STM32F072x8 STM32F072xB

STM32F072x8 STM32F072xB
STM32F072x8 STM32F072xB
ARM®-based 32-bit MCU, up to 128 KB Flash, crystal-less USB
FS 2.0, CAN, 12 timers, ADC, DAC & comm. interfaces, 2.0 - 3.6 V
Datasheet - production data
Features
)%*$
®
®
 Core: ARM 32-bit Cortex -M0 CPU,
frequency up to 48 MHz
LQFP100 14x14 mm UFQFPN48
LQFP64 10x10 mm
7x7 mm
LQFP48 7x7 mm
 Memories
– 64 to 128 Kbytes of Flash memory
– 16 Kbytes of SRAM with HW parity
UFBGA100
WLCSP49
7x7 mm
3.277x3.109 mm
UFBGA64
5x5 mm
 Calendar RTC with alarm and periodic wakeup
from Stop/Standby
 CRC calculation unit
 Reset and power management
– Digital and I/O supply: VDD = 2.0 V to 3.6 V
– Analog supply: VDDA = VDD to 3.6 V
– Selected I/Os: VDDIO2 = 1.65 V to 3.6 V
– Power-on/Power down reset (POR/PDR)
– Programmable voltage detector (PVD)
– Low power modes: Sleep, Stop, Standby
– VBAT supply for RTC and backup registers
 Clock management
– 4 to 32 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 8 MHz RC with x6 PLL option
– Internal 40 kHz RC oscillator
– Internal 48 MHz oscillator with automatic
trimming based on ext. synchronization
 Up to 87 fast I/Os
– All mappable on external interrupt vectors
– Up to 68 I/Os with 5V tolerant capability
and 19 with independent supply VDDIO2
 Seven-channel DMA controller
 12 timers
– One 16-bit advanced-control timer for 
six-channel PWM output
– One 32-bit and seven 16-bit timers, with up
to four IC/OC, OCN, usable for IR control
decoding or DAC control
– Independent and system watchdog timers
– SysTick timer
 Communication interfaces
– Two I2C interfaces supporting Fast Mode
Plus (1 Mbit/s) with 20 mA current sink; one
supporting SMBus/PMBus and wakeup
– Four USARTs supporting master
synchronous SPI and modem control; two
with ISO7816 interface, LIN, IrDA, auto
baud rate detection and wakeup feature
– Two SPIs (18 Mbit/s) with 4 to 16
programmable bit frames, and with I2S
interface multiplexed
– CAN interface
– USB 2.0 full-speed interface, able to run
from internal 48 MHz oscillator and with
BCD and LPM support
 One 12-bit, 1.0 µs ADC (up to 16 channels)
– Conversion range: 0 to 3.6 V
– Separate analog supply: 2.4 V to 3.6 V
 HDMI CEC wakeup on header reception
 One 12-bit D/A converter (with 2 channels)
 96-bit unique ID
 Two fast low-power analog comparators with
programmable input and output
 Up to 24 capacitive sensing channels for
touchkey, linear and rotary touch sensors
 Serial wire debug (SWD)
®
 All packages ECOPACK 2
Table 1. Device summary
Reference
STM32F072xx
September 2015
This is information on a product in full production.
DocID025004 Rev 3
Part number
STM32F072C8, STM32F072R8, STM32F072V8,
STM32F072CB, STM32F072RB, STM32F072VB
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Contents
STM32F072x8 STM32F072xB
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3
Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1
ARM®-Cortex®-M0 core with embedded Flash and SRAM . . . . . . . . . . . 13
3.2
Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.3
Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.4
Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 14
3.5
Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5.2
Power supply supervisors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5.3
Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.5.4
Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.6
Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.7
General-purpose inputs/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.8
Direct memory access controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.9
Interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.10
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3.5.1
3.9.1
Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 18
3.9.2
Extended interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . 18
Analog to digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.10.1
Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.10.2
Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.10.3
VBAT battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.11
Digital-to-analog converter (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.12
Comparators (COMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.13
Touch sensing controller (TSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.14
Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.14.1
Advanced-control timer (TIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.14.2
General-purpose timers (TIM2..3, TIM14..17) . . . . . . . . . . . . . . . . . . . . 23
3.14.3
Basic timers TIM6 and TIM7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.14.4
Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.14.5
System window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
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3.14.6
Contents
SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.15
Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 24
3.16
Inter-integrated circuit interfaces (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.17
Universal synchronous/asynchronous receiver transmitters (USART) . . 26
3.18
Serial peripheral interface (SPI)/Inter-integrated sound interfaces (I2S) . 28
3.19
High-definition multimedia interface (HDMI) - consumer
electronics control (CEC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.20
Controller area network (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.21
Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.22
Clock recovery system (CRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.23
Serial wire debug port (SW-DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4
Pinouts and pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5
Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1
Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.1
Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.2
Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.3
Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.4
Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.5
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.1.6
Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
6.1.7
Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.3
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6.3.1
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6.3.2
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 56
6.3.3
Embedded reset and power control block characteristics . . . . . . . . . . . 56
6.3.4
Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
6.3.5
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
6.3.6
Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
6.3.7
External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
6.3.8
Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
6.3.9
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
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6.3.10
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.3.11
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.3.12
Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
6.3.13
I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
6.3.14
I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
6.3.15
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
6.3.16
12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
6.3.17
DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
6.3.18
Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
6.3.19
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
6.3.20
VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
6.3.21
Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
6.3.22
Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
7.1
UFBGA100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
7.2
LQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
7.3
UFBGA64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
7.4
LQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115
7.5
WLCSP49 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
7.6
LQFP48 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
7.7
UFQFPN48 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
7.8
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
7.8.1
Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
7.8.2
Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . 128
8
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
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List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
STM32F072x8/xB family device features and peripheral counts . . . . . . . . . . . . . . . . . . . . 11
Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Internal voltage reference calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Capacitive sensing GPIOs available on STM32F072x8/xB devices. . . . . . . . . . . . . . . . . . 21
Number of capacitive sensing channels available on STM32F072x8/xB
devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Comparison of I2C analog and digital filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
STM32F072x8/xB I2C implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
STM32F072x8/xB USART implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
STM32F072x8/xB SPI/I2S implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
STM32F072x8/xB pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Alternate functions selected through GPIOA_AFR registers for port A . . . . . . . . . . . . . . . 43
Alternate functions selected through GPIOB_AFR registers for port B . . . . . . . . . . . . . . . 44
Alternate functions selected through GPIOC_AFR registers for port C . . . . . . . . . . . . . . . 45
Alternate functions selected through GPIOD_AFR registers for port D . . . . . . . . . . . . . . . 45
Alternate functions selected through GPIOE_AFR registers for port E . . . . . . . . . . . . . . . 46
Alternate functions available on port F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
STM32F072x8/xB peripheral register boundary addresses . . . . . . . . . . . . . . . . . . . . . . . . 48
Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 56
Programmable voltage detector characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Typical and maximum current consumption from VDD supply at VDD = 3.6 V . . . . . . . . . . 58
Typical and maximum current consumption from the VDDA supply . . . . . . . . . . . . . . . . . 60
Typical and maximum consumption in Stop and Standby modes . . . . . . . . . . . . . . . . . . . 61
Typical and maximum current consumption from the VBAT supply. . . . . . . . . . . . . . . . . . . 62
Typical current consumption, code executing from Flash, running from HSE
8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Switching output I/O current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
HSI14 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
HSI48 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
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List of tables
Table 47.
Table 48.
Table 49.
Table 50.
Table 51.
Table 52.
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
Table 78.
Table 79.
Table 80.
Table 81.
Table 82.
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Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
RAIN max for fADC = 14 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
IWDG min/max timeout period at 40 kHz (LSI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
WWDG min/max timeout value at 48 MHz (PCLK). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
I2S characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
USB electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array 
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
UFBGA100 recommended PCB design rules (0.5 mm pitch BGA) . . . . . . . . . . . . . . . . . 107
LQPF100 - 100-pin, 14 x 14 mm low-profile quad flat package 
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid 
array package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
UFBGA64 recommended PCB design rules (0.5 mm pitch BGA) . . . . . . . . . . . . . . . . . . 113
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat 
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
WLCSP49 - 49-ball, 3.277 x 3.109 mm, 0.4 mm pitch wafer level chip scale 
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package 
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat 
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
DocID025004 Rev 3
STM32F072x8 STM32F072xB
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
UFBGA100 package ballout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
LQFP100 100-pin package pinout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
UFBGA64 package ball-out (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
LQFP64 64-pin package pinout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
LQFP48 48-pin package pinout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
UFQFPN48 48-pin package pinout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
WLCSP49 49-pin package ballout (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
STM32F072x8/xB memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
HSI oscillator accuracy characterization results for soldered parts . . . . . . . . . . . . . . . . . . 75
HSI14 oscillator accuracy characterization results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
HSI48 oscillator accuracy characterization results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
TC and TTa I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Five volt tolerant (FT and FTf) I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
12-bit buffered / non-buffered DAC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Maximum VREFINT scaler startup time from power down . . . . . . . . . . . . . . . . . . . . . . . . . . 96
SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
SPI timing diagram - slave mode and CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
SPI timing diagram - master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
I2S slave timing diagram (Philips protocol). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
I2S master timing diagram (Philips protocol) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
UFBGA100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat package outline . . . . . . . . . . . . . . 109
LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat 
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
LQFP100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid
array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid 
array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
UFBGA64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
DocID025004 Rev 3
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8
List of figures
Figure 44.
Figure 45.
Figure 46.
Figure 47.
Figure 48.
Figure 49.
Figure 50.
Figure 51.
Figure 52.
Figure 53.
Figure 54.
Figure 55.
8/135
STM32F072x8 STM32F072xB
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . 115
LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package 
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
LQFP64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
WLCSP49 - 49-ball, 3.277 x 3.109 mm, 0.4 mm pitch wafer level chip scale 
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
WLCSP49 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 121
LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package 
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
LQFP48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat 
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat 
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
UFQFPN48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
LQFP64 PD max vs. TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
DocID025004 Rev 3
STM32F072x8 STM32F072xB
1
Introduction
Introduction
This datasheet provides the ordering information and mechanical device characteristics of
the STM32F072x8/xB microcontrollers.
This document should be read in conjunction with the STM32F0xxxx reference manual
(RM0091). The reference manual is available from the STMicroelectronics website
www.st.com.
For information on the ARM® Cortex®-M0 core, please refer to the Cortex®-M0 Technical
Reference Manual, available from the www.arm.com website.
DocID025004 Rev 3
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29
Description
2
STM32F072x8 STM32F072xB
Description
The STM32F072x8/xB microcontrollers incorporate the high-performance ARM® Cortex®M0 32-bit RISC core operating at a 48 MHz frequency, high-speed embedded memories (up
to 128 Kbytes of Flash memory and 16 Kbytes of SRAM), and an extensive range of
enhanced peripherals and I/Os. All devices offer standard communication interfaces (two
I2Cs, two SPI/I2S, one HDMI CEC and four USARTs), one USB Full speed device (crystalless), one CAN, one 12-bit ADC, one 12-bit DAC with two channels, seven 16-bit timers,
one 32-bit timer and an advanced-control PWM timer.
The STM32F072x8/xB microcontrollers operate in the -40 to +85 °C and -40 to +105 °C
temperature ranges, from a 2.0 to 3.6 V power supply. A comprehensive set of powersaving modes allows the design of low-power applications.
The STM32F072x8/xB microcontrollers include devices in seven different packages ranging
from 48 pins to 100 pins with a die form also available upon request. Depending on the
device chosen, different sets of peripherals are included. The description below provides an
overview of the complete range of STM32F072x8/xB peripherals proposed.
These features make the STM32F072x8/xB microcontrollers suitable for a wide range of
applications such as application control and user interfaces, hand-held equipment, A/V
receivers and digital TV, PC peripherals, gaming and GPS platforms, industrial applications,
PLCs, inverters, printers, scanners, alarm systems, video intercoms, and HVACs.
10/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Description
Table 2. STM32F072x8/xB family device features and peripheral counts
Peripheral
Flash (Kbyte)
STM32F072Cx
64
128
STM32F072Rx
64
128
SRAM (Kbyte)
Timers
Advanced
control
1 (16-bit)
General
purpose
5 (16-bit)
1 (32-bit)
Basic
2 (16-bit)
128
2 [2]
2C
I
2
USART
4
CAN
1
USB
1
CEC
1
12-bit ADC 
(number of channels)
64
16
SPI [I2S](1)
Comm.
interfaces
STM32F072Vx
1
(10 ext. + 3 int.)
1
(16 ext. + 3 int.)
12-bit DAC
(number of channels)
1
(2)
Analog comparator
2
GPIOs
37
51
87
Capacitive sensing
channels
17
18
24
Max. CPU frequency
48 MHz
Operating voltage
Operating temperature
Packages
2.0 to 3.6 V
Ambient operating temperature: -40°C to 85°C / -40°C to 105°C
Junction temperature: -40°C to 105°C / -40°C to 125°C
LQFP48
UFQFPN48
WLCSP49
LQFP64
UFBGA64
LQFP100
UFBGA100
1. The SPI interface can be used either in SPI mode or in I2S audio mode.
DocID025004 Rev 3
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29
Description
STM32F072x8 STM32F072xB
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DocID025004 Rev 3
06Y9
STM32F072x8 STM32F072xB
Functional overview
3
Functional overview
3.1
ARM®-Cortex®-M0 core with embedded Flash and SRAM
The ARM® Cortex®-M0 processor is the latest generation of ARM processors for embedded
systems. It has been developed to provide a low-cost platform that meets the needs of MCU
implementation, with a reduced pin count and low-power consumption, while delivering
outstanding computational performance and an advanced system response to interrupts.
The ARM® Cortex®-M0 32-bit RISC processor features exceptional code-efficiency,
delivering the high-performance expected from an ARM core in the memory size usually
associated with 8- and 16-bit devices.
The STM32F0xx family has an embedded ARM core and is therefore compatible with all
ARM tools and software.
Figure 1 shows the general block diagram of the device family.
3.2
Memories
The device has the following features:

16 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait
states and featuring embedded parity checking with exception generation for fail-critical
applications.

The non-volatile memory is divided into two arrays:
–
64 to 128 Kbytes of embedded Flash memory for programs and data
–
Option bytes
The option bytes are used to write-protect the memory (with 4 KB granularity) and/or
readout-protect the whole memory with the following options:
–
Level 0: no readout protection
–
Level 1: memory readout protection, the Flash memory cannot be read from or
written to if either debug features are connected or boot in RAM is selected
®
Level 2: chip readout protection, debug features (Cortex -M0 serial wire) and
boot in RAM selection disabled
–
3.3
Boot modes
At startup, the boot pin and boot selector option bit are used to select one of the three boot
options:

Boot from User Flash

Boot from System Memory

Boot from embedded SRAM
The boot loader is located in System Memory. It is used to reprogram the Flash memory by
using USART on pins PA14/PA15, or PA9/PA10 or I2C on pins PB6/PB7 or through the USB
DFU interface.
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Functional overview
3.4
STM32F072x8 STM32F072xB
Cyclic redundancy check calculation unit (CRC)
The CRC (cyclic redundancy check) calculation unit is used to get a CRC code using a
configurable generator polynomial value and size.
Among other applications, CRC-based techniques are used to verify data transmission or
storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of
verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of
the software during runtime, to be compared with a reference signature generated at linktime and stored at a given memory location.
3.5
Power management
3.5.1
Power supply schemes

VDD = VDDIO1 = 2.0 to 3.6 V: external power supply for I/Os (VDDIO1) and the internal
regulator. It is provided externally through VDD pins.

VDDA = from VDD to 3.6 V: external analog power supply for ADC, DAC, Reset blocks,
RCs and PLL (minimum voltage to be applied to VDDA is 2.4 V when the ADC or DAC
are used). It is provided externally through VDDA pin. The VDDA voltage level must be
always greater or equal to the VDD voltage level and must be established first.

VDDIO2 = 1.65 to 3.6 V: external power supply for marked I/Os.VDDIO2 is provided
externally through the VDDIO2 pin. The VDDIO2 voltage level is completely independent
from VDD or VDDA, but it must not be provided without a valid supply on VDD. The
VDDIO2 supply is monitored and compared with the internal reference voltage
(VREFINT). When the VDDIO2 is below this threshold, all the I/Os supplied from this rail
are disabled by hardware. The output of this comparator is connected to EXTI line 31
and it can be used to generate an interrupt. Refer to the pinout diagrams or tables for
concerned I/Os list.

VBAT = 1.65 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and
backup registers (through power switch) when VDD is not present.
For more details on how to connect power pins, refer to Figure 13: Power supply scheme.
3.5.2
Power supply supervisors
The device has integrated power-on reset (POR) and power-down reset (PDR) circuits.
They are always active, and ensure proper operation above a threshold of 2 V. The device
remains in reset mode when the monitored supply voltage is below a specified threshold,
VPOR/PDR, without the need for an external reset circuit.

The POR monitors only the VDD supply voltage. During the startup phase it is required
that VDDA should arrive first and be greater than or equal to VDD.

The PDR monitors both the VDD and VDDA supply voltages, however the VDDA power
supply supervisor can be disabled (by programming a dedicated Option bit) to reduce
the power consumption if the application design ensures that VDDA is higher than or
equal to VDD.
The device features an embedded programmable voltage detector (PVD) that monitors the
VDD power supply and compares it to the VPVD threshold. An interrupt can be generated
when VDD drops below the VPVD threshold and/or when VDD is higher than the VPVD
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Functional overview
threshold. The interrupt service routine can then generate a warning message and/or put
the MCU into a safe state. The PVD is enabled by software.
3.5.3
Voltage regulator
The regulator has two operating modes and it is always enabled after reset.

Main (MR) is used in normal operating mode (Run).

Low power (LPR) can be used in Stop mode where the power demand is reduced.
In Standby mode, it is put in power down mode. In this mode, the regulator output is in high
impedance and the kernel circuitry is powered down, inducing zero consumption (but the
contents of the registers and SRAM are lost).
3.5.4
Low-power modes
The STM32F072x8/xB microcontrollers support three low-power modes to achieve the best
compromise between low power consumption, short startup time and available wakeup
sources:

Sleep mode
In Sleep mode, only the CPU is stopped. All peripherals continue to operate and can
wake up the CPU when an interrupt/event occurs.

Stop mode
Stop mode achieves very low power consumption while retaining the content of SRAM
and registers. All clocks in the 1.8 V domain are stopped, the PLL, the HSI RC and the
HSE crystal oscillators are disabled. The voltage regulator can also be put either in
normal or in low power mode.
The device can be woken up from Stop mode by any of the EXTI lines. The EXTI line
source can be one of the 16 external lines, the PVD output, RTC, I2C1, USART1,
USART2, USB, COMPx, VDDIO2 supply comparator or the CEC.
The I2C1, USART1, USART2 and CEC can be configured to enable the HSI RC
oscillator for processing incoming data. If this is used when the voltage regulator is put
in low power mode, the regulator is first switched to normal mode before the clock is
provided to the given peripheral.

Standby mode
The Standby mode is used to achieve the lowest power consumption. The internal
voltage regulator is switched off so that the entire 1.8 V domain is powered off. The
PLL, the HSI RC and the HSE crystal oscillators are also switched off. After entering
Standby mode, SRAM and register contents are lost except for registers in the RTC
domain and Standby circuitry.
The device exits Standby mode when an external reset (NRST pin), an IWDG reset, a
rising edge on the WKUP pins, or an RTC event occurs.
Note:
The RTC, the IWDG, and the corresponding clock sources are not stopped by entering Stop
or Standby mode.
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Functional overview
3.6
STM32F072x8 STM32F072xB
Clocks and startup
System clock selection is performed on startup, however the internal RC 8 MHz oscillator is
selected as default CPU clock on reset. An external 4-32 MHz clock can be selected, in
which case it is monitored for failure. If failure is detected, the system automatically switches
back to the internal RC oscillator. A software interrupt is generated if enabled. Similarly, full
interrupt management of the PLL clock entry is available when necessary (for example on
failure of an indirectly used external crystal, resonator or oscillator).
Several prescalers allow the application to configure the frequency of the AHB and the APB
domains. The maximum frequency of the AHB and the APB domains is 48 MHz.
Additionally, also the internal RC 48 MHz oscillator can be selected for system clock or PLL
input source. This oscillator can be automatically fine-trimmed by the means of the CRS
peripheral using the external synchronization.
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Functional overview
Figure 2. Clock tree
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General-purpose inputs/outputs (GPIOs)
Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as
input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the
GPIO pins are shared with digital or analog alternate functions.
The I/O configuration can be locked if needed following a specific sequence in order to
avoid spurious writing to the I/Os registers.
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Functional overview
3.8
STM32F072x8 STM32F072xB
Direct memory access controller (DMA)
The 7-channel general-purpose DMAs manage memory-to-memory, peripheral-to-memory
and memory-to-peripheral transfers.
The DMA supports circular buffer management, removing the need for user code
intervention when the controller reaches the end of the buffer.
Each channel is connected to dedicated hardware DMA requests, with support for software
trigger on each channel. Configuration is made by software and transfer sizes between
source and destination are independent.
DMA can be used with the main peripherals: SPI, I2S, I2C, USART, all TIMx timers (except
TIM14), DAC and ADC.
3.9
Interrupts and events
3.9.1
Nested vectored interrupt controller (NVIC)
The STM32F0xx family embeds a nested vectored interrupt controller able to handle up to
®
32 maskable interrupt channels (not including the 16 interrupt lines of Cortex -M0) and 4
priority levels.

