M45PE40

M45PE40
M45PE40
4 Mbit, Low Voltage, Page-Erasable Serial Flash Memory
With Byte-Alterability and a 25 MHz SPI Bus Interface
FEATURES SUMMARY
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4Mbit of Page-Erasable Flash Memory
Page Write (up to 256 Bytes) in 11ms (typical)
Page Program (up to 256 Bytes) in 1.2ms
(typical)
Page Erase (256 Bytes) in 10ms (typical)
Sector Erase (512 Kbit)
2.7 to 3.6V Single Supply Voltage
SPI Bus Compatible Serial Interface
25MHz Clock Rate (maximum)
Deep Power-down Mode 1µA (typical)
Electronic Signature
– JEDEC Standard Two-Byte Signature
(4013h)
More than 100000 Write Cycles
More than 20 Year Data Retention
Figure 1. Packages
VDFPN8 (MP)
6x5mm (MLP8)
8
1
SO8W (MW)
208 mils width
January 2005
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M45PE40
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1.
Figure 2.
Table 1.
Figure 3.
Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
VDFPN and SO Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Data Output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Reset (Reset). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SPI MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Bus Master and Memory Devices on the SPI Bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. SPI Modes Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
OPERATING FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Sharing the Overhead of Modifying Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
An Easy Way to Modify Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
A Fast Way to Modify Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Polling During a Write, Program or Erase Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Active Power, Standby Power and Deep Power-Down Modes . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 2. Status Register Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 3. Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 4. Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Write Enable (WREN) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 8. Write Disable (WRDI) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Read Identification (RDID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 5. Read Identification (RDID) Data-Out Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
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M45PE40
Figure 9. Read Identification (RDID) Instruction Sequence and Data-Out Sequence . . . . . . . . . . 14
Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10.Read Status Register (RDSR) Instruction Sequence and Data-Out Sequence . . . . . . . 15
Read Data Bytes (READ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 11.Read Data Bytes (READ) Instruction Sequence and Data-Out Sequence . . . . . . . . . . . 16
Read Data Bytes at Higher Speed (FAST_READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 12.Read Data Bytes at Higher Speed (FAST_READ) Instruction Sequence
and Data-Out Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Page Write (PW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 13.Page Write (PW) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Page Program (PP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 14.Page Program (PP) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Page Erase (PE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 15.Page Erase (PE) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Sector Erase (SE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 16.Sector Erase (SE) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Deep Power-down (DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 17.Deep Power-down (DP) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Release from Deep Power-down (RDP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 18.Release from Deep Power-down (RDP) Instruction Sequence. . . . . . . . . . . . . . . . . . . . 23
POWER-UP AND POWER-DOWN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 19.Power-up Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 6. Power-Up Timing and VWI Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 7. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 8. Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 9. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 20.AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 10. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 11. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 12. AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 21.Serial Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 22.Write Protect Setup and Hold Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 23.Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 24.Reset AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 25.MLP8, 8-lead Very thin Dual Flat Package No lead, 6x5mm, Package Outline . . . . . . . 32
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M45PE40
Table 13. MLP8, 8-lead Very thin Dual Flat Package No lead, 6x5mm,
Package Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 26.SO8 wide – 8 lead Plastic Small Outline, 208 mils body width, Package Outline . . . . . . 33
Table 14. SO8 wide – 8 lead Plastic Small Outline, 208 mils body width, Mechanical Data . . . . . . 33
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 15. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 16. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
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M45PE40
SUMMARY DESCRIPTION
Table 1. Signal Names
The M45PE40 is a 4Mbit (512K x 8 bit) Serial
Paged Flash Memory accessed by a high speed
SPI-compatible bus.
The memory can be written or programmed 1 to
256 bytes at a time, using the Page Write or Page
Program instruction. The Page Write instruction
consists of an integrated Page Erase cycle followed by a Page Program cycle.
The memory is organized as 8 sectors, each containing 256 pages. Each page is 256 bytes wide.
Thus, the whole memory can be viewed as consisting of 2048 pages, or 524288 bytes.
The memory can be erased a page at a time, using
the Page Erase instruction, or a sector at a time,
using the Sector Erase instruction.
C
Serial Clock
D
Serial Data Input
Q
Serial Data Output
S
Chip Select
W
Write Protect
Reset
Reset
VCC
Supply Voltage
VSS
Ground
Figure 3. VDFPN and SO Connections
Figure 2. Logic Diagram
VCC
D
M45PE40
D
C
Reset
S
Q
C
S
M45PE40
1
2
3
4
8
7
6
5
Q
VSS
VCC
W
AI04041D
W
Reset
VSS
AI04040C
Note: 1. There is an exposed die paddle on the underside of the
MLP8 package. This is pulled, internally, to VSS, and
must not be allowed to be connected to any other voltage
or signal line on the PCB.
2. See PACKAGE MECHANICAL section for package dimensions, and how to identify pin-1.
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M45PE40
SIGNAL DESCRIPTION
Serial Data Output (Q). This output signal is
used to transfer data serially out of the device.
Data is shifted out on the falling edge of Serial
Clock (C).
Select (S) Low selects the device, placing it in the
Active Power mode.
After Power-up, a falling edge on Chip Select (S)
is required prior to the start of any instruction.
Serial Data Input (D). This input signal is used to
transfer data serially into the device. It receives instructions, addresses, and the data to be programmed. Values are latched on the rising edge of
Serial Clock (C).
Reset (Reset). The Reset (Reset) input provides
a hardware reset for the memory. In this mode, the
outputs are high impedance.
When Reset (Reset) is driven High, the memory is
in the normal operating mode. When Reset (Reset) is driven Low, the memory will enter the Reset
mode, provided that no internal operation is currently in progress. Driving Reset (Reset) Low while
an internal operation is in progress has no effect
on that internal operation (a write cycle, program
cycle, or erase cycle).
Serial Clock (C). This input signal provides the
timing of the serial interface. Instructions, addresses, or data present at Serial Data Input (D) are
latched on the rising edge of Serial Clock (C). Data
on Serial Data Output (Q) changes after the falling
edge of Serial Clock (C).
Chip Select (S). When this input signal is High,
the device is deselected and Serial Data Output
(Q) is at high impedance. Unless an internal Read,
Program, Erase or Write cycle is in progress, the
device will be in the Standby Power mode (this is
not the Deep Power-down mode). Driving Chip
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Write Protect (W). This input signal puts the device in the Hardware Protected mode, when Write
Protect (W) is connected to VSS, causing the first
256 pages of memory to become read-only by protecting them from write, program and erase operations. When Write Protect (W) is connected to
VCC, the first 256 pages of memory behave like
the other pages of memory.
M45PE40
SPI MODES
These devices can be driven by a microcontroller
with its SPI peripheral running in either of the two
following modes:
– CPOL=0, CPHA=0
– CPOL=1, CPHA=1
For these two modes, input data is latched in on
the rising edge of Serial Clock (C), and output data
is available from the falling edge of Serial Clock
(C).
The difference between the two modes, as shown
in Figure 5., is the clock polarity when the bus
master is in Stand-by mode and not transferring
data:
– C remains at 0 for (CPOL=0, CPHA=0)
– C remains at 1 for (CPOL=1, CPHA=1)
Figure 4. Bus Master and Memory Devices on the SPI Bus
SDO
SPI Interface with
(CPOL, CPHA) =
(0, 0) or (1, 1)
SDI
SCK
C Q D
C Q D
C Q D
SPI Memory
Device
SPI Memory
Device
SPI Memory
Device
Bus Master
(ST6, ST7, ST9,
ST10, Others)
CS3
CS2
CS1
S
W
RP
S
W
RP
S
W
RP
AI04043B
Note: The Write Protect (W) signal should be driven, High or Low as appropriate.
Figure 5. SPI Modes Supported
CPOL
CPHA
0
0
C
1
1
C
D
Q
MSB
MSB
AI01438B
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M45PE40
OPERATING FEATURES
Sharing the Overhead of Modifying Data
To write or program one (or more) data bytes, two
instructions are required: Write Enable (WREN),
which is one byte, and a Page Write (PW) or Page
Program (PP) sequence, which consists of four
bytes plus data. This is followed by the internal cycle (of duration tPW or tPP).
To share this overhead, the Page Write (PW) or
Page Program (PP) instruction allows up to 256
bytes to be programmed (changing bits from 1 to
0) or written (changing bits to 0 or 1) at a time, provided that they lie in consecutive addresses on the
same page of memory.
An Easy Way to Modify Data
The Page Write (PW) instruction provides a convenient way of modifying data (up to 256 contiguous bytes at a time), and simply requires the start
address, and the new data in the instruction sequence.
The Page Write (PW) instruction is entered by
driving Chip Select (S) Low, and then transmitting
the instruction byte, three address bytes (A23-A0)
and at least one data byte, and then driving Chip
Select (S) High. While Chip Select (S) is being
held Low, the data bytes are written to the data
buffer, starting at the address given in the third address byte (A7-A0). When Chip Select (S) is driven
High, the Write cycle starts. The remaining, unchanged, bytes of the data buffer are automatically
loaded with the values of the corresponding bytes
of the addressed memory page. The addressed
memory page then automatically put into an Erase
cycle. Finally, the addressed memory page is programmed with the contents of the data buffer.
All of this buffer management is handled internally,
and is transparent to the user. The user is given
the facility of being able to alter the contents of the
memory on a byte-by-byte basis.
A Fast Way to Modify Data
The Page Program (PP) instruction provides a fast
way of modifying data (up to 256 contiguous bytes
at a time), provided that it only involves resetting
bits to 0 that had previously been set to 1.
This might be:
– when the designer is programming the device
for the first time
– when the designer knows that the page has
already been erased by an earlier Page Erase
(PE) or Sector Erase (SE) instruction. This is
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–
useful, for example, when storing a fast
stream of data, having first performed the
erase cycle when time was available
when the designer knows that the only
changes involve resetting bits to 0 that are still
set to 1. When this method is possible, it has
the additional advantage of minimising the
number of unnecessary erase operations, and
the extra stress incurred by each page.
Polling During a Write, Program or Erase Cycle
A further improvement in the write, program or
erase time can be achieved by not waiting for the
worst case delay (tPW, tPP, tPE, or tSE). The Write
In Progress (WIP) bit is provided in the Status
Register so that the application program can monitor its value, polling it to establish when the previous cycle is complete.
Reset
An internal Power On Reset circuit helps protect
against inadvertent data writes. Addition protection is provided by driving Reset (Reset) Low during the Power-on process, and only driving it High
when VCC has reached the correct voltage level,
VCC(min).
Active Power, Standby Power and Deep
Power-Down Modes
When Chip Select (S) is Low, the device is selected, and in the Active Power mode.
When Chip Select (S) is High, the device is deselected, but could remain in the Active Power mode
until all internal cycles have completed (Program,
Erase, Write). The device then goes in to the
Standby Power mode. The device consumption
drops to ICC1.
The Deep Power-down mode is entered when the
specific instruction (the Deep Power-down (DP) instruction) is executed. The device consumption
drops further to ICC2. The device remains in this
mode until another specific instruction (the Release from Deep Power-down and Read Electronic Signature (RES) instruction) is executed.
All other instructions are ignored while the device
is in the Deep Power-down mode. This can be
used as an extra software protection mechanism,
when the device is not in active use, to protect the
device from inadvertent Write, Program or Erase
instructions.
M45PE40
Status Register
The Status Register contains two status bits that
can be read by the Read Status Register (RDSR)
instruction.
■
WIP bit. The Write In Progress (WIP) bit indicates
whether the memory is busy with a Write, Program
or Erase cycle.
WEL bit. The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
Table 2. Status Register Format
b7
0
b0
0
0
0
0
0
WEL
WIP
Note: WEL and WIP are volatile read-only bits (WEL is set and reset by specific instructions; WIP is automatically set and reset by the internal logic of the device).
■
Protection Modes
The environments where non-volatile memory devices are used can be very noisy. No SPI device
can operate correctly in the presence of excessive
noise. To help combat this, the M45PE40 features
the following data protection mechanisms:
■
Power On Reset and an internal timer (tPUW)
can provide protection against inadvertant
changes while the power supply is outside the
operating specification.
■
Program, Erase and Write instructions are
checked that they consist of a number of clock
■
■
pulses that is a multiple of eight, before they
are accepted for execution.
All instructions that modify data must be
preceded by a Write Enable (WREN)
instruction to set the Write Enable Latch
(WEL) bit. This bit is returned to its reset state
by the following events:
– Power-up
– Reset (RESET) driven Low
– Write Disable (WRDI) instruction
completion
– Page Write (PW) instruction completion
– Page Program (PP) instruction completion
– Page Erase (PE) instruction completion
– Sector Erase (SE) instruction completion
The Hardware Protected mode is entered
when Write Protect (W) is driven Low, causing
the first 256 pages of memory to become
read-only. When Write Protect (W) is driven
High, the first 256 pages of memory behave
like the other pages of memory
The Reset (Reset) signal can be driven Low to
protect the contents of the memory during any
critical time, not just during Power-up and
Power-down.
In addition to the low power consumption
feature, the Deep Power-down mode offers
extra software protection from inadvertant
Write, Program and Erase instructions while
the device is not in active use.
9/36
M45PE40
MEMORY ORGANIZATION
The memory is organized as:
■
2048 pages (256 bytes each).
■
524288 bytes (8 bits each)
■
8 sectors (512 Kbits, 65536 bytes each)
Each page can be individually:
– programmed (bits are programmed from 1 to
0)
– erased (bits are erased from 0 to 1)
– written (bits are changed to either 0 or 1)
The device is Page or Sector Erasable (bits are
erased from 0 to 1).
10/36
Table 3. Memory Organization
Sector
Address Range
7
70000h
7FFFFh
6
60000h
6FFFFh
5
50000h
5FFFFh
4
40000h
4FFFFh
3
30000h
3FFFFh
2
20000h
2FFFFh
1
10000h
1FFFFh
0
00000h
0FFFFh
M45PE40
Figure 6. Block Diagram
Reset
W
High Voltage
Generator
Control Logic
S
C
D
I/O Shift Register
Q
Address Register
and Counter
Status
Register
256 Byte
Data Buffer
Y Decoder
7FFFFh
10000h
First 256 Pages can
be made read-only
00000h
000FFh
256 Bytes (Page Size)
X Decoder
AI04042B
11/36
M45PE40
INSTRUCTIONS
All instructions, addresses and data are shifted in
and out of the device, most significant bit first.
Serial Data Input (D) is sampled on the first rising
edge of Serial Clock (C) after Chip Select (S) is
driven Low. Then, the one-byte instruction code
must be shifted in to the device, most significant bit
first, on Serial Data Input (D), each bit being
latched on the rising edges of Serial Clock (C).
The instruction set is listed in Table 4..
Every instruction sequence starts with a one-byte
instruction code. Depending on the instruction,
this might be followed by address bytes, or by data
bytes, or by both or none.
In the case of a Read Data Bytes (READ), Read
Data Bytes at Higher Speed (Fast_Read) or Read
Status Register (RDSR) instruction, the shifted-in
instruction sequence is followed by a data-out se-
quence. Chip Select (S) can be driven High after
any bit of the data-out sequence is being shifted
out.
In the case of a Page Write (PW), Page Program
(PP), Page Erase (PE), Sector Erase (SE), Write
Enable (WREN), Write Disable (WRDI), Deep
Power-down (DP) or Release from Deep Powerdown (RDP) instruction, Chip Select (S) must be
driven High exactly at a byte boundary, otherwise
the instruction is rejected, and is not executed.
That is, Chip Select (S) must driven High when the
number of clock pulses after Chip Select (S) being
driven Low is an exact multiple of eight.
All attempts to access the memory array during a
Write cycle, Program cycle or Erase cycle are ignored, and the internal Write cycle, Program cycle
or Erase cycle continues unaffected.
Table 4. Instruction Set
Instruction
Description
One-byte Instruction Code
Address
Bytes
Dummy
Bytes
Data
Bytes
WREN
Write Enable
0000 0110
06h
0
0
0
WRDI
Write Disable
0000 0100
04h
0
0
0
RDID
Read Identification
1001 1111
9Fh
0
0
1 to 3
RDSR
Read Status Register
0000 0101
05h
0
0
1 to ∞
READ
Read Data Bytes
0000 0011
03h
3
0
1 to ∞
0000 1011
0Bh
3
1
1 to ∞
FAST_READ Read Data Bytes at Higher Speed
PW
Page Write
0000 1010
0Ah
3
0
1 to 256
PP
Page Program
0000 0010
02h
3
0
1 to 256
PE
Page Erase
1101 1011
DBh
3
0
0
SE
Sector Erase
1101 1000
D8h
3
0
0
DP
Deep Power-down
1011 1001
B9h
0
0
0
Release from Deep Power-down
1010 1011
ABh
0
0
0
RDP
12/36
M45PE40
Write Enable (WREN)
Page Erase (PE), and Sector Erase (SE) instruction.
The Write Enable (WREN) instruction is entered
by driving Chip Select (S) Low, sending the instruction code, and then driving Chip Select (S)
High.
The Write Enable (WREN) instruction (Figure 7.)
sets the Write Enable Latch (WEL) bit.
The Write Enable Latch (WEL) bit must be set prior to every Page Write (PW), Page Program (PP),
Figure 7. Write Enable (WREN) Instruction Sequence
S
0
1
2
3
4
5
6
7
C
Instruction
D
High Impedance
Q
AI02281E
Write Disable (WRDI)
–
–
–
–
–
–
The Write Disable (WRDI) instruction (Figure 8.)
resets the Write Enable Latch (WEL) bit.
The Write Disable (WRDI) instruction is entered by
driving Chip Select (S) Low, sending the instruction code, and then driving Chip Select (S) High.
The Write Enable Latch (WEL) bit is reset under
the following conditions:
Power-up
Write Disable (WRDI) instruction completion
Page Write (PW) instruction completion
Page Program (PP) instruction completion
Page Erase (PE) instruction completion
Sector Erase (SE) instruction completion
Figure 8. Write Disable (WRDI) Instruction Sequence
S
0
1
2
3
4
5
6
7
C
Instruction
D
High Impedance
Q
AI03750D
13/36
M45PE40
The device is first selected by driving Chip Select
(S) Low. Then, the 8-bit instruction code for the instruction is shifted in. This is followed by the 24-bit
device identification, stored in the memory, being
shifted out on Serial Data Output (Q), each bit being shifted out during the falling edge of Serial
Clock (C).
The instruction sequence is shown in Figure 9..
The Read Identification (RDID) instruction is terminated by driving Chip Select (S) High at any time
during data output.
When Chip Select (S) is driven High, the device is
put in the Standby Power mode. Once in the
Standby Power mode, the device waits to be selected, so that it can receive, decode and execute
instructions.
Read Identification (RDID)
The Read Identification (RDID) instruction allows
the 8-bit manufacturer identification to be read, followed by two bytes of device identification. The
manufacturer identification is assigned by JEDEC,
and has the value 20h for STMicroelectronics. The
device identification is assigned by the device
manufacturer, and indicates the memory type in
the first byte (40h), and the memory capacity of the
device in the second byte (13h).
Any Read Identification (RDID) instruction while
an Erase or Program cycle is in progress, is not
decoded, and has no effect on the cycle that is in
progress.
Table 5. Read Identification (RDID) Data-Out Sequence
Device Identification
Manufacturer Identification
20h
Memory Type
Memory Capacity
40h
13h
Figure 9. Read Identification (RDID) Instruction Sequence and Data-Out Sequence
S
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18
28 29 30 31
C
Instruction
D
Manufacturer Identification
Device Identification
High Impedance
Q
15 14 13
MSB
3
2
1
0
MSB
AI06809b
14/36
M45PE40
WIP bit. The Write In Progress (WIP) bit indicates
whether the memory is busy with a Write, Program
or Erase cycle. When set to 1, such a cycle is in
progress, when reset to 0 no such cycle is in
progress.
Read Status Register (RDSR)
The Read Status Register (RDSR) instruction allows the Status Register to be read. The Status
Register may be read at any time, even while a
Program, Erase or Write cycle is in progress.
When one of these cycles is in progress, it is recommended to check the Write In Progress (WIP)
bit before sending a new instruction to the device.
It is also possible to read the Status Register continuously, as shown in Figure 10..
The status bits of the Status Register are as follows:
WEL bit. The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
When set to 1 the internal Write Enable Latch is
set, when set to 0 the internal Write Enable Latch
is reset and no Write, Program or Erase instruction
is accepted.
Figure 10. Read Status Register (RDSR) Instruction Sequence and Data-Out Sequence
S
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
C
Instruction
D
Status Register Out
Status Register Out
High Impedance
Q
7
MSB
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
MSB
AI02031E
15/36
M45PE40
Read Data Bytes (READ)
next higher address after each byte of data is shifted out. The whole memory can, therefore, be read
with a single Read Data Bytes (READ) instruction.
When the highest address is reached, the address
counter rolls over to 000000h, allowing the read
sequence to be continued indefinitely.
The Read Data Bytes (READ) instruction is terminated by driving Chip Select (S) High. Chip Select
(S) can be driven High at any time during data output. Any Read Data Bytes (READ) instruction,
while an Erase, Program or Write cycle is in
progress, is rejected without having any effects on
the cycle that is in progress.
The device is first selected by driving Chip Select
(S) Low. The instruction code for the Read Data
Bytes (READ) instruction is followed by a 3-byte
address (A23-A0), each bit being latched-in during
the rising edge of Serial Clock (C). Then the memory contents, at that address, is shifted out on Serial Data Output (Q), each bit being shifted out, at
a maximum frequency fR, during the falling edge of
Serial Clock (C).
The instruction sequence is shown in Figure 11..
The first byte addressed can be at any location.
The address is automatically incremented to the
Figure 11. Read Data Bytes (READ) Instruction Sequence and Data-Out Sequence
S
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39
C
Instruction
24-Bit Address
23 22 21
D
3
2
1
0
MSB
Data Out 1
High Impedance
Q
7
6
5
4
3
2
Data Out 2
1
0
7
MSB
AI03748D
Note: Address bits A23 to A19 are Don’t Care.
16/36
M45PE40
Read Data Bytes at Higher Speed
(FAST_READ)
next higher address after each byte of data is shifted out. The whole memory can, therefore, be read
with a single Read Data Bytes at Higher Speed
(FAST_READ) instruction. When the highest address is reached, the address counter rolls over to
000000h, allowing the read sequence to be continued indefinitely.
The Read Data Bytes at Higher Speed
(FAST_READ) instruction is terminated by driving
Chip Select (S) High. Chip Select (S) can be driven High at any time during data output. Any Read
Data Bytes at Higher Speed (FAST_READ) instruction, while an Erase, Program or Write cycle
is in progress, is rejected without having any effects on the cycle that is in progress.
The device is first selected by driving Chip Select
(S) Low. The instruction code for the Read Data
Bytes at Higher Speed (FAST_READ) instruction
is followed by a 3-byte address (A23-A0) and a
dummy byte, each bit being latched-in during the
rising edge of Serial Clock (C). Then the memory
contents, at that address, is shifted out on Serial
Data Output (Q), each bit being shifted out, at a
maximum frequency fC, during the falling edge of
Serial Clock (C).
The instruction sequence is shown in Figure 12..
The first byte addressed can be at any location.
The address is automatically incremented to the
Figure 12. Read Data Bytes at Higher Speed (FAST_READ) Instruction Sequence
and Data-Out Sequence
S
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31
C
Instruction
24 BIT ADDRESS
23 22 21
D
3
2
1
0
High Impedance
Q
S
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
C
Dummy Byte
D
7
6
5
4
3
2
1
0
DATA OUT 2
DATA OUT 1
Q
7
MSB
6
5
4
3
2
1
0
7
MSB
6
5
4
3
2
1
0
7
MSB
AI04006
Note: Address bits A23 to A19 are Don’t Care.
17/36
M45PE40
data bytes are guaranteed to be written correctly
within the same page. If less than 256 Data bytes
are sent to device, they are correctly written at the
requested addresses without having any effects
on the other bytes of the same page.
Chip Select (S) must be driven High after the
eighth bit of the last data byte has been latched in,
otherwise the Page Write (PW) instruction is not
executed.
As soon as Chip Select (S) is driven High, the selftimed Page Write cycle (whose duration is tPW) is
initiated. While the Page Write cycle is in progress,
the Status Register may be read to check the value of the Write In Progress (WIP) bit. The Write In
Progress (WIP) bit is 1 during the self-timed Page
Write cycle, and is 0 when it is completed. At some
unspecified time before the cycle is complete, the
Write Enable Latch (WEL) bit is reset.
A Page Write (PW) instruction applied to a page
that is Hardware Protected is not executed.
Any Page Write (PW) instruction, while an Erase,
Program or Write cycle is in progress, is rejected
without having any effects on the cycle that is in
progress.
Page Write (PW)
The Page Write (PW) instruction allows bytes to
be written in the memory. Before it can be accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write Enable
(WREN) instruction has been decoded, the device
sets the Write Enable Latch (WEL).
The Page Write (PW) instruction is entered by
driving Chip Select (S) Low, followed by the instruction code, three address bytes and at least
one data byte on Serial Data Input (D). The rest of
the page remains unchanged if no power failure
occurs during this write cycle.
The Page Write (PW) instruction performs a page
erase cycle even if only one byte is updated.
If the 8 least significant address bits (A7-A0) are
not all zero, all transmitted data exceeding the addressed page boundary wrap round, and are written from the start address of the same page (the
one whose 8 least significant address bits (A7-A0)
are all zero). Chip Select (S) must be driven Low
for the entire duration of the sequence.
The instruction sequence is shown in Figure 13..
If more than 256 bytes are sent to the device, previously latched data are discarded and the last 256
Figure 13. Page Write (PW) Instruction Sequence
S
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39
C
Instruction
24-Bit Address
23 22 21
D
3
2
Data Byte 1
1
0
7
6
5
4
3
2
0
1
MSB
MSB
S
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
C
Data Byte 2
D
7
6
5
4
3
2
MSB
Data Byte 3
1
0
7
MSB
6
5
4
3
2
Data Byte n
1
0
7
6
5
4
3
2
1
0
MSB
AI04045
Note: 1. Address bits A23 to A19 are Don’t Care
2. 1 ≤ n ≤ 256
18/36
M45PE40
bytes are sent to device, they are correctly programmed at the requested addresses without having any effects on the other bytes of the same
page.
Chip Select (S) must be driven High after the
eighth bit of the last data byte has been latched in,
otherwise the Page Program (PP) instruction is not
executed.
As soon as Chip Select (S) is driven High, the selftimed Page Program cycle (whose duration is tPP)
is initiated. While the Page Program cycle is in
progress, the Status Register may be read to
check the value of the Write In Progress (WIP) bit.
The Write In Progress (WIP) bit is 1 during the selftimed Page Program cycle, and is 0 when it is
completed. At some unspecified time before the
cycle is complete, the Write Enable Latch (WEL)
bit is reset.
A Page Program (PP) instruction applied to a page
that is Hardware Protected is not executed.
Any Page Program (PP) instruction, while an
Erase, Program or Write cycle is in progress, is rejected without having any effects on the cycle that
is in progress.
Page Program (PP)
The Page Program (PP) instruction allows bytes to
be programmed in the memory (changing bits from
1 to 0, only). Before it can be accepted, a Write Enable (WREN) instruction must previously have
been executed. After the Write Enable (WREN) instruction has been decoded, the device sets the
Write Enable Latch (WEL).
The Page Program (PP) instruction is entered by
driving Chip Select (S) Low, followed by the instruction code, three address bytes and at least
one data byte on Serial Data Input (D). If the 8
least significant address bits (A7-A0) are not all
zero, all transmitted data exceeding the addressed page boundary wrap round, and are programmed from the start address of the same page
(the one whose 8 least significant address bits
(A7-A0) are all zero). Chip Select (S) must be driven Low for the entire duration of the sequence.
The instruction sequence is shown in Figure 14..
If more than 256 bytes are sent to the device, previously latched data are discarded and the last 256
data bytes are guaranteed to be programmed correctly within the same page. If less than 256 Data
Figure 14. Page Program (PP) Instruction Sequence
S
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39
C
Instruction
24-Bit Address
23 22 21
D
3
2
Data Byte 1
1
0
7
6
5
4
3
2
0
1
MSB
MSB
S
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
C
Data Byte 2
D
7
6
5
4
3
2
MSB
Data Byte 3
1
0
7
MSB
6
5
4
3
2
Data Byte n
1
0
7
6
5
4
3
2
1
0
MSB
AI04044
Note: 1. Address bits A23 to A19 are Don’t Care
2. 1 ≤ n ≤ 256
19/36
M45PE40
Page Erase (PE)
in, otherwise the Page Erase (PE) instruction is
not executed. As soon as Chip Select (S) is driven
High, the self-timed Page Erase cycle (whose duration is tPE) is initiated. While the Page Erase cycle is in progress, the Status Register may be read
to check the value of the Write In Progress (WIP)
bit. The Write In Progress (WIP) bit is 1 during the
self-timed Page Erase cycle, and is 0 when it is
completed. At some unspecified time before the
cycle is complete, the Write Enable Latch (WEL)
bit is reset.
A Page Erase (PE) instruction applied to a page
that is Hardware Protected is not executed.
Any Page Erase (PE) instruction, while an Erase,
Program or Write cycle is in progress, is rejected
without having any effects on the cycle that is in
progress.
The Page Erase (PE) instruction sets to 1 (FFh) all
bits inside the chosen page. Before it can be accepted, a Write Enable (WREN) instruction must
previously have been executed. After the Write
Enable (WREN) instruction has been decoded,
the device sets the Write Enable Latch (WEL).
The Page Erase (PE) instruction is entered by
driving Chip Select (S) Low, followed by the instruction code, and three address bytes on Serial
Data Input (D). Any address inside the Page is a
valid address for the Page Erase (PE) instruction.
Chip Select (S) must be driven Low for the entire
duration of the sequence.
The instruction sequence is shown in Figure 15..
Chip Select (S) must be driven High after the
eighth bit of the last address byte has been latched
Figure 15. Page Erase (PE) Instruction Sequence
S
0
1
2
3
4
5
6
7
8
9
29 30 31
C
Instruction
D
24 Bit Address
23 22
2
1
0
MSB
AI04046
Note: Address bits A23 to A19 are Don’t Care.
20/36
M45PE40
not executed. As soon as Chip Select (S) is driven
High, the self-timed Sector Erase cycle (whose duration is tSE) is initiated. While the Sector Erase cycle is in progress, the Status Register may be read
to check the value of the Write In Progress (WIP)
bit. The Write In Progress (WIP) bit is 1 during the
self-timed Sector Erase cycle, and is 0 when it is
completed. At some unspecified time before the
cycle is complete, the Write Enable Latch (WEL)
bit is reset.
A Sector Erase (SE) instruction applied to a sector
that contains a page that is Hardware Protected is
not executed.
Any Sector Erase (SE) instruction, while an Erase,
Program or Write cycle is in progress, is rejected
without having any effects on the cycle that is in
progress.
Sector Erase (SE)
The Sector Erase (SE) instruction sets to 1 (FFh)
all bits inside the chosen sector. Before it can be
accepted, a Write Enable (WREN) instruction
must previously have been executed. After the
Write Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Sector Erase (SE) instruction is entered by
driving Chip Select (S) Low, followed by the instruction code, and three address bytes on Serial
Data Input (D). Any address inside the Sector (see
Table 3.) is a valid address for the Sector Erase
(SE) instruction. Chip Select (S) must be driven
Low for the entire duration of the sequence.
The instruction sequence is shown in Figure 16..
Chip Select (S) must be driven High after the
eighth bit of the last address byte has been latched
in, otherwise the Sector Erase (SE) instruction is
Figure 16. Sector Erase (SE) Instruction Sequence
S
0
1
2
3
4
5
6
7
8
9
29 30 31
C
Instruction
D
24 Bit Address
23 22
2
1
0
MSB
AI03751D
Note: Address bits A23 to A19 are Don’t Care.
21/36
M45PE40
Deep Power-down (DP)
Executing the Deep Power-down (DP) instruction
is the only way to put the device in the lowest consumption mode (the Deep Power-down mode). It
can also be used as an extra software protection
mechanism, while the device is not in active use,
since in this mode, the device ignores all Write,
Program and Erase instructions.
Driving Chip Select (S) High deselects the device,
and puts the device in the Standby Power mode (if
there is no internal cycle currently in progress). But
this mode is not the Deep Power-down mode. The
Deep Power-down mode can only be entered by
executing the Deep Power-down (DP) instruction,
to reduce the standby current (from ICC1 to ICC2,
as specified in Table 11.).
Once the device has entered the Deep Powerdown mode, all instructions are ignored except the
Release from Deep Power-down (RDP) instruction. This releases the device from this mode.
The Deep Power-down mode automatically stops
at Power-down, and the device always Powers-up
in the Standby Power mode.
The Deep Power-down (DP) instruction is entered
by driving Chip Select (S) Low, followed by the instruction code on Serial Data Input (D). Chip Select (S) must be driven Low for the entire duration
of the sequence.
The instruction sequence is shown in Figure 17..
Chip Select (S) must be driven High after the
eighth bit of the instruction code has been latched
in, otherwise the Deep Power-down (DP) instruction is not executed. As soon as Chip Select (S) is
driven High, it requires a delay of tDP before the
supply current is reduced to ICC2 and the Deep
Power-down mode is entered.
Any Deep Power-down (DP) instruction, while an
Erase, Program or Write cycle is in progress, is rejected without having any effects on the cycle that
is in progress.
Figure 17. Deep Power-down (DP) Instruction Sequence
S
0
1
2
3
4
5
6
7
tDP
C
Instruction
D
Stand-by Mode
22/36
Deep Power-down Mode
AI03753D
M45PE40
Release from Deep Power-down (RDP)
Once the device has entered the Deep Powerdown mode, all instructions are ignored except the
Release from Deep Power-down (RDP) instruction. Executing this instruction takes the device out
of the Deep Power-down mode.
The Release from Deep Power-down (RDP) instruction is entered by driving Chip Select (S) Low,
followed by the instruction code on Serial Data Input (D). Chip Select (S) must be driven Low for the
entire duration of the sequence.
The instruction sequence is shown in Figure 18..
The Release from Deep Power-down (RDP) instruction is terminated by driving Chip Select (S)
High. Sending additional clock cycles on Serial
Clock (C), while Chip Select (S) is driven Low,
cause the instruction to be rejected, and not executed.
After Chip Select (S) has been driven High, followed by a delay, tRDP, the device is put in the
Standby Power mode. Chip Select (S) must remain High at least until this period is over. The device waits to be selected, so that it can receive,
decode and execute instructions.
Any Release from Deep Power-down (RDP) instruction, while an Erase, Program or Write cycle
is in progress, is rejected without having any effects on the cycle that is in progress.
Figure 18. Release from Deep Power-down (RDP) Instruction Sequence
S
0
1
2
3
4
5
6
7
tRDP
C
Instruction
D
High Impedance
Q
Deep Power-down Mode
Standby Mode
AI06807
23/36
M45PE40
POWER-UP AND POWER-DOWN
At Power-up and Power-down, the device must
not be selected (that is Chip Select (S) must follow
the voltage applied on VCC) until VCC reaches the
correct value:
– VCC(min) at Power-up, and then for a further
delay of tVSL
– VSS at Power-down
Usually a simple pull-up resistor on Chip Select (S)
can be used to ensure safe and proper Power-up
and Power-down.
To avoid data corruption and inadvertent write operations during power up, a Power On Reset
(POR) circuit is included. The logic inside the device is held reset while VCC is less than the Power
On Reset (POR) threshold voltage, VWI – all operations are disabled, and the device does not respond to any instruction.
Moreover, the device ignores all Write Enable
(WREN), Page Write (PW), Page Program (PP),
Page Erase (PE) and Sector Erase (SE) instructions until a time delay of tPUW has elapsed after
the moment that VCC rises above the VWI threshold. However, the correct operation of the device
is not guaranteed if, by this time, VCC is still below
VCC(min). No Write, Program or Erase instructions
should be sent until the later of:
– tPUW after VCC passed the VWI threshold
– tVSL after VCC passed the VCC(min) level
These values are specified in Table 6..
If the delay, tVSL, has elapsed, after VCC has risen
above VCC(min), the device can be selected for
READ instructions even if the tPUW delay is not yet
fully elapsed.
As an extra protection, the Reset (Reset) signal
can be driven Low for the whole duration of the
Power-up and Power-down phases.
At Power-up, the device is in the following state:
– The device is in the Standby Power mode (not
the Deep Power-down mode).
– The Write Enable Latch (WEL) bit is reset.
Normal precautions must be taken for supply rail
decoupling, to stabilize the VCC supply. Each device in a system should have the VCC rail decoupled by a suitable capacitor close to the package
pins. (Generally, this capacitor is of the order of
0.1µF).
At Power-down, when VCC drops from the operating voltage, to below the Power On Reset (POR)
threshold voltage, VWI, all operations are disabled
and the device does not respond to any instruction. (The designer needs to be aware that if a
Power-down occurs while a Write, Program or
Erase cycle is in progress, some data corruption
can result.)
Figure 19. Power-up Timing
VCC
VCC(max)
Program, Erase and Write Commands are Rejected by the Device
Chip Selection Not Allowed
VCC(min)
Reset State
of the
Device
tVSL
Read Access allowed
Device fully
accessible
VWI
tPUW
time
24/36
AI04009C
M45PE40
Table 6. Power-Up Timing and VWI Threshold
Symbol
1
Parameter
Min.
Max.
Unit
VCC(min) to S low
30
tPUW1
Time delay before the first Write, Program or Erase instruction
1
10
ms
VWI1
Write Inhibit Voltage
1.5
2.5
V
tVSL
µs
Note: 1. These parameters are characterized only, over the temperature range –40°C to +85°C.
INITIAL DELIVERY STATE
The device is delivered with the memory array
erased: all bits are set to 1 (each byte contains
FFh). All usable Status Register bits are 0.
25/36
M45PE40
MAXIMUM RATING
Stressing the device outside the ratings listed in
Table 7. may cause permanent damage to the device. These are stress ratings only, and operation
of the device at these, or any other conditions outside those indicated in the Operating sections of
this specification, is not implied. Exposure to Absolute Maximum Rating conditions for extended
periods may affect device reliability. Refer also to
the STMicroelectronics SURE Program and other
relevant quality documents.
Table 7. Absolute Maximum Ratings
Symbol
Parameter
TSTG
Storage Temperature
TLEAD
Lead Temperature during Soldering
Max.
Unit
–65
150
°C
See note 1
°C
VIO
Input and Output Voltage (with respect to Ground)
–0.6
4.0
V
VCC
Supply Voltage
–0.6
4.0
V
VESD
Electrostatic Discharge Voltage (Human Body model) 2
–2000
2000
V
Note: 1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST
the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU
2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω)
26/36
Min.
ECOPACK®
7191395 specification, and
M45PE40
DC AND AC PARAMETERS
ment Conditions summarized in the relevant
tables. Designers should check that the operating
conditions in their circuit match the measurement
conditions when relying on the quoted parameters.
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC
and AC Characteristic tables that follow are derived from tests performed under the MeasureTable 8. Operating Conditions
Symbol
VCC
TA
Parameter
Min.
Max.
Unit
Supply Voltage
2.7
3.6
V
Ambient Operating Temperature
–40
85
°C
Min.
Max.
Unit
Table 9. AC Measurement Conditions
Symbol
CL
Parameter
Load Capacitance
30
Input Rise and Fall Times
pF
5
ns
Input Pulse Voltages
0.2VCC to 0.8VCC
V
Input and Output Timing Reference Voltages
0.3VCC to 0.7VCC
V
Note: Output Hi-Z is defined as the point where data out is no longer driven.
Figure 20. AC Measurement I/O Waveform
Input Levels
Input and Output
Timing Reference Levels
0.8VCC
0.7VCC
0.3VCC
0.2VCC
AI00825B
Table 10. Capacitance
Symbol
COUT
CIN
Parameter
Output Capacitance (Q)
Input Capacitance (other pins)
Test Condition
Min.
Max.
Unit
VOUT = 0V
8
pF
VIN = 0V
6
pF
Note: Sampled only, not 100% tested, at TA=25°C and a frequency of 20 MHz.
27/36
M45PE40
Table 11. DC Characteristics
Symbol
Parameter
Test Condition
(in addition to those in Table 8.)
Min.
Max.
Unit
ILI
Input Leakage Current
±2
µA
ILO
Output Leakage Current
±2
µA
ICC1
Standby Current
(Standby and Reset modes)
S = VCC, VIN = VSS or VCC
50
µA
ICC2
Deep Power-down Current
S = VCC, VIN = VSS or VCC
10
µA
ICC3
Operating Current (FAST_READ)
C = 0.1VCC / 0.9.VCC at 25 MHz,
Q = open
6
mA
ICC4
Operating Current (PW)
S = VCC
15
mA
ICC5
Operating Current (SE)
S = VCC
15
mA
VIL
Input Low Voltage
– 0.5
0.3VCC
V
VIH
Input High Voltage
0.7VCC
VCC+0.4
V
VOL
Output Low Voltage
IOL = 1.6 mA
0.4
V
VOH
Output High Voltage
IOH = –100 µA
28/36
VCC–0.2
V
M45PE40
Table 12. AC Characteristics
Test conditions specified in Table 8. and Table 9.
Symbol
fC
Alt.
fC
fR
Parameter
Min.
Typ.
Max.
Unit
Clock Frequency for the following
instructions: FAST_READ, PW, PP,
PE, SE, DP, RDP, WREN, WRDI,
RDSR
D.C.
25
MHz
Clock Frequency for READ
instructions
D.C.
20
MHz
tCH 1
tCLH
Clock High Time
18
ns
tCL 1
tCLL
Clock Low Time
18
ns
0.03
V/ns
S Active Setup Time (relative to C)
10
ns
S Not Active Hold Time (relative to C)
10
ns
Clock Slew Rate 2 (peak to peak)
tSLCH
tCSS
tCHSL
tDVCH
tDSU
Data In Setup Time
5
ns
tCHDX
tDH
Data In Hold Time
5
ns
tCHSH
S Active Hold Time (relative to C)
10
ns
tSHCH
S Not Active Setup Time (relative to C)
10
ns
200
ns
tSHSL
tCSH
S Deselect Time
tSHQZ 2
tDIS
Output Disable Time
15
ns
tCLQV
tV
Clock Low to Output Valid
15
ns
tCLQX
tHO
Output Hold Time
0
ns
tRLRH 2
tRST
Reset Pulse Width
10
µs
tRHSL
tREC
Reset Recovery Time
3
µs
tSHRH
Chip should have been deselected
before Reset is de-asserted
10
ns
tWHSL
Write Protect Setup Time
50
ns
tSHWL
Write Protect Hold Time
100
ns
tDP 2
S to Deep Power-down
3
µs
tRDP 2
S High to Standby Power mode
30
µs
tPW
Page Write Cycle Time
11
25
ms
tPP
Page Program Cycle Time
1.2
5
ms
tPE
Page Erase Cycle Time
10
20
ms
tSE
Sector Erase Cycle Time
1
5
s
Note: 1. tCH + tCL must be greater than or equal to 1/ fC(max)
2. Value guaranteed by characterization, not 100% tested in production.
29/36
M45PE40
Figure 21. Serial Input Timing
tSHSL
S
tCHSL
tSLCH
tCHSH
tSHCH
C
tDVCH
tCHCL
tCHDX
D
Q
MSB IN
tCLCH
LSB IN
High Impedance
AI01447C
Figure 22. Write Protect Setup and Hold Timing
W
tSHWL
tWHSL
S
C
D
High Impedance
Q
AI07439
30/36
M45PE40
Figure 23. Output Timing
S
tCH
C
tCLQV
tCLQX
tCLQV
tCL
tSHQZ
tCLQX
LSB OUT
Q
tQLQH
tQHQL
D ADDR.LSB IN
AI01449D
Figure 24. Reset AC Waveforms
S
tSHRH
Reset
tRHSL
tRLRH
AI06808
31/36
M45PE40
PACKAGE MECHANICAL
Figure 25. MLP8, 8-lead Very thin Dual Flat Package No lead, 6x5mm, Package Outline
D
D1
E E1
E2
e
b
θ
A
D2
A2
L
A1 A3
VDFPN-01
Note: Drawing is not to scale.
Table 13. MLP8, 8-lead Very thin Dual Flat Package No lead, 6x5mm,
Package Mechanical Data
millimeters
inches
Symbol
Typ.
A
0.85
A1
0.00
Max.
Typ.
1.00
0.0335
0.05
A2
0.65
0.0256
A3
0.20
0.0079
b
0.40
D
6.00
0.2362
D1
5.75
0.2264
D2
3.40
E
5.00
0.1969
E1
4.75
0.1870
E2
4.00
e
1.27
L
0.60
θ
32/36
Min.
0.35
3.20
3.80
0.48
3.60
4.20
0.0157
0.1339
0.1575
Min.
Max.
0.0394
0.0000
0.0020
0.0138
0.0189
0.1260
0.1417
0.1496
0.1654
0.0197
0.0295
0.0500
0.50
0.75
12°
0.0236
12°
M45PE40
Figure 26. SO8 wide – 8 lead Plastic Small Outline, 208 mils body width, Package Outline
A2
A
C
B
CP
e
D
N
E
H
1
A1
α
L
SO-b
Note: Drawing is not to scale.
Table 14. SO8 wide – 8 lead Plastic Small Outline, 208 mils body width, Mechanical Data
millimeters
inches
Symbol
Typ
Min
A
Typ
Min
2.03
A1
0.10
A2
0.25
0.20
0.35
0.45
–
–
CP
Max
0.080
0.004
1.78
B
C
Max
0.010
0.070
0.008
0.014
0.018
–
–
0.10
0.004
D
5.15
5.35
0.203
0.211
E
5.20
5.40
0.205
0.213
–
–
–
–
H
7.70
8.10
0.303
0.319
L
0.50
0.80
0.020
0.031
α
0°
10°
0°
10°
N
8
e
1.27
0.050
8
33/36
M45PE40
PART NUMBERING
Table 15. Ordering Information Scheme
Example:
M45PE40
–
V MP
6
T
P
Device Type
M45PE = Page-Erasable Serial Flash Memory
Device Function
40 = 4Mbit (512K x 8)
Operating Voltage
V = VCC = 2.7 to 3.6V
Package
MW = SO8 (208 mils width)
MP = VDFPN8 6x5mm (MLP8)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating Technology
blank = Standard SnPb plating
P or G = RoHS compliant
For a list of available options (speed, package,
etc.) or for further information on any aspect of this
34/36
device, please contact your nearest ST Sales Office.
M45PE40
REVISION HISTORY
Table 16. Document Revision History
Date
Version
Description of Revision
04-Dec-2003
1.2
First public release
23-Jan-2004
2.0
SO16 pin-out corrected
31-Mar-2004
3.0
Soldering temperature information clarified for RoHS compliant devices. Device grade
information clarified
05-Aug-2004
4.0
Device grade information further clarified
11-Jan-2005
5.0
Document promoted to Mature Datasheet. Minor wording changes.
Notes 1 and 2 removed from Table 15., Ordering Information Scheme. SO16 package
removed and SO8 wide package added.
35/36
M45PE40
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
ECOPACK is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
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36/36
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