ESD Suppressor EZAEG EZAEG1A, 2A, 3A ■

ESD Suppressor EZAEG EZAEG1A, 2A, 3A ■
ESD Suppressor
ESD Suppressor
Type:
EZAEG
EZAEG1A, 2A, 3A
■ Features
■ Recommended Applications
● ESD protection of high-speed data lines
● Low capacitance
(1608 size : 0.1 pF, 1005 size : 0.05 pF,
0603 size : 0.04 pF)
● Good ESD suppression characteristics
● Good ESD withstanding
● High-Speed Data Lines
(HDMI, Serial ATA, USB, IEEE1394, Display Port)
● Antenna Circuitry and RF Modules (Cellular Phones)
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
Z
A
E
G
2
A
5
0
A
X
Product Code
ESD Suppressor
Code
1
2
3
Size
Size (inches)
0603 (0201)
1005 (0402)
1608 (0603)
Design Specification
Code Design Specification
A Rated Voltage 30 V
Peak Voltage
Code Peak Voltage
50
500 V
Special Feature
Code Special Feature
A Standard
Code
C
X
V
■ Construction
Packaging Methods
Packaging
Type
Pressed Carrier Taping
EZAEG1A
2 mm Pitch, 15000 pcs.
Pressed Carrier Taping
2 mm Pitch, 10000 pcs. EZAEG2A
Punched Carrier Taping
EZAEG3A
4 mm Pitch, 5000 pcs.
■ Dimensions in mm (not to scale)
L
Protective coating
a
Alumina substrate
Gap electrode
W
t
b
Electrode
(Between)
Type
(inches)
ESD absorbent material
Electrode (Outer)
Dimensions (mm)
L
W
a
b
t
Mass (Weight)
[g/1000 pcs.]
EZAEG1A 0.60±0.03 0.30±0.03 0.15±0.10 0.15±0.10 0.23±0.03
(0201)
0.12
EZAEG2A 1.00 ±0.10 0.50 ±0.05 0.20 ±0.10 0.25 ±0.10 0.38 ±0.05
(0402)
0.6
EZAEG3A 1.60 ±0.15 0.80 ±0.15 0.30 ±0.20 0.30 ±0.20 0.50 ±0.10
(0603)
2.2
■ Circuit Configuration
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2009
ESD Suppressor
■ Ratings
Type
(inches)
EZAEG1A (0201)
Capacitance (1)
EZAEG2A (0402)
0.05+0.05
–0.04 pF
EZAEG3A (0603)
+0.10
–0.08
Peak Voltage (2)
Clamping
Voltage (3)
Rated Voltage
Category Temperature Range
(Operating Temperature Range)
500 V max.
(350 V typ.)
100 V max.
30 V max
–55 to +125 °C
0.04+0.04
–0.03 pF
0.10
pF
(1) Capacitance = The capacitance value shall be measured under the conditions specified below.
Frequency : 1 MHz±10 %, Voltage : 1 Vrms±0.2 Vrms, Temperature : 25 °C±2 °C
(2) Peak Voltage = The peak voltage value shall be measured under the following conditions. ESD test conditions : IEC61000-4-2, 8 kV contact discharge
(3) Clamping Voltage = The clamping voltage value shall be measured at 30 ns after initiation of pulse and measured under the conditions specified below.
ESD test conditions : IEC61000-4-2, 8 kV contact discharge
■ ESD Suppression Voltage Waveform
5
400
0
350
300
-5
Volts (V)
Attenuation (dB)
■ Frequency Characteristics
-10
-15
-20
250
200
150
100
50
-25
-30
0
1
10
100
1000
Frequency(MHz)
-50
-20 0
10000
■ Typical Circuits Requiring Protection
● HDMI circuit
20 40 60 80 100 120 140 160 180 200
Times (nSecs)
● Antenna circuit
Antenna
HDMI Controller
Ga/As-SW
or
ASM
HDMI
Rx/Tx
■ Packaging Methods (Taping)
● Standard Quantity
Type
EZAEG1A
EZAEG2A
EZAEG3A
Kind of Taping
Pitch (P1)
Pressed Carrier Taping
2 mm
Punched Carrier Taping
4 mm
Quantity
15000 pcs./reel
10000 pcs./reel
5000 pcs./reel
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2009
ESD Suppressor
● Carrier Taping
(Unit : mm)
Pressed Carrier Punched Carrier
P1
P0
P2
B
W
F
E
φD0
T
Type
EZAEG1A
EZAEG2A
EZAEG3A
A
0.38±0.05
0.70±0.05
1.10±0.10
B
0.68±0.05
1.20±0.05
1.90±0.10
P1 (2 mm Pitch)
A
T
W
F
8.00±0.20
3.50±0.05
E
1.75±0.10
P1
2.00
P2
P0
φD0
2.00±0.05
4.00±0.10
1.50+0.10
–0
T
0.42±0.05
0.60±0.05
0.70±0.05
±0.10
4.00±0.10
● Taping Reel
(Unit : mm)
Type
EZAEG1A
EZAEG2A
EZAEG3A
T
φB
180.0+0
–3.0 60 min.
φC
W
T
13.0±1.0
9.0±1.0
11.4±1.0
φB
φC
φA
φA
W
■ Recommended Land Pattern
In case of flow soldering, the land width must be smaller than the ESD Suppressor width to properly control the
solder amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of ESD Suppressor. In
case of reflow soldering, solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times
ESD Suppressor width (W).
c
ESD Suppressor
a
b
Type
(inches)
EZAEG1A
(0201)
EZAEG2A
(0402)
EZAEG3A
(0603)
a
Dimensions (mm)
b
c
0.3 to 0.4
0.8 to 0.9
0.25 to 0.35
0.5 to 0.6
1.4 to 1.6
0.4 to 0.6
0.7 to 0.9
2.0 to 2.2
0.8 to 1.0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2009
ESD Suppressor
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Temperature
Peak
Preheating
Heating
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
150 °C to 180 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog.
1. If a large electric surge (especially, one which is larger than an ESD) is expected to be applied, be sure to test and
confirm proper ESD Suppressor (hereafter called the suppressors) functionality when mounted on your board. When
the applied load is more than the allowable rated power under normal load conditions, it may impair performance and/or
the reliability of the suppressors. Never exceed the rated power. If the product will be used under these special conditions,
be sure to contact a Panasonic representative first.
2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the suppressors' performance
and/or reliability.
3. When soldering with a soldering iron, never touch the suppressors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
4. Avoid excessive bending of printed circuit boards in order to protect the suppressors from abnormal stress.
5. Do not immerse the suppressors in solvent for a long time. Before using solvent, carefully check the effects of immersion.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2009
Safety Precautions
(Common precautions for ESD Suppressors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general electronic
equipment (e.g. AV equipment, home electric appliances, offi ce equipment, information and communication
equipment)
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
5. In an environment where these products cause dew condensation
6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or
inflammables, such as vinyl-coated wires, near these products .
• Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their
electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)
may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Dec. 2007
– ER3 –
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