Manual 21040182

Manual 21040182

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device

5962-8670405PA

Status

(1)

ACTIVE

Package Type Package

Drawing

Pins Package

Qty

CDIP JG 8 1

Eco Plan

(2)

TBD

5962-8670405XA ACTIVE LCCC FK 20 1 TBD

5962-8670406PA

5962-8670406XA

5962-8670407PA

5962-8670407XA

5962-8670408PA

5962-8670408XA

UC1842AJ

UC1842AJ883B

UC1842AL883B

UC1843AJ

UC1843AJ883B

ACTIVE

ACTIVE

CDIP

LCCC

ACTIVE

ACTIVE

CDIP

LCCC

ACTIVE

ACTIVE

CDIP

LCCC

ACTIVE

ACTIVE

ACTIVE

CDIP

CDIP

LCCC

ACTIVE

ACTIVE

CDIP

CDIP

JG

FK

8

20

1

1

JG

FK

8

20

1

1

JG

FK

8

20

1

1

JG

JG

FK

8

8

20

1

1

1

JG

JG

8

8

1

1

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

12-Sep-2015

Lead/Ball Finish

(6)

A42

POST-PLATE

A42

POST-PLATE

A42

POST-PLATE

A42

POST-PLATE

A42

A42

POST-PLATE

A42

A42

MSL Peak Temp

(3)

N / A for Pkg Type

Op Temp (°C)

-55 to 125

N / A for Pkg Type -55 to 125

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

Device Marking

(4/5)

8670405PA

UC1842A

5962-

8670405XA

UC1842AL/

883B

8670406PA

UC1843A

5962-

8670406XA

UC1843AL/

883B

8670407PA

UC1844A

5962-

8670407XA

UC1844AL/

883B

8670408PA

UC1845A

5962-

8670408XA

UC1845AL/

883B

UC1842AJ

8670405PA

UC1842A

5962-

8670405XA

UC1842AL/

883B

UC1843AJ

8670406PA

UC1843A

Addendum-Page 1

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device

UC1843AL883B

UC1844AJ

UC1844AJ883B

UC1844AL883B

UC1845AJ

UC1845AJ883B

UC1845AL883B

UC2842AD

UC2842AD8

UC2842AD8G4

UC2842AD8TR

UC2842AD8TRG4

UC2842ADG4

UC2842ADTR

12-Sep-2015

Status

(1)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Package Type Package

Drawing

LCCC

CDIP

CDIP

LCCC

CDIP

CDIP

LCCC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

FK

JG

JG

FK

JG

JG

FK

D

D

D

D

D

D

D

Pins Package

Qty

20

8

8

20

8

8

20

1

1

1

1

1

1

1

Eco Plan

(2)

TBD

TBD

TBD

TBD

TBD

TBD

TBD

14

8

8

8

50

75

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

75 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

8

14

14

2500 Green (RoHS

& no Sb/Br)

50 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

Lead/Ball Finish

(6)

POST-PLATE

A42

A42

POST-PLATE

A42

A42

POST-PLATE

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

MSL Peak Temp

(3)

N / A for Pkg Type

Op Temp (°C)

-55 to 125

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

N / A for Pkg Type

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-55 to 125

-40 to 85

-40 to 85

-40 to 85

-40 to 85

-40 to 85

-40 to 85

-40 to 85

UC2842A

UC2842

AD8

UC2842A

UC2842

AD8

UC2842A

UC2842

AD8

UC2842A

UC2842

AD8

UC2842AD

UC2842AD

Device Marking

(4/5)

5962-

8670406XA

UC1843AL/

883B

UC1844AJ

8670407PA

UC1844A

5962-

8670407XA

UC1844AL/

883B

UC1845AJ

8670408PA

UC1845A

5962-

8670408XA

UC1845AL/

883B

UC2842AD

Addendum-Page 2

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

12-Sep-2015

Orderable Device

UC2842ADW

UC2842ADWTR

UC2842ADWTRG4

UC2842AJ

UC2842AN

UC2842ANG4

UC2843AD

UC2843AD8

UC2843AD8G4

UC2843AD8TR

UC2843AD8TRG4

UC2843ADG4

UC2843ADTR

UC2843AJ

UC2843AN

UC2843ANG4

UC2843AQ

Status

(1)

