Manual 21106143

Manual 21106143
www.ti.com
SLVS426 − MAY 2002
FEATURES
APPLICATIONS
D Notebook PCs, PDAs
D Consumer Game Systems
D DSP Application
D Three Independent Step-Down DC/DC
Controllers and One LDO Controller
D Input Voltage Range
− Switcher: 4.5 V ~ 28 V
− LDO: 1.1 V ~ 3.6 V
DESCRIPTION
The TPS5130 is composed of three independent
synchronous buck regulator controllers (SBRC) and
one low drop-out (LDO) regulator controller. On-chip
high-side and low-side synchronous rectifier drivers are
integrated to drive less expensive N-channel
MOSFETs. The LDO controller can also drive an
external N-channel MOSFET. Since the input current
ripple is minimized by operating 180 degree out of
phase, it allows a smaller input capacitance resulting in
reduced power supply cost. The SBRC of the TPS5130
automatically adjusts from PWM mode to SKIP mode
to maintain high efficiency under light load conditions.
Resistor-less current protection for the synchronous
buck controller and the fixed high-side driver voltage
simplifies the system design and reduces the external
parts count. The LDO controller has a current limit
protection and overshoot protection to suppress output
voltage hump at load transient. To further extend
battery life, the TPS5130 features dead-time control
and very low quiescent current.
D Output Voltage Range
− Switcher: 0.9 V ~ 5.5 V
− LDO: 0.9 V ~ 2.5 V
D
D
D
D
D
D
Synchronous for High Efficiency
D
D
D
D
Overvoltage and Undervoltage Protection
Precision Vref (±1.5%)
PWM Mode Control : Max. 500 kHz Operation
Auto PWM/SKIP Mode Available
High Speed Error Amplifier
Over Current Protection With Temperature
Compensation Circuit for Each Channel
Programmable Short-Circuit Protection
Powergood With Programmable Delay Time
5-V and 3.3-V Linear Regulators
VIN
VIN
OUT3_u
Vo3
OUT1_u
LL3
LL1
OUT3_d
Vo1
5V
OUT1_d
TPS5130
INV3
INV1
REG5V_IN
LDO_IN
OUT2_u
LDO_CUR
LL2
Vo3
LDO_GATE
OUT2_d
Vo_LDO
INV_LDO
GND
INV2
See application section of this data sheet for more detailed information.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
! "#$ ! %#&'" ($) (#"!
" !%$""! %$ *$ $! $+! !#$! !(( ,-)
(#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!)
Copyright  2002, Texas Instruments Incorporated
www.ti.com
SLVS426 − MAY 2002
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGED DEVICES
PLASTIC TQFP (PT)(1)
TA
−40°C to 85°C
TPS5130PT
(1) The PT package is also available taped and reeled. Add an R suffix to the device type (i.e.,
TPS5130PTR).
PACKAGE DISSIPATION RATINGS
PACKAGE(1)
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
25.7 mW/°C
TA = 85°C
POWER RATING
48 pin PT
3210 mW
1670 mW
(1) These devices are mounted on a JEDEC high-k board (2 oz. traces on surface, 2-layer 1 oz. plane
inside). (Assumes the maximum junction temperature is 150°C)
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
TPS5130
Supply voltage, (2) VIN
Input voltage range(2), VI
Output voltage range, VO (2)
−0.3 V to 30 V
LH1/2/3
−0.3 V to 35 V
VIN_SENSE12/3, LL1/2/3, STBY_LDO,
STBY_VREF3.3/5, TRIP1/2/3
−0.3 V to 30 V
INV1/2/3, CT, SS_STBY1/2/3,
INV_LDO, LDO_OUT, FLT,
PG_DELAY, VREF3.3/5,
LDO_IN, LDO_CUR, PWM_SEL,
REG5V_IN
−0.3 V to 7 V
OUT1/2/3_u
−0.3 V to 35 V
FB1/2/3, PGOUT, OUT1/2/3_d
−0.3 V to 7 V
LDO_GATE
−0.3 V to 9 V
REF
Operating ambient temperature range, TA
−0.3 V to 3 V
−40°C to 85°C
Storage temperature, Tstg
−55°C to 150°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal.
2
www.ti.com
SLVS426 − MAY 2002
RECOMMENDED OPERATING CONDITIONS
MIN
Supply voltage
MAX UNIT
4.5
28
LDO_IN
1.1
3.6
REG5V_IN
4.5
5.5
−0.1
33
4.5
28
STBY_LDO, LL1/2/3, TRIP, STBY_VREF3.3/5
−0.1
28
LDO_GATE
−0.1
8
INV1/2/3, INV_LDO, CT, PWM_SEL, FLT, PG_DELAY, SS_STBY1/2/3
−0.1
6
PGOUT, FB1/2/3, OUT1/2/3_d
−0.1
5.5
LDO_CUR, LDO_OUT
−0.1
3.5
OUT1/2/3_u, LH1/2/3
VIN_SENSE1/2/3
Input voltage, VI
NOM
VIN
Oscillator frequency, fosc
300
Operating free-air temperature, TA
V
V
500
kHz
85
°C
−40
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range, V(VIN) = V(VIN_SENSE12) = V(VIN_SENSE3) = 12 V (unless otherwise noted)
Supply Current
PARAMETER
ICC
Supply current
ICC(STBY)
Standby current
ICC(S)
Shutdown current
TEST CONDITIONS
TA = 25°C, V(LDO_IN) = 3.6 V,
V(CT) = V(INVx) = V(INV_LDO) = 0 V,
V(SS_STBYx) = 0 V, V(STBY_LDO) = 0V,
V(STBY_VREF3.3/5) = 5 V
V(SS_STBYx) = 0 V, V(STBY_LDO) = 0V,
V(STBY_VREF3.3/5) = 0 V
MIN
V(PWM_SEL) = 0 V
TYP
MAX
UNIT
2
3
mA
150
250
µA
0.001
10
µA
TYP
MAX
Reference Voltage
PARAMETER
Vref
TEST CONDITIONS
MIN
Reference voltage
0.85
V
TA = 25°C,
TA = 0°C to 85°C,
Iref = 50 µA
Iref = 50 µA
−1.5%
−2%
2%
Iref = 50 µA
Iref = 50 µA
−2.5%
2.5%
Line regulation
TA = −40°C to 85°C,
V(VIN) = 4.5 V to 28 V,
Load regulation
Iref = 0.1 µA to 1 mA
Vref(tol) Reference voltage tolerance
UNIT
1.5%
0.05
5
mV
0.15
5
mV
TYP
MAX
5 V Internal Switch
PARAMETER
VT(LH)
VT(HL)
Threshold voltage
Vhys
Hysteresis
TEST CONDITIONS
High
Low
REG5V_IN voltage
REG5V_IN voltage
MIN
UNIT
4.2
4.8
4.1
4.7
30
200
mV
MAX
UNIT
V
VREF5
PARAMETER
VO
TEST CONDITIONS
IO = 0 mA to 50 mA,
V(VIN) = 5.5 V to 28 V,
V(VIN) = 5.5 V to 28 V,
Output voltage
Line regulation
Load regulation
IOS
VT(LH)
VT(HL)
Vhys
IO = 1 mA to 10 mA,
V(VREF5) = 0 V,
Short-circuit output current
High
UVLO threshold voltage
Hysteresis
Low
VREF5 voltage
VREF5 voltage
TA = 25°C
IO = 10 mA
V(VIN) = 5.5 V
TA = 25°C
MIN
4.8
TYP
5.2
V
20
mV
40
mV
65
mA
3.6
4.2
3.5
4.1
30
200
V
mV
3
www.ti.com
SLVS426 − MAY 2002
ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range, V(VIN) = V(VIN_SENSE12) = V(VIN_SENSE3) = 12 V (unless otherwise noted)
VREF3.3
PARAMETER
VO
TEST CONDITIONS
IO = 0 mA to 30 mA,
TA = 25°C
V(VIN) = 5.5 V to 28 V,
Output voltage
Line regulation
Load regulation
IOS
Short circuit output current
IO = 1 mA to 10 mA,
V(VREF3.3) = 0 V,
V(VIN) = 5.5 V to 28 V,
MIN
TYP
MAX
UNIT
3.15
3.30
3.45
V
IO = 10 mA
V(VIN) = 5.5 V
TA = 25°C
−30
TEST CONDITIONS
MIN
20
mV
40
mV
mA
Control
PARAMETER
VIH
VIL
High-level input voltage
SS_STBYx, STBY_LDO, PWM_SEL, STBY_VREF3.3/5
Low-level input voltage
SS_STBYx, STBY_LDO, PWM_SEL, STBY_VREF3.3/5
TYP
MAX
2.2
UNIT
V
0.3
V
Output Voltage Monitor
MIN
TYP
MAX
UNIT
OVP comparator threshold
PARAMETER
SBRC, LDO
TEST CONDITIONS
0.91
0.95
0.99
V
UVP comparator threshold
SBRC, LDO
0.51
0.55
0.59
V
PG comparator low-level threshold
0.75
0.79
0.81
V
PG comparator high-level threshold
