NTC Thermistors

NTC Thermistors
NTC Thermistors
The NTC Thermistors
This is a Negative Temperature Coefficient Resistor whose resistance changes as ambient temperature changes. Thermistor comprises 2 or 4 kinds of metal oxides of iron, nickel, cobalt, manganese and copper, being shaped and sintered
at high temperature (1200 to 1500 °C)
■ Features
■ Recommended Applications
● Temperature Coefficient of Resistance is negative and
extremely large
● Various kinds of types especially smaller ones are
available.
● Resistance values are available from 22 Ω to 470 kΩ
● For temperature measurement or temperature detection :
thermometer, temperature controller
● For temperature compensation : transistor circuit,
measuring instruments
■ Physical Characteristics of NTC Thermistors
Thermistor is a resistor sensitive to temperature utilizing
the large temperature-coefficient of metal oxide semiconductor. And its temperature dependency of resistance
value is indicated by the following equation:
R=R0 exp
[ (
B
1
T
1
T0
)]
Fig. 1
1000
100
.................................... (1)
10
RT/R25
T0: Standard Temperature 298.15 K(25 °C)
R0: Resistance at T0 K
B: Thermistor Constant (K)
So called Temperature Coefficient (a) is generally
indicated as follows:
1
2000
3000
400
0
500
0
60
00
0.1
B ....................................................................
(2)
T2
0.01
But a is not adequate for use as a constant, because a
change by temperature is considerably large, so B Value
is used as a coefficient of thermistor.
0.001
a=
B=1000
–40 –20
0
20
40 60
T (˚C)
80
100 120 140
■ Major Characteristics of NTC Thermistors
The relation between resistance and temperature of a
thermistor is linear as shown in Fig. 2, in which resistance
is shown in vertical direction in a logarithmic scale and
reciprocal of absolute temperature in horizontal direction.
Bias degrees in these straight lines are determined according
to the B Value expressed by the following equation.
knR1 – knR2
1
1
T1 T2
10000000
700
=4
/5 0
050
5
2
B
=4
50
<
B 25 /
7
250
<
=4
& +&1
50
5+
B 25/
&3 &35
<
35
=34
&3
5/85
+
2
B
5
00
<"
&3
45
0=
(
5
/
&
5
5+
B 2
&3
<
5
&
5+
&3
0
280
0=
25/5
B
<
"
+&
&35
1000000
100000
.................................................. (3)
10000
R (?)
B=
Fig. 2
R1: Resistance at T1 K
R2: Resistance at T2 K
When calculated from this equation, B Value is a variable
in a strict sense, and the resistance is expressed by the
following equation:
R = AT–C exp D/T........................................................ (4)
1000
100
10
In (4), C is a small positive or negative constant and quite
negligible except use in precision temperature-measuring
device, thereby the B Value is, in practical usage, to be
considered as a constant. In Fig. 1,
the relation between the resistance ratio RT/R25
(R25: Resistance at 25 °C, RT: Resistance at T °C) and B Value is
shown with T °C, in the horizontal direction.
1
2.4
125
2.9
85
3.4
1
(L10 –3K–1)
T
50
25
T (˚C)
3.9
0
–20
4.4
–40
00 Sep. 2010
2
Multilayer NTC Thermistors
Multilayer NTC Thermistors
Series:
ERTJ
■ Features
●
●
●
●
●
■ Recommended Applications
● Mobile Phone
· Temperature compensation for crystal oscillator
· Temperature compensation for semiconductor
devices
● Personal Computer
· Temperature detection for CPU and memory device
· Temperature compensation for ink-viscosity
(Inkjet Printer)
● Battery Pack
· Temperature detection of battery cells
● Liquid Crystal Display
· Temperature compensation of display contrast
· Temperature compensation of display backlighting
(CCFL)
Surface Mount Device (0201, 0402, 0603)
Highly reliable multilayer / monolithic structure
Wide temperature operating range (–40 to 125 °C)
Environmentally-friendly lead-free
RoHS compliant
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
&
3
5
+
&
(
+
"
$PNNPO$PEF
Product Code
Type Code
ERT NTC
J Chip Type (SMD)
Thermistors
Multilayer Type
4J[F$PEF
Z “0201”
0 “0402”
1 “0603”
1BDLBHJOH
4UZMF$PEF
E
V
“0201”, “0402”
Pressed Carrier
Taping
Punched Carrier
Taping
(Pitch : 2 mm)
“0603”
Punched Carrier
Taping
(Pitch : 4 mm)
#7BMVF$MBTT$PEF
2701 to 2800
A
3301 to 3400
G
3801 to 3900
M
4001 to 4100
P
4201 to 4300
R
4301 to 4400
S
4401 to 4500
T
4601 to 4700
V
/PNJOBM3FTJTUBODF
3?
The first two digits
are significant figures
of resistance and the
third one denotes
the number of zeros
following them.
