3 V
0.2
5
µA
VCC Active Read-While-Program
Current (1, 2)
5 MHz
21
45
ICC6
OE# = VIH,
10 MHz
46
70
ICC7
VCC Active Read-While-Erase
Current (1, 2)
OE# = VIH,
ICC8
VCC Active Program-While-EraseSuspended Current (2, 5)
ICC9
VIL
mA
mA
5 MHz
21
45
10 MHz
46
70
OE# = VIH
17
25
mA
VCC Active Page Read Current (2)
OE# = VIH, 8 word Page Read
10
15
mA
–0.4
0.4
V
Input Low Voltage
VIO = 1.65–1.95 V
(PL127J and PL129J)
VIO = 2.7–3.6 V
–0.5
0.8
V
VIO–0.4
VIO+0.4
V
VIO = 1.65–1.95 V
(PL127J AND PL129J)
mA
VIH
Input High Voltage
VIO = 2.7–3.6 V
2.0
VCC+0.3
V
VHH
Voltage for ACC
Program Acceleration
VCC = 3.0 V ± 10%
8.5
9.5
V
VID
Voltage for Autoselect and
Temporary Sector Unprotect
VCC = 3.0 V ± 10%
11.5
12.5
V
0.1
V
Output Low Voltage
IOL = 100 µA, VCC = VCC min,
VIO = 1.65–1.95 V
(PL127J AND PL129J)
IOL = 2.0 mA, VCC = VCC min,
VIO = 2.7–3.6 V
0.4
V
VOL
VOH
VLKO
Output High Voltage
IOH = –100 µA, VCC = VCC min,
VIO = 1.65–1.95 V
(PL127J AND PL129J)
VIO–0.1
V
IOH = ––100 µA, VIO = VCC min
VCC0.2V
V
Low VCC Lock-Out Voltage (5)
2.3
2.5
V
Notes
1. The ICC current listed is typically less than 5 mA/MHz, with OE# at VIH.
2. Maximum ICC specifications are tested with VCC = VCCmax.
3. ICC active while Embedded Erase or Embedded Program is in progress.
4. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns. Typical sleep mode current is 2 µA.
5. Not 100% tested.
6. In S29PL129J there are two CE# (CE1#, CE2#).
7. Valid CE1#/CE2# conditions: (CE1# = VIL, CE2# = VIH,) or (CE1# = VIH, CE2# = VIL) or (CE1# = VIH, CE2# = VIH)
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20. AC Characteristic
20.1
Test Conditions
Figure 20.1 Test Setups
3.6 V
2.7 kΩ
Device
Under
Test
Device
Under
Test
CL
VIO
Note
Diodes are IN3064 or equivalent
CL
6.2 kΩ
= 3.0 V
VIO = 1.8 V (PL127J and PL129J)
Table 20.1 Test Specifications
Test Conditions
All Speeds
Output Load
1 TTL gate
Output Load Capacitance, CL (including jig capacitance)
Input Rise and Fall Times
Unit
VIO = 1.8 V
(PL127J AND PL129J)
30
pF
5
ns
VIO = 3.0 V
Input Pulse Levels
20.2
VIO = 1.8 V
(PL127J AND PL129J)
0.0 - 1.8
VIO = 3.0 V
0.0–3.0
V
Input timing measurement reference levels
VIO/2
V
Output timing measurement reference levels
VIO/2
V
Switching Waveforms
Table 20.2 Key To Switching Waveforms
Waveform
Inputs
Outputs
Steady
Changing from H to L
Changing from L to H
76
Don’t Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State (High Z)
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Figure 20.2 Input Waveforms and Measurement Levels
VIO
Input
VIO/2
VIO/2
Measurement Level
Output
0.0 V
20.3
Read Operations
Table 20.3 Read-Only Operations
Parameter
Speed Options
JEDEC
Std.
tAVAV
tRC
Read Cycle Time (1)
tAVQV
tACC
Address to Output Delay
tCE
Chip Enable to Output Delay
tELQV
Description (Notes)
tPACC
Test Setup
55
60
65
70
80
55
60
65
70
80
ns
CE#, OE# = VIL
Max 55
60
65
70
80
ns
OE# = VIL
Min
Unit
Max 55
60
65
70
80
ns
Page Access Time
Max 20
25
25
30
30
ns
25
35
ns
tGLQV
tOE
Output Enable to Output Delay
Max 20
tEHQZ
tDF
Chip Enable to Output High Z (3)
Max
16
ns
tGHQZ
tDF
Output Enable to Output High Z (1, 3)
Max
16
ns
tAXQX
tOH
Output Hold Time From Addresses,
CE# or OE#, Whichever Occurs First (3)
Min
5
ns
tOEH
Output Enable Hold Time (1)
30
Read
Min
0
ns
Toggle and Data# Polling
Min
10
ns
Notes
1. Not 100% tested.
2. See Figure 20.1 on page 76 and Table 20.1 on page 76 for test specifications
3. Measurements performed by placing a 50 ohm termination on the data pin with a bias of VCC /2. The time from OE# high to the data bus
driven to VCC /2 is taken as tDF.
4. S29PL129J has two CE# (CE1#, CE2#).
5. Valid CE1# / CE2# conditions: (CE1# = VIL,CE2# = VIH) or (CE1# = VIH,CE2# = VIL) or (CE1# = VIH, CE2# = VIH)
6. Valid CE1# / CE2# transitions: (CE1# = VIL,CE2# = VIH) or (CE1# = VIH,CE2# = VIL) to (CE1# = CE2# = VIH)
7. Valid CE1# / CE2# transitions: (CE1# = CE2# = VIH) to (CE1# = VIL,CE2# = VIH) or (CE1# = VIH,CE2# = VIL)
8. For 70 pF Output Load Capacitance, 2 ns will be added to the above tACC,tCE,tPACC,tOE values for all speed grades
Figure 20.3 Read Operation Timings
tRC
Addresses Stable
Addresses
tACC
CE#
tRH
tRH
tD
tOE
OE#
tOEH
WE
tCE
tOH
High Z
Data
High Z
Valid Data
RESET#
RY/BY#
0V
Notes
1. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
2. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
Figure 20.4 Page Read Operation Timings
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Amax-A3
A2-A0
S hee t
Aa
tACC
Data
Ab
tPACC
Qa
Ad
Ac
tPACC
Qb
tPACC
Qc
Qd
CE#
OE#
Notes
1. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
2. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
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Reset
Table 20.4 Hardware Reset (RESET#)
Parameter
JEDEC
Std
Description
All Speed
Options
Unit
tReady
RESET# Pin Low (During Embedded Algorithms) to Read Mode
(See Note)
Max
20
µs
tReady
RESET# Pin Low (NOT During Embedded Algorithms) to Read Mode
(See Note)
Max
500
ns
tRP
RESET# Pulse Width
Min
500
ns
tRH
Reset High Time Before Read (See Note)
Min
50
ns
tRPD
RESET# Low to Standby Mode
Min
20
µs
tRB
RY/BY# Recovery Time
Min
0
ns
Note
Not 100% tested.
Figure 20.5 Reset Timings
RY/BY#
CE#, OE#
tRH
RESET#
tRP
tReady
Reset Timings NOT during Embedded Algorithms
Reset Timings during Embedded Algorithms
tReady
RY/BY#
tRB
CE#, OE#
RESET#
tRP
Notes
1. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
2. S29PL129J - There are two CE# (CE1#, CE2#). In the below waveform CE# = CE1# or CE2#
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20.5
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Erase/Program Operations
Table 20.5 Erase and Program Operations
Parameter
Speed Options (ns)
JEDEC
Std
tAVAV
tWC
Write Cycle Time (Note 1)
tAS
Address Setup Time
Min
0
ns
Address Setup Time to OE# low during toggle bit polling
Min
15
ns
tAH
Address Hold Time
Min
tAHT
Address Hold Time From CE# (CE1#, CE#2 in PL129J) or OE# high
during toggle bit polling
Min
tDVWH
tDS
Data Setup Time
Min
tWHDX
tDH
Data Hold Time
Min
0
ns
tOEPH
Output Enable High during toggle bit polling
Min
10
ns
tGHWL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tAVWL
tASO
tWLAX
tGHWL
Description
Min
55
60
65
70
80
55
60
65
70
80
30
35
0
25
Unit
ns
ns
30
ns
tELWL
tCS
CE# (CE1# or CE#2 in PL129J) Setup Time
Min
0
ns
tWHEH
tCH
CE# (CE1# or CE#2 in PL129J) Hold Time
Min
0
ns
tWLWH
tWP
Write Pulse Width
Min
tWHDL
tWPH
Write Pulse Width High
Min
tSR/W
Latency Between Read and Write Operations
Min
0
ns
Typ
6
µs
35
20
ns
25
ns
tWHWH1
tWHWH1 Programming Operation (Note 4)
tWHWH1
tWHWH1 Accelerated Programming Operation (Note 4)
Typ
4
µs
tWHWH2
tWHWH2 Sector Erase Operation (Note 4)
Typ
0.5
sec
VCC Setup Time (Note 1)
Min
50
µs
Write Recovery Time from RY/BY#
Min
0
ns
Program/Erase Valid to RY/BY# Delay
Max
90
ns
Min
35
ns
tPSL
Program Suspend Latency
Max
35
µs
tESL
Erase Suspend Latency
Max
35
µs
tVCS
tRB
tBUSY
Notes:
1. Not 100% tested.
2. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
3. S29PL129J - There are two CE# (CE1#, CE2#).
4. See Table 21.4 on page 88 for more information.
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Timing Diagrams
Figure 20.6 Program Operation Timings
Program Command Sequence (last two cycles)
tAS
tWC
Addresses
Read Status Data (last two cycles)
555h
PA
PA
PA
tAH
CE#
tCH
OE#
tWHWH1
tWP
WE#
tWPH
tCS
tDS
tDH
A0h
Data
PD
Status
tBUSY
DOUT
tRB
RY/BY#
VCC
tVCS
Notes
1. PA = program address, PD = program data, DOUT is the true data at the program address
2. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
Figure 20.7 Accelerated Program Timing Diagram
VHH
WP#/ACC
VIL or VIH
VIL or VIH
tVHH
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Figure 20.8 Chip/Sector Erase Operation Timings
Erase Command Sequence (last two cycles)
tAS
tWC
2AAh
Addresses
Read Status Data
VA
SA
VA
555h for chip erase
tAH
CE#
tCH
OE#
tWP
WE#
tWPH
tCS
tWHWH2
tDS
tDH
Data
55h
30h
Status
DOUT
10 for Chip Erase
tBUSY
tRB
RY/BY#
tVCS
VCC
Notes
1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see Write Operation Status on page 68
2. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#.
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Figure 20.9 Back-to-back Read/Write Cycle Timings
Addresses
tWC
tWC
tRC
Valid PA
Valid RA
tWC
tAH
tAS
Valid PA
Valid PA
tAS
tCPH
tACC
tAH
tCE
CE#
tCP
tOE
OE#
tOEH
tGHWL
tWP
WE#
tDF
tWPH
tDS
tOH
tDH
Valid
Out
Valid
In
Data
Valid
In
Valid
In
tSR/W
WE# Controlled Write Cycle
Read Cycle
CE# Controlled Write Cycles
Figure 20.10 Data# Polling Timings (During Embedded Algorithms)
tRC
Addresses
VA
VA
VA
tACC
tCE
CE#
tCH
tOE
OE#
tOEH
tDF
WE#
tOH
High Z
DQ7
Complement
Complement
DQ6–DQ0
Status Data
Status Data
True
Valid Data
High Z
True
Valid Data
tBUSY
RY/BY#
Note
VA = Valid address. The illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle
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Figure 20.11 Toggle Bit Timings (During Embedded Algorithms)
tAHT
tAS
Addresses
tAHT
tASO
CE#
tCEPH
tOEH
WE#
tOEPH
OE#
tDH
DQ6/DQ2
tOE
Valid Data
Valid
Status
Valid
Status
Valid
Status
(first read)
(second read)
(stops toggling)
Valid Data
RY/BY#
Notes
1. VA = Valid address; not required for DQ6. The illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle
2. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
Figure 20.12 DQ2 vs. DQ6
Enter
Embedded
Erasing
WE#
Erase
Suspend
Erase
Enter Erase
Suspend Program
Erase Suspend
Read
Erase
Suspend
Program
Erase
Resume
Erase Suspend
Read
Erase
Erase
Complete
DQ6
DQ2
Note
DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CE# to toggle DQ2 and DQ6.
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21. Protect/Unprotect
Table 21.1 Temporary Sector Unprotect
Parameter
JEDEC
Unit
Std
Description
tVIDR
VID Rise and Fall Time (See Note)
tVHH
tRSP
tRRB
All Speed Options
Min
500
ns
VHH Rise and Fall Time (See Note)
Min
250
ns
RESET# Setup Time for Temporary Sector Unprotect
Min
4
µs
RESET# Hold Time from RY/BY# High for Temporary
Sector Unprotect
Min
4
µs
Note
Not 100% tested.
Figure 21.1 Temporary Sector Unprotect Timing Diagram
VID
VID
RESET#
VIL or VIH
VIL or VIH
tVIDR
tVIDR
Program or Erase Command Sequence
CE#
WE#
tRRB
tRSP
RY/BY#
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Figure 21.2 Sector/Sector Block Protect and Unprotect Timing Diagram
VID
VIH
RESET#
SA, A6,
A1, A0
Valid*
Valid*
Sector Group Protect/Unprotect
Data
60h
Valid*
Verify
60h
40h
Status
1 µs
CE#
Sector Group Protect: 150 µs
Sector Group Unprotect: 15 ms
WE#
OE#
Notes
1. For sector protect, A6 = 0, A1 = 1, A0 = 0. For sector unprotect, A6 = 1, A1 = 1, A0 = 0.
2. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
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Data
21.1
She et
Controlled Erase Operations
Table 21.2 Alternate CE# Controlled Erase and Program Operations
Parameter
Speed Options
JEDEC
Std
Description (Notes)
tAVAV
tWC
Write Cycle Time (Note 1)
Min
tAVWL
tAS
Address Setup Time
Min
55
60
65
70
80
55
60
65
70
80
0
Unit
ns
ns
tELAX
tAH
Address Hold Time
Min
30
35
ns
tDVEH
tDS
Data Setup Time
Min
25
30
ns
tEHDX
tDH
Data Hold Time
Min
0
tGHEL
tGHEL
Read Recovery Time Before Write (OE# High to WE# Low)
Min
0
ns
tWLEL
tWS
WE# Setup Time
Min
0
ns
tEHWH
tWH
WE# Hold Time
Min
tELEH
tCP
CE# (CE1# or CE#2 in PL129J) Pulse Width
Min
35
40
ns
tEHEL
tCPH
CE# (CE1# or CE#2 in PL129J) Pulse Width High
Min
20
25
ns
ns
0
ns
tWHWH1
tWHWH1
Programming Operation (Note 2)
Typ
6
tWHWH1
tWHWH1
Accelerated Programming Operation (Note 2)
Typ
4
µs
µs
tWHWH2
tWHWH2
Sector Erase Operation (Note 2)
Typ
0.5
sec
Notes
1. Not 100% tested.
2. See Erase And Programming Performance on page 88 for more information.
Figure 21.3 Alternate CE# Controlled Write (Erase/Program) Operation Timings
555 for program
2AA for erase
PA for program
SA for sector erase
555 for chip erase
Data# Polling
Addresses
PA
tWC
tAS
tAH
tWH
WE#
tGHEL
OE#
tWHWH1 or 2
tCP
CE#
tWS
tCPH
tBUSY
tDS
tDH
DQ7#
Data
tRH
A0 for program
55 for erase
DOUT
PD for program
30 for sector erase
10 for chip erase
RESET#
RY/BY#
Notes
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. DOUT is the data written to the device
4. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
5. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
April 18, 2013 S29PL-J_00_A16
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Table 21.3 CE1#/CE2# Timing (S29PL129J only)
Parameter
JEDEC
Std
tCCR
Description
CE1#/CE2# Recover Time (See Note)
All Speed Options
Unit
0
ns
Min
Note
This parameter is defined for CE1#/CE2# recover time for read/read, program/read, and read/program operations. Program/program operation are not allowed and
only a single program operation is allowed at one time.
Figure 21.4 Timing Diagram for Alternating Between CE1# and CE2# Control
CE1#
tCCR
tCCR
CE2#
Table 21.4 Erase And Programming Performance
Parameter
Sector Erase Time
Max
(Note 2)
Unit
0.5
2
sec
PL127J/129J
135
216
sec
PL064J
71
113.6
sec
PL032J
39
62.4
sec
6
100
µs
Chip Erase Time
Word Program Time
Accelerated Word Program Time
Chip Program Time
(Note 3)
Typ (Note 1)
4
60
µs
PL127J/129J
50.4
200
sec
PL064J
25.2
50.4
sec
PL032J
12.6
25.2
sec
Comments
Excludes 00h programming
prior to erasure (Note 4)
Excludes system level
overhead (Note 5)
Notes
1. Typical program and erase times assume the following conditions: 25°C, 3.0 V VCC, 100,000 cycles. Additionally, programming typicals
assume checkerboard pattern. All values are subject to change.
2. Under worst case conditions of 90°C, VCC = 2.7 V, 1,000,000 cycles. All values are subject to change.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster
than the maximum program times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 15.1
on page 66 for further information on command definitions.
6. The device has a minimum erase and program cycle endurance of 100,000 cycles.
88
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Data
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22. Pin Capacitance
22.1
BGA Pin Capacitance
Parameter Symbol
Parameter Description
Test Setup
Typ
Max
Unit
CIN
Input Capacitance
VIN = 0
6.3
7
pF
COUT
Output Capacitance
VOUT = 0
7.0
8
pF
CIN2
Control Pin Capacitance
VIN = 0
5.5
8
pF
CIN3
WP#/ACC Pin Capacitance
VIN = 0
11
12
pF
Test Setup
Typ
Max
Unit
Notes
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
22.2
TSOP Pin Capacitance
Parameter Symbol
Parameter Description
CIN
Input Capacitance
VIN = 0
10
10.5
pF
COUT
Output Capacitance
VOUT = 0
5.5
6.5
pF
CIN2
Control Pin Capacitance
VIN = 0
8
10
pF
CIN3
WP#/ACC Pin Capacitance
VIN = 0
9.5
10
pF
Notes
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
April 18, 2013 S29PL-J_00_A16
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23. Physical Dimensions
23.1
VBG080—80-Ball Fine-pitch Ball Grid Array 8 x 11 mm Package (PL127J)
0.05 C
(2X)
D
D1
A
e
8
e
7
7
SE
6
5
E1
E
4
3
2
1
M
L
K
J
H
G
F
E
D
C
B
A
INDEX MARK
PIN A1
CORNER
A1 CORNER
B
10
6
SD
NXφb
0.05 C
(2X)
7
φ 0.08 M C
φ 0.15 M C A B
TOP VIEW
BOTTOM VIEW
0.10 C
A2
A
A1
C
0.08 C
SEATING PLANE
SIDE VIEW
NOTES:
PACKAGE
VBG 080
JEDEC
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
N/A
2. ALL DIMENSIONS ARE IN MILLIMETERS.
11.00 mm x 8.00 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
A
---
---
1.00
A1
0.18
---
---
A2
0.62
---
0.76
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
NOTE
OVERALL THICKNESS
BALL HEIGHT
11.00 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
8.80 BSC.
BALL FOOTPRINT
E1
5.60 BSC.
BALL FOOTPRINT
MD
12
ROW MATRIX SIZE D DIRECTION
ME
8
ROW MATRIX SIZE E DIRECTION
N
80
---
TOTAL BALL COUNT
0.43
BALL DIAMETER
e
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
(A3-A6,B3-B6,L3-L6,M3-M6)
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
D1
0.33
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
BODY THICKNESS
D
φb
4.
DEPOPULATED SOLDER BALLS
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3329 \ 16-038.25b
90
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
23.2
She et
VBH064—64-Ball Fine-pitch Ball Grid Array 8 x 11.6 mm package (PL127J)
0.05 C
(2X)
D
D1
A
e
10
9
e
7
8
SE
7
6
E1
E
5
4
3
2
1
M
A1 CORNER
INDEX MARK
L
K
B
10
H
G
F
E
SD
6
0.05 C
(2X)
J
D
C
B
A
A1 CORNER
7
NXφb
φ 0.08 M C
TOP VIEW
φ 0.15 M C A B
BOTTOM VIEW
0.10 C
A2
A
A1
C
0.08 C
SEATING PLANE
SIDE VIEW
NOTES:
PACKAGE
VBH 064
JEDEC
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
N/A
2. ALL DIMENSIONS ARE IN MILLIMETERS.
11.60 mm x 8.00 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
A
---
---
1.00
A1
0.18
---
---
A2
0.62
---
0.76
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
NOTE
OVERALL THICKNESS
BALL HEIGHT
11.60 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
8.80 BSC.
BALL FOOTPRINT
E1
7.20 BSC.
BALL FOOTPRINT
MD
12
ROW MATRIX SIZE D DIRECTION
ME
10
ROW MATRIX SIZE E DIRECTION
N
64
TOTAL BALL COUNT
---
0.43
BALL DIAMETER
e
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
(A2-9,B1-4,B7-10,C1-K1,
M2-9,C10-K10,L1-4,L7-10,
G5-6,F5-6)
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
D1
0.33
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
BODY THICKNESS
D
φb
4.
DEPOPULATED SOLDER BALLS
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3330 \ 16-038.25b
April 18, 2013 S29PL-J_00_A16
S29PL-J
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23.3
S hee t
VBK048—48-Ball Fine-pitch Ball Grid Array 8.15 x 6.15 mm package
(PL032J and PL064J)
0.10
D
(4X)
D1
A
6
5
7
e
4
E
SE
E1
3
2
1
H
PIN A1
CORNER
INDEX MARK
6
B
10
G
F
φb
E
D
C
SD
B
A
A1 CORNER
7
φ 0.08 M C
TOP VIEW
φ 0.15 M C A B
BOTTOM VIEW
0.10 C
A2
A
SEATING PLANE
A1
C
0.08 C
SIDE VIEW
NOTES:
PACKAGE
VBK 048
JEDEC
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
N/A
2. ALL DIMENSIONS ARE IN MILLIMETERS.
8.15 mm x 6.15 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
A
---
---
1.00
A1
0.18
---
---
A2
0.62
---
0.76
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
NOTE
OVERALL THICKNESS
BALL HEIGHT
8.15 BSC.
BODY SIZE
6.15 BSC.
BODY SIZE
5.60 BSC.
BALL FOOTPRINT
E1
4.00 BSC.
BALL FOOTPRINT
MD
8
ROW MATRIX SIZE D DIRECTION
ME
6
ROW MATRIX SIZE E DIRECTION
N
48
TOTAL BALL COUNT
---
0.43
BALL DIAMETER
e
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
---
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E
D1
0.33
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
BODY THICKNESS
D
φb
4.
DEPOPULATED SOLDER BALLS
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3338 \ 16-038.25b
92
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
23.4
She et
VBU056—56-Ball Fine-pitch BGA 7 x 9mm package (PL064J and PL032J)
A
D
D1
e
0.05 C
(2X)
8
7
SE 7
6
5
E
E1
4
3
e
2
1
H
10
A1 CORNER
INDEX MARK
B
TOP VIEW
G
F
E
D
C
B
A
A1 CORNER
6
SD
NXφb
7
φ 0.08 M C
0.05 C
φ 0.15 M C A B
(2X)
BOTTOM VIEW
0.10 C
A2
A
A1
SEATING PLANE
C
0.08 C
SIDE VIEW
NOTES:
PACKAGE
VBU 056
JEDEC
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
N/A
2. ALL DIMENSIONS ARE IN MILLIMETERS.
9.00 mm x 7.00 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
A
---
---
1.00
A1
0.17
---
---
A2
0.62
---
0.76
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
NOTE
OVERALL THICKNESS
BALL HEIGHT
9.00 BSC.
BODY SIZE
E
7.00 BSC.
BODY SIZE
5.60 BSC.
BALL FOOTPRINT
E1
5.60 BSC.
BALL FOOTPRINT
MD
8
ROW MATRIX SIZE D DIRECTION
ME
8
ROW MATRIX SIZE E DIRECTION
N
56
0.40
TOTAL BALL COUNT
0.45
BALL DIAMETER
e
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A1,A8,D4,D5,E4,E5,H1,H8
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
D1
0.35
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
BODY THICKNESS
D
φb
4.
DEPOPULATED SOLDER BALLS
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3440\ 16-038.25 \ 01.13.05
April 18, 2013 S29PL-J_00_A16
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TS056—20 x 14 mm, 56-pin TSOP (PL127J)
STANDARD PIN OUT (TOP VIEW)
A2
2
0.10 C
1
N
SEE DETAIL B
-A-
-BE 5
e
N
+1
2
N
2
D1
D
5
A1
4
C
SEATING
PLANE
B
A
0.08MM (0.0031") M C A-B S
B
SEE DETAIL A
b
6
7
WITH PLATING
7
(c)
c1
b1
BASE METAL
R
c
SECTION B-B
e/2
GAGE LINE
0.25MM (0.0098") BSC
0˚
-X-
PARALLEL TO
SEATING PLANE
L
X = A OR B
DETAIL A
Package
TS 056
Jedec
MO-142 (B) EC
Symbol
A
A1
A2
b1
b
c1
c
D
D1
E
e
L
0
R
N
94
MIN
NOM
MAX
1.20
0.15
0.05
1.00
0.95
1.05
0.20
0.23
0.17
0.22
0.17
0.27
0.10
0.16
0.10
0.21
19.80 20.00 20.20
18.30 18.40 18.50
13.90 14.00 14.10
0.50 BASIC
0.50
0.70
0.60
3˚
0˚
5˚
0.08
0.20
56
DETAIL B
NOTES:
1
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (MM).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
2
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
3
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
4
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF
CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT
HORIZONTAL SURFACE.
5
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
0.15MM (.0059") PER SIDE.
6
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE
0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE
BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
7
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
0.25MM (0.0098") FROM THE LEAD TIP.
8
LEAD COPLANARITY SHALL BE WITHIN 0.10MM (0.004") AS MEASURED FROM THE SEATING PLANE.
9
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
S29PL-J
S29PL-J_00_A16 April 18, 2013
Data
She et
24. Revision Summary
24.1
Revision A0 (January 29, 2004)
Initial release.
24.2
Revision A1 (February 12, 2004)
Software Features
Included backward compatibility with MBM29xx families.
General Description
48-ball BGA package is not supported and was removed.
Ordering Information
Model numbers for the 48-ball BGA configurations were removed.
64-Ball Fine Pitch BGA—MCP Compatible
An illustration was added to show the pin-out configuration.
Table 20
Added the description of 01h for address 4Fh and removed the 0004 data.
Table 34
Provided the time units of measure for the erase and programming performances.
24.3
Revision A2 (February 17, 2004)
Memory Array Command Definitions, Table
Corrected typo in device ID.
24.4
Revision A3 (February 25, 2004)
Architectural Advantages
Added 3V VIO for PL064J and PL032J devices.
Ordering Information
Corrected the voltage rating, ball configuration, and physical dimensions for model numbers 12 and 13.
Connection Diagrams
Removed the 64-ball, 8x9 mm diagram.
Operating Ranges
Clarified the supply voltages that apply to the PL127J/PL129J and all other PLxxxJ products.
BGA Pin Capacitance
Added information applicable to the CIN3 symbol.
Package Drawings
Removed the 9x8 mm package drawing.
April 18, 2013 S29PL-J_00_A16
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24.5
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Revision A4 (February 27, 2004)
Connection Diagrams
Added the 56-ball 7x9 mm pinout diagram.
Package Options
Updated to include the 8 x 6 mm, 48-ball Fine pitch BGA and 7 x 9 mm, 56-ball Fine-pitch BGA options.
Physical Dimensions
Added the VBK048 package drawing.
24.6
Revision A5 (March 15, 2004)
Connection Diagrams
Changed names.
24.7
Revision A6 (August 30, 2004)
Global
Removed VIO, added TSOP, fixed Secured Silicon DQ bits.
Product Selector Guide
Updated specs in this table.
Ordering Information
Updated the Model Number offerings.
Valid Combinations Table (128Mb)
Corrected the Package Markings for the 64-ball FBGA packages.
Added combinations for the TLC056 package on the PL064J and PL032J devices.
Valid Combinations for BGA Packages (128Mb)
Updated information in this table.
Package Options
Added the 7 x 9mm 56-ball package.
Connection Diagram
56-ball connection diagram
Erase/Programming Performance Table
Notes 1 and 2 corrected to reflect accurate temperature ranges and cycling.
24.8
Revision A7 (March 2, 2005)
Ordering Information
Updated the Model Number offerings
Valid Combinations table
Updated the Package Types information.