ACTIVE

ACTIVE

ACTIVE

OBSOLETE

Package Type Package

Drawing

SOIC

SOIC

DW

DW

Pins Package

16

16

Qty

Eco Plan

(2)

40 Green (RoHS

& no Sb/Br)

2000 Green (RoHS

& no Sb/Br)

SOIC

CDIP

DW

JG

16

8

2000 Green (RoHS

& no Sb/Br)

TBD

ACTIVE

ACTIVE

ACTIVE

ACTIVE

PDIP

PDIP

SOIC

SOIC

P

P

D

D

8

8

14

8

50

50

50

75

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

ACTIVE SOIC D 8

ACTIVE

ACTIVE

ACTIVE

ACTIVE

OBSOLETE

ACTIVE

ACTIVE

ACTIVE

SOIC

SOIC

SOIC

SOIC

CDIP

PDIP

PDIP

PLCC

D

D

D

D

JG

P

P

FN

8

8

14

14

8

8

8

20

75 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

50

2500 Green (RoHS

& no Sb/Br)

TBD

50

50

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

46

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Lead/Ball Finish

(6)

CU NIPDAU

CU NIPDAU

CU NIPDAU

Call TI

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

MSL Peak Temp

(3)

Level-2-260C-1 YEAR

Op Temp (°C)

-40 to 85

Level-2-260C-1 YEAR -40 to 85

Level-2-260C-1 YEAR -40 to 85

Call TI

N / A for Pkg Type

-40 to 85

-40 to 85

N / A for Pkg Type

Level-1-260C-UNLIM

Level-1-260C-UNLIM

-40 to 85

-40 to 85

-40 to 85

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

Call TI

CU NIPDAU

CU NIPDAU

CU SN

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Call TI

N / A for Pkg Type

N / A for Pkg Type

-40 to 85

-40 to 85

-40 to 85

-40 to 85

-40 to 85

-40 to 85

-40 to 85

-40 to 85

Level-2-260C-1 YEAR -40 to 85

Device Marking

(4/5)

UC2842ADW

UC2842ADW

UC2842ADW

UC2842AN

UC2842AN

UC2843AD

UC2843A

UC2843

AD8

UC2843A

UC2843

AD8

UC2843A

UC2843

AD8

UC2843A

UC2843

AD8

UC2843AD

UC2843AD

UC2843AN

UC2843AN

UC2843AQ

Addendum-Page 3

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device

UC2844AD

UC2844AD8

UC2844AD8G4

UC2844AD8TR

UC2844AD8TRG4

UC2844ADG4

UC2844ADTR

UC2844ADTRG4

UC2844AN

UC2844ANG4

UC2844AQD8

UC2844AQD8R

UC2844AQDR

UC2845AD

UC2845AD8

UC2845AD8G4

12-Sep-2015

Status

(1)

ACTIVE

ACTIVE

Package Type Package

Drawing

Pins Package

Qty

SOIC

SOIC

D

D

14

8

50

75

Eco Plan

(2)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

ACTIVE SOIC D 8

ACTIVE SOIC D 8

75 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

SOIC

SOIC

SOIC

SOIC

PDIP

PDIP

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

D

D

D

D

P

P

D

D

D

D

D

D

8

14

14

14

8

8

8

8

14

14

8

8

2500 Green (RoHS

& no Sb/Br)

50 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

50

50

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

75 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

50 Green (RoHS

& no Sb/Br)

75 Green (RoHS

& no Sb/Br)

75 Green (RoHS

& no Sb/Br)

Lead/Ball Finish

(6)

