Toshiba Qosmio X500 computer Maintenance Manual
Below you will find brief information for Qosmio X500. The Qosmio X500 sports a variety of features including a DVD Super Multi drive, a high-performance processor, and a high-resolution display. It is designed for multimedia use and offers a number of multimedia features, such as a built-in microphone, speakers, and a web camera. The Qosmio X500 is a robust and reliable laptop that is perfect for users who need a powerful and versatile device.
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Toshiba Personal Computer
Qosmio X500
Maintenance Manual
TOSHIBA CORPORATION
File Number 960-Q08
Qosmio X500
Maintenance Manual (960-Q08)
Copyright
© 200
9 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein.
Toshiba Personal Computer Qosmio X500 Maintenance Manual
First edition Aug. 2009
Disclaimer
The information presented in this manual has been reviewed and validated for accuracy. The included set of instructions and descriptions are accurate for the Qosmio X500 series at the time of this manual's production. However, succeeding computers and manuals are subject to change without notice. Therefore, Toshiba assumes no liability for damages incurred directly or indirectly from errors, omissions, or discrepancies between any succeeding product and this manual.
Trademarks
Intel, Intel SpeedStep, Intel Core, Pentium and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries/regions.Windows and Microsoft are registered trademarks of Microsoft
Corporation.
Other trademarks and registered trademarks not listed above may be used in this manual.
Qosmio X500
Maintenance Manual (960-Q08)
Preface
This maintenance manual describes how to perform hardware service maintenance for the
Toshiba Personal Computer Qosmio X500 Series.
The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
SAFETY PRECAUTIONS
Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
DANGER: “Danger” indicates the existence of a hazard that could result in death or serious bodily injury, if the safety instruction is not observed.
WARNING: “Warning” indicates the existence of a hazard that could result in bodily injury, if the safety instruction is not observed.
CAUTION: “Caution” indicates the existence of a hazard that could result in property damage, if the safety instruction is not observed.
NOTE: “Note” contains general information that relates to your safe maintenance service.
Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.
Be sure to fasten screws securely with the right screwdriver. If a screw is not fully fastened, it could come loose, creating a danger of a short circuit, which could cause overheating, smoke or fire.
If you replace the battery pack or RTC battery, be sure to use only the same model battery or an equivalent battery recommended by Toshiba. Installation of the wrong battery can cause the battery to explode.
Qosmio X500
Maintenance Manual (960-Q08)
The manual is divided into the following parts:
Chapter 1 Hardware Overview describes the Qosmio X500 system unit and each
FRU.
Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve
FRU problems.
Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service.
Chapter 4 Replacement Procedures describes the removal and replacement of the
FRUs.
Appendices The appendices describe the following:
Handling the LCD Module
Board layout
Pin assignments
Keyboard scan/character codes
Key layout
Wiring diagrams
Qosmio X500
Maintenance Manual (960-Q08)
Conventions
This manual uses the following formats to describe, identify, and highlight terms and operating procedures.
Acronyms
On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example:
Read Only Memory (ROM)
Keys
Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Key operation
Some operations require you to simultaneously use two or more keys. We identify such operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause
(Break) means you must hold down Ctrl and at the same time press Pause (Break). If three keys are used, hold down the first two and at the same time press the third.
User input
Text that you are instructed to type in is shown in the boldface type below:
DISK COPY A: B:
The display
Text generated by the computer that appears on its display is presented in the typeface below:
Format complete
System transferred
Qosmio X500
Maintenance Manual (960-Q08)
Table of Contents
Chapter 1 Contents
1.1 Features ..........................................................................................................................1
1.2 System Block Diagram ..................................................................................................5
1.3 2.5-inch Hard Disk Drive...............................................................................................8
1.5 Keyboard......................................................................................................................16
1.6 TFT Color Display.......................................................................................................17
1.6.1 LCD Module With CCFL Backlight...........................................................17
1.6.2 CCFL Inverter Board ..................................................................................19
1.8 Batteries .......................................................................................................................21
1.8.1 Main Battery ...............................................................................................21
1.8.2 Battery Charging Control............................................................................22
1.8.3 RTC battery.................................................................................................24
Qosmio X500
Maintenance Manual (960-Q08)
Chapter 2 Troubleshooting Procedures
2.1 Troubleshooting ............................................................................................................ 1
2.2 Troubleshooting Flowchart........................................................................................... 3
2.3 Power Supply Troubleshooting..................................................................................... 7
Procedure 1 Power Status Check .......................................................................... 7
Procedure 2 Connection Check ............................................................................. 9
Procedure 3 Charging Check .............................................................................. 10
Procedure 4 Replacement Check ........................................................................ 1
1
2.4 System Board Troubleshooting................................................................................... 1
2
Procedure 1 Message Check ............................................................................... 1
3
Procedure 2 Debugging Port Check .................................................................... 1
4
Procedure 3 Replacement Check ........................................................................ 14
2.5 USB FDD Troubleshooting ........................................................................................ 15
Procedure 1 FDD Head Cleaning Check ............................................................ 15
Procedure 2 Diagnostic Test Program Execution Check .................................... 16
Procedure 3 Connector Check and Replacement Check..................................... 17
2.6 2.5” HDD Troubleshooting......................................................................................... 19
Procedure 1 Partition Check................................................................................ 19
Procedure 2 Message Check ............................................................................... 20
Procedure 3 Format Check.................................................................................. 21
Procedure 4 Diagnostic Test Program Execution Check .................................... 22
Procedure 5 Connector Check and Replacement Check..................................... 23
2.7 Keyboard Troubleshooting ......................................................................................... 24
Procedure 1 Diagnostic Test Program Execution Check .................................... 24
Procedure 2 Connector Check and Replacement Check..................................... 25
2.8 Touch pad Troubleshooting ........................................................................................ 26
Procedure 1 Diagnostic Test Program Execution Check .................................... 26
Procedure 2 Connector Check and Replacement Check..................................... 27
Qosmio X500
Maintenance Manual (960-Q08)
2.9 Display Troubleshooting..............................................................................................28
Procedure 1 External Monitor Check...................................................................28
Procedure 2 Diagnostic Test Program Execution Check .....................................28
Procedure 3 Connector and Cable Check ............................................................29
Procedure 4 Replacement Check .........................................................................30
2.10 Optical Disk Drive Troubleshooting............................................................................31
Procedure 1 Diagnostic Test Program Execution Check .....................................31
Procedure 2 Connector Check and Replacement Check......................................31
2.11 Modem Troubleshooting..............................................................................................32
Procedure 1 Diagnostic Test Program Execution Check .....................................32
Procedure 2 Connector Check and Replacement Check......................................32
2.12 LAN Troubleshooting..................................................................................................34
Procedure 1 Diagnostic Test Program Execution Check .....................................34
Procedure 2 Connector Check and Replacement Check......................................34
2.13 Wireless LAN Troubleshooting...................................................................................35
Procedure 1 Transmitting-Receiving Check ........................................................35
Procedure 2 Antennas' Connection Check ...........................................................36
Procedure 3 Replacement Check .........................................................................37
Procedure 1 Connector Check..............................................................................38
Procedure 2 Replacement Check .........................................................................39
Procedure 1 Diagnostic Test Program Execution Check .....................................40
Procedure 2 Connector Check and Replacement Check.....................................40
Procedure 1 Connector Check and Replacement Check.....................................41
Qosmio X500
Maintenance Manual (960-Q08)
Chapter 3 Diagnostic Programs
3.1 Tests and Diagnostics Software Overview .............. 3-Error! Bookmark not defined.
3.2 Executing the Diagnostic Test ................................. 3-Error! Bookmark not defined.
3.3 Subtest names........................................................... 3-Error! Bookmark not defined.
3.4 System Test .............................................................. 3-Error! Bookmark not defined.
3.5 Memory Test ............................................................ 3-Error! Bookmark not defined.
3.6 Keyboard Test .......................................................................................................... 3-22
3.7 Display Test ............................................................................................................. 3-25
3.8 Floppy Disk Test...................................................................................................... 3-40
3.9 Hard Disk Test ......................................................................................................... 3-42
3.10 Real Time Clock Test .............................................................................................. 3-45
3.11 Cache Memory Test ................................................. 3-Error! Bookmark not defined.
3.12 High Resolution Display Test.................................. 3-Error! Bookmark not defined.
3.13 Multimedia Test ....................................................................................................... 3-55
3.14 MEMORY2 Test...................................................... 3-Error! Bookmark not defined.
3.15 Error Codes and Error Status Names ....................... 3-Error! Bookmark not defined.
3.16 Running Test ............................................................................................................ 3-60
3.17 DMI INFOEMATION ............................................. 3-Error! Bookmark not defined.
3.17.1 Check DMI Information .............. 3-Error! Bookmark not defined.
3.17.2 Write DMI Information................ 3-Error! Bookmark not defined.
3.18 Log Utilities ............................................................................................................. 3-63
3.18.1 Operations .................................................................................... 3-63
3.19 System Configuration .............................................................................................. 3-65
3.20 Running Test Edit Item............................................ 3-Error! Bookmark not defined.
3.21 Common Tests and Operation ................................. 3-Error! Bookmark not defined.
3.21.1 How to operate a window ............ 3-Error! Bookmark not defined.
3.21.2
3.21.3
3.21.4
3.21.5
How to Stop the Test Program..... 3-Error! Bookmark not defined.
Test Status Screen ........................ 3-Error! Bookmark not defined.
Test Stop Display......................................................................... 3-70
How to enter data ......................................................................... 3-70
Qosmio X500
Maintenance Manual (960-Q08)
Chapter 4 Replacement Procedures
4.1 Overview.................................................................................................................... 4-1
Safety Precautions................................................................................................ 4-2
Before You Begin ................................................................................................ 4-3
Disassembly Procedure........................................................................................ 4-4
Assembly Procedure ............................................................................................ 4-5
Tools and Equipment ........................................................................................... 4-5
Screw Tightening Torque .................................................................................... 4-6
Grip Color…. ......... ……………………………………………………………..4-6
Screw Notation .................................................................................................... 4-7
4.5 Optical disk drive..................................................................................................... 4-16
4.6 Slot in optical disk drive .......................................................................................... 4-18
4.7 HDD(SECOND HDD)............................................................................................ 4-21
4.9 Keyboard.................................................................................................................. 4-28
4.10 Wireless LAN card .................................................................................................. 4-31
4.11 Bluetooth module..................................................................................................... 4-34
4.12 TV Tuner card.......................................................................................................... 4-35
4.14 Top Cover assembly ................................................................................................ 4-42
4.16 USB Board ............................................................................................................... 4-48
4.17 B CAS Board ........................................................................................................... 4-49
4.18 System Board ...........................................................................................................4-
50
4.19 CPU..........................................................................................................................4-
54
4.20 LCD unit / FL inverter ............................................................................................. 4-57
Qosmio X500
Maintenance Manual (960-Q08)
4.21 Web Camera module................................................................................................ 4-62
4.22 Speaker Box ............................................................................................................. 4-64
4.23 Application for thermal pad and grease on CPU, North Bridge, and VGA
Board………………………………………………………………………….........4-
67
Qosmio X500
Maintenance Manual (960-Q08)
Appendices
Appendix A Handling the LCD Module ........................................................................... A-1
Appendix B Board Layout .................................................................................................B-1
Appendix C Pin Assignments.............................................................................................C-1
Appendix D Keyboard Scan/Character Codes .................................................................. D-1
Appendix E Key Layout.....................................................................................................E-1
Appendix F Wiring Diagrams............................................................................................ F-1
Qosmio X500
Maintenance Manual (960-Q08)
Qosmio X500
Maintenance Manual (960-Q08)
Chapter 1
Hardware Overview
Qosmio X500
Maintenance Manual (960-Q08)
Chapter 1
1 Hardware Overview
Chapter 1 Contents
Hardware Overview
1.1 Features..........................................................................................................................1
1.2 System Block Diagram ..................................................................................................5
1.3 2.5-inch Hard Disk Drive...............................................................................................8
1.5 Keyboard......................................................................................................................16
1.6 TFT Color Display.......................................................................................................17
1.6.1 LCD Module With CCFL Backlight......................................................17
1.6.2 CCFL Inverter Board .............................................................................19
1.8 Batteries .......................................................................................................................21
1.8.2 Battery Charging Control .......................................................................22
Qosmio X500
Maintenance Manual (960-Q08)
ii
Hardware Overview Chapter 1
Figures
Figure 1-1-1 Front of the computer.........................................................................................4
Figure 1-2-1 System block diagram for AMD platform .........................................................5
Figure 1-3-1 2.5-inch HDD Disk Drive ..................................................................................8
Figure 1-4-1 DVD Super Muti drive.....................................................................................11
Figure 1-5-1 Keyboard for US Style.....................................................................................16
Figure 1-5-2 Keyboard for UK Style ....................................................................................16
Figure 1-6-1 SAMSUNG LCD Module................................................................................17
Tables
Table 1-3-2 2.5-inch HDD dimensions .................................................................................8
Table 1-3-3 2.5-inch HDD specifications..............................................................................9
Table 1-4-2 DVD Super Multi drive outline dimensions ....................................................12
Table 1-4-3 HLDS DVD Super Multi drive specifications .................................................13
Table 1-4-4 Panasonic DVD Super Multi drive specifications ...........................................14
Table 1-4-5 TSST DVD Super Multi drive specifications ..................................................15
Table 1-6-2 LCD module specifications..............................................................................18
Table 1-6-3 FL inverter board specifications ......................................................................19
Table 1-7-1 Power supply output rating ..............................................................................20
Table 1-8-1 Battery specifications.......................................................................................21
Table 1-8-2 Time required for charges of main battery ......................................................22
Table 1-8-3 Data retaining time...........................................................................................23
Table 1-8-4 Time required for charges of RTC battery.......................................................24
Table 1-9-1 AC adapter specifications ................................................................................25
Qosmio X500
Maintenance Manual (960-Q08) iii
Chapter 1 Hardware Overview
Features
1.1 Features
The Qosmio X500 features are listed below.
Microprocessor
Microprocessor that is used will be different by the model.
It supports processors as follows
Intel® Core(TM) i7-720QM processor
1.6GHZ,1.73GHz
Additional processor may be introduced
Memory
Two DDR3 SO-DIMM (1066MHz specification compliant) used and be up to 4GB which can be upgraded through Memory Module Slot. Maximum upgradeable system memory may depend on the model
VRAM
Shared with System memory for Intel PM55.
HDD
5400rpm: 250GB, 320GB, 400GB, 500GB, internal drives. 2.5 inch x 9.5mm height.
USB FDD
Toshiba external USB FDD for option
Display
18.4” Wide WXGA
1-Lamp HD+ ( 1680 x 945) CSV only (Typical 200 NIT brightness)
2-Lamp FHD ( 1920 x 1080) CSV only (Typical 300 NIT brightness)
External monitor
Supported via a RGB or HDMI connector.
Keyboard
Qosmio X500
Maintenance Manual (960-Q08)
1
Chapter 1 Hardware Overview
Keyboard module has104/105/109 keys. It supports Windows keys and application keys.
New Dummy card slot
The new card slot (dummy card) accommodates express card.
Optical devices
A DVD Super Multi drive is equipped.
Battery
The RTC battery is equipped inside the computer.
The main battery is a detachable lithium ion battery.
12 cell Li-Ion 10.8v
USB (Universal Serial Bus)
4 USB ports are provided. The ports comply with the USB2.0 standard,
USB Sleep and Charge function can be supported by only one port of the left side.(mode 1-4)
If USB Sleep and Charge function is enabled, the computer’s battery will discharge during hibernation or when the computer is turned off. It is recommended that user connect the AC adaptor to the computer when enabling the USB Sleep and Charge function.ESATA
One ESATA port is equipped.
Sound system
Internal stereo speaker, Internal MIC external monaural microphone connector, stereo headphone connector.
Wireless LAN
Some computers in this series are equipped with a Wireless LAN card.
LAN/MODEM
Connectors for LAN and Modem are separately mounted.
1394
One 1394 port is equipped.
2
Qosmio X500
Maintenance Manual (960-Q08)
Chapter 1 Hardware Overview
Bridge media slot
XD/MS/MS pro/SD/MMC are supported
Bluetooth
Some computers in this series offer Bluetooth wireless communication functionality.
This module is Version 2.1+EDR.
Security
Kensington Lock,
Fingerprint –Enhanced Lock is also equipped.
HDD password
HDD security function
Qosmio X500
Maintenance Manual (960-Q08)
3
Chapter 1 Hardware Overview
1. Web Camera LED* 2. Web Camera*
3. Built-in microphone* 4. Wireless LAN/Wireless WAN Antennas (Not shown)
5. Speaker 6. Touch Pad
7. Fingerprint Sensor* 8. Touch Pad Control Buttons
9. Display Screen 10. Speaker
11. Power Button* 12. Internet Button*
13. CD/ DVD Button* 14. Previous Button*
15. Volume Down Button* 16. Mute Button*
17. Play/Pause Button* 18. Next Button* 19. Volume Up Button*
Figure 1-1-1 Front of the computer
4
Qosmio X500
Maintenance Manual (960-Q08)
1.2 System Block Diagram
Figure 1-2-1 shows the system block diagram.
Chapter 1 Hardware Overview
Figure 1-2-1 System block diagram for Intel Platform
Qosmio X500
Maintenance Manual (960-Q08)
5
Chapter 1 Hardware Overview
The PC contains the following components.
CPU
Intel® Core(TM) i7-720QM processor
1.6GHz, 1.73GHz
Memory
DDR3-1066MHz 1GB, 2GB or 4GB memory modules
200-pin SO-DIMM
1.8V operation
BIOS ROM (Flash memory)
16Mbit
Chipset
North Bridge
Penryn processor System Bus support
DRAM Controller : DDR3 1066MHz support
DMI
1299-ball 35 x 35mm Mirco FC-BGA Package
South Bridge
Direct Media Interface (DMI)
PCI Express
Serial ATA Controller
PCI Interface
Low Pin count (LPC) interface
Serial Peripheral Interface (SPI)
DMA controller
Advanced Programmable Interrupt Controller (APIC)
USB Controllers
Gigabit Ethernet Controller
RTC
GPIO
Enhanced Power Management
SMBus 2.0
High Definition Audio Controller
676-pin 31mmx31mm mBGA Package
6
Qosmio X500
Maintenance Manual (960-Q08)
Chapter 1 Hardware Overview
Other main system chips
• Clock Generator
• EC/KBC –[W/CIR(Winbond WPCE775CA0DG)] –[WO/CIR(Winbond
WPCE775LA0DG)]
• HD Audio (CONEXANT CX20583-10Z)
• Card Reader controller (O2 OZ888GS0LN)
• 10/100 LAN controller (Atheros AR8132M)
• Giga LAN controller (Atheros AR8131M)
Mini Card
Wireless LAN (BTO)
DSSS/OFDM LAN card is equipped. Conformity with IEEE 802.11b/g, IEEE
802.11 a/g/n or IEEE 802.11a/b/g..
MODEM (Conexant x 1)
Supported by on board Modem + DAA daughter card.
Data and FAX transmission is available.
Supports ITU-TV.92.
The transfer speed of data receiving is 56kbps, of data sending is 33.6kbps and of
FAX is 14.4kbps. Actual speed depends on the quality of the line used.
Connected to telephone line through RJ11 MOD
Bluetooth
Bluetooth V2.1+EDR. (BTO)
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Chapter 1 Hardware Overview
1.3 2.5-inch Hard Disk Drive
A compact, high-capacity HDD with a height of 9.5mm. Contains a 2.5-inch magnetic disk and magnetic heads.
Figure 1-3-1 shows a view of the 2.5-inch HDD and Tables 1-3-2 and 1-3-3 list the specifications.
Figure 1-3-1 2.5-inch HDD
Parameter
Outline dimens ions
Width (mm)
Height
(mm)
Depth (mm)
Weight (g)
Parameter
Table 1-3-2 2.5-inch HDD dimensions
Standard value
TOSHIBA
MK1655G
SX
FUJITSU
MJA2160B
H
TOSHIBA
MK2555G
SX
TOSHIBA
MK3255GS
X
TOSHIBA
MK4055G
SX
TOSHIBA
MK3263G
SX
TOSHIB
A
MK5055
GSX
69.85 +/- 0.25
9.5
100.2 +/- 0.25
101
//10
2
101//102
FUJITSU
MJA2250BH
Standard value
FUJITSU
MJA2320B
H
100
FUJITSU
MJA240
0BH
FUJITSU
MJA2500BH
Outline dimensi ons
Width
(mm)
Height
(mm)
Depth
(mm)
Weight
(g)
9.5
70
101(Max)
8
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Chapter 1 Hardware Overview
Parameter
HITACHI
HTS545016B9A
300
HITACHI
Standard value
HITACHI HITACHI
HTS545025B9
A300
HTS545032
B9A300
HTS545040
B9A300
HITACHI
HTS545050B9A
300
Outlin e dimen sions
Width (mm)
Height (mm)
Depth (mm)
Weight (g)
95 (max.)
69.85 +/- 0.25
9.5
100.2 +/- 0.25
95 (max.) 102 (max.)
Parameter
Storage size (formatted)
Speed (RPM)
Data transfer Rate
- To/From Media
- T0/From Host
Table 1-3-3 2.5-inch HDD specifications
TOSHIBA
MK1655GSX
Specification
TOSHIBA
MK2555GS
X
TOSHIBA
MK3255G
SX
5,400
363~952 typical
3Gbps (150MB/s)
102 (max.)
TOSHIBA
MK4055G
SX
TOSHIBA
MK5055G
SX
400 500GB
3Gbps(150MB/s) bus transfer rate (MB/s)
Average random seek time
(read) (ms)
Power-on-to-ready (sec)
12
3.5(typ)/9.5(Max)
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Chapter 1 Hardware Overview
Parameter
Storage size
(formatted)
Speed (RPM)
Data transfer Rate
- To/From Media
- T0/From Host bus transfer rate
(MB/s)
Average random seek time (read)
(ms)
Power-on-to-ready
(sec)
Specification
FUJITSU
MJA2160BH
FUJITSU
MJA2250BH
FUJITSU
MJA2320BH
FUJITSU
MJA2400BH
FUJITSU
MJA2500BH
160GB 250GB 320GB 400GB 500GB
5,400
363~952 typical
3Gbps (150MB/s)
3Gbps(150MB/s)
12.0ms/14.0ms
4.0(typ9.5(Max)
Parameter
Specification
HITACHI
HTS545016B
9A300
HITACHI
HTS545025B9
A300
HITACHI
HTS545032
B9A300
HITACHI
HTS545040
B9A300
HITACHI
HTS545050B9A
300
Storage size (formatted)
Speed (RPM)
Data transfer Rate
- To/From Media
- T0/From Host bus transfer rate (MB/s)
5,400
875MB/s Max.
3Gbps
875MB/s Max.
3Gbps
11 Average random seek time
(read) (ms)
Power-on-to-ready (sec) 3.5 sec
10
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Maintenance Manual (960-Q08)
Chapter 1 Hardware Overview
1.4 Optical Drive (HD DVD-ROM & CD-R/RW Drive)
The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch)
CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM. It is a high-performance drive that reads DVD-ROM at maximum 8-speed and CD at maximum 24-speed. Write speed of
DVD±R/±RW and DVD-RAM is different depending on the drive.
The DVD Super Multi drive is shown in Figure 1-4-1. The dimensions and specifications of the DVD Super Multi drive are described in Table 1-4-2, Table 1-4-3, Table 1-4-4, Table 1-
4-5.
Figure 1-4-1 DVD Super Multi drive
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Chapter 1 Hardware Overview
Table 1-
4-2
DVD Super Multi drive outline dimensions
Maker
Outline dimensions
Width (mm)
Height (mm)
Depth (mm)
Mass (g)
HLDS
(GT20N-ATAK7N7 )
128
12.7
127
168
HLDS
(GT20F-ATAK7N7)
Maker
Outline dimensions
Width (mm)
Height (mm)
Depth (mm)
Mass (g)
Panasonic
(UJ240/J890ADTJR-A)
128
12.7
129
185
Panasonic
(UJ141/UJ890EDTJR-A)
TSST
(TS-L633C)
TSST
(TS-L633Y)
Maker
Outline dimensions
Width (mm)
Height (mm)
Depth (mm)
Mass (g)
128
12.7
127
165
12
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Chapter 1 Hardware Overview
Table 1-
4-3
HLDS DVD Super Multi drive specifications
Parameter
Label Flash Function
Data transfer speed
Read
Write
Burst
Transfer mode
Access time
(ms) (Random)
Buffer memory
HLDS Drive Specification
GT20N-ATAK7N7 GT20F-ATAK7N7
No support Support
DVD-ROM 8x max.
DVD-R(SL/DL) 8x/4x max.
DVD+R(SL/DL) 8x/4x max.
DVD-RW 8x max.
DVD+RW 8x max.
DVD-RAM (Ver.1.0) 2x
(Ver.2.2) 2x, 3x, 5x
DVD-Video 4x max. (Single/Dual layer)
CD-R/RW/ROM 24x/24x/24x max.
CD-DA (DAE: Ripping/Play) 20x/20x max.
DVD-R 2x CLV, 4x ZCLV, 8x CAV
DVD-R DL 2x CLV, 4x ZCLV
DVD-RW 1x, 2x CLV, 4x, 6x ZCLV
DVD-RAM 2x, 3x ZCLV, 5x PCAV(Ver.2.2)
(16x Media: Not support)
DVD+R 2.4x CLV, 4x ZCLV, 8x CAV
DVD+R DL 2.4x CLV, 4x ZCLV
DVD+RW .4x, 3.3x CLV, 4x ZCLV, 8x
ZCLV
CD-R
(8x Speed disc: 3.3x CLV, 8x ZCLV)
10x CLV, 16x, 24x ZCLV
CD-RW
4x, 10x CLV, 16x ZCLV
PIO mode4/Multi word mode2/Ultra DMA mode2
2MB
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Chapter 1 Hardware Overview
Table 1-
4-4
Panasonic DVD Super Multi drive specifications
Data transfer speed
Parameter
Label Flash Function
Read
Write
Burst Transfer mode
Access time
(ms) (Random)
Buffer memory
Panasonic Drive Specification
UJ240/UJ890ADTJR-A UJ141/UJ890EDTJR-A
No support Support
DVD-ROM :Max 8X CAV
CD-ROM :Max 24X CAV
CD-R :Max24X CAV
CD-RW :4X CLV
High Speed CD-RW :10XCLV
Ultra Speed CD-RW :Max 16X Zone CLV
DVD-R :Max.8X CAV
DVD-R DL :Max.4X Zone CLV
DVD-RW :Max.6X Zone CLV
DVD+R :Max.8X CAV
DVD+R DL :Max.4X Zone CLV
DVD+RW :Max.8X Zone CLV
DVD-RAM :3-5X ZCLV ( 4.7GB)
PIO mode4/Multi word mode2/Ultra DMA mode2
2MB
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Table 1-
4-5
TSST DVD Super Multi drive specifications
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1.5 Keyboard
The
Qosmio X500 keyboard has two different kinds of placement, one is for US style and the other is for UK style.
Figure 1-5-1 is a view of the keyboard for US style
Figure 1-5-1 Keyboard for US style
Figure 1-5-2 is a view of the keyboard for UK style
Figure 1-5-2 Keyboard for UK style
See Appendix E for details of the keyboard layout
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1.6 TFT Color Display
The Qosmio X500 Ganel use CCFL to control backlight.
1.6.1 LCD Module with CCFL Backlight
Figure 1-6-1 shows a view of the LCD module and Table 1-6-2 lists the specifications.
Figure 1-6-1 SAMSUNG LCD Module
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Chapter 1 Hardware Overview
Item
Number of Pixel
Dot spacing (mm)
Display Colors
Table 1-6-2 LCD module specifications
Specifications(WXGA+)
Samsung
LTN184KT02-T01
Samsung
LTN184HT04-T01
1680 x 945
0.243 (H)× 0.243 (V)
262,144 colors
1920 x 1080
0.213 (H)× 0.213 (V)
262,144 colors
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1.6.2 CCFL Inverter Board
Table 1-10 lists the FL inverter board specifications.
Input
Output
Item
Table 1-6-3 FL inverter board specifications
Voltage (V)
Power (W)
Voltage (Vrms)
Current
(f=55KHz)(mArms)
SUMIDA
TWS-449-341
Specifications
Ampower
T18I107.00
8~21 8~21
7.5W 7.5W
612~945 612~945
2.3±0.4 ~ 6.5±0.3
TDK
TBD573NR
8~21
7.5W
612~945
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Chapter 1 Hardware Overview
1.7 Power Rails
Table 1-7-1 lists the power rail output specifications.
Table 1-7-1 Power supply output rating
Name
+5VPCU
+5V
+3VPCU
+3V_S5
+3VSUS
+3V
+1.8VSUS
+SMDDR_VTERM
+SMDDR_VREF
+1.8V
+1.5V
+1.2V
+1.05v
+NB_CORE
VCC_CORE
+VCCRTC
Power supply （Yes/No）
Voltage [V]
Power OFF
Suspend mode
Power OFF
Boot mode
No Main Battery (with RTC Battery)
5 Yes Yes
5 No No
3.3
3.3
3.3
Yes
Yes
Yes
Yes
No
No
No
No No
No No
3.3 No
1.8 Yes
1.8
1.8
Yes
Yes
1.8 No
1.5 No
1.25 No
1.05 No
1.0~1.2 No
0.7~1.2 No
No No
No No
No No
No No
No
No
No
No
No
No
No
No
No
No
No
No
3.266 Yes Yes Yes
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1.8 Batteries
The PC has the following two batteries.
Main battery
Real time clock (RTC) battery
Table 1-8-1 lists the specifications for these two batteries.
Table 1-8-1 Battery specifications
1.8.1 Main Battery
The main battery is the primary power supply for the computer when the AC adapter is not connected.
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Chapter 1 Hardware Overview
1.8.2 Battery Charging Control
Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer.
Battery Charge
When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off. Refer to the following Table 1-13.
Table 1-8-2 Time required for charges of main battery
Charge is stopped in the following cases.
1. The main battery is fully charged
2. The main battery is removed
3. Main battery or AC adapter voltage is abnormal
4. Charging current is abnormal
Data retaining time
When turning off the power in being charged fully, the retaining time is as following
Table 1-8-3.
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Table 1-8-3 Data retaining time
*
If USB Seep and Charge function is enabled, the computer’s battery will discharge during hibernation or when the computer is turned off.
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Chapter 1 Hardware Overview
1.8.3 RTC Battery
The RTC battery provides the power supply to maintain the date, time, and other system information in memory.
Table 1-8-4 lists the Time required for charges of RTC battery and data preservation time.
Table 1-8-4 Time required for charges of RTC battery
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1.9 AC Adapter
Table 1-9-1 lists the AC adapter specifications.
Table 1-9-1 AC adapter specifications
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Chapter 2
Troubleshooting Procedures
2-1 Qosmio X500
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Chapter 2 Contents
2.1 Troubleshooting .............................................................................................................1
2.2 Troubleshooting Flowchart............................................................................................3
2.3 Power Supply Troubleshooting......................................................................................7
Procedure 1 Power Status Check ...................................................................7
Procedure 2
Procedure 3
Connection Check......................................................................9
Charging Check .......................................................................10
Procedure 4 Replacement Check ................................................................ 1
1
2.4 System Board Troubleshooting................................................................................... 1
2
Procedure 1 Message Check ....................................................................... 1
3
Procedure 2 Debugging Port Check............................................................ 1
4
Procedure 3 Replacement Check .................................................................14
2.5 USB FDD Troubleshooting .........................................................................................15
Procedure 1 FDD Head Cleaning Check .....................................................15
Procedure 2
Procedure 3
Diagnostic Test Program Execution Check .............................16
Connector Check and Replacement Check..............................17
2.6 2.5” HDD Troubleshooting..........................................................................................19
Procedure 1
Procedure 2
Procedure 3
Partition Check.........................................................................19
Message Check ........................................................................20
Format Check...........................................................................21
Procedure 4
Procedure 5
Diagnostic Test Program Execution Check .............................22
Connector Check and Replacement Check..............................23
2.7 Keyboard Troubleshooting ..........................................................................................24
Procedure 1
Procedure 2
Diagnostic Test Program Execution Check .............................24
Connector Check and Replacement Check..............................25
2.8 Touch pad Troubleshooting .........................................................................................26
Procedure 1 Diagnostic Test Program Execution Check .............................26
Procedure 2 Connector Check and Replacement Check..............................27
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2.9 Display Troubleshooting..............................................................................................28
Procedure 1 External Monitor Check...........................................................28
Procedure 2
Procedure 3
Procedure 4
Diagnostic Test Program Execution Check .............................28
Connector and Cable Check.....................................................29
Replacement Check .................................................................30
2.10 Optical Disk Drive Troubleshooting............................................................................31
Procedure 1 Diagnostic Test Program Execution Check .............................31
Procedure 2 Connector Check and Replacement Check..............................31
2.11 Modem Troubleshooting..............................................................................................32
Procedure 1 Diagnostic Test Program Execution Check .............................32
Procedure 2 Connector Check and Replacement Check..............................32
2.12 LAN Troubleshooting..................................................................................................34
Procedure 1 Diagnostic Test Program Execution Check .............................34
Procedure 2 Connector Check and Replacement Check..............................34
2.13 Wireless LAN Troubleshooting...................................................................................35
Procedure 1 Transmitting-Receiving Check ................................................35
Procedure 2
Procedure 3
Antennas' Connection Check ...................................................36
Replacement Check .................................................................37
Procedure 1
Procedure 2
Procedure 1
Procedure 2
Procedure 1
Connector Check......................................................................38
Replacement Check .................................................................39
Diagnostic Test Program Execution Check .............................40
Connector Check and Replacement Check.............................40
Connector Check and Replacement Check.............................41
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2 Troubleshooting Procedures
2
2.1 Troubleshooting
Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction.
The FRUs covered are:
1. Power supply
2. System Board
3. USB FDD
4. 2.5” HDD
5. Keyboard
6. Touch pad
7. Display
8. Optical Disk Drive
9. Modem
10. LAN
11. Wireless LAN
12. Sound
13, Finger Print Board
14, B luetooth
The Test Program operations are described in Chapter 3. Detailed replacement procedures are described in Chapter 4.
NOTE: After replacing the system board or CPU, it is necessary to execute the subtest 01 initial configuration of the 3.3 Setting of the hardware configuration in Chapter
3. Also update with the latest BIOS
After replacing the LCD, update with the latest EC/KBC.
The implement for the Diagnostics procedures is referred to Chapter 3. Also, following implements are necessary:
1. Phillips screwdrivers (For replacement procedures)
2. Implements for debugging port check
Toshiba Free-DOS system FD
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There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting.
(1) Cable connection is described in the figure as line.
(2) Pin connection is described in the figure as arrow.
<e.g.> Connection of modem
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2.2 Troubleshooting Flowchart
Use the flowchart in Figure 2-1-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following:
Ask customer to enter the password if a password is registered.
Verify with the customer that Toshiba Windows is installed on the hard disk. Non-
Windows operating systems can cause the computer to malfunction.
Make sure all optional equipment is removed from the computer.
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Figure 2-1-1 Troubleshooting flowchart (1/2)
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Figure 2-1-2 Troubleshooting flowchart (2/2)
If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities
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function to confirm which diagnostic test detected an error(s), and then perform the appropriate troubleshooting procedures as follows:
1. If an error is detected on the system test, memory test, display test, CD-ROM/DVD-
ROM test, expansion test, real timer test, sound test or Modem/LAN/Bluetooth
/IEEE1394 test, perform the System Board Troubleshooting Procedures in Section 2.4.
2. If an error is detected on the floppy disk test, perform the USB FDD Troubleshooting
Procedures in Section 2.5.
3. If an error is detected on the hard disk test, perform the HDD Troubleshooting
Procedures in Section 2.6.
4. If an error is found on the keyboard test and pressed key display test, perform the
Keyboard Troubleshooting Procedures in Section 2.7.
5. If an error is found on the touch pad test, perform the touch pad Troubleshooting
Procedures in Section 2.8.
6. If an error is detected on the display test, perform the Display Troubleshooting
Procedures in Section 2.9.
7. If an error is detected on the CD-ROM/DVD-ROM test, perform the Optical Disk
Drive Troubleshooting Procedures in Section 2.10.
8. If an error is detected on the modem test, perform the Modem Troubleshooting
Procedures in Section 2.11.
9. If an error is detected on the LAN test, perform the LAN Troubleshooting Procedures in Section 2.12.
10. If an error is detected on the wireless LAN test, perform the Wireless LAN
Troubleshooting Procedures in Section 2.13.
11. If an error is detected on the sound test, perform the Sound Troubleshooting
Procedures in Section 2.14.
12. If an error is detected on the fingerprint test, perform the fingerprint Troubleshooting
Procedures in Section 2.15.
13. If an error is detected on the Bluetooth test, perform the Bluetooth Troubleshooting
Procedures in Section 2.16.
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2.3 Power Supply Troubleshooting
The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other
Procedures as instructed. The procedures described in this section are:
Procedure 1: Power Status Check
Procedure 2: Connection Check
Procedure 3: Charging Check
Procedure 4: Replacement Check
Procedure 1 Power Status Check
The following LED indicates the power supply status:
Battery LED
DC IN LED
The Power Supply control displays the power supply status with the Battery LED and the DC
IN LED as listed in the tables below.
Table 2-1 Battery icon
Battery icon
Lights orange
Lights red
Power supply status
Battery is charged and the AC adapter is connected. It has no relation with ON/OFF of the system power.
Battery is fully charged and the AC adapter is connected. It has no relation with ON/OFF of the system power.
The battery level is low while the system power is ON. Blinks orange
(even intervals)
Blinks orange once
(at being switched on)
Doesn’t light
The system is driven by only a battery and the battery level is low.
Any condition other than those above.
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Table 2-2 DC IN icon
DC IN icon Power supply status
Lights red
Blinks orange
DC power is being supplied from the AC adapter.
Power supply malfunction
*1
Doesn’t light Any condition other than those above.
*1 When the power supply controller detects a malfunction, the DC IN icon blinks orange.
When the icon is blinking, perform the following procedure.
1. Remove the battery pack and the AC adapter.
2. Re-attach the battery pack and the AC adapter.
If the icon is still blinking after the operation above, check the followings:
Check 1 If the DC IN icon blinks orange, go to Procedure 2.
Check 2 If the DC IN icon does not light, go to Procedure 3.
Check 3 If the battery icon does not light orange or green, go to Procedure 4.
NOTE: Use a supplied AC adapter.
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Procedure 2 Connection Check
The wiring diagram related to the power supply is shown below:
Any of the connectors may be disconnected. Perform Check 1.
Check 1 Make sure the AC adapter and the AC power cord is firmly plugged into the DC
IN connector PCN3 and wall outlet. If these cables are connected firmly, go to
Check 2.
Check 2 Replace the AC adapter and the AC power cord with new ones.
If the DC IN icon does not light, go to Procedure 4.
If the battery icon does not light, go to Check 3.
Check 3 Make sure the main battery pack is installed in the computer correctly. If the battery is properly installed and the battery icon still does not light, go to
Procedure 4.
Procedure 3 Charging Check
Check if the power supply controller charges the battery pack properly. Perform the following procedures:
Check 1 Make sure the AC adapter is firmly plugged into the DC IN socket.
Check 2 Make sure the battery pack is properly installed. If it is properly installed, go to
Check 3.
Check 3 The battery pack may be completely discharged. Wait a few minutes to charge the battery pack while connecting the battery pack and the AC adapter. If the battery pack is still not charged, go to Check 4.
Check 4 The battery’s temperature is too high or low. Leave the battery for a while to
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adjust it in the right temperature. If the battery pack is still not charged, go to
Check 5.
Check 5 Replace the battery pack with a new one. If the battery pack is still not charged, go to Procedure 4.
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Procedure 4 Replacement Check
The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks.
To disassemble the computer, follow the steps described in Chapter 4, Replacement
Procedures.
When AC adapter is connected;
Check 1 AC adapter may be faulty. Replace the AC adapter with a new one. If the problem still occurs, perform Check 2.
Check 2 System board may be faulty. Replace the system board with a new one.
When AC adapter is not connected ;
(When driving with battery pack)
Check 1 Battery pack may be faulty. Replace it with a new one. If the problem still occurs, perform Check 2.
Check 2 System board may be faulty. Replace it with a new one.
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2.4 System Board Troubleshooting
This section describes how to determine if the system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed. The procedures described in this section are:
Procedure 1: Message Check
Procedure 2: Diagnostic Test Program Execution Check
Procedure 3: Replacement Check
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Procedure 1 Message Check
When the power is turned on, the system performs the Power On Self Test (POST) installed in the BIOS ROM. The POST tests each IC on the system board and initializes it.
If an error message is shown on the display, perform Check 1.
If there is no error message, go to Procedure 2.
If Free-DOS or Windows is properly loaded, go to Procedure 3.
Check 1 If one of the following error messages is displayed on the screen, press the F2 key as the message instructs. These errors occur when the system configuration preserved in the RTC memory (CMOS type memory) is not the same as the actual configuration or when the data is lost.
If you press the F2 key as the message instructs, the SETUP screen appears to set the system configuration. If error message (b) appears often when the power is turned on, replace the RTC battery.
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Procedure 2 Diagnostic Test Program Execution Check
Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests.
1. System test
2. Memory test
3. Keyboard test
4. Display test
5. Floppy Disk test
6. VGA test
7. VGA Memory test
8. Hard Disk test
9. CPU Temperature test
10. Main Battery test
11. BIOS test
12. CD-ROM/DVD-ROM test
13. System Status LED test
14. Wireless LAN test
15. LAN/Modem/Sound test
16. UUID test-DMI Information (Write DMI)
If an error is detected during these tests, go to Procedure 3.
Procedure 3 Replacement Check
System board may be faulty. Disassemble the computer following the steps described in
Chapter 4, Replacement Procedures and replace system board with a new one.
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2.5 USB FDD Troubleshooting
To check if the USB FDD is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Procedure 1: FDD Head Cleaning Check
Procedure 2: Diagnostic Test Program Execution Check
Procedure 3: Connector Check and Replacement Check
Procedure 1 FDD Head Cleaning Check
FDD head cleaning is one option available in the Diagnostic Program.
After connecting USB FDD, insert the Diagnostics Disk in the floppy disk drive. Turn on the computer and run the test. And then clean the FDD heads using the cleaning kit. If the FDD still does not function properly after cleaning, go to Procedure 2.
Detailed operation is given in Chapter 3, Tests and Diagnostics.
If the test program cannot be executed on the computer, go to Procedure 3.
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Procedure 2 Diagnostic Test Program Execution Check
Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to
Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures.
Make sure the floppy disk is formatted correctly and that the write protect tab is disabled.
Floppy disk drive test error codes and their status names are listed in Table 2-7. If any other errors occur while executing the FDD diagnostics test, go to Check 1.
Table 2-7 FDD error code and status
Code Status
02h
04h
08h
09h
Address mark not found
Record not found
DMA overrun error
DMA boundary error
60h
80h
EEh
FFh
FDD not drive
Time out error (Not ready)
Write buffer error
Data compare error
Check 1 If the following message is displayed, disable the write protect tab on the floppy disk by sliding the write protect tab to “write enable”. If any other message appears, perform Check 2.
Write protected
Check 2 Make sure the floppy disk is formatted correctly. If it is, go to Procedure 3.
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Procedure 3 Connector Check and Replacement Check
USB FDD is connected to USB port on system board and US board. US board is also connected to system board by cable. The connection of cable and board may be defective.
Otherwise, they may be faulty. Disassemble the computer following the steps described in
Chapter 4, Replacement Procedures and perform the following checks.
USB FDD can be connected to the following 4 ports on system board.
Check 1 Make sure USB FDD is firmly connected to USB port. If the connection is loose, connect firmly and repeat Procedure 2. If the problem still occurs, go to Check 2.
NOTE: When checking the connection, be sure to check it with care for the followings.
1. Cable can not be disconnected from the connector.
2. Cable is connected straight to the connector.
3. Cable is connected all the way seated in the connector.
4. Cable can not be broken.
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Check 2 USB FDD may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3.
Check 3 Connect USB FDD to each port embedded on system board.
If it does not work properly, perform Check 4.
Check 4 System board may be faulty. Replace it with a new one following the steps in
Chapter 4, Replacement Procedures.
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2.6 2.5” HDD Troubleshooting
To check if 2.5” HDD is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Procedure 1: Partition Check
Procedure 2: Message Check
Procedure 3: Format Check
Procedure 4: Diagnostic Test Program Execution Check
Procedure 5: Connector Check and Replacement Check
CAUTION: The contents of the hard disk will be erased when the 2.5” HDD troubleshooting procedures are executed. Transfer the contents of the hard disk to other storage drive(s). For the backup, refer to the User’s Manual.
Procedure 1 Partition Check
Insert the Toshiba Free-DOS system disk and start the computer. Perform the following checks:
Check 1 Input C: and press Enter. If you cannot change to drive C, go to Check 2. If you can change to drive C, go to Procedure 2.
Check 2 Input FDISK and press Enter. Choose Display Partition Information from the
FDISK menu. If drive C is listed in the Display Partition Information, go to Check
3. If drive C is not listed, return to the FDISK menu and choose the option to create a DOS partition or a logical DOS drive on drive C. If the problem still occurs, go to Procedure 2.
Check 3 If drive C is listed as active in the FDISK menu, go to Check 4. If drive C is not listed as active, return to the FDISK menu and choose the option to set the active partition for drive C. Then go to Procedure 2.
Check 4 Remove the system disk from the FDD and reboot the computer. If the problem still occurs, go to Procedure 2. Otherwise, the 2.5” HDD is operating normally.
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Procedure 2 Message Check
When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen.
Make sure no floppy disk is in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with
Check 1 below and perform the other checks as instructed.
Check 1 If either of the following messages appears, go to Check 3. If the following messages do not appear, perform Check 3.
Insert system disk in drive
Press any key when ready ..... or
Non-System disk or disk error
Replace and press any key when ready
Check 2 Using the SYS command of the Free-DOS, transfer the system to the 2.5” HDD.
If the system is not transferred, go to Procedure 3. Refer to the Free -DOS Manual for detailed operation.
If the following message appears on the display, the system program has been transferred to the HDD.
System Transferred
If an error message appears on the display, perform Check 3.
Check 3 2.5” HDD(s) and the connector(s) of system board may be defective (Refer to the steps described in Chapter 4, Replacement Procedures for disassembling.). Insert
HDD(s) to the connector(s) firmly. If it is (or they are) firmly connected, go to
Procedure 3.
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Procedure 3 Format Check
The computer’s HDD is formatted using the Free-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required.
Refer to the Free-DOS Manual for the operation of Free-DOS. For the format by the test program, refer to the Chapter 3.
Check 1 Format an 2.5” HDD using Free-DOS FORMAT command. Type as FORMAT
C:/S/U.
If 2.5” HDD can not be formatted, perform Check 2.
Check 2 Using the Free -DOS FDISK command, set the 2.5” HDD partition. If the partition is not set, go to Check 3. If it is set, format 2.5” HDD using Free-DOS
FORMAT command.
Check 3 Using the Diagnostic Disk, format 2.5” HDD with a format option (physical format). If HDD is formatted, set the 2.5” HDD partition using Free-DOS FDISK command.
If you cannot format 2.5” HDD using the Tests and Diagnostic program, go to
Procedure 4.
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Procedure 4 Diagnostic Test Program Execution Check
The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the
Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program.
If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-8. If an error code is not displayed but the problem still occurs, go to Procedure 5.
Table 2-5-1 2.5” Hard disk drive error code and status
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Procedure 5 Connector Check and Replacement Check
HDD(s) is/are connected to the connector(s) on the system board. The connection of HDD(s) and board may be defective. Otherwise, they may be faulty. Disassemble the computer following instructions in Chapter 4, Replacement Procedures and perform the following checks.
