STM32F098xC ARM -based 32-bit MCU, 256 KB Flash, CAN, 12 timers,... DAC & comm. interfaces, 1.8 V

STM32F098xC ARM -based 32-bit MCU,  256 KB Flash, CAN, 12 timers,... DAC & comm. interfaces, 1.8 V
STM32F098xC
ARM®-based 32-bit MCU, 256 KB Flash, CAN, 12 timers, ADC,
DAC & comm. interfaces, 1.8 V
Datasheet - preliminary data
Features
ARM®
&"'!
Cortex®-M0
• Core:
32-bit
frequency up to 48 MHz
CPU,
LQFP100 14x14 mm UFQFPN48
LQFP64 10x10 mm
7x7 mm
LQFP48 7x7 mm
• Memories
– 256 Kbytes of Flash memory
– 32 Kbytes of SRAM with HW parity
• CRC calculation unit
• Reset and power management
– Digital & I/Os supply: VDD = 1.8 V ± 8%
– Analog supply: VDDA = VDD to 3.6 V
– Selected I/Os: VDDIO2 = 1.65 V to 3.6 V
– Low power modes: Sleep, Stop
– VBAT supply for RTC and backup registers
• Clock management
– 4 to 32 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 8 MHz RC with x6 PLL option
– Internal 40 kHz RC oscillator
– Internal 48 MHz oscillator with automatic
trimming based on ext. synchronization
• Up to 87 fast I/Os
– All mappable on external interrupt vectors
– Up to 68 I/Os with 5V tolerant capability
and 19 with independent supply VDDIO2
• 12-channel DMA controller
• One 12-bit, 1.0 μs ADC (up to 16 channels)
– Conversion range: 0 to 3.6 V
– Separate analog supply: 2.4 V to 3.6 V
• Up to 23 capacitive sensing channels for
touchkey, linear and rotary touch sensors
WLCSP64
4.5x4.9 mm
• 12 timers
– One 16-bit advanced-control timer for
6 channel PWM output
– One 32-bit and seven 16-bit timers, with up
to 4 IC/OC, OCN, usable for IR control
decoding or DAC control
– Independent and system watchdog timers
– SysTick timer
• Communication interfaces
– Two I2C interfaces supporting Fast Mode
Plus (1 Mbit/s) with 20 mA current sink; one
supporting SMBus/PMBus and wakeup
– Up to eight USARTs supporting master
synchronous SPI and modem control; three
with ISO7816 interface, LIN, IrDA, auto
baud rate detection and wakeup feature
– Two SPIs (18 Mbit/s) with 4 to 16
programmable bit frames, and with I2S
interface multiplexed
– CAN interface
• HDMI CEC wakeup on header reception
• Serial wire debug (SWD)
• 96-bit unique ID
®
• All packages ECOPACK 2
• One 12-bit D/A converter (with 2 channels)
• Two fast low-power analog comparators with
programmable input and output
UFBGA100
7x7 mm
UFBGA64
5x5 mm
Table 1. Device summary
Reference
STM32F098xC
Part number
STM32F098CC, STM32F098RC, STM32F098VC
• Calendar RTC with alarm and periodic wakeup
from Stop
November 2014
DocID026967 Rev 2
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
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www.st.com
Contents
STM32F098xC
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3
Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1
ARM®-Cortex®-M0 core with embedded Flash and SRAM . . . . . . . . . . . 13
3.2
Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.3
Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.4
Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 14
3.5
Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5.2
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5.3
Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.6
Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.7
General-purpose inputs/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.8
Direct memory access controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.9
Interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.10
3.9.1
Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 17
3.9.2
Extended interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . 17
Analog to digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.10.1
Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.10.2
Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.10.3
VBAT battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.11
Digital-to-analog converter (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.12
Comparators (COMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.13
Touch sensing controller (TSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.14
Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.15
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3.5.1
3.14.1
Advanced-control timer (TIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.14.2
General-purpose timers (TIM2..3, TIM14..17) . . . . . . . . . . . . . . . . . . . . 22
3.14.3
Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.14.4
System window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.14.5
SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 23
DocID026967 Rev 2
STM32F098xC
Contents
3.16
Inter-integrated circuit interfaces (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.17
Universal synchronous/asynchronous receiver transmitters (USART) . . 25
3.18
Serial peripheral interface (SPI)/Inter-integrated sound interfaces (I2S) . 26
3.19
High-definition multimedia interface (HDMI) - consumer
electronics control (CEC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.20
Controller area network (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.21
Clock recovery system (CRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.22
Serial wire debug port (SW-DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4
Pinouts and pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5
Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1
Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.1
Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.2
Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.3
Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.4
Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.5
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.6
Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
6.1.7
Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.3
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6.3.1
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6.3.2
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 56
6.3.3
Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6.3.4
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
6.3.5
Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
6.3.6
External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
6.3.7
Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
6.3.8
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
6.3.9
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
6.3.10
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
6.3.11
Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
6.3.12
I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
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STM32F098xC
6.3.13
I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
6.3.14
NRST and NPOR pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
6.3.15
12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
6.3.16
DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
6.3.17
Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
6.3.18
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
6.3.19
VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
6.3.20
Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
6.3.21
Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
7.1
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
7.2
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
7.2.1
Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
7.2.2
Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . 123
8
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
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List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Table 47.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
STM32F098xC family device features and peripheral counts . . . . . . . . . . . . . . . . . . . . . . 11
Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Internal voltage reference calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Capacitive sensing GPIOs available on STM32F098xC devices . . . . . . . . . . . . . . . . . . . . 20
No. of capacitive sensing channels available on STM32F098xC devices . . . . . . . . . . . . . 20
Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Comparison of I2C analog and digital filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
STM32F098xC I2C implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
STM32F098xC USART implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
STM32F098xC SPI/I2S implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
STM32F098xC pin definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Alternate functions selected through GPIOA_AFR registers for port A . . . . . . . . . . . . . . . 42
Alternate functions selected through GPIOB_AFR registers for port B . . . . . . . . . . . . . . . 43
Alternate functions selected through GPIOC_AFR registers for port C . . . . . . . . . . . . . . . 44
Alternate functions selected through GPIOD_AFR registers for port D . . . . . . . . . . . . . . . 44
Alternate functions selected through GPIOE_AFR registers for port E . . . . . . . . . . . . . . . 45
Alternate functions selected through GPIOF_AFR registers for port F. . . . . . . . . . . . . . . . 45
STM32F098xC peripheral register boundary addresses . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Typical and maximum current consumption from VDD supply at VDD = 1.8 V . . . . . . . . . . 58
Typical and maximum current consumption in Stop mode . . . . . . . . . . . . . . . . . . . . . . . . 59
Typical and maximum current consumption from the VDDA supply . . . . . . . . . . . . . . . . . 59
Typical and maximum current consumption from the VBAT supply. . . . . . . . . . . . . . . . . . . 60
Typical current consumption, code executing from Flash, running from HSE
8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Switching output I/O current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Low-power mode wakeup timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
HSI14 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
HSI48 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
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List of tables
Table 48.
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
Table 78.
Table 79.
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STM32F098xC
ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Output voltage characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
NPOR pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
RAIN max for fADC = 14 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
IWDG min/max timeout period at 40 kHz (LSI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
WWDG min/max timeout value at 48 MHz (PCLK). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
I2S characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
UFBGA100 – ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch, package
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
UFBGA100 recommended PCB design rules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
LQFP100 – 14 x 14 mm low-profile quad flat package mechanical data . . . . . . . . . . . . . 107
UFBGA64 –ultra fine pitch ball grid array, 5 x 5 mm, 0.50 mm pitch,
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
LQFP64 – 10 x 10 mm low-profile quad flat package mechanical data . . . . . . . . . . . . . . 112
WLCSP64 wafer level chip size package mechanical data . . . . . . . . . . . . . . . . . . . . . . . 115
LQFP48 – 7 x 7 mm low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . 117
UFQFPN48 – 7 x 7 mm, 0.5 mm pitch, package mechanical data . . . . . . . . . . . . . . . . . . 121
Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
DocID026967 Rev 2
STM32F098xC
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
Figure 45.
Figure 46.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
UFBGA100 package ballout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
LQFP100 100-pin package pinout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
UFBGA64 package ball-out (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
LQFP64 64-pin package pinout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
WLCSP64 package ballout (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
LQFP48 48-pin package pinout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
UFQFPN48 48-pin package pinout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
STM32F098xC memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
HSI oscillator accuracy characterization results(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
HSI14 oscillator accuracy characterization results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
HSI48 oscillator accuracy characterization results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
TC and TTa I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Five volt tolerant (FT and FTf) I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
SPI timing diagram - slave mode and CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
SPI timing diagram - master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
I2S slave timing diagram (Philips protocol). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
I2S master timing diagram (Philips protocol) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
UFBGA100 – ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
UFBGA100 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
UFBGA100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
LQFP100 – 14 x 14 mm 100 pin low-profile quad flat package outline. . . . . . . . . . . . . . . 107
LQFP100 recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
LQFP100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
UFBGA64 – ultra fine pitch ball grid array, 5 x 5 mm, 0.50 mm pitch,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
UFBGA64 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package outline. . . . . . . . . . . . . . . . . 112
LQFP64 recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
LQFP64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
WLCSP64 wafer level chip size package mechanical drawing. . . . . . . . . . . . . . . . . . . . . 115
WLCSP64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
LQFP48 – 7 x 7 mm, 48 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 117
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8
List of figures
Figure 47.
Figure 48.
Figure 49.
Figure 50.
Figure 51.
Figure 52.
8/128
STM32F098xC
LQFP48 recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
LQFP48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
UFQFPN48 – 7 x 7 mm, 0.5 mm pitch, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . 120
UFQFPN48 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
UFQFPN48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
LQFP64 PD max vs. TA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
DocID026967 Rev 2
STM32F098xC
1
Introduction
Introduction
This datasheet provides the ordering information and mechanical device characteristics of
the STM32F098xC microcontrollers.
This document should be read in conjunction with the STM32F0xxxx reference manual
(RM0091). The reference manual is available from the STMicroelectronics website
www.st.com.
For information on the ARM® Cortex®-M0 core, please refer to the Cortex®-M0 Technical
Reference Manual, available from the www.arm.com website.
DocID026967 Rev 2
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27
Description
2
STM32F098xC
Description
The STM32F098xC microcontrollers incorporate the high-performance ARM® Cortex®-M0
32-bit RISC core operating at a 48 MHz frequency, high-speed embedded memories
(256 Kbytes of Flash memory and 32 Kbytes of SRAM), and an extensive range of
enhanced peripherals and I/Os. The device offers standard communication interfaces (two
I2Cs, two SPIs/one I2S, one HDMI CEC and up to eight USARTs), one CAN, one 12-bit
ADC, one 12-bit DAC with two channels, seven general-purpose 16-bit timers, a 32-bit timer
and an advanced-control PWM timer.
The STM32F098xC microcontrollers operate in the -40 to +85 °C and -40 to +105 °C
temperature ranges, at a 1.8 V ± 8% power supply. A comprehensive set of power-saving
modes allows the design of low-power applications.
The STM32F098xC microcontrollers include devices in seven different package ranging
from 48 pins to 100 pins with a die form also available upon request. Depending on the
device chosen, different sets of peripherals are included. The description below provides an
overview of the complete range of STM32F098xC peripherals proposed.
These features make the STM32F098xC microcontrollers suitable for a wide range of
applications such as application control and user interfaces, handheld equipment, A/V
receivers and digital TV, PC peripherals, gaming and GPS platforms, industrial applications,
PLCs, inverters, printers, scanners, alarm systems, video intercoms, and HVACs.
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STM32F098xC
Description
Table 2. STM32F098xC family device features and peripheral counts
Peripheral
STM32F098CC
STM32F098RC
Flash (Kbytes)
256
SRAM (Kbytes)
32
Timers
Advanced
control
1 (16-bit)
General
purpose
5 (16-bit)
1 (32-bit)
Basic
2 (16-bit)
SPI [I2S](1)
2 [2]
2
I C
Comm.
interfaces
USART
2
6
8
CAN
1
CEC
1
12-bit ADC
(number of channels)
STM32F098VC
1
(10 ext. + 3 int.)
1
(16 ext. + 3 int.)
12-bit DAC
(number of channels)
1
(2)
Analog comparator
2
GPIOs
37
51
87
Capacitive sensing
channels
16
17
23
Max. CPU frequency
48 MHz
1.8 V ± 8%
Operating voltage
Operating temperature
Packages
Ambient operating temperature: -40°C to 85°C / -40°C to 105°C
Junction temperature: -40°C to 105°C / -40°C to 125°C
LQFP48
UFQFPN48
LQFP64
UFBGA64
WLCSP64
LQFP100
UFBGA100
1. The SPI interface can be used either in SPI mode or in I2S audio mode.
DocID026967 Rev 2
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27
Description
STM32F098xC
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DocID026967 Rev 2
06Y9
STM32F098xC
Functional overview
3
Functional overview
3.1
ARM®-Cortex®-M0 core with embedded Flash and SRAM
The ARM® Cortex®-M0 processor is the latest generation of ARM processors for
embedded systems. It has been developed to provide a low-cost platform that meets the
needs of MCU implementation, with a reduced pin count and low-power consumption, while
delivering outstanding computational performance and an advanced system response to
interrupts.
The ARM® Cortex®-M0 32-bit RISC processor features exceptional code-efficiency,
delivering the high-performance expected from an ARM core in the memory size usually
associated with 8- and 16-bit devices.
The STM32F0xx family has an embedded ARM core and is therefore compatible with all
ARM tools and software.
Figure 1 shows the general block diagram of the device family.
3.2
Memories
The device has the following features:
•
32 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait
states and featuring embedded parity checking with exception generation for fail-critical
applications.
•
The non-volatile memory is divided into two arrays:
–
256 Kbytes of embedded Flash memory for programs and data
–
Option bytes
The option bytes are used to write-protect the memory (with 4 KB granularity) and/or
readout-protect the whole memory with the following options:
–
Level 0: no readout protection
–
Level 1: memory readout protection, the Flash memory cannot be read from or
written to if either debug features are connected or boot in RAM is selected
®
–
Level 2: chip readout protection, debug features (Cortex -M0 serial wire) and
boot in RAM selection disabled
3.3
Boot modes
At startup, the boot pin and boot selector option bits are used to select one of the three boot
options:
•
Boot from User Flash
•
Boot from System Memory
•
Boot from embedded SRAM
The boot pin is shared with the standard GPIO and can be disabled through the boot
selector option bits. The boot loader is located in System Memory. It is used to reprogram
the Flash memory by using USART on pins PA14/PA15 or PA9/PA10 or I2C on pins
PB6/PB7.
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27
Functional overview
3.4
STM32F098xC
Cyclic redundancy check calculation unit (CRC)
The CRC (cyclic redundancy check) calculation unit is used to get a CRC code using a
configurable generator polynomial value and size.
Among other applications, CRC-based techniques are used to verify data transmission or
storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of
verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of
the software during runtime, to be compared with a reference signature generated at linktime and stored at a given memory location.
3.5
Power management
3.5.1
Power supply schemes
•
•
•
•
VDD = 1.8 V ± 8%: external power supply for I/Os and digital logic. Provided externally
through VDD pins.
VDDA = from VDD to 3.6 V: external analog power supply for ADC, DAC, RCs and PLL
(minimum voltage to be applied to VDDA is 2.4 V when the ADC or DAC are used). The
VDDA voltage level must be always greater or equal to the VDD voltage level and must
be provided first.
VDDIO2 = 1.65 to 3.6 V: external power supply for marked I/Os. Provided externally
through the VDDIO2 pin. The VDDIO2 voltage level is completely independent from VDD
or VDDA, but it must not be provided without a valid supply on VDD. The VDDIO2 supply
is monitored and compared with the internal reference voltage (VREFINT). When the
VDDIO2 is below this threshold, all the I/Os supplied from this rail are disabled by
hardware. The output of this comparator is connected to EXTI line 31 and it can be
used to generate an interrupt. Refer to the pinout diagrams or tables for concerned I/Os
list.
VBAT = 1.65 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and
backup registers (through power switch) when VDD is not present.
For more details on how to connect power pins, refer to Figure 13: Power supply scheme.
3.5.2
Power-on reset
To guarantee a proper power-on reset, the NPOR pin must be held low until VDD is stable.
When VDD is stable, the reset state can be exited either by:
•
putting the NPOR pin in high impedance (NPOR pin has an internal pull-up), or by
•
forcing the pin to high level by connecting it to VDDA.
3.5.3
Low-power modes
The STM32F098xC microcontrollers support two low-power modes to achieve the best
compromise between low power consumption, short startup time and available wakeup
sources:
•
Sleep mode
In Sleep mode, only the CPU is stopped. All peripherals continue to operate and can
wake up the CPU when an interrupt/event occurs.
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STM32F098xC
•
Functional overview
Stop mode
Stop mode achieves very low power consumption while retaining the content of SRAM
and registers. All clocks in the 1.8 V domain are stopped, the PLL, the HSI RC and the
HSE crystal oscillators are disabled.
The device can be woken up from Stop mode by any of the EXTI lines. The EXTI line
source can be one of the 16 external lines, RTC, I2C1 USART1, USART3, COMPx.
Note:
The RTC, the IWDG, and the corresponding clock sources are not stopped by entering Stop
mode.
3.6
Clocks and startup
System clock selection is performed on startup, however the internal RC 8 MHz oscillator is
selected as default CPU clock on reset. An external 4-32 MHz clock can be selected, in
which case it is monitored for failure. If failure is detected, the system automatically switches
back to the internal RC oscillator. A software interrupt is generated if enabled. Similarly, full
interrupt management of the PLL clock entry is available when necessary (for example on
failure of an indirectly used external crystal, resonator or oscillator).
Several prescalers allow the application to configure the frequency of the AHB and the APB
domains. The maximum frequency of the AHB and the APB domains is 48 MHz.
Additionally, also the internal RC 48 MHz oscillator can be selected for system clock or PLL
input source. This oscillator can be automatically fine-trimmed by the means of the CRS
peripheral using the external synchronization.
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Functional overview
STM32F098xC
Figure 2. Clock tree
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3.7
General-purpose inputs/outputs (GPIOs)
Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as
input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the
GPIO pins are shared with digital or analog alternate functions.
The I/O configuration can be locked if needed following a specific sequence in order to
avoid spurious writing to the I/Os registers.
16/128
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STM32F098xC
3.8
Functional overview
Direct memory access controller (DMA)
The 12-channel general-purpose DMAs (seven channels for DMA1 and five channels for
DMA2) manage memory-to-memory, peripheral-to-memory and memory-to-peripheral
transfers.
The DMAs support circular buffer management, removing the need for user code
intervention when the controller reaches the end of the buffer.
Each channel is connected to dedicated hardware DMA requests, with support for software
trigger on each channel. Configuration is made by software and transfer sizes between
source and destination are independent.
DMA can be used with the main peripherals: SPI, I2S, I2C, USART, all TIMx timers (except
TIM14), DAC and ADC.
3.9
Interrupts and events
3.9.1
Nested vectored interrupt controller (NVIC)
The STM32F0xx family embeds a nested vectored interrupt controller able to handle up to
®
32 maskable interrupt channels (not including the 16 interrupt lines of Cortex -M0) and 4
priority levels.
•
Closely coupled NVIC gives low latency interrupt processing
•
Interrupt entry vector table address passed directly to the core
•
Closely coupled NVIC core interface
•
Allows early processing of interrupts
•
Processing of late arriving higher priority interrupts
•
Support for tail-chaining
•
Processor state automatically saved
•
Interrupt entry restored on interrupt exit with no instruction overhead
This hardware block provides flexible interrupt management features with minimal interrupt
latency.
3.9.2
Extended interrupt/event controller (EXTI)
The extended interrupt/event controller consists of 32 edge detector lines used to generate
interrupt/event requests and wake-up the system. Each line can be independently
configured to select the trigger event (rising edge, falling edge, both) and can be masked
independently. A pending register maintains the status of the interrupt requests. The EXTI
can detect an external line with a pulse width shorter than the internal clock period. Up to 88
GPIOs can be connected to the 16 external interrupt lines.
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Functional overview
3.10
STM32F098xC
Analog to digital converter (ADC)
The 12-bit analog to digital converter has up to 16 external and 3 internal (temperature
sensor, voltage reference, VBAT voltage measurement) channels and performs conversions
in single-shot or scan modes. In scan mode, automatic conversion is performed on a
selected group of analog inputs.
The ADC can be served by the DMA controller.
An analog watchdog feature allows very precise monitoring of the converted voltage of one,
some or all selected channels. An interrupt is generated when the converted voltage is
outside the programmed thresholds.
3.10.1
Temperature sensor
The temperature sensor (TS) generates a voltage VSENSE that varies linearly with
temperature.
The temperature sensor is internally connected to the ADC_IN16 input channel which is
used to convert the sensor output voltage into a digital value.
The sensor provides good linearity but it has to be calibrated to obtain good overall
accuracy of the temperature measurement. As the offset of the temperature sensor varies
from chip to chip due to process variation, the uncalibrated internal temperature sensor is
suitable for applications that detect temperature changes only.
To improve the accuracy of the temperature sensor measurement, each device is
individually factory-calibrated by ST. The temperature sensor factory calibration data are
stored by ST in the system memory area, accessible in read-only mode.
Table 3. Temperature sensor calibration values
Calibration value name
3.10.2
Description
Memory address
TS_CAL1
TS ADC raw data acquired at a
temperature of 30 °C (± 5 °C),
VDDA= 3.3 V (± 10 mV)
0x1FFF F7B8 - 0x1FFF F7B9
TS_CAL2
TS ADC raw data acquired at a
temperature of 110 °C (± 5 °C),
VDDA= 3.3 V (± 10 mV)
0x1FFF F7C2 - 0x1FFF F7C3
Internal voltage reference (VREFINT)
The internal voltage reference (VREFINT) provides a stable (bandgap) voltage output for the
ADC and comparators. VREFINT is internally connected to the ADC_IN17 input channel. The
precise voltage of VREFINT is individually measured for each part by ST during production
test and stored in the system memory area. It is accessible in read-only mode.
Table 4. Internal voltage reference calibration values
Calibration value name
VREFINT_CAL
18/128
Description
Memory address
Raw data acquired at a
temperature of 30 °C (± 5 °C), 0x1FFF F7BA - 0x1FFF F7BB
VDDA= 3.3 V (± 10 mV)
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STM32F098xC
3.10.3
Functional overview
VBAT battery voltage monitoring
This embedded hardware feature allows the application to measure the VBAT battery voltage
using the internal ADC channel ADC_IN18. As the VBAT voltage may be higher than VDDA,
and thus outside the ADC input range, the VBAT pin is internally connected to a bridge
divider by 2. As a consequence, the converted digital value is half the VBAT voltage.
3.11
Digital-to-analog converter (DAC)
The two 12-bit buffered DAC channels can be used to convert digital signals into analog
voltage signal outputs. The chosen design structure is composed of integrated resistor
strings and an amplifier in non-inverting configuration.
This digital Interface supports the following features:
•
8-bit or 12-bit monotonic output
•
Left or right data alignment in 12-bit mode
•
Synchronized update capability
•
Noise-wave generation
•
Triangular-wave generation
•
Dual DAC channel independent or simultaneous conversions
•
DMA capability for each channel
•
External triggers for conversion
Six DAC trigger inputs are used in the device. The DAC is triggered through the timer trigger
outputs and the DAC interface is generating its own DMA requests.
3.12
Comparators (COMP)
The device embeds two fast rail-to-rail low-power comparators with programmable
reference voltage (internal or external), hysteresis and speed (low speed for low power) and
with selectable output polarity.
The reference voltage can be one of the following:
•
External I/O
•
DAC output pins
•
Internal reference voltage or submultiple (1/4, 1/2, 3/4). Refer to Table 26: Embedded
internal reference voltage for the value and precision of the internal reference voltage.
Both comparators can wake up from STOP mode, generate interrupts and breaks for the
timers and can be also combined into a window comparator.
3.13
Touch sensing controller (TSC)
The STM32F098xC devices provide a simple solution for adding capacitive sensing
functionality to any application. These devices offer up to 2324 capacitive sensing channels
distributed over 8 analog I/O groups.
Capacitive sensing technology is able to detect the presence of a finger near a sensor which
is protected from direct touch by a dielectric (glass, plastic...). The capacitive variation
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Functional overview
STM32F098xC
introduced by the finger (or any conductive object) is measured using a proven
implementation based on a surface charge transfer acquisition principle. It consists of
charging the sensor capacitance and then transferring a part of the accumulated charges
into a sampling capacitor until the voltage across this capacitor has reached a specific
threshold. To limit the CPU bandwidth usage, this acquisition is directly managed by the
hardware touch sensing controller and only requires few external components to operate.
The touch sensing controller is fully supported by the STMTouch touch sensing firmware
library, which is free to use and allows touch sensing functionality to be implemented reliably
in the end application.
Table 5. Capacitive sensing GPIOs available on STM32F098xC devices
Group
1
2
3
4
Capacitive sensing
signal name
Pin
name
Capacitive sensing
signal name
Pin
name
TSC_G1_IO1
PA0
TSC_G5_IO1
PB3
TSC_G1_IO2
PA1
TSC_G5_IO2
PB4
TSC_G1_IO3
PA2
TSC_G5_IO3
PB6
TSC_G1_IO4
PA3
TSC_G5_IO4
PB7
TSC_G2_IO1
PA4
TSC_G6_IO1
PB11
TSC_G2_IO2
PA5
TSC_G6_IO2
PB12
TSC_G2_IO3
PA6
TSC_G6_IO3
PB13
TSC_G2_IO4
PA7
TSC_G6_IO4
PB14
TSC_G3_IO1
PC5
TSC_G7_IO1
PE2
TSC_G3_IO2
PB0
TSC_G7_IO2
PE3
TSC_G3_IO3
PB1
TSC_G7_IO3
PE4
TSC_G7_IO4
PE5
TSC_G8_IO1
PD12
TSC_G8_IO2
PD13
TSC_G8_IO3
PD14
TSC_G8_IO4
PD15
TSC_G4_IO1
PA9
TSC_G4_IO2
PA10
TSC_G4_IO3
PA11
TSC_G4_IO4
PA12
Group
5
6
7
8
Table 6. No. of capacitive sensing channels available on STM32F098xC devices
Number of capacitive sensing channels
Analog I/O group
20/128
STM32F098Vx
STM32F098Rx
STM32F098Cx
G1
3
3
3
G2
3
3
3
G3
2
2
1
G4
3
3
3
G5
3
3
3
G6
3
3
3
G7
3
0
0
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STM32F098xC
Functional overview
Table 6. No. of capacitive sensing channels available on STM32F098xC devices
Number of capacitive sensing channels
Analog I/O group
3.14
STM32F098Vx
STM32F098Rx
STM32F098Cx
G8
3
0
0
Number of capacitive
sensing channels
23
17
16
Timers and watchdogs
The STM32F098xC devices include up to six general-purpose timers, two basic timers and
an advanced control timer.
Table 7 compares the features of the different timers.
Table 7. Timer feature comparison
Timer
type
Timer
Counter
resolution
Counter
type
Prescaler
factor
DMA request
generation
Advanced
control
TIM1
16-bit
Up,
down,
up/down
Any integer
between 1
and 65536
Yes
4
Yes
TIM2
32-bit
Up,
down,
up/down
Any integer
between 1
and 65536
Yes
4
No
TIM3
16-bit
Up,
down,
up/down
Any integer
between 1
and 65536
Yes
4
No
TIM14
16-bit
Up
Any integer
between 1
and 65536
No
1
No
TIM15
16-bit
Up
Any integer
between 1
and 65536
Yes
2
Yes
TIM16,
TIM17
16-bit
Up
Any integer
between 1
and 65536
Yes
1
Yes
TIM6,
TIM7
16-bit
Up
Any integer
between 1
and 65536
Yes
0
No
General
purpose
Basic
3.14.1
Capture/compare Complementary
channels
outputs
Advanced-control timer (TIM1)
The advanced-control timer (TIM1) can be seen as a three-phase PWM multiplexed on six
channels. It has complementary PWM outputs with programmable inserted dead times. It
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Functional overview
STM32F098xC
can also be seen as a complete general-purpose timer. The four independent channels can
be used for:
•
Input capture
•
Output compare
•
PWM generation (edge or center-aligned modes)
•
One-pulse mode output
If configured as a standard 16-bit timer, it has the same features as the TIMx timer. If
configured as the 16-bit PWM generator, it has full modulation capability (0-100%).
The counter can be frozen in debug mode.
Many features are shared with those of the standard timers which have the same
architecture. The advanced control timer can therefore work together with the other timers
via the Timer Link feature for synchronization or event chaining.
3.14.2
General-purpose timers (TIM2..3, TIM14..17)
There are six synchronizable general-purpose timers embedded in the STM32F098xC
devices (see Table 7 for differences). Each general-purpose timer can be used to generate
PWM outputs, or as simple time base.
TIM2, TIM3
STM32F098xC devices feature two synchronizable 4-channel general-purpose timers. TIM2
is based on a 32-bit auto-reload up/downcounter and a 16-bit prescaler. TIM3 is based on a
16-bit auto-reload up/downcounter and a 16-bit prescaler. They feature 4 independent
channels each for input capture/output compare, PWM or one-pulse mode output. This
gives up to 12 input captures/output compares/PWMs on the largest packages.
The TIM2 and TIM3 general-purpose timers can work together or with the TIM1 advancedcontrol timer via the Timer Link feature for synchronization or event chaining.
TIM2 and TIM3 both have independent DMA request generation.
These timers are capable of handling quadrature (incremental) encoder signals and the
digital outputs from 1 to 3 hall-effect sensors.
Their counters can be frozen in debug mode.
TIM14
This timer is based on a 16-bit auto-reload upcounter and a 16-bit prescaler.
TIM14 features one single channel for input capture/output compare, PWM or one-pulse
mode output.
Its counter can be frozen in debug mode.
TIM15, TIM16 and TIM17
These timers are based on a 16-bit auto-reload upcounter and a 16-bit prescaler.
TIM15 has two independent channels, whereas TIM16 and TIM17 feature one single
channel for input capture/output compare, PWM or one-pulse mode output.
The TIM15, TIM16 and TIM17 timers can work together, and TIM15 can also operate
withTIM1 via the Timer Link feature for synchronization or event chaining.
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Functional overview
TIM15 can be synchronized with TIM16 and TIM17.
TIM15, TIM16 and TIM17 have a complementary output with dead-time generation and
independent DMA request generation.
Their counters can be frozen in debug mode.
Basic timersTIM6 and TIM7These timers are mainly used for DAC trigger
generation. They can also be used as a generic 16-bit time base.
3.14.3
Independent watchdog (IWDG)
The independent watchdog is based on an 8-bit prescaler and 12-bit downcounter with
user-defined refresh window. It is clocked from an independent 40 kHz internal RC and as it
operates independently from the main clock, it can operate in Stop mode. It can be used
either as a watchdog to reset the device when a problem occurs, or as a free running timer
for application timeout management. It is hardware or software configurable through the
option bytes. The counter can be frozen in debug mode.
3.14.4
System window watchdog (WWDG)
The system window watchdog is based on a 7-bit downcounter that can be set as free
running. It can be used as a watchdog to reset the device when a problem occurs. It is
clocked from the APB clock (PCLK). It has an early warning interrupt capability and the
counter can be frozen in debug mode.
3.14.5
SysTick timer
This timer is dedicated to real-time operating systems, but could also be used as a standard
down counter. It features:
•
A 24-bit down counter
•
Autoreload capability
•
Maskable system interrupt generation when the counter reaches 0
•
Programmable clock source (HCLK or HCLK/8)
3.15
Real-time clock (RTC) and backup registers
The RTC and the five backup registers are supplied through a switch that takes power either
on VDD supply when present or through the VBAT pin. The backup registers are five 32-bit
registers used to store 20 bytes of user application data when VDD power is not present.
They are not reset by a system or power reset.
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The RTC is an independent BCD timer/counter. Its main features are the following:
•
Calendar with subseconds, seconds, minutes, hours (12 or 24 format), week day, date,
month, year, in BCD (binary-coded decimal) format.
•
Automatic correction for 28, 29 (leap year), 30, and 31 day of the month.
•
Programmable alarm with wake up from Stop mode capability.
•
Periodic wakeup unit with programmable resolution and period.
•
On-the-fly correction from 1 to 32767 RTC clock pulses. This can be used to
synchronize the RTC with a master clock.
•
Digital calibration circuit with 1 ppm resolution, to compensate for quartz crystal
inaccuracy.
•
Three anti-tamper detection pins with programmable filter. The MCU can be woken up
from Stop mode on tamper event detection.
•
Timestamp feature which can be used to save the calendar content. This function can
be triggered by an event on the timestamp pin, or by a tamper event. The MCU can be
woken up from Stop mode on timestamp event detection.
•
Reference clock detection: a more precise second source clock (50 or 60 Hz) can be
used to enhance the calendar precision.
The RTC clock sources can be:
•
A 32.768 kHz external crystal
•
A resonator or oscillator
•
The internal low-power RC oscillator (typical frequency of 40 kHz)
•
The high-speed external clock divided by 32
3.16
Inter-integrated circuit interfaces (I2C)
Up to two I2C interfaces (I2C1 and I2C2) can operate in multimaster or slave modes. Both
can support Standard mode (up to 100 kbit/s), Fast mode (up to 400 kbit/s) and Fast Mode
Plus (up to 1 Mbit/s) with extra output drive on most of the associated I/Os.
Both support 7-bit and 10-bit addressing modes, multiple 7-bit slave addresses (two
addresses, one with configurable mask). They also include programmable analog and
digital noise filters.
Table 8. Comparison of I2C analog and digital filters
Analog filter
Digital filter
Pulse width of
suppressed spikes
≥ 50 ns
Programmable length from 1 to 15
I2C peripheral clocks
Benefits
Available in Stop mode
1. Extra filtering capability vs.
standard requirements.
2. Stable length
Drawbacks
Variations depending on
temperature, voltage, process
Wakeup from Stop on address
match is not available when digital
filter is enabled.
In addition, I2C1 provides hardware support for SMBUS 2.0 and PMBUS 1.1: ARP
capability, Host notify protocol, hardware CRC (PEC) generation/verification, timeouts
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Functional overview
verifications and ALERT protocol management. I2C1 also has a clock domain independent
from the CPU clock, allowing the I2C1 to wake up the MCU from Stop mode on address
match.
The I2C interfaces can be served by the DMA controller.
Refer to Table 9 for the differences between I2C1 and I2C2.
Table 9. STM32F098xC I2C implementation
I2C features(1)
I2C1
I2C2
7-bit addressing mode
X
X
10-bit addressing mode
X
X
Standard mode (up to 100 kbit/s)
X
X
Fast mode (up to 400 kbit/s)
X
X
Fast Mode Plus (up to 1 Mbit/s) with extra output drive I/Os
X
X
Independent clock
X
-
SMBus
X
-
Wakeup from STOP
X
-
1. X = supported.
3.17
Universal synchronous/asynchronous receiver transmitters
(USART)
The device embeds up to eight universal synchronous/asynchronous receiver transmitters
(USART1, USART2, USART3, USART4, USART5, USART6, USART7, USART8), which
communicate at speeds of up to 6 Mbit/s.
They provide hardware management of the CTS, RTS and RS485 DE signals,
multiprocessor communication mode, master synchronous communication and single-wire
half-duplex communication mode. USART1, USART2 and USART3 support also SmartCard
communication (ISO 7816), IrDA SIR ENDEC, LIN Master/Slave capability and auto baud
rate feature, and have a clock domain independent from the CPU clock, allowing to wake up
the MCU from Stop mode.
The USART interfaces can be served by the DMA controller.
Table 10. STM32F098xC USART implementation
USART1
USART2
USART3
USART4
USART5
USART6
USART7
USART8
Hardware flow control for modem
X
X
-
Continuous communication using DMA
X
X
X
Multiprocessor communication
X
X
X
Synchronous mode
X
X
X
Smartcard mode
X
-
-
USART
modes/features(1)
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Functional overview
STM32F098xC
Table 10. STM32F098xC USART implementation (continued)
USART1
USART2
USART3
USART4
USART5
USART6
USART7
USART8
Single-wire half-duplex communication
X
X
X
IrDA SIR ENDEC block
X
-
-
LIN mode
X
-
-
Dual clock domain and wakeup from Stop mode
X
-
-
Receiver timeout interrupt
X
-
-
Modbus communication
X
-
-
Auto baud rate detection
X
-
-
Driver Enable
X
X
X
USART modes/features
(1)
1. X = supported.
3.18
Serial peripheral interface (SPI)/Inter-integrated sound
interfaces (I2S)
Two SPIs are able to communicate up to 18 Mbit/s in slave and master modes in full-duplex
and half-duplex communication modes. The 3-bit prescaler gives 8 master mode
frequencies and the frame size is configurable from 4 bits to 16 bits.
Two standard I2S interfaces (multiplexed with SPI1 and SPI2 respectively) supporting four
different audio standards can operate as master or slave at half-duplex communication
mode. They can be configured to transfer 16 and 24 or 32 bits with 16-bit or 32-bit data
resolution and synchronized by a specific signal. Audio sampling frequency from 8 kHz up to
192 kHz can be set by an 8-bit programmable linear prescaler. When operating in master
mode, they can output a clock for an external audio component at 256 times the sampling
frequency.
Table 11. STM32F098xC SPI/I2S implementation
SPI features(1)
Hardware CRC calculation
X
Rx/Tx FIFO
X
NSS pulse mode
X
I2S mode
X
TI mode
X
1. X = supported.
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SPI1 and SPI2
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3.19
Functional overview
High-definition multimedia interface (HDMI) - consumer
electronics control (CEC)
The device embeds a HDMI-CEC controller that provides hardware support for the
Consumer Electronics Control (CEC) protocol (Supplement 1 to the HDMI standard).
This protocol provides high-level control functions between all audiovisual products in an
environment. It is specified to operate at low speeds with minimum processing and memory
overhead. It has a clock domain independent from the CPU clock, allowing the HDMI_CEC
controller to wakeup the MCU from Stop mode on data reception.
3.20
Controller area network (CAN)
The CAN is compliant with specifications 2.0A and B (active) with a bit rate up to 1 Mbit/s. It
can receive and transmit standard frames with 11-bit identifiers as well as extended frames
with 29-bit identifiers. It has three transmit mailboxes, two receive FIFOs with 3 stages and
14 scalable filter banks.
3.21
Clock recovery system (CRS)
The STM32F098xC embeds a special block which allows automatic trimming of the internal
48 MHz oscillator to guarantee its optimal accuracy over the whole device operational
range. This automatic trimming is based on the external synchronization signal, which could
be either derived from LSE oscillator, from an external signal on CRS_SYNC pin or
generated by user software. For faster lock-in during startup it is also possible to combine
automatic trimming with manual trimming action.
3.22
Serial wire debug port (SW-DP)
An ARM SW-DP interface is provided to allow a serial wire debugging tool to be connected
to the MCU.
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Pinouts and pin descriptions
4
STM32F098xC
Pinouts and pin descriptions
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DocID026967 Rev 2
STM32F098xC
Pinouts and pin descriptions
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9''
1325
3$
966
9''
3$
3$
3$
3$
3&
3&
3%
3%
3(
3(
3(
3(
3(
9%$7
3&
3&26&B,1
3&26&B287
3)
3)
3)26&B,1
3)26&B287
1567
3&
3&
3&
3&
3)
966$
9''$
3)
3$
3$
3$
*0QJOTVQQMJFECZ7%%*0
069
DocID026967 Rev 2
29/128
41
Pinouts and pin descriptions
STM32F098xC
Figure 5. UFBGA64 package ball-out (top view)
$
3&
26&B,1
3&
3%
3%
3%
3$
3$
3$
%
3&
26&B287
9%$7
3%
%227
3'
3&
3&
3$
&
3)
26&B,1
966
3%
3%
3&
3$
3$
3$
'
3)
26&B287
9''
3%
966
966
966
3$
3&
(
1567
3&
3&
9''
9''
9'',2
3&
3&
)
966$
3&
3$
3$
3%
3&
3%
3%
*
3&
3$
3$
3$
3%
1325
3%
3%
+
9''$
3$
3$
3$
3&
3&
3%
3%
/HJHQG,2SLQVXSSSOLHGE\9'',2
069
30/128
DocID026967 Rev 2
STM32F098xC
Pinouts and pin descriptions
3&
3&26&B,1
3&26&B287
3)26&B,1
3)26&B287
1567
3&
3&
3&
3&
966$
9''$
3$
3$
966
9''
3$
3$
3%
3%
3%
3%
3%
3'
3& 3& 3& 3$
3$
3)%227
/4)3
9'',2
966
3$
3$
3$
3$
3$
3$
3&
3&
3&
3&
3%
3%
3%
3%
3$
3$
3$
3$
3&
3&
3%
3%
1325
3%
3%
966
9''
9%$7
3%
3%
9''
966
Figure 6. LQFP64 64-pin package pinout (top view)
*0QJOTVQQMJFECZ7%%*0
069
DocID026967 Rev 2
31/128
41
Pinouts and pin descriptions
STM32F098xC
Figure 7. WLCSP64 package ballout (bottom view)
$
9''
966
3%
%
9%$7
3&
3%
&
'
(
3)
3&
26&B287
3'
3&
3$
9'',2
3%
3&
3$
966
3$
3%
3&
3$
3$
3$
3&
3%
3%
3$
3$
3&
3&
3$
3$
3&
3&
3&
3&
26&B,1 3& 3)
26&B287
3)
26&B,1 1567
3%
)
3&
3$
3$
3$
3&
3%
3%
3%
*
966$
966
9''
3$
3%
3%
3%
3%
+
9''$
3$
3$
3&
1325
3%
966
9''
,2SLQVXSSOLHGE\9'',2
069
32/128
DocID026967 Rev 2
STM32F098xC
Pinouts and pin descriptions
3$
3$
3%
3%
3%
3%
3%
3)%227
3%
3%
9''
966
Figure 8. LQFP48 48-pin package pinout (top view)
9%$7
3&
3&26&B,1
3&26&B287
3)26&B,1
3)26&B287
1567
966$
9''$
3$
3$
/4)3
966
9'',2
966
3$
3$
3$
3$
3$
3$
3%
3%
3%
3%
9''
3%
3%
3%
1325
3$
3%
3$
3$
3$
3$
3$
,2SLQVXSSOLHGE\9'',2
069
9%$7
3$
3%
3$
3%
3%
3%
3%
3%
3)%227
3%
9''
966
Figure 9. UFQFPN48 48-pin package pinout (top view)
9'',2
966
3$
3$
3$
3)26&B287
3$
1567
3$
966$
9''$
3$
3$
3$
3$
3%
3%
3%
3%
1325
3%
3%
966
9''
3$
3$
3%
3%
8)4)31
3$
3$
3$
3&
3&26&B,1
3&26&B287
3)26&B,1
*0QJOTVQQMJFECZ7%%*0
069
DocID026967 Rev 2
33/128
41
Pinouts and pin descriptions
STM32F098xC
Table 12. Legend/abbreviations used in the pinout table
Name
Abbreviation
Unless otherwise specified in brackets below the pin name, the pin function during and
after reset is the same as the actual pin name
Pin name
Pin type
I/O structure
S
Supply pin
I
Input only pin
I/O
Input / output pin
FT
5 V tolerant I/O
FTf
5 V tolerant I/O, FM+ capable
TTa
3.3 V tolerant I/O directly connected to ADC
POR
External power on reset pin with embedded weak pull-up resistor,
powered from VDDA
TC
Standard 3.3 V I/O
B
Dedicated BOOT0 pin
RST
Bidirectional reset pin with embedded weak pull-up resistor
Unless otherwise specified by a note, all I/Os are set as floating inputs during and after
reset.
