TPS61175EVM-326 User's Guide

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User's Guide

SLVU260 – December 2008

TPS61175EVM-326

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This user's guide describes the characteristics, operation, and use of the TPS61175EVM-326 evaluation module (EVM). This EVM contains the Texas Instruments TPS61175 high-efficiency boost converter that is configured to provide a regulated 24-V output voltage from an input voltage ranging from 5.0 V to 12 V.

This user's guide includes a schematic diagram, board layout, bill of materials and test data.

Contents

Introduction

...................................................................................................................

1

Setup and Test Results

.....................................................................................................

5

Board Layout

................................................................................................................

11

Bill of Materials and Schematic

...........................................................................................

14

List of Figures

TPS61175EVM-326 Efficiency

Start-Up With V

IN

= 5V and I

OUT

.............................................................................................

7

= 100 mA

...............................................................................

7

Start-Up With V

IN

= 12V and I

OUT

PWM Operation at 1.2 A With V

IN

= 100 mA

PWM Operation at 450 mA With V

IN

= 5V

= 12V

.............................................................................

8

...............................................................................

8

................................................................................

9

Load Transient Response From 45 mA to 400 mA With V

IN

= 5V

...................................................

9

Load Transient Response From 45 mA to 400 mA With V

IN

Loop Gain and Phase

= 12V

................................................

10

.....................................................................................................

10

Top Assembly Layer

Internal Layer 2

.......................................................................................................

11

Top Layer Routing

Internal Layer 1

.........................................................................................................

12

.............................................................................................................

12

.............................................................................................................

13

Bottom-Side Layer

.........................................................................................................

13

TPS61175EVM-326 Schematic

..........................................................................................

15

List of Tables

Performance Specification Summary for V

IN

= 5.0 V

...................................................................

2

Performance Specification Summary for V

IN

= 12.0V

...................................................................

2

HPA326 Bill of Materials

...................................................................................................

14

1 Introduction

This section contains background information for the TPS61175EVM-326 evaluation module.

1.1

Background

This TPS61175EVM-326 is designed to boost 5.0 V to 12.0 V input voltages to a 24-V output. The goal of the EVM is to facilitate evaluation of the TPS61175 power supply solution. The EVM uses the TPS61175 adjustable output boost converter, external schottky diode, input and output capacitors, inductor, and the appropriate feedback and compensation components to provide a regulated 24V.

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Introduction

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1.2

Performance Specification Summary

Table 1

provides a summary of the TPS61175EVM-326 performance specifications. All specifications are given for an ambient temperature of 25

°

C.

Table 1. Performance Specification Summary for V

IN

= 5.0 V

PARAMETER

INPUT CHARACTERISTICS

V

IN

Input voltage

I

IN(AVG) f

SW

Average input current

Switching frequency

OUTPUT CHARACTERISTICS

V

O

Output voltage

Line regulation

Load regulation

ΔV

O(PP)

I

O

Output voltage ripple

Output current

TRANSIENT RESPONSE

Load step ΔI

O

ΔI

O

/ ΔT

ΔV

O t

S

Load slew rate

V

O undershoot

Settling time

I

O

= 450 mA

CONDITIONS

4.5 V < V

IN

< 5.5 V at I

O

= 400 mA

V

IN

= 5 V, 1 mA < I

O

< 450 mA

I

O

= 450 mA

MIN NOM

23

(1)

1

5

750

24

0.35

9

1.1

280

MAX

2.6

UNIT

V

A kHz

25

(1)

V

1% ΔV

O

/ ΔV

IN

1% ΔV

O

/ ΔI

O

75

450 mV

PP mA

A

A/

µ s

V

µ s

(1)

Minimum and maximum values include 1% resistor tolerance as well as IC feedback reference voltage tolerance.