Check 1 Make sure HDD(s) is/are firmly connected to the connector(s) on the system board.
If any of the connections are loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2.
Check 2 (One of) HDD(s) may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures and check the operation. If the problem still occurs, perform Check 3.
Check 3 System board may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures.
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2.7 Keyboard Troubleshooting
To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector and Replacement Check
Procedure 1 Diagnostic Test Program Execution Check
Execute the Keyboard Test (DIAGNOSTIC TEST) and Pressed key display test in the
Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform the test program.
If an error occurs, go to Procedure 2. If an error does not occur, keyboard is functioning properly.
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2 Troubleshooting Procedures
Procedure 2 Connector and Replacement Check
The connection of cable and board may be defective. Otherwise, they may be faulty.
Disassemble the computer following the steps described in Chapter 4, Replacement
Procedures, and perform the following checks:
Check 1 Make sure keyboard cable is firmly connected to system board.
If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2.
Check 2 Keyboard may be faulty. Replace it with a new one following the instructions in
Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 3.
Check 3 System board may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures.
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2.8 Touch pad Troubleshooting
To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector and Replacement Check
Procedure 1 Diagnostic Test Program Execution Check
Execute the Touch pad test in the Diagnostic Program. Refer to Chapter 3, Tests and
Diagnostics, for more information on how to perform the test program.
If an error occurs, go to Procedure 2. If an error does not occur, touch pad is functioning properly.
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Procedure 2 Connector and Replacement Check
The connection of cable and board may be defective. Otherwise, they may be faulty.
Disassemble the computer following the steps described in Chapter 4, Replacement
Procedures, and perform the following checks:
Check 1 Make sure the cable is firmly connected to system board.
If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2.
Check 2 Touch Pad or the cable may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 3.
Check 3 System board may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures
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2.9 Display Troubleshooting
To check if the computer’s display is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Procedure 1: External Monitor Check
Procedure 2: Diagnostic Test Program Execution Check
Procedure 3: Connector and Cable Check
Procedure 4: Replacement Check
Procedure 1 External Monitor Check
Connect an external monitor to the computer’s external monitor port, and then boot the computer. The computer automatically detects the external monitor when “Power on Display” setting is “Auto-Selected” (Default) in BIOS Setup Menu.
If this setting is “System LCD only”, external monitor cannot be displayed.
If the external monitor works correctly, the internal LCD may be faulty. Go to Procedure 3.
If the external monitor appears to have the same problem as the internal monitor, system board may be faulty. Go to Procedure 2.
Procedure 2 Diagnostic Test Program Execution Check
The Display Test program is stored in Diagnostics disk. This program checks the display controller on system board. Insert the Diagnostics disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics for details. If an error is detected, go to Procedure 3.
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Procedure 3 Connector and Cable Check
LCD Module is connected to system board by an LCD/FL cable. FL inverter board is also connected to system board by an LCD/FL cable. And, fluorescent lamp is connected to FL inverter board by HV cable. Their cables may be disconnected from system board or FL inverter board. Disassemble the computer following the steps described in Chapter 4,
Replacement Procedures.
If the connection is loose, reconnect firmly and restart the computer. If the problem still occurs, go to Procedure 4 .
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Procedure 4 Replacement Check
Fluorescent lamp, FL inverter, LCD module, HV cable and LCD/FL cable are connected to display circuits. Any of these components may be faulty. Refer to Chapter 4, Replacement
Procedures, for instructions on how to disassemble the computer and then perform the following checks:
If LED backlight does not light, perform Check 1.
If characters or graphics on the internal display are not displayed clearly, perform
Check 3.
If some screen functions do not operate properly, perform Check 3.
If LED backlight remains lit when the display is closed, perform Check 4.
Check 1 LCD/FL cable may be faulty. Replace FL/LCD cable with a new one following the instructions in Chapter 4, Replacement Procedure and test the display again. If the problem still occurs, perform Check 2.
Check2 FL inverter may be faulty. Replace FL inverter with a new one following the instructions in Chapter 4, Replacement Procedure and test the display again. If the problem still occurs, perform Check 3.
Check 3 LCD module may be faulty. Replace LCD module with a new one following the instructions in Chapter 4, Replacement Procedure and test the display again. If the problem still occurs, perform Check 4.
Check 4 System board may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedure.
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2.10 Optical Disk Drive Troubleshooting
To check if optical disk drive is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector Check and Replacement Check
Procedure 1 Diagnostic Test Program Execution Check
Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program. Refer to Chapter 3, Tests
and Diagnostics for more information on how to perform the test program.
Prepare the tools before the test.
If any error is detected by the test, go to Procedure 2.
Procedure 2 Connector Check and Replacement Check
The connection of optical disk drive and system board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4 and perform the following checks:
Check 1 Make sure optical disk drive is firmly connected to the connector on system board.
If the connection is loose, reconnect it firmly and return to Procedure 2. If the problem still occurs, perform Check 2.
Check 2 Optical disk drive may be faulty. Replace it with a new one following the steps in
Chapter 4. If the problem still occurs, perform Check 3.
Check 3 System board may be faulty. Replace it with new one following the instructions in
Chapter 4.
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2.11 Modem Troubleshooting
To check if modem is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector Check and Replacement Check
Procedure 1 Diagnostic Test Program Execution Check
Execute Modem test in the LAN/Modem/Bluetooth/IEEE1394 test program. Refer to Chapter
3, Tests and Diagnostics for more information on how to perform the test program.
If any error is detected, perform Procedure 2.
Procedure 2 Connector Check and Replacement Check
MDC (Modem Daughter Card) is used as the modem for this computer. MDC is connected to system board by connector. And also, MDC is connected to system and LAN board by modem cable. If modem malfunctions, the connection of cable, board and module may be defective.
Otherwise, they may be faulty.
Disassemble the computer following the steps described in Chapter 4 and perform the following checks:
Check 1 Make sure the following connections are firmly connected.
If any connector is disconnected, connect it firmly and return to Procedure 1. If the problem still occurs, perform Check 2.
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Check 2 Modem cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3.
Check 3 MDC may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 4.
Check 4 Cable between MDC and system board may be faulty. Replace it with a new one following the instructions in Chapter 4. If the problem still occurs, perform Check
5.
Check 5 System board may be faulty. Replace it with a new one following the instruction in
Chapter 4.
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2.12 LAN Troubleshooting
To check if the computer’s LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector Check and Replacement Check
Procedure 1 Diagnostic Test Program Execution Check
Execute LAN test in the LAN/Modem test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
If any error is detected by the test, go to Procedure 2.
Procedure 2 Connector Check and Replacement Check
The LAN function is embedded on system board. If LAN malfunctions, its connection is defective or LAN cable and system board may be faulty.
Check 1 Make sure LAN cable is firmly connected to the connector CN1. If the problem still occurs, perform Check 2.
Check 2 LAN cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3.
Check 3 System board may be faulty. Replace it with a new one following the instruction in
Chapter 4.
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2.13 Wireless LAN Troubleshooting
To check if the computer's Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Procedure 1: Transmitting-Receiving Check
Procedure 2: Antennas' Connection Check
Procedure 3: Replacement Check
Procedure 1 Transmitting-Receiving Check
Before starting the test, make sure the wireless communication is Enabled in BIOS setup
Check 1 Execute Wireless LAN test program to check the transmitting-receiving function of wireless LAN. You will need a second computer that can communicate by wireless LAN. Perform the test following the instructions described in Chapter 3.
If the computer passes the test, the function is correctly working. If the computer does not pass the test, perform Procedure 2.
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Troubleshooting Procedures
Procedure 2 Antennas' Connection Check
The wireless LAN function-wiring diagram is shown below:
Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks:
Check 1 Make sure the wireless communication is Enabled in BIOS setup
If the Wireless communication is "Disabled", change it to "Enabled". If the problem still occurs, perform Check 2.
Check 2 Make sure wireless LAN card is firmly connected to the CN15 on system board. If the connector is defective, connect it firmly and perform Procedure 1. If the problem still occurs, perform Check 3.
Check 3 Make sure that wireless LAN antenna cables (black and white) are firmly connected to the connectors on Wireless LAN card. If wireless LAN antenna cables are not connected properly, connect them firmly and perform Procedure 1.
If the problem still occurs, go to the procedure 3.
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Procedure 3 Replacement Check
Wireless LAN card, wireless LAN antenna or system board may be faulty. Refer to Chapter 4,
Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks:
Check 1 Wireless LAN antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2.
Check 2 Wireless LAN card may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 3.
Check3 System board may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures.
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Troubleshooting Procedures
2.14 Sound Troubleshooting
To check if the sound function is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Procedure 1: Connector Check
Procedure 2: Replacement Check
Procedure 1 Connector Check
The connection of sound system is shown in the following figure.
As the connection may be defective, disassemble the PC and check each connection.
If the problem still occurs, go to Procedure 2.
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Procedure 2 Replacement Check
If External microphone/Headphone does not work properly, perform check 1.
If Internal microphone /Speaker does not work properly, perform check 2.
If HP out does not work properly, perform check 3.
If Volume control does not work properly, perform check 4.
Check 1 External microphone/Headphone may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 5.
Check 2 Internal microphone /Speaker may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 5.
Check 3 HP out may be faulty. Replace it with a new one following the steps in Chapter 4.
If the problem still occurs, perform Check 5.
Check 4 Volume control may be faulty. Replace it with a new one following the steps in
Chapter 4. If the problem still occurs, perform Check 6.
Check 5 Flat cable between AD board/Speaker and system board may be faulty. Replace it with new cable following the instructions in Chapter 4. If the problem still occurs, perform Check 6.
Check 6 Audio board/System board may be faulty. Replace it with a new one following the instructions in Chapter 4.
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Troubleshooting Procedures
2.15 Fingerprint Troubleshooting
To check if the computer’s Fingerprint is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Procedure 1: Connector Check and Replacement Check
Procedure 1 Diagnostic Test Program Execution Check
Execute Fingerprint test in the test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
If any error is detected, perform Procedure 2.
Procedure 2 Connector Check and Replacement Check
The Fingerprint function is embedded on system board. If Fingerprint malfunctions, its connection is defective or Fingerprint cable and system board may be faulty.
Check 1 Make sure Fingerprint cable is firmly connected to the connector
. If the problem still occurs, perform Check 2.
Check 2 Fingerprint cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check4.
Check 3 Fingerprint may be faulty. Replace it with a new one following the steps in
Chapter 4. If the problem still occurs, perform Check 4.
Check 4 System board may be faulty. Replace it with a new one following the instruction in
Chapter 4.
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Troubleshooting Procedures
2.16 Bluetooth Troubleshooting
To check if the computer’s B luetooth is malfunctioning or not, follow the troubleshooting procedure below as instructed.
Procedure 1: Connector Check and Replacement Check
Procedure 1 Connector Check and Replacement Check
The B luetooth module is connected to system board. If Bluetooth malfunctions, its connection is defective or B luetooth cable and system board may be faulty.
Check 1 Make sure B luetooth cable is firmly connected to the connector CN27. If the problem still occurs, perform Check 2.
Check 2 B luetooth cable may be faulty. Replace it with a new one. If the problem s till occurs, perform Check 3.
Check 3 B luetooth may be faulty. Replace it with a new one following the steps in Chapter
4. If the problem still occurs, perform Check 4.
Check 4 System board may be faulty. Replace it with a new one following the instruction in
Chapter 4.
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Chapter 3
Diagnostic Programs
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Chapter 3 Contents
Tests and Diagnostics Software Overview
............................................................ 3-3
............................................................................... 3-4
.......................................................................................... 3-45
............................................................................................. 3-47
Error Codes and Error Status Names
................................................................... 3-58
......................................................................................... 3-61
................................................................................ 3-61
........................................................................................ 3-66
............................................................................ 3-68
........................................................................................ 3-68
......................................................................................... 3-70
......................................................................................... 3-70
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3.1 Tests and Diagnostics Software Overview
This chapter explains how to use the Tests and Diagnostics Software for the Satellite P500 and Satellite Pro P500 computer systems.
NOTES: Before starting the Tests and Diagnostics software:
1. Check all cables for loose connections.
2. Exit any application and close Windows.
The Diagnostics Menu consists of the following options:
Diagnostic Test
Running Test
DMI Information
Log Utilities
System Configuration
Option
The Diagnostic Test Menu consists of the following functional tests:
System Test
Memory Test
Keyboard Test
Display Test
Floppy Disk Test
Hard Disk Test
Real Time Clock Test
Cache Memory Test
High Resolution Display Test
Multimedia Test
Memory2 Test
FDD & HDD Error Retry Count Set
The following equipment is required to perform some of the diagnostic test programs:
The Diagnostics Disk (all tests)
A formatted working disk for the floppy disk drive test (all tests)
A CD test media (Toshiba Backup CD ROM for the CD-ROM test)
The following sections detail the tests contained within the Diagnostic Test Menu. Refer to
Sections 3.18, 3.19, 3.20 and, 3.21 for detailed information on the remaining functions of the
Tests and Diagnostics software.
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3.2 Executing the Diagnostic Test
DOS is required to run the Diagnostics Program. To start the programs follow these steps:
1. Create a DOS bootable disk and copy all the files from the Tests and Diagnostics software to the disk.
2. Insert the boot disk into the computer’s floppy disk drive and turn on the computer.
NOTES: If error message display “Sorry. This Model Type Not Match This Machine”:
Please Check :
1. You test disk is match this model , ex. disk is 14” but machine is 13” .
2. The M/B EEPROM project type is math your test disk , if not , please use WDMI3.EXE to modify with right LCD size .
The following screen displays:
TOSHIBA Satellite(Pro) P500 Diagnostics
Version v1.10
[ DIAGNOSTICS MENU ]
01.DIAGNOSTIC TEST
02.RUNNING TEST
03.DMI INFORMATION
04.LOG UTILITIES
05.SYSTEM CONFIGURATION
06.OPTION
99.EXIT
::Select item
ESC :Escape
3. To select the Diagnostic Test from the Diagnostics Menu use the arrow keys to set the highlight bar to 01 and press Enter.
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The following menu displays:
TOSHIBA Satellite(Pro) P500 Diagnostics
Version V1.10
::Select item
ESC :Escape
[ DIAGNOSTICS MENU ]
01. DIAGNOSTIC TEST
02. RUNNING TEST
03. DMI INFORMATION
[ DIAGNOSTIC TEST MENU ]
04. LOG UTILITIES
05. SYSTEM CONFIGURATION
08. CACHE MEMORY TEST
02. MEMORY TEST 09. HIGH RESOLUTION DISPLAY TEST
99. EXIT
10. MULTIMEDIA TEST
04. DISPLAY TEST
05. FLOPPY DISK TEST
06. HARD DISK TEST
07. REAL TIME CLOCK TEST
11. MEMORY2 TEST
88. FDD&HDD ERROR RETRY COUNT SET
99. EXIT TO DIAGNOSTICS MENU
:Select item Enter:Decision item Esc:Escape
Refer to Sections 3.4 through 3.14 for detailed descriptions of Diagnostics Tests 1 through
11. Item 88 sets the floppy disk drive and hard disk drive error retry count. Item 99 exits the submenu of the Diagnostic Test and returns to the Diagnostics Menu.
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4. Select the subtest you want to execute and press Enter. The following menu displays:
TOSHIBA Satellite(Pro) P500 Diagnostics
Version V1.10
[ DIAGNOSTICS MENU ]
: :Select item
ESC :Escape
[ SYSTEM TEST ]
01. DIAGNOSTIC TEST
02. RUNNING TEST
03. DMI INFORMATION
04. LOG UTILITIES
05. SYSTEM CONFIGURATION
01. SYSTEM TEST
99. EXIT
03. KEYBOARD TEST
[
01. FAN ON/OFF
02. Battery Test
03. CPU Temperature
08. CACHE MEMORY TEST
09. HIGH RESOLUTION DISPLAY TEST
04. DISPLAY TEST 10. MULTIMEDIA TEST
05. FLOPPY DISK TEST 11. MEMRY2 TEST
06. HARD DISK TEST 88. FDD&HDD ERROR RETRY COUNT SET
07. REAL TIME CLOCK TEST 99. EXIT TO DIAGNOSTICS MENU
5. Select the desired test from the subtest menu and press Enter. The following Test
Parameter menu displays:
TOSHIBA Satellite(Pro) P500 Diagnostics
Version V1.10
: :Select item
ESC :Escape
[ DIAGNOSTICS MENU ]
[ TEST PARAMETER ]
01. DIAG NO STIC TEST
01. Go To Test
03. DISK UTILITIES
03. CPU T
[ SYSTEM TEST ]
01. FAN ON/OFF e y Test mperature
4. LOG
05. SYST
03. Error Stop : NO
E M CONFIG
99. Exit
URATION
09. REAL TIME CLOCK TEST
06. OPT ON
02. MEMORY TEST
[ DIAGNOSTIC TEST MENU ] to DIAGNOSTIC TEST MENU
10. NPX TEST
04. DISPLAY TEST
05. FLOPPY DISK TEST
06. HARD DISK TEST
11. HIGH RESOLUTION DISPLAY TEST
12. MULTIMEDIA TEST
13. USB TEST
14. MEMORY2 TEST
07. REAL TIME CLOCK TEST 88. FDD&HDD ERROR RETRY COUNT SET
99. EXIT TO DIAGNOSTICS MENU
Use the arrow keys to highlight the desired option and press Enter.
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NOTES: The Item2 and 3 of Test Parameter are not used by some tests.
Go To Test
Move the highlight bar to Go To Test and press Enter to start executing the test.
Test Loop
Select NO to return the screen to the subtest menu after the test is complete.
Select YES to set the test to run continuously until it is halted by the user.
Error Stop
Select NO to keep the test running even if an error is found.
Select YES to stop the test program when an error is found and display the HALT
OPERATION screen as shown below:
[[ HALT OPERATION ]]
1: Test end
2: Continue
3: Retry
These three selections have the following functions:
1: Terminates the test program and exits to the subtest menu.
2: Continues the test from the error.
3: Restarts the test from the beginning.
Use the arrow keys to move the cursor to the desired option and press Enter.
Table 3-1 in Section 3.3 lists the function of each test on the subtest menu. Table 3-2 in
Section 3.15 lists the error codes and error status for each error.
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3.3 Subtest names
Table 3-1 lists the subtest names for each test program in the Diagnostic
Test menu.
Table 3-1 Subtest Names(1/3)
No. Test Name No.
08
09
10
11
12
02
03
04
05
06
07
02
03
04
01
02
03
04
05
02
03
04
05
06
Subtest Name
FAN ON/OFF check
Battery TEST
CPU Temperature
3D HDD Protection Test (90d)
Conventional Memory
Protected Mode
Protected Mode (32MB-MAX)
RAM Refresh
Stress Test
Pressed Key Display [109 KBD]
Pressed Key Display [105 KBD]
Pressed Key Display [104 KBD]
Hot Key Display [9 KBD]
Hot Key Display [1 KBD]
PS/2 Mouse (Pointing 2Button)
Character Attributes
Character Set
80* 25 Character Display
320* 200 Graphics Display
640* 200 Graphics Display
640* 480 Graphics Display
Display Page
“H” Pattern Display
Video DAC Register W/R/C
Color Graphics Display
Color Attributes Display
Color Tiling
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05
No.
06
07
08 CACHE
TEST
09
Table 3-1 Subtest Names(2/3)
Test Name
FLOPPY DISK TEST
HARD DISK TEST
REAL TIME CLOCK
TEST
HIGH RESOLUTION
DISPLAY TEST
05
06
07
08
01
02
03
04
01
02
03
04
05
01
02
03
04
05
06
01
02
03
07
08
01
02
03
04
05
06
No. Subtest Name
Sequential Read
Sequential W/R/C
Random Address/Data
Write Specified Address
Read Specified Address
Sequential Read
Address Uniqueness
Random Address Data
Cross Talk and Peek Shift
Write Specified Address
Read Specified Address
Sequential Write
W-R-C Specified Address
Real Time Test
Backup Memory Test
Real Time Carry Test
Constant Data Test
Address Pattern Test
Increment/Decrement Test
Bit Shift Pattern Test
*Write Disturb Test
Checker Board Test
Marching Test
Working Data Test
VRAM W/R/C Test
640* 480 Mode Display
800* 600 Mode Display
1024* 768 Mode Display
“H” Pattern Display
Focus Test (“E” Pattern)
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No. Test Name
Table 3-1 Subtest Names(3/3)
11 MEMORY2
No.
02
03
04
01
02
03
04
Subtest Name
Sequential Read Test
Random Read Test
Read Specified Address Test
1 point W/R/C Test
All one/zero Test
Walking 1/Walking 0 Test(Left)
Walking 1/Walking 0 Test(Right)
Walking 1/Walking 0 Test(Left /Right)
*This test cannot support.
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3.4 System Test
To execute the System Test select 01 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The System Test contains three subtests. Move the highlight bar to the subtest you want to execute and press Enter.
Subtest 01 FAN ON/OFF Checking
Select 1,2,3 to control FAN on/off , 1=Fan on , 2=Fan off , 3=Exit .
[BOIFAN2.EXE] Program Version : 1.0
1: Fan On 2: Fan Off 3: Exit
Fan1 Status On Fan1RPM : 5000 or Fan1 Status OFF Fan1RPM : 0
Fan2 Status On Fan2RPM : 2500 or Fan2 Status OFF Fan2RPM : 0
Subtest 02 Battery Test
This will display battery information for check , press [ESC] to exit .
[BOIPCU.EXE] Program Version : 1.0 03-27-2007 voltage : 12522 mV Remaining capacity alarm : 400 mAh temperature : 24.4 ‘C Remaining time alarm : 10 min current : 1330 mA Battery mode : 0 average current : 1327 mA AtRate : 0 mA relative state of charge : 93 % At rate time to full : 65535 min absolute state of charge : 89 % At rate time to empty : 65535 min remaining capacity : 3546 mAh At rate O. K. : FFFF full charge capacity : 3800 mAh Maximun error : 2 % run time to empty : -1 min. Charging current : 2800 mA average time to empty : -1 min. Charging voltage : 12600 mA average time to full : 101 min. Manufacturer name : SANYO cycle count : 10 times Device name : NS2P3SZDNVWR design capacity : 4000 mAh Device chemistry : LION design voltage : 11100 mV Manufacturer data : 0 specification information : 2.1 Manufacture date : 9/13/2005 serial no. : 32009
STATUS : INIT
Press [ESC] KEY to exit
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Subtest 03 CPU Temperature
This will display CPU Temperature for check , press [ESC] to exit .
[CPU_TEMP.EXE] Program Version : 1.3 03-09-2009
CPU Temperature : XX
GPU Temperature : XX
NOTES: If no external Graphics , GPU not report temperature .
Subtest 04 3D HDD Protection Test (90d)
1. For Field inspection T&D.
This program judges by sampling five kinds of data shown below.
No Item Contents
1 Access platform.
2 Test
An access platform is leveling.
Vibration/shock doesn't take a PCB at the time of T&D inspection.
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3 Test1 The display of a test program and the set method of PC are shown below.
Display of a Test Program
The portion which PC and Test-Fixture contact is green.
Set method of PC
Z
Upper
X
Judgment
If all data is less than ranges, it will be OK.
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4 Test2 The display of a test program and the set method of PC are shown below.
Display of a Test Program
Set method of PC
Uppe r
Rear
Judgment
If all data is less than ranges, it will be OK.
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5 Test3 The display of a test program and the set method of PC are shown below.
Display of a Test Program
Set method of PC
Uppe r
Right
Judgment
If all data is less than ranges, it will be OK.
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6 Test4 The display of a test program and the set method of PC are shown below.
Display of a Test Program
Set method of PC
Uppe r
Front
Judgment
If all data is less than ranges, it will be OK.
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7 Test5 The display of a test program and the set method of PC are shown below.
Display of a Test Program
Set method of PC
Uppe r
Left
Judgment
If all data is less than ranges, it will be OK.
