ESDALC6V1Px Low capacitance Transil™ arrays for ESD protection Description −

ESDALC6V1Px Low capacitance Transil™ arrays for ESD protection Description −
ESDALC6V1Px
Low capacitance Transil™ arrays for ESD protection
Datasheet − production data
Description
The ESDALC6V1Px are monolithic suppressors
designed to protect components connected to
data and transmission lines against ESD.
627
627
627,3
Features
These devices clamp the voltage just above the
logic level supply for positive transients and to a
diode drop below ground for negative transients.
Figure 1. ESDALC6V1P3 functional diagram
• 2 to 4 unidirectional Transil functions
• Breakdown voltage VBR = 6.1 V min.
• Low leakage current < 100 nA
• Low capacitance (7.5 pF at 3 V)
• Very small PCB area < 2.6 mm2
Benefits
• High ESD protection level
• High integration
Figure 2. ESDALC6V1P5 functional diagram
Complies with the following standards:
• IEC 61000-4-2 (exceeds level 4)
– 15 kV (air discharge)
– 8 kV (contact discharge)
• MIL STD 883E-Method 3015-7: class3
– 25 kV HBM (human body model)
Applications
Figure 3. ESDALC6V1P6 functional diagram
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
• Automotive applications
• Computers
• Printers
• Communication systems
• Cellular phone handsets and accessories
• Wireline and wireless telephone sets
• Set-top boxes
December 2014
This is information on a product in full production.
TM: Transil is a trademark of STMicroelectronics
DocID12636 Rev 6
1/13
www.st.com
Characteristics
1
ESDALC6V1Px
Characteristics
Table 1. Absolute ratings (Tamb = 25 °C)
Symbol
VPP(1)
Parameter
Value
Unit
8
15
kV
IEC 61000-4-2:
Contact discharge
Electrostatic
Air discharge
discharge capability
MIL STD 883G - method 3015-7: Class3
PPP
Tj
(1)
Peak pulse power dissipation (8/20 µs)
25
Tj initial = Tamb
30
W
150
°C
- 55 to + 150
°C
260
°C
-40 to +150
°C
Operating junction temperature
Tstg
Storage temperature range
TL
Maximum lead temperature for soldering during 10 s
Top
Operating temperature range
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Figure 4. Electrical characteristics (definitions)
Symbol
VBR
VCL
IRM
IF
IPP
IR
VF
C
Rd
αT
=
=
=
=
=
=
=
=
=
=
I
Parameter
Breakdown voltage
Clamping voltage
Leakage current
Forward current
Peak pulse current
Breakdown current
Forward voltage drop
Capacitance
Dynamic impedance
Voltage temperature
IF
VBR
Vcl
VF
VRM
V
IRM
Slope = 1/Rd
IPP
Table 2. Electrical characteristics (Tamb = 25 °C)
IRM at VRM
Rd
αT
C
typ.
max.
typ.
typ.
typ.at 3V
VBR at IR
Order code
ESDALC6V1P3
ESDALC6V1P5
ESDALC6V1P6
2/13
min.
max.
V
V
mA
nA
µA
V
Ω
10-4/°C
pF
6.1
7.2
1
10
0.1
3
1.5
4.5
7.5
DocID12636 Rev 6
ESDALC6V1Px
Characteristics
Figure 5. Peak power dissipation versus initial Figure 6. Peak pulse power versus exponential
junction temperature
pulse duration (Tj initial = 25 °C)
PPP(W)
PPP [T j initial] / PPP [T j initial=25°C]
1.1
1000
Tj initial = 25°C
1.0
0.9
0.8
0.7
0.6
100
0.5
0.4
0.3
0.2
0.1
tp(µs)
Tj(°C)
0.0
10
0
25
50
75
100
125
150
175
Figure 7. Clamping voltage versus peak pulse
current (typical values, rectangular waveform)
1
10
100
Figure 8. Forward voltage drop versus peak
forward current (typical values)
IPP(A)
IFM(A)
1.E+00
100.0
tp = 2.5µs
Tj initial = 25°C
Tj = 125°C
Tj = 25°C
10.0
1.E-01
1.0
1.E-02
VFM(V)
VCL(V)
1.E-03
0.1
0
10
20
30
40
50
60
70
Figure 9. Junction capacitance versus reverse
applied voltage (typical values)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Figure 10. Relative variation of leakage current
versus junction temperature (typical values)
C(pF)
IR [T j] / IR [T j=25°C]
1.E+04
13
F=1MHz
VOSC=30mVRMS
Tj=25°C
12
11
VR =3 V
10
1.E+03
9
8
7
1.E+02
6
5
4
1.E+01
3
2
VR(V)
1
T j(°C)
1.E+00
0
0
1
2
3
4
5
6
25
DocID12636 Rev 6
50
75
100
125
150
3/13
13
Characteristics
ESDALC6V1Px
Figure 11. ESD response to IEC 61000-4-2
(air discharge 15 kV positive surge)
Figure 12. Analog crosstalk measurement
0.00
10 V per div.
dB
-10.00
-20.00
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
-90.00
0.1 µs per division
F (Hz)
-100.00
100.0k
1.0M
10.0M
Figure 13. Digital crosstalk test measurement
5 V per div.
VG1
β21VG1
0.1 µs per div.
