WL1835MODCOM8B WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara™ Platform

WL1835MODCOM8B WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara™ Platform

User's Guide

SWRU359D – September 2013 – Revised March 2015

WL1835MODCOM8B WLAN MIMO and Bluetooth

®

Module

Evaluation Board for TI Sitara™ Platform

This user's guide describes how to use the TI WL1835MODCOM8B board to evaluate the performance of the TI WL18MODGB module.

1

2

3

4

5

6

7

Contents

Introduction

1.1

...................................................................................................................

3

Features

..............................................................................................................

4

1.2

Applications

..........................................................................................................

5

1.3

TI Module Key Benefits

Board Pin Assignment

............................................................................................

5

......................................................................................................

6

2.1

Pin Descriptions

.....................................................................................................

7

Electrical Characteristics

Antenna Characteristics

....................................................................................................

9

.....................................................................................................

9

4.1

4.2

VSWR

................................................................................................................

9

Efficiency

...........................................................................................................

10

Antenna Characteristics

5.1

Radio Pattern

...................................................................................................

10

......................................................................................................

10

Circuit Design

6.1

6.2

...............................................................................................................

14

Schematic

..........................................................................................................

14

Bill of Materials (BOM)

............................................................................................

15

Layout Guidelines

7.1

..........................................................................................................

16

Board Layout

.......................................................................................................

16

List of Figures

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

WL1835MODCOM8B Top View

...........................................................................................

3

Board Top View

..............................................................................................................

6

Board Bottom View

..........................................................................................................

6

Antenna VSWR

..............................................................................................................

9

Antenna Efficiency

.........................................................................................................

10

Radio Pattern

...............................................................................................................

10

ANT1 Polarization

..........................................................................................................

11

ANT1 Polarization

..........................................................................................................

11

ANT1 Polarization

..........................................................................................................

12

ANT2 Polarization

..........................................................................................................

12

ANT2 Polarization

..........................................................................................................

13

ANT2 Polarization

..........................................................................................................

13

Schematic

...................................................................................................................

14

Layer 1

.......................................................................................................................

16

Layer 2

.......................................................................................................................

16

Layer 3

.......................................................................................................................

17

Sitara, WiLink8 are trademarks of Texas Instruments.

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

Android is a trademark of Google Inc.

Linux is a registered trademark of Linux Foundation.

Wi-Fi is a registered trademark of Wi-Fi Alliance.

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1

21

22

23

24

17

18

19

20

1

2

3 www.ti.com

Layer 4

.......................................................................................................................

17

Module Layout Guidelines (Top Layer)

..................................................................................

18

Module Layout Guidelines (Bottom Layer)

..............................................................................

18

Trace Design for the PCB Layout

........................................................................................

19

Layer 1 Combined With Layer 2

..........................................................................................

19

Top Layer – Antenna and RF Trace Routing Layout Guidelines

....................................................

20

Bottom Layer – Antenna and RF Trace Routing Layout Guidelines

.................................................

20

MIMO Antenna Spacing

...................................................................................................

21

List of Tables

BOM

..........................................................................................................................

15

Module Layout Guidelines

................................................................................................

17

Antenna and RF Trace Routing Layout Guidelines

....................................................................

19

Warning

The WL1835MODCOM8B board is tested to comply with ETSI/R&TTE over temperatures from –40°C to

85°C.

This board should not be modified to operate in other frequency bands other than what they are designed for.

FCC Licensing Requirements for the Wi-Fi and Bluetooth Radio Module of the EVM:

For evaluation only; not FCC approved for resale. This kit is designed to allow:

1. Product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product

2. Software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required

FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18, or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

Per TI’s Regulatory Compliance Information located in the WL1835ModCOMB8B User’s Guide’s

“Evaluation Board/Kit/Module (EVM) Additional Terms,” this EVM cannot be used for production purposes and is explicitly restricted from end-product introduction.

Use of this EVM requires the developer to provide a minimum distance of at least 20 cm from the antenna to all persons in order to minimize risk of potential radiation hazards.

