2008 RECOMMENDED Electronics Assembly Materials ®

2008  RECOMMENDED Electronics  Assembly  Materials ®
2008 RECOMMENDED
Electronics Assembly Materials
®
Solve Your Lead-Free Puzzle with Kester
Kester’s set of compatible lead-free materials makes lead-free
assembly a snap. Whether it’s for SMT, Wave Soldering, Hand
Soldering or Rework applications, Kester has reliable Lead-Free
Solutions™ specifically tailored for your assembly needs.
EnviroMark™907 No-Clean Solder Paste
• Excellent wetting and shininess
• Extremely print friendly
• #1 globally specified lead-free paste
K100LD Bar Solder
• Lowest copper dissolution
• Silver-free and low-dross to lower costs
• Shiny joints with excellent process yields
®
An Illinois Tool Works Company
Global Headquarters
800 W. Thorndale Avenue
Itasca, IL 60143
Phone: 800 2.KESTER
(+1) 847.297.1600
Fax: (+1) 847.390.9338
Branches:
Canada
Mexico Germany Brazil Japan
Singapore Taiwan Malaysia China
website: www.kester.com
959T Alcohol-Based and 979 VOC-Free Fluxes
• Excellent hole-fill
• Low voids
• High reliability no-clean with low residues
275 No-Clean Cored Wire
• Fast wetting for efficient soldering
• Minimal smoke and low odor
• Available in K100LD and SAC305 alloys
Call Kester today for your complete
Global Lead-Free Solutions™ package.
Page 3
Kester Lead-Free
Kester Lead-Free Solutions™
With over 100 years of soldering technology experience,
Kester understands the challenges associated with the transition
from leaded to lead-free soldering. Kester's Lead-Free
Solutions™ offers the following help:
• Complete line of lead-free materials
• Kester's know-how to implement lead-free
• Consulting and training courses in lead-free SMT,
wave soldering, and rework
• Unique lead-free product packaging
• Test services
Kester RoHS Ready Logo
Kester commitment to a smooth lead-free transition is demonstrated by its "green packaging", the development of uniquely
shape lead-free triangular bar solders for easy identification,
and the lead-free knowledge available in Kester University training
courses, lead-free seminars, and
its quarterly Lead-Free Connection™
newsletter. Now Kester has gone
one step further by developing a
RoHS Ready Logo.
• Logo identifies Kester products to be in
compliance with RoHS Directive 2002/95/EC
Article 4 for banned substances
• Can be seen on technical literature such as
data sheets.
Page 4
Kester Lead-Free
Lead-Free Solder Pastes
Formula
EnviroMark™ 907
Application
Alloys
R520A
EnviroMark™ 828
No-Clean Stencil Printing
Water-Soluble Stencil Printing
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Product
Characteristics
Designed to exceed customers' expectations for high yield
lead-free manufacturing. EM907 is engineered for the
high thermal demands of assembling with lead-free alloys
such as the family of SnAgCu (SAC). Joints are cosmetically
bright as SnPb joints. Prints down to 0201 pad sites.
Designed to be reflowable in air as well as nitrogen.
Kester EM828 provides excellent printability, activity,
cleanability and low-voiding behavior. EM828 is very
robust and can tolerate a wide variety of printing and
reflow conditions. EM828 is first to market with a
water-soluable lead-free paste that combines superior
activity, cleanability and low-voiding.
R520A is designed to solder effectively difficult metal
surfaces in an air or nitrogen reflow atmosphere. The
activator package is able to withstand the higher temperatures without slump. The flux system is non-hygroscopic,
reducing paste waste at the printer. It is available in all
common lead-free alloys.
Residue Characteristics
Light colored
Cleanable in warm water
Cleanable in warm water
Typical Metal Percentage
88.5%, -325/+500 (Type 3)
89.5%, -325/+500 (Type 3)
89.5%, -325/+500 (Type 3)
Compliant Specifications
Telcordia Issue 1 GR-78-CORE
IPC/J-STD-004 Flux Designator ROL0
IPC/J-STD-004 Flux Designator ORH1
IPC/J-STD-004 Flux Designator ORH0
Suggested Packaging Style
500g jar, 600g, 1400g cartridges
500g jar, 600g, 1400g cartridges
500g jar, 600g, 1400g cartridges
Liquid Soldering Fluxes for
Lead-Free Wave Soldering
Kester Part #
Description
Alloy
Packaging
57-3043-9909
EM907 No-Clean, Type 3, 88.5% metal
Sn96.5Ag3.0Cu0.5
500g jar
57-3043-9913
EM907 No-Clean, Type 3, 88.5% metal
Sn96.5Ag3.0Cu0.5
600g cartridge
57-3043-9916
EM907 No-Clean, Type 3, 88.5% metal
Sn96.5Ag3.0Cu0.5
1400g cartridge
55-3843-2209
EM828 Water-Soluble, Type 3, 89.5% metal
Sn96.5Ag3.0Cu0.5
55-3843-2213
EM828 Water-Soluble, Type 3, 89.5% metal
Sn96.5Ag3.0Cu0.5
500g jar
600g cartridge
57-3843-8109
R520A Water-Soluble, Type 3, 89.5% metal
Sn96.5Ag3.0Cu0.5
500g jar
57-3843-8113
R520A Water-Soluble, Type 3, 89.5% metal
Sn96.5Ag3.0Cu0.5
600g cartridge
57-3843-8116
R520A Water-Soluble, Type 3, 89.5% metal
Sn96.5Ag3.0Cu0.5
1400g cartridge
Lead-free wave and selective soldering require exposing the flux to
slightly higher soldering temperatures. Lead-free alloys traditionally
wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for
lead-free assembly have new activator packages to enable rapid wetting
and hole-filling, ensuring reliable product output.
