TVS Diode Arrays Low Capacitance ESD Protection - SP3003 Series (SPA

TVS Diode Arrays Low Capacitance ESD Protection - SP3003 Series (SPA
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
SP3003 Series 0.65pF Rail Clamp Array
RoHS
Pb GREEN
The SP3003 has ultra low capacitance rail-to-rail diodes with
an additional zener diode fabricated in a proprietary silicon
avalanche technology to protect each I/O pin providing a
high level of protection for electronic equipment that may
experience destructive electrostatic discharges (ESD). These
robust diodes can safely absorb repetitive ESD strikes at the
maximum level specified in the IEC 61000-4-2 international
standard (Level 4, ±8kV contact discharge) without
performance degradation. Their very low loading capacitance
also makes them ideal for protecting high speed signal pins
such as HDMI, DVI, USB2.0, and IEEE 1394.
Pinout
Features
SP3003-02X/J
NC
SP3003-04X/J
I/O 1
GND
I/O 2
VCC
I/O 1
I/O 4
GND
VCC
I/O 2
I/O 3
SP3003-04A
• E
SD protection of ±8kV
contact discharge,
±15kV air discharge,
(IEC61000-4-2)
• Low capacitance of
0.65pF (TYP) per I/O
• E
FT protection,
IEC61000-4-4, 40A
(5/50ns)
• C
omplete line of small
packaging helps save
board space (SC70,
SOT553, SOT563,
MSOP10)
• L
ow leakage current of
0.5μA (MAX) at 5V
• L
ightning Protection,
IEC61000-4-5, 2.5A
(8/20µs)
SP3003-08A
I/O 1
NC
I/O 1
I/O 8
I/O 2
NC
I/O 2
I/O 7
VCC
GND
I/O 3
NC
I/O 3
NC
I/O 4
I/O 6
• LCD/ PDP TVs
• Set Top Boxes
I/O 4
NC
GND
I/O 5
• DVD Players
• Mobile Phones
• Desktops
• Notebooks
• MP3/ PMP
• Computer Peripherals
Applications
Functional Block Diagram
SP3003-04J/XTG
6
5
4
SP3003-04ATG
10
9
8
7
• Digital Cameras
6
Application Example
DVI/ HDMI Port
*Package is shown as transparent
D2+
GND
D21
2
3
1
SP3003-02J/XTG
5
4
2
3
4
D1+
5
GND
SP3003-08ATG
10
9
8
7
Vcc/NC
D1-
IC
D0+
6
GND
D0CLK+
Vcc/NC
GND
CLK-
GND
1
2
3
1
2
3
4
5
Signal GND
A single, 4 channel SP3003-04 device can be used to
protect four (4) of the data lines in a HDMI/DVI interface
so two (2) SP3003-04 devices provide protection for all
eight (8) TMDS lines.
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
GND
95
Revision: June 14, 2011
SP3003 Series
SP3003
Description
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
Value
IPP
Peak Current (tp=8/20μs)
TOP
TSTOR
Parameter
Rating
Units
-65 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
Units
2.5
A
Operating Temperature
-40 to 85
°C
Storage Temperature
-50 to 150
°C
Storage Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
Max
Units
Reverse Standoff Voltage
Parameter
VRWM
IR ≤ 1µA
6
V
Reverse Leakage Current
ILEAK
VR=5V
0.5
µA
Clamp Voltage1
VC
ESD Withstand Voltage1
VESD
Diode Capacitance1
CI/O-GND
Diode Capacitance1
CI/O-I/O
Min
Typ
IPP=1A, tp=8/20µs, Fwd
10.0
12.0
V
IPP=2A, tp=8/20µs, Fwd
11.8
15.0
V
IEC61000-4-2 (Contact)
±8
kV
IEC61000-4-2 (Air)
±15
Reverse Bias=0V
0.7
0.8
0.95
pF
Reverse Bias=1.65V
0.55
0.65
0.8
pF
kV
Reverse Bias=0V
0.35
pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Insertion Loss (S21) I/O to GND
Capacitance vs. Bias Voltage
1
1.00
0
0.95
0.90
-2
I/O Capacitance (pF)
Insertion Loss [dB]
-1
-3
-4
-5
-6
-7
VCC = Float
0.75
0.70
VCC = 3.3V
0.65
VCC = 5V
0.55
-9
0.50
-10
1.E+07
1.E+08
1.E+09
0.0
1.E+10
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
I/O DC Bias (V)
Frequency [Hz]
SP3003 Series
0.80
0.60
-8
1.E+06
0.85
96
Revision: June 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
Product Characteristics
1.4E-12
Lead Plating
Matte Tin (SC70-x, MSOP-10) Pre-Plated
Frame (SOT5x3)
1.2E-12
Lead Material
Copper Alloy
1E-12
Lead Coplanarity
0.0004 inches (0.102mm)
8E-13
Subsitute Material
Silicon
6E-13
Body Material
Molded Epoxy
Flammability
UL94-V-0
4E-13
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
2E-13
0
1.E+06
1.E+07
1.E+08
SP3003
Capacitance [F]
Capacitance vs. Frequency
1.E+09
Frequency [Hz]
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
260
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
time to peak temperature
Time
°C
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
25
Peak Temperature (TP)
+0/-5
tP
TP
Temperature
Reflow Condition
97
Revision: June 14, 2011
SP3003 Series
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
Package Dimensions — SC70-5
5
6
Package
e
e
Solder Pad Layout
4
not used
E
5
JEDEC
MO-203 Issue A
Millimeters
3
2
1
HE
SC70-5
Pins
B
D
A2 A
A1
C
Min
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
e
L
Inches
0.65 BSC
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package Dimensions — SC70-6
e
e
6
5
4
E
1
2
Package
SC70-6
Pins
6
Solder Pad Layout
JEDEC
HE
MO-203 Issue A
Millimeters
B
D
A2 A
A1
C
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
e
L
Inches
Min
3
0.65 BSC
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package Dimensions — SOT553
A
D
6
5
(not used)
2
4
3
e
E
Package
L
HE
5
Millimeters
Solder Pad Layout
c
Min
Max
Min
Max
0.60
0.020
0.024
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
e
98
Revision: June 14, 2011
Inches
0.50
A
B
SP3003 Series
SOT 553
Pins
0.50 BSC
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
Package Dimensions — SOT563
6
5
2
4
E
Package
L
e
6
Millimeters
Solder Pad Layout
HE
3
SOT 563
Pins
c
B
Inches
Min
Max
Min
Max
A
0.50
B
0.17
0.60
0.020
0.024
0.27
0.007
c
0.011
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
0.50 BSC
e
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
Package Dimensions — MSOP10
Package
MSOP10
Pins
10
Millimeters
Solder Pad Layout
Max
Min
Max
A
-
1.10
-
0.043
A1
0.00
0.15
0.000
0.006
B
0.17
0.27
0.007
0.011
c
0.08
0.23
0.003
0.009
D
2.90
3.10
0.114
0.122
E
4.67
5.10
0.184
0.200
E1
2.90
3.10
0.114
0.122
e
HE
SP3003-0X X T G
0.40
0.020 BSC
0.80
0.016
0.031
Part Number
Package
Marking
Min. Order Qty.
G= Green
SP3003-02JTG
SC70-5
HX2
3000
T= Tape & Reel
SP3003-02XTG
SOT553
HX2
5000
SP3003-04ATG
MSOP-10
FX4
4000
SP3003-04JTG
SC70-6
FX4
3000
SP3003-04XTG
SOT563
FX4
5000
SP3003-08ATG
MSOP-10
FX8
4000
Package
A = MSOP-10, 4000 quantity
J = SC70-5 or SC70-6, 3000 quantity
X = SOT553 or SOT563, 5000 quantity
Number of Channels
0.50 BSC
Ordering Information
Part Numbering System
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
Series
Inches
Min
-02 = 2 channel
(SC70-5, SOT553 packages)
-04 = 4 channel
(SC70-6, SOT563, MSOP-10 packages)
-08 = 8 channel
(MSOP-10 packages)
Part Marking System
XXX
XXX
Product Series
(varies) F, H or P =
SP3003 series
Number of Channels
(varies) 2 or 4
Assembly Site
(varies)
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
99
Revision: June 14, 2011
SP3003 Series
SP3003
A
D
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3003 Series
Embossed Carrier Tape & Reel Specification — MSOP-10
Millimetres
Inches
Min
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
5.40
5.60
0.213
0.220
D
1.50
1.60
0.059
0.063
1.50 Min
D1
P0
10P0
0.059 Min
3.90
4.10
40.0+/- 0.20
0.154
0.161
1.574+/-0.008
W
11.90
12.10
0.469
0.476
P
7.90
8.10
0.311
0.319
A0
5.20
5.40
0.205
0.213
B0
3.20
3.40
0.126
0.134
K0
1.20
1.40
0.047
0.055
t
0.30 +/- 0.05
0.012+/- 0.002
Millimetres
Inches
Embossed Carrier Tape & Reel Specifications — SC70-5 and SC70-6
Min
Max
Min
Max
E
1.65
1.85
0.064
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
10P0
40.0+/- 0.20
1.574+/-0.008
W
7.70
8.10
0.303
P
3.90
4.10
0.153
0.161
A0
2.14
2.34
0.084
0.092
B0
2.24
2.44
0.088
0.960
K0
1.12
1.32
0.044
0.052
0.27 max
t
0.318
0.010 max
Embossed Carrier Tape & Reel Specifications — SOT553 and SOT563
Millimetres
Max
Min
Max
E
1.65
1.85
0.064
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.076
0.081
D
1.40
1.60
0.055
0.063
D1
0.45
0.55
0.017
0.021
P0
3.90
4.10
0.154
0.161
10P0
100
Revision: June 14, 2011
40.0+/- 0.20
1.574+/-0.008
W
7.70
8.10
0.303
P
3.90
4.10
0.153
0.161
A0
1.73
1.83
0.068
0.072
0.318
B0
1.73
1.83
0.068
0.072
K0
0.64
0.74
0.025
0.029
t
SP3003 Series
Inches
Min
0.22 max
0.009 max
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement