TVS Diode Arrays Low Capacitance ESD Protection - SP3002 Series (SPA

TVS Diode Arrays Low Capacitance ESD Protection - SP3002 Series (SPA
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3002 Series
SP3002 Series 0.85pF Rail Clamp Array
RoHS
Pb GREEN
The SP3002 has ultra low capacitance rail-to-rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level (Level 4) specified in the
IEC 61000-4-2 international standard without performance
degradation. Their very low loading capacitance also makes
them ideal for protecting high speed signal pins such as
HDMI, DVI, USB2.0, and IEEE 1394.
Pinout
Features
I/O 1
I/O 4
GND
VCC
I/O 2
I/O 3
I/O 1
1
NC
2
I/O 2
3
Gnd
6
I/O 4
5
V CC
4
I/O 3
Functional Block Diagram
I/O2
t-PXMFBLBHFDVSSFOUPG
0.5μA (MAX) at 5V
t&4%QSPUFDUJPOPG
±12kV contact discharge,
±15kV air discharge,
(IEC61000-4-2)
t4NBMMQBDLBHJOHPQUJPOT
saves board space
t&'5QSPUFDUJPO
IEC61000-4-4, 40A
(5/50ns)
uDFN-6
(1.6x1.6x0.5mm)
SC70-6 and SOT23-6
t-PXDBQBDJUBODFPG
0.85 pF (TYP) per I/O
t-JHIUOJOH1SPUFDUJPO
IEC61000-4-5, 4.5A
(8/20μs)
Applications
I/O4
VCC
t$PNQVUFS1FSJQIFSBMT
t/FUXPSL)BSEXBSF1PSUT
t.PCJMF1IPOFT
t5FTU&RVJQNFOU
t1%"T
t.FEJDBM&RVJQNFOU
t%JHJUBM$BNFSBT
Application Example
I/O1
GND
I/O3
+5V
D2+
D2+
Gnd
D2-
D26
5
4
SP300x-04
1
2
3
D1+
D1+
Gnd
D1HDMI
or DVI
Connector
D1HDMI
or DVI
Interface
IC
D0+
D0+
Gnd
D0-
D06
5
4
SP300x-04
1
2
3
Clk+
Clk+
Gnd
Clk-
ClkGnd
A single 4 channel SP300x-04
device can be used to protect
four of the data lines in a
HDMI/DVI interface. Two (2)
SP300x-04 devices provide
protection for the main data
lines. Low voltage ASIC
HDMI/DVI drivers can also be
protected with the SP300x-04,
the +VCC pins on the SP300x-04
can be substituted with a
suitable bypass capacitor or in
some backdrive applications the
+VCC of the SP300x-04 can be
floated or NC.
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
89
Revision: April 14, 2011
SP3002 Series
SP3002
Description
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3002 Series
Thermal Information
Absolute Maximum Ratings
Symbol
IPP
Parameter
Parameter
Value
Units
Peak Current (tp=8/20μs)
4.5
A
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature (Soldering 10s)
TOP
Operating Temperature
-40 to 85
°C
TSTOR
Storage Temperature
-50 to 150
°C
Rating
Units
-65 to 150
°C
150
°C
260
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
Max
Units
Reverse Standoff Voltage
Parameter
VRWM
IR ≤ 1μA
6.0
V
Reverse Leakage Current
ILEAK
VR=5V
0.5
μA
Clamp Voltage1
VC
ESD Withstand Voltage1
VESD
Diode Capacitance1
CI/O-GND
1
Diode Capacitance
CI/O-I/O
Min
Typ
IPP=1A, tp=8/20μs, Fwd
9.5
11.0
V
IPP=2A, tp=8/20μs, Fwd
10.6
13.0
V
IEC61000-4-2 (Contact)
±12
kV
IEC61000-4-2 (Air)
±15
kV
Reverse Bias=0V
0.95
1.1
1.25
pF
Reverse Bias=1.65V
0.7
0.85
1.0
pF
Reverse Bias=0V
0.5
pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Insertion Loss (S21) I/O to GND
Capacitance vs. Bias Voltage
1.50
0
1.40
I/O Capacitance (pF)
Insertion Loss [dB]
1.30
-5
-10
-15
1.20
VCC = Float
1.10
1.00
VCC = 3.3V
0.90
0.80
VCC = 5V
0.70
0.60
0.50
-20
1.E+06
1.E+07
1.E+08
1.E+09
0.0
1.E+10
SP3002 Series
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
I/O DC Bias (V)
Frequency [Hz]
90
Revision: April 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3002 Series
Capacitance vs. Frequency
Product Characteristics
Lead Plating
SC70 & SOT23: Matte Tin
uDFN: Pre-Plated Frame
1.6E-12
Capacitance [F]
1.4E-12
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
SP3002
2E-12
1.8E-12
1.2E-12
1E-12
8E-13
6E-13
4E-13
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
2E-13
0
1.E+06
1.E+07
1.E+08
1.E+09
Frequency [Hz]
Soldering Parameters
Reflow Condition
Pb – Free assembly
tP
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
+0/-5