0.88
0.91
0.94
V
PG propagation delay from INVx, INV_LDO to PGOUT (no load at PG_DELAY)
I(PG_DELAY)
Powergood H to L
6.5
Powergood L to H
16
PG_DELAY source current
µss
µA
−1.8
Timer latch current source
UVP protection
−1.5
−2.3
−3.1
OVP protection
−80
−125
−180
MIN
TYP
MAX
µA
Oscillator
PARAMETER
fosc
Oscillation frequency
VOH
High level output voltage
VOL
Low level output voltage
TEST CONDITIONS
PWM mode, C(CT) = 44 pF,
dc
TA = 25°C
fosc = 300 kHz
dc
300
1
1.1
kHz
1.2
V
1.17
0.4
fosc = 300 kHz
0.5
UNIT
0.6
V
0.43
Error Amplifier for SBRC
PARAMETER
VIO
Input offset voltage
TEST CONDITIONS
INVx voltage,
MIN
TA = 25°C
Open loop voltage gain
Output sink current
Output source current
MAX
2
10
50
Unity-gain bandwidth
IO(snk)
IO(src)
TYP
V(FBx) = 1 V
V(FBx) = 1 V
UNIT
mV
dB
2.5
MHz
0.2
0.7
mA
−0.2
−0.9
mA
Duty Control
PARAMETER
Maximum duty control
4
TEST CONDITIONS
CH1/3, fosc = 300 kHz, V(INVx) = 0 V
CH2, fosc = 300 kHz, V(INVx) = 0 V
MIN
TYP
82%
97%
MAX
UNIT
www.ti.com
SLVS426 − MAY 2002
ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range, V(VIN) = V(VIN_SENSE12) = V(VIN_SENSE3) = 12 V (unless otherwise noted)
Output Drivers
PARAMETER
OUT_u sink current
OUT_u source current
OUT_d sink current
OUT_d source current
LDO_GATE sink current
I(TRIPx)
TEST CONDITIONS
MIN
V(OUTx_u) – V(LLx) = 3 V
V(LHx) − V(OUTx_u) = 3 V
V(OUTx_d) = 3 V
V(OUTx_d) = 2 V
LDO_GATE source current
V(LDO_GATE) = 2 V
V(LDO_GATE) = 2 V
TRIP current
TA = 25°C
TYP
MAX
UNIT
1.2
A
−1.2
A
1.5
A
−1.5
A
2
mA
−1.4
mA
µA
11
13
15
MIN
TYP
MAX
UNIT
−1.6
−2.3
−2.9
µA
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V(LDO_IN) = 3.3 V, TA = 25 °C
V(LDO_IN) = 3.3 V
2
10
Open loop voltage gain
50
Unity-gain bandwidth
V(LDO_IN) = 3.3 V, CL = 2000 pF
Soft Start
PARAMETER
I(SS_STBYx)
Soft start current
TEST CONDITIONS
V(SS_STBYx) = 0.7 V
Error Amplifier for LDO Controller
PARAMETER
VIO
Input offset voltage
mV
dB
1.4
MHz
Current Limit for LDO Controller
PARAMETER
Current limit comparator threshold voltage
TEST CONDITIONS
V(LDO_IN) = 3.3 V
MIN
TYP
MAX
40
50
60
MIN
TYP
MAX
UNIT
mV
Overshoot Protection for LDO Controller
PARAMETER
LDO_OUT sink current
TEST CONDITIONS
V(LDO_OUT) = V(LDO_GATE) = 1.5 V
25
UNIT
mA
5
www.ti.com
SLVS426 − MAY 2002
PIN ASSIGNMENTS
VIN_SENSE12
41 40 39 38
37
TRIP2
OUT2_d
43 42
TRIP1
OUTGND1
OUT1_d
LL1
OUT1_u
46 45 44
OUTGND2
48 47
LH1
FLT
INV1
PT
(TOP VIEW)
36
LL2
SS_STBY1
2
35
OUT2_u
INV2
3
34
LH2
FB2
4
33
VIN
SS_STBY2
5
32
VREF3.3
PWM_SEL
6
31
VREF5
CT
7
30
REG5V_IN
GND
8
29
LDO_IN
REF
9
28
LDO_CUR
STBY_VREF5
10
27
LDO_GATE
STBY_VREF3.3
11
26
LDO_OUT
STBY_LDO
12
25
INV_LDO
24
OUTGND3
OUT3_d
LL3
OUT3_u
20 21 22 23
LH3
VIN_SENSE3
18 19
TRIP3
PG_DELAY
PGOUT
15 16 17
FB3
13 14
INV3
1
SS_STBY3
FB1
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
CT
7
I/O
External capacitor from CT to GND adjusts frequency of the triangle oscillator.
FB1
1
O
Feedback output of SBRC-CH1 error amplifier
FB2
4
O
Feedback output of SBRC-CH2 error amplifier
FB3
14
O
Feedback output of SBRC-CH3 error amplifier
FLT
47
I/O
Fault latch timer pin. An external capacitor connected between FLT and GND sets FLT enable time up.
GND
8
−
Signal GND
INV1
48
I
Inverting inputs of SBRC-CH1 error amplifier, skip comparator, OVP1/UVP1 comparator and PG comparator
INV2
3
I
Inverting inputs of SBRC-CH2 error amplifier, skip comparator, OVP2/UVP2 comparator and PG comparator
INV3
15
I
Inverting inputs of SBRC-CH3 error amplifier, skip comparator, OVP3/UVP3 comparator and PG comparator
INV_LDO
25
I
Inverting inputs of LDO error amplifier, OVP/UVP comparators and PG comparator.
LDO_CUR
28
I
Current sense input of LDO regulator.
LDO_GATE
27
O
Gate control output of external MOSFET for LDO regulator
LDO_OUT
26
I/O
LDO regulator’s output connection. If output voltage has an overshoot when output current changes high to
low quickly, it absorbs electrical charge from this pin.
LDO_IN
29
I
6
Supply voltage input and current sense input of LDO regulator
www.ti.com
SLVS426 − MAY 2002
Terminal Functions (Continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
LH1
46
I/O
Bootstrap capacitor connection for SBRC-CH1 high-side gate driver.
LH2
34
I/O
Bootstrap capacitor connection for SBRC-CH2 high-side gate driver.
LH3
20
I/O
Bootstrap capacitor connection for SBRC-CH3 high-side gate driver.
LL1
44
I/O
SBRC-CH1 high-side gate driving return. Connect this pin to the junction of the high-side and low-side
MOSFETs for floating drive configuration. This pin is also an input terminal for current comparator.
LL2
36
I/O
SBRC-CH2 high-side gate driving return. Connect this pin to the junction of the high-side and low-side
MOSFETs for floating drive configuration. This pin is also an input terminal for current comparator.
LL3
22
I/O
SBRC-CH3 high-side gate driving return. Connect this pin to the junction of the high-side and low-side
MOSFETs for floating drive configuration. This pin is also an input terminal for current comparator.
OUT1_d
43
O
Gate drive output for SBRC-CH1 low-side MOSFETs
OUT2_d
37
O
Gate drive output for SBRC-CH2 low-side MOSFETs
OUT3_d
23
O
Gate drive output for SBRC-CH3 low-side MOSFETs
OUT1_u
45
O
Gate drive output for SBRC-CH1 high-side MOSFETs.
OUT2_u
35
O
Gate drive output for SBRC-CH2 high-side MOSFETs.
OUT3_u
21
O
Gate drive output for SBRC-CH3 high-side MOSFETs.
OUTGND1
42
O
Ground for SBRC-CH1 MOSFETs drivers. It is connected to the current limiting comparator’s negative input.
OUTGND2
38
O
Ground for SBRC-CH2 MOSFETs drivers. It is connected to the current limiting comparator’s negative input.
OUTGND3
24
O
Ground for SBRC-CH3 MOSFETs drivers. It is connected to the current limiting comparator’s negative input.
PGOUT
16
O
Powergood open drain output. PG comparators monitor all SBRC’s and LDO’s over voltage and under
voltage. The threshold is ±7%. When one of the output is beyond this condition, powergood output goes low.
PG_DELAY
17
I/O
Programmable delay for Powergood. Connect an external capacitor between this pin and GND to specify
time delay.
PWM_SEL
6
I
PWM or auto PWM/SKIP mode select.
H : auto PWM/SKIP
L : PWM fixed
REF
9
O
0.85-V reference voltage output. This 0.85-V reference voltage is used to set the output voltage and the
reference for the over and undervoltage protections. This reference voltage is dropped down from the internal
5-V regulator.