Notes
Pin
functions
Definition
Alternate
functions
Functions selected through GPIOx_AFR registers
Additional
functions
Functions directly selected/enabled through peripheral registers
Table 13. STM32F098xC pin definitions
UFBGA64
LQFP64
WLCSP64
LQFP48/UFQFPN48
Pin type
I/O structure
B2
1
-
-
-
-
PE2
I/O
FT
TSC_G7_IO1, TIM3_ETR
-
A1
2
-
-
-
-
PE3
I/O
FT
TSC_G7_IO2, TIM3_CH1
-
B1
3
-
-
-
-
PE4
I/O
FT
TSC_G7_IO3, TIM3_CH2
-
C2
4
-
-
-
-
PE5
I/O
FT
TSC_G7_IO4, TIM3_CH3
-
D2
5
-
-
-
-
PE6
I/O
FT
TIM3_CH4
WKUP3,
RTC_TAMP3
E2
6
B2
1
B8
1
VBAT
S
-
34/128
Pin name
(function after
reset)
Notes
LQFP100
Pin functions
UFBGA100
Pin numbers
-
DocID026967 Rev 2
Alternate functions
Additional
functions
Backup power supply
STM32F098xC
Pinouts and pin descriptions
Table 13. STM32F098xC pin definitions (continued)
Notes
I/O structure
Pin name
(function after
reset)
Pin type
LQFP48/UFQFPN48
Pin functions
WLCSP64
LQFP64
UFBGA64
LQFP100
UFBGA100
Pin numbers
(1)
Alternate functions
Additional
functions
-
WKUP2,
RTC_TAMP1,
RTC_TS,
RTC_OUT
-
OSC32_IN
-
OSC32_OUT
C1
7
A2
2
B7
2
PC13
I/O
TC
D1
8
A1
3
C8
3
PC14OSC32_IN
(PC14)
I/O
TC
E1
9
B1
4
C7
4
PC15OSC32_OUT
(PC15)
I/O
TC
F2
10
-
-
-
-
PF9
I/O
FT
TIM15_CH1, USART6_TX
-
G2
11
-
-
-
-
PF10
I/O
FT
TIM15_CH2, USART6_RX
-
F1
12
C1
5
D8
5
PF0-OSC_IN
(PF0)
I/O
FTf
CRS_ SYNC, I2C1_SDA
OSC_IN
G1
13
D1
6
E8
6
PF1-OSC_OUT
(PF1)
I/O
FTf
I2C1_SCL
OSC_OUT
H2
14
E1
7
D7
7
NRST
I/O
RST
H1
15
E3
8
E7
-
PC0
I/O
TTa
EVENTOUT,
USART6_TX,
USART7_TX
ADC_IN10
J2
16
E2
9
F8
-
PC1
I/O
TTa
EVENTOUT,
USART6_RX,
USART7_RX
ADC_IN11
J3
17
F2
10
D6
-
PC2
I/O
TTa
SPI2_MISO, I2S2_MCK,
EVENTOUT, USART8_TX
ADC_IN12
K2
18
G1
11
E6
-
PC3
I/O
TTa
SPI2_MOSI, I2S2_SD,
EVENTOUT, USART8_RX
ADC_IN13
J1
19
-
-
-
-
PF2
I/O
FT
EVENTOUT,
USART7_TX,
USART7_CK_RTS
WKUP8
K1
20
F1
12
G8
8
VSSA
S
-
Analog ground
M1
21
H1
13
H8
9
VDDA
S
-
Analog power supply
L1
22
-
-
-
-
PF3
I/O
FT
(2)
(1)
(2)
(1)
(2)
DocID026967 Rev 2
Device reset input / internal reset output
(active low)
EVENTOUT,
USART7_RX,
USART6_CK_RTS
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Pinouts and pin descriptions
STM32F098xC
Table 13. STM32F098xC pin definitions (continued)
L2
M2
23
24
G2
H2
14
15
F7
F6
10
11
PA0
PA1
I/O
I/O
Notes
I/O structure
Pin name
(function after
reset)
Pin type
LQFP48/UFQFPN48
Pin functions
WLCSP64
LQFP64
UFBGA64
LQFP100
UFBGA100
Pin numbers
Alternate functions
Additional
functions
TTa
USART2_CTS,
TIM2_CH1_ETR,
TSC_G1_IO1,
USART4_TX
COMP1_OUT
RTC_ TAMP2,
WKUP1,
ADC_IN0,
COMP1_INM6
TTa
USART2_RTS,
TIM2_CH2,
TIM15_CH1N,
TSC_G1_IO2,
USART4_RX,
EVENTOUT
ADC_IN1,
COMP1_INP
ADC_IN2,
WKUP4,
COMP2_INM6
ADC_IN3,
COMP2_INP
K3
25
F3
16
E5
12
PA2
I/O
TTa
USART2_TX, TIM2_CH3,
TIM15_CH1,
TSC_G1_IO3
COMP2_OUT
L3
26
G3
17
H7
13
PA3
I/O
TTa
USART2_RX,TIM2_CH4,
TIM15_CH2,
TSC_G1_IO4
D3
27
C2
18
G7
-
VSS
S
-
Ground
H3
28
D2
19
G6
-
VDD
S
-
Digital power supply
M3
K4
L4
36/128
29
30
31
H3
F4
G4
20
21
22
H6
F5
G5
14
15
16
PA4
PA5
PA6
I/O
I/O
I/O
TTa
SPI1_NSS, I2S1_WS,
TIM14_CH1,
TSC_G2_IO1,
USART2_CK,
USART6_TX
COMP1_INM4,
COMP2_INM4,
ADC_IN4,
DAC_OUT1
TTa
SPI1_SCK, I2S1_CK,
CEC,
TIM2_CH1_ETR,
TSC_G2_IO2,
USART6_RX
COMP1_INM5,
COMP2_INM5,
ADC_IN5,
DAC_OUT2
TTa
SPI1_MISO, I2S1_MCK,
TIM3_CH1, TIM1_BKIN,
TIM16_CH1,
COMP1_OUT,
TSC_G2_IO3,
EVENTOUT,
USART3_CTS
ADC_IN6
DocID026967 Rev 2
STM32F098xC
Pinouts and pin descriptions
Table 13. STM32F098xC pin definitions (continued)
Notes
I/O structure
Pin name
(function after
reset)
Pin type
LQFP48/UFQFPN48
Pin functions
WLCSP64
LQFP64
UFBGA64
LQFP100
UFBGA100
Pin numbers
Alternate functions
Additional
functions
ADC_IN7
M4
32
H4
23
E4
17
PA7
I/O
TTa
SPI1_MOSI, I2S1_SD,
TIM3_CH2, TIM14_CH1,
TIM1_CH1N, TIM17_CH1,
COMP2_OUT,
TSC_G2_IO4,
EVENTOUT
K5
33
H5
24
H5
-
PC4
I/O
TTa
EVENTOUT, USART3_TX
ADC_IN14
L5
34
H6
25
F4
-
PC5
I/O
TTa
TSC_G3_IO1,
USART3_RX
ADC_IN15,
WKUP5
TTa
TIM3_CH3, TIM1_CH2N,
TSC_G3_IO2,
EVENTOUT,
USART3_CK
ADC_IN8
TIM3_CH4,
USART3_RTS,
TIM14_CH1, TIM1_CH3N,
TSC_G3_IO3
ADC_IN9
M5
35
F5
26
G4
18
PB0
I/O
M6
36
G5
27
F3
19
PB1
I/O
TTa
L6
37
G6
28
H4
20
NPOR
I
POR
M7
38
-
-
-
-
PE7
I/O
FT
TIM1_ETR,
USART5_CK_RTS
-
L7
39
-
-
-
-
PE8
I/O
FT
TIM1_CH1N,
USART4_TX
-
M8
40
-
-
-
-
PE9
I/O
FT
TIM1_CH1, USART4_RX
-
L8
41
-
-
-
-
PE10
I/O
FT
TIM1_CH2N,
USART5_TX
-
M9
42
-
-
-
-
PE11
I/O
FT
TIM1_CH2, USART5_RX
-
L9
43
-
-
-
-
PE12
I/O
FT
SPI1_NSS, I2S1_WS,
TIM1_CH3N
-
M10
44
-
-
-
-
PE13
I/O
FT
SPI1_SCK, I2S1_CK,
TIM1_CH3
-
M11
45
-
-
-
-
PE14
I/O
FT
SPI1_MISO, I2S1_MCK,
TIM1_CH4
-
M12
46
-
-
-
-
PE15
I/O
FT
SPI1_MOSI, I2S1_SD,
TIM1_BKIN
-
(3)
DocID026967 Rev 2
Device power-on reset input (active low)
37/128
41
Pinouts and pin descriptions
STM32F098xC
Table 13. STM32F098xC pin definitions (continued)
L10
47
G7
29
G3
21
PB10
I/O
Notes
I/O structure
Pin name
(function after
reset)
Pin type
LQFP48/UFQFPN48
Pin functions
WLCSP64
LQFP64
UFBGA64
LQFP100
UFBGA100
Pin numbers
Alternate functions
Additional
functions
FTf
SPI2_SCK, I2S2_CK,
I2C2_SCL,
USART3_TX, CEC,
TSC_SYNC, TIM2_CH3
-
USART3_RX, TIM2_CH4,
EVENTOUT,
TSC_G6_IO1,
I2C2_SDA
-
L11
48
H7
30
H3
22
PB11
I/O
FTf
F12
49
D5
31
H2
23
VSS
S
-
Ground
G12
50
E5
32
H1
24
VDD
S
-
Digital power supply
L12
K12
K11
51
52
53
H8
G8
F8
33
34
35
G2
F2
G1
25
26
27
PB12
PB13
PB14
I/O
I/O
I/O
FT
TIM1_BKIN, TIM15_BKIN,
SPI2_NSS, I2S2_WS,
USART3_CK,
TSC_G6_IO2,
EVENTOUT
-
FTf
SPI2_SCK, I2S2_CK,
I2C2_SCL,
USART3_CTS,
TIM1_CH1N,
TSC_G6_IO3
-
FTf
SPI2_MISO, I2S2_MCK,
I2C2_SDA,
USART3_RTS,
TIM1_CH2N, TIM15_CH1,
TSC_G6_IO4
-
WKUP7,
RTC_REFIN
K10
54
F7
36
F1
28
PB15
I/O
FT
SPI2_MOSI, I2S2_SD,
TIM1_CH3N,
TIM15_CH1N,
TIM15_CH2
K9
55
-
-
-
-
PD8
I/O
FT
USART3_TX
-
K8
56
-
-
-
-
PD9
I/O
FT
USART3_RX
-
J12
57
-
-
-
-
PD10
I/O
FT
USART3_CK
-
J11
58
-
-
-
-
PD11
I/O
FT
USART3_CTS
-
J10
59
-
-
-
-
PD12
I/O
FT
USART3_RTS,
TSC_G8_IO1,
USART8_CK_RTS
-
38/128
DocID026967 Rev 2
STM32F098xC
Pinouts and pin descriptions
Table 13. STM32F098xC pin definitions (continued)
UFBGA64
LQFP64
WLCSP64
LQFP48/UFQFPN48
Pin type
I/O structure
H12
60
-
-
-
-
PD13
I/O
FT
TSC_G8_IO2,
USART8_TX
-
H11
61
-
-
-
-
PD14
I/O
FT
TSC_G8_IO3,
USART8_RX
-
H10
62
-
-
-
-
PD15
I/O
FT
TSC_G8_IO4,
CRS_SYNC,
USART7_CK_RTS
-
E12
63
F6
37
E1
-
PC6
I/O
FT
(4)
TIM3_CH1, USART7_TX
-
TIM3_CH2, USART7_RX
-
Pin name
(function after
reset)
Notes
LQFP100
Pin functions
UFBGA100
Pin numbers
Alternate functions
Additional
functions
E11
64
E7
38
D1
-
PC7
I/O
FT
(4)
E10
65
E8
39
E2
-
PC8
I/O
FT
(4)
TIM3_CH3, USART8_TX
-
D12
66
D8
40
E3
-
PC9
I/O
FT
(4)
TIM3_CH4, USART8_RX
-
D11
67
D7
41
D2
29
PA8
I/O
FT
(4)
USART1_CK, TIM1_CH1,
EVENTOUT, MCO,
CRS_SYNC
-
D10
68
C7
42
C1
30
PA9
I/O
FT
(4)
USART1_TX, TIM1_CH2,
TIM15_BKIN,
TSC_G4_IO1, I2C1_SCL
MCO
C12
69
C6
43
C2
31
PA10
I/O
FT
(4)
USART1_RX, TIM1_CH3,
TIM17_BKIN,
TSC_G4_IO2, I2C1_SDA
-
FT
(4)
CAN_RX, USART1_CTS,
TIM1_CH4, COMP1_OUT,
TSC_G4_IO3,
EVENTOUT, I2C2_SCL
-
(4)
CAN_TX, USART1_RTS,
TIM1_ETR, COMP2_OUT,
TSC_G4_IO4,
EVENTOUT, I2C2_SDA
-
(5)
IR_OUT, SWDIO
-
(4)
-
-
B12
70
C8
44
D3
32
PA11
I/O
A12
71
B8
45
B1
33
PA12
I/O
FT
A11
72
A8
46
C3
34
PA13
I/O
FT
C11
73
-
-
-
-
PF6
I/O
FT
F11
74
D6
47
B2
35
VSS
S
-
G11
75
E6
48
A1
36
VDDIO2
S
-
A10
76
A7
49
B3
37
PA14
I/O
FT
(4)
Ground
Digital power supply
(4)
(5)
DocID026967 Rev 2
USART2_TX, SWCLK
-
39/128
41
Pinouts and pin descriptions
STM32F098xC
Table 13. STM32F098xC pin definitions (continued)
Notes
I/O structure
Pin name
(function after
reset)
Pin type
LQFP48/UFQFPN48
Pin functions
WLCSP64
LQFP64
UFBGA64
LQFP100
UFBGA100
Pin numbers
Alternate functions
Additional
functions
-
A9
77
A6
50
A2
38
PA15
I/O
FT
(4)
SPI1_NSS, I2S1_WS,
USART2_RX,
USART4_RTS,
TIM2_CH1_ETR,
EVENTOUT
B11
78
B7
51
A3
-
PC10
I/O
FT
(4)
USART3_TX,
USART4_TX
-
C10
79
B6
52
C4
-
PC11
I/O
FT
(4)
USART3_RX,
USART4_RX
-
B10
80
C5
53
B4
-
PC12
I/O
FT
(4)
USART3_CK,
USART4_CK,
USART5_TX
-
C9
81
-
-
-
-
PD0
I/O
FT
(4)
SPI2_NSS, I2S2_WS,
CAN_RX
-
B9
82
-
-
-
-
PD1
I/O
FT
(4)
SPI2_SCK, I2S2_CK
CAN_TX
-
C8
83
B5
54
A4
-
PD2
I/O
FT
(4)
USART3_RTS,
TIM3_ETR, USART5_RX
-
B8
84
-
-
-
-
PD3
I/O
FT
SPI2_MISO, I2S2_MCK,
USART2_CTS
-
B7
85
-
-
-
-
PD4
I/O
FT
SPI2_MOSI, I2S2_SD,
USART2_RTS
-
A6
86
-
-
-
-
PD5
I/O
FT
USART2_TX
-
B6
87
-
-
-
-
PD6
I/O
FT
USART2_RX
-
A5
88
-
-
-
-
PD7
I/O
FT
USART2_CK
-
A8
89
A5
55
D4
39
PB3
I/O
FT
SPI1_SCK, I2S1_CK,
TIM2_CH2, TSC_G5_IO1,
EVENTOUT, USART5_TX
-
FT
SPI1_MISO, I2S1_MCK,
TIM17_BKIN, TIM3_CH1,
TSC_G5_IO2,
EVENTOUT, USART5_RX
-
FT
SPI1_MOSI, I2S1_SD,
I2C1_SMBA,
TIM16_BKIN,
TIM3_CH2,
USART5_CK_RTS
WKUP6
A7
C5
40/128
90
91
A4
C4
56
57
D5
C5
40
41
PB4
PB5
I/O
I/O
DocID026967 Rev 2
STM32F098xC
Pinouts and pin descriptions
Table 13. STM32F098xC pin definitions (continued)
WLCSP64
LQFP48/UFQFPN48
D3
58
A5
42
PB6
Alternate functions
Additional
functions
I/O
FTf
I2C1_SCL, USART1_TX,
TIM16_CH1N,
TSC_G5_I03
-
-
Notes
LQFP64
92
I/O structure
UFBGA64
B5
Pin name
(function after
reset)
Pin type
LQFP100
Pin functions
UFBGA100
Pin numbers
B4
93
C3
59
B5
43
PB7
I/O
FTf
I2C1_SDA, USART1_RX,
USART4_CTS,
TIM17_CH1N,
TSC_G5_IO4
A4
94
B4
60
C6
44
PF11-BOOT0
I/O
FT
-
Boot memory
selection
A3
95
B3
61
A6
45
PB8
I/O
FTf
I2C1_SCL, CEC,
TIM16_CH1, TSC_SYNC,
CAN_RX
-
-
B3
96
A3
62
B6
46
PB9
I/O
FTf
SPI2_NSS, I2S2_WS,
I2C1_SDA, IR_OUT,
TIM17_CH1, EVENTOUT,
CAN_TX
C3
97
-
-
-
-
PE0
I/O
FT
EVENTOUT, TIM16_CH1
-
A2
98
-
-
-
-
PE1
I/O
FT
EVENTOUT, TIM17_CH1
-
D3
99
D4
63
A7
47
VSS
S
-
Ground
C4
100 E4
64
A8
48
VDD
S
-
Digital power supply
1. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current
(3 mA), the use of GPIOs PC13 to PC15 in output mode is limited:
- The speed should not exceed 2 MHz with a maximum load of 30 pF.
- These GPIOs must not be used as current sources (e.g. to drive an LED).
2. After the first RTC domain power-up, PC13, PC14 and PC15 operate as GPIOs. Their function then depends on the content
of the RTC registers which are not reset by the system reset. For details on how to manage these GPIOs, refer to the RTC
domain and RTC register descriptions in the reference manual.
3. This pin is powered by VDDA.
4. PC6, PC7, PC8, PC9, PA8, PA9, PA10, PA11, PA12, PA13, PF6, PA14, PA15, PC10, PC11, PC12, PD0, PD1 and PD2 I/Os
are supplied by VDDIO2
5. After reset, these pins are configured as SWDIO and SWCLK alternate functions, and the internal pull-up on the SWDIO pin
and the internal pull-down on the SWCLK pin are activated.
