Texas Instruments WL1837MODCOM8I WLAN MIMO and BT Module EVB for TI Sitara Platform (Rev. A) User manual

Texas Instruments WL1837MODCOM8I WLAN MIMO and BT Module EVB for TI Sitara Platform (Rev. A) User manual
User's Guide
SWRU382A – November 2014 – Revised December 2014
WL1837MODCOM8I WLAN MIMO and Bluetooth® Module
Evaluation Board for TI Sitara™ Platform
The WL1837MODCOM8I is a Wi-Fi® dual-band, Bluetooth, and BLE module evaluation board (EVB) with
the TI WL1837 module (WL1837MOD, with Bluetooth) or WL1807 module (WL1807MOD, without
Bluetooth). The WL18x7MOD is a certified WiLink™ 8 module from TI that offers high throughput and
extended range along with Wi-Fi and Bluetooth coexistence in a power-optimized design. The
WL1807MOD offers A 2.4- and 5-GHz module solution with two antennas supporting industrial
temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and
client. TI offers drivers for high-level operating systems, such as Linux®, Android™, WinCE, and RTOS.TI.
1
2
3
4
5
6
7
8
Contents
Overview ...................................................................................................................... 3
1.1
General Features ................................................................................................... 3
1.2
Key Benefits ......................................................................................................... 3
1.3
Applications .......................................................................................................... 4
Board Pin Assignment ...................................................................................................... 4
2.1
Pin Description ...................................................................................................... 5
2.2
Jumper Connections ............................................................................................... 7
Electrical Characteristics .................................................................................................... 7
Approved Antenna Types and Maximum Gain Values ................................................................. 8
Antenna Characteristics..................................................................................................... 9
5.1
VSWR ................................................................................................................ 9
5.2
Efficiency ........................................................................................................... 10
5.3
Radio Pattern ...................................................................................................... 10
Circuit Design ............................................................................................................... 11
6.1
EVB Reference Schematics ..................................................................................... 11
6.2
Bill of Materials (BOM) ............................................................................................ 12
Layout Guidelines .......................................................................................................... 13
7.1
Board Layout ....................................................................................................... 13
Ordering Information ....................................................................................................... 18
List of Figures
1
WL1837MODCOM8I EVB (Top View) .................................................................................... 3
2
EVB Top View ................................................................................................................ 4
3
EVB (Bottom View) .......................................................................................................... 5
4
Antenna VSWR Characteristics ............................................................................................ 9
5
Antenna Efficiency
10
6
EVB Reference Schematics
11
7
8
9
10
.........................................................................................................
..............................................................................................
WL1837MODCOM8I Layer 1 Layout ....................................................................................
WL1837MODCOM8I Layer 2 Layout ....................................................................................
WL1837MODCOM8I Layer 3 Layout ....................................................................................
WL1837MODCOM8I Layer 4 Layout ....................................................................................
13
13
14
14
Sitara, WiLink are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
Android is a trademark of Google, Inc.
Linux is a registered trademark of Linus Torvalds.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
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1
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11
Module Layout Guidelines (Top Layer) .................................................................................. 15
12
Module Layout Guidelines (Bottom Layer) .............................................................................. 15
13
Trace Design for the PCB Layout ........................................................................................ 16
14
Layer 1 Combined With Layer 2.......................................................................................... 16
15
Top Layer – Antenna and RF Trace Routing Layout Guidelines
16
Bottom Layer – Antenna and RF Trace Routing Layout Guidelines................................................. 17
17
MIMO Antenna Spacing ................................................................................................... 18
....................................................
17
List of Tables
1
Pin Description ............................................................................................................... 5
2
Approved Antenna Types and Maximum Gain Values ................................................................. 8
3
BOM .......................................................................................................................... 12
4
Module Layout Guidelines
5
................................................................................................
Antenna and RF Trace Routing Layout Guidelines ....................................................................
15
17
Warning
The WL1837MODCOM8I board is tested to comply with ETSI/R&TTE over temperatures from –40°C to
+85°C.