CAUTION

Do not leave the EVM powered when unattended.

2

WL1835MODCOM8B WLAN MIMO and Bluetooth

®

Module Evaluation Board

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1 Introduction

Introduction

The WL1835MODCOM8B device is a Wi-Fi

®

MIMO, Bluetooth, and Bluetooth Low Energy (BLE) module board with the TI WL18MODGB module. WL18MODGB is built-in TI WL1835 IEEE 802.11 b/g/n and

Bluetooth 4.0 solutions to provide the best Wi-Fi and Bluetooth coexistence interoperability and powersaving technologies from TI.

Figure 1. WL1835MODCOM8B Top View

FCC/IC Regulatory Compliance

FCC Part 15 Class A Compliant

IC ICES-003 Class A Compliant

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Introduction

www.ti.com

(continued)

FCC ID: Z64-WL1835COM

This device complies with part 15 of the

FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation.

IC ID: 451I-WL1835COM

This device complies with Industry

Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including that may cause undesired operation of the device.

1.1

Features

• WLAN, Bluetooth, BLE on a module board

• 100-pin board card

• Dimension 76.0 mm(L) x 31.0 mm(W)

• WLAN 2.4 GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels)

• Support for BLE dual mode

• Seamless integration with TI Sitara and other application processors

• Design for TI AM335X general-purpose EVM

• WLAN and Bluetooth, BLE cores are software and hardware compatible with prior WL127x, WL128x and CC256x offerings, for smooth migration to device.

• Shared HCI transport for Bluetooth and BLE over UART and SDIO for WLAN.

• Wi-Fi / Bluetooth single antenna co-existence

• Built-in chip antenna

• Optional U.FL RF connector for external 2.4-GHz band antenna

• Direct connection to battery using external switching mode power supply supporting 4.8-V to 2.9-V operation

• VIO in the 1.8-V domain

4

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1.2

Applications

• Internet of Things Multimedia

• Home Electronics

• Home Appliances and White Goods

• Industrial and Home Automation

• Smart Gateway and Metering

• Video Conferencing

• Video Camera and Security

Introduction

1.3

TI Module Key Benefits

• Reduces Design Overhead: Single WiLink8™ Module Scales Across Wi-Fi and Bluetooth.

• WLAN High Throughput: 80 Mbps (TCP), 100 Mbps (UDP)

Bluetooth 4.0 + BLE (Smart Ready)

• Wi-Fi-Bluetooth Single Antenna Coexistence

• Low Power (30–50% Less than Previous Generation)

• Available as Easy-to-Use FCC, ETSI, and Telec Certified Module

• Lower Manufacturing Costs, Saving Board Space and Minimizing RF Expertise

• AM335x Linux

® and Android™ Reference Platform Accelerates Customer Development and Time to

Market

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5

Board Pin Assignment

2 Board Pin Assignment

U1

WL18MODGB

Figure 2. Board Top View

www.ti.com

Figure 3. Board Bottom View

6

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2.1

Pin Descriptions

34

35

36

37

38

29

30

31

32

33

24

25

26

27

28

19

20

21

22

23

39

40

41

42

43

44

45

46

47

14

15

16

17

18

9

10

11

12

13

4

5

6

7

8

2

3

No.

1

N.C.

N.C.

N.C.

GND

N.C.

N.C.

N.C.

N.C.

GND

GND

SDIO_CLK

N.C.

GND

N.C.

SDIO_CMD

N.C.

SDIO_D0

N.C.

SDIO_D1

N.C.

SDIO_D2

N.C.

SDIO_D3

N.C.

WLAN_IRQ

N.C.

N.C.

GND

N.C.

Name

SLOW_CLK

GND

GND

WL_EN

VBAT

GND

VBAT

VIO

GND

N.C.

WL_RS232_TX

N.C.

WL_RS232_RX

N.C.

WL_UART_DBG

N.C.

N.C.