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41
DocID026967 Rev 2
Pin name
AF0
AF1
AF2
AF3
AF4
AF5
AF6
AF7
PA0
-
USART2_CTS
TIM2_CH1_ETR
TSC_G1_IO1
USART4_TX
-
-
COMP1_OUT
PA1
EVENTOUT
USART2_RTS
TIM2_CH2
TSC_G1_IO2
USART4_RX
TIM15_CH1N
-
-
PA2
TIM15_CH1
USART2_TX
TIM2_CH3
TSC_G1_IO3
-
-
-
COMP2_OUT
PA3
TIM15_CH2
USART2_RX
TIM2_CH4
TSC_G1_IO4
-
-
-
-
PA4
SPI1_NSS, I2S1_WS
USART2_CK
-
TSC_G2_IO1
TIM14_CH1
USART6_TX
-
-
PA5
SPI1_SCK, I2S1_CK
CEC
TIM2_CH1_ETR
TSC_G2_IO2
-
USART6_RX
-
-
PA6
SPI1_MISO, I2S1_MCK
TIM3_CH1
TIM1_BKIN
TSC_G2_IO3
USART3_CTS
TIM16_CH1
EVENTOUT
COMP1_OUT
PA7
SPI1_MOSI, I2S1_SD
TIM3_CH2
TIM1_CH1N
TSC_G2_IO4
TIM14_CH1
TIM17_CH1
EVENTOUT
COMP2_OUT
PA8
MCO
USART1_CK
TIM1_CH1
EVENTOUT
CRS_SYNC
-
-
-
PA9
TIM15_BKIN
USART1_TX
TIM1_CH2
TSC_G4_IO1
I2C1_SCL
MCO
-
-
PA10
TIM17_BKIN
USART1_RX
TIM1_CH3
TSC_G4_IO2
I2C1_SDA
-
-
-
PA11
EVENTOUT
USART1_CTS
TIM1_CH4
TSC_G4_IO3
CAN_RX
I2C2_SCL
-
COMP1_OUT
PA12
EVENTOUT
USART1_RTS
TIM1_ETR
TSC_G4_IO4
CAN_TX
I2C2_SDA
-
COMP2_OUT
PA13
SWDIO
IR_OUT
-
-
-
-
-
-
PA14
SWCLK
USART2_TX
-
-
-
-
-
-
PA15
SPI1_NSS, I2S1_WS
USART2_RX
TIM2_CH1_ETR
EVENTOUT
USART4_RTS
-
-
-
STM32F098xC
Table 14. Alternate functions selected through GPIOA_AFR registers for port A
42/128
43/128
Table 15. Alternate functions selected through GPIOB_AFR registers for port B
DocID026967 Rev 2
Pin name
AF0
AF1
AF2
AF3
AF4
AF5
PB0
EVENTOUT
TIM3_CH3
TIM1_CH2N
TSC_G3_IO2
USART3_CK
-
PB1
TIM14_CH1
TIM3_CH4
TIM1_CH3N
TSC_G3_IO3
USART3_RTS
-
PB3
SPI1_SCK, I2S1_CK
EVENTOUT
TIM2_CH2
TSC_G5_IO1
-
PB4
SPI1_MISO, I2S1_MCK
TIM3_CH1
EVENTOUT
TSC_G5_IO2
TIM17_BKIN
PB5
SPI1_MOSI, I2S1_SD
TIM3_CH2
TIM16_BKIN
I2C1_SMBA
-
PB6
USART1_TX
I2C1_SCL
TIM16_CH1N
TSC_G5_IO3
-
-
PB7
USART1_RX
I2C1_SDA
TIM17_CH1N
TSC_G5_IO4
USART4_CTS
-
PB8
CEC
I2C1_SCL
TIM16_CH1
TSC_SYNC
-
PB9
IR_OUT
I2C1_SDA
TIM17_CH1
EVENTOUT
SPI2_NSS, I2S2_WS
PB10
CEC
I2C2_SCL
TIM2_CH3
TSC_SYNC
USART3_TX
SPI2_SCK, I2S2_CK
PB11
EVENTOUT
I2C2_SDA
TIM2_CH4
TSC_G6_IO1
USART3_RX
-
PB12
SPI2_NSS, I2S2_WS
EVENTOUT
TIM1_BKIN
TSC_G6_IO2
USART3_CK
TIM15_BKIN
PB13
SPI2_SCK, I2S2_CK
-
TIM1_CH1N
TSC_G6_IO3
USART3_CTS
I2C2_SCL
PB14
SPI2_MISO, I2S2_MCK
TIM15_CH1
TIM1_CH2N
TSC_G6_IO4
USART3_RTS
I2C2_SDA
PB15
SPI2_MOSI, I2S2_SD
TIM15_CH2
TIM1_CH3N
TIM15_CH1N
-
-
STM32F098xC
STM32F098xC
Table 16. Alternate functions selected through GPIOC_AFR registers for port C
Pin name
AF0
AF1
AF2
PC0
EVENTOUT
USART7_TX
USART6_TX
PC1
EVENTOUT
USART7_RX
USART6_RX
PC2
EVENTOUT
SPI2_MISO, I2S2_MCK
USART8_TX
PC3
EVENTOUT
SPI2_MOSI, I2S2_SD
USART8_RX
PC4
EVENTOUT
USART3_TX
-
PC5
TSC_G3_IO1
USART3_RX
-
PC6
TIM3_CH1
USART7_TX
-
PC7
TIM3_CH2
USART7_RX
-
PC8
TIM3_CH3
USART8_TX
-
PC9
TIM3_CH4
USART8_RX
-
PC10
USART4_TX
USART3_TX
-
PC11
USART4_RX
USART3_RX
-
PC12
USART4_CK
USART3_CK
USART5_TX
PC13
-
-
-
PC14
-
-
-
PC15
-
-
-
Table 17. Alternate functions selected through GPIOD_AFR registers for port D
44/128
Pin name
AF0
AF1
AF2
PD0
CAN_RX
SPI2_NSS, I2S2_WS
-
PD1
CAN_TX
SPI2_SCK, I2S2_CK
-
PD2
TIM3_ETR
USART3_RTS
USART5_RX
PD3
USART2_CTS
SPI2_MISO, I2S2_MCK
-
PD4
USART2_RTS
SPI2_MOSI, I2S2_SD
-
PD5
USART2_TX
-
-
PD6
USART2_RX
-
-
PD7
USART2_CK
-
-
PD8
USART3_TX
-
-
PD9
USART3_RX
-
-
PD10
USART3_CK
-
-
PD11
USART3_CTS
-
-
PD12
USART3_RTS
TSC_G8_IO1
USART8_CK_RTS
PD13
USART8_TX
TSC_G8_IO2
-
PD14
USART8_RX
TSC_G8_IO3
-
PD15
CRS_SYNC
TSC_G8_IO4
USART7_CK_RTS
DocID026967 Rev 2
STM32F098xC
Table 18. Alternate functions selected through GPIOE_AFR registers for port E
Pin name
AF0
AF1
PE0
TIM16_CH1
EVENTOUT
PE1
TIM17_CH1
EVENTOUT
PE2
TIM3_ETR
TSC_G7_IO1
PE3
TIM3_CH1
TSC_G7_IO2
PE4
TIM3_CH2
TSC_G7_IO3
PE5
TIM3_CH3
TSC_G7_IO4
PE6
TIM3_CH4
-
PE7
TIM1_ETR
USART5_CK_RTS
PE8
TIM1_CH1N
USART4_TX
PE9
TIM1_CH1
USART4_RX
PE10
TIM1_CH2N
USART5_TX
PE11
TIM1_CH2
USART5_RX
PE12
TIM1_CH3N
SPI1_NSS, I2S1_WS
PE13
TIM1_CH3
SPI1_SCK, I2S1_CK
PE14
TIM1_CH4
SPI1_MISO, I2S1_MCK
PE15
TIM1_BKIN
SPI1_MOSI, I2S1_SD
Table 19. Alternate functions selected through GPIOF_AFR registers for port F
Pin
name
AF0
AF1
AF2
PF0
CRS_SYNC
I2C1_SDA
-
PF1
-
I2C1_SCL
-
PF2
EVENTOUT
USART7_TX
USART7_CK_RTS
PF3
EVENTOUT
USART7_RX
USART6_CK_RTS
PF4
EVENTOUT
-
-
PF5
EVENTOUT
-
-
PF6
-
-
-
PF9
TIM15_CH1
USART6_TX
-
PF10
TIM15_CH2
USART6_RX
-
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45
Memory mapping
5
STM32F098xC
Memory mapping
Figure 10. STM32F098xC memory map
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46/128
DocID026967 Rev 2
STM32F098xC
Memory mapping
Table 20. STM32F098xC peripheral register boundary addresses
Bus
AHB2
AHB1
Boundary address
Size
Peripheral
0x4800 1800 - 0x5FFF FFFF
~384 MB
Reserved
0x4800 1400 - 0x4800 17FF
1 KB
GPIOF
0x4800 1000 - 0x4800 13FF
1 KB
GPIOE
0x4800 0C00 - 0x4800 0FFF
1 KB
GPIOD
0x4800 0800 - 0x4800 0BFF
1 KB
GPIOC
0x4800 0400 - 0x4800 07FF
1 KB
GPIOB
0x4800 0000 - 0x4800 03FF
1 KB
GPIOA
0x4002 4400 - 0x47FF FFFF
~128 MB
Reserved
0x4002 4000 - 0x4002 43FF
1 KB
TSC
0x4002 3400 - 0x4002 3FFF
3 KB
Reserved
0x4002 3000 - 0x4002 33FF
1 KB
CRC
0x4002 2400 - 0x4002 2FFF
3 KB
Reserved
0x4002 2000 - 0x4002 23FF
1 KB
FLASH Interface
0x4002 1400 - 0x4002 1FFF
3 KB
Reserved
0x4002 1000 - 0x4002 13FF
1 KB
RCC
0x4002 0400 - 0x4002 0FFF
3 KB
Reserved
0x4002 0000 - 0x4002 03FF
1 KB
DMA
0x4001 8000 - 0x4001 FFFF
32 KB
Reserved
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49
Memory mapping
STM32F098xC
Table 20. STM32F098xC peripheral register boundary addresses (continued)
Bus
APB
48/128
Boundary address
Size
Peripheral
0x4001 5C00 - 0x4001 7FFF
9 KB
Reserved
0x4001 5800 - 0x4001 5BFF
1 KB
DBGMCU
0x4001 4C00 - 0x4001 57FF
3 KB
Reserved
0x4001 4800 - 0x4001 4BFF
1 KB
TIM17
0x4001 4400 - 0x4001 47FF
1 KB
TIM16
0x4001 4000 - 0x4001 43FF
1 KB
TIM15
0x4001 3C00 - 0x4001 3FFF
1 KB
Reserved
0x4001 3800 - 0x4001 3BFF
1 KB
USART1
0x4001 3400 - 0x4001 37FF
1 KB
Reserved
0x4001 3000 - 0x4001 33FF
1 KB
SPI1/I2S1
0x4001 2C00 - 0x4001 2FFF
1 KB
TIM1
0x4001 2800 - 0x4001 2BFF
1 KB
Reserved
0x4001 2400 - 0x4001 27FF
1 KB
ADC
0x4001 2000 - 0x4001 23FF
1 KB
Reserved
0x4001 1C00 – 0x4001 1FFF
1 KB
USART8
0x4001 1800 – 0x4001 1BFF
1 KB
USART7
0x4001 1400 – 0x4001 17FF
1 KB
USART6
0x4001 0800 - 0x4001 13FF
3 KB
Reserved
0x4001 0400 - 0x4001 07FF
1 KB
EXTI
0x4001 0000 - 0x4001 03FF
1 KB
SYSCFG + COMP
0x4000 8000 - 0x4000 FFFF
32 KB
Reserved
DocID026967 Rev 2
STM32F098xC
Memory mapping
Table 20. STM32F098xC peripheral register boundary addresses (continued)
Bus
APB
Boundary address
Size
Peripheral
0x4000 7C00 - 0x4000 7FFF
1 KB
Reserved
0x4000 7800 - 0x4000 7BFF
1 KB
CEC
0x4000 7400 - 0x4000 77FF
1 KB
DAC
0x4000 7000 - 0x4000 73FF
1 KB
PWR
0x4000 6C00 - 0x4000 6FFF
1 KB
CRS
0x4000 6800 - 0x4000 6BFF
1 KB
Reserved
0x4000 6400 - 0x4000 67FF
1 KB
BxCAN
0x4000 6100 - 0x4000 63FF
768 B
Reserved
0x4000 6000 - 0x4000 60FF
256 B
CAN RAM
0x4000 5C00 - 0x4000 5FFF
1 KB
Reserved
0x4000 5800 - 0x4000 5BFF
1 KB
I2C2
0x4000 5400 - 0x4000 57FF
1 KB
I2C1
0x4000 5000 - 0x4000 53FF
1 KB
USART5
0x4000 4C00 - 0x4000 4FFF
1 KB
USART4
0x4000 4800 - 0x4000 4BFF
1 KB
USART3
0x4000 4400 - 0x4000 47FF
1 KB
USART2
0x4000 3C00 - 0x4000 43FF
2 KB
Reserved
0x4000 3800 - 0x4000 3BFF
1 KB
SPI2
0x4000 3400 - 0x4000 37FF
1 KB
Reserved
0x4000 3000 - 0x4000 33FF
1 KB
IWDG
0x4000 2C00 - 0x4000 2FFF
1 KB
WWDG
0x4000 2800 - 0x4000 2BFF
1 KB
RTC
0x4000 2400 - 0x4000 27FF
1 KB
Reserved
0x4000 2000 - 0x4000 23FF
1 KB
TIM14
0x4000 1800 - 0x4000 1FFF
2 KB
Reserved
0x4000 1400 - 0x4000 17FF
1 KB
TIM7
0x4000 1000 - 0x4000 13FF
1 KB
TIM6
0x4000 0800 - 0x4000 0FFF
2 KB
Reserved
0x4000 0400 - 0x4000 07FF
1 KB
TIM3
0x4000 0000 - 0x4000 03FF
1 KB
TIM2
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49
Electrical characteristics
STM32F098xC
6
Electrical characteristics
6.1
Parameter conditions
Unless otherwise specified, all voltages are referenced to VSS.
6.1.1
Minimum and maximum values
Unless otherwise specified, the minimum and maximum values are guaranteed in the worst
conditions of ambient temperature, supply voltage and frequencies by tests in production on
100% of the devices with an ambient temperature at TA = 25 °C and TA = TAmax (given by
the selected temperature range).
Data based on characterization results, design simulation and/or technology characteristics
are indicated in the table footnotes and are not tested in production. Based on
characterization, the minimum and maximum values refer to sample tests and represent the
mean value plus or minus three times the standard deviation (mean ±3σ).
6.1.2
Typical values
Unless otherwise specified, typical data are based on TA = 25 °C, VDD = 1.8 V and VDDA =
3.3 V. They are given only as design guidelines and are not tested.
Typical ADC accuracy values are determined by characterization of a batch of samples from
a standard diffusion lot over the full temperature range, where 95% of the devices have an
error less than or equal to the value indicated (mean ±2σ).
6.1.3
Typical curves
Unless otherwise specified, all typical curves are given only as design guidelines and are
not tested.
6.1.4
Loading capacitor
The loading conditions used for pin parameter measurement are shown in Figure 11.
6.1.5
Pin input voltage
The input voltage measurement on a pin of the device is described in Figure 12.
Figure 11. Pin loading conditions
Figure 12. Pin input voltage
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DocID026967 Rev 2
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STM32F098xC
6.1.6
Electrical characteristics
Power supply scheme
Figure 13. Power supply scheme
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Caution:
Each power supply pair (VDD/VSS, VDDA/VSSA etc.) must be decoupled with filtering ceramic
capacitors as shown above. These capacitors must be placed as close as possible to, or
below, the appropriate pins on the underside of the PCB to ensure the good functionality of
the device.
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103
Electrical characteristics
6.1.7
STM32F098xC
Current consumption measurement
Figure 14. Current consumption measurement scheme
,
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DocID026967 Rev 2
STM32F098xC
6.2
Electrical characteristics
Absolute maximum ratings
Stresses above the absolute maximum ratings listed in Table 21: Voltage characteristics,
Table 22: Current characteristics and Table 23: Thermal characteristics may cause
permanent damage to the device. These are stress ratings only and functional operation of
the device at these conditions is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Table 21. Voltage characteristics(1)
Symbol
VDD–VSS
Ratings
Min
Max
Unit
-0.3
1.95
V
-0.3
4.0
V
-0.3
4.0
V
-
0.4
V
-0.3
4.0
V
Input voltage on FT and FTf pins
VSS − 0.3
VDDIOx + 4.0
V
Input voltage on POR pins
VSS − 0.3
4.0
V
Input voltage on TTa pins
VSS − 0.3
4.0
V
Input voltage on any other pin
VSS − 0.3
4.0
V
Variations between different VDD power pins
-
50
mV
Variations between all the different ground
pins
-
50
mV
External main supply voltage
VDDIO2–VSS External I/O supply voltage
VDDA–VSS
External analog supply voltage
VDD–VDDA
Allowed voltage difference for VDD > VDDA
VBAT–VSS
External backup supply voltage
VIN(2)
|ΔVDDx|
|VSSx − VSS|
VESD(HBM)
Electrostatic discharge voltage
(human body model)
see Section 6.3.11: Electrical
sensitivity characteristics
1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power
supply, in the permitted range.
2. VIN maximum must always be respected. Refer to Table 22: Current characteristics for the maximum
allowed injected current values.
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103
Electrical characteristics
STM32F098xC
Table 22. Current characteristics
Symbol
Ratings
Max.
ΣIVDD
Total current into sum of all VDD power lines (source)(1)
120
ΣIVSS
(1)
-120
Total current out of sum of all VSS ground lines (sink)
IVDD(PIN)
(1)
Maximum current into each VDD power pin (source)
100
IVSS(PIN)
Maximum current out of each VSS ground pin (sink)(1)
-100
IIO(PIN)
Output current sunk by any I/O and control pin
25
Output current source by any I/O and control pin
-25
(2)
ΣIIO(PIN)
Total output current sunk by sum of all I/Os and control pins
80
Total output current sourced by sum of all I/Os and control pins(2)
-80
Total output current sourced by sum of all I/Os supplied by VDDIO2
-40
Injected current on TC and RST pin
±5
Injected current on TTa pins(5)
ΣIINJ(PIN)
Total injected current (sum of all I/O and control
mA
-5/+0(4)
Injected current on POR, FT and FTf pins
IINJ(PIN)(3)
Unit
±5
pins)(6)
± 25
1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power supply, in the
permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be
sunk/sourced between two consecutive power supply pins referring to high pin count QFP packages.
3. A positive injection is induced by VIN > VDDIOx while a negative injection is induced by VIN < VSS. IINJ(PIN) must never be
exceeded. Refer to Table 21: Voltage characteristics for the maximum allowed input voltage values.
4. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum
value.
5. On these I/Os, a positive injection is induced by VIN > VDDA. Negative injection disturbs the analog performance of the
device. See note (2) below Table 58: ADC accuracy.
6. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum of the positive and
negative injected currents (instantaneous values).
Table 23. Thermal characteristics
Symbol
TSTG
TJ
54/128
Ratings
Storage temperature range
Maximum junction temperature
DocID026967 Rev 2
Value
Unit
–65 to +150
°C
150
°C
STM32F098xC
Electrical characteristics
6.3
Operating conditions
6.3.1
General operating conditions
Table 24. General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
0
48
fPCLK
Internal APB clock frequency
0
48
VDD
Standard operating voltage
1.65
1.95
V
1.65
3.6
V
VDD
3.6
2.4
3.6
1.65
3.6
TC and RST I/O
–0.3
VDDIOx+0.3
TTa and POR I/O
–0.3
VDDA+0.3(1)
–0.3
5.2(1)
UFBGA100
-
364
LQFP100
-
476
-
455
-
377
-
308
LQFP48
-
370
UFQFPN48
-
625
–40
85
–40
105
VDDIO2
VDDA
VBAT
VIN
I/O supply voltage
Analog operating voltage
(ADC and DAC not used)
Analog operating voltage
(ADC and DAC used)
Must not be supplied if VDD
is not present
Must have a potential equal
to or higher than VDD
Backup operating voltage
I/O input voltage
FT and FTf I/O
PD
LQFP64
Power dissipation at TA = 85 °C
for suffix 6 or TA = 105 °C for WLCSP64
suffix 7(2)
UFBGA64
V
Ambient temperature for the
suffix 6 version
Maximum power dissipation
Ambient temperature for the
suffix 7 version
Maximum power dissipation
–40
105
Low power dissipation(3)
–40
125
TA
Low power
dissipation(3)
MHz
V
V
mW
°C
°C
1. To sustain a voltage higher than VDDIOx+0.3 V, the internal pull-up/pull-down resistors must be disabled.
2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See
3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.2:
Thermal characteristics).
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103
Electrical characteristics
6.3.2
STM32F098xC
Operating conditions at power-up / power-down
The parameters given in Table 25 are derived from tests performed under the ambient
temperature condition summarized in Table 24.
Table 25. Operating conditions at power-up / power-down
Symbol
tVDD
tVDDA
6.3.3
Parameter
Conditions
VDD rise time rate
-
VDD fall time rate
VDDA rise time rate
-
VDDA fall time rate
Min
Max
0
∞
20
∞
0
∞
20
∞
Unit
μs/V
Embedded reference voltage
The parameters given in Table 26 are derived from tests performed under the ambient
temperature and supply voltage conditions summarized in Table 24: General operating
conditions.
Table 26. Embedded internal reference voltage
Symbol
Parameter
VREFINT
Internal reference voltage
tS_vrefint
ADC sampling time when
reading the internal
reference voltage
ΔVREFINT
Internal reference voltage
spread over the
temperature range
TCoeff
Conditions
Min
Typ
Max
Unit
–40 °C < TA < +105 °C
1.16
1.2
1.25
V
1.16
1.2
1.24(1)
V
4(2)
-
-
μs
-
-
10(2)
mV
- 100(2)
-
100(2) ppm/°C
1.5
2.5
–40 °C < TA < +85 °C
VDDA = 3 V
Temperature coefficient
TVREFINT_RDY Internal reference voltage
(3)
temporization
4.5
ms
1. Data based on characterization results, not tested in production.
2. Guaranteed by design, not tested in production.
3. Guaranteed by design, not tested in production. This parameter is the latency between the time when pin
NPOR is set to 1 by the application and the time when the VREFINTRDYF status bit is set to 1 by the
hardware.
56/128
DocID026967 Rev 2
STM32F098xC
6.3.4
Electrical characteristics
Supply current characteristics
The current consumption is a function of several parameters and factors such as the
operating voltage, ambient temperature, I/O pin loading, device software configuration,
operating frequencies, I/O pin switching rate, program location in memory and executed
binary code.
The current consumption is measured as described in Figure 14: Current consumption
measurement scheme.
All Run-mode current consumption measurements given in this section are performed with a
reduced code that gives a consumption equivalent to CoreMark code.
Typical and maximum current consumption
The MCU is placed under the following conditions:
•
All I/O pins are in analog input mode
•
All peripherals are disabled except when explicitly mentioned
•
The Flash memory access time is adjusted to the fHCLK frequency:
–
0 wait state and Prefetch OFF from 0 to 24 MHz
–
1 wait state and Prefetch ON above 24 MHz
•
When the peripherals are enabled fPCLK = fHCLK
The parameters given in Table 27 to Table 30 are derived from tests performed under
ambient temperature and supply voltage conditions summarized in Table 24: General
operating conditions.