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

MSL Peak Temp

(3)

Level-1-260C-UNLIM

Op Temp (°C)

-40 to 85

Level-1-260C-UNLIM -40 to 85

Level-1-260C-UNLIM -40 to 85

Level-1-260C-UNLIM -40 to 85

Level-1-260C-UNLIM -40 to 85

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

-40 to 85

-40 to 85

-40 to 85

N / A for Pkg Type

N / A for Pkg Type

-40 to 85

-40 to 85

Level-1-260C-UNLIM -40 to 125

Level-1-260C-UNLIM -40 to 125

Level-1-260C-UNLIM -40 to 125

Level-1-260C-UNLIM

Level-1-260C-UNLIM

-40 to 85

-40 to 85

Level-1-260C-UNLIM -40 to 85

Addendum-Page 4

UC2844AN

UC2844AN

(2844AQ ~

UC2844AQ)

(2844AQ ~

UC2844AQ)

(2844AQ ~

UC2844AQ)

UC2845AD

UC2845A

UC2845

AD8

UC2845A

UC2845

Device Marking

(4/5)

UC2844AD

UC2844A

UC2844

AD8

UC2844A

UC2844

AD8

UC2844A

UC2844

AD8

UC2844A

UC2844

AD8

UC2844AD

UC2844AD

UC2844AD

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device

UC2845AD8TR

UC2845AD8TRG4

UC2845ADG4

UC2845ADTR

UC2845ADTRG4

UC2845ADW

UC2845AN

UC2845ANG4

UC3842AD

UC3842AD8

UC3842AD8G4

UC3842AD8TR

UC3842AD8TRG4

UC3842ADG4

UC3842ADTR

12-Sep-2015

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

ACTIVE SOIC D 8

ACTIVE SOIC D 8

2500 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

SOIC

SOIC

SOIC

SOIC

PDIP

PDIP

SOIC

SOIC

SOIC

D

D

D

DW

P

P

D

D

D

14

14

14

16

8

8

14

8

8

50

2500 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

40 Green (RoHS

& no Sb/Br)

50 Green (RoHS

& no Sb/Br)

50

Green (RoHS

& no Sb/Br)

50

75

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

75 Green (RoHS

& no Sb/Br)

ACTIVE SOIC D

ACTIVE

ACTIVE

ACTIVE

SOIC

SOIC

SOIC

D

D

D

8

8

14

14

2500 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

50 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

Lead/Ball Finish

(6)

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

MSL Peak Temp

(3)

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Op Temp (°C)

-40 to 85

-40 to 85

Level-1-260C-UNLIM -40 to 85

Level-1-260C-UNLIM

Level-1-260C-UNLIM

-40 to 85

-40 to 85

Level-2-260C-1 YEAR -40 to 85

N / A for Pkg Type -40 to 85

N / A for Pkg Type

Level-1-260C-UNLIM

Level-1-260C-UNLIM

-40 to 85

0 to 70

0 to 70

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

UC2845AN

UC3842AD

UC3842A

UC3842

AD8

UC3842A

UC3842

AD8

UC3842A

UC3842

AD8

UC3842A

UC3842

AD8

UC3842AD

UC3842AD

Device Marking

(4/5)

AD8

UC2845A

UC2845

AD8

UC2845A

UC2845

AD8

UC2845AD

UC2845AD

UC2845AD

UC2845ADW

UC2845AN

Addendum-Page 5

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device

UC3842ADW

UC3842ADWG4

UC3842AN

UC3842ANG4

UC3842J

UC3843A-W

UC3843AD

UC3843AD8

UC3843AD8G4

UC3843AD8TR

UC3843AD8TRG4

UC3843ADG4

UC3843ADTR

UC3843ADTRG4

UC3843AN

UC3843ANG4

12-Sep-2015

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Status

(1)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Package Type Package

Drawing

Pins Package

Qty

SOIC

SOIC

PDIP

PDIP

DW

DW

P

P

16

16

8

8

40

40

50

50

Eco Plan

(2)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

CDIP JG 8 1 TBD

ACTIVE WAFERSALE

ACTIVE SOIC

ACTIVE SOIC

YS

D

D

0

14

8

3298

50

75

TBD

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

ACTIVE SOIC D 8

ACTIVE SOIC D 8

75 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br)