This board should not be modified to operate in other frequency bands other than what they are designed
for.
FCC Licensing Requirements for the Wi-Fi and Bluetooth Radio Module of the EVM:
For evaluation only; not FCC approved for resale. This kit is designed to allow:
1. Product developers to evaluate electronic components, circuitry, or software associated with the kit to
determine whether to incorporate such items in a finished product
2. Software developers to write software applications for use with the end product. This kit is not a
finished product and when assembled may not be resold or otherwise marketed unless all required
FCC equipment authorizations are first obtained. Operation is subject to the condition that this product
not cause harmful interference to licensed radio stations and that this product accept harmful
interference. Unless the assembled kit is designed to operate under part 15, part 18, or part 95 of this
chapter, the operator of the kit must operate under the authority of an FCC license holder or must
secure an experimental authorization under part 5 of this chapter.
Per TI’s Regulatory Compliance Information located in the WL1837MODCOM8I User’s Guide’s
“Evaluation Board/Kit/Module (EVM) Additional Terms,” this EVM cannot be used for production purposes
and is explicitly restricted from end-product introduction.
Use of this EVM requires the developer to provide a minimum distance of at least 20 cm from the antenna
to all persons in order to minimize risk of potential radiation hazards.
CAUTION
Do not leave the EVM powered when unattended.
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Overview
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1
Overview
Figure 1 shows the WL1837MODCOM8I EVB.
U1
WL1837MODGI
Figure 1. WL1837MODCOM8I EVB (Top View)
1.1
General Features
The WL1837MODCOM8I EVB includes the following features:
• WLAN, Bluetooth, and BLE on a single module board
• 100-pin board card
• Dimensions: 76.0 mm (L) x 31.0 mm (W)
• WLAN 2.4- and 5-GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels)
• Support for BLE dual mode
• Seamless integration with TI Sitara and other application processors
• Design for the TI AM335X general-purpose evaluation module (EVM)
• WLAN and Bluetooth, BLE, and ANT cores that are software- and hardware-compatible with prior
WL127x, WL128x, and BL6450 offerings for smooth migration to device
• Shared host-controller-interface (HCI) transport for Bluetooth, BLE, and ANT using UART and SDIO for
WLAN
• Wi-Fi and Bluetooth single-antenna coexistence
• Built-in chip antenna
• Optional U.FL RF connector for external antenna
• Direct connection to the battery using an external switched-mode power supply (SMPS) supporting
2.9- to 4.8-V operation
• VIO in the 1.8-V domain
1.2
Key Benefits
The WL18x7MOD offers the following benefits:
• Reduces design overhead: Single WiLink 8 module scales across Wi-Fi and Bluetooth
• WLAN high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
• Bluetooth 4.1 + BLE (Smart Ready)
• Wi-Fi and Bluetooth single-antenna coexistence
• Low power at 30% to 50% less than the previous generation
• Available as an easy-to-use FCC-, ETSI-, and Telec-certified module
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Overview
•
•
1.3
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Lower manufacturing costs saves board space and minimizes RF expertise.
AM335x Linux and Android reference platform accelerates customer development and time to market.
Applications
The WL1837MODCOM8I device is designed for the following applications:
• Portable consumer devices
• Home electronics
• Home appliances and white goods
• Industrial and home automation
• Smart gateway and metering
• Video conferencing
• Video camera and security
2
Board Pin Assignment
Figure 2 shows the top view of the EVB.
Figure 2. EVB Top View
4
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Board Pin Assignment
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Figure 3 shows the bottom view of the EVB.
Figure 3. EVB (Bottom View)
2.1
Pin Description
Table 1 describes the board pins.
Table 1. Pin Description
No.
Name
Type
Description
1
SLOW_CLK
I
Slow clock input option (default: NU)
2
GND
G
Ground
3
GND
G
Ground
4
WL_EN
I
WLAN enable
5
VBAT
P
3.6-V typical voltage input
6
GND
G
Ground
7
VBAT
P
3.6-V typical voltage input
8
VIO
P
VIO 1.8-V (I/O voltage) input
9
GND
G
Ground
10
N.C.