Kester Part #
Description
Packaging
63-0004-0985
985M No-Clean
1 gallon
64-0004-0985
985M No-Clean
5 gallon
65-0004-0985
985M No-Clean
53 gallon drum
63-0020-0959
959T No-Clean
1 gallon
64-0020-0959
959T No-Clean
5 gallon
65-0020-0959
959T No-Clean
53 gallon drum
63-0056-2220
2220-VF VOC-Free Water-Soluble
1 gallon
64-0056-2220
2220-VF VOC-Free Water-Soluble
5 gallon
65-0056-2220
2220-VF VOC-Free Water-Soluble
53 gallon drum
63-0000-2235
2235 Water-Soluble
1 gallon
64-0000-2235
2235 Water-Soluble
5 gallon
65-0000-2235
2235 Water-Soluble
53 gallon drum
*Formula
985M
959T
2220-VF VOC-Free
2235
No-Clean
No-Clean
Water-Soluble
Water-Soluble
Application
Spray or Wave Fluxer
Spray or Foam Fluxer
Spray, Wave or Foam Fluxer
Spray or Foam Fluxer
Halide Content %
Halide - free
Halide - free
1.6
1.6
Specific Gravity
0.805
0.794
1.055
0.856
Solids %
3.6
2.9
7
11
Compliant Specifications
IPC/J-STD-004
Flux Designator ROL0
IPC/J-STD-004
Flux Designator ORL0
IPC/J-STD-004
Flux Designator ORH1
IPC/J-STD-004
Flux Designator ORH1
*These products are designed specifically for high performance lead-free applications.
.
Ultrapure® K100LD Lead-Free Solder Bar
K100LD is a new patent-pending low-cost lead-free solder alloy for use in wave soldering,
selective soldering, and tip tinning operations. K100LD has the Lowest Copper Dissolution
amongst all common solder alloys, including SN63, SAC305, and other lead-free options.
Kester K100LD provides the lowest cost for wave soldering operations. It also provides
solder joints with no shrinkage effects, excellent through-hole penetration and topside
fillet, and provides a low dross rate.
Ultrapure K100 Lead-Free Solder Bar
®
Kester Ultrapure® K100 is a low-cost lead-free bar and wire solder. It is a near-eutectic
Tin/Copper alloy with metallic dopants to control the grain structure of the solder joint.
This improves joint reliability and virtually eliminates icicling and bridging.The improved
grain structure also results in shinier solder joints than other traditional lead-free alloys.
Kester Part #
Alloy
Each Bar
Sold As
04-9574-0050
K100LD
1 2/3 lbs.
25 lbs.
04-9571-0050
K100
1 2/3 lbs.
25 lbs.
04-7068-0000
Sn96.5Ag3.0Cu0.5
1 2/3 lbs.
25 lbs.
Common Lead-Free Alloys
*Alloys
Melt Temperature
Application
K100LD
~227°C/441°F
Wave/Hand Soldering
K100
~227°C/441°F
Wave/Hand Soldering
Sn96.5Ag3.0Cu0.5
217°C/423°F
SMT/Hand/Wave
Sn96.5Ag3.5
221°C/430°F
SMT/Hand Soldering
* These are the most common lead-free alloys used in the industry. Kester can also produce a multitude of
lead-free alloys as specified by individual requirements.
Page 6
Kester Lead-Free
Solder Wires for
Lead-Free Assembly
Formula
275
48
331
No-Clean
Activated Rosin
Water-Soluble
< 0.05%
1.0%
1.25%
Flux Content
Availability
See
Below
66 core
(3.3%)
66 core
(3.3%)
Compliant
Specifications
Telcordia Issue 1
GR-78-CORE & IPC/J-STD-004
Flux designator ROL0
IPC/J-STD-004
Flux Designator ROM1
IPC/J-STD-004
Flux designator ORH1
Halide Percentage
“275” No-Clean Core 1 lb. with K100LD
“275” No-Clean Core 1 lb. with SAC305
Part #
Alloy
Diameter
Core Size
Part #
Alloy
Diameter
Core Size
24-9574-7610
K100LD
.020
66
24-7068-7603
Sn96.5Ag3.0Cu0.5
.020
58
24-9574-7619
K100LD
.025
66
24-7068-7617
Sn96.5Ag3.0Cu0.5
.025
58
24-9574-7618
K100LD
.031
66
24-7068-7601
Sn96.5Ag3.0Cu0.5
.031
58
24-9574-7613
K100LD
.050
66
24-7068-7606
Sn96.5Ag3.0Cu0.5
.050
58
24-9574-7615
K100LD
.062
66
24-7068-7607
Sn96.5Ag3.0Cu0.5
.062
58
"48" Activated Rosin 1 lb. with SAC305
"48" Activated Rosin 1 lb. with K100LD
Part #
Alloy
Diameter
Core Size
Part #
Alloy
Diameter
Core Size
24-9574-1401
K100LD
.020
66
24-7068-1401
Sn96.5Ag3.0Cu0.5
.020
66
24-9574-1406
K100LD
.025
66
24-7068-1406
Sn96.5Ag3.0Cu0.5
.025
66
24-9574-1402
K100LD
.031
66
24-7068-1402
Sn96.5Ag3.0Cu0.5
.031
66
24-9574-1404
K100LD
.050
66
24-7068-1404
Sn96.5Ag3.0Cu0.5
.050
66
24-9574-1400
K100LD
.062
66
24-7068-1400
Sn96.5Ag3.0Cu0.5
.062
66
“331” Water-Soluble Core 1 lb. with SAC305
“331” Water-Soluble Core 1 lb. with K100LD
Part #
Alloy
Diameter
Core Size
Part #
Alloy
Diameter
Core Size
24-9574-6401
K100LD
.020
66
24-7068-6401
Sn96.5Ag3.0Cu0.5
.020
66
24-9574-6417
K100LD
.025
66
24-7068-6417
Sn96.5Ag3.0Cu0.5
.025
66
24-9574-6403
K100LD
.031
66
24-7068-6403
Sn96.5Ag3.0Cu0.5
.031
66
24-9574-6409
K100LD
.050
66
24-7068-6409
Sn96.5Ag3.0Cu0.5
.050
66
66
24-7068-6411
Sn96.5Ag3.0Cu0.5
.062
66
24-9574-6411
K100LD
.062
Page 7
Solder Paste
Water-Soluble
No-Clean
Solder Paste for Stencil Printing Applications
Formula Type
Alloy
Easy Profile 256HA
Sn63Pb37
Easy
Sn62Pb36Ag2
Sn63Pb37
Profile®
HydroMark 531
256
Sn62Pb36Ag2
High activity no-clean paste specifically
engineered to provide excellent solderability Standard no-clean paste for a wide
to lead free component and board finishes. variety of reflow profiles and printing
Product
Consistent print volume regardless of
conditions. Industry standard formula
Characteristics
process parameters and 0201 application
that performs well in a variety of
capable. Wide reflow process window.
applications. Compatible with enclosed
Compatible with enclosed print head
print head systems.
systems.