REG5V_IN
30
I
External 5-V input
SS_STBY1
2
I/O
Soft start control and stand by control for SBRC-CH1. Connect an external capacitor between this pin and
GND to specify soft start time.
SS_STBY2
5
I/O
Soft start control and stand by control for SBRC-CH2. Connect an external capacitor between this pin and
GND to specify soft start time.
SS_STBY3
13
I/O
Soft start control and stand by control for SBRC-CH3. Connect an external capacitor between this pin and
GND to specify soft start time.
STBY_LDO
12
I
Standby control input for LDO regulator. LDO regulator can be switched into standby mode by grounding the
STBY_LDO pin.
STBY_VREF3.3
11
I
Standby control for 3.3-V linear regulator.
STBY_VREF5
10
I
Standby control for 5-V linear regulator.
TRIP1
41
I
External resistor connection for SBRC-CH1 output current protection control.
TRIP2
39
I
External resistor connection for SBRC-CH2 output current protection control.
TRIP3
18
I
External resistor connection for SBRC-CH3 output current protection control.
VIN
33
I
Supply voltage input
VIN_SENSE12
40
I
SBRC-CH1/2 supply voltage monitor for reference of current limit. Input range is 4.5 V to 28 V.
VIN_SENSE3
19
I
SBRC-CH 3 supply voltage monitor for reference of current limit. Input range is 4.5 V to 28 V.
VREF3.3
32
O
3.3-V linear regulator output
VREF5
31
O
5-V linear regulator output.
7
www.ti.com
SLVS426 − MAY 2002
FUNCTIONAL BLOCK DIAGRAM
PWM_SEL
SBRC−CH1
SOFTSTART
/STBY
SS_STBY1
Duplicate for CH2 and CH3.
SKIP Comp.
−
0.85 V
+
FB1
LH1
ERROR Amp.
INV1
−
Oscillator
CT
OUT1_u
PWM Comp.
+
+
+
−
LL1
0.85 V
OUT1_d
OUTGND1
Phase
Inverter
Current Comp. 1
OVP Comp.
−
+
+
Current
Protection
Trigger
0.85 V + 12 %
UVP Comp.
+
SS_STBY
−
−(VIN_SENSE−TRIP)
−
−
VIN_SENSE12
+
TRIP1
Current Comp. 2
0.85 V − 35 %
LH2
SS_STBY2
SBRC−CH2
FB2
OUT2_u
LL2
OUT2_d
INV2
OUTGND2
TRIP2
SS_STBY3
FB 3
INV3
LH3
SBRC−CH3
+
OUT3_u
+
LL3
+
OUT3_d
+
OUTGND3
−
VIN_SENSE3
TRIP3
−
−
TIMER
−
−
0.85 V + 7 %
+
0.85 V − 7 %
Fault
Latch
Timer
PG_DELAY
PGOUT
FLT
STBY_LDO
INV_LDO
UVLO
VIN
SS_STBY
STBY_LDO
STBY_LDO
STBY_VREF5
VREF3.3
ERROR Amp.
STBY_VREF3.3
VIN_SENSE
−
3.3 V
REG.
5V
REG.
VREF5
VREF
0.85 V
0.85 V
+
0.85 V + 12 %
Current Limit
+
REG5V_IN
GND
−
+
−
LDO Overshoot
Protection
0.85 V − 35 %
LDO
8
LDO_IN
LDO_CUR
UVP Comp.
4.5 V
REF
LDO_GATE
+
OVP Comp.
−
LDO_OUT
www.ti.com
SLVS426 − MAY 2002
DETAILED DESCRIPTION
PWM OPERATION
The SBRC block has a high-speed error amplifier to regulate the output voltage of the synchronous buck converter. The
output voltage of the SBRC is fed back to the inverting input (INVx (x=1,2,3)) of the error amplifier. The noninverting input
is internally connected to a 0.85-V precise band gap reference circuit. The unity gain bandwidth of the amplifier is 2.5 MHz.
This decreases the amplifier delay during fast load transients and contributes to a fast response. Loop gain and phase
compensation is programmable by an external C, R network between the FBx and INVx pins. The output signal of the error
amplifier is compared with a triangular wave to achieve the PWM control signal. The oscillation frequency of this triangular
wave sets the switching frequency of the SBRC and is determined by the capacitor connected between the CT and GND
pins. The PWM mode is used for the entire load range if the PWM_SEL pin is set LOW, or used in high output current
condition if auto PWM/SKIP mode is selected by setting the same pin to HIGH.
SKIP MODE OPERATION
The PWM_SEL pin selects either the auto PWM/SKIP mode or fixed PWM mode. If this pin is lower than 0.3-V, the SBRC
operates in the fixed PWM mode. If 2.5 V (min.) or higher is applied, it operates in auto PWM/SKIP mode. In the auto
PWM/SKIP mode, the operation changes from constant frequency PWM mode to an energy-saving SKIP mode
automatically in accordance with load conditions. Using a MOSFET with ultra-low rDS(on) when the auto SKIP function is
implemented is not recommended. The SBRC block has a hysteretic comparator to regulate the output voltage of the
synchronous buck converter during SKIP mode. The delay from the comparator input to the driver output is typically 1.2
µs. In the SKIP mode, the frequency varies with load current and input voltage.
HIGH-SIDE DRIVER
The high-side driver is designed to drive high current and low rDS(on) N-channel MOSFET(s). The current rating of the driver
is 1.2 A at source and sink. When configured as a floating driver, a 5-V bias voltage is delivered from VREF5 pin. The
instantaneous drive current is supplied by the flying capacitor between the LHx and LLx pins since a 5-V power supply does
not usually have low impedance. It is recommended to add a 5 Ω to 10 Ω resistor between the gate of the high-side
MOSFET(s) and the OUTx_u pin to suppress noise. The maximum voltage that can be applied between the LHx and
OUTGNDx pins is 33 V.
When selecting the high current rating MOSFET(s), it is important to pay attention to both gate drive power dissipation and
the rise/fall time against the dead-time between high-side and low-side drivers. The gate drive power is dissipated from
the controller IC and it is proportional to the gate charge at VGS = 5 V, PWM switching frequency, and the numbers of all
MOSFETs used for low-side and high-side switches. This gate drive loss should not exceed the maximum power dissipation
of the device.
LOW-SIDE DRIVER
The low-side driver is designed to drive high current and low rDS(on) N-channel MOSFET(s). The maximum drive voltage
is 5 V from the internal regulator or REG5V_IN pin. The current rating of the driver is typically 1.5 A at source and sink.
Gate resistance is not necessary for the low-side MOSFET for switching noise suppression since it turns on after the
parallel diode is turned on (ZVS). It needs the same dissipation consideration when using high current rating MOSFET(s).
Another issue that needs precaution is the gate threshold voltage. Even though the OUTx_d pin is shorted to the OUTGNDx
pin with low resistance when the low-side MOSFET(s) is OFF, high dv/dt of the LLx pin during turnon of the high-side arm
will generate a voltage peak at the OUTx_d pin through the drain to gate capacitance, Cdg, of the low-side MOSFET(s).
To prevent a short period shoot-through during this switching event, the application designer should select MOSFET(s) with
adequate threshold voltage.
9
www.ti.com
SLVS426 − MAY 2002
DEAD-TIME
The internally defined dead-time prevents shoot-through-current flowing through the main power MOSFETs during
switching transitions. Typical value of the dead-time is 100 ns.
STANDBY
The SBRC controller, the LDO controller, and the internal regulators can be switched into standby mode separately as
shown in Table 1. The standby mode current, when both controllers and regulators are off, can be as low as 1 nA.
Table 1. Standby Logic
INPUT
FUNCTION
STBY_VREF5
SS_STBYx
STBY_VREF3.3
STBY_LDO
VREF5
VREF3.3
SBRCx
LDO
L
(1)
L
V(REG5V_IN) > 4.5V
False
True(1)
L
(1)
L
L
(1)
L
L
(1)
L
OFF
ON(1)
OFF
OFF(1)
OFF
OFF(1)
OFF
OFF(1)
H
L
L
L
x
ON
OFF
OFF
OFF
L
H
L
L
x
OFF
OFF
OFF
OFF
H
H
L
L
x
ON
OFF
ON
OFF
L
L
H
L
x
ON
ON
OFF
OFF
H
L
H
L
x
ON
ON
OFF
OFF
L
H
H
L
x
ON
ON
OFF
OFF
H
H
H
L
x
ON
ON
ON
OFF
L
L
L
H
x
ON
OFF
OFF
ON
H
L
L
H
x
ON
OFF
OFF
ON
L
H
L
H
x
ON
OFF
OFF
ON
H
H
L
H
x
ON
OFF
ON
ON
L
L
H
H
x
ON
ON
OFF
ON
H
L
H
H
x
ON
ON
OFF
ON
L
H
H
H
x
ON
ON
OFF
ON
H
H
H
(1) This functional mode is not recommended.
x = true or false
H
x
ON
ON
ON
ON
SOFT START
Soft start ramp up of the SBRC is controlled by the SS_STBYx pin voltage, which is controlled by an internal current source
and an external capacitor connected between the SS_STBYx and GND pins. When the STBY_VREF5 and/or SS_STBYx
pin voltages are forced to LOW, the SBRCx is disabled. When the STBY_VREF5 pin voltage is set to HIGH and the
SS_STBYx pin floats, the internal current source starts to charge the external capacitor. The output voltage ramps up as
the SS_STBYx pin voltage increases from 0 V to 0.85 V. The soft start time is easily calculated from the supply current and
the capacitance value (see application information). The soft start timing circuit for the LDO is integrated into the device.
The soft start time is fixed and can be as short as 600 µs. This is observed when the LDO is turned on separately from the
SBRC. Simultaneous start-up of one of the SBRC and the LDO, is also possible. Tie the LDO input to the SBRCx’s output,
let both the STBY_VREF5 and STBY_LDO voltages rise to the HIGH level, and invoke Soft start on the SS_STBYx pin;
then the LDO’s output follows the ramp of the SBRCx’s output.
10
www.ti.com
SLVS426 − MAY 2002
OVER CURRENT PROTECTION
Over current protection (OCP) is achieved by comparing the drain-to-source voltage of the high-side and low-side MOSFET
to a set-point voltage, which is defined by both the internal current source, I(TRIP), and the external resistor connected
between the VIN_SENSEx and the TRIPx pins. I(TRIP) has a typical value of 13 µA at 25°C. When the drain-to-source
voltage exceeds the set-point voltage during low-side conduction, the high-side current comparator becomes active, and
the low-side pulse is extended until this voltage comes back below the threshold. If the set-point voltage is exceeded during
high-side conduction in the following cycle, the current limit circuit terminates the high-side driver pulse. Together this action
has the effect of decreasing the output voltage until the under voltage protection circuit is activated to latch both the
high-side and low-side drivers OFF. In the TPS5130, trip current I(TRIP) has a temperature coefficient of 3400 ppm/°C in
order to compensate for temperature drift of the MOSFET on-resistance.
OCP FOR THE LDO
To achieve the LDO current limit, a sense resistor must be placed in series with the N-channel MOSFET drain, connected
between the LDO_IN and LDO_CUR pins (see reference schematic). If the voltage drop across this sense resistor exceeds
50 mV, the output voltage is reduced to approximately 22% of the nominal value, thus it activates the UVP to start the FLT
latch timer. When the time is up, the LDO_GATE pin is pulled LOW to makes the LDO regulator shut down. Note that all
of the SBRCs are latched OFF at the same time since the LDO and the SBRCs share the same FLT capacitor.
OVER VOLTAGE PROTECTION
For overvoltage protection (OVP), the TPS5130 monitors the INVx and INV_LDO pin voltages. When the INVx or INV_LDO
pin voltage is higher than 0.95 V (0.85 V +12%), the OVP comparator output goes low and the FLT timer starts to charge
an external capacitor connected to FLT pin. After a set time, the FLT circuit latches the high-side MOSFET driver, the
low-side MOSFET drivers, and the LDO. The latched state of each block is summarized in Table 2. The timer source current
for the OVP latch is 125 µA(typ.), and the time-up voltage is 1.185 V (typ.). The OVP timer is designed to be 50 times faster
than the under voltage protection timer described in Table 2.
Table 2. OVP Logic
OVP OCCURRED AT
HIGH-SIDE MOSFET DRIVER
LOW-SIDE MOSFET DRIVER
LDO
SBRC
OFF
ON
OFF
LDO
OFF
OFF
OFF
UNDER VOLTAGE PROTECTION
For under voltage protection (UVP), the TPS5130 monitors the INVx and INV_LDO pin voltages. When the INVx or
INV_LDO pin voltage is lower than 0.55 V (0.85 V - 35 %), the UVP comparator output goes low, and the FLT timer starts
to charge the external capacitor connected to FLT pin. Also, when the current comparator triggers the OCP, the UVP
comparator detects the under voltage output and starts the FLT capacitor charge, too. After a set time, the FLT circuit latches
all of the MOSFET drivers to the OFF state. The timer latch source current for UVP is 2.3 µA (typ.), and the time-up voltage
is also 1.185 V (typ.). The UVP function of the LDO controller is disabled when voltage across the pass transistor is less
than 0.23 V (typ.).
FLT
When an OVP or UVP comparator output goes low, the FLT circuit starts to charge the FLT capacitor. If the FLT pin voltage
goes beyond a constant level, the TPS5130 latches the MOSFET drivers. At this time, the state of MOSFET is different
depending on the OVP alert and the UVP alert (see Table 2). The enable time used to latch the MOSFET drivers is decided
by the value of the FLT capacitor. The charging constant current value depends on whether it is an OVP alert or a UVP
alert as shown in the following equation:
FLT source current (OVP) = FLT source current (UVP) × 50
11
www.ti.com
SLVS426 − MAY 2002
UNDER VOLTAGE LOCK OUT (UVLO)
When the output voltage of the internal 5-V regulator or the REG5V_IN voltage decreases below about 4 V, the output
stages of all the SBRCs and the LDO are turned off. This state is not latched, and the operation recovers immediately after
the input voltage becomes higher than the turnon value again. The typical hysteresis voltage is 100 mV.
UVLO FOR LDO
The LDO_IN voltage is monitored with a hysteretic comparator. When this voltage is less than 1 V, the UVLO circuit disables
the UVP/OVP comparators that monitor the INV_LDO voltage. In case the SBRC overcurrent protection is activated prior
to that of the LDO’s, this protection function may also be observed.
LDO CONTROL
The LDO controller can drive an external N-channel MOSFET. This realizes a fast response as well as an ultralow dropout
voltage regulator. For example, it is easy to configure both a 1.8-V and a 1.5-V high current power supply for core and I/O
of modern digital processors, one from the SBRC and the other from the LDO. The LDO_IN voltage range is from 1.1 V
to 3.6 V, and the output voltage is adjustable from 0.9 V to 2.5 V by an external resistor divider. Gain and phase of the
high-speed error amplifier for this LDO control is internally compensated and is connected to the 0.85-V band gap reference
circuit. The gate driver buffer is supplied by VIN_SENSE voltage. In the relatively high output voltage applications, make
sure that output voltage plus threshold voltage of the pass transistor is less than the minimum VIN. More precisely,
VIN - 0.7 ≥ Vthn + V(LDO_OUT)
where Vthn is the threshold voltage of the Nch MOSFET.
The LDO controller is also equipped with OVP, UVP, overcurrent limit, and overshoot protection functions.
OVERSHOOT PROTECTION
In the event that load current changes from high to low very quickly, the LDO regulator output voltage may start to overshoot.
In order to resist this phenomenon, the LDO controller has an overshoot protection function. If the LDO regulator output
overshoots, the controller draws electrical charge out from the LDO_OUT pin to hold it stable.
POWERGOOD
A single powergood circuit monitors the SBRCx output voltages and the LDO output voltage. The powergood pin is an open
drain output. When the INV or INV_LDO voltage goes beyond ±7% of 0.85 V, the powergood pin is pulled down to the LOW
level. Powergood propagation delay is programmable by controlling rising time using an external capacitor connected to
the PG_DELAY pin. During the soft start period, powergood indicates LOW, in other words power bad.
Table 3. Powergood Logic
12
SS_STBY1
SS_STBY2
SS_STBY3
STBY_LDO
POWERGOOD
L
L
L
L
L
H
L
L
L
H
L
H
L
L
H
H
H
L
L
H
L
L
H
L
H
H
L
H
L
H
L
H
H
L
H
H
H
H
L
H
H or L
H or L
H or L
H
H
www.ti.com
SLVS426 − MAY 2002
5-V REGULATOR
An internal linear voltage regulator is used for the high-side driver bootstrap. Since the input voltage ranges from 4.5 V to
28 V, this feature offers a fixed bootstrap voltage to simplify the drive design. It is active if the STBY_VREF5 is HIGH and
has a tolerance of 4%. The 5-V regulator is used for powering the low-side driver and the VREF. When this regulator is
disconnected from the MOSFET drivers, it is used only for the source of VREF.
3.3-V REGULATOR
The TPS5130 has a 3.3-V linear regulator. The output is made from the internal 5-V regulator or an external 5 V from the
REG5V_IN pin. The maximum output current of this regulator is limited to 30 mA by an output current limit control. A ceramic
capacitor of 4.7 µF should be connected between the VREF3.3 and GND pins to stabilize the output voltage.