8 Inspection Judgment
If all data is less than ranges, it will be OK.
9 Setting
Calibration data
When an inspection result is O.K., calibration at HPC.
2. Test Result
A test result is displayed when a test is completed. A display of result is O.K. or NG.
And an error flag is returned at the end of a program.
OK is 0.
NG is 1.
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3.5 Memory Test
To execute the Memory Test select 02 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Memory Test contains five subtests that test the computer’s memory. Move the highlight bar to the subtest you want to execute and press
Enter.
NOTE: If NO is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the test is executing. When the test is complete the Memory Test menu displays.
If YES is selected for Test Loop on the Test Parameter menu, the Test Status screen
displays while the test is executing. Press Ctrl + break to return to the Memory Test menu.
Subtest 01 Conventional Memory
This subtest first writes test data patterns to conventional memory (0 to 640
KB), then reads the new data and compares the result with the original data patterns.
If a compare error occurs, the write data, read data, and test address display on the screen. Addresses are displayed in 4KB increments during the test.
Test Process:
1. Byte Enable Test
One bit write/ 8 bit read” is executed and the new data is compared with the original data.
Test data = CCAA5533H, 80000000H
2. Byte Enable Test
“One bit write/16 bit read” is executed and the new data is compared with the original data.
Test data = CCAA5533H, 80000000H
3. Data bus test
“One bit write/16 bit read” is executed and the new data is compared with the original data.
Test data = 1H, 2H, 4H, 8H, 10H, through 80000000H.
4. Fixed data test
“16 bit write/ 16 bit read” is executed and the new data is compared to the original data.
Test data = FFFFFFFFH, 00000000H, 80018001H
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5. Address pattern test
“16 bit write and 16 bit read” of address pattern data is executed and the new data is compared with the original data.
Test data = 0000H, 0004H, 0008H, 000CH,...8000H, 8004H, through
FFECH
Subtest 02 Protected Mode
This subtest first writes data patterns and address data from 1 to 32 MB, then reads the new data and compares the result with the original data patterns.
Addresses are displayed in 64KB increments during the test.
.
Test Process:
1. Byte Enable Test
One bit write/ 8 bit read” is executed and the new data is compared with the original data.
Test data = CCAA5533H, 80000000H
2. Byte Enable Test
“One bit write/16 bit read” is executed and the new data is compared with the original data.
Test data = CCAA5533H, 80000000H
3. Data bus test
“One bit write/16 bit read” is executed and the new data is compared with the original data.
Test data = 1H, 2H, 4H, 8H, 10H, through 80000000H.
4. Fixed data test
“16 bit write/ 16 bit read” is executed and the new data is compared to the original data.
Test data = FFFFFFFFH, 00000000H, 80018001H
5. Address pattern test
“16 bit write and 16 bit read” of address pattern data is executed and the new data is compared with the original data.
Test data = 0000H, 0004H, 0008H, 000CH,...8000H, 8004H, through
FFECH
Subtest 03 Protected Mode [32MB - MAX]
This subtest first writes data patterns and address data from 32MB to the maximum installed memory, reads the new data, and then compares the result
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with the original data patterns. Addresses are displayed in 64KB increments during the test.
Test Process:
1. Byte Enable Test
One bit write/ 8 bit read” is executed and the new data is compared with the original data.
Test data = CCAA5533H, 80000000H
2. Byte Enable Test
“One bit write/16 bit read” is executed and the new data is compared with the original data.
Test data = CCAA5533H, 80000000H
3. Data bus test
“One bit write/16 bit read” is executed and the new data is compared with the original data.
Test data = 1H, 2H, 4H, 8H, 10H, through 80000000H.
4. Fixed data test
“16 bit write/ 16 bit read” is executed and the new data is compared to the original data.
Test data = FFFFFFFFH, 00000000H, 80018001H
5. Address pattern test
“16 bit write and 16 bit read” of address pattern data is executed and the new data is compared with the original data.
Test data = 0000H, 0004H, 0008H, 000CH,...8000H, 8004H, through
FFECH
Subtest 04 RAM Refresh
This subtest writes a data pattern (CCAA5533H ) in 4KB from 0 to the maximum installed memory, then waits for a memory refresh cycle (16 ms or more), reads the new data, and compares the result with the original data pattern.
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Test Process:
1. Checks the memory size to determine the maximum size of installed memory.
2. Tests memory addresses 0 to the maximum installed.
3. Writes, reads, and compares test data after a memory refresh cycle
(16ms or more).
NOTE: There may be a short delay between write and read operations, depending on the memory size.
Subtest 05 Stress Test
This subtest writes the following 16KB data patterns to the Write/Read Buffer in conventional memory. data:
FFFFFFFFFFFFFFFF0000000000000000
5555555555555555AAAAAAAAAAAAAAAA
CCCCCCCCCCCCCCCC3333333333333333
0000000000000000FFFFFFFFFFFFFFFF
AAAAAAAAAAAAAAAA5555555555555555
3333333333333333CCCCCCCCCCCCCCCC
FFFFFFFFFFFFFFFF0000000000000000
0000000000000000FFFFFFFFFFFFFFFF
5555555555555555AAAAAAAAAAAAAAAA
AAAAAAAAAAAAAAAA5555555555555555
CCCCCCCCCCCCCCCC3333333333333333
3333333333333333CCCCCCCCCCCCCCCC
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3.6 Keyboard Test
To execute the Keyboard Test select 03 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Keyboard Test contains five subtests that test the computer’s keyboard and mouse actions. Move the highlight bar to the subtest you want to execute and press Enter.
NOTE: The Test Loop and Error Stop parameters are not enabled for the Keyboard test.
Subtest 01 Pressed Key Display [109 Keyboard]
When you execute this subtest, the keyboard layout is drawn on the display.
When any key is pressed, the corresponding key on the screen changes from light to dark. Holding a key down enables the auto-repeat function which causes the key’s display character to blink.
[[[ Press Key Display ]]]
Layout of a keyboard (109 keys)
Subtest 02 Pressed Key Display [105 Keyboard]
This subtest is used for the 105 keyboard and functions the same as Subtest 1.
Subtest 03 Pressed Key Display [104 Keyboard]
This subtest is used for the 104 keyboard and functions the same as Subtest 1.
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Subtest 04 Hot Key Display [9 Key]
This subtest is used for the 9 hot key and functions the same as Subtest 1.
ECO MUTE MUSIC PLAY BACK NEXT VOL- VOL+ WLAN
Subtest 05 Hot Key Display [1 Key]
This subtest is used for the 1 hot key and functions the same as Subtest 1.
WLAN
Subtest 06 PS/2 Mouse (Pointing)
This subtest checks the function of mouse as shown below.
A) Pointing device (mouse)
B) Mouse buttons
Please move cursor to upper left and press left button , screen will display
<PRESS> in left rectangle , move cursor to lower right and press right button , screen will display <PRESS> in right rectangle , the program exit .
If left and right button short , screen will display <Left and Right Button maybe short > , the program exit .
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LEFT
PRESS
TOUCH_PAD TEST
RIGHT
PRESS
Please Do Not Press the Left and Right Button At The Same Time
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3.7 Display Test
To execute the Display Test select 04 from the Diagnostic Test Menu, press Enter and follow the directions displayed on the screen. The Display Test contains twelve subtests that test the display in various modes. Move the highlight bar to the subtest you want to execute and press Enter.
Subtest 01 Character Attributes
This subtest displays character attributes and color attributes. The character attributes are: normal, intensified, reverse, and blinking. The color attributes are: blue, red, magenta, cyan, yellow, and white. These seven colors each display a background color, foreground color and high resolution color. The screen below displays when this subtest is executed.
CHARACTER ATTRIBUTES
NEXT LINE SHOWS NORMAL DISPLAY
NNNNNNNNNNNNNNNNNNNNNNNNNNNNNNNN
NEXT LINE SHOWS INTENSIFIED DISPLAY
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
NEXT LINE SHOWS REVERSE DISPLAY
RRRRRRRRRRRRRRRRRRRRRRRRRRRRRRRR
RRRRRRRRRRRRRRRRRRRRRRRRRRRRRRRR
BBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBB
BLUE
RED
MAGENTA
GREEN
CYAN
YELLOW
WHITE
Press [ Enter ] KEY
To exit this subtest and return to the Display Test menu:
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Menu.
Subtest 02 Character Set
This subtest displays the character codes 00H - FFH, using Mode 01H
(40*25). The screen below displays when this subtest is executed.
CHARACTER SET IN 40*25
Press [Enter] Key
To exit this subtest and return to the Display Test menu:
Menu.
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Subtest 03 80 * 25 Character Display
This subtest uses 80*25 video resolution to display character codes 20H -
7EH using Mode 03H (80*25). The data displayed is shifted 1 byte to the left for each line as shown below.
80*25 CHARACTER DISPLAY
01234567890123456789012345678901234567890123456789012345678901234567890123456789
!”#$%&’()*=,.-/0123456789:;
?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdefghIjklmno
!”#$%&’()*=,.-/0123456789:;
?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdefghIjkl mnop
”#$%&’()*=,.-/0123456789:;
?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdefghIjklmnopq
#$%&’()*=,.-/0123456789:;
?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdefghIjklmnopqr
$%&’()*=,.-/0123456789:;
?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdefghIjklmnopqrs
%&’()*=,.-/0123456789:;
?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdefghIjklmnopqrst
&’()*=,.-/0123456789:;
?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdefghIjkl mnopqrstu
’()*=,.-/0123456789:;
?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdefghIjklmnopqrstuv
Shifted to the left one letter by one letter.
23456789:;
?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdef gh I j k l mnopqrst
3456789:;
?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdef gh I j k l mnopqrst
456789:;
?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdef gh I j k l mnopqrst
Press [Enter] KEY
To exit this subtest and return to the Display Test menu:
Menu.
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Subtest 04 320 * 200 Character Display
This subtest uses 320*200 video resolution to display green, red and yellow followed by cyan, magenta, and white. The screen below shows the displays when this subtest is executed.
320 * 200 GRAPHICS DISPLAY
COLOR SET 0 : [ 4 ]
GREEN RED YELLOW
CYAN MAGENTA WHITE
Press ENTER to display the following sixteen colors: black, blue, green, cyan, red, magenta, brown, white, dark gray, light blue, light green, light cyan, light red, light magenta, yellow, and intensified white.
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320*200 GRAPHICS DISPLAY : [ D ]
BLACK D GRAY
BLUE L BLUE
GREEN L GREEN
CYAN L CYAN
RED L RED
MAGENTA L MAGENTA
BROWN YELLOW
WHITE I WHITE
Press [Enter] KEY
Press ENTER to display 64 gradations of red, green, blue and white on the screen
320*200 GRAPHICS DISPLAY : [ 13 ]
64 gradations of red are displayed.
64 gradations of green are displayed.
64 gradations of blue are displayed.
64 gradations of white are displayed.
Press [Enter] KEY
To exit this subtest and return to the Display Test menu:
Press Ctrl + break if YES was selected for Test Loop on the Test Parameter
Menu.
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Subtest 05 640 * 200 Character Display
This subtest uses 640*200 video resolution to display three windows, each window drives a different set of dots: even dots, odd dots and all dots. The screen below displays when this subtest is executed.
640 * 200 GRAPHICS DISPLAY : [ 6 ]
EVEN DOTS ODD DOTS ALL DOTS
DRIVEN DRIVEN DRIVEN
Press ENTER to display the following 16 colors: black, blue, green, cyan, red, magenta, brown, white, dark gray, light blue, light green, light cyan, light red, light magenta, yellow, and intensified white.
640*200 GRAPHICS DISPLAY : [ E ]
BLACK
BLUE
GREEN
CYAN
RED
MAGENTA
BROWN
WHITE
Press [Enter] KEY
DARK GRAY
LIGHT BLUE
LIGHT GREEN
LIGHT CYAN
LIGHT RED
LIGHT MAGENTA
YELLOW
INTENSIFIED WHITE
To exit this subtest and return to the Display Test menu:
Menu.
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Subtest 06 640 * 480 Character Display
This subtest uses 640*350 video resolution to display 16 colors: black, blue, green, cyan, red, magenta, brown, white, dark gray, light blue, light green, light cyan, light red, light magenta, yellow, and intensified white. The screen below displays when this subtest is executed.
640*350 GRAPHICS DISPLAY : [10 ]
BLACK
BLUE
GREEN
CYAN
RED
MAGENTA
BROWN
WHITE
Press [Enter] KEY
DARK GRAY
LIGHT BLUE
LIGHT GREEN
LIGHT CYAN
LIGHT RED
LIGHT MAGENTA
YELLOW
INTENSIFIED WHITE
Press ENTER to display the following 16 colors: black, blue, green, cyan, red, magenta, brown, white, dark gray, light blue, light green, light cyan, light red, light magenta, yellow, and intensified white using 640*480 video resolution.
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640*480 GRAPHICS DISPLAY : [12 ]
BLACK
BLUE
GREEN
CYAN
RED
MAGENTA
BROWN
WHITE
Press [Enter] KEY
To exit this subtest and return to the Display Test menu:
DARK GRAY
LIGHT BLUE
LIGHT GREEN
LIGHT CYAN
LIGHT RED
LIGHT MAGENTA
YELLOW
INTENSIFIED WHITE
Menu.
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Subtest 07 Display Page
This subtest displays video pages zero through seven.
DISPLAY PAGE 0
000000000000000000000000000000000000000000000000000000000000000
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
0............................................................0
000000000000000000000000000000000000000000000000000000000000000
To exit this subtest and return to the Display Test menu:
Menu.
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Subtest 08 "H" Pattern Display
This subtest displays a full screen of "H" patterns.
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
To exit this subtest and return to the Display Test menu:
Subtest 9
Menu.
Video DAC Register W/R/C
This subtest writes data patterns to the Video DAC register lookup table (PEL
Address register), then reads the new data, and compares the result to the original data patterns. The original content of the Video DAC register is saved in RAM and restored after the test is completed.
The test data patterns are 00H,15H, 2AH and 3FH.
NOTE: If NO is selected for Test Loop on the Test Parameter menu,
“
Screen will remain blank
” displays on the screen while the test is executing. When the test is complete the Display Test menu displays.
If YES is selected for Test Loop on the Test Parameter menu, “
The Screen will remain blank
” displays on the screen and then the screen flickers due to the fast screen refresh while the test is executing. Press Ctrl + break to return to the Display Test menu.
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Subtest 10 Color Graphics Display
This subtest displays three colors, cyan, white and yellow on the screen as shown below.
640 * 480 GRAPHICS DISPLAY
CYAN WHITE YELLOW
To exit this subtest and return to the Display Test menu:
Menu.
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Subtest 11 Color Attributes Display
This subtest displays 16 colors: black, blue, green, cyan, red, magenta, brown, white, dark gray, light blue, light green, light cyan, light red, light magenta, yellow, and intensified white. The screen below displays when this subtest is executed.
640*480 COLOR ATTRIBUTE DISPLAY
0 1
Press [Enter] Key
2 3 4 5 6 7 8 9 A B C D E F
Press Enter to execute the VRAM mapping test which displays a horizontal line at one dot intervals using Mode 12.
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NOTE: The following screen does not display correctly. It will be amended in the next version.
Press [Enter] Key
Press Enter to execute the VRAM mapping test which displays a vertical line at four dot intervals using Mode 12.
Press [Enter] Key
Press Enter to display VRAM mapping test using the all dots Mode.
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Press [Enter] Key
To exit this subtest and return to the Display Test menu:
Menu.
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Subtest 12 Color Tiling
This subtest displays black, gray, white, and 3 gradations of red, green, and blue as shown in the following display.
Black Red Green Blue
Gray Red
Gradation
Green
Gradation
Blue
Gradation
White Red
Gradation
Green
Gradation
Blue
Gradation
To exit this subtest and return to the Display Test menu:
Menu.
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3.8 Floppy Disk Test
CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the diagnostics disk and insert the work disk into the FDD. The contents of the floppy disk will be erased.
To execute the Floppy Disk Test select 05 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Floppy Disk Test contains five subtests that test the
FDD. Move the highlight bar to the subtest you want to execute and press Enter.
Subtest 01 Sequential Read
This subtest sequentially reads all the tracks (Tracks 0 to 79)on the floppy disk.
Subtest 02 Sequential W/R/C
This subtest continuously writes the data pattern B5ADADh to all the specified tracks selected in Subtest 01. The data pattern is then read and compared to the original data.
Subtest 03 Random Address/Data
This subtest writes random data to random addresses on all tracks defined in
Subtest 01. The data is then read and compared to the original data.
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Subtest 04 Write Specified Address
NOTE: The first two digits of the ADDRESS indicate which track is being tested, the next two digits indicates the head, and the last two digits indicate the sector.
This subtest allows you to verify the errors from Subtest 02. It writes specified data to a specified track and head. Use the Log Utilities (see Section 3.21) to specify the track number and head number where the error(s) occurred during
Subtest 02. The following message displays on the screen to enter the test data, track number, and head number.
TEST DATA ??
TRACK NO (00~79) ??
HEAD NO (0~1) ?
Subtest 05 Read Specified Address
This subtest reads data from a specified track and head.
The following message displays on the screen to enter the test track number and head number.
TRACK NO (00~79) ??
HEAD NO (0~1) ?
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3.9 Hard Disk Test
To execute the Hard Disk Test select 06 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Hard Disk Test contains eight subtests that test the functions of the hard disk drive. Move the highlight bar to the subtest you want to execute and press Enter.
NOTES: The contents of the hard disk will be erased when subtest 02, 03, 04, 05, 07 or
08 is executed. Before running the test, transfer the contents of the hard disk to other disk.
A password is necessary to execute the Hard Disk Test. The password is: hard disk
Subtest 01 Sequential Read
This subtest sequentially reads all the tracks on the HDD starting at track 0.
When all tracks have been read, the test starts at the maximum track and reads sequentially back to track 0.
Subtest 02 Address Uniqueness (This subtest need very long time)
This subtest writes unique address data to each sector of the HDD track-bytrack. The data written to each sector is then read and compared with the original data. There are three ways the HDD can be read:
Forward sequential
Reverse sequential
Random
Subtest 03 Random Address Data
This subtest writes random data to 1000 different random addresses on the
HDD. This data is then read and compared to the original data.
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Subtest 04 Cross Talk and Peak Shift
This subtest writes eight of the most likely to fail data patterns (shown below) to a cylinder on the HDD, then reads the data while moving from cylinder to cylinder.
Data Pattern
B5ADADH
4A5252H
EB6DB6H
149249H
63B63BH
9C49C4H
2DB6DBH
D24924H
Subtest 05 Write Specified Address
NOTE: This subtest is designed to run with the Test Loop set to NO. This subtest is a debug tool and the operator should enter the Test Parameters each time.
.
This subtest allows you to verify the errors from Subtest 01. It writes specified data to a specified LBA. Use the Log Utilities (see Section 3.18) to specify the
LBA number where the error(s) occurred during Subtest 01. The following message displays on the screen to enter the test data, and Sector count.
TEST DATA ??
SECTOR COUNT (01~39) ??
START ADDRESS (00000000~MAX Address) ?
Subtest 06 Read Specified Address
NOTE: This subtest is designed to run with the Test Loop set to NO. This subtest is a debug tool and the operator should enter the Test Parameters each time.
This subtest allows you to verify the errors from Subtest 01. It reads specified data (Subtest 06) from a specified LBA. Use the Log Utilities (see Section
3.18) to specify the LBA number where the error(s) occurred during Subtest
01. The following message displays on the screen to enter the test sector count.
SECTOR COUNT (01~39) ??
START ADDRESS (00000000~MAX Address) ?
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Subtest 07 Sequential Write
Subtest 08
This subtest writes specified data to all cylinders on the HDD. The following message displays on the screen to enter the test data.
TEST DATA ????(=37b3H)
W-R-C Specified Address
This subtest writes specified data to a specified sector count, then reads and compares the result. The following message displays on the screen to enter the test data, sector count.
TEST DATA ????(=37b3H)
SECTOR COUNT (01~39) ??
START ADDRESS (00000000~Max Address) ?
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3.10 Real Time Clock Test
To execute the Real Time Clock Test select 07 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Real Time Clock Test contains three subtests that test the computer’s real time functions. Move the highlight bar to the subtest you want to execute and press Enter.
Subtest 01 Real Time
This subtest allows you to change the date and time. To execute the Real Time
Subtest, follow these steps:
[ REAL TIME TEST ]
Current date : mm-dd-yyyy
Current time : hh:mm:ss
Enter new date : mm-dd-yyyy
Enter new time : hh:mm:ss
Press [Enter] key to exit test
2. If the current date is not correct, enter the correct date at the "Enter new date" prompt and press Enter. The following prompt displays:
Enter new time :
3. If the current time is not correct, enter the correct time using a 24-hour format and press Enter.
NOTE: If NO is selected for Test Loop on the Test Parameter menu, the
Real Time Clock Test menu displays.
If YES is selected for Test Loop on the Test Parameter menu, the screen above displays and the test is executed again. Press Ctrl + break to return to the Real Time Clock Test menu.
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Subtest 02 Backup Memory
This subtest writes 50 bytes of test data (FFH, AAH, 55H, and 00H) to the
CMOS 14 th
address, then reads the new data and compares it to the original data.
Subtest 03 Real Time Carry
CAUTION: When this subtest is executed, the current date and time are reset.
This subtest checks the clock’s carry function.
[ REAL TIME CARRY TEST ]
Current date : 12-31-1999
Current time : 23:59:55
Press [Enter] key to exit test
The following is the display after the date carry function is executed.
[ REAL TIME CARRY TEST ]
Current date : 01-01-2000
Current time : 00:00:01
Press [Enter] key to exit test
To exit this subtest and return to the Real Time Clock menu:
Menu.
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3.11 Cache Memory Test
To execute the Cache Memory Test select 08 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Cache Memory Test contains eight subtests that test the computer's cache memory. Move the highlight bar to the subtest you want to execute and press Enter.
NOTE: If NO is selected for Test Loop on the Test Parameter menu, the screen will remain blank while the subtest is executing. When the test is complete the Cache Memory
Test menu displays.
If YES is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the subtest is executing. Press Ctrl + break to return to the Cache Memory
Test menu.
Subtest 01 Constant Data Test
This subtest reads the contents of cache memory and saves it into RAM. The subtest then writes constant data (FFFFH, AAAAH, 5555H, 0101H, 0000H), reads the new data and compares the result with the original data pattern. The original cache memory content is then restored to the cache memory.
Subtest 02 Address Pattern Test
This subtest reads the contents of cache memory and saves it into RAM. The subtest then writes address data patterns (0000H, 0001H, 0002H, through
3FFDH, 3FFEH, 3FFFH), reads the new data and compares the result with the original data. The original cache memory content is then restored to the cache memory.
Subtest 03 Increment/Decrement Test
This subtest reads the contents of cache memory and saves it into RAM. The subtest then writes the increment data (00H, 01H, 02H, through FDH, FEH,
FFH), reads the new data and compares the result with the original data. After comparing the incremental data, decrement data (FFH, FEH, FEH, through
02H, 01H, 00H) is written and the new data is read and compared with the original data. The original cache memory content is then restored to the cache memory.
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Subtest 04 Bit Shift Pattern Test
This subtest reads the contents of cache memory and saves it into RAM. The subtest then writes the bit shift data patterns (1 bit shifted every 4 bytes
), reads the new data and compares the result with the original data. The original cache memory content is then restored to the cache memory.
Subtest 05 Write Disturb Test (We can’t support this time)
This subtest reads the contents of cache memory and saves it into RAM. The subtest then writes the “write disturb data,” reads the new data and compares the result with the original data. The original cache memory content is then restored to the cache memory.
Subtest 06 Checker Board Test
This subtest reads the contents of cache memory and saves it into RAM. The subtest then writes the “checker board data,” (data which is inverted front/back and left/right) reads the new data and compares the result with the original data. The original cache memory content is then restored to the cache memory.
Subtest 07 Marching Test
This subtest reads the contents of cache memory and saves it into RAM. The subtest then writes the “marching data,”
(00H through 01H and 01H through
00H) reads the new data and compares the result with the original data. The original cache memory content is then restored to the cache memory.
Subtest 08 Working Data Test
This subtest reads the contents of cache memory and saves it into RAM. The subtest then writes the “working data,” reads the new data and compares the result with the original data. The original cache memory content is then restored to the cache memory.
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3.12 High Resolution Display Test
To execute the High Resolution Display Test select 09 from the Diagnostic Test Menu, press
Enter and follow the directions on the screen. The High Resolution Display Test contains six subtests that test the computer's high resolution video display. Move the highlight bar to the subtest you want to execute and press Enter.
Subtest 01 VRAM W/R/C Test
This subtest writes address and data patterns to Video RAM, then reads the values from the Video RAM and compares them to the original test patterns.
During the execution of this test 13 different color screens display: black, green, green, blue, blue, red, red, red, black, white, pink, cyan, and black.
Test Process:
1. Sets the video display to 1024*768 mode
2. Bank change test
Writes 1 byte data in order 0, 1, through Fh, and compares the result, at every bank, to the original data patterns.
3. Bit shift data test
Writes 01h data into addresses A000:0000h through A000:FFFFh for each bank, reads the new data and, then compares the results with the original data. Data is then shifted 1 bit to the left, and all bits (01h,
02h, 04h, 08h, through 80h) are tested again.
4. Fixed data test
Writes test data (in order FFh, AAh, 55h, 00h) into addresses
A000:0000h through A000:FFFFh for each bank by, reads the new data and, then compares the results with the original data. Data is then shifted 1 bit to the left, and all bits are tested again
NOTE: If NO is selected for Test Loop on the Test Parameter menu, the screen displays the colors listed above and then the High Resolution
Display Test menu displays.
If YES is selected for Test Loop on the Test Parameter menu, the screen displays the colors listed above. Press Ctrl + break to return to the High
Resolution Display Test menu.
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Subtest 02 640*480 Mode Display
This subtest uses 640*480 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 64 gradations of white, red, green, and blue as shown below.
[ 640*480 256 ] Press [ Enter ]key
256 letter types indication
WHITE
RED
GREEN
BLUE
0---+---1---+---2---+---3---+---4---+---5---+---6---
64 gradations
64 gradations
64 gradations
64 gradations
To exit this subtest and return to the High Resolution Display Test menu:
Menu.
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Subtest 03 800 * 600 Mode Display
This subtest uses 800*600 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 256 gradations of white, red, green, and blue as shown below.
[
800*600 256
]
Press [ Enter ] key
256 letter types indication
WHITE
RED
GREEN
BLUE
0---+---1---+---2---+---3---+---4---+---5---+---6---
64 gradations
64 gradations
64 gradations
64 gradations
To exit this subtest and return to the High Resolution Display Test menu:
Menu
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Subtest 04 1024* 768 Mode Display
This subtest uses 1024*768 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 64 gradations of white, red, green, and blue as shown below.
[ 1024*768 256 ] Press [ Enter ] key
256 letter types indication
WHITE
RED
GREEN
BLUE
0---+---1---+---2---+---3---+---4---+---5---+---6---
64 gradations
64 gradations
64 gradations
64 gradations
To exit this subtest and return to the High Resolution Display Test menu:
Menu.
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Subtest 05 “H” Pattern Display
This subtest uses the 1024*768 Mode to display a high resolution white frame, “H” letters (8*16 pixels fonts), at 128 letters by 48 lines.
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH
To exit this subtest and return to the High Resolution Display Test menu:
Menu.
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Subtest 06 Focus Test ( “E” Pattern)
This subtest sets the 1024*768 Mode and displays “E” patterns (18*18 dot fonts), at 56 letters *42 lines surrounded by a high resolution white frame.
To exit this subtest and return to the High Resolution Display Test menu:
Menu.
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3.13 Multimedia Test
To execute the Multimedia Test select 10 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Multimedia Test contains four subtests that test the computer's multimedia functions. Move the highlight bar to the subtest you want to execute and press Enter.
NOTE: Use the Toshiba Backup CD-ROM for Subtests 01, 02, and 03.
Because CDROM driver issue , the Multimedia function can’t test , this is limitation .
Subtest 01 Sequential Read Test
This subtest sequentially reads one block unit (2K bytes) of all logical addresses from the test CD.
NOTE: If NO is selected for Test Loop on the Test Parameter Menu, the screen will remain blank while the subtest is executing. When the test is complete the Multimedia Test menu displays.
If YES is selected for Test Loop on the Test Parameter Menu, the Test
Status screen displays while the subtest is executing. Press Ctrl + break to return to the Multimedia Test menu.
Subtest 02 Random Read Test
This subtest randomly reads all addresses.
Subtest 03 Read Specified Address Test
This subtest reads data from a specified block of addresses.
The following message displays on the screen to enter the start and end block addresses:
START BLOCK ADDRESS ?
END BLOCK ADDRESS ?
Subtest 04 1 Point W/R/C (R/RW Media)
NOTE: Use CD-R or CD-RW, the CD-ROM and DVD cannot be used for this subtest, and some DVD-dual can’t support this test.
This subtest writes specified data to a specified block count, then reads and compares the result.
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3.14 MEMORY2 Test
To execute the Expansion Test select 11 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The MEMORY2 Test contains four subtests that test the computer's. Move the highlight bar to the subtest you want to execute and press Enter.
NOTE: If NO is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the test is executing. When the test is complete the Memory Test menu displays.
If YES is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the test is executing. Press Ctrl + break to return to the Memory Test menu
Subtest 01 All one/All zero test
This subtest performs pseudorandom data read/write. The data consists of “all ones”/”all zero” patterns produced by pseudorandom sequence generator. The test checks address error.
FFFFFFFFFFFFFFFF0000000000000000
0000000000000000FFFFFFFFFFFFFFFF
Subtest 02 Walking 1/Walking 0 test (Left)
This subtest uses “running one”/”running zero” patterns. This test sequence allows also to checking system bus in maximum noise conditions. The following test sequence is written.
7FFF7FFF7FFF7FFF8000800080008000
BFFFBFFFBFFFBFFF4000400040004000
After all the memory being tested is filled with the pattern, it is read in descanting direction and compared with reference data. As the memory is read, the data is replaced with inverse test pattern. After all the memory is read and replaced with inverted pattern, it is read in descanting direction and compare with new reference data. As the memory is read, the data is replaced with next pattern, which is like first one shifted to right.
Subtest 03 Walking 1/Walking 0 test (Right)
Tee test method is the same as Subtest2. However, the data to be used differs.
80008000800080007FFF7FFF7FFF7FFF
4000400040004000BFFFBFFFBFFFBFFF
Subtest 04 Walking 1/Walking 0 test (Left/ Right)
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Tee test method is the same as Subtest2. However, the data to be used differs.
7FFF7FFF7FFF7FFF8000800080008000
BFFFBFFFBFFFBFFF4000400040004000
DFFFDFFFDFFFDFFF2000200020002000
FFFBFFFBFFFBFFFB0004000400040004
FFFDFFFDFFFDFFFD0002000200020002
FFFEFFFEFFFEFFFE0001000100010001
80008000800080007FFF7FFF7FFF7FFF
4000400040004000BFFFBFFFBFFFBFFF
0004000400040004FFFBFFFBFFFBFFFB
0002000200020002FFFDFFFDFFFDFFFD
0001000100010001FFFEFFFEFFFEFFFE
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3.15 Error Codes and Error Status Names
The following table lists the error codes and error status names for the Diagnostic Tests.
Table 3-2 Error codes and error status names (1/2)
Device Name
(Common)
Memory
Error Code
FF
02
Error Status Name
Data Compare Error
Protected Mode Not Changed
FDD 01
02
04
06
08
09
0C
Bad Command Error
Address Mark Not Found
Record Not Found
Media Change Line Error
DMA Overrun Error
DMA Boundary Error
Select Media Error
80
01
02
04
05
07
09
0A
0B
11
Time Out Error
Bad Command Error
Bad Address Mark Error
Record Not Found
HDC Not Reset Error
Drive Not Initialized
DMA Boundary Error
Bad Sector
Bad Track Error
ECC Recover Enabled
80
AA
Time Out Error
Drive Not Ready
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Table 3-2 Error codes and error status names (2/2)
Device Name Error Code Error Status Name
Cache Memory
F0
02
No Sense Error
Protect Mode Error
15 Drive Not Ready
NOTE: If error status name is Other Error , please reference the Error Code for error information
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3.16 Running Test
NOTES:
1. You may add or delete subtests using the Running Test Edit Item function, see Section
3.20.
2. Do not forget to insert a work disk in the FDD. If a work disk is not inserted an error will be generated during the Floppy Disk Test.
3. If the test completes successfully an “PASS” sign with blue letters displays on the screen.
4. If the test fails or is interrupted before completion an “FAIL” sign with red letters displays on the screen.
5. If running item not select an “NOITEM” sign with green letters display on the screen.
6. All errors which occur during execution of the Running Test are logged in the Log
File.
7. This program is executed according to the Count Loop number selected in the
Running Test Edit Item, see Section 3.20. To terminate the program, press Ctrl +
Break.
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3.17 DMI INFOEMATION
Select 03 from the Diagnostics Menu and press Enter to Check or Write DMI Information
Data:
3.17.1 Check DMI Information
The Check DMI Configuration program contains the following configuration information for the computer:
NOTE: Please set the media of DVD before starting a test.
AHCI cannot control under the DOS
System information (Type 1)
1. Manufacture : TOSHIBA
2. Product Name : Satellite XXXXXX
3. Version :(TOSHIBA Part Number)
4. Serial Number : Serial Number
5. UUID Number: xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
OEM Strings (Type 11)
1. OEM String : xxxxxxxxxxxxxxxxxxxxxxxxxxx
On Board LAN MAC
1. MAC ADR : xxxxxxxxxxxx
DVD Region Code
1. User Change Time : X
2. Region Code : X
3.17.2 Write DMI Information
The Write DMI Information program contains the following information for the computer :
1. Manufacture Name ( TOSHIBA )
2. Product Name ( Satellite XXXXXX )
3. Part Number ( PSP50X-XXXXXX )
4. Serial Number ( 12345678W )
5. OEM String ( PSP50X-XXXXX,SXXXXXXXXXX )
6. Model Select [1]Dyn-Jpn [2]Tos-Jpn [3]Tos-Eng [4]Tos-FR
7. Write UUID ( XXXXXXXXXXXXXXXX )
8. Brightness Write ( XXXXXXXX ) a. SLP2.0 Build Sig [1]Non OS [2]OS
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b. Wireless LAN ID ( 001E4CXXXXXX ) c. AC Adapter Select [1]65W [2]75W [3]90W [4]120W
Select 1 ~ c to keyin new data , select 0 to exit program , program will compare input data length with the max length , if over will retry keyin
Note : Please Check New DMI Information After System Restart !! V3.2
1. **** Manufacture Name ( TOSHIBA ) - (32)
2. **** Product Name ( Satellite XXXXXX ) - (32)
3. **** Part Number ( PSP50X-XXXXXX ) - (26)
4. **** Serial Number ( 12345678W ) - (32)
5. **** OEM String ( PSP50X-XXXXX,SXXXXXXXXXX ) - (64)
6. **** Model Select [1]Dyn-Jpn [2]Tos-Jpn [3]Tos-Eng [4]Tos-FR – (2)
7. **** Write UUID ( XXXXXXXXXXXXXXXX ) – (16)
8. **** Brightness Write ( XXXXXXXX ) – (8) a. **** SLP2.0 Build Sig [1]Non OS [2]OS-(2) b. **** Wireless LAN ID ( 001E4CXXXXXX ) –(12) c. **** AC Adapter Select [1]65W [2]75W [3]90W [4]120W –(1)
0. **** Exit
Please Select (1 ~ c) To Modify DMI String :
Current Data of EEPROM : Toshiba
1. Enter the Manufacture Name : TOSHIBA
Your Keyin is : TOSHIBA …… This is your keyin data
EEPROM return : TOSHIBA ……. This is read from eeprom back
Press any key to continue
Note : Please Check New DMI Information After System Restart !!
If Keyin length too long will retry :
Current Data of EEPROM : 12345678WU
4. Enter the Serial Number : 12345678901234
Your Keyin String Length Not Correct 14 > 10 !!!
Current Data of EEPROM : 12345678WU
4. Enter the Serial Number :
NOTE: The SLP2.0 is Microsoft SPEC , call “System Locked Pre-Installation”or”SLP”,
It is for OEM pre install Windows and no need to Active , If you select Non OS , then you need to Active your OS before you use .
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3.18 Log Utilities
This function logs error information generated while a test is in progress and stores the results in RAM (Maximum error log : 500 times). This function can store data on a floppy disk. If the power switch is turned off, the error information will be lost. Error information is displayed in the following order:
1. Error count (CNT)
2. Test name and subtest number (TEST)
3. Pass count (PASS)
4. Error status (STS)
5. FDD/HDD or memory address (ADDR)
6. Write data (WD)
7. Read data (RD)
8. Error Name ( ERROR NAME/DETAILS)
3.18.1 Operations
1. Select 04 and press Enter in the Diagnostics Menu to log error information into
RAM or onto a floppy disk. Error information is displayed in the following format:
XXXX ERRORS PASSCOUNT = XXXX
CNT TEST PASS STS ADDR WD RD ERROR
Address
Error
Subtest Number Read Data
Error Count Error Name and Detail
[[1:Next, 2:Prev, 3:Exit, 4;Clear, 5:FD Log Read, 6:FD Log Write, 7:Log Save]]
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2. Error information displayed on the screen can be manipulated with the following number keys:
The 1 key scrolls the display to the next page.
The 2 key scrolls the display to the previous page.
The 3 key returns to the Diagnostics Menu.
The 4 key erases all error log information in RAM.
The 5 key reads the log information from a floppy disk.
The 6 key writes the log information to a floppy disk.
The 7 key save the log information to a floppy disk.
The following are the test abbreviations for each Diagnostics Test.
Test Name
System Test
Memory Test
Keyboard Test
Display Test
Floppy Disk Test
Hard Disk Test
Real Time Clock Test
Cache Memory Test
Height Resolution Display Test
Multimedia Test
Memory2 Test
Test Abbreviations
ROM
RAM
KBD
CRT
FDD
HDD
RTM
CAH
KIF
MLT
RAM
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3.19 System Configuration
Select 05 from the Diagnostics Menu and press Enter to display the following system configuration:
SYSTEM CONFIGURATION :
* - BIOS VER = VX.XX KBC VER = XXXX
* - MAC ADDRESS : XXXXXXXXXXXX
* - 0 ASYNC ADAPTER
* - 1 HDD DRIVE(S):XXXXXXXXXXXXXXXXXXXXXXXXXX
FW Rev.:XXXXXXXX
CUR LBA:XXXXXXXX ORG LBA:XXXXXXXX
* - BATTERY TYPE:XXXXXXXXXX
* - XXXMB MEMORY SIZE
* - XXX CPU
* - 1 Vedio Chip XXXXXXXXXXXXX
* - 1 ODD DRIVE(S):XXXXXXXX
FW Rev.:XXXX
Press Enter to return to the Diagnostics Menu.
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3.20 Running Test Edit Item
3.20.1 Function Description
Function description lets you add or delete the subtests used to execute the Running Test.
The following screen displays after pressing the Tab key to edit an item in the Running Test.
KEY OPERATION
Cursor Down
Up
Home Top of ITEM
End End of ITEM
Enter End
3.20.2 Operation Description
Select 05 from the Diagnostics Menu and press Enter to display the following:
Test Item Editor [RUNNING TEST]
04
04
04
04
04
05
08
08
Loop Count (1-65535, 0 = infinity) 00000 Error Stop NO
T-No Test Name S-No Subtest Name
01
02
02
02
02
04
04
04
System Test
Memory Test
Memory Test
Memory Test
Memory Test
Display Test
Display Test
Display Test
Subtest 01 ROM Checksum
Subtest 01 Conventional Memory
Subtest 02 Protect Mode
Subtest 03 Protect Mode (32MB Max)
Subtest 04 RAM Refresh
Subtest 01 VRAM W/R/C
Subtest 02 Character Attribute Set
Subtest 03 Character Set
Display Test
Display Test
Display Test
Display Test
Subtest 04 80 * 25 Character Display
Subtest 05 320 * 200 Graphics Display
Subtest 06 640 * 200 Graphics Display
Subtest 07 640 * 480 Graphics Display
Display Test
Floppy Disk Test
Subtest 08 Display Page
Subtest 02 Sequential W/R/C
Hard Disk Test Subtest 01 Sequential Read
Real Time Clock Test Subtest 02 Backup Memory Test
Tab: HELP (Key Operation)
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1. Enter a number or 0 for Loop Count and press Enter.
Select a number from 1 to 65535 to define the number of times the Running Test executes.
Select 0 to run the test continuously until halted by the user.
2. Select the NO or YES for Error Stop and press Enter.
Select NO to keep the test running even if an error is found.
Select YES to stop the test program when an error is found.
NOTE: All errors which occur during execution of the Running Test are logged in the Log File.
3. Press Insert to add a subtest.
4. Press Delete to remove the selected subtest.
5. Press Enter when you have finished editing the Running Test list.
6. The following message displays:
Do you want to save the data?
Save to disk
Do not save
7. Select the option and press Enter.
8. Select 03 from the Diagnostics Menu and press Enter to execute the Running Test.
NOTE: If press Ctrl+break in the runin process, please press more one any key to exit.
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3.21 Common Tests and Operation
3.21.1 How to operate a window
To input parameters, or open a window use the following keys.
key : to move a highlight bar
[Enter] key : to select an item at the highlight bar
[Esc] key : to close the current window and go back to the previous
window
3.21.2 How to Stop the Test Program
To stop a test:
[Ctrl]+[Break] Press the Ctrl key and the Break key simultaneously.
3.21.3 Test Status Screen
NOTE: The Test Status Screen does not display during all the tests. See the specific test description Sections 3.4 through 3.14.
The following Test Status screen displays during most tests. See the description of each test
Sections 3.4 through 3.14 for specific screen information.
Test Name
Sub Test :0101
Pass Count :00000
Write Data :00
Error Count :00000
Read Data :00
Test Name
Address :00000000 :00
Displays the name of the test being executed.
Subtest No. Displays the Subtest number in the following format: ffgg ff = Subtest No. gg = Step Number (Will be blank if the test does not have a
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Test Program for Field.
Pass Count
Error Count
Write Data
Read Data
Test Address
Error Status
Error Name
Displays the number of times the test has been executed.
Displays the number of errors which have occurred during the test.
Displays only the test data that has failed to compare during the test while being written during the test.
Displays test data that has failed to compare during the test while being read during the test.
Displays the Test Address. (The format differs for each test.)
Displays the error status.
Displays the name of the error.
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Test Program for Field.
3.21.4 Test Stop Display
If an error occurs during a Subtest and YES is selected for Error Stop, the following message displays:
[HALT OPERATION]
* Select 1, 2, or 3
The three selections have the following functions:
1: Terminates the test program and exits to the subtest menu.
2: Continues the test from the error.
3: Restarts the test from the beginning.
Use the arrow keys to move the cursor to the desired option and press Enter.
3.21.5 How to enter data
Letters which must be entered are always shown in [ ]. Simultaneous entries are displayed by a “+” mark. For example:
[a] [Enter]
Press the “a” key, then press the [Enter] key.
[Ctrl] + [c]
Press the [Ctrl] key and the “c” key simultaneously.
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Chapter 4
Replacement Procedures
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Replacement Procedures
Chapter 4 Contents
4.1 Overview.................................................................................................................... 4-1
Safety Precautions ................................................................................................ 4-2
Before You Begin ................................................................................................ 4-3
Disassembly Procedure........................................................................................ 4-4
Assembly Procedure ............................................................................................ 4-5
Tools and Equipment ........................................................................................... 4-5
Screw Tightening Torque .................................................................................... 4-6
Grip Color ............................................................................................................ 4-6
Screw Notation..................................................................................................... 4-7
4.5 Optical disk drive..................................................................................................... 4-16
4.6 Slot in optical disk drive .......................................................................................... 4-18
4.7 HDD(SECOND HDD)............................................................................................ 4-21
4.9 Keyboard.................................................................................................................. 4-28
4.10 Wireless LAN card .................................................................................................. 4-31
4.11 Bluetooth module..................................................................................................... 4-34
4.12 TV Tuner card.......................................................................................................... 4-35
4.14 Top Cover assembly ................................................................................................ 4-42
4.16 USB Board ............................................................................................................... 4-48
4.17 B CAS Board ........................................................................................................... 4-49
4.18 System Board ...........................................................................................................4-
50
4.19 CPU..........................................................................................................................4-
54
4.20 LCD unit / FL inverter ............................................................................................. 4-57
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Replacement Procedures
4.21 Web Camera module................................................................................................ 4-62
4.22 Speaker Box ............................................................................................................. 4-64
4.23 Application for thermal pad and grease on CPU, North Bridge, and VGA
Board………………………………………………………………………….....4-67
Figures
Figure 4-2-1 Remove the battery pack.............................................................................. 4-8
Figure 4-2-2 Install the battery pack................................................................................. 4-9
Figure 4-3-1 Remove a PC card...................................................................................... 4-10
Figure 4-3-2 Insert a PC card.......................................................................................... 4-11
Figure 4-4-1
Turn the compute upside down ................................................................. 4-12
Figure 4-4-2 Remove the SSD/MAIN HDD assembly................................................... 4-13
Figure 4-4-3 Remove SSD/MAIN HDD ........................................................................ 4-14
Figure 4-5-1 Remove an optical disk drive..................................................................... 4-16
Figure 4-5-2 Disassemble the side bracket ..................................................................... 4-17
Figure 4-6-1 Remove an optical disk drive..................................................................... 4-19
Figure 4-6-2 Disconnect the slot in ODD from Motherboard ........................................ 4-19
Figure 4-6-3 Disassemble the bracket from slot in ODD ............................................... 4-20
Figure 4-7-1
Turn the computer upside down................................................................ 4-21
Figure 4-7-2 Remove the second HDD assembly........................................................... 4-22
Figure 4-7-3 Remove the screws and HDD holder......................................................... 4-23
Figure 4-8-1 Remove memory slot cover ....................................................................... 4-26
Figure 4-8-2 Remove a memory module ........................................................................ 4-26
Figure 4-8-3 Insert a memory module ............................................................................ 4-27
Figure 4-9-1 Remove screws for KB Holder.................................................................. 4-29
Figure 4-10-1 Wireless LAN card ................................................................................... 4-31
Figure 4-10-2 Remove a wireless LAN card ................................................................... 4-32
Figure 4-10-3 Cables layout on motherboard……………………………………….......4-33
Figure 4-11-1 Remove a Bluetooth module……………………………………….........4-34
Figure 4-12-1 TV Tuner card………………………… …………………………… ….4-35
Figure 4-13-1 Remove the screws (securing display assembly)....................................... 4-37
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Replacement Procedures
Figure 4-13-2 Remove the screws(from bottom side) ...................................................... 4-38
Figure 4-13-3 Remove the screws(from top side) ............................................................ 4-39
Figure 4-13-4 Remove the Wireless Antenna and LCD cable ......................................... 4-39
Figure 4-13-5 Remove the hinge screws .......................................................................... 4-40
Figure 4-14-1 Remove the Screws(back) ......................................................................... 4-42
Figure 4-14-2 Remove the screws (front) and top cover assembly .................................. 4-43
Figure 4-14-3 Disconnect the touch pad flat cable/Fingerprint cable............................... 4-44
Figure 4-15-1 Remove the touch FFC and Fingerprint cable………..………….……….4-45
Figure 4-15-2 Loose the M2.5x3 screw………………...…………………………….....4-46
Figure 4-15-3 Remove the touchpad and touchpad board……………………………....4-46
Figure 4-16-1 Remove the USB Board............................................................................ 4-48
Figure 4-17-1 Remove the B CAS Board ........................................................................ 4-49
Figure 4-18-1 Disconnect the power cable ...................................................................... 4-50
Figure 4-18-2 Remove the system board ......................................................................... 4-51
Figure 4-18-3 Pull away from the socket of RTC Battery............................................... 4-52
Figure 4-18-4 Rotate the RTC Battery............................................................................. 4-52
Figure 4-18-5 Install the RTC battery.............................................................................. 4-53
Figure 4-19-1 Remove the CPU heat sink ....................................................................... 4-54
Figure 4-19-2 Remove the CPU ...................................................................................... 4-55
Figure 4-19-3 Apply silicon grease.................................................................................. 4-56
Figure 4-20-1 Remove the display mask ......................................................................... 4-57
Figure 4-20-2 Remove the inverter.................................................................................. 4-58
Figure 4-20-3 Remove the LCD unit ............................................................................... 4-59
Figure 4-20-4 Remove the LCD hinge ............................................................................ 4-60
Figure 4-21-1 Remove the connector of Web Camera module ....................................... 4-62
Figure 4-21-2 Peel off the glue of Web Camera module................................................. 4-63
Figure 4-22-1 Removing the securing screws at left side................................................ 4-64
Figure 4-22-2 Removing the securing screws at right side.............................................. 4-65
Figure 4-22-3 Removing the Speaker Box ...................................................................... 4-65
Figure 4-23-1 Intel &AMD Thermal pad on North Bridge………….……………….....4-67
Figure 4-23-2 Apply silicon grease on North Bridge ...................................................... 4-68
Figure 4-22-3 Thermal pad position………………………………………….………....4-68
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Replacement Procedures
4 2
4.1 Overview
This chapter describes the procedure for removing and replacing the field replaceable units
(FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one.
The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual.
In all cases when removing an FRU, the battery pack must also be removed. When repairing an FRU that is the potential cause of a computer fault, use the chart to determine the order in which FRUs need to be removed.
The tilt stand, if it is installed, can be removed without any other FRUs removed.
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Replacement Procedures
Safety Precautions
Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer.
DANGER: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
Due to the risk of alkali fluid leaks, never attempt to heat or disassemble the battery. Similarly, due to the risk of explosion, never expose the battery to flame.
2. Some parts including the power supply and FL inverter generate high voltages. If you need to turn on the power while disassembling the computer, do not touch any connectors or other components due to the risk of electric shock. Also, do not disassemble individual parts when performing routine maintenance.
WARNING: 1. To prevent electric shock, turn off the power unplug the AC adapter from the power source.
2. As the battery installed to the computer is typically already charged, the risk of electric shock remains even when the AC adapter is unplugged from the socket. To prevent electric shock, always take off any metal jewelry or accessories such as necklaces, bracelets or rings before working on the computer. Never work with wet or moist hands.
3. Take care not to injury yourself on any edges or corners.
CAUTION: 1. Confirm that replacement parts have compatible specifications before replacing on the computer. Never use incorrect parts as these may cause faults on the computer.
2. To prevent internal damage such as short circuits or burning, do not allow any screws, paper clips, or other metal objects to fall into the computer. When removing screws, always replace with the same size screws. Ensure that all screws are fully tightened. Loose screws may result in short circuits leading to overheating, smoke or flame.
3. To prevent electric shock, check that you have disconnected all cables from a part before removing the part.
4. When connecting to the AC power supply, use only an AC adapter and cable approved by Toshiba.
5. To prevent electric shock, ensure that all replacement parts are compatible with the computer and that all cables and connectors are securely connected.
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Replacement Procedures
Before You Begin
Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2 Battery Pack”.
1. Do not disassemble the computer unless it is operating abnormally.
2. Use the designated tools.
3. Ensure that the environment for working on and storing parts does not contain any of the following.
Dust or dirt
Static electricity
Extremely hot, cold or humid conditions
4. Perform the diagnostic tests described in Chapter 2 to determine which FRU is the cause of the fault.
5. Do not perform any unnecessary work. Always work in accordance with the disassembly and reassembly procedures in this manual.
6. Keep parts removed from the computer in a safe place away from the computer where they will not be damaged or interfere with your work.
7. Disassembling requires the removal of a large number of screws. Keep removed screws in a safe place such that you can determine which screws belong to which part.
8. When reassembling, ensure that you use the correct screws and fit parts in the correct position. Screw sizes are noted in the text and figures.
9. As all parts have sharp edges and corners, take care not to cut yourself.
10. After replacing an FRU, check that the computer and replaced part operate correctly.
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Replacement Procedures
Disassembly Procedure
Three main types of cable connector are used.
Pressure plate connector
Spring connector
Normal pin connector
When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector. Press down on both sides of the pressure plate such that both sides of the plate and connector are at the same height and that the cable is fixed in the correct position. Pull the cable to ensure that it is securely connected. If the cable is disconnected from the connector, reconnect it making sure that you lift the pressure plate high enough to insert fully the cable.
For spring connectors, lifting up the stopper frees the cable and allows it to be pulled out. To reconnect, hold the stopper in the up position and insert the cable, then lower the stopper to secure the cable.
Normal pin connectors are used for all other cables. Simply pull out or push in these connectors to disconnect or reconnect.
Pressure plate connector
Spring connector
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Replacement Procedures
Assembly Procedure
After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled.
Take note of the following general points when assembling the computer.
Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems.
Check that all cables and connectors are securely connected;
Before fastening FRUs or other parts in place, ensure that no cables are caught on screws or the FRU.
Check that all latches are securely closed.
Ensure that you have installed all FRUs correctly and do not have any screws left over. Using an incorrect screw may damage the thread or screw head and result in the FRU not being securely fastened in place.
After installing FRUs, check that the computer operates correctly.
Tools and Equipment
For your safety and the safety of the people around you, it is important that you use
Electrostatic Discharge (ESD) equipment. Correctly utilizing of the equipment increases the percentage of successful repairs and saves on the cost of damaged or destroyed parts. The following equipment is required for disassembly and assembly.
One Philips screwdriver with type 0 bit (for THIN HEAD screws)
One Philips screwdriver with type 1 bit (for screws other than above)
Tweezers (for lifting screws)
ESD mats (lay on work table or floor)
An ESD wrist strap and heel grounder
Anti-static carpet or flooring
Qosmio X500 Maintenance Manual (960-Q08) 4-5
Replacement Procedures
Screw Tightening Torque
Use the following torque when tightening screws.
CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage.
NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended.
M2.5 (2.5mm)
0.245 N·m(2.5 kgf·cm)
M2.5 (2.5mm)
0.392 N·m(4.0 kgf·cm) for Hinge support
NOTE: To prevent damage to THIN HEAD screws, press along the axis of the screwdriver while turning the screw. This is because the contact area between the screw and driver is less than for a pan head screw (standard pan-shaped screw head).
Grip Color
Some screws have a colored grip area to help you determine the length of the screw.
Even numbered length screws: Brown
Odd numbered length screws: White
Special length screw: Blue
G r ip a r e a
“Special length screw” means screws whose length is indicated in an integral number to the first decimal places such as 2.5 mm, 2.8 mm and so on.
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Replacement Procedures
Screw Notation
To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths are indicated on the computer body.
Format:
Screw shape + Screw length (mm)
Screw shape
B: Bind screw
F: Thin head screw
S: Super thin head screw
T: Tapping screw
U: Other screws (Unique screws: pan head, stud, etc.)
Example: B6 … 6mm bind screw
Qosmio X500 Maintenance Manual (960-Q08) 4-7
Replacement Procedures
4.2 Battery pack
Removing the battery pack
The following describes the procedure for removing the battery pack (See Figure 4-2-1).
CAUTION: Take care not to short circuit the terminals when removing the battery pack.
Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack.
1. Turn off the power of the computer.
2. Disconnect the AC adapter and all external devices from the computer.
3. Turn the computer upside down.
4. Slide and hold the battery release latch (2) to free the battery pack after moving the battery release latch (1) into it unlock position – pick the battery pack out of the computer from fillister.
Figure 4-2-1 Remove the battery pack
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Replacement Procedures
NOTE: Dispose of the used battery pack in accordance with the laws and ordinances of your local authority.
Installing the battery pack
The following describes the procedure for installing the battery pack (See Figure 4-2-2).
CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used battery pack in accordance with the laws and ordinances of your local authority.
Use only the batteries approved by Toshiba.
NOTE: Check visually the battery terminals and clean off any dirt with a dry cloth.
1. Turn off the power of the computer.
2. Disconnect the AC adapter and all external devices from the computer.
3. Insert the battery pack
4. Ensure the battery release latch (1) is moved into its locked position
Figure 4-2-2 Install the battery pack
Qosmio X500 Maintenance Manual (960-Q08) 4-9
Replacement Procedures
4.3 PC card
Removing a PC card
The following describes the procedure for removing a PC card (See Figure 4-3-1).
CAUTION: Insert or remove a PC card in accordance with any instructions in a PC card manual or the manuals of the computer system you are using.
1. Push the PC card. It will pop out PCMCIA Card when you release it. And NEW
Card same as PC card. Then press the card once more to eject a card.
2. Grasp one of PC card and remove it.
NOTE: If a PC card is not inserted all the way, the eject button may not pop out. Be sure to push a PC card firmly and press the eject button again.
Figure 4-3-1 Remove a PC card
Installing a PC card
The following describes the procedure for inserting a PC card (See Figure 4-3-2).
Qosmio X500 Maintenance Manual (960-Q08) 4-10
Replacement Procedures
1. Make sure the PC card does not stick out.
2. Insert a PC card and press it until it is securely connected.
Figure 4-3-2 Insert a PC card
Qosmio X500 Maintenance Manual (960-Q08) 4-11
Replacement Procedures
4.4 SSD/HDD (Main HDD)
Removing a SSD/MAIN HDD-H9.5mm / HDD-H12.5mm
The following describes the procedure for removing the SSD/main HDD (See Figure 4-4-1 to
4-4-3).
CAUTION: Take care not to press on the top or bottom of a SSD/HDD. Pressure may cause data loss or damage to the device.
1. Turn the computer upside down.
2. Remove the following screws securing a SSD/HDD slot cover and remove a
SSD/HDD slot cover.
M2.54.0B
FLAT BIND screw x2
3. Remove the following screws securing the SSD/HDD assembly.
M2.53.0B
FLAT BIND screw x2
4. Disconnect the SSD/HDD assembly from the connector on the system board.
Figure 4-4-1
Turn
the computer upside down
Qosmio X500 Maintenance Manual (960-Q08) 4-12
Replacement Procedures
CAUTION: When a SSD/HDD is installed, they are installed in the position as the following figure.
Figure 4-4-2 Remove the SSD/MAIN HDD assembly
Qosmio X500 Maintenance Manual (960-Q08) 4-13
Replacement Procedures
5. Remove the following screws securing the SSD/HDD holder and remove the SSD/
HDD holder.
M3.03.0B
FLAT BIND screw x4
Figure 4-4-3 Remove SSD/MAIN HDD
Qosmio X500 Maintenance Manual (960-Q08) 4-14
Replacement Procedures
Installing SSD/MAIN HDD-H9.5mm / HDD-H12.5 mm
The following describes the procedure for installing the main HDD.
1. Install a SSD/HDD to the SSD/HDD holder and secure it with the following screws.
M3.03.0B FLAT BIND screw x4
NOTE: Although they are 3mm head screws, screw torque must be set in 2.5kg-cm for four screws securing the HDD holder.
2. Insert the SSD/HDD assembly into the SSD/HDD slot and connect it carefully to the
SSD/MAIN HDD on the system board.
3. Secure the SSD/HDD assembly with the following screw.
M2.5
3.0B
FLAT BIND screw x2
M2.5
4.0B
FLAT BIND screw x2
Qosmio X500 Maintenance Manual (960-Q08) 4-15
Replacement Procedures
4.5 Optical disk drive
NOTE: Do not apply excessive force to the top of an optical disk drive.
Do not touch the shaded portion of the figure below, when the drive is removed or installed.
Removing an optical disk drive
The following describes the procedure for removing an optical disk drive (See Figure 4-5-
1and 4-5-2).
1. Remove MAIN HDD Slot cover and next remove the following screws securing an optical disk drive.
M2.53.0B FLAT BIND screw x1
2. Disconnect an optical disk drive toward the arrow direction from the connector
CN26 on the system board.
Figure 4-5-1 Remove an optical disk drive
Qosmio X500 Maintenance Manual (960-Q08) 4-16
Replacement Procedures
Figure 4-5-2 Disassemble the side bracket
Installing an optical disk drive
The following describes the procedure for installing an optical disk drive.
1. Attach the ODD bracket to an optical disk drive and secure it with the following
screws.
M2.03.0 Flat BIND screw x2
2. Insert an optical disk drive assembly into the slot and connect it to the connector
CN26 on the system board.
3. Secure the ODD drive with the following screw.
M2.5X5.0 Flat BIND screw x1
Qosmio X500 Maintenance Manual (960-Q08) 4-17
Replacement Procedures
4.6 Slot in Optical disk drive
NOTE: Do not apply excessive force to the top of an optical disk drive.
Do not touch the shaded portion of the figure below, when the drive is removed or installed.
Removing an optical disk drive
The following describes the procedure for removing an optical disk drive (See Figure 4-6-1 to 4-6-3).
1. Remove the screws securing Motherboard.
M2.56.5B FLAT BIND screw x3
2. Remove the Motherboard and thermal fan.
3. Remove the screws to disconnect the slot in ODD
M2.03.0B FLAT BIND screw x2
4. Remove the slot in ODD bracket from right side and left side.
M2.02.0B FLAT BIND screw x4
Qosmio X500 Maintenance Manual (960-Q08) 4-18
Replacement Procedures
Figure 4-6-1 Remove an optical disk drive
Figure 4-6-2 Disconnect the Slot in ODD from Motherboard
Qosmio X500 Maintenance Manual (960-Q08) 4-19
Replacement Procedures
Figure 4-6-3 Disassemble the bracket from slot in ODD
Installing an optical disk drive
The following describes the procedure for installing an optical disk drive.
1. Attach the ODD bracket to an optical disk drive and secure it with the following
screws.
M2.02.0 Flat BIND screw x4
2. Insert an optical disk drive assembly into the slot and connect it to the connector
CN26 on the system board and secure it with the following screws.
M2.0
3.0B FLAT BIND screw x2
3. Secure Motherboard with following screws.
M2.5
6.5B FLAT BIND screw x3
Qosmio X500 Maintenance Manual (960-Q08) 4-20
Replacement Procedures
4.7 HDD (SECOND HDD)
Removing second HDD-H9.5mm / HDD-H12.5mm
The following describes the procedure for removing the second HDD (See Figure 4-7-1 to 4-
7-3).
CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause data loss or damage to the device.
1. Turn the computer upside down.
2. Remove the following screws securing a HDD slot cover and remove a HDD slot
cover.
M2.54.0B
FLAT BIND screw x2
3. Remove the following screws securing the HDD assembly.
M2.53.0B
FLAT BIND screw x2
4. Disconnect the HDD assembly from the connector on the system board.
Figure 4-7-1 Turn the computer upside down
Qosmio X500 Maintenance Manual (960-Q08) 4-21
Replacement Procedures
CAUTION: When a HDD is installed, they are installed in the position as the following figure.
Figure 4-7-2 Remove the SECOND HDD assembly
Qosmio X500 Maintenance Manual (960-Q08) 4-22
Replacement Procedures
5. Remove the following screws securing the HDD holder and remove the HDD holder.
M3.03.0B
FLAT BIND screw x4
Figure 4-7-3 Remove the screws and HDD holder
Qosmio X500 Maintenance Manual (960-Q08) 4-23
Replacement Procedures
Installing Second HDD-H9.5mm / HDD-H12.5mm
The following describes the procedure for installing a HDD.
1. Install a HDD to the HDD holder and secure it with the following screws.
M3.0
3.5F
FLAT BIND screw x4
NOTE: Although they are 3mm head screws, screw torque must be set in 2.5kg-cm for four screws securing the HDD holder.
2. Insert the HDD assembly into the HDD slot and connect it carefully to the MAIN
HDD on the system board.
3. Secure the HDD assembly with the following screw.
M2.5
3.0B
FLAT BIND screw x2
M2.5
4.0B
FLAT BIND screw x2
Qosmio X500 Maintenance Manual (960-Q08) 4-24
Replacement Procedures
4.8 Memory module
CAUTION: The power of the computer must be turned off when you remove a memory module. Remove a memory module with the power on risks damaging the module or the computer itself.
Do not touch memory module terminals. Any dirt on the terminals may cause memory access problems.
Never press hard or bend a memory module.
Removing a memory module
To remove a memory module, confirm that the computer is in boot mode. Then perform the following procedure (See Figure 4-8-1 to 4-8-2).
1. Loose the screw securing the memory slot cover.
M2.5
4.0B
FLAT BIND screw x3
2. Remove the memory slot cover.
3. Open the left and right latches and remove a memory module.
Qosmio X500 Maintenance Manual (960-Q08) 4-25
Replacement Procedures
Figure 4-8-1 Remove memory slot cover
Figure 4-8-2 Remove a memory module
Qosmio X500 Maintenance Manual (960-Q08) 4-26
Replacement Procedures
Installing a memory module
To install a memory module, confirm that the computer is in boot mode. Then perform the following procedure (See Figure 4-8-3).
1. Insert a memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly.
CAUTION: The power must be turned off when you insert a memory module. Inserting a memory module with the power on might damage the module or the computer itself.
Never press hard or bend a memory module.
2. Install the memory slot cover and secure it with the screw.
M2.5
4.0B
FLAT BIND screw x3
3. When the power of the computer is turned on, the computer checks automatically the memory size. Confirm that the new memory is detected correctly.
4. If the memory is not detected, check that it is connected correctly.
Socket1
Socket2
Figure 4-8-3 Insert a memory module
Qosmio X500 Maintenance Manual (960-Q08) 4-27
Replacement Procedures
4.9 Keyboard
Removing the keyboard
The following describes the procedure for removing the keyboard (See Figure 4-9-1).
CAUTION: As the keycap may fall out, when handling the keyboard always hold it by the frame and do not touch the keycap.
1. Upside down the computer.
2. Open the display.
3. Remove KBD holder. Insert your finger into the slot between the KBD holder and the keyboard. Then, lift up the keyboard cover to remove it.
4. Loose the screw securing KBD Holder.
M2.5x3.0B Flat BIND screws x4
5. Insert your finger into the keyboard slot and keyboard. Then lift up the keyboard to remove it.
6. Disconnect keyboard cable.
Qosmio X500 Maintenance Manual (960-Q08) 4-28
Replacement Procedures
Figure 4-9-1 Remove screws for KB Holder
Qosmio X500 Maintenance Manual (960-Q08) 4-29
Replacement Procedures
Installing the keyboard
The following describes the procedure for installing the keyboard.
1. Turn the keyboard upside down and place it on the palm rest as its face down.
Connect the keyboard flexible cable to the connector on the system board.
2. Slide and set the speaker cover assembly and secure it with the following screw.
M2.53.0B FLAT BIND screw x4
3. Install the keyboard brace by pressing it from the topside.
Qosmio X500 Maintenance Manual (960-Q08) 4-30
Replacement Procedures
4.10 Wireless LAN card
Removing a Wireless LAN card
The following describes the procedure for removing a Wireless LAN card (See Figure 4-10-1 to 4-10-2).
1. Remove the following screw of wireless cover securing wireless LAN card cover and remove it. And remove screw of wireless board
2. Disconnect the wireless LAN antenna cable from the connectors on a wireless LAN card
3. Open the left and right latches holding a wireless LAN card and remove a wireless
LAN card from the connector on the system board.
Figure 4-10-1 Wireless LAN card
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Replacement Procedures
Figure 4-10-2 Remove a wireless LAN card
Qosmio X500 Maintenance Manual (960-Q08) 4-32
Replacement Procedures
Installing a Wireless LAN card
The following describes the procedure for installing a Wireless LAN card.
1. Insert a wireless LAN card terminals slantwise into the connector on the computer and press a wireless LAN card and lock the secure screws.
M2.5. x 3.0B BIND screw x2
2. Connect the wireless LAN antenna cable to the terminals on a wireless LAN card.
3. Put the wireless LAN antenna cable on the right location from the guide (Antenna cable locate top, USB cable locate bottom and FM cable locate middle).Stick the tape of cable on the surface. If fail to stick, replace tape with new adhesive tape.(see
Figure 4-10-3)
Figure 4-10-3 Cables layout on motherboard
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Replacement Procedures
4.11 Bluetooth module
Remove a Bluetooth module
The following describes the procedure for removing a Bluetooth module(see Figure4-11-1)
1. Disconnect the Bluetooth cable from motherboard side
2. Remove the following screw from TOP case and remove the Bluetooth bracket
2.5.0
3. Remove the Bluetooth module
Figure 4-11-1 Remove a Bluetooth module
Installing a Bluetooth module
The following describes the procedure for installing a Bluetooth module.
1. Insert a Bluetooth into the connector on the computer.
2. Connect the Bluetooth cable to the terminals on a Bluetooth and connect it to the motherboard side.
3. Install the Bluetooth bracket and secure it with following screw.
3.0B BIND
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Replacement Procedures
4.12 TV Tuner card
Removing a TV Tuner card
The following describes the procedure for removing a TV Tuner card (See Figure 4-12-1).
1. Remove the following screw of TOP cover securing and remove it. And remove screw of TV tuner card
2. Disconnect the TV antenna cable from the connectors on a TV tuner card
3. Open the left and right latches holding a TV tuner card and remove a TV tuner card from the connector on the system board.
Figure 4-12-1 TV Tuner card
Qosmio X500 Maintenance Manual (960-Q08) 4-35
Replacement Procedures
Installing a TV Tuner card
The following describes the procedure for installing a TV tuner card.
1. Insert a TV tuner card terminals slantwise into the connector on the computer and press a TV tuner card and lock the secure screws.
2. Connect the TV antenna cable to the terminals on a TV tuner card.
3. Put the TV antenna cable on the right location from the guide(see Figure 4-10-3)
4. Secure TV tuner card with the following screws
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Replacement Procedures
4
4.13 Display assembly
Removing the display assembly
The following describes the procedure for removing the display assembly (See Figure 4-13-1 to 4-13-5).
1. Close the display and turn the computer upside down.
2. Remove the battery pack (See Figure 4-2-1)
3. Remove the Main HDD door screws and open the MAIN HDD Door, remove Optical
Drive Disk.
M2.5
4.0 FLAT BIND screw x2
M2.5
3.0 FLAT BIND screw x1
Figure 4-13-1 Remove the screws (securing display assembly)
4. Open the SECOND HDD Door.
5. Remove the screws from the bottom side.
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Replacement Procedures
M2.5
6.5 FLAT BIND screw x11
M2.5
8.0 FLAT BIND screw x6
M2.5
4.0 FLAT BIND screw x2
M2.5X3.0 FLAT BIND screw x1
M2.5
2.0 FLAT BIND screw x5
Figure 4-13-2 Remove the screws (from bottom side)
6. Disassemble KBD Holder and Keyboard screw (See Figure 4-9-1)
M2.5x3.0 Flat BIND screws x4
7. Remove the screws from the top side and remove the cover.
M2.5x6.5 Flat BIND screws x7
M2.5x3.0 Flat BIND screws x2
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Replacement Procedures
Figure 4-13-3 Remove the screws (from top side)
8. Disconnect the FFC and cables.
9. Disassembly TOP cover.
10. Pull out the wireless LAN antenna and LCD cables from the guide.
Figure 4-13-4 Remove the Wireless Antenna and LCD cable
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Replacement Procedures
Opening the display to 135degree, and remove the hinge screw.
‧
M2.5
6.5 FLAT BIND screw x6 (Locktight)
Figure 4-13-5 Remove the hinge screws
11. Pulling out the pole of hinge from the hole of hinge assembly, remove the display
assembly from the base assembly.
Installing display assembly
The following describes the procedure for installing the display assembly.
1. Inserting the pole of hinge to the hole of hinge assembly, set the display assembly on the base assembly.
2. Secure the hinges with the following screws secure the display mask with the following screws and stick the mask seal on them.
M2.56.5 FLAT BIND screw x6 (Locktight)
NOTE: Be sure to apply the locktight to the screws instructed in the figure above.
3. Connect the LCD harness to the connector on the system board.
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Replacement Procedures
4. Arrange the wireless antenna cables along the guide (front) and secure them with
guide.
5. Pass the cables to the back of computer through the slot.
6. Arrange the wireless LAN antenna along the guide and contact with the connector.
7. Install the LAN board and cover ASSY of the system, secure it with the screws
M2.5x6.5 Flat BIND screws x7
8. Install the KBD Holder and Keyboard with screws
M2.5x3.0 Flat BIND screws x4
9. Turn the computer downside and Secure the bottom with screws
M2.5
6.5 FLAT BIND screw x11
M2.5
8.0 FLAT BIND screw x6
M2.5
4.0 FLAT BIND screw
M2.5
3.0 FLAT BIND screw x2 x1
M2.5
2.0 FLAT BIND screw x5
10. Install battery pack, HDD door and Optical Drive Disk with screws
M2.5
4.0 FLAT BIND screw x2
M2.5
3.0 FLAT BIND screw
x1
NOTE: If Fingerprint or Dust left on LCD screen during disassembly and assembly
LCD units, please follow Appendix A to clean it.
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Replacement Procedures
4.14 Top Cover assembly
Removing the Top cover assembly
The following describes the procedure for removing the top cover assembly (See Figure 4-
14-1 to 4-14-3).
1. Turn over the computer.
2. Remove the following screws securing the top cover assembly from the back and bottom of computer.
M2.52.0 FLAT BIND screw Back x5
M2.56.5 FLAT BIND screw Back x11
M2.58.0
FLAT BIND screw Back x6
M2.54.0 FLAT BIND screw Back x2
M2.53.0 FLAT BIND screw Back x1
Figure 4-14-1 Remove the screws (back)
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Replacement Procedures
3. Remove the following screws securing the top cover assembly from the front of computer. Pull up and remove the top cover assembly from the base assembly.
M2.5x6.5 Flat BIND screws x7
Figure 4-14-2 Remove the screws (front) and top cover assembly
4. Disconnect the touch pad flat cable/Fingerprint cable from the connector on the system board.
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Replacement Procedures
Figure 4-14-3 Disconnect the touch pad flat cable/Fingerprint cable
Installing Top Cover assembly
The following describes the procedure for installing the top cover assembly.
1. Install the top cover assembly to the base assembly.
NOTE: Be careful not to catch the cables between top cover assembly and base assembly.
2. Connect the touch pad flat cable to the connector on the system board.
3. Secure the top cover assembly with following screws from the front of computer.
M2.5x6.5 Flat BIND screws x7
M2.5x3.0 Flat BIND screws x2
4. Secure the top cover assembly with the following screws from the back and bottom of computer.
M2.5
2.0 FLAT BIND screw x5 M2.56.5 FLAT BIND screw x11
M2.5
8.0 FLAT BIND screw x6 M2.54.0 FLAT BIND screw x2
M2.5
3.0 FLAT BIND screw x1
5. Free the cable from cable-drain when through the antenna cable to PCB hole.
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Replacement Procedures
4.15 Touch pad
Removing the touch pad
The following describes the procedure for removing the touch pad (See Figure 4-15-1 to 4-
15-3).
1. Peel off the glass tape and disconnect the touch pad flat cable, Fingerprint cable from the connector on the touch pad.
2. Remove the following screws securing the touch pad plate.
M2.03.0B SUPER THIN HEAD screw x10
3. Remove the touch pad board and touch pad plate.
4. Peel off and remove the touch pad from the top cover assembly.
Figure 4-15-1 Remove the touch FFC and Fingerprint cable
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Replacement Procedures
Figure 4-15-2 Loose the M2.5x3 screw
Figure 4-15-3 Remove the touchpad and touchpad board
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Replacement Procedures
Installing the touch pad
The following describes the procedure for installing the touch pad.
1. Peel off the separator covering on the sensor portion of a new touch pad.
NOTE: Do not reuse the touch pad so that it can not be used after peeling off from the computer. Be sure to stick a new touch pad.
When sticking the touch pad, be careful not to get the bubbles under the touch pad.
2. Stick and install the touch pad on the top cover assembly.
3. Install the touch pad plate and secure it with the following screws.
M2.53.0 SUPER THIN HEAD screw x10
4. Stick the insulator on the touch pad plate.
5. Connect the touch pad flat cable to the connector on the touch pad and stick the
glass tape on the connector.
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Replacement Procedures
4.16 USB Board
The following describes for removing the USB board (See Figure 4-16-1).
Removing the USB Board
1. Pull out the USB cable, Audio cable, from USB board connector.
2. Loose the below screws and then incline pull out USB board.
M2.5x6.5 FLAT BIND screw x2
Figure 4-16-1 Remove the USB board
Installing the USB Board
The following describes the procedure for installing the USB board.
1. Insert the USB board into base case and connect USB board cable, Modem cable
2. Fix the below screws
M2.5x6.5 FLAT BIND screw x2
NOTE: Be careful not to catch the cables between top cover assembly and base assembly.
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Replacement Procedures
4.17 B CAS Board
The following describes for removing the B CAS Board (See Figure 4-17-1).
Removing the B CAS Board
1. Pull out the B CAS FFC from USB board connector.
2. Loose the below screws and then incline pull out B CAS board.
M2.5x3 FLAT BIND screw x4
Figure 4-17-1 Remove the B CAS Board
Installing the B CAS Board
The following describes the procedure for installing the B CAS board.
1. Insert the B CAS board into base case and connect B CAS board FFC.
2. Fix the below screws
M2.5x3 FLAT BIND screw x4
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Replacement Procedures
4.18 System Board
CAUTION: 1. when handling the system board, always hold by the edges. Do not touch the printed circuit face.
2. if replacing with a new system board, execute the subtest01 Initial configuration in section 3.3 “Setting of the hardware configuration”. Also update with the latest BIOS
Removing the System Board
The following describes the procedure for removing the system board (See Figure 4-18-1 to
4-18-2).
1. Disconnect the power cable from the system board.
Power Cable
Figure 4-18-1 Disconnect the power cable
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Replacement Procedures
2. Disconnect the speaker cable, LCD CABLE, WIRELESS ANTENNA, CRT cable,
USB cable, FM CABLE, MDC CABLE, and TV-F ANTENNA from the connector on the system board.
3. Remove the following screws securing the fan and the system board and remove the
system board.
M2.56.5 screw x2
M2.56.5 screw x3
Figure 4-18-2 Remove the system board
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Replacement Procedures
Removing RTC battery
The following describes the procedure for removing the RTC battery unit (See Figure 4-18-3 to 4-18-4).
1. Pull the away the socket of RTC battery and use a clamp to hold RTC battery tightly.
Figure 4-18-3 Pull away from the socket of RTC Battery
2. Rotate battery through the way then remove it.
Figure 4-18-4 Rotate the RTC Battery
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Replacement Procedures
Installing the System Board
The following describes the procedure for installing the system board.
1. Secure the system board with the following screws.
M2.5
6.5
x3
2. Secure the fan with the following screws.
M2.5
6.5
3. Connect the speaker cable, LCD CABLE, WIRELESS ANTENNA, CRT cable,
USB cable, FM CABLE, MDC CABLE, and TV-F ANTENNA to the connector on the system board.
4. Connect the power cable to the connector on the system board
Installing RTC battery
The following describes the procedure for installing the RTC battery unit
(See Figure 4-18-5).
1. Press the force vertically then lock the RTC battery tightly.
Figure 4-18-5 Install the RTC battery
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Replacement Procedures
4.19 CPU
Removing the CPU heat sink
The following describes the procedure for removing the CPU heat sink (See Figure 4-19-1 to
4-19-2).
1. Disconnect the Heat sink cable from the connector on the system board
2. Remove the following screws securing the heat sink holder along 1 to 4.
NOTE: When removing the heat sink holder, be sure to remove the screws in the reverse order of the number marked on the holder.
3. Remove the CPU heat sink.
Figure 4-19-1 Remove the CPU heat sink
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Replacement Procedures
4. Unlock the CPU by rotating the cam on the CPU socket 120 degrees to the counterclockwise with a flat-blade screwdriver.
5. Remove the CPU.
Figure 4-19-2 Remove the CPU
Installing the CPU
The following describes the procedure for installing the CPU (see Figure 4-19-3)
1. Check that the mark of cam is in the unlocking position.
2. Attach the CPU to the correct position in the CPU socket.
3. Fix the CPU by rotating the cam 120 degrees to the clockwise with a flat-blade screwdriver.
4. If there is already silicon grease on the CPU, clean it with a cloth.
Using a special applicator, apply silicon grease so that the CPU chip on the CPU is completely covered.
5. Please apply 0.1cc silicon grease (Shinetsu 7762) for each repair.
And apply
Thermal pad for N-bridge, VGA&V-RAM for each repair
NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. Thermal pad is fixed for each one, no need special applicator.
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Replacement Procedures
Figure 4-19-3 Apply silicon grease
6. Install the CPU heat sink and heat sink holder and secure them with the following
screws along 1 to 4.
M2
2 screw x4
7. Connect the Heat sink cable to the connector on the system board
NOTE: When securing the heat sink holder, be sure to secure the screws in the order of the number marked on the holder.
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Replacement Procedures
4.20 LCD unit / FL inverter
CAUTION: When replacing a LCD, it is required that SVP parameter is set. Update with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite
Procedures”.
Removing the LCD unit / FL inverter
The following describes the procedure for removing the LCD unit and FL inverter (See
Figure 4-20-1 to 4-20-4).
Remove Screw MYLAR cover X8
1. Remove the following screws securing the display mask
M2.5
6.5
screw X8
2. Insert your finger between the edge of the display mask and the LCD, and remove the
display mask while releasing the latches of display mask.
Figure 4-20-1 Remove the display mask
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Replacement Procedures
3. Pull out one insulator and peel off the other one adhered to the inverter.
4. Disconnect the LCD harnesses from the connectors CN1 on the inverter.
5. Disconnect the HV harnesses from the connectors CN2 on the inverter.
6. Remove the FL inverter while peeling off the double-sided tape.
CN1
Insulator
CN2
Inverter
Double-sided tape
HV harness
Figure 4-19-2 Remove the inverter
LCD harness
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Replacement Procedures
7. Remove the following screws securing the LCD unit.
8. With the bottom edge of the LCD unit on the display cover, lift only the top edge of the LCD unit. After peeling off the CONDUTIVE tape, disconnect the LCD harness from the connector on the back of the LCD.
9. Remove the LCD unit.
LCD HARNESS
Figure 4-20-3 Remove the LCD unit
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Replacement Procedures
10. Remove the following screws securing the LCD support (LCD unit side) and remove the hinge from the LCD unit.
M2.0x2.5 screw x8
Figure 4-20-4 Remove the LCD hinge
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Replacement Procedures
Installing the LCD unit/FL Inverter
The following describes the procedure for installing the LCD unit and FL inverter.
Install the LCD supports (LCD unit side) and hinge to the LCD and secure them with the following screws.
M2.02.5 BINK screw x8
1. Stand the LCD unit on the display cover and connect the LCD harness to the connector on the back of LCD.
2. Stick the conductive tape on the connector of LCD harness.
3. Secure the LCD unit with the following screws.
4. Connect LCD harnesses to the connector CN1 of the inverter.
CAUTION: Be careful not to connect the LCD harnesses to the wrong connectors of FL inverter.
5. Connect HV harnesses to the connector CN2 of the FL inverter.
6. Install the display mask while fitting the latches.
7. Secure the display mask with following screws
M2.5
6.5 screw X8
8. Cover screws with Screw MYLAR cover X8
NOTE: When installing the display mask, make sure there is no gap between the display mask and the display cover.
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Replacement Procedures
4.21 Web Camera module
Removing Web Camera module
The following describes the procedure for removing the Web Camera module.
(See Figure 4-21-1 to 4-21-2).
1. Pull off the connector of Web Camera module.
Figure 4-21-1 Remove the connector of Web Camera module
2. Peel off the glue of Web Camera module.
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Replacement Procedures
Figure 4-21-2 Peel off the glue of Web Camera module
Installing Web Camera module
The following describes the procedure for installing the Web Camera module.
1. Pull in the glue of Web Camera Module.
2. Connect the connector of Web Camera module.
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Replacement Procedures
4.22 Speaker Box
Removing Speaker Box
The following describes the procedure for removing Speaker Box.
(See Figure 4-22-1 to 4-22-3).
1. Remove the following screws securing Speaker Box.
M2.5
2.0 screw x 4
Figure 4-22-1 Removing the securing screws at left side.
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Replacement Procedures
Figure 4-22-2 Removing the securing screws at right side.
2. Removing the Speaker Box.
Figure 4-22-3 Removing the Speaker Box.
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Replacement Procedures
Installing Speaker Box
The following describes the procedure for installing Speaker Box.
1. Installing the Speaker Box.
2. Securing Speaker Box of following screws.
M2.5
2.0 screw x 4
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Replacement Procedures
4.23
Application for Thermal pad and grease on CPU, North Bridge, and
VGA board (see Figure 4-22-1 to 4-22-3)
I. For Silvis thermal pad on North Bridge and grease on CPU
Figure 4-23-1 Intel &AMD Thermal pad on North Bridge
RAW PN TSB PN Vendor Description
JXTZ1024010
A000048640
THERMAL PAD INT NB BS TZ1(JXTZ1024,3A)
XY0GFCM1000
A000018440
THERMAL GREASE GFC-M1
II. Use grease and Thermal pad on VGA
1. 0.15cc for one repair.
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Replacement Procedures
Figure 4-23-2 Apply silicon grease for North Bridge
2. Thermal pad and grease used on VGA thermal module.
Figure 4-22-3 Thermal pad position
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Replacement Procedures
RAW PN TSB PN Vendor Description
JXTZ1027010
A000048650
THERMAL PAD VGA V-RAM AD(JXTZ1027,3A)
JXTZ1026010
A000048660
THERMAL PAD VGA CHOKE AD(JXTZ1026,3A)
XY0GFCM1000
A000018440
THERMAL GREASE GFC-M1
NOTE: Thermal pad is fixed for each one, no need special applicator and can re-use.
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Appendix A
Appendix A Handling the LCD Module
Precautions for handling the LCD module
The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module:
1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained.
2. Be careful to align the holes at the four corners of the LCD module with the corresponding holes in the LCD cover before securing the module with screws.
Do not force the module into place, because stress can affect its performance.
Also, the panel’s polarized surface is easily scarred, so be careful when handling it.
A-1 Qosmio X500
Maintenance Manual Maintenance Manual (960-Q08)
Handling the LCD Module
3. If the panel’s surface gets fingerprint or dust, put on gloves and wipe it with static electricity cloth. If it is still dirty, drop some cleaning alcohol on the surface and wipe it again
If the surface is much more fingerprint or dust, we recommend a CRT cleaning agent.
Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel.
If dust still exists, please use ionic FAN which can avoid static electricity to deal with it.
4. If water or other liquid is left on the panel’s surface for a long period, it can change the screen’s tint or stain it. Be sure to quickly wipe off any liquid with cloth or ionic
FAN
A-2 Qosmio X500
Maintenance Manual Maintenance Manual (960-Q08)
Handling the LCD Module
5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks.
6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
A-3 Qosmio X500
Maintenance Manual Maintenance Manual (960-Q08)
Handling the LCD Module
7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods.
8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
A-4 Qosmio X500
Maintenance Manual Maintenance Manual (960-Q08)
Handling the LCD Module
10. If you transport the module, do not use packing material that contains epoxy resin
(amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
A-5 Qosmio X500
Maintenance Manual Maintenance Manual (960-Q08)
Appendix B
Appendix B Board Layout
B.1 System Board
27 23
0
1
08
21
20
1
9
22
0
3
0
5
0
2
26
13
0
6
1
8
14
11
1
2
0
4
24
07
09
15
1
0
17
28
1
6
Figure B-1-1 System board layout (front)
Qosmio X500
Maintenance Manual (960-Q08) B-1
42
32
29
43
3
1
33
34
30
25
8
41
40
35 37
39
38
Figure B-1-2 System board layout (Back)
B-2 Qosmio X500
Maintenance Manual (960-Q08)
Board Layout
Table B-1-1 System board ICs and connectors
NUM Location Function
(11) CN20 K/B LED power CONN
(22) CN26 TV Tuner CONN
Qosmio X500
Maintenance Manual (960-Q08) B-3
(23) CN13 Power/B CONN
(25)
(26)
U13
U4
Clock generator
Embedded Controller IC
(28) U27 Card Reader /1394
(29) U35 CPU
(32)
(33)
(34)
(35)
CN32
PCN1
CN46
CN47
2nd SATA HDD CONN
DC IN CONN
Main SATA HDD CONN
SATA ODD CONN
(42) PCN0 VGA Power CONN
B-4 Qosmio X500
Maintenance Manual (960-Q08)
Board Layout
B.2 Touch Pad Board
<Front layout>
01 02 03 04
Figure B-2-1 Touch Pad board layout (Front)
Table B-2-2 Touch Pad board connectors
NUM
Location Function
(01) SW1 Mouse Button Left key
(02) SW3 Mouse Button Left key
<Back layout>
Qosmio X500
Maintenance Manual (960-Q08) B-5
01
02
Figure B-2-3 Touch Pad board layout (Back)
Table B-2-2 Touch Pad board connectors
NUM
Location Function
(01) CN3 TP Board to TP Module CONN
(02) CN1 TP Board to M/B CONN
B-6 Qosmio X500
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Board Layout
B.3 Finger Print Board
<Front layout>
01
Figure B-3-1 Finger Print Board layout (Front)
Table B-3-2 Finger Print Board connectors
Location
(01) U2 Finger Printer IC
Qosmio X500
Maintenance Manual (960-Q08) B-7
<Back layout>
01
02
Figure B-3-3 Finger Print Board layout (Back)
Table B-3-4 Finger Print Board connectors
Location
(01) CN2 Finger Print Board to TP Board connector
(02) CN3 Finger Print Board to TP Board connector
B-8 Qosmio X500
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Pin Assignment
Appendix C Pin Assignment
CN11 LCD Panel Connectors
PIN No. Signal name
1 VIN
3 VIN
5 VIN
7 +3V
I/O PIN No. Signal name I/O
---
---
_POWER --- I/O
11 MIC_GND --- 12 GND ---
13 INT_MIC_R
15 DISPON
17 GND
I/O 14 USBP3+_LCD
--- 16 USBP3-_LCD
--- 18 GND
I/O
I/O
---
23 GND --- 24 GND ---
25 LCD_TXLOUT0+ I/O 26 LCD_TXUOUT0+ I/O
27 LCD_TXLOUT0- I/O 28 LCD_TXUOUT0- I/O
29 GND --- 30 GND ---
31 LCD_TXLOUT1+ I/O 32 LCD_TXUOUT1+ I/O
33 LCD_TXLOUT1- I/O 34 LCD_TXUOUT1- I/O
35 GND --- 36 GND ---
37 LCD_TXLOUT2+ I/O 38 LCD_TXUOUT2+ I/O
39 LCD_TXLOUT2- I/O 40 LCD_TXUOUT2- I/O
41 GND --- 42 GND ---
1
Qosmio X500
Maintenance Manual (960-Q08)
CN24 MMB Connector
PIN No. Signal name
1 +3VPCU
3 KEY_INT
I/O PIN No. Signal name
I 4 GND
Pin Assignment
I/O
---
---
CN20 Keyboard LED Connectors
PIN No. Signal name I/O PIN No. Signal name I/O
CN13 Power Board Connectors
PIN No. Signal name I/O PIN No. Signal name I/O
CN16 Keyboard Connectors
PIN No. Signal name I/O PIN No. Signal name I/O
2
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
11 MY3 O 12 MY5 O
17 MY7 O 18 MY9 O
23 MX7 O 24 MX2 O
25 MX3 O 26 MX4 O
27 MX0 O 28 MX5 O
29 MX6 O 30 MX1 O
CN21 Touchpad & Fingerprint Connectors
PIN No. Signal name I/O PIN No. Signal name I/O
CN1
8 Felica Connectors
3
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
PIN No. Signal name
1 +5V_Felica
3 USBP4+
5 NC
I/O
CN10 Audio&USB Board Connectors
PIN No. Signal name I/O
PIN No.
PIN No.
Signal name
Signal name
I/O
I/O
---
---
I/O
11 +3V --- 12 HP_JD I
15 GND --- 16 GND ---
17 HPR O 18 MIC1-R O
19 HPL O 20 MIC1-L O
21 GND O 22 GND ---
CN32 New Card Connectors
PIN No. Signal name I/O PIN No. Signal name I/O
4
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
5 --- --- ---
7 NEW SMCLK I 8 NEW SMDATA
I
I/O
---
I/O
14 I
---
22 O
7 WCS_DAT O 8 +3V
9 BT_EN
CN45 RTC Battery Connectors
O 10 GND
---
CN27 Blue Tooth Connectors
PIN No. Signal name
1 GND
I/O
---
PIN No. Signal name I/O
I/O
3 USBP2- I/O
5 GND
---
---
5
Qosmio X500
Maintenance Manual (960-Q08)
PIN No. Signal name PIN No. Signal name
Pin Assignment
I/O I/O
CN2 CRT Connectors
PIN No. Signal name I/O PIN No. Signal name I/O
1 +5V --- 2 NC
15 GND ---
CN14 FAN Connectors
PIN No. Signal name I/O PIN No. Signal name I/O
3 FANSIG1 O
CN48 Battery Connectors
PIN No. Signal name I/O PIN No. Signal name I/O
6
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
1 MBAT+
3 ID O 4 B/I
5 TEMP_MBAT O 6 MBDATA
7 MBCLK
9 GND
11 GND
13 GND
--- 12 GND
---
CN15 MINI PCI-E Card WLAN Connectors
---
---
I/O
---
---
---
PIN No. Signal name
7 ---
9 GND
I/O PIN No.
Signal name
1 WLAN_WAKE# O 2 +3V
3 WCS_DATR ---
5 WCS_CLKR ---
I/O
---
---
---
I/O
I/O
I/O
13 CLK_PCIEI_MINI I 14 LAD3_PCIE
15 GND
17 NC
--- 16 LFRAME#_PCIE
--- 18 GND
I/O
I
---
19 NC
21 GND
23 PCIE_RXN1
25 PCIE_RXP1
27 GND
29 GND
--- 20 RF_EN_WLAN
--- 22 PLTRST#
O 24 +3V_S5
O 26 GND
--- 28 +1.5V
--- 30 WL_SMCLK
I
I
---
---
---
I/O
7
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
31 PCIE_TXN0
33 PCIE_TXP0
35 GND
37 GND
I 32 WL_SMDATA
I 34 GND
--- 36 USBP3-_B
--- 38 USBP3+_B
39 NC
41 NC
--- 40 NC
--- 42 NC
43 GND --- 44 LED_WLAN#
45 CL_CLK1_MIN --- 46 LED_WPAN#
47 CL DATA1 MIN --- 48 +1.5V
49 CL_RST#1_MIN --- 50 GND
51 SERIRQ_WLAN O 52 +3V
CN
26 TV Connectors
PIN No. Signal name
1 GND
I/O PIN No. Signal name
I/O
---
I/O
I/O
---
---
---
---
---
---
---
I/O
5 GND
CN33 5 in 1 Card Reader Connectors
PIN No. Signal name
1 NC
3 XBCCLK-P3P
5 BCCDET-P3N
I/O PIN No. Signal name
--- 4 GND
---
I/O
I/O
I/O
8
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
7 NC
9 GND
11 NC
13 NC
15 GND
17 BCRST-P3N
19 BCPWON-P3P
21 GND
23 NC
25 NC
27 GND
29 GND
31 NC
33 NC
35 GND
37 GND
39 +3.3V
41 +3.3V
43 GND
45 NC
47 TMPTU2-SXP
49 NC
51 NC
CN31 DDR Connectors
I/O 12 NC
I/O 14 NC
---
I
---
I/O
--- 16 BCIO-P5P I/O
I/O 18 IVDET-P3P ---
I/O 20 NC I/O
--- 22 RESET# I/O
I/O 24 +3.3V
I/O 26 GND
---
I
--- 28 NC ---
I/O 30 USB I
--- 34 GND
I
---
I/O
I/O 38 USB I/O
--- 40 GND ---
--- 42 NV ---
I/O 44 CPLGP1-P3P I/O
--- 48 NC
I/O 50 GND
I/O 52 +3.3V
---
O
I
9
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
PI N No. Signal name
1 +0.9VSMDDR_VREF_
DIMM
I/O PIN No.
--- 2
Signal name
GND
I/O
---
3 GND
5 M_B_DQ5 I/O I/O
7 M_B_DQ4 I/O ---
9 GND
11 M_B_DQS#0 I/O ---
13 M_B_DQS0 I/O I/O
15 GND
17 M_B_DQ2
19 M_B_DQ3
21 GND
23 M_B_DQ8
25 M_B_DQ9
27 GND
I/O
I/O
---
---
---
---
31 M_B_DQS1 I/O I
33 GND --- ---
35 M_B_DQ14 I/O I/O
37 M_B_DQ15 I/O I/O
39 GND
41 GND
--- ---
--- ---
43 M_B_DQ20 I/O I/O
45 M_B_DQ17 I/O I/O
47 GND --- ---
10
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
51 M_B_DQS2 I/O I
53 GND --- ---
55 M_B_DQ23 I/O I/O
57 M_B_DQ22 I/O I/O
59 GND --- ---
61 M_B_DQ28 I/O I/O
63 M_B_DQ25 I/O I/O
65 GND --- ---
67 M_B_DM3 I 68 M_B_DQS#3
69 NC
71 GND --- ---
73 M_B_DQ30 I/O I/O
75 M_B_DQ31 I/O I/O
77 GND
79 M_CKE3
81 +1.8VSUS
--- ---
I 80 M_CKE4 I
83 NC ---
85 M_B_BS#2 I 86 M_B_A14 ---
87 +1.8VSUS
89 M_B_A12
91 M_B_A9
93 M_B_A8
95 +1.8VSUS
97 M_B_A5
99 M_B_A3
101 M_B_A1
11
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
103 +1.8VSUS
105 M_B_A10
107 M_B_BS#0
109 M_B_WE#
111 +1.8VSUS
--- 104 +1.8VSUS ---
I/O I
I
I
---
I
I
I 113 M_B_CAS#
115 M_CS#3
117 +1.8VSUS
119 M_ODT3
121 GND
123 M_B_DQ32
125 M_B_DQ36
127 GND
I
I
---
I
---
I/O
I/O
---
129 M_B_DQS#4 I/O
131 M_B_DQS4 I/O
133 GND ---
118 +1.8VSUS ---
---
---
---
---
135 M_B_DQ35
137 M_B_DQ34
139 GND
141 M_B_DQ41
143 M_B_DQ40
145 GND
147 M_B_DM5
149 GND
151 M_B_DQ43
153 M_B_DQ46
I/O
I/O
---
I/O
I/O
---
I
---
I/O
---
---
---
12
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
157 M_B_DQ52
159 M_B_DQ49
161 GND
163 NC
--- 162 GND
165 GND
167 M_B_DQS#6 I/O
169 M_B_DQS6
171 GND
173 M_B_DQ55
175 M_B_DQ50
--- 172 GND
177 GND
179 M_B_DQ56
181 M_B_DQ57
183 GND
185 M_B_DM7
--- 178 GND
I/O
187 GND
189 M_B_DQ59
191 M_B_DQ63
193 GND
---
---
---
---
---
---
--- 200 SA1
---
--
--- 199 +3V
CN41 HDMI Connectors
13
Qosmio X500
Maintenance Manual (960-Q08)
PIN No. Signal name I/O PIN No.
3 HDMITX2N_ C
5 GND
--- 4
Signal name
HDMITX1P_ C
Pin Assignment
I/
O
---
---
---
11 GND
13 CEC
15 HDMI DDCCLK C
17 GND
I/O 16
21 GND
23 GND
CN47 ODD Connectors
PIN No. Signal name
1 GND
---
I/O PIN No.
HAMI DDCDATA C
---
---
---
---
---
Signal name I/
O
---
7 GND ---
11 NC
13 GND
15 GND I/O
---
---
14
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
CN39 VGA Connectors
PIN No. S ignal name
2 PEG_TXN15
4 PEG_TXP15
6 GND
8 PEG_TXN14
10 PEG_TXP14
12 GND
14 PEG_TXN13
16 PEG_TXP13
18 GND
20 PEG_TXN12
22 PEG_TXP12
24 GND
26 PEG_TXN11
28 PEG_TXP11
30 GND
32 PEG_TXN10
34 PEG_TXP10
36 GND
38 PEG_TXN9
40 PEG_TXP9
42 GND
44 PEG_TXN8
46 PEG_TXP8
48 GND
50 PEG_TXN7
52 PEG_TXP7
54 GND
56 PEG_TXN6
58 PEG_TXP6
PI N No. Sign al name
1 E
3 E
5 N
7 E
9 E
11 N
13 E
15 E
17 N
19 E
21 E
23 N
25 E
27 E
29 N
31 E
33 E
35 N
37 E
39 E
41 N
43 E
45 E
47 N
49 E
51 E
53 N
55 E
57 E
15
Qosmio X500
Maintenance Manual (960-Q08)
60 GND
62 PEG_TXN5
64 PEG_TXP5
66 GND
68 PEG_TXN4
70 PEG_TXP4
72 GND
74 PEG_TXN3
76 PEG_TXP3
78 GND
80 PEG_TXN2
82 PEG_TXP2
84 GND
86 PEG_TXN1
88 PEG_TXP1
90 GND
92 PEG_TXN0
94 PEG_TXP0
96 GND
98
EXT_CRT_DDCCL
K
100
EXT_CRT_DDCD
AT
102 GND
104
106
EXT_HDMI_DDCC
LK
EXT_HDMI_DDCD
AT
108 GND
110
EXT_LVDS_PNLC
LK
112 EXT_LVDS_PNLD
59 N
61 E
63 E
65 N
67 E
69 E
71 N
73 E
75 E
77 N
79 E
81 E
83 N
85 E
87 E
89 N
91 E
93 E
95 N
97
9 9
10 N
10 3
KP
10 5
10 A
10 9
111 VGA_MBDATA
16
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
Pin Assignment
AT
114 GND
116 EXT_VGA_RED
118 GND
120 EXT_VGA_GRN
122 GND
124 EXT_VGA_BLU
126 GND
128
EXT_LVDS_TXL#
2
130
EXT_LVDS_TXL2
132 GND
134
EXT_LVDS_TXL#
1
136
EXT_LVDS_TXL1
138 GND
140
EXT_LVDS_TXL#
0
142
148
EXT_LVDS_TXL0
144 GND
146
EXT_LVDS_TXLC
K#
EXT_LVDS_TXLC
K
150
GND
152 X
154 X
156 X
11 G
11 X N
11 X P_ON
11 P
12 N
12 X NC
12 X
127
129
2
13 X S_TXU2
13 3
13 5
1
S_TXU#
13 X LVDS_TXU1
13 9
14 1
0
X VDS_TXU#
14 X VDS_TXU0
14 5
14 7
14 9
K
151 GND
153 X
155 X
S_TXUC
17
Qosmio X500
Maintenance Manual (960-Q08)
158 5V
160 5V
162 X
164 X
166 DP_CAD
168 CEC
170 GND
172 EXT_DPTX3N
174 EXT_DPTX3P
176 GND
178 EXT_DPTX2N
180 EXT_DPTX2P
182 GND
184 EXT_DPTX1N
186 EXT_DPTX1P
188 G ND
190 EXT_DPTX0N
192 EXT_DPTX0P
194 GND
196 DP_AUX1P
198 D P_AUX1N
200 GND
CN35 LAN Connectors
PIN No. Signal name
15 7 X
15 V
16 V
16 V
16 V
16 V
16 9 X
17 1 X
17 V
175 GND
177 EXT_HDMICLK-
179 EXT_HDMICLK+
181 GND
183 EXT_HDMITX2N
185 EXT_HDMI TX2P
187 G ND
189 EX T_HDMITX 1N
191 E XT_HDMITX 1P
193 GND
195 EXT_HDMITX0N
197 EX T_HDMITX
199 GND
0P
I/O PIN No . Sign al name
Pin Assignment
I/ O
---
---
18
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
9
11
LAN _ VCC4 ---
LAN _ ACTLED ---
10
12
LAN _ LINKLED# ---
LAN _ GND ---
C N37 USB Conn ectors
PI N No.
1 GND
Signal name I/O PI N No. Signa l name
BUSBP6+
3 BUS
5 GND
BP6-
7 GND
CN32 2nd SATA HDD Connecto rs
P IN No. Signa l name
USBPWR2
--- GN D
GND
I/O P IN No. Sig nal name I/O
I/O
---
---
---
---
11 GND --- 12 GND ---
13 GND --- 14 +5V ---
---
17 GND --- 18 --- ---
19 GND --- 20 --- ---
21 --- --- 22 --- ---
19
Qosmio X500
Maintenance Manual (960-Q08)
CN3 3 5 in 1 Card R eader Connec tors
PIN No. Sig nal name I/O PIN No.
Pin Assignment
Signal name I/O
7 XD _ALE_ 8 XD _C
I
21 VCC_XD ---
23 MS_D 3/XD_D I/O
22 MS_D0/ XD_D2_C
D
I/O
27 GND
29 MS_D2/XD_D1_C SD_D0_C I/O
31 MS_D0/XD_ 32 SD_D 1_C I/O
XD_D 4_C I/O
35 XD_D5_
G
ND
---
I/O G ND ---
---
20
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
CN46 SATA HDD Connectors
P IN No. Signa l name I/O P IN No. Sig nal name I/O
11 GND --- 12 GND ---
13 GND --- 14 +5V ---
15 V --- 16 +5V ---
17 GND --- 18 --- ---
19 GND --- 20 --- ---
21 --- 22 --- ---
23 GND --- 24 GND ---
CN22 TM A Connecto rs
PIN No. Signal nam
1 GND
e
3 PCIE_TXN3
5 PCIE_RXP3
--
I/O PIN No.
-
Signal name
_TXP3
-4 GND
-- RXN3
7 GND
9 CLK_PCIE_MINI3#_TMA 10 GND
--
--
--
I/O
-
-
-
21
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
11 TMPSPR-GND
13 CLKDWN#
15 PLTRST#
17 NC
12 TMPS PR-SXP
14 ALERT
16 CLKREQ#
18 NC
19 +3V_ TMA_VDD 20 +3V _TMA_VDD
21 NC 22 NC
23 NC
25 GND
24 GND
26 GND
27 GND
29 GND
31 GND
28 GND
29 GND
30 GND
CN17 Min i Card Connectors
PIN
1
No. Signal name
WAKE#
I/O
O
PIN
2
No.
+3V
Signal name
3 BT_DATA
5 BT_CHCLK
7 ---
9 GND
15 GND
17 NC
19 NC
21 GND
I3 I
10 NC
1
16
NC
NC
NC
GND 18
20
--- 22
R F_EN_WLAN
PLTRST#
I/O
---
---
---
---
--
--
--
--
-
-
I
I
-
---
22
Qosmio X500
Maintenance Manual (960-Q08)
Pin Assignment
23 PCI E_RXN5
25 PCIE_RXP5
O 24 +3V _S5
O 26 GN D
27 GND
29 GND
--- 28 +1.5V
--- _SMCLK
31 PCIE_TXN5 I 32 MINI 3_SMDATA
33 PCIE_TXP5 I 34 GND
35 GND
37 GND
3 9 ---
41 ---
C
43 GN D
45 C_LINK_CLK
47 C_LINK_DAT ---
49 C_LINK_RST ---
51 NC
CN
47 1394 Port
PIN No. S ignal name I/O PIN No. S ignal name I /O
1 L139 O 2 L1394_TPB0 + O
3 L1394_TPA0 O 4 L1394_T PA0+ O
5
GN
D
---
6
GND -
---
---
---
I/O
I/O
---
I/O
I/O
---
---
---
---
---
---
---
23
Qosmio X500
Maintenance Manual (960-Q08)
CN6 SPDIF Connectors
PIN No. Signal name I/O PIN No. Signal name
Pin Assignment
I/O
24
Qosmio X500
Maintenance Manual (960-Q08)
Display codes
Appendix. D
Appendix D Display Codes
D.1 Display Codes
Table D-1-1 Scan codes (set 1 and set 2) (1/4)
Cap
No.
Keytop
Code set 1 Code set 2
Make Break Make Break
Note
05
06
07
08
01
02
03
04
‘ ~
1 !
2 @
3 #
4 $
5 %
6 ^
7 &
05
06
07
08
29
02
03
04
85
86
87
88
A9
82
83
84
25
2E
36
3D
0E
16
1E
26
F0
F0
F0
F0
F0
F0
F0
F0
25
2E
36
3D
0E
16
1E
26
*2
09
10
11
12
8 *
9 (
0 )
- _
09
0A
0B
0C
89
8A
8B
8C
3E
46
45
4E
F0
F0
F0
F0
3E
46
45
4E
*2
*2
13 = + 0D 8D 55 F0 55
15 BkSp 0E 8E 66 F0 66
17 Q 10 90 15 F0 15
19 E 12 92 24 F0 24
22 Y 15 95 35 F0 35
24 I 17 97 43 F0 43 *2
25 O 13 98 44 F0 44 *2
27
28
[ {
] }
1A
1B
9A
9B
54
5B
F0
F0
54
5B
Qosmio X500
Maintenance Manual (960-Q08)
D-1
Display codes
Table D-1-2 Scan codes (set 1 and set 2) (2/4)
Cap
No.
Keytop
Code set 1 Code set 2
Note
Make Break Make Break
29 \ | 2B AB 5D F0 5D *5
30 Caps
33 D 20 A0 23 F0 23
35 G 22 A2 34 F0 34
36 H 23 A3 33 F0 33
38 K 25 A5 42 F0 42 *2
40
41
; :
‘ “
27
28
A7
A8
4C
52
F0
F0
4C
52
*2
45 No.102 key
56 D6 61 F0 61
50 B 30 B0 32 F0 32
51 N 31 B1 31 F0 31
53
54
55
, <
. >
/ ?
33
34
35
B3
B4
B5
41
49
4A
F0
F0
F0
41
49
4A
*2
*2
*2
D-2
Qosmio X500
Maintenance Manual (960-Q08)
Display codes
Cap
No.
Table D-1-3 Scan codes (set 1 and set 2) (3/4)
Keytop
Code set 1 Code set 2
Make Break Make Break
Note
62 ALT
75 Ins E0 52 E0 D2 E0 70 E0 F0 70
76
79
*1
Del E0 53 E0 D3 E0 71 E0 F0 71
E0 4B E0 CB E0 6B E0 F0 6B
*1
*1
80
81
83
84
Home E0 47 E0 C7 E0 6C E0 F0 6C *1
End E0 4F E0 CF E0 69 E0 F0 69 *1
E0 48 E0 C8 E0 75 E0 F0 75
E0 50 E0 D0 E0 72 E0 F0 72
*1
*1
117
118
119
120
121
85
86
89
PgUp E0 49 E0 C9 E0 7D E0 F0 7D *1
PgDn E0 51 E0 D1 E0 7A E0 F0 7A *1
E0 4D E0 CD E0 74 E0 F0 74 *1
110 Esc 01 81 76
112 F1 3B BB 05 F0
76
05
113
114
115
116
F2
F3
F4
F5
3C
3D
3E
3F
BC
BD
BE
BF
06
04
0C
03
F0
F0
F0
F0
06
04
0C
03
F6
F7
F8
F9
F10
40
41
42
43
44
C0
C1
C2
C3
C4
0B
83
0A
01
09
F0
F0
F0
F0
F0
0B
83
0A
01
09 *3
Qosmio X500
Maintenance Manual (960-Q08)
D-3
Display codes
Cap
No.
Keytop
Table D-1-4 Scan codes (set 1 and set 2) (4/4)
Code set 1 Code set 2
Make Break Make Break
Note
203
204
*6
*7 *7 *7 *7 *7
— — — — *4
Win E0
App E0
Notes:
1. * Scan codes differ by mode.
2. * Scan codes differ by overlay function.
3. * Combined with the Fn key makes different codes.
4. * Fn key does not generate a code by itself.
5. * This key corresponds to key No. 42 in a 102-key model.
6. * Refer to Table D-6, No. 124 key scan code.
7. * Refer to Table D-7, No. 126 key scan code.
D-4
Qosmio X500
Maintenance Manual (960-Q08)
Display codes
Table D-1-5 Scan codes with left Shift key
Cap
No.
Key top
Code set 1
Make Break
Code set 2
Make Break
55 / E0 AA E0 35 E0 B5 E0 2A E0 F0 12 E0 4A E0 F0 4A E0 12
75 INS E0 AA E0 52 E0 D2 E0 2A E0 F0 12 E0 70 E0 F0 70 E0 12
76 DEL E0 AA E0 53 E0 D3 E0 2A E0 F0 12 E0 71 E0 F0 71 E0 12
79 E0 AA E0 4B E0 CB E0 2A E0 F0 12 E0 6B E0 F0 6B E0 12
80 Home E0 AA E0 47 E0 C7 E0 2A E0 F0 12 E0 6C E0 F0 6C E0 12
83
84
E0 AA E0 48 E0 C8 E0 2A E0 F0 12 E0 75 E0 F0 75 E0 12
E0 AA E0 50 E0 D0 E0 2A E0 F0 12 E0 72 E0 F0 72 E0 12
85 PgUp E0 AA E0 49 E0 C9 E0 2A E0 F0 12 E0 7D E0 F0 7D E0 12
86 PgDn E0 AA E0 51 E0 D1 E0 2A E0 F0 12 E0 7A E0 F0 7A E0 12
89 E0 AA E0 4D E0 CD E0 2A E0 F0 12 E0 74 E0 F0 74 E0 12
203 Win E0 AA E0 5B E0 DB E0 2A E0 F0 12 E0 1F E0 F0 1F E0 12
204 App E0 AA E0 5D E0 DD E0 2A E0 F0 12 E0 2F E0 F0 2F E0 12
Note : The table above shows scan codes with the left Shift key. In combination with the right Shift key, scan codes are changed as listed below:
Set 1
Set 2
E0 AA __________ E0 B6
E0 2A ___________ E0 36
E0 F0 12 ________ E0 F0 59
E0 12 ___________ E0 59
Qosmio X500
Maintenance Manual (960-Q08)
D-5
Cap
No.
Key top
Display codes
Table D-1-6 Scan codes in Numlock mode
Code set 1 Code set 2
Make Break Make Break
79 E0 2A E0 4B E0 CB E0 AA E0 12 E0 6B E0 F0 6B E0 F0 12
80 Home E0 2A E0 47 E0 C7 E0 AA E0 12 E0 6C E0 F0 6C E0 F0 12
81 End E0 2A E0 4F E0 CF E0 AA E0 12 E0 69 E0 F0 69 E0 F0 12
83
E0 2A E0 48 E0 C8 E0 AA E0 12 E0 75 E0 F0 75 E0 F0 12
84 E0 2A E0 50 E0 D0 E0 AA E0 12 E0 72 E0 F0 72 E0 F0 12
85 PgUp E0 2A E0 49 E0 C9 E0 AA E0 12 E0 7D E0 F0 7D E0 F0 12
86 PgDn E0 2A E0 51 E0 D1 E0 AA E0 12 E0 7A E0 F0 7A E0 F0 12
89 E0 2A E0 4D E0 CD E0 AA E0 12 E0 74 E0 F0 74 E0 F0 12
203 Win E0 2A E0 5B E0 DB E0 AA E0 12 E0 1F E0 F0 1F E0 F0 12
204 App E0 2A E0 5D E0 DD E0 AA E0 12 E0 2F E0 F0 2F E0 F0 12
Table D-1-7 Scan codes with Fn key
Cap
No. Keytop
Code set 1 Code set 2
Make Break Make Break
43 ENT E0 1C E0 9C E0 5A
58 CTRL E0 1D E0 9D E0 14 E0 F0 14
60 LALT E0 38 E0 B8 E0 11 E0 F0 11
121 ARROW 45 C5 77 F0 77
122 NUMERIC 45 C5 77 F0 77
123 Scrl 46 C5 7E F0
D-6
Qosmio X500
Maintenance Manual (960-Q08)
Key top
Shift
Display codes
Table D-1-8 Scan codes in overlay mode
Cap
No.
Keytop
Code set 1 Code set 2
Make Break Make Break
09 8 (8) 48
10 9 (9) 49
11 0 (*) 37
23 U (4) 4B
24 I (5) 4C
25 O (6) 4D
26 P (–) 4A
37 J (1) 4F
38 K (2) 50
39 L (3) 51
40 ; (+) 4E
52 M (0) 52
54 . (.) 53
C8
C9
B7
CB
CC
CD
CA
CF
D0
D1
CE
D2
D3
75 F0 75
7D F0 7D
7C F0 7C
6B F0 6B
73 F0 73
74 F0 74
7B F0 7B
69 F0 69
72
7A
79
70
71
F0
F0
F0
72
7A
F0 79
70
F0 71
Ctrl
Shift
Alt
Table D-1-9 No.124 key scan code
Code set 1 Code set 2
Make Break Make Break
54
F0
F0
D4 84 B4
Qosmio X500
Maintenance Manual (960-Q08)
D-7
Display codes
Table D-1-10 No.126 key scan code
Key top
Shift Code set 1 Code set 2
Make Make
Pause Common* E1 1D 45 E1 9D C5 E1 14 77 E1 F0 14 F0 77
46 C6 7E
*: This key generates only make codes.
D-8
Qosmio X500
Maintenance Manual (960-Q08)
Appendix E Key Layout
1. United Status (US) Keyboard
Figure US keyboard
2. United Status (US) Keyboard (Backlight)
Figure US keyboard (Backlight)
E-1 - Qosmio X500 Maintenance Manual (960-Q08)
3. United Kingdom (UK) Keyboard
Figure UK keyboard
3. United Kingdom (UK) Keyboard (Backlight)
Figure UK keyboard (Backlight)
E-2 - Qosmio X500 Maintenance Manual (960-Q08)
Appendix F
Appendix F Wiring Diagrams
F.1 RGB Monitor ID Wraparound connector
(1) RED
(2) GREEN
(3) BLUE
(4) NC
(5) GND
(6) GND
(7) GND
(8) GND
(9) 5V
(10) GND
(11) NC
(12) SDA
(13) HSYNC
(14) VSYNC
(15) SDL
RED (1)
GREEN (2)
BLUE (3)
NC (4)
GND (5)
GND (6)
GND (7)
GND (8)
5V (9)
GND (10)
NC (11)
SDA (12)
HSYNC (13)
VSYNC (14)
SCL (15)
Figure F-1-1 RGB Monitor ID Wrapa round connector (15PIN to 15PIN)
(1) BIBAP ‘(TX+)
(2) BIDAN (TX-)
Figure F-2-1 LAN loopback connector
(3) BIDBP (RX+)
(4) BIDBN (RX-)
Qosmio X500
Maintenance Manual (960-Q08)
F-1
Wiring Diagrams
Qosmio X500
Maintenance Manual (960-Q08)
F-2
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Key features
DVD Super Multi drive
High-performance processor
High-resolution display
Built-in microphone
Speakers
Web camera
Wireless LAN
Bluetooth
Fingerprint sensor
HDD password
Frequently asked questions
The Qosmio X500 supports Intel® Core(TM) i7-720QM processor 1.6GHZ, 1.73GHz and may support additional processors in the future.
The Qosmio X500 uses Two DDR3 SO-DIMM (1066MHz specification compliant).
The Qosmio X500 has 4 USB ports that comply with the USB2.0 standard. One of the ports on the left side supports the USB Sleep and Charge function.