DocID026967 Rev 2
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103
Electrical characteristics
STM32F098xC
Parameter
Symbol
Table 27. Typical and maximum current consumption from VDD supply at VDD = 1.8 V
All peripherals enabled
Conditions
Supply current in Sleep mode
IDD
Supply current in Run mode,
code executing from RAM
Supply current in Run mode,
code executing from Flash
HSI48
Max @ TA(1)
Max @ TA(1)
Unit
Typ
Typ
25 °C
85 °C
105 °C
25 °C
85 °C
105 °C
48 MHz
26.2
28.0
28.8
28.9
14.2
15.1
15.2
15.3
48 MHz
26.1
27.9
28.7
28.8
14.1
15.0
15.1
15.3
32 MHz
17.7
18.9
19.4
19.5
9.6
10.2
10.3
10.4
24 MHz
13.8
14.6
14.9
15.0
7.9
8.2
8.4
8.6
8 MHz
4.7
5.0
5.1
5.3
2.7
2.9
2.9
2.9
1 MHz
0.8
0.9
1.0
1.1
0.6
0.7
0.8
0.8
48 MHz
26.1
27.9
28.7
28.9
14.1
15.0
15.2
15.3
32 MHz
17.8
19.0
19.4
19.5
9.7
10.2
10.4
10.4
24 MHz
13.9
14.7
15.0
15.1
8.0
8.3
8.5
8.7
HSI clock,
PLL off
8 MHz
4.8
5.1
5.1
5.4
2.7
2.9
2.9
2.9
HSI48
48 MHz
25.7
27.6
28.2
28.5
13.6
14.6
14.7
14.9
48 MHz
25.5
27.4
28.1
28.3
13.5
14.5
14.7
14.8
32 MHz
17.2
18.4
18.9
19.0
9.1
9.7
9.9
9.9
24 MHz
13.1
14.0
14.3
14.4
7.1
7.5
7.7
7.8
8 MHz
4.2
4.6
4.7
4.8
2.3
2.5
2.5
2.6
1 MHz
0.5
0.7
0.7
0.7
0.3
0.4
0.4
0.5
48 MHz
25.6
27.5
28.2
28.4
13.6
14.5
14.7
14.8
32 MHz
17.3
18.5
18.9
19.0
9.1
9.8
9.9
10.0
24 MHz
13.2
14.1
14.4
14.4
7.2
7.6
7.8
7.9
HSI clock,
PLL off
8 MHz
4.4
4.7
4.9
4.9
2.3
2.6
2.6
2.6
HSI48
48 MHz
16.5
17.7
18.2
18.3
3.1
3.4
3.5
3.6
48 MHz
16.4
17.6
18.0
18.1
3.1
3.3
3.4
3.5
32 MHz
11.1
11.9
12.2
12.3
2.1
2.3
2.4
2.5
24 MHz
8.4
9.1
9.3
9.4
1.6
1.8
1.9
2.0
8 MHz
2.8
3.0
3.1
3.4
0.5
0.7
0.7
0.8
1 MHz
0.4
0.5
0.5
0.6
0.2
0.3
0.3
0.4
48 MHz
16.4
17.7
18.1
18.2
3.1
3.3
3.4
3.5
32 MHz
11.2
12.0
12.2
12.3
2.2
2.4
2.5
2.6
24 MHz
8.5
9.1
9.3
9.4
1.7
1.8
1.9
2.0
8 MHz
2.8
3.1
3.1
3.5
0.6
0.7
0.7
0.8
HSE bypass,
PLL on
HSE bypass,
PLL off
HSI clock,
PLL on
HSE bypass,
PLL on
HSE bypass,
PLL off
HSI clock,
PLL on
HSE bypass,
PLL on
HSE bypass,
PLL off
HSI clock,
PLL on
HSI clock,
PLL off
58/128
fHCLK
All peripherals disabled
DocID026967 Rev 2
mA
mA
STM32F098xC
Electrical characteristics
1. Data based on characterization results, not tested in production unless otherwise specified.
Table 28. Typical and maximum current consumption in Stop mode
IDDA
Max
= 3.6 V
= 3.3 V
= 3.0 V
= 2.7 V
= 2.4 V
= 2.0 V
Conditions
All oscillators OFF
= 1.8 V
Parameter
Supply current
in Stop mode
Symbol
IDD
Typ @ VDDA (VDD = 1.8 V)
0.6
0.9
0.9
1.0
1.0
1.0
1.1
1.2
TA =
25 °C
Unit
TA =
TA =
85 °C 105 °C
2.4
33
78
2.5
3.0
3.7
μA
Symbol
Para-meter
Table 29. Typical and maximum current consumption from the VDDA supply
VDDA = 2.4 V
Conditions
(1)
HSI48
IDDA
Supply
current in
Run or
Sleep
mode,
code
executing
from
Flash or
RAM
HSE
bypass,
PLL on
HSE
bypass,
PLL off
HSI clock,
PLL on
HSI clock,
PLL off
fHCLK
VDDA = 3.6 V
Max @ TA(2)
Max @ TA(2)
Typ
Unit
Typ
25 °C
85 °C
105 °C
25 °C 85 °C 105 °C
48 MHz
311
332
337
346
315
333
340
349
48 MHz
146
167
177
180
159
180
191
196
32 MHz
100
118
124
126
108
126
134
137
24 MHz
79
95
98
99
85
100
105
108
8 MHz
2
3
3
4
3
3
4
4
1 MHz
2
2
3
3
2
3
3
4
48 MHz
212
242
253
257
234
261
274
280
32 MHz
165
193
202
203
183
206
215
219
24 MHz
143
170
176
177
160
179
186
189
8 MHz
64
82
84
85
76
88
91
92
μA
1. Current consumption from the VDDA supply is independent of whether the digital peripherals are enabled or disabled, being
in Run or Sleep mode or executing from Flash or RAM. Furthermore, when the PLL is off, IDDA is independent from the
frequency.
2. Data based on characterization results, not tested in production unless otherwise specified.
DocID026967 Rev 2
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103
Electrical characteristics
STM32F098xC
Table 30. Typical and maximum current consumption from the VBAT supply
Max(1)
= 2.7 V
= 3.3 V
= 3.6 V
RTC
domain
IDD_VBAT
supply
current
= 2.4 V
Parameter
= 1.8 V
Symbol
= 1.65 V
Typ @ VBAT
TA =
25 °C
LSE & RTC ON; “Xtal
mode”: lower driving
capability;
LSEDRV[1:0] = '00'
0.5
0.5
0.6
0.7
0.9
1.0
1.0
LSE & RTC ON; “Xtal
mode” higher driving
capability;
LSEDRV[1:0] = '11'
0.8
Conditions
1.3
Unit
1.8
μA
0.8
0.9
1.0
1. Data based on characterization results, not tested in production.
60/128
TA =
TA =
85 °C 105 °C
DocID026967 Rev 2
1.2
1.3
1.4
1.7
2.2
STM32F098xC
Electrical characteristics
Typical current consumption
The MCU is placed under the following conditions:
•
VDD = VDDA = 1.8 V
•
All I/O pins are in analog input configuration
•
The Flash access time is adjusted to fHCLK frequency:
–
0 wait state and Prefetch OFF from 0 to 24 MHz
–
1 wait state and Prefetch ON above 24 MHz
•
When the peripherals are enabled, fPCLK = fHCLK
•
PLL is used for frequencies greater than 8 MHz
•
AHB prescaler of 2, 4, 8 and 16 is used for the frequencies 4 MHz, 2 MHz, 1 MHz and
500 kHz respectively
Table 31. Typical current consumption, code executing from Flash, running from HSE
8 MHz crystal
Typical consumption in
Run mode
Symbol
IDD
IDDA
Parameter
Current
consumption
from VDD
supply
Current
consumption
from VDDA
supply
fHCLK
Typical consumption in
Sleep mode
Unit
Peripherals Peripherals Peripherals Peripherals
enabled
disabled
enabled
disabled
48 MHz
26.1
14.3
16.8
3.4
36 MHz
20.2
11.1
13.0
2.8
32 MHz
18.5
10.3
11.7
2.5
24 MHz
14.5
8.1
9.1
1.9
16 MHz
10.1
5.7
6.3
1.4
8 MHz
5.0
2.8
2.9
0.7
4 MHz
3.1
1.8
1.9
0.6
2 MHz
1.8
1.1
1.3
0.6
1 MHz
1.2
0.8
1.0
0.5
500 kHz
1.0
0.7
0.9
0.5
48 MHz
151
36 MHz
118
32 MHz
108
24 MHz
87
16 MHz
63
8 MHz
1.1
4 MHz
1.1
2 MHz
1.1
1 MHz
1.1
500 kHz
1.1
DocID026967 Rev 2
mA
μA
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103
Electrical characteristics
STM32F098xC
I/O system current consumption
The current consumption of the I/O system has two components: static and dynamic.
I/O static current consumption
All the I/Os used as inputs with pull-up generate current consumption when the pin is
externally held low. The value of this current consumption can be simply computed by using
the pull-up/pull-down resistors values given in Table 51: I/O static characteristics.
For the output pins, any external pull-down or external load must also be considered to
estimate the current consumption.
Additional I/O current consumption is due to I/Os configured as inputs if an intermediate
voltage level is externally applied. This current consumption is caused by the input Schmitt
trigger circuits used to discriminate the input value. Unless this specific configuration is
required by the application, this supply current consumption can be avoided by configuring
these I/Os in analog mode. This is notably the case of ADC input pins which should be
configured as analog inputs.
Caution:
Any floating input pin can also settle to an intermediate voltage level or switch inadvertently,
as a result of external electromagnetic noise. To avoid current consumption related to
floating pins, they must either be configured in analog mode, or forced internally to a definite
digital value. This can be done either by using pull-up/down resistors or by configuring the
pins in output mode.
I/O dynamic current consumption
In addition to the internal peripheral current consumption measured previously (see
Table 33: Peripheral current consumption), the I/Os used by an application also contribute
to the current consumption. When an I/O pin switches, it uses the current from the I/O
supply voltage to supply the I/O pin circuitry and to charge/discharge the capacitive load
(internal or external) connected to the pin:
I SW = V DDIOx × f SW × C
where
ISW is the current sunk by a switching I/O to charge/discharge the capacitive load
VDDIOx is the I/O supply voltage
fSW is the I/O switching frequency
C is the total capacitance seen by the I/O pin: C = CINT + CEXT + CS
CS is the PCB board capacitance including the pad pin.
The test pin is configured in push-pull output mode and is toggled by software at a fixed
frequency.
62/128
DocID026967 Rev 2
STM32F098xC
Electrical characteristics
Table 32. Switching output I/O current consumption
Symbol
Parameter
Conditions(1)
VDDIOx = 1.8 V
CEXT = 0 pF
C = CINT + CEXT + CS
VDDIOx = 1.8 V
CEXT = 10 pF
C = CINT + CEXT + CS
ISW
I/O current
consumption
VDDIOx = 1.8 V
CEXT = 22 pF
C = CINT + CEXT + CS
VDDIOx = 1.8 V
CEXT = 33 pF
C = CINT + CEXT + CS
VDDIOx = 1.8 V
CEXT = 47 pF
C = CINT + CEXT + CS
I/O toggling
frequency (fSW)
Typ
2 MHz
0.09
4 MHz
0.17
8 MHz
0.34
18 MHz
0.79
36 MHz
1.50
48 MHz
2.06
2 MHz
0.13
4 MHz
0.26
8 MHz
0.50
18 MHz
1.18
36 MHz
2.27
48 MHz
3.03
2 MHz
0.18
4 MHz
0.36
8 MHz
0.69
18 MHz
1.60
36 MHz
3.27
2 MHz
0.23
4 MHz
0.45
8 MHz
0.87
18 MHz
2.0
36 MHz
3.7
2 MHz
0.29
4 MHz
0.55
8 MHz
1.09
18 MHz
2.43
Unit
mA
1. CS = 5 pF (estimated value).
DocID026967 Rev 2
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103
Electrical characteristics
STM32F098xC
On-chip peripheral current consumption
The current consumption of the on-chip peripherals is given in Table 33. The MCU is placed
under the following conditions:
•
All I/O pins are in analog mode
•
All peripherals are disabled unless otherwise mentioned
•
The given value is calculated by measuring the current consumption
–
with all peripherals clocked off
–
with only one peripheral clocked on
•
Ambient operating temperature and supply voltage conditions summarized in Table 21:
Voltage characteristics
Table 33. Peripheral current consumption
Peripheral
AHB
64/128
Typical consumption at 25 °C
BusMatrix(1)
3.1
CRC
2.0
DMA1
5.5
DMA2
5.1
Flash interface
15.4
GPIOA
5.5
GPIOB
5.4
GPIOC
3.2
GPIOD
3.1
GPIOE
4.0
GPIOF
2.5
SRAM
0.8
TSC
5.5
All AHB peripherals
61.0
DocID026967 Rev 2
Unit
μA/MHz
STM32F098xC
Electrical characteristics
Table 33. Peripheral current consumption (continued)
Peripheral
APB
Typical consumption at 25 °C
APB-Bridge(2)
3.6
ADC(3)
4.3
CAN
12.4
CEC
0.4
CRS
0.0
DAC(3)
4.2
DBG (MCU Debug Support)
0.2
I2C1
2.9
I2C2
2.4
PWR
0.6
SPI1
8.8
SPI2
7.8
SYSCFG and COMP
1.9
TIM1
15.2
TIM14
2.6
TIM15
8.7
TIM16
5.8
TIM17
7.0
TIM2
16.2
TIM3
11.9
TIM6
11.8
TIM7
2.5
USART1
17.6
USART2
16.3
USART3
16.2
USART4
4.7
USART5
4.4
USART6
5.5
USART7
5.2
USART8
5.1
WWDG
1.1
All APB peripherals
Unit
μA/MHz
207.2
1. The BusMatrix is automatically active when at least one master is ON (CPU, DMA).
2. The APB Bridge is automatically active when at least one peripheral is ON on the Bus.
3. The power consumption of the analog part (IDDA) of peripherals such as ADC, DAC, comparators, is not
included. Refer to the tables of characteristics in the subsequent sections.
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103
Electrical characteristics
6.3.5
STM32F098xC
Wakeup time from low-power mode
The wakeup times given in Table 34 are the latency between the event and the execution of
the first user instruction. The device goes in low-power mode after the WFE (Wait For
Event) instruction, in the case of a WFI (Wait For Interruption) instruction, 16 CPU cycles
must be added to the following timings due to the interrupt latency in the Cortex M0
architecture.
The SYSCLK clock source setting is kept unchanged after wakeup from Sleep mode.
During wakeup from Stop mode, SYSCLK takes the default setting: HSI 8 MHz.
The wakeup source from Sleep and Stop mode is an EXTI line configured in event mode.
All timings are derived from tests performed under the ambient temperature and supply
voltage conditions summarized in Table 24: General operating conditions
Table 34. Low-power mode wakeup timings
Symbol
Parameter
tWUSTOP
Wakeup from Stop mode
tWUSLEEP
Wakeup from Sleep mode
66/128
Typ @ VDDA
= 1.8 V
= 3.3 V
3.5
2.8
4 SYSCLK cycles
DocID026967 Rev 2
Max
Unit
5.3
μs
-
μs
STM32F098xC
6.3.6
Electrical characteristics
External clock source characteristics
High-speed external user clock generated from an external source
In bypass mode the HSE oscillator is switched off and the input pin is a standard GPIO.
The external clock signal has to respect the I/O characteristics in Section 6.3.13. However,
the recommended clock input waveform is shown in Figure 15: High-speed external clock
source AC timing diagram.
Table 35. High-speed external user clock characteristics
Parameter(1)
Symbol
Min
Typ
Max
Unit
-
8
32
MHz
fHSE_ext
User external clock source frequency
VHSEH
OSC_IN input pin high level voltage
0.7 VDDIOx
-
VDDIOx
VHSEL
OSC_IN input pin low level voltage
VSS
-
0.3 VDDIOx
15
-
-
tw(HSEH)
tw(HSEL)
OSC_IN high or low time
tr(HSE)
tf(HSE)
OSC_IN rise or fall time
V
ns
-
-
20
1. Guaranteed by design, not tested in production.
Figure 15. High-speed external clock source AC timing diagram
WZ+6(+
9+6(+
9+6(/
WU+6(
WI+6(
WZ+6(/
W
7+6(
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Electrical characteristics
STM32F098xC
Low-speed external user clock generated from an external source
In bypass mode the LSE oscillator is switched off and the input pin is a standard GPIO.
The external clock signal has to respect the I/O characteristics in Section 6.3.13. However,
the recommended clock input waveform is shown in Figure 16.
Table 36. Low-speed external user clock characteristics
Parameter(1)
Symbol
Min
Typ
Max
Unit
kHz
fLSE_ext
User external clock source frequency
-
32.768
1000
VLSEH
OSC32_IN input pin high level voltage
0.7 VDDIOx
-
VDDIOx
VLSEL
OSC32_IN input pin low level voltage
VSS
-
0.3 VDDIOx
450
-
-
tw(LSEH)
OSC32_IN high or low time
tw(LSEL)
tr(LSE)
tf(LSE)
V
ns
OSC32_IN rise or fall time
-
-
50
1. Guaranteed by design, not tested in production.
Figure 16. Low-speed external clock source AC timing diagram
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069
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Electrical characteristics
High-speed external clock generated from a crystal/ceramic resonator
The high-speed external (HSE) clock can be supplied with a 4 to 32 MHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on design
simulation results obtained with typical external components specified in Table 37. In the
application, the resonator and the load capacitors have to be placed as close as possible to
the oscillator pins in order to minimize output distortion and startup stabilization time. Refer
to the crystal resonator manufacturer for more details on the resonator characteristics
(frequency, package, accuracy).
Table 37. HSE oscillator characteristics
Symbol
fOSC_IN
Parameter
Conditions(1)
Min(2)
Typ
Max(2)
Unit
4
8
32
MHz
-
200
-
kΩ
Oscillator frequency
Feedback resistor
RF
(3)
During startup
IDD
HSE current consumption
gm
tSU(HSE)
Oscillator transconductance
(4)
Startup time
-
8.5
VDD = 1.8 V,
Rm = 30 Ω,
CL = 10 [email protected] MHz
-
0.4
-
VDD = 1.8 V,
Rm = 45 Ω,
CL = 10 [email protected] MHz
-
0.5
-
VDD = 1.8 V,
Rm = 30 Ω,
CL = 5 [email protected] MHz
-
0.8
-
VDD = 1.8 V,
Rm = 30 Ω,
CL = 10 [email protected] MHz
-
1
-
VDD = 1.8 V,
Rm = 30 Ω,
CL = 20 [email protected] MHz
-
1.5
-
Startup
10
-
-
mA/V
VDD is stabilized
-
2
-
ms
mA
1. Resonator characteristics given by the crystal/ceramic resonator manufacturer.
2. Guaranteed by design, not tested in production.
3. This consumption level occurs during the first 2/3 of the tSU(HSE) startup time
4. tSU(HSE) is the startup time measured from the moment it is enabled (by software) to a stabilized 8 MHz
oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly
with the crystal manufacturer
For CL1 and CL2, it is recommended to use high-quality external ceramic capacitors in the
5 pF to 20 pF range (Typ.), designed for high-frequency applications, and selected to match
the requirements of the crystal or resonator (see Figure 17). CL1 and CL2 are usually the
same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of CL1 and CL2. PCB and MCU pin capacitance must be included (10 pF
can be used as a rough estimate of the combined pin and board capacitance) when sizing
CL1 and CL2.
Note:
For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.
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Electrical characteristics
STM32F098xC
Figure 17. Typical application with an 8 MHz crystal
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069
1. REXT value depends on the crystal characteristics.
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Electrical characteristics
Low-speed external clock generated from a crystal resonator
The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal resonator
oscillator. All the information given in this paragraph are based on design simulation results
obtained with typical external components specified in Table 38. In the application, the
resonator and the load capacitors have to be placed as close as possible to the oscillator
pins in order to minimize output distortion and startup stabilization time. Refer to the crystal
resonator manufacturer for more details on the resonator characteristics (frequency,
package, accuracy).
Table 38. LSE oscillator characteristics (fLSE = 32.768 kHz)
Symbol
IDD
gm
Parameter
LSE current consumption
Oscillator
transconductance
tSU(LSE)(3) Startup time
Conditions(1)
Min(2)
Typ
Max(2) Unit
LSEDRV[1:0]=00
lower driving capability
-
0.5
0.9
LSEDRV[1:0]= 01
medium low driving capability
-
-
1
LSEDRV[1:0] = 10
medium high driving capability
-
-
1.3
LSEDRV[1:0]=11
higher driving capability
-
-
1.6
LSEDRV[1:0]=00
lower driving capability
5
-
-
LSEDRV[1:0]= 01
medium low driving capability
8
-
-
LSEDRV[1:0] = 10
medium high driving capability
15
-
-
LSEDRV[1:0]=11
higher driving capability
25
-
-
VDDIOx is stabilized
-
2
-
μA
μA/V
s
1. Refer to the note and caution paragraphs below the table, and to the application note AN2867 “Oscillator design guide for
ST microcontrollers”.
2. Guaranteed by design, not tested in production.
3.
tSU(LSE) is the startup time measured from the moment it is enabled (by software) to a stabilized 32.768 kHz oscillation is
reached. This value is measured for a standard crystal and it can vary significantly with the crystal manufacturer
Note:
For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.
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Electrical characteristics
STM32F098xC
Figure 18. Typical application with a 32.768 kHz crystal
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26&B28 7
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069
Note:
72/128
An external resistor is not required between OSC32_IN and OSC32_OUT and it is forbidden
to add one.
DocID026967 Rev 2
STM32F098xC
6.3.7
Electrical characteristics
Internal clock source characteristics
The parameters given in Table 39 are derived from tests performed under ambient
temperature and supply voltage conditions summarized in Table 24: General operating
conditions. The provided curves are characterization results, not tested in production.