SOIC

SOIC

SOIC

PDIP

PDIP

D

D

D

P

P

14

14

14

8

8

50 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

50 Green (RoHS

& no Sb/Br)

50 Green (RoHS

& no Sb/Br)

Lead/Ball Finish

(6)

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

A42

Call TI

CU NIPDAU

CU NIPDAU

MSL Peak Temp

(3)

Level-2-260C-1 YEAR

Op Temp (°C)

0 to 70

Level-2-260C-1 YEAR

N / A for Pkg Type

N / A for Pkg Type

0 to 70

0 to 70

0 to 70

N / A for Pkg Type

Call TI

Level-1-260C-UNLIM

Level-1-260C-UNLIM

0 to 70

0 to 70

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

N / A for Pkg Type

N / A for Pkg Type

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

Device Marking

(4/5)

UC3842ADW

UC3842ADW

UC3842AN

UC3842AN

UC3842J

UC3843AD

UC3843A

UC3843

AD8

UC3843A

UC3843

AD8

UC3843A

UC3843

AD8

UC3843A

UC3843

AD8

UC3843AD

UC3843AD

UC3843AD

UC3843AN

UC3843AN

Samples

Addendum-Page 6

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device

UC3844AD

UC3844AD8

UC3844AD8G4

UC3844AD8TR

UC3844AD8TRG4

UC3844ADG4

UC3844ADTR

UC3844ADTRG4

UC3844AN

UC3844ANG4

UC3845AD

UC3845AD8

UC3845AD8G4

UC3845AD8TR

UC3845AD8TRG4

12-Sep-2015

Status

(1)

ACTIVE

ACTIVE

Package Type Package

Drawing

Pins Package

Qty

SOIC

SOIC

D

D

14

8

50

75

Eco Plan

(2)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

ACTIVE SOIC D 8

ACTIVE SOIC D 8

75 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

SOIC

SOIC

SOIC

SOIC

PDIP

PDIP

SOIC

SOIC

D

D

D

D

P

P

D

D

8

14

14

14

8

8

14

8

2500 Green (RoHS

& no Sb/Br)

50 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

50

50

50

75

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

ACTIVE

ACTIVE

ACTIVE

SOIC

SOIC

SOIC

D

D

D

8

8

8

75 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

Lead/Ball Finish

(6)

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

CU NIPDAU

MSL Peak Temp

(3)

Level-1-260C-UNLIM

Op Temp (°C)

0 to 70

Level-1-260C-UNLIM 0 to 70

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

N / A for Pkg Type

N / A for Pkg Type

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

0 to 70

UC3844AN

UC3844AN

UC3845AD

UC3845A

UC3845

AD8

UC3845A

UC3845

AD8

UC3845A

UC3845

AD8

UC3845A

UC3845

Device Marking

(4/5)

UC3844AD

UC3844A

UC3844

AD8

UC3844A

UC3844

AD8

UC3844A

UC3844

AD8

UC3844A

UC3844

AD8

UC3844AD

UC3844AD

UC3844AD

Addendum-Page 7

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

12-Sep-2015

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

AD8

UC3845AD UC3845ADG4

UC3845ADTR

UC3845ADTRG4

ACTIVE

ACTIVE

ACTIVE

SOIC

SOIC

SOIC

D

D

D

14

14

14

50 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

2500 Green (RoHS

& no Sb/Br)

CU NIPDAU

CU NIPDAU

CU NIPDAU

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

0 to 70

0 to 70

0 to 70

UC3845AD

UC3845AD

UC3845AN ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br)

CU NIPDAU N / A for Pkg Type 0 to 70 UC3845AN

UC3845ANG4 ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

CU NIPDAU N / A for Pkg Type

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

0 to 70 UC3845AN

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.