11
WL_RS232_TX
12
N.C.
13
WL_RS232_RX
14
N.C.
15
WL_UART_DBG
16
N.C.
17
N.C.
18
GND
G
Ground
19
GND
G
Ground
20
SDIO_CLK
I
WLAN SDIO clock
No connection
O
WLAN tool RS232 output
No connection
I
WLAN tool RS232 input
No connection
O
WLAN Logger output
No connection
No connection
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Board Pin Assignment
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Table 1. Pin Description (continued)
No.
6
Name
Type
Description
21
N.C.
No connection
22
GND
23
N.C.
24
SDIO_CMD
25
N.C.
26
SDIO_D0
27
N.C.
28
SDIO_D1
29
N.C.
30
SDIO_D2
31
N.C.
32
SDIO_D3
33
N.C.
34
WLAN_IRQ
35
N.C.
36
N.C.
37
GND
38
N.C.
No connection
39
N.C.
No connection
40
N.C.
No connection
41
N.C.
No connection
42
GND
43
N.C.
No connection
44
N.C.
No connection
45
N.C.
No connection
46
N.C.
47
GND
48
N.C.
No connection
49
N.C.
No connection
50
N.C.
No connection
51
N.C.
No connection
52
PCM_IF_CLK
53
N.C.
54
PCM_IF_FSYNC
55
N.C.
56
PCM_IF_DIN
57
N.C.
58
PCM_IF_DOUT
59
N.C.
60
GND
61
N.C.
62
N.C.
63
GND
G
Ground
64
GND
G
Ground
65
N.C.
66
BT_UART_IF_TX
67
N.C.
G
Ground
No connection
I/O
WLAN SDIO command
No connection
I/O
WLAN SDIO data bit 0
No connection
I/O
WLAN SDIO data bit 1
No connection
I/O
WLAN SDIO data bit 2
No connection
I/O
WLAN SDIO data bit 3
No connection
O
WLAN SDIO interrupt out
No connection
No connection
G
G
Ground
Ground
No connection
G
I/O
Ground
Bluetooth PCM clock input or output
No connection
I/O
Bluetooth PCM frame sync input or output
No connection
I
Bluetooth PCM data input
No connection
O
Bluetooth PCM data output
No connection
G
Ground
No connection
No connection
No connection
O
Bluetooth HCI UART transmit output
No connection
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Board Pin Assignment
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Table 1. Pin Description (continued)
No.
2.2
Name
Type
I
Description
68
BT_UART_IF_RX
Bluetooth HCI UART receive input
69
N.C.
70
BT_UART_IF_CTS
71
N.C.
72
BT_UART_IF_RTS
73
N.C.
74
RESERVED1
75
N.C.
76
BT_UART_DEBUG
O
Bluetooth Logger UART output
77
GND
G
Ground
78
GPIO9
I/O
General-purpose I/O
79
N.C.
No connection
80
N.C.
No connection
81
N.C.
No connection
82
N.C.
No connection
83
GND
84
N.C.
No connection
85
N.C.
No connection
86
N.C.
87
GND
88
N.C.
89
BT_EN
90
N.C.
91
N.C.
92
GND
G
Ground
93
RESERVED2
I
Reserved
94
N.C.