(Example)
3FTJTUBODF5PMFSBODF
$PEF
F
G
H
J
±1% Narrow
Tolerance
±2%
Type
±3% Standard
±5% Type
4QFDJBM
4QFDJGJDBUJPO
■ Construction
3
Name
A
Semiconductive Ceramics
B
Internal electrode
C
4
D
5
1
No
E
2
Terminal
electrode
Substrate electrode
Intermediate electrode
External electrode
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Dec. 2013
3
Multilayer NTC Thermistors
■ Dimensions in mm (not to scale)
L
(Unit : mm)
W
Size Code (EIA)
L
W
T
L1, L 2
T
L1
Z(0201)
0.60±0.03
0.30±0.03
0.30±0.03
0.15±0.05
0(0402)
1.0±0.1
0.50±0.05
0.50±0.05
0.25±0.15
1(0603)
1.60±0.15
0.8±0.1
0.8±0.1
0.3±0.2
L2
■ Packaging Methods
● Standard Packing Quantities
Thickness
(mm)
Z(0201)
0(0402)
1(0603)
0.3
0.5
0.8
Pitch Quantity
(mm) (pcs./reel)
Kind of Taping
Pressed Carrier Taping
2
2
4
Punched Carrier Taping
W1
E
15,000
10,000
4,000
C
B
Size
Code
● Reel for Taping
D
● Pitch 2 mm (Pressed Carrier Taping) : Size 0201
Feeding hole
fD0
Chip pocket
A
E
t
W2
Dim.
(mm)
B
K0
Chip component
A
Symbol
B
W
P 1 P2
F
E
P2
P0
fD 0
t
±0.03 ±0.03 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1
0
max. ±0.03
Feeding hole
fD0
D
E
W1
W2
9.0+1.0
11.4±1.0
0
Top cover tape
● Pitch 2 mm (Punched Carrier Taping) : Size 0402
100 min.
Vacant position
400 min.
Chip pocket
E
t1
C
● Leader Part and Taped End
Leader part
K0
Dim. 0.36 0.66 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.55 0.36
(mm)
fB
0
180 –3 60.0+1.0
13.0±0.5 21.0±0.8 2.0±0.5
0
Tape running direction
P0
P1
fA
Symbol
F
W
A
Taped end
B
F
W
A
t2
Chip component
A
Symbol
B
W
P1 P2
F
E
P0
P1
P2
P0
fD 0
t1
Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7
(mm)
160 min.
Vacant position
Tape running direction
±0.05 ±0.05 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1
0
t2
1.0
max. max.
■ Minimum Quantity / Packing Unit
Part Number Minimum Quantity Packing Quantity
Carton
/ Packing Unit
in Carton
L×W×H (mm)
(Size)
● Pitch 4 mm (Punched Carrier Taping) : Size 0603
Feeding hole
fD0
Chip pocket
E
t1
B
F
W
A
t2
Symbol
A
Dim. 1.0
(mm)
P1
Chip component
±0.1
B
W
F
E
P2
P1
Tape running direction
P0
P2
P0
fD 0
t1
1.8 8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1
±0.1
±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1
0
(Unit : mm)
ERTJZ
(0201)
15,000
300,000
250×200×200
ERTJ0
(0402)
10,000
200,000
250×200×200
ERTJ1
(0603)
4,000
80,000
250×200×200
Part No., quantity and country of origin are designated
on outer packages in English.
t2
1.4
max. max.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Dec. 2013
4
Multilayer NTC Thermistors
■ Ratings
Size code (EIA)
Operating
Temperature Range
Rated Maximum
Power Dissipation ✽1
Z(0201)
0(0402)
1(0603)
33 mW
66 mW
100 mW
Dissipation Factor✽2
approximately
1 mW/°C
approximately
2 mW/°C
approximately
3 mW/°C
–40 to 125 °C
✽1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
· The Maximum Power Dissipation under ambient temperature 25 °C or less is the same with the rated maximum power dissipation, and Maximum
power dissipation beyond 25 °C depends on the Decreased power dissipation curve.
· Please see “Operating Power” for details paging 371.
✽2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation under
stable temperatures.
· Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).
● Resistance ratios to R25 at each temperature/Reference values
(for obtaining resistance at each temperature by using R25 shown in part number)
ERTJ□□A∼
ERTJ□□G∼ ERTJ□□M∼ ERTJ□□P∼ ERTJ□□R∼ ERTJ0ES∼ ERTJ1VS∼
B25/50 2750 K
2800 K (3375 K) 3900 K
4050 K
4250K
4330K
(4330K)
4390K
B25/85 (2700 K) (2750 K) 3435 K (3970 K) (4100 K) (4300K) (4390K)
T(°C)
-40 13.05
13.28
20.52
32.11
33.10
43.10
45.67
45.53
-35 10.21
10.40
15.48
23.29
24.03
30.45
32.08
31.99
-30 8.061
8.214
11.79
17.08
17.63
21.76
22.80
22.74
-25 6.427
6.547
9.069
12.65
13.06
15.73
16.39
16.35
-20 5.168
5.261
7.037
9.465
9.761
11.48
11.91
11.89
-15 4.191
4.261
5.507
7.147
7.362
8.466
8.743
8.727
-10 3.424
3.476
4.344
5.444
5.599
6.300
6.479
6.469
-5 2.819
2.856
3.453
4.181
4.291
4.730
4.845
4.839
0 2.336
2.362
2.764
3.237
3.312
3.582
3.654
3.650
5 1.948
1.966
2.227
2.524
2.574
2.734
2.778
2.776
10 1.635
1.646
1.806
1.981
2.013
2.102
2.128
2.126
15 1.380
1.386
1.474
1.567
1.584
1.629
1.642
1.641
20 1.171
1.174
1.211
1.247
1.255
1.272
1.277
1.276
25 1
1
1
1
1
1
1
1
30 0.8585
0.8565
0.8309
0.8072
0.8016
0.7921
0.7888
0.7890
35 0.7407
0.7372
0.6941
0.6556
0.6461
0.6315
0.6263
0.6266
40 0.6422
0.6376
0.5828
0.5356
0.5235
0.5067
0.5004
0.5007
45 0.5595
0.5541
0.4916
0.4401
0.4266
0.4090
0.4022
0.4025
50 0.4899
0.4836
0.4165
0.3635
0.3496
0.3319
0.3251
0.3254
55 0.4309
0.4238
0.3543
0.3018
0.2881
0.2709
0.2642
0.2645
60 0.3806
0.3730
0.3027
0.2518
0.2386
0.2222
0.2158
0.2161
65 0.3376
0.3295
0.2595
0.2111
0.1985
0.1832
0.1772
0.1774
70 0.3008
0.2922
0.2233
0.1777
0.1659
0.1518
0.1463
0.1465
75 0.2691
0.2600
0.1929
0.1504
0.1393
0.1264
0.1213
0.1215
80 0.2417
0.2322
0.1672
0.1278
0.1174
0.1057
0.1011
0.1013
85 0.2180
0.2081
0.1451
0.1090
0.09937 0.08873 0.08469 0.08486
90 0.1974
0.1871
0.1261
0.09310 0.08442 0.07468 0.07122 0.07138
95 0.1793
0.1688
0.1097
0.07980 0.07200 0.06307 0.06014 0.06028
100 0.1636
0.1528
0.09563 0.06871 0.06166 0.05353 0.05099 0.05112
105 0.1498
0.1387
0.08357 0.05947 0.05306 0.04568 0.04340 0.04351
110 0.1377
0.1263
0.07317 0.05170 0.04587 0.03918 0.03708 0.03718
115 0.1270
0.1153
0.06421 0.04512 0.03979 0.03374 0.03179 0.03188
120 0.1175
0.1056
0.05650 0.03951 0.03460 0.02916 0.02734 0.02742
125 0.1091
0.09695 0.04986 0.03470 0.03013 0.02527 0.02359 0.02367
✽1 Other than ERTJ0ET104□ in B25/50=4500K.
✽2 ERTJ0ET104□ only.
B25/50=
kn (R25/R50)
1/298.15–1/323.15
B25/85=
kn (R25/R85)
1/298.15–1/358.15
ERTJ□□T∼ ERTJ0ET104□ ERTJ□□V∼
4500K
4500K
4700K
(4450K) (4580K) (4750K)
✽1
63.30
42.92
29.50
20.53
14.46
10.30
7.407
5.388
3.966
2.953
2.221
1.687
1.293
1
0.7799
0.6131
0.4856
0.3874
0.3111
0.2513
0.2042
0.1670
0.1377
0.1144
0.09560
0.08033
0.06782
0.05753
0.04903
0.04198
0.03609
0.03117
0.02702
0.02351
✽2
47.07
33.31
23.80
17.16
12.49
9.159
6.772
5.046
3.789
2.864
2.179
1.669
1.287
1
0.7823
0.6158
0.4876
0.3884
0.3111
0.2504
0.2026
0.1648
0.1348
0.1108
0.09162
0.07609
0.06345
0.05314
0.04472
0.03784
0.03218
0.02748
0.02352
0.02017
59.76
41.10
28.61
20.14
14.33
10.31
7.482
5.481
4.050
3.015
2.262
1.710
1.303
1
0.7734
0.6023
0.4721
0.3723
0.2954
0.2356
0.1889
0.1523
0.1236
0.1009
0.08284
0.06834
0.05662
0.04712
0.03939
0.03308
0.02791
0.02364
0.02009
0.01712
R25=Resistance at 25.0±0.1 °C
R50=Resistance at 50.0±0.1 °C
R85=Resistance at 85.0±0.1 °C
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Dec. 2013
5
Multilayer NTC Thermistors
■ Specification and Test Method
Item
Specification
Rated Zero-power Within the specified tolerance.
Resistance (R25)
Test Method
The value of the d.c. resistance shall be measured at
the rated ambient temperature of 25.0 ±0.1 °C under
the power less than 0.1mW which is negligible self
heat generation.
B Value
The Zero-power resistances; R1 and R2, shall be
measured respectively at T1 (°C) and T2 (°C).
The B value is calculated by the following equation.
kn (R1)–kn (R2)
BT1/T2=
1/(T1+273.15)–1/(T2+273.15)
Within the specified tolerance.
✽ Individual Specification shall specify B25/50 or
B25/85.
T1
25.0 ±0.1 °C
25.0 ±0.1 °C
B25/50
B25/85
Adhesion
T2
50.0 ±0.1 °C
85.0 ±0.1 °C
The terminal electrode shall be free from peeling Applied force :
or signs of peeling.
Size 0201
:2N
Size 0402, 0603 : 5 N
Duration : 10 s
Size : 0201, 0402
1.0
0.3/Size:0201
0.5/Size:0402
0.5R
Test Sample
Board
1.0
Size : 0603
Test
Sample
Bending distance : 1 mm
Bending speed : 1 mm/s
20
Bending
distance
Bending Strength There shall be no cracks and other mechanical
damage.
R25 change : within ±5 %
Unit : mm
R340
45±2
45±2
Unit : mm
Resistance to
Soldering Heat
Solderability
There shall be no cracks and other mechanical
damage.
Nallow Tol. type Standard type
: within ±2 %
within ±3 %
R25 change
B Value change : within ±1 %
within ±2 %
Soldering bath method
Solder temperature : 270 ±5 °C
Dipping period : 3.0 ±0.5 s
Preheat condition :
More than 75 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period : 4 ±1 s
Solder : H63A (JIS–Z–3282)
Step
1
2
Temp (°C)
80 to 100
150 to 200
Period (s)
120 to 180
120 to 180
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Dec. 2013
6
Multilayer NTC Thermistors
■ Specification and Test Method
Item
Temperature
Cycling
Moisture
Resistance
Specification
Test Method
Nallow Tol. type Standard type Conditions of one cycle
R25 change
: within ±2 %
within ±3 %
Step 1 : –40 °C, 30±3 min
B Value change : within ±1 %
within ±2 %
Step 2 : Room temp., 3 min max.
Step 3 : 125 °C, 30±3 min.
Step 4 : Room temp., 3 min max.
Number of cycles: 100 cycles
R25 change
:
B Value change :
Damp Heat Load
R25 change
:
B Value change :
Cold Resistance
Dry Heat
Resistance
Nallow Tol. type Standard type Temperature : 85 ±2 °C
within ±2 %
within ±3 % Relative humidity : 85 ±5 %
within ±1 %
within ±2 % Test period : 1000 +48/0 h
Nallow Tol. type Standard type Temperature : 85 ±2 °C
within ±2 %
within ±3 % Relative humidity : 85 ±5 %
within ±1 %
within ±2 % Applied power : 10 mW
Test period : 500 +24/0 h
R25 change
:
B Value change :
Nallow Tol. type Standard type Temperature : –40 ±3 °C
within ±2 %
within ±3 % Test period : 1000 +48/0 h
within ±1 %
within ±2 %
R25 change
:
B Value change :
Nallow Tol. type Standard type Temperature : 125 ±3 °C
within ±2 %
within ±3 % Test period : 1000 +48/0 h
within ±1 %
within ±2 %
■ Part Number List of Narrow Tolerance Type (Resistance Tolerance : ±2 %, ±1 %)
● 0201(EIA)
B value class code
G
Nominal
Resistance
Resistance
25/50
Nominal
B
value
B
(3375
K)
Tolerance
at 25 °C
3435 K±1 %
✽() Reference value B25/85
10 kΩ
ERTJZEG103□A
±1 %(F)
47 kΩ
or
±2 %(G)
100 kΩ
P
4050 K±1 %
(4100 K)
V
4700 K±1 %
(4750 K)
ERTJZEP473□
ERTJZEV104□
□ : Resistance Tolerance Code
Avoid flow soldering.
● 0402(EIA)
B value class code
G
Nominal
Resistance
Resistance
25/50
Nominal
B
value
B
(3375
K)
Tolerance
at 25 °C
3435 K±1 %
✽() Reference value B25/85
10 kΩ
ERTJ0EG103□A
±1 %(F)
47 kΩ
or
±2 %(G)
100 kΩ
P
4050 K±1 %
(4100 K)
S
4330 K±1 %
(4390 K)
V
4700 K±1 %
(4750 K)
ERTJ0ES104□
ERTJ0EV104□
ERTJ0EP473□
□ : Resistance Tolerance Code
Avoid flow soldering.
● 0603(EIA)
B value class code
G
Nominal
Resistance
Resistance
25/50
Nominal
B
value
B
(3375
K)
Tolerance
at 25 °C
3435 K±1 %
✽() Reference value B25/85
10 kΩ ±1 %(F)
ERTJ1VG103□A
or
100 kΩ ±2 %(G)
□ : Resistance Tolerance Code
Avoid flow soldering.
S
(4330 K)
4390 K±1 %
ERTJ1VS104□A
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Dec. 2013
7
Multilayer NTC Thermistors
■ Part Number List of Standard Type (Resistance Tolerance : ±5 %, ±3 %)
● 0201(EIA)
B value class code
G
Nominal
Resistance
Resistance
25/50
Nominal
B
value
B
(3375
K)
Tolerance
at 25 °C
3435 K±2 %
✽() Reference value B25/85
2.0 kΩ
3.0 kΩ
4.7 kΩ ±3 %(H)
or
10 kΩ ±5 %(J)
ERTJZEG103□A
47 kΩ
100 kΩ
P
4050 K±3 %
(4100 K)
T
4500 K±2 %
(4450 K)
ERTJZET202□
ERTJZET302□
ERTJZET472□
V
4700 K±2 %
(4750 K)
ERTJZEP473□
ERTJZEV104□
□ : Resistance Tolerance Code
Avoid flow soldering.
● 0402(EIA)
Nominal
Resistance
at 25 °C
22 Ω
33 Ω
40 Ω
47 Ω
68 Ω
100 Ω
150 Ω
Nominal
Resistance
at 25 °C
3.3 kΩ
4.7 kΩ
6.8 kΩ
10 kΩ
15 kΩ
22 kΩ
33 kΩ
47 kΩ
100 kΩ
Resistance
Tolerance
B value class code
Nominal B value B25/50
✽() Reference value B25/85
±3 %(H)
or
±5 %(J)
Resistance
Tolerance
A
2750 K±3 %
(2700 K)
ERTJ0EA220□
ERTJ0EA330□
ERTJ0EA400□
ERTJ0EA470□
2800 K±3 %
(2750 K)
ERTJ0EA680□
ERTJ0EA101□
ERTJ0EA151□
B value class code
Nominal B value B25/50
✽() Reference value B25/85
±3 %(H)
or
±5 %(J)
B value class code
Nominal
Resistance
Resistance
Nominal
B value B25/50
Tolerance
at 25 °C
✽() Reference value B25/85
1.0 kΩ
1.5 kΩ
2.0 kΩ
2.2 kΩ
3.0 kΩ
3.3 kΩ
4.7 kΩ ±3 %(H)
or
47 kΩ ±5 %(J)
68 kΩ
100 kΩ
150 kΩ
220 kΩ
330 kΩ
470 kΩ
G
(3375 K)
3435 K±1 %
M
3900 K±2 %
(3970 K)
ERTJ0EG103□A
ERTJ0EM103□
P
4050 K±2 %
(4100 K)
ERTJ0EP333□
ERTJ0EP473□
ERTJ0EP104□
S
4330 K±2 %
(4390 K)
T
4500 K±2 %
(4450 K, 4580 K)
ERTJ0ET102□
ERTJ0ET152□
ERTJ0ET202□
ERTJ0ET222□
ERTJ0ET302□
ERTJ0ET332□
ERTJ0ET472□
ERTJ0ES104□
ERTJ0ET104□
ERTJ0ET154□
R
4250 K±2 %
(4300 K)
ERTJ0ER332□
ERTJ0ER472□
ERTJ0ER682□
ERTJ0ER103□
ERTJ0ER153□
ERTJ0ER223□
ERTJ0ER333□
V
4700 K±2 %
(4750 K)
ERTJ0EV473□
ERTJ0EV683□
ERTJ0EV104□
ERTJ0EV154□
ERTJ0EV224□
ERTJ0EV334□
ERTJ0EV474□
□ : Resistance Tolerance Code
Avoid flow soldering.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Dec. 2013
8
Multilayer NTC Thermistors
● 0603(EIA)
B value class code
Nominal
Resistance
Resistance
Nominal
B value B25/50
Tolerance
at 25 °C
✽() Reference value B25/85
22 Ω
33 Ω
A
2750 K±3 %
(2700 K)
ERTJ1VA220□
68 Ω
G
(3375 K)
3435 K±1 %
ERTJ1VA400□
±3 %(H)
or
±5 %(J)
ERTJ1VA470□
ERTJ1VA680□
100 Ω
ERTJ1VA101□
10 kΩ
ERTJ1VG103□A
47 kΩ
ERTJ1VP473□
B value class code
Nominal
Resistance
Resistance
Nominal
B value B25/50
Tolerance
at 25 °C
✽() Reference value B25/85
1.0 kΩ
R
4250 K±2 %
(4300 K)
S
(4330 K)
4390 K±1%
T
4500 K±2 %
(4450 K)
ERTJ1VT102□
1.5 kΩ
ERTJ1VT152□
2.0 kΩ
ERTJ1VT202□
2.2 kΩ
ERTJ1VT222□
3.0 kΩ
4.7 kΩ
10 kΩ
V
4700 K±2 %
(4750 K)
ERTJ1VT302□
3.3 kΩ
6.8 kΩ
P
4050 K±3 %
(4100 K)
ERTJ1VA330□
40 Ω
47 Ω
2800 K±3 %
(2750 K)
±3 %(H)
or
±5 %(J)
ERTJ1VR332□
ERTJ1VT332□
ERTJ1VR472□
ERTJ1VT472□
ERTJ1VR682□
ERTJ1VR103□
15 kΩ
ERTJ1VR153□
22 kΩ
ERTJ1VR223□
33 kΩ
ERTJ1VR333□
47 kΩ
ERTJ1VR473□
ERTJ1VV473□
68 kΩ
ERTJ1VR683□
ERTJ1VV683□
100 kΩ
ERTJ1VS104□A
150 kΩ
ERTJ1VV104□
ERTJ1VV154□
□ : Resistance Tolerance Code
Avoid flow soldering.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Dec. 2013
9
Multilayer NTC Thermistors
■ Typical Application
● Temperature Detection
Writing current control of HDD
Vcc
GMR Head
R
R
L
Rth
NTC
AD
converter
CPU
Interface
● Temperature Compensation (Pseudo-linearization)
Contrast level control of LCD
Vcc
R
Rth
NTC
R
LCD
R
● Temperature Compensation (RF circuit)
Rth
Rth
0TDGSFREFWJBUJPOEGE5QQN
Temperature compensation of TCXO
X’tal
[for Low Temp.] [for High Temp.]
R
NTC
NTC
R
Vcc
Output
C
C
R
C
C
R
with compensation
without compensation
8
0
-8
-20
25
75
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Dec. 2013
10
Multilayer NTC Thermistors
Multilayer Chip NTC Thermistors
Series: ERTJ
Handling Precautions
Safety Precautions
Multilayer NTC Thermistors (hereafter referred to as “Thermistors”) should be used for general purpose applications
found in consumer electronics (audio/visual, home, office, information & communication) equipment.
When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifications, as noted
in the Ratings and Specified Conditions section, the Thermistor may fail in a short circuit mode or in an open-circuit
mode. This case results in a burn-out, smoke or flaming.
For products which require high safety levels, please carefully consider how a single malfunction can affect your
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe,
such as setting up protecting circuits, etc.
● For the following applications and conditions, please contact us for additional not found in this document.
· When your application may have difficulty complying with the safety or handling precautions specified below.
· For any applications where a malfunction with this product may directly or indirectly cause hazardous conditions
which could result in death or injury;
1 Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)
2 Submarine Equipment (submarine repeating equipment, etc.)
3 Transportation Equipment (motor vehicles, airplanes, trains, ship, traffic signal controllers, etc.)
4 Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.)
5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
6 Information Processing Equipment (large scale computer systems, etc.)
7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
8 Rotary Motion Equipment
9 Security Systems
J And any similar types of equipment
■ Operating Conditions and Circuit Design
[Maximum power dissipation]
· The Maximum power that can be continuously applied
under static air at a certain ambient temperature.
The Maximum power dissipation under an ambient
temperature of 25 °C or less is the same with the
rated maximum power dissipation, and Maximum
power dissipation beyond 25 °C depends on the
Decreased power dissipation curve below.
1. Circuit Design
1.1 Operating Temperature and Storage Temperature
The specified “Operating Temperature Range”
found in the Specifications is the absolute maximum
and minimum temperature rating. Every Thermistor
shall be operated within the specified “Operating
Temperature Range”.
The Thermistors mounted on PCB shall be stored
without operating within the specified “Storage
Temperature Range” in the Specifications.
Maximum power dissipation
/ Rated maximum power dissipation (%)
Decreased power dissipation curve
1.2 Operating Power
Thermistors shall not be operated in excess of the
“Maximum power dissipation”.
If the Thermistors are operated beyond the specified
Maximum power dissipation, it may cause burnout
and/or damage due to thermal run away.
For temperature detection applications, the accuracy
may be greatly influenced by self-heat generation
and the heat dissipation of the Thermistor, even
if the Thermistor is operated under the specified
Maximum Power Dissipation.
Please check the safety and reliability of your circuit.
100
50
25
75
125
Ambient temperature (°C)
[Dissipation factor]
· The constant amount power required to raise the
temperature of the Thermistor 1 °C through self heat
generation under stable temperatures.
Dissipation factor (mW/°C) = Power consumption of
Thermistor / Temperature rise of element
00 Sep. 2010
11
Multilayer NTC Thermistors
(2) The size of lands shall be designed to have
equal spacing between the right and left sides. If
the amount of solder on the right land is different
from that on the left land, the component may
be cracked by stress since the side with a larger
amount of solder solidifies later during cooling.
1.3 Environmental Restrictions
The Thermistors shall not be operated and/or stored
under the following conditions.
(1) Environmental conditions
(a) Under direct exposure to water or salt water
(b) Under conditions where water can condense
and/or dew can form
(c) Under conditions containing corrosive gases
such as hydrogen sulfide, sulfurous acid,
chlorine and ammonia
(2) Mechanical conditions
Under severe conditions of vibration or impact
beyond the specified conditions found in the
Specifications.
Recommended Amount of Solder
(a) Excessive amount
(c) Insufficient amount
2.3 Utilization of Solder Resist
(1) Solder resist shall be utilized to equalize the
amounts of solder on both sides.
(2) Solder resist shall be used to divide the pattern
for the following cases;
· Components are arranged closely.
· The Thermistor is mounted near a component
with lead wires.
· The Thermistor is placed near a chassis.
See the table below.
1.4 Measurement of Resistance
The resistance of the Thermistors varies dependent
on ambient temperatures and self-heating. Note the
following points when measuring resistance values of
the Thermistors during inspection or when considering
them for circuits.
1 Measurement temp : 25±0.1 °C
Measurement in liquid (silicon oil, etc.) is
recommended for a stable measurement temperature.
2 Power : 0.10 mW max.
4 terminal measurement with a constant-current
power supply is recommended.
Prohibited Applications and Recommended Applications
Item
2. Design of Printed Circuit Board
Mixed mounting
with a component
with lead wires
2.1 Selection of Printed Circuit Boards
When the Thermistors are mounted and soldered on
an “Alumina Substrate”, the substrate influences the
Thermistors’ reliability against “Temperature Cycles”
and “Heat shock” due to the difference in the thermal
expansion coefficient between them. Confirm that
the actual board used does not deteriorate the
characteristics of the Thermistors.
Arrangement near
chassis
Prohibited
applications
The lead wire of a
component with lead wires
Chassis
Solder
(Ground solder)
Improved applications
by pattern division
Solder resist
Solder resist
Electrode pattern
2.2 Design of Land Pattern
(1) Recommended land dimensions are shown below.
Retro-fitting of
component with
lead wires
Use the proper amount of solder in order to prevent
cracking. Using too much solder places excessive
stress on the Thermistors.
Recommended Land Dimensions
Lateral
arrangement
SMD
A lead wire of
Soldering Retro-fitted
component
iron
Portion to be
excessively soldered
Land
Solder resist
Solder resist
Solder resist
c
Land
(b) Proper amount
2.4 Component Layout
b
The Thermistors/components shall be placed on the
PC board such that both electrodes are subjected
to uniform stresses, or to position the component
electrodes at right angles to the grid glove or
bending line. T his should be done to avoid
cracking the Thermistors from bending the PC
board after or during placing/mounting on the PC
board. Placement of the Thermistors near heating
elements also requires that great care be taken
in order to avoid stresses from rapid heating and
cooling.
a
Unit (mm)
Size Code
(EIA)
Z(0201)
0(0402)
1(0603)
Component
dimensions
L
W
T
0.6 0.3 0.3
1.0 0.5 0.5
1.6 0.8 0.8
a
b
c
0.2 to 0.3
0.4 to 0.5
0.8 to 1.0
0.25 to 0.30
0.4 to 0.5
0.6 to 0.8
0.2 to 0.3
0.4 to 0.5
0.6 to 0.8
00 Sep. 2010
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Multilayer NTC Thermistors
(1) To minimize mechanical stress caused by the
warp or bending of a PC board, please follow
the recommended Thermistors’ layout below.
Prohibited layout
2. Chip Mounting Consideration
(1) When mounting the Thermistors/components on
a PC board, the Thermistor bodies shall be free
from excessive impact loads such as mechanical
impact or stress due to the positioning, pushing
force and displacement of vacuum nozzles during
mounting.
(2) Maintenance and inspection of the Chip Mounter
must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle is
too low, the Thermistor will crack from excessive
force during mounting.
The following precautions and recommendations are
for your reference in use.
(a) Set and adjust the bottom dead center of the
vacuum nozzles to the upper surface of the PC
board after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle
during mounting to 1 to 3 N in static load.
(c) F or double sur face m ounting, apply a
supporting pin on the rear surface of the PC
board to suppress the bending of the PC
board in order to minimize the impact of the
vacuum nozzles. Typical examples are shown
in the table below.
Recommended layout
Layout the Thermistors sideways
against the stressing direction
(2) The following layout is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on the
mounting position of the Thermistors.
E
D
Perforation
C
A
B
Slit
Magnitude of stress A>B=C>D>E
(3) The magnitude of mechanical stress applied to
the Thermistors when the circuit board is divided
is in the order of push back < slit < V-groove <
perforation.
Also take into account the layout of the Thermistors
and the dividing/breaking method.
(4) When the Thermistors are placed near heating
elements such as heater, etc., cracks from thermal
stresses may be caused by the following:
· Soldering the Thermistors directly heating
elements.
· Mounting the Thermistors on the same land
that another Thermistor is mounted on.
For the above - mentioned mounting and/or
placement, please contact us in advance,
Item
Single surface
mouting
Prohibited mounting
Crack
Recommended mounting
The supporting pin does not necessarily
have to be positioned beneath the
Thermistor.
Supporting
pin
Double surface
mounting
Separation of Solder
Crack
Supporting
pin
(d) Adjust the vacuum nozzles so that their bottom
dead center during mounting is not too low.
(4) The closing dimensions of the positioning chucks
shall be controlled. Maintenance and replacement
of positioning chucks shall be performed regularly
to prevent chipping or cracking of the Thermistors
caused by mechanical impact during positioning
due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted
so that the maximum bending of PC board does
not exceed 0.5 mm at 90 mm span. The PC
board shall be supported by an adequate number
of supporting pins.
2.5 Mounting Density and Spaces
If components are arranged in too narrow a space,
the components can be affected by solder bridges
and solder balls. The space between components
should be carefully determined.
■ Precautions for Assembly
1. Storage
(1) The Thermistors shall be stored between 5 - 40 °C
and 20 - 70 % RH, not under severe conditions of
high temperature and humidity.
(2) If stored in a place that is humid, dusty, or contains
corrosive gasses (hydrogen sulfide, sulfurous
acid, hydrogen chloride and ammonia etc.), the
solderability of terminal electrodes may deteriorate.
In addition, storage in a place subjected to heating
and/or exposure to direct sunlight will cause
deformed tapes and reels, and component sticking
to tapes, both of which can result in mounting
problems
(3) Do not store components longer than 6 months.
Check the solderability of products that have
been stored for more than 6 months before use
3. Selection of Soldering Flux
Soldering flux may seriously affect the performance
of the Thermistors. The following shall be confirmed
before use.
(1) The soldering flux should have a halogen based
content of 0.1 wt% (converted to chlorine) or below.
Do not use soldering flux with strong acid.
(2) When applying water-soluble soldering flux,
wash the Thermistors sufficiently because the
soldering flux residue on the surface of PC
boards may deteriorate the insulation resistance
on the Thermistors’ surface.
00 Sep. 2010
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Multilayer NTC Thermistors
(b) Preheating:
The Thermistors shall be preheated so that the
“Temperature Gradient” between the devices
and the tip of soldering iron is 150 °C or below.
(c) Temperature of Iron tip: 300 °C max.
(The required amount of solder shall be
melted in advance on the soldering tip.)
(d) Gradual cooling:
After soldering, the Thermistors shall be
cooled gradually at room temperature.
4. Soldering
4.1 Reflow Soldering
The reflow soldering temperature conditions are
each temperature curves of Preheating, Temp. rise,
Heating, Peak and Gradual cooling. Large temperature
difference caused by rapid heat application to the
Thermistors may lead to excessive thermal stresses,
contributing to the thermal cracks. The Preheating
temperature requires controlling with great care so
that tombstone phenomenon may be prevented.
Recommended profile of Hand soldering (EX)
Period or Speed
60 to 120 sec
Gradual cooling
2 to 5 °C /sec
6T
Temperature
140 to 180 °C
1Preheating
Preheating temp
2Temp. rise
to Peak temp.
220 °C min.
3Heating
260 °C max.
4Peak
Peak temp.
5Gradual cooling
to 140 °C
Item
60 sec max.
10 sec max.
Preheating
1 to 4 °C /sec
60 to 120 sec
3 sec max.
Recommended profile of Reflow soldering (EX)
65
Temperature (°C)
△T : Allowable temperature difference △T < 150 °C
4 Peak
260
220
(2) Condition 2 (without preheating)
Hand soldering can be per formed without
preheating, by following the conditions below:
(a) Soldering iron tip shall never directly touch
the ceramic and terminal electrodes of the
Thermistors.
(b) The lands are sufficiently preheated with a
soldering iron tip before sliding the soldering
iron tip to the terminal electrodes of the
Thermistors for soldering.
2 Temp. rise
5 Gradual
cooling
180
140
1 Preheating
3 Heating
Time
60 to 120 sec
60 sec max.
△T : Allowable temperature difference △T < 150 °C
Conditions of Hand soldering without preheating
The rapid cooling (forced cooling) during Gradual
cooling part should be avoided, because this may
cause defects such as the thermal cracks, etc.
When the Thermistors are immersed into a cleaning
solvent, make sure that the surface temperatures of
the devices do not exceed 100 °C.
Performing reflow soldering twice under the conditions
shown in the figure above [Recommended profile of
Reflow soldering (EX)] will not cause any problems.
However, pay attention to the possible warp and
bending of the PC board.
Item
Temperature of Iron tip
Wattage
Shape of Iron tip
Soldering time with
a soldering iron
Condition
270 °C max.
20 W max.
f3 mm max.
3 sec max.
5. Post Soldering Cleaning
5.1 Cleaning solvent
Soldering flux residue may remain on the PC board
if cleaned with an inappropriate solvent. This may
deteriorate the electrical characteristics and reliability
of the Thermistors.
4.2 Hand Soldering
Hand soldering typically causes significant temperature
change, which may induce excessive thermal stresses
inside the Thermitors, resulting in the thermal cracks, etc.
In order to prevent any defects, the following should be
observed.
· The temperature of the soldering tips should be
controlled with special care.
· The direct contact of soldering tips with the
Thermistors and/or terminal electrodes should be
avoided.
· Dismounted Thermistors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering:
f1.0 mm or below Thread eutectic solder with
soldering flux✽ in the core.
✽ Rosin-based and non-activated flux is
recommended.
5.2 Cleaning conditions
Inappropriate cleaning conditions such as insufficient
cleaning or excessive cleaning may impair the electrical
characteristics and reliability of the Thermistors.
(1) Insufficient cleaning can lead to:
(a) The halogen substance found in the residue
of the soldering flux may cause the metal of
terminal electrodes to corrode.
(b) The halogen substance found in the residue
of the soldering flux on the surface of the
Thermistors may change resistance values.
(c) Water-soluble soldering flux may have more
remarkable tendencies of (a) and (b) above
compared to those of rosin soldering flux.
00 Sep. 2010
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Multilayer NTC Thermistors
(3) Examples of PCB dividing/breaking jigs:
The outline of PC board breaking jig is shown
below. When PC boards are broken or divided,
loading points should be close to the jig to
minimize the extent of the bending
Also, planes with no parts mounted on should
be used as plane of loading, which generates
a compressive stress on the mounted plane,
in order to prevent tensile stress induced by the
bending, which may cause cracks of the Thermistors
or other parts mounted on the PC boards.
(2) Excessive cleaning can lead to:
(a) Overuse of ultrasonic cleaning may deteriorate
the strength of the terminal electrodes or cause
cracking in the solder and /or ceramic bodies of
the Thermistors due to vibration of the PC boards.
Please follow these conditions for Ultrasonic
cleaning:
Ultrasonic wave output
: 20 W/L max.
Ultrasonic wave frequency
: 40 kHz max.
Ultrasonic wave cleaning time : 5 min. max.
5.3 Contamination of Cleaning solvent
Outline of Jig
Cleaning with contaminated cleaning solvent may
cause the same results as insufficient cleaning due
to the high density of liberated halogen.
PC board
V-groove
6.Inspection Process
When mounted PC boards are inspected with
measuring terminal pins, abnormal and excess
mechanical stress shall not be applied to the PC
board or mounted components, to prevent failure
or damage to the devices.
(1) Mounted PC boards shall be supported by
an adequate number of supporting pins with
bend settings of 90 mm span 0.5 mm max.
(2) Confirm that the measuring pins have the right
tip shape, are equal in height and are set in the
correct positions.
The following figures are for your reference to
avoid bending the PC board.
Item
Prohibited setting
PC board
splitting jig
Prohibited dividing
Chip
component
Loading direction
V-groove
Chip component
Loading
point
9. Mechanical Impact
(1) The Thermistors shall be free from any excessive
mechanical impact.
The Thermistor body is made of ceramics and
may be damaged or cracked if dropped.
N eve r use a T h er misto r w hich has be en
dropped; their quality may be impaired and
failure rate increased.
(2) When handling PC boards with Thermistors
mounted on them, do not allow the Thermistors
to collide with another PC board.
When mounted PC boards are handled or stored
in a stacked state, impact between the corner
of a PC board and the Thermistor may cause
damage or cracking and can deteriorate the
withstand voltage and insulation resistance of the
Thermistor.
Check pin
Bending of
PC board
Separated, Crack
PC
board
V-groove
Recommended
setting
Check pin
Loading direction
Loading
point
PC
board
Recommended dividing
Supporting pin
7. Protective Coating
When the surface of a PC board on which the
Capacitors have been mounted is coated with resin
to protect against moisture and dust, it shall be
confirmed that the protective coating which is
corrosive or chemically active is not used, in order
that the reliability of the Thermistors in the actual
equipment may not be influenced. Coating materials
that expand or shrink also may lead to damage to
the Thermistors during the curing process.
Mounted PCB
8. Dividing/Breaking of PC Boards
Crack
(1) Abnormal and excessive mechanical stress such
as bending or torsion shown below can cause
cracking in the Thermistors.
Crack
Floor
Bending
Torsion
■ Other
The various precautions described above are typical.
For special mounting conditions, please contact us.
(2) Dividing/Breaking of the PC boards shall be
done carefully at moderate speed by using a jig
or apparatus to prevent the Thermistors on the
boards from mechanical damage.
00 Sep. 2010
15
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