EXTERNAL 5-V INPUT AND 5-V SWITCH
If the internal 5-V switch detects 5-V input from the REG5V_IN pin, the internal 5-V regulator is disconnected from the
MOSFET drivers. The external 5 V is used for both the high-side bootstrap and the low-side driver, thus increasing the
efficiency. When an excess voltage is applied to the REG5V_IN pin, the OVP timer starts to charge the FLT capacitor and
latches all the MOSFET drivers and the LDO at OFF state after a set time.
PHASE INVERTER
The SBRC3 of the TPS5130 operates in the same phase as the internal triangular oscillator output while the SBRC1 and
the SBRC2 operate 180 degrees out of phase. When the SBRC1 and the SBRC3 (or the SBRC2 and the SBRC3) share
the same input power supply, the TPS5130 realizes 180 degrees out of phase operation that reduces input current ripple
and enables the input capacitor value smaller.
13
www.ti.com
SLVS426 − MAY 2002
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
JUNCTION TEMPERATURE
SUPPLY CURRENT (SHUTDOWN)
vs
JUNCTION TEMPERATURE
3
250
I CC − Supply Current (Shutdown) − nA
I CC − Supply Current − mA
V(LDO_IN) = V(LDO_CUR) = 3.6 V,
V(PWM_ESL) = V(FLT) = V(CT) = 0 V
2.5
2
1.5
1
V(LDO_IN) = V(LDO_CUR) = 3.6 V,
V(INX) = V(INV_LDO) = 0 V
V(SS_STBYx) = 0 V
V(STBY_VREF 3.3/5) = 0 V
V(PWM_SEL) = 0 V
200
150
100
50
0
−50
0
50
100
150
−50
0
50
SOURCE CURRENT FLT(OVP)
vs
JUNCTION TEMPERATURE
SOURCE CURRENT FLT(UVP)
vs
JUNCTION TEMPERATURE
−3
I S − Source Current − FLT(UVP) − µ A
I S − Source Current − FLT(OVP) − µ A
−160
−140
−120
−100
−80
−60
−40
V(LDO_IN) = V(LDO_CUR) = 3.3 V,
V(INV_LDO) = 1 V
−2.5
−2
−1.5
−1
−0.5
0
0
−50
0
50
100
TJ − Junction Temperature − °C
150
V(LDO_IN) = V(LDO_CUR) = 3.3 V,
V(INV_LDO) = 5 V
−50
0
150
SINK CURRENT (LDO_GATE)
vs
OUTPUT VOLTAGE
3
25
V(INV_LDO) = 2 V
V(LDO_IN) = V(LDO_CUR) = 3.3 V
Sink Current (LDO_GATE) − mA
V(Trip) = V(VIN_SENSE) − 0.1 V
20
Trip Current − µ A
100
Figure 4
TRIP CURRENT
vs
JUNCTION TEMPERATURE
15
10
5
2.5
2
1.5
1
0.5
0
0
50
100
TJ − Junction Temperature − °C
Figure 5
V(VIN_SENSE) = 12 V, unless otherwise noted
14
50
TJ − Junction Temperature − °C
Figure 3
0
−50
150
Figure 2
Figure 1
−20
100
TJ − Junction Temperature − °C
TJ − Junction Temperature − °C
150
0
2
4
6
VO − Output Voltage − V
Figure 6
8
10
www.ti.com
SLVS426 − MAY 2002
TYPICAL CHARACTERISTICS
SOURCE CURRENT (LDO_GATE)
vs
OUTPUT VOLTAGE
955
V(INV_LDO) = 0 V
V(LDO_IN) = V(LDO_CUR) = 3.3 V
Threshold Voltage (OVP) − mV
Source Current (LDO_GATE) − mA
−2
THRESHOLD VOLTAGE (OVP)
vs
JUNCTION TEMPERATURE
−1.5
−1
−0.5
950
945
940
935
0
0
2
4
6
8
−50
10
0
VO − Output Voltage − V
OSCILLATOR FREQUENCY
vs
CAPACITANCE
150
OUTPUT MAXIMUM DUTY CYCLE
vs
JUNCTION TEMPERATURE
1000
100
Output Maximum Duty Cycle − %
TJ = 25°C
Oscillator Frequency − kHz
100
Figure 8
Figure 7
100
95
0
50
100
150
200
250
300
CH2
90
85
CH1/3
80
V(LH) = 5 V, C(CT) = 45 pF,
V(PWM_SEL) = V(FLT) = V(LL) = V(INV)
=0V
75
10
70
350
−50
C − Capacitance − pF
0
50
100
TJ − Junction Temperature − °C
150
Figure 10
Figure 9
DELAY TIME FLT(OVP)
vs
CAPACITANCE
DELAY TIME FLT(UVP)
vs
CAPACITANCE
100000
100000
VINV = 0.85 to 1.05 V,
TJ = 25°C
10000
t d − Delay Time FLT (UVP) − µ s
t d − Delay Time FLT (OVP) − µ s
50
TJ − Junction Temperature − °C
10000
1000
100
10
1
0.1
10
100
VINV = 0.65 to 0.05 V,
TJ = 25°C
1000
10000
1000
100
10
1
0.1
10
100
1000
C − Capacitance − pF
C − Capacitance − pF
Figure 11
Figure 12
10000
VVIN_SENSE = 12 V, unless otherwise noted
15
www.ti.com
SLVS426 − MAY 2002
TYPICAL CHARACTERISTICS
CURRENT LIMIT THRESHOLD
VOLTAGE FOR LDO
vs
JUNCTION TEMPERATURE
100000
TJ = 25°C
Soft Start Time − µ s
10000
1000
100
10
1
1
10
100
1000
10000
C − Capacitance − pF
100000
Current Limit Threshold Voltage For LDO − mV
SOFT START TIME
vs
CAPACITANCE
60
50
40
30
20
V(LDO_IN) = 3.3 V
V(INV_LDO) = 0.5 V
10
0
−50
Figure 13
50
100
150
Figure 14
LDO UVLO THRESHOLD VOLTAGE
vs
JUNCTION TEMPERATURE
POWERGOOD DELAY TIME
vs
CAPACITANCE
10000
1.2
VTLH
Powergood Delay Time − µ s
LDO UVLO Threshold Voltage − V
0
TJ − Junction Temperature − °C
1
VTHL
0.8
0.6
0.4
VIN = 12 V, TJ = 25°C
V(INV_LDO) = 1 V → 0.85 V
1000
100
10
0.2
V(INV_LDO) = 1.2 V
1
0
−50
0
50
100
TJ − Junction Temperature − °C
Figure 15
VVIN_SENSE = 12 V, unless otherwise noted
16
150
1
10
100
1000
C − Capacitance − pF
Figure 16
10000
www.ti.com
SLVS426 − MAY 2002
APPLICATION INFORMATION
The design shown is a reference design for a notebook PC application. An evaluation module (EVM) is available
for customer testing and evaluation.
The following key design procedures aid in the design of the notebook PC power supply using TPS5130.
Q01A
R25
5−8
4
C35
Q01B
5−8
4
1−3
1−3
L01
C41
VO1−1
Q02A
5−8
4
1−3
4
1−3
D01
Q02B
5−8
4
1−3
4
1−3
C37
D02
C38 C39 D07 C40
VO1−2
R09
R23
C43
R49
R03A
C03
R01A
C02
R03B
R04
R01B
R02
R24
C44
2SC4617
R46
1
Q08
R26
D03
JP01
JP11
3
R28
C42
2
R27
Q11
Q09
47
46
45
44
43
42
41
40
39
38
37
LL1
OUT1_d
OUTGND1
TRIP1
VIN_SENSE12
TRIP2
OUTGND2
OUT2_d
48
OUT1_u
JP02
VO2−1
R29
C28
STBY_VREF5
3
2
LDO_OUT
4
26
1−3
3 Q07B
OUTGND3
JP10
R21C
C13
GND−1
GND−2
LDO_OUT−1
R18
C23
C22
C24
LDO_OUT−2
R19
Q10
R32
D05
4
R33
C14
1−3
5−8
Q06A
4
C17 C18
1−3
C19 D09 C20
5−8
Q06B
L03
VO3−1
4
C21
R17
R15
VIN1−2
LDO_IN
R21B
1
Q07A
25
R16
PWR_GD
C01A C01B
2
5−8
R20
27
24
OUT3_d
R21A
C45
28
R14B
C12
29
R34
R13
C11
R11
Q13
VREF5
VIN1−1
2SC4617
C10
JP07
INV_LDO
23
STBY_LDO
LL3
STBY_VREF3.3
12
JP13
C36
LDO_GATE
11
13
1
C27
LDO_VIN
22
3
2
R48
1
VREF3.3
32
LDO_CUR
OUT3_u
JP06
3
35
C26
REF
SS_STBY3
1
2
5−8
36
LH2 34
33
GND
21
3
2
VO2−2
JP08
REG5V_IN
LH3
JP05
C29
VREF5 31
30
TPS5130PT
CT
20
1
9
10
Q03B
1−3
D04
VREF3.3
PWM_SEL
VIN_SENSE3
C09
3
SS_STBY2
19
8
JP04
2
4
VIN
TRIP3
1
7
FB2
18
6
C08
5−8
Q03A
OUT2_u
INV2
PG_DELAY
5
3
2
SS_STBY1
17
C07
JP03
4
R14
1
R08
1−3
4
R30
R22
PGOUT
3
C06
INV3
R07
R31
LL2
16
2
FB1
FB3
C05
1
14
Q12
R06
R12 15
C04
C30
C33 D08 C34
L02
VIN_SLIT
2
FLT
INV1
JP12
3
LH1
U01
1
C31 C32
5−8
Q04B
2SC4617
R05
C16
R47
5−8
Q04A
1−3
4
5−8
Q05A
1−3
C15
VO3−2
5−8
Q05B
D06
Figure 17. EVM Schematic
An optional circuit composed of Q08, Q09, Q10, R26, R27, R28, R29, R30, R31, R32, R33, and R34 can be
used to increase temperature coefficient of the trip current.