High-speed internal (HSI) RC oscillator
Table 39. HSI oscillator characteristics(1)
Symbol
fHSI
TRIM
ACCHSI
Parameter
Conditions
Min
Typ
Max
Unit
Frequency
-
-
8
-
MHz
HSI user trimming step
-
-
-
1(2)
Accuracy of the HSI
oscillator
TA = -40 to 105°C
-2.8
(3)
-
3.8
TA = -10 to 85°C
-1.9(3)
-
2.3(3)
TA = 0 to 85°C
-1.9(3)
-
2(3)
TA = 0 to 70°C
-1.3
-
2(3)
TA = 0 to 55°C
-1(3)
-
2(3)
-1
-
1
TA = 25°C(4)
%
(3)
%
tsu(HSI)
HSI oscillator startup
time
-
1(2)
-
1(2)
μs
IDDA(HSI)
HSI oscillator startup
time
-
-
80
100(2)
μA
1. VDDA = 3.3 V, TA = -40 to 105°C unless otherwise specified.
2. Guaranteed by design, not tested in production.
3. Data based on characterization results, not tested in production.
4. Factory calibrated, parts not soldered.
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Electrical characteristics
STM32F098xC
Figure 19. HSI oscillator accuracy characterization results(1)
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1. Data for soldered parts, based on characterization results.
High-speed internal 14 MHz (HSI14) RC oscillator (dedicated to ADC)
Table 40. HSI14 oscillator characteristics(1)
Symbol
fHSI14
TRIM
Parameter
Conditions
Frequency
HSI14 user-trimming step
DuCy(HSI14) Duty cycle
ACCHSI14
Accuracy of the HSI14
oscillator (factory calibrated)
IDDA(HSI14)
-
14
Max
Unit
-
MHz
(2)
%
-
-
1
45(2)
-
55(2)
%
-
5.1(3)
%
%
TA = –40 to 105 °C
TA = –10 to 85 °C
–3.2(3)
-
3.1(3)
TA = 0 to 70 °C
–2.5(3)
-
2.3(3)
%
–1
HSI14 oscillator startup time
HSI14 oscillator power
consumption
1. VDDA = 3.3 V, TA = –40 to 105 °C unless otherwise specified.
2. Guaranteed by design, not tested in production.
3. Data based on characterization results, not tested in production.
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Typ
–4.2(3)
TA = 25 °C
tsu(HSI14)
Min
DocID026967 Rev 2
-
1
%
1(2)
-
2(2)
μs
-
100
150(2)
μA
STM32F098xC
Electrical characteristics
Figure 20. HSI14 oscillator accuracy characterization results
-!8
-).
4; #=
!
-36
High-speed internal 48 MHz (HSI48) RC oscillator
Table 41. HSI48 oscillator characteristics(1)
Symbol
Parameter
fHSI48
Frequency
TRIM
HSI48 user-trimming step
Conditions
TA = –40 to 105 °C
TA = –10 to 85 °C
Accuracy of the HSI48
oscillator (factory calibrated) T = 0 to 70 °C
A
TA = 25 °C
tsu(HSI48)
IDDA(HSI48)
Typ
Max
Unit
-
48
-
MHz
0.09(2)
0.14
0.2(2)
%
-
55(2)
%
%
45(2)
DuCy(HSI48) Duty cycle
ACCHSI48
Min
-4.9(3)
-
4.7(3)
-4.1(3)
-
3.7(3)
%
-3.8(3)
-
3.4(3)
%
-2.8
-
2.9
%
μs
μA
HSI48 oscillator startup time
-
-
6(2)
HSI48 oscillator power
consumption
-
312
350(2)
1. VDDA = 3.3 V, TA = –40 to 105 °C unless otherwise specified.
2. Guaranteed by design, not tested in production.
3. Data based on characterization results, not tested in production.
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Electrical characteristics
STM32F098xC
Figure 21. HSI48 oscillator accuracy characterization results
-!8
-).
4; #=
!
-36
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Electrical characteristics
Low-speed internal (LSI) RC oscillator
Table 42. LSI oscillator characteristics(1)
Symbol
fLSI
tsu(LSI)
Parameter
Min
Typ
Max
Unit
30
40
50
kHz
LSI oscillator startup time
-
-
85
μs
LSI oscillator power consumption
-
0.75
1.2
μA
Frequency
(2)
IDDA(LSI)(2)
1. VDDA = 3.3 V, TA = –40 to 105 °C unless otherwise specified.
2. Guaranteed by design, not tested in production.
6.3.8
PLL characteristics
The parameters given in Table 43 are derived from tests performed under ambient
temperature and supply voltage conditions summarized in Table 24: General operating
conditions.
Table 43. PLL characteristics
Value
Symbol
fPLL_IN
fPLL_OUT
tLOCK
JitterPLL
Parameter
Unit
Min
Typ
Max
1(2)
8.0
24(2)
MHz
PLL input clock duty cycle
40
(2)
-
60(2)
%
PLL multiplier output clock
16(2)
-
48
MHz
PLL lock time
-
-
200(2)
μs
Cycle-to-cycle jitter
-
-
300(2)
ps
PLL input clock(1)
1. Take care to use the appropriate multiplier factors to obtain PLL input clock values compatible with the
range defined by fPLL_OUT.
2. Guaranteed by design, not tested in production.
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Electrical characteristics
6.3.9
STM32F098xC
Memory characteristics
Flash memory
The characteristics are given at TA = –40 to 105 °C unless otherwise specified.
Table 44. Flash memory characteristics
Min
Typ
Max(1)
Unit
16-bit programming time TA = –40 to +105 °C
40
53.5
60
μs
Page (2 KB) erase time
TA = –40 to +105 °C
20
-
40
ms
tME
Mass erase time
TA = –40 to +105 °C
20
-
40
ms
IDD
Supply current
Write mode
-
-
10
mA
Erase mode
-
-
12
mA
Symbol
tprog
tERASE
Parameter
Conditions
1. Guaranteed by design, not tested in production.
Table 45. Flash memory endurance and data retention
Symbol
NEND
Parameter
Endurance
Conditions
TA = –40 to +105 °C
1
tRET
Data retention
kcycle(2)
at TA = 85 °C
1 kcycle(2) at TA = 105 °C
(2)
10 kcycles
at TA = 55 °C
Min(1)
Unit
10
kcycles
30
10
Years
20
1. Data based on characterization results, not tested in production.
2. Cycling performed over the whole temperature range.
6.3.10
EMC characteristics
Susceptibility tests are performed on a sample basis during device characterization.
Functional EMS (electromagnetic susceptibility)
While a simple application is executed on the device (toggling 2 LEDs through I/O ports).
the device is stressed by two electromagnetic events until a failure occurs. The failure is
indicated by the LEDs:
•
Electrostatic discharge (ESD) (positive and negative) is applied to all device pins until
a functional disturbance occurs. This test is compliant with the IEC 61000-4-2 standard.
•
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to VDD and
VSS through a 100 pF capacitor, until a functional disturbance occurs. This test is
compliant with the IEC 61000-4-4 standard.
A device reset allows normal operations to be resumed.
The test results are given in Table 46. They are based on the EMS levels and classes
defined in application note AN1709.
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Electrical characteristics
Table 46. EMS characteristics
Symbol
Parameter
Level/
Class
Conditions
VFESD
VDD = 1.8 V, LQFP100, TA = +25 °C,
Voltage limits to be applied on any I/O pin
fHCLK = 48 MHz,
to induce a functional disturbance
conforming to IEC 61000-4-2
2B
VEFTB
Fast transient voltage burst limits to be
applied through 100 pF on VDD and VSS
pins to induce a functional disturbance
VDD = 1.8 V, LQFP100, TA = +25°C,
fHCLK = 48 MHz,
conforming to IEC 61000-4-4
4B
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
•
Corrupted program counter
•
Unexpected reset
•
Critical Data corruption (control registers...)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
Electromagnetic Interference (EMI)
The electromagnetic field emitted by the device are monitored while a simple application is
executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with
IEC 61967-2 standard which specifies the test board and the pin loading.
Table 47. EMI characteristics
Symbol Parameter
SEMI
Conditions
Monitored
frequency band
0.1 to 30 MHz
VDD = 1.8 V, TA = 25 °C,
30 to 130 MHz
LQFP100 package
Peak level
compliant with
130 MHz to 1 GHz
IEC 61967-2
EMI Level
DocID026967 Rev 2
Max vs. [fHSE/fHCLK]
Unit
8/48 MHz
3
23
dBμV
15
4
-
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103
Electrical characteristics
6.3.11
STM32F098xC
Electrical sensitivity characteristics
Based on three different tests (ESD, LU) using specific measurement methods, the device is
stressed in order to determine its performance in terms of electrical sensitivity.
Electrostatic discharge (ESD)
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts × (n+1) supply pins). This test
conforms to the JESD22-A114/C101 standard.
Table 48. ESD absolute maximum ratings
Symbol
Ratings
Conditions
Packages
Class
Maximum
value(1)
Unit
VESD(HBM)
Electrostatic discharge voltage TA = +25 °C, conforming
(human body model)
to JESD22-A114
All
2
2000
V
VESD(CDM)
Electrostatic discharge voltage TA = +25 °C, conforming
(charge device model)
to ANSI/ESD STM5.3.1
All
C4
500
V
1. Data based on characterization results, not tested in production.
Static latch-up
Two complementary static tests are required on six parts to assess the latch-up
performance:
•
A supply overvoltage is applied to each power supply pin.
•
A current injection is applied to each input, output and configurable I/O pin.
These tests are compliant with EIA/JESD 78A IC latch-up standard.
Table 49. Electrical sensitivities
Symbol
LU
6.3.12
Parameter
Static latch-up class
Conditions
TA = +105 °C conforming to JESD78A
Class
II level A
I/O current injection characteristics
As a general rule, current injection to the I/O pins, due to external voltage below VSS or
above VDDIOx (for standard, 3.3 V-capable I/O pins) should be avoided during normal
product operation. However, in order to give an indication of the robustness of the
microcontroller in cases when abnormal injection accidentally happens, susceptibility tests
are performed on a sample basis during device characterization.
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Electrical characteristics
Functional susceptibility to I/O current injection
While a simple application is executed on the device, the device is stressed by injecting
current into the I/O pins programmed in floating input mode. While current is injected into
the I/O pin, one at a time, the device is checked for functional failures.
The failure is indicated by an out of range parameter: ADC error above a certain limit (higher
than 5 LSB TUE), out of conventional limits of induced leakage current on adjacent pins (out
of the -5 μA/+0 μA range) or other functional failure (for example reset occurrence or
oscillator frequency deviation).
The characterization results are given in Table 50.
Negative induced leakage current is caused by negative injection and positive induced
leakage current is caused by positive injection.
Table 50. I/O current injection susceptibility
Functional
susceptibility
Symbol
Description
Unit
Negative Positive
injection injection
IINJ
6.3.13
Injected current on BOOT0
-0
NA
Injected current on PF1 pin (FTf pin)
-0
NA
Injected current on PC0 pin (TTA pin)
-0
+5
Injected current on PA4, PA5 pins with induced leakage
current on adjacent pins less than -20 μA
-5
NA
Injected current on other FT and FTf pins, and on NPOR pin
-5
NA
Injected current on all other TC, TTa and RST pins
-5
+5
mA
I/O port characteristics
General input/output characteristics
Unless otherwise specified, the parameters given in Table 51 are derived from tests
performed under the conditions summarized in Table 24: General operating conditions. All
I/Os are designed as CMOS- and TTL-compliant.
Table 51. I/O static characteristics
Symbol
VIL
Parameter
Low level input
voltage
Conditions
Min
Typ
Max
TC and TTa I/O
-
-
0.3 VDDIOx+0.07(1)
FT and FTf I/O
-
-
0.475 VDDIOx–0.2(1)
All I/Os
-
TC and TTa I/O
VIH
High level input
voltage
FT and FTf I/O
All I/Os
0.445
0.5
-
0.3 VDDIOx
VDDIOx+0.398(1)
-
-
VDDIOx+0.2(1)
-
-
0.7 VDDIOx
-
-
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V
V
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103
Electrical characteristics
STM32F098xC
Table 51. I/O static characteristics (continued)
Symbol
Vhys
Ilkg
RPU
Parameter
Schmitt trigger
hysteresis
Input leakage
current(2)
Weak pull-up
equivalent resistor
(4)
RPD
Weak pull-down
equivalent
resistor(4)
CIO
I/O pin capacitance
Conditions
Min
Typ
Max
TC and TTa I/O
-
200(1)
-
FT and FTf I/O
-
100(1)
-
TC, FT and FTf I/O
TTa in digital mode
VSS ≤ VIN ≤ VDDIOx
-
-
± 0.1
TTa in digital mode
VDDIOx ≤ VIN ≤ VDDA
-
-
1
TTa in analog mode
VSS ≤ VIN ≤ VDDA
-
-
± 0.2
FT and FTf I/O (3)
VDDIOx ≤ VIN ≤ 5 V
-
-
10
VIN = VSS
25
40
55
kΩ
VIN = VDDIOx
25
40
55
kΩ
-
5
-
pF
1. Data based on design simulation only. Not tested in production.
2. The leakage could be higher than the maximum value, if negative current is injected on adjacent pins. Refer to Table 50:
I/O current injection susceptibility.
3. To sustain a voltage higher than VDDIOx + 0.3 V, the internal pull-up/pull-down resistors must be disabled.
4. Pull-up and pull-down resistors are designed with a true resistance in series with a switchable PMOS/NMOS. This
PMOS/NMOS contribution to the series resistance is minimal (~10% order).
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Unit
mV
μA
STM32F098xC
Electrical characteristics
All I/Os are CMOS- and TTL-compliant (no software configuration required). Their
characteristics cover more than the strict CMOS-technology or TTL parameters. The
coverage of these requirements is shown in Figure 22 for standard I/Os, and in Figure 23 for
5 V tolerant I/Os. The following curves are design simulation results, not tested in
production.
Figure 22. TC and TTa I/O input characteristics
3
VIN (V)
2.5
TESTED RANGE
TTL standard requirement
2
1.5
UNDEFINED INPUT RANGE
1
TTL standard requirement
0.5
TESTED RANGE
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VDDIOx
(V)
MS32130V3
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Electrical characteristics
STM32F098xC
Figure 23. Five volt tolerant (FT and FTf) I/O input characteristics
3
VIN (V)
2.5
TESTED RANGE
TTL standard requirement
2
1.5
1
TTL standard requirement
0.5
TESTED RANGE
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VDDIOx (V)
MS32131V3
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Electrical characteristics
Output driving current
The GPIOs (general purpose input/outputs) can sink or source up to +/-8 mA, and sink or
source up to +/- 20 mA (with a relaxed VOL/VOH).
In the user application, the number of I/O pins which can drive current must be limited to
respect the absolute maximum rating specified in Section 6.2:
•
The sum of the currents sourced by all the I/Os on VDDIOx, plus the maximum
consumption of the MCU sourced on VDD, cannot exceed the absolute maximum rating
ΣIVDD (see Table 21: Voltage characteristics).
•
The sum of the currents sunk by all the I/Os on VSS, plus the maximum consumption of
the MCU sunk on VSS, cannot exceed the absolute maximum rating ΣIVSS (see
Table 21: Voltage characteristics).
Output voltage levels
Unless otherwise specified, the parameters given in the table below are derived from tests
performed under the ambient temperature and supply voltage conditions summarized in
Table 24: General operating conditions. All I/Os are CMOS- and TTL-compliant (FT, TTa or
TC unless otherwise specified).
Table 52. Output voltage characteristics(1)
Symbol
Parameter
VOL
Output low level voltage for an I/O pin
VOH
Output high level voltage for an I/O pin
VOL
Output low level voltage for an I/O pin
VOH
Output high level voltage for an I/O pin
VOL(3)
Output low level voltage for an I/O pin
VOH(3)
Output high level voltage for an I/O pin
VOL(3)
Output low level voltage for an I/O pin
VOH(3)
Output high level voltage for an I/O pin
VOL(4)
Output low level voltage for an I/O pin
VOH(4)
Output high level voltage for an I/O pin
VOLFm+(3)
Output low level voltage for an FTf I/O pin in
Fm+ mode
Conditions
Min
Max
CMOS port(2)
|IIO| = 8 mA
VDDIOx ≥ 2.7 V
-
0.4
VDDIOx–0.4
-
-
0.4
2.4
-
-
1.3
VDDIOx–1.3
-
-
0.4
VDDIOx–0.4
-
-
0.4
V
VDDIOx–0.4
-
V
|IIO| = 20 mA
VDDIOx ≥ 2.7 V
-
0.4
V
|IIO| = 10 mA
-
0.4
V
TTL port(2)
|IIO| = 8 mA
VDDIOx ≥ 2.7 V
|IIO| = 20 mA
VDDIOx ≥ 2.7 V
|IIO| = 6 mA
VDDIOx ≥ 2 V
|IIO| = 4 mA
Unit
V
V
V
V
1. The IIO current sourced or sunk by the device must always respect the absolute maximum rating specified in Table 21:
Voltage characteristics, and the sum of the currents sourced or sunk by all the I/Os (I/O ports and control pins) must always
respect the absolute maximum ratings ΣIIO.
2. TTL and CMOS outputs are compatible with JEDEC standards JESD36 and JESD52.
3. Data based on characterization results. Not tested in production.
4. Data based on characterization results. Not tested in production.
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Input/output AC characteristics
The definition and values of input/output AC characteristics are given in Figure 24 and
Table 53, respectively.
Unless otherwise specified, the parameters given are derived from tests performed under
the ambient temperature and supply voltage conditions summarized in Table 24: General
operating conditions.
Table 53. I/O AC characteristics(1)(2)
OSPEEDRy
[1:0] value(1)
Symbol
Parameter
Conditions
Min
Max
Unit
-
2
MHz
-
125
-
125
-
1
-
125
-
125
-
10
-
25
-
25
-
4
-
62.5
-
62.5
CL = 30 pF, VDDIOx ≥ 2.7 V
-
50
CL = 50 pF, VDDIOx ≥ 2.7 V
-
30
CL = 50 pF, 2 V ≤ VDDIOx < 2.7 V
-
20
CL = 50 pF, VDDIOx < 2 V
-
10
CL = 30 pF, VDDIOx ≥ 2.7 V
-
5
CL = 50 pF, VDDIOx ≥ 2.7 V
-
8
CL = 50 pF, 2 V ≤ VDDIOx < 2.7 V
-
12
CL = 50 pF, VDDIOx < 2 V
-
25
CL = 30 pF, VDDIOx ≥ 2.7 V
-
5
CL = 50 pF, VDDIOx ≥ 2.7 V
-
8
CL = 50 pF, 2 V ≤ VDDIOx < 2.7 V
-
12
CL = 50 pF, VDDIOx < 2 V
-
25
fmax(IO)out Maximum frequency(3)
x0
tf(IO)out
Output fall time
tr(IO)out
Output rise time
CL = 50 pF, VDDIOx ≥ 2 V
fmax(IO)out Maximum frequency(3)
tf(IO)out
Output fall time
tr(IO)out
Output rise time
CL = 50 pF, VDDIOx < 2 V
fmax(IO)out Maximum frequency(3)
01
tf(IO)out
Output fall time
tr(IO)out
Output rise time
CL = 50 pF, VDDIOx ≥ 2 V
fmax(IO)out Maximum frequency(3)
tf(IO)out
Output fall time
tr(IO)out
Output rise time
CL = 50 pF, VDDIOx < 2 V
fmax(IO)out Maximum frequency(3)
11
tf(IO)out
tr(IO)out
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Output fall time
Output rise time
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ns
MHz
ns
MHz
ns
MHz
ns
MHz
ns
STM32F098xC
Electrical characteristics
Table 53. I/O AC characteristics(1)(2) (continued)
OSPEEDRy
[1:0] value(1)
Symbol
Parameter
Conditions
fmax(IO)out Maximum frequency(3)
Fm+
configuration
(4)
tf(IO)out
Output fall time
tr(IO)out
Output rise time
CL = 50 pF, VDDIOx ≥ 2 V
fmax(IO)out Maximum frequency(3)
CL = 50 pF, VDDIOx < 2 V
tf(IO)out
Output fall time
tr(IO)out
Output rise time
tEXTIpw
Pulse width of external
signals detected by the
EXTI controller
Min
Max
Unit
-
2
MHz
-
12
-
34
-
0.5
-
16
-
44
10
-
ns
MHz
ns
ns
1. The I/O speed is configured using the OSPEEDRx[1:0] bits. Refer to the STM32F0xxxx RM0091 reference manual for a
description of GPIO Port configuration register.
2. Guaranteed by design, not tested in production.
3. The maximum frequency is defined in Figure 24.
4. When Fm+ configuration is set, the I/O speed control is bypassed. Refer to the STM32F0xxxx reference manual RM0091
for a detailed description of Fm+ I/O configuration.
Figure 24. I/O AC characteristics definition
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6.3.14
NRST and NPOR pin characteristics
NRST pin characteristics
The NRST pin input driver uses the CMOS technology. It is connected to a permanent pullup resistor, RPU.
Unless otherwise specified, the parameters given in the table below are derived from tests
performed under the ambient temperature and supply voltage conditions summarized in
Table 24: General operating conditions.
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Table 54. NRST pin characteristics
Symbol
Parameter
VIL(NRST)
Conditions
Min
Typ
Max
NRST input low level voltage
-
-
0.3 VDD+0.07(1)
VIH(NRST)
NRST input high level voltage
0.445 VDD+0.398(1)
-
-
Vhys(NRST)
NRST Schmitt trigger voltage
hysteresis
-
200
-
mV
25
40
55
kΩ
-
-
100(1)
ns
700(1)
-
-
ns
RPU
Weak pull-up equivalent
resistor(2)
VF(NRST)
NRST input filtered pulse
VIN = VSS
VNF(NRST) NRST input not filtered pulse
Unit
V
1. Data based on design simulation only. Not tested in production.
2. The pull-up is designed with a true resistance in series with a switchable PMOS. This PMOS contribution to the series
resistance is minimal (~10% order).
Figure 25. Recommended NRST pin protection
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1. The external capacitor protects the device against parasitic resets.
2. The user must ensure that the level on the NRST pin can go below the VIL(NRST) max level specified in
Table 54: NRST pin characteristics. Otherwise the reset will not be taken into account by the device.
NPOR pin characteristics
The NPOR pin input driver uses the CMOS technology. It is connected to a permanent pullup resistor to the VDDA, RPU.
Unless otherwise specified, the parameters given in Table 55 below are derived from tests
performed under ambient temperature and supply voltage conditions summarized in
Table 24: General operating conditions.
Table 55. NPOR pin characteristics
Symbol
Parameter
VIL(NPOR)
NPOR Input low level voltage
VIH(NPOR)
NPOR Input high level
voltage
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Conditions
Min
Typ
Max
-
0.475 VDDA - 0.2(1)
0.5 VDDA + 0.2(1)
-
DocID026967 Rev 2
Unit
V
STM32F098xC
Electrical characteristics
Table 55. NPOR pin characteristics (continued)
Symbol
Parameter
Vhys(NPOR)
NPOR Schmitt trigger voltage
hysteresis
RPU
Conditions
Weak pull-up equivalent
resistor(2)
VIN = VSS
Min
Typ
Max
Unit
-
100(1)
-
mV
25
40
55
kΩ
1. Guaranteed by design, not tested in production.
2. The pull-up is designed with a true resistance in series with a switchable PMOS. This PMOS contribution to the series
resistance is minimal (~10% order).
6.3.15
12-bit ADC characteristics
Unless otherwise specified, the parameters given in Table 56 are preliminary values derived
from tests performed under ambient temperature, fPCLK frequency and VDDA supply voltage
conditions summarized in Table 24: General operating conditions.
Note:
It is recommended to perform a calibration after each power-up.
Table 56. ADC characteristics
Symbol
Parameter
VDDA
Analog supply voltage for
ADC ON
IDDA (ADC)
Current consumption of
the ADC(1)
Conditions
VDD = VDDA = 3.3 V
Min
Typ
Max
Unit
2.4
-
3.6
V
-
0.9
-
mA
fADC
ADC clock frequency
0.6
-
14
MHz
fS(2)
Sampling rate
0.05
-
1
MHz
-
-
823
kHz
-
-
17
1/fADC
0
-
VDDA
V
-
-
50
kΩ
fADC = 14 MHz
fTRIG(2)
External trigger frequency
VAIN
Conversion voltage range
RAIN(2)
External input impedance
RADC(2)
Sampling switch
resistance
-
-
1
kΩ
CADC(2)
Internal sample and hold
capacitor
-
-
8
pF
tCAL(2)
Calibration time
See Equation 1 and
Table 57 for details
fADC = 14 MHz
ADC_DR register write
latency
μs
83
1/fADC
1.5 ADC
cycles + 2
fPCLK cycles
-
1.5 ADC
cycles + 3
fPCLK cycles
ADC clock = PCLK/2
-
4.5
-
fPCLK
cycle
ADC clock = PCLK/4
-
8.5
-
fPCLK
cycle
ADC clock = HSI14
WLATENCY(2)
5.9
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Table 56. ADC characteristics (continued)
Symbol
(2)
tlatr
Parameter
Conditions
Min
μs
fADC = fPCLK/2
5.5
1/fPCLK
0.219
μs
10.5
1/fPCLK
fADC = fHSI14 = 14 MHz
0.188
-
0.259
μs
fADC = fHSI14
-
1
-
1/fHSI14
fADC = 14 MHz
0.107
-
17.1
μs
1.5
-
239.5
1/fADC
0
0
1
μs
1
-
18
μs
ADC jitter on trigger
conversion
Sampling time
tSTAB(2)
Power-up time
tCONV(2)
Total conversion time
(including sampling time)
Unit
0.196
Trigger conversion latency fADC = fPCLK/4 = 12 MHz
tS(2)
Max
fADC = fPCLK/2 = 14 MHz
fADC = fPCLK/4
JitterADC
Typ
fADC = 14 MHz
14 to 252 (tS for sampling +12.5 for
successive approximation)
1/fADC
1. During conversion of the sampled value (12.5 x ADC clock period), an additional consumption of 100 μA on IDDA and 60 μA
on IDD should be taken into account.
2. Guaranteed by design, not tested in production.
Equation 1: RAIN max formula
TS
R AIN < ------------------------------------------------------------- – R ADC
N+2
f ADC × C ADC × ln ( 2
)
The formula above (Equation 1) is used to determine the maximum external impedance
allowed for an error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).
Table 57. RAIN max for fADC = 14 MHz
Ts (cycles)
tS (μs)
RAIN max (kΩ)(1)
1.5
0.11
0.4
7.5
0.54
5.9
13.5
0.96
11.4
28.5
2.04
25.2
41.5
2.96
37.2
55.5
3.96
50
71.5
5.11
NA
239.5
17.1
NA
1. Guaranteed by design, not tested in production.
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Electrical characteristics
Table 58. ADC accuracy(1)(2)(3)
Symbol
Parameter
Test conditions
Typ
Max(4)
±1.3
±2
±1
±1.5
±0.5
±1.5
±0.7
±1
ET
Total unadjusted error
EO
Offset error
EG
Gain error
ED
Differential linearity error
EL
Integral linearity error
±0.8
±1.5
ET
Total unadjusted error
±3.3
±4
EO
Offset error
±1.9
±2.8
EG
Gain error
±2.8
±3
ED
Differential linearity error
±0.7
±1.3
EL
Integral linearity error
±1.2
±1.7
ET
Total unadjusted error
±3.3
±4
EO
Offset error
±1.9
±2.8
EG
Gain error
±2.8
±3
ED
Differential linearity error
±0.7
±1.3
EL
Integral linearity error
±1.2
±1.7
fPCLK = 48 MHz,
fADC = 14 MHz, RAIN < 10 kΩ
VDDA = 3 V to 3.6 V
TA = 25 °C
fPCLK = 48 MHz,
fADC = 14 MHz, RAIN < 10 kΩ
VDDA = 2.7 V to 3.6 V
TA = −40 to 105 °C
fPCLK = 48 MHz,
fADC = 14 MHz, RAIN < 10 kΩ
VDDA = 2.4 V to 3.6 V
TA = 25 °C
Unit
LSB
LSB
LSB
1. ADC DC accuracy values are measured after internal calibration.
2. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-robust) analog input
pins should be avoided as this significantly reduces the accuracy of the conversion being performed on another analog
input. It is recommended to add a Schottky diode (pin to ground) to standard analog pins which may potentially inject
negative current.
Any positive injection current within the limits specified for IINJ(PIN) and ΣIINJ(PIN) in Section 6.3.13 does not affect the ADC
accuracy.
3. Better performance may be achieved in restricted VDDA, frequency and temperature ranges.
4. Data based on characterization results, not tested in production.
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Figure 26. ADC accuracy characteristics
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Figure 27. Typical connection diagram using the ADC
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1. Refer to Table 56: ADC characteristics for the values of RAIN, RADC and CADC.
2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy
this, fADC should be reduced.
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure Caution:: Each power
supply pair (VDD/VSS, VDDA/VSSA etc.) must be decoupled with filtering ceramic
capacitors as shown above. These capacitors must be placed as close as possible to, or
below, the appropriate pins on the underside of the PCB to ensure the good functionality of
the device.. The 10 nF capacitor should be ceramic (good quality) and it should be placed
as close as possible to the chip.
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6.3.16
Electrical characteristics
DAC electrical specifications
Table 59. DAC characteristics
Symbol
Parameter
Min
Typ
Max
Unit
Comments
VDDA
Analog supply voltage for
DAC ON
2.4
-
3.6
V
RLOAD(1)
Resistive load with buffer
ON
5
-
-
kΩ
Load is referred to ground
RO(1)
CLOAD(1)
Impedance output with
buffer OFF
-
-
15
kΩ
When the buffer is OFF, the
Minimum resistive load between
DAC_OUT and VSS to have a
1% accuracy is 1.5 MΩ
Capacitive load
-
-
50
pF
Maximum capacitive load at
DAC_OUT pin (when the buffer
is ON).
It gives the maximum output
excursion of the DAC.
It corresponds to 12-bit input
code (0x0E0) to (0xF1C) at
VDDA = 3.6 V and (0x155) and
(0xEAB) at VDDA = 2.4 V
DAC_OUT
min(1)
Lower DAC_OUT voltage
with buffer ON
0.2
-
-
V
DAC_OUT
max(1)
Higher DAC_OUT voltage
with buffer ON
-
-
VDDA – 0.2
V
DAC_OUT
min(1)
Lower DAC_OUT voltage
with buffer OFF
-
0.5
-
mV
DAC_OUT
max(1)
Higher DAC_OUT voltage
with buffer OFF
-
-
VDDA – 1LSB
V
-
-
380
μA
IDDA(1)
DAC DC current
consumption in quiescent
mode(2)
With no load, middle code
(0x800) on the input
-
-
480
μA
With no load, worst code
(0xF1C) on the input
Differential non linearity
Difference between two
consecutive code-1LSB)
-
-
±0.5
LSB
Given for the DAC in 10-bit
configuration
-
-
±2
LSB
Given for the DAC in 12-bit
configuration
-
-
±1
LSB
Given for the DAC in 10-bit
configuration
-
-
±4
LSB
Given for the DAC in 12-bit
configuration
-
-
±10
mV
-
-
±3
LSB
Given for the DAC in 10-bit at
VDDA = 3.6 V
-
-
±12
LSB
Given for the DAC in 12-bit at
VDDA = 3.6 V
-
-
±0.5
%
DNL(3)
INL(3)
Offset(3)
Integral non linearity
(difference between
measured value at Code i
and the value at Code i on a
line drawn between Code 0
and last Code 1023)
Offset error
(difference between
measured value at Code
(0x800) and the ideal value
= VDDA/2)
Gain error(3) Gain error
DocID026967 Rev 2
It gives the maximum output
excursion of the DAC.
Given for the DAC in 12-bit
configuration
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Electrical characteristics
STM32F098xC
Table 59. DAC characteristics (continued)
Symbol
Min
Typ
Max
Unit
Settling time (full scale: for a
10-bit input code transition
(3) between the lowest and the
tSETTLING
highest input codes when
DAC_OUT reaches final
value ±1LSB
-
3
4
μs
Max frequency for a correct
DAC_OUT change when
small variation in the input
code (from code i to i+1LSB)
-
-
1
tWAKEUP(3)
Wakeup time from off state
(Setting the ENx bit in the
DAC Control register)
-
6.5
10
μs
CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ
input code between lowest and
highest possible ones.
PSRR+ (1)
Power supply rejection ratio
(to VDDA) (static DC
measurement
-
–67
–40
dB
No RLOAD, CLOAD = 50 pF
Update
rate(3)
Parameter
Comments
CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ
MS/s CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ
1. Guaranteed by design, not tested in production.
2. The DAC is in “quiescent mode” when it keeps the value steady on the output so no dynamic consumption is involved.
3. Data based on characterization results, not tested in production.
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6.3.17
Electrical characteristics
Comparator characteristics
Table 60. Comparator characteristics
Symbol
VDDA
Parameter
Conditions
Analog supply voltage
Min(1) Typ Max(1)
1.65
-
3.6
Unit
V
VIN
Comparator input
voltage range
0
-
VDDA
VSC
VREFINT scaler offset
voltage
-
±5
±10
mV
tS_SC
VREFINT scaler startup
time from power down
-
-
0.2
ms
tSTART
Comparator startup
time
Startup time to reach propagation delay
specification
-
-
60
μs
Ultra-low power mode
-
2
4.5
Low power mode
-
0.7
1.5
Medium power mode
-
0.3
0.6
VDDA ≥ 2.7 V
-
50
100
VDDA < 2.7 V
-
100
240
Ultra-low power mode
-
2
7
Low power mode
-
0.7
2.1
Medium power mode
-
0.3
1.2
VDDA ≥ 2.7 V
-
90
180
VDDA < 2.7 V
-
110
300
Propagation delay for
200 mV step with
100 mV overdrive
High speed mode
tD
Propagation delay for
full range step with
100 mV overdrive
High speed mode
μs
ns
μs
ns
Voffset
Comparator offset error
-
±4
±10
mV
dVoffset/dT
Offset error
temperature coefficient
-
18
-
μV/°C
Ultra-low power mode
-
1.2
1.5
Low power mode
-
3
5
Medium power mode
-
10
15
High speed mode
-
75
100
IDD(COMP)
COMP current
consumption
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STM32F098xC
Table 60. Comparator characteristics (continued)
Symbol
Parameter
Min(1) Typ Max(1)
Conditions
No hysteresis
(COMPxHYST[1:0]=00)
Vhys
Comparator hysteresis
-
0
High speed mode
Low hysteresis
(COMPxHYST[1:0]=01) All other power
modes
3
High speed mode
Medium hysteresis
(COMPxHYST[1:0]=10) All other power
modes
7
High speed mode
High hysteresis
(COMPxHYST[1:0]=11) All other power
modes
18
Unit
13
8
5
10
26
15
9
19
mV
19
49
31
40
1. Data based on characterization results, not tested in production.
6.3.18
Temperature sensor characteristics
Table 61. TS characteristics
Symbol
Parameter
TL(1)
Typ
Max
Unit
-
±1
±2
°C
Average slope
4.0
4.3
4.6
mV/°C
Voltage at 30 °C (± 5 °C)(2)
1.34
1.43
1.52
V
Startup time
4
-
10
μs
ADC sampling time when reading the
temperature
4
-
-
μs
VSENSE linearity with temperature
(1)
Avg_Slope
V30
tSTART
Min
(1)
tS_temp(1)
1. Guaranteed by design, not tested in production.
2. Measured at VDDA = 3.3 V ± 10 mV. The V30 ADC conversion result is stored in the TS_CAL1 byte. Refer to Table 3:
Temperature sensor calibration values.
6.3.19
VBAT monitoring characteristics
Table 62. VBAT monitoring characteristics
Symbol
Parameter
Typ
Max
Unit
kΩ
R
Resistor bridge for VBAT
-
50
-
Q
Ratio on VBAT measurement
-
2
-
Error on Q
–1
-
+1
%
ADC sampling time when reading the VBAT
4
-
-
μs
Er(1)
tS_vbat(1)
1. Guaranteed by design, not tested in production.
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6.3.20
Electrical characteristics
Timer characteristics
The parameters given in the following tables are guaranteed by design.
Refer to Section 6.3.13: I/O port characteristics for details on the input/output alternate
function characteristics (output compare, input capture, external clock, PWM output).
Table 63. TIMx characteristics
Symbol
Parameter
Conditions
tres(TIM)
Timer resolution time
fEXT
Timer external clock
frequency on CH1 to
CH4
ResTIM
tCOUNTER
tMAX_COUNT
Min
Max
Unit
1
-
tTIMxCLK
20.8
-
ns
0
fTIMxCLK/2
MHz
fTIMxCLK = 48 MHz
0
24
MHz
TIMx (except TIM2)
-
16
TIM2
-
32
1
65536
tTIMxCLK
0.0208
1365
μs
-
65536 × 65536
tTIMxCLK
-
89.48
s
fTIMxCLK = 48 MHz
Timer resolution
16-bit counter clock
period
fTIMxCLK = 48 MHz
Maximum possible count
with 32-bit counter
fTIMxCLK = 48 MHz
bit
Table 64. IWDG min/max timeout period at 40 kHz (LSI)(1)
Prescaler divider
PR[2:0] bits
Min timeout RL[11:0]=
0x000
Max timeout RL[11:0]=
0xFFF
/4
0
0.1
409.6
/8
1
0.2
819.2
/16
2
0.4
1638.4
/32
3
0.8
3276.8
/64
4
1.6
6553.6
/128
5
3.2
13107.2
/256
6 or 7
6.4
26214.4
Unit
ms
1. These timings are given for a 40 kHz clock but the microcontroller internal RC frequency can vary from 30
to 60 kHz. Moreover, given an exact RC oscillator frequency, the exact timings still depend on the phasing
of the APB interface clock versus the LSI clock so that there is always a full RC period of uncertainty.
Table 65. WWDG min/max timeout value at 48 MHz (PCLK)
Prescaler
WDGTB
Min timeout value
Max timeout value
1
0
0.0853
5.4613
2
1
0.1706
10.9226
4
2
0.3413
21.8453
8
3
0.6826
43.6906
DocID026967 Rev 2
Unit
ms
97/128
103
Electrical characteristics
6.3.21
STM32F098xC
Communication interfaces
I2C interface characteristics
The I2C interface meets the timings requirements of the I2C-bus specification and user
manual rev. 03 for:
•
Standard-mode (Sm): with a bit rate up to 100 kbit/s
•
Fast-mode (Fm): with a bit rate up to 400 kbit/s
•
Fast-mode Plus (Fm+): with a bit rate up to 1 Mbit/s.
The I2C timings requirements are guaranteed by design when the I2C peripheral is properly
configured (refer to Reference manual).
The SDA and SCL I/O requirements are met with the following restrictions: the SDA and
SCL I/O pins are not “true” open-drain. When configured as open-drain, the PMOS
connected between the I/O pin and VDDIOx is disabled, but is still present. Only FTf I/O pins
support Fm+ low level output current maximum requirement. Refer to Section 6.3.13: I/O
port characteristics for the I2C I/Os characteristics.
All I2C SDA and SCL I/Os embed an analog filter. Refer to the table below for the analog
filter characteristics:
Table 66. I2C analog filter characteristics(1)
Symbol
Parameter
Min
Max
Unit
tAF
Maximum pulse width of spikes that
are suppressed by the analog filter
50(2)
260(3)
ns
1. Guaranteed by design, not tested in production.
2. Spikes with widths below tAF(min) are filtered.
3. Spikes with widths above tAF(max) are not filtered
98/128
DocID026967 Rev 2
STM32F098xC
Electrical characteristics
SPI/I2S characteristics
Unless otherwise specified, the parameters given in Table 67 for SPI or in Table 68 for I2S
are derived from tests performed under the ambient temperature, fPCLKx frequency and
supply voltage conditions summarized in Table 24: General operating conditions.
Refer to Section 6.3.13: I/O port characteristics for more details on the input/output alternate
function characteristics (NSS, SCK, MOSI, MISO for SPI and WS, CK, SD for I2S).
Table 67. SPI characteristics(1)
Symbol
fSCK
1/tc(SCK)
Parameter
SPI clock frequency
Conditions
Min
Max
Master mode
-
18
Slave mode
-
18
-
6
tr(SCK)
tf(SCK)
SPI clock rise and fall
time
Capacitive load: C = 15 pF
tsu(NSS)
NSS setup time
Slave mode
4Tpclk
-
th(NSS)
NSS hold time
Slave mode
2Tpclk + 10
-
SCK high and low time
Master mode, fPCLK = 36 MHz,
presc = 4
Tpclk/2 -2
Tpclk/2 + 1
Master mode
4
-
Slave mode
5
-
Master mode
4
-
Slave mode
5
-
tw(SCKH)
tw(SCKL)
tsu(MI)
tsu(SI)
th(MI)
th(SI)
Data input setup time
Data input hold time
ta(SO)(2)
Data output access time
Slave mode, fPCLK = 20 MHz
0
3Tpclk
tdis(SO)(3)
Data output disable time
Slave mode
0
18
tv(SO)
Data output valid time
Slave mode (after enable edge)
-
22.5
tv(MO)
Data output valid time
Master mode (after enable edge)
-
6
Slave mode (after enable edge)
11.5
-
Master mode (after enable edge)
2
-
Slave mode
25
75
th(SO)
th(MO)
DuCy(SCK)
Data output hold time
SPI slave input clock
duty cycle
Unit
MHz
ns
ns
%
1. Data based on characterization results, not tested in production.
2. Min time is for the minimum time to drive the output and the max time is for the maximum time to validate the data.
3. Min time is for the minimum time to invalidate the output and the max time is for the maximum time to put the data in Hi-Z
DocID026967 Rev 2
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103
Electrical characteristics
STM32F098xC
Figure 28. SPI timing diagram - slave mode and CPHA = 0
E^^ŝŶƉƵƚ
ƚĐ;^<Ϳ
ƚŚ;E^^Ϳ
ƚ^h;E^^Ϳ
^</ŶƉƵƚ
W,с Ϭ
WK>сϬ
ƚǁ;^<,Ϳƚǁ;^<>Ϳ
W,с Ϭ
WK>сϭ
ƚǀ;^KͿ
ƚĂ;^KͿ
D/^K
Khd W hd
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ƚĚŝƐ;^KͿ
ƚŚ;^KͿ
D^ K hd
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D ^ /E
/ dϭ /E
>^ Khd
ƚƐƵ;^/Ϳ
DK^/
/ EWhd
>^ /E
ƚŚ;^/Ϳ
DLF
Figure 29. SPI timing diagram - slave mode and CPHA = 1
E^^ŝŶƉƵƚ
ƚ^h;E^^Ϳ
^</ŶƉƵƚ
W ,сϭ
W K>сϬ
W ,сϭ
W K>сϭ
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ƚǁ;^>,Ϳ
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ƚĂ;^KͿ
D/^ K
Khd W hd
ƚŚ;^KͿ
D^ K hd
ƚƐƵ;^/Ϳ
DK^ /
/ EWhd
ƚŚ;E^^Ϳ
/ dϲ Khd
ƚƌ;^>Ϳ
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ƚĚŝƐ;^KͿ
> ^ Khd
ƚŚ;^/Ϳ
/ dϭ /E
D^ /E
> ^ /E
DL
1. Measurement points are done at CMOS levels: 0.3 VDD and 0.7 VDD.
100/128
DocID026967 Rev 2
STM32F098xC
Electrical characteristics
Figure 30. SPI timing diagram - master mode
(IGH
.33INPUT
3#+/UTPUT
#0(! #0/,
3#+/UTPUT
TC3#+
#0(!
#0/,
#0(! #0/,
#0(!
#0/,
TW3#+(
TW3#+,
TSU-)
-)3/
).0 54
TR3#+
TF3#+
-3 ").
") 4).
