Manual 21040175
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device
5962-8670405PA
Status
(1)
ACTIVE
Package Type Package
Drawing
Pins Package
Qty
CDIP JG 8 1
Eco Plan
(2)
TBD
5962-8670405XA ACTIVE LCCC FK 20 1 TBD
5962-8670406PA
5962-8670406XA
5962-8670407PA
5962-8670407XA
5962-8670408PA
5962-8670408XA
UC1842AJ
UC1842AJ883B
UC1842AL883B
UC1843AJ
UC1843AJ883B
ACTIVE
ACTIVE
CDIP
LCCC
ACTIVE
ACTIVE
CDIP
LCCC
ACTIVE
ACTIVE
CDIP
LCCC
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
LCCC
ACTIVE
ACTIVE
CDIP
CDIP
JG
FK
8
20
1
1
JG
FK
8
20
1
1
JG
FK
8
20
1
1
JG
JG
FK
8
8
20
1
1
1
JG
JG
8
8
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
12-Sep-2015
Lead/Ball Finish
(6)
A42
POST-PLATE
A42
POST-PLATE
A42
POST-PLATE
A42
POST-PLATE
A42
A42
POST-PLATE
A42
A42
MSL Peak Temp
(3)
N / A for Pkg Type
Op Temp (°C)
-55 to 125
N / A for Pkg Type -55 to 125
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
(4/5)
8670405PA
UC1842A
5962-
8670405XA
UC1842AL/
883B
8670406PA
UC1843A
5962-
8670406XA
UC1843AL/
883B
8670407PA
UC1844A
5962-
8670407XA
UC1844AL/
883B
8670408PA
UC1845A
5962-
8670408XA
UC1845AL/
883B
UC1842AJ
8670405PA
UC1842A
5962-
8670405XA
UC1842AL/
883B
UC1843AJ
8670406PA
UC1843A
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
UC1843AL883B
UC1844AJ
UC1844AJ883B
UC1844AL883B
UC1845AJ
UC1845AJ883B
UC1845AL883B
UC2842AD
UC2842AD8
UC2842AD8G4
UC2842AD8TR
UC2842AD8TRG4
UC2842ADG4
UC2842ADTR
12-Sep-2015
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Type Package
Drawing
LCCC
CDIP
CDIP
LCCC
CDIP
CDIP
LCCC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
FK
JG
JG
FK
JG
JG
FK
D
D
D
D
D
D
D
Pins Package
Qty
20
8
8
20
8
8
20
1
1
1
1
1
1
1
Eco Plan
(2)
TBD
TBD
TBD
TBD
TBD
TBD
TBD
14
8
8
8
50
75
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
75 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
8
14
14
2500 Green (RoHS
& no Sb/Br)
50 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
POST-PLATE
A42
A42
POST-PLATE
A42
A42
POST-PLATE
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
N / A for Pkg Type
Op Temp (°C)
-55 to 125
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
UC2842A
UC2842
AD8
UC2842A
UC2842
AD8
UC2842A
UC2842
AD8
UC2842A
UC2842
AD8
UC2842AD
UC2842AD
Device Marking
(4/5)
5962-
8670406XA
UC1843AL/
883B
UC1844AJ
8670407PA
UC1844A
5962-
8670407XA
UC1844AL/
883B
UC1845AJ
8670408PA
UC1845A
5962-
8670408XA
UC1845AL/
883B
UC2842AD
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2015
Orderable Device
UC2842ADW
UC2842ADWTR
UC2842ADWTRG4
UC2842AJ
UC2842AN
UC2842ANG4
UC2843AD
UC2843AD8
UC2843AD8G4
UC2843AD8TR
UC2843AD8TRG4
UC2843ADG4
UC2843ADTR
UC2843AJ
UC2843AN
UC2843ANG4
UC2843AQ
Status
(1)
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
Package Type Package
Drawing
SOIC
SOIC
DW
DW
Pins Package
16
16
Qty
Eco Plan
(2)
40 Green (RoHS
& no Sb/Br)
2000 Green (RoHS
& no Sb/Br)
SOIC
CDIP
DW
JG
16
8
2000 Green (RoHS
& no Sb/Br)
TBD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
PDIP
SOIC
SOIC
P
P
D
D
8
8
14
8
50
50
50
75
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ACTIVE SOIC D 8
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
CDIP
PDIP
PDIP
PLCC
D
D
D
D
JG
P
P
FN
8
8
14
14
8
8
8
20
75 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
50
2500 Green (RoHS
& no Sb/Br)
TBD
50
50
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
46
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-2-260C-1 YEAR
Op Temp (°C)
-40 to 85
Level-2-260C-1 YEAR -40 to 85
Level-2-260C-1 YEAR -40 to 85
Call TI
N / A for Pkg Type
-40 to 85
-40 to 85
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
N / A for Pkg Type
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Level-2-260C-1 YEAR -40 to 85
Device Marking
(4/5)
UC2842ADW
UC2842ADW
UC2842ADW
UC2842AN
UC2842AN
UC2843AD
UC2843A
UC2843
AD8
UC2843A
UC2843
AD8
UC2843A
UC2843
AD8
UC2843A
UC2843
AD8
UC2843AD
UC2843AD
UC2843AN
UC2843AN
UC2843AQ
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
UC2844AD
UC2844AD8
UC2844AD8G4
UC2844AD8TR
UC2844AD8TRG4
UC2844ADG4
UC2844ADTR
UC2844ADTRG4
UC2844AN
UC2844ANG4
UC2844AQD8
UC2844AQD8R
UC2844AQDR
UC2845AD
UC2845AD8
UC2845AD8G4
12-Sep-2015
Status
(1)
ACTIVE
ACTIVE
Package Type Package
Drawing
Pins Package
Qty
SOIC
SOIC
D
D
14
8
50
75
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ACTIVE SOIC D 8
ACTIVE SOIC D 8
75 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
P
P
D
D
D
D
D
D
8
14
14
14
8
8
8
8
14
14
8
8
2500 Green (RoHS
& no Sb/Br)
50 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
50
50
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
75 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
50 Green (RoHS
& no Sb/Br)
75 Green (RoHS
& no Sb/Br)
75 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Op Temp (°C)
-40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
N / A for Pkg Type
N / A for Pkg Type
-40 to 85
-40 to 85
Level-1-260C-UNLIM -40 to 125
Level-1-260C-UNLIM -40 to 125
Level-1-260C-UNLIM -40 to 125
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
Level-1-260C-UNLIM -40 to 85
Addendum-Page 4
UC2844AN
UC2844AN
(2844AQ ~
UC2844AQ)
(2844AQ ~
UC2844AQ)
(2844AQ ~
UC2844AQ)
UC2845AD
UC2845A
UC2845
AD8
UC2845A
UC2845
Device Marking
(4/5)
UC2844AD
UC2844A
UC2844
AD8
UC2844A
UC2844
AD8
UC2844A
UC2844
AD8
UC2844A
UC2844
AD8
UC2844AD
UC2844AD
UC2844AD
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
UC2845AD8TR
UC2845AD8TRG4
UC2845ADG4
UC2845ADTR
UC2845ADTRG4
UC2845ADW
UC2845AN
UC2845ANG4
UC3842AD
UC3842AD8
UC3842AD8G4
UC3842AD8TR
UC3842AD8TRG4
UC3842ADG4
UC3842ADTR
12-Sep-2015
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
ACTIVE SOIC D 8
ACTIVE SOIC D 8
2500 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
D
D
D
DW
P
P
D
D
D
14
14
14
16
8
8
14
8
8
50
2500 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
40 Green (RoHS
& no Sb/Br)
50 Green (RoHS
& no Sb/Br)
50
Green (RoHS
& no Sb/Br)
50
75
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
75 Green (RoHS
& no Sb/Br)
ACTIVE SOIC D
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
D
D
D
8
8
14
14
2500 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
50 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Op Temp (°C)
-40 to 85
-40 to 85
Level-1-260C-UNLIM -40 to 85
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
Level-2-260C-1 YEAR -40 to 85
N / A for Pkg Type -40 to 85
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
0 to 70
0 to 70
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
UC2845AN
UC3842AD
UC3842A
UC3842
AD8
UC3842A
UC3842
AD8
UC3842A
UC3842
AD8
UC3842A
UC3842
AD8
UC3842AD
UC3842AD
Device Marking
(4/5)
AD8
UC2845A
UC2845
AD8
UC2845A
UC2845
AD8
UC2845AD
UC2845AD
UC2845AD
UC2845ADW
UC2845AN
Addendum-Page 5
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
UC3842ADW
UC3842ADWG4
UC3842AN
UC3842ANG4
UC3842J
UC3843A-W
UC3843AD
UC3843AD8
UC3843AD8G4
UC3843AD8TR
UC3843AD8TRG4
UC3843ADG4
UC3843ADTR
UC3843ADTRG4
UC3843AN
UC3843ANG4
12-Sep-2015
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Type Package
Drawing
Pins Package
Qty
SOIC
SOIC
PDIP
PDIP
DW
DW
P
P
16
16
8
8
40
40
50
50
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CDIP JG 8 1 TBD
ACTIVE WAFERSALE
ACTIVE SOIC
ACTIVE SOIC
YS
D
D
0
14
8
3298
50
75
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ACTIVE SOIC D 8
ACTIVE SOIC D 8
75 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
P
P
14
14
14
8
8
50 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
50 Green (RoHS
& no Sb/Br)
50 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
A42
Call TI
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-2-260C-1 YEAR
Op Temp (°C)
0 to 70
Level-2-260C-1 YEAR
N / A for Pkg Type
N / A for Pkg Type
0 to 70
0 to 70
0 to 70
N / A for Pkg Type
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Device Marking
(4/5)
UC3842ADW
UC3842ADW
UC3842AN
UC3842AN
UC3842J
UC3843AD
UC3843A
UC3843
AD8
UC3843A
UC3843
AD8
UC3843A
UC3843
AD8
UC3843A
UC3843
AD8
UC3843AD
UC3843AD
UC3843AD
UC3843AN
UC3843AN
Samples
Addendum-Page 6
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
UC3844AD
UC3844AD8
UC3844AD8G4
UC3844AD8TR
UC3844AD8TRG4
UC3844ADG4
UC3844ADTR
UC3844ADTRG4
UC3844AN
UC3844ANG4
UC3845AD
UC3845AD8
UC3845AD8G4
UC3845AD8TR
UC3845AD8TRG4
12-Sep-2015
Status
(1)
ACTIVE
ACTIVE
Package Type Package
Drawing
Pins Package
Qty
SOIC
SOIC
D
D
14
8
50
75
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ACTIVE SOIC D 8
ACTIVE SOIC D 8
75 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
D
D
D
D
P
P
D
D
8
14
14
14
8
8
14
8
2500 Green (RoHS
& no Sb/Br)
50 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
50
50
50
75
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
D
D
D
8
8
8
75 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Op Temp (°C)
0 to 70
Level-1-260C-UNLIM 0 to 70
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
UC3844AN
UC3844AN
UC3845AD
UC3845A
UC3845
AD8
UC3845A
UC3845
AD8
UC3845A
UC3845
AD8
UC3845A
UC3845
Device Marking
(4/5)
UC3844AD
UC3844A
UC3844
AD8
UC3844A
UC3844
AD8
UC3844A
UC3844
AD8
UC3844A
UC3844
AD8
UC3844AD
UC3844AD
UC3844AD
Addendum-Page 7
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2015
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
AD8
UC3845AD UC3845ADG4
UC3845ADTR
UC3845ADTRG4
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
D
D
D
14
14
14
50 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
2500 Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
UC3845AD
UC3845AD
UC3845AN ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type 0 to 70 UC3845AN
UC3845ANG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
CU NIPDAU N / A for Pkg Type
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
0 to 70 UC3845AN
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
Addendum-Page 8
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1842A, UC1843A, UC1844A, UC1845A, UC2843A, UC3842A, UC3842M, UC3843A, UC3844A, UC3845A :
•
Catalog: UC3842A , UC3843A , UC3844A , UC3845A , UC3842 , UC3845AM
•
Automotive: UC2843A-Q1
•
Enhanced Product: UC1842A-EP , UC1843A-EP , UC1844A-EP , UC1845A-EP , UC1842A-EP , UC1843A-EP , UC1844A-EP , UC1845A-EP
• Military: UC1842A , UC1843A , UC1844A , UC1845A
•
Space: UC1842A-SP , UC1843A-SP , UC1844A-SP , UC1845A-SP , UC1842A-SP , UC1843A-SP , UC1844A-SP , UC1845A-SP
NOTE: Qualified Version Definitions:
•
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Military - QML certified for Military and Defense Applications
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 9
www.ti.com
TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
23-Nov-2015
*All dimensions are nominal
Device
UC2842AD8TR
UC2842ADTR
UC2842ADWTR
UC2843AD8TR
UC2843ADTR
UC2844AD8TR
UC2844ADTR
UC2844AQD8R
UC2844AQD8R
UC2844AQDR
UC2845AD8TR
UC2845ADTR
UC3842AD8TR
UC3842ADTR
UC3843AD8TR
UC3843ADTR
UC3844AD8TR
UC3844ADTR
Package
Type
Package
Drawing
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
DW
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Pins
8
14
16
8
14
8
14
8
8
14
8
14
8
14
8
14
8
14
SPQ
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2500
2500
2500
2500
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
330.0
12.4
330.0
330.0
A0
(mm)
B0
(mm)
6.4
5.2
16.4
6.5
9.0
16.4
10.75
10.7
330.0
330.0
330.0
330.0
12.4
16.4
12.4
16.4
6.4
6.5
6.4
6.5
5.2
9.0
5.2
9.0
330.0
330.0
330.0
12.4
12.4
16.4
12.4
16.4
12.4
16.4
12.4
16.4
12.4
16.4
6.4
6.4
6.5
6.4
6.5
6.4
6.5
6.4
6.5
6.4
6.5
9.0
5.2
9.0
9.0
5.2
9.0
5.2
5.2
5.2
9.0
5.2
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
2.1
8.0
12.0
2.1
8.0
16.0
2.7
12.0
16.0
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
8.0
8.0
8.0
8.0
8.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
16.0
12.0
16.0
12.0
12.0
16.0
12.0
16.0
12.0
16.0
12.0
16.0
12.0
16.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
23-Nov-2015 www.ti.com
Device
UC3845AD8TR
UC3845ADTR
Package
Type
Package
Drawing
SOIC
SOIC
D
D
Pins
8
14
SPQ
2500
2500
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
330.0
12.4
330.0
16.4
A0
(mm)
6.4
6.5
B0
(mm)
5.2
9.0
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
2.1
2.1
8.0
8.0
12.0
16.0
Q1
Q1
*All dimensions are nominal
Device
UC2842AD8TR
UC2842ADTR
UC2842ADWTR
UC2843AD8TR
UC2843ADTR
UC2844AD8TR
UC2844ADTR
UC2844AQD8R
UC2844AQD8R
UC2844AQDR
UC2845AD8TR
UC2845ADTR
UC3842AD8TR
UC3842ADTR
UC3843AD8TR
Package Type Package Drawing Pins
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
DW
D
D
D
D
D
D
D
D
D
D
D
D
14
8
14
8
8
8
14
8
8
14
8
14
8
14
16
SPQ
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2500
2500
2500
2500
Length (mm) Width (mm) Height (mm)
367.0
367.0
367.0
340.5
333.2
340.5
333.2
340.5
340.5
333.2
367.0
340.5
333.2
340.5
333.2
338.1
345.9
367.0
338.1
345.9
338.1
345.9
367.0
367.0
367.0
338.1
345.9
338.1
345.9
338.1
35.0
35.0
38.0
20.6
28.6
20.6
28.6
20.6
20.6
28.6
38.0
20.6
28.6
20.6
28.6
Pack Materials-Page 2
www.ti.com
Device
UC3843ADTR
UC3844AD8TR
UC3844ADTR
UC3845AD8TR
UC3845ADTR
PACKAGE MATERIALS INFORMATION
23-Nov-2015
Package Type Package Drawing Pins
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
14
8
14
8
14
SPQ
2500
2500
2500
2500
2500
Length (mm) Width (mm) Height (mm)
333.2
340.5
333.2
340.5
333.2
345.9
338.1
345.9
338.1
345.9
28.6
20.6
28.6
20.6
28.6
Pack Materials-Page 3
JG (R-GDIP-T8)
0.063 (1,60)
0.015 (0,38)
0.100 (2,54)
8
0.400 (10,16)
0.355 (9,00)
5
1
0.280 (7,11)
0.245 (6,22)
4
0.065 (1,65)
0.045 (1,14)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0
°
–15
°
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
MECHANICAL DATA
MPLC004A – OCTOBER 1994
PLASTIC J-LEADED CHIP CARRIER FN (S-PQCC-J**)
20 PIN SHOWN
3
D
D1
1 19
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
0.020 (0,51) MIN
0.032 (0,81)
0.026 (0,66)
4 18
D2 / E2
E E1
D2 / E2
8 14
9 13
0.050 (1,27)
0.008 (0,20) NOM
0.021 (0,53)
0.013 (0,33)
0.007 (0,18)
M
NO. OF
PINS
**
52
68
84
20
28
44
D / E D1 / E1 D2 / E2
MIN MAX MIN MAX MIN MAX
0.385 (9,78)
0.485 (12,32)
0.395 (10,03)
0.495 (12,57)
0.350 (8,89)
0.450 (11,43)
0.356 (9,04)
0.456 (11,58)
0.685 (17,40)
0.785 (19,94)
0.695 (17,65)
0.795 (20,19)
0.650 (16,51)
0.750 (19,05)
0.656 (16,66)
0.756 (19,20)
0.985 (25,02)
1.185 (30,10)
0.995 (25,27)
1.195 (30,35)
0.950 (24,13)
1.150 (29,21)
0.958 (24,33)
1.158 (29,41)
0.141 (3,58)
0.191 (4,85)
0.291 (7,39)
0.341 (8,66)
0.441 (11,20)
0.541 (13,74)
0.169 (4,29)
0.219 (5,56)
0.319 (8,10)
0.369 (9,37)
0.469 (11,91)
0.569 (14,45)
4040005 / B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
1
IMPORTANT NOTICE
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.
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