ESDALC6V1Px Low capacitance Transil™ arrays for ESD protection Datasheet − production data Description The ESDALC6V1Px are monolithic suppressors designed to protect components connected to data and transmission lines against ESD. 627 627 627,3 Features These devices clamp the voltage just above the logic level supply for positive transients and to a diode drop below ground for negative transients. Figure 1. ESDALC6V1P3 functional diagram • 2 to 4 unidirectional Transil functions • Breakdown voltage VBR = 6.1 V min. • Low leakage current < 100 nA • Low capacitance (7.5 pF at 3 V) • Very small PCB area < 2.6 mm2 Benefits • High ESD protection level • High integration Figure 2. ESDALC6V1P5 functional diagram Complies with the following standards: • IEC 61000-4-2 (exceeds level 4) – 15 kV (air discharge) – 8 kV (contact discharge) • MIL STD 883E-Method 3015-7: class3 – 25 kV HBM (human body model) Applications Figure 3. ESDALC6V1P6 functional diagram Where transient overvoltage protection in ESD sensitive equipment is required, such as: • Automotive applications • Computers • Printers • Communication systems • Cellular phone handsets and accessories • Wireline and wireless telephone sets • Set-top boxes December 2014 This is information on a product in full production. TM: Transil is a trademark of STMicroelectronics DocID12636 Rev 6 1/13 www.st.com Characteristics 1 ESDALC6V1Px Characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol VPP(1) Parameter Value Unit 8 15 kV IEC 61000-4-2: Contact discharge Electrostatic Air discharge discharge capability MIL STD 883G - method 3015-7: Class3 PPP Tj (1) Peak pulse power dissipation (8/20 µs) 25 Tj initial = Tamb 30 W 150 °C - 55 to + 150 °C 260 °C -40 to +150 °C Operating junction temperature Tstg Storage temperature range TL Maximum lead temperature for soldering during 10 s Top Operating temperature range 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Figure 4. Electrical characteristics (definitions) Symbol VBR VCL IRM IF IPP IR VF C Rd αT = = = = = = = = = = I Parameter Breakdown voltage Clamping voltage Leakage current Forward current Peak pulse current Breakdown current Forward voltage drop Capacitance Dynamic impedance Voltage temperature IF VBR Vcl VF VRM V IRM Slope = 1/Rd IPP Table 2. Electrical characteristics (Tamb = 25 °C) IRM at VRM Rd αT C typ. max. typ. typ. typ.at 3V VBR at IR Order code ESDALC6V1P3 ESDALC6V1P5 ESDALC6V1P6 2/13 min. max. V V mA nA µA V Ω 10-4/°C pF 6.1 7.2 1 10 0.1 3 1.5 4.5 7.5 DocID12636 Rev 6 ESDALC6V1Px Characteristics Figure 5. Peak power dissipation versus initial Figure 6. Peak pulse power versus exponential junction temperature pulse duration (Tj initial = 25 °C) PPP(W) PPP [T j initial] / PPP [T j initial=25°C] 1.1 1000 Tj initial = 25°C 1.0 0.9 0.8 0.7 0.6 100 0.5 0.4 0.3 0.2 0.1 tp(µs) Tj(°C) 0.0 10 0 25 50 75 100 125 150 175 Figure 7. Clamping voltage versus peak pulse current (typical values, rectangular waveform) 1 10 100 Figure 8. Forward voltage drop versus peak forward current (typical values) IPP(A) IFM(A) 1.E+00 100.0 tp = 2.5µs Tj initial = 25°C Tj = 125°C Tj = 25°C 10.0 1.E-01 1.0 1.E-02 VFM(V) VCL(V) 1.E-03 0.1 0 10 20 30 40 50 60 70 Figure 9. Junction capacitance versus reverse applied voltage (typical values) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Figure 10. Relative variation of leakage current versus junction temperature (typical values) C(pF) IR [T j] / IR [T j=25°C] 1.E+04 13 F=1MHz VOSC=30mVRMS Tj=25°C 12 11 VR =3 V 10 1.E+03 9 8 7 1.E+02 6 5 4 1.E+01 3 2 VR(V) 1 T j(°C) 1.E+00 0 0 1 2 3 4 5 6 25 DocID12636 Rev 6 50 75 100 125 150 3/13 13 Characteristics ESDALC6V1Px Figure 11. ESD response to IEC 61000-4-2 (air discharge 15 kV positive surge) Figure 12. Analog crosstalk measurement 0.00 10 V per div. dB -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 0.1 µs per division F (Hz) -100.00 100.0k 1.0M 10.0M Figure 13. Digital crosstalk test measurement 5 V per div. VG1 β21VG1 0.1 µs per div. 4/13 DocID12636 Rev 6 100.0M 1.0G ESDALC6V1Px 2 Package information Package information • Epoxy meets UL94, V0 • Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 14. SOT-663 dimension definitions $ ' E DOSKD +( ( / / H F [H DocID12636 Rev 6 5/13 13 Package information ESDALC6V1Px Table 3. SOT-663 dimension values Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.60 0.70 0.80 0.024 0.028 0.031 D 1.40 1.60 1.80 0.055 0.063 0.071 E 0.75 0.85 0.95 0.030 0.033 0.037 HE 1.50 1.60 1.70 0.059 0.063 0.067 L 0.39 0.015 L2 0.40 0.47 0.50 0.016 0.018 0.020 c 0.08 0.13 0.18 0.003 0.005 0.007 b 0.22 0.27 0.37 0.009 0.011 0.015 e 0.50 2xe 0.90 α 4° 1.00 0.020 1.10 0.035 7° 4° 0.040 7° Figure 15. SOT-663 footprint (dimensions in mm) 6/13 DocID12636 Rev 6 0.043 ESDALC6V1Px Package information Figure 16. SOT-665 dimension definitions ES ( ' $ /S +H & H H DocID12636 Rev 6 7/13 13 Package information ESDALC6V1Px Table 4. SOT-665 dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. A 0.50 0.60 0.020 0.024 BP 0.17 0.27 0.007 0.011 C 0.08 0.18 0.003 0.007 D 1.50 1.70 0.060 0.067 E 1.10 1.30 0.043 0.051 e 1.00 0.040 e1 0.50 0.020 He 1.50 1.70 0.059 0.067 Lp 0.10 0.30 0.004 0.012 Figure 17. SOT-665 footprint (dimensions in mm) 8/13 Max. DocID12636 Rev 6 ESDALC6V1Px Package information Figure 18. SOT-666IP dimension definitions E / / / E 3LQ ( ' DQJOH $ $ / ( H DocID12636 Rev 6 9/13 13 Package information ESDALC6V1Px Table 5. SOT-666IP dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 0.34 0.007 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 0.27 0.011 e 0.50 0.020 L1 0.19 0.007 L2 0.10 0.30 0.004 L3 0.10 0.004 L4 0.60 0.024 3LQ DocID12636 Rev 6 0.013 0.012 Figure 19. SOT-666IP footprint (dimensions in mm) 10/13 Max. ESDALC6V1Px 3 Ordering information Ordering information Figure 20. Ordering information scheme (6'$/& 93[ (6'DUUD\ /RZFDSDFLWDQFH %UHDNGRZQYROWDJH 9ROWVPLQ 3DFNDJH 3 627&6/ 3 627 3 627,3LQWHUQDOSDG Table 6. Ordering information Order code Marking(1) Package Weight Base qty Delivery mode ESDALC6V1P3 A2 SOT-663 2.9 mg 3000 Tape and reel ESDALC6V1P5 A1 SOT-665 2.9 mg 3000 Tape and reel ESDALC6V1P6 D SOT-666IP 2.9 mg 3000 Tape and reel 1. The marking can be rotated by multiples of 90° to differentiate assembly location DocID12636 Rev 6 11/13 13 Revision history 4 ESDALC6V1Px Revision history Table 7. Document revision history 12/13 Date Revision Changes 16-Aug-2006 1 ESDALC6V1P3, ESDALC6V1P5, and ESDALC6V1P6 merged and reformatted to current standards. 23-Aug-2006 2 Table 1 on page 2: Temperature range upgraded to Tj max = 150 °C 11-Oct-2006 3 Added values for VPP in Table 1. 23-Apr-2008 4 Reformatted to current standards. Added IRM typical value in Table 2. Update minimum dimension for L2 of SOT-663 in Table 3. 15-Jan-2010 5 Updated Figure 17: SOT-665 footprint (dimensions in mm). 03-Dec-2014 6 Updated SOT-666IP dimension definitions and reformatted to current standard. DocID12636 Rev 6 ESDALC6V1Px IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2014 STMicroelectronics – All rights reserved DocID12636 Rev 6 13/13 13
* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project
advertisement