,3").
TH-)
-/3)
/54054
- 3"/54
" ) 4/54
TV-/
,3"/54
TH-/
AI6
1. Measurement points are done at CMOS levels: 0.3 VDD and 0.7 VDD.
Table 68. I2S characteristics(1)
Symbol
fCK
1/tc(CK)
Parameter
I2S
clock frequency
tr(CK)
I2S clock rise time
tf(CK)
I2S clock fall time
Conditions
Min
Max
1.597
1.601
Slave mode
0
6.5
Capacitive load CL = 15 pF
-
10
-
12
306
-
312
-
Master mode (data: 16 bits, Audio
frequency = 48 kHz)
Master fPCLK= 16 MHz, audio
frequency = 48 kHz
tw(CKH)
I2S clock high time
tw(CKL)
I2S clock low time
tv(WS)
WS valid time
Master mode
2
-
th(WS)
WS hold time
Master mode
2
-
tsu(WS)
WS setup time
Slave mode
7
-
th(WS)
WS hold time
Slave mode
0
-
I2S slave input clock duty
cycle
Slave mode
25
75
DuCy(SCK)
DocID026967 Rev 2
Unit
MHz
ns
%
101/128
103
Electrical characteristics
STM32F098xC
Table 68. I2S characteristics(1) (continued)
Symbol
Parameter
Conditions
Min
Max
tsu(SD_MR)
Data input setup time
Master receiver
6
-
tsu(SD_SR)
Data input setup time
Slave receiver
2
-
Master receiver
4
-
Slave receiver
0.5
-
th(SD_MR)
(2)
th(SD_SR)(2)
Data input hold time
tv(SD_ST)(2)
Data output valid time
th(SD_ST)
Data output hold time
tv(SD_MT)
(2)
th(SD_MT)
Slave transmitter (after enable edge)
Slave transmitter (after enable edge)
Master transmitter (after enable edge)
Master transmitter (after enable edge)
Data output valid time
Data output hold time
13
-
-
4
0
-
1. Data based on design simulation and/or characterization results, not tested in production.
2. Depends on fPCLK. For example, if fPCLK = 8 MHz, then TPCLK = 1/fPLCLK = 125 ns.
Figure 31. I2S slave timing diagram (Philips protocol)
&.,QSXW
WF&.
&32/ &32/ WZ&.+
WK:6
WZ&./
:6LQSXW
WY6'B67
WVX:6
6'WUDQVPLW
/6%WUDQVPLW
06%WUDQVPLW
WVX6'B65
6'UHFHLYH
/6%UHFHLYH
%LWQWUDQVPLW
WK6'B67
/6%WUDQVPLW
WK6'B65
06%UHFHLYH
%LWQUHFHLYH
/6%UHFHLYH
DLE
1. Measurement points are done at CMOS levels: 0.3 × VDDIOx and 0.7 × VDDIOx.
2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
102/128
DocID026967 Rev 2
Unit
ns
STM32F098xC
Electrical characteristics
Figure 32. I2S master timing diagram (Philips protocol)
TF#+
TR#+
#+OUTPUT
TC#+
#0/,
TW#+(
#0/,
TV73
TH73
TW#+,
73OUTPUT
TV3$?-4
3$TRANSMIT
,3"TRANSMIT
-3"TRANSMIT
,3"RECEIVE
,3"TRANSMIT
TH3$?-2
TSU3$?-2
3$RECEIVE
"ITNTRANSMIT
TH3$?-4
-3"RECEIVE
"ITNRECEIVE
,3"RECEIVE
AIB
1. Data based on characterization results, not tested in production.
2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
CAN (controller area network) interface
Refer to Section 6.3.13: I/O port characteristics for more details on the input/output alternate
function characteristics (CAN_TX and CAN_RX).
DocID026967 Rev 2
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103
Package characteristics
STM32F098xC
7
Package characteristics
7.1
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
104/128
DocID026967 Rev 2
STM32F098xC
Package characteristics
Figure 33. UFBGA100 – ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch,
package outline
0.10
Z
D1
D
X
A1 ball
pad corner
FD
Y
A1 ball
pad corner
0.50
1.75
b
1.75
E1
E
e
A1
A
0.10
FE
A2
Side view
Top view
Bottom view
A0C2_ME
1. Drawing is not to scale.
Table 69. UFBGA100 – ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch, package
mechanical data
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
0.460
0.530
0.600
0.0181
0.0209
0.0236
A1
0.060
0.080
0.100
0.0024
0.0031
0.0039
A2
0.400
0.450
0.500
0.0157
0.0177
0.0197
b
0.200
0.250
0.300
0.0079
0.0098
0.0118
D
-
7.000
-
-
0.2756
-
D1
-
5.500
-
-
0.2165
-
E
-
7.000
-
-
0.2756
-
E1
-
5.500
-
-
0.2165
-
e
-
0.500
-
-
0.0197
-
FD
-
0.750
-
-
0.0295
-
FE
-
0.750
-
-
0.0295
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
DocID026967 Rev 2
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126
Package characteristics
STM32F098xC
Figure 34. UFBGA100 recommended footprint
'SDG
'VP
069
Table 70. UFBGA100 recommended PCB design rules
Dimension
Recommended values
Pitch
0.50 mm
Dpad
0.27 mm
Dsm
0.35 mm typ (depending on the soldermask registration tolerance)
Solder paste
0.27 mm aperture diameter
Device marking for UFBGA100
The following figure shows the device marking for the UFBGA100 package.
Figure 35. UFBGA100 marking example (package top view)
3URGXFWLGHQWLILFDWLRQ 45.'
7$)
'DWHFRGH
: 88
3LQLGHQWLILHU
5HYLVLRQFRGH
3
069
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
106/128
DocID026967 Rev 2
STM32F098xC
Package characteristics
Figure 36. LQFP100 – 14 x 14 mm 100 pin low-profile quad flat package outline
C
!
!
!
3%!4).'
0,!.%
#
MM
'!5'%0,!.%
,
$
!
+
CCC #
,
$
$
%
%
%
B
0).
)$%.4)&)#!4)/.
E
,?-%?6
1. Drawing is not to scale.
Table 71. LQFP100 – 14 x 14 mm low-profile quad flat package mechanical data
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
-
-
1.600
-
-
0.0630
A1
0.050
-
0.150
0.0020
-
0.0059
A2
1.350
1.400
1.450
0.0531
0.0551
0.0571
b
0.170
0.220
0.270
0.0067
0.0087
0.0106
c
0.090
-
0.200
0.0035
-
0.0079
D
15.800
16.000
16.200
0.6220
0.6299
0.6378
D1
13.800
14.000
14.200
0.5433
0.5512
0.5591
D3
-
12.000
-
-
0.4724
-
E
15.800
16.000
16.200
0.6220
0.6299
0.6378
DocID026967 Rev 2
107/128
126
Package characteristics
STM32F098xC
Table 71. LQFP100 – 14 x 14 mm low-profile quad flat package mechanical data (continued)
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
E1
13.800
14.000
14.200
0.5433
0.5512
0.5591
E3
-
12.000
-
-
0.4724
-
e
-
0.500
-
-
0.0197
-
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
-
1.000
-
-
0.0394
-
ccc
-
-
0.080
-
-
0.0031
K
0°
3.5°
7°
0°
3.5°
7°
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 37. LQFP100 recommended footprint
75
76
51
50
0.5
0.3
16.7
14.3
100
26
1.2
1
25
12.3
16.7
ai14906b
1. Dimensions are in millimeters.
108/128
DocID026967 Rev 2
STM32F098xC
Package characteristics
Device marking for LQFP100
The following figure shows the device marking for the LQFP100 package.
Figure 38. LQFP100 marking example (package top view)
2SWLRQDOJDWHPDUN
3URGXFWLGHQWLILFDWLRQ 45.'
7$5
5HYLVLRQFRGH
3
'DWHFRGH
: 88
3LQLGHQWLILHU
069
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
DocID026967 Rev 2
109/128
126
Package characteristics
STM32F098xC
Figure 39. UFBGA64 – ultra fine pitch ball grid array, 5 x 5 mm, 0.50 mm pitch,
package outline
= 6HDWLQJSODQH
GGG =
$
$ $
$ $
(
H
$EDOO
$EDOO
LGHQWLILHU LQGH[DUHD
)
;
(
$
)
'
'
H
<
+
%277209,(:
‘EEDOOV
‘ HHH 0 = < ;
‘ III 0 =
7239,(:
$B0(B9
1. Drawing is not to scale.
Table 72. UFBGA64 –ultra fine pitch ball grid array, 5 x 5 mm, 0.50 mm pitch,
package mechanical data
Dimensions
Ref.
110/128
Inches (1)
Millimeters
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.460
0.530
0.600
0.0181
0.0209
0.0236
A1
0.050
0.080
0.110
0.0020
0.0031
0.0043
A2
0.400
0.450
0.500
0.0157
0.0177
0.0197
A3
0.080
0.130
0.180
0.0031
0.0051
0.0071
A4
0.270
0.320
0.370
0.0106
0.0126
0.0146
b
0.170
0.280
0.330
0.0067
0.0110
0.0130
D
4.850
5.000
5.150
0.1909
0.1969
0.2028
D1
3.450
3.500
3.550
0.1358
0.1378
0.1398
E
4.850
5.000
5.150
0.1909
0.1969
0.2028
E1
3.450
3.500
3.550
0.1358
0.1378
0.1398
e
-
0.500
-
-
0.0197
-
F
0.700
0.750
0.800
0.0276
0.0295
0.0315
ddd
-
-
0.080
-
-
0.0031
DocID026967 Rev 2
STM32F098xC
Package characteristics
Table 72. UFBGA64 –ultra fine pitch ball grid array, 5 x 5 mm, 0.50 mm pitch,
package mechanical data (continued)
Dimensions
Ref.
Inches (1)
Millimeters
Min.
Typ.
Max.
Min.
Typ.
Max.
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 40. UFBGA64 recommended footprint
%RDUG6ROGHU0DVN2SHQLQJ
—
%RDUG3DG'LDPHWHU
—
$B0(B)3B9
DocID026967 Rev 2
111/128
126
Package characteristics
STM32F098xC
Figure 41. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package outline
!
C
!
!
3%!4).'
0,!.%
#
MM
'!5'%0,!.%
!
CCC #
+
,
$
,
$
$
%
%
%
B
0).
)$%.4)&)#!4)/.
E
7?-%?6
1. Drawing is not to scale.
Table 73. LQFP64 – 10 x 10 mm low-profile quad flat package mechanical data
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
-
-
1.600
-
-
0.0630
A1
0.050
-
0.150
0.0020
-
0.0059
A2
1.350
1.400
1.450
0.0531
0.0551
0.0571
b
0.170
0.220
0.270
0.0067
0.0087
0.0106
c
0.090
0.200
0.0035
-
0.0079
D
11.800
12.000
12.200
0.4646
0.4724
0.4803
D1
9.800
10.000
10.200
0.3858
0.3937
0.4016
D3
-
7.500
-
-
0.2953
-
112/128
DocID026967 Rev 2
STM32F098xC
Package characteristics
Table 73. LQFP64 – 10 x 10 mm low-profile quad flat package mechanical data (continued)
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
E
11.800
12.000
12.200
0.4646
0.4724
0.4803
E1
9.800
10.000
10.200
0.3858
0.3937
0.4016
E3
-
7.500
-
-
0.2953
-
e
-
0.500
-
-
0.0197
-
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
-
1.000
-
-
0.0394
-
ccc
-
-
0.080
-
-
0.0031
K
0°
3.5°
7°
0°
3.5°
7°
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 42. LQFP64 recommended footprint
AIB
1. Dimensions are in millimeters.
DocID026967 Rev 2
113/128
126
Package characteristics
STM32F098xC
Device marking for LQFP64
The following figure shows the device marking for the LQFP64 package.
Figure 43. LQFP64 marking example (package top view)
5HYLVLRQFRGH
3
3URGXFWLGHQWLILFDWLRQ 45.'
3$5
: 88
3LQLGHQWLILHU
'DWHFRGH
069
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
114/128
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STM32F098xC
Package characteristics
Figure 44. WLCSP64 wafer level chip size package mechanical drawing
!BALLLOCATION
$
E
E
E
$ETAIL!
E
%
'
!
&
!
7AFERBACKSIDE
3IDEVIEW
"UMPSIDE
$ETAIL!
ROTATEDBY #
!
EEE
B
3EATINGPLANE
!&8?-%
Table 74. WLCSP64 wafer level chip size package mechanical data
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
0.520
0.570
0.620
0.0205
0.0224
0.0244
A1
0.170
0.190
0.210
0.0067
0.0075
0.0083
A2
0.350
0.380
0.410
0.0138
0.0150
0.0161
b
0.240
0.270
0.300
0.0094
0.0106
0.0118
D
4.519
4.539
4.559
0.1779
0.1787
0.1795
E
4.891
4.911
4.931
0.1926
0.1933
0.1941
e
-
0.400
-
-
0.0157
-
e1
-
2.800
-
-
0.1102
-
F
-
0.870
-
-
0.0343
-
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Package characteristics
STM32F098xC
Table 74. WLCSP64 wafer level chip size package mechanical data (continued)
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
G
-
1.056
-
-
0.0416
-
eee
-
0.050
-
-
0.0020
-
1. Values in inches are converted from mm and rounded to four decimal digits.
Device marking for WLCSP64
The following figure shows the device marking for the WLCSP64 package.
Figure 45. WLCSP64 marking example (package top view)
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45.'
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1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
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Package characteristics
Figure 46. LQFP48 – 7 x 7 mm, 48 pin low-profile quad flat package outline
C
!
!
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3%!4).'
0,!.%
#
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1. Drawing is not to scale.
Table 75. LQFP48 – 7 x 7 mm low-profile quad flat package mechanical data
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
-
-
1.600
-
-
0.0630
A1
0.050
-
0.150
0.0020
-
0.0059
A2
1.350
1.400
1.450
0.0531
0.0551
0.0571
b
0.170
0.220
0.270
0.0067
0.0087
0.0106
c
0.090
-
0.200
0.0035
-
0.0079
D
8.800
9.000
9.200
0.3465
0.3543
0.3622
D1
6.800
7.000
7.200
0.2677
0.2756
0.2835
D3
-
5.500
-
-
0.2165
-
E
8.800
9.000
9.200
0.3465
0.3543
0.3622
E1
6.800
7.000
7.200
0.2677
0.2756
0.2835
E3
-
5.500
-
-
0.2165
-
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Package characteristics
STM32F098xC
Table 75. LQFP48 – 7 x 7 mm low-profile quad flat package mechanical data (continued)
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
e
-
0.500
-
-
0.0197
-
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
-
1.000
-
-
0.0394
-
ccc
-
-
0.080
-
-
0.0031
K
0°
3.5°
7°
0°
3.5°
7°
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 47. LQFP48 recommended footprint
AID
1. Dimensions are in millimeters.
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Package characteristics
Device marking for LQFP48
The following figure shows the device marking for the LQFP48 package.
Figure 48. LQFP48 marking example (package top view)
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1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
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Package characteristics
STM32F098xC
Figure 49. UFQFPN48 – 7 x 7 mm, 0.5 mm pitch, package outline
3LQLGHQWLILHU
ODVHUPDUNLQJDUHD
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$
(
(
7
GGG
$
6HDWLQJ
SODQH
E
H
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1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
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Package characteristics
Table 76. UFQFPN48 – 7 x 7 mm, 0.5 mm pitch, package mechanical data
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
0.500
0.550
0.600
0.0197
0.0217
0.0236
A1
0.000
0.020
0.050
0.0000
0.0008
0.0020
D
6.900
7.000
7.100
0.2717
0.2756
0.2795
E
6.900
7.000
7.100
0.2717
0.2756
0.2795
D2
5.500
5.600
5.700
0.2165
0.2205
0.2244
E2
5.500
5.600
5.700
0.2165
0.2205
0.2244
L
0.300
0.400
0.500
0.0118
0.0157
0.0197
T
-
0.152
-
-
0.0060
-
b
0.200
0.250
0.300
0.0079
0.0098
0.0118
e
-
0.500
-
-
0.0197
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 50. UFQFPN48 recommended footprint
7.30
48
37
1
36
6.20
0.20
6.20
7.30
5.80
5.60
5.60
0.30
12
25
13
0.55
24
5.80
0.50
0.75
ai15697
1. Dimensions are in millimeters.
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Package characteristics
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Device marking for UFQFPN48
The following figure shows the device marking for the UFQFPN48 package.
Figure 51. UFQFPN48 marking example (package top view)
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1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
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7.2
Package characteristics
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 24: General operating conditions.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x ΘJA)
Where:
•
TA max is the maximum temperature in °C,
•
ΘJA is the package junction-to- thermal resistance, in °C/W,
•
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
•
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 77. Package thermal characteristics
Symbol
ΘJA
7.2.1
Parameter
Value
Thermal resistance junctionUFBGA100 - 7 × 7 mm
55
Thermal resistance junctionLQFP100 - 14 × 14 mm
42
Thermal resistance junctionUFBGA64 - 5 × 5 mm / 0.5 mm pitch
65
Thermal resistance junctionLQFP64 - 10 × 10 mm / 0.5 mm pitch
44
Thermal resistance junctionWLCSP64 - 0.4 mm pitch
53
Thermal resistance junctionLQFP48 - 7 × 7 mm
54
Thermal resistance junctionUFQFPN48 - 7 × 7 mm
32
Unit
°C/W
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
7.2.2
Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the ordering
information scheme shown in Section 8: Part numbering.
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Package characteristics
STM32F098xC
Each temperature range suffix corresponds to a specific guaranteed temperature at
maximum dissipation and to a specific maximum junction temperature.
As applications do not commonly use the STM32F0 at maximum dissipation, it is useful to
calculate the exact power consumption and junction temperature to determine which
temperature range is best suited to the application.
The following examples show how to calculate the temperature range needed for a given
application.
Example 1: High-performance application
Assuming the following application conditions:
Maximum temperature TAmax = 82 °C (measured according to JESD51-2), IDDmax = 50
mA, VDD = 3.5 V, maximum 20 I/Os used at the same time in output at low level with IOL
= 8 mA, VOL= 0.4 V and maximum 8 I/Os used at the same time in output at low level
with IOL = 20 mA, VOL= 1.3 V
PINTmax = 50 mA × 3.5 V= 175 mW
PIOmax = 20 × 8 mA × 0.4 V + 8 × 20 mA × 1.3 V = 272 mW
This gives: PINTmax = 175 mW and PIOmax = 272 mW:
PDmax = 175 + 272 = 447 mW
Using the values obtained in Table 77 TJmax is calculated as follows:
–
For LQFP64, 45 °C/W
TJmax = 82 °C + (45 °C/W × 447 mW) = 82 °C + 20.115 °C = 102.115 °C
This is within the range of the suffix 6 version parts (–40 < TJ < 105 °C).
In this case, parts must be ordered at least with the temperature range suffix 6 (see
Section 8: Part numbering).
Note:
With this given PDmax we can find the TAmax allowed for a given device temperature range
(order code suffix 6 or 7).
Suffix 6: TAmax = TJmax - (45°C/W × 447 mW) = 105-20.115 = 84.885 °C
Suffix 7: TAmax = TJmax - (45°C/W × 447 mW) = 125-20.115 = 104.885 °C
Example 2: High-temperature application
Using the same rules, it is possible to address applications that run at high temperatures
with a low dissipation, as long as junction temperature TJ remains within the specified
range.
Assuming the following application conditions:
Maximum temperature TAmax = 100 °C (measured according to JESD51-2), IDDmax =
20 mA, VDD = 3.5 V, maximum 20 I/Os used at the same time in output at low level with
IOL = 8 mA, VOL= 0.4 V
PINTmax = 20 mA × 3.5 V= 70 mW
PIOmax = 20 × 8 mA × 0.4 V = 64 mW
This gives: PINTmax = 70 mW and PIOmax = 64 mW:
PDmax = 70 + 64 = 134 mW
Thus: PDmax = 134 mW
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Package characteristics
Using the values obtained in Table 77 TJmax is calculated as follows:
–
For LQFP64, 45 °C/W
TJmax = 100 °C + (45 °C/W × 134 mW) = 100 °C + 6.03 °C = 106.03 °C
This is above the range of the suffix 6 version parts (–40 < TJ < 105 °C).
In this case, parts must be ordered at least with the temperature range suffix 7 (see
Section 8: Part numbering) unless we reduce the power dissipation in order to be able to
use suffix 6 parts.
Refer to Figure 52 to select the required temperature range (suffix 6 or 7) according to your
temperature or power requirements.
Figure 52. LQFP64 PD max vs. TA
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Part numbering
8
STM32F098xC
Part numbering
For a list of available options (memory, package, and so on) or for further information on any
aspect of this device, please contact your nearest ST sales office.
Table 78. Ordering information scheme
Example:
STM32
Device family
STM32 = ARM-based 32-bit microcontroller
Product type
F = General-purpose
Sub-family
098 = STM32F098xx
Pin count
C = 48 pins
R = 64 pins
V = 100 pins
Code size
C = 256 Kbytes of Flash memory
Package
H = UFBGA
T = LQFP
U = UFQFPN
Y = WLCSP
Temperature range
6 = –40 to 85 °C
Options
xxx = programmed parts
TR = tape and reel
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R
C
T
6
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9
Revision history
Revision history
Table 79. Document revision history
Date
Revision
10-Nov-2014
1
Initial release.
2
Updated the following:
– Features: changed the number of capacitive sensing
channels.
– Table 2: STM32F098xC family device features and
peripheral counts: changed the number of GPIOs and
capacitive sensing channels.
19-Nov-2014
Changes
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STM32F098xC
IMPORTANT NOTICE – PLEASE READ CAREFULLY
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ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2014 STMicroelectronics – All rights reserved
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