4/13
DocID12636 Rev 6
100.0M
1.0G
ESDALC6V1Px
2
Package information
Package information
•
Epoxy meets UL94, V0
•
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 14. SOT-663 dimension definitions
$
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E
DOSKD
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F
[H
DocID12636 Rev 6
5/13
13
Package information
ESDALC6V1Px
Table 3. SOT-663 dimension values
Dimensions
Ref.
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.60
0.70
0.80
0.024
0.028
0.031
D
1.40
1.60
1.80
0.055
0.063
0.071
E
0.75
0.85
0.95
0.030
0.033
0.037
HE
1.50
1.60
1.70
0.059
0.063
0.067
L
0.39
0.015
L2
0.40
0.47
0.50
0.016
0.018
0.020
c
0.08
0.13
0.18
0.003
0.005
0.007
b
0.22
0.27
0.37
0.009
0.011
0.015
e
0.50
2xe
0.90
α
4°
1.00
0.020
1.10
0.035
7°
4°
0.040
7°
Figure 15. SOT-663 footprint (dimensions in mm)
6/13
DocID12636 Rev 6
0.043
ESDALC6V1Px
Package information
Figure 16. SOT-665 dimension definitions
ES
(
'
$
/S
+H
&
H
H
DocID12636 Rev 6
7/13
13
Package information
ESDALC6V1Px
Table 4. SOT-665 dimension values
Dimensions
Ref.
Millimeters
Min.
Typ.
Inches
Max.
Min.
Typ.
A
0.50
0.60
0.020
0.024
BP
0.17
0.27
0.007
0.011
C
0.08
0.18
0.003
0.007
D
1.50
1.70
0.060
0.067
E
1.10
1.30
0.043
0.051
e
1.00
0.040
e1
0.50
0.020
He
1.50
1.70
0.059
0.067
Lp
0.10
0.30
0.004
0.012
Figure 17. SOT-665 footprint (dimensions in mm)
8/13
Max.
DocID12636 Rev 6
ESDALC6V1Px
Package information
Figure 18. SOT-666IP dimension definitions
E
/
/
/
E
3LQ
(
'
DQJOH
$
$
/
(
H
DocID12636 Rev 6
9/13
13
Package information
ESDALC6V1Px
Table 5. SOT-666IP dimension values
Dimensions
Ref.
Millimeters
Min.
Typ.
Inches
Max.
Min.
Typ.
A
0.45
0.60
0.018
0.024
A3
0.08
0.18
0.003
0.007
b
0.17
0.34
0.007
0.013
b1
0.19
0.34
0.007
D
1.50
1.70
0.059
0.067
E
1.50
1.70
0.059
0.067
E1
1.10
1.30
0.043
0.051
0.27
0.011
e
0.50
0.020
L1
0.19
0.007
L2
0.10
0.30
0.004
L3
0.10
0.004
L4
0.60
0.024
3LQ
DocID12636 Rev 6
0.013
0.012
Figure 19. SOT-666IP footprint (dimensions in mm)
10/13
Max.
ESDALC6V1Px
3
Ordering information
Ordering information
Figure 20. Ordering information scheme
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(6'DUUD\
/RZFDSDFLWDQFH
%UHDNGRZQYROWDJH
9ROWVPLQ
3DFNDJH
3 627&6/
3 627
3 627,3LQWHUQDOSDG
Table 6. Ordering information
Order code
Marking(1)
Package
Weight
Base qty
Delivery mode
ESDALC6V1P3
A2
SOT-663
2.9 mg
3000
Tape and reel
ESDALC6V1P5
A1
SOT-665
2.9 mg
3000
Tape and reel
ESDALC6V1P6
D
SOT-666IP
2.9 mg
3000
Tape and reel
1. The marking can be rotated by multiples of 90° to differentiate assembly location
DocID12636 Rev 6
11/13
13
Revision history
4
ESDALC6V1Px
Revision history
Table 7. Document revision history
12/13
Date
Revision
Changes
16-Aug-2006
1
ESDALC6V1P3, ESDALC6V1P5, and ESDALC6V1P6 merged and
reformatted to current standards.
23-Aug-2006
2
Table 1 on page 2:
Temperature range upgraded to Tj max = 150 °C
11-Oct-2006
3
Added values for VPP in Table 1.
23-Apr-2008
4
Reformatted to current standards. Added IRM typical value in
Table 2. Update minimum dimension for L2 of SOT-663 in Table 3.
15-Jan-2010
5
Updated Figure 17: SOT-665 footprint (dimensions in mm).
03-Dec-2014
6
Updated SOT-666IP dimension definitions and reformatted to
current standard.
DocID12636 Rev 6
ESDALC6V1Px
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© 2014 STMicroelectronics – All rights reserved
DocID12636 Rev 6
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