GND

Board Pin Assignment

Type Description

I Slow clock input

G

G

Ground

Ground

I

P

G

P

P

G

WLAN Enable

Power supply input

Ground

Power supply input

Power supply input for I/O pin

O

I

Ground

No connection

WLAN tool RS232 output

No connection

WLAN tool RS232 input

O

G

G

I

G

No connection

WLAN Logger output

No connection

No connection

Ground

Ground

WLAN SDIO clock

No connection

Ground

No connection

I/O WLAN SDIO command

No connection

I/O WLAN SDIO data bit 0

No connection

I/O WLAN SDIO data bit 1

No connection

I/O WLAN SDIO data bit 2

No connection

I/O WLAN SDIO data bit 3

No connection

O WLAN SDIO interrupt out

No connection

No connection

G

G

Ground

No connection

No connection

No connection

No connection

Ground

No connection

G

No connection

No connection

No connection

Ground

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Board Pin Assignment

82

83

84

85

86

77

78

79

80

81

72

73

74

75

76

67

68

69

70

71

92

93

94

95

96

87

88

89

90

91

62

63

64

65

66

57

58

59

60

61

52

53

54

55

56

No.

48

49

50

51

N.C.

GND

N.C.

N.C.

N.C.

GND

GPIO9

N.C.

N.C.

N.C.

N.C.

BT_UART_IF_RX

N.C.

BT_UART_IF_CTS

N.C.

BT_UART_IF_RTS

N.C.

BT_FUNC1

N.C.

BT_UART_DEBUG

Name

N.C.

N.C.

N.C.

N.C.

PCM_IF_CLK

N.C.

PCM_IF_FSYNC

N.C.

PCM_IF_DIN

N.C.

PCM_IF_DOUT

N.C.

GND

N.C.

N.C.

GND

GND

N.C.

BT_UART_IF_TX

GND

N.C.

BT_EN

N.C.

N.C.

GND

BT_FUNC2

N.C.

GND

GPIO11 www.ti.com

Type Description

No connection

No connection

No connection

No connection

I/O Bluetooth PCM clock input or output

No connection

I/O Bluetooth PCM frame sync input or output

I

No connection

Bluetooth PCM data input

O

G

G

G

O

No connection

Bluetooth PCM data output

No connection

Ground

No connection

No connection

Ground

Ground

No connection

Bluetooth HCI UART transmit output

I

I

No connection

Bluetooth HCI UART receive input

No connection

Bluetooth HCI UART Clear to Send input

No connection

O

O

Bluetooth HCI UART Request to Send output

No connection

BT_HOST_WAKE_UP Signal to wake up the host from Bluetooth

O

G

No connection

Bluetooth Logger UART output

Ground

I/O General-purpose I/O

No connection

No connection

No connection

G

G

I

No connection

Ground

No connection

No connection

No connection

Ground

No connection

Bluetooth Enable

No connection

No connection

G

I

Ground

BT_WAKE_UP Bluetooth wakeup from host

No connection

G Ground

I/O General-purpose I/O

8

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No.

97

98

99

100

Name

GND

GPIO12

N.C.

GPIO10

Type Description

G Ground

I/O General-purpose I/O

General-purpose I/O

I/O General-purpose I/O

Electrical Characteristics

3 Electrical Characteristics

Refer to the detailed data in the WL18MODGB data sheet ( SWRS152 ) for electrical characteristics.

4 Antenna Characteristics

4.1

VSWR

Figure 4

shows the antenna VSWR.

Figure 4. Antenna VSWR

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Antenna Characteristics

4.2

Efficiency

Figure 5

shows the antenna efficiency.

Figure 5. Antenna Efficiency

5 Antenna Characteristics

5.1

Radio Pattern

Figure 6

shows the radio pattern of the WL1835MODCOM8B device.

www.ti.com

Figure 6. Radio Pattern

10

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5.1.1

ANT1

Figure 7

shows the ANT1 polarization of the WL1835MODCOM8B device.