95
GND
G
Ground
96
GPIO11
I/O
General-purpose I/O
97
GND
G
Ground
98
GPIO12
I/O
General-purpose I/O
99
TCXO_CLK_COM
100
GPIO10
No connection
I
Bluetooth HCI UART Clear-to-Send input
No connection
O
Bluetooth HCI UART Request-to-Send output
No connection
O
Reserved
No connection
G
Ground
No connection
G
Ground
No connection
I
Bluetooth enable
No connection
No connection
No connection
I
I/O
Option to supply 26 MHz externally
General-purpose I/O
Jumper Connections
The WL1837MODCOM8I EVB includes the following jumper connections:
• J1: Jumper connector for VIO power input
• J3: Jumper connector for VBAT power input
• J5: RF connector for 2.4- and 5-GHz WLAN and Bluetooth
• J6: Second RF connector for 2.4-GHz WLAN
3
Electrical Characteristics
For electrical characteristics, see the WL18xxMOD WiLink™ Single-Band Combo Module – Wi-Fi®,
Bluetooth®, and Bluetooth Low Energy (BLE) Data Sheet (SWRS170).
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Approved Antenna Types and Maximum Gain Values
4
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Approved Antenna Types and Maximum Gain Values
This device is intended only for OEM integrators under the following conditions:
• The antenna must be installed so that 20 cm is maintained between the antenna and users.
• The transmitter module cannot be co-located with any other transmitter or antenna.
• The radio transmitter can operate only using an antenna of a type and maximum (or lesser) gain
approved by TI. Table 2 lists the antennas approved by TI for use with the radio transmitter along with
maximum allowable gain values. Antenna types not included in the list or having a gain greater than
the maximum indicated are strictly prohibited for use with this transmitter.
Table 2. Approved Antenna Types and Maximum Gain Values
(1)
Antenna Type
Brand
2.4 GHz
4.9 to 5.9 GHz (1)
PCB
Ethertronics
–0.600
4.50
Dipole
LSR
2.00
2.00
PCB
Laird
2.00
4.00
Chip
Pulse
3.20
4.20
PIFA
LSR
2.00
3.00
Chip
TDK
2.27
3.96
Unit
dBi
Range is approximate.
NOTE: If these conditions cannot be met (for example, with certain laptop configurations or colocation with another transmitter), the FCC/IC authorization will not be considered valid and
the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM
integrator is responsible for reevaluating the end product (including the transmitter) and
obtaining a separate FCC/IC authorization.
8
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Antenna Characteristics
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5
Antenna Characteristics
5.1
VSWR
Figure 4 shows the antenna VSWR characteristics.
Figure 4. Antenna VSWR Characteristics
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Antenna Characteristics
5.2
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Efficiency
Figure 5 shows the antenna efficiency.
Figure 5. Antenna Efficiency
5.3
Radio Pattern
For information on the antenna radio pattern and other related information, see
productfinder.pulseeng.com/product/W3006.
10
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Circuit Design
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6
Circuit Design
6.1
EVB Reference Schematics
Figure 6 shows the reference schematics for the EVB.
WL_UART_DBG
R1
0R 0402
R2
0R 0402
R4
BT_UART_DBG
J1
NU_HEADER 1x2
H-1X2_2MM
0R 0402
R3
2
1
BT_EN_SOC
TP2
1
TP1
1
C2
10uF
0603
C1
1uF
0402
R32
0R
0603
VBAT_IN
1
TP7
VIO_IN
0R 0402
R31
0R
0603
C3
0.1uF
0402
SLOW_CLK
OSC1
1V8 / 32.768kHz
OSC-3.2X2.5
SLOW_CLK
2
1
WLAN_EN_SOC
3
R6
0R
0402
2
OUT
GND
VIO_IN
VBAT_IN
1
EN
4
VCC
C4
0.1uF
0402
J3
NU_HEADER 1x2
H-1X2_2MM
WL_RS232_TX
WL_RS232_RX
A2
EN
GND
A1
34
33
GND
GND
GND
35
36
37
38
VIO
GND
EXT_32K
41
42
40
39
GND
BT_EN_SOC
WLAN_EN_SOC
46
43
BT_UART_DBG
WL_UART_DBG
GND
47
44
45
GND
VBAT
RF_ANT2
RESERVED
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
1
EXT_CLK_REQ_OUT
VIO_CLK
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
VBAT_IN
U4
NU_TLV70518
C32
XBGA-N4_0.8X0.8_0.4
NU_0.1uF
0402
B2
B1
VIN
VOUT
G19
G20
G21
G22
G23
G24
G25
G26
G27
G28
G29
G30
G31
G32
G33
G34
G35
G36
GND
GND
R33
0R
0402
RESERVED3
WLAN_IRQ
R35
NU
0402
2
GND
RF_ANT1
32
NU
0402
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
30
27
28
29
1
TP3
29
30
28
1
TP4
31
32
31
1
TP8
These two TPs for test mode
when WL_IRQ pull high.