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
25
Peak Temperature (TP)
250
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
Temperature
TP
time to peak temperature
Time
°C
91
Revision: April 14, 2011
SP3002 Series
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3002 Series
Package Dimensions — SC70-6
Package
Pins
JEDEC
e
e
6
5
4
E
2
1
SC70-6
6
MO-203 Issue A
Millimeters
Inches
Min
Max
Min
Max
0.80
1.10
0.031
0.043
0.00
0.10
0.000
0.004
0.70
1.00
0.028
0.039
0.15
0.30
0.006
0.012
0.08
0.25
0.003
0.010
1.85
2.25
0.073
0.089
1.15
1.35
0.045
0.053
0.65 BSC
0.026 BSC
2.00
2.40
0.079
0.094
0.26
0.46
0.010
0.018
HE
3
A
A1
A2
B
c
D
E
e
HE
L
B
D
A2 A
A1
C
Solder Pad Layout
L
Package Dimensions — SOT23-6
Package
SOT23-6
Pins
6
JEDEC
MO-203 Issue A
Millimeters
Min
Inches
Min
Max
Notes
A
0.900
1.450
0.035
0.057
-
A1
0.000
0.150
0.000
0.006
-
A2
0.900
1.300
0.035
0.051
-
b
0.350
0.500
0.0138
0.0196
-
C
0.080
0.220
0.0031
0.009
-
D
2.800
3.000
0.11
0.118
3
E
2.600
3.000
0.102
0.118
-
E1
1.500
1.750
0.06
0.069
3
e
0.95 Ref
0.0374 Ref
e1
1.9 Ref
0.0748 Ref
L
0.100
N
a
Recommended Solder Pad Layout
Max
0.600
0.004
10º
0º
6
0º
0.023
6
4,5
6
10º
-
M
2.590
0.102
-
O
0.690
.027 TYP
-
P
0.990
.039 TYP
-
R
0.950
0.038
-
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
M
P
R
O
SP3002 Series
92
Revision: April 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3002 Series
Package Dimensions — uDFN (1.6x1.6x0.5mm)
Bottom View
Top View
0.05 C
L
6
5
Millimeters
4
4
6
5
2
Max
Min
Max
0.45
0.55
0.018
0.022
A1
0.00
0.05
0.000
A3
E2
1
Min
A
0.05 C
E
Pin 1 Index Area
3
2
3
B
1
Pin 1 chamfer
0.10 x 45’
℮
Side View
0.05 C
A1
Inches
Symbol
A3
0.127 Ref
b
0.20
0.30
0.008
0.012
D
1.50
1.70
0.060
0.067
D2
1.05
1.30
0.042
0.052
E
1.50
1.70
0.060
0.067
E2
0.40
0.65
0.016
e
A
Seating plane
0.002
0.005 Ref
L
0.50 Ref
0.25
0.026
0.020 Ref
0.40
0.010
0.016
C
b
0.10 M C A B
0.05 M C
Ordering Information
Part Numbering System
SP3002-04XTG
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
G= Green
T= Tape & Reel
Package
H = SOT23-6
J = SC70-6
U = uDFN-6
Series
Number of Channels
-04 = 4 channel
Part Number
Package
Marking
Min. Order
Qty.
SP3002-04HTG
SOT23-6
EX4
3000
SP3002-04JTG
SC70-6
EX4
3000
SP3002-04UTG
uDFN-6
(1.6x1.6x0.5mm)
EX4
3000
Part Marking System
E X4
EX4
Product Series
Number of Channels
E = SP3002 series
Assembly Site
(varies)
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
93
Revision: April 14, 2011
SP3002 Series
SP3002
D
uDFN (1.6x1.6x0.5mm)
D2
A
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3002 Series
Embossed Carrier Tape & Reel Specification — SC70-6
Millimetres
Symbol
Inches
Min
Max
Min
Max
E
1.65
1.85
0.064
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
10P0
40.0+/- 0.20
1.574+/-0.008
W
7.70
8.10
0.303
P
3.90
4.10
0.153
0.161
A0
2.14
2.34
0.084
0.092
B0
2.24
2.44
0.088
0.096
K0
1.12
1.32
0.044
0.052
t
0.27 Max
0.318
0.010 Max
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND REEL
4.0mm
1.5mm
DIA. HOLE
ACCESS HOLE
14.4mm
1.75mm
2.0mm
CL
8mm
4.0mm
13mm
GENERAL INFORMATION
SOT-23 (8mm POCKET PITCH)
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
60mm
180mm
8.4mm
USER DIRECTION OF FEED
PIN 1
D
Embossed Carrier Tape & Reel Specification — uDFN-6 (1.6x1.6x0.5mm)
Symbol
t
W
E
P2
1.65
1.85
0.06
0.07
3.55
0.14
0.14
D1
1.00
1.25
0.04
B0
F
94
Revision: April 14, 2011
1.50 MIN
3.90
0.05
0.06 MIN
4.10
40.0+/- 0.20
0.15
0.16
1.57+/-0.01
W
7.90
8.30
0.31
0.33
P2
1.95
2.05
0.08
0.08
A0
1.78
1.88
0.07
0.07
B0
1.78
1.88
0.07
0.07
K0
0.84
0.94
0.03
0.04
t
K0
SP3002 Series
Max
3.45
10P0
A0
Min
F
D
P0
Inches
Max
E
P0
D1
Millimetres
Min
0.25 TYP
0.01 TYP
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
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