- Texas Instruments
- Low Power, 1.8/2.5/3.3-V In, 3.3-V CMOS Out Single Schmitt-Trigger Inverter Gate
- Data Sheet
Texas Instruments Low Power, 1.8/2.5/3.3-V In, 3.3-V CMOS Out Single Schmitt-Trigger Inverter Gate Datasheet
Add to my manuals
14 Pages
advertisement
▼
Scroll to page 2
of 14
SN74AUP1T14 www.ti.com SCES802 – APRIL 2010 LOW POWER, 1.8/2.5/3.3-V INPUT, 3.3-V CMOS OUTPUT, SINGLE SCHMITT-TRIGGER INVERTER GATE Check for Samples: SN74AUP1T14 FEATURES 1 • • • • • • • • Single-Supply Voltage Translator Output Level Up to Supply VCC CMOS Level – 1.8 V to 3.3 V (at VCC = 3.3 V) – 2.5 V to 3.3 V (at VCC = 3.3 V) – 1.8 V to 2.5 V (at VCC = 2.5 V) – 3.3 V to 2.5 V (at VCC = 2.5 V Schmitt-Trigger Inputs Reject Input Noise and Provide Better Output Signal Integrity Ioff Supports Partial Power Down (VCC = 0 V) Very Low Static Power Consumption: 0.1 µA Very Low Dynamic Power Consumption: 0.9 µA Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II Pb-Free Packages Available: SC-70 (DCK) 2 x 2.1 x 0.65 mm (Height 1.1 mm) • • More Gate Options Available at www.ti.com/littlelogic ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) DCK PACKAGE (TOP VIEW) NC 1 A 2 GND 3 5 VCC 4 Y DESCRIPTION/ORDERING INFORMATION The SN74AUP1T14 performs the Boolean function Y = A with designation for logic-level translation applications with output referenced to supply VCC. AUP technology is the industry's lowest-power logic technology designed for use in extending battery-life in operating. All input levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCC supply. This product also maintains excellent signal integrity (see Figure 1 and Figure 2). The wide VCC range of 2.3 V to 3.6 V allows the possibility of switching output level to connect to external controllers or processors. Schmitt-trigger inputs (ΔVT = 210 mV between positive and negative input transitions) offer improved noise immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition. Ioff is a feature that allows for powered-down conditions (VCC = 0 V) and is important in portable and mobile applications. When VCC = 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of the device. No damage occurs to the device under these conditions. The SN74AUP1T14 is designed with optimized current-drive capability of 4 mA to reduce line reflections, overshoot, and undershoot caused by high-drive outputs. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated SN74AUP1T14 SCES802 – APRIL 2010 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 85°C (1) (2) (3) SOT (SC-70) – DCK TOP-SIDE MARKING (3) ORDERABLE PART NUMBER Reel of 3000 SN74AUP1T14DCKR Reel of 250 SN74AUP1T14DCKT 6F_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. The actual top-side marking has one additional character that designates the wafer fab/assembly site. FUNCTION TABLE INPUT (Lower Level Input) OUTPUT (VCC CMOS) A Y H L L H Supply VCC = 2.3 V to 2.7 V (2.5 V) INPUTS VT+ max = VIH min VT- min = VIL max A OUTPUT CMOS B Y VIH = 1.1 V VOH = 1.85 V VIL = 0.35 V VOL = 0.45 V Supply VCC = 3 V to 3.6 V (3.3 V) INPUTS VT+ max = VIH min VT- min = VIL max A OUTPUT CMOS B Y VIH = 1.19 V VOH = 2.55 V VIL = 0.5 V VOL = 0.45 V LOGIC DIAGRAM (SCHMITT-TRIGGER INVERTER GATE) A Static-Power Consumption (µA) 2 Y Dynamic-Power Consumption (pF) 3 80% 2.5 60% 3.3-V LVC Logic† 40% Voltage − V 100% 80% 3.3-V 