Sn63Pb37
R562
Sn62Pb36Ag2
Sn63Pb37
This highly-active, anti-slump paste is produced
consistently so that every batch results in high yield
manufacturing. HydroMark 531 also offers
extremely robust printing, even with idle time up
to 1 hour and print speeds of up to 6 in/sec. This
very active formula is effective on a wide variety of
metallizations, including palladium. Compatible with
enclosed print head systems.
Sn62Pb36Ag2
Designed for maximum environmental robustness
and minimal void production, R562 has a stencil life
of over 8 hours and may be used in a wide range
of humidities (10 - 85% RH). Compatible with
enclosed print head systems.
Residue
Removal
Not normally required.
Not normally required.
Use de-ionized or soft tap water at
120-140°F.
Use de-ionized or soft tap water at
120-140°F.
Compliant
Specifications
Telcordia Issue 1GR-78-CORE,
IPC/J-STD-004
Classification ROL0
Telcordia Issue 1GR-78-CORE,
IPC/J-STD-004
Classification ROL0
IPC/J-STD-004
Classification ORM0
IPC/J-STD-004
Classification ORH0
Powder
Mesh Size
-325/+500 (Type 3)
-325/+500 (Type 3)
-325/+500 (Type 3)
-325/+500 (Type 3)
Metal %
90%
90%
90%
90%
Suggested
Packaging Style
500g jar,
600g, 1400g cartridges
500g jar,
600g, 1400g cartridges
500g jar,
600g, 1400g cartridges
500g jar,
600g, 1400g cartridges
Solder Paste for Syringe Dispensing Applications
Formula Type
R276
R500
Alloy
Sn63Pb37
Sn63Pb37
Product
Characteristics
Provides optimal performance in all types of dispensing applications. R276 is packaged void-free to ensure consistent dispensing in high speed automated processes.
Exhibits excellent dispensing characteristics with a wide range of needle diameters.
The activator package in this formula is aggressive enough to remove tenacious oxide layers or
solder to OSP coated boards. R500 delivers excellent wetting characteristics.
Residue
Removal
Not normally required.
Use de-ionized or soft tap water at
120-140°F.
Compliant
Specifications
Telcordia Issue 1GR-78-CORE,
IPC/J-STD-004 Classification ROL0
IPC/J-STD-004
Classification ORH0
Powder
Mesh Size
-325/+500 (Type 3)
-325/+500 (Type 3)
Metal %
87%
87%
Suggested
Packaging Style
35g and 100g syringes
35g and 100g syringes
*For lead based products, Kester produces solder powder to J-STD-00GB for alloy purity and
particle distribution, except for Antimony, which is specified to a maximum of 0.2%.
Page 8
Solder Paste
Kester Part #
Description
Alloy
Packaging
57-3201-9209
57-3203-9209
57-3201-9213
57-3203-9213
57-3201-9216
57-3203-9216
Easy Profile® 256HA No-Clean, Type 3, 90% metal
Easy Profile® 256HA No-Clean, Type 3, 90% metal
Easy Profile® 256HA No-Clean, Type 3, 90% metal
Easy Profile® 256HA No-Clean, Type 3, 90% metal
Easy Profile® 256HA No-Clean, Type 3, 90% metal
Easy Profile® 256HA No-Clean, Type 3, 90% metal
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
500g jar
500g jar
600g cartridge
600g cartridge
1400g cartridge
1400g cartridge
57-3201-4809
57-3203-4809
57-3201-4813
57-3203-4813
57-3201-4816
57-3203-4816
Easy Profile® 256 No-Clean, Type 3, 90% metal
Easy Profile® 256 No-Clean, Type 3, 90% metal
Easy Profile® 256 No-Clean, Type 3, 90% metal
Easy Profile® 256 No-Clean, Type 3, 90% metal
Easy Profile® 256 No-Clean, Type 3, 90% metal
Easy Profile® 256 No-Clean, Type 3, 90% metal
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
500g jar
500g jar
600g cartridge
600g cartridge
1400g cartridge
1400g cartridge
57-3201-8509
57-3203-8509
57-3201-8513
57-3203-8513
57-3201-8516
57-3203-8516
HydroMark 531 Water Soluble, Type 3, 90% metal
HydroMark 531 Water Soluble, Type 3, 90% metal
HydroMark 531 Water Soluble, Type 3, 90% metal
HydroMark 531 Water Soluble, Type 3, 90% metal
HydroMark 531 Water Soluble, Type 3, 90% metal
HydroMark 531 Water Soluble, Type 3, 90% metal
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
500g jar
500g jar
600g cartridge
600g cartridge
1400g cartridge
1400g cartridge
57-3201-7509
57-3203-7509
57-3201-7513
57-3203-7513
57-3201-7516
57-3203-7516
R562 Water Soluble, Type 3, 90% metal
R562 Water Soluble, Type 3, 90% metal
R562 Water Soluble, Type 3, 90% metal
R562 Water Soluble, Type 3, 90% metal
R562 Water Soluble, Type 3, 90% metal
R562 Water Soluble, Type 3, 90% metal
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
Sn63Pb37
Sn62Pb36Ag2
500g jar
500g jar
600g cartridge
600g cartridge
1400g cartridge
1400g cartridge
57-3901-5403
57-3901-5407
57-3901-5603
57-3901-5607
R276 No-Clean, Type 3, 87% metal
R276 No-Clean, Type 3, 87% metal
R500 Water Soluble, Type 3, 87% metal
R500 Water Soluble, Type 3, 87% metal
Sn63Pb37
Sn63Pb37
Sn63Pb37
Sn63Pb37
35g syringe
100g syringe
35g syringe
100g syringe
Page 9
Bar Solder
®
Kester Ultra Low Dross
Kester ULTRAPURE
Manufactured by a special process that controls the inclusions of oxides and
metallic and non-metallic impurities, Kester Ultrapure® is the industry standard bar solder for use high tech electronic applications where lower surface
tension and hole filling ability are essential. The purity of Kester Ultrapure®
far exceeds the requirements of ASTM B32, and IPC/J-STD-006A.
Kester Part #
Alloy
Each Bar
Sold As
04-6337-0050
Sn63Pb37
1 2/3 lbs.
25 lbs.
04-6040-0050
Sn60Pb40
1 2/3 lbs.
25 lbs.
This bar solder is manufactured using the Ultrapure® process and containing
the same metal purity as Kester Ultrapure®. Kester Ultra Low Dross is formulated with a special low dross additive that dramatically decreases dross
formation on the solder pot.
Kester Part #
Alloy
Each Bar
Sold As
04-6337-0030
Sn63Pb37
1 2/3 lbs.
25 lbs.
Kester E-Bar
Designed for electrical, electronic and mechanical applications requiring bar solder
that meets or exceeds the requirements of ASTM B32, and IPC/J-STD-006A.
Kester Part #
Alloy
Each Bar
Sold As
04-6337-0000
Sn63Pb37
1 2/3 lbs.
25 lbs.
04-6040-0000
Sn60Pb40
1 2/3 lbs.
25 lbs.
Kester Solder Analysis Program
Kester's Solder Analysis Program is a prepaid method for rapid response solder
sample analysis. It allows customers to document solder pot impurities for
conformance to Federal Specifications or ISO quality requirements.
Kester Flo-Bar
Flo-Bar is an extruded 8.5 or 10 lb. bar manufactured specifically for situations where a larger size is more conveniently managed on certain automatic
solder feeding systems. Flo-Bar is available in Ultrapure® and Ultra Low Dross
grade solder.
Kester Part #
Alloy
Each Bar
Sold As
07-6337-1950
Ultrapure® Sn63Pb37
8.5 lbs.
42.5 lbs.
07-6337-0050
Ultrapure® Sn63Pb37
10 lbs.
50 lbs.
07-6337-1930 Ultra Low Dross Sn63Pb37
8.5 lbs.
42.5 lbs.
07-6337-0030 Ultra Low Dross Sn63Pb37
10 lbs.
50 lbs.
Option C: This option includes monitoring tin, antimony, copper, gold, lead,
cadmium, aluminum, zinc, iron, arsenic, bismuth, silver, and nickel.
Kester Part #
Description
53-0000-0041
Option C
#5744 Solder Saver®
A chloride-free, inorganic white powder formulated to remove dross, which is
the oxide of solder, from still solder pots and wave soldering machines. It does
not decompose to sticky residues that are harder to remove than the original
dross. The product is low fuming and is stable at molten solder temperatures.
Kester Part #
Description
56-0002-5744 5744 Solder Saver 2 lb.
56-0005-5744 5744 Solder Saver 5 lb.
56-0025-5744 5744 Solder Saver 25 lb.
Page 10
Solder Wire
"245" No-Clean
"275" No-Clean
"245" is a halide-free; rosin based no-clean core flux that
provides excellent wetting combined with optimal reliability
and cosmetics. "245" is compliant to Bellcore GR-78-CORE
and is classified as ROL0 per J-STD-004.
"275" provides superior wetting performance leaving an
extremely clear post-soldering residue. "275" is designed
to be a low splattering core flux. "275" is classified as
ROL0 per J-STD-004.
“245” No-Clean Core 1 lb.
“275” No-Clean Core 1 lb.
Part #
Alloy
Diameter
Core Size
Part #
Alloy
Diameter
Core Size
24-6337-8806
Sn63Pb37
.015
50
24-6337-7604
Sn63Pb37
.015
50
24-6337-8807
Sn63Pb37
.020
50
24-6337-7602
Sn63Pb37
.020
50
24-6337-8834
Sn63Pb37
.020
58
24-6337-7616
Sn63Pb37
.025
50
24-6337-8809
Sn63Pb37
.025
50
24-6337-7600
Sn63Pb37
.031
50
24-6337-8800
Sn63Pb37
.031
50
24-6337-7612
Sn63Pb37
.050
50
24-6337-8801
Sn63Pb37
.031
58
24-6337-7614
Sn63Pb37
.062
50
24-6337-8802
Sn63Pb37
.031
66
24-6337-8813
Sn63Pb37
.040
50
24-6337-8814
Sn63Pb37
.050
50
24-6337-8817
Sn63Pb37
.062
50
Kester “44”®
Rosin “44”® is a high activity RA core flux designed for
excellent instant wetting action, even on Nickel surfaces.
Although “44”® is a RA-based material, the residues are
non-corrosive if not cleaned. Per J-STD-004, “44”® is
classified as ROM1 flux.
"331" Water Soluble
“44”® RA Core 1 lb.
"331" is a high-activity water-soluble core flux for soldering
difficult metals. "331" is designed for optimal cleanability,
along with minimal smoke and odor. The residues from
"331" must be removed. "331" is classified as ORH1
per J-STD-004.
“331” Water-Soluble Core 1 lb.
Part #
Alloy
Diameter
Core Size
24-6337-0007
Sn63Pb37
.015
66
24-6337-0010
Sn63Pb37
.020
66
24-6337-0018
Sn63Pb37
.025
66
24-6337-0027
Sn63Pb37
.031
66
24-6337-0039
Sn63Pb37
.040
66
Part #
Alloy
Diameter
Core Size
24-6337-0053
Sn63Pb37
.050
66
24-6337-6422
Sn63Pb37
.015
66
24-6337-0061
Sn63Pb37
.062
66
24-6337-6401
Sn63Pb37
.020
66
24-6040-0010
Sn60Pb40
.020
66
24-6337-6417
Sn63Pb37
.025
66
24-6337-6403
Sn63Pb37
.031
66
24-6040-0018
Sn60Pb40
.025
66
24-6337-6411
Sn63Pb37
.062
66
24-6040-0027
Sn60Pb40
.031
66
24-6040-0039
Sn60Pb40
.040
66
24-6040-0053
Sn60Pb40
.050
66
24-6040-0061
Sn60Pb40
.062
66
24-6040-0066
Sn60Pb40
.093
66
"285" RMA
"285" is an RMA based core flux that provides wetting
action comparable to that of typical RA fluxes. Although
"285" is an RMA-based material, the residues are noncorrosive if not cleaned. "285" is categorized as ROL0
per J-STD-004.
Kester Solid Wire
Solid Wire 1 lb.
Kester's solid wire solder, without flux core, is manufactured using virgin metals and strict quality control standards. Conforming to IPC/J-STD-006A and ASTM B32.
“285” RMA Core 1 lb.
Solid Wire 5 lbs.
Part #
Alloy
Diameter
14-6337-0015
Sn63Pb37
.015
14-6337-0031
Sn63Pb37
.031
14-6337-0062
Sn63Pb37
.062
Part #
Alloy
Diameter
Core Size
Part #
Alloy
Diameter
24-6337-9703
Sn63Pb37
.015
66
16-6337-0062
Sn63Pb37
.062
14-6337-0125
Sn63Pb37
.125
24-6337-9702
Sn63Pb37
.020
66
16-6337-0125
Sn63Pb37
.125
14-6040-0031
Sn60Pb40
.031
24-6337-9718
Sn63Pb37
.025
66
16-6040-0031
Sn63Pb37
.031
24-6337-9710
Sn63Pb37
.031
66
16-6040-0050
Sn63Pb37
.050
14-6040-0062
Sn60Pb40
.062
24-6337-9713
Sn63Pb37
.031
58
16-6040-0125
Sn63Pb37
.125
14-6040-0125
Sn60Pb40
.125
Page 11
No-Clean Fluxes
No-Clean Fluxes
Alcohol Based
VOC-Free
Formula
959
951
958
979
977
971M
Flux Type
Low Solids
No-Clean
Rosin-Free
Low Solids, No-Clean
Low Solids
No-Clean
VOC-Free
No-Clean
VOC-Free
No-Clean
VOC-Free
No-Clean
Percent Solids
3.9
2.0
2.7
4.5
3.25
2.8
VOCs (g/liter)
776
792
735
0
0
0
Specific Gravity
0.800
0.813
0.806
1.016
1.012
1.007
Developed to reduce bottomside
Designed for foam
Developed to reduce bottomside
Very low solids, rosin Designed for wave sol- micro-solder balling and bridging
applications. VOC-Free, no
micro-solder
balling
and
bridging.
The
on glossy laminates and between
free, foam and spray
clean flux that is water
dering applications,
wetting system is designed to allow
connector pins. Designed as a
application flux.
based, water soluble, halide
gives excellent
for
a
larger
process
window
and
can
spray flux, 979's activation
Practically no residue soldering performance
free, non-flammable and
survive the longer dwell times in
system provides excellent
after the soldering
eliminates the need for a
on bare copper PCBs.
extremely
turbulent
chip
waves.
wetting producing complete
process.
flux thinner.
Designed for spray applications.
and consistent hole-fill.
Product
Characteristics
Designed for the wave soldering of conventional and
surface mount circuit board
assemblies. Developed to
minimize the formation of
micro-solderballs during
wave soldering operations.
Compliant
Specifications
Telcordia Issue 1
GR-78-CORE &
IPC/J-STD-004
Flux designator ORL0
Telcordia Issue 1
GR-78-CORE &
IPC/J-STD-004
Flux designator ORL0
Telcordia Issue 1
GR-78-CORE &
IPC/J-STD-004
Flux designator ORL0
Telcordia Issue 1
GR-78-CORE &
IPC/J-STD-004
Flux designator ORL0
Telcordia Issue 1
GR-78-CORE &
IPC/J-STD-004
Flux designator ORL0
Telcordia Issue 1
GR-78-CORE &
ANSI/J-STD-004
Flux designator ORL0
Residue Removal
(not normally required)
Wash with Kester's
#5768 Bio-Kleen®
saponifier at 2%
concentration.
Wash with Kester's
#5768 Bio-Kleen®
saponifier at 2%
concentration.
Wash with Kester's
#5768 Bio-Kleen®
saponifier at 2%
concentration.
Wash with hot de-ionized water
at 140-160°F or use 1% solution
of Kester's #5768 Bio-Kleen®
saponifier in water.
Wash with hot de-ionized water at
140-160°F or use 1% solution of
Kester's #5768 Bio-Kleen®
saponifier in water.
Wash with hot de-ionized
water at 140-160°F or use
1% solution of Kester's
#5768 Bio-Kleen®
saponifier in water.
Thinner
#4662-SM
110
#4662-SM
De-ionized Water
De-ionized Water
De-ionized Water
Flux Test Kit
PS-20 or PS-22
PS-22
PS-20
PS-20 or PS-22
PS-20 or PS-22
PS-20
Kester Part #
Description
Packaging
63-0000-0951
951 No-Clean
1 gallon
64-0000-0951
951 No-Clean
5 gallon
65-0000-0951
951 No-Clean
53 gallon drum
63-0000-0958
958 No-Clean
1 gallon
64-0000-0958
958 No-Clean
5 gallon
65-0000-0958
958 No-Clean
53 gallon drum
63-0000-0959
959 No-Clean
1 gallon
64-0000-0959
959 No-Clean
5 gallon
65-0000-0959
959 No-Clean
53 gallon drum
63-0004-0971
971M VOC-Free No-Clean
1 gallon
64-0004-0971
971M VOC-Free No-Clean
5 gallon
65-0004-0971
971M VOC-Free No-Clean
53 gallon drum
63-0000-0977
977 VOC-Free No-Clean
1 gallon
64-0000-0977
977 VOC-Free No-Clean
5 gallon
65-0000-0977
977 VOC-Free No-Clean
53 gallon drum
63-0000-0979
979 VOC-Free No-Clean
1 gallon
64-0000-0979
979 VOC-Free No-Clean
5 gallon
65-0000-0979
979 VOC-Free No-Clean
53 gallon drum
Page 12
Water-Soluble Fluxes
Water-Soluble Fluxes
Formula
2331-ZX
2235
2120
Flux Type
Neutral pH
Organic Water-Soluble
Organic
Water-Soluble
Organic
Water-Soluble
Percent Solids
33
11
24
VOCs (g/liter)
729
763
670
Specific Gravity
0.899 ± 0.005
0.856 ± 0.005
0.862 ± 0.005
Percent Halides
2.2
1.5
Halide-Free
Product
Characteristics
Original pH neutral organic flux for
automated wave and drag soldering
processes.
Very active flux for surface mount
assemblies designed to help reduce
skips on bottom side surface
mount pads.
Highly active, organic flux designed for automated
wave soldering applications. This halide-free
formula produces bright, shiny joints and high
ionic cleanliness after water cleaning
Compliant
Specifications
IPC/J-STD-004
Flux designator ORH1
IPC/J-STD-004
Flux designator ORH1
IPC/J-STD-004
Flux designator ORH0
Residue Removal
Residue removal is required. Use soft
or de-ionized water at temperatures of
120-150°F.
Residue removal is required. Use soft
or de-ionized water at temperatures of
120-150°F.