Figure 6, In-System Sector Protection/Sector Unprotection Algorithms
Updated the illustration.
Program Suspend/Program Resume Commands
New section added. Made global changes to include program suspend/resume commands.
96
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Data
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Table 29 on page 82
Added Erase Suspend Latency.
Table 32, CE1#/CE2# Timing (S29PL129J only)
Updated table and added a notes section.
Physical Dimensions
Added the VBU056 package.
24.9
Revision A8 (July 29, 2005)
Autoselect Codes (High Voltage Method) Table
Added note: When Polling the SecSi indicator bit the Bank Address (BA) should be set within the address
range 004000h-03FFFFh.
Autoselect Codes for PL129J Table
Added note: When Polling the SecSi indicator bit the A21 to A12 should be set within the address range
004000h-03FFFFh.
Secured Silicon Sector Flash Memory Region
Added sentence: Once the Enter Secured Silicon Sector Command sequence has been entered, the
standard array cannot be accessed until the Exit Secured Silicon Sector command has been entered or the
device has been reset.
Sector Protection Command Definitions Table
Added note 16: Once the Secured Silicon Sector Entry Command sequence has been entered, the standard
array cannot be accessed until the Exit Secured Silicon Sector command has been entered or the device has
been reset.
Valid Combinations
Content the same, tables consolidated to match Ordering Information Descriptions
Connection Diagrams Section
Consolidated Special Package Handling Instructions and put the information before the package/pinout
descriptions.
Added Figure numbers to the connection diagram graphics.
Operating Ranges
Updated operating temperatures.
DC Characteristics Table
Updated VOH parameter.
Erase/Program Operations Table
Added tESL parameter
VBK048—48-Ball Fine-pitch Ball Grid Array 8.15 x 6.15 mm package (PL032J and PL064J)
Updated the product that uses this package from PL127J to PL064J and PL032J
24.10 Revision A9 (September 22, 2006)
64-Ball Fine-Pitch BGA—MCP Compatible—PL127J
Changed ball F9 to A22
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24.11 Revision A10 (September 7, 2007)
Pin Description
Corrected WP#/ACC description.
24.12 Revision A11 (September 10, 2009)
Global
Changed data sheet status from Advanced Information to Full Production
Ordering Information
Modified/Added note to the Valid Combinations to be Supported for this Device tables
VCC Ramp Rate
Removed Section
Connection Diagram
Corrected 64-Ball Fine-Pitch BGA ball description (H9 and L5)
24.13 Revision A12 (December 18, 2009)
Ordering Information
Under Package Type, changed wording of “Lead (Pb)-free compliant” material type to “Standard”.
24.14 Revision A13 (Febuary 1, 2011)
Global
Removed 55 ns as a valid speed supported by PL127J.
Product Selector Guide
Corrected the 55 ns Speed Option's Max Page Access and Max OE# Access time from 2 to 20 ns.
Corrected the 65 ns Speed Option's Max Access and Max CE# Access time from 25 to 65 ns.
Dynamic Protection Bit (DYB)
Corrected reference to Table 17 to Table 10.15.
Erase Suspend/Erase Resume Commands
Corrected “This command is valid only during the sector erase operation, including the 80 µs time-out
period...” to “This command is valid only during the sector erase operation, including the 50 µs time-out
period...”.
Command Definitions Tables
In Table 15.2, corrected the value of the third bus cycle of the “PPB Status”, “PPB Lock Bit Status” and “DYB
Status” commands from 555 to BA+555.
Absolute Maximum Ratings
Corrected the A9, OE# and RESET# “Voltage with Respect to Ground” maximum range value from +13.0V to
+12.5V.
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24.15 Revision A14 (July 8, 2011)
DQ6: Toggle Bit I
Corrected Figure 16.2: Toggle Bit Algorithm.
Pin Capacitance
Added TSOP package pin capacitance values.
24.16 Revision A15 (March 14, 2012)
Ordering Information
For model number 13, corrected “56-ball” TSOP package description to “56-pin”.
24.17 Revision A16 (April 18, 2013)
Global
Changed 65 ns and 70 ns initial access time for VIO=1.8V to 80 ns.
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Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
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The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2004-2013 Spansion Inc. All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™ and
combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used
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