Closely coupled NVIC gives low latency interrupt processing

Interrupt entry vector table address passed directly to the core

Closely coupled NVIC core interface

Allows early processing of interrupts

Processing of late arriving higher priority interrupts

Support for tail-chaining

Processor state automatically saved

Interrupt entry restored on interrupt exit with no instruction overhead
This hardware block provides flexible interrupt management features with minimal interrupt
latency.
3.9.2
Extended interrupt/event controller (EXTI)
The extended interrupt/event controller consists of 32 edge detector lines used to generate
interrupt/event requests and wake-up the system. Each line can be independently
configured to select the trigger event (rising edge, falling edge, both) and can be masked
independently. A pending register maintains the status of the interrupt requests. The EXTI
can detect an external line with a pulse width shorter than the internal clock period. Up to 87
GPIOs can be connected to the 16 external interrupt lines.
3.10
Analog to digital converter (ADC)
The 12-bit analog to digital converter has up to 16 external and 3 internal (temperature
sensor, voltage reference, VBAT voltage measurement) channels and performs conversions
in single-shot or scan modes. In scan mode, automatic conversion is performed on a
selected group of analog inputs.
The ADC can be served by the DMA controller.
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Functional overview
An analog watchdog feature allows very precise monitoring of the converted voltage of one,
some or all selected channels. An interrupt is generated when the converted voltage is
outside the programmed thresholds.
3.10.1
Temperature sensor
The temperature sensor (TS) generates a voltage VSENSE that varies linearly with
temperature.
The temperature sensor is internally connected to the ADC_IN16 input channel which is
used to convert the sensor output voltage into a digital value.
The sensor provides good linearity but it has to be calibrated to obtain good overall
accuracy of the temperature measurement. As the offset of the temperature sensor varies
from chip to chip due to process variation, the uncalibrated internal temperature sensor is
suitable for applications that detect temperature changes only.
To improve the accuracy of the temperature sensor measurement, each device is
individually factory-calibrated by ST. The temperature sensor factory calibration data are
stored by ST in the system memory area, accessible in read-only mode.
Table 3. Temperature sensor calibration values
Calibration value name
3.10.2
Description
Memory address
TS_CAL1
TS ADC raw data acquired at a
temperature of 30 °C (5 °C),
VDDA= 3.3 V (10 mV)
TS_CAL2
TS ADC raw data acquired at a
temperature of 110 °C (5 °C), 0x1FFF F7C2 - 0x1FFF F7C3
VDDA= 3.3 V (10 mV)
0x1FFF F7B8 - 0x1FFF F7B9
Internal voltage reference (VREFINT)
The internal voltage reference (VREFINT) provides a stable (bandgap) voltage output for the
ADC and comparators. VREFINT is internally connected to the ADC_IN17 input channel. The
precise voltage of VREFINT is individually measured for each part by ST during production
test and stored in the system memory area. It is accessible in read-only mode.
Table 4. Internal voltage reference calibration values
Calibration value name
VREFINT_CAL
3.10.3
Description
Memory address
Raw data acquired at a
temperature of 30 °C (5 °C), 0x1FFF F7BA - 0x1FFF F7BB
VDDA= 3.3 V (10 mV)
VBAT battery voltage monitoring
This embedded hardware feature allows the application to measure the VBAT battery voltage
using the internal ADC channel ADC_IN18. As the VBAT voltage may be higher than VDDA,
and thus outside the ADC input range, the VBAT pin is internally connected to a bridge
divider by 2. As a consequence, the converted digital value is half the VBAT voltage.
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Functional overview
3.11
STM32F072x8 STM32F072xB
Digital-to-analog converter (DAC)
The two 12-bit buffered DAC channels can be used to convert digital signals into analog
voltage signal outputs. The chosen design structure is composed of integrated resistor
strings and an amplifier in non-inverting configuration.
This digital Interface supports the following features:

8-bit or 12-bit monotonic output

Left or right data alignment in 12-bit mode

Synchronized update capability

Noise-wave generation

Triangular-wave generation

Dual DAC channel independent or simultaneous conversions

DMA capability for each channel

External triggers for conversion
Six DAC trigger inputs are used in the device. The DAC is triggered through the timer trigger
outputs and the DAC interface is generating its own DMA requests.
3.12
Comparators (COMP)
The device embeds two fast rail-to-rail low-power comparators with programmable
reference voltage (internal or external), hysteresis and speed (low speed for low power) and
with selectable output polarity.
The reference voltage can be one of the following:

External I/O

DAC output pins

Internal reference voltage or submultiple (1/4, 1/2, 3/4).Refer to Table 28: Embedded
internal reference voltage for the value and precision of the internal reference voltage.
Both comparators can wake up from STOP mode, generate interrupts and breaks for the
timers and can be also combined into a window comparator.
3.13
Touch sensing controller (TSC)
The STM32F072x8/xB devices provide a simple solution for adding capacitive sensing
functionality to any application. These devices offer up to 24 capacitive sensing channels
distributed over 8 analog I/O groups.
Capacitive sensing technology is able to detect the presence of a finger near a sensor which
is protected from direct touch by a dielectric (glass, plastic...). The capacitive variation
introduced by the finger (or any conductive object) is measured using a proven
implementation based on a surface charge transfer acquisition principle. It consists of
charging the sensor capacitance and then transferring a part of the accumulated charges
into a sampling capacitor until the voltage across this capacitor has reached a specific
threshold. To limit the CPU bandwidth usage, this acquisition is directly managed by the
hardware touch sensing controller and only requires few external components to operate.
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Functional overview
The touch sensing controller is fully supported by the STMTouch touch sensing firmware
library, which is free to use and allows touch sensing functionality to be implemented reliably
in the end application.
Table 5. Capacitive sensing GPIOs available on STM32F072x8/xB devices
Group
1
2
3
4
Capacitive sensing
signal name
Pin
name
TSC_G1_IO1
PA0
TSC_G1_IO2
PA1
TSC_G1_IO3
PA2
TSC_G1_IO4
Capacitive sensing
signal name
Pin
name
TSC_G5_IO1
PB3
TSC_G5_IO2
PB4
TSC_G5_IO3
PB6
PA3
TSC_G5_IO4
PB7
TSC_G2_IO1
PA4
TSC_G6_IO1
PB11
TSC_G2_IO2
PA5
TSC_G6_IO2
PB12
TSC_G2_IO3
PA6
TSC_G6_IO3
PB13
TSC_G2_IO4
PA7
TSC_G6_IO4
PB14
TSC_G3_IO1
PC5
TSC_G7_IO1
PE2
TSC_G3_IO2
PB0
TSC_G7_IO2
PE3
TSC_G3_IO3
PB1
TSC_G7_IO3
PE4
TSC_G3_IO4
PB2
TSC_G7_IO4
PE5
TSC_G4_IO1
PA9
TSC_G8_IO1
PD12
TSC_G4_IO2
PA10
TSC_G8_IO2
PD13
TSC_G4_IO3
PA11
TSC_G8_IO3
PD14
TSC_G4_IO4
PA12
TSC_G8_IO4
PD15
Group
5
6
7
8
Table 6. Number of capacitive sensing channels available on STM32F072x8/xB
devices
Number of capacitive sensing channels
Analog I/O group
STM32F072Vx
STM32F072Rx
STM32F072Cx
G1
3
3
3
G2
3
3
3
G3
3
3
2
G4
3
3
3
G5
3
3
3
G6
3
3
3
G7
3
0
0
G8
3
0
0
Number of capacitive
sensing channels
24
18
17
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Functional overview
3.14
STM32F072x8 STM32F072xB
Timers and watchdogs
The STM32F072x8/xB devices include up to six general-purpose timers, two basic timers
and an advanced control timer.
Table 7 compares the features of the different timers.
Table 7. Timer feature comparison
Timer
type
Timer
Counter
resolution
Counter
type
Prescaler
factor
DMA request
generation
Advanced
control
TIM1
16-bit
Up,
down,
up/down
Any integer
between 1
and 65536
Yes
4
3
TIM2
32-bit
Up,
down,
up/down
Any integer
between 1
and 65536
Yes
4
No
TIM3
16-bit
Up,
down,
up/down
Any integer
between 1
and 65536
Yes
4
No
TIM14
16-bit
Up
Any integer
between 1
and 65536
No
1
No
TIM15
16-bit
Up
Any integer
between 1
and 65536
Yes
2
1
TIM16,
TIM17
16-bit
Up
Any integer
between 1
and 65536
Yes
1
1
TIM6,
TIM7
16-bit
Up
Any integer
between 1
and 65536
Yes
No
No
General
purpose
Basic
3.14.1
Capture/compare Complementary
channels
outputs
Advanced-control timer (TIM1)
The advanced-control timer (TIM1) can be seen as a three-phase PWM multiplexed on six
channels. It has complementary PWM outputs with programmable inserted dead times. It
can also be seen as a complete general-purpose timer. The four independent channels can
be used for:

Input capture

Output compare

PWM generation (edge or center-aligned modes)

One-pulse mode output
If configured as a standard 16-bit timer, it has the same features as the TIMx timer. If
configured as the 16-bit PWM generator, it has full modulation capability (0-100%).
The counter can be frozen in debug mode.
Many features are shared with those of the standard timers which have the same
architecture. The advanced control timer can therefore work together with the other timers
via the Timer Link feature for synchronization or event chaining.
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3.14.2
Functional overview
General-purpose timers (TIM2..3, TIM14..17)
There are six synchronizable general-purpose timers embedded in the STM32F072x8/xB
devices (see Table 7 for differences). Each general-purpose timer can be used to generate
PWM outputs, or as simple time base.
TIM2, TIM3
STM32F072x8/xB devices feature two synchronizable 4-channel general-purpose timers.
TIM2 is based on a 32-bit auto-reload up/downcounter and a 16-bit prescaler. TIM3 is based
on a 16-bit auto-reload up/downcounter and a 16-bit prescaler. They feature 4 independent
channels each for input capture/output compare, PWM or one-pulse mode output. This
gives up to 12 input captures/output compares/PWMs on the largest packages.
The TIM2 and TIM3 general-purpose timers can work together or with the TIM1 advancedcontrol timer via the Timer Link feature for synchronization or event chaining.
TIM2 and TIM3 both have independent DMA request generation.
These timers are capable of handling quadrature (incremental) encoder signals and the
digital outputs from 1 to 3 hall-effect sensors.
Their counters can be frozen in debug mode.
TIM14
This timer is based on a 16-bit auto-reload upcounter and a 16-bit prescaler.
TIM14 features one single channel for input capture/output compare, PWM or one-pulse
mode output.
Its counter can be frozen in debug mode.
TIM15, TIM16 and TIM17
These timers are based on a 16-bit auto-reload upcounter and a 16-bit prescaler.
TIM15 has two independent channels, whereas TIM16 and TIM17 feature one single
channel for input capture/output compare, PWM or one-pulse mode output.
The TIM15, TIM16 and TIM17 timers can work together, and TIM15 can also operate
withTIM1 via the Timer Link feature for synchronization or event chaining.
TIM15 can be synchronized with TIM16 and TIM17.
TIM15, TIM16 and TIM17 have a complementary output with dead-time generation and
independent DMA request generation.
Their counters can be frozen in debug mode.
3.14.3
Basic timers TIM6 and TIM7
These timers are mainly used for DAC trigger generation. They can also be used as a
generic 16-bit time base.
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3.14.4
STM32F072x8 STM32F072xB
Independent watchdog (IWDG)
The independent watchdog is based on an 8-bit prescaler and 12-bit downcounter with
user-defined refresh window. It is clocked from an independent 40 kHz internal RC and as it
operates independently from the main clock, it can operate in Stop and Standby modes. It
can be used either as a watchdog to reset the device when a problem occurs, or as a free
running timer for application timeout management. It is hardware or software configurable
through the option bytes. The counter can be frozen in debug mode.
3.14.5
System window watchdog (WWDG)
The system window watchdog is based on a 7-bit downcounter that can be set as free
running. It can be used as a watchdog to reset the device when a problem occurs. It is
clocked from the APB clock (PCLK). It has an early warning interrupt capability and the
counter can be frozen in debug mode.
3.14.6
SysTick timer
This timer is dedicated to real-time operating systems, but could also be used as a standard
down counter. It features:
3.15

A 24-bit down counter

Autoreload capability

Maskable system interrupt generation when the counter reaches 0

Programmable clock source (HCLK or HCLK/8)
Real-time clock (RTC) and backup registers
The RTC and the five backup registers are supplied through a switch that takes power either
on VDD supply when present or through the VBAT pin. The backup registers are five 32-bit
registers used to store 20 bytes of user application data when VDD power is not present.
They are not reset by a system or power reset, or when the device wakes up from Standby
mode.
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Functional overview
The RTC is an independent BCD timer/counter. Its main features are the following:

Calendar with subseconds, seconds, minutes, hours (12 or 24 format), week day, date,
month, year, in BCD (binary-coded decimal) format.

Automatic correction for 28, 29 (leap year), 30, and 31 day of the month.

Programmable alarm with wake up from Stop and Standby mode capability.

Periodic wakeup unit with programmable resolution and period.

On-the-fly correction from 1 to 32767 RTC clock pulses. This can be used to
synchronize the RTC with a master clock.

Digital calibration circuit with 1 ppm resolution, to compensate for quartz crystal
inaccuracy.

Three anti-tamper detection pins with programmable filter. The MCU can be woken up
from Stop and Standby modes on tamper event detection.

Timestamp feature which can be used to save the calendar content. This function can
be triggered by an event on the timestamp pin, or by a tamper event. The MCU can be
woken up from Stop and Standby modes on timestamp event detection.

Reference clock detection: a more precise second source clock (50 or 60 Hz) can be
used to enhance the calendar precision.
The RTC clock sources can be:
3.16

A 32.768 kHz external crystal

A resonator or oscillator

The internal low-power RC oscillator (typical frequency of 40 kHz)

The high-speed external clock divided by 32
Inter-integrated circuit interfaces (I2C)
Up to two I2C interfaces (I2C1 and I2C2) can operate in multimaster or slave modes. Both
can support Standard mode (up to 100 kbit/s), Fast mode (up to 400 kbit/s) and Fast Mode
Plus (up to 1 Mbit/s) with 20 mA output drive on most of the associated I/Os.
Both support 7-bit and 10-bit addressing modes, multiple 7-bit slave addresses (two
addresses, one with configurable mask). They also include programmable analog and
digital noise filters.
Table 8. Comparison of I2C analog and digital filters
Analog filter
Digital filter
Pulse width of
suppressed spikes
 50 ns
Programmable length from 1 to 15
I2C peripheral clocks
Benefits
Available in Stop mode
1. Extra filtering capability vs.
standard requirements.
2. Stable length
Drawbacks
Variations depending on
temperature, voltage, process
Wakeup from Stop on address
match is not available when digital
filter is enabled.
In addition, I2C1 provides hardware support for SMBUS 2.0 and PMBUS 1.1: ARP
capability, Host notify protocol, hardware CRC (PEC) generation/verification, timeouts
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Functional overview
STM32F072x8 STM32F072xB
verifications and ALERT protocol management. I2C1 also has a clock domain independent
from the CPU clock, allowing the I2C1 to wake up the MCU from Stop mode on address
match.
The I2C interfaces can be served by the DMA controller.
Refer to Table 9 for the differences between I2C1 and I2C2.
Table 9. STM32F072x8/xB I2C implementation
I2C features(1)
I2C1
I2C2
7-bit addressing mode
X
X
10-bit addressing mode
X
X
Standard mode (up to 100 kbit/s)
X
X
Fast mode (up to 400 kbit/s)
X
X
Fast Mode Plus (up to 1 Mbit/s) with 20 mA output drive I/Os
X
X
Independent clock
X
-
SMBus
X
-
Wakeup from STOP
X
-
1. X = supported.
3.17
Universal synchronous/asynchronous receiver transmitters
(USART)
The device embeds four universal synchronous/asynchronous receiver transmitters
(USART1, USART2, USART3, USART4), which communicate at speeds of up to 6 Mbit/s.
They provide hardware management of the CTS, RTS and RS485 DE signals,
multiprocessor communication mode, master synchronous communication and single-wire
half-duplex communication mode. USART1 and USART2 support also SmartCard
communication (ISO 7816), IrDA SIR ENDEC, LIN Master/Slave capability and auto baud
rate feature, and have a clock domain independent from the CPU clock, allowing to wake up
the MCU from Stop mode.
The USART interfaces can be served by the DMA controller.
Table 10. STM32F072x8/xB USART implementation
USART1 and
USART2
USART3 and
USART4
Hardware flow control for modem
X
X
Continuous communication using DMA
X
X
Multiprocessor communication
X
X
Synchronous mode
X
X
Smartcard mode
X
-
Single-wire half-duplex communication
X
X
IrDA SIR ENDEC block
X
-
USART modes/features(1)
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DocID025004 Rev 3
STM32F072x8 STM32F072xB
Functional overview
Table 10. STM32F072x8/xB USART implementation (continued)
USART1 and
USART2
USART3 and
USART4
LIN mode
X
-
Dual clock domain and wakeup from Stop mode
X
-
Receiver timeout interrupt
X
-
Modbus communication
X
-
Auto baud rate detection
X
-
Driver Enable
X
X
USART modes/features(1)
1. X = supported.
DocID025004 Rev 3
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29
Functional overview
3.18
STM32F072x8 STM32F072xB
Serial peripheral interface (SPI)/Inter-integrated sound
interfaces (I2S)
Two SPIs are able to communicate up to 18 Mbit/s in slave and master modes in full-duplex
and half-duplex communication modes. The 3-bit prescaler gives 8 master mode
frequencies and the frame size is configurable from 4 bits to 16 bits.
Two standard I2S interfaces (multiplexed with SPI1 and SPI2 respectively) supporting four
different audio standards can operate as master or slave at half-duplex communication
mode. They can be configured to transfer 16 and 24 or 32 bits with 16-bit or 32-bit data
resolution and synchronized by a specific signal. Audio sampling frequency from 8 kHz up to
192 kHz can be set by an 8-bit programmable linear prescaler. When operating in master
mode, they can output a clock for an external audio component at 256 times the sampling
frequency.
Table 11. STM32F072x8/xB SPI/I2S implementation
SPI features(1)
SPI1 and SPI2
Hardware CRC calculation
X
Rx/Tx FIFO
X
NSS pulse mode
X
I2S mode
X
TI mode
X
1. X = supported.
3.19
High-definition multimedia interface (HDMI) - consumer
electronics control (CEC)
The device embeds a HDMI-CEC controller that provides hardware support for the
Consumer Electronics Control (CEC) protocol (Supplement 1 to the HDMI standard).
This protocol provides high-level control functions between all audiovisual products in an
environment. It is specified to operate at low speeds with minimum processing and memory
overhead. It has a clock domain independent from the CPU clock, allowing the HDMI_CEC
controller to wakeup the MCU from Stop mode on data reception.
3.20
Controller area network (CAN)
The CAN is compliant with specifications 2.0A and B (active) with a bit rate up to 1 Mbit/s. It
can receive and transmit standard frames with 11-bit identifiers as well as extended frames
with 29-bit identifiers. It has three transmit mailboxes, two receive FIFOs with 3 stages and
14 scalable filter banks.
3.21
Universal serial bus (USB)
The STM32F072x8/xB embeds a full-speed USB device peripheral compliant with the USB
specification version 2.0. The internal USB PHY supports USB FS signaling, embedded DP
pull-up and also battery charging detection according to Battery Charging Specification
28/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Functional overview
Revision 1.2. The USB interface implements a full-speed (12 Mbit/s) function interface with
added support for USB 2.0 Link Power Management. It has software-configurable endpoint
setting with packet memory up-to 1 KB (the last 256 byte are used for CAN peripheral if
enabled) and suspend/resume support. It requires a precise 48 MHz clock which can be
generated from the internal main PLL (the clock source must use an HSE crystal oscillator)
or by the internal 48 MHz oscillator in automatic trimming mode. The synchronization for this
oscillator can be taken from the USB data stream itself (SOF signalization) which allows
crystal-less operation.
3.22
Clock recovery system (CRS)
The STM32F072x8/xB embeds a special block which allows automatic trimming of the
internal 48 MHz oscillator to guarantee its optimal accuracy over the whole device
operational range. This automatic trimming is based on the external synchronization signal,
which could be either derived from USB SOF signalization, from LSE oscillator, from an
external signal on CRS_SYNC pin or generated by user software. For faster lock-in during
startup it is also possible to combine automatic trimming with manual trimming action.
3.23
Serial wire debug port (SW-DP)
An ARM SW-DP interface is provided to allow a serial wire debugging tool to be connected
to the MCU.
DocID025004 Rev 3
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29
Pinouts and pin descriptions
4
STM32F072x8 STM32F072xB
Pinouts and pin descriptions
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DocID025004 Rev 3
STM32F072x8 STM32F072xB
Pinouts and pin descriptions
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42
Pinouts and pin descriptions
STM32F072x8 STM32F072xB
Figure 5. UFBGA64 package ball-out (top view)
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32/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Pinouts and pin descriptions
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069
DocID025004 Rev 3
33/135
42
Pinouts and pin descriptions
STM32F072x8 STM32F072xB
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34/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Pinouts and pin descriptions
Table 12. Legend/abbreviations used in the pinout table
Name
Abbreviation
Unless otherwise specified in brackets below the pin name, the pin function during and
after reset is the same as the actual pin name
Pin name
Pin type
I/O structure
S
Supply pin
I
Input only pin
I/O
Input / output pin
FT
5 V tolerant I/O
FTf
5 V tolerant I/O, FM+ capable
TTa
3.3 V tolerant I/O directly connected to ADC
TC
Standard 3.3 V I/O
B
Dedicated BOOT0 pin
RST
Bidirectional reset pin with embedded weak pull-up resistor
Unless otherwise specified by a note, all I/Os are set as floating inputs during and after
reset.
Notes
Pin
functions
Definition
Alternate
functions
Functions selected through GPIOx_AFR registers
Additional
functions
Functions directly selected/enabled through peripheral registers
Table 13. STM32F072x8/xB pin definitions
LQFP100
UFBGA64
LQFP64
LQFP48/UFQFPN48
WLCSP49
Pin name
(function after
reset)
I/O structure
Notes
Pin functions
UFBGA100
Pin numbers
B2
1
-
-
-
-
PE2
I/O
FT
-
TSC_G7_IO1,
TIM3_ETR
-
A1
2
-
-
-
-
PE3
I/O
FT
-
TSC_G7_IO2,
TIM3_CH1
-
B1
3
-
-
-
-
PE4
I/O
FT
-
TSC_G7_IO3,
TIM3_CH2
-
C2
4
-
-
-
-
PE5
I/O
FT
-
TSC_G7_IO4,
TIM3_CH3
-
D2
5
-
-
-
-
PE6
I/O
FT
-
TIM3_CH4
WKUP3,
RTC_TAMP3
E2
6
B2
1
1
B7
VBAT
S
-
-
Pin
type
DocID025004 Rev 3
Alternate functions
Additional
functions
Backup power supply
35/135
42
Pinouts and pin descriptions
STM32F072x8 STM32F072xB
Table 13. STM32F072x8/xB pin definitions (continued)
Pin
type
Notes
Pin name
(function after
reset)
I/O structure
WLCSP49
Pin functions
LQFP48/UFQFPN48
LQFP64
UFBGA64
LQFP100
UFBGA100
Pin numbers
Alternate functions
Additional
functions
-
WKUP2,
RTC_TAMP1,
RTC_TS,
RTC_OUT
-
OSC32_IN
(2)
-
OSC32_OUT
(1)
C1
7
A2
2
2
D5
PC13
I/O
TC
D1
8
A1
3
3
C7
PC14OSC32_IN
(PC14)
I/O
TC
E1
9
B1
4
4
C6
PC15OSC32_OUT
(PC15)
I/O
TC
F2
10
-
-
-
-
PF9
I/O
FT
-
TIM15_CH1
-
G2
11
-
-
-
PF10
I/O
FT
-
TIM15_CH2
-
F1
12
C1
5
5
D7
PF0-OSC_IN
(PF0)
I/O
FT
-
CRS_ SYNC
OSC_IN
G1
13
D1
6
6
D6
PF1-OSC_OUT
(PF1)
I/O
FT
-
-
OSC_OUT
H2
14
E1
7
7
E7
NRST
I/O
RST
-
H1
15
E3
8
-
-
PC0
I/O
TTa
-
EVENTOUT
ADC_IN10
J2
16
E2
9
-
-
PC1
I/O
TTa
-
EVENTOUT
ADC_IN11
J3
17
F2
10
-
-
PC2
I/O
TTa
-
SPI2_MISO, I2S2_MCK,
EVENTOUT
ADC_IN12
K2
18
G1
11
-
-
PC3
I/O
TTa
-
SPI2_MOSI, I2S2_SD,
EVENTOUT
ADC_IN13
J1
19
-
-
-
-
PF2
I/O
FT
-
EVENTOUT
WKUP8
K1
20
F1
12
8
E6
VSSA
S
-
-
Analog ground
M1
21
H1
13
9
F7
VDDA
S
-
-
Analog power supply
L1
22
-
-
-
-
PF3
I/O
FT
-
EVENTOUT
-
USART2_CTS,
TIM2_CH1_ETR,
COMP1_OUT,
TSC_G1_IO1,
USART4_TX
L2
36/135
23
G2
14
10
F6
PA0
I/O
TTa
(2)
(1)
(2)
(1)
DocID025004 Rev 3
Device reset input / internal reset output
(active low)
RTC_ TAMP2,
WKUP1,
ADC_IN0,
COMP1_INM6
STM32F072x8 STM32F072xB
Pinouts and pin descriptions
Table 13. STM32F072x8/xB pin definitions (continued)
M2
24
H2
15
11
G7
PA1
Pin
type
I/O
TTa
Notes
Pin name
(function after
reset)
I/O structure
WLCSP49
Pin functions
LQFP48/UFQFPN48
LQFP64
UFBGA64
LQFP100
UFBGA100
Pin numbers
Alternate functions
Additional
functions
-
USART2_RTS,
TIM2_CH2,
TIM15_CH1N,
TSC_G1_IO2,
USART4_RX,
EVENTOUT
ADC_IN1,
COMP1_INP
ADC_IN2,
COMP2_INM6,
WKUP4
ADC_IN3,
COMP2_INP
K3
25
F3
16
12
E5
PA2
I/O
TTa
-
USART2_TX,
COMP2_OUT,
TIM2_CH3,
TIM15_CH1,
TSC_G1_IO3
L3
26
G3
17
13
E4
PA3
I/O
TTa
-
USART2_RX,TIM2_CH4,
TIM15_CH2,
TSC_G1_IO4
D3
27
C2
18
-
-
VSS
S
-
-
Ground
H3
28
D2
19
-
-
VDD
S
-
-
Digital power supply
M3
K4
L4
M4
29
30
31
32
H3
F4
G4
H4
20
21
22
23
14
15
16
17
G6
F5
F4
F3
PA4
PA5
PA6
PA7
I/O
I/O
I/O
I/O
TTa
TTa
TTa
TTa
-
SPI1_NSS, I2S1_WS,
TIM14_CH1,
TSC_G2_IO1,
USART2_CK
COMP1_INM4,
COMP2_INM4,
ADC_IN4,
DAC_OUT1
-
SPI1_SCK, I2S1_CK,
CEC,
TIM2_CH1_ETR,
TSC_G2_IO2
COMP1_INM5,
COMP2_INM5,
ADC_IN5,
DAC_OUT2
-
SPI1_MISO, I2S1_MCK,
TIM3_CH1, TIM1_BKIN,
TIM16_CH1,
COMP1_OUT,
TSC_G2_IO3,
EVENTOUT,
USART3_CTS
ADC_IN6
-
SPI1_MOSI, I2S1_SD,
TIM3_CH2, TIM14_CH1,
TIM1_CH1N,
TIM17_CH1,
COMP2_OUT,
TSC_G2_IO4,
EVENTOUT
ADC_IN7
DocID025004 Rev 3
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42
Pinouts and pin descriptions
STM32F072x8 STM32F072xB
Table 13. STM32F072x8/xB pin definitions (continued)
LQFP100
UFBGA64
LQFP64
LQFP48/UFQFPN48
WLCSP49
Pin name
(function after
reset)
I/O structure
Notes
Pin functions
UFBGA100
Pin numbers
K5
33
H5
24
-
-
PC4
I/O
TTa
-
EVENTOUT,
USART3_TX
ADC_IN14
L5
34
H6
25
-
-
PC5
I/O
TTa
-
TSC_G3_IO1,
USART3_RX
ADC_IN15,
WKUP5
-
TIM3_CH3, TIM1_CH2N,
TSC_G3_IO2,
EVENTOUT,
USART3_CK
ADC_IN8
ADC_IN9
M5
35
F5
26
18
G5
PB0
Pin
type
I/O
TTa
Alternate functions
Additional
functions
M6
36
G5
27
19
G4
PB1
I/O
TTa
-
TIM3_CH4,
USART3_RTS,
TIM14_CH1,
TIM1_CH3N,
TSC_G3_IO3
L6
37
G6
28
20
G3
PB2
I/O
FT
-
TSC_G3_IO4
-
M7
38
-
-
-
-
PE7
I/O
FT
-
TIM1_ETR
-
L7
39
-
-
-
-
PE8
I/O
FT
-
TIM1_CH1N
-
M8
40
-
-
-
-
PE9
I/O
FT
-
TIM1_CH1
-
L8
41
-
-
-
-
PE10
I/O
FT
-
TIM1_CH2N
-
M9
42
-
-
-
-
PE11
I/O
FT
-
TIM1_CH2
-
L9
43
-
-
-
-
PE12
I/O
FT
-
SPI1_NSS, I2S1_WS,
TIM1_CH3N
-
M10
44
-
-
-
-
PE13
I/O
FT
-
SPI1_SCK, I2S1_CK,
TIM1_CH3
-
M11
45
-
-
-
-
PE14
I/O
FT
-
SPI1_MISO, I2S1_MCK,
TIM1_CH4
-
M12
46
-
-
-
-
PE15
I/O
FT
-
SPI1_MOSI, I2S1_SD,
TIM1_BKIN
-
L10
47
G7
29
21
E3
PB10
I/O
FT
-
SPI2_SCK, I2C2_SCL,
USART3_TX, CEC,
TSC_SYNC, TIM2_CH3
-
USART3_RX,
TIM2_CH4,
EVENTOUT,
TSC_G6_IO1,
I2C2_SDA
-
L11
48
H7
30
22
G2
PB11
I/O
FT
-
F12
49
D5
31
23
D3
VSS
S
-
-
38/135
DocID025004 Rev 3
Ground
STM32F072x8 STM32F072xB
Pinouts and pin descriptions
Table 13. STM32F072x8/xB pin definitions (continued)
LQFP64
LQFP48/UFQFPN48
WLCSP49
G12
50
E5
32
24
F2
VDD
L12
K12
K11
51
52
53
H8
G8
F8
33
34
35
25
26
27
E2
G1
F1
PB12
PB13
PB14
Pin
type
Notes
UFBGA64
Pin name
(function after
reset)
I/O structure
LQFP100
Pin functions
UFBGA100
Pin numbers
S
-
-
I/O
I/O
I/O
FT
FTf
FTf
Alternate functions
Additional
functions
Digital power supply
-
TIM1_BKIN,
TIM15_BKIN,
SPI2_NSS, I2S2_WS,
USART3_CK,
TSC_G6_IO2,
EVENTOUT
-
-
SPI2_SCK, I2S2_CK,
I2C2_SCL,
USART3_CTS,
TIM1_CH1N,
TSC_G6_IO3
-
-
SPI2_MISO, I2S2_MCK,
I2C2_SDA,
USART3_RTS,
TIM1_CH2N,
TIM15_CH1,
TSC_G6_IO4
-
WKUP7,
RTC_REFIN
K10
54
F7
36
28
E1
PB15
I/O
FT
-
SPI2_MOSI, I2S2_SD,
TIM1_CH3N,
TIM15_CH1N,
TIM15_CH2
K9
55
-
-
-
-
PD8
I/O
FT
-
USART3_TX
-
K8
56
-
-
-
-
PD9
I/O
FT
-
USART3_RX
-
J12
57
-
-
-
-
PD10
I/O
FT
-
USART3_CK
-
J11
58
-
-
-
-
PD11
I/O
FT
-
USART3_CTS
-
J10
59
-
-
-
-
PD12
I/O
FT
-
USART3_RTS,
TSC_G8_IO1
-
H12
60
-
-
-
-
PD13
I/O
FT
-
TSC_G8_IO2
-
H11
61
-
-
-
-
PD14
I/O
FT
-
TSC_G8_IO3
-
H10
62
-
-
-
-
PD15
I/O
FT
-
TSC_G8_IO4,
CRS_SYNC
-
E12
63
F6
37
-
-
PC6
I/O
FT
(3)
TIM3_CH1
-
FT
(3)
TIM3_CH2
-
TIM3_CH3
-
TIM3_CH4
-
E11
64
E7
38
-
-
PC7
I/O
E10
65
E8
39
-
-
PC8
I/O
FT
(3)
D12
66
D8
40
-
-
PC9
I/O
FT
(3)
DocID025004 Rev 3
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42
Pinouts and pin descriptions
STM32F072x8 STM32F072xB
Table 13. STM32F072x8/xB pin definitions (continued)
C12
B12
68
69
70
C7
C6
C8
41
42
43
44
29
30
31
32
WLCSP49
LQFP48/UFQFPN48
LQFP64
UFBGA64
D7
D1
D2
C2
C1
Pin name
(function after
reset)
PA8
Pin
type
I/O
PA9
I/O
PA10
I/O
PA11
I/O
Notes
D10
67
Pin functions
I/O structure
D11
LQFP100
UFBGA100
Pin numbers
Alternate functions
Additional
functions
FT
(3)
USART1_CK,
TIM1_CH1,
EVENTOUT, MCO,
CRS_SYNC
-
FT
(3)
USART1_TX,
TIM1_CH2,
TIM15_BKIN,
TSC_G4_IO1
-
FT
(3)
USART1_RX,
TIM1_CH3,
TIM17_BKIN,
TSC_G4_IO2
-
FT
(3)
CAN_RX,
USART1_CTS,
TIM1_CH4,
COMP1_OUT,
TSC_G4_IO3,
EVENTOUT
USB_DM
CAN_TX, USART1_RTS,
TIM1_ETR,
(3)
COMP2_OUT,
TSC_G4_IO4,
EVENTOUT
A12
71
B8
45
33
C3
PA12
I/O
FT
A11
72
A8
46
34
B3
PA13
I/O
FT
C11
73
-
-
-
-
PF6
I/O
F11
74
D6
47
35
B1
VSS
G11
75
E6
48
36
B2
A10
76
A7
49
37
A1
(3)
(4)
IR_OUT, SWDIO,
USB_NOE
-
FT
(3)
-
-
S
-
-
Ground
VDDIO2
S
-
-
Digital power supply
PA14
I/O
FT
(3)
(4)
USART2_TX, SWCLK
-
-
-
A9
77
A6
50
38
A2
PA15
I/O
FT
(3)
SPI1_NSS, I2S1_WS,
USART2_RX,
USART4_RTS,
TIM2_CH1_ETR,
EVENTOUT
B11
78
B7
51
-
-
PC10
I/O
FT
(3)
USART3_TX,
USART4_TX
40/135
USB_DP
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Pinouts and pin descriptions
Table 13. STM32F072x8/xB pin definitions (continued)
LQFP100
UFBGA64
LQFP64
LQFP48/UFQFPN48
WLCSP49
Pin name
(function after
reset)
I/O structure
Notes
Pin functions
UFBGA100
Pin numbers
C10
79
B6
52
-
-
PC11
I/O
FT
(3)
USART3_RX,
USART4_RX
-
B10
80
C5
53
-
-
PC12
I/O
FT
(3)
USART3_CK,
USART4_CK
-
C9
81
-
-
-
-
PD0
I/O
FT
(3)
SPI2_NSS, I2S2_WS,
CAN_RX
-
B9
82
-
-
-
-
PD1
I/O
FT
(3)
SPI2_SCK, I2S2_CK,
CAN_TX
-
C8
83
B5
54
-
-
PD2
I/O
FT
(3)
USART3_RTS,
TIM3_ETR
-
B8
84
-
-
-
-
PD3
I/O
FT
-
SPI2_MISO, I2S2_MCK,
USART2_CTS
-
B7
85
-
-
-
-
PD4
I/O
FT
-
SPI2_MOSI, I2S2_SD,
USART2_RTS
-
A6
86
-
-
-
-
PD5
I/O
FT
-
USART2_TX
-
B6
87
-
-
-
-
PD6
I/O
FT
-
USART2_RX
-
A5
88
-
-
-
-
PD7
I/O
FT
-
USART2_CK
-
-
SPI1_SCK, I2S1_CK,
TIM2_CH2,
TSC_G5_IO1,
EVENTOUT
-
-
SPI1_MISO, I2S1_MCK,
TIM17_BKIN,
TIM3_CH1,
TSC_G5_IO2,
EVENTOUT
-
WKUP6
-
A8
A7
89
90
A5
A4
55
56
39
40
A3
A4
PB3
PB4
Pin
type
I/O
I/O
FT
FT
Alternate functions
Additional
functions
C5
91
C4
57
41
B4
PB5
I/O
FT
-
SPI1_MOSI, I2S1_SD,
I2C1_SMBA,
TIM16_BKIN,
TIM3_CH2
B5
92
D3
58
42
C4
PB6
I/O
FTf
-
I2C1_SCL, USART1_TX,
TIM16_CH1N,
TSC_G5_I03
DocID025004 Rev 3
41/135
42
Pinouts and pin descriptions
STM32F072x8 STM32F072xB
Table 13. STM32F072x8/xB pin definitions (continued)
Pin
type
Notes
Pin name
(function after
reset)
I/O structure
WLCSP49
Pin functions
LQFP48/UFQFPN48
LQFP64
UFBGA64
LQFP100
UFBGA100
Pin numbers
B4
93
C3
59
43
D4
PB7
I/O
FTf
-
A4
94
B4
60
44
A5
BOOT0
I
B
-
A3
95
B3
61
45
B5
PB8
I/O
FTf
Alternate functions
Additional
functions
I2C1_SDA,
USART1_RX,
USART4_CTS,
TIM17_CH1N,
TSC_G5_IO4
-
Boot memory selection
-
I2C1_SCL, CEC,
TIM16_CH1,
TSC_SYNC,
CAN_RX
-
-
B3
96
A3
62
46
C5
PB9
I/O
FTf
-
SPI2_NSS, I2S2_WS,
I2C1_SDA, IR_OUT,
TIM17_CH1,
EVENTOUT,
CAN_TX
C3
97
-
-
-
-
PE0
I/O
FT
-
EVENTOUT, TIM16_CH1
-
A2
98
-
-
-
-
PE1
I/O
FT
-
EVENTOUT, TIM17_CH1
-
D3
99
D4
63
47
A6
VSS
S
-
-
Ground
C4
100
E4
64
48
A7
VDD
S
-
-
Digital power supply
1. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current
(3 mA), the use of GPIOs PC13 to PC15 in output mode is limited: 
- The speed should not exceed 2 MHz with a maximum load of 30 pF.
- These GPIOs must not be used as current sources (e.g. to drive an LED).
2. After the first RTC domain power-up, PC13, PC14 and PC15 operate as GPIOs. Their function then depends on the
content of the RTC registers which are not reset by the system reset. For details on how to manage these GPIOs, refer to
the RTC domain and RTC register descriptions in the reference manual.
3. PC6, PC7, PC8, PC9, PA8, PA9, PA10, PA11, PA12, PA13, PF6, PA14, PA15, PC10, PC11, PC12, PD0, PD1 and PD2 I/Os
are supplied by VDDIO2.
4. After reset, these pins are configured as SWDIO and SWCLK alternate functions, and the internal pull-up on the SWDIO
pin and the internal pull-down on the SWCLK pin are activated.
42/135
DocID025004 Rev 3
DocID025004 Rev 3
Pin name
AF0
AF1
AF2
AF3
AF4
AF5
AF6
AF7
PA0
-
USART2_CTS
TIM2_CH1_ETR
TSC_G1_IO1
USART4_TX
-
-
COMP1_OUT
PA1
EVENTOUT
USART2_RTS
TIM2_CH2
TSC_G1_IO2
USART4_RX
TIM15_CH1N
-
-
PA2
TIM15_CH1
USART2_TX
TIM2_CH3
TSC_G1_IO3
-
-
-
COMP2_OUT
PA3
TIM15_CH2
USART2_RX
TIM2_CH4
TSC_G1_IO4
-
-
-
-
PA4
SPI1_NSS, I2S1_WS
USART2_CK
-
TSC_G2_IO1
TIM14_CH1
-
-
-
PA5
SPI1_SCK, I2S1_CK
CEC
TIM2_CH1_ETR
TSC_G2_IO2
-
-
-
-
PA6
SPI1_MISO, I2S1_MCK
TIM3_CH1
TIM1_BKIN
TSC_G2_IO3
USART3_CTS
TIM16_CH1
EVENTOUT
COMP1_OUT
PA7
SPI1_MOSI, I2S1_SD
TIM3_CH2
TIM1_CH1N
TSC_G2_IO4
TIM14_CH1
TIM17_CH1
EVENTOUT
COMP2_OUT
PA8
MCO
USART1_CK
TIM1_CH1
EVENTOUT
CRS_SYNC
-
-
-
PA9
TIM15_BKIN
USART1_TX
TIM1_CH2
TSC_G4_IO1
-
-
-
-
PA10
TIM17_BKIN
USART1_RX
TIM1_CH3
TSC_G4_IO2
-
-
-
-
PA11
EVENTOUT
USART1_CTS
TIM1_CH4
TSC_G4_IO3
CAN_RX
-
-
COMP1_OUT
PA12
EVENTOUT
USART1_RTS
TIM1_ETR
TSC_G4_IO4
CAN_TX
-
-
COMP2_OUT
PA13
SWDIO
IR_OUT
USB_NOE
-
-
-
-
-
PA14
SWCLK
USART2_TX
-
-
-
-
-
-
PA15
SPI1_NSS, I2S1_WS
USART2_RX
TIM2_CH1_ETR
EVENTOUT
USART4_RTS
-
-
-
STM32F072x8 STM32F072xB
Table 14. Alternate functions selected through GPIOA_AFR registers for port A
43/135
44/135
Table 15. Alternate functions selected through GPIOB_AFR registers for port B
DocID025004 Rev 3
Pin name
AF0
AF1
AF2
AF3
AF4
AF5
PB0
EVENTOUT
TIM3_CH3
TIM1_CH2N
TSC_G3_IO2
USART3_CK
-
PB1
TIM14_CH1
TIM3_CH4
TIM1_CH3N
TSC_G3_IO3
USART3_RTS
-
PB2
-
-
-
TSC_G3_IO4
-
-
PB3
SPI1_SCK, I2S1_CK
EVENTOUT
TIM2_CH2
TSC_G5_IO1
-
-
PB4
SPI1_MISO, I2S1_MCK
TIM3_CH1
EVENTOUT
TSC_G5_IO2
-
TIM17_BKIN
PB5
SPI1_MOSI, I2S1_SD
TIM3_CH2
TIM16_BKIN
I2C1_SMBA
-
-
PB6
USART1_TX
I2C1_SCL
TIM16_CH1N
TSC_G5_IO3
-
-
PB7
USART1_RX
I2C1_SDA
TIM17_CH1N
TSC_G5_IO4
USART4_CTS
-
PB8
CEC
I2C1_SCL
TIM16_CH1
TSC_SYNC
CAN_RX
-
PB9
IR_OUT
I2C1_SDA
TIM17_CH1
EVENTOUT
CAN_TX
SPI2_NSS, I2S2_WS
PB10
CEC
I2C2_SCL
TIM2_CH3
TSC_SYNC
USART3_TX
SPI2_SCK, I2S2_CK
PB11
EVENTOUT
I2C2_SDA
TIM2_CH4
TSC_G6_IO1
USART3_RX
-
PB12
SPI2_NSS, I2S2_WS
EVENTOUT
TIM1_BKIN
TSC_G6_IO2
USART3_CK
TIM15_BKIN
PB13
SPI2_SCK, I2S2_CK
-
TIM1_CH1N
TSC_G6_IO3
USART3_CTS
I2C2_SCL
PB14
SPI2_MISO, I2S2_MCK
TIM15_CH1
TIM1_CH2N
TSC_G6_IO4
USART3_RTS
I2C2_SDA
PB15
SPI2_MOSI, I2S2_SD
TIM15_CH2
TIM1_CH3N
TIM15_CH1N
-
-
STM32F072x8 STM32F072xB
STM32F072x8 STM32F072xB
Table 16. Alternate functions selected through GPIOC_AFR registers for port C
Pin name
AF0
AF1
PC0
EVENTOUT
-
PC1
EVENTOUT
-
PC2
EVENTOUT
SPI2_MISO, I2S2_MCK
PC3
EVENTOUT
SPI2_MOSI, I2S2_SD
PC4
EVENTOUT
USART3_TX
PC5
TSC_G3_IO1
USART3_RX
PC6
TIM3_CH1
-
PC7
TIM3_CH2
-
PC8
TIM3_CH3
-
PC9
TIM3_CH4
-
PC10
USART4_TX
USART3_TX
PC11
USART4_RX
USART3_RX
PC12
USART4_CK
USART3_CK
PC13
-
-
PC14
-
-
PC15
-
-
Table 17. Alternate functions selected through GPIOD_AFR registers for port D
Pin name
AF0
AF1
PD0
CAN_RX
SPI2_NSS, I2S2_WS
PD1
CAN_TX
SPI2_SCK, I2S2_CK
PD2
TIM3_ETR
USART3_RTS
PD3
USART2_CTS
SPI2_MISO, I2S2_MCK
PD4
USART2_RTS
SPI2_MOSI, I2S2_SD
PD5
USART2_TX
-
PD6
USART2_RX
-
PD7
USART2_CK
-
PD8
USART3_TX
-
PD9
USART3_RX
-
PD10
USART3_CK
-
PD11
USART3_CTS
-
PD12
USART3_RTS
TSC_G8_IO1
PD13
-
TSC_G8_IO2
PD14
-
TSC_G8_IO3
PD15
CRS_SYNC
TSC_G8_IO4
DocID025004 Rev 3
45/135
46
STM32F072x8 STM32F072xB
Table 18. Alternate functions selected through GPIOE_AFR registers for port E
Pin name
AF0
AF1
PE0
TIM16_CH1
EVENTOUT
PE1
TIM17_CH1
EVENTOUT
PE2
TIM3_ETR
TSC_G7_IO1
PE3
TIM3_CH1
TSC_G7_IO2
PE4
TIM3_CH2
TSC_G7_IO3
PE5
TIM3_CH3
TSC_G7_IO4
PE6
TIM3_CH4
-
PE7
TIM1_ETR
-
PE8
TIM1_CH1N
-
PE9
TIM1_CH1
-
PE10
TIM1_CH2N
-
PE11
TIM1_CH2
-
PE12
TIM1_CH3N
SPI1_NSS, I2S1_WS
PE13
TIM1_CH3
SPI1_SCK, I2S1_CK
PE14
TIM1_CH4
SPI1_MISO, I2S1_MCK
PE15
TIM1_BKIN
SPI1_MOSI, I2S1_SD
Table 19. Alternate functions available on port F
46/135
Pin name
AF
PF0
CRS_SYNC
PF1
-
PF2
EVENTOUT
PF3
EVENTOUT
PF6
-
PF9
TIM15_CH1
PF10
TIM15_CH2
DocID025004 Rev 3
STM32F072x8 STM32F072xB
5
Memory mapping
Memory mapping
Figure 10. STM32F072x8/xB memory map
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DocID025004 Rev 3
47/135
49
Memory mapping
STM32F072x8 STM32F072xB
Table 20. STM32F072x8/xB peripheral register boundary addresses
Bus
AHB2
AHB1
APB
48/135
Boundary address
Size
Peripheral
0x4800 1800 - 0x5FFF FFFF
~384 MB
Reserved
0x4800 1400 - 0x4800 17FF
1 KB
GPIOF
0x4800 1000 - 0x4800 13FF
1 KB
GPIOE
0x4800 0C00 - 0x4800 0FFF
1 KB
GPIOD
0x4800 0800 - 0x4800 0BFF
1 KB
GPIOC
0x4800 0400 - 0x4800 07FF
1 KB
GPIOB
0x4800 0000 - 0x4800 03FF
1 KB
GPIOA
0x4002 4400 - 0x47FF FFFF
~128 MB
Reserved
0x4002 4000 - 0x4002 43FF
1 KB
TSC
0x4002 3400 - 0x4002 3FFF
3 KB
Reserved
0x4002 3000 - 0x4002 33FF
1 KB
CRC
0x4002 2400 - 0x4002 2FFF
3 KB
Reserved
0x4002 2000 - 0x4002 23FF
1 KB
FLASH Interface
0x4002 1400 - 0x4002 1FFF
3 KB
Reserved
0x4002 1000 - 0x4002 13FF
1 KB
RCC
0x4002 0400 - 0x4002 0FFF
3 KB
Reserved
0x4002 0000 - 0x4002 03FF
1 KB
DMA
0x4001 8000 - 0x4001 FFFF
32 KB
Reserved
0x4001 5C00 - 0x4001 7FFF
9 KB
Reserved
0x4001 5800 - 0x4001 5BFF
1 KB
DBGMCU
0x4001 4C00 - 0x4001 57FF
3 KB
Reserved
0x4001 4800 - 0x4001 4BFF
1 KB
TIM17
0x4001 4400 - 0x4001 47FF
1 KB
TIM16
0x4001 4000 - 0x4001 43FF
1 KB
TIM15
0x4001 3C00 - 0x4001 3FFF
1 KB
Reserved
0x4001 3800 - 0x4001 3BFF
1 KB
USART1
0x4001 3400 - 0x4001 37FF
1 KB
Reserved
0x4001 3000 - 0x4001 33FF
1 KB
SPI1/I2S1
0x4001 2C00 - 0x4001 2FFF
1 KB
TIM1
0x4001 2800 - 0x4001 2BFF
1 KB
Reserved
0x4001 2400 - 0x4001 27FF
1 KB
ADC
0x4001 0800 - 0x4001 23FF
7 KB
Reserved
0x4001 0400 - 0x4001 07FF
1 KB
EXTI
0x4001 0000 - 0x4001 03FF
1 KB
SYSCFG + COMP
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Memory mapping
Table 20. STM32F072x8/xB peripheral register boundary addresses (continued)
Bus
APB
Boundary address
Size
Peripheral
0x4000 8000 - 0x4000 FFFF
32 KB
Reserved
0x4000 7C00 - 0x4000 7FFF
1 KB
Reserved
0x4000 7800 - 0x4000 7BFF
1 KB
CEC
0x4000 7400 - 0x4000 77FF
1 KB
DAC
0x4000 7000 - 0x4000 73FF
1 KB
PWR
0x4000 6C00 - 0x4000 6FFF
1 KB
CRS
0x40006800 - 0x4000 6BFF
1 KB
Reserved
0x4000 6400 - 0x4000 67FF
1 KB
BxCAN
0x4000 6000 - 0x4000 63FF
1 KB
USB/CAN RAM
0x4000 5C00 - 0x4000 5FFF
1 KB
USB
0x4000 5800 - 0x4000 5BFF
1 KB
I2C2
0x4000 5400 - 0x4000 57FF
1 KB
I2C1
0x4000 5000 - 0x4000 53FF
1 KB
Reserved
0x4000 4C00 - 0x4000 4FFF
1 KB
USART4
0x4000 4800 - 0x4000 4BFF
1 KB
USART3
0x4000 4400 - 0x4000 47FF
1 KB
USART2
0x4000 3C00 - 0x4000 43FF
2 KB
Reserved
0x4000 3800 - 0x4000 3BFF
1 KB
SPI2
0x4000 3400 - 0x4000 37FF
1 KB
Reserved
0x4000 3000 - 0x4000 33FF
1 KB
IWDG
0x4000 2C00 - 0x4000 2FFF
1 KB
WWDG
0x4000 2800 - 0x4000 2BFF
1 KB
RTC
0x4000 2400 - 0x4000 27FF
1 KB
Reserved
0x4000 2000 - 0x4000 23FF
1 KB
TIM14
0x4000 1800 - 0x4000 1FFF
2 KB
Reserved
0x4000 1400 - 0x4000 17FF
1 KB
TIM7
0x4000 1000 - 0x4000 13FF
1 KB
TIM6
0x4000 0800 - 0x4000 0FFF
2 KB
Reserved
0x4000 0400 - 0x4000 07FF
1 KB
TIM3
0x4000 0000 - 0x4000 03FF
1 KB
TIM2
DocID025004 Rev 3
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49
Electrical characteristics
STM32F072x8 STM32F072xB
6
Electrical characteristics
6.1
Parameter conditions
Unless otherwise specified, all voltages are referenced to VSS.
6.1.1
Minimum and maximum values
Unless otherwise specified, the minimum and maximum values are guaranteed in the worst
conditions of ambient temperature, supply voltage and frequencies by tests in production on
100% of the devices with an ambient temperature at TA = 25 °C and TA = TAmax (given by
the selected temperature range).
Data based on characterization results, design simulation and/or technology characteristics
are indicated in the table footnotes and are not tested in production. Based on
characterization, the minimum and maximum values refer to sample tests and represent the
mean value plus or minus three times the standard deviation (mean ±3).
6.1.2
Typical values
Unless otherwise specified, typical data are based on TA = 25 °C, VDD = VDDA = 3.3 V. They
are given only as design guidelines and are not tested.
Typical ADC accuracy values are determined by characterization of a batch of samples from
a standard diffusion lot over the full temperature range, where 95% of the devices have an
error less than or equal to the value indicated (mean ±2).
6.1.3
Typical curves
Unless otherwise specified, all typical curves are given only as design guidelines and are
not tested.
6.1.4
Loading capacitor
The loading conditions used for pin parameter measurement are shown in Figure 11.
6.1.5
Pin input voltage
The input voltage measurement on a pin of the device is described in Figure 12.
Figure 11. Pin loading conditions
Figure 12. Pin input voltage
0&8SLQ
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& S)
9,1
069
50/135
DocID025004 Rev 3
069
STM32F072x8 STM32F072xB
6.1.6
Electrical characteristics
Power supply scheme
Figure 13. Power supply scheme
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Caution:
Each power supply pair (VDD/VSS, VDDA/VSSA etc.) must be decoupled with filtering ceramic
capacitors as shown above. These capacitors must be placed as close as possible to, or
below, the appropriate pins on the underside of the PCB to ensure the good functionality of
the device.
DocID025004 Rev 3
51/135
105
Electrical characteristics
6.1.7
STM32F072x8 STM32F072xB
Current consumption measurement
Figure 14. Current consumption measurement scheme
,
''B9%$7
9 %$7
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9 ''
9 '',2
, ''$
9 ''$
069
52/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
6.2
Electrical characteristics
Absolute maximum ratings
Stresses above the absolute maximum ratings listed in Table 21: Voltage characteristics,
Table 22: Current characteristics and Table 23: Thermal characteristics may cause
permanent damage to the device. These are stress ratings only and functional operation of
the device at these conditions is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Table 21. Voltage characteristics(1)
Symbol
VDD–VSS
Ratings
External main supply voltage
VDDIO2–VSS External I/O supply voltage
VDDA–VSS
External analog supply voltage
VDD–VDDA
Allowed voltage difference for VDD > VDDA
VBAT–VSS
External backup supply voltage
VIN(2)
|VSSx VSS|
VESD(HBM)
Max
Unit
-0.3
4.0
V
-0.3
4.0
V
-0.3
4.0
V
-
0.4
V
-0.3
4.0
V
4.0(3)
Input voltage on FT and FTf pins
VSS  0.3
VDDIOx +
Input voltage on TTa pins
VSS  0.3
4.0
V
0
9.0
V
VSS 0.3
4.0
V
Variations between different VDD power pins
-
50
mV
Variations between all the different ground
pins
-
50
mV
BOOT0
Input voltage on any other pin
|VDDx|
Min
Electrostatic discharge voltage
(human body model)
V
see Section 6.3.12: Electrical
sensitivity characteristics
1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power
supply, in the permitted range.
2. VIN maximum must always be respected. Refer to Table 22: Current characteristics for the maximum
allowed injected current values.
3. Valid only if the internal pull-up/pull-down resistors are disabled. If internal pull-up or pull-down resistor is
enabled, the maximum limit is 4 V.
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105
Electrical characteristics
STM32F072x8 STM32F072xB
Table 22. Current characteristics
Symbol
Ratings
Max.
IVDD
Total current into sum of all VDD power lines (source)(1)
120
IVSS
(1)
-120
Total current out of sum of all VSS ground lines (sink)
IVDD(PIN)
Maximum current into each VDD power pin (source)
(1)
100
IVSS(PIN)
Maximum current out of each VSS ground pin (sink)(1)
-100
IIO(PIN)
Output current sunk by any I/O and control pin
25
Output current source by any I/O and control pin
Total output current sunk by sum of all I/Os and control pins
IIO(PIN)
-25
(2)
80
Total output current sourced by sum of all I/Os and control pins(2)
-80
Total output current sourced by sum of all I/Os supplied by VDDIO2
-40
Injected current on TC and RST pin
±5
Injected current on TTa pins(5)
IINJ(PIN)
Total injected current (sum of all I/O and control
mA
-5/+0(4)
Injected current on B, FT and FTf pins
IINJ(PIN)(3)
Unit
±5
pins)(6)
± 25
1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power supply, in the
permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be
sunk/sourced between two consecutive power supply pins referring to high pin count QFP packages.
3. A positive injection is induced by VIN > VDDIOx while a negative injection is induced by VIN < VSS. IINJ(PIN) must never be
exceeded. Refer to Table 21: Voltage characteristics for the maximum allowed input voltage values.
4. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum
value.
5. On these I/Os, a positive injection is induced by VIN > VDDA. Negative injection disturbs the analog performance of the
device. See note (2) below Table 59: ADC accuracy.
6. When several inputs are submitted to a current injection, the maximum IINJ(PIN) is the absolute sum of the positive and
negative injected currents (instantaneous values).
Table 23. Thermal characteristics
Symbol
TSTG
TJ
54/135
Ratings
Storage temperature range
Maximum junction temperature
DocID025004 Rev 3
Value
Unit
–65 to +150
°C
150
°C
STM32F072x8 STM32F072xB
Electrical characteristics
6.3
Operating conditions
6.3.1
General operating conditions
Table 24. General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
-
0
48
fPCLK
Internal APB clock frequency
-
0
48
VDD
Standard operating voltage
-
2.0
3.6
V
Must not be supplied if VDD
is not present
1.65
3.6
V
VDD
3.6
2.4
3.6
1.65
3.6
TC and RST I/O
–0.3
VDDIOx+0.3
TTa I/O
–0.3
VDDA+0.3(1)
FT and FTf I/O
–0.3
5.5(1)
BOOT0
0
5.5
UFBGA100
-
364
LQFP100
-
476
UFBGA64
-
308
LQFP64
-
455
LQFP48
-
370
UFQFPN48
-
625
WLCSP49
-
408
–40
85
–40
105
–40
105
–40
125
Suffix 6 version
–40
105
Suffix 7 version
–40
125
VDDIO2
VDDA
VBAT
VIN
PD
I/O supply voltage
Analog operating voltage
(ADC and DAC not used)
Analog operating voltage
(ADC and DAC used)
Backup operating voltage
-
I/O input voltage
Power dissipation at TA = 85 °C
for suffix 6 or TA = 105 °C for
suffix 7(2)
Ambient temperature for the
suffix 6 version
Maximum power dissipation
Ambient temperature for the
suffix 7 version
Maximum power dissipation
TA
TJ
Must have a potential equal
to or higher than VDD
Junction temperature range
Low power dissipation
Low power dissipation
(3)
(3)
MHz
V
V
V
mW
°C
°C
°C
1. For operation with a voltage higher than VDDIOx + 0.3 V, the internal pull-up resistor must be disabled.
2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See Section 7.8: Thermal characteristics.
3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.8:
Thermal characteristics).
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105
Electrical characteristics
6.3.2
STM32F072x8 STM32F072xB
Operating conditions at power-up / power-down
The parameters given in Table 25 are derived from tests performed under the ambient
temperature condition summarized in Table 24.
Table 25. Operating conditions at power-up / power-down
Symbol
Parameter
VDD rise time rate
tVDD
-
VDD fall time rate
VDDA rise time rate
tVDDA
6.3.3
Conditions
-
VDDA fall time rate
Min
Max
0

20

0

20

Unit
µs/V
Embedded reset and power control block characteristics
The parameters given in Table 26 are derived from tests performed under the ambient
temperature and supply voltage conditions summarized in Table 24: General operating
conditions.
Table 26. Embedded reset and power control block characteristics
Symbol
Parameter
VPOR/PDR(1)
VPDRhyst
tRSTTEMPO
(4)
Power on/power down
reset threshold
Conditions
Min
Typ
Max
Unit
Falling edge(2)
1.80
1.88
1.96(3)
V
1.84(3)
1.92
2.00
V
-
40
-
mV
1.50
2.50
4.50
ms
Rising edge
PDR hysteresis
Reset temporization
1. The PDR detector monitors VDD and also VDDA (if kept enabled in the option bytes). The POR detector
monitors only VDD.
2. The product behavior is guaranteed by design down to the minimum VPOR/PDR value.
3. Data based on characterization results, not tested in production.
4. Guaranteed by design, not tested in production.
Table 27. Programmable voltage detector characteristics
Symbol
56/135
Parameter
VPVD0
PVD threshold 0
VPVD1
PVD threshold 1
VPVD2
PVD threshold 2
VPVD3
PVD threshold 3
Conditions
Min
Typ
Max
Unit
Rising edge
2.1
2.18
2.26
V
Falling edge
2
2.08
2.16
V
Rising edge
2.19
2.28
2.37
V
Falling edge
2.09
2.18
2.27
V
Rising edge
2.28
2.38
2.48
V
Falling edge
2.18
2.28
2.38
V
Rising edge
2.38
2.48
2.58
V
Falling edge
2.28
2.38
2.48
V
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Electrical characteristics
Table 27. Programmable voltage detector characteristics (continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rising edge
2.47
2.58
2.69
V
Falling edge
2.37
2.48
2.59
V
Rising edge
2.57
2.68
2.79
V
Falling edge
2.47
2.58
2.69
V
Rising edge
2.66
2.78
2.9
V
Falling edge
2.56
2.68
2.8
V
Rising edge
2.76
2.88
3
V
Falling edge
2.66
2.78
2.9
V
VPVD4
PVD threshold 4
VPVD5
PVD threshold 5
VPVD6
PVD threshold 6
VPVD7
PVD threshold 7
VPVDhyst(1)
PVD hysteresis
-
100
-
mV
PVD current consumption
-
0.15
0.26(1)
µA
IDD(PVD)
1. Guaranteed by design, not tested in production.
6.3.4
Embedded reference voltage
The parameters given in Table 28 are derived from tests performed under the ambient
temperature and supply voltage conditions summarized in Table 24: General operating
conditions.
Table 28. Embedded internal reference voltage
Symbol
Parameter
VREFINT
Internal reference voltage
tSTART
Conditions
Min
Typ
Max
Unit
–40 °C < TA < +105 °C
1.16
1.2
1.25
V
V
–40 °C < TA < +85 °C
1.16
1.2
1.24(1)
ADC_IN17 buffer startup
time
-
-
-
10(2)
µs
tS_vrefint
ADC sampling time when
reading the internal
reference voltage
-
4(2)
-
-
µs
VREFINT
Internal reference voltage
spread over the
temperature range
VDDA = 3 V
-
-
10(2)
mV
-
- 100(2)
-
100(2) ppm/°C
TCoeff
Temperature coefficient
1. Data based on characterization results, not tested in production.
2. Guaranteed by design, not tested in production.
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105
Electrical characteristics
6.3.5
STM32F072x8 STM32F072xB
Supply current characteristics
The current consumption is a function of several parameters and factors such as the
operating voltage, ambient temperature, I/O pin loading, device software configuration,
operating frequencies, I/O pin switching rate, program location in memory and executed
binary code.
The current consumption is measured as described in Figure 14: Current consumption
measurement scheme.
All Run-mode current consumption measurements given in this section are performed with a
reduced code that gives a consumption equivalent to CoreMark code.
Typical and maximum current consumption
The MCU is placed under the following conditions:

All I/O pins are in analog input mode

All peripherals are disabled except when explicitly mentioned

The Flash memory access time is adjusted to the fHCLK frequency:

–
0 wait state and Prefetch OFF from 0 to 24 MHz
–
1 wait state and Prefetch ON above 24 MHz
When the peripherals are enabled fPCLK = fHCLK
The parameters given in Table 29 to Table 31 are derived from tests performed under
ambient temperature and supply voltage conditions summarized in Table 24: General
operating conditions.
Parameter
Symbol
Table 29. Typical and maximum current consumption from VDD supply at VDD = 3.6 V
All peripherals enabled(1)
Conditions
Supply current in Run mode,
code executing from Flash
IDD
HSE bypass,
PLL on
HSE bypass,
PLL off
HSI clock,
PLL on
HSI clock,
PLL off
58/135
Max @ TA(2)
fHCLK
Max @ TA(2)
Unit
Typ
Typ
HSI48
All peripherals disabled
25 °C
85 °C
105 °C
25 °C
85 °C
105 °C
48 MHz
24.3
26.9
27.2
27.9
13.1
14.8
14.9
15.5
48 MHz
24.1
26.8
27.0
27.7
13.0
14.6
14.8
15.4
32 MHz
16.0
18.3
18.6
19.2
8.76
9.56
9.73
10.6
24 MHz
12.3
13.7
14.3
14.7
7.36
7.94
8.37
8.81
8 MHz
4.52
5.25
5.28
5.61
2.89
3.17
3.26
3.34
1 MHz
1.25
1.39
1.58
1.87
0.93
1.06
1.15
1.34
48 MHz
24.1
27.1
27.6
27.8
12.9
14.7
14.9
15.5
32 MHz
16.1
18.2
18.9
19.3
8.82
9.69
9.83
10.7
24 MHz
12.4
14.0
14.4
14.8
7.31
7.92
8.34
8.75
8 MHz
4.52
5.25
5.35
5.61
2.87
3.16
3.25
3.33
DocID025004 Rev 3
mA
STM32F072x8 STM32F072xB
Electrical characteristics
Parameter
Symbol
Table 29. Typical and maximum current consumption from VDD supply at VDD = 3.6 V (continued)
All peripherals enabled(1)
Conditions
Supply current in Run mode,
code executing from RAM
Supply current in Sleep mode,
code executing from Flash or RAM
IDD
Max @ TA(2)
fHCLK
Max @ TA(2)
48 MHz
23.1
Unit
Typ
Typ
HSI48
All peripherals disabled
25 °C
85 °C
105 °C
25.4
25.8
26.6
25.7
26.5(3)
85 °C
105 °C
12.8
13.5
13.7
13.9
12.6
13.3(3)
13.5
13.8(3)
48 MHz
23.0
32 MHz
15.4
17.3
17.8
18.3
7.96
8.92
9.17
9.73
24 MHz
11.4
12.9
13.5
13.7
6.48
8.04
8.23
8.41
8 MHz
4.21
4.6
4.89
5.25
2.07
2.3
2.35
2.94
1 MHz
0.78
0.9
0.92
1.15
0.36
0.48
0.59
0.82
48 MHz
23.1
24.5
25.0
25.2
12.6
13.7
13.9
14.0
32 MHz
15.4
17.4
17.7
18.2
8.05
8.85
9.16
9.94
24 MHz
11.5
13.0
13.6
13.9
6.49
8.06
8.21
8.47
HSI clock,
PLL off
8 MHz
4.34
4.75
5.03
5.41
2.11
2.36
2.38
2.98
HSI48
48 MHz
15.1
16.6
16.8
17.5
3.08
3.43
3.56
3.61
48 MHz
15.0
16.5(3)
16.7
17.3(3)
2.93 3.28(3)
3.41
3.46(3)
32 MHz
9.9
11.4
11.6
11.9
2.0
2.24
2.32
2.49
24 MHz
7.43
8.17
8.71
8.82
1.63
1.82
1.88
1.9
8 MHz
2.83
3.09
3.26
3.66
0.76
0.88
0.91
0.93
1 MHz
0.42
0.54
0.55
0.67
0.28
0.39
0.41
0.43
48 MHz
15.0
17.2
17.3
17.9
3.04
3.37
3.41
3.46
32 MHz
9.93
11.3
11.6
11.7
2.11
2.35
2.44
2.65
24 MHz
7.53
8.45
8.87
8.95
1.64
1.83
1.9
1.93
8 MHz
2.95
3.24
3.41
3.8
0.8
0.92
0.94
0.97
HSE bypass,
PLL on
HSE bypass,
PLL off
HSI clock,
PLL on
HSE bypass,
PLL on
HSE bypass,
PLL off
HSI clock,
PLL on
HSI clock,
PLL off
25.3
(3)
25 °C
mA
1. USB is kept disabled as this IP functions only with a 48 MHz clock.
2. Data based on characterization results, not tested in production unless otherwise specified.
3. Data based on characterization results and tested in production (using one common test limit for sum of IDD and IDDA).
DocID025004 Rev 3
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105
Electrical characteristics
STM32F072x8 STM32F072xB
Table 30. Typical and maximum current consumption from the VDDA supply
VDDA = 2.4 V
Symbol
Parameter
Conditions
(1)
IDDA
Max @ TA(2)
fHCLK
Max @ TA(2)
HSE
bypass,
PLL on
HSE
bypass,
PLL off
HSI clock,
PLL on
HSI clock,
PLL off
48 MHz
311
Unit
Typ
Typ
HSI48
Supply
current in
Run or
Sleep
mode,
code
executing
from
Flash or
RAM
VDDA = 3.6 V
25 °C
85 °C
105 °C
326
334
343
170
(3)
178
182
(3)
25 °C 85 °C 105 °C
322
165
337
(3)
184
345
354
196
200(3)
48 MHz
152
32 MHz
105
121
126
128
113
129
136
138
24 MHz
81.9
95.9
99.5
101
88.7
102
107
108
8 MHz
2.7
3.8
4.3
4.6
3.6
4.7
5.2
5.5
1 MHz
2.7
3.8
4.3
4.6
3.6
4.7
5.2
5.5
48 MHz
223
244
255
260
245
265
279
284
32 MHz
176
195
203
206
193
212
221
224
24 MHz
154
171
178
181
168
185
192
195
8 MHz
74.2
83.4
86.4
87.3
83.4
92.5
95.3
96.6
µA
1. Current consumption from the VDDA supply is independent of whether the digital peripherals are enabled or disabled, being
in Run or Sleep mode or executing from Flash or RAM. Furthermore, when the PLL is off, IDDA is independent from the
frequency.
2. Data based on characterization results, not tested in production unless otherwise specified.
3. Data based on characterization results and tested in production (using one common test limit for sum of IDD and IDDA).
60/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Electrical characteristics
Table 31. Typical and maximum consumption in Stop and Standby modes
Max(1)
Typ @VDD (VDD = VDDA)
Parameter
Supply
current in
Stop
mode
IDD
Supply
current in
Standby
mode
Supply
current in
Stop
mode
Supply
current in
Standby
mode
Conditions
2.0 V 2.4 V 2.7 V 3.0 V 3.3 V 3.6 V
TA =
25 °C
TA =
85 °C
TA =
105 °C
Regulator in run
mode, all
oscillators OFF
15.4
15.5
15.6
15.7
15.8
15.9
23(2)
49
68(2)
Regulator in lowpower mode, all
oscillators OFF
3.2
3.3
3.4
3.5
3.6
3.7
8(2)
33
51(2)
LSI ON and IWDG
ON
0.8
1.0
1.1
1.2
1.3
1.4
-
-
-
LSI OFF and IWDG
OFF
0.6
0.7
0.9
0.9
1.0
1.1
2.1(2)
2.6
3.1(2)
Regulator in
run mode, all
oscillators
OFF
2.1
2.2
2.3
2.5
2.6
2.8
3.5(2)
3.6
4.6(2)
Regulator in
low-power
mode, all
oscillators
OFF
2.1
2.2
2.3
2.5
2.6
2.8
3.5(2)
3.6
4.6(2)
LSI ON and
IWDG ON
2.5
2.7
2.8
3.0
3.2
3.5
-
-
-
LSI OFF and
IWDG OFF
1.9
2.1
2.2
2.3
2.5
2.6
3.5(2)
3.6
4.6(2)
Regulator in
run mode, all
oscillators
OFF
1.3
1.3
1.4
1.4
1.5
1.5
-
-
-
Regulator in
low-power
mode, all
oscillators
OFF
1.3
1.3
1.4
1.4
1.5
1.5
-
-
-
LSI ON and
IWDG ON
1.7
1.8
1.9
2.0
2.1
2.2
-
-
-
LSI OFF and
IWDG OFF
1.2
1.2
1.2
1.3
1.3
1.4
-
-
-
VDDA monitoring ON
Symbol
Supply
current in
Stop
mode
Supply
current in
Standby
mode
VDDA monitoring OFF
IDDA
Unit
µA
1. Data based on characterization results, not tested in production unless otherwise specified.
2. Data based on characterization results and tested in production (using one common test limit for sum of IDD and IDDA).
DocID025004 Rev 3
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105
Electrical characteristics
STM32F072x8 STM32F072xB
Table 32. Typical and maximum current consumption from the VBAT supply
Max(1)
= 2.7 V
= 3.3 V
= 3.6 V
RTC
domain
IDD_VBAT
supply
current
= 2.4 V
Parameter
= 1.8 V
Symbol
= 1.65 V
Typ @ VBAT
TA =
25 °C
LSE & RTC ON; “Xtal
mode”: lower driving
capability;
LSEDRV[1:0] = '00'
0.5
0.6
0.7
0.8
1.1
1.2
1.3
LSE & RTC ON; “Xtal
mode” higher driving
capability;
LSEDRV[1:0] = '11'
0.8
Conditions
1.7
Unit
2.3
µA
0.9
1.1
1.2
1. Data based on characterization results, not tested in production.
62/135
TA =
TA =
85 °C 105 °C
DocID025004 Rev 3
1.4
1.6
1.7
2.1
2.8
STM32F072x8 STM32F072xB
Electrical characteristics
Typical current consumption
The MCU is placed under the following conditions:

VDD = VDDA = 3.3 V

All I/O pins are in analog input configuration

The Flash access time is adjusted to fHCLK frequency:
–
0 wait state and Prefetch OFF from 0 to 24 MHz
–
1 wait state and Prefetch ON above 24 MHz

When the peripherals are enabled, fPCLK = fHCLK

PLL is used for frequencies greater than 8 MHz

AHB prescaler of 2, 4, 8 and 16 is used for the frequencies 4 MHz, 2 MHz, 1 MHz and
500 kHz respectively
Table 33. Typical current consumption, code executing from Flash, running from HSE
8 MHz crystal
Typical consumption in
Run mode
Symbol
Parameter
Typical consumption in
Sleep mode
fHCLK
Unit
Peripherals Peripherals Peripherals Peripherals
enabled
disabled
enabled
disabled
IDD
IDDA
Current
consumption
from VDD
supply
Current
consumption
from VDDA
supply
48 MHz
24.1
13.5
14.6
3.5
36 MHz
18.3
10.5
11.1
2.9
32 MHz
16.5
9.6
10.0
2.7
24 MHz
12.9
7.6
7.8
2.2
16 MHz
8.9
5.3
5.5
1.7
8 MHz
4.8
3.1
3.1
1.2
4 MHz
3.1
2.1
2.2
1.1
2 MHz
2.1
1.6
1.6
1.0
1 MHz
1.6
1.3
1.4
1.0
500 kHz
1.3
1.2
1.2
1.0
48 MHz
163.3
36 MHz
124.3
32 MHz
111.9
24 MHz
87.1
16 MHz
62.5
8 MHz
2.5
4 MHz
2.5
2 MHz
2.5
1 MHz
2.5
500 kHz
2.5
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mA
μA
63/135
105
Electrical characteristics
STM32F072x8 STM32F072xB
I/O system current consumption
The current consumption of the I/O system has two components: static and dynamic.
I/O static current consumption
All the I/Os used as inputs with pull-up generate current consumption when the pin is
externally held low. The value of this current consumption can be simply computed by using
the pull-up/pull-down resistors values given in Table 53: I/O static characteristics.
For the output pins, any external pull-down or external load must also be considered to
estimate the current consumption.
Additional I/O current consumption is due to I/Os configured as inputs if an intermediate
voltage level is externally applied. This current consumption is caused by the input Schmitt
trigger circuits used to discriminate the input value. Unless this specific configuration is
required by the application, this supply current consumption can be avoided by configuring
these I/Os in analog mode. This is notably the case of ADC input pins which should be
configured as analog inputs.
Caution:
Any floating input pin can also settle to an intermediate voltage level or switch inadvertently,
as a result of external electromagnetic noise. To avoid current consumption related to
floating pins, they must either be configured in analog mode, or forced internally to a definite
digital value. This can be done either by using pull-up/down resistors or by configuring the
pins in output mode.
I/O dynamic current consumption
In addition to the internal peripheral current consumption measured previously (see
Table 35: Peripheral current consumption), the I/Os used by an application also contribute
to the current consumption. When an I/O pin switches, it uses the current from the I/O
supply voltage to supply the I/O pin circuitry and to charge/discharge the capacitive load
(internal or external) connected to the pin:
I SW = V DDIOx  f SW  C
where
ISW is the current sunk by a switching I/O to charge/discharge the capacitive load
VDDIOx is the I/O supply voltage
fSW is the I/O switching frequency
C is the total capacitance seen by the I/O pin: C = CINT + CEXT + CS
CS is the PCB board capacitance including the pad pin.
The test pin is configured in push-pull output mode and is toggled by software at a fixed
frequency.
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STM32F072x8 STM32F072xB
Electrical characteristics
Table 34. Switching output I/O current consumption
Symbol
Parameter
Conditions(1)
VDDIOx = 3.3 V
C =CINT
VDDIOx = 3.3 V
CEXT = 0 pF
C = CINT + CEXT+ CS
VDDIOx = 3.3 V
CEXT = 10 pF
C = CINT + CEXT+ CS
ISW
I/O current
consumption
VDDIOx = 3.3 V
CEXT = 22 pF
C = CINT + CEXT+ CS
VDDIOx = 3.3 V
CEXT = 33 pF
C = CINT + CEXT+ CS
VDDIOx = 3.3 V
CEXT = 47 pF
C = CINT + CEXT+ CS
C = Cint
VDDIOx = 2.4 V
CEXT = 47 pF
C = CINT + CEXT+ CS
C = Cint
I/O toggling
frequency (fSW)
Typ
4 MHz
0.07
8 MHz
0.15
16 MHz
0.31
24 MHz
0.53
48 MHz
0.92
4 MHz
0.18
8 MHz
0.37
16 MHz
0.76
24 MHz
1.39
48 MHz
2.188
4 MHz
0.32
8 MHz
0.64
16 MHz
1.25
24 MHz
2.23
48 MHz
4.442
4 MHz
0.49
8 MHz
0.94
16 MHz
2.38
24 MHz
3.99
4 MHz
0.64
8 MHz
1.25
16 MHz
3.24
24 MHz
5.02
4 MHz
0.81
8 MHz
1.7
16 MHz
3.67
4 MHz
0.66
8 MHz
1.43
16 MHz
2.45
24 MHz
4.97
Unit
mA
1. CS = 7 pF (estimated value).
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105
Electrical characteristics
STM32F072x8 STM32F072xB
On-chip peripheral current consumption
The current consumption of the on-chip peripherals is given in Table 35. The MCU is placed
under the following conditions:

All I/O pins are in analog mode

All peripherals are disabled unless otherwise mentioned

The given value is calculated by measuring the current consumption
–
with all peripherals clocked off
–
with only one peripheral clocked on

Ambient operating temperature and supply voltage conditions summarized in Table 21:
Voltage characteristics

The power consumption of the digital part of the on-chip peripherals is given
inTable 35. The power consumption of the analog part of the peripherals (where
applicable) is indicated in each related section of the datasheet.
Table 35. Peripheral current consumption
Peripheral
AHB
66/135
Typical consumption at 25 °C
BusMatrix(1)
2.2
CRC
1.6
DMA
5.7
Flash interface
13.0
GPIOA
8.2
GPIOB
8.5
GPIOC
2.3
GPIOD
1.9
GPIOE
2.2
GPIOF
1.2
SRAM
0.9
TSC
5.0
All AHB peripherals
52.6
DocID025004 Rev 3
Unit
µA/MHz
STM32F072x8 STM32F072xB
Electrical characteristics
Table 35. Peripheral current consumption (continued)
Peripheral
APB-Bridge
APB
Typical consumption at 25 °C
(2)
Unit
2.8
ADC(3)
4.1
CAN
12.4
CEC
1.5
CRS
0.8
DAC(3)
4.7
DEBUG (MCU debug feature)
0.1
I2C1
3.9
I2C2
4.0
PWR
1.3
SPI1
8.7
SPI2
8.5
SYSCFG & COMP
1.7
TIM1
14.9
TIM2
15.5
TIM3
11.4
TIM6
2.5
TIM7
2.3
TIM14
5.3
TIM15
9.1
TIM16
6.6
TIM17
6.8
USART1
17.0
USART2
16.7
USART3
5.4
USART4
5.4
USB
7.2
WWDG
1.4
All APB peripherals
182
µA/MHz
1. The BusMatrix is automatically active when at least one master is ON (CPU, DMA).
2. The APB Bridge is automatically active when at least one peripheral is ON on the Bus.
3. The power consumption of the analog part (IDDA) of peripherals such as ADC, DAC, Comparators, is not
included. Refer to the tables of characteristics in the subsequent sections.
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105
Electrical characteristics
6.3.6
STM32F072x8 STM32F072xB
Wakeup time from low-power mode
The wakeup times given in Table 36 are the latency between the event and the execution of
the first user instruction. The device goes in low-power mode after the WFE (Wait For
Event) instruction, in the case of a WFI (Wait For Interruption) instruction, 16 CPU cycles
must be added to the following timings due to the interrupt latency in the Cortex M0
architecture.
The SYSCLK clock source setting is kept unchanged after wakeup from Sleep mode.
During wakeup from Stop or Standby mode, SYSCLK takes the default setting: HSI 8 MHz.
The wakeup source from Sleep and Stop mode is an EXTI line configured in event mode.
The wakeup source from Standby mode is the WKUP1 pin (PA0).
All timings are derived from tests performed under the ambient temperature and supply
voltage conditions summarized in Table 24: General operating conditions.
Table 36. Low-power mode wakeup timings
Typ @VDD = VDDA
Symbol
Parameter
Conditions
Max Unit
= 2.0 V = 2.4 V = 2.7 V
tWUSTOP
tWUSTANDBY
tWUSLEEP
68/135
Wakeup from Stop
mode
=3V
= 3.3 V
Regulator in run
mode
3.2
3.1
2.9
2.9
2.8
5
Regulator in low
power mode
7.0
5.8
5.2
4.9
4.6
9
60.4
55.6
53.5
52
51
-
Wakeup from
Standby mode
-
Wakeup from Sleep
mode
-
µs
4 SYSCLK cycles
DocID025004 Rev 3
-
STM32F072x8 STM32F072xB
6.3.7
Electrical characteristics
External clock source characteristics
High-speed external user clock generated from an external source
In bypass mode the HSE oscillator is switched off and the input pin is a standard GPIO.
The external clock signal has to respect the I/O characteristics in Section 6.3.14. However,
the recommended clock input waveform is shown in Figure 15: High-speed external clock
source AC timing diagram.
Table 37. High-speed external user clock characteristics
Parameter(1)
Symbol
Min
Typ
Max
Unit
-
8
32
MHz
fHSE_ext
User external clock source frequency
VHSEH
OSC_IN input pin high level voltage
0.7 VDDIOx
-
VDDIOx
VHSEL
OSC_IN input pin low level voltage
VSS
-
0.3 VDDIOx
15
-
-
tw(HSEH)
tw(HSEL)
OSC_IN high or low time
tr(HSE)
tf(HSE)
OSC_IN rise or fall time
V
ns
-
-
20
1. Guaranteed by design, not tested in production.
Figure 15. High-speed external clock source AC timing diagram
WZ+6(+
9+6(+
9+6(/
WU+6(
WI+6(
WZ+6(/
W
7+6(
069
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105
Electrical characteristics
STM32F072x8 STM32F072xB
Low-speed external user clock generated from an external source
In bypass mode the LSE oscillator is switched off and the input pin is a standard GPIO.
The external clock signal has to respect the I/O characteristics in Section 6.3.14. However,
the recommended clock input waveform is shown in Figure 16.
Table 38. Low-speed external user clock characteristics
Parameter(1)
Symbol
fLSE_ext User external clock source frequency
Min
Typ
Max
Unit
-
32.768
1000
kHz
VLSEH
OSC32_IN input pin high level voltage
0.7 VDDIOx
-
VDDIOx
VLSEL
OSC32_IN input pin low level voltage
VSS
-
0.3 VDDIOx
450
-
-
tw(LSEH)
OSC32_IN high or low time
tw(LSEL)
tr(LSE)
tf(LSE)
V
ns
OSC32_IN rise or fall time
-
-
50
1. Guaranteed by design, not tested in production.
Figure 16. Low-speed external clock source AC timing diagram
WZ/6(+
9/6(+
9/6(/
WU/6(
WI/6(
WZ/6(/
W
7/6(
069
70/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Electrical characteristics
High-speed external clock generated from a crystal/ceramic resonator
The high-speed external (HSE) clock can be supplied with a 4 to 32 MHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on design
simulation results obtained with typical external components specified in Table 39. In the
application, the resonator and the load capacitors have to be placed as close as possible to
the oscillator pins in order to minimize output distortion and startup stabilization time. Refer
to the crystal resonator manufacturer for more details on the resonator characteristics
(frequency, package, accuracy).
Table 39. HSE oscillator characteristics
Symbol
fOSC_IN
RF
Conditions(1)
Min(2)
Typ
Max(2)
Unit
Oscillator frequency
-
4
8
32
MHz
Feedback resistor
-
-
200
-
k
Parameter
(3)
During startup
IDD
gm
tSU(HSE)(4)
HSE current consumption
Oscillator transconductance
Startup time
-
8.5
VDD = 3.3 V,
Rm = 30 ,
CL = 10 [email protected] MHz
-
0.4
-
VDD = 3.3 V,
Rm = 45 ,
CL = 10 [email protected] MHz
-
0.5
-
VDD = 3.3 V,
Rm = 30 ,
CL = 5 [email protected] MHz
-
0.8
-
VDD = 3.3 V,
Rm = 30 ,
CL = 10 [email protected] MHz
-
1
-
VDD = 3.3 V,
Rm = 30 ,
CL = 20 [email protected] MHz
-
1.5
-
Startup
10
-
-
mA/V
VDD is stabilized
-
2
-
ms
mA
1. Resonator characteristics given by the crystal/ceramic resonator manufacturer.
2. Guaranteed by design, not tested in production.
3. This consumption level occurs during the first 2/3 of the tSU(HSE) startup time
4. tSU(HSE) is the startup time measured from the moment it is enabled (by software) to a stabilized 8 MHz
oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly
with the crystal manufacturer
For CL1 and CL2, it is recommended to use high-quality external ceramic capacitors in the
5 pF to 20 pF range (Typ.), designed for high-frequency applications, and selected to match
the requirements of the crystal or resonator (see Figure 17). CL1 and CL2 are usually the
same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of CL1 and CL2. PCB and MCU pin capacitance must be included (10 pF
can be used as a rough estimate of the combined pin and board capacitance) when sizing
CL1 and CL2.
Note:
For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.
DocID025004 Rev 3
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105
Electrical characteristics
STM32F072x8 STM32F072xB
Figure 17. Typical application with an 8 MHz crystal
5HVRQDWRUZLWKLQWHJUDWHG
FDSDFLWRUV
&/
26&B,1
0+]
UHVRQDWRU
&/
5(;7 I+6(
5)
%LDV
FRQWUROOHG
JDLQ
26&B287
069
1. REXT value depends on the crystal characteristics.
72/135
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STM32F072x8 STM32F072xB
Electrical characteristics
Low-speed external clock generated from a crystal resonator
The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal resonator
oscillator. All the information given in this paragraph are based on design simulation results
obtained with typical external components specified in Table 40. In the application, the
resonator and the load capacitors have to be placed as close as possible to the oscillator
pins in order to minimize output distortion and startup stabilization time. Refer to the crystal
resonator manufacturer for more details on the resonator characteristics (frequency,
package, accuracy).
Table 40. LSE oscillator characteristics (fLSE = 32.768 kHz)
Symbol
IDD
gm
Parameter
LSE current consumption
Oscillator
transconductance
tSU(LSE)(3) Startup time
Conditions(1)
Min(2)
Typ
Max(2) Unit
LSEDRV[1:0]=00
lower driving capability
-
0.5
0.9
LSEDRV[1:0]= 01
medium low driving capability
-
-
1
LSEDRV[1:0] = 10
medium high driving capability
-
-
1.3
LSEDRV[1:0]=11
higher driving capability
-
-
1.6
LSEDRV[1:0]=00
lower driving capability
5
-
-
LSEDRV[1:0]= 01
medium low driving capability
8
-
-
LSEDRV[1:0] = 10
medium high driving capability
15
-
-
LSEDRV[1:0]=11
higher driving capability
25
-
-
VDDIOx is stabilized
-
2
-
µA
µA/V
s
1. Refer to the note and caution paragraphs below the table, and to the application note AN2867 “Oscillator design guide for
ST microcontrollers”.
2. Guaranteed by design, not tested in production.
3.
tSU(LSE) is the startup time measured from the moment it is enabled (by software) to a stabilized 32.768 kHz oscillation is
reached. This value is measured for a standard crystal and it can vary significantly with the crystal manufacturer
Note:
For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.
DocID025004 Rev 3
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105
Electrical characteristics
STM32F072x8 STM32F072xB
Figure 18. Typical application with a 32.768 kHz crystal
5HVRQDWRUZLWKLQWHJUDWHG
FDSDFLWRUV
&/
26&B,1
I/6(
'ULYH
SURJUDPPDEOH
DPSOLILHU
N+]
UHVRQDWRU
26&B287
&/
069
Note:
74/135
An external resistor is not required between OSC32_IN and OSC32_OUT and it is forbidden
to add one.
DocID025004 Rev 3
STM32F072x8 STM32F072xB
6.3.8
Electrical characteristics
Internal clock source characteristics
The parameters given in Table 41 are derived from tests performed under ambient
temperature and supply voltage conditions summarized in Table 24: General operating
conditions. The provided curves are characterization results, not tested in production.
High-speed internal (HSI) RC oscillator
Table 41. HSI oscillator characteristics(1)
Symbol
Parameter
fHSI
TRIM
DuCy(HSI)
Conditions
Min
Typ
Max
Unit
Frequency
-
-
8
-
MHz
HSI user trimming step
-
-
-
1(2)
%
-
45(2)
%
TA = -40 to 105°C
-2.8(3)
-
3.8(3)
TA = -10 to 85°C
-1.9(3)
-
2.3(3)
TA = 0 to 85°C
-1.9(3)
-
2(3)
TA = 0 to 70°C
-1.3(3)
-
2(3)
TA = 0 to 55°C
-1(3)
-
2(3)
-1
-
1
Duty cycle
Accuracy of the HSI
oscillator
ACCHSI
-
55(2)
TA = 25°C(4)
tsu(HSI)
IDDA(HSI)
%
HSI oscillator startup time
-
1(2)
-
2(2)
µs
HSI oscillator power
consumption
-
-
80
100(2)
µA
1. VDDA = 3.3 V, TA = -40 to 105°C unless otherwise specified.
2. Guaranteed by design, not tested in production.
3. Data based on characterization results, not tested in production.
4. Factory calibrated, parts not soldered.
Figure 19. HSI oscillator accuracy characterization results for soldered parts
."9
.*/
5<$>
"
069
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105
Electrical characteristics
STM32F072x8 STM32F072xB
High-speed internal 14 MHz (HSI14) RC oscillator (dedicated to ADC)
Table 42. HSI14 oscillator characteristics(1)
Symbol
fHSI14
TRIM
Parameter
Conditions
Min
Typ
-
-
14
Frequency
HSI14 user-trimming step
DuCy(HSI14) Duty cycle
-
-
-
(2)
45
Accuracy of the HSI14
oscillator (factory calibrated)
TA = –10 to 85 °C
TA = 25 °C
tsu(HSI14)
IDDA(HSI14)
-
MHz
(2)
-
%
1
55
(2)
%
(3)
%
(3)
-
5.1
–3.2(3)
-
3.1(3)
%
–2.5
-
2.3
(3)
%
–1
(3)
TA = 0 to 70 °C
Unit
-
TA = –40 to 105 °C –4.2
ACCHSI14
Max
HSI14 oscillator startup time
-
1(2)
HSI14 oscillator power
consumption
-
-
-
1
%
-
2(2)
µs
100
150(2)
µA
1. VDDA = 3.3 V, TA = –40 to 105 °C unless otherwise specified.
2. Guaranteed by design, not tested in production.
3. Data based on characterization results, not tested in production.
Figure 20. HSI14 oscillator accuracy characterization results
-!8
-).
4; #=
!
-36
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Electrical characteristics
High-speed internal 48 MHz (HSI48) RC oscillator
Table 43. HSI48 oscillator characteristics(1)
Symbol
fHSI48
TRIM
Parameter
Conditions
Min
Typ
Max
Unit
-
-
48
-
MHz
Frequency
HSI48 user-trimming step
(2)
-
DuCy(HSI48) Duty cycle
0.09
-
45
TA = –40 to 105 °C
ACCHSI48
TA = –10 to 85 °C
Accuracy of the HSI48
oscillator (factory calibrated) T = 0 to 70 °C
A
IDDA(HSI48)
0.14
-
%
(2)
%
(3)
0.2
55
(3)
-
4.7
%
-4.1(3)
-
3.7(3)
%
-
(3)
%
-4.9
(3)
-3.8
TA = 25 °C
tsu(HSI48)
(2)
(2)
-2.8
3.4
-
2.9
%
µs
µA
HSI48 oscillator startup time
-
-
-
6(2)
HSI48 oscillator power
consumption
-
-
312
350(2)
1. VDDA = 3.3 V, TA = –40 to 105 °C unless otherwise specified.
2. Guaranteed by design, not tested in production.
3. Data based on characterization results, not tested in production.
Figure 21. HSI48 oscillator accuracy characterization results
-!8
-).
4; #=
!
-36
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Electrical characteristics
STM32F072x8 STM32F072xB
Low-speed internal (LSI) RC oscillator
Table 44. LSI oscillator characteristics(1)
Symbol
fLSI
tsu(LSI)
Parameter
Min
Typ
Max
Unit
30
40
50
kHz
LSI oscillator startup time
-
-
85
µs
LSI oscillator power consumption
-
0.75
1.2
µA
Frequency
(2)
IDDA(LSI)(2)
1. VDDA = 3.3 V, TA = –40 to 105 °C unless otherwise specified.
2. Guaranteed by design, not tested in production.
6.3.9
PLL characteristics
The parameters given in Table 45 are derived from tests performed under ambient
temperature and supply voltage conditions summarized in Table 24: General operating
conditions.
Table 45. PLL characteristics
Value
Symbol
fPLL_IN
fPLL_OUT
tLOCK
JitterPLL
Parameter
Unit
Min
Typ
Max
1(2)
8.0
24(2)
MHz
PLL input clock duty cycle
(2)
40
-
60(2)
%
PLL multiplier output clock
16(2)
-
48
MHz
PLL lock time
-
-
200(2)
µs
Cycle-to-cycle jitter
-
-
300(2)
ps
PLL input clock(1)
1. Take care to use the appropriate multiplier factors to obtain PLL input clock values compatible with the
range defined by fPLL_OUT.
2. Guaranteed by design, not tested in production.
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STM32F072x8 STM32F072xB
6.3.10
Electrical characteristics
Memory characteristics
Flash memory
The characteristics are given at TA = –40 to 105 °C unless otherwise specified.
Table 46. Flash memory characteristics
Min
Typ
Max(1)
Unit
16-bit programming time TA–40 to +105 °C
40
53.5
60
µs
Page (2 KB) erase time
TA –40 to +105 °C
20
-
40
ms
tME
Mass erase time
TA –40 to +105 °C
20
-
40
ms
IDD
Supply current
Write mode
-
-
10
mA
Erase mode
-
-
12
mA
Symbol
tprog
tERASE
Parameter
Conditions
1. Guaranteed by design, not tested in production.
Table 47. Flash memory endurance and data retention
Symbol
NEND
Parameter
Endurance
Conditions
TA = –40 to +105 °C
1 kcycle
tRET
Data retention
(2)
at TA = 85 °C
1 kcycle(2) at TA = 105 °C
(2)
10 kcycle
at TA = 55 °C
Min(1)
Unit
10
kcycle
30
10
Year
20
1. Data based on characterization results, not tested in production.
2. Cycling performed over the whole temperature range.
6.3.11
EMC characteristics
Susceptibility tests are performed on a sample basis during device characterization.
Functional EMS (electromagnetic susceptibility)
While a simple application is executed on the device (toggling 2 LEDs through I/O ports).
the device is stressed by two electromagnetic events until a failure occurs. The failure is
indicated by the LEDs:

Electrostatic discharge (ESD) (positive and negative) is applied to all device pins until
a functional disturbance occurs. This test is compliant with the IEC 61000-4-2 standard.

FTB: A Burst of Fast Transient voltage (positive and negative) is applied to VDD and
VSS through a 100 pF capacitor, until a functional disturbance occurs. This test is
compliant with the IEC 61000-4-4 standard.
A device reset allows normal operations to be resumed.
The test results are given in Table 48. They are based on the EMS levels and classes
defined in application note AN1709.
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Electrical characteristics
STM32F072x8 STM32F072xB
Table 48. EMS characteristics
Symbol
Parameter
Level/
Class
Conditions
VFESD
VDD 3.3 V, LQFP100, TA +25 °C, 
Voltage limits to be applied on any I/O pin
fHCLK 48 MHz,
to induce a functional disturbance
conforming to IEC 61000-4-2
2B
VEFTB
Fast transient voltage burst limits to be
applied through 100 pF on VDD and VSS
pins to induce a functional disturbance
VDD3.3 V, LQFP100, TA +25°C, 
fHCLK 48 MHz,
conforming to IEC 61000-4-4
4B
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:

Corrupted program counter

Unexpected reset

Critical Data corruption (control registers...)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
Electromagnetic Interference (EMI)
The electromagnetic field emitted by the device are monitored while a simple application is
executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with
IEC 61967-2 standard which specifies the test board and the pin loading.
Table 49. EMI characteristics
Symbol Parameter
SEMI
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Conditions
Monitored
frequency band
0.1 to 30 MHz
VDD 3.6 V, TA 25 °C,
30 to 130 MHz
LQFP100 package
Peak level
compliant with 
130 MHz to 1 GHz
IEC 61967-2
EMI Level
DocID025004 Rev 3
Max vs. [fHSE/fHCLK]
Unit
8/48 MHz
-2
27
dBµV
17
4
-
STM32F072x8 STM32F072xB
6.3.12
Electrical characteristics
Electrical sensitivity characteristics
Based on three different tests (ESD, LU) using specific measurement methods, the device is
stressed in order to determine its performance in terms of electrical sensitivity.
Electrostatic discharge (ESD)
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts × (n+1) supply pins). This test
conforms to the JESD22-A114/C101 standard.
Table 50. ESD absolute maximum ratings
Symbol
Ratings
Conditions
Packages
Class
Maximum
value(1)
Unit
All
2
2000
V
C3
250
C4
500
VESD(HBM)
Electrostatic discharge voltage TA +25 °C, conforming
(human body model)
to JESD22-A114
VESD(CDM)
Electrostatic discharge voltage TA +25 °C, conforming WLCSP49
(charge device model)
to ANSI/ESD STM5.3.1 All others
V
1. Data based on characterization results, not tested in production.
Static latch-up
Two complementary static tests are required on six parts to assess the latch-up
performance:

A supply overvoltage is applied to each power supply pin.

A current injection is applied to each input, output and configurable I/O pin.
These tests are compliant with EIA/JESD 78A IC latch-up standard.
Table 51. Electrical sensitivities
Symbol
LU
6.3.13
Parameter
Static latch-up class
Conditions
TA +105 °C conforming to JESD78A
Class
II level A
I/O current injection characteristics
As a general rule, current injection to the I/O pins, due to external voltage below VSS or
above VDDIOx (for standard, 3.3 V-capable I/O pins) should be avoided during normal
product operation. However, in order to give an indication of the robustness of the
microcontroller in cases when abnormal injection accidentally happens, susceptibility tests
are performed on a sample basis during device characterization.
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Functional susceptibility to I/O current injection
While a simple application is executed on the device, the device is stressed by injecting
current into the I/O pins programmed in floating input mode. While current is injected into
the I/O pin, one at a time, the device is checked for functional failures.
The failure is indicated by an out of range parameter: ADC error above a certain limit (higher
than 5 LSB TUE), out of conventional limits of induced leakage current on adjacent pins (out
of the -5 µA/+0 µA range) or other functional failure (for example reset occurrence or
oscillator frequency deviation).
The characterization results are given in Table 52.
Negative induced leakage current is caused by negative injection and positive induced
leakage current is caused by positive injection.
Table 52. I/O current injection susceptibility
Functional
susceptibility
Symbol
Description
Unit
Negative Positive
injection injection
IINJ
6.3.14
Injected current on BOOT0 and PF1 pins
–0
NA
Injected current on PC0 pin
–0
+5
Injected current on PA11 and PA12 pins with induced
leakage current on adjacent pins less than -1 mA
–5
NA
Injected current on all other FT and FTf pins
–5
NA
Injected current on all other TTa, TC and RST pins
–5
+5
mA
I/O port characteristics
General input/output characteristics
Unless otherwise specified, the parameters given in Table 53 are derived from tests
performed under the conditions summarized in Table 24: General operating conditions. All
I/Os are designed as CMOS- and TTL-compliant (except BOOT0).
Table 53. I/O static characteristics
Symbol
VIL
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Parameter
Low level input
voltage
Conditions
Min
Typ
Max
TC and TTa I/O
-
-
0.3 VDDIOx+0.07(1)
FT and FTf I/O
-
-
0.475 VDDIOx–0.2(1)
BOOT0
-
-
0.3 VDDIOx–0.3(1)
All I/Os except
BOOT0 pin
-
-
0.3 VDDIOx
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STM32F072x8 STM32F072xB
Electrical characteristics
Table 53. I/O static characteristics (continued)
Symbol
VIH
Vhys
Ilkg
RPU
Parameter
High level input
voltage
Schmitt trigger
hysteresis
Input leakage
current(2)
Weak pull-up
equivalent resistor
(4)
RPD
Weak pull-down
equivalent
resistor(4)
CIO
I/O pin capacitance
Conditions
Min
TC and TTa I/O
0.445 VDDIOx+0.398
FT and FTf I/O
0.5 VDDIOx+0.2(1)
(1)
(1)
0.2 VDDIOx+0.95
BOOT0
Typ
Max
-
-
-
-
-
-
Unit
V
All I/Os except
BOOT0 pin
0.7 VDDIOx
-
TC and TTa I/O
-
200(1)
-
FT and FTf I/O
-
(1)
100
-
BOOT0
-
300(1)
-
TC, FT and FTf I/O
TTa in digital mode
VSS  VIN VDDIOx
-
-
0.1
TTa in digital mode
VDDIOx  VIN VDDA
-
-
1
TTa in analog mode
VSS  VIN VDDA
-
-
0.2
FT and FTf I/O (3)
VDDIOx VIN 5 V
-
-
10
VIN VSS
25
40
55
k
VIN VDDIOx
25
40
55
k
-
5
-
pF
-
mV
µA
1. Data based on design simulation only. Not tested in production.
2. The leakage could be higher than the maximum value, if negative current is injected on adjacent pins. Refer to Table 52:
I/O current injection susceptibility.
3. To sustain a voltage higher than VDDIOx + 0.3 V, the internal pull-up/pull-down resistors must be disabled.
4. Pull-up and pull-down resistors are designed with a true resistance in series with a switchable PMOS/NMOS. This
PMOS/NMOS contribution to the series resistance is minimal (~10% order).
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Electrical characteristics
STM32F072x8 STM32F072xB
All I/Os are CMOS- and TTL-compliant (no software configuration required). Their
characteristics cover more than the strict CMOS-technology or TTL parameters. The
coverage of these requirements is shown in Figure 22 for standard I/Os, and in Figure 23 for
5 V tolerant I/Os. The following curves are design simulation results, not tested in
production.
Figure 22. TC and TTa I/O input characteristics
3
VIN (V)
2.5
TESTED RANGE
TTL standard requirement
2
1.5
UNDEFINED INPUT RANGE
1
TTL standard requirement
0.5
TESTED RANGE
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VDDIOx
(V)
MS32130V3
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Electrical characteristics
Figure 23. Five volt tolerant (FT and FTf) I/O input characteristics
3
VIN (V)
2.5
TESTED RANGE
TTL standard requirement
2
1.5
1
TTL standard requirement
0.5
TESTED RANGE
0
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VDDIOx (V)
MS32131V3
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STM32F072x8 STM32F072xB
Output driving current
The GPIOs (general purpose input/outputs) can sink or source up to +/-8 mA, and sink or
source up to +/- 20 mA (with a relaxed VOL/VOH).
In the user application, the number of I/O pins which can drive current must be limited to
respect the absolute maximum rating specified in Section 6.2:

The sum of the currents sourced by all the I/Os on VDDIOx, plus the maximum
consumption of the MCU sourced on VDD, cannot exceed the absolute maximum rating
IVDD (see Table 21: Voltage characteristics).

The sum of the currents sunk by all the I/Os on VSS, plus the maximum consumption of
the MCU sunk on VSS, cannot exceed the absolute maximum rating IVSS (see
Table 21: Voltage characteristics).
Output voltage levels
Unless otherwise specified, the parameters given in the table below are derived from tests
performed under the ambient temperature and supply voltage conditions summarized in
Table 24: General operating conditions. All I/Os are CMOS- and TTL-compliant (FT, TTa or
TC unless otherwise specified).
Table 54. Output voltage characteristics(1)
Symbol
Parameter
VOL
Output low level voltage for an I/O pin
VOH
Output high level voltage for an I/O pin
VOL
Output low level voltage for an I/O pin
VOH
Output high level voltage for an I/O pin
VOL(3)
Output low level voltage for an I/O pin
VOH(3)
Output high level voltage for an I/O pin
VOL(3)
Output low level voltage for an I/O pin
VOH(3)
Output high level voltage for an I/O pin
VOL(4)
Output low level voltage for an I/O pin
VOH(4)
Output high level voltage for an I/O pin
VOLFm+(3)
Output low level voltage for an FTf I/O pin in
Fm+ mode
Conditions
Min
Max
CMOS port(2)
|IIO| = 8 mA
VDDIOx  2.7 V
-
0.4
VDDIOx–0.4
-
-
0.4
2.4
-
-
1.3
VDDIOx–1.3
-
-
0.4
VDDIOx–0.4
-
-
0.4
V
VDDIOx–0.4
-
V
|IIO| = 20 mA
VDDIOx  2.7 V
-
0.4
V
|IIO| = 10 mA
-
0.4
V
TTL port(2)
|IIO| = 8 mA
VDDIOx  2.7 V
|IIO| = 20 mA
VDDIOx  2.7 V
|IIO| = 6 mA
VDDIOx  2 V
|IIO| = 4 mA
Unit
V
V
V
V
1. The IIO current sourced or sunk by the device must always respect the absolute maximum rating specified in Table 21:
Voltage characteristics, and the sum of the currents sourced or sunk by all the I/Os (I/O ports and control pins) must always
respect the absolute maximum ratings IIO.
2. TTL and CMOS outputs are compatible with JEDEC standards JESD36 and JESD52.
3. Data based on characterization results. Not tested in production.
4. Data based on characterization results. Not tested in production.
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Electrical characteristics
Input/output AC characteristics
The definition and values of input/output AC characteristics are given in Figure 24 and
Table 55, respectively.
Unless otherwise specified, the parameters given are derived from tests performed under
the ambient temperature and supply voltage conditions summarized in Table 24: General
operating conditions.
Table 55. I/O AC characteristics(1)(2)
OSPEEDRy
[1:0] value(1)
Symbol
Parameter
Conditions
Min
Max
Unit
-
2
MHz
-
125
-
125
-
1
-
125
-
125
-
10
-
25
-
25
-
4
-
62.5
-
62.5
CL = 30 pF, VDDIOx  2.7 V
-
50
CL = 50 pF, VDDIOx  2.7 V
-
30
CL = 50 pF, 2 V VDDIOx  2.7 V
-
20
CL = 50 pF, VDDIOx  2 V
-
10
CL = 30 pF, VDDIOx  2.7 V
-
5
CL = 50 pF, VDDIOx  2.7 V
-
8
CL = 50 pF, 2 V VDDIOx  2.7 V
-
12
CL = 50 pF, VDDIOx  2 V
-
25
CL = 30 pF, VDDIOx  2.7 V
-
5
CL = 50 pF, VDDIOx  2.7 V
-
8
CL = 50 pF, 2 V VDDIOx  2.7 V
-
12
CL = 50 pF, VDDIOx  2 V
-
25
fmax(IO)out Maximum frequency(3)
x0
tf(IO)out
Output fall time
tr(IO)out
Output rise time
CL = 50 pF, VDDIOx  2 V
fmax(IO)out Maximum frequency(3)
tf(IO)out
Output fall time
tr(IO)out
Output rise time
CL = 50 pF, VDDIOx  2 V
fmax(IO)out Maximum frequency(3)
01
tf(IO)out
Output fall time
tr(IO)out
Output rise time
CL = 50 pF, VDDIOx  2 V
fmax(IO)out Maximum frequency(3)
tf(IO)out
Output fall time
tr(IO)out
Output rise time
CL = 50 pF, VDDIOx  2 V
fmax(IO)out Maximum frequency(3)
11
tf(IO)out
tr(IO)out
Output fall time
Output rise time
DocID025004 Rev 3
ns
MHz
ns
MHz
ns
MHz
ns
MHz
ns
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105
Electrical characteristics
STM32F072x8 STM32F072xB
Table 55. I/O AC characteristics(1)(2) (continued)
OSPEEDRy
[1:0] value(1)
Symbol
Parameter
Conditions
fmax(IO)out Maximum frequency(3)
Fm+
configuration
(4)
-
tf(IO)out
Output fall time
tr(IO)out
Output rise time
CL = 50 pF, VDDIOx  2 V
fmax(IO)out Maximum frequency(3)
CL = 50 pF, VDDIOx  2 V
tf(IO)out
Output fall time
tr(IO)out
Output rise time
tEXTIpw
Pulse width of external
signals detected by the
EXTI controller
-
Min
Max
Unit
-
2
MHz
-
12
-
34
-
0.5
-
16
-
44
10
-
ns
MHz
ns
ns
1. The I/O speed is configured using the OSPEEDRx[1:0] bits. Refer to the STM32F0xxxx RM0091 reference manual for a
description of GPIO Port configuration register.
2. Guaranteed by design, not tested in production.
3. The maximum frequency is defined in Figure 24.
4. When Fm+ configuration is set, the I/O speed control is bypassed. Refer to the STM32F0xxxx reference manual RM0091
for a detailed description of Fm+ I/O configuration.
Figure 24. I/O AC characteristics definition
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6.3.15
NRST pin characteristics
The NRST pin input driver uses the CMOS technology. It is connected to a permanent pullup resistor, RPU.
Unless otherwise specified, the parameters given in the table below are derived from tests
performed under the ambient temperature and supply voltage conditions summarized in
Table 24: General operating conditions.
Table 56. NRST pin characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
VIL(NRST)
NRST input low level voltage
-
-
-
0.3 VDD+0.07(1)
VIH(NRST)
NRST input high level voltage
-
0.445 VDD+0.398(1)
-
-
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STM32F072x8 STM32F072xB
Electrical characteristics
Table 56. NRST pin characteristics (continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vhys(NRST)
NRST Schmitt trigger voltage
hysteresis
-
-
200
-
mV
RPU
Weak pull-up equivalent
resistor(2)
VIN VSS
25
40
55
k
VF(NRST)
NRST input filtered pulse
-
-
-
100(1)
ns
2.7 < VDD < 3.6
300(3)
-
-
2.0 < VDD < 3.6
(3)
-
-
VNF(NRST) NRST input not filtered pulse
500
ns
1. Data based on design simulation only. Not tested in production.
2. The pull-up is designed with a true resistance in series with a switchable PMOS. This PMOS contribution to the series
resistance is minimal (~10% order).
3. Data based on design simulation only. Not tested in production.
Figure 25. Recommended NRST pin protection
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UHVHWFLUFXLW 9 ''
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069
1. The external capacitor protects the device against parasitic resets.
2. The user must ensure that the level on the NRST pin can go below the VIL(NRST) max level specified in
Table 56: NRST pin characteristics. Otherwise the reset will not be taken into account by the device.
6.3.16
12-bit ADC characteristics
Unless otherwise specified, the parameters given in Table 57 are preliminary values derived
from tests performed under ambient temperature, fPCLK frequency and VDDA supply voltage
conditions summarized in Table 24: General operating conditions.
Note:
It is recommended to perform a calibration after each power-up.
Table 57. ADC characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDDA
Analog supply voltage for
ADC ON
-
2.4
-
3.6
V
VDDA = 3.3 V
-
0.9
-
mA
-
0.6
-
14
MHz
12 bit resolution
0.043
-
1
MHz
IDDA (ADC)
Current consumption of
the ADC(1)
fADC
ADC clock frequency
fS(2)
Sampling rate
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Table 57. ADC characteristics (continued)
Symbol
fTRIG(2)
Parameter
Conditions
Min
Typ
Max
Unit
External trigger frequency
fADC = 14 MHz,
12 bit resolution
-
-
823
kHz
12 bit resolution
-
-
17
1/fADC
VAIN
Conversion voltage range
-
0
-
VDDA
V
RAIN(2)
External input impedance
See Equation 1 and
Table 58 for details
-
-
50
k
RADC(2)
Sampling switch
resistance
-
-
-
1
k
CADC(2)
Internal sample and hold
capacitor
-
-
-
8
pF
tCAL(2)(3)
Calibration time
WLATENCY(2)(4)
tlatr(2)
ADC_DR register ready
latency
fADC = 14 MHz
5.9
µs
-
83
1/fADC
ADC clock = HSI14
1.5 ADC
cycles + 2
fPCLK cycles
-
1.5 ADC
cycles + 3
fPCLK cycles
ADC clock = PCLK/2
-
4.5
-
fPCLK
cycle
ADC clock = PCLK/4
-
8.5
-
fPCLK
cycle
fADC = fPCLK/2 = 14 MHz
0.196
µs
fADC = fPCLK/2
5.5
1/fPCLK
0.219
µs
10.5
1/fPCLK
Trigger conversion latency fADC = fPCLK/4 = 12 MHz
fADC = fPCLK/4
JitterADC
tS(2)
fADC = fHSI14 = 14 MHz
0.179
-
0.250
µs
fADC = fHSI14
-
1
-
1/fHSI14
fADC = 14 MHz
0.107
-
17.1
µs
-
1.5
-
239.5
1/fADC
ADC jitter on trigger
conversion
Sampling time
tSTAB(2)
Stabilization time
tCONV(2)
Total conversion time
(including sampling time)
fADC = 14 MHz,
12 bit resolution
12 bit resolution
14
1
-
1/fADC
18
14 to 252 (tS for sampling +12.5 for
successive approximation)
µs
1/fADC
1. During conversion of the sampled value (12.5 x ADC clock period), an additional consumption of 100 µA on IDDA and 60 µA
on IDD should be taken into account.
2. Guaranteed by design, not tested in production.
3. Specified value includes only ADC timing. It does not include the latency of the register access.
4. This parameter specify latency for transfer of the conversion result to the ADC_DR register. EOC flag is set at this time.
90/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Electrical characteristics
Equation 1: RAIN max formula
TS
- – R ADC
R AIN  ------------------------------------------------------------N+2
f ADC  C ADC  ln  2

The formula above (Equation 1) is used to determine the maximum external impedance
allowed for an error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).
Table 58. RAIN max for fADC = 14 MHz
Ts (cycles)
tS (µs)
RAIN max (k)(1)
1.5
0.11
0.4
7.5
0.54
5.9
13.5
0.96
11.4
28.5
2.04
25.2
41.5
2.96
37.2
55.5
3.96
50
71.5
5.11
NA
239.5
17.1
NA
1. Guaranteed by design, not tested in production.
Table 59. ADC accuracy(1)(2)(3)
Symbol
Parameter
Test conditions
Typ
Max(4)
±1.3
±2
±1
±1.5
±0.5
±1.5
±0.7
±1
ET
Total unadjusted error
EO
Offset error
EG
Gain error
ED
Differential linearity error
EL
Integral linearity error
±0.8
±1.5
ET
Total unadjusted error
±3.3
±4
EO
Offset error
±1.9
±2.8
EG
Gain error
±2.8
±3
ED
Differential linearity error
±0.7
±1.3
EL
Integral linearity error
±1.2
±1.7
ET
Total unadjusted error
±3.3
±4
EO
Offset error
±1.9
±2.8
EG
Gain error
±2.8
±3
ED
Differential linearity error
±0.7
±1.3
EL
Integral linearity error
±1.2
±1.7
fPCLK = 48 MHz,
fADC = 14 MHz, RAIN < 10 k
VDDA = 3 V to 3.6 V
TA = 25 °C
fPCLK = 48 MHz,
fADC = 14 MHz, RAIN < 10 k
VDDA = 2.7 V to 3.6 V
TA = 40 to 105 °C
fPCLK = 48 MHz,
fADC = 14 MHz, RAIN < 10 k
VDDA = 2.4 V to 3.6 V
TA = 25 °C
Unit
LSB
LSB
LSB
1. ADC DC accuracy values are measured after internal calibration.
DocID025004 Rev 3
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105
Electrical characteristics
STM32F072x8 STM32F072xB
2. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-robust) analog input
pins should be avoided as this significantly reduces the accuracy of the conversion being performed on another analog
input. It is recommended to add a Schottky diode (pin to ground) to standard analog pins which may potentially inject
negative current. 
Any positive injection current within the limits specified for IINJ(PIN) and IINJ(PIN) in Section 6.3.14 does not affect the ADC
accuracy.
3. Better performance may be achieved in restricted VDDA, frequency and temperature ranges.
4. Data based on characterization results, not tested in production.
Figure 26. ADC accuracy characteristics
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Figure 27. Typical connection diagram using the ADC
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1. Refer to Table 57: ADC characteristics for the values of RAIN, RADC and CADC.
2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy
this, fADC should be reduced.
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 13: Power supply
scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as
close as possible to the chip.
92/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
6.3.17
Electrical characteristics
DAC electrical specifications
Table 60. DAC characteristics
Symbol
Parameter
Min
Typ
Max
Unit
Comments
VDDA
Analog supply voltage for
DAC ON
2.4
-
3.6
V
RLOAD(1)
Resistive load with buffer
ON
5
-
-
k
Load is referred to ground
RO(1)
CLOAD(1)
Impedance output with
buffer OFF
-
-
15
k
When the buffer is OFF, the
Minimum resistive load between
DAC_OUT and VSS to have a
1% accuracy is 1.5 M
Capacitive load
-
-
50
pF
Maximum capacitive load at
DAC_OUT pin (when the buffer
is ON).
It gives the maximum output
excursion of the DAC.
It corresponds to 12-bit input
code (0x0E0) to (0xF1C) at
VDDA = 3.6 V and (0x155) and
(0xEAB) at VDDA = 2.4 V
DAC_OUT
min(1)
Lower DAC_OUT voltage
with buffer ON
0.2
-
-
V
DAC_OUT
max(1)
Higher DAC_OUT voltage
with buffer ON
-
-
VDDA – 0.2
V
DAC_OUT
min(1)
Lower DAC_OUT voltage
with buffer OFF
-
0.5
-
mV
DAC_OUT
max(1)
Higher DAC_OUT voltage
with buffer OFF
-
-
VDDA – 1LSB
V
-
-
600
µA
IDDA(1)
DAC DC current
consumption in quiescent
mode(2)
With no load, middle code
(0x800) on the input
-
-
700
µA
With no load, worst code
(0xF1C) on the input
Differential non linearity
Difference between two
consecutive code-1LSB)
-
-
±0.5
LSB
Given for the DAC in 10-bit
configuration
-
-
±2
LSB
Given for the DAC in 12-bit
configuration
-
-
±1
LSB
Given for the DAC in 10-bit
configuration
-
-
±4
LSB
Given for the DAC in 12-bit
configuration
-
-
±10
mV
-
-
±3
LSB
Given for the DAC in 10-bit at
VDDA = 3.6 V
-
-
±12
LSB
Given for the DAC in 12-bit at
VDDA = 3.6 V
-
-
±0.5
%
DNL(3)
INL(3)
Offset(3)
Integral non linearity
(difference between
measured value at Code i
and the value at Code i on a
line drawn between Code 0
and last Code 1023)
Offset error
(difference between
measured value at Code
(0x800) and the ideal value
= VDDA/2)
Gain error(3) Gain error
DocID025004 Rev 3
It gives the maximum output
excursion of the DAC.
Given for the DAC in 12-bit
configuration
93/135
105
Electrical characteristics
STM32F072x8 STM32F072xB
Table 60. DAC characteristics (continued)
Symbol
Min
Typ
Max
Unit
Settling time (full scale: for a
10-bit input code transition
between the lowest and the
(3)
tSETTLING
highest input codes when
DAC_OUT reaches final
value ±1LSB
-
3
4
µs
Max frequency for a correct
DAC_OUT change when
small variation in the input
code (from code i to i+1LSB)
-
-
1
tWAKEUP(3)
Wakeup time from off state
(Setting the ENx bit in the
DAC Control register)
-
6.5
10
µs
CLOAD  50 pF, RLOAD  5 k
input code between lowest and
highest possible ones.
PSRR+ (1)
Power supply rejection ratio
(to VDDA) (static DC
measurement
-
–67
–40
dB
No RLOAD, CLOAD = 50 pF
Update
rate(3)
Parameter
Comments
CLOAD  50 pF, RLOAD  5 k
MS/s CLOAD  50 pF, RLOAD  5 k
1. Guaranteed by design, not tested in production.
2. The DAC is in “quiescent mode” when it keeps the value steady on the output so no dynamic consumption is involved.
3. Data based on characterization results, not tested in production.
Figure 28. 12-bit buffered / non-buffered DAC
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1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external
loads directly without the use of an external operational amplifier. The buffer can be bypassed by
configuring the BOFFx bit in the DAC_CR register.
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STM32F072x8 STM32F072xB
6.3.18
Electrical characteristics
Comparator characteristics
Table 61. Comparator characteristics
Symbol
VDDA
Parameter
Conditions
Min(1) Typ Max(1)
Analog supply voltage
-
2
-
3.6
VIN
Comparator input
voltage range
-
0
-
VDDA
VSC
VREFINT scaler offset
voltage
-
-
±5
±10
tS_SC
VREFINT scaler startup
time from power down
First VREFINT scaler activation after device
power on
-
-
Next activations
-
-
0.2
Startup time to reach propagation delay
specification
-
-
60
Ultra-low power mode
-
2
4.5
Low power mode
-
0.7
1.5
Medium power mode
-
0.3
0.6
VDDA  2.7 V
-
50
100
VDDA  2.7 V
-
100
240
Ultra-low power mode
-
2
7
Low power mode
-
0.7
2.1
Medium power mode
-
0.3
1.2
VDDA  2.7 V
-
90
180
VDDA  2.7 V
-
110
300
tSTART
Comparator startup
time
Propagation delay for 
200 mV step with
100 mV overdrive
High speed mode
tD
Propagation delay for
full range step with
100 mV overdrive
High speed mode
Unit
V
mV
1000
(2)
ms
µs
µs
ns
µs
ns
Voffset
Comparator offset error
-
4
10
mV
dVoffset/dT
Offset error
temperature coefficient
-
18
-
µV/°C
Ultra-low power mode
-
1.2
1.5
Low power mode
-
3
5
Medium power mode
-
10
15
High speed mode
-
75
100
IDD(COMP)
COMP current
consumption
DocID025004 Rev 3
µA
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105
Electrical characteristics
STM32F072x8 STM32F072xB
Table 61. Comparator characteristics (continued)
Symbol
Parameter
Min(1) Typ Max(1)
Conditions
No hysteresis 
(COMPxHYST[1:0]=00)
Vhys
Comparator hysteresis
-
High speed mode
Low hysteresis 
(COMPxHYST[1:0]=01) All other power
modes
3
High speed mode
Medium hysteresis
(COMPxHYST[1:0]=10) All other power
modes
7
High speed mode
High hysteresis
(COMPxHYST[1:0]=11) All other power
modes
18
5
9
19
0
Unit
13
8
10
26
15
mV
19
49
31
40
1. Data based on characterization results, not tested in production.
2. For more details and conditions see Figure 29: Maximum VREFINT scaler startup time from power down.
Figure 29. Maximum VREFINT scaler startup time from power down
Min
Typ
Max
Unit
-
1
2
°C
4.0
4.3
4.6
mV/°C
1.34
1.43
1.52
V
6.3.19
Temperature sensor characteristics
Table 62. TS characteristics
Symbol
Parameter
TL(1)
Avg_Slope
V30
96/135
VSENSE linearity with temperature
(1)
Average slope
Voltage at 30 °C (5
°C)(2)
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Electrical characteristics
Table 62. TS characteristics
Symbol
tSTART
(1)
tS_temp(1)
Parameter
Min
Typ
Max
Unit
ADC_IN16 buffer startup time
-
-
10
µs
ADC sampling time when reading the
temperature
4
-
-
µs
1. Guaranteed by design, not tested in production.
2. Measured at VDDA = 3.3 V 10 mV. The V30 ADC conversion result is stored in the TS_CAL1 byteRefer to Table 3:
Temperature sensor calibration values.
6.3.20
VBAT monitoring characteristics
Table 63. VBAT monitoring characteristics
Symbol
Parameter
Min
Typ
Max
Unit
k
R
Resistor bridge for VBAT
-
2 x 50
-
Q
Ratio on VBAT measurement
-
2
-
Error on Q
–1
-
+1
%
ADC sampling time when reading the VBAT
4
-
-
µs
Er(1)
tS_vbat(1)
1. Guaranteed by design, not tested in production.
6.3.21
Timer characteristics
The parameters given in the following tables are guaranteed by design.
Refer to Section 6.3.14: I/O port characteristics for details on the input/output alternate
function characteristics (output compare, input capture, external clock, PWM output).
Table 64. TIMx characteristics
Symbol
Parameter
tres(TIM)
Timer resolution time
fEXT
Timer external clock
frequency on CH1 to
CH4
ResTIM
tCOUNTER
tMAX_COUNT
Timer resolution
16-bit counter clock
period
Maximum possible count
with 32-bit counter
Conditions
Min
Max
Unit
-
1
-
tTIMxCLK
fTIMxCLK = 48 MHz
20.8
-
ns
0
fTIMxCLK/2
MHz
fTIMxCLK = 48 MHz
0
24
MHz
TIMx (except TIM2)
-
16
TIM2
-
32
-
1
65536
tTIMxCLK
fTIMxCLK = 48 MHz
0.0208
1365
µs
-
-
65536 × 65536
tTIMxCLK
fTIMxCLK = 48 MHz
-
89.48
s
-
DocID025004 Rev 3
bit
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105
Electrical characteristics
STM32F072x8 STM32F072xB
Table 65. IWDG min/max timeout period at 40 kHz (LSI)(1)
Prescaler divider
PR[2:0] bits
Min timeout RL[11:0]=
0x000
Max timeout RL[11:0]=
0xFFF
/4
0
0.1
409.6
/8
1
0.2
819.2
/16
2
0.4
1638.4
/32
3
0.8
3276.8
/64
4
1.6
6553.6
/128
5
3.2
13107.2
/256
6 or 7
6.4
26214.4
Unit
ms
1. These timings are given for a 40 kHz clock but the microcontroller internal RC frequency can vary from 30
to 60 kHz. Moreover, given an exact RC oscillator frequency, the exact timings still depend on the phasing
of the APB interface clock versus the LSI clock so that there is always a full RC period of uncertainty.
Table 66. WWDG min/max timeout value at 48 MHz (PCLK)
6.3.22
Prescaler
WDGTB
Min timeout value
Max timeout value
1
0
0.0853
5.4613
2
1
0.1706
10.9226
4
2
0.3413
21.8453
8
3
0.6826
43.6906
Unit
ms
Communication interfaces
I2C interface characteristics
The I2C interface meets the timings requirements of the I2C-bus specification and user
manual rev. 03 for:

Standard-mode (Sm): with a bit rate up to 100 kbit/s

Fast-mode (Fm): with a bit rate up to 400 kbit/s

Fast-mode Plus (Fm+): with a bit rate up to 1 Mbit/s.
The I2C timings requirements are guaranteed by design when the I2C peripheral is properly
configured (refer to Reference manual).
The SDA and SCL I/O requirements are met with the following restrictions: the SDA and
SCL I/O pins are not “true” open-drain. When configured as open-drain, the PMOS
connected between the I/O pin and VDDIOx is disabled, but is still present. Only FTf I/O pins
support Fm+ low level output current maximum requirement. Refer to Section 6.3.14: I/O
port characteristics for the I2C I/Os characteristics.
All I2C SDA and SCL I/Os embed an analog filter. Refer to the table below for the analog
filter characteristics:
98/135
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STM32F072x8 STM32F072xB
Electrical characteristics
Table 67. I2C analog filter characteristics(1)
Symbol
Parameter
Min
Max
Unit
tAF
Maximum pulse width of spikes that
are suppressed by the analog filter
50(2)
260(3)
ns
1. Guaranteed by design, not tested in production.
2. Spikes with widths below tAF(min) are filtered.
3. Spikes with widths above tAF(max) are not filtered
DocID025004 Rev 3
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105
Electrical characteristics
STM32F072x8 STM32F072xB
SPI/I2S characteristics
Unless otherwise specified, the parameters given in Table 68 for SPI or in Table 69 for I2S
are derived from tests performed under the ambient temperature, fPCLKx frequency and
supply voltage conditions summarized in Table 24: General operating conditions.
Refer to Section 6.3.14: I/O port characteristics for more details on the input/output alternate
function characteristics (NSS, SCK, MOSI, MISO for SPI and WS, CK, SD for I2S).
Table 68. SPI characteristics(1)
Symbol
fSCK
1/tc(SCK)
Parameter
SPI clock frequency
Conditions
Min
Max
Master mode
-
18
Slave mode
-
18
-
6
tr(SCK)
tf(SCK)
SPI clock rise and fall
time
Capacitive load: C = 15 pF
tsu(NSS)
NSS setup time
Slave mode
4Tpclk
-
th(NSS)
NSS hold time
Slave mode
2Tpclk + 10
-
SCK high and low time
Master mode, fPCLK = 36 MHz,
presc = 4
Tpclk/2 -2
Tpclk/2 + 1
Master mode
4
-
Slave mode
5
-
Master mode
4
-
Slave mode
5
-
Data output access time
Slave mode, fPCLK = 20 MHz
0
3Tpclk
Data output disable time
Slave mode
0
18
tv(SO)
Data output valid time
Slave mode (after enable edge)
-
22.5
tv(MO)
Data output valid time
Master mode (after enable edge)
-
6
Slave mode (after enable edge)
11.5
-
Master mode (after enable edge)
2
-
Slave mode
25
75
tw(SCKH)
tw(SCKL)
tsu(MI)
tsu(SI)
th(MI)
th(SI)
ta(SO)(2)
tdis(SO)
(3)
th(SO)
th(MO)
DuCy(SCK)
Data input setup time
Data input hold time
Data output hold time
SPI slave input clock
duty cycle
Unit
MHz
ns
ns
%
1. Data based on characterization results, not tested in production.
2. Min time is for the minimum time to drive the output and the max time is for the maximum time to validate the data.
3. Min time is for the minimum time to invalidate the output and the max time is for the maximum time to put the data in Hi-Z
100/135
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STM32F072x8 STM32F072xB
Electrical characteristics
Figure 30. SPI timing diagram - slave mode and CPHA = 0
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1. Measurement points are done at CMOS levels: 0.3 VDD and 0.7 VDD.
DocID025004 Rev 3
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105
Electrical characteristics
STM32F072x8 STM32F072xB
Figure 32. SPI timing diagram - master mode
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1. Measurement points are done at CMOS levels: 0.3 VDD and 0.7 VDD.
Table 69. I2S characteristics(1)
Symbol
fCK
1/tc(CK)
Parameter
I2S
clock frequency
tr(CK)
I2S clock rise time
tf(CK)
I2S clock fall time
Conditions
Min
Max
1.597
1.601
Slave mode
0
6.5
Capacitive load CL = 15 pF
-
10
-
12
306
-
312
-
Master mode (data: 16 bits, Audio
frequency = 48 kHz)
Master fPCLK= 16 MHz, audio
frequency = 48 kHz
tw(CKH)
I2S clock high time
tw(CKL)
I2S clock low time
tv(WS)
WS valid time
Master mode
2
-
th(WS)
WS hold time
Master mode
2
-
tsu(WS)
WS setup time
Slave mode
7
-
th(WS)
WS hold time
Slave mode
0
-
I2S slave input clock duty
cycle
Slave mode
25
75
DuCy(SCK)
102/135
DocID025004 Rev 3
Unit
MHz
ns
%
STM32F072x8 STM32F072xB
Electrical characteristics
Table 69. I2S characteristics(1) (continued)
Symbol
Parameter
Conditions
Min
Max
tsu(SD_MR)
Data input setup time
Master receiver
6
-
tsu(SD_SR)
Data input setup time
Slave receiver
2
-
Master receiver
4
-
Slave receiver
0.5
-
-
20
13
-
-
4
0
-
th(SD_MR)
th(SD_SR)
tv(SD_ST)
(2)
(2)
(2)
Data input hold time
Data output valid time
th(SD_ST)
Data output hold time
tv(SD_MT)(2)
Data output valid time
th(SD_MT)
Data output hold time
Slave transmitter (after enable edge)
Slave transmitter (after enable edge)
Master transmitter (after enable edge)
Master transmitter (after enable edge)
Unit
ns
1. Data based on design simulation and/or characterization results, not tested in production.
2. Depends on fPCLK. For example, if fPCLK = 8 MHz, then TPCLK = 1/fPLCLK = 125 ns.
Figure 33. I2S slave timing diagram (Philips protocol)
&.,QSXW
WF&.
&32/ &32/ WZ&.+
WK:6
WZ&./
:6LQSXW
WY6'B67
WVX:6
6'WUDQVPLW
/6%WUDQVPLW
06%WUDQVPLW
WVX6'B65
6'UHFHLYH
/6%UHFHLYH
%LWQWUDQVPLW
WK6'B67
/6%WUDQVPLW
WK6'B65
06%UHFHLYH
%LWQUHFHLYH
/6%UHFHLYH
DLE
1. Measurement points are done at CMOS levels: 0.3 × VDDIOx and 0.7 × VDDIOx.
2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
DocID025004 Rev 3
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105
Electrical characteristics
STM32F072x8 STM32F072xB
Figure 34. I2S master timing diagram (Philips protocol)
TF#+
TR#+
#+OUTPUT
TC#+
#0/,
TW#+(
#0/,
TV73
TH73
TW#+,
73OUTPUT
TV3$?-4
3$TRANSMIT
,3"TRANSMIT
-3"TRANSMIT
3$RECEIVE
,3"TRANSMIT
TH3$?-2
TSU3$?-2
,3"RECEIVE
"ITNTRANSMIT
TH3$?-4
-3"RECEIVE
"ITNRECEIVE
,3"RECEIVE
AIB
1. Data based on characterization results, not tested in production.
2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
104/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Electrical characteristics
USB characteristics
The STM32F072x8/xB USB interface is fully compliant with the USB specification version
2.0 and is USB-IF certified (for Full-speed device operation).
Table 70. USB electrical characteristics
Symbol
Conditions
Min.
Typ
Max.
Unit
USB transceiver operating
voltage
-
3.0(1)
-
3.6
V
tSTARTUP(2)
USB transceiver startup time
-
-
-
1.0
µs
RPUI
Embedded USB_DP pull-up
value during idle
-
1.1
1.26
1.5
RPUR
Embedded USB_DP pull-up
value during reception
-
ZDRV(2)
Output driver impedance(3)
VDDIO2
Parameter
k
Driving high
and low
2.0
2.26
2.6
28
40
44