Residue removal is required. Use soft or
de-ionized water at temperatures of 120-150°F.
Thinner
4662
4662
4662
Kester Part #
Description
Packaging
63-0097-2331
2331-ZX Water-Soluble
1 gallon
64-0097-2331
2331-ZX Water-Soluble
5 gallon
65-0097-2331
2331-ZX Water-Soluble
53 gallon drum
63-0000-2235
2235 Water-Soluble
1 gallon
64-0000-2235
2235 Water-Soluble
5 gallon
65-0000-2235
2235 Water-Soluble
53 gallon drum
63-0000-2120
2120 Water-Soluble
1 gallon
64-0000-2120
2120 Water-Soluble
5 gallon
65-0000-2120
2120 Water-Soluble
53 gallon drum
Page 13
Rosin Fluxes
Rosin Based Fluxes
Formula
186 Series
1544
Flux Type
Rosin Mildly Activated
(RMA)
Activated Rosin
(RA)
Percent Solids
18 to 36
50
Specific Gravity
0.879 ± 0.005 (186)
0.848 ± 0.005 (186-25)
0.831 ± 0.005 (186-18)
0.929 ± 0.005
Percent Halides
0.02
0.44
Product
Characteristics
Designed for high thermal stability and
superior solderability. Kester 186 is
available in 18, 25, or 36 percent
solids formulations.
Kester's active, Non-corrosive rosin type
flux. Used on surfaces that are more
difficult to solder.
Compliant
Specifications
IPC/J-STD-004
Flux designator ROL0
IPC/J-STD-004
Flux designator ROM1
Residue Removal
Thinner
Residue is non-corrosive, but may be
Residue is non-corrosive, but may be removed
removed with solvent or with Kester’s
with solvent or with Kester’s 5768 Bio-Kleen®
®
5768 Bio-Kleen saponifier at 7-10%
saponifier at 7-10% solution in de-ionized or
solution in de-ionized or soft water at
soft water at temperatures of 120-140°F.
temperatures of 120-140°F.
120
Kester Flux-Pen®
The Kester Flux-Pen® is a unique tool for rework and touch-up soldering. It allows
controlled application of flux, eliminating the mess from flux bottles. Flux-Pens
are ideally suited for typical hand-soldering applications. The five available
formulas are listed below.
Kester Part #
Description
83-1020-0959
959T Low Solids No-Clean (20 pens/carton)
83-1000-0951
951 Low Solids No-Clean (20 pens/carton)
83-1018-0186
186-18 RMA No-Clean (20 pens/carton)
83-1000-0186
186 RMA No-Clean (20 pens/carton)
83-1097-2331
2331-ZX Neutral pH Water-Soluble (20pens/carton)
53-0000-0225
Flux-Pen® Replacement Tips (25 tips/bag)
104
Kester Part #
Description
Packaging
63-0000-0186
186 RMA
1 gallon
64-0000-0186
186 RMA
5 gallon
65-0000-0186
186 RMA
53 gallon drum
63-0018-0186
186-18 RMA
1 gallon
64-0018-0186
186-18 RMA
5 gallon
65-0018-0186
186-18 RMA
53 gallon drum
63-0025-0186
186-25 RMA
1 gallon
64-0025-0186
186-25 RMA
5 gallon
65-0025-0186
186-25 RMA
53 gallon drum
63-0000-1544
1544 RA
1 gallon
64-0000-1544
1544 RA
5 gallon
65-0000-1544
1544 RA
53 gallon drum
Page 14
Additional Flux Materials
Kester Saponifier
5768 Bio-Kleen® is a highly concentrated liquid cleaner used for the
safe removal of rosin flux residues. The chemicals in the cleaner
react with the rosin residues to form soaps that can then be rinsed
away with water. 5768 Bio-Kleen® is designed for difficult to
remove solder paste residues and is non reactive with most metals
present on electronic assemblies.
Kester Rework Fluxes
Kester's two rework formulas are specifically formulated for PCB
rework operations. Kester's No-Clean RF-741 and Water Soluble RF-771
rework fluxes are all that's needed to handle any surface mount or
through-hole rework applications. Available only in 30 gram syringe
packaging.
63-0000-5768
5768 Bio-Kleen
1 gallon
64-0000-5768
5768 Bio-Kleen
5 gallon
65-0000-5768
5768 Bio-Kleen
53 gallon drum
®
®
Kester Part #
Description
Packaging
57-0000-5025
RF-741 No-Clean
30g syringe
55-0000-0225
RF-771 Water-Soluble
30g syringe
Description
Packaging
104 Flux Thinner
1 gallon
64-0000-0104
104 Flux Thinner
5 gallon
65-0000-0104
104 Flux Thinner
53 gallon drum
63-0000-0110
110 Flux Thinner
1 gallon
64-0000-0110
110 Flux Thinner
5 gallon
65-0000-0110
110 Flux Thinner
53 gallon drum
63-0000-0120
120 Flux Thinner
1 gallon
64-0000-0120
120 Flux Thinner
5 gallon
65-0000-0120
120 Flux Thinner
53 gallon drum
63-0024-4662
4662-SM Flux Thinner
1 gallon
64-0024-4662
4662-SM Flux Thinner
5 gallon
959 No-Clean Flux
958 No-Clean Flux
65-0024-4662
4662-SM Flux Thinner
53 gallon drum
2331-ZX Organic Water-Soluble Flux
2235 Organic Water-Soluble Flux
2120 Organic Water-Soluble Flux
63-0000-4662
4662 Flux Thinner
1 gallon
64-0000-4662
4662 Flux Thinner
5 gallon
65-0000-4662
4662 Flux Thinner
53 gallon drum
Use with Soldering Flux
104
1544 Activated Rosin Flux
110
951 No-Clean Flux
120
186 Series Rosin Mildly Activated Flux
4662
Packaging
®
Kester Part #
Selecting the correct thinner for reducing solids or replacing evaporated
solvent will result in maximum efficiency of the flux. To select a thinner,
find the flux you are using from the chart below:
4662-SM
Description
63-0000-0104
Kester Flux Thinners
Thinner
Kester Part #
Kester Flux Test Kits
Control of the flux concentration in the flux becomes more critical when
using a low solids flux. The accuracy problems encountered with automatic
specific gravity controllers in conjunction with low-solids "no-clean" fluxes
make the flux kit a better alternative for process control. Good control is
necessary to assure a consistent amount of flux is applied to the circuit
boards, consistent soldering results are obtained, and the least amount of
flux residue remains after soldering. Kester PS-20 and PS-22 flux kits
provide a simple method for process control.
Flux Test Kit
Use With Soldering Flux
PS-20
959 No-Clean Flux
959T No-Clean Flux
958 No-Clean Flux
979 VOC-Free No-Clean Flux
977 VOC-Free No-Clean Flux
971M VOC-Free No-Clean Flux
PS-22
951No-Clean Flux
959 No-Clean Flux
979 VOC-Free No-Clean Flux
977 VOC-Free No-Clean Flux
Kester Part #
Description
53-0000-0200
PS-20 Flux Test Kit
53-0000-0220
PS-22 Flux Test Kit
Page 15
Tacky Soldering Fluxes
Kester Tacky Soldering Fluxes
Kester's TSFs are the industry standard for attachment of spheres to BGA and μBGA packages. The TSFs are also used in electronics assembly operations to solder flip chip components to PWB substrates. Kester's TSF portfolio includes a complete line of no clean and water-soluble products capable
of being screen and stencil printed, dot dispensed, or thin film transfer processed.
TSF-6592LV Lead-Free No-Clean
(For Screen Printing/Stencil Printing/Pin Transfer)
TSF-6852 Lead-Free Water Soluble
(For Screen or Stencil Printing)
TSF-6592LV is compatible with lead and lead-free solder alloys such as SnAg,
SnCu, SnAgCu, SnAgBi, and can be reflowed in nitrogen or air with peak
temperatures up to 270ºC. The residues are clear, non-conductive, and
non-corrosive.
TSF-6850 is an aggressive synthetic flux with residues that are easily and
completely cleaned with water temperatures ranging from 20-65ºC yielding
bright, shiny joints. TSF-6852 is a drop-in solution for solder alloys that will
have a liquidus up to 300ºC. TSF-6852 also has a 6 month shelf life when
stored between 0-25ºC (refrigerated or room temperature).
Kester Part #
Description
Packaging
Kester Part #
Description
Packaging
55-0000-1225
TSF-6592LV No-Clean
30g syringe
55-0000-1325
TSF-6852 Water-Soluble
30g syringe
55-0000-1237
TSF-6592LV No-Clean
100g jar
55-0000-1337
TSF-6852 Water-Soluble
100g jar
55-0000-1241
TSF-6592LV No-Clean
150g cartridge
55-0000-1341
TSF-6852 Water-Soluble
150g cartridge
TSF-6502 No-Clean
(Lower Viscosity for Screen
Printing/Thin Film Deposition)
TSF-6502 is a no-clean tacky soldering flux formula designed for
BGA/CSP/PGA screen printing, sphere/pin processing or for repair and
reballing/repinning. It possesses a high activity level, allowing it to solder
nickel surfaces. The robust wetting action of the TSF-6502 will allow OSP
treated copper, as well as heavily oxidized copper, surfaces to exhibit good
soldering properties, even after 2 or 3 thermal cycles. TSF-6502 is designed
for a wide range of temperature and humid conditions.
Kester Part #
Description
Packaging
57-0000-1225
TSF-6502 No-Clean
30g syringe
57-0000-1237
TSF-6502 No-Clean
100g jar
57-0000-1241
TSF-6502 No-Clean
150g cartridge
Page 16
Solder Masks and Solderforms®
Kester Solder Masks
TC-530 Peelable De-Ammoniated Solder Mask
TC-564-1 Water Soluble Temporary Solder Mask
This high-temperature flexible solder masking compound can be applied to
areas of printed circuit boards, which require masking during wave soldering
processes. It can also be used on bare copper without causing oxidation.
TC-530 is popular because of its low odor characteristics and can be used as a
mold seal and conformal coat mask.
Kester's best selling temporary solder mask specially designed to effectively
protect printed circuit boards that require masking during wave soldering
operations. TC-564-1 can be used with any type of flux: rosin, organic or inorganic and can also be washed away in any appropriate cleaning equipment.
TC-533 Peelable Solder Mask
This is a high-temperature flexible solder masking compound specially formulated of natural latex rubber. It is extremely versatile as it can be used as a
temporary solder mask, conformal coating maskant, and a potting compound
mold seal.
TC-527 Hi-Temp Flexible Solder Mask
TC-527 is a high-temperature flexible solder masking compound formulated of
natural latex rubber to protect delicate components. The latex is heat stable
and tacky enough to be applied to those areas of circuit boards that require
masking during a wave soldering process. Can be applied by automatic dip,
brush or flow methods, direct from applicator bottle or by automated dispensing machines. It can easily be peeled away without leaving a residue.
Solderform®
Ribbons
Cut-Offs
Washers
Discs
Pellets
Minimum (mm)
Maximum (mm)
Width
0.50 ± 0.13
76.20 ± 0.75
Thickness
0.0762 ± 0.03
3.18 ± 0.13
Width
0.50 ± 0.13
76.20 ± 0.75
Thickness
0.0762 ± 0.03
3.18 ± 0.13
Length
0.762 ± 0.25
500 ± 1.25
Outside Diameter
0.889 ± 0.05
63.5 ± 0.13
Inside Diameter
0.38 ± 0.05
58.42 ± 0.13
Thickness
0.0762 ± 0.03
6.35 ± 0.25
Outside Diameter
0.41 ± 0.05
65 ± 0.05
Thickness
0.0762 ± 0.03
6.35 ± 0.25
Diameter
0.254 ± 0.03
12.7 ± 0.13
Length
0.50 ± 0.13
152.4 ± 0.76
Description
Stampings
Kester Part #
Description
Packaging
53-4000-0530
TC-530
½ pint
53-4001-0530
TC-530
1 pint
53-4003-0530
TC-530
1 gallon
53-4000-0533
TC-533
½ pint
53-4001-0533
TC-533
1 pint
53-4003-0533
TC-533
1 gallon
53-4001-0564
TC-564-1
1 pint
53-4003-0564
TC-564-1
1 gallon
53-4000-0527
TC-527
½ pint
53-4001-0527
TC-527
1 pint
53-4003-0527
TC-527
1 gallon
Stampings use special dies that are customer specific
and require a customer’s engineering drawing and
specification.
Kester Solderforms®
Kester Solderforms® are stamped, extruded, compacted or
formed pieces of pure soft solder alloys manufactured
with strict known tolerances to customer specifications.
Kester also creates other preforms such as collars, ribbon
forms, rings, and wireforms.
Solderforms® may be produced as flux cored, solid metal,
and with or without a flux coating.
Fluxes available are no-clean, water soluble, RMA, and
RA chemistries. External dyes are also available for
identification or to aid in determining the solder melt
point.
Page 17
Technical Data
Table 1
Metal Solderability Chart
Category
If trying to solder to this
metal surface:
Solder Paste and
Tacky Soldering Fluxes
Liquid Fluxes and
Flux-Pen® Formulas
Cored Wire
1
Platinum, Gold, Copper, Tin,
Solder, Silver
All products can solder these
metal surfaces.
All products can solder these
metal surfaces.
All products can solder these
metal surfaces.
2
Nickel, Cadmium, Brass,
Lead, Bronze, Rhodium,
Beryllium Copper, Palladium,
Immersion Tin, Immersion Silver
EniviroMark™ 907, EnviroMark™ 808
Easy Profile® 256 & 256HA
HydroMark 531, TSF 6592,
TSF 6800 Series
186, 1544, 2120,
2331-ZX, 2235, 2224-25,
2222, 2220-VF
3
Nickel-Iron, Kovar
Base metal must be plated.
2222, 2220-VF
48, 331, OR-421
4
Zinc, Mild Steel, Chromium,
Inconel, Monel, Stainless Steel
Base metal must be plated.
Call Kester's Customer Service
Department
48
44, 48, 331, OR-421
EXAMPLE 1: When soldering Beryllium Copper to Tin, you could use any of the products listed in Category 2, 3, or 4 since Beryllium Copper
requires more active products than Tin.
EXAMPLE 2: If you were soldering Solder coated leads to a Copper surface, you could use any of Kester's products (Category 1, 2, 3, or 4).
Stage 1- Preheat Zone
(Rapid Heating Stage)
The purpose of this zone is to quickly bring the
assembly up to a temperature where solder paste
can become highly chemically active.
STANDARD SOLDER PASTE REFLOW PROFILE
FOR KESTER PASTE CONTAINING
ALLOYS: Sn96.5Ag3.0Cu0.5 or Sn96.5Ag3.5
Stage 2- Soak Zone
(Temperature Equalization Stage)
The purpose of this stage is for the thermal mass of
the assembly to reach a uniform temperature
plateau so that there is a very small differential
between the hottest and coldest soldering locations
on the assembly.
Stage 3- Reflow Zone
(Rapid Heating and Cooling)
The purpose of this stage is to rapidly heat the
assembly above the melting (liquidus) temperature
of the solder and subsequently cool the assembly
down quickly to solidify the solder. Wetting of solder
onto substrates occurs in the reflow zone.
WEIGHTS AND MEASURES
COMMON CONVERSIONS
To Change
To
Multiply By:
3.7853
Gallons (US)
Liters
Quarts (liquid)
Liters
0.9463
Pounds (avdp.)
Grams
453.592
Pounds (avdp.)
Kilograms
0.4536
Pounds (avdp.)
Ounce (troy)
14.5833
Ounces (avdp.)
Grams
28.3495
Celsius = 5/9 (F-32)
FORMULA FOR ADDING TIN TO
TIN-LEAD SOLDER POTS
Tin can be added to solder to replace tin lost by oxidation. The pot temperature should be
at least 460°F. Tin bars should be added slowly and the solder should be mixed well.
T = W(A - B)
(100 - A)
EXAMPLE
900 (63 - 61.6) = 1260 = 34 lbs. of
(100 - 63)
37
Tin to add
T = Pounds of Tin to add
A = Percentage of Tin desired
W = Pounds of solder on pot
B = Percentage of Tin in pot
Fahrenheit = 9/5 (C) + 32
Please visit www.kester.com and click on Lead-Free Solutions™
for a worksheet to balance Lead-Free alloy systems.
GLOBAL
HEADQUARTERS
HEADQUARTERS
EUROPEAN
HEADQUARTERS
HEADQUARTERS
ASIA-PACIFIC
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HEADQUARTERS
HEADQUARTERS
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08541 Neuensalz
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Singapore 4690224
Phone: (+1) 847-297-1600
Fax: (+1) 847-390-9338
Email: [email protected]
Customer Service
Phone: 800-2-KESTER
Fax: (+1) 847-699-5548
Phone: (+49) 3741 4233-0
Fax: (+49) 3741 4233-111
Email: [email protected]
Phone: (+65) 6 449-1133
Fax: (+65) 6 242-9036
Email: [email protected]
China
Penang, Malaysia
Japan
Block B, #03-03/08
No. 5 Xing Han Street
Suzhou Industrial Park
Suzhou 215021
China
Hotel Equatorial Penang, Unit 2
Lower Level 3, No. 1
Jalan Bukit Jambul 11900
Penang, Malaysia
20-11 YokoKawa 2-Chome,
Sumida-ku
Tokyo 130, Japan
For customer service call the
Asia-Pacific Headquarters facility
Tel: (+60) 4-641-4633
Fax: (+60) 4-641-4634
Tel: (+81) 3-3624-5351
Fax (+81) 3-3626-6253
Email: [email protected]
Email: [email protected]
Mexico
Bromont, Canada
JOHOR BAHRU, MALAYSIA
Carretera Internacional Km. 6.5
Esquina Boulevard del Castillo
Parque Industrial
Nogales, Son. 84000
Mexico
Technologie Estrie Inc.
30, boul. de l’Aéroport
Bromont (Québec)
Canada J2L 1S6
PLO 113, Fasa 3
Kawasan Perindustria Senai
81400 Senai, Johor, Malaysia
For customer service call the
Global Headquarters facility
For customer service call the
Global Headquarters facility
Tel: (+60) 7-598-4113
Fax: (+60) 7-598-3103
Taiwan
4th Floor, No. 128
Lane 235
Pao-Chiao Road
Hsien-Tien City
Taipei Hsien, Taiwan
Tel: (+886) 2-8912-1066
Fax: (+886) 2-8912-1072
Kester Vision Statement
Smart Products.
Great Service.
No Boundaries.
Kester will be the leading global supplier of high performance interconnecting materials
and related services for the electronic assembly and component assembly markets.
To achieve this we will focus on customer-driven innovation and exceptional service worldwide.
Email: [email protected]
Revised 1.17.08
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