Antenna Characteristics

Figure 7. ANT1 Polarization

Figure 8. ANT1 Polarization

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Antenna Characteristics

www.ti.com

Figure 9. ANT1 Polarization

5.1.2

ANT2

Figure 10

shows the ANT2 polarization of the WL1835MODCOM8B device.

Figure 10. ANT2 Polarization

12

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Antenna Characteristics

Figure 11. ANT2 Polarization

Figure 12. ANT2 Polarization

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Circuit Design

6 Circuit Design

6.1

Schematic

WLAN_EN_SOC

BT_EN_SOC

WL_UART_DBG

BT_UART_DBG

TP8

R1

R2

R4

1

R3

0R 0402

0R 0402

0R 0402

TP2 1

TP1

0R 0402

1

VBAT_IN

C2

10uF

0603

C3

0.1uF

0402

J3

HEADER 1x2

H-1X2_2MM

BT_HCI_RTS

BT_HCI_CTS

BT_HCI_TX

BT_HCI_RX

R7

R8

R9

R11

0R 0402

0R 0402

0R 0402

0R 0402

BT_AUD_IN

BT_AUD_OUT

BT_AUD_FSYNC

R14

R15

R16

0R 0402

0R 0402

0R 0402

BT_AUD_CLK R18 0R 0402

TP6 1

GPIO11

GPIO9

GPIO10

GPIO12

R21

R22

R24

R26

0R 0402

0R 0402

0R 0402

0R 0402

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

G25

G26

G27

G28

G29

G30

G31

G32

G33

G34

G35

G36

G19

G20

G21

G22

G23

G24

57

58

59

49

50

51

52

GND

BT_HCI_RTS

BT_HCI_CTS

BT_HCI_TX

53

54

55

56

BT_HCI_RX

GND

GND

BT_AUD_IN

BT_AUD_OUT

BT_AUD_FSYNC

GND

60

61

62

63

BT_AUD_CLK

GND

RESERVED3

64

GND

GND

R32

0R

0402

R31

0R

0402

J1

HEADER 1x2

H-1X2_2MM

VIO_IN

C1

1uF

0402

SLOW_CLK

R6

0R

0402

3

OSC1

1V8 / 32.768kHz

OSC-3.2X2.5

1

OUT EN

2

GND VCC

4

VIO_IN

C4

0.1uF

0402

U1

WL1835MODGB

E-13.4X13.3-N100_0.75-TOP

32

2G4_ANT1_WB

GND

31

30

GND

29

GND

28

GND

27

GPIO_1

GPIO_2

26

25

GPIO_4

GND

24

23

GND

22

RESERVED2

21

RESERVED1

20

GND

GND

19

18

2G4_ANT2_W

GND

17

G1

G2

G3

G4

G5

G6

G7

G8

G9

G10

G11

G12

G13

G14

G15

G16

G17

G18

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

R17

R19

0R

0R

0402

0402

2G4_ANT1_WB

1

R12

R13

TP5

0R

0R

1

1

0402

0402

TP3

TP4

These two TPs for test mode when WL_IRQ pull high.

WL_RS232_TX

WL_RS232_RX

BT_FUNC2

BT_FUNC1

2G4_ANT2_W

R23

R25

R27

R29

R30

R28

0R

0R

0R

0R

0R

0R

J4

HEADER 1x2

H-1X2_2MM

Short PIN Header (1-2) for entering test mode.

Open for function mode.

VIO_IN

R20 10k

0402

0402

0402

0402

0402

0402

0402

WLAN_IRQ

SDIO_D3_WL

SDIO_D2_WL

SDIO_D1_WL

SDIO_D0_WL

SDIO_CLK_WL

SDIO_CMD_WL www.ti.com

SLOW_CLK R5

VBAT_IN

WL_RS232_TX

WL_RS232_RX

WL_UART_DBG

BT_EN_SOC

BT_FUNC2

NU_0R

0402

71

73

75

77

79

81

83

57

59

61

63

65

67

69

93

95

97

99

85

87

89

91

43

45

47

49

51

53

55

29

31

33

35

37

39

41

15

17

19

21

23

25

27

5

7

1

3

9

11

13

72

74

76

78

80

82

84

58

60

62

64

66

68

70

94

96

98

100

86

88

90

92

44

46

48

50

52

54

56

30

32

34

36

38

40

42

16

18

20

22

24

26

28

6

8

2

4

10

12

14

R10

J2

NU_100pin Micro Edge MEC6

SD-100P

EDGE CONNECTOR - MALE

WLAN_EN_SOC

BT_HCI_TX

BT_HCI_RX

BT_HCI_CTS

BT_HCI_RTS

BT_FUNC1

BT_UART_DBG

GPIO9

GPIO11

GPIO12

GPIO10

VIO_IN

SDIO_CLK_WL

0R

0402

SDIO_CMD_WL

SDIO_D0_WL

SDIO_D1_WL

SDIO_D2_WL

SDIO_D3_WL

WLAN_IRQ

BT_AUD_CLK

BT_AUD_FSYNC

BT_AUD_IN

BT_AUD_OUT

WL_BG/BT ANT1

2G4_ANT1_WB

C7

NU_10pF

0402

C5

10pF

0402

2

1

3

L1

1.1nH

0402

J5

U.FL-R-SMT(10)

U.FL

C13

8pF

0402

ANT1

ANT016008LCD2442MA1

ANT-N3-1.6X0.8MM-A

A

FEED

2.4G

5G

C9

2pF

0402

C10

NU_0.3pF

0402

WL_BG ANT2

2G4_ANT2_W

C8

NU_10pF

0402

C6

10pF

0402

2

1

3

L2

1.5nH

0402

J6

U.FL-R-SMT(10)

U.FL

C14

4pF

0402

ANT2

ANT016008LCD2442MA1

ANT-N3-1.6X0.8MM-B

A

FEED

2.4G

5G

C11

1.2pF

0402

C12

NU

0402

Figure 13. Schematic

14

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8

9

10

11

12

13

14

15

16

3

4

5

1

2

6

7 www.ti.com

6.2

Bill of Materials (BOM)

Table 1

lists the bill of materials.

Table 1. BOM

TI WL1835 Wi-Fi/Bluetooth Module

XOSC 3225 / 32.768 kHz / 1.8 V / ±50 ppm

ANT / Chip / 2.4 GHz, 5 GHz / Peak Gain >5 dBi

CON Male 1x2 / Pitch

DC JUMPER / PITCH 2.0 mm

Mini RF Header Receptacle

IND 0402 / 1.1 nH / ±0.05 nH / SMD

IND 0402 / 1.5 nH / ±0.05 nH / SMD

CAP 0402 / 1.2 pF / 50 V / C0G / ±0.1 pF

CAP 0402 / 2.2 pF / 50 V / C0G / ±0.1 pF

CAP 0402 / 4 pF / 50 V / C0G / ±0.1 pF

CAP 0402 / 8 pF / 50 V / C0G / ±0.1 pF

CAP 0402 / 10 pF / 50 V / NPO / ±5%

CAP 0402 / 0.1 µF / 6.3 V / X7R / ±10%

CAP 0402 / 1 µF / 6.3 V / X5R / ±10% / HF

CAP 0603 / 10 µF / 6.3 V / X5R / ±20%

WL18MODGB

7XZ3200005

ANT016008LCD2442MA1

P301-SGP-040/028-02

CMJ-20BB

U.FL-R-SMT-1(10)

LQP15MN1N1W02

LQP15MN1N5W02

GJM1555C1H1R2BB01

GJM1555C1H2R2BB01

GJM1555C1H4R0BB01

GJM1555C1H8R0BB01

0402N100J500LT

0402B104K100CT

GRM155R60J105KE19D

C1608X5R0J106M

17

18

RES 0402 / 0R / ±5%

RES 0402 / 10K / ±5%

WR04X000 PTL

WR04X103 JTL

Circuit Design

U1

OSC1

ANT1, ANT2

J1, J3, J4

J1, J3

J5, J6

L1

L2

C11

C9

C14

C13

C7, C8

C3, C4

C1

C2

R1, R2, R3, R4, R5, R6, R7, R8, R9,

R10, R11, R12, R13, R14, R15,

R16, R17, R18, R19, R21, R22,

R23, R24, R25, R26, R27, R28,

R29, R30, R31, R32

R20

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Layout Guidelines

7 Layout Guidelines

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7.1

Board Layout

Figure 14

shows the WL1835MODCOM8B 4-layer board.