1. The STM32F072x8/xB USB functionality is ensured down to 2.7 V but not the full USB electrical
characteristics which are degraded in the 2.7-to-3.0 V voltage range.
2. Guaranteed by design, not tested in production.
3. No external termination series resistors are required on USB_DP (D+) and USB_DM (D-); the matching
impedance is already included in the embedded driver.
CAN (controller area network) interface
Refer to Section 6.3.14: I/O port characteristics for more details on the input/output alternate
function characteristics (CAN_TX and CAN_RX).
DocID025004 Rev 3
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105
Package information
7
STM32F072x8 STM32F072xB
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
7.1
UFBGA100 package information
Figure 35. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array package outline
= 6HDWLQJSODQH
GGG =
$ $ $
$ $
(
$EDOO
$EDOO
LGHQWLILHU LQGH[DUHD
=
H
;
(
$
=
'
'
H
<
0
%277209,(:
‘EEDOOV
‘ HHH 0 = < ;
‘ III 0 =
7239,(:
$&B0(B9
1. Drawing is not to scale.
Table 71. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array
package mechanical data
inches(1)
millimeters
Symbol
106/135
Min.
Typ.
Max.
Min.
Typ.
Max.
A
-
-
0.600
-
-
0.0236
A1
-
-
0.110
-
-
0.0043
A2
-
0.450
-
-
0.0177
-
A3
-
0.130
-
-
0.0051
0.0094
A4
-
0.320
-
-
0.0126
-
b
0.240
0.290
0.340
0.0094
0.0114
0.0134
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Package information
Table 71. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array
package mechanical data (continued)
inches(1)
millimeters
Symbol
Min.
Typ.
Max.
Min.
Typ.
Max.
D
6.850
7.000
7.150
0.2697
0.2756
0.2815
D1
-
5.500
-
-
0.2165
-
E
6.850
7.000
7.150
0.2697
0.2756
0.2815
E1
-
5.500
-
-
0.2165
-
e
-
0.500
-
-
0.0197
-
Z
-
0.750
-
-
0.0295
-
ddd
-
-
0.080
-
-
0.0031
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 36. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array package recommended footprint
'SDG
'VP
$&B)3B9
Table 72. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.280 mm
Dsm
0.370 mm typ. (depends on the solder mask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
DocID025004 Rev 3
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131
Package information
STM32F072x8 STM32F072xB
Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.
Figure 37. UFBGA100 marking example (package top view)
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7#)
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3
069
1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
108/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
LQFP100 package information
Figure 38. LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat package outline
MM
C
!
!
3%!4).'0,!.%
#
!
'!5'%0,!.%
$
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+
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,
$
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)$%.4)&)#!4)/.
%
%
%
B
7.2
Package information
E
,?-%?6
1. Drawing is not to scale.
Table 73. LQPF100 - 100-pin, 14 x 14 mm low-profile quad flat package
mechanical data
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
-
-
1.600
-
-
0.0630
A1
0.050
-
0.150
0.0020
-
0.0059
A2
1.350
1.400
1.450
0.0531
0.0551
0.0571
b
0.170
0.220
0.270
0.0067
0.0087
0.0106
c
0.090
-
0.200
0.0035
-
0.0079
D
15.800
16.000
16.200
0.6220
0.6299
0.6378
D1
13.800
14.000
14.200
0.5433
0.5512
0.5591
DocID025004 Rev 3
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131
Package information
STM32F072x8 STM32F072xB
Table 73. LQPF100 - 100-pin, 14 x 14 mm low-profile quad flat package
mechanical data (continued)
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
D3
-
12.000
-
-
0.4724
-
E
15.800
16.000
16.200
0.6220
0.6299
0.6378
E1
13.800
14.000
14.200
0.5433
0.5512
0.5591
E3
-
12.000
-
-
0.4724
-
e
-
0.500
-
-
0.0197
-
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
-
1.000
-
-
0.0394
-
k
0.0°
3.5°
7.0°
0.0°
3.5°
7.0°
ccc
-
-
0.080
-
-
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 39. LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat
recommended footprint
AIC
1. Dimensions are expressed in millimeters.
110/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Package information
Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.
Figure 40. LQFP100 marking example (package top view)
3URGXFWLGHQWLILFDWLRQ
45.'
7#5
3
5HYLVLRQFRGH
'DWHFRGH
: 88
3LQLGHQWLILFDWLRQ
069
1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
DocID025004 Rev 3
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131
Package information
7.3
STM32F072x8 STM32F072xB
UFBGA64 package information
Figure 41. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid
array package outline
= 6HDWLQJSODQH
GGG =
$
$ $
$ $
(
H
$EDOO
$EDOO
LGHQWLILHU LQGH[DUHD
)
;
(
$
)
'
'
H
<
+
%277209,(:
‘EEDOOV
‘ HHH 0 = < ;
‘ III 0 =
7239,(:
$B0(B9
1. Drawing is not to scale.
Table 74. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid
array package mechanical data
inches(1)
millimeters
Symbol
112/135
Min
Typ
Max
Min
Typ
Max
A
0.460
0.530
0.600
0.0181
0.0209
0.0236
A1
0.050
0.080
0.110
0.0020
0.0031
0.0043
A2
0.400
0.450
0.500
0.0157
0.0177
0.0197
A3
0.080
0.130
0.180
0.0031
0.0051
0.0071
A4
0.270
0.320
0.370
0.0106
0.0126
0.0146
b
0.170
0.280
0.330
0.0067
0.0110
0.0130
D
4.850
5.000
5.150
0.1909
0.1969
0.2028
D1
3.450
3.500
3.550
0.1358
0.1378
0.1398
E
4.850
5.000
5.150
0.1909
0.1969
0.2028
E1
3.450
3.500
3.550
0.1358
0.1378
0.1398
e
-
0.500
-
-
0.0197
-
F
0.700
0.750
0.800
0.0276
0.0295
0.0315
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Package information
Table 74. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid
array package mechanical data (continued)
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
0.460
0.530
0.600
0.0181
0.0209
0.0236
ddd
-
-
0.080
-
-
0.0031
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 42. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid
array package recommended footprint
'SDG
'VP
$B)3B9
Table 75. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Pad trace width
0.100 mm
DocID025004 Rev 3
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131
Package information
STM32F072x8 STM32F072xB
Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Figure 43. UFBGA64 marking example (package top view)
3URGXFWLGHQWLILFDWLRQ &43#)
'DWHFRGH
:
88
5HYLVLRQFRGH
3
%DOOLGHQWLILFDWLRQ
069
1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
114/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
LQFP64 package information
Figure 44. LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package outline
PP
*$8*(3/$1(
F
$
$
6($7,1*3/$1(
&
$
$
FFF &
'
'
'
.
/
/
3,1
,'(17,),&$7,21
(
(
E
(
7.4
Package information
H
:B0(B9
1. Drawing is not to scale.
Table 76. LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat
package mechanical data
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
-
-
1.600
-
-
0.0630
A1
0.050
-
0.150
0.0020
-
0.0059
A2
1.350
1.400
1.450
0.0531
0.0551
0.0571
b
0.170
0.220
0.270
0.0067
0.0087
0.0106
c
0.090
-
0.200
0.0035
-
0.0079
D
-
12.000
-
-
0.4724
-
D1
-
10.000
-
-
0.3937
-
D3
-
7.500
-
-
0.2953
-
E
-
12.000
-
-
0.4724
-
E1
-
10.000
-
-
0.3937
-
DocID025004 Rev 3
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131
Package information
STM32F072x8 STM32F072xB
Table 76. LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat
package mechanical data (continued)
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
E3
-
7.500
-
-
0.2953
-
e
-
0.500
-
-
0.0197
-
K
0°
3.5°
7°
0°
3.5°
7°
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
-
1.000
-
-
0.0394
-
ccc
-
-
0.080
-
-
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 45. LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package
recommended footprint
AIC
1. Dimensions are expressed in millimeters.
116/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Package information
Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.
Figure 46. LQFP64 marking example (package top view)
5HYLVLRQFRGH
3
3URGXFWLGHQWLILFDWLRQ
45.'
3#5
'DWHFRGH
: 88
3LQLGHQWLILFDWLRQ
069
1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
DocID025004 Rev 3
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131
Package information
7.5
STM32F072x8 STM32F072xB
WLCSP49 package information
Figure 47. WLCSP49 - 49-ball, 3.277 x 3.109 mm, 0.4 mm pitch wafer level chip scale
package outline
H
EEE =
)
$EDOOORFDWLRQ
$
*
'HWDLO$
H (
H
*
$
$
H
%XPSVLGH
6LGHYLHZ
$
)URQWYLHZ
%XPS
'
$
HHH =
E
6HDWLQJSODQH
(
'HWDLO$
URWDWHGƒ
$RULHQWDWLRQ
UHIHUHQFH
DDD
;
:DIHUEDFNVLGH
1. Drawing is not to scale.
118/135
DocID025004 Rev 3
$;/B0(B9
STM32F072x8 STM32F072xB
Package information
Table 77. WLCSP49 - 49-ball, 3.277 x 3.109 mm, 0.4 mm pitch wafer level chip scale
package mechanical data
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
0.525
0.555
0.585
0.0207
0.0219
0.0230
A1
-
0.175
-
-
0.0069
-
A2
-
0.380
-
-
0.0150
-
-
0.025
-
-
0.0010
-
b(3)
0.220
0.250
0.280
0.0087
0.0098
0.0110
D
3.242
3.277
3.312
0.1276
0.1290
0.1304
E
3.074
3.109
3.144
0.1210
0.1224
0.1238
e
-
0.400
-
-
0.0157
-
e1
-
2.400
-
-
0.0945
-
e2
-
2.400
-
-
0.0945
-
F
-
0.4385
-
-
0.0173
-
G
-
0.3545
-
-
0.0140
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
A3
(2)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
DocID025004 Rev 3
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131
Package information
STM32F072x8 STM32F072xB
Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Figure 48. WLCSP49 marking example (package top view)
3LQLGHQWLILFDWLRQ
3URGXFWLGHQWLILFDWLRQ
'$#:
'DWHFRGH
5HYLVLRQFRGH
:
88
3
069
1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
120/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
LQFP48 package information
Figure 49. LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package outline
3%!4).'
0,!.%
#
C
!
!
!
MM
'!5'%0,!.%
CCC #
$
+
!
$
,
,
$
0).
)$%.4)&)#!4)/.
%
%
B
%
7.6
Package information
E
"?-%?6
1. Drawing is not to scale.
DocID025004 Rev 3
121/135
131
Package information
STM32F072x8 STM32F072xB
Table 78. LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package
mechanical data
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
-
-
1.600
-
-
0.0630
A1
0.050
-
0.150
0.0020
-
0.0059
A2
1.350
1.400
1.450
0.0531
0.0551
0.0571
b
0.170
0.220
0.270
0.0067
0.0087
0.0106
c
0.090
-
0.200
0.0035
-
0.0079
D
8.800
9.000
9.200
0.3465
0.3543
0.3622
D1
6.800
7.000
7.200
0.2677
0.2756
0.2835
D3
-
5.500
-
-
0.2165
-
E
8.800
9.000
9.200
0.3465
0.3543
0.3622
E1
6.800
7.000
7.200
0.2677
0.2756
0.2835
E3
-
5.500
-
-
0.2165
-
e
-
0.500
-
-
0.0197
-
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
-
1.000
-
-
0.0394
-
k
0°
3.5°
7°
0°
3.5°
7°
ccc
-
-
0.080
-
-
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
122/135
DocID025004 Rev 3
STM32F072x8 STM32F072xB
Package information
Figure 50. LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package
recommended footprint
AID
1. Dimensions are expressed in millimeters.
DocID025004 Rev 3
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131
Package information
STM32F072x8 STM32F072xB
Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.
Figure 51. LQFP48 marking example (package top view)
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1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
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7.7
Package information
UFQFPN48 package information
Figure 52. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package outline
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1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
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Package information
STM32F072x8 STM32F072xB
Table 79. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package mechanical data
inches(1)
millimeters
Symbol
Min
Typ
Max
Min
Typ
Max
A
0.500
0.550
0.600
0.0197
0.0217
0.0236
A1
0.000
0.020
0.050
0.0000
0.0008
0.0020
D
6.900
7.000
7.100
0.2717
0.2756
0.2795
E
6.900
7.000
7.100
0.2717
0.2756
0.2795
D2
5.500
5.600
5.700
0.2165
0.2205
0.2244
E2
5.500
5.600
5.700
0.2165
0.2205
0.2244
L
0.300
0.400
0.500
0.0118
0.0157
0.0197
T
-
0.152
-
-
0.0060
-
b
0.200
0.250
0.300
0.0079
0.0098
0.0118
e
-
0.500
-
-
0.0197
-
ddd
-
-
0.080
-
-
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 53. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package recommended footprint
1. Dimensions are expressed in millimeters.
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Package information
Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.
Figure 54. UFQFPN48 marking example (package top view)
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1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
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Package information
7.8
STM32F072x8 STM32F072xB
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 24: General operating conditions.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x JA)
Where:

TA max is the maximum ambient temperature in °C,

JA is the package junction-to-ambient thermal resistance, in C/W,

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = (VOL × IOL) + ((VDDIOx – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 80. Package thermal characteristics
Symbol
JA
7.8.1
Parameter
Value
Thermal resistance junction-ambient
UFBGA100 - 7 × 7 mm
55
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm
42
Thermal resistance junction-ambient
UFBGA64 - 5 × 5 mm / 0.5 mm pitch
65
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
44
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm
54
Thermal resistance junction-ambient
UFQFPN48 - 7 × 7 mm
32
Thermal resistance junction-ambient
WLCSP49 - 0.4 mm pitch
49
Unit
°C/W
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
7.8.2
Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the ordering
information scheme shown in Section 8: Part numbering.
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Package information
Each temperature range suffix corresponds to a specific guaranteed ambient temperature at
maximum dissipation and, to a specific maximum junction temperature.
As applications do not commonly use the STM32F072x8/xB at maximum dissipation, it is
useful to calculate the exact power consumption and junction temperature to determine
which temperature range will be best suited to the application.
The following examples show how to calculate the temperature range needed for a given
application.
Example 1: High-performance application
Assuming the following application conditions:
Maximum temperature TAmax = 82 °C (measured according to JESD51-2), IDDmax = 50
mA, VDD = 3.5 V, maximum 20 I/Os used at the same time in output at low level with IOL
= 8 mA, VOL= 0.4 V and maximum 8 I/Os used at the same time in output at low level
with IOL = 20 mA, VOL= 1.3 V
PINTmax = 50 mA × 3.5 V= 175 mW
PIOmax = 20 × 8 mA × 0.4 V + 8 × 20 mA × 1.3 V = 272 mW
This gives: PINTmax = 175 mW and PIOmax = 272 mW:
PDmax = 175 + 272 = 447 mW
Using the values obtained in Table 80 TJmax is calculated as follows:
–
For LQFP64, 45 °C/W
TJmax = 82 °C + (45 °C/W × 447 mW) = 82 °C + 20.115 °C = 102.115 °C
This is within the range of the suffix 6 version parts (–40 < TJ < 105 °C).
In this case, parts must be ordered at least with the temperature range suffix 6 (see
Section 8: Part numbering).
Note:
With this given PDmax we can find the TAmax allowed for a given device temperature range
(order code suffix 6 or 7).
Suffix 6: TAmax = TJmax - (45°C/W × 447 mW) = 105-20.115 = 84.885 °C
Suffix 7: TAmax = TJmax - (45°C/W × 447 mW) = 125-20.115 = 104.885 °C
Example 2: High-temperature application
Using the same rules, it is possible to address applications that run at high temperatures
with a low dissipation, as long as junction temperature TJ remains within the specified
range.
Assuming the following application conditions:
Maximum temperature TAmax = 100 °C (measured according to JESD51-2), IDDmax =
20 mA, VDD = 3.5 V, maximum 20 I/Os used at the same time in output at low level with
IOL = 8 mA, VOL= 0.4 V
PINTmax = 20 mA × 3.5 V= 70 mW
PIOmax = 20 × 8 mA × 0.4 V = 64 mW
This gives: PINTmax = 70 mW and PIOmax = 64 mW:
PDmax = 70 + 64 = 134 mW
Thus: PDmax = 134 mW
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STM32F072x8 STM32F072xB
Using the values obtained in Table 80 TJmax is calculated as follows:
–
For LQFP64, 45 °C/W
TJmax = 100 °C + (45 °C/W × 134 mW) = 100 °C + 6.03 °C = 106.03 °C
This is above the range of the suffix 6 version parts (–40 < TJ < 105 °C).
In this case, parts must be ordered at least with the temperature range suffix 7 (see
Section 8: Part numbering) unless we reduce the power dissipation in order to be able to
use suffix 6 parts.
Refer to Figure 55 to select the required temperature range (suffix 6 or 7) according to your
temperature or power requirements.
Figure 55. LQFP64 PD max vs. TA
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Part numbering
Part numbering
For a list of available options (memory, package, and so on) or for further information on any
aspect of this device, please contact your nearest ST sales office.
Table 81. Ordering information scheme
STM32
Example:
F
072
R
8
T
6
x
Device family
STM32 = ARM-based 32-bit microcontroller
Product type
F = General-purpose
Sub-family
072 = STM32F072xx
Pin count
C = 48/49 pins
R = 64 pins
V = 100 pins
Code size
8 = 64 Kbytes of Flash memory
B = 128 Kbytes of Flash memory
Package
H = UFBGA
T = LQFP
U = UFQFPN
Y = WLCSP
Temperature range
6 = –40 to 85 °C
7 = –40 to 105 °C
Options
xxx = programmed parts
TR = tape and reel
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Revision history
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STM32F072x8 STM32F072xB
Revision history
Table 82. Document revision history
Date
Revision
13-Jan-2014
1
Initial release.
2
Updated “Reset and power management“ data in Features.
Updated tS_vrefint in Table: Embedded internal reference
voltage.
Updated VHSEH and VHSEL in Table: High-speed external user
clock characteristics.
Updated VLSEH and VLSEL in Table: Low-speed external user
clock characteristics.
Updated tS_temp in Table: TS characteristics.
Updated tS_vbat in Table: VBAT monitoring characteristics.
Updated Section: I2C interface characteristics.
Updated Figure: UFBGA100 package top view and Figure:
WLCSP49 package top view.
Modified value of ts_sc and removed row VBG in Table:
Comparator characteristics.
21-Feb-2014
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Revision history
Table 82. Document revision history (continued)
Date
Revision
Changes
Addition of UFBGA64 package option. Updates in:
– Section 2: Description,
– Section 4: Pinouts and pin descriptions
– Section 7: Package information
– Section 8: Part numbering.
18-Sep-2015
3
Updates in Section 5: Memory mapping:
– Figure 10: STM32F072x8/xB memory map.
Updates in Section 2: Description:
– corrected the number of AF in Figure 1: Block diagram.
Updates in Section 3: Functional overview
– added the number of complementary outputs for the
advanced control timer and for TIM15, TIM16 and TIM17
general purpose timers in Table 7: Timer feature
comparison.
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STM32F072x8 STM32F072xB
Table 82. Document revision history (continued)
Date
18-Sep-2015
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Revision
Changes
3 (continued)
Updates in Section 6: Electrical characteristics:
– the footnote for VIN parameter in Table 24: General
operating conditions,
– addition of tSTART parameter in Table 28: Embedded
internal reference voltage,
– Table 31: Typical and maximum consumption in Stop and
Standby modes,
– Table 33: Typical current consumption, code executing from
Flash, running from HSE 8 MHz crystal,
– Table 37: High-speed external user clock characteristics:
replaced VDD with VDDIOX,
– Table 38: Low-speed external user clock characteristics:
replaced VDD with VDDIOX,
– Table 41: HSI oscillator characteristics and Figure 19: HSI
oscillator accuracy characterization results for soldered
parts,
– Table 42: HSI14 oscillator characteristics: changed the min
value for ACCHSI14,
– Table 46: Flash memory characteristics: changed the
values for tME and IDD in write mode,
– Table 48: EMS characteristics: changed the value for
VEFBT,
– Table 57: ADC characteristics,
– Table 61: Comparator characteristics: changed the
description and values for VSC; VDDA and VREFINT
parameters;
– Table 62: TS characteristics: changed the min value for 
tS-temp
– Table 63: VBAT monitoring characteristics: changed the min
value for tS-vbat and the typical value for R parameter,
– Table 69: I2S characteristics: updated the min value for
data input hold time (master and slave receiver).
Updates in Section 7: Package information:
– Section : Device marking.
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