OUTPUT VOLTAGE SETPOINT CALCULATION
In the following calculation, assume the output voltage of SBRC1 (VO1), SBRC2 (VO2), SBRC3 (VO3), and LDO
(VO4) are 3.3 V, 5 V, 1.8 V, and 1.5 V respectively. The reference voltage and the voltage divider set the output
voltage. In the TPS5130, the reference voltage is 0.85 V, and the divider is composed of three resistors in the
EVM design that are R01A, R01B, and R05 for the first SBRC output; R03A, R03B, and R07 for the second
SBRC output ; R14A, R14B, and R11 for the third SBRC output ; R18 and R19 for LDO regulator output.
VO +
R1
V ref
R2
) V ref or R2 +
R1 Vref
V O * V ref
where R1 is the top resistor (kΩ) (R01A + R01B or R03A + R03B or R14A + R14B or R18); R2 is the bottom
resistor (kΩ) (R05 or R07 or R11 or R19); VO is the required output voltage (V); Vref is the reference voltage
(0.85 V in TPS5130). The value for R1 is set as a part of the compensation circuit and the value of R2 may be
17
www.ti.com
SLVS426 − MAY 2002
calculated to achieve the desired output voltage. In the EVM design, the value of R1 is determined as
R01A = 27 kΩ and R01B = 1.8 kΩ for VO1, R03A = 47 kΩ and R03B = 1.8 kΩ for VO2, R14A = 10 kΩ and
R14B = 1.2 kΩ for VO3, and R18 = 6.8 k + 820 Ω for VO4 considering stability. For VO1:
R05 +
(27 k ) 1.8 k) 0.85
+ 9.99 kW
3.3 * 0.85
Therefore, use 10 kΩ.
In a same manner, R07 = R11 = R19 = 10 kΩ as follows.
R07 +
(47 k ) 1.8 k) 0.85
+ 10.00 kW
5 * 0.85
R11 +
(10 k ) 1.2 k) 0.85
+ 10.02 kW
1.8 * 0.85
R19 +
(6.8 k ) 820) 0.85
+ 9.96 kW
1.5 * 0.85
The values of R01B, R03B, R14B and R19 are chosen so that the calculated values of R05, R07, R11, and R19
are standard value resistors and the VO setpoint maintains the highest precision. This is best accomplished by
combining two resistor values. If a standard value resistor can not be applied, use a value for R01A, R03A,
R14A, and R18 that is just slightly less than the desired total. A small resistor value in the range of tens or
hundreds of ohms for R01B, R03B, R14B and R18 can then be added to generate the desired final value.
OUTPUT INDUCTOR SELECTION
The required value for the output filter inductor can be calculated by using the equation below, assuming the
magnitude of the ripple current is 20 % of the maximum output current:
L (out) +
VIN * V O
0.2 I O
VO
VIN
1
fS
Where L(out) is output filter inductor value (H), VIN is the input voltage (V), IO is the maximum output current
(A), fs is the switching frequency (Hz).
Example : VIN = 8 V; VO = 3.3 V; IO = 4 A; fs = 300 kHz.
Then, L(out) = 8.1 µH.
If faster output response is required for a sudden transition of the load, smaller inductance value is
recommended.
OUTPUT INDUCTOR RIPPLE CURRENT
The output inductor current can affect not only the efficiency, but also the output voltage ripple. The equation
is exhibited below:
I (ripple) +
VIN * V O * I O
ǒr DS(on) ) RLǓ
L (out)
VO
VIN
1
fS
where I(ripple) is the peak-to-peak ripple current (A) through the inductor; Io is the output current; rDS(on) is the
on-time resistance of MOSFET (Ω); RL is the inductor dc resistance (Ω). From the equation, it can be seen that
the current ripple can be adjusted by changing the output inductor value.
Example: VIN = 8 V; VO = 3.3 V; IO = 4 A; rDS(on) = 25 mΩ; RL = 10 mΩ; fs = 300 kHz; L(out) = 4 µH.
Then, the ripple current I(ripple) = 1.57 A
18
www.ti.com
SLVS426 − MAY 2002
OUTPUT CAPACITOR SELECTION
Selection of the output capacitor is basically dependent on the amount of peak-to-peak ripple voltage allowed
on the output and the ability of the capacitor to dissipate the RMS ripple current. Assuming that the ESR of the
output filter sees the entire inductor ripple current then:
V pp + I (ripple)
R(esr)
And a suitable capacitor must be chosen so that the peak-to-peak output ripple is within the limits allowable
for the application.
OUTPUT CAPACITOR RMS CURRENT
Assuming the inductor ripple current totally goes through the output capacitor to ground, the RMS current in
the output capacitor can be calculated as:
I O(rms) +
I (ripple)
Ǹ12
where IO(rms) is maximum RMS current in the output capacitor (A); I(ripple) is the peak-to-peak inductor ripple
current (A).
Example: I(ripple) = 1.57 A, then, IO(rms) = 0.45 A
INPUT CAPACITOR RMS CURRENT
Since the SBRC3 of the TPS5130 operates 180 degree off phase against the SBRC1 and SBRC2, total RMS
current in the input capacitor is calculated as follows, assuming the input current totally goes into the input
capacitor to the power ground, and ignoring ripple current in the inductor.
When the duty cycle of the SBRC2 (D2) is over 50 %,
I I(rms) +
Ǹ(D1
I O12) ) (D2
I Ox + (D1
I O2 2) ) (D3
I O1) ) (D2
I O2) ) (D3
I O3 2) ) (2D1
I O2) ) (2D2 * 1)
I O1
I O2
I O3 * I Ox 2
D2 w 0.5 w D1 w D3
I O3)
II(rms) is the input RMS current in the input capacitor; DX is duty cycles, defined as VO/VI in this case, of the
SBRCx.
When D2 is less than 50%,
I I(rms) + Ǹ(D1
I O1 2) ) (D2
I O22) ) (D3
I O32) ) (2D1
I O1
I O2) * I Ox 2
Example: VIN = 12 V, VO1 = 3.3 V, VO2 = 5 V (D2 = 0.42), VO3 = 1.8V, IO1 = IO2 = 4 A, IO3 = 6 A
Then, II(rms) = 3.44 A
On the contrary, if three SBRCs operate in a same phase the RMS current is calculated as follows.
I I(rms) +
Ǹ(D1
I O12) ) (D2
I O2 2) ) (D3
I O3 2) ) (2D1
I O1
I O2) ) (2D3
I O3)
ǒIO1 ) IO2Ǔ * I Ox2
Under the same operation condition, II(rms) = 5.13 A
Therefore, 180 degree out of phase operation is effective in reducing input RMS current, and it allows a smaller
input capacitance value. The input capacitors must be chosen so that together they can safely handle the input
ripple current. Depending on the input filtering and the dc input voltage source, not all the ripple current flows
through the input capacitors, but some may be present on the input leads to the EVM.
19
www.ti.com
SLVS426 − MAY 2002
SOFT START
The soft start timing can be adjusted by selecting the soft-start capacitor value. The equation is;
C(soft) + 2.3
10–6
T(soft)
0.85
where C(soft) is the soft-start capacitor (µF) (C05, C07 and C10 in EVM design):
T(soft) is the start-up time (s).
Example: T(soft) = 5 ms, therefore, C(soft) = 0.0135 µF.
CURRENT PROTECTION
The current limit in TPS5130 is set using an internal current source and an external resistor (R17, R23 and R24).