40% Logic† 20% 20% AUP 0% † 0% AUP Single, dual, and triple gates Switching Characteristics at 25 MHz† 3.5 100% 60% 2 1.5 1 Input Output 0.5 0 −0.5 0 5 10 15 20 25 30 Time − ns 35 40 45 † AUP1G08 data at C = 15 pF L Figure 1. AUP – The Lowest-Power Family 2 4 Figure 2. Excellent Signal Integrity Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1T14 SN74AUP1T14 www.ti.com SCES802 – APRIL 2010 3.3 V 3.3 V VIH = 1.19 V VIL = 0.5 V VIH = 1.19 V VIL = 0.5 V 1.8-V System 2.5-V System 3.3-V System 3.3-V System 2.5 V 2.5 V VIH = 1.10 V VIL = 0.35 V VIH = 1.10 V VIL = 0.35 V 1.8-V System 3.3-V System 2.5-V System 2.5-V System Figure 3. Typical Design Examples 3.3 V 1.8-V System 3.3-V System VOH min VT+ max = VIH min = 1.19 V VT− min = V IL max = 0.5 V VOL max Input Switching Waveform Output Switching Waveform Figure 4. Switching Thresholds for 1.8-V to 3.3-V Translation Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1T14 3 SN74AUP1T14 SCES802 – APRIL 2010 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VI Input voltage range (2) –0.5 4.6 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 4.6 V –0.5 VCC + 0.5 (2) UNIT VO Output voltage range in the high or low state IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±20 mA Continuous current through VCC or GND ±50 mA 259 °C/W 150 °C qJA Package thermal impedance (3) Tstg Storage temperature range (1) (2) (3) DCK package –65 V Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current TA Operating free-air temperature (1) 4 MIN MAX 2.3 3.6 V 0 3.6 V VCC V 0 VCC = 2.3 V –3.1 VCC = 3 V –4 VCC = 2.3 V 3.1 VCC = 3 V 4 –40 85 UNIT mA mA °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1T14 SN74AUP1T14 www.ti.com SCES802 – APRIL 2010 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TA = –40°C to 85°C TA = 25°C VCC MIN TYP UNIT MAX MIN MAX VT+ Positive-going input threshold voltage 2.3 V to 2.7 V 0.6 1.1 0.6 1.1 3 V to 3.6 V 0.75 1.16 0.75 1.19 VT– Negative-going input threshold voltage 2.3 V to 2.7 V 0.35 0.6 0.35 0.6 3 V to 3.6 V 0.5 0.85 0.5 0.85 ΔVT Hysteresis (VT+ – VT–) 2.3 V to 2.7 V 0.23 0.6 0.1 0.6 3 V to 3.6 V 0.25 0.56 0.15 0.56 IOH = –20 mA 2.3 V to 3.6 V IOH = –2.3 mA VOH 2.3 V IOH = –3.1 mA IOH = –2.7 mA 3V IOH = –4 mA IOL = 20 mA 1.9 1.85 2.72 2.67 2.6 2.55 3V IOL = 4 mA All inputs 1.97 2.3 V IOL = 3.1 mA IOL = 2.7 mA II VCC – 0.1 2.05 2.3 V to 3.6 V IOL = 2.3 mA VOL VCC – 0.1 VI = 3.6 V or GND V V V V 0.1 0.1 0.31 0.33 0.44 0.45 0.31 0.33 V 0.44 0.45 0 V to 3.6 V 0.1 0.5 mA 0V 0.1 0.5 mA Ioff VI or VO = 0 V to 3.6 V ΔIoff VI or VO = 3.6 V 0 V to 0.2 V 0.2 0.5 mA ICC VI = 3.6 V or GND, IO = 0 2.3 V to 3.6 V 0.5 0.9 mA One input at 0.3 V or 1.1 V, Other inputs at 0 or VCC, IO = 0 2.3 V to 2.7 V 4 One input at 0.45 V or 1.2 V, Other inputs at 0 or VCC, IO = 0 3 V to 3.6 V 12 ΔICC mA Ci VI = VCC or GND 3.3 V 1.5 pF Co VO = VCC or GND 3.3 V 3 pF SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V, VI = 1.8 V ± 0.15 V (unless otherwise noted) (see Figure 5) PARAMETER tpd FROM (INPUT) A TO (OUTPUT) Y CL TA = –40°C to 85°C TA = 25°C MIN TYP MAX MIN MAX 5 pF 1.8 2.3 2.9 0.5 6.8 10 pF 2.3 2.8 3.4 1 7.9 15 pF 2.6 3.1 3.8 1 8.7 30 pF 3.8 4.4 5.1 1.5 10.8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1T14 UNIT ns 5 SN74AUP1T14 SCES802 – APRIL 2010 www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V, VI = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 5) PARAMETER tpd FROM (INPUT) A TO (OUTPUT) Y CL TA = –40°C to 85°C TA = 25°C MIN TYP MAX MIN UNIT MAX 5 pF 1.8 2.3 3.1 0.5 6 10 pF 2.2 2.8 3.5 1 7.1 15 pF 2.6 3.2 5.2 1 7.9 30 pF 3.7 4.4 5.2 1.5 10 ns SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V, VI = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 5) PARAMETER tpd FROM (INPUT) A TO (OUTPUT) Y CL TA = –40°C to 85°C TA = 25°C UNIT MIN TYP MAX MIN MAX 5 pF 2 2.7 3.5 0.5 5.5 10 pF 2.4 3.1 3.9 1 6.5 15 pF 2.8 3.5 4.3 1 7.4 30 pF 4 4.7 5.5 1.5 9.5 ns SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, VI = 1.8 V ± 0.15 V (unless otherwise noted) (see Figure 5) PARAMETER FROM (INPUT) TO (OUTPUT) CL A Y UNIT MIN TYP MAX MIN MAX 1.6 2 2.5 0.5 8 10 pF 2 2.4 2.9 1 8.5 15 pF 2.3 2.8 3.3 1 9.1 30 pF 3.4 3.9 4.4 1.5 9.8 5 pF tpd TA = –40°C to 85°C TA = 25°C ns SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, VI = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 5) PARAMETER tpd 6 FROM (INPUT) A TO (OUTPUT) Y CL TA = –40°C to 85°C TA = 25°C MIN TYP MAX MIN MAX 5 pF 1.6 1.9 2.4 0.5 5.3 10 pF 2 2.3 2.7 1 6.1 15 pF 2.3 2.7 3.1 1 6.8 30 pF 3.4 3.8 4.2 1.5 8.5 Submit Documentation Feedback UNIT ns Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1T14 SN74AUP1T14 www.ti.com SCES802 – APRIL 2010 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, VI = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 5) PARAMETER tpd FROM (INPUT) A TO (OUTPUT) Y CL TA = –40°C to 85°C TA = 25°C MIN TYP MAX MIN MAX 5 pF 1.6 2.1 2.7 0.5 4.7 10 pF 2 2.4 3 1 5.7 15 pF 2.3 2.7 3.3 1 6.2 30 pF 3.4 3.8 4.4 1.5 7.8 UNIT ns OPERATING CHARACTERISTICS TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS f = 10 MHz VCC = 2.5 V VCC = 3.3 V TYP TYP 4 5 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1T14 UNIT pF 7 SN74AUP1T14 SCES802 – APRIL 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION From Output Under Test CL (see Note A) VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V 5, 10, 15, 30 pF VI/2 VCC/2 5, 10, 15, 30 pF VI/2 VCC/2 1 MΩ CL VMI VMO LOAD CIRCUIT VI VMI Input VMI 0V tPHL tPLH VOH VMO Output VMo VOL tPHL tPLH VOH Output VMo VMo VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS NOTES: A. B. C. D. CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns. The outputs are measured one at a time, with one transition per measurement. tPLH and tPHL are the same as tpd. Figure 5. Load Circuit and Voltage Waveforms 8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1T14 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) SN74AUP1T14DCKR ACTIVE Package Type Package Pins Package Drawing Qty SC70 DCK 5 3000 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) CU NIPDAU Level-1-260C-UNLIM (4) -40 to 85 6FF (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 4-Aug-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74AUP1T14DCKR Package Package Pins Type Drawing SC70 DCK 5 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 178.0 9.0 Pack Materials-Page 1 2.4 B0 (mm) K0 (mm) P1 (mm) 2.5 1.2 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 4-Aug-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AUP1T14DCKR SC70 DCK 5 3000 180.0 180.0 18.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated
advertisement
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
Related manuals
advertisement