Data sheet acquired from Harris Semiconductor SCHS052B – Revised June 2003

Data sheet acquired from Harris Semiconductor SCHS052B – Revised June 2003

Data sheet acquired from Harris Semiconductor

SCHS052B – Revised June 2003

The CD4067B and CD4097B types are supplied in 24-lead hermetic dual-in-line ceramic packages (F3A suffix), 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96, and NSR suffixes), and 24-lead thin shrink small-outline packages (P and PWR suffixes).

Copyright © 2003, Texas Instruments Incorporated

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

PACKAGING INFORMATION

Orderable Device

CD4067BE

CD4067BEE4

CD4067BF

CD4067BF3A

CD4067BM

CD4067BM96

CD4067BM96E4

CD4067BM96G4

CD4067BME4

CD4067BMG4

CD4067BPW

CD4067BPWE4

CD4067BPWG4

CD4097BE

CD4097BEE4

CD4097BF

CD4097BM

Status

(1)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Package Type Package

Drawing

PDIP

PDIP

CDIP

CDIP

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

TSSOP

TSSOP

TSSOP

PDIP

PDIP

CDIP

SOIC

N

N

J

J

DW

DW

DW

DW

DW

DW

PW

PW

PW

N

N

J

DW

Pins Package

Qty

24

24

24

24

24

24

24

24

24

24

24

24

24

24

24

24

24

15

15

Eco Plan

(2)

Pb-Free

(RoHS)

Pb-Free

(RoHS)

TBD

Lead/Ball Finish MSL Peak Temp

(3)

CU NIPDAU N / A for Pkg Type

CU NIPDAU

Call TI

N / A for Pkg Type

N / A for Pkg Type 1

1 TBD

25

2000 Green (RoHS

& no Sb/Br)

2000 Green (RoHS

& no Sb/Br)

2000 Green (RoHS

& no Sb/Br)

25 Green (RoHS

& no Sb/Br)

25

Green (RoHS

& no Sb/Br)

60

60

60

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

15

15

1

Pb-Free

(RoHS)

Pb-Free

(RoHS)

TBD

25 Green (RoHS

& no Sb/Br)

Call TI

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

Call TI

CU NIPDAU

N / A for Pkg Type

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

Level-1-260C-UNLIM

Op Temp (°C)

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

Top-Side Markings

(4)

CD4067BE

CD4067BE

CD4067BF

CD4067BF3A

CD4067BM

CD4067BM

CD4067BM

CD4067BM

CD4067BM

CD4067BM

CM067B

CM067B

CM067B

CD4097BE

CD4097BE

CD4097BF

CD4097BM

Samples

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Orderable Device

CD4097BME4

CD4097BMG4

CD4097BPW

CD4097BPWE4

Status

(1)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Package Type Package

Drawing

Pins Package

Qty

SOIC

SOIC

TSSOP

TSSOP

DW

DW

PW

PW

24

24

24

24

25

25

60

60

Eco Plan

(2)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Lead/Ball Finish MSL Peak Temp

(3)

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

Op Temp (°C)

-55 to 125

-55 to 125

-55 to 125

-55 to 125

Top-Side Markings

(4)

CD4097BM

CD4097BM

CM097B

CM097B

CD4097BPWG4

CD4097BPWR

CD4097BPWRE4

ACTIVE

ACTIVE

ACTIVE

TSSOP

TSSOP

TSSOP

PW

PW

PW

24

24

24

60 Green (RoHS

& no Sb/Br)

2000 Green (RoHS

& no Sb/Br)

2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

-55 to 125

-55 to 125

-55 to 125

CM097B

CM097B

CM097B

CD4097BPWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -55 to 125

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

CM097B

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Addendum-Page 2

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF CD4067B, CD4067B-MIL, CD4097B, CD4097B-MIL :

Catalog: CD4067B , CD4097B

Military: CD4067B-MIL , CD4097B-MIL

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

Military - QML certified for Military and Defense Applications

Addendum-Page 3

www.ti.com

TAPE AND REEL INFORMATION

PACKAGE MATERIALS INFORMATION

11-Oct-2012

*All dimensions are nominal

Device

CD4067BM96

CD4067BM96G4

CD4097BPWR

Package

Type

Package

Drawing

SOIC

SOIC

TSSOP

DW

DW

PW

Pins

24

24

24

SPQ

2000

2000

2000

Reel

Diameter

(mm)

Reel

Width

W1 (mm)

330.0

A0

(mm)

B0

(mm)

24.4

10.75

15.7

330.0

330.0

24.4

10.75

15.7

16.4

6.95

8.3

K0

(mm)

P1

(mm)

2.7

1.6

12.0

8.0

W

(mm)

Pin1

Quadrant

24.0

2.7

12.0

24.0

16.0

Q1

Q1

Q1

Pack Materials-Page 1

www.ti.com

PACKAGE MATERIALS INFORMATION

11-Oct-2012

*All dimensions are nominal

Device

CD4067BM96

CD4067BM96G4

CD4097BPWR

Package Type Package Drawing Pins

SOIC

SOIC

TSSOP

DW

DW

PW

24

24

24

SPQ

2000

2000

2000

Length (mm) Width (mm) Height (mm)

367.0

367.0

367.0

367.0

367.0

367.0

45.0

45.0

38.0

Pack Materials-Page 2

MECHANICAL DATA

MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997

CERAMIC DUAL-IN-LINE PACKAGE J (R-GDIP-T**)

24 PINS SHOWN

24

B

13

C

1

0.065 (1,65)

0.045 (1,14)

0.090 (2,29)

0.060 (1,53)

12

0.175 (4,45)

0.140 (3,56)

Lens Protrusion (Lens Optional)

0.010 (0.25) MAX

A

Seating Plane

0.018 (0,46) MIN

0.125 (3,18) MIN

0.100 (2,54)

0.022 (0,56)

0.014 (0,36)

0.012 (0,30)

0.008 (0,20)

DIM

”A”

”B”

”C”

MAX

MIN

MAX

MIN

MAX

MIN

PINS **

24

NARR WIDE

0.624(15,85) 0.624(15,85)

0.590(14,99) 0.590(14,99)

1.265(32,13) 1.265(32,13)

1.235(31,37) 1.235(31,37)

0.541(13,74) 0.598(15,19)

0.514(13,06) 0.571(14,50)

28

NARR WIDE

0.624(15,85) 0.624(15,85)

0.590(14,99) 0.590(14,99)

1.465(37,21) 1.465(37,21)

1.435(36,45) 1.435(36,45)

0.541(13,74) 0.598(15,19)

0.514(13,06) 0.571(14,50)

32

NARR WIDE

0.624(15,85) 0.624(15,85)

0.590(14,99) 0.590(14,99)

1.668(42,37) 1.668(42,37)

1.632(41,45) 1.632(41,45)

0.541(13,74) 0.598(15,19)

0.514(13,06) 0.571(14,50)

40

NARR WIDE

0.624(15,85) 0.624(15,85)

0.590(14,99) 0.590(14,99)

2.068(52,53) 2.068(52,53)

2.032(51,61) 2.032(51,61)

0.541(13,74) 0.598(15,19)

0.514(13,06) 0.571(14,50)

4040084/C 10/97

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).

D. This package can be hermetically sealed with a ceramic lid using glass frit.

E. Index point is provided on cap for terminal identification.

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

MECHANICAL DATA

MPDI008 – OCTOBER 1994

PLASTIC DUAL-IN-LINE PACKAGE N (R-PDIP-T**)

24 PIN SHOWN

24

A

13

0.560 (14,22)

0.520 (13,21)

1

0.060 (1,52) TYP

12

0.200 (5,08) MAX

0.020 (0,51) MIN

0.610 (15,49)

0.590 (14,99)

Seating Plane

0.021 (0,53)

0.015 (0,38)

0.010 (0,25)

M

0.100 (2,54)

0.125 (3,18) MIN

0.010 (0,25) NOM

DIM

PINS **

A MAX

A MIN

24 28 32 40 48 52

1.270

1.450

(32,26) (36,83)

1.650

(41,91)

2.090

(53,09)

2.450

(62,23)

2.650

(67,31)

1.230

(31,24)

1.410

(35,81)

1.610

(40,89)

2.040

(51,82)

2.390

(60,71)

2.590

(65,79)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-011

D. Falls within JEDEC MS-015 (32 pin only)

0

°

– 15

°

4040053 / B 04/95

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

IMPORTANT NOTICE

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