STPSC2006CW 600 V power Schottky silicon carbide diode Features ■ No or negligible reverse recovery A1 ■ Switching behavior independent of temperature A2 ■ Particularly suitable in PFC boost diode function K Description The SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide band gap material allows the design of a Schottky diode structure with a 600 V rating. Due to the Schottky construction no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. A2 K A1 TO-247 STPSC2006CW Table 1. ST SiC diodes will boost the performance of PFC operations in hard switching conditions. March 2011 Doc ID 018506 Rev 1 Device summary Symbol Value IF(AV) 2 x 10 A VRRM 600 V Tj (max) 175 °C QC (typ) 12 nC 1/7 www.st.com 7 Characteristics 1 STPSC2006CW Characteristics Table 2. Absolute ratings (limiting values at 25 °C unless otherwise specified, per diode) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Value Unit 600 V 18 A Tc = 115 °C, δ = 0.5 Per diode 10 A Tc = 100 °C, δ = 0.5 Per device 20 A IF(AV) Average forward current IFSM Surge non repetitive forward current tp = 10 ms sinusoidal, Tc = 25 °C tp = 10 ms sinusoidal, Tc = 125 °C tp = 10 µs square, Tc = 25 °C 40 32 160 A IFRM Repetitive peak forward current δ = 0.1, Tc = 110 °C, Tj = 150 °C 40 A Tstg Storage temperature range -55 to +175 °C Maximum operating junction temperature range -40 to +175 °C Value Unit Tj Table 3. Thermal resistance Symbol Parameter Per diode Rth(j-c) 2 Total Rth(c) Table 4. Symbol °C/W Junction to case 1.2 Coupling 0.4 °C/W °C/W Static electrical characteristics per diode Parameter IR (1) Reverse leakage current VF (2) Forward voltage drop Tests conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 10 A Min. Typ. Max. - 30 150 - 210 1500 - 1.4 1.7 - 1.6 2.1 Unit µA V 1. tp = 10 ms, δ < 2% 2. tp = 500 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.2 x IF(AV) + 0.09 x IF2(RMS) Table 5. Symbol 2/7 Other parameters per diode Parameter Test conditions Typ. Unit Qc Total capacitive charge Vr = 400 V, IF = 10 A dIF/dt = -200 A/µs Tj = 150 °C 12 nC C Total capacitance Vr = 0 V, Tc = 25 °C, F = 1 Mhz 650 pF Doc ID 018506 Rev 1 STPSC2006CW Figure 1. 20 Characteristics Forward voltage drop versus forward current (typical values, per diode) Figure 2. IFM(A) 1.E+04 Reverse leakage current versus reverse voltage applied (maximum values, per diode) IR(µA) 18 Tj = 175 °C 16 1.E+03 Tj = 25 °C 14 Tj = 150 °C Tj = 150 °C 1.E+02 12 10 Tj = 175 °C 1.E+01 8 6 1.E+00 4 Tj = 25 °C 2 VFM(V) 0 0.0 0.5 Figure 3. 70 1.0 1.5 2.0 2.5 Peak forward current versus case temperature (per diode) IM(A) 60 δ = 0.1 δ = tp / T 50 Figure 4. 100 150 200 250 300 350 400 450 500 550 600 Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) F = 1 MHz Vosc = 30 mVRMS T = 25 °C 450 400 tp j 50 350 300 40 30 δ = 0.3 250 δ = 0.5 200 150 20 δ=1 10 100 δ = 0.7 50 TC(°C) 0 0 25 Figure 5. 1.0 0 500 T VR(V) 1.E-01 3.0 50 75 VR(V) 0 100 125 150 175 Relative variation of thermal impedance junction to case versus pulse duration 1 10 Figure 6. Zth(j-c)/Rth(j-c) 1.E+03 100 1000 Non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform, per diode) IFSM(A) 0.9 0.8 0.7 1.E+02 TC = 25 °C 0.6 TC = 125 °C 0.5 0.4 1.E+01 0.3 0.2 0.1 Single pulse 0.0 1.E-05 tp(s) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+00 1.E-05 Doc ID 018506 Rev 1 tp(s) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 3/7 Characteristics Figure 7. STPSC2006CW Total capacitive charge versus dIF/dt (typical values, per diode) 18 QC(nC) IF = 10 A VR = 400 V Tj = 150 °C 16 14 12 10 8 6 4 2 dIF/dt(A/µs) 0 0 4/7 50 100 150 200 250 300 350 Doc ID 018506 Rev 1 400 450 500 STPSC2006CW 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: convection (C) ● Recommended torque value: 0.55 to 1.0 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. TO-247 dimensions Dimensions Ref. V V Dia A H L5 L2 L4 F2 F1 L3 L1 F3 V2 D F4 F(x3) M Inches Min. Max. Min. Max. A 4.85 5.16 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F1 3.00 typ. 0.118 typ. F2 2.00 typ. 0.079 typ. F3 1.90 2.40 0.075 0.094 F4 3.00 3.40 0.118 0.134 G L Millimeters 10.90 typ. 0.429 typ. H 15.45 16.03 0.608 0.631 L 19.85 21.09 0.781 0.830 L1 3.70 4.30 0.146 0.169 L2 18.30 19.13 0.720 0.753 L3 14.20 20.30 0.559 0.799 L4 34.05 41.38 1.341 1.629 L5 5.35 6.30 0.211 0.248 M 2.00 3.00 0.079 0.118 E G V 5° typ. 5° typ. V2 60° typ. 60° typ. Dia. Doc ID 018506 Rev 1 3.55 3.65 0.140 0.144 5/7 Ordering information 3 Ordering information Table 7. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPSC2006CW STPSC2006CW TO-247 4.36 g 30 Tube Revision history Table 8. 6/7 STPSC2006CW Document revision history Date Revision 01-Mar-2011 1 Changes First issue. Doc ID 018506 Rev 1 STPSC2006CW Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 018506 Rev 1 7/7
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