Table 2. Performance Specification Summary for V

IN

= 12.0V

CONDITIONS MIN NOM MAX PARAMETER

INPUT CHARACTERISTICS

V

IN

I

IN(AVG)

Input Voltage

Average Input Current f

SW

Switching Frequency

OUTPUT CHARACTERISTICS

V

O

Output Voltage

Line Regulation

Load Regulation

ΔV

O(PP)

I

O

Output Voltage Ripple

Output Current

TRANSIENT RESPONSE

ΔI

TRAN

Δ

IO

/ ΔT

ΔV

TRAN t

S

Load Step

Load slew rate

V

O undershoot

Settling time

11 V < V

IN

< 13 V at I

O

= 1.1 A

V

IN

= 12 V, 1 mA < Io < 1.2 A

I

O

= 1.2 A

23

(1)

1

12

750

24

0.35

9

480

300

2.6

UNIT

V

A kHz

25

(1)

V

1% ΔV

O

/ ΔV

IN

1% ΔV

O

/ ΔI

O

250

1.2

mV

A

PP

A

A/

µ s mV

µ s

(1)

Minimum and maximum values include 1% resistor tolerance as well as IC feedback reference voltage tolerance.

1.3

Design Example

The following example illustrates the design process and component selection for a 12-V to 24-V non-synchronous boost regulator using the TPS61175 converter.

1. Determining the duty cycle.

V

OUT

+ V

D

-

V

IN(MIN)

D

(MIN)

=

V

O UT

+ V

D

=

24 V + 0.5V

-

12 V

24 V + 0.5 V

= 51%

(1)

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Introduction

2. Computing the maximum output current.

Assuming

η est

= 90% at V

IN

= 12 V and RPL% =20%, datasheet equation 6 gives

I

OUT(max)

=

V

IN

´

I

LIM

´

(1

-

R PL%/2)

´

η est

V

OUT

=

12 V

´

3A

´

(1

-

20%/2)

´

90%

24

= 1.2 A

3. Selecting the inductor.

The designer chose RPL% = 20% and f

SW equation 5.

´

L

³

η est

V

IN

ê

ë

é

ƒ

SW

´

æ

ç

è

V

OUT

1

+ V

D

-

V

IN

+

1

V

IN

= 750kHz and assumed

η est

ö

÷

ø

ù

ú

´

RPL% x P

OUT

= 90% for use in datasheet

(2)

=

750 kHz

´

90%

´

12 V

æ

è

1

-

+

1

24 V + 0.5 V 12 V 12 V

ö

ø

´

20%

´

1.2 A

´

24 V

= 15.3 H 22 H

(3)

4. Setting the output voltage.

Selecting R2 = 16.2 k

Ω gives

R1 = R2

´

æ

ç

è

V

OUT

1.229 V

-

1

ö

÷

ø

= 16.2 k Ω

´

æ

è

24

1.229 V

-

ö

1 = 300 k

W ®

301k

W

(4)

5. Setting the switching frequency

Using datasheet Table 1 and Figure 13 as well as some bench testing results, the designer selected a

143k

Ω resistor to set the 750kHz switching frequency.

6. Selecting the soft start capacitor

The designer selected the datasheet recommended value of 0.047

µ

F.

7. Selecting the Schottky diode

The designer selected a 40-V rated diode to accommodate user modifications of higher output voltages to the power supply. With 1.2A

×

0.45V = 540mW potential power dissipation and T

Amax

= 25

°

C , the designer choose the SMA package diode, which will experience a rise in junction temperature to T

25

°

C + 81

°

C/W

×

540mW = 69

°

C. In a real application, a larger packaged diode is recommended.

J

=

8. Selecting the output capacitance:

The output capacitance needs to be the larger of

C

OUT

=

(V

OUT

V

OUT

-

V )

´ ¦

SW

´

I

´ D

OUT

V

RIP

(24 V 12 V) ´ 1.2 A

=

24 V

´

750 kHz

´

300 mV

(5) to meet the ripple specification or

C

OUT

=

2

´ p ´

ΔI

TRAN

ƒ

LOOP-BW

=

2

´ p ´

350 mA

10 kHz

´

500 mW

= 11 μF to meet the transient specification. The designer selected 3

×

4.7

µ

F, 50V capacitors to give close to

15

µ

F of output capacitance.

9. Compensating the control loop.

´ D

V

TRAN

Using MathCAD to plot data sheet equation 10 with

R

OUT

= 24V/1.2A = 20

, R

SENSE

= 40m

2 2

ƒ

P

=

2 p ´

R

O

´

=

C2 2 p ´

20

W ´

3

´ m

= 1.1 kHz

(6)

(7)

ƒ

RHPZ

=

R

O

2 p ´

L

Vin

è Vout

ö

2

= p

20

W m

×

æ

ç

12

24

ö

÷

2

= 36.2 kHz

(8) and neglecting the ESR zero produce by the ceramic output capacitors gives

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3

Introduction

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60

Phase

180

120 40

20

Gain

0

-20

60

0

-60

22

-40

120

-120

-60

1 10 100

1 10

3

1 10

4 f - Frequency - Hz

1 10

5

-180

1 10

6

The designer chose f

G

EAmax

C

= 10kHz which means K

COMP

(f

C

) = -22dB. With R1 = 16.2k and R2=301k

= 440

µ mho, solving the equation on datasheet page 17 for R3 gives

K

COMP

(

¦

C

) -22dB

10

20dB

10

20dB

R3 @ = = 4.57 k W ® 4.53 k W

R2 16.2 k W

G

EA

´ ´

R2+R1 301 k W + 16.2 k W

Solving datasheet equation 20 for C4 and setting f

Z

≅ f

C

/10 = 1kHz gives

(9)

C4

1

=

1

@

2 p ´ ´ ¦

Z

4.57 k Ω ´ 1 kH z

= 35 nF

®

33 nF

R3 2 p ´

The designer used bench measurements to set R3 = 3.09k

Ω in order to get closer to the desired 60 degrees phase margin. Using MathCAD to plot T(s) = G

PW

(s)

×

H

EA

(s) from the datasheet gives

(10)

180

90

60

30

Phase

135

90

45

Gain

0

-30

0

-45

-60

-90

-120

1 10 100

1 10

3

1 10

4 f - Frequency - Hz

1 10

5

-90

-135

-180

1 10

6

1.4

Modifications

Because the primary goal of the EVM is to demonstrate the flexibility of the TPS61175 power supply solution, the selected capacitors and inductors are not optimized for either a 5-V or a 12-V to 24-V conversion.

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Setup and Test Results

The TPS61175 integrated circuit (IC) has a maximum input voltage of 18 V and can boost its input voltage up to 38 V. Changes to this EVM's recommended input and output voltage likely requires changing one or more of the following components: schottky diode, input or output capacitors, inductor, feedback resistors, or error amplifier compensation components. Consult the data sheet (link to datasheet TBD) and/or design tools for assistance in selecting these components for your application. Changing components could improve or degrade EVM performance.

2 Setup and Test Results

This section describes how to properly connect, set up, and use the TPS61175EVM-326.

2.1

Input/Output Connections

The connection points are described in the following paragraphs.

2.1.1

J1 - V

IN

This header is the positive connection to the input power supply used for lower (< 1A) input currents. Twist the leads to the input supply, and keep them as short as possible.

2.1.2

J2 - V

OUT

This header is the positive output for the device used for lower (< 1A) output currents. Connect the positive lead of the load and/or output multimeter to this point.

2.1.3

J3 - GND

This header is the return connection for the input power supply used for lower (< 1A) input currents.

2.1.4

J4 - GND

This header is the return connection for the load and/or output multimeter used for lower (< 1A) output currents.

2.1.5

J5 pin 1 - SYNC

This pin is available for the application of an external clock synchronization signal. Make sure that the frequency of the clock signal is within the range in

Table 1 . This pin cannot be left floating so use a

shorting jumper to short the SYNC pin to GND if not used.

2.1.6

J5 pin 2 - GND

This pin is the return connection for the external synchronization signal.

2.1.7

J6 pin 1 - V

IN

This is the positive connection for the input power supply used for higher (> 1A) input currents.

2.1.8

J6 pin 2 - GND

This is the return connection to the input power supply used for higher (> 1A) input currents. Twist the leads to the input supply, and keep them as short as possible.

2.1.9

J7 pin 1 - GND

This is the return connection for the load used for higher (> 1A) output currents.

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Setup and Test Results

2.1.10

J7 pin 2 - V

OUT

This is the positive connection for the load used for higher (> 1A) output currents.

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2.1.11

JP1 - ENABLE

Installing this jumper ties the enable pin to either the input voltage (on) or ground (off). If left unconnected, the enable pin's internal pull down resistor disables the IC.

2.1.12

TP1 - SW Node

Test point for the switch node of the boost converter.

2.1.13

TP2 - Loop Response

Test point for control loop response measurements.

2.1.14

TP3 - Comp Pin

Test point for the compensation network.

2.1.15

TP4 & TP5 - Output Ripple

Test points for measuring the output ripple voltage.

6

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2.2

Test Results

The following section shows the test results of the TPS61175EVM-326.

100

90

80

70

60

50

40

30

0 200 400 600

I

O

- Output Current - mA

800

Figure 1. TPS61175EVM-326 Efficiency

EN

1000

Setup and Test Results

Vout

IL

Figure 2. Start-Up With V

IN

= 5V and I

OUT

= 100 mA

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Setup and Test Results

EN

Vout

IL

Figure 3. Start-Up With V

IN

= 12V and I

OUT

= 100 mA

IL

SW

Vout-ac www.ti.com

Figure 4. PWM Operation at 450 mA With V

IN

= 5V

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Setup and Test Results

IL

SW

Vout-ac

Figure 5. PWM Operation at 1.2 A With V

IN

= 12V

Vout-ac

Iout

Figure 6. Load Transient Response From 45 mA to 400 mA With V

IN

= 5V

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Setup and Test Results

Vout-ac

Iout

60

50 dB

40 dB

30 dB

20 dB

10 dB

0 dB

-10 dB

-20 dB

-30 dB

-40 dB

Figure 7. Load Transient Response From 45 mA to 400 mA With V

IN

= 12V

Phase - 12V

IN

Gain - 12V

IN

Phase - 5V

IN

Gain - 5V

IN

Red/Royal Blue - Vin = 5 V, Iout = 450 mA

Pink/Black - Vin = 12 V, Iout = 1.2 A

150 deg

180

120 deg

90 deg

60 deg

30 deg

0 deg

-30 deg

-60 deg

-90 deg

-120 deg

-60

100

-180

100 k f - Frequency - Hz

Figure 8. Loop Gain and Phase

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3 Board Layout

This section provides the TPS61175EVM-326 board layout and illustrations.

Board Layout

3.1

Layout

Board layout is critical for all switch-mode power supplies.

Figure 9

through

Figure 13

show the board layout for the HPA326 printed-circuit board. The switching nodes with high-frequency noise are isolated from the noise-sensitive feedback circuitry. Careful attention has been given to the routing of high-frequency current loops. See the data sheet (SLVS892) for further layout recommendations.

Figure 9. Top Assembly Layer

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11

Board Layout

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Figure 10. Top Layer Routing

12

TPS61175EVM-326

Figure 11. Internal Layer 1

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Board Layout

Figure 12. Internal Layer 2

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Figure 13. Bottom-Side Layer

TPS61175EVM-326

13

Bill of Materials and Schematic

4 Bill of Materials and Schematic

This section provides the TPS61175EVM-326 bill of materials and schematic.

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4.1

Bill of Materials

Table 3. HPA326 Bill of Materials

L1

R1

R2

R3

R4

R5

R6

TP1–TP4

TP5

U1

RefDes

C1

C10

C2

C3

Value

10

µ

F

Open

Open

0.047

µ

F

33 nF C4

C5 Open

C7 0.1

µ

F

C8, C9, C11 4.7

µ

F

D1 MBRA340

J1– J5

J6, J7

JP1

PTC36SAAN

Description

Capacitor, Ceramic, 25V, X5R, 20%

Capacitor, Ceramic, 50V, X7R, 10%

Capacitor, Ceramic, 25V, X5R, 20%

Capacitor, Ceramic, 10V, X5R, 10%

Capacitor, Ceramic, 10V, X5R, 10%

Capacitor, Ceramic, 10V, X5R, 10%

Capacitor, Ceramic, 25V, X5R, 20%

Capacitor, Ceramic, 50V, X7R, 10%

Diode, Schottky, 3A, 40V

Header, Male 2-pin, 100mil spacing, (36-pin strip)

Terminal Block, 2-pin, 6-A, 3.5mm

ED555/2DS

PTC36SAAN

22

µ

H

301k

16.2k

3.09k

143k

50

Header, Male 3-pin, 100mil spacing, (36-pin strip)

Inductor, SMT, 2.9A, 47milliohm

Resistor, Chip, 1/16W, 1%

Resistor, Chip, 1/16W, 1%

Resistor, Chip, 1/16W, 1%

Resistor, Chip, 1/16W, 1%

Resistor, Chip, 1/16W, 1%

0

5000

5001

Resistor, Chip, 1/16W, 1%

Test Point, Red, Thru Hole Color Keyed

Test Point, Black, Thru Hole Color Keyed

TPS61175PWP IC, High Voltage/Current Boost Converter

Shunt, 100-mil, Black

PCB, 1.5"

×

2.6"

×

0.062"

Size

1206

1210

1206

0603

0603

0603

0603

1210

SMA

0.100 inch

×

2

0.27

×

0.25 inch

0.100 inch

×

3

Part Number

STD

STD

STD

STD

STD

STD

STD

STD

MBRA340

PTC36SAAN

ED555/2DS

PTC36SAAN

OST

Sullins

0.402 sq inch

0603

0603

0603

CDRH105RNP-220N Sumida

Std Std

Std

Std

Std

Std

0603

0603

Std

Std

0603 Std

0.100

×

0.100 inch 5000

0.100

×

0.100 inch 5001

HTSSOP-14 TPS61175PWP

0.100

929950-00

HPA326

Std

Std

Std

Keystone

Keystone

TI

3M

Any

MFR

STD

STD

STD

STD

STD

STD

STD

STD

On Semi

Sullins

14

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4.2

Schematic

Bill of Materials and Schematic

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Figure 14. TPS61175EVM-326 Schematic

TPS61175EVM-326

15

EVALUATION BOARD/KIT IMPORTANT NOTICE

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:

This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES

ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling

(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.

Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER

AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF

MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge.

EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY

INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.

TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.

TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or

services described herein.

Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/or safety programs, please contact the TI application engineer or visit www.ti.com/esh .

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used.

FCC Warning

This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES

ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.

EVM WARNINGS AND RESTRICTIONS

It is important to operate this EVM within the input voltage range of 3 V to 18 V and the output voltage range of 38V.

Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions concerning the input range, please contact a TI field representative prior to connecting the input power.

Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.

Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.

During normal operation, some circuit components may have case temperatures greater than 125

°

C. The EVM is designed to operate properly with certain components above 85

°

C as long as the input and output ranges are maintained. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2007-2008, Texas Instruments Incorporated

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products

Amplifiers

Data Converters

DSP

Clocks and Timers

Interface

Logic

Power Mgmt

Microcontrollers amplifier.ti.com

dataconverter.ti.com

dsp.ti.com

www.ti.com/clocks interface.ti.com

logic.ti.com

power.ti.com

microcontroller.ti.com

RFID www.ti-rfid.com

RF/IF and ZigBee® Solutions www.ti.com/lprf

Applications

Audio

Automotive

Broadband

Digital Control

Medical

Military

Optical Networking

Security

Telephony

Video & Imaging

Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2008, Texas Instruments Incorporated

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