Addendum-Page 8

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

12-Sep-2015

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF UC1842A, UC1843A, UC1844A, UC1845A, UC2843A, UC3842A, UC3842M, UC3843A, UC3844A, UC3845A :

Catalog: UC3842A , UC3843A , UC3844A , UC3845A , UC3842 , UC3845AM

Automotive: UC2843A-Q1

Enhanced Product: UC1842A-EP , UC1843A-EP , UC1844A-EP , UC1845A-EP , UC1842A-EP , UC1843A-EP , UC1844A-EP , UC1845A-EP

• Military: UC1842A , UC1843A , UC1844A , UC1845A

Space: UC1842A-SP , UC1843A-SP , UC1844A-SP , UC1845A-SP , UC1842A-SP , UC1843A-SP , UC1844A-SP , UC1845A-SP

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

• Enhanced Product - Supports Defense, Aerospace and Medical Applications

Military - QML certified for Military and Defense Applications

Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

Addendum-Page 9

www.ti.com

TAPE AND REEL INFORMATION

PACKAGE MATERIALS INFORMATION

9-Apr-2014

*All dimensions are nominal

Device

UC2842AD8TR

UC2842ADTR

UC2842ADWTR

UC2843AD8TR

UC2843ADTR

UC2844AD8TR

UC2844ADTR

UC2844AQD8R

UC2845AD8TR

UC2845ADTR

UC3842AD8TR

UC3842ADTR

UC3843AD8TR

UC3843ADTR

UC3844AD8TR

UC3844ADTR

UC3845AD8TR

UC3845ADTR

Package

Type

Package

Drawing

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

D

D

DW

D

D

D

D

D

D

D

D

D

D

D

D

D

D

D

Pins

8

14

16

8

14

8

14

8

8

14

8

14

8

14

8

14

8

14

SPQ

2500

2500

2500

2500

2500

2500

2500

2500

2500

2500

2000

2500

2500

2500

2500

2500

2500

2500

330.0

330.0

330.0

330.0

330.0

330.0

330.0

330.0

Reel

Diameter

(mm)

Reel

Width

W1 (mm)

330.0

12.4

330.0

330.0

A0

(mm)

B0

(mm)

6.4

5.2

16.4

6.5

9.0

16.4

10.75

10.7

330.0

330.0

330.0

330.0

12.4

16.4

12.4

16.4

6.4

6.5

6.4

6.5

5.2

9.0

5.2

9.0

330.0

330.0

330.0

12.4

12.4

16.4

12.4

16.4

12.4

16.4

12.4

16.4

12.4

16.4

6.4

6.4

6.5

6.4

6.5

6.4

6.5

6.4

6.5

6.4

6.5

9.0

5.2

9.0

9.0

5.2

9.0

5.2

5.2

5.2

9.0

5.2

K0

(mm)

P1

(mm)

W

(mm)

Pin1

Quadrant

2.1

8.0

12.0

2.1

8.0

16.0

2.7

12.0

16.0

2.1

2.1

2.1

2.1

2.1

2.1

2.1

2.1

2.1

2.1

2.1

2.1

2.1

2.1

2.1

8.0

8.0

8.0

8.0

4.0

8.0

8.0

8.0

8.0

8.0

8.0

8.0

8.0

8.0

8.0

12.0

16.0

12.0

16.0

12.0

12.0

16.0

12.0

16.0

12.0

16.0

12.0

16.0

12.0

16.0

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Q1

Pack Materials-Page 1

www.ti.com

PACKAGE MATERIALS INFORMATION

9-Apr-2014

*All dimensions are nominal

Device

UC2842AD8TR

UC2842ADTR

UC2842ADWTR

UC2843AD8TR

UC2843ADTR

UC2844AD8TR

UC2844ADTR

UC2844AQD8R

UC2845AD8TR

UC2845ADTR

UC3842AD8TR

UC3842ADTR

UC3843AD8TR

UC3843ADTR

UC3844AD8TR

UC3844ADTR

UC3845AD8TR

UC3845ADTR

Package Type Package Drawing Pins

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

D

D

D

D

D

D

D

D

D

D

D

D

D

D

D

D

DW

D

8

14

8

14

8

14

8

14

8

14

14

8

14

8

8

14

16

8

SPQ

2500

2500

2500

2500

2500

2500

2500

2500

2500

2500

2500

2500

2000

2500

2500

2500

2500

2500

Length (mm) Width (mm) Height (mm)

340.5

333.2

340.5

333.2

340.5

333.2

340.5

333.2

340.5

333.2

340.5

333.2

367.0

340.5

333.2

340.5

333.2

367.0

338.1

345.9

367.0

338.1

345.9

338.1

345.9

367.0

338.1

345.9

338.1

345.9

338.1

345.9

338.1

345.9

338.1

345.9

20.6

28.6

20.6

28.6

20.6

28.6

20.6

28.6

20.6

28.6

20.6

28.6

38.0

20.6

28.6

20.6

28.6

35.0

Pack Materials-Page 2

JG (R-GDIP-T8)

0.063 (1,60)

0.015 (0,38)

0.100 (2,54)

8

0.400 (10,16)

0.355 (9,00)

5

1

0.280 (7,11)

0.245 (6,22)

4

0.065 (1,65)

0.045 (1,14)

0.020 (0,51) MIN

0.200 (5,08) MAX

Seating Plane

0.130 (3,30) MIN

0.023 (0,58)

0.015 (0,38)

MECHANICAL DATA

MCER001A – JANUARY 1995 – REVISED JANUARY 1997

CERAMIC DUAL-IN-LINE

0.310 (7,87)

0.290 (7,37)

0

°

–15

°

0.014 (0,36)

0.008 (0,20)

4040107/C 08/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a ceramic lid using glass frit.

D. Index point is provided on cap for terminal identification.

E. Falls within MIL STD 1835 GDIP1-T8

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

MECHANICAL DATA

MPLC004A – OCTOBER 1994

PLASTIC J-LEADED CHIP CARRIER FN (S-PQCC-J**)

20 PIN SHOWN

3

D

D1

1 19

Seating Plane

0.004 (0,10)

0.180 (4,57) MAX

0.120 (3,05)

0.090 (2,29)

0.020 (0,51) MIN

0.032 (0,81)

0.026 (0,66)

4 18

D2 / E2

E E1

D2 / E2

8 14

9 13

0.050 (1,27)

0.008 (0,20) NOM

0.021 (0,53)

0.013 (0,33)

0.007 (0,18)

M

NO. OF

PINS

**

52

68

84

20

28

44

D / E D1 / E1 D2 / E2

MIN MAX MIN MAX MIN MAX

0.385 (9,78)

0.485 (12,32)

0.395 (10,03)

0.495 (12,57)

0.350 (8,89)

0.450 (11,43)

0.356 (9,04)

0.456 (11,58)

0.685 (17,40)

0.785 (19,94)

0.695 (17,65)

0.795 (20,19)

0.650 (16,51)

0.750 (19,05)

0.656 (16,66)

0.756 (19,20)

0.985 (25,02)

1.185 (30,10)

0.995 (25,27)

1.195 (30,35)

0.950 (24,13)

1.150 (29,21)

0.958 (24,33)

1.158 (29,41)

0.141 (3,58)

0.191 (4,85)

0.291 (7,39)

0.341 (8,66)

0.441 (11,20)

0.541 (13,74)

0.169 (4,29)

0.219 (5,56)

0.319 (8,10)

0.369 (9,37)

0.469 (11,91)

0.569 (14,45)

4040005 / B 03/95

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-018

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

1

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

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Industrial

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