The current limit protection circuit compares the drain to source voltage of the high-side and low-side
MOSFET(s) with respect to the set-point voltage. If the voltage up exceeds the limit during high-side conduction,
the current limit circuit terminates the high-side driver pulse. If the set point voltage is exceeded during low-side
conduction, the low side pulse is extended through the next cycle. Together this action has the effect of
decreasing the output voltage until the under voltage protection circuit is activated and the fault latch is set and
both the high-side and low-side MOSFET drivers are shut off. The equation below should be used for calculating
the external resistor value for current protection set point:
r DS(on)
R(cl) +
ǒ
I (trip) )
13
Ǔ
I (ripple)
2
10 –6
where R(cl) is the external current limit resistor (R17, R23 and R24); rDS(on) is the low-side MOSFET(Q02, Q04
and Q06) on-time resistance. I(trip) is the required current limit.
Example: rDS(on) = 25 mΩ, I(trip) = 4 A, I(ripple) = 1.57 A, therefore, R(cl)= 9.2 kΩ.
It should be noted that rDS(on) of a FET is highly dependent on temperature, so to insure full output at maximum
operating temperature, the value of rDS(on) in the above equation should be adjusted. For maximum stability,
it is recommended that the high-side MOSFET(s) has the same, or slightly higher rDS(on)than the low-side
MOSFET(s). If the low-side MOSFET(s) has a higher rDS(on), in certain low duty cycle applications it may be
possible for the device to regulate at an output current higher than that set by the above equation by increasing
the high-side conduction time to compensate for the missed conduction cycle caused by the extension of the
previous low-side pulse.
TIMER-LATCH
The TPS5130 includes fault latch function with a user adjustable timer to latch the MOSFET drivers in case
of a fault condition. When either the OVP or UVP comparator detect a fault condition, the timer starts to charge
FLT capacitor (C42), which is connected with FLT pin. The circuit is designed so that for any value of FLT
capacitor, the undervoltage latch time t(uvplatch) is about 50 times larger than the overvoltage latch time t(ovplatch).
The equations needed to calculate the required value of the FLT capacitor for the desired over and undervoltage
latch delay times are:
C (lat) + 2.3
10 *6
C (lat) + 125
10 *6
t (uvplatch)
1.185
and
t (ovplatch)
1.185
where C(lat) is the external capacitor, t(uvplatch) is the time from UVP detection to latch. t(ovplatch) is the time from
OVP detection to latch.
For the EVM, t(uvplatch) = 5 ms and t(ovplatch) = 0.1 ms, so C(lat) = 0.01 µF. If the voltage on the FLT pin reaches
1.185 V, the fault latch is set, and the MOSFET drivers are set as follows:
20
www.ti.com
SLVS426 − MAY 2002
Undervoltage Protection
The undervoltage comparator circuit continually monitors the voltage at the INV and INV_LDO pins. If the
voltage at either pin falls below 65 % of the 0.85 V reference, the timer begins to charge the FLT capacitor. if
the fault condition persists beyond the time t(uvplatch), the fault latch is set and both the high-side and low-side
drivers, and LDO regulator drivers are forced OFF.
Short-Circuit Protection
The short-circuit protection circuitry uses the UVP circuit to latch the MOSFET drivers. When the current limit
circuit limits the output current, then the output voltage goes below the target output voltage and UVP
comparator detects a fault condition as described above.
Overvoltage Protection
The overvoltage comparator circuit continually monitors the voltage at the INV and INV_LDO pins. If the voltage
at either pin rises above 112 % of the 0.85 V reference, the timer begins to charge the FLT capacitor. If the fault
condition persists beyond the time t(ovplatch), the fault latch is set and the high-side drivers are forced OFF, while
the low-side drivers are forced ON, and LDO regulator drivers are forced OFF.
CAUTION:
Do not set the FLT terminal to a lower voltage (or GND) while the device is timing out an OVP or UVP
event. If the FLT terminal is manually set to a lower voltage during this time, output overshoot may
occur. The TPS5130 must be reset by grounding SS_STBYx and STBY_LDO, or dropping down
REG5V_IN.
Disablement of the Protection Function
If it is necessary to inhibit the protection functions of the TPS5130 for troubleshooting or other purposes, the
OCP,OVP, and UVP circuits may be disabled.
D OCP(SBRC): Remove the current limit resistors R17, R23 and R24 to disable the current limit function.
D OCP(LDO): Short−circuit R21 to disable the current limit function.
D OVP, UVP: Grounding the FLT terminal can disable OVP and UVP.
LDO REGULATOR APPLICATION INFORMATION
Output Capacitor Selection
To keep stable operation of the LDO, capacitance of more than 33 µF and R(esr) of more than 30 mΩ are
recommended for the output capacitor.
Power MOSFET Selection
Also, to keep stable operation of LDO, lower input capacitance is recommended for the external power
MOSFET. However, input capacitance that is too small may lead the feedback loop into an unstable region.
In this case, the gate resistor of several hundreds ohms keeps the LDO operation in the stable state.
Current Protection
If excess output current flows through sense resistor (R21) and the voltage drop exceeds 50 mV, the output
voltage is reduced to approximately 22% of the nominal value, thus activates UVP to start the FLT latch timer.
When the set current is 3 A, the value of R21 is 16.7 mΩ.
21
www.ti.com
SLVS426 − MAY 2002
Layout Guidelines
Good power supply results only occur when care is given to proper design and layout. Layout affects noise
pickup and generation and can cause a good design to perform with less than expected results. With a range
of currents from milliamps to tens amps, good power supply layout is much more difficult than most general
PCB designs. The general design should proceed from the switching node to the output, then back to the driver
section and, finally, parallel the low-level components. Below are specific points to consider before the layout
of a TPS5130 design begins.
D A four-layer PCB design is recommended for design using the TPS5130. For the EVM design, the top layer
contains the interconnection to the TPS5130, plus some additional signal traces. Layer2 is fully devoted
to the ground plane. Layer3 has some signal traces. The bottom layer is almost devoted to ANAGND, and
the rest is to other signal trace.
D All sensitive analog components such as INV, REF, CT, GND, FLT, and SS_STBY should be referenced
to ANAGND.
D Ideally, all of the area directly under the TPS5130 chip should also be ANAGND.
D ANAGND and DRVGND should be isolated as much as possible, with a single point connection between
them.
CTRIP
TRIP
VIN
VIN_SENSE
VREF5
CBS
LH
CBP
CIN
OUT_u
INV
Vox
LL
FB
COUT
SOFT_START
ANAGND
CT
GND
REF
OUT_d
OUTGND
DRVGND
VoxGND
LDO_IN
LDO_CUR
FLT
LDO_GATE
INV_LDO
LDO_OUT
Vo_LDO
Figure 18. PCB Diagram
Low-Side MOSFET(s)
D The source of low-side MOSFET(s) should be referenced to DRVGND, otherwise ANAGND is subject to
the noise of the outputs.
D DRVGND should be connected to the main ground plane close to the source of the low-side MOSFET.
D OUTGND should be placed close to the source of low side MOSFET(s).
D The Schottky diode anode, the returns for the high frequency bypass capacitor for the MOSFETs, and the
source of the low-side MOSFET(s) traces should be routed as close together as possible.
22
www.ti.com
SLVS426 − MAY 2002
Connections
D Connections from the drivers to the gate of the power MOSFETs should be as short and wide as possible
to reduce stray inductance. This becomes more critical if external gate resistors are not being used. In
addition, as for the current limit noise issue, use of a gate resistor on the high-side MOSFET(s) considerably
reduces the noise at the LL node, improving the performance of the current limit function.
D The connection from LL to the power MOSFETs should be as short and wide as possible.
Bypass Capacitor
D The bypass capacitor for VIN_SENSE should be placed close to the TPS5130.
D The bulk storage capacitors across VIN should be placed close to the power MOSFETs. High-frequency
bypass capacitors should be placed in parallel with the bulk capacitors and connected close to the drain
of the high-side MOSFET(s) and to the source of the low-side MOSFET(s).
D For aligning phase between the drain of high-side MOSFET(s) and the trip-pin, and for noise reduction, a
0.1 µF capacitor C(TRIP) should be placed in parallel with the trip resistor.
Bootstrap Capacitor
D The bootstrap capacitor C(BS) (connected from LH to LL) should be placed close to the TPS5130.
D LH and LL should be routed close to each other to minimize noise coupling to these traces.
D LH and LL should not be routed near the control pin area (ex. INV, FB, REF, etc.).
Output Voltage
D The output voltage sensing trace should be isolated by either ground plane.
D The output voltage sensing trace should not be placed under the inductors on same layer.
D The feedback components should be isolated from output components, such as, MOSFETs, inductors, and
output capacitors. Otherwise the feedback signal line is susceptible to output noise.