Table 2 ,

Figure 15 ,

Figure 16

,

Figure 17 ,

Figure 18 , and Figure 19

show instances of good layout practices.

Figure 14. Layer 1

Figure 15. Layer 2

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Layout Guidelines

Figure 16. Layer 3

Figure 17. Layer 4

Reference

1

2

3

4

5

6

Table 2. Module Layout Guidelines

Guideline Description

The proximity of ground vias must be close to the pad.

Signal traces must not be run underneath the module on the layer where the module is mounted.

Have a complete ground pour in layer 2 for thermal dissipation.

Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.

Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if possible.

Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting layer.

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Layout Guidelines

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Figure 18. Module Layout Guidelines (Top Layer)

Figure 19. Module Layout Guidelines (Bottom Layer)

Figure 20

shows the trace design for the PCB. A 50Ω impedance match on the trace to the antenna should be used. Also, 50Ω traces are recommended for the PCB layout.

18

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Layout Guidelines

Figure 20. Trace Design for the PCB Layout

Figure 21

shows layer 1 with the trace to the antenna over ground layer 2.

Figure 21. Layer 1 Combined With Layer 2

Table 3

,

Figure 22 , and Figure 23

describe instances of good layout practices for the antenna and RF trace routing.

Reference

1

2

3

4

5

6

7

Table 3. Antenna and RF Trace Routing Layout Guidelines

Guideline Description

The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate.

The RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF traces must not have sharp corners.

RF traces must have via stitching on the ground plane beside the RF trace on both sides

RF traces must have constant impedance (microstrip transmission line).

For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be solid.

There must be no traces or ground under the antenna section.

RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered.

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Layout Guidelines

Figure 22. Top Layer – Antenna and RF Trace Routing Layout Guidelines

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Figure 23. Bottom Layer – Antenna and RF Trace Routing Layout Guidelines

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Layout Guidelines

Figure 24

describes the MIMO antenna spacing. The distance of ANT1 and ANT2 must be greater than half of wavelength (62.5 mm at 2.4 GHz).

Figure 24. MIMO Antenna Spacing

The supply routing guidelines are as follows:

• For power supply routing, the power trace for V

BAT must be at least 40-mil wide.

• The 1.8-V trace must be at least 18-mil wide.

• Make V

BAT traces as wide as possible to ensure reduced inductance and trace resistance.

• If possible, shield V

BAT traces with ground above, below, and beside the traces.

The digital signals routing guidelines are as follows:

• SDIO signals traces (CLK, CMD, D0, D1, D2, and D3) should be routed in parallel to each other and as short as possible (less than 12 cm). In addition, every trace length must be the same as the others.

There should be enough space between traces – greater than 1.5 times the trace width or ground – to ensure signal quality, especially for the SDIO_CLK trace. Remember to keep them away from the other digital or analog signal traces. TI recommends adding ground shielding around these buses.

• SDIO Clock, PCM clock… These digital clock signals are a source of noise. Keep the traces of these signals as short as possible. Whenever possible, maintain a clearance around them.

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Revision History

www.ti.com

This user's guide revision history highlights the technical changes made to the SWRU359 device-specific user's guide.

Revision

SWRS359C

SWRS359D

Revision History

Date

January 2014

March 2015

Description / Changes

Changed all references of the module from

WL1835MODGB to WL18MODGB.

In : Changed tested-temperature range from 0 – +70, to

–20 – +70.

Changed supply routing guidelines from 40-mm to 40-mil,

18-mm to 18-mil

Reformatted sections

22

Revision History

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