27
R12
0R
0402
WL_RS232_TX
33
34
26
R13
0R
0402
WL_RS232_RX
35
36
37
38
39
40
25
1
TP5
24
41
42
RESERVED2
43
44
RESERVED1
45
46
20
47
48
19
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
23
22
R17
21
0R 0402
R19
0R 0402
RF_ANT2
18
17
G1
G2
G3
G4
G5
G6
G7
G8
G9
G10
G11
G12
G13
G14
G15
G16
G17
G18
WLAN_EN_SOC
VIO_IN
SDIO_CLK_WL
SDIO_CMD_WL
SDIO_D0_WL
SDIO_D1_WL
SDIO_D2_WL
SDIO_D3_WL
R10
0R
0402
WLAN_IRQ
BT_AUD_CLK
BT_AUD_FSYNC
BT_AUD_IN
BT_AUD_OUT
BT_HCI_TX
BT_HCI_RX
BT_HCI_CTS
BT_HCI_RTS
RESERVED1
BT_UART_DBG
GPIO9
16
64
GND
15
GND
63
RESERVED1
WL_SDIO_D3
NC
NU
0402
GND
BT_AUD_CLK
WL_SDIO_D2
1
TCXO_CLK_COM R36
62
R34
NU
0402
GND
RESERVED2
WL_SDIO_D1
EXT_CLK_REQ_OUT
TCXO1
NU_TCXO 26MHz
2.0x1.6x0.73mm
4
3
VCC OUT
C15
NU_1uF
0402
61
GPIO_4
GND
14
1
TP6
VIO_CLK
60
0R 0402
BT_AUD_FSYNC
13
R18
BT_AUD_OUT
12
BT_AUD_CLK
U1
WL1837MODGI
E-13.4X13.3-N100_0.75-TOP
BT_AUD_IN
11
59
WL_SDIO_D0
58
GND
57
0R 0402
GPIO_2
10
56
0R 0402
R16
GND
WL_SDIO_CLK
0R 0402
R15
BT_AUD_FSYNC
GPIO_1
GND
R14
BT_AUD_OUT
GND
WL_SDIO_CMD
BT_AUD_IN
GND
9
55
GND
BT_HCI_RX
8
54
BT_HCI_TX
7
53
0402
GPIO12
52
0R
GND
6
0R 0402
R11
BT_HCI_CTS
GPIO10
R9
BT_HCI_RX
GND
GPIO9
BT_HCI_TX
RF_ANT1
BT_HCI_RTS
GPIO11
51
5
50
0R 0402
4
0R 0402
R8
3
R7
BT_HCI_CTS
2
BT_HCI_RTS
GND
GND
49
VBAT
GND
48
WL_UART_DBG
R5
VIO_IN
R20 for test mode.
R20
10k
0402
WLAN_IRQ
GPIO11
R21
0R 0402
GPIO9
R22
0R 0402
R23
0R
0402
SDIO_D3_WL
GPIO10
R24
0R 0402
R25
0R
0402
SDIO_D2_WL
89
90
GPIO12
R26
0R 0402
R27
0R
0402
SDIO_D1_WL
91
92
R29
0R
0402
SDIO_D0_WL
93
94
BT_EN_SOC
R30
0R
0402
SDIO_CLK_WL
R28
0R
0402
SDIO_CMD_WL
RESERVED2
95
TCXO_CLK_COM
96
97
98
99
100
GPIO11
GPIO12
GPIO10
J2
NU_100pin Micro Edge MEC6
SD-100P
ANT1 - WL_2.4_IO2/BT/WL_5GHz
ANT2 - WL_2.4_IO1/WL_5GHz
C5
0R
0402
RF_ANT1
ANT1
W3006
ANT-10.0X3.2MM_B
C13
1pF
0402
1
C7
NU_0R
0402
L2
NU
0402
2
1
3
J5
U.FL-R-SMT(10)
U.FL
L1
1.3nH
0402
FEED
NC
2
C6
0R
0402
RF_ANT2
C14
2.4pF
0402
C8
NU_0R
0402
L4
2.2nH
0402
2
1
3
EDGE CONNECTOR - MALE
ANT2
W3006
ANT-10.0X3.2MM_A
1
FEED
NC
2
L3
1.8nH
0402
J6
U.FL-R-SMT(10)
U.FL
Figure 6. EVB Reference Schematics
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Circuit Design
6.2
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Bill of Materials (BOM)
Table 3 lists the BOM for the EVB.
Table 3. BOM
Item
(1)
12
Package
Reference
Qty
Mfr
1
TI WL1837 Wi-Fi / Bluetooth
module
Description
WL1837MODGI
Part Number
13.4 mm x 13.3 mm
x 2.0 mm
U1
1
Jorjin
2
XOSC 3225 / 32.768KHZ / 1.8 V /
±50 ppm
7XZ3200005
3.2 mm × 2.5 mm ×
1.0 mm
OSC1
1
TXC
3
Antenna / Chip / 2.4 and 5 GHz
W3006
10.0 mm × 3.2 mm
× 1.5 mm
ANT1, ANT2
2
Pulse
4
Mini RF header receptacle
U.FL-R-SMT-1(10)
3.0 mm × 2.6 mm ×
1.25 mm
J5, J6
2
Hirose
5
Inductor 0402 / 1.3 nH / ±0.1 nH /
SMD
LQP15MN1N3B02
0402
L1
1
Murata
6
Inductor 0402 / 1.8 nH / ±0.1 nH /
SMD
LQP15MN1N8B02
0402
L3
1
Murata
7
Inductor 0402 / 2.2 nH / ±0.1 nH /
SMD
LQP15MN2N2B02
0402
L4
1
Murata
8
Capacitor 0402 / 1 pF / 50 V / C0G GJM1555C1H1R0BB01
/ ±0.1 pF
0402
C13
1
Murata
9
Capacitor 0402 / 2.4 pF / 50 V /
C0G / ±0.1 pF
GJM1555C1H2R4BB01
0402
C14
1
Murata
10
Capacitor 0402 / 0.1 µF / 10 V /
X7R / ±10%
0402B104K100CT
0402
C3, C4
2
Walsin
11
Capacitor 0402 / 1 µF / 6.3 V /
X5R / ±10% / HF
GRM155R60J105KE19D
0402
C1
1
Murata
12
Capacitor 0603 / 10 µF / 6.3 V /
X5R / ±20%
C1608X5R0J106M
0603
C2
1
TDK
13
Resistor 0402 / 0R / ±5%
WR04X000 PTL
0402
R1 to R4, R6 to
R19, R21 to
R30, R33, C5,
C6 (1)
31
Walsin
14
Resistor 0402 / 10K / ±5%
WR04X103 JTL
0402
R20
1
Walsin
15
Resistor 0603 / 0R / ±5%
WR06X000 PTL
0603
R31, R32
2
Walsin
C5 and C6 are mounted with a 0-Ω resistor by default.
WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation BoardSWRU382A – November 2014 – Revised December 2014
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Layout Guidelines
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7
Layout Guidelines
7.1
Board Layout
Figure 7 through Figure 10 show the four layers of the WL1837MODCOM8I EVB.
Figure 7. WL1837MODCOM8I Layer 1 Layout
Figure 8. WL1837MODCOM8I Layer 2 Layout
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Layout Guidelines
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Figure 9. WL1837MODCOM8I Layer 3 Layout
Figure 10. WL1837MODCOM8I Layer 4 Layout
Figure 11 and Figure 12 show instances of good layout practices.
14
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Figure 11. Module Layout Guidelines (Top Layer)
Figure 12. Module Layout Guidelines (Bottom Layer)
Table 4 describes the guidelines corresponding to the reference numbers in Figure 11 and Figure 12.
Table 4. Module Layout Guidelines
Reference
Guideline Description
1
Keep the proximity of ground vias close to the pad.
2
Do not run signal traces underneath the module on the layer where the module is mounted.
3
Have a complete ground pour in layer 2 for thermal dissipation.
4
Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation.
5
Increase ground pour in the first layer and have all traces from the first layer on the inner layers, if possible.
6
Signal traces can be run on a third layer under the solid ground layer and the module mounting layer.
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Layout Guidelines
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Figure 13 shows the trace design for the PCB. TI recommends using a 50-Ω impedance match on the
trace to the antenna and 50-Ω traces for the PCB layout.
Figure 13. Trace Design for the PCB Layout
Figure 14 shows layer 1 with the trace to the antenna over ground layer 2.
Figure 14. Layer 1 Combined With Layer 2
Figure 15 and Figure 16 show instances of good layout practices for the antenna and RF trace routing.
NOTE: RF traces must be as short as possible. The antenna, RF traces, and modules must be on
the edge of the PCB product. The proximity of the antenna to the enclosure and the
enclosure material must also be considered.
16
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Figure 15. Top Layer – Antenna and RF Trace Routing Layout Guidelines
Figure 16. Bottom Layer – Antenna and RF Trace Routing Layout Guidelines
Table 5 describes the guidelines corresponding to the reference numbers in Figure 15 and Figure 16.
Table 5. Antenna and RF Trace Routing Layout Guidelines
Reference
Guideline Description
1
The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace
starts to radiate.
2
RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF
traces must not have sharp corners.
3
RF traces must have via stitching on the ground plane beside the RF trace on both sides.
4
RF traces must have constant impedance (microstrip transmission line).
5
For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The
ground layer must be solid.
6
There must be no traces or ground under the antenna section.
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Ordering Information
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Figure 17 shows the MIMO antenna spacing. The distance between ANT1 and ANT2 must be greater
than half the wavelength (62.5 mm at 2.4 GHz).
Figure 17. MIMO Antenna Spacing
Follow these supply routing guidelines:
• For power supply routing, the power trace for VBAT must be at least 40-mil wide.
• The 1.8-V trace must be at least 18-mil wide.
• Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance.
• If possible, shield VBAT traces with ground above, below, and beside the traces.
Follow these digital-signal routing guidelines:
• Route SDIO signal traces (CLK, CMD, D0, D1, D2, and D3) in parallel to each other and as short as
possible (less than 12 cm). In addition, each trace must be the same length. Ensure enough space
between traces (greater than 1.5 times the trace width or ground) to ensure signal quality, especially
for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal
traces. TI recommends adding ground shielding around these buses.
• Digital clock signals (SDIO clock, PCM clock, and so on) are a source of noise. Keep the traces of
these signals as short as possible. Whenever possible, maintain a clearance around these signals.
8
Ordering Information
Part number:
WL1837MODCOM8I
Revision History
Changes from Original (November 2014) to A Revision ................................................................................................ Page
•
•
•
•
•
•
18
Added WL1807MOD in abstract ........................................................................................................ 1
Added Warning ............................................................................................................................ 2
Changed EVB in Figure 1 ................................................................................................................ 3
Added input type to pin 99 in Table 1 .................................................................................................. 7
Added Section 4, Approved Antennas and Maximum Gain Values ................................................................ 8
Changed EVB reference schematics in Figure 6 .................................................................................... 11
WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation BoardSWRU382A – November 2014 – Revised December 2014
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Revision History
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•
Deleted item 16 (PCB) in Table 3
.....................................................................................................
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Revision History
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19
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