D The resistors for setup output voltage should be referenced to ANAGND.
D The INV trace should be as short as possible.
VIN = 8 V
VIN = 8 V
80
VIN = 12 V
60
VIN = 20 V
40
SBRC CH1
External 5 V
VO1 = 3.3 V
20
0.1
1
IO − Output Current − A
Figure 19
10
VIN = 8 V
Efficiency (PWM MODE) − %
Efficiency (PWM MODE) − %
Efficiency (PWM MODE) − %
100
100
100
0
0.01
EFFICIENCY (PWM MODE)
vs
OUTPUT CURRENT
EFFICIENCY (PWM MODE)
vs
OUTPUT CURRENT
EFFICIENCY (PWM MODE)
vs
OUTPUT CURRENT
80
VIN = 12 V
60
VIN = 20 V
40
SBRC CH2
External 5 V
VO2 = 5 V
20
0
0.01
0.1
1
IO − Output Current − A
Figure 20
10
80
VIN = 12 V
60
VIN = 20 V
40
SBRC CH3
External 5 V
VO3 = 1.8 V
20
0
0.01
0.1
1
10
IO − Output Current − A
Figure 21
23
www.ti.com
SLVS426 − MAY 2002
EFFICIENCY (AUTO SKIP MODE)
vs
OUTPUT CURRENT
EFFICIENCY (AUTO SKIP MODE)
vs
OUTPUT CURRENT
Efficiency (AUTO SKIP MODE) − %
Efficiency (AUTO SKIP MODE) − %
80
VIN = 8 V
VIN = 12 V
VIN = 20 V
60
40
SBRC CH1
External 5 V
VO1 = 3.3 V
20
0
0.01
0.1
1
IO − Output Current − A
100
VIN = 8 V
VIN = 12 V
VIN = 20 V
80
60
40
SBRC CH2
External 5 V
VO2 = 5 V
20
0
0.01
10
0.1
1
IO − Output Current − A
Figure 22
VIN = 20 V
40
SBRC CH3
External 5 V
VO3 = 1.8 V
20
IO = 6 A
1.764
3.264
3.262
VO − Output Voltage − V
VO − Output Voltage − V
3.266
5
4.998
4.996
5
10
15
VI − Input Voltage − V
Figure 25
LDO OUTPUT LINE REGULATION
1.758
20
5.030
PWM Mode
VIN = 12 V
VO − Output Voltage − V
1.462
1.456
3.280
3.275
3.270
3.260
20
5.020
5.015
5.010
5.005
3.265
1.454
PWM Mode
VIN = 12 V
5.025
VO − Output Voltage − V
3.285
1.458
20
Figure 27
3.290
1.460
10
15
VI − Input Voltage − V
SBRC CH1 OUTPUT LOAD REGULATION SBRC CH2 OUTPUT LOAD REGULATION
V(LDO_IN = VO3
IO = 3 A
Figure 28
1.760
Figure 26
1.464
10
15
VI − Input Voltage − V
1.762
1.756
5
4.994
20
10
SBRC CH3 OUTPUT LINE REGULATION
5.002
3.268
10
15
VI − Input Voltage − V
0.1
1
IO − Output Current − A
1.766
IO = 4 A
IO = 4 A
VO − Output Voltage − V
60
Figure 24
5.004
5
VIN = 8 V
VIN = 12 V
0
0.01
10
SBRC CH2 OUTPUT LINE REGULATION
SBRC CH1 OUTPUT LINE REGULATION
3.260
5
80
Figure 23
3.270
VO − Output Voltage − V
Efficiency (AUTO SKIP MODE) − %
100
100
24
EFFICIENCY (AUTO SKIP MODE)
vs
OUTPUT CURRENT
5
0
1
2
3
IO− Output Current − A
Figure 29
4
0
1
2
3
IO− Output Current − A
Figure 30
4
www.ti.com
SLVS426 − MAY 2002
SBRC CH3 OUTPUT LOAD REGULATION
LDO OUTPUT LOAD REGULATION
1.790
1.480
PWM Mode
VIN = 12 V
V(LDO_IN)= VO3
1.475
VO − Output Voltage − V
VO − Output Voltage − V
1.785
1.780
1.775
1.770
1.765
1.760
0
1.470
1.465
1.460
1.455
1.450
1
2
3
4
IO− Output Current − A
5
0
6
Figure 31
SBRC CH1 OUTPUT VOLTAGE RIPPLE
50 mV/div
2
3
Figure 32
SBRC CH2 OUTPUT VOLTAGE RIPPLE
SBRC CH3 OUTPUT VOLTAGE RIPPLE
20 mV/div
50 mV/div
VIN = 12 V, VO1 = 3.3 V
1
IO− Output Current − A
IO1 = 0 A
IO2 = 0 A
IO2 = 0 A
2A
2A
4A
4A
4A
6A
VIN = 12 V, VO2 = 5 V
1 µs/div
Figure 33
LDO OUTPUT VOLTAGE RIPPLE
1 µs/div
VIN = 12 V, VO3 = 1.8 V
1 µs/div
Figure 34
Figure 35
SBRC CH1 LOAD TRANSIENT RESPONSE
SBRC CH2 LOAD TRANSIENT RESPONSE
10 mV/div
VO2
20 mV/div
VO1
20 mV/div
IO= 0.3 A
1A
4A
4A
3A
VIN = 12 V, V(LDO_IN) = VO3 = 1.8 V,
IO3 = 0 A
1 µs/div
Figure 36
IO1
2 A/div
0A
VIN = 12 V, VO1 = 3.3 V
100 µs/div
Figure 37
IO2
2 A/div
0A
VIN = 12 V, VO2 = 5 V
100 µs/div
Figure 38
25
www.ti.com
SLVS426 − MAY 2002
LDO LOAD TRANSIENT RESPONSE
SBRC CH3 LOAD TRANSIENT RESPONSE
VIN = 12 V, V(LDO_IN) = VO3 = 1.8 V,
V(LDO) = 1.5 V
VO
50 mV/div
VO3
20 mV/div
3A
6A
IO3
2 A/div
0A
IO
1 A/div
30 mA
100 µs/div
100 µs/div
Figure 39
Figure 40
SBRC CH1 GAIN AND PHASE
80
SBRC CH2 GAIN AND PHASE
80
240
120
Phase
60
20
0
0
−20
−40
100
1K
120
40
Phase
60
20
0
0
Gain
10K
100K
f − Frequency − Hz
180
−60
−20
−120
−40
100
1M
−120
1K
40
120
Phase
60
20
0
0
26
60
Gain
1M
180
120
40
Gain − dB
180
Phase − Degrees
Gain − dB
Phase Margin = 37 Degrees
Figure 43
240
Phase Margin = 74 Degrees
60
10K
100K
f − Frequency − Hz
1M
80
240
1K
10K
100K
f − Frequency − Hz
LDO GAIN AND PHASE
SBRC CH3 GAIN AND PHASE
−40
100
−60
Figure 42
80
−20
Gain
VIN = 12 V,
VO2 = 5 V,
IO2 = 4 A
Figure 41
VIN = 12 V,
VO3 = 1.8 V,
IO3 = 6 A
Phase − Degrees
40
60
Gain − dB
180
Phase − Degrees
Gain − dB
Phase Margin = 53 Degrees
60
VIN = 12 V,
VO1 = 3.3 V,
IO1 = 4 A
240
Phase Margin = 59 Degrees
Phase
60
20
Gain
0
0
−60
−20
−120
−40
100
VIN = 12 V,
V(LDO_IN) = VO3 =1.8 V,
I(LDO) = 3 A
1K
10K
100K
f − Frequency − Hz
Figure 44
Phase − Degrees
VIN = 12 V, VO3 = 1.8 V
−60
−120
1M
www.ti.com
SLVS426 − MAY 2002
MECHANICAL DATA
PT (S-PQFP-G48)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
36
0,08 M
25
37
24
48
13
0,13 NOM
1
12
5,50 TYP
7,20
SQ
6,80
9,20
SQ
8,80
Gage Plane
0,25
1,45
1,35
0,05 MIN
Seating Plane
1,60 MAX
0°−ā 7°
0,75
0,45
0,10
4040052/ C 11/96
NOTES:A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
This may also be a thermally enhanced plastic package with leads conected to the die pads.
27
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS5130PT
ACTIVE
LQFP
PT
48
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS5130PTG4
ACTIVE
LQFP
PT
48
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS5130PTR
ACTIVE
LQFP
PT
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS5130PTRG4
ACTIVE
LQFP
PT
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPS5130PTR
Package Package Pins
Type Drawing
LQFP
PT
48
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
1000
330.0
16.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.6
9.6
1.9
12.0
16.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS5130PTR
LQFP
PT
48
1000
346.0
346.0
33.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement